Printing apparatus, printing method, and printing program

Abstract

The present invention provides a printing apparatus, printing method, and printing program that eliminate the need for strict control over the amount of coating material supplied by the operator, thereby reducing the burden on the operator. [Solution] This printing apparatus 100 includes a squeegee 51 for printing the coating material So on the mask M1 onto the substrate Su, a coating material splitting unit 51 for splitting the coating material So on the mask M1, and a control unit 10 that controls the splitting of the coating material So on the mask M1 by the coating material splitting unit 51.

Description

Technical Field

[0001] This invention relates to a printing apparatus, a printing method, and a printing program.

Background Art

[0002] Conventionally, a printing apparatus, a printing method, and a printing program have been known (see, for example, Patent Document 1).

[0003] The above Patent Document 1 discloses a printing apparatus. This printing apparatus includes a squeegee and a control unit. The squeegee slides on the upper surface of a screen mask to which solder is supplied while pressing a substrate against the lower surface of the screen mask. Thereby, solder is printed on the substrate through the pattern openings of the screen mask. The control unit is configured to control the printing operation by the squeegee.

Prior Art Document

Patent Document

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In printing apparatuses like the one described in Patent Document 1, although not explicitly stated in Patent Document 1, there are cases where an operator loads solder onto a screen mask and then performs the printing operation using a squeegee. In this case, the operator may increase the amount of solder loaded to reduce the frequency of solder loading and improve work efficiency. However, when the amount of solder loaded is increased, there is a risk of printing defects occurring, such as the solder overflowing from the designated printing area on the substrate due to its own weight when printing the solder onto the substrate with the squeegee. Therefore, strict control of the amount of solder loaded (supplied) by the operator is required, increasing the burden on the operator. Thus, in order to suppress the occurrence of printing defects, it is desirable to reduce the burden on the operator by eliminating the need for strict control of the amount of solder loaded (supplied) by the operator.

[0006] This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a printing apparatus, printing method, and printing program that can reduce the burden on the operator by eliminating the need for strict control of the amount of coating material supplied by the operator. [Means for solving the problem]

[0007] A printing apparatus according to the first aspect of this invention comprises a squeegee for printing a coating material on a mask onto a substrate, a coating material dividing unit for dividing the coating material on the mask, and a control unit for controlling the division of the coating material on the mask by the coating material dividing unit.

[0008] In the printing apparatus according to the first aspect of this invention, a control unit is provided that controls the division of the coating material on the mask by a coating material division unit. As a result, even if the operator increases the amount of coating material to be fed in order to reduce the frequency of feeding the coating material and improve work efficiency, the amount of coating material can be reduced by the amount divided by the coating material division unit on the mask. This makes it possible to suppress the occurrence of printing defects such as the coating material overflowing from the predetermined printing area on the substrate due to the weight of the coating material when printing the coating material on the substrate with a squeegee. As a result, the occurrence of printing defects can be suppressed without strictly controlling the amount of coating material fed (supplied) by the operator, thus reducing the burden on the operator by eliminating the need for strict control of the amount of coating material fed (supplied) by the operator.

[0009] In the substrate work system according to the first aspect described above, preferably, the system further includes a coating material scooping unit that scoops up coating material from one mask while moving in a direction along the printing direction of the squeegee, and the control unit is configured to control the transfer of the coating material from one mask to another by scooping up the divided coating material with the coating material scooping unit after it has been divided by the coating material dividing unit. With this configuration, even if the amount of coating material is too large to be scooped up by the coating material scooping unit when transferring coating material from one mask to another, the amount of coating material on the mask can be reduced by the amount divided by the coating material dividing unit, so that it can be scooped up by the coating material scooping unit. As a result, the coating material can be transferred to a new mask by the coating material scooping unit, so that errors (printing defects) in which the coating material cannot be transferred by the coating material scooping unit can be suppressed.

[0010] In this case, preferably, the control unit is configured to perform control such that, based on the amount of coating material on one mask exceeding a predetermined amount, the coating material splitting unit splits the coating material on one mask into a predetermined amount of coating material and excess coating material, and then the divided predetermined amount of coating material is scooped up by the coating material scooping unit and transferred from one mask to another mask. With this configuration, the coating material scooping unit can reliably scoop up a predetermined amount of coating material, thus reliably suppressing the occurrence of errors in which the coating material cannot be transferred by the coating material scooping unit.

[0011] In the printing apparatus according to the first aspect described above, preferably, the control unit is configured to control the printing process by having the coating material splitting unit divide the coating material on the mask into a predetermined amount of coating material and excess coating material, based on the amount of coating material on the mask exceeding a predetermined amount, and then printing the divided predetermined amount of coating material onto the substrate with a squeegee. With this configuration, even if the operator puts in a large amount of coating material, the coating material on the mask is divided by the coating material splitting unit, so that the amount of coating material has been reduced by the amount of the divided coating material and the printing work on the substrate can be performed with a squeegee. This prevents the formation of a gap between the upper surface of the substrate and the lower surface of the mask due to the weight of the coating material. Therefore, it is possible to prevent the coating material from being supplied into the formed gap and spilling out from the predetermined printing area (printing defects), and thus prevent deterioration of print quality.

[0012] In this case, preferably, the control unit is configured to continuously control the division of the coating material into a predetermined amount of coating material and excess coating material by the coating material division unit, and the printing of the divided predetermined amount of coating material onto the substrate with a squeegee. With this configuration, no other operation is performed between the division by the coating material division unit and the printing onto the substrate with the squeegee, so an increase in the time required for the printing operation can be suppressed.

[0013] In the printing apparatus according to the first aspect described above, preferably, the control unit is configured to move the coating material dividing section in the printing direction of the squeegee so as to leave the excess coating material behind, based on the amount of coating material on the mask exceeding a predetermined amount, and then press the lower end of the coating material dividing section against the upper surface of the mask to divide the coating material into a predetermined amount of coating material and excess coating material. With this configuration, the thickness of the excess coating material can be reduced by leaving the excess coating material behind with the squeegee, so that the cross-sectional area divided by the coating material dividing section when the lower end of the coating material dividing section is pressed against the upper surface of the mask can be reduced. Therefore, the amount of coating material flowing towards the excess coating material can be suppressed by the force applied when the lower end of the coating material dividing section is pressed against the upper surface of the mask, so that the amount of coating material pushed out from the excess coating material can be suppressed. As a result, excess coating material is less likely to adhere to the back of the squeegee.

[0014] In the printing apparatus according to the first aspect described above, preferably, the control unit is configured to control the scraping of excess coating material by moving the coating material dividing section a predetermined distance in the printing direction of the squeegee while positioning the lower end of the coating material dividing section at a predetermined height below the height of the coating material on the mask, based on the amount of coating material on the mask exceeding a predetermined amount. With this configuration, the excess coating material can be scraped off by adjusting the height of the lower end of the coating material dividing section and the predetermined distance the coating material dividing section moves in the printing direction, making it easy to adjust the amount of excess coating material.

[0015] In this case, preferably, the system further includes a coating material width measuring unit that measures the width of the coating material on the mask in the printing direction, and the control unit is configured to obtain the volume of the coating material based on the width of the coating material measured by the coating material width measuring unit and the length of the squeegee in the longitudinal direction, and to perform control to calculate a predetermined distance based on the difference between the target volume of the coating material (a predetermined amount) and the obtained volume of the coating material, and a predetermined height position. With this configuration, the predetermined distance is calculated according to the width of the coating material on the mask in the printing direction measured by the coating material width measuring unit, so the amount of excess coating material can be adjusted accurately.

[0016] In a printing apparatus configured such that the control unit, based on the amount of coating material on the mask exceeding a predetermined amount, moves the coating material dividing section a predetermined distance in the printing direction of the squeegee while positioning the lower end of the coating material dividing section at a predetermined height, thereby controlling the removal of excess coating material, preferably the squeegee is configured to also function as the coating material dividing section, and the control unit is configured to print on the substrate using a predetermined amount of coating material, and then, after scraping off the excess coating material with the squeegee, to mix the excess coating material with the printed coating material. With this configuration, even if excess coating material is left behind, mixing it with the printed coating material prevents the leftover excess coating material from drying out, thus suppressing a deterioration in the quality of the excess coating material.

[0017] In a printing apparatus equipped with the above-described coating material scooping unit, preferably, the coating material scooping unit includes a scraper that scoops up and holds the coating material on one mask, and the control unit is configured to control the scooping of the excess coating material by moving the coating material scooping unit in the printing direction, pressing the scraper against the excess coating material from the center to the edge of one mask, and then scooping up the excess coating material, thereby scooping up the excess coating material with a reduced width in the printing direction and holding it with the scraper. With this configuration, even if the width of the excess coating material in the printing direction exceeds the scooping distance of the scraper, the scraper can hold the excess coating material, thus suppressing the occurrence of errors caused by the width of the excess coating material in the printing direction exceeding the scooping distance of the scraper.

[0018] In this case, preferably, the coating material scooping unit further includes a sheet positioned along the surface of a scraper and a sheet drive unit that moves the sheet along the surface of the scraper. The control unit is configured to reduce the width of the excess coating material in the printing direction by moving the coating material scooping unit in the printing direction while the sheet drive unit is stopped, and pressing the scraper against the excess coating material from the center of one mask toward the edge. It is also configured to move the sheet while the sheet drive unit is moving the coating material scooping unit in the printing direction, thereby scooping up and holding the excess coating material with its reduced width in the printing direction with the scraper. With this configuration, the width of the excess coating material in the printing direction can be reduced by utilizing the movement of the coating material scooping unit and the stopping and movement of the sheet by the sheet drive unit. Unlike the case where a dedicated unit is provided to reduce the width of the excess coating material in the printing direction, this configuration can suppress an increase in the number of units in the printing device, thus suppressing the enlargement of the printing device.

[0019] In a printing apparatus configured such that the control unit controls the process of dividing the coating material on one mask into a predetermined amount of coating material and excess coating material using a coating material dividing unit based on the amount of coating material on one mask exceeding a predetermined amount, then scooping up the divided predetermined amount of coating material with a coating material scooping unit and transferring it from one mask to another mask, preferably further comprising a mask storage unit in which a used mask (as one mask) and a new mask (as the other mask) are stored, the control unit is configured to place the used mask in the mask storage unit with one of the predetermined amount of coating material and excess coating material on the mask storage unit scooped up by the coating material scooping unit, and then place the new mask in the mask storage unit from the mask storage unit to the work position, and then transfer one of the coating materials to the new mask using the coating material scooping unit, and also scoop up the other coating material on the used mask stored in the mask storage unit and transfer it to the new mask using the coating material scooping unit. Here, the other coating material on the used mask is positioned on the opposite side from the mask storage section. Therefore, when stored in the mask storage section, the other coating material on the used mask is positioned towards the work position. This shortens the distance the coating material scooping unit has to travel to reach the other coating material on the used mask after transferring one coating material to a new mask, thus enabling efficient transfer of both coating materials to the new mask by the coating material scooping unit.

[0020] A printing method according to a second aspect of this invention comprises the steps of dividing the coating material on a mask using a coating material dividing section, and printing the coating material on the mask onto a substrate using a squeegee.

[0021] In the printing method according to the second aspect of the present invention, a step of dividing the coating material on the mask by the coating material dividing section is provided. Thereby, even when the operator increases the amount of the coating material to be input in order to reduce the input frequency of the coating material and improve the work efficiency, the coating material on the mask is divided by the coating material dividing section, and the amount of the coating material can be reduced by the divided amount. As a result, when printing the coating material on the substrate with a squeegee, it is possible to suppress the occurrence of printing defects such as the coating material protruding from a predetermined printing position on the substrate due to the self-weight of the coating material. As a result, even if the amount of the coating material input (supplied) by the operator is not strictly managed, the occurrence of printing defects can be suppressed, so that it is possible to provide a printing method that can reduce the burden on the operator by eliminating the need for strict management of the amount of the coating material input (supplied) by the operator.

[0022] In the printing method according to the second aspect, preferably, a step of scooping up and transferring the coating material divided by the coating material dividing section by a coating material scooping unit that scoops up the coating material on the mask while moving in a direction along the printing direction of the squeegee is further provided. With this configuration, even when the amount of the coating material is large and cannot be scooped up by the coating material scooping unit, the amount of the coating material can be reduced by the divided amount by dividing the coating material on the mask by the coating material dividing section, so that it can be scooped up by the coating material scooping unit. As a result, since the coating material can be transferred to a new mask by the coating material scooping unit, it is possible to suppress the occurrence of an error that the coating material cannot be transferred by the coating material scooping unit.

[0023] The printing program according to the third aspect of the present invention causes a computer to perform a process of dividing the coating material on the mask by the coating material dividing section and a process of printing the coating material on the mask on the substrate with a squeegee.

[0024] In the printing program according to the third aspect of the present invention, the coating material dividing unit is caused to perform a process of dividing the coating material on the mask. As a result, even when the operator increases the amount of the coating material to be input in order to reduce the input frequency of the coating material and improve the work efficiency, the coating material on the mask can be divided by the coating material dividing unit, and the amount of the coating material can be reduced by the divided amount. Thereby, when printing the coating material on the substrate with a squeegee, it is possible to suppress the occurrence of printing defects such as the coating material protruding from a predetermined printing position on the substrate due to the weight of the coating material. As a result, even if the amount of the coating material input (supplied) by the operator is not strictly managed, the occurrence of printing defects can be suppressed. Therefore, it is possible to provide a printing program that can reduce the burden on the operator by eliminating the need for strict management of the amount of the coating material input (supplied) by the operator.

Effects of the Invention

[0025] According to the present invention, as described above, it is possible to reduce the burden on the operator by eliminating the need for strict management of the amount of the coating material input (supplied) by the operator.

Brief Description of the Drawings

[0026] [Figure 1] It is a plan view showing a printing apparatus according to an embodiment. [Figure 2] It is a plan view showing a state in which a mask is arranged at a work position in a printing apparatus according to an embodiment. [Figure 3] It is a side view showing a printing apparatus according to an embodiment. [Figure 4] It is a plan view showing a state in which solder on a mask is divided into a predetermined amount of solder and excess solder, and printing is performed using the predetermined amount of solder in a printing apparatus according to an embodiment. [Figure 5] It is a schematic view showing a reciprocating movement for forming the solder input on a mask into a solder roll by a squeegee in a printing apparatus according to an embodiment. [Figure 6]This is a schematic diagram showing the state in which solder introduced onto a mask by a squeegee is formed into a solder roll in a printing apparatus according to one embodiment. [Figure 7] This is a schematic diagram showing the state in which the width of solder is measured by the coating material width measuring unit in a printing apparatus according to one embodiment. [Figure 8] This is a schematic diagram showing a state in which excess solder is left on the edge plate of the mask by a squeegee in a printing apparatus according to one embodiment. [Figure 9] This is a schematic diagram showing a state in a printing apparatus according to one embodiment in which excess solder and a predetermined amount of solder are separated by a squeegee. [Figure 10] This is a schematic diagram showing a state in which excess solder is mixed with the solder after printing using a squeegee in a printing apparatus according to one embodiment. [Figure 11] This is a plan view showing a state in which a predetermined amount of solder has been transferred to a new mask by a coating material scooping unit in a printing apparatus according to one embodiment. [Figure 12] This is a plan view showing a state in which excess solder has been transferred to a new mask by a coating material scooping unit in a printing apparatus according to one embodiment. [Figure 13] Figure 13(A) is a schematic diagram showing a used mask with a predetermined amount of solder and excess solder placed on it. Figure 13(B) is a schematic diagram showing a used mask with a predetermined amount of solder scooped out. Figure 13(C) is a schematic diagram showing a used mask stored in the mask storage compartment. Figure 13(D) is a schematic diagram showing a new mask placed in the work position. Figure 13(E) is a schematic diagram showing a new mask with a predetermined amount of solder transferred to it. Figure 13(F) is a schematic diagram showing excess solder scooped out of a used mask. Figure 13(G) is a schematic diagram showing a new mask with excess solder transferred to it. [Figure 14] This is a schematic diagram showing the scooping distance of the scraper of the coating material scooping unit and the width of the excess solder in a printing apparatus according to one embodiment. [Figure 15]Figure 15(A) is a schematic diagram showing the state in which the first wrinkle has been formed in the excess solder by the scraper of the coating material scooping unit. Figure 15(B) is a schematic diagram showing the state in which a portion of the excess solder has been scooped up by the coating material scooping unit. Figure 15(C) is a schematic diagram showing the state in which the excess solder has been scooped up after the second wrinkle has been formed in the excess solder by the scraper of the coating material scooping unit. [Figure 16] This is a flowchart illustrating a printing method by the control unit of a printing apparatus according to one embodiment. [Figure 17] This is a schematic diagram showing a state in a printing apparatus according to a modified embodiment in which excess solder and a predetermined amount of solder are separated by a squeegee. [Modes for carrying out the invention]

[0027] The following describes embodiments of the present invention based on the drawings.

[0028] The configuration of the printing apparatus 100 according to an embodiment of the present invention will be described with reference to Figures 1 to 16.

[0029] (Configuration of the printing device) As shown in Figures 1 and 2, the printing apparatus 100 is configured to print a predetermined pattern on a substrate Su at the printing position Pr, which is composed of a plurality of openings Op1 (or openings Op2) formed on a mask M1 (or mask M2). Each of the masks M1 and M2 is formed in a rectangular shape in plan view. Masks M1 and M2 each have frames F1 and F2 attached to their outer periphery. Figure 1 is a diagram of the substrate Su before it is placed at the printing position Pr. Figure 2 is a diagram of the mask M1 after it has been placed at the printing position Pr and moved to the work position Pw where printing is performed on the substrate Su. The substrate Su is a printed circuit board on which electronic components (not shown) are mounted. Mask M1 is an example of "one mask" and "used mask" in the claims. Mask M2 is an example of "another mask" and "new mask" in the claims.

[0030] Here, the transport direction of the substrate Su is defined as the X1 direction, the opposite direction of the transport direction as the X2 direction, and the combined direction of the X1 and X2 directions as the X direction. In the horizontal direction, the direction perpendicular to the X direction is defined as the Y direction, one of the Y directions is defined as the Y1 direction, and the other Y direction is defined as the Y2 direction. The direction perpendicular to both the X and Y directions is defined as the Z direction (up and down direction), the Z1 direction is defined as the up direction, and the Z2 direction is defined as the down direction.

[0031] The printing apparatus 100 comprises a base 1, a mask clamp member 2, a printing table unit 3 (see Figure 3), a camera unit 4 (see Figure 3), a squeegee unit 5, a coating material width measuring unit 6, a mask slider 7, a coating material scooping unit 8, a mask replacement unit 9, and a control unit 10 (see Figure 3). The control unit 10 is an example of the "computer" in the claims.

[0032] <Mask clamp component> The mask clamp member 2 is configured to hold the mask M1 (or mask M2) in the working position Pw when printing solder So onto the substrate Su in a predetermined pattern using the mask M1 (or mask M2). Solder So is an example of the "coating material" in the claims.

[0033] Specifically, the mask clamp member 2 has a first mask support portion 21, a second mask support portion 22, and a plurality (four) of mask pressing portions 23. The first mask support portion 21 is configured to support the end of the mask M1 (mask M2) on the X1 direction side from below. The second mask support portion 22 is configured to support the end of the mask M1 (mask M2) on the X2 direction side from below. The plurality (four) of mask pressing portions 23 are configured to press the end of the mask M1 (mask M2) on the X1 direction side and the end of the mask M1 (mask M2) on the X2 direction side from above. As a result, the mask M1 (mask M2) is held in the working position Pw.

[0034] <Printing Table Unit> As shown in Figure 3, the printing table unit 3 is mounted on the base 1 and is configured to hold the substrate Su and to align with the mask M1 (or mask M2) placed at the work position Pw.

[0035] Specifically, the print table unit 3 includes an X-axis movement mechanism (not shown), a Y-axis movement mechanism (not shown), an R-axis movement mechanism (not shown), a Z-axis movement mechanism 31, a print table 32, a pair of conveyors 33 (see Figure 1), an edge plate 34, and a backup pin station 35 (see Figure 1).

[0036] The X-axis movement mechanism uses a servo motor or the like as a driving source to move the printing table 32 in the X direction. The Y-axis movement mechanism uses a servo motor or the like as a driving source to move the printing table 32 in the Y direction. The R-axis movement mechanism uses a servo motor or the like as a driving source to move the printing table 32 in the R direction, which is the rotational direction around the central axis extending in the Z direction. The Z-axis movement mechanism 31 uses a servo motor or the like as a driving source to move the printing table 32 in the Z direction (up and down direction).

[0037] The printing table 32 includes a table body 32a, a pair of bracket members 32b, a support plate 32c, and a support plate drive unit 32d.

[0038] The table body 32a is configured to move in the Z direction (up and down direction) by a Z-axis movement mechanism 31. A pair of bracket members 32b are provided on the table body 32a. A conveyor 33 is attached to the upper part of each of the pair of bracket members 32b. The support plate 32c is a member on which a plurality of backup pins P are arranged. The support plate drive unit 32d is configured to move the support plate 32c in the up and down direction (Z direction). The backup pins P are configured to support the substrate Su from the Z2 direction (downward direction) when the solder So is printed onto the substrate Su by the squeegee 51 described later, by moving the support plate 32c in the Z1 direction (upward direction) by the support plate drive unit 32d.

[0039] As shown in Figures 1 and 2, a pair of conveyors 33 are configured to transport the substrate Su in the X1 direction. Each of the conveyors 33 is configured to support the substrate Su from below (Z2 direction). The edge plate 34 is configured to press the substrate Su, which is supported from below (Z2 direction) by the pair of conveyors 33, from above (Z1 direction). These hold the substrate Su positioned at the printing position Pr. The backup pin station 35 is configured to hold a plurality of backup pins P.

[0040] <Camera Unit> As shown in Figure 3, the camera unit 4 includes a substrate camera 41, a mask camera 42, an X-axis movement mechanism 43, and a Y-axis movement mechanism 44. The substrate camera 41 is configured to recognize the relative position of the substrate Su supported by backup pins P with respect to the printing table 32. The mask camera 42 is configured to recognize the position of the mask M1 (or mask M2) held by a pair of conveyors 33 and edge plates 34. The X-axis movement mechanism 43 is a mechanism having a drive source for moving the substrate camera 41 and the mask camera 42 in the X direction. The Y-axis movement mechanism 44 is a mechanism having a drive source for moving the X-axis movement mechanism 43 in the Y direction.

[0041] <Squeegee Unit> As shown in Figure 3, the squeegee unit 5 is configured to move along the upper surface of the mask M1 (or mask M2) by reciprocating in the Y direction, thereby scraping the solder So supplied onto the upper surface of the mask M1 (or mask M2).

[0042] Specifically, the squeegee unit 5 includes a squeegee 51, a Y-axis drive mechanism 52, a Z-axis drive mechanism 53, and an R-axis drive mechanism 54. The squeegee 51 is a component that prints solder So on the mask M1 (or mask M2) onto the substrate Su. The squeegee 51 is a plate-shaped component that extends in the X direction. The Y-axis drive mechanism 52 is a mechanism that has a drive source such as a servo motor for moving the squeegee 51 in the printing direction (Y direction). The Z-axis drive mechanism 53 is a mechanism that has a drive source such as a servo motor for moving the squeegee 51 in the vertical direction (Z direction). The R-axis drive mechanism 54 is a mechanism that has a drive source such as a servo motor for rotating the squeegee 51 around a pivot axis that extends in the X direction. Note that the squeegee 51 is an example of the "coating material dividing section" in the claims.

[0043] As a result, the squeegee 51 is configured to print solder So supplied to the mask M1 (or mask M2) onto the substrate Su by moving downward (in the Z2 direction) by the Z-axis drive mechanism 53, thereby applying a predetermined printing pressure (load) to the mask M1 (or mask M2).

[0044] <Coating material width measurement section> As shown in Figure 3, the coating material width measuring unit 6 measures the width Ws of the solder So on the mask M1 (or mask M2) in the printing direction (Y direction). The coating material width measuring unit 6 is attached to the squeegee unit 5. The coating material width measuring unit 6 is a laser measuring device having a light-emitting unit and a light-receiving unit. The coating material width measuring unit 6 is configured to receive the laser light reflected by the light-receiving unit when laser light is irradiated from the light-emitting unit onto the upper surface of the mask M1 (or mask M2). When laser light is irradiated from the light-emitting unit onto the upper surface of the solder So, the laser light is scattered on the upper surface of the solder So, and the light-receiving unit is unable to receive the laser light. As a result, the width Ws of the solder So is measured by the coating material width measuring unit 6 based on the section where the laser light could not be received.

[0045] <Mask Slider> As shown in Figure 3, the mask slider 7 is configured to slide the mask M1 (or mask M2) in the Y direction. The mask slider 7 is composed of, for example, an air cylinder.

[0046] <Coating material scooping unit> As shown in Figure 3, the coating material scooping unit 8 is configured to scoop up solder So from the mask M1 (or mask M2) while moving in a direction along the printing direction (Y direction) of the squeegee 51.

[0047] Specifically, the coating material scooping unit 8 includes a scraper 81, a sheet 82, a sheet drive unit 83, and a Z-direction movement mechanism 84.

[0048] The scraper 81 is a plate-shaped member that scoops up and holds solder So from the mask M1 (or mask M2) from the Y1 direction. The sheet 82 is a member that holds the solder So scooped up by the scraper 81 and moves the placed solder So in the Y1 direction. The sheet 82 is positioned along the surface of the scraper 81. The sheet drive unit 83 is configured to move the sheet 82 along the surface of the scraper 81. The sheet drive unit 83 moves the sheet 82 along the surface of the scraper 81 by winding the sheet 82 toward the Y1 direction. The sheet drive unit 83 also moves the sheet 82 along the surface of the scraper 81 by feeding the sheet 82 toward the Y2 direction. The Z-direction movement mechanism 84 is configured to move the scraper 81 between a lowered position and an raised position. The Z-direction movement mechanism 84 has a drive source such as a servo motor for moving the scraper 81 in the Z direction.

[0049] The coating material scooping unit 8, with the scraper 81 in the lowered position, synchronizes its movement in the Y2 direction with the winding of the sheet 82 in the Y1 direction to scoop up and hold the solder So on the sheet 82 on the Z1 direction side of the scraper 81. The coating material scooping unit 8, with the scraper 81 in the lowered position, synchronizes its movement in the Y1 direction with the feeding of the sheet 82 in the Y2 direction to transfer the solder So on the sheet 82 onto the mask M1 (or mask M2).

[0050] The squeegee unit 5, coating material width measuring unit 6, mask slider 7, and coating material scooping unit 8 described above are configured to move integrally in the Y direction by the Y-axis drive mechanism 52.

[0051] <Mask exchange unit> As shown in Figure 3, the mask replacement unit 9 is configured to accommodate the mask M1 held by the mask clamp member 2 and the mask M2 which is replaced at a predetermined timing. Specifically, the mask replacement unit 9 includes an upper mask storage section 91, a lower mask storage section 92, a first lifting / lowering section (not shown), and a second lifting / lowering section (not shown). The predetermined timing is the timing when the type (variety) of the substrate Su is switched. Note that the upper mask storage section 91 and the lower mask storage section 92 are examples of the "mask storage section" in the claims.

[0052] The upper mask storage section 91 is configured to accommodate the mask M2. The upper mask storage section 91 supports the X1-side end and the X2-side end of the mask M2 from below (Z2-side). The lower mask storage section 92 is configured to accommodate the mask M1. The lower mask storage section 92 supports the X1-side end and the X2-side end of the mask M1 from below (Z2-side).

[0053] Each of the first and second lifting sections is configured to raise and lower the upper mask storage section 91 and the lower mask storage section 92 together. The first lifting section is located on the X1 direction side of the upper mask storage section 91 and the lower mask storage section 92. The second lifting section is located on the X2 direction side of the upper mask storage section 91 and the lower mask storage section 92. Each of the first and second lifting sections is composed of, for example, an air cylinder.

[0054] (Control Unit) As shown in Figure 3, the control unit 10 includes a CPU (Central Processing Unit) 10a and a storage unit 10b. The storage unit 10b has ROM (Read Only Memory) and RAM (Random Access Memory), etc. The storage unit 10b stores the print program Po. The control unit 10 has the function of controlling each part of the printing device 100 based on the print program Po.

[0055] (Print control) As shown in Figure 4, the control unit 10 performs printing control using the squeegee 51 based on the printing program Po. In this embodiment, the control unit 10 performs control to divide the solder So on the mask M1 (or mask M2) using the squeegee 51. In the following description, the state in which solder So is supplied onto the mask M1 will be described as an example.

[0056] Specifically, the control unit 10, based on the fact that the amount of solder So on the mask M1 exceeds a predetermined amount, uses the squeegee 51 to divide the solder So on the mask M1 into a predetermined amount of solder So1 and excess solder So2, and then controls the squeegee 51 to print the divided predetermined amount of solder So1 onto the substrate Su. The predetermined amount of solder So1 is an example of the "predetermined amount of coating material" in the claims. The excess solder So2 is an example of the "excess coating material" in the claims.

[0057] In other words, based on the amount of solder So on the mask M1 exceeding a predetermined amount, the control unit 10 controls the squeegee 51 to print a predetermined amount of solder So1 onto the substrate Su while scraping off the excess solder So2 on the edge plate 34 of the mask M1. In this way, the control unit 10 continuously controls the division of the solder So into a predetermined amount of solder So1 and excess solder So2 by the squeegee 51, and the printing of the divided predetermined amount of solder So1 onto the substrate Su by the squeegee 51.

[0058] <Control of excess solder residue> The control of excess solder residue by the control unit 10 will be explained with reference to Figures 5 to 9.

[0059] As shown in Figure 5, with a dummy substrate Dsu pressed against the lower surface of the mask M1, the control unit 10 controls the squeegee 51 to move in the Y1 direction and then in the Y2 direction after the dummy substrate Dsu has been supplied onto the edge plate 34 of the mask M1. As shown in Figure 6, during the reciprocating movement control, the control unit 10 controls the squeegee 51 to move in the Y2 direction until the Y2-side end of the solder So being moved by the squeegee 51 is positioned at the Y2-side end of the edge plate 34. This forms the supplied solder So into a roughly cylindrical solder roll. Here, the dummy substrate Dsu is a substrate used for test printing with the squeegee 51.

[0060] As shown in Figure 7, after controlling the reciprocating movement of the squeegee 51, the control unit 10 performs control to calculate the amount of solder (volume of solder So) of the substantially cylindrical solder So. The control unit 10 moves the coating material width measuring unit 6 from the end on the Y1 direction side to the end on the Y2 direction side of the edge plate 34, and also performs control to irradiate laser light from the coating material width measuring unit 6. Based on the section in which the laser light measured by the coating material width measuring unit 6 could not be received, the control unit 10 performs control to calculate the width Ws of the solder So.

[0061] As shown in Figures 7 and 8, the control unit 10 obtains the volume of solder So based on the width Ws of the solder So calculated based on the measurement results from the coating material width measuring unit 6 and the length L in the longitudinal direction (X direction) of the squeegee 51, and performs control to calculate a predetermined distance Lm based on the difference between the target volume of coating material (a predetermined amount) and the obtained volume of solder So, and a predetermined height position Hm.

[0062] Specifically, as shown in Figure 7, the control unit 10 performs control to calculate the cross-sectional area of ​​the approximately cylindrical solder So based on the calculated width Ws of the solder So. The control unit 10 performs control to calculate the cross-sectional area of ​​the approximately cylindrical solder So by multiplying the square of half the length of the width Ws of the solder So by pi. The control unit 10 performs control to calculate the volume (amount of solder) of the approximately cylindrical solder So by multiplying the cross-sectional area of ​​the approximately cylindrical solder So by the length L in the X direction of the squeegee 51.

[0063] Furthermore, the control unit 10 performs control to calculate the target cross-sectional area of ​​the approximately cylindrical solder So based on the target solder roll width. The control unit 10 performs control to calculate the target cross-sectional area of ​​the approximately cylindrical solder So by multiplying the square of half the length of the target solder roll width by pi. The control unit 10 performs control to calculate the target volume of the approximately cylindrical solder So coating material (target solder amount) by multiplying the target cross-sectional area of ​​the approximately cylindrical solder So by the length L in the X direction of the squeegee 51.

[0064] Based on these calculations, the volume of the roughly cylindrical solder So and the target volume of the coating material can be determined.

[0065] Furthermore, as shown in Figure 8, the control unit 10 performs control to calculate a predetermined distance Lm based on the difference between the target volume of coating material and the volume of acquired solder So, a predetermined height position Hm, and the length L in the X direction of the squeegee 51. Specifically, the control unit 10 performs control to calculate the predetermined distance Lm by dividing the difference between the target volume of coating material and the volume of acquired solder So by the value obtained by multiplying the predetermined height position Hm by the length L in the X direction of the squeegee 51.

[0066] Here, as an example, we will explain how to calculate a predetermined distance Lm using numerical values.

[0067] Assume that the length L in the X direction of the squeegee 51 is 250 mm, the calculated width Ws of solder So is 30 mm, the target solder roll width is 20 mm, and the predetermined height position Hm is 5 mm.

[0068] In this case, the volume (amount of solder) of the roughly cylindrical solder So is 88357 mm³. 3 The calculation is as follows: The target volume of the coating material is 39269 mm³. 3 This is the calculation. Therefore, 88357mm 3 -39269mm 3 = 49087mm 3 This is calculated as the volume of excess solder SO2. The predetermined distance Lm is 49087 mm. 3 The calculation is (250mm x 5mm) = 39mm. This means that by leaving a predetermined distance Lm of 39mm unscraped at a predetermined height position Hm of 5mm, the volume of the predetermined amount of solder So1 used for printing will be close to the target volume of the coating material.

[0069] Then, as shown in Figures 8 and 9, control is performed to leave excess solder So2 behind using the calculated predetermined distance Lm.

[0070] First, as shown in Figure 8, the control unit 10 removes the dummy substrate Dsu from the lower surface of the mask M1 and then loads the substrate Su into the mask M1, while simultaneously pressing the loaded substrate Su against the lower surface of the mask M1. Then, based on the fact that the amount of solder So on the mask M1 exceeds a predetermined amount (target volume of coating material), the control unit 10 controls the movement of the squeegee 51 by a predetermined distance Lm in the Y1 direction while positioning the lower end of the squeegee 51 at a predetermined height position Hm below the height position of the solder So on the mask M1, thereby scraping off the excess solder So2. Here, the control unit 10 adds the thickness Th of the mask M1 and the predetermined height position Hm to the upper end position Pe1 of the edge plate 34, thereby controlling the movement to position the lower end of the squeegee 51 above the upper surface of the mask M1 by the predetermined height position Hm. Furthermore, the control unit 10 adds a predetermined distance Lm to position PL1, which is the position of the Y2-side end of the edge plate 34 on the Y2-side, thereby controlling the lower end of the squeegee 51 to move in the Y1 direction by a predetermined distance Lm from the position of the Y2-side end of the edge plate 34 on the Y2-side.

[0071] Then, based on the fact that the amount of solder So on the mask M1 exceeds a predetermined amount (target volume of coating material), the control unit 10 moves the squeegee 51 in the printing direction (for example, the Y1 direction) so as to leave the excess solder So2 behind, and then presses the lower end of the squeegee 51 against the upper surface of the mask M1 to divide the solder So into a predetermined amount of solder So1 and the excess solder So2. Here, the control unit 10 controls the position of the lower end of the squeegee 51 on the upper surface of the mask M1 by adding the thickness Th of the mask M1 to the upper end position Pe1 of the edge plate 34. In this way, the squeegee 51 is configured to also serve as a coating material dividing section.

[0072] <Control of excess solder scraping> Furthermore, as shown in Figure 10, the control unit 10 prints on the substrate Su using a predetermined amount of solder So1, and then uses the squeegee 51 to scrape off the excess solder So2, thereby mixing the excess solder So2 with the printed solder So3. Here, the control unit 10 controls the squeegee 51 to move in the Y2 direction until the Y2 direction end of the solder So mixed by the squeegee 51 is positioned at the Y2 direction end of the edge plate 34 on the Y2 direction side.

[0073] In print control, the above-described control is performed until the type of substrate Su is switched.

[0074] <Control of transferring a predetermined amount of solder and excess solder> Furthermore, in print control, when switching between substrate Su types, transfer control is performed for a predetermined amount of solder So1 and excess solder So2. The transfer control of the predetermined amount of solder So1 and excess solder So2 will be explained with reference to Figures 11 to 13.

[0075] As shown in Figures 11 and 12, the control unit 10 controls the process of dividing the solder So with the squeegee 51, then scooping up the divided solder So with the coating material scooping unit 8 and transferring it from mask M1 to mask M2.

[0076] Specifically, as shown in Figure 11, the control unit 10, based on the amount of solder So on the mask M1 exceeding a predetermined amount, uses the squeegee 51 to divide the solder So on the mask M1 into a predetermined amount of solder So1 and excess solder So2. Then, it controls the application material scooping unit 8 to scoop up the divided predetermined amount of solder So1 and transfer it from mask M1 to mask M2. Furthermore, as shown in Figure 12, the control unit 10 also controls the application material scooping unit 8 to scoop up the divided excess solder So2 and transfer it from mask M1 to mask M2.

[0077] Specifically, as shown in Figures 13(A) and 13(B), the control unit 10 controls the application material scooping unit 8 to scoop up a predetermined amount of solder So1 from the mask M1 and a predetermined amount of excess solder So1 from the lower mask storage section 92. As shown in Figure 13(C), the control unit 10 controls the storage of the mask M1 in the lower mask storage section 92 with the predetermined amount of solder So1 scooped up by the application material scooping unit 8. As shown in Figure 13(D), the control unit 10 controls the lowering of the upper mask storage section 91 and the lower mask storage section 92. With the predetermined amount of solder So1 scooped up by the application material scooping unit 8, the control unit 10 controls the placement of the mask M2 at the printing position Pr.

[0078] Here, mask M1 is a used mask, while mask M2 is a new mask.

[0079] As shown in Figure 13(E), the control unit 10 controls the transfer of a predetermined amount of solder So1 to one edge plate 34 of the mask M2. As shown in Figure 13(F), the control unit 10 controls the transfer of excess solder So2 on the mask M1 to the coating material scooping unit 8. As shown in Figure 13(G), the control unit 10 controls the transfer of excess solder So2 to the other edge plate 34 of the mask M2.

[0080] In this manner, the control unit 10 controls the placement of the used mask M1 in the lower mask storage section 92 after scooping up a predetermined amount of solder So1 from the mask M1 and a predetermined amount of excess solder So2 from the lower mask storage section 92 using the coating material scooping unit 8. The control unit 10 also controls the placement of the new mask M2 in the upper mask storage section 91 to the work position Pw, and then transfers a predetermined amount of solder So1 to the mask M2 using the coating material scooping unit 8. The control unit 10 also controls the placement of the used mask M1 to the mask M2 after scooping up the excess solder So2 from the mask M1 stored in the lower mask storage section 92 using the coating material scooping unit 8.

[0081] <Convolution control of excess solder> Furthermore, in the transfer control of excess solder So2 described above, there are cases where the width Wts of the excess solder So2 in the Y direction exceeds the scooping distance Lt of the coating material scooping unit 8. In such cases, the control unit 10 performs convolution control of the excess solder So2. The convolution control of excess solder So2 will be explained with reference to Figures 14 and 15.

[0082] As shown in Figure 14, the control unit 10 performs control to determine whether the width Wts of the excess solder So2 measured by the coating material width measuring unit 6 exceeds the scooping distance Lt of the coating material scooping unit 8. If the width Wts of the excess solder So2 exceeds the scooping distance Lt, the control unit 10 performs convolution control of the excess solder So2. If the width Wts of the excess solder So2 is less than or equal to the scooping distance Lt, the control unit 10 performs control to transfer the excess solder So2. Furthermore, if the width Wts of the excess solder So2 exceeds the width of the edge plate 34 in the Y direction, the control unit 10 performs control to notify an error.

[0083] If the width Wts of the excess solder So2 exceeds the scoopable distance Lt, the control unit 10 performs control to calculate the number of times the scraper 81 is pushed in the Y direction by dividing the difference between the width Wts of the excess solder So2 and the scoopable distance Lt by twice the amount of the scraper 81 is pushed in the Y direction. Here, wrinkles are formed in the excess solder So2 by the number of times the scraper 81 is pushed in the Y direction. The amount of the push is set in advance.

[0084] Refer to Figures 15(A) to 15(C) for a detailed explanation of the convolution control of excess solder So2. In Figures 15(A) to 15(C), the number of indentations is calculated to be 2 as an example.

[0085] As shown in Figure 15(A), the control unit 10 obtains the width Wts of the excess solder So2 in the printing direction (Y direction), and then controls the Z-direction movement mechanism 84 to lower the scraper 81 to the lowered position. If the width Wts of the excess solder So2 in the printing direction (Y direction) exceeds the scooping distance Lt of the scraper 81, the control unit 10 controls the scraper 81 to press the scraper 81 against the excess solder So2 in the Y2 direction while pushing the coating material scooping unit 8 in the Y2 direction by the amount of the movement. In other words, with the sheet 82 movement by the sheet drive unit 83 stopped, the control unit 10 controls the scraper 81 to press the scraper 81 against the excess solder So2 in the Y direction by the amount of the movement while moving the coating material scooping unit 8 in the Y2 direction, thereby reducing the width Wts of the excess solder So2 in the Y direction. As a result, the Y1-direction end of the excess solder So2 is folded in the Z1 direction by the amount of the indentation, forming a wrinkle of height Hp.

[0086] As shown in Figure 15(B), after pressing the scraper 81 against the excess solder So2, the scraper 81 is pushed in and scooped up by the amount of movement of the excess solder So2, thereby reducing the width Wts of the excess solder So2 in the Y direction, and controlling the scraper 81 to scoop up a portion of the excess solder So2 including wrinkles and hold it in place. In other words, the control unit 10 moves the sheet 82 with the sheet drive unit 83 and moves the coating material scooping unit 8 in the Y2 direction by the amount of movement of the push in, thereby controlling the scraper 81 to scoop up a portion of the excess solder So2 including wrinkles, which has a reduced width Wts in the Y direction, and hold it in place.

[0087] As shown in Figure 15(C), the control unit 10 scoops up a portion of the excess solder So2 with the scraper 81 and holds it, then moves the coating material scooping unit 8 in the Y2 direction, pressing the scraper 81 into the excess solder So2 by the amount of movement, thereby controlling it to press in the Y2 direction. That is, with the sheet drive unit 83 stopping the movement of the sheet 82, the control unit 10 moves the coating material scooping unit 8 in the Y2 direction by the amount of movement, pressing the scraper 81 into the excess solder So2 in the Y2 direction, thereby reducing the width Wts of the excess solder So2 in the Y direction. As a result, a portion of the excess solder So2 is folded in the Z1 direction by the amount of movement, forming one wrinkle of height Hp. This results in the formation of two wrinkles.

[0088] As shown in Figure 15(C), after pressing the scraper 81 against the excess solder So2, the entire excess solder So2 is scooped up, thereby reducing the width Wts of the excess solder So2 in the Y direction, and the control is performed to scoop up the entire excess solder So2 and hold it in the scraper 81. In other words, the control unit 10 moves the sheet 82 with the sheet drive unit 83 and moves the coating material scooping unit 8 in the Y2 direction, thereby controlling the scraper 81 to scoop up and hold the entire excess solder So2 with a reduced width Wts in the Y direction.

[0089] As shown in Figures 15(A) to 15(C), if the width Wts of the excess solder So2 in the printing direction (Y direction) exceeds the scooping distance Lt of the scraper 81, the control unit 10 moves the coating material scooping unit 8 in the Y2 direction (printing direction), presses the scraper 81 against the excess solder So2 from the center of the mask M1 toward the edge (Y2 direction), and then scoops up the excess solder So2, thereby scooping up the excess solder So2 with a reduced width Wts in the printing direction (Y direction) and holding it in the scraper 81.

[0090] Specifically, the control unit 10 stops the sheet 82 from moving by the sheet drive unit 83, and moves the coating material scooping unit 8 in the printing direction (Y2 direction), while pressing the scraper 81 against the excess solder So2 from the center of the mask M1 toward the edge (Y2 direction), thereby controlling the width Wts of the excess solder So2 in the printing direction (Y direction). The control unit 10 moves the sheet 82 by the sheet drive unit 83, and then moves the coating material scooping unit 8 in the printing direction (Y2 direction), thereby controlling the scraper 81 to scoop up and hold the excess solder So2, whose width Wts in the printing direction (Y direction) has been reduced.

[0091] Thus, the printing program Po executed by the control unit 10 causes the control unit 10 to perform the process of dividing the solder So on the mask M1 (or mask M2) using the squeegee 51. The printing program Po executed by the control unit 10 causes the control unit 10 to perform the process of printing the solder So on the mask M1 (or mask M2) onto the substrate Su using the squeegee 51.

[0092] (Printing method) Now, with reference to Figure 16, the printing method processed in the control unit 10 will be described.

[0093] As shown in Figure 16, in step S1, it is determined whether or not there is excess solder So2 at the destination of the squeegee 51. If there is excess solder So2, the process proceeds to step S2. If there is no excess solder So2, the process proceeds to step S8, where the solder So3 is moved to the edge of the edge plate 34, the excess solder So2 is mixed with the solder So3, and then the process proceeds to step S3. In step S2, the solder So is printed onto the substrate Su. Thus, step S3 is the step in which the solder So on the mask M1 is printed onto the substrate Su using the squeegee 51.

[0094] In step S3, the printed substrate Su is moved from the mask M1 in the Z2 direction, the substrate Su is released from the conveyor 33 and edge plate 34, and then the substrate Su is discharged. In step S4, it is determined whether the last substrate Su of the type has been printed. If the last substrate Su of the type has been printed, the process proceeds to step S9; otherwise, the process proceeds to step S5. In step S5, the width Ws of the solder So is measured by the coating material width measuring unit 6. In step S6, the next substrate Su is loaded. In step S7, it is determined whether the volume of solder So calculated based on the width Ws of solder So is less than or equal to the target volume of coating material. If the volume of solder So is less than or equal to the target volume of coating material, the process returns to step S1; if the volume of solder So exceeds the target volume of coating material, the process proceeds to step S11.

[0095] In step S11, the squeegee 51 separates the solder So into excess solder So2 and a predetermined amount of solder So1, and then the process returns to step S1. Thus, step S11 is a step in which the solder So on the mask M1 is separated by the squeegee 51.

[0096] Furthermore, in step S9, a predetermined amount of solder So1 is transferred to the mask M2 corresponding to the next substrate Su type. In step S10, the excess solder So2 is transferred to the mask M2 corresponding to the next substrate Su type. Thus, steps S9 and S10 are steps in which the coating material scooping unit 8 scoops up and transfers the predetermined amount of solder So1 and the excess solder So2 that have been separated by the squeegee 51.

[0097] After step S10, the printing process is complete.

[0098] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0099] In this embodiment, as described above, the printing apparatus 100 includes a control unit 10 that controls the division of solder So on the mask M1 (or mask M2) by the squeegee 51. As a result, even if the operator increases the amount of solder to be fed in order to reduce the frequency of solder feeding and improve work efficiency, the amount of solder can be reduced by dividing the solder So on the mask M1 (or mask M2) by the squeegee 51. This makes it possible to suppress the occurrence of printing defects, such as solder So overflowing from the predetermined printing area on the substrate Su due to the weight of the solder So when printing solder So on the substrate Su with the squeegee 51. As a result, the occurrence of printing defects can be suppressed without strictly controlling the amount of solder fed (supplied) by the operator, thus reducing the burden on the operator by eliminating the need for strict control of the amount of solder fed (supplied) by the operator.

[0100] Furthermore, in this embodiment, as described above, the printing apparatus 100 is equipped with a coating material scooping unit 8 that scoops up solder So on the mask M1 while moving in a direction along the printing direction (Y direction) of the squeegee 51. The control unit 10 controls the process to scoop up the divided solder So with the coating material scooping unit 8 after it has been divided by the squeegee 51 and transfer it from mask M1 to mask M2. As a result, even if the amount of solder So is large and cannot be scooped up by the coating material scooping unit 8 when transferring solder So from mask M1 to mask M2, the amount of solder can be reduced by the amount divided by the squeegee 51, so that it can be scooped up by the coating material scooping unit 8. As a result, the coating material scooping unit 8 can transfer the solder So to the mask M2, thus suppressing the occurrence of errors (printing defects) in which the coating material scooping unit 8 is unable to transfer the solder So.

[0101] Furthermore, in this embodiment, as described above, the control unit 10, based on the fact that the amount of solder So on the mask M1 exceeds a predetermined amount, uses the squeegee 51 to divide the solder So on the mask M1 into a predetermined amount of solder So1 and excess solder So2. Then, it controls the application material scooping unit 8 to scoop up the divided predetermined amount of solder So1 and transfer it from mask M1 to mask M2. As a result, the application material scooping unit 8 can reliably scoop up any predetermined amount of solder So1, thus reliably suppressing the occurrence of errors in which the application material scooping unit 8 is unable to transfer the solder So.

[0102] Furthermore, in this embodiment, as described above, the control unit 10, based on the amount of solder So on the mask M1 (or mask M2) exceeding a predetermined amount, uses the squeegee 51 to divide the solder So on the mask M1 (or mask M2) into a predetermined amount of solder So1 and excess solder So2, and then controls the squeegee 51 to print the divided predetermined amount of solder So1 onto the substrate Su. As a result, even if the operator puts in a large amount of solder, the squeegee 51 divides the solder So on the mask M1 (or mask M2), allowing the squeegee 51 to perform the printing work on the substrate Su with a reduced amount of solder So1. This prevents the formation of a gap between the upper surface of the substrate Su and the lower surface of the mask M1 (or mask M2) due to the weight of the solder So. Therefore, it is possible to prevent solder So from being supplied into the formed gap and overflowing from the predetermined printing area (printing defects), thus preventing deterioration of printing quality.

[0103] Furthermore, in this embodiment, as described above, the control unit 10 controls the continuous division of solder So into a predetermined amount of solder So1 and excess solder So2 using the squeegee 51, and the printing of the divided predetermined amount of solder So1 onto the substrate Su using the squeegee 51. As a result, no other work is performed between the division by the squeegee 51 and the printing onto the substrate Su using the squeegee 51, thus suppressing an increase in the time required for the printing work.

[0104] Furthermore, in this embodiment, as described above, the control unit 10, based on the fact that the amount of solder So on the mask M1 (or mask M2) exceeds a predetermined amount, moves the squeegee 51 in the printing direction (Y direction) of the squeegee 51 so as to leave behind the excess solder So2, and then presses the lower end of the squeegee 51 against the upper surface of the mask M1 (or mask M2) to divide the solder So into a predetermined amount of solder So1 and excess solder So2. As a result, by leaving behind excess solder So2 with the squeegee 51, the thickness of the excess solder So2 can be reduced, and the cross-sectional area divided by the squeegee 51 when the lower end of the squeegee 51 is pressed against the upper surface of the mask M1 (or mask M2) can be reduced. Therefore, the amount of solder So flowing toward the excess solder So2 can be suppressed by the force applied when the lower end of the squeegee 51 is pressed against the upper surface of the mask M1, and thus the amount of solder So pushed out from the excess solder So2 can be suppressed. As a result, excess solder SO2 is less likely to adhere to the back of the squeegee 51.

[0105] Furthermore, in this embodiment, as described above, the control unit 10, based on the amount of solder So on the mask M1 (or mask M2) exceeding a predetermined amount, controls the squeegee 51 to leave excess solder So2 behind by moving the squeegee 51 a predetermined distance Lm in the printing direction (Y direction) of the squeegee 51 while positioning the lower end of the squeegee 51 at a predetermined height position Hm below the height position of the solder So on the mask M1 (or mask M2). By adjusting the height position of the lower end of the squeegee 51 and the predetermined distance Lm that the squeegee 51 moves in the printing direction (Y direction), the excess solder So2 can be left behind, making it easy to adjust the amount of excess solder So2.

[0106] Furthermore, in this embodiment, as described above, the control unit 10 acquires the volume of solder So based on the width Ws of the solder So measured by the coating material width measuring unit 6 and the length L in the longitudinal direction (X direction) of the squeegee 51, and performs control to calculate a predetermined distance Lm based on the difference between the target solder volume (a predetermined amount) and the acquired volume of solder So, and a predetermined height position Hm. As a result, the predetermined distance Lm is calculated according to the width Ws of the solder So in the printing direction (Y direction) on the mask M1 (or mask M2) measured by the coating material width measuring unit 6, so that the amount of excess solder So2 can be adjusted with high accuracy.

[0107] Furthermore, in this embodiment, as described above, the squeegee 51 is configured to also serve as a coating material dividing section. The control unit 10 prints on the substrate Su using a predetermined amount of solder So1, and then uses the squeegee 51 to scrape off the excess solder So2, thereby controlling the mixing of the excess solder So2 with the solder So after printing. As a result, even if some excess solder So2 is left behind, mixing it with the solder So after printing prevents the remaining excess solder So2 from drying out, thus suppressing a deterioration in the quality of the excess solder So2.

[0108] Furthermore, in this embodiment, as described above, the coating material scooping unit 8 includes a scraper 81 that scoops up and holds the solder So on the mask M1. When the width Wts of the excess solder So2 in the printing direction (Y direction) exceeds the scooping distance Lt of the scraper 81, the control unit 10 moves the coating material scooping unit 8 in the printing direction (Y direction), presses the scraper 81 against the excess solder So2 from the center of the mask M1 toward the edge (Y2 direction), and then scoops up the excess solder So2, thereby scooping up the excess solder So2 with a reduced width Wts in the printing direction (Y direction) and holding it in the scraper 81. As a result, even if the width Wts of the excess solder So2 in the printing direction (Y direction) exceeds the scooping distance Lt of the scraper 81, the scraper 81 can retain the excess solder So2, thereby suppressing the occurrence of errors caused by the width Wts of the excess solder So2 in the printing direction (Y direction) exceeding the scooping distance Lt of the scraper 81.

[0109] Furthermore, in this embodiment, as described above, the coating material scooping unit 8 includes a sheet 82 positioned along the surface of the scraper 81 and a sheet drive unit 83 that moves the sheet 82 along the surface of the scraper 81. The control unit 10 controls the movement of the sheet 82 by the sheet drive unit 83 to reduce the width Wts of the excess solder So2 in the printing direction (Y direction) by moving the coating material scooping unit 8 in the printing direction (Y direction) and pressing the scraper 81 against the excess solder So2 from the center of the mask M1 toward the edge. The control unit 10 controls the movement of the sheet 82 by the sheet drive unit 83 to reduce the width Wts of the excess solder So2 in the printing direction (Y direction) by moving the coating material scooping unit 8 in the printing direction (Y direction) and by moving the coating material scooping unit 8 in the printing direction (Y direction) to scoop up and hold the excess solder So2 with reduced width Wts in the printing direction (Y direction) with the scraper 81. This allows for reducing the width Wts of excess solder So2 in the printing direction (Y direction) by utilizing the movement of the coating material scooping unit 8 and the stopping and moving of the sheet 82 by the sheet drive unit 83. Unlike the case where a dedicated unit is provided to reduce the width Wts of excess solder So2 in the printing direction (Y direction), this suppresses an increase in the number of units in the printing device 100, thus preventing the printing device 100 from becoming larger.

[0110] Furthermore, in this embodiment, as described above, the printing apparatus 100 includes a lower mask storage section 92 in which a used mask M1 is stored, and an upper mask storage section 91 in which a new mask M2 is stored. The control unit 10 scoops up a predetermined amount of solder So1 from the lower mask storage section 92 side of the excess solder So2 on the mask M1 using the coating material scooping unit 8, places the mask M1 in the lower mask storage section 92, and places the mask M2 from the upper mask storage section 91 to the working position Pw. Then, the control unit 10 transfers a predetermined amount of solder So1 to the mask M2 using the coating material scooping unit 8, and also scoops up excess solder So2 from the mask M1 stored in the lower mask storage section 92 using the coating material scooping unit 8 and transfers it to the mask M2. Here, the excess solder So2 on the mask M1 is located on the side opposite to the upper mask storage section 91. Therefore, when stored in the upper mask storage section 91, the excess solder So2 on the mask M1 is located on the working position Pw side. This shortens the distance the coating material scooping unit 8 has to travel to reach the excess solder So2 on the mask M1 after transferring a predetermined amount of solder So1 to the mask M2. Thus, the transfer of a predetermined amount of solder So1 and excess solder So2 to the mask M2 by the coating material scooping unit 8 can be performed efficiently.

[0111] [Differentiation] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than by the description of the embodiments above, and further includes all modifications (exceptions) within the meaning and scope equivalent to the claims.

[0112] For example, in the above embodiment, a squeegee 51 was shown as an example of the "coating material dividing section" in the claims, but the present invention is not limited thereto. In the present invention, the "coating material dividing section" in the claims may be a squeegee used for dividing, separate from the squeegee used for printing.

[0113] Furthermore, in the above embodiment, the control unit 10 controls the process of dividing the solder So1 and excess solder So2 using the coating material scooping unit 8 after dividing it with the squeegee 51 (coating material dividing unit), and transferring them from mask M1 (one mask) to mask M2 (the other mask). However, the present invention is not limited to this. In the present invention, the control unit may control the process of scooping up the coating material with the coating material scooping unit and transferring it from one mask to the other mask without dividing it with the coating material dividing unit.

[0114] Furthermore, in the above embodiment, the control unit 10, based on the amount of solder So (coating material) on mask M1 (one mask) exceeding a predetermined amount, divides the solder So (coating material) on mask M1 (one mask) into a predetermined amount of solder So1 (coating material) and excess solder So2 (coating material) using the squeegee 51 (coating material dividing unit), and then controls the division of the predetermined amount of solder So1 (coating material) to be scooped up by the coating material scooping unit 8 and transferred from mask M1 (one mask) to mask M2 (the other mask). However, the present invention is not limited to this. In the present invention, the control unit may, regardless of whether the amount of coating material on one mask exceeds a predetermined amount or not, divide the coating material on one mask using the coating material dividing unit, and then control the division of the coating material to be scooped up by the coating material scooping unit and transferred from one mask to the other mask.

[0115] Furthermore, in the above embodiment, the control unit 10 controls the process by using the squeegee 51 (coating material splitting unit) to split the solder So (coating material) on the mask M1 into a predetermined amount of solder So1 (coating material) and excess solder So2 (coating material) based on whether the amount of solder So (coating material) on the mask M1 exceeds a predetermined amount, and then printing the divided predetermined amount of solder So1 (coating material) onto the substrate Su using the squeegee 51. However, the present invention is not limited to this. In the present invention, the control unit may, regardless of whether the amount of coating material on the mask exceeds a predetermined amount, use the coating material splitting unit to split the coating material on the mask, and then print the divided coating material onto the substrate using the squeegee.

[0116] Furthermore, in the above embodiment, the control unit 10 is shown to continuously control the division of the coating material into a predetermined amount of solder So1 (coating material) and excess solder So2 (coating material) using the squeegee 51 (coating material dividing unit), and the printing of the divided predetermined amount of solder So1 (coating material) onto the substrate Su using the squeegee 51. However, the present invention is not limited to this. In the present invention, after the coating material is divided into a predetermined amount of coating material and excess coating material using the coating material dividing unit, the control unit may measure the predetermined amount of coating material and, based on the measurement results confirming that it has been divided into predetermined amounts, print the predetermined amount of coating material onto the substrate using the squeegee.

[0117] Furthermore, in the above embodiment, the control unit 10 controls the process by moving the squeegee 51 (coating material splitting section) in the printing direction of the squeegee 51 so as to leave behind excess solder So2 (coating material) based on the amount of solder So (coating material) on the mask M1 exceeding a predetermined amount, and then pressing the lower end of the squeegee 51 (coating material splitting section) against the upper surface of the mask M1 to split the solder So (coating material) into a predetermined amount of solder So1 (coating material) and excess solder So2 (coating material). However, the present invention is not limited to this. In the present invention, as shown in the modified example in Figure 17, the control unit 10 may control the process by pressing the lower end of the squeegee 51 against the upper surface of the mask M1 without leaving behind excess solder So2, based on the amount of solder So on the mask M1 exceeding a predetermined amount, thereby splitting the solder So into a predetermined amount of solder So1 and excess solder So2.

[0118] Furthermore, in the above embodiment, the control unit 10, based on the amount of solder So (coating material) on the mask M1 exceeding a predetermined amount, positioned the lower end of the squeegee 51 (coating material dividing section) at a predetermined height Hm below the height position of the solder So (coating material) on the mask M1, and moved the squeegee 51 (coating material dividing section) a predetermined distance Lm in the printing direction of the squeegee 51 to scrape off the excess solder So2 (coating material). However, the present invention is not limited to this. In the present invention, the control unit may, based on the amount of coating material on the mask exceeding a predetermined amount, move the coating material dividing section a predetermined distance in the printing direction of the squeegee without scraping off the excess coating material, and then press the lower end of the coating material dividing section against the upper surface of the mask to leave the excess coating material.

[0119] Furthermore, although the above embodiment shows the coating material width measuring unit 6 as a laser measuring device having a light-emitting unit and a light-receiving unit, the present invention is not limited to this. In the present invention, the coating material width measuring unit may be a camera that captures an image of the solder.

[0120] Furthermore, in the above embodiment, the control unit 10 controls the system to scoop up excess solder So2 (coating material) in a reduced width Wts in the printing direction when the width Wts of the excess solder So2 (coating material) exceeds the scooping distance Lt of the scraper 81, by moving the coating material scooping unit 8 in the printing direction, pressing the scraper 81 against the excess solder So2 (coating material) from the center of the mask M1 (one mask) toward the edge, and then scooping up the excess solder So2 (coating material) so that the width Wts of the excess solder So2 (coating material) in the printing direction is reduced and the scraper 81 holds it. However, the present invention is not limited to this. In the present invention, the control unit may use a dedicated scraper provided separately from the scraper of the coating material scooping unit to reduce the width of the excess coating material in the printing direction.

[0121] Furthermore, in the above embodiment, the control unit 10 scoops up a predetermined amount of solder So1 (coating material) from the lower mask storage section 92 side of the solder So1 (coating material) and excess solder So2 (coating material) on the mask M1 (used mask) using the coating material scooping unit 8, places the mask M1 (used mask) in the lower mask storage section 92, and places the mask M2 (new mask) from the upper mask storage section 91 to the work position Pw. Then, the coating material scooping unit 8 transfers a predetermined amount of solder So1 (one of the coating materials) to the mask M2 (new mask), and the coating material scooping unit 8 scoops up the excess solder So2 (the other coating material) on the mask M1 (used mask) stored in the lower mask storage section 92 and transfers it to the mask M2 (new mask). However, the present invention is not limited to this. In the present invention, the control unit may perform control to place the used mask into the mask storage section after scooping up a predetermined amount of coating material and the excess coating material on the side opposite to the mask storage section using a coating material scooping unit.

[0122] Furthermore, in the above embodiment, an example was shown in which the control unit 10 controls the division of solder So into a predetermined amount of solder So1 and excess solder So2, but the present invention is not limited to this. In the present invention, the control unit may control the division into a predetermined amount of solder, a first excess of solder, and a second excess of solder.

[0123] Furthermore, although the above embodiment shows an example in which the printing apparatus 100 includes a coating material scooping unit 8 and a mask replacement unit 9, the present invention is not limited to this. In the present invention, the printing apparatus does not need to include a coating material scooping unit and a mask replacement unit. In this case, the control unit, based on the fact that the amount of coating material on the mask exceeds a predetermined amount, divides the coating material on the mask into a predetermined amount of coating material and excess coating material using a coating material dividing unit, and then only controls printing the divided predetermined amount of coating material onto the substrate Su with a squeegee.

[0124] Furthermore, in the above embodiment, for the sake of explanation, an example was shown in which the control processing of the control unit 10 was explained using a flow-driven flowchart that processes sequentially according to the processing flow, but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing that executes processing on an event-by-event basis. In this case, it may be performed as a completely event-driven system, or a combination of event-driven and flow-driven systems may be used. [Explanation of Symbols]

[0125] 6. Coating material width measurement section 8. Coating material scooping unit 10 Control Unit 51 Squeegee 81 Scraper 82 seats 83 Seat drive unit 91 Upper mask storage compartment (mask storage compartment) 92 Lower mask storage compartment (mask storage compartment) 100 Printing equipment Hm (height) predetermined height position Lm specified distance Lt scooping distance M1 Mask (First Mask, Used Mask) M2 Mask (Other Masks, New Masks) Po Printing Program Pw Working position So solder (coating material) SO1 solder (a specified amount of coating material) SO2 solder (excess coating material) Su substrate Ws: Solder width (width of coating material) Wts: Width of excess solder in the printing direction (width of excess coating material in the printing direction)

Claims

1. A squeegee for printing the coating material on the mask onto the substrate, A coating material dividing section for dividing the coating material on the mask, A printing apparatus comprising a control unit that controls the division of the coating material on the mask by the coating material dividing unit.

2. The system further comprises a coating material scooping unit that scoops up the coating material from one of the masks while moving in a direction along the printing direction of the squeegee, The printing apparatus according to claim 1, wherein the control unit is configured to perform control to transfer the divided coating material from one mask to another by scooping up the divided coating material with the coating material scooping unit after it has been divided by the coating material dividing unit.

3. The printing apparatus according to claim 2, wherein the control unit is configured to control the process by which, based on the amount of coating material on one of the masks exceeding a predetermined amount, the coating material dividing unit divides the coating material on one of the masks into a predetermined amount of coating material and excess coating material, and then the divided predetermined amount of coating material is scooped up by the coating material scooping unit and transferred from one of the masks to the other mask.

4. The printing apparatus according to claim 1, wherein the control unit is configured to control the printing apparatus to print the divided predetermined amount of coating material onto the substrate using the squeegee, based on the amount of coating material on the mask exceeding a predetermined amount, by using the coating material dividing unit to divide the coating material on the mask into a predetermined amount of coating material and excess coating material.

5. The printing apparatus according to claim 4, wherein the control unit is configured to control the continuous division of the coating material into a predetermined amount of coating material and excess coating material by the coating material dividing unit, and the printing of the divided predetermined amount of coating material onto the substrate by the squeegee.

6. The printing apparatus according to claim 1, wherein the control unit is configured to perform control such that, based on the amount of coating material on the mask exceeds a predetermined amount, it moves the coating material dividing section in the printing direction of the squeegee so as to leave the excess coating material behind, and then presses the lower end of the coating material dividing section against the upper surface of the mask to divide the coating material into a predetermined amount of coating material and the excess coating material.

7. The printing apparatus according to claim 1, wherein the control unit is configured to perform control to leave excess coating material behind by moving the coating material dividing portion a predetermined distance in the printing direction of the squeegee while positioning the lower end of the coating material dividing portion at a predetermined height below the height position of the coating material on the mask, based on the amount of coating material on the mask exceeding a predetermined amount.

8. The mask further comprises a coating material width measuring unit for measuring the width of the coating material in the printing direction, The printing apparatus according to claim 7, wherein the control unit is configured to obtain the volume of the coating material based on the width of the coating material and the length in the longitudinal direction of the squeegee, based on the measurement result of the coating material width measuring unit, and to perform control to calculate the predetermined distance based on the difference between the target volume of the coating material as a predetermined amount and the obtained volume of the coating material, and the predetermined height position.

9. The squeegee is configured to also serve as the coating material dividing section, The printing apparatus according to claim 7, wherein the control unit is configured to perform control to mix the excess coating material into the printed coating material by scraping off the excess coating material with the squeegee after printing on the substrate using the predetermined amount of coating material.

10. The coating material scooping unit includes a scraper for scooping up and holding the coating material on one of the masks. The printing apparatus according to claim 2, wherein the control unit is configured to control the scooping of excess coating material in the printing direction if the width of the excess coating material exceeds the scooping distance of the scraper, by moving the coating material scooping unit in the printing direction, pressing the scraper against the excess coating material from the center of one mask toward the edge, and then scooping up the excess coating material, thereby scooping up the excess coating material in a state in which the width of the excess coating material in the printing direction is reduced and holding it in the scraper.

11. The aforementioned coating material scooping unit is A sheet arranged along the surface of the scraper, The present invention further includes a sheet drive unit that moves the sheet along the surface of the scraper, The printing apparatus according to claim 10, wherein the control unit is configured to reduce the width of the excess coating material in the printing direction by moving the coating material scooping unit in the printing direction while the sheet drive unit is stopped, and pressing the scraper against the excess coating material from the center of one mask toward the edge, and to scoop up and hold the excess coating material with a reduced width in the printing direction with the scraper by moving the coating material scooping unit in the printing direction while the sheet drive unit is moving the sheet.

12. The system further comprises a mask storage section in which a used mask (one of the aforementioned masks) and a new mask (the other of the aforementioned masks) are stored. The printing apparatus according to claim 3, wherein the control unit is configured to scoop up one of the coating materials on the mask storage side of the predetermined amount of coating material and the excess coating material on the used mask using the coating material scooping unit, place the used mask in the mask storage unit, and after placing the new mask from the mask storage unit to the work position, transfer one of the coating materials to the new mask using the coating material scooping unit, and scoop up the other of the coating material on the used mask stored in the mask storage unit and transfer it to the new mask using the coating material scooping unit.

13. A step of dividing the coating material on the mask using the coating material dividing section, A printing method comprising the step of printing the coating material on the mask onto a substrate using a squeegee.

14. The printing method according to claim 13, further comprising the step of scooping up the coating material divided by the coating material dividing section with a coating material scooping unit that scoops up the coating material on the mask while moving in a direction along the printing direction of the squeegee.

15. A process of dividing the coating material on the mask by the coating material division section, A process of printing the coating material on the mask onto the substrate using a squeegee, A printing program that has a computer perform the printing task.

Images