Resin composition, adhesive member, and electronic device including adhesive member

Abstract

The present invention provides a resin composition that exhibits excellent dispensing properties and high adhesive properties after curing, as well as an adhesive member made from the resin composition. [Solution] The resin composition of one embodiment may comprise at least one monofunctional (meth)acrylate compound, at least one dendritic (meth)acrylate copolymer, and at least one photopolymerization initiator. The resin composition may have a shear viscosity of 50 mPa·s or less measured at 25°C, and the value obtained by dividing the maximum value in the apparent extensional viscosity-Henky strain curve measured at 25°C by the shear viscosity may be 30 or less. As a result, the resin composition may exhibit properties that facilitate dispensing, and the adhesive member made of the resin composition may exhibit properties that provide high adhesive reliability at room temperature and high temperatures.

Description

Technical Field

[0001] The present invention relates to a resin composition, an adhesive member made of the resin composition, and an electronic device including the adhesive member.

Background Art

[0002] A variety of display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, game machines, etc. have been developed. In particular, recently, in order to facilitate portability and improve user convenience, developments have been made on display devices that can be folded, bent, or wound using a flexible display member that can be bent. The adhesive resin used to form an adhesive layer applied to display devices of various shapes needs to have excellent dischargeability with respect to members of various forms of display devices.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to provide a resin composition having excellent dischargeability and exhibiting high adhesive properties after curing, and an adhesive member made of the resin composition.

[0004] Another object of the present invention is to provide an electronic device including an adhesive member having high adhesive properties.

Means for Solving the Problems

[0005] One embodiment provides a resin composition including at least one monofunctional (meth)acrylate compound, at least one dendritic (meth)acrylate copolymer, and at least one photoinitiator, having a shear viscosity measured at 25°C of 50 mPa·s or less, and a value obtained by dividing the maximum value in the apparent extensional viscosity-Hencky Strain curve measured at 25°C by the shear viscosity of 30 or less.

[0006] Based on the total weight of the resin composition, the weight of the dendritic (meth)acrylate copolymer may be 4 wt% or more and 10 wt% or less.

[0007] The weight-average molecular weight of the dendritic (meth)acrylate copolymer may be between 20,000 and 40,000.

[0008] The glass transition temperature of the dendritic (meth)acrylate copolymer may be between -20°C and 120°C.

[0009] The monofunctional (meth)acrylate compound may include at least one of 4-hydroxybutyl acrylate (4-HBA), isodecyl acrylate (IDAA), tetrahydrofurfuryl acrylate (THF-A), and isobornyl acrylate (IBXA).

[0010] The resin composition may result in the maximum value of the apparent extensional viscosity-Henkey strain curve measured at 25°C being 200 mPa·s or less.

[0011] The aforementioned resin composition may be provided by an inkjet printing method.

[0012] One embodiment provides an adhesive member comprising a polymer derived from a resin composition comprising at least one monofunctional (meth)acrylate compound, at least one dendritic (meth)acrylate copolymer, and at least one photopolymerization initiator, wherein the shear viscosity measured at 25°C is 50 mPa·s or less, and the value obtained by dividing the maximum value in the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity is 30 or less.

[0013] The adhesive member may have a 180° peel force of 1500 gf / 25 mm or more on a glass substrate at 25°C.

[0014] The adhesive member may have a 180° peel force of 500 gf / 25 mm or more on a glass substrate at 60°C.

[0015] The adhesive member may be manufactured by applying the resin composition onto a substrate and irradiating the applied resin composition with ultraviolet light having an integrated irradiance of 900 mW for UVA and UVV and an integrated light amount of 1000 mJ.

[0016] The adhesive member may have a glass transition temperature of -25°C or higher and 20°C or lower.

[0017] Based on the total weight of the resin composition, the weight of the dendritic (meth)acrylate copolymer may be 4 wt% or more and 10 wt% or less.

[0018] The weight-average molecular weight of the dendritic (meth)acrylate copolymer may be between 20,000 and 40,000.

[0019] The maximum value of the apparent extensional viscosity-Henkey strain curve measured at 25°C for the aforementioned resin composition may be 200 mPa·s or less.

[0020] One embodiment provides an electronic device comprising a display module, a window disposed on the display module, and an adhesive member disposed between the display module and the window, wherein the adhesive member comprises a polymer derived from a resin composition comprising at least one monofunctional (meth)acrylate compound, at least one dendritic (meth)acrylate copolymer, and at least one photopolymerization initiator, the resin composition having a shear viscosity of 50 mPa·s or less measured at 25°C, and a value of 30 or less obtained by dividing the maximum value in the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity.

[0021] The adhesive member may have a 180° peel force of 1500 gf / 25 mm or more on a glass substrate at 25°C.

[0022] The adhesive member may have a 180° peel force of 500 gf / 25 mm or more on a glass substrate at 60°C.

[0023] The electronic device includes at least one folding region, and the radius of curvature of the folding region can be 5 mm or less.

[0024] The electronic device may further include at least one of a processor, a memory, and a power module.

Advantages of the Invention

[0025] The resin composition of one embodiment includes a dendritic (meth)acrylate copolymer and can be cured in a short time and exhibit excellent discharge properties.

[0026] The adhesive member of one embodiment includes a polymer derived from the resin composition of one embodiment and can exhibit excellent adhesive properties at room temperature and high temperature.

[0027] The electronic device of one embodiment includes the adhesive member of one embodiment and can exhibit excellent reliability.

Brief Description of the Drawings

[0028] [Figure 1] It is a block diagram of an electronic device according to one embodiment. [Figure 2] It is a schematic diagram of an electronic device according to various embodiments. [Figure 3a] It is a perspective view showing an electronic device of one embodiment. [Figure 3b] It is a perspective view showing an electronic device of one embodiment. [Figure 3c] It is a plan view showing a display device of one embodiment. [Figure 3d] It is a perspective view showing an electronic device of one embodiment. [Figure 4] It is an exploded perspective view showing a display device of one embodiment. [Figure 5] It is a cross-sectional view showing a portion corresponding to the line I-I' in FIG. 4. [Figure 6] It is a cross-sectional view showing a part of a display module according to one embodiment. [Figure 7a] It is a diagram showing a method of manufacturing an adhesive member of one embodiment. [Figure 7b]This figure shows a method for manufacturing an adhesive member according to one embodiment. [Figure 7c] This figure shows a method for manufacturing an adhesive member according to one embodiment. [Figure 7d] This figure shows a method for manufacturing an adhesive member according to one embodiment. [Figure 8] This is a cross-sectional view showing a display device in one embodiment. [Figure 9] This graph shows the apparent extensional viscosity for different Henkey strains in the examples and comparative examples. [Modes for carrying out the invention]

[0029] Because the present invention can be modified in various ways and take on various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this should be understood not as an attempt to limit the present invention to any particular disclosure, but rather as including all modifications, equivalents, or substitutes that fall within the spirit and technical scope of the present invention.

[0030] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on top of," "connected to," or "joined" another component, it means that it can be directly placed on top of, connected to, or joined to the other component, or that a third component can be placed between them.

[0031] The same drawing symbol refers to the same component. Furthermore, in drawings, the thickness, proportions, and dimensions of components are exaggerated for the sake of effective explanation of the technical content. "and / or" includes all combinations of one or more components defined by the relevant component.

[0032] Terms such as "first," "second," etc., are used to describe a variety of components, but the components are not limited to those defined by these terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. A singular expression includes plural expressions unless the context clearly indicates otherwise.

[0033] Furthermore, terms such as "down," "on the lower side," "up," and "on the upper side" are used to describe the relationships between the components shown in the drawing. These terms are relative concepts and are described in relation to the direction shown in the drawing.

[0034] Terms such as "includes" or "possesses" indicate the presence of features, figures, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood not to pre-exist to exclude the presence or possibility of adding one or more other features, figures, steps, actions, components, parts, or combinations thereof.

[0035] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art in the field to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries should be interpreted as having the same meaning as they do in the context of the relevant art, and should not be interpreted in an overly idealistic or formal sense unless expressly defined herein.

[0036] The following describes a resin composition according to one embodiment of the present invention, an adhesive member according to one embodiment, and a display device containing the same. The display device according to one embodiment can be applied to a variety of electronic devices. The electronic device according to one embodiment includes a display device and may further include modules or devices having other additional functions besides the display device.

[0037] Figure 1 is a block diagram of an electronic device according to one embodiment. Referring to Figure 1, the electronic device EA according to one embodiment may include a display module DM, a processor PR, a memory MR, and a power supply module PM.

[0038] A processor PR may include at least one of the following: a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), or a controller.

[0039] Memory MR can store data information necessary for the operation of the processor PR and the display module DM. When the processor PR executes an application stored in memory MR, video data signals and / or input control signals are transmitted to the display module DM, which processes the provided signals and can output video information via the display screen.

[0040] The power module PM may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power necessary for the operation of the electronic device EA.

[0041] At least one of the components of the electronic device EA described above may be included in the display device according to the embodiment described above. Furthermore, some of the individual modules functionally contained within a single module may be included in the display device, while others may be provided separately from the display device. For example, the display device may include a display module DM, while the processor PR, memory MR, and power supply module PM may be provided in the form of other devices within the electronic device EA rather than in the display device.

[0042] Figure 2 is a schematic diagram of an electronic device according to various embodiments. Referring to Figure 2, the various electronic devices to which the display devices according to the embodiments are applied may include not only image display electronic devices such as smartphones EA_1a, tablet PCs EA_1b, laptops EA_1c, televisions EA_1d, and desk monitors EA_1e, but also wearable electronic devices including display modules such as smart glasses EA_2a, head-mounted displays EA_2b, and smartwatches EA_2c, and automotive electronic devices EA_3 including display modules such as CIDs (Center Information Displays) and rearview mirror displays located on the instrument panel, center fascia, and dashboard of an automobile.

[0043] Figure 3a is an expanded perspective view of an electronic device EA according to one embodiment. The electronic device EA in one embodiment may be a device activated by an electrical signal. For example, the electronic device EA may be, but is not limited to, a mobile phone, tablet, car navigation system, game console, or wearable device. In Figure 3a and other figures, the electronic device EA is shown as a mobile phone as an example.

[0044] The electronic device EA may include a first display surface FS defined by a first directional axis DR1 and a second directional axis DR2 intersecting the first directional axis DR1. The electronic device EA may provide video IM to the user via the first display surface FS. The electronic device EA may display video IM in the direction of a third directional axis DR3 on the first display surface FS, which is parallel to the first directional axis DR1 and the second directional axis DR2, respectively.

[0045] In this specification, the first directional axis DR1 and the second directional axis DR2 are orthogonal to each other, and the third directional axis DR3 may be the normal direction to the plane defined by the first directional axis R1 and the second directional axis DR2. The thickness direction of the electronic device EA may be aligned with the third directional axis DR3. The front (or top) and back (or bottom) surfaces are opposite each other along the third directional axis DR3, and the normal directions of the front (or top) and back (or bottom) surfaces, respectively, may be parallel to the third directional axis DR3. The front (or top) surface means the surface adjacent to the first display surface FS, and the back (or bottom) surface means the surface separated from the first display surface FS. Alternatively, the back (or bottom) surface means the surface close to the second display surface RS, which will be described later. The upper side means the direction approaching the first display surface FS, and the lower side means the direction away from the first display surface FS.

[0046] A cross-section refers to a plane aligned with the thickness direction DR3, while a plane refers to a plane perpendicular to the thickness direction DR3. A plane refers to the plane defined by the first directional axis DR1 and the second directional axis DR2.

[0047] The directions indicated by the first to third directional axes DR1, DR2, and DR3 described herein are relative concepts and can be converted to other directions. Furthermore, the directions indicated by the first to third directional axes DR1, DR2, and DR3 are referred to as the first to third directions, and the same drawing reference numerals may be used.

[0048] The electronic device EA senses external inputs applied from the outside. These external inputs include various forms of input provided from outside the electronic device EA. For example, external inputs include contact by a part of the user's body, such as their hand, as well as external inputs applied from close proximity to the electronic device EA or adjacent at a certain distance (e.g., hovering). Furthermore, external inputs can take various forms, such as force, pressure, temperature, and light.

[0049] The electronic device EA may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS may be defined as a surface facing at least a portion of the first display surface FS. In other words, the second display surface RS may be defined as a portion of the rear surface of the electronic device EA.

[0050] The first active region F-AA may be a region that is activated by an electrical signal. The first active region F-AA may be a region where video IM is displayed and where various forms of external input can be sensed.

[0051] The first peripheral region F-NAA may be adjacent to the first active region F-AA. The first peripheral region F-NAA may have several colors. The first peripheral region F-NAA may surround the first active region F-AA. Thus, the shape of the first active region F-AA may be substantially defined by the first peripheral region F-NAA. However, this is illustrative, and the first peripheral region F-NAA may be located on only one side of the first active region F-AA, or may be omitted.

[0052] A variety of electronic modules can be arranged in the electronic module area (EMA). For example, an electronic module may include at least one of a camera, speaker, light sensor, and thermal sensor. The electronic module area (EMA) may sense external objects received via the display surface FS, RS, or provide audio signals, such as sound, to the outside via the display surface FS, RS. An electronic module may include multiple configurations and is not limited to any one embodiment.

[0053] The electronic module region (EMA) may be surrounded by the first peripheral region (F-NAA). However, this is illustrative and not limited to any one embodiment. For example, the electronic module region (EMA) may be surrounded by the first active region (F-AA) and the first peripheral region (F-NAA), and the electronic module region (EMA) may be located within the first active region (F-AA).

[0054] An electronic device EA in one embodiment may be a flexible electronic device. An electronic device EA in one embodiment may include at least one folding region FA and a plurality of non-folding regions NFA1, NFA2 extending from the folding region FA. For example, a first non-folding region NFA1, a folding region FA, and a second non-folding region NFA2 may be defined along a second direction DR2. An electronic device EA in one embodiment may include a first non-folding region NFA1 and a second non-folding region NFA2 separated from each other in the second direction DR2 with the folding region FA in between. For example, the first non-folding region NFA1 may be located on one side of the folding region FA along the second direction DR2, and the second non-folding region NFA2 may be located on the other side of the folding region FA along the second direction DR2.

[0055] Figure 3a and others show one embodiment of an electronic device EA that includes one folding region FA, but the examples are not limited to this, and multiple folding regions can be defined in an electronic device EA. For example, the electronic device according to one embodiment may include three or more folding regions, and may also include two or more non-folding regions arranged between the folding regions.

[0056] Figure 3b is a perspective view showing the folding operation of the electronic device EA according to one embodiment. Figure 3c is a plan view of the electronic device EA in the folded state according to one embodiment. Figure 3d is a perspective view showing the folding operation of the electronic device EA according to one embodiment.

[0057] Referring to Figure 3b, an electronic device EA according to one embodiment can be folded with respect to a first folding axis FX1 extending in a first direction DR1. When the electronic device EA is folded, the folding region FA may have a small curvature and radius of curvature. For example, the radius of curvature of the folding region FA may be 5 mm or less. The electronic device EA can be folded with respect to the first folding axis FX1, and the first non-folding region NFA1 and the second non-folding region NFA2 can be deformed into an in-folding state so that the first display surface FS is not exposed to the outside.

[0058] Referring to Figure 3c, in one embodiment, the electronic device EA is folded inward, and the second display surface RS can be seen by the user. In this case, the second display surface RS may include a second active area R-AA for displaying an image. The second active area R-AA may be an area that is activated by an electrical signal. The second active area R-AA may be an area where an image is displayed and which can sense various forms of external input.

[0059] The second peripheral region R-NAA may be adjacent to the second active region R-AA. The second peripheral region R-NAA may have several colors. The second peripheral region R-NAA may surround the second active region R-AA. On the other hand, although not shown, the electronic device EA may further include an electronic module region on the second display surface RS in which various electronic modules are arranged, and is not limited to any one embodiment.

[0060] Referring to Figure 3d, an electronic device EA according to one embodiment can be folded with respect to a second folding axis FX2 that extends in a first direction DR1. When the electronic device EA is folded, the folding region FA may have a small curvature and radius of curvature. For example, the radius of curvature of the folding region FA may be 5 mm or less. The electronic device EA can be deformed into an out-folding state by folding with respect to the second folding axis FX2 so that the first display surface FS is exposed to the outside. In one embodiment, the electronic device EA may be configured to alternate between an unfolding operation and inward folding or outward folding operations.

[0061] Figures 3a to 3d illustrate folding based on folding axis FX1 or FX2, but the number of folding axes and the resulting number of non-folding areas are not limited to these. For example, the device may fold based on multiple folding axes so that parts of the first display surface FS and the second display surface RS face each other. Also, although the first and second folding axes FX1 and FX2 are shown aligned with the long side of the electronic device EA, the embodiment is not limited to this, and the first and second folding axes FX1 and FX2 may be aligned with the short side of the electronic device EA.

[0062] In the electronic device EA, the first non-folding region NFA1 and the second non-folding region NFA2 can be defined as parts having display surfaces FS and RS aligned with the planes defined by the first directional axis DR1 and the second directional axis DR2 when folded, as shown in Figure 3c, and the folding region FA can be defined as the region between the first non-folding region NFA1 and the second non-folding region NFA2. The folding region FA may include a curved surface portion that is bent to have a slight curvature when folded. For example, the radius of curvature of the folding region FA may be 5 mm or less.

[0063] Figure 4 is an exploded perspective view showing a display device DD of one embodiment. The display device DD of one embodiment may be included in the electronic device EA (Figure 3a) described above and provide images. Referring to Figure 4, it may include a display module DM, a window WP disposed on the display module DM, and an adhesive member AP disposed between the display module DM and the window WP. The display device DD may further include a support member SM disposed below the display module DM, a protective layer PF disposed on the window WP, and a housing HAU that houses the display module DM, the support member SM, etc.

[0064] The housing (HAU) may contain materials with relatively high rigidity. For example, the housing (HAU) may include multiple frames and / or plates made of glass, plastic, or metal. The housing (HAU) may provide a small enclosure space. The display module (DM) may be housed within this enclosure space and protected from external impacts.

[0065] The support member SM may include a metallic material or a polymeric material. For example, the support member SM may be formed from stainless steel, aluminum, or an alloy thereof. Alternatively, the support member SM may be made of carbon fiber reinforced plastic (CFRP), etc. However, the examples are not limited to these, and the support member SM may include a non-metallic substance, plastic, glass fiber reinforced plastic, or glass. Unlike in the illustration, the support member SM may be omitted.

[0066] Although not shown in the diagram, the display device DD may further include a cushioning layer, a shielding layer, etc., located beneath the support member SM. The cushioning layer may include a sponge, foam, or an elastomer such as urethane resin. The shielding layer may be an electromagnetic shielding layer or a heat dissipation layer.

[0067] The display module DM can be activated by an electrical signal. When activated, the display module DM can display the image IM (Figure 3a) on the display surface FS (Figure 3a) of the display device DD. The display module DM may have a display area AA-DM and a non-display area NAA-DM defined within it. The display area AA-DM may be an area that is activated by an electrical signal. The non-display area NAA-DM may be an area located adjacent to at least one side of the display area AA-DM. Circuits and wiring for driving the display area AA-DM may be placed in the non-display area NAA-DM.

[0068] An adhesive member AP may be placed on the display module DM. The display module DM and the window WP may be bonded by the adhesive member AP. The adhesive member AP may be optically transparent. The adhesive member AP of one embodiment may contain a polymer derived from the resin composition RC of one embodiment (Figure 7a), which will be described later. The adhesive resin AP may consist of the resin composition RC of one embodiment (Figure 7a). The adhesive member AP of one embodiment, consisting of the resin composition RC of one embodiment (Figure 7a), may exhibit excellent adhesive reliability at room temperature and high temperature. In one embodiment, the display device DD including the adhesive member AP consisting of the resin composition RC (Figure 7a) may exhibit excellent reliability.

[0069] The window WP may include a glass substrate. The window WP may protect the display module DM, etc. The image IM (Figure 3a) generated by the display panel DM may be provided to the user through the window WP. For example, the window WP may include UTG (Ultra Thin Glass).

[0070] The window WP may include a transparent region TA and a bezel region BZA. The transparent region TA may overlap with at least a portion of the display region AA-DM of the display module DM. The transparent region TA may be an optically transparent region. The image IM (Figure 3a) may be provided to the user via the transparent region TA.

[0071] The bezel region (BZA) may be a region with relatively lower light transmittance compared to the transparent region (TA). The bezel region (BZA) may define the shape of the transparent region (TA). The bezel region (BZA) may be adjacent to or surround the transparent region (TA).

[0072] The bezel area BZA may have several colors. The bezel area BZA covers the non-display area NAA-DM of the display module DM, and can block the non-display area NAA-DM from being visible from the outside. However, the embodiment is not limited to this, and the bezel area BZA may be located adjacent to only one side of the transparent area TA, or at least a part of it may be omitted.

[0073] The protective layer PF may be a functional layer that protects one surface (e.g., the top surface) of the window WP. The protective layer PF may include a fingerprint-resistant coating agent, a hard coating agent, an antistatic agent, etc. Although not shown, an auxiliary adhesive may be placed between the window WP and the protective layer PF. Contrary to the illustration, the protective layer PF may be omitted.

[0074] Figure 5 is a cross-sectional view showing the portion corresponding to the line I-I' in Figure 4. Figure 5 is a cross-sectional view showing a display device DD according to one embodiment. In Figure 5, the housing HAU is omitted for ease of explanation, and the support member SM, display module DM, adhesive member AP, window WP, and protective layer PF are shown.

[0075] Referring to Figure 5, the support plate SM may include a first support portion MP1 superimposed on the first non-folding region NFA1 and a second support portion MP2 superimposed on the second non-folding region NFA2. The first support portion MP1 and the second support portion MP2 may be separated from the folding region FA. The first support portion MP1 and the second support portion MP2 may not superimpose on the folding region FA. Contrary to the illustration, at least a portion of the first support portion MP1 and at least a portion of the second support portion MP2 may superimpose on the folding region FA.

[0076] The display module DM may include a display panel DP and an input sensing unit TP disposed on the display panel DP. The display panel DP may include a base substrate BS, a circuit layer DP-CL disposed on the base substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and a sealing layer TFE covering the display element layer DP-EL. An adhesive member AP may be disposed between the display panel DP and the window WP.

[0077] The configuration of the display panel DP shown in Figure 5 is illustrative, and the configuration of the display panel DP is not limited to this. For example, the sealing layer TFE may be omitted from the display panel DP, or the display panel DP may further include an optical functional layer that increases efficiency and improves display quality.

[0078] The base substrate BS may provide a base surface on which the circuit layer DP-CL is placed. The base substrate BS may be a flexible substrate that can be bent, folded, rolled, etc. The base substrate BS may be a glass substrate, a metal substrate, or a polymer substrate. However, the examples are not limited to these, and the base substrate BS may include an inorganic layer, an organic layer, or a composite material layer.

[0079] The circuit layer DP-CL may include an insulating layer, semiconductor patterns, conductive patterns, and signal lines. For example, the circuit layer DP-CL may include a switching transistor and a drive transistor for driving the light-emitting element ED (Figure 6) of the display element layer DP-EL.

[0080] The display element layer DP-EL may include light-emitting elements ED (Figure 6). For example, the light-emitting elements ED (Figure 6) may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro-LEDs, or nano-LEDs.

[0081] The encapsulation layer TFE may be placed on top of the display element layer DP-EL. The encapsulation layer TFE can protect the light-emitting element layer DP-EL from foreign matter such as moisture, oxygen, and / or dust particles. The encapsulation layer TFE may include at least one inorganic layer. Alternatively, the encapsulation layer TFE may include at least one organic layer and at least one inorganic layer. For example, the encapsulation layer TFE may include sequentially stacked inorganic layers, organic layers, and inorganic layers.

[0082] The input sensing unit TP may be positioned on top of the display panel DP. For example, the input sensing unit TP may be positioned directly on top of the sealing layer TFE of the display panel DP.

[0083] In this specification, the direct placement / provision of one component on top of another component means that no third component is positioned / provisioned between the two components. In other words, the direct "placement / provision" of one component on top of another component means that the two components are in "contact".

[0084] The input sensing unit TP can sense external inputs, convert them into several input signals, and provide these input signals to the display panel DP. For example, in one embodiment of the display device DD, the input sensing unit TP may be a touch sensing unit that detects touches. The input sensing unit TP may recognize direct touches by the user, indirect touches by the user, direct touches by an object, or indirect touches by an object.

[0085] The input sensing unit TP can sense at least one of the following: the position of an externally applied touch and the intensity (pressure) of the touch. In one embodiment, the input sensing unit TP may have a variety of structures or be made of a variety of materials, and is not limited to any one embodiment. For example, the input sensing unit TP may sense external input using a capacitive method. The display panel DP receives an input signal from the input sensing unit TP and can generate an image in response to the input signal.

[0086] The window WP may include a base layer BL and a print layer BM. Although not shown, the window WP may further include at least one functional layer (not shown) provided on top of the base layer BL. For example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, etc., but the examples are not limited to these.

[0087] The base layer BL may be a glass substrate. Alternatively, the base layer BL may be a plastic substrate. For example, the base layer BL may consist of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof.

[0088] The print layer BM may be positioned on one surface of the base layer BL. The print layer BM may be provided on the underside of the base layer BL adjacent to the display module DM. The print layer BM may be positioned in the edge region of the base layer BL. The print layer BM may be an ink print layer. Alternatively, the print layer BM may be a layer formed containing a pigment or dye. In a window WP, the bezel region BZA may be the portion where the print layer BM is provided.

[0089] A step SP-a may exist between the printed layer BM and a portion of the base layer BL where the printed layer BM is not provided. The adhesive member AP, made of the resin composition RC (Figure 7a) according to one embodiment, has excellent flexibility and excellent adhesive strength, so that the step SP-a portion can be attached to the window WP without lifting.

[0090] An adhesive member AP may be placed between the display panel DP and the window WP. An adhesive member AP may also be placed between the input sensing unit TP, which is located on the display panel DP, and the window WP.

[0091] In one embodiment, the thickness T0 of the adhesive member AP may be between 50 μm and 200 μm. For example, the thickness T0 of the adhesive member AP may be between 50 μm and 100 μm. However, this is illustrative, and the thickness T0 of the adhesive member AP is not limited to this.

[0092] Figure 6 is a cross-sectional view specifically showing the display module DM of Figure 5. The configuration of the display module DM shown in Figure 6 is illustrative, and the embodiment is not limited thereto.

[0093] In Figure 6, the base substrate BS may include a single layer or a multilayer. For example, the base substrate BS may include a first synthetic resin layer, a multilayer or single-layer inorganic layer, and a second synthetic resin layer disposed on the multilayer or single-layer inorganic layer. Each of the first and second synthetic resin layers may contain a polyimide resin. Furthermore, each of the first and second synthetic resin layers may contain at least one of acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. In this specification, "○○-based" resin means containing the "○○" active group.

[0094] The display panel DP may include a transistor TR and a light-emitting element ED. The transistor TR and the light-emitting element ED may be placed on a base substrate BS. Although one transistor TR is shown in Figure 6, the display panel DP may include multiple transistors and at least one capacitor to substantially drive the light-emitting element ED.

[0095] The circuit layer DP-CL may be placed on the base substrate BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connecting electrode CNE, and a plurality of insulating layers BFL and INS1 to INS6. The plurality of insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and the first to sixth insulating layers INS1 to INS6. However, the laminated structure of the circuit layer DP-CL shown in Figure 6 is illustrative, and the laminated structure of the circuit layer DP-CL may be changed depending on the configuration of the display panel DP and processes such as the manufacturing of the circuit layer DP-CL.

[0096] The shielding electrode BML may be placed on the base substrate BS. The shielding electrode BML may be superimposed on the transistor TR. The shielding electrode BML may protect the transistor TR by blocking light incident on the transistor TR from below the display panel DP. The shielding electrode BML may contain a conductive material. When a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR placed on the shielding electrode BML may be maintained. However, the embodiment is not limited to this, and the shielding electrode BML may be a floating electrode. The shielding electrode BML may be omitted.

[0097] The buffer layer BFL may be placed on the base substrate BS and cover the light-shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL may improve the bonding force between the semiconductor pattern or conductive pattern placed on the buffer layer BFL and the base substrate BS.

[0098] A transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, channel C1, and drain D1 of the transistor TR may consist of a semiconductor pattern. The semiconductor pattern of the transistor TR may include polysilicon, amorphous silicon, or metal oxides, but is not limited to any one of these materials as long as it has semiconductor properties.

[0099] A semiconductor pattern may contain multiple regions that are divided by their conductivity. Regions of the semiconductor pattern that are doped with a dopant or where metal oxides are reduced may have high conductivity and can effectively function as the source and drain electrodes of a transistor TR. Regions of the semiconductor pattern with high conductivity may correspond to the source S1 and drain D1 of the transistor TR. Regions of the semiconductor pattern that are not doped, doped at a low concentration, or where metal oxides are not reduced and have low conductivity may correspond to the channel C1 (or active) of the transistor TR.

[0100] The first insulating layer INS1 may be placed on top of the buffer layer BFL, covering the semiconductor pattern of the transistor TR. The gate G1 of the transistor TR may be placed on top of the first insulating layer INS1. On a plane, the gate G1 may be superimposed on the channel C1 of the transistor TR. The gate G1 may function as a mask in the process of doping the semiconductor pattern of the transistor TR.

[0101] A second insulating layer INS2 may be placed on top of the first insulating layer INS1, covering the gate G1. A third insulating layer INS3 may be placed on top of the second insulating layer INS2.

[0102] The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2 for electrically connecting the transistor TR and the light-emitting element ED. However, the configuration of the connecting electrode CNE for electrically connecting the transistor TR and the light-emitting element ED is not limited to this, and one of the first and second connecting electrodes CNE1 and CNE2 may be omitted, or additional connecting electrodes may be included.

[0103] The first connecting electrode CNE1 may be placed on the third insulating layer INS3. The first connecting electrode CNE1 may be connected to the first drain D1 via a first contact hole CH1 that penetrates the first to third insulating layers INS1 to INS3. The fourth insulating layer INS4 may be placed on the third insulating layer INS3 while covering the first connecting electrode CNE1. The fifth insulating layer INS5 may be placed on the fourth insulating layer INS4.

[0104] The second connecting electrode CNE1 may be placed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 via a second contact hole CH2 that penetrates the fourth and fifth insulating layers INS4 and INS5. The sixth insulating layer INS6 may be placed on the fifth insulating layer INS5 while covering the second connecting electrode CNE2.

[0105] Each of the first to sixth functional layers INS1 to INS6 may include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and ferylene resin.

[0106] The display element layer DP-EL may include a pixel definition film PDL and a light-emitting element ED. The light-emitting element ED may include a first electrode AE, a hole control layer HCL, a light-emitting layer EML, an electron control layer TCL, and a second electrode CE.

[0107] The first electrode AE ​​may be placed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connecting electrode CNE2 via a third contact hole CH3 that penetrates the sixth insulating layer INS6. The first electrode AE ​​may be electrically connected to the drain D1 of the transistor TR via the first and second connecting electrodes CNE1 and CNE2.

[0108] The first electrode AE ​​may consist of a metallic material, a metallic alloy, or a conductive compound. The first electrode AE ​​may be an anode or a cathode. The first electrode AE ​​may also be a pixel electrode. The first electrode AE ​​may be a transmissive electrode, a semitransmissive electrode, or a reflective electrode. The first electrode AE ​​may contain at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, two or more compounds selected from these, a mixture of two or more selected from these, or oxides thereof.

[0109] If the first electrode AE ​​is a transmissive electrode, it may contain transparent metal oxides, such as ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), etc. If the first electrode AE ​​is a semi-transmissive or reflective electrode, it may contain Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca (a layered structure of LiF and Ca), LiF / Al (a layered structure of LiF and Al), Mo, Ti, W, or compounds or mixtures thereof (for example, a mixture of Ag and Mg). Alternatively, the first electrode AE ​​may have a multi-layer structure including a reflective or semi-transmissive film made of the aforementioned materials, and a transparent conductive film made of ITO, IZO, ZnO, ITZO, etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not limited to this. Furthermore, the examples are not limited to those described above, and the first electrode AE ​​may include the metal material described above, a combination of two or more metal materials selected from the metal materials described above, or an oxide of the metal material described above.

[0110] The pixel definition film PDL may be placed on the sixth insulating layer INS6. The pixel definition film PDL may have an emission aperture PX_OP that exposes a portion of the first electrode AE. The portion of the first electrode AE ​​exposed by the emission aperture PX_OP may be defined as an emission region LA.

[0111] The display area AA-DM of the display module DM may include an emission area LA and a light-shielding area NLA. The area where the pixel definition film PDL is placed may correspond to the light-shielding area NLA. The light-shielding area NLA may surround the emission area LA within the display area AA-DM.

[0112] The hole control layer (HCL) may be placed on the first electrode (AE) and the pixel definition film (PDL). The hole control layer (HCL) may be provided as a common layer superimposed on the light-emitting region (LA) and the light-shielding region (NLA). Alternatively, the hole control layer (HCL) may be provided only in the region corresponding to the light-emitting aperture (PX-OP). The hole control layer (HCL) may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer (HCL) may include a known hole injection material and / or a known hole transport material.

[0113] The emissive layer (EML) may be placed on the hole control layer (HCL). The emissive layer (EML) may be placed in the region corresponding to the light emission aperture (PX_OP). Alternatively, the emissive layer (EML) may be provided as a common layer. The emissive layer (EML) may contain organic and / or inorganic photoluminescent materials. The emissive layer (EML) may emit light of any one of the following colors: red, green, and blue. For example, the emissive layer (EML) may emit blue light.

[0114] The electron control layer (TCL) may be placed on top of the light-emitting layer (EML). The electron control layer (TCL) may be provided as a common layer superimposed on the light-emitting region (LA) and the light-shielding region (NLA). Alternatively, the electron control layer (TCL) may be provided only in the region corresponding to the light-emitting aperture (PX-OP). The electron control layer (TCL) may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electron control layer (TCL) may include a known electron injection material and / or a known electron transport material.

[0115] The second electrode CE may be placed on the electronic control layer TCL. The second electrode CE may be provided as a common layer superimposed on the light-emitting region LA and the light-shielding region NLA.

[0116] The second electrode CE can be a common electrode. The second electrode CE can be either a cathode or an anode. For example, if the first electrode AE ​​is an anode, the second electrode can be a cathode, and if the first electrode AE ​​is a cathode, the second electrode CE can be an anode.

[0117] The second electrode CE can be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. If the second electrode CE is a transmissive electrode, it can be made of a transparent metal oxide, such as ITO, IZO, ZnO, ITZO, etc.

[0118] If the second electrode CE is a semi-transparent or reflective electrode, the second electrode CE may contain Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, Yb, W, or compounds or mixtures containing these (e.g., AgMg, AgYb, or MgYb). Alternatively, the second electrode CE may have a multi-layer structure including a reflective or semi-transparent film made of the above-mentioned material, and a transparent conductive film made of ITO, IZO, ZnO, ITZO, etc. For example, the second electrode CE may contain the above-mentioned metallic material, a combination of two or more metallic materials selected from the above-mentioned metallic materials, or an oxide of the above-mentioned metallic material.

[0119] The sealing layer TFE may be placed on the second electrode CE to cover the light-emitting element ED. The sealing layer TFE may include multiple thin films. For example, the sealing layer TFE may include an inorganic film placed on the second electrode CE and an organic film placed between the inorganic films. The inorganic film may protect the light-emitting element ED from moisture / oxygen, and the organic film may protect the light-emitting element ED from foreign matter such as dust particles.

[0120] The input sensing unit TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing unit TP may include at least one conductive layer disposed on top of the sensing insulating layers. The input sensing unit TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0121] The first sensing insulating layer IL1 may be placed on top of the sealing layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the sealing layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, in which case the first conductive layer CD1 may be in contact with the sealing layer TFE.

[0122] A first conductive layer CDL1 may be placed on a first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be placed on the first sensing insulating layer IL1. A second sensing insulating layer IL2 may be placed on the first sensing insulating layer IL1 so as to cover at least a portion of the first conductive layer CDL1.

[0123] A second conductive layer CDL2 may be placed on top of a second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be placed on top of the second sensing insulating layer IL2. Each of the plurality of second conductive patterns may be connected to a plurality of first conductive patterns via contact holes formed in the second sensing insulating layer IL2.

[0124] Each of the multiple first conductive patterns of the first conductive layer CDL1 and each of the multiple second conductive patterns of the second conductive layer CDL2 may be arranged in a manner corresponding to the light-shielding region NLA. Each of the multiple first conductive patterns of the first conductive layer CDL1 and each of the multiple second conductive patterns of the second conductive layer CDL2 may correspond to a mesh pattern.

[0125] The third sensing insulating layer IL3 may be positioned on top of the second sensing insulating layer IL2 and cover the second conductive layer CDL2. Each of the second sensing insulating layer IL2 and the third sensing insulating layer IL3 may include an inorganic insulating layer or an organic insulating layer.

[0126] The first conductive layer CDL1 and the second conductive layer CDL2 may each have a monolayer structure or a multilayer structure stacked along a third direction DR3. The monolayer conductive layers CDL1 and CDL2 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium zinc tin oxide (ITO). The transparent conductive layer may also include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0127] The multilayer conductive layers CDL1 and CDL2 may include a metal layer. The metal layer may have a three-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti). The multilayer conductive layers CDL1 and CDL2 may include at least one metal layer and at least one transparent conductive layer.

[0128] Figures 7a to 7d schematically illustrate a method for manufacturing an adhesive member AP (Figure 5) from a resin composition RC according to one embodiment. For example, a method for manufacturing an adhesive member AP (Figure 5) may include the steps of: providing the resin composition RC on a substrate CF; providing the resin composition RC with first UV-1 light to form a preliminary adhesive member P-AP; and providing the preliminary adhesive member P-AP with second UV-2 light to form the adhesive member AP (Figure 5). Alternatively, a method for manufacturing an adhesive member AP (Figure 5) may include the steps of: providing the resin composition RC on a substrate CF; and irradiating the provided resin composition with ultraviolet light to form an adhesive member. In other words, the step of curing the resin composition may be performed in a single curing step (or a single UV irradiation step).

[0129] In the following explanation of Figures 7a and 7d, we will not repeat any information that has already been explained with reference to Figures 1 through 6, and will focus on explaining the differences.

[0130] Referring to Figure 7a, the resin composition RC of one embodiment may be provided on a substrate CF. The resin composition RC may be provided on the substrate CF via a nozzle NZ. For example, the substrate CF on which the resin composition RC is provided may contain polyethylene terephthalate (PET). The substrate CF is a temporary substrate used to form an adhesive member AP (Figure 5) from the resin composition RC and can be used without limitation as long as it can be easily removed after the resin composition RC has cured. One surface of the substrate CF on which the resin composition RC is provided may be subjected to a release treatment.

[0131] The resin composition RC of one embodiment may be provided by an inkjet printing method or a dispensing method. In one embodiment, the liquid resin composition RC may be provided in a uniform amount and / or at a uniform rate. Although Figure 7a shows that the resin composition RC is provided through a nozzle NZ, the equipment for providing the resin composition RC is not limited to this.

[0132] The resin composition RC of one example may comprise at least one monofunctional (meth)acrylate compound, at least one dendritic (meth)acrylate copolymer, and at least one photopolymerization initiator. In one example, the photopolymerization initiator may comprise a radical polymerization initiator. In this specification, (meth)acryloyl group means acryloyl group or methacryloyl group, and (meth)acrylic means acrylic or methacrylic.

[0133] The resin composition RC of one example may contain at least one monofunctional (meth)acrylate compound. The monofunctional (meth)acrylate compound may include at least one of alicyclic (meth)acrylates, hydroxyl group-containing (meth)acrylates, alkyl (meth)acrylates, and aromatic (meth)acrylates. For example, the monofunctional (meth)acrylate compound may include at least one of 4-hydroxybutyl acrylate (4-HBA), isodecyl acrylate (IDAA), tetrahydrofurfuryl acrylate (THF-A), and isobornyl acrylate (IBXA).

[0134] The resin composition RC of one embodiment may contain at least one dendritic (meth)acrylate copolymer. A dendritic (meth)acrylate copolymer means a copolymer having a "dendritic structure," and a "dendritic structure" means a structure that includes a core and branches (arms) that are directly or indirectly bonded to the core. The core may consist of a single element or a plurality of elements. The branches may consist of a plurality of elements.

[0135] A resin composition containing a dendritic (meth)acrylate copolymer can selectively segregate at the interface with air during curing, thereby increasing the cohesive force at the interface. In one example, the resin composition RC contains a dendritic (meth)acrylate copolymer, and entanglement between polymer chains or between polymers and matrix monomers is reduced, allowing for efficient segregation at the interface. Therefore, the adhesive member AP made from the resin composition RC of one example containing a dendritic (meth)acrylate copolymer can exhibit reduced stiffness. Furthermore, in one example, the adhesive member AP (Figure 3) made from the resin composition RC containing a dendritic (meth)acrylate copolymer can satisfy the 180° peel strength and glass transition temperature characteristics described later.

[0136] The resin composition of one embodiment may have a shear viscosity of 50 mPa·s or less, measured at 25°C. Resin composition RC with a shear viscosity of 50 mPa·s or less, measured at 25°C, is easily dispensed from equipment such as nozzles NZ, and a uniform dispensing speed and uniform dispensing volume can be maintained. Thus, resin composition RC of one embodiment can be easily provided with a desired dispensing volume controlled by inkjet printing or dispensing methods. Resin composition RC with a shear viscosity exceeding 50 mPa·s, measured at 25°C, is not easily dispensed from equipment such as nozzles NZ, and cannot be applied in a uniform amount and / or uniform thickness.

[0137] In one embodiment, the resin composition RC may have a value of 30 or less obtained by dividing the maximum value of the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity. In one embodiment, the resin composition RC may have a maximum value of 200 mPa·s or less obtained by the apparent extensional viscosity-Henkey strain curve measured at 25°C. When a specimen with an initial length of 1 is stretched in one direction to a 2nd length, the Henkey strain is the value obtained by taking the natural logarithm of the value obtained by dividing the 2nd length by the 1st length.

[0138] Resin composition RC, in which the value obtained by dividing the maximum value in the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity is 30 or less, is easily dispensed from equipment such as nozzles NZ, and a uniform dispensing speed and uniform dispensing volume can be maintained.

[0139] An adhesive member AP (Figure 5) made from the resin composition of one embodiment may exhibit high adhesive reliability. Furthermore, an electronic device EA including the adhesive member AP (Figure 5) made from the resin composition may exhibit excellent reliability when repeatedly folding and unfolding. A resin composition RC in which the value obtained by dividing the maximum value in the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity exceeds 30 may not be easily dispensed from equipment such as a nozzle NZ, and it may be difficult to apply it in a uniform amount and / or thickness.

[0140] Resin compositions RC with a maximum apparent extensional viscosity-Henkey strain curve of 200 mPa·s or less, measured at 25°C, have a small value obtained by dividing the maximum value by the shear viscosity, making them easy to dispense and allowing for the maintenance of a uniform dispensing rate and uniform dispensing volume. Resin compositions RC with a maximum apparent extensional viscosity-Henkey strain curve exceeding 200 mPa·s, measured at 25°C, may not be easily dispensed from equipment such as nozzles NZ, and it may be difficult to apply them in a uniform amount and / or thickness.

[0141] Based on the total weight of the resin composition RC, the weight of the dendritic (meth)acrylate copolymer may be between 4 wt% and 10 wt%. Based on the total weight of the resin composition RC, adhesive members made from resin compositions containing less than 4 wt% of dendritic (meth)acrylate copolymer exhibit low 180° peel strength and are not suitable for use in flexible display devices. Based on the total weight of the resin composition RC, adhesive members made from resin compositions containing more than 10 wt% of dendritic (meth)acrylate copolymer exhibit high elastic modulus and low shape retention. In contrast, in one example, adhesive member AP (Figure 3) made from resin composition RC containing 4 wt% to 10 wt% of dendritic (meth)acrylate copolymer based on the total weight exhibits excellent shape retention and may exhibit properties suitable for use in flexible display devices.

[0142] In one embodiment, the weight-average molecular weight of the dendritic (meth)acrylate copolymer may be 20,000 or more and 40,000 or less. For example, the weight-average molecular weight of the dendritic (meth)acrylate copolymer may be 25,000 or more and 35,000 or less. A resin composition RC containing a dendritic (meth)acrylate copolymer with a weight-average molecular weight of 20,000 or more and 40,000 or less satisfies the maximum values ​​in the shear viscosity and apparent extensional viscosity-Henkey strain curve described above, and an adhesive member AP (Figure 3) made of the resin composition RC can satisfy the 180° peel strength and glass transition temperature characteristics described later.

[0143] In one embodiment, the glass transition temperature of the dendritic (meth)acrylate copolymer may be between -20°C and 120°C. For example, the glass transition temperature of the dendritic (meth)acrylate copolymer may be between 0°C and 100°C, or between 20°C and 80°C. A resin composition RC containing a dendritic (meth)acrylate copolymer with a glass transition temperature of -20°C to 120°C satisfies the maximum values ​​in the shear viscosity and apparent extensional viscosity-Henkey strain curve described above, and an adhesive member AP (Figure 3) made of the resin composition RC can satisfy the 180° peel strength and glass transition temperature characteristics described later.

[0144] The resin composition RC of one embodiment may contain at least one photopolymerization initiator. The photopolymerization initiator may include a radical polymerization initiator. For example, the resin composition RC may contain at least one of Omnirad 819 (manufactured by IGM Resin) and Omnirad 184 (manufactured by IGM Resin) as a photopolymerization initiator.

[0145] When a resin composition RC contains multiple photopolymerization initiators, the different photopolymerization initiators may be activated by ultraviolet light with different central wavelengths. For example, the photopolymerization initiators may include at least one of 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methylpropan-1-one.

[0146] In addition, photopolymerization initiators, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl(2,4,6-trimethylbenzoyl)phenyl It may contain at least one of the following: phosphinenate, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, [1-(4-phenylsulfanylbenzoyl)heptylideneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazole-3-yl]ethylideneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyryl)phenyl]titanium(IV).

[0147] Referring to Figure 7b, a resin composition RC coated on a substrate CF to a uniform thickness may be exposed to first UV-1 light. The liquid resin composition RC may be cured by the first UV-1 light to form a preliminary adhesive member P-AP (Figure 7c). The first UV-1 light may be ultraviolet light. Although Figure 7b shows that the resin composition RC coated on the substrate CF is directly irradiated with first UV-1 light to form the preliminary adhesive member P-AP, the examples are not limited to this. A carrier film (not shown) may be placed on the resin composition RC coated to a uniform thickness, and the carrier film (not shown) may be one that transmits ultraviolet light.

[0148] Referring to Figures 7c and 7d, a preliminary adhesive member P-AP formed by irradiating a resin composition RC with a first UV-1 light (Figure 7b) can be detached from the substrate CF and provided on one surface of the window WP or one surface of the display module DM. One surface of the preliminary adhesive member P-AP can be laminated onto one surface of the window WP or one surface of the display module DM, and the remaining surface of the preliminary adhesive member P-AP that is not attached to the other surface of the window WP or display module DM can be attached. Next, the preliminary adhesive member P-AP can be irradiated with a second UV-2 light to form an adhesive member AP (Figure 5). The second UV-2 light may be ultraviolet light. The second UV-2 light may be provided from above the window WP, and the window WP may be transparent to the second UV-2 light. The second UV-2 light may be provided to the preliminary adhesive member P-AP by passing through the window WP.

[0149] Figures 7a to 7d show that the adhesive member AP (Figure 5) is formed by curing the resin composition RC twice (i.e., by applying light twice during curing), but the examples are not limited to this. For example, the adhesive member AP (Figure 5) may be formed by curing the resin composition RC (Figure 7a) once, or by curing it three or more times.

[0150] One example of the resin composition RC (Figure 7a) may comprise at least one monofunctional (meth)acrylate compound, at least one dendritic (meth)acrylate copolymer, and at least one photopolymerization initiator. One example of the resin composition RC (Figure 7a) can be cured by UV-1 and UV-2 light. For example, the resin composition RC (Figure 7a) can be cured by ultraviolet light to form an adhesive member AP (Figure 5).

[0151] In one embodiment, the adhesive resin AP may consist of the resin composition RC (Figure 7a) of the embodiment. The adhesive member AP of the embodiment can be manufactured by applying the resin composition RC (Figure 7a) onto a substrate and irradiating the applied resin composition RC (Figure 7a) with ultraviolet light having an integrated irradiance of UVA and UVV of 900 mW and an integrated light amount of 1000 mJ. As a result, the adhesive member AP of the embodiment can satisfy the 180° peel strength and glass transition temperature characteristics described later.

[0152] In one embodiment, the adhesive member AP may have a 180° peel strength of 1500 gf / 25 mm or more to the glass substrate at 25°C. An adhesive member AP with a 180° peel strength of 1500 gf / 25 mm or more to the glass substrate at 25°C may exhibit excellent adhesive reliability. A display device DD including an adhesive member AP with a 180° peel strength of 1500 gf / 25 mm or more to the glass substrate at 25°C may exhibit excellent adhesive reliability. In contrast, an adhesive member AP with a 180° peel strength of less than 1500 gf / 25 mm to the glass substrate at 25°C may not be able to attach to adjacent display device components (e.g., display modules and / or windows) with sufficient adhesive strength, resulting in reduced adhesive reliability.

[0153] In one embodiment, the adhesive member AP may have a 180° peel strength of 500 gf / 25 mm or more against the glass substrate at 60°C. An adhesive member AP with a 180° peel strength of 500 gf / 25 mm or more against the glass substrate at 60°C can exhibit excellent adhesive reliability. A display device DD including an adhesive member AP with a 180° peel strength of 500 gf / 25 mm or more against the glass substrate at 60°C can exhibit excellent adhesive reliability. In contrast, an adhesive member AP with a 180° peel strength of less than 500 gf / 25 mm against the glass substrate at 60°C cannot be attached with sufficient adhesive strength to adjacent display device components (e.g., display modules and / or windows), resulting in reduced adhesive reliability.

[0154] In one embodiment, the adhesive member AP may have a glass transition temperature (Tg) of -25°C or lower. The glass transition temperature (Tg) of the adhesive member AP may be 20°C or lower. Adhesive members with a glass transition temperature below -25°C may have low resistance and reduced adhesive strength in high-temperature and high-humidity environments. In contrast, the adhesive member of one embodiment with a glass transition temperature of -25°C or higher does not have reduced resistance even in high-temperature and high-humidity environments and can maintain a constant adhesive strength. Adhesive members with a glass transition temperature exceeding 20°C have very high cohesive force of the polymer constituting the adhesive member, making them vulnerable to external impacts and unsuitable for use in display devices. In contrast, the adhesive member AP of one embodiment with a glass transition temperature of 20°C or lower has good cohesiveness of the polymer constituting the adhesive member AP and can exhibit excellent impact resistance. In one embodiment, a display device DD including an adhesive member AP with a glass transition temperature of -25°C or higher and 20°C or lower can exhibit excellent reliability.

[0155] In one embodiment, the display device DD including the adhesive member AP can maintain adhesion between the window WP and the display device DM without the adhesive member AP lifting even in the folding region FA (Figure 3a). For example, if the radius of curvature of the folding region FA (Figure 3a) is 5 mm or less, the adhesive member AP of one embodiment can exhibit excellent flexibility and excellent adhesive strength when repeatedly folding and unfolding. As a result, the display device DD including the adhesive member AP of one embodiment can exhibit excellent reliability.

[0156] Figure 8 is a cross-sectional view showing a display device according to one embodiment of the present invention. In the following description of the display device shown in Figure 8, we will not repeat any information that has been explained with reference to Figures 1 to 7d, and will focus on the differences.

[0157] Compared to the display device DD described with reference to Figures 4 and 5, the display device DD-a shown in Figure 8 may further include a light control layer PP and an optical adhesive layer AP-a. In one embodiment, the display device DD-a may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP. The light control layer PP may include a polarizing plate or a color filter layer.

[0158] The optical adhesive layer AP-a may consist of the resin composition RC of one embodiment (Figure 7a). The optical adhesive layer AP-a containing a polymer derived from the resin composition RC of one embodiment (Figure 7a) may have a 180° peel force of 1500 gf / 25 mm or more on a glass substrate at 25°C. The optical adhesive layer AP-a containing a polymer derived from the resin composition RC of one embodiment (Figure 7a) may have a 180° peel force of 500 gf / 25 mm or more on a glass substrate at 60°C. The optical adhesive layer AP-a containing a polymer derived from the resin composition RC of one embodiment (Figure 7a) may have a glass transition temperature of -25°C or higher and 20°C or lower. The optical adhesive layer AP-a containing a polymer derived from the resin composition RC of one embodiment (Figure 7a) may exhibit excellent flexibility and excellent adhesive reliability.

[0159] The following describes in detail a resin composition according to one embodiment of the present invention and an adhesive member made from the resin composition, with reference to examples and comparative examples. Furthermore, the following examples are illustrative to aid in understanding the present invention, and the scope of the present invention is not limited thereto. [Examples]

[0160] 1. Synthesis of (meth)acrylate copolymers The (meth)acrylate copolymers P1 to P5 provided for the resin compositions of the Examples and Comparative Examples were synthesized by the method described below. The (meth)acrylate copolymers P1 to P3 are the dendritic (meth)acrylate copolymers of the Examples, and the (meth)acrylate copolymers P4 and P5 are the linear (meth)acrylate copolymers of the Comparative Examples. The molecular weight and glass transition temperature of the (meth)acrylate copolymers were measured using the molecular weight measurement method and glass transition temperature measurement method described below.

[0161] <Synthesis of (meth)acrylate copolymer P1> In a circular flask equipped with a condenser, dropping funnel, nitrogen inlet tube, and magnetic stirrer, 60 g of butyl acetate, 16 g of methyl methacrylate (MMA, Tokyo Chemical Industry Co., Ltd.), 8.9 g of isobornyl methacrylate (IBXMA, Tokyo Chemical Industry Co., Ltd.), 0.2 g of V-601 (dimethyl 2,2'-azobis(2-propionate methyl), FUJIFILM Wako Pure Chemical Co., Ltd.), and 1.6 g of KarenzMT PE1 (pentaerythritol tetrakis(3-mercaptobutyric acid), Resonac Co., Ltd.) were added, and the mixture was reacted under a nitrogen stream at 80°C for 4 hours to obtain a sample. Next, the cooled sample was reprecipitated and purified in methanol, and then vacuum dried to obtain (meth)acrylate copolymer P1. The molecular weight (Mw) of copolymer P1 was 22,000, and the glass transition temperature (Tg) was 119°C.

[0162] <Synthesis of (meth)acrylate copolymer P2> In a circular flask equipped with a condenser, dropping funnel, nitrogen inlet tube, and magnetic stirrer, 60 g of propylene glycol 1-monomethyl ether, 13 g of methyl methacrylate (MMA, manufactured by Tokyo Chemical Industry), 7.2 g of isobornyl methacrylate (IBXMA, manufactured by Tokyo Chemical Industry), 22 g of lauryl methacrylate (LMA, manufactured by Tokyo Chemical Industry), 0.2 g of 4,4'-azobis(4-cyanovaleric acid, manufactured by FUJIFILM Wako Pure Chemical), and 1.1 g of KarenzMT PE1 (pentaerythritol tetrakis(3-mercaptobutyric acid), manufactured by Resonac Co., Ltd.) were added, and the mixture was reacted at 80°C under a nitrogen stream for 4 hours to obtain the sample. Next, the cooled sample was reprecipitated and purified in methanol, and then vacuum dried to obtain (meth)acrylate copolymer P2. The molecular weight (Mw) of copolymer P2 was 23,000, and its glass transition temperature (Tg) was -20°C.

[0163] <Synthesis of (meth)acrylate copolymer P3> In a circular flask equipped with a condenser, dropping funnel, nitrogen inlet tube, and magnetic stirrer, 300 g of propylene glycol 1-monomethyl ether, 65 g of methyl methacrylate (MMA, manufactured by Tokyo Chemical Industry), 36 g of isobornyl methacrylate (IBXMA, manufactured by Tokyo Chemical Industry), 111 g of lauryl methacrylate (LMA, manufactured by Tokyo Chemical Industry), 0.8 g of 4,4'-azobis(4-cyanovaleric acid, manufactured by FUJIFILM Wako Pure Chemical), and 3.2 g of KarenzMT PE1 (pentaerythritol tetrakis(3-mercaptobutyric acid), manufactured by Resonac Co., Ltd.) were added, and the mixture was reacted at 80°C under a nitrogen stream for 4 hours to obtain the sample. Next, the cooled sample was reprecipitated and purified in methanol, and then vacuum dried to obtain (meth)acrylate copolymer P3. The molecular weight (Mw) of copolymer P3 was 31,000, and its glass transition temperature (Tg) was -20°C.

[0164] <Synthesis of (meth)acrylate copolymer P4> In a circular flask equipped with a condenser, dropping funnel, nitrogen inlet tube, and magnetic stirrer, 300 g of propylene glycol 1-monomethyl ether (Tokyo Chemical Industry), 80 g of 1,3-dimethyl-2-imidazolidinone (FUJIFILM Wako Pure Chemical), 165 g of methyl methacrylate (MMA, Tokyo Chemical Industry), 44 g of isobornyl methacrylate (IBXMA, Tokyo Chemical Industry), and 12 g of lauryl methacrylate (LMA, Tokyo Chemical Industry) were added and stirred, and the oil bath temperature was raised to 80°C. Separately, a solution of 10 g of 1,3-dimethyl-2-imidazolidinone and 0.8 g of 4,4'-azobis(4-cyanovaleric acid, FUJIFILM Wako Pure Chemical) was added dropwise to the above solution, and the reaction was carried out for 4 hours while maintaining 80°C to obtain a sample. Next, the cooled sample was reprecipitated and purified in methanol, and then vacuum-dried to obtain (meth)acrylate copolymer P4. The molecular weight (Mw) of copolymer P4 was 10,000, and the glass transition temperature (Tg) was -89°C.

[0165] <Synthesis of (meth)acrylate copolymer P5> 60 g of propylene glycol 1-monomethyl ether (Tokyo Chemical Industry Co., Ltd.) was placed in a circular flask equipped with a condenser, dropping funnel, nitrogen inlet tube, and magnetic stirrer, and nitrogen was bubbled through for 30 minutes, followed by heating at 80°C. Separately, 15 g of 1,3-dimethyl-2-imidazolidinone (FUJIFILM Wako Pure Chemical Co., Ltd.), 24 g of methyl methacrylate (MMA, Tokyo Chemical Industry Co., Ltd.), 13.3 g of isobornyl methacrylate (IBXMA, Tokyo Chemical Industry Co., Ltd.), and 2.5 g of 4,4'-azobis (4-cyanovaleric acid, FUJIFILM Wako Pure Chemical Co., Ltd.) were added and stirred to prepare the initiator and monomer solution. After confirming homogeneity, the initiator and monomer solution were added dropwise to the propylene glycol 1-monomethyl ether. After dropwise addition, the reaction was carried out at 80°C for 4 hours to obtain the sample. Next, a large quantity of the cooled sample was added to methanol for reprecipitation and purification, and then vacuum-dried to obtain a P5 precursor.

[0166] In a circular flask equipped with a condenser, dropping funnel, nitrogen inlet tube, and magnetic stirrer, 5 g of P5 precursor, 20 mL of DMF (dimethylformamide), 0.05 g of triphenylphosphine (TPP, FUJIFILM Wako Pure Chemical), and 5 mg of 4-methoxyphenol (MEHQ, Tokyo Chemical Industry) were added and heated in an oil bath to 120°C. Next, 1 mL of glycidyl methacrylate (GMA, Tokyo Chemical Industry) was added and the reaction was carried out for 6 hours to obtain the sample. The sample was then cooled and reprecipitated and purified in a large amount of methanol, and vacuum dried to obtain (meth)acrylate copolymer P5. The molecular weight (Mw) of copolymer P5 was 9,000 and the glass transition temperature (Tg) was -110°C.

[0167] <Measurement of molecular weight of (meth)acrylate copolymer> The molecular weight was measured using a gel permeation chromatography (GPC) analyzer HLC-8420GPC manufactured by TOSOH Corporation. A TSKgel SUPER HZM-N column was used as the measurement column, and tetrahydrofuran (THF) was used as the measurement solvent. The weight-average molecular weight was obtained from the SEC (Size Exclusion Chromatography) curve detected by a refractive index (RI) detector, converted to standard polystyrene (PS).

[0168] <Measurement of glass transition temperature of (meth)acrylate copolymers> Glass transition measurements were performed using a NETZSCH Photo-DSC 204 Phoenix differential scanning calorimetry (DSC) under a heating rate of 10 K / min.

[0169] The (meth)acrylate copolymers P1 to P3 have a weight-average molecular weight of 20,000 or more and 40,000 or less, satisfying the weight-average molecular weight of the dendritic (meth)acrylate copolymer according to one example. The (meth)acrylate copolymers P1 to P3 have a glass transition temperature of -20°C or more and 120°C or less, satisfying the glass transition temperature of the dendritic (meth)acrylate copolymer according to one example.

[0170] 2. Manufacturing and evaluation of resin compositions The resin compositions of the examples and comparative examples were prepared using the materials listed in Table 1. The materials listed in Table 1 were measured in their respective quantities (g, gram) in a light-shielding glass vial and stirred in a roll mill at room temperature for 12 hours.

[0171] <Measurement of shear viscosity of resin composition> In Table 1, the shear viscosity of the resin composition was measured at 25°C using the JIS Z8803 method. The shear viscosity of the resin composition was measured using a viscometer TVE-25L (manufactured by Toki Sangyo Co., Ltd.) at a speed of 10 rpm and is recorded in Table 1.

[0172] <Measurement of the maximum elongation viscosity of resin compositions> Measurements were performed using a Capillary Breakup Extensional Rheometer (model name CaBER1, Thermo Fisher Scientific Inc.) under the following conditions: 25°C, upper and lower plate diameters of 4 mm, initial gap of 1 mm, upper plate pulling distance of 3.5 mm, upper plate pulling time of 30 ms (milliseconds), and measurement time of 1 second. The obtained diameter-time curves were converted to obtain apparent extensional viscosity-Henkey strain curves. In the apparent extensional viscosity-Henkey strain curves, the maximum value of the apparent extensional viscosity in the Henkey strain range of 0.1 to 12 is recorded as the maximum extensional viscosity in Table 1. The apparent extensional viscosity-Henkey strain curves for Example 1-1 and Comparative Example 1-5 are shown via the graph in Figure 9. In Figure 9, the vertical axis of the graph represents apparent extensional viscosity, and the horizontal axis represents Henkey strain.

[0173] <Evaluation of the dispensing properties of resin compositions> DevicePrinter-CX (MICROJET CORP.), equipped with a KM1024i (KONICA MINOLTA, INC.) inkjet printer, was used. The resin compositions listed in Table 1 were coated to a thickness of 80 μm onto a 40 mm x 150 mm soda-lime glass surface. Cases where there were no ejection defects and the entire surface of the glass could be coated were rated "○" (good ejection performance), while cases where liquid clogging occurred during the process and full surface coating was not possible were rated "×" (poor ejection performance), and these results were recorded in Table 1.

[0174] 3. Manufacturing and evaluation of adhesive materials The glass transition temperature and 180° peel strength of the adhesive members made from the resin compositions of the examples and comparative examples were evaluated and recorded in Table 1. The adhesive members are made from the resin compositions of Examples 1-1 to 1-3, respectively. The adhesive members are made from the resin compositions of Comparative Examples 1-4 and 1-5, respectively.

[0175] <Measurement of glass transition temperature of adhesive materials> A 500 μm thick silicone rubber sheet with an 8 mm inner diameter hole was placed on top of a molded PET film, and approximately 28 μL of the resin compositions of the example and comparative example were placed into the hole. Next, LED lamps with peaks at wavelengths of 365 nm and 395 nm were used, and the total integrated luminous intensity of each lamp was 1800 mJ / cm². 2 By irradiating the sample with light to achieve a specific temperature, a circular sample with a diameter of 8 nm and a thickness of 500 μm was obtained. The obtained sample was measured using an MCR302e (Anton-Paar) at a frequency of 1 Hz, a temperature of -20 to 80 °C, and a heating rate of 2 °C / min. The glass transition temperatures confirmed by the measurements are recorded in Table 1. The glass transition temperature is recorded as the temperature at which the tanδ value is at its maximum, and tanδ is the ratio of the loss modulus (G") to the storage modulus (G') (G' / G'').

[0176] <Measurement of 180° peel strength of adhesive materials> The resin compositions of the examples and comparative examples were coated to a thickness of 150 μm onto a 20 nm x 76 mm soda-lime glass (manufactured by Central Glass Co., Ltd.) using a bar coater. An LED lamp with peaks at wavelengths of 365 nm and 395 nm was used on the soda-lime glass coated with the resin composition, and the total integrated luminous intensity of the light from each lamp was 1800 mJ / cm². 2 The resin composition was irradiated with light to achieve the desired result. A PET film measuring 20 mm x 150 mm (A4360 50 μm, TOYOBO Co., Ltd. product) was placed on top of the irradiated resin composition and bonded with a bonding pressure of 0.15 MPa.

[0177] The peel force of the obtained samples was measured using a Universal Testing Machine (Instron Corporation, Model 5965) at 25°C and 60°C at a speed of 300 mm / min to achieve a peel angle of 180°. The average value over approximately 50 mm of peeling was calculated, and the obtained value was multiplied by 1.25 to record the peel force for a width of 25 mm in Table 1. For the 60°C measurement, the sample was kept in a high-temperature test chamber for 15 minutes before measurement.

[0178] [Table 1]

[0179] <Data for materials in Table 1> 4-HBA: 4-Hydroxybutyl acrylate (product of OSAKA ORGANIC CHEMICAL INDUSTRY LTD.) IDAA: Isodecyl acrylate (product of OSAKA ORGANIC CHEMICAL INDUSTRY LTD.) THF-A: Tetrahydrofurfuryl acrylate (product of Kyoeisha Chemical Co., Ltd.) IBXA: Isobornyl acrylate (a product of OSAKA ORGANIC CHEMICAL INDUSTRY LTD.) Omnirad 819: Phenylbis(2,4,6-trimethylbenzoyl)-phosphine oxide (manufactured by IGM Resins) Omnirad 184: 1-Hydroxycyclohexyl-phenyl ketone (manufactured by IGM Resins) KBM403: 3-Glycidoxytrimethoxysilane (product of Shin-etsu Chemical Co., Ltd.) KBM5103: 3-Acrylooxypropyltrimethoxysilane (product of Shin-etsu Chemical Co., Ltd.) UV-3300B: Urethane acrylate (weight-average molecular weight 13,000, manufactured by Mitsubishi Chemical Corp.)

[0180] Each of the resin compositions in Examples 1-1 to 1-3 contains (meth)acrylate copolymers P1 to P3. As described above, (meth)acrylate copolymers P1 to P3 correspond to the dendritic (meth)acrylate copolymers in one example. In the resin composition of Example 1-1, the weight of (meth)acrylate copolymer P1 is 4 wt% to 10 wt% based on the total weight of the resin composition. In the resin composition of Example 1-2, the weight of (meth)acrylate copolymer P2 is 4 wt% to 10 wt% based on the total weight of the resin composition. In the resin composition of Example 1-3, the weight of (meth)acrylate copolymer P3 is 4 wt% to 10 wt% based on the total weight of the resin composition.

[0181] The resin composition of Example 1-1 had a total weight of 100.1 g. When 100.1 g is converted to 100 wt%, the weight of the (meth)acrylate copolymer in the resin composition of Example 1-1 is approximately 9.09 wt%. Using the same method, when the total weight of the resin compositions of Examples 1-2 to 1-3 is converted to 100 wt%, the weight of the (meth)acrylate copolymer is approximately 8.70 wt% and approximately 4.59 wt%, respectively.

[0182] The resin compositions of Comparative Examples 1-4 and 1-5 do not contain the dendritic (meth)acrylate copolymer according to one example. The resin composition of Comparative Example 1-4 does not contain the (meth)acrylate copolymer. The resin composition of Comparative Example 1-5 contains the linear (meth)acrylate copolymer.

[0183] Referring to the maximum extensional viscosity in Table 1, it can be seen that the resin compositions of Examples 1-1 to 1-3 have a maximum extensional viscosity of 200 mPa·s or less measured at 25°C. Furthermore, it can be seen that the resin compositions of Examples 1-1 to 1-3 have a value of 30 or less obtained by dividing the maximum extensional viscosity measured at 25°C by the shear viscosity. The resin compositions of Examples 1-1 to 1-3 are resin compositions according to one example and contain a monofunctional (meth)acrylate compound, a dendritic (meth)acrylate copolymer, and a photopolymerization initiator. Therefore, it can be seen that the resin composition according to one example exhibits excellent discharge properties.

[0184] Referring to the maximum extensional viscosity in Table 1, it can be seen that the resin compositions of Comparative Examples 1-5 have a maximum extensional viscosity exceeding 200 mPa·s when measured at 25°C. Furthermore, it can be seen that the resin compositions of Comparative Examples 1-5 have a maximum extensional viscosity divided by the shear viscosity that exceeds 30 when measured at 25°C. It can be seen that the resin compositions of Comparative Examples 1-5 exhibit high maximum extensional viscosity because they do not contain dendritic (meth)acrylate copolymers. This explains the high value obtained by dividing the maximum extensional viscosity by the shear viscosity. As mentioned above, resin compositions with a maximum extensional viscosity divided by the shear viscosity exceeding 30 are not easily dispensed from equipment such as nozzles and cannot be applied in a uniform amount and / or thickness.

[0185] Referring to Table 1, it can be seen that the adhesive members after photocuring of Examples 1-1 to 1-3 have a glass transition temperature of -25°C to 20°C. The adhesive members after photocuring of Examples 1-1 to 1-3 have a 180° peel strength of 1500 gf / 25 mm or more at 25°C. The adhesive members after photocuring of Examples 1-1 to 1-3 have a 180° peel strength of 500 gf / 25 mm or more at 60°C. The adhesive members after photocuring of Examples 1-1 to 1-3 consist of the resin composition according to one example. Therefore, it can be seen that the adhesive members consisting of the resin composition according to one example exhibit excellent adhesive reliability at room temperature and high temperatures.

[0186] Referring to Table 1, it can be seen that the adhesive members of Comparative Examples 1-4 after photocuring have a glass transition temperature of -25°C to 20°C. However, it can be seen that the adhesive members of Comparative Examples 1-4 after photocuring have a 180° peel strength of less than 1500 gf / 25 mm at 25°C. Furthermore, it can be seen that the adhesive members of Comparative Examples 1-4 after photocuring have a 180° peel strength of less than 500 gf / 25 mm at 60°C. It can be seen that the adhesive members of Comparative Examples 1-4 after photocuring exhibit low 180° peel strength at room temperature and high temperatures because they do not contain dendritic (meth)acrylate copolymers.

[0187] The electronic device of one embodiment includes an adhesive member disposed between a display module and a window, the adhesive member may include a polymer derived from the resin composition of one embodiment. The adhesive resin may be formed by curing the resin composition of one embodiment.

[0188] One embodiment comprises a monofunctional (meth)acrylate compound, a dendritic (meth)acrylate copolymer, and a photopolymerization initiator, wherein the shear viscosity measured at 25°C is 50 mPa·s or less, and the value obtained by dividing the maximum value in the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity may be 30 or less. As a result, the resin composition of this embodiment can be cured in a short waiting time, exhibits excellent discharge properties, and can exhibit excellent adhesive properties at room temperature and high temperatures after curing. An adhesive member made from the resin composition of this embodiment and an electronic device containing the adhesive member can exhibit excellent reliability.

[0189] Although preferred embodiments of the present invention have been described so far with reference, a person skilled in the art or with ordinary knowledge in the art will understand that the present invention can be modified and altered in various ways without departing from the spirit and technical domain of the invention as described in the claims below.

[0190] Therefore, the technical scope of the present invention is not limited to what is described in the detailed description of the specification, but should be determined by the claims. [Explanation of symbols]

[0191] RC: Resin composition AP: Adhesive material DD:Display device DP: Display Panel WP:Window EA:Electronic equipment

Claims

1. At least one monofunctional (meth)acrylate compound, At least one dendritic (meth)acrylate copolymer, It comprises at least one photopolymerization initiator, A resin composition having a shear viscosity of 50 mPa·s or less measured at 25°C, and a value of 30 or less obtained by dividing the maximum value in the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity.

2. The resin composition according to claim 1, wherein the weight of the dendritic (meth)acrylate copolymer is 4 wt% or more and 10 wt% or less, based on the total weight of the resin composition.

3. The resin composition according to claim 1, wherein the weight-average molecular weight of the dendritic (meth)acrylate copolymer is 20,000 or more and 40,000 or less.

4. The resin composition according to claim 1, wherein the glass transition temperature of the dendritic (meth)acrylate copolymer is -20°C or higher and 120°C or lower.

5. The resin composition according to claim 1, wherein the monofunctional (meth)acrylate compound comprises at least one of 4-hydroxybutyl acrylate (4-HBA), isodecyl acrylate (IDAA), tetrahydrofurfuryl acrylate (THF-A), and isobornyl acrylate (IBXA).

6. The resin composition according to claim 1, wherein the maximum value of the apparent extensional viscosity-Henkey strain curve measured at 25°C is 200 mPa·s or less.

7. The resin composition according to claim 1, provided by an inkjet printing method.

8. At least one monofunctional (meth)acrylate compound, At least one dendritic (meth)acrylate copolymer, It comprises at least one photopolymerization initiator, An adhesive member comprising a polymer derived from a resin composition having a shear viscosity of 50 mPa·s or less measured at 25°C, and a value of 30 or less obtained by dividing the maximum value in the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity.

9. The adhesive member according to claim 8, wherein the 180° peel strength to a glass substrate at 25°C is 1500 gf / 25 mm or more.

10. The adhesive member according to claim 8, wherein the 180° peel strength to a glass substrate at 60°C is 500 gf / 25 mm or more.

11. The adhesive member according to claim 8, wherein the resin composition is applied to a substrate, and the applied resin composition is irradiated with ultraviolet light having an integrated illuminance of UVA and UVV of 900 mW and an integrated light amount of 1000 mJ to produce the adhesive member.

12. The adhesive member according to claim 8, wherein the glass transition temperature is -25°C or higher and 20°C or lower.

13. The adhesive member according to claim 8, wherein the weight of the dendritic (meth)acrylate copolymer is 4 wt% or more and 10 wt% or less, based on the total weight of the resin composition.

14. The adhesive member according to claim 8, wherein the weight-average molecular weight of the dendritic (meth)acrylate copolymer is 20,000 or more and 40,000 or less.

15. The adhesive member according to claim 8, wherein the maximum value of the apparent extensional viscosity-Henkey strain curve measured at 25°C for the resin composition is 200 mPa·s or less.

16. Display module and, A window placed on the aforementioned display module, Includes an adhesive member disposed between the display module and the window, The adhesive member comprises a polymer derived from a resin composition containing at least one monofunctional (meth)acrylate compound, at least one dendritic (meth)acrylate copolymer, and at least one photopolymerization initiator. The resin composition has a shear viscosity of 50 mPa·s or less measured at 25°C, and the value obtained by dividing the maximum value in the apparent extensional viscosity-Henkey strain curve measured at 25°C by the shear viscosity is 30 or less.

17. The electronic device according to claim 16, wherein the adhesive member has a 180° peel force to a glass substrate of 1500 gf / 25 mm or more at 25°C.

18. The electronic device according to claim 16, wherein the adhesive member has a 180° peel force of 500 gf / 25 mm or more to a glass substrate at 60°C.

19. The electronic device according to 16, which includes at least one folding region, wherein the radius of curvature of the folding region is 5 mm or less.

20. The electronic device according to claim 16, further comprising at least one of a processor, memory, and power supply module.

Images