Semiconductor device, method for manufacturing a semiconductor device, semiconductor inspection apparatus, and inspection jig for a semiconductor device

Abstract

The objective is for an inspection device to be able to recognize the precise location of each terminal and accurately move the probe to the location of each terminal when a semiconductor device has a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing of terminals that have been brought out to the outside of the package is uneven. [Solution] The semiconductor device according to the present disclosure is a semiconductor device having a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals exposed to the outside of the package is uneven, and comprises a semiconductor element, a resin part provided to cover the semiconductor element, a plurality of terminals each having an exposed portion at one end electrically connected to the semiconductor element and the other end exposed from the surface of the resin part, and an identification part provided on the surface of the resin part and having the function of being able to identify the position of the exposed portion of each of the plurality of terminals.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor device, a method for manufacturing a semiconductor device, a semiconductor manufacturing apparatus, and an inspection jig for a semiconductor device.

Background Art

[0002] In semiconductor packages, there are discrete semiconductors and module semiconductors. A discrete semiconductor is one in which about one or two semiconductor elements are connected to wiring members and housed in one package. Since discrete semiconductors have standard specifications, the package structure is the same for each type. Therefore, the method of drawing out terminals to the outside of the package is the same for each type. Therefore, in a discrete semiconductor, generally, terminals of the same shape exist in one package, and the intervals between the terminals drawn out to the outside of the package are uniform within one package.

[0003] On the other hand, a module semiconductor is one in which a plurality of combined discrete semiconductors are housed in one package, and more than one semiconductor element is connected to each other by wiring members and housed in one package. In addition, in order to connect a plurality of semiconductor elements housed in the package to an external power source or a control device to form a circuit, one end of a terminal, which is a wiring member, is drawn out from the package. Semiconductor modules are used in various applications such as in-vehicle, industrial, and consumer applications, and the package structure or circuit configuration varies depending on the application. Therefore, depending on the package structure or circuit configuration, the method of drawing out terminals to the outside of the package is different. Depending on the method of drawing out terminals, there may be a case where terminals of different shapes are mixed in one package, or a case where there is a portion where the intervals between the other ends of the terminals drawn out to the outside of the package are non-uniform within one package.

[0004] Furthermore, semiconductor package inspection is performed in the back-end processes of semiconductor manufacturing. Semiconductor package inspection involves electrical characteristics testing to check for defects in electrical properties. In electrical characteristics testing, a probe is brought into contact with terminals that have been brought out to the outside of the semiconductor package, and the electrical characteristics of the semiconductor package are evaluated by passing current from the probe to the terminals.

[0005] One method for bringing an inspection jig into contact with the terminals of a semiconductor package is to use an inspection device called a flying probe tester. In a flying probe tester, a probe is attached to a robotic arm, and by specifying the coordinates of each terminal of the semiconductor package in advance and controlling the robotic arm, the probe can be moved to the position of each terminal.

[0006] Furthermore, discrete semiconductors sometimes have marks called index marks on the package surface, corresponding to a specific terminal that is brought out, in order to indicate the orientation of the package. (For example, the "semiconductor package" described in Patent Document 1) As mentioned above, the way terminals are brought out to the outside of the package is the same for each type of discrete semiconductor, so if the inspection device recognizes the position of the index mark, it can recognize the relative position of each terminal, and thus accurately move the probe to the position of each terminal. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2003-197848 [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] In the invention described in Patent Document 1, the index mark is provided at a position corresponding to one terminal. However, as mentioned above, depending on how the terminals are routed, the semiconductor device may have a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals routed outside the package is uneven. In such cases, even if the inspection device recognizes the position of the index mark, it cannot recognize the precise relative position of each terminal, which presents a problem in that it cannot accurately move the probe to the position of each terminal.

[0009] This disclosure is made to solve the above-mentioned problems, and aims to provide a semiconductor device in which, when the semiconductor device has a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals brought out to the outside of the package is uneven, an inspection device can recognize the precise position of each terminal and move the probe precisely to the position of each terminal. [Means for solving the problem]

[0010] The semiconductor device according to this disclosure is a semiconductor device having a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals exposed to the outside of the package is uneven, and comprises a semiconductor element, a resin part provided to cover the semiconductor element, a plurality of terminals each having an exposed portion at one end electrically connected to the semiconductor element and the other end exposed from the surface of the resin part, and an identification part provided on the surface of the resin part and having the function of being able to identify the position of the exposed portion of each of the plurality of terminals. [Effects of the Invention]

[0011] The semiconductor device described herein provides a semiconductor device and a method for manufacturing a semiconductor device that, when the semiconductor device has a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals extended outside the package is uneven, allows an inspection device to recognize the precise position of each terminal and accurately move a probe to the position of each terminal. [Brief explanation of the drawing]

[0012] [Figure 1] This is a schematic top view of a semiconductor device according to Embodiment 1. [Figure 2] This is a schematic cross-sectional view of XX in Figure 1 of the semiconductor device according to Embodiment 1. [Figure 3] This is a schematic side view of the semiconductor device according to Embodiment 1. [Figure 4] This is a schematic top view of a semiconductor device according to Embodiment 1. [Figure 5] This is a configuration diagram showing a basic example of the configuration of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 6] This is a schematic perspective view showing a basic configuration example of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 7] This is a schematic side view showing a basic configuration example of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 8] This is a flowchart showing the operation flow of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 9] This is a configuration diagram showing a specific configuration example 1 of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 10] This flowchart shows the operation flow of a semiconductor inspection apparatus having Configuration Example 1 for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 11]It is a configuration diagram showing a specific configuration example 2 of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 12] It is a diagram showing a specific example 1 of an abnormality of a terminal of a semiconductor device according to Embodiment 1. [Figure 13] It is an enlarged view of a region A in FIG. 12 showing a specific example 1 of an abnormality of a terminal of a semiconductor device according to Embodiment 1. [Figure 14] It is a diagram showing a specific example 2 of an abnormality of a terminal of a semiconductor device according to Embodiment 1. [Figure 15] It is an enlarged view of a region A in FIG. 14 showing a specific example 2 of an abnormality of a terminal of a semiconductor device according to Embodiment 1. [Figure 16] It is a flowchart showing an operation flow of a semiconductor inspection apparatus having a configuration example 2 for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 17] It is a configuration diagram showing a configuration example 3 of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 18] It is a schematic side view showing a configuration example 3 of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 1. [Figure 19] It is a schematic top view of a semiconductor device according to Modification Example 1 of Embodiment 1. [Figure 20] It is an X-X schematic cross-sectional view in FIG. 19 of a semiconductor device according to Modification Example 1 of Embodiment 1. [Figure 21] It is a schematic top view of a semiconductor device according to Modification Example 2 of Embodiment 1. [Figure 22] It is a schematic top view of a semiconductor device according to Embodiment 2. [Figure 23] It is a schematic side view of a semiconductor device according to Embodiment 2. [Figure 24] It is a schematic top view showing a configuration example of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 2. [Figure 25] It is a schematic top view of a semiconductor device according to Embodiment 3. [Figure 26] It is a schematic side view of a semiconductor device according to Embodiment 3. [Figure 27] This is a schematic top view of a semiconductor device according to Embodiment 3. [Figure 28] This is a schematic side view showing the configuration of a semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to Embodiment 3. [Figure 29] This is a schematic top view of a semiconductor device according to a modified example of Embodiment 3. [Figure 30] This is a schematic side view of a semiconductor device according to a modified example of Embodiment 3. [Figure 31] This is a schematic top view of a semiconductor device according to a modified example of Embodiment 3. [Modes for carrying out the invention]

[0013] <Introduction> In semiconductor devices, one side parallel to the depth direction is referred to as the "top," and the other side as the "bottom." Of the two main surfaces of a substrate, layer, or other component, one surface is referred to as the top surface, and the other surface as the bottom surface. The directions of "top" and "bottom" are not limited to the direction of gravity or the direction in which the semiconductor device is mounted. Furthermore, the top surface, bottom surface, and side surfaces of a substrate, layer, or other component are referred to as surfaces.

[0014] Furthermore, for the sake of explanation, in the following, the width direction of the semiconductor device will be described as the X-axis direction, the depth direction of the semiconductor device intersecting the X-axis direction will be described as the Y-axis direction, and the thickness direction or depth direction of the semiconductor device, that is, the direction normal to the XY plane, will be described as the Z-axis direction.

[0015] Furthermore, the drawings are schematic representations, and the relative sizes and positions of images shown in different drawings are not necessarily accurately depicted and may be modified as appropriate. In the following explanation, similar components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed explanations of these components may be omitted.

[0016] Embodiment 1. Embodiment 1 will be described below with reference to the drawings. Figure 1 is a schematic top view of the semiconductor device 10 according to Embodiment 1. Figure 2 is a schematic cross-sectional view of the semiconductor device 10 according to Embodiment 1. Figure 3 is a schematic side view of the semiconductor device 10 according to Embodiment 1. Note that Figure 2 shows a cross-section along the dashed line X-X shown in Figure 1. Note that the dotted line and dashed line in Figure 1 do not represent the identification part 9. Also, the schematic side view shown in Figure 3 is a view of the semiconductor device 10 from the negative X-axis side. Unless otherwise specified, other schematic side views described later are also assumed to be views of the semiconductor device 10 from the negative X-axis side.

[0017] Figures 1-3 illustrate an example of the configuration of the semiconductor device 10. The semiconductor device 10 includes a semiconductor element 5, terminals 7, a resin part 8, and an identification part 9. In the following description, the semiconductor device 10 is assumed to have a modular structure, but even if it has a discrete structure, the present invention can be applied if it has a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing of terminals brought out to the outside of the package is uneven.

[0018] As shown in Figure 2, a heat sink 1 may be provided. The heat sink 1 is made of a material that has electrical and thermal conductivity. For example, the heat sink 1 is made of a metallic material such as copper or aluminum.

[0019] As shown in Figure 2, the insulating substrate 2 may be provided on the upper surface of the heat sink 1. The insulating substrate 2 is mounted on the upper surface of the heat sink 1, for example, by soldering. The insulating substrate 2 is made of an insulating resin, for example, ceramic.

[0020] As shown in Figure 2, the metal pattern 3 may be provided on the upper surface of the insulating substrate 2. The metal pattern 3 is mounted on the upper surface of the insulating substrate 2 by means of solder, for example. The metal pattern 3 is made of a highly conductive metal such as copper.

[0021] As shown in Figure 2, a semiconductor element 5 is provided. The semiconductor element 5 is mounted on a metal pattern 3 by a junction layer 4 such as solder. The semiconductor element 5 may be made of Si, or it may be made of a wide bandgap semiconductor such as SiC, GaN, or Ga2O3. There is no particular limit to the type of device of the semiconductor element 5, but it may be a switching element such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or it may be a freewheeling element. Also, as shown in Figure 2, multiple semiconductor elements 5 are provided, and the number of semiconductor elements 5 can be arbitrarily changed depending on the circuit configuration of the semiconductor device 10. Each semiconductor element 5 is electrically connected to a terminal 7, and as shown in Figure 2, the semiconductor element 5 and the terminal 7 may be electrically connected by a wire 6. Also, as shown in Figure 2, the wire 6 may directly connect the semiconductor element 5 and the terminal 7, or it may connect the semiconductor element 5 and the terminal 7 via the metal pattern 3.

[0022] In detail, each semiconductor element 5 is electrically connected to terminal 7 at its electrode portion. The main electrode of the semiconductor element 5 is electrically connected to terminal 7. For example, if the semiconductor element 5 is a MOSFET, the drain electrode of the semiconductor element 5 is connected to the drain terminal, and the source electrode of the semiconductor element 5 is connected to the source terminal. In addition, the control electrode of the semiconductor element 5 is electrically connected to terminal 7. For example, the gate electrode of the semiconductor element 5 is connected to the gate terminal. The number of electrodes of the semiconductor element 5 can be changed according to the number of semiconductor elements 5. Note that the control electrode is not limited to a gate electrode (gate pad) to which a gate drive voltage for controlling the on / off state of the semiconductor element 5 is applied, but may be, for example, a current sense pad, a voltage sense pad, a Kelvin source pad, or a temperature sense diode pad. The current sense pad is a control pad for detecting the current flowing in the cell region of the semiconductor element 5. Specifically, the current sense pad is a control pad electrically connected to a part of the cell region of the semiconductor element 5 so that when current flows in the cell region of the semiconductor element 5, a current of a fraction to a fraction of the current flowing in the entire cell region flows. The voltage sense pad is a control pad electrically connected to the drain (collector) region to detect the saturation voltage when current flows through the semiconductor element 5. The Kelvin source pad is a control pad to which a gate drive voltage is applied for on / off control of the semiconductor element 5. The temperature sense diode pad is a control pad electrically connected to the anode and cathode of a temperature sense diode (not shown) provided on the semiconductor element 5. The temperature of the semiconductor element 5 is measured by measuring the voltage between the anode and cathode of the temperature sense diode provided in the cell region. Alternatively, a thermistor may be used instead of the temperature sense diode in the semiconductor element 5, in which case control pads corresponding to the anode and cathode of the temperature sense diode are also provided.

[0023] As shown in Figures 1-3, terminals 7 are provided. Multiple terminals 7 are provided, and as shown in Figure 2, one end of each of the multiple terminals 7 is electrically connected to the semiconductor element 5, and as shown in Figures 1-3, the other end of each is provided so as to be exposed from the surface of the resin part 8. In detail, one end of each of the multiple terminals 7 is electrically connected to the electrode portion of the semiconductor element 5 as described above. The portion where the other end of each of the multiple terminals 7 is exposed from the surface of the resin part 8 is called the exposed portion 71. Note that, as shown in Figures 1 and 3, the terminal 7 may consist of a first terminal 7a and a second terminal 7b which has a different shape from the first terminal 7a. The first terminal 7a is provided so as to extend in the Y-axis direction along the surface of the resin part 8. The second terminal 7b is provided so as to extend in the Z-axis direction from the surface of the resin part 8. In addition, the spacing between each of the multiple terminals 7 may be non-uniform.

[0024] As shown in Figures 1-3, a resin part 8 is provided. The resin part 8 is provided so as to cover the semiconductor element 5 and a part of the terminal 7. The resin part 8 is composed of at least one of a case material 8a or a sealing material 8b. In this embodiment, as shown in Figures 1 and 2, the resin part 8 is composed of both a case material 8a and a sealing material 8b. The case material 8a is made of an insulating resin and is joined to the heat sink 1. Also, as shown in Figure 2, the case material 8a may be provided so as to surround the outer periphery of an insulating substrate 2 or the like provided on the heat sink 1. The sealing material 8b is provided so as to seal at least the semiconductor element 5 and a part of the terminal 7 of the semiconductor device 10. As shown in Figures 1 and 2, in this embodiment, the sealing material 8b is provided inside the case material 8a. The sealing material 8b is made of, for example, an insulating gel or resin.

[0025] As shown in Figures 1 and 2, an identification section 9 is provided. The identification section 9 is provided on the surface of the resin section 8. The identification section 9 has the function of being able to identify the position of each exposed portion 71 of the multiple terminals 7. Furthermore, the identification section 9 of this embodiment has the function of being able to identify each of the multiple terminals 7. In addition, the identification section 9 of this embodiment is provided on the surface of the sealing material 8b of the resin section 8, and is provided on the upper surface of the sealing material 8b.

[0026] Furthermore, as shown in Figure 1, the identification unit 9 may consist of a first identification unit 9a that has the function of identifying the type of each of the multiple terminals 7, and a second identification unit 9b that has the function of identifying any orientation. The first identification unit 9a and the second identification unit 9b are each provided on the upper surface of the resin unit 8, corresponding to each of the multiple terminals 7.

[0027] When an identification section 9 is provided on the upper surface of the resin section 8, one for each of the multiple terminals 7, it is desirable that each identification section 9 be provided in such a way that it is easy to determine which terminal 7 it corresponds to. As shown in Figure 4, it is desirable to reduce the distance a between the probe contact position (which may be simply called the "probe contact position" in the following description), which is the position on the exposed portion 71 of the terminal 7 where the probe makes contact, and the identification section 9 provided in correspondence with the terminal 7, and to increase the distance b between identification sections 9 provided for the same type of terminal 7 and the distance c between identification sections 9 provided for different types of terminal 7, so that it is possible to determine which terminal 7 each identification section 9 corresponds to. It is desirable that the distance c be greater than, for example, the distance d between the upper end of the first identification section 9a and the lower end of the second identification section 9b provided in correspondence with the first identification section 9a.

[0028] Furthermore, the above-mentioned interval a may be changed for each type of terminal 7, but it is desirable that it be equally spaced regardless of the type of terminal 7. Note that, as with the first terminal 7a, if it is provided extending along the surface of the resin part 8 in the X-axis or Y-axis direction, it may be desirable to set the probe contact position on the outer peripheral side of the exposed portion 71 of the first terminal 7a. In that case, since the second identification portion 9b is provided on the resin part 8, the interval a between the probe contact position of the first terminal 7a and the second identification portion 9b provided in correspondence with the first terminal 7a may increase. In that case, the interval a between the probe contact position of the first terminal 7a and the second identification portion 9b provided in correspondence with the first terminal 7a can be made the same as the interval a between the probe contact position of the second terminal 7b and the second identification portion 9b provided in correspondence with the second terminal 7b by providing the second identification portion 9b provided in correspondence with the second terminal 7b on the central side of the semiconductor device 10.

[0029] As shown in Figure 1, the first identification unit 9a may consist of different characters depending on the type of terminal 7 (collector terminal, emitter terminal, gate terminal, etc.). The first identification unit 9a only needs to have the function of being able to identify each type of terminal 7, and may consist of different shapes depending on the type of terminal 7, or may consist of different colors depending on the type of terminal 7.

[0030] The second identification section 9b may have a shape that allows for easy identification of any orientation, as shown in Figure 1. As shown in Figure 1, the second identification section 9b may be composed of an arrow, or for example, a triangle. The second identification section 9b is provided to indicate the position of the exposed portion 71 of the corresponding terminal 7. As shown in Figure 1, in this embodiment, since the second identification section 9b is provided inside the exposed portion 71 of the terminal 7, the second identification section 9b is provided to indicate the outer circumference of the resin section 8. As shown in Figure 1, when the second identification section 9b is provided on the upper surface of the resin section 8, the inspection device can identify the probe contact position in the X-axis and Y-axis directions of the terminal 7 by identifying any orientation from the second identification section 9b. Furthermore, it is desirable that the second identification section 9b has a shape that allows for easy identification of any reference position. For example, as shown in Figure 1, a reference line may be provided above or below the first identification section 9a. Furthermore, as shown in Figure 1, the first identification unit 9a may be located inside the second identification unit 9b, or it may be located outside the second identification unit 9b.

[0031] As described above, the semiconductor device 10 of this embodiment is configured. By providing an identification part 9 on the surface of the resin part 8 that can identify the position of the exposed part 71 of each of the multiple terminals 7, when the semiconductor device has a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals pulled out to the outside of the package is uneven, the inspection device can recognize the precise position of each terminal 7 and move the inspection jig precisely to the position of each terminal 7. The reason for this will be explained below.

[0032] In conventional semiconductor devices, index marks are only placed at positions corresponding to a single terminal. Therefore, when a semiconductor device has a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing of terminals extending outside the package is uneven, even if the inspection device recognizes the position of the index mark, it cannot recognize the precise relative position of each terminal, and thus cannot accurately move the probe to the position of each terminal. For this reason, it was necessary to pre-set the coordinates of each of the multiple terminals 7 on the inspection device side and move the probe to the position of each terminal based on the set coordinates.

[0033] In contrast, the semiconductor device 10 of this embodiment is configured to include an identification unit 9 capable of identifying the position of the exposed portion 71 of each of the multiple terminals 7. Therefore, even when terminals of different shapes are mixed within a single package, or when there are areas within a single package where the spacing between terminals extended outside the package is uneven, the inspection device can recognize the precise position of each terminal 7 and accurately move the probe to the position of each terminal 7. As a result, it is no longer necessary for the inspection device to pre-set the coordinates of each of the multiple terminals 7, thus simplifying the control program used in the inspection device.

[0034] Furthermore, as mentioned above, if an identification unit 9 is provided on the upper surface of the resin part 8, corresponding to each of the multiple terminals 7, it is desirable that the identification unit 9 be provided in a way that makes it easy to determine which terminal 7 each identification unit 9 corresponds to. This makes it easier for the inspection device to recognize which terminal 7 the detected identification unit 9 corresponds to, allowing the probe to be moved more accurately to the position of each terminal 7.

[0035] Furthermore, as mentioned above, it is desirable that the distance a between the probe contact position of terminal 7 and the identification unit 9 provided in correspondence with terminal 7 be equal regardless of the type of terminal 7. By doing so, it becomes unnecessary to set the distance a in advance on the inspection device for each type of terminal 7, and the control program used in the inspection device can be simplified.

[0036] Furthermore, as described above, the identification unit 9 may also have the function of being able to identify the type of each of the multiple terminals 7. This eliminates the need for the inspection device to set in advance which probe to connect to which terminal 7, and simplifies the control program used in the inspection device. Alternatively, by setting in advance on the inspection device what kind of terminal shape each of the multiple terminals 7 has, the inspection device may be able to identify the terminal shapes of each of the multiple terminals 7 when it identifies each of the multiple terminals 7. Furthermore, by setting the probe contact position for each terminal shape in advance on the inspection device, the inspection device may be able to identify the probe contact position for each terminal shape when it identifies each of the multiple terminals 7. Here, we will explain the case where the semiconductor device has a structure in which terminals of different shapes are mixed within a single package, and it is desired to identify the probe contact position for each terminal shape. For example, if a terminal 7b has a shape that extends in the Z-axis direction, and it is desired to identify the upper end of the second terminal 7b in the Z-axis direction as the probe contact position, and the second identification unit 9b is provided on the upper surface of the resin part 8, then, as described above, the inspection device can identify the probe contact position of the second terminal 7b in the X-axis or Y-axis direction, but it cannot identify the probe contact position of the second terminal 7b in the Z-axis direction. Therefore, by enabling the inspection device to identify the terminal shape of each of the multiple terminals 7 from the first identification unit 9a and to identify the probe contact position for each terminal shape, the probe contact position of the second terminal 7b in the Z-axis direction can also be identified.

[0037] Next, the manufacturing method of the semiconductor device 10 of this embodiment will be described. The manufacturing method of the semiconductor device 10 of this embodiment is basically the same as that of conventional semiconductor device manufacturing methods, so some parts will be omitted from the explanation.

[0038] The method for manufacturing the semiconductor device 10 includes a connection step, a resin part formation step, an identification part formation step, and an inspection step.

[0039] First, let's explain the connection process. In the connection process, one end of each of the multiple terminals 7 is electrically connected to the semiconductor element 5.

[0040] Next, the resin part formation process will be described. In the resin part formation process, a resin part 8 is formed that covers a portion of the multiple semiconductor elements 5 and the multiple terminals 7, such that the other end of each of the multiple terminals 7 is exposed from the surface. In this embodiment, a sealing material 8b is used to seal the multiple semiconductor elements 5 and a portion of the multiple terminals 7, such that the other end of each of the multiple terminals 7 is exposed from the surface.

[0041] Next, the identification part formation process will be described. In the identification part formation process, an identification part 9 is formed on the surface of the resin part 8, which has the function of identifying the position of the exposed part 71 where the other end of each of the multiple terminals 7 is exposed from the surface of the resin part 8. In this embodiment, the identification part 9 is formed on the surface of the sealing material 8b of the resin part 8. For example, the identification part 9 is formed by printing it on the surface of the resin part 8 using a method such as screen printing. Alternatively, the identification part 9 may be formed by printing it on the surface of the resin part 8 using a laser method, or by attaching a sticker-like material to the surface of the resin part 8, or by processing the surface of the resin part 8 by embossing during the molding of the resin part 8 to form the identification part 9.

[0042] Next, the inspection process will be explained. In the inspection process, a probe is brought into contact with terminal 7, and current is passed from the probe to terminal 7. This is used to inspect the electrical characteristics of the semiconductor device 10. Further details will be provided later.

[0043] The semiconductor device 10 is manufactured through the process described above. As stated above, the manufacturing method of the semiconductor device 10 in this embodiment includes an identification part formation step, in which an identification part is formed that can identify the position of each of the multiple terminals' exposed parts 71. In this way, even if the semiconductor device has a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals pulled out to the outside of the package is uneven, the inspection device can recognize the precise position of each terminal 7 in the inspection step and move the inspection jig precisely to the position of each terminal 7.

[0044] Next, a basic configuration example of a semiconductor inspection device 1000 for inspecting the electrical characteristics of the semiconductor device 10 will be explained using Figures 5 to 7. Figure 5 is a configuration diagram showing a basic configuration example of the semiconductor inspection device 1000. Figure 6 is a schematic perspective view showing a basic configuration example of the semiconductor inspection device 1000. Figure 7 is a schematic side view showing a basic configuration example of the semiconductor inspection device 1000. The semiconductor inspection device 1000 is used in the inspection process of the manufacturing process of the semiconductor device 10 described above. Furthermore, the semiconductor inspection device 1000 described below is, for example, a flying probe tester.

[0045] The semiconductor inspection apparatus 1000 consists of an imaging unit 1100, a control device 1200, a transport unit 1300, and a probe 1400.

[0046] The imaging unit 1100 images the identification unit 9 of the semiconductor device 10 and outputs the image to the control device 1200. In this embodiment, since the identification unit 9 is located on the upper surface of the semiconductor device 10, the imaging unit 1100 images the semiconductor device 10 from above, as shown in Figures 6 and 7. In other words, the imaging unit 1100 images the semiconductor device 10 from the positive Z-axis side. The imaging unit 1100 in this embodiment consists of one camera, and the imaging range of the one camera is the range that includes the entire upper surface of the semiconductor device 10, and the camera is fixedly mounted on the positive Z-axis side of the upper surface of the semiconductor device 10. If the imaging range of one camera is the range that includes a part of the upper surface of the semiconductor device 10, the camera may be mounted so as to be movable in the X-axis and Y-axis directions, for example. Also, if the imaging range of one camera is the range that includes a part of the upper surface of the semiconductor device 10, multiple cameras may be fixedly mounted.

[0047] The control device 1200 includes an image acquisition unit 1210, a position determination unit 1220, and an output unit 1230. The image acquisition unit 1210 acquires the captured image output from the imaging unit 1100.

[0048] The position determination unit 1220 determines the contact position (synonymous with the "probe contact position" described above) for the probe 1400 to contact the terminal 7 of the semiconductor device 10, based on the captured image acquired by the image acquisition unit 1210. Specifically, it detects the identification unit 9 from the captured image, identifies the position of the exposed portion 71 of the terminal 7 from the identification unit 9, and determines the contact position for the probe 1400 to contact the terminal 7 based on the identified position of the exposed portion 71 of the terminal 7.

[0049] The output unit 1230 outputs the contact position determined by the position determination unit 1220 to the transport unit 1300.

[0050] The transport unit 1300 moves the probe 1400 to the contact position based on the contact position output from the output unit 1230.

[0051] The probe 1400 is moved to the contact position by the transport unit 1300, makes contact with terminal 7, and the electrical characteristics of the semiconductor device 10 are inspected by passing current from the probe 1400 to terminal 7.

[0052] The semiconductor inspection apparatus 1000 of this embodiment is configured as described above.

[0053] Next, the operation of the semiconductor inspection device 1000 will be explained using Figure 8. Figure 8 is a flowchart showing the operation flow of the semiconductor inspection device 1000.

[0054] When the semiconductor inspection apparatus 1000 receives a command from the control device 1200 to start processing from an external source, it starts the processing shown in Figure 8. (Start)

[0055] In step ST1001, the imaging unit 1100 captures an image of the surface of the resin part 8 and outputs the captured image.

[0056] Next, in step ST1002, the image acquisition unit 1210 acquires the captured image output from the imaging unit 1100.

[0057] Next, in step ST1003, the position determination unit 1220 detects the identification unit 9 from the captured image acquired by the image acquisition unit 1210, identifies the position of the exposed portion 71 where the other end of the terminal 7 is exposed from the surface of the resin portion 8 from the identification unit 9, and determines the contact position in which the probe 1400 will contact the terminal 7 based on the identified position of the exposed portion 71 of the terminal 7.

[0058] Next, in step ST1004, the output unit 1230 outputs the contact position determined by the position determination unit 1220, and the transport unit 1300 moves the probe 1400 to the contact position based on the contact position output from the output unit 1230. The probe 1400 and the terminal 7 come into contact, and the electrical characteristics of the semiconductor device 10 are inspected by passing current from the probe 1400 to the terminal 7.

[0059] Once the process reaches step ST1004, the process shown in Figure 8 will terminate. (Termination)

[0060] Next, a specific example of the configuration of a semiconductor inspection device 1000 for inspecting the electrical characteristics of the semiconductor device 10 will be explained using Figures 9 to 18.

[0061] First, a specific configuration example 1 of the semiconductor inspection apparatus 1000 will be described using Figure 9. Figure 9 is a configuration diagram showing a specific configuration example 1 of the semiconductor inspection apparatus 1000. The semiconductor inspection apparatus 1000 equipped with this configuration example 1 will be referred to as semiconductor inspection apparatus 1000a.

[0062] The semiconductor inspection device 1000a inspects the electrical characteristics of a semiconductor device 10, which is equipped with an identification unit 9 that has both the function of identifying the position of the exposed portion 71 where the other end of each of the multiple terminals 7 is exposed from the surface of the resin portion 8, and the function of identifying the type of each of the multiple terminals.

[0063] As shown in Figure 9, the semiconductor inspection apparatus 1000a has a control device 1200a which further includes a type determination unit 1240.

[0064] The type determination unit 1240 determines the type of probe 1400 to contact the terminal 7 of the semiconductor device 10 based on the captured image acquired by the image acquisition unit 1210. Specifically, it detects the identification unit 9 from the captured image, identifies the type of terminal 7 from the identification unit 9, and determines the probe type of the probe 1400 to contact the terminal 7 based on the identified type of terminal 7.

[0065] The output unit 1230 outputs the contact position determined by the position determination unit 1220 and the probe type of the probe 1400 determined by the type determination unit 1240 to the transport unit 1300.

[0066] The transport unit 1300 moves the determined probe 1400 to the contact position based on the contact position and probe type output from the output unit 1230.

[0067] The probe 1400 is moved to the contact position by the transport unit 1300, makes contact with terminal 7, and the electrical characteristics of the semiconductor device 10 are inspected by passing current from the probe 1400 to terminal 7.

[0068] Next, the operation of the semiconductor inspection device 1000a will be explained using Figure 10. Figure 10 is a flowchart showing the operation flow of the semiconductor inspection device 1000a.

[0069] When the semiconductor inspection device 1000a receives a command from the control device 1200 to start processing from an external source, it starts the processing shown in Figure 10. (Start)

[0070] In step ST1101, the imaging unit 1100 images the surface of the resin part 8 and outputs the image.

[0071] Next, in step ST1102, the image acquisition unit 1210 acquires the captured image output from the imaging unit 1100.

[0072] Next, in step ST1103, the position determination unit 1220 detects the identification unit 9 from the captured image acquired by the image acquisition unit 1210, identifies the position of the exposed portion 71 where the other end of the terminal 7 is exposed from the surface of the resin portion 8 from the identification unit 9, and determines the contact position in which the probe 1400 will contact the terminal 7 based on the identified position of the exposed portion 71 of the terminal 7.

[0073] Furthermore, in step ST1104, the type determination unit 1240 detects the identification unit 9 from the captured image, identifies the type of terminal 7 from the identification unit 9, and determines the type of probe 1400 to contact the terminal 7 based on the identified type of terminal 7.

[0074] Next, in step ST1105, the output unit 1230 outputs the contact position determined by the position determination unit 1220 and the probe type of the probe 1400 determined by the type determination unit 1240. The transport unit 1300 then moves the determined probe 1400 to the contact position based on the contact position and probe type output from the output unit 1230. The probe 1400 and the terminal 7 come into contact, and current is passed from the probe 1400 to the terminal 7 to test the electrical characteristics of the semiconductor device 10.

[0075] Once the process reaches step ST1105 described above, the process shown in Figure 10 is terminated. (Termination)

[0076] Next, a specific configuration example 2 of the semiconductor inspection apparatus 1000 will be described using Figure 11. Figure 11 is a configuration diagram showing a specific configuration example 2 of the semiconductor inspection apparatus 1000. The semiconductor inspection apparatus 1000 equipped with this configuration example 2 will be referred to as semiconductor inspection apparatus 1000b.

[0077] As shown in Figure 11, the semiconductor inspection apparatus 1000b further includes an abnormality detection unit 1250 in the control device 1200b.

[0078] The abnormality detection unit 1250 detects abnormalities in the terminals 7 of the semiconductor device 10 from the captured images acquired by the image acquisition unit 1210. Abnormalities in the terminals 7 include, for example, foreign matter F adhering to the terminals 7 as shown in Figures 13 and 15, and scratches W on the terminals 7 as shown in Figure 15.

[0079] If the abnormality detection unit 1250 detects an abnormality in terminal 7, an external device (not shown) performs a corrective action to resolve the abnormality in terminal 7.

[0080] If the abnormality detection unit 1250 does not detect an abnormality in terminal 7, the output unit 1230 outputs the contact position determined by the position determination unit 1220. If an abnormality in terminal 7 is detected, the output unit 1230 does not output the contact position determined by the position determination unit 1220. Alternatively, if the abnormality detection unit 1250 does not detect an abnormality in terminal 7, the position determination unit 1220 may determine the contact position from the captured image acquired by the image acquisition unit 1210. If an abnormality in terminal 7 is detected, the position determination unit 1220 may not determine the contact position from the captured image acquired by the image acquisition unit 1210.

[0081] The operation of the semiconductor inspection apparatus 1000b having an anomaly detection unit 1250 will be explained using Figure 16. Figure 16 is a flowchart showing the operation flow of the semiconductor inspection apparatus 1000a having an anomaly detection unit 1250.

[0082] When the semiconductor inspection device 1000b receives a command from the control device 1200 to start processing from an external source, it starts the processing shown in Figure 16. (Start)

[0083] In step ST1201, the imaging unit 1100 images the surface of the resin part 8 and outputs the image.

[0084] Next, in step ST1202, the image acquisition unit 1210 acquires the captured image output from the imaging unit 1100.

[0085] Next, in step ST1203, the position determination unit 1220 detects the identification unit 9 from the captured image acquired by the image acquisition unit 1210, identifies the position of the exposed portion 71 where the other end of the terminal 7 is exposed from the surface of the resin portion 8 from the identification unit 9, and determines the contact position in which the probe 1400 will contact the terminal 7 based on the identified position of the exposed portion 71 of the terminal 7.

[0086] Next, in step ST1204, the abnormality detection unit 1250 detects an abnormality in terminal 7 from the captured image acquired by the image acquisition unit 1210. If the abnormality detection unit 1250 detects an abnormality in terminal 7 (step ST1204 "YES"), the process proceeds to step ST1205; if no abnormality is detected in terminal 7 (step ST1204 "NO"), the process proceeds to step ST1206.

[0087] If the process proceeds to step ST1205, an external device (not shown) will perform the necessary troubleshooting.

[0088] If the process proceeds to step ST1206, the output unit 1230 outputs the contact position determined by the position determination unit 1220, and the transport unit 1300 moves the probe 1400 to the contact position based on the contact position output from the output unit 1230. The probe 1400 and the terminal 7 come into contact, and the electrical characteristics of the semiconductor device 10 are tested by passing current from the probe 1400 to the terminal 7.

[0089] Next, in step ST1207, the abnormality detection unit 1250 detects an abnormality in terminal 7 from the captured image acquired by the image acquisition unit 1210. If the abnormality detection unit 1250 detects an abnormality in terminal 7 (step ST1207 "YES"), the process proceeds to step ST1205; if no abnormality is detected in terminal 7 (step ST1207 "NO"), the process proceeds to step ST1208. Note that the abnormality in terminal 7 detected by the abnormality detection unit 1250 in step ST1207 is a scratch W, such as a discharge mark, that may occur when current is passed through terminal 7 in step ST1206.

[0090] If the process proceeds to step ST1208, the control device 1200 determines whether there are other inspection items. If the control device 1200 determines that there are other inspection items (step ST1208 "YES"), the process proceeds to step ST1201. If it determines that there are no other inspection items (step ST1208 "NO"), the process shown in Figure 16 is terminated. (Termination)

[0091] Note that either step ST1204 or step ST1207 above may be omitted.

[0092] The semiconductor inspection apparatus 1000b has an abnormality detection unit 1250 that detects abnormalities in terminal 7 from the captured image acquired by the image acquisition unit 1210. If the abnormality detection unit 1250 does not detect an abnormality in terminal 7, the output unit 1230 outputs the contact position determined by the position determination unit 1220. If an abnormality in terminal 7 is detected, the output unit 1230 does not output the contact position determined by the position determination unit 1220. In this way, if there is an abnormality in terminal 7, the probe 1400 is not moved to the contact position, so current is not sent to the abnormal terminal 7, and the risk of the semiconductor device 10 malfunctioning and failing is suppressed. Therefore, since the probe 1400 can be made to contact terminal 7 only after confirming that terminal 7 is normal, unnecessary troubles in the semiconductor device 10 can be suppressed, and the productivity of the semiconductor device 10 can be improved. Furthermore, after the probe 1400 is brought into contact with terminal 7 and the electrical characteristics of the semiconductor device 10 are inspected, the abnormality detection unit 1250 will again detect an abnormality in terminal 7 from the image acquired by the image acquisition unit 1210, thereby enabling early detection of defective semiconductor device 10 caused by the inspection of electrical characteristics.

[0093] Next, a specific configuration example 3 of the semiconductor inspection apparatus 1000 will be described using Figures 17 and 18. Figure 17 is a configuration diagram showing a specific configuration example 3 of the semiconductor inspection apparatus 1000. Figure 18 is a configuration diagram showing a specific configuration example 3 of the semiconductor inspection apparatus 1000. The semiconductor inspection apparatus 1000 equipped with this configuration example 3 will be referred to as semiconductor inspection apparatus 1000c.

[0094] As shown in Figures 17 and 18, the semiconductor inspection apparatus 1000c has a visual inspection apparatus 1500. In configuration example 3, the image acquisition unit 1210 and the anomaly detection unit 1250 are provided inside the visual inspection apparatus 1500. Also, as shown in Figure 18, the imaging unit 1100 may be connected to the visual inspection apparatus 1500 and be movable by a transport unit 1300.

[0095] The operation of semiconductor inspection device 1000c is the same as that of semiconductor inspection device 1000b described above, so it will be omitted.

[0096] Next, a modified example of Embodiment 1 will be described using Figures 19 to 21. First, Modification 1 of Embodiment 1 will be described using Figures 19 and 20. Figure 19 is a schematic top view of the semiconductor device 10a according to Modification 1 of Embodiment 1. Figure 20 is a schematic cross-sectional view of the semiconductor device 10a according to Modification 1 of Embodiment 1. Note that Figure 20 shows the cross-section along the dashed-dotted line X-X shown in Figure 19. Note that the dotted line and dashed-dotted line in Figure 19 do not represent the identification part 9.

[0097] The semiconductor device 10a according to Modification 1 of Embodiment 1 differs from the semiconductor device 10 described above in the configuration of the resin part 8. In Modification 1, the resin part 8 of the case material 8a is composed of a peripheral portion 81a and a cover portion 82a. As shown in Figures 19 and 20, the peripheral portion 81a is a part provided to surround the outer periphery of the insulating substrate 2 etc. provided on the heat sink 1, and the cover portion 82a is a part provided to cover the space surrounded by the peripheral portion 81a. In the semiconductor device 10 described above, the case material 8a is composed only of the peripheral portion 81a.

[0098] As shown in Figures 19 and 20, the identification part 9 of the modified example 1 is provided on the upper surface of the lid portion 82a of the case material 8a.

[0099] The semiconductor device 10a of the modified example 1 can achieve the same effects as the semiconductor device 10 described above.

[0100] Next, a modified example 2 of Embodiment 1 will be described using Figure 21. Figure 21 is a schematic top view of the semiconductor device 10b according to modified example 2 of Embodiment 1. Note that the dotted lines in Figure 21 do not represent the identification unit 9.

[0101] The semiconductor device 10b according to Modification 2 of Embodiment 1 differs from the semiconductor device 10 described above in the configuration of the identification unit 9. The identification unit 9 of Modification 2 is composed of a two-dimensional code. The two-dimensional code has identification information that can identify the position of the exposed portion 71 of each of the multiple terminals 7. Note that, as shown in Figure 21, one two-dimensional code may be provided on the surface of the resin part 8 corresponding to each of the multiple terminals 7. In that case, each two-dimensional code should have the above-mentioned identification information for the corresponding terminal 7. Also, in that case, it is desirable that the distance a between the probe contact position of the terminal 7 and the two-dimensional code provided corresponding to the terminal 7 be equal regardless of the type of terminal 7. Also, only one two-dimensional code may be provided on the surface of the resin part 8. In that case, one two-dimensional code should have the above-mentioned identification information for all of the multiple terminals 7. Furthermore, the identification information possessed by the two-dimensional code may include identification information that can identify the type of each of the multiple terminals 7, and may also include identification information that can identify inspection conditions (current value, voltage value, etc.) for inspecting the electrical characteristics of the semiconductor device 10.

[0102] The semiconductor device 10b of Modified Example 2 can achieve the same effects as the semiconductor device 10 described above. Furthermore, since the semiconductor device 10b of Modified Example 2 can identify inspection conditions for testing the electrical characteristics of the semiconductor device 10 from the identification unit 9, it is no longer necessary to pre-set these inspection conditions on the control device 1200 side, and the control program used in the control device 1200 can be simplified.

[0103] Embodiment 2. The semiconductor device 20 in Embodiment 2 will be described using Figures 22 and 23. Figure 22 is a schematic top view of the semiconductor device 20 according to Embodiment 2. Figure 23 is a schematic side view of the semiconductor device 20 according to Embodiment 2. Note that the dotted lines in Figure 23 do not represent the identification part 9. Furthermore, Figure 23(a) is a schematic side view of the semiconductor device 20 shown in Figure 22, viewed from the positive side (direction a) in the X-axis direction. Figure 23(b) is a schematic side view of the semiconductor device 20 shown in Figure 22, viewed from the negative side (direction b) in the X-axis direction.

[0104] In Embodiment 2, the semiconductor device 20 has the identification portion 9 provided on the side surface of the resin portion 8. In Embodiment 1, the semiconductor device 10 had the identification portion 9 provided on the upper surface of the resin portion 8, but in Embodiment 2, the semiconductor device 20 differs in that the identification portion 9 is provided on the side surface of the resin portion 8. In Embodiment 2, as shown in Figure 23, the identification portion 9 is provided on the side surface of the resin portion 8 facing the X-axis direction, but the identification portion 9 may also be provided on the side surface of the resin portion 8 facing the Y-axis direction. Furthermore, the identification portion 9 may be provided on both the side surface of the resin portion 8 facing the X-axis direction and the side surface facing the Y-axis direction. For example, the identification portion 9 provided in correspondence with the first terminal 7a may be provided on the side surface of the resin portion 8 facing the Y-axis direction, and the identification portion 9 provided in correspondence with the second terminal 7b may be provided on the side surface of the resin portion 8 facing the X-axis direction.

[0105] The identification unit 9 may further have the function of being able to identify the type of each of the multiple terminals 7. Also, although the identification unit 9 in Embodiment 2 is provided on the surface of the case material 8a, it may be provided on the surface of the sealing material 8b.

[0106] Furthermore, the identification unit 9 is composed of a first identification unit 9a that has the function of identifying the type of each of the multiple terminals 7, and a second identification unit 9b that has the function of identifying any orientation, and the first identification unit 9a and the second identification unit 9b may be provided one each on the side surface of the resin unit 8, corresponding to each of the multiple terminals 7.

[0107] When an identification section 9 is provided on the side of the resin section 8, one for each of the multiple terminals 7, it is desirable that the identification section 9 be provided in such a way that it is easy to determine which terminal 7 each identification section 9 corresponds to. As shown in Figure 23, it is desirable to reduce the distance a between the probe contact position of the terminal 7 and the identification section 9 provided in conjunction with the terminal 7, and to increase the distance b between identification sections 9 provided for the same type of terminal 7 and the distance c between identification sections 9 provided for different types of terminals 7, so that it is possible to determine which terminal 7 each identification section 9 corresponds to.

[0108] Furthermore, it is desirable that the above-mentioned interval a is equal regardless of the type of terminal 7.

[0109] As shown in Figure 23, the first identification unit 9a may consist of different characters depending on the type of terminal 7 (collector terminal, emitter terminal, gate terminal, etc.). The first identification unit 9a only needs to have the function of being able to identify each type of terminal 7, and may consist of different shapes depending on the type of terminal 7, and may also consist of different colors depending on the type of terminal 7.

[0110] The second identification section 9b may have a shape that allows for easy identification of any orientation, as shown in Figure 23. For example, as shown in Figure 23, the second identification section 9b may be composed of an arrow or a triangle. The second identification section 9b is provided to indicate the position of the exposed portion 71 of the corresponding terminal 7. As shown in Figure 23, in this embodiment, the second identification section 9b is provided below the position of the exposed portion 71 of the terminal 7, so the second identification section 9b is provided to indicate the upper surface direction of the resin portion 8. As shown in Figure 23, when the second identification section 9b is provided on the side surface of the resin portion 8, the inspection device can identify the probe contact position in the Y-axis direction and the Z-axis direction of the terminal 7 by identifying any orientation from the second identification section 9b. Furthermore, it is desirable that the second identification section 9b has a shape that allows for easy identification of any reference position. For example, as shown in Figure 23(b), a reference line may be provided above or below the first identification section 9a. Furthermore, as shown in Figure 23, the first identification unit 9a may be located above the second identification unit 9b, or the first identification unit 9a may be located below the second identification unit 9b.

[0111] Furthermore, the identification unit 9 may be composed of the two-dimensional code described above.

[0112] As described above, the semiconductor device 20 of Embodiment 2 is configured. Similar to Embodiment 1, by providing the identification unit 9 on the surface of the resin unit 8, the same effects as in Embodiment 1 can be achieved. Furthermore, when the terminal 7 has a shape that extends in the positive Z-axis direction, such as the second terminal 7b, the probe contact position of the terminal 7 can be determined by its relative position from the second identification unit 9b provided on the side surface of the resin unit 8. This eliminates the need to pre-set the coordinates in the Z-axis direction on the control device 1200 side, and simplifies the control program used in the control device 1200. Also, since the identification unit 9 is provided on the side surface of the resin unit 8, the spacing c between identification units 9 provided for different types of terminals 7 can be increased, depending on the shape of the resin unit 8 or the size of the surface area of ​​the resin unit 8, compared to the case where the identification unit 9 is provided on the upper surface of the resin unit 8. This makes it easier for the inspection device to recognize which terminal 7 the detected identification unit 9 corresponds to, and allows the probe to be moved more accurately to the position of each terminal 7.

[0113] In the above description, the identification portion 9 was provided on the side surface of the resin portion 8, but the identification portion 9 may also be provided on the upper surface of the resin portion 8, not just on the side surface. For example, the identification portion 9 corresponding to the second terminal 7b, which has a shape extending in the positive Z-axis direction, may be provided on the side surface of the resin portion 8, and the identification portion 9 corresponding to the first terminal 7a, which has a shape extending in the X-axis direction, may be provided on the upper surface of the resin portion 8.

[0114] Next, an example configuration of a semiconductor inspection apparatus 2000 for inspecting the electrical characteristics of a semiconductor device 20 will be described using Figure 24. Figure 24 is a schematic top view showing an example configuration of the semiconductor inspection apparatus 2000. Note that the configuration diagram showing the example configuration of the semiconductor inspection apparatus 2000 is the same as that of Figures 5, 9, and 11 and will therefore be omitted. Also, the flowchart showing the operation flow of the semiconductor inspection apparatus 2000 is the same as that of Figures 8, 10, and 16 and will therefore be omitted. Note that, as shown in Figures 17 and 18, an appearance inspection apparatus 1500 may also be included.

[0115] In Embodiment 2, since the identification unit 9 is provided on the side surface of the semiconductor device 20, the imaging unit 1100 images the semiconductor device 20 from the side, as shown in Figure 24. In Embodiment 2, since the identification unit 9 is provided on the side surface of the semiconductor device 20 facing in the X-axis direction, the imaging unit 1100 images the semiconductor device 20 from the positive X-axis side and the negative X-axis side, with the semiconductor device 20 in between. The imaging unit 1100 in Embodiment 2 consists of two cameras, and the imaging range of one camera is the range that includes the entire surface of one of the sides of the semiconductor device 20 facing in the X-axis direction, and the cameras are fixedly provided on the positive X-axis side and the negative X-axis side, respectively, with the semiconductor device 20 in between. If the imaging range of one camera is the range that includes a part of one of the sides of the semiconductor device 20 facing in the X-axis direction, the cameras may be provided so as to be movable in the Y-axis and Z-axis directions, for example. Furthermore, if the imaging range of one camera covers a portion of one of the sides of the semiconductor device 20 that are opposite each other in the X-axis direction, multiple cameras may be fixedly installed.

[0116] Furthermore, if the identification unit 9 is provided on the side surface of the semiconductor device 20 facing the Y-axis direction, the imaging unit 1100 may image the semiconductor device 20 from the Y-axis direction. Also, if the identification unit 9 is provided on both the side surface of the resin part 8 facing the X-axis direction and the side surface facing the Y-axis direction, the imaging unit 1100 may image the semiconductor device 20 from both the X-axis direction and the Y-axis direction.

[0117] Embodiment 3. The semiconductor device 30 in Embodiment 3 will be described with reference to Figures 25 and 26. Figure 25 is a schematic top view of the semiconductor device 30 according to Embodiment 3. Figure 26 is a schematic side view of the semiconductor device 30 according to Embodiment 3. Note that the dotted line in Figure 25 does not represent the identification unit 9.

[0118] In the semiconductor device 30 of Embodiment 3, the identification unit 9 is provided on the surface of the cover 110 of the inspection jig 100. In the semiconductor device 10 of Embodiment 1 and the semiconductor device 20 of Embodiment 2, the identification unit 9 was provided on the surface of the resin part 8, but in the semiconductor device 30 of Embodiment 3, the identification unit 9 is provided on the surface of the inspection jig 100. In other words, the identification unit 9 is not directly provided in the semiconductor device 30 of Embodiment 3.

[0119] The semiconductor device 30 of Embodiment 3 is a semiconductor device having a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals exposed to the outside of the package is uneven, and comprises a semiconductor element 5, a resin part 8 provided so as to cover the semiconductor element 5, and a plurality of terminals 7, each having one end electrically connected to the semiconductor element 5 and the other end exposed from the surface of the resin part 8.

[0120] The inspection jig 100 is a jig used in the inspection process described above during the manufacturing process of the semiconductor device 30. The inspection jig 100 includes a cover 110 provided to expose the other end of each of the multiple terminals 7. In the third embodiment, the cover 110 of the inspection jig 100 is provided to cover the top surface of the semiconductor device 30 so as to expose the other end of each of the multiple terminals 7. The cover 110 of the inspection jig 100 has holes on its surface at positions corresponding to the other ends of each of the multiple terminals 7. In this way, the other ends of each of the multiple terminals 7 can be exposed from the surface of the cover 110.

[0121] The cover 110 includes an identification unit 9 that has the function of identifying the position of the exposed portion 71 of each of the multiple terminals 7.

[0122] Furthermore, the identification unit 9 may also have the function of being able to identify the type of each of the multiple terminals 7. Also, although the identification unit 9 in Embodiment 3 is provided on the upper surface of the cover 110, it may also be provided on the side surface of the cover 110.

[0123] Furthermore, the identification unit 9 is composed of a first identification unit 9a that has the function of identifying the type of each of the multiple terminals 7, and a second identification unit 9b that has the function of identifying any orientation, and the first identification unit 9a and the second identification unit 9b may be provided one each on the upper surface of the cover 110, corresponding to each of the multiple terminals 7.

[0124] When an identification unit 9 is provided on the upper surface of the cover 110, one for each of the multiple terminals 7, it is desirable that each identification unit 9 be provided in such a way that it is easy to determine which terminal 7 it corresponds to. As shown in Figure 27, it is desirable to make the distance a between the probe contact position of the terminal 7 and the identification unit 9 provided in correspondence with the terminal 7 small, and to make the distance b between identification units 9 provided for the same type of terminal 7 and the distance c between identification units 9 provided for different types of terminals 7 large, so that it is possible to determine which terminal 7 each identification unit 9 corresponds to. It is desirable that the distance c be larger than the distance d between the upper end of the first identification unit 9a and the lower end of the second identification unit 9b provided in correspondence with the first identification unit 9a.

[0125] Furthermore, it is desirable that the above-mentioned interval a is equal regardless of the type of terminal 7.

[0126] As shown in Figure 25, the first identification unit 9a may consist of different characters depending on the type of terminal 7 (collector terminal, emitter terminal, gate terminal, etc.). The first identification unit 9a only needs to have the function of being able to identify each type of terminal 7, and may consist of different shapes depending on the type of terminal 7, and may also consist of different colors depending on the type of terminal 7.

[0127] The second identification section 9b may have a shape that allows for easy identification of any orientation, as shown in Figure 25. For example, as shown in Figure 25, the second identification section 9b may be composed of an arrow or a triangle. The second identification section 9b is provided to indicate the position of the exposed portion 71 of the corresponding terminal 7. As shown in Figures 25 and 26, the cover 110 of the inspection jig 100 is provided to cover the upper surface of the semiconductor device 30, and the second identification section 9b is located inside the position of the exposed portion 71 of the terminal 7. Therefore, the second identification section 9b is provided to indicate the outer circumference direction of the upper surface of the resin portion 8.

[0128] Furthermore, the identification unit 9 may be provided on the side of the cover 110. Also, the identification unit 9 may be composed of the two-dimensional code described above.

[0129] As described above, the inspection jig 100 used for inspecting the semiconductor device 30 of Embodiment 3 is configured. By providing the identification portion 9 on the surface of the cover 110 of the inspection jig 100, the same effects as in Embodiments 1 and 2 can be achieved. Furthermore, since the identification portion 9 is not directly provided on the surface of the semiconductor device 30, the manufacturing cost of the semiconductor device 30 can be reduced. In addition, unlike the semiconductor device 30, which is subject to constraints on material and surface condition in order to satisfy electrical characteristics, the cover 110 is not subject to constraints on material and surface condition. Therefore, by selecting a cover 110 with high visibility, the recognition rate of the identification portion 9 provided on the surface of the cover 110 can be improved.

[0130] Next, an example configuration of a semiconductor inspection apparatus 3000 for inspecting the electrical characteristics of the semiconductor device 30 will be described using Figure 28. Figure 28 is a schematic side view showing an example configuration of the semiconductor inspection apparatus 3000. Note that the configuration diagram showing the example configuration of the semiconductor inspection apparatus 3000 is the same as that of Figures 5, 9, and 11 and will therefore be omitted. Also, the flowchart showing the operation flow of the semiconductor inspection apparatus 3000 is the same as that of Figures 8, 10, and 16 and will therefore be omitted. Note that, as shown in Figures 17 and 18, an appearance inspection apparatus 1500 may also be included.

[0131] In Embodiment 3, the identification unit 9 is provided on the surface of the cover 110 of the inspection jig 100. As shown in Figure 28, the imaging unit 1100 images the surface of the cover 110 and outputs the image. When the identification unit 9 is provided on the upper surface of the cover 110, the imaging unit 1100 images the semiconductor device 30 from above. When the identification unit 9 is provided on the side of the cover 110, the imaging unit 1100 images the semiconductor device 30 from the side.

[0132] Next, a modified example of Embodiment 3 will be described using Figures 29 and 30. Figure 29 is a schematic top view of the semiconductor device 30a according to the modified example of Embodiment 3. Figure 30 is a schematic side view of the semiconductor device 30a according to the modified example of Embodiment 3. Note that the dotted line in Figure 29 does not indicate the identification unit 9.

[0133] The inspection jig 100a used to inspect the semiconductor device 30a according to a modified example of Embodiment 3 differs from the inspection jig 100 described above in the shape of its cover 110.

[0134] As shown in Figures 29 and 30, the cover 110 of the inspection jig 100a is provided to surround the outer periphery of the semiconductor device 30a so as to expose the other ends of each of the multiple terminals 7. The cover 110 may have recesses provided along the outer shape of the semiconductor device 30a, and the semiconductor device 30a may be housed in these recesses to surround the outer periphery of the semiconductor device 30a. Alternatively, the cover 110 may have holes provided along the outer shape of the semiconductor device 30a, and the semiconductor device 30a may be housed in these holes to surround the outer periphery of the semiconductor device 30a.

[0135] Furthermore, as shown in Figures 29 and 30, the cover 110 of the inspection jig 100a is provided so as to surround the outer periphery of the semiconductor device 30a, and the second identification portion 9b is located outside the position of the exposed portion 71 of the terminal 7. Therefore, the second identification portion 9b is provided so as to point toward the center of the upper surface of the resin portion 8.

[0136] The inspection jig 100a used for inspecting the semiconductor device 30a according to a modification of Embodiment 3 can achieve the same effects as the inspection jig 100 described above. Furthermore, in the inspection jig 100a, the identification part 9 can be positioned outside the outer circumference of the semiconductor device 30a. Compared to the case where the identification part 9 is provided inside the outer circumference of the semiconductor device 30, as in the inspection jig 100, the spacing c (spacing c in Figure 31) between the identification parts 9 provided to correspond to different types of terminals 7 can be increased, depending on the shape of the resin part 8 or the size of the surface area of ​​the resin part 8. This makes it easier for the inspection device to recognize which terminal 7 the detected identification part 9 corresponds to, allowing the probe to be moved more accurately to the position of each terminal 7.

[0137] The configurations shown in the embodiments described above are merely examples of the content of this disclosure and can be combined with other known technologies. Furthermore, the embodiments can be combined with each other, as well as with each other, and variations can be combined. Additionally, parts of the configuration can be omitted or modified without departing from the gist of this disclosure.

[0138] The various aspects of this disclosure are summarized below as an appendix.

[0139] (Note 1) A semiconductor device having a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals exposed to the outside of the package is uneven, Semiconductor elements and A resin portion provided to cover the semiconductor element, Each of a plurality of terminals has one end electrically connected to the semiconductor element and the other end having an exposed portion that is exposed from the surface of the resin part, A semiconductor device comprising: an identification unit provided on the surface of the resin part and having the function of identifying the position of the exposed part of each of the plurality of terminals. (Note 2) The semiconductor device is the semiconductor device described in Appendix 1, having a modular structure. (Note 3) The semiconductor device according to Appendix 1 or Appendix 2, wherein the identification unit is provided one for each of the plurality of terminals. (Note 4) The semiconductor device described in Appendix 3, wherein the identification unit has a shape capable of identifying any orientation. (Note 5) The identification portion is provided on the upper surface of the resin portion, and is a semiconductor device as described in Appendix 4. (Note 6) The identification portion is provided on the side surface of the resin portion, as described in Appendix 4, for the semiconductor device. (Note 7) The semiconductor device according to any one of the appendices 1 to 3, wherein the identification unit is composed of a two-dimensional code having identification information capable of identifying the position of the exposed portion of each of the plurality of terminals. (Note 8) The semiconductor device according to Appendix 1 or Appendix 2, wherein the identification unit further has the function of being able to identify the type of each of the plurality of terminals. (Note 9) The aforementioned identification unit is A first identification unit having a shape that can identify the type of each of the plurality of terminals, It consists of a second identification unit having a shape that can identify any orientation, The semiconductor device according to Appendix 1 or Appendix 2, wherein the first identification portion and the second identification portion are each provided on the surface of the resin portion, corresponding to each of the plurality of terminals. (Note 10) A method for manufacturing a semiconductor device having a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals exposed to the outside of the package is uneven, A connection process that electrically connects one end of each of multiple terminals to a semiconductor element, A resin part forming step in which a resin part is formed that covers the semiconductor element and a part of the plurality of terminals such that the other end of each of the plurality of terminals is exposed from the surface, A method for manufacturing a semiconductor device, comprising: an identification portion forming step of forming an identification portion on the surface of the resin portion, the identification portion having the function of being able to identify the position of the exposed portion where the other end of each of the plurality of terminals is exposed from the surface of the resin portion. (Note 11) The semiconductor device has a modular structure, and the method for manufacturing the semiconductor device described in Appendix 10. (Note 12) A semiconductor testing apparatus for testing the electrical characteristics of a semiconductor device described in any one of the items from Appendix 1 to Appendix 9, An imaging unit that images the surface of the resin part and outputs the image, An image acquisition unit that acquires the captured image output from the imaging unit, A position determination unit detects the identification unit from the captured image acquired by the image acquisition unit, and determines a contact position for bringing the probe into contact with the exposed portion of the terminal, An output unit that outputs the contact position determined by the position determination unit, A semiconductor inspection apparatus comprising: a transport unit that moves the probe to the contact position based on the contact position output from the output unit. (Note 13) A semiconductor device inspection jig used to inspect the electrical characteristics of a semiconductor device, comprising a semiconductor element, a resin part provided to cover the semiconductor element, and a plurality of terminals, each having one end electrically connected to the semiconductor element and the other end exposed from the surface of the resin part, wherein the structure has a configuration in which terminals of different shapes are mixed within a single package, or a configuration in which there are areas within a single package where the spacing of terminals exposed to the outside of the package is uneven, the jig for inspecting the electrical characteristics of a semiconductor device The device includes a cover provided to expose the other end of each of the aforementioned multiple terminals, The cover is an inspection jig for a semiconductor device, comprising an identification section that has the function of identifying the position of the exposed portion of each of the plurality of terminals. (Note 14) The semiconductor device is an inspection jig for the semiconductor device described in Appendix 13, having a modular structure. (Note 15) A semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device using the semiconductor device inspection jig described in Appendix 13 or Appendix 14, An imaging unit that images the surface of the cover and outputs the captured image, An image acquisition unit that acquires the captured image output from the imaging unit, A position determination unit detects the identification unit from the captured image acquired by the image acquisition unit, and determines a contact position for bringing the probe into contact with the exposed portion of the terminal, An output unit that outputs the contact position determined by the position determination unit, A semiconductor inspection apparatus comprising: a transport unit that moves the probe to the contact position based on the contact position output from the output unit. [Explanation of symbols]

[0140] 5 Semiconductor element, 7 Terminal, 71 Exposed part, 8 Resin part, 9 Identification part, 9a First identification part, 9b Second identification part, 10 20 30 Semiconductor device, 100 Inspection jig, 110 Cover, 1000 2000 Semiconductor manufacturing equipment, 1100 Imaging unit, 1200 Control device, 1210 Image acquisition unit, 1220 Position determination unit, 1230 Output unit, 1300 Transport unit, 1400 Probe

Claims

1. A semiconductor device having a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals exposed to the outside of the package is uneven, Semiconductor elements and A resin portion provided to cover the semiconductor element, Each of a plurality of terminals has one end electrically connected to the semiconductor element and the other end having an exposed portion that is exposed from the surface of the resin part, A semiconductor device comprising: an identification unit provided on the surface of the resin part and having the function of identifying the position of the exposed part of each of the plurality of terminals.

2. The semiconductor device is the semiconductor device according to claim 1, wherein the semiconductor device has a modular structure.

3. The semiconductor device according to claim 1, wherein the identification unit is provided one for each of the plurality of terminals.

4. The semiconductor device according to claim 3, wherein the identification unit has a shape capable of identifying any orientation.

5. The semiconductor device according to claim 4, wherein the identification portion is provided on the upper surface of the resin portion.

6. The semiconductor device according to claim 4, wherein the identification portion is provided on the side surface of the resin portion.

7. The semiconductor device according to claim 1, wherein the identification unit is composed of a two-dimensional code having identification information capable of identifying the position of the exposed portion of each of the plurality of terminals.

8. The semiconductor device according to claim 1, wherein the identification unit further has the function of being able to identify the type of each of the plurality of terminals.

9. The aforementioned identification unit is A first identification unit having a shape that can identify the type of each of the plurality of terminals, It consists of a second identification unit having a shape that can identify any orientation, The semiconductor device according to claim 1, wherein the first identification portion and the second identification portion are each provided on the surface of the resin portion, corresponding to each of the plurality of terminals.

10. A method for manufacturing a semiconductor device having a structure in which terminals of different shapes are mixed within a single package, or a structure in which there are areas within a single package where the spacing between terminals exposed to the outside of the package is uneven, A connection process that electrically connects one end of each of multiple terminals to a semiconductor element, A resin part forming step in which a resin part is formed that covers the semiconductor element and a part of the plurality of terminals such that the other end of each of the plurality of terminals is exposed from the surface, A method for manufacturing a semiconductor device, comprising: an identification portion forming step of forming an identification portion on the surface of the resin portion, the identification portion having the function of being able to identify the position of the exposed portion where the other end of each of the plurality of terminals is exposed from the surface of the resin portion.

11. The method for manufacturing a semiconductor device according to claim 10, wherein the semiconductor device has a modular structure.

12. A semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device according to any one of claims 1 to 9, An imaging unit that images the surface of the resin part and outputs the image, An image acquisition unit that acquires the captured image output from the imaging unit, A position determination unit detects the identification unit from the captured image acquired by the image acquisition unit, and determines a contact position for bringing the probe into contact with the exposed portion of the terminal, An output unit that outputs the contact position determined by the position determination unit, A semiconductor inspection apparatus comprising: a transport unit that moves the probe to the contact position based on the contact position output from the output unit.

13. A semiconductor device inspection jig used to inspect the electrical characteristics of a semiconductor device, comprising a semiconductor element, a resin part provided to cover the semiconductor element, and a plurality of terminals, each having one end electrically connected to the semiconductor element and the other end exposed from the surface of the resin part, wherein the structure has a configuration in which terminals of different shapes are mixed within a single package, or a configuration in which there are areas within a single package where the spacing of terminals exposed to the outside of the package is uneven, the jig for inspecting the electrical characteristics of a semiconductor device and the jig for inspecting the electrical characteristics of a semiconductor device, the jig for inspecting the electrical characteristics of a semiconductor device, and the jig for inspecting the electrical characteristics of a semiconductor device, the jig for inspecting the electrical characteristics of a semiconductor device, and the jig for inspecting the electrical characteristics of a semiconductor device, and the jig for inspecting the electrical characteristics of a semiconductor device, and the structure has a configuration in which terminals of different shapes are mixed within a single package, or in which there are areas within a single package where the spacing of terminals exposed to the outside of the package is uneven. The device includes a cover provided to expose the other end of each of the aforementioned multiple terminals, The cover is an inspection jig for a semiconductor device, comprising an identification section that has the function of identifying the position of the exposed portion of each of the plurality of terminals.

14. The semiconductor device is an inspection jig for a semiconductor device according to claim 13, wherein the semiconductor device has a modular structure.

15. A semiconductor inspection apparatus for inspecting the electrical characteristics of a semiconductor device using the semiconductor device inspection jig described in claim 13 or claim 14, An imaging unit that images the surface of the cover and outputs the captured image, An image acquisition unit that acquires the captured image output from the imaging unit, A position determination unit detects the identification unit from the captured image acquired by the image acquisition unit, and determines a contact position for bringing the probe into contact with the exposed portion of the terminal, An output unit that outputs the contact position determined by the position determination unit, A semiconductor inspection apparatus comprising: a transport unit that moves the probe to the contact position based on the contact position output from the output unit.

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