Method for manufacturing packaging, apparatus for manufacturing packaging

Abstract

To provide a novel method for manufacturing packaging. [Solution] The method includes a heating step in which microwaves are irradiated onto a laminate of packaging materials, which is formed by stacking multiple sheets of packaging material, to heat the bonding region of the laminate of packaging materials. A method for manufacturing a package, wherein the heating step is carried out with a shielding member installed to reduce the transmission of microwaves so as to cover at least a portion of the non-bonded areas of the laminated packaging material other than the bonded areas.

Description

[Technical Field]

[0001] This invention relates to a method for manufacturing packaging and an apparatus for manufacturing packaging. [Background technology]

[0002] Patent Document 1 discloses a pouch with a spout. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2024-73048 [Overview of the project] [Problems that the invention aims to solve]

[0004] As disclosed in Patent Document 1, conventional packaging materials such as pouches, which are made by joining multiple packaging materials together, have been manufactured.

[0005] Traditionally, packaging materials have been manufactured by joining multiple pieces of packaging material together to form a bag or similar shape that can hold the contents. In recent years, various materials have been considered for packaging, and the structure of packaging materials has also become more diverse.

[0006] Therefore, new manufacturing methods are needed for joining multiple packaging materials to produce a package, which differ from conventional methods.

[0007] One aspect of the present invention aims to provide a novel method for manufacturing packaging. [Means for solving the problem]

[0008] A method for manufacturing a packaging body according to one aspect of the present invention includes a heating step of irradiating a packaging material laminate, which is formed by stacking multiple packaging materials, with microwaves to heat the bonding region of the packaging material laminate, The heating step is carried out with a shielding member installed to reduce microwave transmission, so as to cover at least a portion of the non-bonded areas of the packaging material laminate other than the bonded areas. [Effects of the Invention]

[0009] According to one aspect of the present invention, a novel method for manufacturing packaging can be provided. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a top view of a packaging material laminate with a shielding member installed. [Figure 2] Figure 2 is a cross-sectional view of Figure 1(A) or Figure 1(B). [Figure 3] Figure 3 is an explanatory diagram of the support member. [Figure 4] Figure 4 is an explanatory diagram of the packaging material. [Figure 5] Figure 5 is an explanatory diagram of one example of a package configuration. [Figure 6] Figure 6 is a schematic diagram of a packaging manufacturing apparatus according to one aspect of the present disclosure. [Figure 7] Figure 7 is a schematic diagram of a packaging manufacturing apparatus according to one aspect of the present disclosure. [Figure 8] Figure 8 is a schematic diagram of a packaging manufacturing apparatus according to one aspect of the present disclosure. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described in detail below. To facilitate understanding of the explanation, the same reference numerals are used for identical components in each drawing, and redundant explanations are omitted. Furthermore, since the drawings are schematic diagrams for illustrative purposes, the scale of each component may differ from the actual scale. [Manufacturing method for packaging] A method for manufacturing a packaging body according to an embodiment of the present invention (hereinafter sometimes simply referred to as "this embodiment") will be described below.

[0012] In the conventional method for manufacturing a package, for a laminate of a plurality of film-like packaging materials, a joining region was heated using resistance heating, and joined by applying pressure as necessary to form a bag shape or the like. The inventor of the present invention focused on using microwaves instead of resistance heating as the heating means, and completed the present invention.

[0013] In the conventional heating method using resistance heating, the portion in contact with the heat source of the resistance heating and the vicinity thereof are heated by heat transfer, and it was difficult to selectively heat depending on the shape of the region to be heated. In addition, since it is heated by heat transfer from the heat source, it may be difficult to control the temperature profile when heating the joining region.

[0014] On the other hand, in the case of microwave heating, for example, by selecting the irradiation region of the microwave, it is possible to select the portion to be heated and the portion not to be heated. Further, by changing the output of the microwave, the temperature to be heated and the temperature profile can be set to desired conditions. For example, by irradiating with a high-output microwave, the temperature can be rapidly increased in a short time. In addition, since the temperature of the surroundings can be made sufficiently low during microwave irradiation, heating can be stopped and rapidly cooled by stopping the microwave irradiation. Therefore, according to microwave heating, it is possible to easily heat a desired region selectively so as to obtain a desired temperature profile.

[0015] Therefore, the method for manufacturing a package according to the present embodiment can include a heating step of irradiating a laminate of a plurality of packaging materials with microwaves to heat the joining region of the laminate of the packaging materials.

[0016] In this specification, microwaves mean electromagnetic waves having a frequency of 0.3 GHz or more and 300 GHz or less.

[0017] Hereinafter, the method for manufacturing a packaging material according to the present embodiment will be described step by step. (1) Heating step In the heating process, microwaves can be irradiated onto the packaging material laminate 11. The microwave irradiation conditions in the heating process are not particularly limited, and microwave irradiation can be performed to achieve a desired temperature profile depending on the material of the packaging material laminate 11 used.

[0018] When manufacturing a package, the packaging materials can be joined by selectively heating the joining regions of the laminated packaging material, which are the areas where the packaging materials are joined together. This softens or melts a portion of the packaging material. When manufacturing a package, it is preferable not to heat the non-joining regions, which are the areas where the packaging materials are not joined.

[0019] One method for selecting the area to be heated by microwaves is to place a shielding member on a laminate of multiple packaging materials, which is the object to be heated, such that it covers at least a portion of the non-bonded area of ​​the surface to be irradiated with microwaves, thereby reducing the transmission of microwaves. The shielding member can reduce the transmission of microwaves, for example, by reflecting them.

[0020] Therefore, the heating step in the packaging manufacturing method of this embodiment can be carried out with the shielding member installed on the packaging material laminate.

[0021] Examples of the arrangement of the packaging material laminate and the shielding member will be explained using Figures 1(A), 1(B), 2(A), 2(B), 2(C), and 2(D).

[0022] Figures 1(A) and 1(B) show the packaging material laminate 11 and the shielding member 12 as viewed along the lamination direction of the packaging material laminate 11 and the shielding member 12 after the shielding member 12 has been placed on the packaging material laminate 11 during the heating process.

[0023] Figures 2(A), 2(B), and 2(C) are cross-sectional views along line AA in Figure 1(A). Figure 2(D) is a cross-sectional view along line BB in Figure 1(B). In Figures 2(A), 2(B), 2(C), and 2(D), the waveguide 20 connected to the microwave oscillator is also shown to clarify its relationship with the microwave source. Microwaves are irradiated from end 20A of the waveguide 20 in the figures toward the packaging material laminate 11.

[0024] Figures 1(B), 2(B), 2(C), and 2(D) are examples of modifications; therefore, the explanation will primarily use Figures 1(A) and 2(A).

[0025] As shown in Figures 1(A) and 2(A), the heating process may be carried out with a shielding member 12 installed to reduce microwave transmission, so as to cover at least a portion of the non-bonded regions 14 of the packaging material laminate 11 other than the bonded regions 13.

[0026] Reducing microwave transmission means that the amount of microwaves irradiated onto the surface of the packaging material laminate 11 is reduced compared to when the shielding member 12 is not installed.

[0027] Figures 1(A), 2(A), etc., show an example in which two packaging materials, packaging material 111 and packaging material 112, are laminated as the packaging material laminate 11, but the invention is not limited to this form. The packaging material laminate subjected to the heating process may, for example, contain three or more packaging materials according to the shape of the package being manufactured.

[0028] As shown in Figure 2(A), the shielding member 12 can be placed on the surface of the packaging material laminate 11 that is irradiated with microwaves. As shown in Figure 2(A), the shielding member 12 may be placed in direct contact with the packaging material laminate 11. Alternatively, as shown in Figure 2(B), the shielding member 12 may be placed away from the packaging material laminate 11 so that a gap 21 is created between the shielding member 12 and the packaging material laminate 11. However, it is preferable to select the distance between the shielding member 12 and the packaging material laminate 11 so that the irradiated microwaves do not enter the gap 21 between the shielding member 12 and the packaging material laminate 11. The distance between the shielding member 12 and the packaging material laminate 11 may be constant or may vary depending on the location.

[0029] The shielding member 12 may cover the entire non-jointed region 14, or it may cover only a part of the non-jointed region 14. For example, when microwaves are irradiated, parts of the non-jointed region 14 that can be controlled to a temperature such that they do not join the packaging material 111 and the packaging material 112, even if they are not covered by the shielding member 12, do not need to be covered by the shielding member 12. In addition, the shielding member 12 may be provided with through holes of a size that does not allow microwaves to pass through, and the non-jointed region 14 does not need to be covered in the areas where such through holes are provided.

[0030] The heating step in the packaging manufacturing method of this embodiment can also be performed to join the remaining joining region after filling the contents into the partially joined packaging material laminate 11. For this reason, although the shielding member 12 is shown as a plate-like body in Figure 2(A), the shielding member 12 may also have a recess on the surface facing the packaging material laminate 11 that corresponds to the bulge caused by the contents filled inside the packaging material laminate 11. (1-1) Regarding shielding members (Regarding thickness) The thickness T12 of the shielding member 12 (see Figure 2(A)) can be selected according to the material of the shielding member 12, the microwave frequency, the shape of the packaging material laminate 11, etc. For this reason, the shielding member 12 may be as thin as a film, only a few millimeters thick, or it may be a plate material, i.e., a plate-like body, with a thickness of several centimeters.

[0031] Within the shielding member 12, the thickness T12 of the shielding member 12 does not need to be constant; it may vary depending on the location in order to control the amount of microwave transmission, etc. (Regarding shape) Since the shielding member 12 is provided to reduce the amount of microwave irradiation to the non-jointed region 14 and to irradiate the jointed region 13 with microwaves, it can have a shape that matches the jointed region 13 and the non-jointed region 14.

[0032] Figures 1(A) and 2(A) show an example in which a bonding region 13 is provided along sides 11A, 11B, and 11C of a packaging material laminate 11, which is formed by laminating two packaging materials 111 and 112. Therefore, in Figure 1(A), the bonding region 13 along sides 11A, 11B, and 11C is exposed, while the shielding member 12 is rectangular so that the other non-bonding regions 14 can be covered.

[0033] For example, the packaging manufacturing method of this embodiment can also be used when joining the packaging material laminate 11 along the edge 11D after the contents have been placed inside the packaging. In this case, the shape of the shielding member 12 can be selected so that a joining area can be set along the edge 11D.

[0034] The width L11 of the joining area 13 is not particularly limited and can be selected according to the required strength of the packaging and the materials of the packaging materials 111 and 112. Furthermore, the width L11 of the joining area 13 can be selected according to the specifications of the packaging being manufactured; it may be constant or vary depending on the location.

[0035] The shielding member 12 can be made of, for example, a metal plate. If the shielding member 12 is made of a metal plate, the corners 120 of the plate may be chamfered, as shown in Figure 1(A).

[0036] When metal materials are irradiated with microwaves, electrons may concentrate at sharp edges and other pointed parts, causing sparks. On the other hand, by chamfering the edges and reducing the number of sharp parts, sparks can be prevented.

[0037] The shielding member 12 may be shaped to cover a portion of the joining area 13, as shown in Figures 1(B) and 2(D). In this case, the shielding member 12 may be installed to cover a portion of the joining area 13 during the heating process.

[0038] If the shielding member 12 covers a portion of the joining region 13, the portion of the shielding member 12 that covers the joining region 13 may be made transparent to microwaves.

[0039] Specifically, for example, the portion of the shielding member 12 that covers the joint area 13 may be provided with a plurality of through-holes 121 that transmit microwaves.

[0040] Furthermore, the material of the portion of the shielding member 12 that covers the joint area 13 may be a material with high microwave transmittance, such as resin or glass.

[0041] By positioning the shielding member 12 to cover a portion of the joining area 13, it becomes possible to press the packaging material laminate 11 with the shielding member 12. Therefore, when heated in the heating process, the packaging material 111 and the packaging material 112 contained in the packaging material laminate 11 can be brought closer together in the joining area 13, and pressure can be applied simultaneously, resulting in a particularly strong bond after the heating process.

[0042] When a through-hole is provided in the portion of the shielding member 12 that covers the joint area 13, the size of the through-hole 121, for example, the inner diameter D121, is not particularly limited and can be selected according to the thickness of the shielding member 12 and the microwave frequency so that microwaves can pass through. By selecting the inner diameter D121 of the through-hole 121 and the density in which the through-holes 121 are arranged, the degree to which microwaves pass through the shielding member 12 can be selected, and the degree to which the joint area 13 is heated can also be selected. In Figure 1(B), the opening of the through-hole 121 is circular, but it may be any shape such as polygon or irregular shape.

[0043] The through-holes 121 may also be provided in the portion covering the non-jointed region 14. However, it is preferable to select the size and density of the through-holes provided in the non-jointed region 14 so that they do not transmit microwaves or reduce their transmission. By providing through-holes in the non-jointed region 14, the weight of the shielding member 12 can be reduced, improving workability during packaging manufacturing.

[0044] If the shielding member 12 covers at least a portion of the joint area 13, and the material of the part covering the joint area 13 and the part covering the non-joint area 14 are different, the part covering the joint area 13 may be separable from the part covering the non-joint area 14. Alternatively, the part covering the joint area 13 may be a separate component from the shielding member 12, and the component covering the joint area 13 and the shielding member 12 may be able to move or otherwise operate independently.

[0045] The shielding member 12 can also have its surface properties selected to enhance its microwave reflection characteristics. For example, it can be mirror-polished. Alternatively, as shown in Figure 2(C), a coating layer 22 can be provided on its surface. Figure 2(C) shows an example where the coating layer 22 is provided on only one surface of the shielding member 12, but the coating layer 22 may be provided on all surfaces of the shielding member 12. Depending on the function of the coating layer 22, the surface of the shielding member 12 on which the coating layer 22 is provided can be selected. (Regarding the materials for shielding members) The shielding member 12 is installed on the surface of the packaging material laminate 11, and it is sufficient if it reduces the microwaves irradiated onto the surface of the packaging material laminate 11. Therefore, the material of the shielding member 12 can be any material that can reduce the transmission of microwaves. The shielding member 12 may absorb microwaves or reflect microwaves. In particular, it is preferable that the shielding member 12 can reflect microwaves. This is because by reflecting microwaves, the shielding member 12 can reduce the heating of the non-jointed areas 14 of the packaging material laminate 11 caused by the shielding member 12 absorbing microwaves and heating, and it is particularly effective in preventing partial melting or welding. For this reason, as already explained, the shielding member 12 may be a metal plate. Metal materials have excellent microwave reflection properties, so by making the shielding member 12 a metal plate, the transmission of microwaves can be particularly reduced. In addition, by making the shielding member 12 a metal plate, it is possible to make a highly durable member that can prevent damage even with repeated use.

[0046] The shielding member 12 may include one or more materials selected from, for example, iron, stainless steel, aluminum, aluminum alloy, copper, copper alloy, etc.

[0047] As shown in Figure 2(C), the metal plate may also have a coating layer 22 on its surface. The coating layer 22 may contain one or more materials selected from, for example, resin, ceramic, carbon, and metal.

[0048] As the resin, one or more types selected from fluororesins such as polytetrafluoroethylene (PTFE) and fluoroethylene propylene (FEP), as well as silicone rubber, silicone resin, polyimide, and polysulfone, can be used.

[0049] As for the ceramic, one or more types selected from aluminum oxide, zirconium oxide, silicon oxide, etc., can be used.

[0050] As for the carbon (carbon material), one or more types selected from carbon nanotubes, graphite, diamond-like carbon, etc., can be used.

[0051] The coating layer 22 may contain multiple types of materials, such as a composite of polyimide, polysulfone, and ceramic particles.

[0052] By having a coating layer 22 on its surface, the shielding member 12 can be made more durable and given new functions such as heat resistance and chemical resistance.

[0053] For example, the coating layer 22 can be made to contain fluororesin or ceramic to improve heat resistance and chemical resistance. The coating layer 22 can also be made to contain silicone rubber or silicone resin to improve durability and heat resistance, and to reduce friction with the packaging material laminate 11.

[0054] The coating layer 22 may be arranged to cover the entire surface of the shielding member 12, or, as shown in Figure 2(C), it may be arranged only on a part of the surface of the shielding member 12, such as the surface of the shielding member 12 that is irradiated with microwaves. Depending on the material and function of the coating layer 22, the portion of the shielding member 12 on which the coating layer 22 is placed can be selected. (1-2) Regarding support members For example, as shown in Figure 3, in the heating process, the support member 31 may be placed on the second surface 110B, which is the surface opposite to the first surface 110A of the packaging material laminate 11 that is irradiated with microwaves. The packaging material laminate 11 can also be sandwiched between the shielding member 12 and the support member 31. Figure 3 is a cross-sectional view along line AA in Figure 1(A), and, like Figure 2(A), etc., the microwave waveguide 20 and the end 20A of the waveguide 20 are also shown.

[0055] The support member 31 can be any member capable of supporting the packaging material laminate 11 or the shielding member 12, and its material is not particularly limited. For example, the support member 31 may have the same configuration as the shielding member 12 already described. In this case, the support member 31 may cover at least a portion of the non-joined region 14 of the packaging material laminate 11.

[0056] Since the support member 31 has the same configuration as the shielding member 12, it is possible to prevent microwaves reflected from the surface of a microwave irradiation chamber or the like from being irradiated from the second surface 110B of the packaging material laminate 11. In particular, by having the support member 31 cover at least a part of the non-jointed region 14, the amount of microwaves irradiated from the second surface 110B to the non-jointed region 14 can be reduced.

[0057] The shape and size of the support member 31 are not particularly limited and can be selected to support the packaging material laminate 11. The shape and size of the support member 31 may be selected to cover, for example, at least a portion of the non-joined area 14, or to cover, for example, the entire second surface 110B.

[0058] By performing the above heating process, the bonding region of the packaging material laminate 11 is heated, and the packaging material 111 and packaging material 112 contained in the packaging material laminate 11 can be bonded together.

[0059] During the heating process, while the packaging material laminate 11 is irradiated with microwaves, non-jointed areas 14 and the like of the packaging material laminate 11 other than the jointed areas 13 may be cooled as needed. The method of cooling the non-jointed areas 14 and the like is not particularly limited; the non-jointed areas 14 may be cooled by bringing a pipe circulating cooling water into contact with them, or by blowing cold air onto the non-jointed areas 14.

[0060] When manufacturing packaging, the heating process can be carried out in multiple stages. Specifically, for example, the heating process may be carried out to join only a portion of the joining area of ​​the packaging, then the contents may be filled into the packaging, and then the heating process may be carried out again to join the remaining joining area. In other words, the heating process can be carried out multiple times in the method of manufacturing packaging. (2) Other processes The packaging manufacturing method of this embodiment may also include any other steps besides the heating step, such as a pressurizing step or a placement step. (2-1) Pressurization process The packaging manufacturing method of this embodiment may further include a pressurizing step of pressurizing the packaging material laminate with respect to the joining region.

[0061] By performing a pressurizing process, the packaging material 111 and the packaging material 112 contained in the packaging material laminate 11 can be brought into close contact at the joining region and firmly bonded together.

[0062] The timing of the pressurization process is not particularly limited; the timing and duration can be selected to ensure sufficient bonding strength in the bonded area. The pressurization process may be performed so as to overlap with the heating process in some way, or it may be performed after the heating process. For example, the pressurization process may be started before the heating process begins, continued during the heating process, and ended after the heating process is completed.

[0063] In the pressurizing process, the packaging material laminate 11 can be pressurized along the lamination direction of the packaging materials contained within it. In the pressurizing process, the packaging material laminate 11 may also be pressurized in areas that are not joined. The method of pressurizing the packaging material laminate 11 in the pressurizing process is not particularly limited; for example, the packaging material laminate may be pressurized by passing it between rollers. In addition, in the pressurizing process, the packaging material laminate 11 may be pressurized using a shielding member 12, or it may be pressurized while heating it with a heat sealing bar. In the pressurizing process, the packaging material laminate 11 may be pressurized by multiple means; for example, the means of pressurizing may be changed midway through the pressurizing process.

[0064] If a pressurizing step is performed after a heating step, the packaging material laminate 11 may be heated again during the pressurizing step. In this case, since the pressurizing step is performed immediately after heating in the heating step, there is no need to heat it to an excessively high temperature, so for example, the pressurizing step may be performed by resistance heating. (2-2) Placement process In the placement step, the shielding member 12 can be placed on the packaging material laminate 11 so as to cover at least a portion of the non-bonded area 14. The placement step can be performed before the heating step.

[0065] The specific method of the placement process is not particularly limited, but for example, the shielding member 12 may be supplied along the transport path that is transporting the packaging material laminate 11 and placed so as to cover the non-joined area 14 of the packaging material laminate 11.

[0066] Alternatively, the shielding member 12 can be fixed in advance inside a chamber or the like that irradiates microwaves along the transport path of the packaging material laminate 11. The shielding member 12 may be positioned on the packaging material laminate 11 when the packaging material laminate 11 passes below the shielding member 12 or when the transport of the packaging material laminate 11 is stopped below the shielding member 12, when viewed along the direction of microwave irradiation. In this case, when the packaging material laminate 11 reaches a predetermined position relative to the shielding member 12, the transport of the packaging material laminate 11 may be temporarily stopped and the heating process may be performed by irradiating it with microwaves.

[0067] During the arrangement process, the distance between the shielding member 12 and the packaging material laminate 11 may be varied.

[0068] During the placement process, the support member 31 may also be placed on the packaging material laminate 11. (3) Packaging materials The packaging material used in the manufacturing method of the packaging body of this embodiment will now be described. Figures 4(A), 4(B), and 4(C) show cross-sectional views of the packaging material in a plane along the lamination direction of the layers.

[0069] The packaging material used in the method for manufacturing the package of the present embodiment can have a base material layer 41 and a sealant layer 42 as shown in the packaging material 400 in FIG. 4(A). (3-1) Base material layer The base material layer 41 can impart rigidity to the packaging material and the package manufactured using the packaging material, and can have a barrier property to prevent permeation of gas and liquid.

[0070] The base material layer 41 can contain, for example, one or more resins selected from polyolefins and polyesters.

[0071] As the polyolefin, for example, one or more selected from polyethylene, ultra-low density polyethylene, low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, polypropylene, etc. can be used. As the polyester, for example, polyethylene terephthalate can be used.

[0072] The density range of ultra-low density polyethylene and the like in this specification will be described. The density of ultra-low density polyethylene is less than 0.900 g / cm 3 The density of low density polyethylene is 0.900 g / cm 3 or more and less than 0.925 g / cm 3 The density of linear low density polyethylene is 0.900 g / cm 3 or more and less than 0.925 g / cm 3 The density of medium density polyethylene is 0.925 g / cm 3 or more and less than 0.945 g / cm 3 The density of high density polyethylene is above 0.945 g / cm 3 or 0.945 g / cm 3 or more and 0.980 g / cm 3 or less.

[0073] The polyethylene resin is not limited to petroleum-derived materials, and may be partially or entirely derived from bio-based resin materials. Examples of bio-based resin materials include biomass polyethylene, which uses biomass-derived ethylene as a raw material. A method for producing biomass-derived polyethylene is disclosed, for example, in Japanese Patent Publication No. 2010-511634. The polyethylene resin may also include commercially available biomass polyethylene (such as Green PE manufactured by Braschem). The polyethylene resin may also include mechanically recycled polyethylene, which uses used polyethylene products or resins such as burrs generated during the manufacturing process of polyethylene products as raw materials. The above description of the polyethylene resin is the same for other layers besides the base layer 41.

[0074] The base layer 41 may further contain additives such as antistatic agents, ultraviolet absorbers, plasticizers, lubricants, colorants, antiblocking agents, antioxidants, flame retardants, inorganic fillers, organic fillers, dyes, and pigments. Other layers described below may also contain the above additives other than resin. (3-2) Sealant layer The sealant layer 42 is a layer that can be melted by heat and welded to other components. In other words, the sealant layer 42 is a heat-sealable layer. For this reason, when packaging materials are laminated and subjected to a heating process as a laminate of packaging materials, the sealant layers may be arranged to face each other in the joining region of the packaging materials to be joined.

[0075] The sealant layer 42 may contain one or more resins selected from, for example, polyolefins, ethylene-acrylic copolymers, ethylene glycol-methacrylic acid copolymers, ethylene-vinyl acetate copolymers, and the like.

[0076] Examples of polyolefins include one or more selected from polyethylene, ultra-low density polyethylene, low density polyethylene, linear low density polyethylene, medium density polyethylene, polypropylene, ionomer polyethylene, and the like. (3-3) Adhesive layer For example, as shown in Figure 4(B), the packaging material 401 may also have an adhesive layer 43 between the base layer 41 and the sealant layer 42.

[0077] The adhesive layer 43 can bond together each layer of the packaging material.

[0078] Regarding the adhesive layer 43, a polyurethane-based adhesive can be used as the adhesive, from the viewpoint of providing a layer with excellent flexibility and bendability. The adhesive layer 43 may include an adhesive whose main component is one or more selected from, for example, polyether polyurethane resin, polyester polyurethane resin, and polyacrylate polyurethane resin.

[0079] The packaging material may be manufactured by a known lamination method, such as a dry lamination method, in which a sealant film and a base film are bonded together via an adhesive layer. The dry lamination method may be a non-solvent dry lamination method using a solvent-free adhesive. However, the packaging material may also be manufactured by a method in which the sealant film is directly extruded onto the base material and laminated.

[0080] Furthermore, from the viewpoint of improving recyclability, the resins in each layer of the packaging material may be polyolefin-based, and the adhesive layer 43 may also be a polyolefin-based adhesive resin. Examples of polyolefin-based adhesive resins include acid-modified polypropylene resins and acid-modified polyethylene resins.

[0081] Examples of acid-modified polypropylene resins include maleic anhydride graft-modified polypropylene resins. Maleic anhydride graft-modified polypropylene resins are resins in which polypropylene resins are graft-modified with maleic anhydride.

[0082] Examples of polypropylene resins include homopolypropylene, block polypropylene, random polypropylene, and propylene-α-olefin copolymers. Examples of α-olefins include ethylene and 1-butene.

[0083] Examples of acid-modified polyethylene resins include maleic anhydride graft-modified polyethylene resins. Maleic anhydride graft-modified polyethylene resins are resins in which polyethylene resins are graft-modified with maleic anhydride.

[0084] Polyethylene resins include high-density polyethylene, medium-density polyethylene, low-density polyethylene, and linear low-density polyethylene obtained by copolymerizing ethylene and α-olefins. Examples of α-olefins include ethylene, 1-butene, and 1-hexane. (3-4) Gas barrier film For example, as shown in Figure 4(C), the packaging material 402 may also have a gas barrier film 44. The gas barrier film 44 can be bonded to the substrate layer 41 or the sealant layer 42 by an adhesive layer 43.

[0085] The gas barrier film 44 may have, for example, a barrier substrate layer 441 and a barrier layer 442.

[0086] The barrier substrate layer 441 may include the materials described for the substrate layer 41.

[0087] The barrier layer 442 has the function of reducing the permeation of oxygen and water vapor, thereby improving the storage stability of the contents. The barrier layer 442 may contain, for example, an inorganic oxide, or one or more selected from aluminum oxide and silicon oxide.

[0088] The barrier layer 442 may be, for example, a deposited layer of an inorganic oxide. That is, the barrier layer 442 may be formed on the surface of the barrier substrate layer 441 by a deposition method such as physical vapor deposition or chemical vapor deposition.

[0089] Furthermore, the barrier layer 442 may contain a metal instead of, or in addition to, the inorganic oxide. As the metal, one or more types selected from aluminum, stainless steel, etc., can be used. The barrier layer 442 may also have a layer of inorganic oxide and a layer of metal.

[0090] The barrier layer 442 may include a barrier-type overcoat layer formed by coating methods such as roll coating, gravure roll coating, kiss coating, etc., or printing methods such as gravure printing, offset printing, transfer printing, etc. As the overcoat layer, a gas barrier coating film containing a resin composition of a metal alkoxide and a water-soluble polymer may be used. Alternatively, as the overcoat layer, a silane coupling agent may be added to a mixture of a metal alkoxide and a water-soluble polymer to form a gas barrier coating film containing these resin compositions. (3-5) Printing layer The packaging material may also have additional printing layers between the base layer 41 and the sealant layer 42, or on the surface of the base layer 41 opposite to the surface facing the sealant layer 42. The packaging material may also have multiple printing layers.

[0091] The printed layer includes images consisting of characters, patterns, symbols, and combinations thereof. The printed layer can be formed using printing methods such as gravure printing, offset printing, and flexographic printing.

[0092] The packaging material used in the packaging manufacturing method of this embodiment may also have any additional layers, such as a heat-resistant layer, a coating layer, or an anchor coating layer, in addition to the base layer, sealant layer, adhesive layer, gas barrier film, and printing layer described above.

[0093] Furthermore, the packaging material can be configured to have multiple layers of each layer, such as the sealant layer 42 and the adhesive layer 43, depending on the required properties. For example, it may have two or more layers of sealant layer 42. (3-6) Microwave Absorbing Materials The packaging material may also include a microwave-absorbing material, which is a material that absorbs microwaves and generates heat.

[0094] The microwave-absorbing material may be present in particulate form in any of the layers of the packaging material. In this case, the microwave-absorbing material may be present in only one layer of the packaging material, or in multiple layers. For example, the sealant layer 42, which is required to reach a particularly high temperature compared to other layers during the heating process, or a layer adjacent to the sealant layer 42, may contain the microwave-absorbing material. From the viewpoint of increasing productivity when manufacturing the packaging material, it is preferable that the microwave-absorbing material is added to the entire layer to which it is added.

[0095] Furthermore, the microwave-absorbing material may be arranged in the form of a film. Specifically, for example, a film of the microwave-absorbing material may be placed on the surface of the substrate layer 41 facing the sealant layer 42, or on the surface of the sealant layer 42.

[0096] The microwave absorbing material can be selected according to the frequency of the microwaves used in the heating process and the temperature to be heated in the heating process, and is not particularly limited. As the microwave absorbing material, one or more types selected from, for example, zinc oxide, silicon carbide, titanium oxide, barium titanate, barium zirconate titanate, lead titanate, potassium niobate, hydrated aluminum silicate, inorganic materials having crystal water such as alkali metal hydrated aluminosilicates, and inorganic materials having crystal water such as alkaline earth metal hydrated aluminosilicates can be used.

[0097] The crystal structure of titanium dioxide is not particularly limited; for example, it may be anatase or rutile.

[0098] In this specification, alkali metals include one or more selected from lithium (Li), sodium (Na), potassium (K), rubidium (Rb), cesium (Cs), and francium (Fr). Alkaline earth metals are used in a broad sense and include one or more selected from beryllium (Be), magnesium (Mg), calcium (Ca), strontium (Sr), barium (Ba), and radium (Ra). (4) Regarding packaging The packaging manufacturing method of this embodiment allows for the production of various types of packaging, such as sachets, gussets, three-sided pouches, four-sided pouches, standing pouches, retort pouches, tubes such as laminated tubes, and pillow packaging, by joining packaging materials at the joining region. The packaging of this embodiment may further have a spout or a zipper.

[0099] As shown in Figure 5, a bag-shaped package 51 can be formed by joining packaging material 111 and packaging material 112 at the joining region 52. Contents 53 can be placed inside the package 51 to form a packaged product 50. Figure 5 is a cross-sectional view of the packaged product 50 along a plane passing through its center.

[0100] The shape of the packaging obtained by the packaging manufacturing method of this embodiment is not limited to the form shown in Figure 5, and can have any shape depending on the application. Furthermore, the contents to be filled into the packaging can include food, liquids, pharmaceuticals, electronic components, and the like. [Packaging manufacturing equipment] An example of the configuration of the packaging manufacturing apparatus of this embodiment will be described with reference to Figures 6, 7, and 8. Since Figures 7 and 8 are modified examples of the packaging manufacturing apparatus, the explanation will mainly use Figure 6, and Figures 7 and 8 will be used as needed. The packaging manufacturing apparatus of this embodiment can be used to carry out a packaging manufacturing method according to one aspect of this disclosure. For this reason, some explanations of matters already described will be omitted.

[0101] As shown in Figure 6, the packaging manufacturing apparatus 60 of this embodiment may include a heating device 600 that includes an oscillator 63 that emits microwaves, and a shielding member installation device 65.

[0102] The following describes each device. (1)Heating device The heating device 600 can heat the bonding areas of the packaging material laminate 11 by irradiating microwaves onto the packaging material laminate 11, which is made up of multiple layers of packaging material, namely packaging material 111 and packaging material 112.

[0103] The heating device 600 may include a chamber 61, an oscillator 63 that emits microwaves, and a waveguide 62 that transmits the microwaves emitted by the oscillator 63 to the chamber 61.

[0104] The chamber 61 may have an opening 610 for loading and unloading the packaging material laminate 11. The size of the opening 610 should preferably be selected to prevent microwaves transmitted into the chamber 61 from leaking to the outside.

[0105] The shape and material of the chamber 61 are not particularly limited. Furthermore, if the end of the waveguide 62 and the packaging material laminate 11 are in close proximity to prevent microwave leakage to the outside, the heating device 600 does not need to have a chamber 61.

[0106] Therefore, as shown in Figures 7 and 8, for example, the packaging manufacturing apparatus 70 and packaging manufacturing apparatus 80, the heating device 700 does not need to have a chamber 61. In this case, the heating device 700 can have an oscillator 63 and a waveguide 62.

[0107] Furthermore, a chamber or the like may be provided to cover the entire packaging manufacturing apparatus. In this case, the chamber or the like may have an opening for loading and unloading the packaging material laminate 11, and the heating device 700 may have an oscillator 63 and a waveguide 62, and may also be equipped with a known horn antenna.

[0108] The waveguide 62 only needs to be able to transmit microwaves, and can be made of materials such as metal. If the waveguide 62 is a metal tube, a ceramic window that can transmit microwaves may be provided at the end of the waveguide 62 as needed to prevent foreign matter from entering the waveguide. A coaxial cable or other electrical wire may be used for part or all of the waveguide 62.

[0109] The oscillator 63 can be selected according to the microwave frequency used, but for example, one or more types selected from gyrotrons, magnetrons, klystrons, traveling wave tubes, etc. may be used. The oscillator 63 may be equipped with a control device (not shown) to control the microwave frequency and output. (2) Shielding member installation device The shielding member installation device 65 can install a shielding member 12 that reduces microwave transmission so as to cover at least a portion of the non-jointed areas of the packaging material laminate 11 other than the jointed areas.

[0110] The shielding member installation device 65 only needs to be able to install the shielding member 12 so as to cover at least a portion of the non-jointed areas of the packaging material laminate 11 other than the jointed areas when microwaves are irradiated, and its configuration is not particularly limited.

[0111] The shielding member installation device 65 can, for example, install the shielding member 12 on the packaging material laminate 11 upstream of the chamber 61, which is the area irradiated with microwaves, or inside the chamber 61, in the transport direction of the packaging material laminate 11. The shielding member installation device 65 may also recover the shielding member 12 downstream of the chamber 61, which is the area irradiated with microwaves, in the transport direction of the packaging material laminate 11, and reuse it.

[0112] The shielding member installation device 65 may simply place the shielding member 12 on the packaging material laminate 11, or it may be possible to sandwich the packaging material laminate 11 between the support member 31 and the shielding member 12 as described in Figure 3, and install the shielding member 12 on the packaging material laminate 11.

[0113] Furthermore, the shielding member installation device 65 may have a shielding member 12 fixed in an area irradiated with microwaves, such as inside the chamber 61. By fixing the shielding member 12 inside the chamber 61, the shielding member 12 can be positioned so as the packaging material laminate 11 passes below the shielding member 12, covering at least a portion of the non-jointed area.

[0114] Furthermore, as shown in the packaging manufacturing apparatus 70 in Figure 7, the shielding member installation device 75 may be configured to allow the shielding member 12 to move along the double-headed arrow C in the area irradiated with microwaves. By moving the shielding member 12 along the double-headed arrow C, the distance between the shielding member 12 and the packaging material laminate 11 can be increased while the packaging material laminate 11 is being transported, preventing the shielding member 12 from coming into contact with the packaging material laminate 11 and causing damage. After a predetermined area of ​​the packaging material laminate 11 reaches the area irradiated with microwaves and the transport of the packaging material laminate 11 is stopped, the shielding member installation device 75 can move the shielding member 12 to shorten the distance between the shielding member 12 and the packaging material laminate 11. This allows a portion of the packaging material laminate 11 to be covered by the shielding member 12, reducing the amount of microwaves irradiated onto the surface of the packaging material laminate 11. After irradiating with microwaves and heating, the shielding member installation device 75 may move the shielding member 12 to increase the distance between the shielding member 12 and the packaging material laminate 11.

[0115] As shown in Figure 7, the packaging manufacturing apparatus 70 may be configured such that the support member 31 is placed on the side of the packaging material laminate 11 opposite to the side on which the shielding member 12 is placed, and the shielding member installation device 75 moves the support member 31 together with the shielding member 12. The shielding member installation device 75 can move the support member 31 along the double arrow D, for example.

[0116] As shown in Figure 7, while the packaging material laminate 11 is being transported, the shielding member installation device 75 may increase the distance between the shielding member 12 and the support member 31 and the packaging material laminate 11. This prevents the shielding member 12 and the support member 31 from coming into contact with the packaging material laminate 11 and being damaged. After a predetermined area of ​​the packaging material laminate 11 reaches the area irradiated with microwaves and the transport of the packaging material laminate 11 is stopped, the shielding member installation device 75 can move the shielding member 12 and the support member 31. In this case, the distance between the shielding member 12 and the support member 31 may be shortened to sandwich the packaging material laminate 11. This covers a portion of the upper and lower surfaces of the packaging material laminate 11 with the shielding member 12 and the support member 31, reducing the amount of microwaves irradiated to the non-jointed areas of the packaging material laminate 11. After irradiating with microwaves and heating, the shielding member installation device 75 may move the shielding member 12 and the support member 31 to increase the distance between the shielding member 12 and the support member 31 and the packaging material laminate 11.

[0117] If the packaging manufacturing apparatus 70 has a support member 31, the support member 31 may be driven by a device other than the shielding member installation device 75.

[0118] The configuration of the shielding member installation device 75 is not particularly limited, but it may include, for example, a motor or cylinder or other drive device for linearly moving the shielding member 12 and the support member 31. The shielding member installation device 75 may also have guides as needed.

[0119] Since the shielding member 12 and the support member 31 have already been explained, their explanation will be omitted here.

[0120] The heating device may, if necessary, include a cooling device for cooling non-jointed areas other than the jointed area in the microwave irradiation area, such as inside the chamber 61. The cooling device may consist of piping that circulates cooling water in contact with the non-jointed area 14, etc., or it may be designed to blow cold air. It may also be designed to cool the temperature inside the chamber 61 and the microwave irradiation area. (3) Pressurizing device The packaging manufacturing apparatus of this embodiment may further include a pressurizing device 64 for pressurizing the laminated packaging material in the joining region.

[0121] By applying pressure to the joining area with the pressurizing device 64, the packaging material 111 and the packaging material 112 contained in the packaging material laminate 11 can be brought into close contact at the joining area and firmly joined.

[0122] The pressurizing device 64 may, for example, be configured to pressurize the packaging material laminate 11 by passing it between rollers, as shown in Figure 6. The pressurizing device 64 may also have a heating device to heat the packaging material laminate 11 if necessary.

[0123] Furthermore, as shown in Figure 7, for example, a heat seal bar can be used as the pressurizing device 74. A heat seal bar, also known as a heat sealer, is a device that can pressurize and heat the joining region of the packaging material laminate 11 using upper and lower seal bars. By using a heat seal bar, it is possible to easily pressurize along the joining region of the packaging material laminate 11 and heat it at the same time.

[0124] Furthermore, as shown in the packaging manufacturing apparatus 80 in Figure 8, the pressurizing device 84 may be installed within the area irradiated with microwaves. In this case, the pressurizing device 84 may have a pair of plate-like bodies 841 and a drive device 842 that changes the distance between the pair of plate-like bodies 841. When pressurizing is performed by the pressurizing device 84, the drive device 842 shortens the distance between the pair of plate-like bodies 841, allowing the laminated packaging material to be sandwiched and pressurized. After pressurizing is complete, the pressurizing device 84 can use the drive device 842 to increase the distance between the pair of plate-like bodies 841, making it possible to transport the laminated packaging material 11.

[0125] The configuration of the drive unit 842 is not particularly limited, but it may include, for example, a motor or cylinder for linearly moving a pair of plate-shaped bodies 841. The drive unit 842 may also have guides as needed.

[0126] The pair of plate-like bodies 841 can be formed from, for example, a material that can transmit microwaves, such as resin or glass. Alternatively, the pair of plate-like bodies 841 may be formed from metal and have through holes that can transmit microwaves.

[0127] Therefore, by applying microwave irradiation while the packaging material laminate 11 is pressurized by a pair of plate-like bodies 841, pressurization and heating can be performed simultaneously on the bonding region of the packaging material laminate 11.

[0128] In the packaging manufacturing apparatus 80 shown in Figure 8, the pair of plate-shaped bodies 841 in the pressurizing device 84 may be integrated with a shielding member 12 and a support member 31, and pressurization may be performed by the shielding member 12 and the support member 31. In Figure 8, due to space limitations, an example of a single pressurizing device 84 is shown, but multiple pressurizing devices 84 may be installed depending on the size of the joining area, etc. Furthermore, the packaging manufacturing apparatus 80 shown in Figure 8 may also have pressurizing devices 64 and 74, as shown in Figures 6 and 7, outside the area irradiated with microwaves, and pressurization may be performed in multiple stages.

[0129] Examples of embodiments of the present disclosure are as follows: <1> The process includes a heating step in which microwaves are irradiated onto a laminate of packaging materials, which is formed by stacking multiple sheets of packaging material, to heat the bonding region of the laminate of packaging materials. A method for manufacturing a package, wherein the heating step is carried out with a shielding member installed to reduce the transmission of microwaves so as to cover at least a portion of the non-bonded areas of the laminated packaging material other than the bonded areas. <2> The shielding member is the metal plate material. <1> A method for manufacturing the packaging described above. <3> The corners of the aforementioned plate material are beveled. <2> A method for manufacturing the packaging described above. <4> The aforementioned plate material has a coating layer on its surface containing one or more materials selected from resin, ceramic, carbon, and metal. <2> or <3> A method for manufacturing the packaging described above. <5> The shielding member is installed so as to cover a part of the joint area, and the portion of the shielding member that covers the joint area is provided with through holes that allow the microwaves to pass through. <1> ~ <4> A method for manufacturing a package as described in any of the following. <6> The bonding region further comprises a pressing step of pressing the packaging material laminate, <1> ~ <5> A method for manufacturing a package as described in any of the following. <7> A heating device that irradiates a laminate of multiple layers of packaging material with microwaves to heat the bonding area of ​​the laminate of packaging material, A packaging manufacturing apparatus comprising: a shielding member installation device for installing a shielding member that reduces the transmission of microwaves so as to cover at least a portion of the non-jointed areas of the packaging material laminate other than the jointed areas. [Explanation of Symbols]

[0130] 11 Packaging material laminate 110A 1st page 110B 2nd side L11 width 111 Packaging materials 112 Packaging materials 11A side 11B side 11C edge 11D edge 12 Shielding member T12 Thickness 120 corner 121 Through hole D121 Inner diameter 13 Joint area 14 Non-bonded area 20 Waveguide 20A end 21 gaps 22 Coat Layers 31 Support member 400 Packaging materials 401 Packaging materials 402 Packaging materials 41 Base material layer 42. Sealant layer 43 Adhesive layer 44 Gas barrier film 441 Barrier substrate layer 442 Barrier layer 50 packaging products 51 Packaging 52 Joint area 53 Contents 60 Packaging manufacturing equipment 70 Packaging manufacturing equipment 80 Packaging manufacturing equipment 600 Heating device 700 Heating device 61 Chamber (heating device) 610 Opening 62 Waveguide (heating device) 63 Oscillator (heating device) 64 Pressurizing device 74 Pressurizing device 84 Pressurizing device 841 Plate-like body 842 Drive unit 65 Shielding Member Installation Device 75 Shielding Member Installation Device C Double arrow D Double arrow

Claims

1. The process includes a heating step in which microwaves are irradiated onto a laminate of packaging materials, which is formed by stacking multiple sheets of packaging material, to heat the bonding region of the laminate of packaging materials. A method for manufacturing a package, wherein the heating step is carried out with a shielding member installed to reduce the transmission of microwaves so as to cover at least a portion of the non-bonded areas of the laminated packaging material other than the bonded areas.

2. The method for manufacturing a package according to claim 1, wherein the shielding member is a metal plate.

3. The method for manufacturing a packaging body according to claim 2, wherein the corners of the plate material are chamfered.

4. The method for manufacturing a package according to claim 2, wherein the plate material has a coating layer on its surface containing one or more selected from resin, ceramic, carbon, and metal.

5. The method for manufacturing a package according to any one of claims 1 to 4, wherein the shielding member is installed so as to cover a part of the joining area, and the portion of the shielding member that covers the joining area is provided with through holes that transmit microwaves.

6. A method for manufacturing a package according to any one of claims 1 to 4, further comprising a pressurizing step of pressurizing the laminate of the packaging material with respect to the bonding region.

7. A heating device that irradiates a laminate of multiple layers of packaging material with microwaves to heat the bonding area of ​​the laminate of packaging material, A packaging manufacturing apparatus comprising: a shielding member installation device for installing a shielding member that reduces the transmission of microwaves so as to cover at least a portion of the non-jointed areas of the packaging material laminate other than the jointed areas.

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