Semiconductor manufacturing equipment and semiconductor manufacturing method

Abstract

The present invention provides a semiconductor device manufacturing apparatus capable of stably holding the semiconductor components to be bonded during the wire bonding process and stabilizing the bonding properties of the wire bond. [Solution] The semiconductor device manufacturing apparatus 1 includes a holding unit 4 for holding a semiconductor component 9 to be bonded, a bonding unit 5 for performing bonding on the semiconductor component 9 held by the holding unit 4, and a detection unit 6 for detecting whether there is an abnormality in the mounting area on the holding unit 4 where the semiconductor component 9 is mounted when the holding unit 4 is not holding the semiconductor component 9. The holding unit 4 holds the semiconductor component 9 when the detection unit 6 does not detect an abnormality, and the bonding unit 5 performs bonding on the semiconductor component 9 held by the holding unit 4.

Description

Technical Field

[0001] The present disclosure relates to a manufacturing apparatus for semiconductor devices and a method for manufacturing semiconductor devices.

Background Art

[0002] Patent Document 1 discloses an example of a method for manufacturing a semiconductor device having a wire bonding process for electrically connecting a bonding pad of a semiconductor element and a wiring board on which the semiconductor element is mounted. In this manufacturing method, after sequentially connecting Au balls to two adjacent bonding pads, the height of the capillary at the time of each bonding is compared. When the difference in height between the two bonding pads exceeds a threshold value due to foreign matter on the surface of the bonding pad, the bonding operation is immediately stopped.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the wire bonding process, for example, the upper and lower surfaces of a semiconductor component including a lead frame on which a semiconductor element is mounted are fixed by being sandwiched between fixing jigs. Among these, as the fixing jig on the lower surface side, there is one having a structure that supports the entire lower surface of the semiconductor component. In the manufacturing method of Patent Document 1, foreign matter adhering to the surface of the bonding pad can be detected, but when the above-described fixing jig on the lower surface side is used, foreign matter sandwiched between the semiconductor component and the fixing jig on the lower surface side cannot be detected. Therefore, in the manufacturing method of Patent Document 1, when foreign matter is sandwiched between the semiconductor component and the fixing jig on the lower surface side, the fixing state of the semiconductor component becomes unstable, and the bonding property of the wire bond is not stable.

[0005] This disclosure is made to solve the above problems and aims to provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method that can stably hold the semiconductor component to be bonded in the wire bonding process and stabilize the bondability of the wire bond. [Means for solving the problem]

[0006] The semiconductor device manufacturing apparatus according to this disclosure comprises a holding unit for holding a semiconductor component to be bonded, a bonding unit for performing bonding on the semiconductor component held by the holding unit, and a detection unit for detecting whether or not there is an abnormality in the mounting area of ​​the holding unit on which the semiconductor component is mounted when the holding unit is not holding the semiconductor component, wherein the holding unit holds the semiconductor component when no abnormality is detected by the detection unit, and the bonding unit performs bonding on the semiconductor component held by the holding unit.

[0007] A method for manufacturing a semiconductor device according to the present disclosure comprises: a holding unit for holding a semiconductor component to be bonded; a bonding unit for performing bonding on the semiconductor component held by the holding unit; and a detection unit for detecting whether or not there is an abnormality in the mounting area on the holding unit where the semiconductor component is mounted when the holding unit is not holding the semiconductor component, and the method includes the steps of: the holding unit holding the semiconductor component when the detection unit detects that there is no abnormality in the mounting area; and the bonding unit performing bonding on the semiconductor component held by the holding unit. [Effects of the Invention]

[0008] According to the semiconductor device manufacturing apparatus and semiconductor device manufacturing method described herein, it is possible to stably hold the semiconductor component to be bonded in the wire bonding process and stabilize the bonding properties of the wire bond. [Brief explanation of the drawing]

[0009] [Figure 1] This is a side view showing the semiconductor component being held in the semiconductor device manufacturing apparatus according to Embodiment 1. [Figure 2] This is a block diagram showing the configuration of a semiconductor device manufacturing apparatus according to Embodiment 1. [Figure 3] This is a block diagram showing an example of the hardware configuration of the control unit of a semiconductor device manufacturing apparatus according to Embodiment 1. [Figure 4] This is a block diagram showing an example of the hardware configuration of the control unit of a semiconductor device manufacturing apparatus according to Embodiment 1. [Figure 5] This is a flowchart showing the operation process of the semiconductor device manufacturing apparatus according to Embodiment 1. [Figure 6] This is a side view showing a state in which the semiconductor component is not being held in the semiconductor manufacturing apparatus according to Embodiment 1. [Figure 7] This is a side view showing the semiconductor component being held in the semiconductor device manufacturing apparatus according to Embodiment 2. [Figure 8] This is a side view showing a state in which semiconductor components are not being held in the semiconductor manufacturing apparatus according to Embodiment 2. [Figure 9] This is a plan view showing the lower holding portion of the semiconductor device manufacturing apparatus according to Embodiment 3. [Figure 10] This is a side view showing the semiconductor components being held in a semiconductor device manufacturing apparatus according to a modified example. [Figure 11] This is a side view showing the semiconductor components being held in a semiconductor device manufacturing apparatus according to a modified example. [Modes for carrying out the invention]

[0010] In the following explanation, terms such as "up" and "down" are used to indicate directions, but these directions refer to the relative orientation within the semiconductor manufacturing equipment and do not limit the direction in which the semiconductor manufacturing equipment is used.

[0011] Embodiment 1. Embodiment 1 of this disclosure will be described below with reference to the drawings. Figure 1 is a side view showing a semiconductor device manufacturing apparatus 1 according to Embodiment 1. Figure 2 is a control block diagram of the semiconductor device manufacturing apparatus 1 according to Embodiment 1.

[0012] The semiconductor device manufacturing apparatus 1 is a wedge bonding type wire bonding apparatus. The semiconductor device manufacturing apparatus 1 comprises a frame 2, a control unit 3, a holding unit 4, a bonding unit 5, a detection unit 6, a transport unit 7, and an alarm 8. The semiconductor device manufacturing apparatus 1 is an apparatus that performs wire bonding on a semiconductor component 9 on which a semiconductor element is provided.

[0013] The semiconductor component 9 is the object to be wire-bonded by the semiconductor device manufacturing apparatus 1, and comprises a semiconductor element (not shown) and a lead frame on which the semiconductor element is mounted. The lead frame has a die pad portion to which a power device or the like is attached, and a frame portion located diagonally above the die pad portion, with the die pad portion and the frame portion being integrally connected. The lead frame has a step formed by these die pad portion and frame portion.

[0014] The semiconductor elements can be switching elements or diodes, for example, insulated-gate bipolar transistors (IGBTs) or metal-oxide-semiconductor field-effect transistors (MOSFETs), and diodes may be used as freewheeling elements. The number of semiconductor elements is not limited to one, but can be two or more. Furthermore, while the above embodiment shows switching elements and diode elements made of silicon, they may also be made of wide-bandgap semiconductors with a larger bandgap than silicon. Examples of wide-bandgap semiconductors include silicon carbide, gallium nitride-based materials, gallium oxide-based materials, or diamond.

[0015] As shown in FIG. 2, the control unit 3 is connected to each part of the manufacturing apparatus 1 of the semiconductor device via the communication bus 10 to control each unit and control the entire manufacturing apparatus 1 of the semiconductor device.

[0016] FIGS. 3 and 4 are diagrams showing the hardware configuration of the control unit 3. Referring to FIGS. 3 and 4, the hardware configuration of the control unit 3 will be described. As an example, as shown in FIG. 3, the control unit 2 is realized by the processing circuit 13. The control unit 3 is, for example, a single circuit, a composite circuit, a programmed processor, a parallel-programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a combination thereof. The functions of each unit of the control unit 3 may be realized by separate processing circuits, or these functions may be realized by one processing circuit together.

[0017] As another example, as shown in FIG. 4, the control unit 3 is realized by the processor 12 and the memory 13. When the program stored in the memory 13 is read out and executed by the processor 12, the functions of the functional units provided in each unit are realized. The program is realized as software, firmware, or a combination of software and firmware. Examples of the memory 13 include non-volatile or volatile semiconductor memories such as RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), EEPROM (Electrically-EPROM), magnetic disks, flexible disks, optical disks, compact disks, mini disks, and DVDs.

[0018] The holding unit 4 is a device that holds the semiconductor component 9, and includes a lower holding part 41 and an upper holding part 42. The lower holding part 41 and the upper holding part 42 are fixed to the flat upper surface of the gantry 2.

[0019] The lower holding section 41 comprises a base 411 fixed to the frame 2 and a mounting section 412 installed on the base 411. The upper surface of the mounting section 412 is a mounting area 413 on which the semiconductor component 9 is mounted, and the mounting section 412 has a recess formed in the center when viewed from the side. With the semiconductor component 9 mounted on the mounting section 412, the die pad portion, which is the lower part of the semiconductor component 9, is mounted on the lower mounting section 414 which is formed by the recess, and the frame portion, which is the upper part of the semiconductor component 9, is mounted on the upper mounting section 415 located on the side of the lower mounting section 414.

[0020] The upper holding portion 42 comprises a plurality of legs 421 fixed to the frame 2 and extending vertically, a main body portion 422, and a lead frame retainer 423. The main body portion 422 is a rectangular plate-shaped member, with each corner supported by the legs 421, and a rectangular opening 424 in plan view formed in the center. The opening 424 is formed in the portion corresponding to the wire bonding area of ​​the semiconductor component 9 mounted on the lower holding portion 41. In addition, lighting fixtures 425 such as LEDs (Light Emission Diodes) that illuminate the mounting area 413 are installed at the upper end of each leg portion 421. The installation position of the lighting fixtures 425 is not limited to illuminating the mounting area 413, but is sufficient. The lead frame retainer 423 is installed on the periphery of the opening 424 on the lower surface of the main body portion 422, extending diagonally downward from the periphery, with its tip located in the wire bonding area of ​​the semiconductor component 9. The lead frame retainer 423 rotates up and down around its upper end, releasing the semiconductor component 9 when rotated upward, and holding the semiconductor component 9 together with the lower retaining portion 41 by pressing the peripheral portion of the wire bonding area of ​​the semiconductor component 9 when rotated downward.

[0021] The bonding unit 5 is positioned above the holding unit 4. As shown in Figure 2, the bonding unit 5 includes a bonding head 51, a correction camera 52 for correcting the bonding position of the bonding head 51, and a bonding head drive unit 53. The correction camera 52 images the wire bonding area of ​​the semiconductor component 9 mounted on the lower holding unit 41, and the bonding position of the bonding head 51 is corrected based on the captured image. The bonding head drive unit 53 is composed of a servo motor or the like. The bonding head drive unit 53 moves the bonding head 51 up, down, left, and right to the corrected bonding position based on the image captured by the correction camera 52, and causes the bonding head 51 to perform wire bonding. The bonding unit 5 is mounted on the frame 2 by a base (not shown).

[0022] The detection unit 6 is installed on the frame 2, spaced apart from the holding unit 4 and the bonding unit 5. Therefore, the detection unit 6 is independent of the respective drive mechanisms of the holding unit 4 and the bonding unit 5. The detection unit 6 comprises a fixed member 61 installed on the frame 2 and a detection camera 62 attached to the fixed member 61. The fixed member 61 comprises a vertical member extending from the frame 2 to above the bonding unit 5 and a horizontal member extending horizontally from the upper end of the vertical member to a position that does not overlap with the bonding head 51 in a plan view. The detection camera 62 is installed at the tip of the horizontal member in a position that images diagonally downward toward the opening 424 of the holding unit 4, and is installed so as not to interfere with the imaging of the wire bonding area by the bonding unit 5. The detection unit 6 further comprises a determination unit 63 as shown in Figure 2. The detection camera 62 images the entire mounting area 413 before the semiconductor component 9 is mounted on the mounting area 413 by the transport unit 7, that is, before the semiconductor component 9 is held by the holding unit 4. The determination unit 63 detects abnormalities in the mounting area 413 based on the captured image. The determination unit 63 may use various determination methods, such as pattern recognition, image segmentation, or 3D vision. Here, "abnormality" refers to a state in which the mounting area 413 is not smooth, such as when foreign matter is attached to the mounting area 413 or when the mounting area 413 has scratches or defects.

[0023] The transport unit 7 carries the semiconductor component 9 before wire bonding into the mounting section 412 of the lower holding section 41, and then unloads the wire-bonded semiconductor component 9 from the mounting section 412. More specifically, the transport unit 7 carries the semiconductor component 9 into the mounting area 413 if the detection unit 6 does not detect any abnormality in the mounting area 413, and then unloads the wire-bonded semiconductor component 9 from the mounting area 413 by the bonding unit 5.

[0024] Alarm 8 issues an external alarm when the detection unit 6 detects an abnormality in the mounting area 413.

[0025] Figure 5 is a flowchart showing the operation of the semiconductor device manufacturing apparatus 1. Figure 6 is a side view showing the semiconductor device manufacturing apparatus 1 in a state where no semiconductor component 9 is being held. The operation of the semiconductor device manufacturing apparatus 1 according to Embodiment 1 will be described below.

[0026] As shown in Figure 6, the control unit 3 starts processing when no semiconductor components 9 are mounted in the mounting area 413, and the detection unit 6 images the mounting area 413 with the illumination device 425 (step S1).

[0027] If the detection unit 6 detects an abnormality in the mounting area 413 (NO in step S2), the control unit 3 stops the semiconductor device manufacturing apparatus 1 and activates the alarm 8 (step 3).

[0028] If the detection unit 6 does not detect an abnormality in the mounting area 413 (YES in step S2), the control unit 3 uses the transport unit 7 to mount the semiconductor component 9 onto the mounting area 413 and the holding unit 4 to hold the semiconductor component 9 (step S4).

[0029] The control unit 3 performs wire bonding on the bonding region of the semiconductor component 9 held by the bonding unit 5 (step S5).

[0030] The control unit 3 controls the holding unit 4 to release the held semiconductor component 9 (step S6), and the transport unit 7 transports the semiconductor component 9 out of the mounting area 413 (step S7).

[0031] The control unit 3 returns the process to step S1 and performs wire bonding to the next semiconductor component 9.

[0032] As described above, by holding the semiconductor component 9 when there are no abnormalities in the mounting area of ​​the semiconductor component 9 without holding the semiconductor component 9, the semiconductor component 9 is stably held by the holding unit 4, and the bonding performance of the wire bond can be stabilized. Furthermore, the detection unit 6 is independent of the drive mechanisms of the holding unit 4 and the bonding unit 5. As a result, the detection unit 6, in particular the detection camera 62, is not affected by vibrations of the aforementioned drive mechanisms during imaging, and can accurately capture images of the mounting area 413.

[0033] Embodiment 2. Figure 7 is a side view showing the semiconductor component 9 being held in the semiconductor device manufacturing apparatus 200 according to Embodiment 2. Figure 8 is a side view showing the semiconductor component 9 not being held in the semiconductor device manufacturing apparatus 200 according to Embodiment 2. In the semiconductor device manufacturing apparatus 200 according to Embodiment 2, components that are the same as or similar to those in the semiconductor device manufacturing apparatus 1 according to Embodiment 1 are denoted by the same reference numerals, and the following description will focus on the differences from Embodiment 1.

[0034] The lower mounting section 414 of the holding unit 4 of the semiconductor device manufacturing apparatus 200 is equipped with a lifting stage that moves up and down by a drive mechanism (not shown). As shown in Figure 7, the lifting stage 416 lowers when a semiconductor component 9 is mounted on the mounting area 413, supporting the die pad portion of the semiconductor component 9. On the other hand, as shown in Figure 8, when no semiconductor component 9 is mounted on the mounting area 413, the lifting stage 416 rises so that its upper surface is at the same height as the upper mounting section 415. The detection unit 6 detects an abnormality in the mounting area 413 when the lifting stage 416 is raised.

[0035] As described above, when the lower mounting section 414 is lowered, there is a risk that the detection accuracy of the lower mounting section 414 will decrease due to shading. However, by raising the lifting stage 416 during the detection operation, shading is less likely to fall on the lower mounting section 414, and the detection accuracy of the lower mounting section 414 can be improved.

[0036] Embodiment 3. Figure 9 is a plan view showing the lower holding portion 41 of the semiconductor device manufacturing apparatus 300 according to Embodiment 3. In the semiconductor device manufacturing apparatus 300 according to Embodiment 2, parts that are the same as or similar to those of the semiconductor device manufacturing apparatus 1 according to Embodiment 1 are denoted by the same reference numerals, and the following description will focus on the differences from Embodiment 1.

[0037] In the holding unit 4 of the semiconductor device manufacturing apparatus 300, the mounting section 412 has transmission sensors 15 installed on both sides of the mounting area 413. The transmission sensor 15 has an emission-side sensor 151 and a light-receiving-side sensor 152, and detects the presence of a foreign object in the mounting area 413 when the amount of light emitted from the emission-side sensor 151 and received by the light-receiving-side sensor 152 falls below a predetermined threshold.

[0038] As described above, foreign objects in the mounting area 413 can be directly detected with a relatively simple configuration.

[0039] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0040] Figure 10 is a side view showing a semiconductor component being held in a semiconductor device manufacturing apparatus according to a modified example. The detection unit 6 is installed on the upper surface 15 inside the apparatus. As a result, the detection camera 62 is independent of the drive mechanisms of the transport unit 7, holding unit 4, and bonding unit 5, and can acquire an image of the mounting area 413 with high accuracy using the detection camera 62.

[0041] Figure 11 is a side view showing a semiconductor component held in a semiconductor device manufacturing apparatus according to a modified example. The detection unit 6 is installed on the bonding unit 5. This allows the mounting area 413 to be imaged at a relatively close position.

[0042] In the above embodiment, the lighting fixture 425 is provided on the leg portion 421 of the lower holding portion 41, but it is not limited to this, and it is sufficient as long as it can illuminate the mounting area 413. For example, it may be provided in a position that does not interfere with the lead frame retainer 423 of the mounting area 413.

[0043] In the above embodiment, the semiconductor device manufacturing apparatus 1 is stopped and an alarm is issued when the detection unit 6 detects an abnormality in the mounting area 413, but the invention is not limited to this. For example, the semiconductor device manufacturing apparatus 1 may be equipped with a mechanism for cleaning the mounting area 413, and may issue an alarm and perform cleaning at the same time.

[0044] In the above embodiment 3, the abnormality of the mounting area 413 is detected by the transmissive sensor 14, but the invention is not limited to this, and any sensor capable of detecting abnormalities in the mounting area 413 may be used.

[0045] The various aspects of this disclosure are summarized below as an appendix.

[0046] (Note 1) A holding part that holds the semiconductor component to be bonded, A bonding unit that performs bonding to the semiconductor component held by the holding unit, The holding portion includes a detection unit that detects whether or not there is an abnormality in the mounting area on which the semiconductor component is mounted when the holding portion is not holding the semiconductor component, The holding unit holds the semiconductor component when no abnormality is detected by the detection unit. The bonding section performs bonding to the semiconductor component held by the holding section. Manufacturing equipment for semiconductor devices. (Note 2) The detection unit comprises an imaging unit that images the mounting area, and a determination unit that determines whether or not there is an abnormality in the mounting area based on the image captured by the imaging unit. The imaging unit is independent of the drive mechanisms of the holding unit and the bonding unit. Manufacturing equipment for semiconductor devices as described in Appendix 1. (Note 3) The aforementioned semiconductor component has a step, The holding portion comprises, in the mounting area, an upper mounting portion on which the upper portion of the semiconductor component is mounted, and a lower mounting portion on which the lower portion of the semiconductor component is mounted. The lower mounting section rises to the height of the upper mounting section when the detection unit performs a detection operation. Manufacturing equipment for semiconductor devices as described in Appendix 1 or Appendix 2. (Note 4) The detection unit includes a sensor that detects abnormalities in the mounting area. A semiconductor device manufacturing apparatus as described in any of Appendix 1 to Appendix 3. (Note 5) A holding part that holds the semiconductor component to be bonded, A bonding unit that performs bonding to the semiconductor component held by the holding unit, The holding portion includes a detection unit that detects whether or not there is an abnormality in the mounting area on which the semiconductor component is mounted when the holding portion is not holding the semiconductor component, The holding unit holds the semiconductor component when the detection unit detects that there is no abnormality in the mounting area. The bonding portion includes the step of performing bonding to the semiconductor component held by the holding portion, A method for manufacturing a semiconductor device. [Explanation of symbols]

[0047] 1,200,300 Semiconductor manufacturing equipment, 4 Holding unit, 5 Bonding unit, 6 Detection unit, 9 Semiconductor components, 14 Transmissive sensor, 62 Detection camera, 63 Judgment unit, 413 Mounting area, 414 Lower mounting section, 415 Upper mounting section, 416 Lifting stage, 51 Bonding head, 52 Correction camera, 53 Bonding head drive unit

Claims

1. A holding part that holds the semiconductor component to be bonded, A bonding unit that performs bonding to the semiconductor component held by the holding unit, The holding portion includes a detection unit that detects whether or not there is an abnormality in the mounting area on which the semiconductor component is mounted when the holding portion is not holding the semiconductor component, The holding unit holds the semiconductor component when no abnormality is detected by the detection unit. The bonding section performs bonding to the semiconductor component held by the holding section. Manufacturing equipment for semiconductor devices.

2. The detection unit comprises an imaging unit that images the mounting area, and a determination unit that determines whether or not there is an abnormality in the mounting area based on the image captured by the imaging unit. The imaging unit is independent of the drive mechanisms of the holding unit and the bonding unit. The apparatus for manufacturing a semiconductor device according to claim 1.

3. The aforementioned semiconductor component has a step, The holding portion comprises, in the mounting area, an upper mounting portion on which the upper portion of the semiconductor component is mounted, and a lower mounting portion on which the lower portion of the semiconductor component is mounted. The lower mounting section rises when the detection unit performs a detection operation. A semiconductor device manufacturing apparatus according to claim 1 or claim 2.

4. The detection unit includes a sensor that detects abnormalities in the mounting area. The apparatus for manufacturing a semiconductor device according to claim 1.

5. A holding part that holds the semiconductor component to be bonded, A bonding unit that performs bonding to the semiconductor component held by the holding unit, The holding portion includes a detection unit that detects whether or not there is an abnormality in the mounting area on which the semiconductor component is mounted when the holding portion is not holding the semiconductor component, The holding unit holds the semiconductor component when the detection unit detects that there is no abnormality in the mounting area. The bonding portion includes the step of performing bonding to the semiconductor component held by the holding portion, A method for manufacturing a semiconductor device.

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