Power supply device

Abstract

To provide a power supply unit equipped with a boss portion that is easy to manufacture and provides a stable mounting position. [Solution] The power supply unit 1 includes electronic components, a circuit board, a die-cast base frame 40, and a plurality of boss portions 50 provided on the base frame 40. The base frame 40 includes a heat sink portion 45, a first column portion 41 and a second column portion 42 extending from the heat sink portion 45, a third column portion 43 extending from the heat sink portion 45 between the first column portion 41 and the second column portion 42, and a beam portion 44 provided to connect the ends of the first column portion 41, the second column portion 42, and the third column portion 43. The boss portions 50 are provided on at least the heat sink portion 45 and the beam portion 44.

Description

Technical Field

[0001] The present invention relates to a power supply device.

Background Art

[0002] Patent Document 1 discloses a housing of an electronic device in which ribs are provided on a housing to be cast in order to improve the water circulation property of a cavity.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in order to fix a power supply device to a rack or the like, the inventor has considered providing a boss portion in a frame of the power supply device into which a screw for device attachment is screwed. Since a large force acts on the boss portion into which the screw for device attachment is screwed, high rigidity is required. On the other hand, a large number of components are mounted on the power supply device. Therefore, it is desired to provide column portions in the frame and arrange components between the column portions to improve the utilization efficiency of space. Focusing on the column portions provided in this way, the inventor has come up with a configuration in which at least one of the boss portions is provided in a heat sink portion, and further boss portions are provided at sites such as the tips of the column portions away from the heat sink portion in order to stabilize the mounting posture of the device. However, the column portions do not have good water circulation property during die casting, and it is difficult to provide a boss portion at the tip of the column portion. For this reason, while seeking stability of the mounting posture, the inventor has considered a frame shape that has good water circulation property and is easy to manufacture.

[0005] An object of the present disclosure is to provide a power supply device including a boss portion that is easy to manufacture and has a stable mounting posture.

Means for Solving the Problems

[0006] A power supply device according to one aspect of the present invention is: Electronic components and, A circuit board on which the aforementioned electronic components are mounted, A die-cast base frame, The base frame is provided with a plurality of boss portions, each having screw holes for mounting the device, The aforementioned base frame is The heatsink section, First column portion and second column portion extending from the heat sink portion so as to span at least a portion of the substrate, A third column extending from the heat sink portion between the first column portion and the second column portion, It has a beam section provided to connect the tips of the first column section, the second column section, and the third column section, The boss portion is provided at least on the heat sink portion and the beam portion. [Effects of the Invention]

[0007] According to the present invention, a power supply device is provided that has a boss portion that is easy to manufacture and has a stable mounting position. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view of a power supply device 1 according to an embodiment of the present invention. [Figure 2] Figure 2 is a side cross-sectional view of the power supply unit 1. [Figure 3] Figure 3 is a view taken along line III-III in Figure 2. [Modes for carrying out the invention]

[0009] Embodiments of the present invention will be described below with reference to the drawings. For the sake of clarity, configurations having the same reference numerals as those already described will be omitted from the description of the embodiments.

[0010] Figure 1 is a perspective view of a power supply device 1 according to an embodiment of the present invention. Figure 2 is a side cross-sectional view of the power supply device 1. The power supply device 1 is connected to, for example, an external AC power source and converts the AC to DC to supply power to a motor or the like. The power supply device 1 is a device that can be attached to a fixing member such as a mounting rack by screw fastening. Hereafter, the power supply device 1 will be described using the front-to-back direction, up-and-down direction, and left-to-right direction as defined in Figure 1.

[0011] As shown in Figures 1 and 2, the power supply unit 1 includes electronic components such as a power conversion unit 2, a power connector 3, a control connector C, a switch 5, and a capacitor 9, as well as a first circuit board 10 and a base frame 40. The illustrated power supply unit 1 further includes a second circuit board 20, a third circuit board 30, a lower case 6, an upper case 7, and a front panel 8. The lower case 6, upper case 7, and front panel 8 form an internal space inside the power supply unit 1.

[0012] The base frame 40 is located within the internal space of the power supply unit 1. The base frame 40 is a die-cast metal component. The first circuit board 10 and the second circuit board 20 are mounted on the base frame 40. The base frame 40 integrally (monolithically) includes multiple boss sections 50, a heat sink section 45, a first column section 41, a second column section 42, a third column section 43, and a beam section 44.

[0013] The heat sink section 45 has a flat heat input section 451 and a heat dissipation section 452 with multiple fins that protrude downward from the heat input section 451. Thermal conductive grease or the like is applied to the upper surface of the heat input section 451, and this upper surface of the heat input section 451 is in close contact with the lower surface of the first substrate 10.

[0014] The upper case 7 is a plate-shaped member that covers the internal space of the power supply unit 1 from above. The upper case 7 is attached to the base frame 40.

[0015] The lower case 6 is a plate-like member that covers the internal space of the power supply device 1 from below. The lower case 6 is also attached to the base frame 40. The lower case 6 has a lower surface portion 6d that covers the lower part of the internal space, a right surface portion 6r that covers the right side of the internal space, and a left surface portion 6l that covers the left side of the internal space. The lower case 6 is formed by bending a metal plate and integrally includes the lower surface portion 6d, the right surface portion 6r, and the left surface portion 6l.

[0016] The front panel 8 is a plate-like member that covers the internal space of the power supply device 1 from the front. A plurality of through holes penetrating in the front-rear direction are provided in the front panel 8. A part of the electronic components is exposed to the outside through these through holes.

[0017] As shown in FIG. 2, the first substrate 10 extends in the front-rear direction and the left-right direction. The first substrate 10 is mounted on the upper surface of the base frame 40. The first substrate 10 is arranged to face the base frame 40. The lower surface of the first substrate 10 serves as the mounting surface. The power conversion unit 2, the power connector 3, the capacitor 9, etc. are mounted on the first substrate 10.

[0018] The power conversion unit 2 converts alternating current to direct current or direct current to alternating current. The power conversion unit 2 is composed of elements such as coils, capacitors, and switching elements, for example. The power conversion unit 2 is mounted on the lower surface of the first substrate 10. The power conversion unit 2 generates a large amount of heat compared to other electronic components. Therefore, the power conversion unit 2 is provided so as to contact the heat input portion 451 of the heat sink portion 45. The power conversion unit 2 is efficiently cooled by the heat sink portion 45.

[0019] The power connector 3 is connected to a cable that is connected to an external device not shown. Power is supplied from the external device to the power conversion unit 2 or the power conversion unit 2 supplies power to the external device through the power connector 3. The power connector 3 is attached to the front end portion of the first substrate 10. The terminal portion of the power connector 3 is exposed to the front of the power supply device 1 through the opening of the front panel 8.

[0020] The second circuit board 20 extends in the front-to-back and left-to-right directions. The second circuit board 20 is positioned along the upper surface of the lower case 6. The second circuit board 20 is positioned in front of the heat sink section 45. A monitor device 4 is mounted on the second circuit board 20. The front of the monitor device 4 is exposed in front of the power supply unit 1 through an opening in the front panel 8.

[0021] The third circuit board 30 extends in the vertical and horizontal directions. The third circuit board 30 is located behind the front panel 8. A switch 5 is mounted on the third circuit board 30. The operating part of the switch 5 is exposed to the front of the power supply unit 1 through an opening in the front panel 8. The switch 5 is operated, for example, to switch the operating state or setting conditions of the power supply unit 1.

[0022] Next, the base frame 40 will be described in detail. Figure 3 is a view taken along line III-III in Figure 2. Note that Figure 2 is also a cross-sectional view taken along line II-II in Figure 3. The base frame 40 comprises a first column section 41, a second column section 42, a third column section 43, and a beam section 44. The first column section 41, the second column section 42, and the third column section 43 are all columnar parts that protrude forward from the upper end of the front surface of the heat sink section 45. The first column section 41 protrudes forward from the left end of the front surface of the heat sink section 45. The second column section 42 protrudes forward from the right end of the front surface of the heat sink section 45. The third column section 43 protrudes forward from the center of the front surface of the heat sink section 45 in the left-right direction. The third column section 43 extends between the first column section 41 and the second column section 42 in the left-right direction.

[0023] The beam section 44 is provided to connect the front end of the first column section 41 and the front end of the second column section 42. The beam section 44 is a columnar member that extends in the left-right direction between the first column section 41 and the second column section 42. The front end of the third column section 43 is connected to the center of the beam section 44 in the left-right direction. The front ends of the first column section 41 and the second column section 42 protrude forward from the beam section 44.

[0024] In the illustrated example, the upper surfaces of the first column portion 41, the second column portion 42, and the heat sink portion 45 are flush. The first substrate 10 is mounted on the upper surfaces of the first column portion 41, the second column portion 42, and the heat sink portion 45. The front portion of the first substrate 10 spans across the upper surfaces of the first column portion 41 and the second column portion 42. In other words, at least a part of the first substrate 10 spans across the first column portion 41 and the second column portion 42.

[0025] Electronic components such as a capacitor 9 are placed in the space between the first column 41 and the third column 43, and in the space between the second column 42 and the third column 43, and this capacitor 9 is mounted on the first substrate 10. An auxiliary heat sink H is placed in the space between the first column 41 and the third column 43, and in the space between the second column 42 and the third column 43, and this auxiliary heat sink H is mounted on the second substrate 20. The space between the beam section 44 and the front panel 8 houses the power connector 3, the monitoring device 4, and the switch 5.

[0026] Electronic components are mounted by utilizing the vertical height of the first column section 41, second column section 42, third column section 43, and beam section 44, which are formed to be thick in this manner, thus efficiently utilizing the internal space of the power supply unit 1 to mount the electronic components. Examples of electronic components that may be placed between the first column section 41 and the third column section 43, as well as between the beam section 44 and the front panel 8, include capacitors, heat sinks, connectors, monitoring devices, switches, as well as board connectors and coils.

[0027] The boss portion 50 is a part where mounting screw holes 57 for attaching the power supply unit 1 to a fixed part such as a rack are provided. In the illustrated example, the boss portion 50 includes a first boss portion 51, a second boss portion 52, a third boss portion 53, a fourth boss portion 54, a fifth boss portion 55, and a sixth boss portion 56.

[0028] The first boss portion 51 and the second boss portion 52 are provided on the upper surface of the heat sink portion 45. The first boss portion 51 and the second boss portion 52 are cylindrical parts that protrude upward from the upper surface of the heat sink portion 45. The first boss portion 51 is provided on the left rear corner of the upper surface of the heat sink portion 45, and the second boss portion 52 is provided on the right rear corner of the upper surface of the heat sink portion 45. Screw holes 57 for mounting devices, which open upward, are provided on the upper surfaces of the first boss portion 51 and the second boss portion 52.

[0029] Although not shown in the figures, the fourth boss portion 54 is located at approximately the same position as the first boss portion 51 in the left-right and front-back directions, and on the opposite side of the first boss portion 51 in the up-down direction. The fifth boss portion 55 is located at approximately the same position as the second boss portion 52 in the left-right and front-back directions, and on the opposite side of the second boss portion 52 in the up-down direction. The lower surfaces of the fourth boss portion 54 and the fifth boss portion 55 are each provided with screw holes 57 for mounting devices that open downwards.

[0030] The third boss portion 53 is provided on the upper surface of the central part of the beam portion 44 in the left-right direction. The third boss portion 53 is provided on the upper surface of the beam portion 44 at a position where the third column portion 43 is extended forward. It is a cylindrical portion of the third column portion 43 that protrudes upward from the upper surface of the beam portion 44. The upper surface of the third column portion 43 is provided with a screw hole 57 for mounting a device that opens upward.

[0031] The sixth boss portion 56 is located in approximately the same position as the third boss portion 53 in the left-right and front-back directions, and is on the opposite side of the third boss portion 53 in the up-down direction. A screw hole 57 for mounting a device, which opens downwards, is provided on the lower surface of the sixth boss portion 56.

[0032] Furthermore, the upper case 7 and the lower case 6 are provided with through holes at positions corresponding to the screw holes 57 for mounting the respective devices, and the openings of the screw holes 57 for mounting the devices are exposed to the outside.

[0033] In the power supply unit 1 of this embodiment, the die-cast base frame 40 has a heat sink portion 45, a first column portion 41, a second column portion 42, a third column portion 43, and a beam portion 44 provided to connect the ends of the first column portion 41, the second column portion 42, and the third column portion 43. In addition, boss portions 50 are provided on at least the heat sink portion 45 and the beam portion 44.

[0034] By the way, in order to span the first substrate 10, the base frame 40 only needs to have a first column 41 and a second column 42, and a third column 43 is unnecessary. On the other hand, since the mounting position is more stable if the spacing between the multiple device mounting screw holes 57 is wider, it is desirable to provide the device mounting screw holes 57 in both the heat sink section 45 and the column section. For this reason, it is conceivable to provide a third boss section 53 in the beam section 44.

[0035] However, unlike the power supply unit 1 of this embodiment, in a power supply unit without a third column 43, molten metal must reach the third boss from the first and second column sections via the beam section during die casting of the base frame. If the molten metal passage is this long, there is a risk that the molten metal will not sufficiently reach the third boss section, forcing the first and second column sections to be made thicker. This could impair the mounting of components inside the power supply unit 1.

[0036] Therefore, according to the power supply unit 1 of this embodiment, the third boss portion 53 is provided on the extension of the third column portion 43. As a result, molten metal can reach the third boss portion 53 through a straight molten metal channel passing through the third column portion 43, making it easier to fill the third column portion 43 with molten metal and enabling stable manufacturing of the base frame 40.

[0037] In the power supply unit 1 of this embodiment described above, the base frame 40 is provided with first substrate boss portions 61 to fourth substrate boss portions 64 that support the first substrate 10. As shown in Figure 3, the first substrate boss portions 61 to fourth substrate boss portions 64 are provided at each of the four corners of the upper surface of the base frame 40.

[0038] The first substrate boss portion 61 and the second substrate boss portion 62 are provided on the heat sink portion 45. The first substrate boss portion 61 and the second substrate boss portion 62 are provided on the upper surface of the heat sink portion 45 in positions that sandwich the power conversion unit 2 (electronic component). The power conversion unit 2 can be pressed against the heat sink portion 45 by the substrate mounting screws that are screwed into the first substrate boss portion 61 and the second substrate boss portion 62, thereby improving the cooling efficiency of the power conversion unit 2.

[0039] Furthermore, the third substrate boss portion 63 is provided on the first column portion 41, and the fourth substrate boss portion 64 is provided on the second column portion 42. The first column portion 41 and the second column portion 42 are configured to be somewhat thick in order to pour molten metal into the beam portion 44, so the first column portion 41 and the second column portion 42 have high rigidity. Since the third substrate boss portion 63 and the fourth substrate boss portion 64 are provided on the highly rigid first column portion 41 and the second column portion 42, the support rigidity of the first substrate 10 by the third substrate boss portion 63 and the fourth substrate boss portion 64 is increased.

[0040] The capacitor 9 (second electronic component) is an electronic component that generates less heat than the power conversion unit 2 (first electronic component). The power conversion unit 2 is mounted on the lower surface (mounting surface) of the first substrate 10 in a position that is in contact with the heat sink 45. The capacitor 9 is mounted on the mounting surface in a position that spans the first column 41 and the second column 42. In this way, electronic components that generate a lot of heat are placed in a location that is cooled by the heat sink 45, and electronic components that generate little heat are placed in a position that spans the first column 41 and the second column 42. According to the power supply device 1 of this embodiment, electronic components are placed in positions appropriate to the amount of heat generated.

[0041] As shown in Figure 2, the lower part of the capacitor 9 protrudes downward from the gap between the first column 41, the second column 42, and the third column 43. Since the space between the first column 41, the second column 42, and the third column 43 of the first substrate 10 is not blocked at the bottom by the heat sink 45, electronic components with a large height from the mounting surface can be mounted.

[0042] As shown in Figure 2, the power connector 3 for connecting to external devices is located on the side opposite the heat sink portion 45 from the beam portion 44. Since the area in front of the beam portion 44 is closer to the outside of the power supply unit 1, placing the power connector 3 in this position makes it easy to insert and remove.

[0043] Furthermore, the back surface of the third board 30 (sub-board), on which a control connector C for connecting to external devices is mounted, is supported by a beam portion 44. A cable is connected to this control connector C that transmits signals from external devices to set the operating status and operating conditions of the power supply unit 1, as well as signals to control the power supply unit 1. The insertion and removal direction of the control connector C is in the front-to-back direction, and since the rear surface of the third board 30 on which the control connector C is mounted is supported by the front surface of the beam portion 44, it is easy to insert the cable into the control connector C.

[0044] While embodiments of this disclosure have been described above, it goes without saying that the technical scope of this disclosure should not be interpreted restrictively by the description of these embodiments. These embodiments are merely examples, and it will be understood by those skilled in the art that various modifications to the embodiments are possible within the scope of the invention described in the claims. The technical scope of this disclosure should be determined based on the scope of the invention described in the claims and the scope of its equivalents. [Explanation of Symbols]

[0045] 1 Power supply 2 Power Conversion Unit 3 Power connector 4. Monitoring device 5 switches 6. Lower case 6d Bottom part 6l Left side 6r Right side 7 Upper case 8 Front Panel 9 Capacitors 10 First board 20 Second board 30 Third board 40 Base Frame 41 First pillar section 42 Second pillar section 43 Third pillar part 44 Beam section 45 Heatsink section 50 Boss Section 51 First Boss Section 52 Second Boss Section 53 Third Boss Section 54. Fourth Boss Section 55 Fifth Boss Section 56 Sixth Boss Section 57 Screw holes for device mounting 61 First board boss section 62 Second board boss section 63 Third board boss section 64 Fourth board boss section 451 Heat input section 452 Heat radiation part

Claims

1. Electronic components and, A circuit board on which the aforementioned electronic components are mounted, A die-cast base frame, The base frame is provided with a plurality of boss portions, each having screw holes for mounting the device, The aforementioned base frame is The heatsink section, First column portion and second column portion extending from the heat sink portion so as to span at least a portion of the substrate, A third column extending from the heat sink portion between the first column portion and the second column portion, It has a beam section provided to connect the tips of the first column section, the second column section, and the third column section, The boss portion is provided at least on the heat sink portion and the beam portion of the power supply device.

2. The base frame and the cover that covers the substrate are provided. The power supply device according to claim 1, wherein the boss portion penetrates the cover and the screw hole is exposed to the outside of the cover.

3. The power supply device according to claim 1, wherein the base frame is provided with a substrate boss portion for supporting the substrate.

4. At least two of the aforementioned substrate bosses are provided on the heat sink portion. The power supply device according to claim 3, wherein the two substrate bosses are provided in positions that sandwich the electronic component.

5. The power supply device according to claim 3, wherein the first column portion and the second column portion are provided with the substrate boss portion.

6. The aforementioned electronic component comprises a first electronic component and a second electronic component that generates less heat than the first electronic component. The mounting surface of the aforementioned substrate faces the base frame. The first electronic component is mounted on the mounting surface at a position in contact with the heat sink portion, The power supply device according to claim 1, wherein the second electronic component is mounted on the mounting surface at a position spanning the first column and the second column.

7. The power supply device according to claim 6, wherein at least a portion of the second electronic component protrudes from the gap between the first column portion, the second column portion, and the third column portion.

8. The power supply device according to claim 1, wherein a connector for connecting to an external device is provided on the side opposite to the heat sink portion from the beam portion.

9. The power supply device according to claim 1, wherein the back surface of a sub-board on which a connector for connection to an external device is mounted is supported by the beam portion.

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