Liquid dispensing head, liquid dispensing device, method for manufacturing articles, and method for manufacturing a liquid dispensing head

Abstract

This ensures the cleanliness of the nozzle surface of the tip plate while suppressing the peeling of the protective material. [Solution] The liquid discharge head 100 includes a tip plate 102 having a nozzle surface 121 on which a nozzle hole 120 for discharging liquid is formed, a protective member 101 that covers at least a part of the nozzle surface so as to avoid the nozzle hole, and an adhesive member 103 that adheres the tip plate and the protective member together. If the direction in which the liquid is discharged is defined as the first direction, the direction perpendicular to the first direction is the second direction, and the direction perpendicular to both the first and second directions is the third direction, the protective member is configured such that, when the cross-section in the second direction is viewed from the third direction, the top portion 112 located between the first end 110 and the second end 111 on the opposite side of the first end 110 protrudes more in the first direction than the first end 110 on the side farther from the nozzle hole in the second direction and the second end 111 on the opposite side of the first end 110.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejection head, a liquid ejection device, a method for manufacturing an article, and a method for manufacturing a liquid ejection head.

Background Art

[0002] A liquid ejection device is used to eject a liquid such as ink onto a medium such as paper to form an image, or to eject a liquid such as ink onto a medium such as a glass substrate or a semiconductor substrate in the industrial field to form a functional film.

[0003] The liquid ejection device includes a liquid ejection head. The liquid ejection head has a chip plate having a nozzle surface including nozzle holes for ejecting a liquid. When the medium is conveyed to a position facing the liquid ejection head, the liquid is ejected from the nozzle holes, and patterns such as an image or a functional film are formed on the medium by the liquid. As the high-precision of the liquid landing on the medium progresses with the high-definition of the pattern, the distance between the liquid ejection head and the medium is narrowed. On the other hand, the medium is getting larger, and it has been required to form a pattern in a large area in a short time, and the conveyance speed of the medium has increased dramatically. When the medium or particles come into contact with the nozzle surface of the liquid ejection head due to factors such as particles or uneven thickness of the medium, the nozzle surface of the liquid ejection head may be damaged, resulting in non-ejection of the liquid or deviation of the liquid ejection direction. As a countermeasure, a protective member for protecting the nozzle surface is provided on the liquid ejection head.

[0004] Furthermore, factors that can cause ejection problems include ink adhering to the nozzle surface, especially near the nozzle hole, drying and remaining there, or, in the case of fast-drying ink, drying and solidifying inside the nozzle, causing a misalignment in the direction of ejection from the nozzle hole. As a countermeasure, ink adhering to the nozzle surface is usually wiped off with a wiping member. In a head with the above-mentioned protective member structure, the wiping member will come into contact with the protective member at the same time as the nozzle surface. In this case, there is a risk that the wiping member may get caught on the edge of the protective member, causing part or all of it to peel off from the nozzle surface.

[0005] Therefore, conventionally, a nozzle plate protective member has been devised in which the edge adjacent to the nozzle row of the nozzle plate is formed to gradually become thinner toward the nozzle row (see Patent Document 1). [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2006-256029 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] In this way, by gradually reducing the thickness of the edge of the nozzle plate protective member toward the nozzle row, the step difference between the edge and the nozzle plate can be reduced, thereby reducing snagging with the wiping member.

[0008] However, in the case of Patent Document 1 mentioned above, in order to physically reduce the aforementioned step difference, it is necessary to suppress the effect of the adhesive thickness, so a recess is provided in a part of the frame member to supply adhesive, and the joint is made with adhesive only in that part. Furthermore, the edge of the nozzle plate protective member is not joined to the nozzle surface of the nozzle plate.

[0009] As a result, an unavoidable gap is created between the edge of the nozzle plate protective member and the nozzle surface of the nozzle plate, where ink accumulates. Over time, the accumulated ink becomes more concentrated, and when it dries completely, it turns into particles, which then re-adhere to the nozzle surface, making it impossible to ensure sufficient cleanliness.

[0010] Therefore, the present invention aims to ensure the cleanliness of the nozzle surface of the chip plate while suppressing the peeling of the protective member. [Means for solving the problem]

[0011] One aspect of the present invention is a liquid discharge head comprising: a tip plate having a nozzle surface formed with nozzle holes for discharging liquid; a protective member covering at least a portion of the nozzle surface so as to avoid the nozzle holes; and an adhesive member for bonding the tip plate and the protective member, wherein, when the direction in which the liquid is discharged is defined as the first direction, the direction perpendicular to the first direction is defined as the second direction, and the direction perpendicular to both the first and second directions is defined as the third direction, the protective member is configured such that, when the cross-section in the second direction is viewed from the third direction, the top portion located between the first end and the second end protrudes in the first direction more than the first end on the side furthest from the nozzle holes in the second direction and the second end on the side opposite to the first end.

[0012] One aspect of the present invention is a liquid discharge head comprising a nozzle surface having a nozzle hole formed thereon for discharging liquid, and a protective member covering at least a portion of the nozzle surface so as to avoid the nozzle hole, wherein, when the direction in which the liquid is discharged is defined as the first direction, the direction perpendicular to the first direction is defined as the second direction, and the direction perpendicular to both the first and second directions is defined as the third direction, the protective member is configured such that, when the cross-section in the second direction is viewed from the third direction, the top portion located between the first end and the second end protrudes in the first direction more than the first end on the side furthest from the nozzle hole in the second direction and the second end on the side opposite to the first end.

[0013] One aspect of the present invention is a method for manufacturing a liquid dispensing head, comprising the steps of: preparing a tip plate having a nozzle surface including a nozzle hole for dispensing liquid; a frame member arranged to surround the outer circumference of the tip plate; and a protective member covering the space between the tip plate and the frame member; interposing an adhesive between the protective member, the tip plate, and the frame member, and aligning the protective member so that it does not overlap the nozzle hole; curing the adhesive between the inner periphery of the protective member and the tip plate, and the adhesive between the outer periphery of the protective member and the frame member, thereby temporarily fixing the protective member to the tip plate and the frame member; and heating the protective member and the adhesive in the temporarily fixed state to deform the protective member so that the space between the inner periphery and the outer periphery protrudes away from the nozzle surface, and to cure the uncured adhesive. [Effects of the Invention]

[0014] According to the present invention, it is possible to ensure the cleanliness of the nozzle surface of the chip plate while suppressing the peeling of the protective member. [Brief explanation of the drawing]

[0015] [Figure 1](a) is a schematic top view of a liquid ejection device according to a first embodiment. (b) is a schematic side view of the liquid ejection device according to the first embodiment. [Figure 2] (a) is a schematic perspective view of a liquid ejection head according to the first embodiment. (b) is a schematic plan view of the liquid ejection head according to the first embodiment. (c) is a cross-sectional view taken along line IIC-IIC' of the liquid ejection head according to the first embodiment. [Figure 3] (a) and (b) are schematic cross-sectional views of a liquid ejection head according to a comparative example, showing the state during recovery by a wiping member. [Figure 4] It is a schematic cross-sectional view of a liquid ejection head according to the first embodiment, showing the state during recovery by a wiping member. [Figure 5] It is a view showing a manufacturing process of a protective member having a mountain portion according to the first embodiment. [Figure 6] It is a schematic cross-sectional view of a liquid ejection head according to a second embodiment. [Figure 7] It is a view showing a space formed by a nozzle surface of a liquid ejection head and a protective member according to the first embodiment and the second embodiment. [Figure 8] It is a schematic cross-sectional view of a liquid ejection head according to a third embodiment. [Figure 9] It is a table showing experimental results according to an example. [Figure 10] It is a schematic diagram for explaining the process of a sliding test.

Embodiments for Carrying Out the Invention

[0016] Referring to the drawings, a liquid ejection head according to an embodiment of the present invention will be described. Note that the embodiments shown below are examples, and for example, those skilled in the art can appropriately change and implement the detailed configurations without departing from the gist of the present invention. In addition, for the sake of convenience of illustration and explanation, the drawings may be schematically represented, and thus the shapes, sizes, arrangements, etc. of the elements shown in the drawings may not necessarily exactly match the actual objects.

[0017] Furthermore, in the following description, directions are indicated by the XYZ coordinate system, which is a rectangular coordinate system. The X-axis, Y-axis, and Z-axis are perpendicular to each other. Also, the direction of the X-axis is also referred to as the X direction, the direction of the Y-axis as the Y direction, and the direction of the Z-axis as the Z direction. Further, for example, when referring to the plus direction of the X-axis, it refers to the same direction as pointed by the X-axis arrow in the illustrated coordinate system, and when referring to the minus direction of the X-axis, it refers to the direction opposite by 180 degrees to the direction pointed by the X-axis arrow in the illustrated coordinate system. Also, when simply referring to the X direction, it refers to a direction parallel to the X-axis regardless of the difference from the direction pointed by the X-axis arrow in the illustration. The same applies to the Y-axis and Z-axis other than the X-axis. Further, for example, a plane including the X-axis and Y-axis is expressed as the XY plane.

[0018] Also, in this specification, the "main component" means, when there are a plurality of components (materials) constituting an object, the component that is the most in terms of weight, and it means that the component occupies 50% by weight or more.

[0019] Furthermore, in the following description, the liquid handled by the liquid ejection head may be described as "ink", but the ink according to the present embodiment is not limited to a liquid containing a recording material for forming characters or images. For example, it may be a liquid containing a functional material for forming functional thin films such as electrodes and optical filters, or functional elements such as organic EL elements. It may also be a liquid containing insoluble solid components.

[0020] Also, when "recording" is described as applying a liquid to an object, the recording here is not necessarily limited to recording information such as characters and images. For example, it also includes applying a liquid to an object for manufacturing articles such as functional thin films, functional elements, and three-dimensional shaped objects. Also, when the object to which the liquid is applied is described as a "recording medium", it is not limited to a medium for recording information such as characters and images, and includes components (for example, substrates) that serve as a base material for manufacturing articles such as functional thin films, functional elements, and three-dimensional shaped objects. [[ID=]]

[0021] <First Embodiment> (Configuration of the liquid dispensing device) A liquid dispensing device 1 according to the first embodiment will now be described. Figure 1(a) is a schematic top view of the liquid dispensing device 1 according to the first embodiment. Figure 1(b) is a schematic side view of the liquid dispensing device 1 according to the first embodiment. In Figures 1(a) and 1(b), for the sake of illustration convenience, some elements constituting the liquid dispensing device 1, such as the power supply and the device cover, are omitted from the illustration.

[0022] The liquid dispensing device 1 includes a base 9. The base 9 is provided with a stage 10 for setting a recording medium 6. The recording medium 6 is, for example, a substrate for forming an organic EL element. A sub-scanning guide rail 7, which extends in the X direction in a plan view, is fixed to the base 9 via a support member 8. A main scanning guide rail 5, which acts as a carriage that can move along the X direction on the sub-scanning guide rail 7, is mounted on the sub-scanning guide rail 7, and a main scanner 4, which can move along the Y direction on the main scanning guide rail 5, is mounted on the main scanning guide rail 5. A liquid dispensing unit 2 capable of dispensing liquid toward the recording medium 6 is mounted on the main scanner 4. By moving the main scanning guide rail 5 in the X direction and the main scanner 4 in the Y direction, the liquid dispensing unit 2 can be freely scanned in the XY direction on the recording medium 6 set on the stage 10. Thus, the liquid dispensing device 1 makes it possible to move and scan the liquid dispensing unit 2, but the scanning mechanism is not limited to the illustrated configuration, and any configuration is acceptable as long as the liquid dispensing unit 2 can be scanned relative to the recording medium 6. For example, the recording medium 6 may be moved in one of the X and Y directions, while the liquid discharge unit 2 is moved in the other direction. Alternatively, the liquid discharge unit 2 may be fixed, and the recording medium 6 may be configured to move in both the X and Y directions.

[0023] The liquid ejection unit 2 is equipped with a liquid ejection head 100 capable of ejecting liquid toward the recording medium 6. The liquid is, for example, ink for forming an organic EL element. The liquid ejection head 100 is equipped with a liquid ejection element that applies pressure to the ink by utilizing, for example, the deformation of a piezoelectric element or boiling caused by a heating element, to eject the ink from the nozzle.

[0024] A main tank 11 is installed on the base 9. The main tank 11 is an example of a tank for supplying liquid to the liquid discharge head 100. The main tank 11 stores ink to replenish the ink in the sub-tank of the liquid discharge unit 2 when the ink level decreases. The main tank 11 is connected to a flow path 15 for circulating the stored ink.

[0025] The liquid dispensing device 1 includes a flow path 14 that can be opened and closed, connecting the sub-tank of the liquid dispensing unit 2 and the first flow path 15. Since the sub-tank moves as the liquid dispensing unit 2 is scanned in the XY direction, the flow path 14 is configured to include a flexible conduit portion.

[0026] The liquid dispensing device 1 is equipped with a liquid dispensing head 100 in which the orientation of the discharge ports of multiple nozzles is aligned and mechanical strength is ensured. Therefore, for example, organic EL elements can be manufactured stably over a long period of time. Alternatively, high-resolution recording can be stably performed over a long period of time using ink for information recording.

[0027] (Configuration of the liquid dispensing head) Figure 2(a) is a schematic perspective view of the liquid discharge head 100 according to the first embodiment. The liquid discharge head 100 is attached to the liquid discharge unit 2 shown in Figure 1, which is composed of a holder and piping.

[0028] The liquid dispensing head 100 comprises a protective member 101, a tip plate 102, an adhesive member 103, a frame member 104, a flexible flat cable 105, and a base 106. The tip plate 102 is an example of a plate. The protective member 101 is an example of a first member. The frame member 104 is an example of a second member. The base 106 is an example of a third member.

[0029] Figure 2(b) is a schematic plan view of the liquid discharge head 100 according to the first embodiment. Figure 2(c) is an IIC-IIC' cross-sectional view of the liquid discharge head 100 according to the first embodiment. That is, Figure 2(c) schematically shows the liquid discharge head 100 as viewed in the negative direction of the Y axis, with the cross section of the liquid discharge head 100 along a plane parallel to the XZ plane. Figure 2(b) schematically shows the liquid discharge head 100 as viewed in the negative direction of the Z axis, and the part of the liquid discharge head 100 hidden by the protective member 101 (gap 109) is shown in white for convenience.

[0030] The tip plate 102 is a plate-shaped component. That is, the tip plate 102 has a rectangular parallelepiped shape. Also, when viewed in the Z direction, the shape of the tip plate 102 is rectangular. Multiple nozzle holes 120, multiple liquid chambers (not shown), and multiple liquid flow paths (not shown) are defined in the tip plate 102.

[0031] The tip plate 102 has a nozzle surface 121 containing multiple nozzle holes 120, a back surface 122 opposite to the nozzle surface 121, and four sides. The Z direction is perpendicular to the nozzle surface 121. The Y direction is the longitudinal direction of the nozzle surface 121. The X direction is the short direction of the nozzle surface 121. The nozzle surface 121 faces the negative Z direction. The back surface 122 faces the positive Z direction. The nozzle surface 121 is a surface parallel to the XY plane. Liquid is discharged from each of the multiple nozzle holes 120 in the negative Z direction (downward, in the direction of gravity).

[0032] Multiple liquid discharge elements (not shown) are arranged inside the chip plate 102. Each of the multiple liquid discharge elements (not shown) imparts energy to the liquid, causing it to be discharged from the corresponding nozzle hole 120 among the multiple nozzle holes 120.

[0033] The back surface 122 of the chip plate 102 is fixed to the base 106 with an adhesive member (not shown). The base 106 has a supply port for supplying ink to the chip plate 102. The adhesive member is a cured adhesive.

[0034] The frame member 104 is a frame-shaped member with an open central portion that surrounds the outer circumference of the chip plate 102. The frame member 104 is supported by the base 106. The frame member 104 is fixed to the base 106 by screws 107. The frame member 104 has a surface 141 that faces the same direction as the nozzle surface 121. In order to align the height in the Z direction between the nozzle surface 121 of the chip plate 102 and the surface 141 of the frame member 104, a spacer 108 may be placed between the frame member 104 and the base 106. That is, the frame member 104 may be supported by the base 106 via the spacer 108.

[0035] A flexible flat cable 105 is electrically and mechanically connected to the chip plate 102. Specifically, an electrical contact is provided on one of the two sides 123 in the X direction of the chip plate 102, and the flexible flat cable 105 is electrically and mechanically connected to this electrical contact. The electrical contact is electrically connected to the liquid discharge element within the chip plate 102. The flexible flat cable 105 is used as a signal transmission path to drive the liquid discharge element within the chip plate 102. A gap 109 is provided between the chip plate 102, the frame member 104, and the base 106. The flexible flat cable 105 is arranged along the gap 109 and is drawn out from between the frame member 104 and the base 106 on the side of the liquid discharge head 100 and connected to a control board (not shown).

[0036] Although Figure 2(c) shows only one flexible flat cable 105, the liquid discharge head 100 is not limited to this. The liquid discharge head 100 may have two or more flexible flat cables. For example, the liquid discharge head 100 may have two flexible flat cables. One of the two flexible flat cables may be connected to one of the two sides of the chip plate 102 in the X direction. The other of the two flexible flat cables may be connected to the other of the two sides of the chip plate 102 in the X direction.

[0037] The protective member 101 is a plate-shaped member. The protective member 101 is fixed to a part of the nozzle surface 121 of the tip plate 102 with an adhesive member 103. The protective member 101 is a frame-shaped member formed so as not to overlap with the multiple nozzle holes 120 in the Z direction. That is, the protective member 101 is formed in a shape with an open central portion that surrounds the multiple nozzle holes 120. The protective member 101 is positioned across the tip plate 102 and the frame member 104 and is fixed to the tip plate 102 and the frame member 104 via the adhesive member 103. The adhesive member 103 is a cured adhesive.

[0038] By providing the protective member 101 on the nozzle surface 121 side of the chip plate 102, damage to the nozzle surface 121 caused by particles, thickness variations of the recording medium 6, etc., can be reduced, thereby reducing liquid failure and deviation in the liquid discharge direction. This prevents liquid discharge failure from occurring in the liquid discharge head 100.

[0039] Furthermore, the protective member 101 is positioned to overlap the chip plate 102 and the frame member 104 in the Z direction and is fixed to the chip plate 102 and the frame member 104. In this embodiment, the protective member 101 is positioned to overlap a part of the nozzle surface 121 of the chip plate 102 and a part of the surface 141 of the frame member 104 in the Z direction. It is also fixed to a part of the nozzle surface 121 of the chip plate 102 and a part of the surface 141 of the frame member 104 with an adhesive member 103.

[0040] In the example shown in Figure 2(c), both the nozzle surface 121 and the surface 141 are fixed to the protective member 101 with the same adhesive member 103, but this is not the only option. For example, the protective member 101 and the nozzle surface 121 of the tip plate 102 may be fixed with a first adhesive member, and the protective member 101 and the surface 141 of the frame member 104 may be fixed with a second adhesive member of a different type than the adhesive member 103.

[0041] Furthermore, ink ejected from the nozzle holes 120 of the liquid ejection head 100 may re-adhere to the nozzle surface 121 of the tip plate 102 as a mist. Electrical contacts to which the flexible flat cable 105 is connected are located on the side surface 123 of the tip plate 102. The protective member 101 is positioned to cover the gap 109, which is shown in white in Figure 2(b). By sealing the gap 109 with the protective member 101 and the adhesive member 103, ink is prevented from entering the gap 109 and from flowing onto the side surface 123 of the tip plate 102. In this way, the protective member 101 can prevent ink from entering the gap 109, thereby preventing short-circuit failures at the electrical contacts of the tip plate 102. This prevents liquid ejection failures from occurring in the liquid ejection head 100.

[0042] The chip plate 102 has fine ink channels and fine nozzle holes 120 formed therein. Due to the miniaturization of the internal structure of the chip plate 102, it is preferable that the chip plate 102 be manufactured using a semiconductor process, and silicon is preferably used as the main material, i.e., the main component, of the chip plate 102. The chip plate 102 has a stacked structure in which multiple silicon wafers are stacked.

[0043] Furthermore, the frame member 104 is provided on the base 106, mainly to cover the base 106 and the flexible flat cable 105. From the viewpoint of workability and other factors, metal is preferably used as the main component of the frame member 104. The metal is either a pure metal or an alloy. Examples of metals used as the main component of the frame member 104 include aluminum, Invar, Kovar, titanium, and stainless steel.

[0044] As shown in Figures 2(a), 2(b), and 2(c), when one chip plate 102 is provided for one frame member 104, aluminum or stainless steel is preferably used as the main component of the frame member 104, among metals.

[0045] Furthermore, if the area of ​​the coating region to which the liquid is applied increases with the size of the recording medium 6, the liquid discharge head 100 may be provided with a plurality of chip plates 102 arranged alternately. In such a case, a plurality of chip plates 102 may be provided for a single frame member 104, and the frame member 104 will become larger. When the frame member 104 becomes larger, the chip plates 102 become more susceptible to the effects of the linear expansion of the frame member 104 via the protective member 101 and the adhesive member 103, so it is preferable that the main component of the frame member 104 be a material with a small coefficient of linear expansion among metals. For example, among metals, Invar, Kovar, titanium, or stainless steel are preferably used as the main component of the frame member 104. Among stainless steels, martensitic stainless steel is preferably used.

[0046] The protective member 101 is positioned on the nozzle surface 121 of the tip plate 102. Therefore, of the protective member 101 and the tip plate 102, the protective member 101 is positioned closer to the recording medium 6 than the tip plate 102. The protective member 101 is located in the liquid discharge head 100 at the position closest to the recording medium 6. As a result, the nozzle surface 121 is protected by the protective member 101. As shown in Figure 2(c), the protective member 101 has a peak 112 between its two ends 110, 111 in the direction away from the nozzle hole row 120 (the -X direction on the IIC side and the +X direction on the IIC' side). This peak 112 is located in the direction away from the tip plate 102 (the -Z direction in the drawing) from the two ends 110, 111. The side closer to the nozzle hole row 120 is the end 111, and the side further away is the end 110. Furthermore, end 110 is the outer peripheral edge of the protective member 101, and will be referred to as the first end in the following description. In addition, end 111 is the inner peripheral edge of the protective member 101, and will be referred to as the second end in the following description.

[0047] The protective member 101 is a component that may come into contact with the recording medium 6, and therefore requires strength. Furthermore, the liquid ejection head 100 requires recovery operations, such as wiping off ink adhering to the nozzle surface 121 of the tip plate 102 with a wiper, and using a suction mechanism to remove ink remaining in the nozzle hole 120 after a pause. During these recovery operations, the protective member 101 may come into contact with the wiper or suction mechanism, so durability is required. From the viewpoint of achieving both strength and durability, metal is preferably used as the main component of the protective member 101. The metal can be a pure metal or an alloy. Examples of metals used as the main component of the protective member 101 include alloys such as Invar, Kovar, and stainless steel, as well as titanium. Thus, the material of the protective member 101 differs from the material of the tip plate 102.

[0048] Figure 3(a) shows the state of the nozzle recovery operation by the wiper. The wipe member 200 consists of a wipe 202 and a base 201. In addition to the shape shown, a cylindrical wipe 202 is also effective. The surface of the tip plate 102 is cleaned and its cleanliness is maintained by wiping the tip plate 102 and the protective member 101, while pressing the wipe 202, which is soaked in cleaning fluid, against the tip plate 102 having nozzle holes 120. The wipe 202 should be selected to have good wetting properties for the cleaning fluid and not damage the tip plate. Specifically, a mixture of polyester and cellulose is preferably used. In the recovery operation, as shown in Figure 3(a), the wipe member 200 is moved relative to the head (in the -X direction in the drawing) to remove ink adhering to the nozzle surface 121 and the surface 141 of the protective member 101 and frame member 104. The protective member 101 has ends 110 and 111, as described in Figure 2, but in the comparative example shown in Figure 3(a), it does not have the peak portion 112 and has a flat shape.

[0049] During the recovery operation, the wipe 202 first contacts the end 110 of the protective member 101, and as the wipe member moves, it continues to apply force to the protective member. The force is concentrated at the end 110, and repeated recovery operations may cause the protective member 101 to detach from the frame member 104, as shown in Figure 3(b). The figure shows the state where detachment has occurred at the interface between the protective member 101 and the adhesive layer 103, but detachment may also occur at the interface between the adhesive layer 103 and the surface 141 of the frame member 104 (not shown).

[0050] Figure 4 is a schematic cross-sectional view of the liquid discharge head according to this embodiment, showing the state during recovery by the wipe member. The protective member 101 differs in shape from the comparative example in that it has a peak 112 between the ends 110 and 111. When the wipe member 200 is moved relative to the head, the wipe 202 first contacts the end 110, as in the comparative example. However, because the protective member 101 has a peak shape, after contacting the end 110, the wipe 202 escapes in the -Z direction in the figure, and as a result the force acting on the end 110 is reduced, reducing the possibility of the protective member 101 peeling off from the frame member 104.

[0051] Furthermore, for example, when the wipe member 200 moves in the direction of the arrow in Figure 4 (-X direction), it comes into contact with the protective member 101 on the opposite side of the nozzle hole 120 from the entry side, and then comes into contact with the end portion 111. As a result, there is a possibility that the protective member 101 may peel off at the end portion 111 as well. However, as in this embodiment, since the protective member 101 has a curved shape, the force from the wipe 202 can be released along the slope at the end portion 111 as well. Consequently, the possibility of the protective member 101 peeling off from the chip plate 102 at the end portion 111 can be reduced.

[0052] (Manufacturing method for dispensing heads) Next, the manufacturing method of the liquid discharge head 100 will be described. First, in the first step, a protective member 101, a tip plate 102, a frame member 104, and a base 106 are prepared. At this time, an assembly is prepared in which the tip plate 102 is fixed to the base 106 and the frame member 104 is fixed to the base 106 with screws 107.

[0053] Next, in the second step, an adhesive, which is the raw material for the adhesive member 103, is applied to the protective member 101. "Adhesive" refers to a substance used for bonding that is uncured and has viscosity or fluidity. In this embodiment, the adhesive applied to the protective member 101 is preferably a thermosetting, photocuring, or photo-heat combined adhesive, as described later. These types of adhesives have fluidity or viscosity at room temperature but harden upon heating or exposure to light. Note that photocuring adhesives may be exposed to high temperatures when hardening by exposure to light. Photo-heat combined adhesives are adhesives that harden with light alone, heat alone, or both light and heat. Since metal is preferably used for the protective member 101, hardening through the protective member is impossible, and a thermosetting adhesive is preferably used to harden the adhesive in areas other than the edge region where light reaches.

[0054] Next, in the third step (positioning step), the protective member 101 is positioned. Specifically, adhesive is sandwiched between the protective member 101, the chip plate 102, and the frame member 104, and the protective member 101 is positioned relative to the chip plate 102 so as not to overlap with the nozzle hole 120 when viewed from the Z direction. At the same time, the protective member 101 is also positioned relative to the frame member 104. At this time, it is preferable that pressure is applied between the protective member 101 and the chip plate 102, and between the protective member 101 and the frame member 104, so that the thickness of the adhesive is uniform. The adhesive only needs to be interposed between the protective member 101 and the chip plate 102, and between the protective member 101 and the frame member 104. When applying the adhesive, it may be applied to the chip plate 102 and the frame member 104, or it may be applied to the protective member 101, the chip plate 102, and the frame member 104. Specifically, regarding the relationship between the chip plate 102 and the protective member 101, it is sufficient to apply adhesive to at least one of the chip plate 102 and the protective member 101. Furthermore, regarding the relationship between the frame member 104 and the protective member 101, it is sufficient to apply adhesive to at least one of the frame member 104 and the protective member 101. The adhesive used in this embodiment is a light- and heat-activated adhesive.

[0055] Next, in the fourth step, the adhesive is cured to fix the chip plate 102 and protective member 101 with adhesive member 103, and the frame member 104 and protective member 101 with adhesive member 103. The liquid discharge head 100, including adhesive members 103a and 103b, is cooled as the adhesive is cured. The curing process is explained in detail in Figures 5(a) to 5(f). In Figure 5(a), uncured adhesive 113 is applied to the protective member 101, and the chip plate 102 and protective member 101, and the frame member 104 and protective member 101 are positioned with the adhesive sandwiched between them. Figures 5(b) to 5(f) show enlarged views of the area indicated by the dashed line and labeled "enlarged area" in Figure 5(a). As shown in Figure 5(b), ultraviolet light 116 was irradiated from the side of the protective member 101 using an ultraviolet irradiation device 115 to cure the adhesive in the end region of the adhesive 113, forming adhesive members 103a and 103b. For the end furthest from the nozzle hole 120, the ultraviolet irradiation device 115 was installed on the side, while for the end closer to the nozzle hole, the ultraviolet irradiation device 115 was installed on the upper surface of the chip plate 102 (in the -Z direction in the drawing), and the light beam was refracted by a folded mirror 117 to irradiate the end. Figure 5(c) shows the state of heating to cure the adhesive in the parts other than the ultraviolet-cured end region. As the temperature rises, the protective member 101 is also heated and becomes protective member 114. Further heating causes the protective member 114 to expand by an amount equivalent to the product of the coefficient of linear expansion, the length of the member, and the temperature difference. However, since the adhesive in the end region of the protective member 101 was photocured in the previous step, fixing it to the chip plate 102 and frame member 104, it cannot be stretched in the X direction in the drawing. Since both ends are constrained, the material expands and stretches while forming peaks in the -Z direction on the drawing, as shown in Figure 5(d). At this stage, the temperature is below the curing start temperature of the adhesive. Heat-curing adhesives have the characteristic of decreasing viscosity and expanding as the temperature rises. Due to this characteristic, the adhesive 113 follows the deformation of the protective member 114 as it expands and stretches while forming peaks due to heating. As the temperature rises further, the curing start temperature of the adhesive is reached, and as shown in Figure 5(e), the adhesive 113 heat-cures while maintaining the expanded and stretched shape of the protective member 114, becoming the adhesive member 103.

[0056] Here, we will explain the shape of the peaks. For example, in the example in Figure 5(a), if the length of the protective member 101 in the X-axis direction is 5 mm and the material of the protective member is titanium (other suitably used materials will be described later), the shape of the peaks is calculated using the following idea. That is, if the coefficient of thermal expansion of titanium is 8.6 ppm and the curing start temperature of the adhesive is 80°C, then the elongation ΔL of titanium due to temperature is ΔL = 8.6 × 10 ―6 ×5×10 3 × (80 - 25) = 2.365 μm This is the result.

[0057] Furthermore, if a 5mm wide protective member stretches by 2.365 micrometers and is constrained at its end, the height of the peak in Figure 5(d) can be calculated using the following method. That is, assuming the original width of the protective member is the chord length d (5mm), the stretched portion of the protective member is the arc length L (5.002365mm), the maximum height of the peak is the arrow height h, and the radius when the protective member is assumed to stretch in an arc shape is r, the optimal solution can be calculated using a geometric formula and the Newton-Raphson method, resulting in h = 66.6 micrometers.

[0058] Note that the above calculations assume free expansion and contraction, so in reality the values ​​will vary due to the influence of the adhesive, but will generally be close to these figures. As will be discussed later, the distance between the chip plate and the recording medium needs to be kept to a few hundred micrometers. In the proposed configuration, elements that protrude beyond the chip plate 102 towards the recording medium include the height of the frame member, the thickness of the adhesive, the thickness of the protective member, and the thermal deformation (peak shape) of the protective member. Other factors besides the thermal deformation of the protective member may also exceed 100 micrometers, and when thermal deformation is added, it will approach the required several hundred micrometers. Considering the vertical movement of the stage during drawing and particles, if the peak shape is too large, problems will arise in aspects other than recovery. Although titanium is used as an example above, if the material of the protective member is aluminum, the linear expansion is 24.0 ppm, so even under the same conditions, the maximum height will be 111 micrometers. Furthermore, depending on the adhesive selected, the curing start temperature may be 120°C. In this case, the peak diameter becomes 88 micrometers for titanium and 146 micrometers for aluminum, and there is a good possibility that the peak shape will become larger. Considering the distance between the device's chip plate and the recording medium, the material and adhesive are appropriately selected to achieve an acceptable peak shape.

[0059] Figure 5(f) shows the state after the adhesive member 103 has completely hardened and has been cooled. The protective member 114 has returned to room temperature and become the protective member 101, but because the adhesive member 103 retains its shape from when it was hot, the protective member 101 also retains its shape with peaks, and this is how the liquid discharge head 100 shown in Figure 2(c) is created.

[0060] In printing on paper or film, the distance between the chip plate 102 and the recording medium 6 is on the order of millimeters. On the other hand, in printing on flat panels for displays, the distance between the chip plate 102 and the recording medium 6 is on the order of sub-millimeters (several hundred micrometers). This is because industrial printing requires both high-speed transport of the recording medium and high-precision ink placement, and to achieve this, it is essential to keep the distance between the chip plate 102 and the recording medium 6 to several hundred micrometers. Therefore, the protective member 101 placed on the nozzle surface 121 of the chip plate 102 is preferably on the order of tens of micrometers in thickness and preferably has a shape that does not have any protrusions such as burrs. Furthermore, it is preferable that the protective member 101 is fixed to the nozzle surface 121 of the chip plate 102 with sub-millimeter precision, and it is preferable that the opening shape of the protective member 101 is formed with a precision one order of magnitude smaller than that precision. In order to satisfy this requirement in the protective member 101, it is preferable that the protective member 101 be manufactured by laser processing or etching using photolithography, rather than by mechanical processing such as punching.

[0061] The protective member 101 may require strength, durability, and processability, and in some cases, the surface of the protective member 101 may be required to be coated with a liquid-repellent film. Considering the film-forming properties of the liquid-repellent film, among metals, alloys containing iron, cobalt, nickel, and chromium, or titanium are preferably used as the main component of the protective member 101. As for alloys, for example, Invar or Kovar are preferably used.

[0062] The adhesive member 103 needs to have sufficient adhesion to the protective member 101, the chip plate 102, and the frame member 104. Furthermore, since the adhesive member 103 forms a sealing portion that seals the gap 109, it is preferable that it has high durability against ink. From this viewpoint, a bisphenol-based epoxy adhesive or the like is preferably used for the adhesive member 103. The adhesive member 103 needs to have a stronger adhesion force between the two members, namely between the protective member 101 and the chip plate 102, and between the protective member 101 and the frame member 104, than the force generated by the difference in the coefficient of thermal expansion between the protective member 101 and the chip plate 102 / frame member 104. The generated force is a compressive force, a tensile force, or a shear force.

[0063] The adhesive member 103 is the cured product of the adhesive. The adhesive can be a room-temperature curing, thermosetting, or photocuring resin (adhesive). For high-precision joining of two members, it is preferable that the adhesive cures quickly after the two members have been aligned, and photocuring resins or thermosetting resins are suitably used as the adhesive. While photocuring resins cure in the shortest time among adhesives, it is difficult to irradiate all of the adhesive applied between the chip plate 102 and the protective member 101 with light. Furthermore, when a photocuring resin is used as the adhesive, initiator residue tends to remain on the adhesive member 103. For this reason, thermosetting resins are suitably used as the adhesive.

[0064] If the adhesive is a thermosetting resin, the manufacturing process of the liquid dispensing head 100 includes a heating step in which the adhesive is heated to cure it. Even if the adhesive is a photocurable resin, heating may still be performed when curing the adhesive. When curing the adhesive, the protective member 101, the chip plate 102, and the frame member 104 expand due to the heating. After the adhesive has cured, the protective member 101, the chip plate 102, and the frame member 104 contract due to the cooling process. The protective member 101 has a larger coefficient of linear expansion than the chip plate 102. In other words, there is a difference between the coefficient of linear expansion of the protective member 101 and the chip plate 102, and forces such as compressive force, tensile force, or shear force act on the chip plate 102.

[0065] Furthermore, although it depends on the thickness of the adhesive, the adhesive expands or compresses when it hardens, and a force is generated due to this deformation. In order to reduce the effect of expansion or compression when the adhesive hardens, and to make the thickness of the hardened adhesive member 103 uniform, filler particles may be included as additives in the adhesive member 103 (adhesive). Inorganic oxides such as silica, alumina, or titania are preferably used as filler particles. However, the filler particles are not limited to the above examples, as long as they are particles that can be adjusted to a thickness such that the adhesive member 103 is not destroyed even if pressure is applied to the adhesive member 103 after the adhesive has hardened.

[0066] The main component of the chip plate 102 is preferably silicon. That is, it is preferable that the material of the chip plate 102 is mainly silicon. Furthermore, since fine structures such as liquid chambers and liquid flow paths are formed inside the chip plate 102, the chip plate 102 is prone to cracking if excessive force is applied to it. That is, in the joining between the protective member 101 and the chip plate 102, it is necessary to suppress cracking of the chip plate 102 and delamination at the adhesive member 103, but there is a risk that cracking of the chip plate 102 may occur before delamination occurs at the adhesive member 103. It is preferable that the difference between the coefficient of thermal expansion of the protective member 101 and the coefficient of thermal expansion of the frame member 104 is small. Considering the difference between the coefficient of thermal expansion of the protective member 101 and the coefficient of thermal expansion of the frame member 104, among metals, Kovar or titanium is preferably used as the main component of the protective member 101, and among Kovar and titanium, Kovar is preferably used. However, considering adhesion with the chip plate 102, it is preferable to select a material for the protective member 101 that has a coefficient of thermal expansion greater than that of the chip plate 102.

[0067] On the other hand, in the joint between the protective member 101 and the frame member 104, the risk of cracking is low, as with the chip plate 102, and the risk of delamination only is high in the adhesive member 103. That is, the difference in the coefficient of linear expansion between the frame member 104 and the protective member 101 can be larger compared to the chip plate 102. From this viewpoint, stainless steel or aluminum is preferably used as the main component of the frame member 104 among metals. From the viewpoint of workability and cost of the frame member 104, stainless steel is preferably used as the main component of the frame member 104 among metals.

[0068] As for stainless steel, stainless steel specified as SUS403 in JIS (Japanese Industrial Standards) or stainless steel specified as SUS309S in JIS is preferred. Hereinafter, stainless steel specified as SUS403 in JIS will be simply referred to as "SUS403," and stainless steel specified as SUS309S in JIS will be simply referred to as "SUS309S."

[0069] SUS403 is a stainless steel containing 0.15% or less carbon (C), 0.50% or less silicon (Si), 1.00% or less manganese (Mn), 0.040% or less phosphorus (P), 0.030% or less sulfur (S), 2.00% or less nickel (Ni), and 11.50% to 13.00% chromium (Cr).

[0070] SUS309S is a stainless steel containing 0.08% or less carbon (C), 1.00% or less silicon (Si), 2.00% or less manganese (Mn), 0.045% or less phosphorus (P), 0.030% or less sulfur (S), 12.00% to 15.00% nickel (Ni), and 22.00% to 24.00% chromium (Cr).

[0071] SUS403 is a martensitic stainless steel, which has a low coefficient of thermal expansion and offers significant cost advantages. SUS309S is an austenitic stainless steel, which has superior chemical resistance compared to martensitic stainless steel. The appropriate stainless steel should be selected based on the ink being used.

[0072] Aluminum is lightweight and inexpensive. However, aluminum has a high coefficient of thermal expansion, and when bonding with Kovar, which is suitably used in protective member 101, or titanium, which has a high coefficient of thermal expansion, the force generated is 50 MPa. Depending on the force generated, it is necessary to select an adhesive with high adhesion strength. Alumina is a material with a low coefficient of thermal expansion and generates a small force, but its poor processability makes it impractical.

[0073] If the force acting between the two members is less than or equal to the adhesion force of the adhesive member 103, the likelihood of delamination occurring in the adhesive member 103 decreases. The adhesion force of the adhesive member 103 can be expressed in terms of shear strength and tensile strength, but in the joining of the protective member 101 and the adhesive member 103, thermal thermal expansion is the cause of delamination, so it is considered sufficient if the shear strength of the adhesive member 103 is greater than the force acting between the two members. The shear strength of epoxy resin is several tens of megapascals, although this depends on the type of adhesive and the members to be bonded.

[0074] As described above, in this embodiment, the protective member 101 has a semi-circular shape that protrudes in the -Z direction between its outer peripheral edge 110 and inner peripheral edge 111. That is, when the protective member 101 is viewed from the Y direction, for example, from a cross-section in the X direction (IIC-IIC' cross-section), the top (peak) 112 between the two ends 110 and 111 protrudes in the -Z direction more than the two ends 110 and 111. Therefore, for example, as shown in Figure 4, even if the wipe 202 moving from the X direction during recovery operation comes into contact with the first end (the end furthest from the nozzle hole 120) 110 of the protective member 101, the stress from the wipe 202 can be released in the -Z direction. Similarly, the stress from the wipe 202 can also be released in the -Z direction at the second end (the end opposite to the first end) 111 of the protective member 101. Therefore, the protective member 101 can suppress peeling at both ends 110 and 111. In addition, it is possible to suppress the deterioration of the wipe 202 caused by snagging.

[0075] In particular, since the protective member 101 has a shape in which the first end 110 and the second end 111 and the top 112 are connected by a curved surface, stress from the wipe 202 can be relieved more smoothly. Note that the first end 110 and the second end 111 and the top 112 may also be connected by a flat surface.

[0076] Furthermore, since the second end 111 of the protective member 101 and the nozzle surface 121 of the tip plate 102 are bonded together by the adhesive member 103, the ejected liquid cannot penetrate between these members. In other words, it is possible to eliminate areas where ejected liquids such as ink can accumulate. As a result, the liquid that penetrates between the members will not dry and turn into particles, nor will the penetrated liquid re-adhere to the nozzle surface 121. Therefore, a clean nozzle surface 121 can be maintained for a long period of time. Moreover, since the first end 111 of the protective member 101 and the surface 141 of the frame member 104 are bonded together by the adhesive member 103, the ejected liquid cannot penetrate between these members. As a result, the liquid that penetrates between the members will not dry and turn into particles, nor will the penetrated liquid re-adhere to the nozzle surface 121. Therefore, a clean nozzle surface 121 can be maintained for a long period of time. In addition, it is possible to prevent liquid discharged from entering the gap 109 between the chip plate 102 and the frame member 104 through the protective member 101, thereby preventing damage to the terminals of the chip plate 102.

[0077] Furthermore, after aligning the protective member 101 with respect to the chip plate 102 and frame member 104 (alignment step), the protective member 101 is temporarily fixed to the chip plate 102 and frame member 104 (Figures 5(b), (c)). Specifically, the adhesive 103b between the inner peripheral edge 111 of the protective member 101 and the chip plate 102, and the adhesive 103a between the outer peripheral edge 110 of the protective member 101 and the frame member 104 are selectively cured. Then, by heating the protective member 101 and the uncured adhesive 113 in this temporarily fixed state, the protective member 101 is molded into the shape described above. Therefore, the protective member 101 can be positioned accurately and molded at the same time. Furthermore, for this reason, the cured adhesive member 103 includes a first adhesive portion 1031 that adheres the first end portion 110, which was cured during temporary fixing, to the frame member 104, and a second adhesive portion 1032 that adheres the second end portion 111 to the chip plate 102. It also includes a third adhesive portion 1033 between the first adhesive portion and the second adhesive portion. The first adhesive portion 1031 and the second adhesive portion 1032 are adhesive portions that have been cured while the third adhesive portion 1033 is still in an uncured state.

[0078] In this embodiment, the -Z direction can be described as the first direction from which liquid is ejected from the nozzle hole 120, which is the normal direction of the nozzle surface 121 of the tip plate 102 in which the nozzle hole 120 is formed. The X direction can be described as the second direction, which is perpendicular to the first direction. The Y direction can be described as the third direction, which is perpendicular to both the first and second directions. Furthermore, although the shape of the protective member 101 was described by showing a cross-section in the X direction, which is the direction in which the wipe 202 moves during the recovery operation, the protective member also has a similar convex shape (mountain shape) in the cross-section in the Y direction. Moreover, the protective member 101 may be molded into a convex shape by pressing or the like.

[0079] <Second Embodiment> Next, a second embodiment will be described. In the following description, elements with reference numerals common to the first embodiment will have substantially the same configuration and function as those described in the first embodiment unless otherwise specified, and the differences from the first embodiment will be mainly described.

[0080] Figure 6(a) is a schematic cross-sectional view of the liquid discharge head 100 according to the second embodiment. The positions of IIC and IIC' in the drawing are the same as in Figure 2(b). In the first embodiment, as shown in Figure 2(c), the nozzle surface 121 of the chip plate 102 and the surface 141 of the frame member 104 were set to the same height in the Z-axis direction. On the other hand, in the second embodiment, as shown in Figure 6(a), the surface 141 of the frame member 104 is formed at a higher position (in the -Z direction on the drawing) than the nozzle surface 121. The frame member 104 protrudes further in the droplet discharge direction than the chip plate 102, that is, the frame member 104 is formed closer to the drawing medium such as a glass substrate or paper. Several reasons for this shape are given below.

[0081] The purpose of installing the protective member 101 is to prevent ink from entering the output wiring and to prevent particles on the drawing medium from coming into contact with the nozzle surface, which could cause head damage or ejection failure. The thicker the protective member 101, the greater this effect becomes. However, this also leads to a problem in this invention: increasing the thickness increases the height difference between the nozzle surface 121 and the protective member 101, which could cause the wipe 202 to get caught and peel off during recovery. Raising the frame member 104 makes it possible to protect the chip plate 102, and by installing a thin protective member 101 in this state, the problem (catching) during recovery operation is eliminated. In other words, raising the frame member 104 is effective in achieving an optimal state that protects the chip plate 102 and solves the problem caused by the wipe during recovery.

[0082] The second point concerns protection during the manufacturing process. During the manufacturing process of the liquid discharge head 100, the nozzle surface 121 may come into contact with jigs or equipment over a surface area. The nozzle surface 121 requires cleanliness, and the tip plate 102 is a laminated structure with a fine structure, making it a fragile structure. By positioning the frame member 104 higher than the nozzle surface 121, issues such as contact that occur during the manufacturing process can be reduced.

[0083] The third point concerns mist recovery. In inkjet printing, when ink is ejected from the nozzle, it is sometimes divided into smaller droplets called satellites in addition to the main droplet. While satellites often combine with the main droplet before impact, small satellites often fail to combine and instead become mist, adhering to various locations within the printing device or to locations unintended. If this accumulates, it can solidify and fall onto the substrate, causing problems. The mist needs to be recovered to prevent it from re-adhering to various locations within the printing device. To prevent mist from floating, a mist recovery mechanism is installed next to the print head in the printing device. Although not shown, an air intake for sucking in mist is often installed on the outside of the frame member 104 in Figures 7(a) and (b). This creates an airflow that prevents the small satellites, which become mist, from reaching the substrate while the main droplet size remains unaffected. The mist in the space formed by the nozzle surface 121, the adhesive layer 103, and the protective member 101 can be wiped off during recovery if it adheres to the member in this space. Because there is a mist recovery mechanism, most of it will adhere to the protective member. If this space is large, it is possible to reduce the amount of mist that flows to other places and reattaches to places where removal is impossible, which is a great advantage for a drawing device. Figure 7(a) shows the case when the height of the chip plate 102 and the frame member 104 are the same, and Figure 7(b) shows the case when the frame member 104 protrudes beyond the chip plate 102 in the -Z axis direction. The volumes enclosed by the protective member 101, the chip plate 102, and the adhesive layer 103 are shown as V1 and V2+V3 in the figures, respectively. V2 is the same volume as V1, and because the heights of the frame member 104 and the chip plate 102 are different, it is thought that the configuration in Figure 7(b) can recover more mist by the volume corresponding to V3.

[0084] From the above perspective, in this embodiment, the frame member 104 is configured to protrude beyond the chip plate 102 towards the drawing medium. That is, the surface 141 of the frame member 104 to which the protective member 101 is bonded is configured to protrude in the -Z axis direction compared to the nozzle surface 121 of the chip plate 102. Also in this embodiment, as shown in Figure 6(b), similar to the first embodiment, the uncured adhesive 113 is sandwiched between the protective member 101 and the chip plate 102 and between the protective member 101 and the frame member 104 to align them, and then the adhesive is cured to join them. Figure 6(C-1) shows an excerpt of the relationship between the protective member 101 and the uncured adhesive 113 at this time. T1 and T2 in the drawing indicate the adhesive thickness between the protective member 101 and the chip plate 102 and the adhesive thickness between the protective member 101 and the frame member 104, respectively.

[0085] The difference in height in the Z-axis direction between the surface 141 of the frame member 104 and the nozzle surface 121 of the tip plate 102 is the difference between T1 and T2. The thickness of the adhesive between the nozzle surface 121 of the tip plate 102 and the protective member 101, T1, is greater than the thickness of the adhesive between the surface 141 of the frame member 104 and the protective member 101, T2. Therefore, the curing shrinkage is greater for T1, and as shown in Figure 6(C-2), the protective member 101 deforms more at the end 111 side than at the end 110. In other words, the end 111 of the protective member 101 on the nozzle hole 120 row side deforms more than the end 110 on the joining side with the frame member, and is located on the +Z side in the Z-axis direction in the drawing. The dashed line in the drawing shows the original position of the upper surface of the protective member 101. At this time, the top portion 112 of the protective member 101 is formed closer to the second end 111 than to the first end 110 in the X direction (second direction).

[0086] In the first embodiment, the shape of the protective member 101 was determined by the coefficient of thermal expansion of the protective member. However, in this embodiment, in addition to the coefficient of thermal expansion of the protective member 101, the curing shrinkage of the adhesive also has an effect. As described above, the thickness of the adhesive differs on the chip plate 102 and the frame member 104, resulting in different degrees of deformation of the protective member 101. In this embodiment, this difference is used to deform the protective member 101 into a mountain shape. Therefore, in this embodiment, it is preferable for the protective member 101 to reflect this curing shrinkage behavior of the adhesive; in other words, the thinner the protective member 101, the more suitable it is. Specifically, if the thickness of the protective member 101 is 50 micrometers or less, it will more easily reflect the deformation of the adhesive and is therefore preferable for use.

[0087] The protective member 101 is joined to the chip plate 102 and frame member 104 via adhesive 113. At this time, the protective member 101 is chucking and simultaneously pressed against the chip plate 102 and frame member 104 during joining. This is done to spread the adhesive, align the joining position, and eliminate tilting of the protective member in the Z-axis direction (i.e., uneven film thickness depending on location). The chucking member used for pressing is designed to be smaller than the protective member 101 to account for adhesive overflow, and therefore no force is applied to the ends during joining, which tends to cause the ends to curl upwards. If temporary fixing is performed by light curing in this state, the resulting shape will be reflected, and the most important end shape will be in the opposite direction to that of the present invention. For this reason, it is desirable that the protective member 101 has a thickness such that it does not curl during chucking, for example, 20 micrometers or more.

[0088] If the thickness of the protective member 101 is in the range of 20 micrometers to 50 micrometers, it will reflect the behavior of the substrate adhesive while also ensuring the rigidity of the protective member.

[0089] Although the thickness of the adhesive differs on the chip plate 102 and the frame member 104, the manufacturing process for joining the protective member 101 to create a shape effective for this invention is the same as in the first embodiment.

[0090] <Third Embodiment> Next, a third embodiment will be described. Hereinafter, elements denoted by the same reference numerals as those in the first or second embodiment will have substantially the same configuration and function as those described in the first or second embodiment unless otherwise specified. The differences from the first and second embodiments will be the main focus of the description.

[0091] In the first and second embodiments, only one type of adhesive 113, a light- and heat-activated adhesive, was used. However, in the third embodiment, two types of adhesives are used: a light-curing or light- and heat-activated adhesive 118 and a thermosetting adhesive 113. The arrangement of the adhesives is as shown in Figure 8(a), with the light-curing or light- and heat-activated adhesive 118 placed on the inner peripheral edge 111 and outer peripheral edge 110 of the protective member 101, and the thermosetting adhesive 113 placed in the other areas.

[0092] Furthermore, because the adhesive is arranged in this manner, the adhesive member 103 after the adhesive has hardened comprises a first adhesive portion 1031 and a second adhesive portion 1032, as shown in Figure 8(b). It also comprises a third adhesive portion 1033 formed by the hardening of a different type of adhesive than the first adhesive portion 1031 and the second adhesive portion 1032. More specifically, the first adhesive portion 1031 is formed by the hardening of the above-mentioned light- and heat-activated adhesive 118, and adheres the outer peripheral edge (first end) 110 of the protective member 101 to the frame member 104. The second adhesive portion 1032 is formed by the hardening of the above-mentioned light- and heat-activated adhesive 118, and adheres the inner peripheral edge (second end) 111 of the protective member 101 to the chip plate 102. The third adhesive portion 1033 is formed by the hardening of the above-mentioned thermosetting adhesive 113, and is located between the first adhesive portion 1031 and the second adhesive portion 1032.

[0093] In Figure 8(a), the two adhesives are in contact, but if this does not affect the overall adhesion, the amount of thermosetting adhesive can be reduced and the two adhesives can be separated. The application width of the light-curing or light / heat combined adhesive 118 is the maximum width reached by light (ultraviolet light is preferably used) and the minimum width is the width that provides sufficient adhesion to restrain the protective member 101 when heated. The values ​​will vary depending on the material used, but 0.1 to 0.5 mm is a target guideline. When the two adhesives are in contact, avoid using combinations that would inhibit each other's curing reaction by coming into contact while they are in a liquid state before curing. The adhesives can be applied using a dispenser, but considering the ease of application, it is best to apply them to the protective member 101. After applying adhesives 113 and 118 to the protective member 101, pressurize the adhesive while aligning it with the chip plate 102 and frame member 104 to spread it out and then begin curing. At this time, if the rheological properties of the two types of adhesives are similar, it will be possible to spread them out uniformly. Fillers may be added to the adhesive to adjust its rheological properties.

[0094] As described in the first embodiment, epoxy resin is preferably used as the thermosetting adhesive in this embodiment from the viewpoint of adhesion, durability, hardness, and solvent resistance. On the other hand, acrylic resin may be preferably used as the photocuring adhesive from the viewpoint of reaction rate. Due to the difference in curing reaction mechanisms, epoxy resin and acrylic resin have different shrinkage rates during curing, with acrylic resin generally having about twice as large a shrinkage rate. If the curing shrinkage rates differ significantly, there is a concern that the stress during curing will increase and lead to delamination, so in this embodiment, epoxy resin is preferably used for the photocuring adhesive as well. By using epoxy resin, the risk of mutual interference when they come into contact can also be reduced. The manufacturing process is the same as in the first embodiment.

[0095] <Fourth Embodiment> Next, a liquid dispensing head of the fourth embodiment will be described. This embodiment combines the features of the second and third embodiments. The frame member 104 protrudes from the chip plate 102 in the -Z axis direction, and the protective member 101 is joined in this state. The adhesive used is a light-curing adhesive 118 for the inner and outer peripheral edges of the protective member 101, and a thermosetting adhesive 113 for the other parts.

[0096] Furthermore, in this embodiment, in order to improve the removal of unwanted ink from the protective member 101, five surfaces of the protective member 101 that are not coated with adhesive are treated with a liquid-repellent coating. Since treating the surfaces to which adhesive is applied would result in poor adhesion, these surfaces are left untreated. Specifically, a fluorine-based silane coupling agent is deposited by vapor deposition, but protective tape is applied to the untreated surfaces to prevent film formation.

[0097] <Examples> Examples 1 to 4 and Comparative Example 1, which show the experimental results, are described below. Figure 9 is a table showing the experimental results for each example. In the evaluation of the catch result shown in Figure 9, "A" was used when the sliding resistance value was small and there was no change in the sliding resistance value during the sliding test. "B" was used when there was no change in the sliding resistance value during the test, but the sliding resistance value was greater than "A". "C" was used when a change in the sliding resistance value was observed when the wipe member 302 of the sliding test section 300 caught on the end of the protective member 101 (estimated to be a numerical change due to a step or catch). "D" was used when a change in the sliding resistance value was observed when the wipe member 302 of the sliding test section 300 caught on the end of the protective member 101, and that value increased during the test, similar to "C".

[0098] The sliding test is explained here with reference to Figure 10. Figures 10(a) and (b) are schematic diagrams showing the state when a sliding test is performed on the liquid discharge head 100 shown in Figures 2(b) and (c) using the sliding test section 300. As shown in Figure 10(b), the sliding test section 300 has a wipe member 302 attached to a movable part 301 connected to the main body of the test device (not shown), and is configured to reciprocate in the X-axis direction while applying a load in the +Z direction in Figure 10(b). Therefore, during the sliding test, the wipe member 302 slides while applying a load to the frame member 104, the tip plate 102, and the protective member 101 which is joined to both by an adhesive member 103. At this time, ink is impregnated into the wipe member 302 as needed. The sliding test section 300, as a sliding test device, is configured to measure the resistance value applied to the movable part 301, thereby making it possible to determine the state of sliding. As shown in Figure 10(a), the sliding range starts from one outer edge of the frame member 104 and moves back and forth to the other outer edge.

[0099] (Example 1) Example 1, corresponding to the first embodiment, will now be described. In Example 1, the liquid dispensing head 100 shown in Figures 2(a) to 2(c) was manufactured. First, a titanium plate was prepared, and a titanium protective member 101 with the shape shown in Figures 2(a) to 2(c) was fabricated by etching using photolithography. The thickness of the protective member 101 was set to 50 μm to reduce snagging and to conform to the shape of the underlying adhesive.

[0100] Next, an assembly was prepared in which a frame member 104 made of SUS410 stainless steel was fixed with screws 107 to a base 106 to which a silicon chip plate 102 was attached. At this time, spacers 108 were used to adjust the height so that the chip plate 102 and the frame member 104 were at the same level.

[0101] Next, a predetermined amount of adhesive was applied to the designated location on the protective member 101 using a dispenser (manufactured by Musashi Engineering Co., Ltd.). A bisphenol-type photo- and heat-activated epoxy adhesive (World Lock 5191S, manufactured by Kyoritsu Chemical Industry Co., Ltd.) was used as the adhesive. After the adhesive-coated protective member 101 was adsorbed with an adsorption pad and placed in the designated location on the chip plate 102 and frame member 104, the adhesive was evenly spread across the bonding area by applying pressure of 1 kgf from above while aligning it with an alignment device. Subsequently, the adhesive on the outer and inner edges of the protective member was treated with a UV irradiation device (manufactured by HOYA CANDEO OPTRONICS) at 6 J / cm². 2 The adhesive at the edges was cured with the irradiation dose. Next, the adhesive in the other areas was cured by heating in an oven at 120°C for 1 hour, and the liquid dispensing head 100 was fabricated.

[0102] After removing the liquid discharge head 100 from the oven, the positional relationship between the tip plate 102 and the protective member 101 was examined under a microscope. The deviation from the alignment mark was less than 5 μm, confirming that the joint was made with high precision. Furthermore, the shape of the protective member 101 was measured and evaluated using a 3D shape measuring machine (Nikon NEXIV). It was confirmed that the height of the outer and inner edges of the protective member 101 was low, with a raised area in between.

[0103] An ultrasonic microscope was used to observe the bonding area for delamination, void formation, and other defects, but no defects were found. Furthermore, the tip plate 102 of the liquid ejection head 100 was immersed in ink, removed, and examined under a microscope. As a result, it was confirmed that there were no problems with the sealing performance. The liquid ejection head 100 was set in the liquid ejection device 1, and a liquid ejection test was performed, confirming that there were no problems with the liquid ejection performance.

[0104] Finally, the liquid discharge head 100 was set in the sliding test apparatus and a sliding test was performed. The wipe member 302 was immersed in ink, and a load of 1N was applied, and sliding was performed 20,000 times in a reciprocating motion as shown in Figure 10. During the sliding test, the resistance value applied to the sliding test section 300 was continuously measured at 10 msec intervals. Although the sliding resistance fluctuated at the stepped sections between the frame member 104 and the protective member 101, and between the chip plate 102 and the protective member 101, no numerical change was observed from the initial value even after 20,000 cycles. Furthermore, after the test was completed, the shape of the protective member 101 was measured using a 3D shape measuring machine, as before the test, and compared with the state before the test, but no change in shape was observed. In addition, when the surface of the protective member 101 was observed with an optical microscope, some ink residue was observed, but it was confirmed that it had been removed when the wipe member 302 was replaced with a new one and two reciprocating sliding cycles were performed.

[0105] (Example 2) Example 2, corresponding to the second embodiment, will now be described. In Example 2, the liquid discharge head 100 shown in Figures 2(a), (b), and 6(a) was manufactured. First, a Kovar plate was prepared, and a Kovar protective member 101 with the shape shown in Figures 2(a) and 2(b) was fabricated by etching using photolithography. The thickness of the protective member 101 was set to 50 μm, similar to Example 1, to reduce snagging and conform to the shape of the underlying adhesive.

[0106] Furthermore, an assembly was prepared in which a frame member 104 made of SUS410 stainless steel was fixed with screws 107 to a base 106 to which a silicon chip plate 102 was attached. At this time, the height of the frame member 104 was adjusted by using a spacer 108 so that it was 30 μm higher than the chip plate 102.

[0107] Next, as in Example 1, a predetermined amount of adhesive was applied to the predetermined position on the protective member 101 using a dispenser (manufactured by Musashi Engineering Co., Ltd.). A bisphenol-type photo- and heat-activated epoxy adhesive (World Lock 5191S, manufactured by Kyoritsu Chemical Industry Co., Ltd.) was used as the adhesive. After the protective member 101 with the adhesive applied was adsorbed with an adsorption pad and placed in the predetermined position on the chip plate 102 and frame member 104, the adhesive was spread uniformly over the bonding area by applying pressure of 1 kgf from above while aligning it with an alignment device. Subsequently, the adhesive on the outer and inner edges of the protective member was treated with a UV irradiation device (manufactured by HOYA CANDEO OPTRONICS) at 6 J / cm². 2 The adhesive at the edges was cured with the irradiation dose. Next, the adhesive in the other areas was cured by heating in an oven at 120°C for 1 hour, and the liquid dispensing head 100 was fabricated.

[0108] After removing the liquid discharge head 100 from the oven, the positional relationship between the tip plate 102 and the protective member 101 was examined under a microscope. The deviation from the alignment mark was less than 5 μm, confirming that the joint was made with high precision. Furthermore, the shape of the protective member 101 was measured and evaluated using a 3D shape measuring machine (Nikon NEXIV). It was confirmed that the height of the protective member 101 was higher at the outer edge than at the inner edge, with the highest region existing in between.

[0109] An ultrasonic microscope was used to observe the bonding area for delamination, void formation, and other defects, but no defects were found. Furthermore, the tip plate 102 of the liquid ejection head 100 was immersed in ink, removed, and examined under a microscope. As a result, it was confirmed that there were no problems with the sealing performance. The liquid ejection head 100 was set in the liquid ejection device 1, and a liquid ejection test was performed, confirming that there were no problems with the liquid ejection performance.

[0110] Finally, the liquid discharge head 100 was set in the sliding test apparatus and a sliding test was performed. The wipe member 302 was immersed in ink, and a load of 1N was applied, and sliding was performed 20,000 times in a reciprocating motion as shown in Figure 10. During the sliding test, the resistance value applied to the sliding test section 300 was continuously measured at 10 msec intervals. The sliding resistance did not change significantly throughout the entire range, and no numerical change was observed from the initial value even after 20,000 cycles. In addition, after the test was completed, the shape of the protective member 101 was measured using a 3D shape measuring machine as before the test and compared with the state before the test, but no change in shape was observed. Furthermore, when the surface of the protective member 101 was observed with an optical microscope, some ink residue was observed, but it was confirmed that it had been removed when the wipe member 302 was replaced with a new one and two reciprocating sliding cycles were performed.

[0111] (Example 3) Example 3, corresponding to the third embodiment, will now be described. In Example 3, the liquid dispensing head 100 shown in Figures 2(a), (b) and 8 was manufactured. Similar to Example 1, a titanium plate was prepared, and the titanium protective member 101 shown in Figures 2(a) and (b) was fabricated by etching using photolithography. The thickness of the protective member 101 was set to 50 μm, similar to Example 1, to reduce snagging and conform to the shape of the underlying adhesive.

[0112] Furthermore, an assembly was prepared in which a frame member 104 made of SUS410 stainless steel was fixed with screws 107 to a base 106 to which a silicon chip plate 102 was attached. At this time, spacers 108 were used to adjust the height so that the chip plate 102 and the frame member 104 were at the same level.

[0113] Next, similar to Example 1, a predetermined amount of adhesive was applied to the designated positions on the protective member 101 using a dispenser (manufactured by Musashi Engineering Co., Ltd.). Bisphenol-type photo- and heat-activated epoxy adhesive (Worldlock 5191S, manufactured by Kyoritsu Chemical Industry Co., Ltd.) and a bisphenol-type thermosetting epoxy adhesive with a naphthalene skeleton were used. The adhesive placement is shown in Figure 8, with photo-curing or photo- and heat-activated adhesive 118 applied to the inner and outer edges of the protective member 101, and thermosetting adhesive 113 applied to the other areas. After the adhesive-coated protective member 101 was adsorbed using an adsorption pad and placed in the designated positions on the chip plate 102 and frame member 104, the adhesive was uniformly spread across the bonding area by applying pressure from above at 1 kgf while aligning it with an alignment device. Subsequently, the photo- and heat-activated adhesive on the outer and inner edges of the protective member was treated with a UV irradiation device (manufactured by HOYA CANDEO OPTRONICS) at 6 J / cm². 2 The adhesive at the edges was cured with the irradiation dose. Next, the thermosetting adhesive in the other areas was cured by heating in an oven at 120°C for 1 hour, thereby creating the liquid dispensing head 100.

[0114] After removing the liquid discharge head 100 from the oven, the positional relationship between the tip plate 102 and the protective member 101 was examined under a microscope. The deviation from the alignment mark was less than 5 μm, confirming that the joint was made with high precision. Furthermore, the shape of the protective member 101 was measured and evaluated using a 3D shape measuring machine (Nikon NEXIV). It was confirmed that the height of the outer and inner edges of the protective member 101 was low, with a raised area in between.

[0115] An ultrasonic microscope was used to observe the bonding area for delamination, void formation, and other defects, but no defects were found. Furthermore, the tip plate 102 of the liquid ejection head 100 was immersed in ink, removed, and examined under a microscope. As a result, it was confirmed that there were no problems with the sealing performance. The liquid ejection head 100 was set in the liquid ejection device 1, and a liquid ejection test was performed, confirming that there were no problems with the liquid ejection performance.

[0116] Finally, the liquid discharge head 100 was set in the sliding test apparatus and a sliding test was performed. The wipe member 302 was immersed in ink, and a load of 1N was applied, and sliding was performed 20,000 times in a reciprocating motion as shown in Figure 10. During the sliding test, the resistance value applied to the sliding test section 300 was continuously measured at 10 msec intervals. Although the sliding resistance fluctuated at the stepped sections between the frame member 104 and the protective member 101, and between the chip plate 102 and the protective member 101, no numerical change was observed from the initial value even after 20,000 cycles. Furthermore, after the test was completed, the shape of the protective member 101 was measured using a 3D shape measuring machine, as before the test, and compared with the state before the test, but no change in shape was observed. In addition, when the surface of the protective member 101 was observed with an optical microscope, some ink residue was observed, but it was confirmed that it had been removed when the wipe member 302 was replaced with a new one and two reciprocating sliding cycles were performed.

[0117] (Example 4) Example 4, corresponding to the fourth embodiment, will now be described. In Example 4, the liquid discharge head 100 shown in Figures 2(a), (b), and 6(a) was manufactured. Similar to Example 2, a Kovar plate was prepared, and a Kovar protective member 101 with the shape shown in Figures 2(a) and 2(b) was fabricated by etching using photolithography. The thickness of the protective member 101 was set to 50 μm, similar to Example 1, to reduce snagging and conform to the shape of the underlying adhesive. After this, a water-repellent treatment was applied to five sides of the protective member 101, excluding the one side that would be the adhesive surface. A fluorine-based coupling agent was used as the water repellent, and a protective tape was applied only to the adhesive surface before the film was deposited by vapor deposition.

[0118] Furthermore, an assembly was prepared in which a frame member 104 made of SUS410 stainless steel was fixed with screws 107 to a base 106 to which a silicon chip plate 102 was attached. At this time, the height of the frame member 104 was adjusted by using a spacer 108 so that it was 30 μm higher than the chip plate 102.

[0119] Next, similar to Example 3, a predetermined amount of adhesive was applied to the designated positions on the protective member 101 using a dispenser (manufactured by Musashi Engineering Co., Ltd.). A bisphenol-type photo- and heat-activated epoxy adhesive (World Lock 5191S, manufactured by Kyoritsu Chemical Industry Co., Ltd.) and a bisphenol-type thermosetting epoxy adhesive with a naphthalene skeleton were used. The adhesive placement is as shown in Figure 8, with photo-curing or photo- and heat-activated adhesive 118 applied to the inner and outer edges of the protective member 101, and thermosetting adhesive 113 applied to the other areas. After the adhesive-coated protective member 101 was adsorbed with an adsorption pad and placed in the designated positions on the chip plate 102 and frame member 104, the adhesive was uniformly spread across the bonding area by applying pressure from above at 1 kgf while aligning it with an alignment device. Subsequently, the photo- and heat-activated adhesive on the outer and inner edges of the protective member was treated with a UV irradiation device (manufactured by HOYA CANDEO OPTRONICS) at 6 J / cm². 2 The adhesive at the edges was cured with the irradiation dose. Next, the thermosetting adhesive in the other areas was cured by heating in an oven at 120°C for 1 hour, thereby creating the liquid dispensing head 100.

[0120] After removing the liquid discharge head 100 from the oven, the positional relationship between the tip plate 102 and the protective member 101 was examined under a microscope. The deviation from the alignment mark was less than 5 μm, confirming that the joint was made with high precision. Furthermore, the shape of the protective member 101 was measured and evaluated using a 3D shape measuring machine (Nikon NEXIV). It was confirmed that the height of the protective member 101 was higher at the outer edge than at the inner edge, with the highest region existing in between.

[0121] An ultrasonic microscope was used to observe the bonding area for delamination, void formation, and other defects, but no defects were found. Furthermore, the tip plate 102 of the liquid ejection head 100 was immersed in ink, removed, and examined under a microscope. As a result, it was confirmed that there were no problems with the sealing performance. The liquid ejection head 100 was set in the liquid ejection device 1, and a liquid ejection test was performed, confirming that there were no problems with the liquid ejection performance.

[0122] Finally, the liquid discharge head 100 was set in the sliding test apparatus and a sliding test was performed. The wipe member 302 was immersed in ink, and a load of 1N was applied, and sliding was performed 20,000 times in a reciprocating motion as shown in Figure 10. During the sliding test, the resistance value applied to the sliding test section 300 was continuously measured at 10 msec intervals. The sliding resistance did not change significantly throughout the entire range, and no numerical change was observed from the initial value even after 20,000 cycles. The sliding resistance value was smaller compared to Example 2 due to the effect of the water-repellent film.

[0123] Furthermore, after the test was completed, the shape of the protective member 101 was measured using a 3D shape measuring machine, just as before the test, and compared with its pre-test state. No change in shape was observed. In addition, when the surface of the protective member 101 was observed with an optical microscope, no ink residue was found.

[0124] (Example 5) Example 5 will now be described. In Example 5, the liquid discharge head 100 shown in Figures 2(a), (b), and 6(a) was manufactured in the same manner as in Example 2. Similar to Example 2, a Kovar plate was prepared, and a Kovar protective member 101 with the shape shown in Figures 2(a) and 2(b) was fabricated by etching using photolithography. The thickness of the protective member 101 was set to 80 μm, taking into consideration the rigidity of the member.

[0125] Similar to Example 2, an assembly was prepared in which a frame member 104 made of SUS410 stainless steel was fixed with screws 107 to a base 106 to which a silicon chip plate 102 was attached. At this time, the height of the frame member 104 was adjusted by using a spacer 108 so that it was 30 μm higher than the chip plate 102.

[0126] Next, similar to Example 2, a predetermined amount of adhesive was applied to the designated position on the protective member 101 using a dispenser (manufactured by Musashi Engineering Co., Ltd.). A bisphenol-type photo- and heat-activated epoxy adhesive (World Lock 5191S, manufactured by Kyoritsu Chemical Industry Co., Ltd.) was used as the adhesive. After the adhesive-coated protective member 101 was adsorbed with an adsorption pad and placed in the designated position on the chip plate 102 and frame member 104, the adhesive was spread uniformly over the bonding area by applying pressure from above at 1 kgf while aligning it with an alignment device. Subsequently, the adhesive on the outer and inner edges of the protective member was treated with a UV irradiation device (manufactured by HOYA CANDEO OPTRONICS) at 6 J / cm². 2 The adhesive at the edges was cured with the irradiation dose. Next, the adhesive in the other areas was cured by heating in an oven at 120°C for 1 hour, and the liquid dispensing head 100 was fabricated.

[0127] After removing the liquid discharge head 100 from the oven, the positional relationship between the chip plate 102 and the protective member 101 was examined under a microscope. The deviation from the alignment mark was less than 5 μm, confirming that the joint was made with high precision. The shape of the protective member 101 was also measured and evaluated using a 3D shape measuring machine (Nikon NEXIV). It was confirmed that the height of the protective member 101 was higher at the outer edge than at the inner edge, with the highest region located in between. However, in Example 2, the height of the peak shape (height from the chip plate side edge to the peak apex) was 70 micrometers, while in Example 5 it was 25 micrometers. The height from the chip plate surface, including the step of the frame member, the thickness of the protective member, the adhesive thickness, and the deformation of the protective member, was 150 micrometers in all cases.

[0128] An ultrasonic microscope was used to observe the bonding area for delamination, void formation, and other defects, but no defects were found. Furthermore, the tip plate 102 of the liquid ejection head 100 was immersed in ink, removed, and examined under a microscope. As a result, it was confirmed that there were no problems with the sealing performance. The liquid ejection head 100 was set in the liquid ejection device 1, and a liquid ejection test was performed, confirming that there were no problems with the liquid ejection performance.

[0129] Finally, the liquid discharge head 100 was set in the sliding test apparatus and a sliding test was performed. The wipe member 302 was immersed in ink, and a load of 1N was applied, and sliding was performed 20,000 times in a reciprocating motion as shown in Figure 10. During the sliding test, the resistance value applied to the sliding test section 300 was continuously measured at 10 msec intervals. Although the sliding resistance fluctuated at the stepped sections between the frame member 104 and the protective member 101, and between the chip plate 102 and the protective member 101, no numerical change was observed from the initial value even after 20,000 cycles. Furthermore, after the test was completed, the shape of the protective member 101 was measured using a 3D shape measuring machine, as before the test, and compared with the state before the test, but no change in shape was observed. In addition, when the surface of the protective member 101 was observed with an optical microscope, some ink residue was observed, but it was confirmed that it had been removed when the wipe member 302 was replaced with a new one and two reciprocating sliding cycles were performed.

[0130] (Comparative Example 1) Comparative Example 1 will now be described. In Comparative Example 1, the liquid dispensing head 100X shown in Figures 2(a), (b) and 3(a) was manufactured. First, a titanium plate was prepared, and a titanium protective member 101X with the shape shown in Figures 2(a) and (b) was fabricated by etching using photolithography. The thickness of the protective member 101 was set to 50 μm to reduce snagging and to conform to the shape of the underlying adhesive.

[0131] Next, an assembly was prepared in which a frame member 104 made of SUS410 stainless steel was fixed with screws 107 to a base 106 to which a silicon chip plate 102 was attached. At this time, spacers 108 were used to adjust the height so that the chip plate 102 and the frame member 104 were at the same level.

[0132] Next, a predetermined amount of adhesive was applied to a predetermined position on the protective member 101 using a dispenser (manufactured by Musashi Engineering Co., Ltd.), similar to that used in Example 1. A bisphenol-type photo- and heat-activated epoxy adhesive (World Lock 5191S, manufactured by Kyoritsu Chemical Industry Co., Ltd.) was used as the adhesive. The protective member 101, to which the adhesive had been applied, was adsorbed with an adsorption pad and placed in a predetermined position on the chip plate 102 and frame member 104. Then, while aligning it with an alignment device, pressure was applied from above with 1 kgf to uniformly spread the adhesive over the bonding area. After that, the adhesive was cured by heating it in an oven at 120°C for 1 hour to produce the liquid dispensing head 100.

[0133] After removing the liquid discharge head 100 from the oven, the positional relationship between the tip plate 102 and the protective member 101 was examined under a microscope. The deviation from the alignment mark was less than 5 μm, confirming that the joint was made with high precision. Furthermore, the shape of the protective member 101 was measured and evaluated using a 3D shape measuring machine (Nikon NEXIV). It was confirmed that the height from the outer edge to the inner edge of the protective member 101 was uniform throughout its entire surface.

[0134] An ultrasonic microscope was used to observe the bonding area for delamination, void formation, and other defects, but no defects were found. Furthermore, the tip plate 102 of the liquid ejection head 100 was immersed in ink, removed, and examined under a microscope. As a result, it was confirmed that there were no problems with the sealing performance. The liquid ejection head 100X was set in the liquid ejection device 1, and a liquid ejection test was performed, confirming that there were no problems with the liquid ejection performance.

[0135] Finally, the liquid discharge head 100X was set in the sliding test apparatus and a sliding test was performed. The wipe member 302 was immersed in ink, and a load of 1N was applied, and sliding in a reciprocating motion as shown in Figure 10 was performed 20,000 times. During the sliding test, the resistance value applied to the sliding test section 300 was continuously measured at 10 msec intervals. The sliding resistance fluctuated at the stepped section between the frame member 104 and the protective member 101, and at the stepped section between the tip plate 102 and the protective member 101. In particular, it was confirmed that the fluctuation at the stepped section between the frame member 104 and the protective member 101 increased with each subsequent sliding cycle.

[0136] Furthermore, after the test was completed, the shape of the protective member 101 was measured using a 3D shape measuring machine, just as before the test. It was found that it was different from its pre-test state, with the outer edge of the protective member 101 being raised and peeling up occurring. In addition, observation of the wipe member 302 used in the sliding test revealed fraying, confirming the effect of the peeling up.

[0137] Finally, when the surface of the protective member 101 was observed using an optical microscope, some ink residue was found. The wipe member 302 was replaced with a new one, and two back-and-forth sliding motions were performed, but it was confirmed that there was some snagging due to the peeling at the edges, and that the nearby ink had not been completely removed.

[0138] <Embodiments of a method for manufacturing articles> In this embodiment, articles are manufactured using the liquid dispensing device described above. The articles may be intermediate or final products. The article manufacturing method according to this embodiment is suitable for manufacturing articles such as organic EL (OLED) panels using a liquid dispensing device. The article manufacturing method of this embodiment includes a step of obtaining a coated substrate by arranging or coating a solution film (a solution containing a solute and a solvent for forming an organic film) on a substrate using a printing method with a liquid dispensing device (coating step). It also includes a step of drying the solution film on the coated substrate to obtain a dried substrate with a dried film formed on it (drying step). Furthermore, such a manufacturing method includes other well-known steps (firing, cooling, dehumidification, dry cleaning, electrode formation, sealing film formation, etc.). The article manufacturing method of this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the articles.

[0139] This disclosure is not limited to the embodiments described above, and many modifications are possible within the technical concept of this disclosure. For example, in the embodiments described above, the top of the protective member is formed in the process of curing the uncured adhesive, but this is not limited to this. The top of the protective member may be formed by mechanical processing or the like before the process of preparing the protective member. For example, in the embodiments described above, the chip plate and the protective member were separate components, but they may be formed as a single unit. Furthermore, the effects described in this embodiment are merely a list of the most preferred effects arising from the embodiments of this disclosure, and the effects of the embodiments of this disclosure are not limited to those described in this embodiment.

[0140] <Summary> [Configuration 1] A tip plate having a nozzle surface formed with nozzle holes for discharging liquid, A protective member that covers at least a portion of the nozzle surface so as to avoid the nozzle hole, The system includes an adhesive member for bonding the chip plate and the protective member, If the direction in which the liquid is discharged from the normal direction of the nozzle surface is defined as the first direction, the direction perpendicular to the first direction is defined as the second direction, and the direction perpendicular to both the first and second directions is defined as the third direction, The protective member is configured such that, when viewed from the third direction, the top portion located between the first end and the second end protrudes more in the first direction than the first end on the side furthest from the nozzle hole in the second direction and the second end on the side opposite to the first end. A liquid dispensing head characterized by the following features.

[0141] [Configuration 2] The chip plate is provided with a frame member configured to surround its outer periphery, The adhesive member adheres the first end of the protective member to the frame member, and adheres the second end of the protective member to the chip plate. A liquid dispensing head according to configuration 1, characterized by the features described above.

[0142] [Configuration 3] The top portion is closer to the second end than to the first end in the second direction. A liquid dispensing head according to configuration 2, characterized by the features described above.

[0143] [Structure 4] The surface of the frame member to which the protective member is bonded via the adhesive member protrudes in the first direction more than the nozzle surface of the chip plate to which the protective member is bonded via the adhesive member. A liquid dispensing head according to configuration 2 or 3, characterized by the above.

[0144] [Composition 5] The adhesive member comprises a first adhesive portion for bonding the first end to the frame member, a second adhesive portion for bonding the second end to the chip plate, and a third adhesive portion between the first adhesive portion and the second adhesive portion. The first and second adhesive portions are adhesive portions that have hardened while the third adhesive portion is still in an unhardened state. A liquid dispensing head according to any one of configurations 2 to 4, characterized by the above.

[0145] [Composition 6] The adhesive member comprises a first adhesive portion for bonding the first end to the frame member, a second adhesive portion for bonding the second end to the chip plate, and a third adhesive portion between the first adhesive portion and the second adhesive portion. The first adhesive portion, the second adhesive portion, and the third adhesive portion are formed by curing different types of adhesives. A liquid dispensing head according to any one of configurations 2 to 5, characterized by the above.

[0146] [Composition 7] The protective member is configured such that the first end, the second end, and the top are connected by a curved surface. A liquid dispensing head according to any one of configurations 1 to 6, characterized by the above.

[0147] [Structure 8] The protective member has a liquid-repellent treatment applied to the surface opposite to the surface to which the adhesive member is bonded in the first direction. A liquid dispensing head according to any one of configurations 1 to 7, characterized by the above.

[0148] [Composition 9] The protective member has a thickness of 50 micrometers or less in the first direction. A liquid dispensing head according to any one of configurations 1 to 8, characterized by the above.

[0149] [Configuration 10] The protective member is made of a material with a higher coefficient of thermal expansion than the chip plate. A liquid dispensing head according to any one of configurations 1 to 9, characterized by the above.

[0150] [Composition 11] The protective member is made of a material whose main component is metal. A liquid dispensing head according to any one of configurations 1 to 10, characterized by the above.

[0151] [Composition 12] The main component of the protective member is Invar, Kovar, titanium, or stainless steel. A liquid dispensing head according to configuration 11, characterized by the features described above.

[0152] [Composition 13] The frame member is made of a material whose main component is metal. A liquid dispensing head according to any one of configurations 2 to 12, characterized by the above.

[0153] [Composition 14] The main component of the frame member is Invar, Kovar, titanium, aluminum, or stainless steel. A liquid dispensing head according to configuration 13, characterized by the features described above.

[0154] [Composition 15] A nozzle surface in which a nozzle hole for discharging liquid is formed, A protective member is provided that covers at least a portion of the nozzle surface so as to avoid the nozzle hole, If the direction in which the liquid is discharged from the normal direction of the nozzle surface is defined as the first direction, the direction perpendicular to the first direction is defined as the second direction, and the direction perpendicular to both the first and second directions is defined as the third direction, The protective member is configured such that, when viewed from the third direction, the top portion located between the first end and the second end protrudes more in the first direction than the first end on the side furthest from the nozzle hole in the second direction and the second end on the side opposite to the first end. A liquid dispensing head characterized by the following features.

[0155] [Composition 16] A liquid dispensing head as described in any one of configurations 1 to 15, The system includes a tank for supplying liquid to the liquid discharge head. A liquid dispensing device characterized by the following features.

[0156] [Method 1] A liquid dispensing head described in any one of configurations 1 to 15 is used to dispense a liquid containing materials for manufacturing an article in order to manufacture an article. A method for manufacturing an article, characterized by the following:

[0157] [Method 2] A method for manufacturing a liquid dispensing head, A step of preparing a tip plate having a nozzle surface including a nozzle hole for discharging liquid, a frame member arranged to surround the outer circumference of the tip plate, and a protective member covering the space between the tip plate and the frame member. The process involves interposing an adhesive between the protective member, the chip plate, and the frame member, and aligning the protective member so that it does not overlap the nozzle hole. A step of curing the adhesive between the inner peripheral edge of the protective member and the chip plate, and the adhesive between the outer peripheral edge of the protective member and the frame member, to temporarily fix the protective member to the chip plate and the frame member, The process includes heating the protective member and adhesive in the temporarily fixed state to deform the protective member so that the space between the inner and outer edges protrudes away from the nozzle surface, and to cure the uncured adhesive, A method for manufacturing a liquid dispensing head, characterized by the following: [Explanation of Symbols]

[0158] 100: Liquid dispensing head / 101: Protective member / 102: Tip plate / 103: Adhesive member / 110: First end / 111: Second end / 120: Nozzle hole / 121: Nozzle surface

Claims

1. A tip plate having a nozzle surface formed with nozzle holes for discharging liquid, A protective member that covers at least a portion of the nozzle surface so as to avoid the nozzle hole, The system includes an adhesive member for bonding the chip plate and the protective member, If the direction in which the liquid is discharged from the normal direction of the nozzle surface is defined as the first direction, the direction perpendicular to the first direction is defined as the second direction, and the direction perpendicular to both the first and second directions is defined as the third direction, The protective member is configured such that, when viewed from the third direction, the top portion located between the first end and the second end protrudes more in the first direction than the first end on the side furthest from the nozzle hole in the second direction and the second end on the side opposite to the first end. A liquid dispensing head characterized by the following features.

2. The chip plate is provided with a frame member configured to surround its outer periphery, The adhesive member adheres the first end of the protective member to the frame member, and adheres the second end of the protective member to the chip plate. The liquid dispensing head according to claim 1.

3. The top portion is closer to the second end than to the first end in the second direction. The liquid dispensing head according to feature 2.

4. The surface of the frame member to which the protective member is bonded via the adhesive member protrudes in the first direction more than the nozzle surface of the chip plate to which the protective member is bonded via the adhesive member. The liquid dispensing head according to feature 2.

5. The adhesive member comprises a first adhesive portion for bonding the first end to the frame member, a second adhesive portion for bonding the second end to the chip plate, and a third adhesive portion between the first adhesive portion and the second adhesive portion. The first and second adhesive portions are adhesive portions that have hardened while the third adhesive portion is in an unhardened state. The liquid dispensing head according to feature 2.

6. The adhesive member comprises a first adhesive portion for bonding the first end to the frame member, a second adhesive portion for bonding the second end to the chip plate, and a third adhesive portion between the first adhesive portion and the second adhesive portion. The first adhesive portion, the second adhesive portion, and the third adhesive portion are formed by curing different types of adhesives. The liquid dispensing head according to feature 2.

7. The protective member is configured such that the first end, the second end, and the top are connected by a curved surface. The liquid dispensing head according to claim 1.

8. The protective member has a liquid-repellent treatment applied to the surface opposite to the surface to which the adhesive member is bonded in the first direction. The liquid dispensing head according to claim 1.

9. The protective member has a thickness of 50 micrometers or less in the first direction. The liquid dispensing head according to claim 1.

10. The protective member is made of a material with a higher coefficient of thermal expansion than the chip plate. The liquid dispensing head according to claim 1.

11. The protective member is made of a material whose main component is metal. The liquid dispensing head according to claim 1.

12. The main component of the protective member is Invar, Kovar, titanium, or stainless steel. The liquid dispensing head according to claim 11.

13. The frame member is made of a material whose main component is metal. The liquid dispensing head according to feature 2.

14. The main component of the frame member is Invar, Kovar, titanium, aluminum, or stainless steel. The liquid dispensing head according to claim 13, characterized in that it is a liquid dispensing head.

15. A nozzle surface in which a nozzle hole for discharging liquid is formed, A protective member is provided that covers at least a portion of the nozzle surface so as to avoid the nozzle hole, If the direction in which the liquid is discharged from the normal direction of the nozzle surface is defined as the first direction, the direction perpendicular to the first direction is defined as the second direction, and the direction perpendicular to both the first and second directions is defined as the third direction, The protective member is configured such that, when viewed from the third direction, the top portion located between the first end and the second end protrudes more in the first direction than the first end on the side furthest from the nozzle hole in the second direction and the second end on the side opposite to the first end. A liquid dispensing head characterized by the following features.

16. A liquid dispensing head according to any one of claims 1 to 15, The system includes a tank for supplying liquid to the liquid discharge head. A liquid dispensing device characterized by the following features.

17. A liquid containing materials for manufacturing an article is dispensed using a liquid dispensing head according to any one of claims 1 to 15 to manufacture an article. A method for manufacturing an article, characterized by the following:

18. A method for manufacturing a liquid dispensing head, A step of preparing a tip plate having a nozzle surface including a nozzle hole for discharging liquid, a frame member arranged to surround the outer circumference of the tip plate, and a protective member covering the space between the tip plate and the frame member. The process involves interposing an adhesive between the protective member, the chip plate, and the frame member, and aligning the protective member so that it does not overlap the nozzle hole. A step of curing the adhesive between the inner peripheral edge of the protective member and the chip plate, and the adhesive between the outer peripheral edge of the protective member and the frame member, to temporarily fix the protective member to the chip plate and the frame member, The process includes heating the protective member and adhesive in the temporarily fixed state to deform the protective member so that the space between the inner and outer edges protrudes away from the nozzle surface, and to cure the uncured adhesive, A method for manufacturing a liquid dispensing head, characterized by the following:

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