Camera module and method for manufacturing a camera module
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- JVC KENWOOD CORP
- Filing Date
- 2025-01-22
- Publication Date
- 2026-08-03
AI Technical Summary
【0008】 本発明は、品質を確保することができる。
Smart Images

Figure 2026125349000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a camera module and a method for manufacturing the camera module.
Background Art
[0002] >For example, Patent Document 1 discloses an imaging device module. This imaging device module includes an image sensor substrate, an image sensor mounted on the image sensor substrate, a cylindrical lens holding member that is fixed to the image sensor substrate and holds a lens that condenses light onto the image sensor, and a molded resin that surrounds from the side surface of the lens holding member to the image sensor substrate.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] In a configuration such as that of Patent Document 1, the lens holding member is adhered to the surface of the substrate with an adhesive in a state where focus adjustment is performed with the image sensor on the substrate, and is surrounded by a molded resin including the adhered portion. In such a configuration, when the molded resin is molded, the adhesive at the adhered portion expands due to heat. Then, due to the expansion pressure of the adhesive, for example, if the lens holding member is deformed, the lens position may fluctuate and the focus position may shift. As a result, the quality of the camera module deteriorates.
[0005] An object of the present invention is to provide a camera module and a method for manufacturing the camera module that can ensure quality.
Means for Solving the Problems
[0006] To achieve the above objective, a camera module according to one aspect of the present invention includes a lens portion for holding a lens, a substrate on which an image sensor is mounted, an adhesive applied to the substrate and the end of the lens portion so as to bond the substrate and the end of the lens portion to each other, an outer resin that is insert-molded to cover the lens portion and the substrate, and a recess that appears on the outside of the outer resin in a manner that covers the adhesive.
[0007] To achieve the above objective, a method for manufacturing a camera module according to one aspect of the present invention includes a lens portion for holding a lens, a substrate on which an image sensor is mounted, an adhesive applied to the substrate and the end of the lens portion so as to bond the substrate and the end of the lens portion to each other, an exterior resin that is insert-molded to cover the lens portion and the substrate, and a recess that appears on the outside of the exterior resin in a position to cover the adhesive, the method for manufacturing a camera module comprising the steps of assembling the lens portion and the substrate as a camera unit, placing the camera unit in an insert mold having a wall portion for forming the recess, and filling the space between the wall portion and the adhesive with insert resin. [Effects of the Invention]
[0008] This invention can ensure quality. [Brief explanation of the drawing]
[0009] [Figure 1] Figure 1 is a forward-view perspective view of the camera module according to the first embodiment. [Figure 2] Figure 2 is a rear-view perspective view of the camera module according to the first embodiment. [Figure 3] Figure 3 is a plan view of the camera module according to the first embodiment. [Figure 4] Figure 4 is a cross-sectional view of AA in Figure 3. [Figure 5] Figure 5 is a cross-sectional perspective view of BB in Figure 3. [Figure 6]Figure 6 is a front view perspective of the camera unit of the camera module according to the first embodiment. [Figure 7] Figure 7 is a rear-view perspective view of the camera unit of the camera module according to the first embodiment. [Figure 8] Figure 8 is a plan view of the camera unit of the camera module according to the first embodiment. [Figure 9] Figure 9 is a front view perspective of the frame portion of the camera module according to the first embodiment. [Figure 10] Figure 10 is a process diagram of the manufacturing method of the camera module according to the first embodiment. [Figure 11] Figure 11 is a plan view of the lower mold of the insert mold for the camera module manufacturing method according to the first embodiment. [Figure 12] Figure 12 is a bottom view of the upper mold of the insert mold for the camera module manufacturing method according to the first embodiment. [Figure 13] Figure 13 is a process diagram of the manufacturing method of the camera module according to the first embodiment. [Figure 14] Figure 14 is a process diagram of the manufacturing method of the camera module according to the first embodiment. [Figure 15] Figure 15 is a flowchart illustrating the manufacturing method of the camera module according to the first embodiment. [Figure 16] Figure 16 is a perspective view of an example of the installation configuration of the camera module according to the embodiment. [Figure 17] Figure 17 is a cross-sectional view of the camera module according to the second embodiment (corresponding to the AA cross-sectional position in Figure 3). [Figure 18] Figure 18 is a front view perspective of the camera unit of the camera module shown in Figure 17. [Figure 19] Figure 19 is a plan view of the camera unit of the camera module shown in Figure 17. [Figure 20] Figure 20 is a process diagram of the manufacturing method for the camera module shown in Figure 17. [Figure 21]FIG. 21 is a flowchart of a method for manufacturing the camera module shown in FIG. 17.
Embodiments of the Invention
[0010] Hereinafter, embodiments for implementing the invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings. Note that the present invention is not limited by the following embodiments. In addition, the constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, substantially identical ones, and those within the so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be combined as appropriate.
[0011] [First Embodiment] FIGS. 1 to 5 show the camera module according to the present embodiment. FIGS. 6 to 8 show the camera unit of the camera module according to the present embodiment.
[0012] In the following description, each direction is defined based on the optical axis O of the camera module 1. Specifically, the direction along (parallel to) the optical axis O is defined as the front-rear direction X, the direction in which the lens 11A faces is "front", and the opposite direction of the front is "rear". Also, the direction horizontally orthogonal to the front-rear direction X is defined as the width direction Y. Further, the direction orthogonal to the front-rear direction X and the width direction Y is defined as the up-down direction Z, the direction facing upward is "upward", and the direction facing downward is "downward". The front-rear direction X, the width direction Y, and the up-down direction Z are orthogonal in three dimensions.
[0013] The camera module 1 of the embodiment is fixed, for example, inside and outside a vehicle that is an attachment target. The camera module 1 includes a camera unit 10, a frame portion 20, and an exterior resin 30.
[0014] As shown in FIGS. 4 and 6 to 8, the camera unit 10 includes a lens unit 11, an imaging substrate (substrate) 12, and an optical axis reference portion 13.
[0015] The lens portion 11 holds the lens 11A. As shown in Figure 4, the lens portion 11 includes the lens 11A, the lens regulating portion 11B, and the lens holding portion 11C. The lens 11A has an optical axis O extending parallel to the front-rear direction X from the center of its disc shape. The lens regulating portion 11B defines the optical axis O of the lens 11A. The lens regulating portion 11B is formed in a cylindrical shape so that the optical axis O passes through its interior, and its front surface abuts against the rear surface of the lens 11A, thereby defining the optical axis O of the lens 11A. The lens holding portion 11C holds the lens 11A together with the lens regulating portion 11B. The lens holding portion 11C is formed in a ring shape so that the optical axis O passes through its interior, and functions to press the rear surface of the lens 11A against the front surface of the lens regulating portion 11B by engaging the female thread 11Ca on its inner circumferential surface with the male thread 11Ba on the outer circumferential surface of the lens regulating portion 11B and tightening them together.
[0016] The imaging substrate 12 is formed in the shape of a rectangular plate with thickness in the front-to-back direction X and planes facing in each direction in the up-and-down direction Z and each direction in the width direction Y. An image sensor 12A, which is an electronic component, is mounted on the front surface of the imaging substrate 12. The image sensor 12A has a center that coincides with the optical axis O of the lens portion 11. In addition, a connection terminal 12B is fixed to the rear surface of the imaging substrate 12. Although not explicitly shown in the figure, other electronic components that constitute the circuit are mounted on the front and rear surfaces of the imaging substrate 12.
[0017] The optical axis reference unit 13 is included in the configuration of the lens unit 11. The optical axis reference unit 13 is fixed to the lens unit 11 and the imaging substrate 12, and aligns the optical axis O of the lens 11A with the center of the image sensor 12A. The optical axis reference unit 13 includes a positioning unit 13A and a fixing unit 13B.
[0018] The fixing part 13B is formed in a cylindrical shape to fix the lens part 11 inside. The fixing part 13B defines the position of the lens part 11 in two dimensions, in the width direction Y and the vertical direction Z, relative to itself by engaging the female thread 13Ba on its inner circumference with the male thread 11Bb on the outer circumference of the lens defining part 11B of the lens part 11. Furthermore, the fixing part 13B defines the position of the lens part 11 in the front-to-back direction X relative to itself by adjusting the tightness of the engagement between the female thread 13Ba and the male thread 11Bb.
[0019] The fixing portion 13B is fixed to the imaging substrate 12 by adhesive 13C at the end opposite to the lens 11A of the fixed lens portion 11 in the front-rear direction X. When fixing the fixing portion 13B to the imaging substrate 12, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. For this reason, the optical axis reference portion 13 has a positioning portion 13A.
[0020] Multiple positioning sections 13A are provided on the outer circumference of the fixed section 13B (four locations in the embodiment). The positioning sections 13A are provided around the optical axis O of the lens 11A of the fixed lens section 11. The positioning sections 13A are provided at a total of four equal intervals (two locations in the embodiment) in the width direction Y and the vertical direction Z, which are perpendicular to the optical axis O (front-to-back direction X) of the lens 11A, with the optical axis O of the lens 11A as the center. Therefore, all positioning sections 13A coincide in the front-to-back direction X with respect to the optical axis O. In the vertical direction Z, the two upper positioning sections 13A that are aligned in the width direction Y are formed as recesses that open upwards. Also, in the vertical direction Z, the two lower positioning sections 13A that are aligned in the width direction Y are formed as recesses that open downwards.
[0021] The optical axis reference unit 13 is installed on a focus adjustment jig (not shown) with the lens unit 11 fixed to the fixing unit 13B, so that the projection of the focus adjustment jig fits into the positioning unit 13A. Thus, the optical axis reference unit 13 is installed on the focus adjustment jig so that the optical axis O of the lens 11A of the lens unit 11 is aligned with the focus adjustment chart (not shown) of the focus adjustment jig. The optical axis O of the lens 11A can be adjusted to match the focus adjustment chart by adjusting the tightness of the engagement between the female screw 13Ba of the fixing unit 13B and the male screw 11Bb of the lens reference unit 11B. In addition, with the optical axis reference unit 13 installed on the focus adjustment jig, the center of the image sensor 12A is aligned with the focus adjustment chart, and the image substrate 12 is fixed with adhesive 13C. In this way, the optical axis reference unit 13 is fixed to the lens unit 11 and the image substrate 12, so that the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. As stated above, the front-to-back X direction adjustment of the lens 11A can be adjusted to match the focus adjustment chart by adjusting the tightness of the engagement between the female screw 13Ba of the fixing part 13B and the male screw 11Bb of the lens reference part 11B. However, adjustment may also be made by using adhesive to suspend and fix the image substrate 12 and the optical axis reference part 13 without using screws.
[0022] In this embodiment, the fixing portion 13B of the optical axis reference portion 13 is positioned as the end of the lens portion 11, fixing the lens portion 11, and this end is fixed to the front surface of the imaging substrate 12 by adhesive 13C. The rear end of the fixing portion 13B, which is the end of the lens portion 11, is formed in a substantially rectangular shape when viewed in the front-to-back direction X. The imaging substrate 12 is also formed in a substantially rectangular shape when viewed in the front-to-back direction X. The adhesive 13C that fixes these fixing portions 13B and the imaging substrate 12 is arranged in a substantially rectangular shape along the substantially rectangular shape of the fixing portion 13B.
[0023] Therefore, the camera unit 10 is assembled with the optical axis O of the lens 11A and the center of the image sensor 12A aligned, using the positioning part 13A of the optical axis reference part 13 as a reference. Although not shown in the diagram, there are actually multiple lenses inside the lens reference part 11B, and together with the lens 11A, multiple lenses form a lens assembly, and the optical axis O determined by these multiple lenses is aligned with the center of the image sensor 12A.
[0024] Returning to the description of camera module 1, as shown in Figures 1 to 4, the frame portion 20 is positioned behind the camera unit 10. The frame portion 20 includes a base portion 21, a connector portion 22, a locking portion 23, and a shield case 24.
[0025] The base portion 21 is molded from a synthetic resin material and has a predetermined thickness in the front-to-back direction X, and is formed in a rectangular plate shape with planes facing in each direction in the width direction Y and each direction in the up-and-down direction Z. The base portion 21 has a positioning portion 21A.
[0026] The positioning portions 21A are provided at a total of four locations (two in the embodiment) at equal intervals in the width direction Y on a plane facing each direction in the vertical direction Z. In the upper plane in the vertical direction Z, the two upper positioning portions 21A aligned in the width direction Y are formed as recesses that open upward. In the lower plane in the vertical direction Z, the two lower positioning portions 21A aligned in the width direction Y are formed as recesses that open downward.
[0027] The connector portion 22 is integrally provided with the base portion 21 and is formed in a cylindrical shape that extends toward the rear. Inside the cylindrical shape of the connector portion 22 is a connecting fitting 22A that connects to a connection terminal 12B fixed to the imaging substrate 12. The connecting fitting 22A extends forward from the connector portion 22, passing through the base portion 21, and is electrically connected to the connection terminal 12B of the camera unit 10 at the rear of the imaging substrate 12.
[0028] The locking portion 23 is integrally provided with the base portion 21 and is positioned along the connector portion 22. The locking portion 23 is formed as a projection into which the claws of a connector (not shown) of a cable such as a recording device, which is inserted into the connector portion 22 and electrically connected to the connecting fitting 22A, engage.
[0029] The shield case 24 is formed of an elastic metal plate and includes a main plate 24A, a plurality of plate pieces 24B, and through holes 24C, as shown in Figures 4 and 9.
[0030] The main plate 24A is formed in a rectangular shape with thickness in the front-to-back direction X, and two sides facing each direction in the up-and-down direction Z and two sides facing each direction in the width direction Y. The main plate 24A is formed in a rectangular shape that is slightly larger than the rectangular shape of the imaging substrate 12. The front surface of the main plate 24A is positioned opposite the rear surface of the imaging substrate 12. The main plate 24A is fixed by the connecting fitting 22A passing through it.
[0031] The plate pieces 24B are formed by bending each side around the main plate 24A and extending forward. Therefore, in this embodiment, the plate pieces 24B are formed at four locations around the main plate 24A. The plate piece 24B has first plate pieces 24BA that are bent and extend from each side in the width direction Y of the rectangular main plate 24A, and second plate pieces 24BB that are bent and extend from each side in the vertical direction Z of the rectangular main plate 24A. Therefore, the plate pieces 24B alternately have first plate pieces 24BA and second plate pieces 24BB around the rectangular main plate 24A. Each first plate piece 24BA is formed so that the length extending from the side of the main plate 24A is longer than the length of each second plate piece 24BB that extends from the side of the main plate 24A. In this way, the plate pieces 24B are formed with different lengths extending from the main plate 24A.
[0032] Each first plate piece 24BA has a tongue portion 24Ba that extends outward at its extended tip. The tongue portion 24Ba is formed by bending it outward, for example, at a 45-degree angle to the plate surface of the first plate piece 24BA. Each first plate piece 24BA also has a bulging portion 24Bb that expands inward along its extension. The bulging portion 24Bb extends in the direction in which the first plate piece 24BA extends, and the cross-sectional shape intersecting that direction of extension is formed by bulging inward in an arc shape. Each first plate piece 24BA also has bent portions 24Bc on both sides adjacent to the second plate piece 24BB in the circumferential direction of the main plate 24A, which are bent so as to overlap the side edges of the second plate piece 24BB from the outside.
[0033] Each second plate piece 24BB has a tongue portion 24Ba bent outward at its extended tip. The tongue portion 24Ba is formed by bending it outward, for example, at a 45-degree angle to the plate surface of the second plate piece 24BB. Each second plate piece 24BB also has a bulging portion 24Bb that expands inward along its extension. The bulging portion 24Bb extends in the direction in which the second plate piece 24BB extends, and the cross-sectional shape intersecting that direction of extension is formed by bulging inward in an arc shape. Each second plate piece 24BB also has projections 24Bd on both ends where the bent portion 24Bc of the first plate piece 24BA overlaps, projecting toward the bent portion 24Bc. The projections 24Bd are not limited to the second plate piece 24BB, but may also be provided on the first plate piece 24BA so as to project toward the second plate piece 24BB on the bent portion 24Bc that overlaps the side end of the second plate piece 24BB.
[0034] The plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around a rectangular main plate 24A facing the rectangular imaging substrate 12. However, for example, the first plate pieces 24BA and second plate pieces 24BB may be alternating around a hexagonal main plate 24A facing the hexagonal imaging substrate 12. That is, the plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around an even-sided main plate 24A.
[0035] Each plate piece 24B contacts the peripheral edge of the imaging substrate 12 by elastic force. The imaging substrate 12 is formed such that a protective film made of resin or the like is peeled off at its peripheral edge, exposing the ground electrode. Each plate piece 24B has a bulge 24Bb that contacts the peripheral edge of the imaging substrate 12 by elastic force. In addition, each plate piece 24B is formed with a sharp bend from the main plate 24A so that the tip side (tongue 24Ba side) faces inward beforehand, in order to generate an elastic force that contacts the peripheral edge of the imaging substrate 12.
[0036] The through-hole 24C penetrates the shield case 24 both internally and externally. The through-hole 24C is formed by cutting out a corner portion of the main plate 24A and the base end of each circumferentially adjacent plate piece 24B that bends from the main plate 24A. This through-hole 24C is provided to penetrate the box-shaped shield case 24, which consists of the main plate 24A and each plate piece 24B, connecting the inside and the outside.
[0037] The shield case 24 is supported by the camera unit 10 by sandwiching the imaging substrate 12 of the camera unit 10 between opposing plate pieces 24B. At this time, in the internal region of the shield case 24 which is partitioned by the shield case 24 and the imaging substrate 12, the connecting fitting 22A of the connector portion 22 is connected to the connection terminal 12B of the imaging substrate 12. Furthermore, the shield case 24 surrounds the peripheral edge of the imaging substrate 12 with opposing plate pieces 24B, and a tongue portion 24Ba extends in front of the imaging substrate 12, surrounding the rear end of the fixing portion 13B which is the end of the lens portion 11, and the adhesive 13C.
[0038] In this type of shield case 24, the shielding effect is enhanced by having multiple plate pieces 24B that contact the peripheral edge of the imaging substrate 12, such that a portion of one plate piece 24B overlaps the outer surface of the other plate piece 24B that is adjacent in the circumferential direction. As a result, this shield case 24 can achieve further improvement in electromagnetic compatibility. In particular, in this shield case 24, each plate piece 24B that is adjacent in the circumferential direction is formed with a different length extending from the main plate 24A. Therefore, when contacting the peripheral edge of the imaging substrate 12, the longer plate piece 24BA makes contact first and spreads outward, and then the shorter plate piece 24BB makes contact with the peripheral edge of the imaging substrate 12 and spreads outward, thus avoiding interference between the overlapping portions of adjacent plate pieces 24B.
[0039] Returning to the description of camera module 1, as shown in Figures 1 to 4, the exterior resin 30 is formed by insert molding so as to cover the outside of the lens portion 11, imaging substrate 12, and optical axis reference portion 13 of the camera unit 10.
[0040] The outer resin 30 is formed of insert resin R (see Figure 14) and, as shown in Figure 4, is provided in front of the base 21 of the frame 20, covering the outer circumference of the shield case 24, the outer circumference of the optical axis reference portion 13, and the outer circumference of the adhesive 13C, and extending into the interior of the shield case 24. Furthermore, as shown in Figure 5, the outer resin 30 is provided so that the outer reference portion 31A, which fits into the positioning portion 13A of the optical axis reference portion 13, is exposed to the outside.
[0041] Furthermore, the exterior resin 30 is formed of insert resin R and, as shown in Figures 4 and 5, is provided to continuously cover the outer circumference of a part of the lens holding portion 11C of the lens portion 11, the outer circumference of a part of the lens regulating portion 11B, and the outer circumference of a part of the optical axis reference portion 13 in the front-to-back direction X.
[0042] Therefore, the exterior resin 30 continuously covers the outer periphery of the camera module 1 in the front-to-back direction X, from the lens holding portion 11C of the lens portion 11 to the frame portion 20.
[0043] Furthermore, as shown in Figures 4 and 5, the exterior resin 30 has recesses 31B that are recessed from the outside to the inside at positions between the tips (tongue portions 24Ba) of each plate piece 24B of the shield case 24 and the exterior reference portion 31A (positioning portion 13A). As shown in Figures 1 to 3, the recesses 31B are formed in a groove shape that continuously surrounds the exterior resin 30 along the width direction Y and the vertical direction Z. Also, as shown in Figures 4 and 5, the recesses 31B have a predetermined groove width in the front-rear direction X and are formed with the groove bottom facing the rear end of the fixing portion 13B, which is the end of the lens portion 11. These recesses 31B are positioned along the front surface of the imaging substrate 12 so as not to come into contact with the imaging substrate 12, the exterior reference portion 31A (positioning portion 13A), the shield case 24, the lens portion 11 (fixing portion 13B), and the adhesive 13C.
[0044] Figures 10 to 15 show a method for manufacturing a camera module according to an embodiment.
[0045] The camera module 1 is molded by placing the camera unit 10 and frame portion 20, which are insert parts, into the insert mold 50 shown in Figures 10 to 14, and filling the insert mold 50 with insert resin R as shown in Figure 14. The insert mold 50 includes a lower mold 50A and an upper mold 50B.
[0046] The lower mold 50A has a cavity 51, an engagement hole 52, a wall portion 53, a gate 54, and an air gate 55. The cavity 51 is where the camera unit 10 and the frame portion 20 are placed, and is filled with insert resin R as shown in Figure 14. The cavity 51 has a reference portion 51A that protrudes from its inner surface and fits into the positioning portion 13A of the optical axis reference portion 13 in the camera unit 10. The cavity 51 also has a reference portion 51B that fits into the positioning portion 21A of the base portion 21 of the frame portion 20 in the camera module 1. The engagement hole 52 engages with each other via a guide (not shown) which is inserted together with the engagement hole 52 of the upper mold 50B. The wall portion 53 forms the recessed portion 31B described above and is formed in a plate shape inside the cavity 51. The gate 54 is a through hole for injecting the insert resin R into the cavity 51 and is provided in the lower mold 50A at least once. The gate 54 is positioned closer to the wall portion 53 than the air gate 55. The air gate 55 is a through-hole for venting air from inside the cavity 51 when the insert resin R is injected into the cavity 51, and at least one is provided in the lower mold 50A.
[0047] The upper mold 50B has a cavity 51, an engagement hole 52, a wall portion 53, a gate 54, and an air gate 55. The cavity 51 is where the camera unit 10 and the frame portion 20 are placed, and is filled with insert resin R as shown in Figure 14. The cavity 51 has a reference portion 51A that protrudes from its inner surface and fits into the positioning portion 13A of the optical axis reference portion 13 in the camera unit 10. The cavity 51 also has a reference portion 51B that fits into the positioning portion 21A of the base portion 21 of the frame portion 20 in the camera module 1. The engagement hole 52 engages with each other via a guide (not shown) which is inserted together with the engagement hole 52 of the lower mold 50A. The wall portion 53 forms the recessed portion 31B described above and is formed in a plate shape inside the cavity 51. The walls 53 of the upper mold 50B and the lower mold 50A are arranged in a continuous manner when the molds 50A and 50B are combined. The gate 54 is a through-hole for injecting the insert resin R into the cavity 51, and at least one gate 54 is provided in the upper mold 50B. The gate 54 is located closer to the wall 53 than the air gate 55. The air gate 55 is a through-hole for venting air from inside the cavity 51 when the insert resin R is injected into the cavity 51, and at least one air gate 55 is provided in the upper mold 50B.
[0048] When the camera unit 10 is placed in the insert mold 50, the frame portion 20 is assembled in advance. Therefore, the camera unit 10 and the frame portion 20 assembled to the camera unit 10 are positioned and placed in the cavities 51 of the lower mold 50A and upper mold 50B by fitting their respective positioning portions 13A and 21A to the reference portions 51A and 51B. In the camera unit 10, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned by the positioning portion 13A, and the optical axis O of the lens 11A is positioned relative to the cavities 51 of the lower mold 50A and upper mold 50B by fitting this positioning portion 13A to the reference portion 51A.
[0049] Then, the lower mold 50A and the upper mold 50B engage their mutual engagement holes 52, thereby positioning the optical axis O of the lens 11A relative to their respective cavities 51, and the camera unit 10 is positioned accordingly.
[0050] As shown in Figure 15, the manufacturing method of the camera module 1 involves assembling the lens unit 11, imaging substrate 12, and optical axis reference unit 13 as a camera unit 10 based on the positioning unit 13A in step S1 (see Figure 14). By assembling the camera unit 10 based on the positioning unit 13A of the optical axis reference unit 13, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned.
[0051] Next, as shown in Figure 15, in step S2, the camera unit 10 is positioned in the insert mold 50 by fitting the positioning portion 13A of the camera unit 10 into the reference portion 51A of the insert mold 50 (see Figure 14). As described above, the camera unit 10 is positioned relative to the insert mold 50 by fitting the positioning portion 13A into the reference portion 51A.
[0052] At this time, the wall portion 53 is positioned between the tip (tongue portion 24Ba) of each plate piece 24B of the shield case 24 and the exterior reference portion 31A (positioning portion 13A), and is arranged in a plate shape that continuously surrounds the fixing portion 13B along the width direction Y and the vertical direction Z. Furthermore, as shown in Figure 14, the wall portion 53 has a predetermined plate thickness in the front-rear direction X, and is positioned with its tip facing the rear end of the fixing portion 13B, which is the end of the lens portion 11. In addition, the wall portion 53 is positioned so as not to come into contact with the shield case 24, the lens portion 11 (fixing portion 13B), and the adhesive 13C.
[0053] Next, as shown in Figure 15, the manufacturing method for the camera module 1 involves filling the insert mold 50 with insert resin R in step S3. The filled insert resin R becomes the outer resin 30 of the camera module 1.
[0054] In this process, the insert resin R moves along the front-rear direction X along each plate piece 24B outside the shield case 24. The insert resin R that has moved forward flows to the front side of the imaging substrate 12 and fills the lens portion 11 and the front side of the imaging substrate 12. Furthermore, the insert resin R that has moved forward is guided by the wall portion 53 so that it folds back the tips of each plate piece 24B of the shield case 24 and flows toward the adhesive 13C. Here, the adhesive 13C expands due to the heat of the insert resin R, but the pressure of the insert resin R guided by the wall portion 53 inhibits the volume change due to the thermal expansion of the adhesive 13C, and the local thermal expansion pressure due to the volume change is canceled out. That is, in the manufacturing method of the camera module 1, as shown in Figure 15, in step S4, the wall portion 53 guides the insert resin R toward the adhesive 13C and acts as a barrier to the thermal expansion pressure of the adhesive 13C. Meanwhile, the insert resin R that has moved to the rear enters the internal region of the shield case 24 through the through hole 24C of the shield case 24 and fills the rear side of the imaging substrate 12.
[0055] Then, a recessed portion 31B, which is a trace of the wall portion 53, is formed on the exterior resin 30. In addition, the exterior reference portion 31A is formed when the positioning portion 13A and the reference portion 51A are fitted together in the exterior resin 30. Since the reference portion 51A is formed protruding from the inner surface of the cavity 51, the exterior reference portion 31A formed in the part where the reference portion 51A is fitted with the positioning portion 13A appears as a recessed trace on the exterior of the exterior resin 30.
[0056] Thus, the manufacturing method for the camera module 1 involves insert molding the exterior resin 30 so as to cover the outside of the lens portion 11, imaging substrate 12, and optical axis reference portion 13 of the camera unit 10, and manufacturing the camera module 1 so that the recessed portion 31B and the exterior reference portion 31A are exposed on the outside of the exterior resin 30.
[0057] According to this camera module 1, in the insert-molded exterior resin 30, the exterior reference part 31A that fits into the positioning part 13A of the optical axis reference part 13 is exposed externally, so that the exterior reference part 31A is set as the reference for the optical axis O of the lens 11A. Therefore, the camera module 1 is fixed to the mounting object based on the exterior reference part 31A that is exposed externally to the exterior resin 30, so that the orientation of the optical axis O of the lens 11A (the direction of rotation around the optical axis O and the direction of inclination of the optical axis O) is properly aligned with the imaging area. Since the camera module 1 is fixed to the mounting object based on the exterior reference part 31A, it is not necessary to readjust the mounting to align the orientation of the optical axis O of the lens 11A, and the mounting work can be easily performed. As a result, with this camera module 1, the imaging accuracy of the imaging area can be further improved.
[0058] As described above, the camera module 1 of the embodiment is characterized by including a lens portion 11 that holds the lens 11A, an imaging substrate (substrate) 12 on which an image sensor 12A is mounted, an adhesive 13C that is applied to the edges of the imaging substrate 12 and the lens portion 11 so as to bond the edges of the imaging substrate 12 and the lens portion 11 (fixing portion 13B) to each other, an exterior resin 30 that is insert-molded to cover the outside of the lens portion 11 and the imaging substrate 12, and a recessed portion 31B that appears on the outside of the exterior resin 30 in a position that covers the adhesive 13C.
[0059] The exterior resin 30 is insert molded by filling the insert mold 50 with insert resin R. The recessed portion 31B that appears on the outside of the exterior resin 30 is formed by the protrusion (wall portion 53) of the insert mold 50. This recessed portion 31B is positioned to cover the adhesive 13C, and the wall portion 53 is also positioned to cover the adhesive 13C. As a result, in this camera module 1, during the insert molding of the exterior resin 30, the wall portion 53 guides the insert resin R toward the adhesive 13C. Furthermore, in this camera module 1, the wall portion 53 acts as a barrier against the thermal expansion pressure of the adhesive 13C, which expands due to the heat of the insert resin R. Therefore, in this camera module 1, there is a risk that the lens portion 11 (fixed portion 13B) may deform due to the thermal expansion of the adhesive 13C and the focus position of the lens 11A may shift. However, the wall portion 53 acts as a barrier against the thermal expansion pressure of the adhesive 13C and cancels out the thermal expansion pressure, thus suppressing the shift in the focus position of the lens 11A. As a result, this camera module 1 can ensure quality.
[0060] Furthermore, in the camera module 1 of this embodiment, the adhesive 13C is provided so as to continuously surround the end of the lens portion 11 (fixing portion 13B), and the recessed portion 31B is arranged so as to continuously surround the lens portion 11.
[0061] According to this camera module 1, if the adhesive 13C is provided to continuously surround the end of the lens portion 11 (fixing portion 13B), it is desirable that the recessed portion 31B also be arranged to continuously surround the lens portion 11. That is, in this camera module 1, the wall portion 53 that forms the recessed portion 31B can act as a barrier to thermal expansion pressure while guiding the insert resin R against the continuous adhesive 13C. As a result, this camera module 1 can ensure quality.
[0062] Furthermore, the camera module 1 of this embodiment further includes a shield case 24 that contacts the peripheral edge of the imaging substrate 12 and surrounds the adhesive 13C, and the recessed portion 31B is positioned with a gap between it and the shield case 24.
[0063] With this camera module 1, the wall portion 53 that forms the recessed portion 31B can be prevented from interfering with the shield case 24, and the wall portion 53 can guide the insert resin R while also acting as a barrier against thermal expansion pressure. As a result, the quality of this camera module 1 can be ensured.
[0064] Furthermore, in the camera module 1 of this embodiment, the lens portion 11 includes a positioning portion 13A that aligns the optical axis O of the lens 11A with the center of the image sensor 12A, the exterior resin 30 has an exterior reference portion 31A that fits into the positioning portion 13A and is exposed to the outside, and the recessed portion 31B is arranged in the exterior resin 30, avoiding the exterior reference portion 31A.
[0065] According to this camera module 1, the recessed portion 31B is positioned in the exterior resin 30 while avoiding the exterior reference portion 31A. This prevents the wall portion 53 that forms the recessed portion 31B from interfering with the molding of the exterior reference portion 31A, thereby ensuring the above-mentioned function of the exterior reference portion 31A.
[0066] Furthermore, in the camera module 1 of this embodiment, the recessed portion 31B is arranged along the arrangement shape that surrounds the end of the lens portion 11 of the adhesive 13C.
[0067] In this embodiment, the adhesive 13C is arranged in a substantially rectangular shape along the substantially rectangular shape of the rear end of the fixing portion 13B. Therefore, the recessed portion 31B is arranged along the substantially rectangular shape surrounding the end of the lens portion 11 of the adhesive 13C. With this camera module 1, the wall portion 53 that forms the recessed portion 31B is arranged along the arrangement shape surrounding the end of the lens portion 11 of the adhesive 13C, thereby providing a barrier to thermal expansion pressure while guiding the insert resin R to the adhesive 13C. As a result, the quality of this camera module 1 can be ensured.
[0068] In this embodiment, the camera module 1 further includes a fixing member 60 that is attached to the exterior reference section 31A with reference to the mounting target, as shown in Figure 16.
[0069] The fixing member 60 has a support body 61 and an adhesive portion 62. In this embodiment, the support body 61 has a projection 61A that is inserted into and fitted into an exterior reference portion 31A formed in a recess. The adhesive portion 62 is a double-sided adhesive layer that is attached to the plate surface of the support body 61 and is attached to the object to be mounted.
[0070] With this camera module 1, the fixing member 60 is attached based on the exterior reference part 31A, and the module is fixed to the mounting object via this fixing member 60, making the installation work easier and improving the imaging accuracy of the imaging area. Alternatively, the camera module 1 may be fixed to the mounting object by directly fitting the exterior reference part 31A into the uneven parts formed on the mounting object.
[0071] Furthermore, the method for manufacturing the camera module 1 of the embodiment includes a lens portion 11 that holds a lens 11A, an imaging substrate 12 on which an image sensor 12A is mounted, an adhesive 13C applied to the edges of the imaging substrate 12 and the lens portion 11 so as to bond the edges of the imaging substrate 12 and the lens portion 11 (fixing portion 13B) to each other, an exterior resin 30 that is insert-molded to cover the outside of the lens portion 11 and the imaging substrate 12, and a recessed portion 31B that appears on the outside of the exterior resin 30 in a position that covers the adhesive 13C, and the method for manufacturing the camera module 1 includes the steps of assembling the lens portion 11 and the imaging substrate 12 as a camera unit 10, placing the camera unit 10 in an insert mold 50 having a wall portion 53 for forming the recessed portion 31B, and filling the space between the wall portion 53 and the adhesive 13C with insert resin R.
[0072] In this camera module 1 manufacturing method, during insert molding of the exterior resin 30, the wall portion 53 guides the insert resin R toward the adhesive 13C. Furthermore, in this camera module 1 manufacturing method, the wall portion 53 acts as a barrier against the thermal expansion pressure of the adhesive 13C, which expands due to the heat of the insert resin R. Therefore, in this camera module 1 manufacturing method, there is a risk that the lens portion 11 (fixed portion 13B) may deform due to the thermal expansion of the adhesive 13C, causing the focus position of the lens 11A to shift. However, the wall portion 53 acts as a barrier against the thermal expansion pressure of the adhesive 13C, counteracting the thermal expansion pressure, thus suppressing the shift in the focus position of the lens 11A. As a result, this camera module 1 manufacturing method ensures quality. It is desirable that in the insert mold 50, the gate 54 be positioned closer to the wall portion 53 than to the air gate 55. The gate 54 is the part into which the insert resin R is injected into the cavity 51, and relatively high pressure is applied to the insert resin R toward the air gate 55 side. Therefore, in the manufacturing method of this camera module 1, by positioning the gate 54 near the wall portion 53, the insert resin R can be guided into the adhesive 13C, and the thermal expansion pressure of the adhesive 13C can be suppressed by the pressure of the insert resin R. Note that the arrangement of the gate 54 and air gate 55 shown in Figure 14 is just one example.
[0073] [Second Embodiment] Figure 17 shows a camera module according to this embodiment. Figures 18 and 19 show the camera unit of the camera module shown in Figure 17.
[0074] The camera module 1' and camera unit 10' of this embodiment differ from the camera module 1 of the first embodiment in that they have a wall portion 13D on the lens portion 11 that corresponds to the wall portion 53 of the insert mold 50, instead of the recessed portion 31B (wall portion 53). Other configurations are the same. Therefore, in the description of the second embodiment, the same reference numerals are used for parts equivalent to those in the first embodiment, and their description is omitted.
[0075] The wall portion 13D is integrally provided at the rear end of the fixing portion 13B, which is the end of the lens portion 11. The wall portion 13D extends from the fixing portion 13B along the width direction Y and the vertical direction Z, and is formed as a plate that continuously surrounds the fixing portion 13B. The wall portion 13D also has a predetermined plate thickness in the front-to-back direction X. This wall portion 13D is positioned along the front surface of the imaging substrate 12 and embedded inside the exterior resin 30 so as not to come into contact with the imaging substrate 12, the exterior reference portion 31A (positioning portion 13A), the shield case 24, and the adhesive 13C.
[0076] Figures 20 and 21 show the manufacturing method of the camera module shown in Figure 17.
[0077] As shown in Figure 20, the camera module 1' is molded by placing the camera unit 10' and frame portion 20, which are insert parts, into an insert mold 50' that does not have a wall portion 53 in the insert mold 50 of the first embodiment, and filling the insert mold 50' with insert resin R. The insert mold 50' is the same as the insert mold 50 of the first embodiment except that it does not have a wall portion 53.
[0078] As shown in Figure 21, the manufacturing method of camera module 1' involves assembling the lens unit 11, imaging substrate 12, and optical axis reference unit 13 as a camera unit 10' based on the positioning unit 13A in step S11 (see Figure 20). By assembling the camera unit 10' based on the positioning unit 13A of the optical axis reference unit 13, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned.
[0079] Next, as shown in Figure 21, the manufacturing method of the camera module 1' involves fitting the positioning portion 13A of the camera unit 10' into the reference portion 51A of the insert mold 50' in step S12, thereby positioning the camera unit 10' in the insert mold 50' (see Figure 20). By fitting the positioning portion 13A of the camera unit 10' into the reference portion 51A, the optical axis O of the lens 11A is positioned relative to the insert mold 50'.
[0080] Next, as shown in Figure 21, the manufacturing method of the camera module 1' involves filling the insert mold 50' with insert resin R in step S13. The filled insert resin R becomes the outer resin 30 of the camera module 1'.
[0081] In this process, the insert resin R moves along the front-rear direction X along each plate piece 24B outside the shield case 24. The insert resin R that has moved forward flows to the front side of the imaging substrate 12 and fills the lens portion 11 and the front side of the imaging substrate 12. Furthermore, the insert resin R that has moved forward is guided by the wall portion 13D to flow towards the adhesive 13C by folding back the tips of each plate piece 24B of the shield case 24. Here, the adhesive 13C expands due to the heat of the insert resin R, but the pressure of the insert resin R guided by the wall portion 13D inhibits the volume change due to the thermal expansion of the adhesive 13C, and the local thermal expansion pressure due to the volume change is canceled out. That is, in the manufacturing method of the camera module 1', as shown in Figure 21, in step S14, the wall portion 13D guides the insert resin R toward the adhesive 13C and acts as a barrier to the thermal expansion pressure of the adhesive 13C. Meanwhile, the insert resin R that has moved to the rear enters the internal region of the shield case 24 through the through hole 24C of the shield case 24 and fills the rear side of the imaging substrate 12.
[0082] Furthermore, the exterior resin 30 has a wall portion 13D embedded inside it. In addition, the exterior resin 30 has a positioning portion 13A and a reference portion 51A that fit together to form the exterior reference portion 31A. Since the reference portion 51A is formed protruding from the inner surface of the cavity 51, the exterior reference portion 31A formed in the part where the reference portion 51A fits with the positioning portion 13A appears as a recessed trace on the outside of the exterior resin 30.
[0083] Thus, the manufacturing method for the camera module 1' involves insert molding the exterior resin 30 so as to cover the outside of the lens portion 11, imaging substrate 12, and optical axis reference portion 13 of the camera unit 10', and manufacturing the camera module 1' such that the exterior reference portion 31A is exposed on the outside of the exterior resin 30.
[0084] According to this camera module 1', in the insert-molded exterior resin 30, the exterior reference part 31A that fits into the positioning part 13A of the optical axis reference part 13 is exposed externally, so that the exterior reference part 31A is set as the reference for the optical axis O of the lens 11A. Therefore, the camera module 1' is fixed to the mounting object based on the exterior reference part 31A that is exposed externally to the exterior resin 30, so that the orientation of the optical axis O of the lens 11A (the direction of rotation around the optical axis O and the direction of inclination of the optical axis O) is properly aligned with the imaging area and fixed to the mounting object. Since the camera module 1' is fixed to the mounting object based on the exterior reference part 31A, it is not necessary to readjust the mounting to align the orientation of the optical axis O of the lens 11A, and the mounting work can be easily performed. As a result, with this camera module 1', the imaging accuracy of the imaging area can be further improved.
[0085] As described above, the camera module 1' of the embodiment is characterized by including a lens portion 11 that holds the lens 11A, an imaging substrate (substrate) 12 on which an image sensor 12A is mounted, an adhesive 13C that is applied to the edges of the imaging substrate 12 and the lens portion 11 so as to bond the edges of the imaging substrate 12 and the lens portion 11 (fixing portion 13B) to each other, an exterior resin 30 that is insert-molded to cover the outside of the lens portion 11 and the imaging substrate 12, and a wall portion 13D provided on the lens portion 11 in a position that covers the adhesive 13C.
[0086] In this camera module 1', during insert molding of the exterior resin 30, the wall portion 13D guides the insert resin R toward the adhesive 13C. Furthermore, in this camera module 1', the wall portion 13D acts as a barrier against the thermal expansion pressure of the adhesive 13C, which expands due to the heat of the insert resin R. Therefore, in this camera module 1', there is a risk that the lens portion 11 (fixing portion 13B) may deform due to the thermal expansion of the adhesive 13C, causing the focus position of the lens 11A to shift. However, the wall portion 13D acts as a barrier against the thermal expansion pressure of the adhesive 13C, counteracting this thermal expansion pressure, thus suppressing the shift in the focus position of the lens 11A. As a result, this camera module 1' can ensure quality.
[0087] Furthermore, in the camera module 1' of the embodiment, the adhesive 13C is provided so as to continuously surround the end of the lens portion 11 (fixing portion 13B), and the wall portion 13D is arranged so as to continuously surround the lens portion 11.
[0088] According to this camera module 1', if the adhesive 13C is provided to continuously surround the end of the lens portion 11 (fixing portion 13B), it is desirable that the wall portion 13D also be arranged to continuously surround the lens portion 11. That is, in this camera module 1', the wall portion 13D can provide a barrier to thermal expansion pressure while guiding the insert resin R with respect to the continuous adhesive 13C. As a result, this camera module 1' can ensure quality.
[0089] Furthermore, in the camera module 1' of this embodiment, the wall portion 13D is arranged along the imaging substrate 12.
[0090] With this camera module 1', the wall portion 13D is positioned along the imaging substrate 12, thereby guiding the insert resin R to the adhesive 13C placed on the imaging substrate 12 while also acting as a barrier to thermal expansion pressure. As a result, this camera module 1' can ensure quality.
[0091] Furthermore, in the camera module 1' of the embodiment, the wall portion 13D is arranged along the arrangement shape that surrounds the end of the lens portion 11 of the adhesive 13C.
[0092] In this embodiment, the adhesive 13C is arranged in a substantially rectangular shape along the substantially rectangular shape of the rear end of the fixing part 13B. Therefore, the wall portion 13D is arranged along the substantially rectangular shape surrounding the end of the lens portion 11 of the adhesive 13C. With this camera module 1', the wall portion 13D is arranged along the arrangement shape surrounding the end of the lens portion 11 of the adhesive 13C, thereby providing a barrier to thermal expansion pressure while guiding the insert resin R to the adhesive 13C. As a result, this camera module 1' can ensure quality.
[0093] Furthermore, the method for manufacturing the camera module 1' of the embodiment includes a lens portion 11 that holds a lens 11A, an imaging substrate 12 on which an image sensor 12A is mounted, an adhesive 13C that is applied to the edges of the imaging substrate 12 and the lens portion 11 so as to bond the edges of the imaging substrate 12 and the lens portion 11 (fixing portion 13B) to each other, an exterior resin 30 that is insert-molded to cover the outside of the lens portion 11 and the imaging substrate 12, and a wall portion 13D provided on the lens portion 11 in a position that covers the adhesive 13C, and the method for manufacturing the camera module 1' includes the steps of assembling the lens portion 11 and the imaging substrate 12 as a camera unit 10', placing the camera unit 10' in an insert mold 50', and filling the space between the wall portion 13D and the adhesive 13C with insert resin R.
[0094] In this camera module 1' manufacturing method, during insert molding of the exterior resin 30, the wall portion 13D guides the insert resin R toward the adhesive 13C. Furthermore, in this camera module 1' manufacturing method, the wall portion 13D acts as a barrier against the thermal expansion pressure of the adhesive 13C, which expands due to the heat of the insert resin R. Therefore, in this camera module 1' manufacturing method, there is a risk that the lens portion 11 (fixed portion 13B) may deform due to the thermal expansion of the adhesive 13C, causing the focus position of the lens 11A to shift. However, the wall portion 13D acts as a barrier against the thermal expansion pressure of the adhesive 13C, counteracting the thermal expansion pressure, thus suppressing the shift in the focus position of the lens 11A. As a result, this camera module 1' manufacturing method ensures quality. It is desirable that in the insert mold 50', the gate 54 be positioned closer to the wall portion 13D than to the air gate 55. The gate 54 is the part into which the insert resin R is injected into the cavity 51, and relatively high pressure is applied to the insert resin R toward the air gate 55 side. Therefore, in the manufacturing method of this camera module 1', the gate 54 is placed near the wall portion 13D, which allows the insert resin R to be guided into the adhesive 13C, and the thermal expansion pressure of the adhesive 13C can be suppressed by the pressure of the insert resin R. Note that the arrangement of the gate 54 and air gate 55 shown in Figure 20 is just one example. [Explanation of Symbols]
[0095] 1 Camera Module 10 Camera Units 11 Lens section 12 Imaging substrate (substrate) 12A Image Sensor 13 Optical axis reference section 13B Fixed part 13C adhesive 53 Wall 24 Shield Cases 30 Exterior resin 31A Exterior reference part 31B Recessed area 50 Insert molds R insert resin
Claims
1. The lens part that holds the lens, A circuit board on which an image sensor is mounted, An adhesive is applied to the substrate and the end of the lens portion so as to bond the substrate and the end of the lens portion together, An outer resin that is insert-molded to cover the lens portion and the substrate, The recessed portion that appears on the outside of the exterior resin in an arrangement that covers the adhesive, A camera module, including the camera module.
2. The adhesive is provided so as to continuously surround the end of the lens portion. The aforementioned recessed portion is arranged to continuously surround the lens portion. The camera module according to claim 1.
3. The present invention further includes a shielding case that contacts the peripheral edge of the substrate and surrounds the adhesive, The recessed portion is positioned with a gap between it and the shield case. The camera module according to claim 1.
4. The lens portion includes a positioning portion that aligns the optical axis of the lens with the center of the image sensor. The exterior resin has an exterior reference portion that fits into the positioning portion and is exposed to the outside, The recessed portion is positioned in the exterior resin, avoiding the exterior reference portion. The camera module according to claim 1.
5. The lens part that holds the lens, A circuit board on which an image sensor is mounted, An adhesive is applied to the substrate and the end of the lens portion so as to bond the substrate and the end of the lens portion together, An outer resin that is insert-molded to cover the lens portion and the substrate, The recessed portion that appears on the outside of the exterior resin in an arrangement that covers the adhesive, A method for manufacturing a camera module, including, A step of assembling the lens section and the substrate as a camera unit, A step of placing the camera unit in an insert mold having a wall portion for forming the recessed portion, A step of filling the space between the wall portion and the adhesive, A method for manufacturing a camera module, including the following: