Cover member with outer frame, method for manufacturing the same, and semiconductor optical device

Abstract

To provide a cover component with an outer frame that achieves high airtight sealing performance in a resin joint, which is advantageous in terms of manufacturing costs. [Solution] A cover member with an outer frame for covering an optical element and sealing it to a substrate, having a wall portion consisting of an upper wall portion and four side wall portions, and a lower opening, with an inverted concave cross-section, wherein one or two of the wall portions are made of a translucent material and the other is made of ceramic, and the wall portion made of the translucent material is joined to an adjacent wall portion made of ceramic by a resin joint, and the resin joint portion consists of a joint region A where the entire surface of one end face of the wall portion made of translucent material and the wall portion made of ceramic is joined to one side of the outer edge of the inner main surface of the other, and a joint joint region B where the inner main surface of the wall portion made of translucent material and the inner main surface of the wall portion made of ceramic are joined to fill the entire corner formed by the wall portion made of translucent material and the wall portion made of ceramic, the cover member with an outer frame.

Description

[Technical Field]

[0001] The present invention relates to a cover member with an outer frame and a method for manufacturing the same. The present invention also relates to a semiconductor optical device having the above-described cover member with an outer frame. [Background technology]

[0002] Devices using light-emitting diodes (LEDs) are used in a wide range of applications, including backlights for mobile phones and large LCD televisions, and for general lighting. For example, in the case of a light-emitting device that uses a light-emitting diode (visible light LED) that emits visible light, a common configuration is to mount the LED chip on a flat substrate, such as aluminum nitride, and then seal it using a resin-based material.

[0003] In contrast, light-emitting devices using ultraviolet light-emitting diodes (UV-LEDs), laser diodes (LDs), vertical-cavity surface-emitting lasers (VCSELs), etc., require hermetically sealed structures. Furthermore, VCSELs also require diffusers.

[0004] Hermetically sealed structures are sometimes required not only for the light-emitting devices mentioned above, but also for light-receiving devices such as sensors. For example, there are devices called MEMS (Micro Electro Mechanical Systems) that integrate electrical circuits and fine mechanical structures onto a single substrate. Silicon substrates are one example of substrates used in MEMS. Similar to light-emitting devices, light-receiving devices are also required to have a cover component with an outer frame.

[0005] Therefore, optical devices such as light-emitting and light-receiving devices require a cover component with an outer frame. While it is possible to provide the outer frame on a substrate such as aluminum nitride, it is more practical from a cost perspective to provide the outer frame on the cover component.

[0006] The simplest method for manufacturing a cover component with an outer frame is to fabricate the cover component and the outer frame separately and then bond them together with a resin-based material. However, it has been difficult to achieve an airtight seal using resin-based materials, which are organic.

[0007] One method for achieving hermetic sealing is to form the outer frame by directly wet etching the glass. However, this method does not allow for perpendicularity between the flat plate portion and the outer frame portion, and it is difficult to create a deep frame. Therefore, in order to maintain perpendicularity while also achieving hermetic sealing, methods of directly joining the flat plate portion and the outer frame portion, such as diffusion bonding or room-temperature bonding, have been investigated.

[0008] For example, synthetic quartz glass cavities (see Patent Document 1) are made by bonding one synthetic quartz glass substrate to another synthetic quartz glass substrate and bonding them at 1000-1200°C; framed anti-reflective glass (see Patent Document 2) is made by using a silicon substrate as a frame-shaped member and superimposing it on a flat borosilicate glass member and anodic bonding; and glass sealing materials (see Patent Document 3) are made by sandwiching a glass plate and a glass piece between a base mold and an opposing mold and bonding them by heating and pressing. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Japanese Patent Publication No. 2020-21937 [Patent Document 2] Patent No. 5646981 [Patent Document 3] Japanese Patent Publication No. 2013-222522 [Overview of the project] [Problems that the invention aims to solve]

[0010] Thus, while high airtightness is achieved through inorganic bonding, adhesives using resin-based components, which are organic materials advantageous in terms of manufacturing cost, have not been able to achieve high airtightness, as mentioned earlier.

[0011] Therefore, the present invention aims to provide a framed cover member that achieves high hermetic sealing performance in a resin joint, which is advantageous in terms of manufacturing cost, and a method for manufacturing the same. Furthermore, the present invention aims to provide a semiconductor optical device in which the framed cover member and the substrate are integrated and the optical elements are hermetically sealed. [Means for solving the problem]

[0012] As a result of diligent research by the inventors, it was found that even with bonding using an organic resin-based component, high airtightness can be achieved by providing an outer frame cover member with an additional bonding area adjacent to the conventional bonding area as the resin bonding area, thus completing the present invention.

[0013] In other words, the gist of this invention is as follows:

[0014] [1] A cover member with an outer frame that covers an optical element on a substrate on which an optical element is installed and seals the substrate, The aforementioned cover member with an outer frame has a wall portion and a lower opening, and has an inverted concave cross-sectional shape. The aforementioned wall consists of an upper wall and four side wall sections. The upper wall portion and the four side wall portions are each rectangular flat plates having a pair of opposing main surfaces and end surfaces. The upper wall and the four side walls are made of, in one or two parts, a translucent material, and the others, ceramics. The wall portion made of the translucent material is joined to an adjacent wall portion made of the ceramic by a resin joint. The resin joint consists of a joint region A and a joint region B adjacent to the joint region A. The joining region A is a region where the entire one end face of one of the wall portions made of the translucent material and the wall portion made of the ceramics is joined to one side of the outer edge portion of the inner main surface of the other, The joining region B is an outer frame - attached cover member which is a region where the inner main surface of the wall portion made of the translucent material and the inner main surface of the wall portion made of the ceramics are joined so as to fill the entire corner portion formed by the wall portion made of the translucent material and the wall portion made of the ceramics. [2] The joining region A and the joining region B are composed of the same cured resin composition and are integrally joined without a seam, the outer frame - attached cover member according to [1] above. [3] The average thickness of the joining region A is 10 to 50 μm, the outer frame - attached cover member according to [1] or [2] above. [4] The average width of the joining region B in contact with the inner main surface of the wall portion made of the translucent material is 50 to 200 μm, the outer frame - attached cover member according to any one of [1] to [3] above. [5] The average width of the joining region B in contact with the inner main surface of the wall portion made of the ceramics is 50 to 200 μm, the outer frame - attached cover member according to any one of [1] to [4] above. [6] The joining region B has a ratio of the width in contact with the inner main surface of the wall portion made of the translucent material to the width in contact with the inner main surface of the wall portion made of the ceramics of 0.5 to 2.0, the outer frame - attached cover member according to any one of [1] to [5] above. [7] The entire one end face of the wall portion made of the ceramics and one side of the outer edge portion of the inner main surface of the wall portion made of the translucent material are joined, the outer frame - attached cover member according to any one of [1] to [6] above. [8] The ceramics is glass - ceramics, alumina, aluminum nitride, boron nitride, silicon carbide, zirconia, or silicon nitride, the outer frame - attached cover member according to any one of [1] to [7] above. [9] The surface roughness Ra of the bonding surface of the ceramics bonded by the resin bonding part is 10 to 50 μm, and the cover member with an outer frame according to any one of [1] to [8].

[10] The light-transmissive material is made of glass, silicon, sapphire, or resin material, and the cover member with an outer frame according to any one of [1] to [9].

[11] The resin bonding part is made of at least one cured resin composition selected from the group consisting of silicone resin, epoxy resin, acrylic resin, epoxyamine resin, polyurethane resin, phenolic resin, and cyanoacrylate resin, and the cover member with an outer frame according to [1] to

[10] .

[12] The optical element is a light-emitting element, and the cover member with an outer frame according to [1] to

[11] .

[13] The wall part is such that the upper wall part is made of a light-transmissive material, and the four side wall parts are made of ceramics, and the cover member with an outer frame according to any one of [1] to

[12] .

[14] The wall part is such that one of the four side wall parts is made of a light-transmissive material, and the remaining three side wall parts and the upper wall part are made of ceramics, and the cover member with an outer frame according to any one of [1] to

[12] .

[15] The wall part is such that two opposing side wall parts of the four side wall parts are made of a light-transmissive material, and the remaining two opposing side wall parts and the upper wall part are made of ceramics, and the cover member with an outer frame according to any one of [1] to

[12] .

[0015]

[16] It has the cover member with an outer frame according to any one of [1] to

[15] , a substrate, and an optical element provided on the substrate. A semiconductor optical device in which the cover member with an outer frame and the substrate are integrated through a sealing layer, and the optical element is hermetically sealed.

[0016]

[17] A manufacturing method of a cover member with an outer frame that covers an optical element and seals it to a substrate with respect to the substrate on which the optical element is installed. To provide a wall made of ceramic with four integrated side walls, a wall made of ceramic with three integrated side walls and an upper wall, or a wall made of ceramic with a pair of opposing side walls and an upper wall integrated. Forming a coating of resin composition on a release film using the doctor blade method. After pressing the end face of the wall portion made of the integrated ceramics against the coating film, the release film is peeled off from the coating film, and the coating film is transferred to the end face of the wall portion made of the integrated ceramics. To temporarily bond a translucent material to the end face of the wall portion made of the ceramics via the transferred coating film, and A method for manufacturing a cover member with an outer frame, comprising applying a load to a wall portion made of integrated ceramics to which the translucent material is temporarily bonded, heating to cure the resin composition, and bonding the translucent material.

[18] The thickness of the coating film is 30 to 500 μm, A method for manufacturing a framed cover member according to

[17] , wherein the average thickness of the cured resin composition is 10 to 50 μm.

[19] The load is 0.002 to 0.006 N / mm 2 A method for manufacturing a framed cover member according to

[17] or

[18] , wherein the load is applied.

[20] As a wall made of the integrated ceramic, multiple wall sections are prepared by making multiple holes of a desired size and shape in a ceramic plate, A method for manufacturing a framed cover member according to any one of

[17] to

[19] , comprising curing the resin composition and then dicing it to form individual pieces to obtain a plurality of framed cover members. [Effects of the Invention]

[0017] According to the present invention, a cover member with an outer frame that achieves high hermetic sealing performance at the resin joint can be provided. Therefore, the above-mentioned cover member with an outer frame can be obtained at low cost. In addition, a semiconductor optical device in which the cover member with an outer frame and the substrate are integrated and the optical element is hermetically sealed can also be obtained at low cost. [Brief explanation of the drawing]

[0018] [Figure 1] Figure 1 is a schematic perspective view showing one embodiment of the cover member with an outer frame according to this embodiment. [Figure 2] Figure 2 is a schematic cross-sectional view showing one embodiment of the cover member with an outer frame according to this embodiment. [Figure 3] Figure 3 is a schematic cross-sectional view taken along the line A-A' in Figure 1. [Figure 4] Figure 4 is an enlarged schematic diagram of the area near the resin joint in Figure 3. [Figure 5] Figure 5 is a schematic cross-sectional view taken along the line B-B' in Figure 2. [Figure 6] Figure 6 shows a microscopic image of the resin joint in the framed cover member of Example 1. [Figure 7] Figure 7 shows a microscopic image of the resin joint in the framed cover member of Example 5. [Figure 8] Figure 8 shows some steps in the manufacturing method of the framed cover member according to this embodiment. Figures 8(a) and 8(b) are schematic top and side views, respectively, of a wall portion in which four side walls made of ceramic are integrated. Figure 8(c) is a schematic side view showing a state in which a resin composition coating film is formed on the end faces of the framed wall portion. Figure 8(d) is a schematic side view showing a state in which a translucent material is joined as the top wall portion to the end faces of the four ceramic wall portions via a resin joint. Figure 8(e) is a schematic top view showing the dicing line when the framed cover member with multiple portions is divided into individual pieces. [Modes for carrying out the invention]

[0019] The present invention will be described in detail below, but the present invention is not limited to the following embodiments and can be modified and implemented as appropriate without departing from the spirit of the invention. In this specification, the "~" symbol indicating a numerical range is used to mean that the numbers before and after it are included as the lower and upper limits, respectively.

[0020] Cover component with outer frame The cover member with an outer frame according to this embodiment is used to cover the optical element on a substrate on which the optical element is installed, thereby sealing the substrate.

[0021] One embodiment of the cover member 10 with an outer frame according to this embodiment, as shown in Figure 1, has a wall portion 11 consisting of an upper wall portion 101 and four side wall portions 102, 103, 104, and 105, and a lower opening 12, and has an inverted concave cross-sectional shape as shown in Figure 3, which is a schematic cross-sectional view taken along line A-A' in Figure 1. In this embodiment, the framed cover member is made of a translucent material for the upper wall and one or two of the four side walls, and ceramics for the other. Figure 1 shows the case where the upper wall 101 is made of a translucent material and the four side walls 102, 103, 104, and 105 are all made of ceramics. Partially shown in Figure 3 are the upper wall 101 and side walls 102 and 104, and both the upper wall and the four side walls have a pair of opposing main surfaces and end surfaces. Specifically, as shown in Figure 3, the upper wall 101 has a pair of opposing main surfaces 101a and 101b and four end surfaces, one of which is 101c. Similarly, the side wall 102 has a pair of opposing main surfaces 102a and 102b and four end surfaces, two of which are 102c. Furthermore, the side wall portion 104 has a pair of opposing main surfaces 104a and 104b, and four end faces, two of which are 104c. These upper wall portion 101 and the four side wall portions 102, 103, 104, and 105 are rectangular flat plates. However, in some cases, the upper wall portion and side wall portions made of ceramics among the wall portions 11 may not have a clear boundary between them due to integral molding or other reasons.

[0022] In Figure 3, the upper wall portion 101, made of a translucent material, is connected to the adjacent ceramic wall portions by four side wall portions 102, 103, 104, and 105. That is, the upper wall portion 101 is joined to each of the four side wall portions 102, 103, 104, and 105 by resin joint portions 13 (not shown in Figure 1).

[0023] Figure 4 shows an enlarged schematic diagram of the area around the resin joint 13 in Figure 3, where the resin joint 13 is divided into joint region A (13A) and joint region B (13B). Here, joint region A (13A) is the region where one end face of the side wall portion 102 made of ceramic, that is, the entire end face of the side wall portion 102 on the side of the upper wall portion 101 made of translucent material, and one side of the outer edge of the inner main surface 101a of the upper wall portion 101 made of translucent material are joined. On the other hand, joint region B (13B) is a region adjacent to joint region A (13A) where the inner main surface 101a of the upper wall portion 101 made of a translucent material and the inner main surface 102a of the side wall portion 102 made of ceramics are joined together, filling the entire corner portion (circled by the dotted line in Figure 4) formed by the upper wall portion 101 made of a translucent material and the side wall portion 102 made of ceramics. Figure 4 shows the bonding between the translucent upper wall portion 101 and the ceramic side wall portion 102. The translucent upper wall portion 101 is bonded to the other three ceramic side wall portions 103, 104, and 105 by a resin bonding portion consisting of bonding region A and bonding region B.

[0024] Another embodiment of the cover member with outer frame according to this embodiment is shown in Figure 2, which has a wall portion 21 consisting of an upper wall portion 201 and four side wall portions 202, 203, 204, and 205, and a lower opening 22, and has an inverted concave cross-sectional shape as shown in Figure 5, which is a schematic cross-sectional view taken along line B-B' in Figure 2. In this embodiment, the framed cover member is made of a translucent material for one or two of the upper wall and four side walls, and ceramics for the other two. Figure 2 shows the case where the upper wall 201 and three side walls 202, 203, and 205 are made of ceramics, and the remaining side wall 204 is made of a translucent material. Partially shown in Figure 5 are the upper wall 201 and side walls 202 and 204, and both the upper wall and the four side walls have a pair of opposing main surfaces and end surfaces. Specifically, as shown in Figure 5, the upper wall 201 has a pair of opposing main surfaces 201a and 201b, and four end surfaces, one of which is 201c. Similarly, the side wall 202 has a pair of opposing main surfaces 202a and 202b, and four end surfaces, one of which is 202c. Furthermore, the side wall portion 204 has a pair of opposing main surfaces 204a and 204b, and four end faces, one of which is 204c. These upper wall portion 201 and the four side wall portions 202, 203, 204, and 205 are rectangular flat plates. However, in some cases, the upper wall portion and side wall portions made of ceramics among the wall portions 11 may not have a clear boundary between adjacent wall portions due to integral molding or other reasons.

[0025] In Figure 2, the side wall portion 204, which is made of a translucent material, is adjacent to the ceramic wall portion, which consists of the upper wall portion 201 and the two side wall portions 203 and 205. That is, the side wall portion 204 is joined to the upper wall portion 201 and each of the two side wall portions 203 and 205 by resin joint portions 23 (not shown in Figure 2).

[0026] Figure 5 shows the resin joint 23, and as with Figure 4 described above, the resin joint 23 is divided into joint region A (23A) and joint region B (23B). Here, joint region A (23A) is the region where one end face of the upper wall portion 201 made of ceramic, that is, the entire end face 201c of the upper wall portion 201 on the side wall portion 204 made of translucent material, and one side of the outer edge of the inner main surface 204a of the side wall portion 204 made of translucent material are joined. On the other hand, joint region B (23B) is adjacent to joint region A (23A) and is the region where the inner main surface 204a of the side wall portion 204 made of translucent material and the inner main surface 201a of the upper wall portion 201 made of ceramic are joined so as to fill the entire corner formed by the side wall portion 204 made of translucent material and the upper wall portion 201 made of ceramic. Figure 5 shows the bonding between the side wall portion 204 made of a translucent material and the upper wall portion 201 made of ceramics. The side wall portion 204 made of translucent material is similarly bonded to the two side wall portions 203 and 205 made of ceramics by a resin bonding portion consisting of bonding region A and bonding region B.

[0027] Thus, in this embodiment, the cover member with an outer frame is joined by a resin joint consisting of a joint area A and a joint area B, as described above, by a wall made of ceramics and a wall made of a translucent material. This allows for high airtight sealing even when using a resin-based member made of organic material.

[0028] In both Figures 1 and 2, the entire surface of one end face of a wall made of ceramics is joined to one side of the outer edge of the inner main surface of a wall made of translucent material. This configuration is preferable from the viewpoint of productivity. Specifically, the wall made of ceramics may be obtained by integral molding, in which case a film of the resin composition that will become the resin joint can be formed on the end faces of multiple wall parts made of ceramics at once. As a result, the desired resin joint can be formed at once by bonding and curing the wall parts made of translucent material. However, the above is based on productivity considerations and does not in any way exclude the configuration in which the entire surface of one end face of a wall made of translucent material is joined to one side of the outer edge of the inner main surface of a wall made of ceramics.

[0029] Furthermore, the framed cover member in Figure 1 has an upper wall made of a translucent material and four side walls made of ceramics, and this configuration is preferable from the viewpoint of productivity. Specifically, a multi-part wall section is manufactured by drilling multiple holes of desired size and shape into a ceramic plate, and a film of a resin composition that will serve as a resin joint is formed on the end face of the wall section in one step. Then, after bonding a sheet of translucent material, the resin composition is cured to form a resin joint, and by dicing to form individual pieces, a large number of cover members with outer frames can be manufactured.

[0030] The framed cover member in Figure 2 has one of its four side walls made of a translucent material, while the remaining three side walls and the top wall are made of ceramics. This type of configuration is also called a side window cap and is suitable when using end-face light-emitting optical elements.

[0031] Figures 1 and 2 both show an embodiment in which the top wall and one of the four side walls are made of a translucent material. However, in this embodiment, the cover member with an outer frame may consist of the top wall and two of the four side walls made of a translucent material, with the other three made of ceramics. One such embodiment is one in which two of the four side walls that are opposite each other are made of a translucent material, and the remaining two corresponding side walls and the top wall are made of ceramics. This embodiment is suitable when used as a cover member with an outer frame that houses multiple optical elements.

[0032] In this embodiment, the wall portion has a rectangular shape for both the top wall portion and the side walls portion. If the above quadrilateral is a rectangle, the four side walls portion will be provided perpendicular to the top wall portion, but in this case, perpendicular does not need to be exactly 90°, but it is sufficient if it is approximately perpendicular within 90° ± 5°.

[0033] Furthermore, if the above quadrilateral is a parallelogram or trapezoid, the angle between the main surface of the upper wall and the main surface of at least one side wall may not be perpendicular at 90°. In this case as well, it is sufficient that good airtight sealing is maintained by the resin joint, and the desired characteristics can be adopted accordingly.

[0034] In this embodiment, the resin joint consists of a joint area A and a joint area B. It is preferable that joint area A and joint area B are made of the same cured resin composition, and more preferably that they are seamlessly integrated. In other words, in this embodiment, it is preferable to provide both joining region A and joining region B at the same time, rather than providing a separate joining region B after joining the wall portion made of a translucent material and the wall portion made of ceramics by joining region A. This is because it improves airtight sealing by eliminating gaps.

[0035] A resin joint in which bonding region A and bonding region B are formed at the same time can be realized, for example, by the manufacturing method described later. In such a resin joint, the same resin composition is used as the resin composition before curing. Therefore, it is composed of the same cured resin composition, and as shown in Figure 6, no seam is observed between bonding region A (dotted line) and bonding region B (dotted line), and they appear to be integrated.

[0036] Regarding the resin joint in this embodiment, the average thickness of the joint region A is preferably 10 to 50 μm. Here, even if there is unevenness in the thickness of the joint region A, from the viewpoint of absorbing the surface roughness of the ceramic side with the resin joint, the average thickness is preferably 10 μm or more, more preferably 12 μm or more, even more preferably 15 μm or more, even more preferably 18 μm or more, and particularly preferably 20 μm or more. Furthermore, from the viewpoint of preventing excessive bleeding of the resin composition, the average thickness is preferably 50 μm or less, more preferably 45 μm or less, even more preferably 42 μm or less, and even more preferably 40 μm or less. Note that when the resin joint is formed by a printing method, although it varies depending on the equipment used for printing, it is difficult to achieve a joint region A thickness significantly exceeding 10 μm.

[0037] The average thickness mentioned above is obtained by measuring the resin joint using a microscope. Specifically, a cover member cut to 15 mm square or less is embedded in epoxy resin and polished to obtain a measurement surface. The measurement surface is then measured using an OLYMPUS MVX10 digital length measuring microscope at a magnification of 283x (6.3x zoom x 45x effective magnification), and the average thickness is measured using the length measuring function attached to the MVX10. The above average thickness measurement was performed on 20 arbitrary points on the surface of the resin joint, and the average value of these measurements was taken as the average thickness of the joint area A. The 20 measurement surfaces mentioned above may be obtained from multiple equivalent cover members with outer frames, if necessary.

[0038] In this embodiment, the average width of the bonding region B in contact with the main inner surface of the wall made of the translucent material is preferably 50 to 200 μm. The above width refers to the width from the boundary between bonding region A and bonding region B. Here, from the viewpoint of achieving higher sealing performance, the average width is preferably 50 μm or more, more preferably 60 μm or more, and even more preferably 75 μm or more. Furthermore, from the viewpoint of maintaining the thickness of the resin bonding portion, the average width is preferably 200 μm or less, more preferably 190 μm or less, and even more preferably 175 μm or less.

[0039] In this embodiment, the average width of the bonding region B in contact with the main inner surface of the ceramic wall is preferably 50 to 200 μm. The above width refers to the width from the boundary between bonding region A and bonding region B. Here, from the viewpoint of achieving higher sealing performance, the average width is preferably 50 μm or more, more preferably 60 μm or more, and even more preferably 75 μm or more. Furthermore, from the viewpoint of maintaining the thickness of the bonding portion, the average width is preferably 200 μm or less, more preferably 190 μm or less, and even more preferably 175 μm or less. The average of the above widths is obtained by measuring the resin joint using a microscope, using the same method as for the average thickness of joint area A. The measurement of the above average widths is also performed on 20 arbitrary points on the resin joint surface, similar to the measurement of the average thickness of joint area A, and the average value of these measurements is taken as the average width of the joint area B that is in contact with the main inner surface of the ceramic wall.

[0040] In this embodiment, the ratio of the joining region B, expressed as [width in contact with the main inner surface of the wall made of translucent material / width in contact with the main inner surface of the wall made of ceramics], is preferably 0.5 to 2.0. In order to ensure sufficient bonding strength between the translucent material and the ceramics, a shape that can most efficiently distribute the stress applied to bonding region B is considered preferable, and such a shape is an isosceles triangle. The above isosceles triangle means that the width in contact with the main inner surface of the wall made of the translucent material is equal to the width in contact with the main inner surface of the wall made of the ceramics. From the viewpoint of achieving a fillet shape close to an isosceles triangle, the above ratio is preferably 0.5 or greater, followed by greater than 0.5, 0.52 or greater, 0.55 or greater, 0.57 or greater, 0.6 or greater, 0.65 or greater, 0.7 or greater, and 0.75 or greater, in that order of preference. Also, from the same viewpoint, the above ratio is preferably 2.0 or less, followed by less than 2.0, 1.92 or less, 1.81 or less, 1.75 or less, 1.67 or less, 1.54 or less, 1.43 or less, and 1.33 or less, in that order of preference.

[0041] Furthermore, as a method to bring the above ratio closer to 1, for example, when heat-curing the resin composition to form a resin joint, the orientation of the cover member can be appropriately changed so that the cover member does not continuously receive gravity in one direction, such as by reversing the vertical direction in which the cover member is placed during the heat-curing process.

[0042] The resin joint is formed by the curing of the resin composition, which then bonds the translucent material to the ceramic. The resin composition is not particularly limited, but examples of resins that make up the resin composition include thermosetting resins, photocurable resins, chemically curable resins, and moisture-curing resins. More specifically, examples include silicone resins, epoxy resins, acrylic resins, epoxyamine resins, polyurethane resins, phenolic resins, and cyanoacrylate resins. Among these, thermosetting organic silicone resins, thermosetting organic modified silicone resins, photocurable organic silicone resins, photocurable organic modified silicone resins, heat- and light combined organic silicone resins, heat- and light combined organic modified silicone resins, and addition-curing silicone resins are preferred, and from the viewpoint of manufacturing method, thermosetting organic silicone resins, thermosetting organic modified silicone resins, heat- and light combined organic silicone resins, and heat- and light combined organic modified silicone resins are more preferred.

[0043] When the translucent material is glass, the resin constituting the resin composition is more preferably a thermosetting organic silicone resin, a thermosetting organic modified silicone resin, a heat- and light combined organic silicone resin, or a heat- and light combined organic modified silicone resin. When the light-transmitting material is silicon, the resin constituting the resin composition is more preferably a thermosetting organic silicone resin, a thermosetting organic modified silicone resin, a heat- and light combined organic silicone resin, or a heat- and light combined organic modified silicone resin. When the translucent material is sapphire, the resin constituting the resin composition is more preferably a thermosetting organic silicone resin, a thermosetting organic modified silicone resin, a heat- and light combined organic silicone resin, or a heat- and light combined organic modified silicone resin. When the light-transmitting material is a resin material, the resin constituting the resin composition is more preferably a thermosetting organic silicone resin, a thermosetting organic modified silicone resin, a heat- and light combined organic silicone resin, or a heat- and light combined organic modified silicone resin.

[0044] Furthermore, when obtaining the framed cover member according to this embodiment by the manufacturing method described later, it is preferable to use a resin composition that is easily peelable from the release film for the coating of the resin composition formed on the release film.

[0045] The ceramics used in this embodiment are not particularly limited, but examples include glass ceramics, alumina, aluminum nitride, boron nitride, silicon carbide, zirconia, and silicon nitride. From the viewpoint of heat dissipation, aluminum nitride is preferred, and from the viewpoint of reflectivity, glass ceramics are preferred. Furthermore, two or more types of ceramics may be mixed and used.

[0046] In this embodiment, the surface roughness Ra of the bonding surface of the ceramics joined by the resin bonding portion is preferably 10 to 50 μm. Here, when the resin bonding portion is formed by a printing method, a certain degree of flatness of the bonding surface of the ceramics is required, whereas when the resin bonding portion in this embodiment is formed by the method described later, high airtightness can be achieved without problems even if the flatness of the bonding surface is low. For this reason, the surface roughness Ra of the ceramics in this embodiment may be 10 μm or more, 20 μm or more, or 25 μm or more. Furthermore, from the viewpoint of the thickness of the resin bonding portion, the surface roughness Ra is preferably 50 μm or less, more preferably 40 μm or less, and even more preferably 35 μm or less.

[0047] The ceramics in this embodiment are glass ceramics in which filler components are dispersed in a glass matrix. The specific glass softening point Ts of the glass matrix in glass ceramics is not particularly limited, but is preferably 450 to 1000°C. Here, the glass softening point Ts is preferably 1000°C or less, more preferably 950°C or less, and even more preferably 900°C or less. Furthermore, from the viewpoint of suppressing the increase of carbon residue during firing which impedes insulation and from the viewpoint of heat resistance when hermetically sealing with the substrate, the glass softening point Ts is preferably 450°C or higher, more preferably 460°C or higher, and even more preferably 470°C or higher. In this specification, the glass softening point Ts of the glass matrix is ​​the temperature at the fourth inflection point of the DTA chart of the glass itself. Furthermore, the preferred combination of upper and lower limit values ​​is arbitrary.

[0048] While conventionally known glass matrices can be used, it is preferable that they contain at least one of bismuth oxide and boron oxide, for example. That is, the glass matrix is ​​preferably bismuth oxide-based glass or borosilicate-based glass.

[0049] Examples of borosilicate glass include glass containing SiO2 and B2O3. In addition to these, it may also contain CeO2, RO, R'2O, R''2O3, R'''O2, etc., and it is preferable that it contains ZnO, K2O, and Na2O. In this specification, R is at least one selected from the group consisting of Zn, Ba, Sr, Mg, Ca, Fe, Mn, Cr, Sn, and Cu. R' is at least one selected from the group consisting of Li, Na, K, Cs, and Cu. R'' is at least one selected from the group consisting of Al, Fe, and La. R''' is at least one selected from the group consisting of Zr, Ti, and Sn.

[0050] Examples of bismuth oxide-based glasses include those containing Bi2O3, and may also contain B2O3, CeO2, SiO2, RO, R'2O, R''2O3, R'''O2, etc.

[0051] While conventionally known filler components can be used, it is preferable to include, for example, low thermal expansion fillers or negative thermal expansion fillers. By using low thermal expansion fillers or negative thermal expansion fillers, a good shape can be maintained as a cover member with an outer frame, and good adhesion to the translucent material can also be achieved. One type of filler may be used, or two or more types may be used.

[0052] Low thermal expansion fillers are those with a thermal expansion coefficient of 0 / °C or higher (40 × 10). -7 Fillers with a temperature of / ℃ or lower include, for example, zirconium oxide, silicon dioxide, and mixtures thereof. Examples of mixtures include cordierite (2MgO·2Al2O3·5SiO2), which is a mixture of magnesium oxide, aluminum oxide, and silicon dioxide.

[0053] Negative thermal expansion fillers are fillers with a negative coefficient of thermal expansion, i.e., less than 0 / °C. Examples include zirconium phosphate, β-eucryptite (Li2O·Al2O3·2SiO2), and zirconium tungstate (ZrW2O8).

[0054] The total volume fraction of filler components in glass ceramics is preferably 25 to 65 vol%. Here, from the viewpoint of preventing crack formation in the translucent material, the total volume fraction is preferably 25 vol% or more, more preferably 30 vol% or more, and even more preferably 35 vol% or more. Furthermore, from the viewpoint of obtaining good adhesion with the translucent material, the total volume fraction of filler components is preferably 65 vol% or less, more preferably 63 vol% or less, and even more preferably 61 vol% or less. However, the above content may vary depending on the specific gravity of the filler, etc. Also, the combination of preferred upper and lower limit values ​​is arbitrary.

[0055] The filler component is an inorganic powder, but the shape of the powder is not particularly limited, and examples include spherical, flattened, flaky, fibrous, etc.

[0056] The size of the filler component powder is not particularly limited; for example, a 50% particle size (D50) of 0.5 to 10 μm is preferred. Here, the 50% particle size (D50) is preferably 0.5 μm or more, more preferably 1 μm or more, and preferably 10 μm or less, and more preferably 9 μm or less. In this specification, the 50% particle size refers to a volume-based value measured using a laser diffraction / scattering particle size distribution analyzer. Furthermore, any preferred combination of upper and lower limit values ​​is acceptable.

[0057] The light-transmitting material in this embodiment is not particularly limited as long as it does not obstruct the light emission or light reception of the optical element installed on the substrate sealed by the outer frame cover member. For this reason, although it varies depending on the wavelength range targeted by the light-emitting element or optical element, examples include glass, silicon, sapphire, and resin materials.

[0058] In this embodiment, the translucent material is preferably glass from the viewpoint of visible light transmittance and heat resistance. From the viewpoint of infrared light transmittance and heat resistance, silicon is preferred, from the viewpoint of mechanical strength and heat resistance, sapphire is preferred, and from the viewpoint of material cost, resin materials are preferred.

[0059] As described above, the translucent material in this embodiment has a rectangular shape with a pair of opposing main surfaces and end surfaces, but the pair of opposing main surfaces do not have to be parallel. Furthermore, a light-diffusing portion may be formed on at least one of the main surfaces of the translucent material, or a functional film such as an anti-reflective film or a conductive film may be formed thereon.

[0060] In this embodiment, when joining the main surface of a wall made of a translucent material to the end surface of a wall made of ceramics, a metalens with an extremely thin thickness may be used as the translucent material. In addition to the above, as the light-transmitting material in this embodiment, for example, plano-concave or plano-convex cylindrical lenses, spherical lenses, aspherical lenses, dome lenses, etc., may be used.

[0061] The substrate sealed by the framed cover member according to this embodiment can be a conventionally known substrate and is not particularly limited. For example, when the optical element is a light-emitting element, the substrate is not particularly limited as long as it is insulating, but from the viewpoint of heat dissipation, a ceramic substrate is preferred. Preferred ceramic substrates include aluminum nitride (AlN) substrates, alumina (Al2O3) substrates, and low-temperature co-fired ceramic (LTCC) substrates. When the optical element is a light-receiving element, a silicon substrate is preferred as the substrate.

[0062] The optical element installed on the substrate sealed by the framed cover member according to this embodiment may be either a light-emitting element or a light-receiving element, and the light-emitting element can be either top-emitting or end-emitting. Examples of light-emitting elements include light-emitting diodes (LEDs) and semiconductor lasers (LDs). Examples of light-receiving elements include MEMS sensors.

[0063] Semiconductor Optical Devices The semiconductor optical device according to this embodiment comprises a cover member with an outer frame, a substrate, and an optical element provided on the substrate. The cover member with an outer frame and the substrate are integrated via a sealing layer, and the optical element is hermetically sealed.

[0064] Here, the cover member with an outer frame can be the one described above under "Cover Member with Outer Frame," and the preferred embodiment is the same.

[0065] The semiconductor optical device may be either a semiconductor light-emitting device or a semiconductor light-receiving device. Examples of semiconductor light-emitting devices include backlights for mobile phones and LCD televisions, light-emitting parts in the operation buttons of small information terminals, lighting for automobiles or decoration, deep ultraviolet LEDs for sterilization purposes, laser parts for 3D distance measuring sensors, and other light sources. Examples of photodetectors in semiconductor photodetectors include MEMS sensors.

[0066] The sealing layer that integrates the framed cover member and the substrate in this embodiment can be a conventionally known one. The sealing layer is preferably made of a metal film or glass frit, and more preferably a metal film.

[0067] If the sealing layer is made of a metal film, the outer frame cover member and the substrate can be hermetically sealed by sealing via a metal ring. Examples of metal rings include gold (Au)-tin (Sn) rings, tin (Sn)-antimony (Sb) rings, and tin (Sn)-silver (Ag)-copper (Cu) rings, but from the viewpoint of sealing performance, gold-tin rings are more preferable.

[0068] From the viewpoint of sealing performance when sealing via a metal ring, the layer made of a metal film preferably has a layer of metal film on its outermost surface containing one or more selected from the group consisting of Au, Ag, Cu, and Au-Sn alloy, and more preferably has an Ag layer or an Au layer. The layer made of a metal film may further have a film of Ni, Ti, Pd, Pt, Cu, etc. as a base for the metal film layer.

[0069] If the sealing layer is made of glass frit, the outer frame cover member and the substrate can be hermetically sealed by heating.

[0070] Glass frit is a sealing glass made of low-melting-point glass, and conventionally known types can be used. For example, low-melting-point glasses such as tin-phosphate glass, bismuth glass, vanadium glass, lead glass, and zinc-borate alkali glass are preferably used. Among these, low-melting-point glasses made of tin-phosphate glass, bismuth glass, or vanadium glass are more preferred, considering reliability such as adhesion, adhesive reliability and hermetic sealing, as well as the impact on the environment and human health. The glass frit may further contain inorganic fillers such as electromagnetic wave absorbers and low thermal expansion fillers.

[0071] Method for manufacturing a cover component with an outer frame The method for manufacturing the cover member with an outer frame according to this embodiment includes the following steps. Step 1: A step of preparing a wall made of ceramic in which four side walls are integrated, a wall made of ceramic in which three side walls and an upper wall are integrated, or a wall made of ceramic in which a pair of opposing side walls and an upper wall are integrated. Step 2: A step in which a coating film of the resin composition is formed on the release film using the doctor blade method. Step 3: After pressing the end surface of the wall portion made of integrated ceramics prepared in Step 1 against the coating film formed in Step 2, the release film is peeled off from the coating film and the coating film is transferred to the end surface of the wall portion made of integrated ceramics. Step 4: A step in which a translucent material is temporarily bonded to the end face of the wall portion made of the integrated ceramic after Step 3, via the transferred coating film. Step 5: Apply a load to the wall portion, which is made of integrated ceramics with the translucent material temporarily bonded to it, and heat it to cure the resin composition and bond the translucent material.

[0072] The framed cover member obtained by the above manufacturing method is suitable as a framed cover member for sealing an optical element to a substrate on which an optical element is installed by covering the optical element.

[0073] By the above manufacturing method, the framed cover member described in the above-mentioned "framed cover member" is obtained, and the preferred form of the obtained framed cover member is the same as that described in the above-mentioned "framed cover member". However, while the manufacturing method according to this embodiment is a suitable embodiment for obtaining the framed cover member described above, the framed cover member described above can also be manufactured by other manufacturing methods.

[0074] The following describes each step in order.

[0075] <Step 1: Wall section made of integrated ceramics> Step 1 is the process of preparing a wall made of ceramic in which four side walls are integrated, a wall made of ceramic in which three side walls and a top wall are integrated, or a wall made of ceramic in which a pair of opposing side walls and a top wall are integrated. Here, the walls made of the integrated ceramic are all sintered and can be used as is as the wall of a cover glass with an outer frame.

[0076] The wall portion, made of integrated ceramics, can be prepared by conventionally known methods, and these methods are not particularly limited. Commercially available materials may also be used.

[0077] For example, a wall made of integrated ceramic material can be prepared by drilling holes of the desired size and shape into a ceramic plate (block). Alternatively, multiple ceramic panels that will form each wall section may be prepared and joined together to create a wall section made of integrated ceramic material.

[0078] When the ceramic is glass ceramic, for example, the ceramic can be obtained by laminating and firing green sheets cast from a slurry or paste of a glass ceramic precursor. Therefore, by laminating and firing frame-shaped green sheets, an integrated wall section with four side walls made of ceramic can be obtained. Alternatively, by laminating rectangular green sheets, hollowing out the center, and then firing, an integrated wall section with four side walls made of ceramic can also be obtained. Furthermore, by applying the above method, it is also possible to obtain an integrated wall section with a top wall section and 1 to 3 side walls made of ceramic.

[0079] <Step 2: Formation of resin film> Step 2 is the process of forming a coating of the resin composition on the release film using the doctor blade method. Steps 1 and 2 may be performed in either order or simultaneously.

[0080] The resin composition coating, upon hardening, forms a resin joint that bonds two walls made of translucent material together. Therefore, the resin constituting the resin composition can be the same resin as described in the "Cover Member with Outer Frame" above, but examples include silicone resin, epoxy resin, acrylic resin, epoxyamine resin, polyurethane resin, phenolic resin, cyanoacrylate resin, etc.

[0081] A resin composition coating can be formed by dissolving or dispersing the desired resin in a solvent or dispersion medium and coating it onto a release film using a doctor blade method. In this case, in addition to the resin, crosslinking agents or the like may be further added to the solvent or dispersion medium as needed. Furthermore, the coating may be dried as needed. During the drying process, heating may be applied as needed, provided that the resin composition does not harden, and ultraviolet irradiation may also be applied as needed, provided that the composition does not harden.

[0082] The thickness of the resin composition coating film is preferably 30 to 500 μm. From the viewpoint of bonding the resin compositions without defects after curing and achieving higher airtightness, the thickness is preferably 30 μm or more, more preferably 35 μm or more, even more preferably 40 μm or more, even more preferably 45 μm or more, and particularly preferably 50 μm or more. Furthermore, from the viewpoint of wetting spread of the resin composition, the thickness is preferably 500 μm or less, more preferably 450 μm or less, even more preferably 400 μm or less, and even more preferably 350 μm or less. The thickness mentioned above can be adjusted depending on the doctor blade used. By setting the thickness of the resin coating film within the above range, it is easy to adjust the average thickness of the cured resin composition after step 5, i.e., the average thickness of the resin joint, to a range of 10 to 50 μm.

[0083] In this embodiment, a conventionally known release film can be used. For example, PET film, PP film, PE film, PVC film, etc. can be used. From the viewpoint of stably forming a uniform coating film of the resin composition, it is preferable that the release film does not have a release agent applied to it.

[0084] <Step 3: Transfer of the coating> Step 3 involves pressing the end face of the wall portion made of integrated ceramics, prepared in Step 1, against the resin composition coating film formed in Step 2, then peeling off the release film from the coating film and transferring the coating film to the end face of the wall portion made of integrated ceramics.

[0085] Specifically, for example, a release film with a resin composition coating is placed on a flat surface, and the end face of the wall made of integrated ceramics is pressed onto it. This causes the release film and the wall made of integrated ceramics to adhere to each other via the resin composition coating. The appropriate pressure applied to the end face varies depending on the type of resin composition and the thickness of the coating, but it should not cause the coating to tear. The pressure applied can be, for example, just enough to rest the part on the coating, that is, about the same amount of pressure as the weight of the wall, or about the same amount of pressure as the weight of the wall, but lighter, so as not to tear the coating.

[0086] Next, when the release film is peeled off to separate the wall portion made of ceramics integrated with the release film, the portion of the resin composition coating that is in contact with the end surface of the wall portion made of integrated ceramics adheres to the end surface of the wall portion and is peeled off from the release film. On the other hand, the portion of the resin composition coating that is not in contact with the end surface of the wall portion made of integrated ceramics remains adhered to the release film and is removed together with the release film. As a result, the resin composition coating is transferred to the end surface of the wall portion made of integrated ceramics.

[0087] The optimal peeling speed of the release film varies depending on the type of release film, the type of resin composition, the thickness of the coating, etc., but it is sufficient that only the portion of the resin composition coating that is in contact with the edge surface of the wall made of integrated ceramics is transferred. The peeling speed of the release film may be, for example, around 1 to 50 cm / sec.

[0088] <Step 4: Temporary joining of translucent materials> Step 4 is a step in which a translucent material is temporarily bonded to the end face of the wall portion made of integrated ceramics via a coating film of the resin composition transferred in Step 3.

[0089] In step 4, temporary bonding is performed by placing a translucent material on the end face of the wall portion made of integrated ceramics, on which a resin composition coating has been formed. When placing the translucent material, light force may be applied. The force at this time is not particularly limited, but for example, it may be just enough to place it on the coating or lightly press it down.

[0090] Furthermore, before applying a translucent material to the end face of the wall made of integrated ceramics, the wall made of integrated ceramics on which the resin composition coating has been transferred may be degassed. This makes the resin composition denser.

[0091] <Step 5: Joining of translucent materials> Step 5 is a process in which a load is applied to the wall portion made of integrated ceramics to which the translucent material has been temporarily bonded in Step 4, and heated to cure the resin composition, thereby bonding the translucent material.

[0092] By heating the resin composition under load during curing, a bond region A can be formed without defects, and a bond region B can also be formed simultaneously. As a result, high airtightness can be achieved without leakage.

[0093] The optimal load for the above application varies depending on the type of resin composition and the thickness of the coating film, but it is sufficient if it can suitably form bonding regions A and B. The load to be applied is, for example, 0.002 to 0.006 N / mm². 2is preferable. Here, from the viewpoint of suitably forming the joint region A without defects and more suitably obtaining the effect of the joint region B, the above load is 0.002 N / mm 2 or more is preferable, 0.0025 N / mm 2 or more is more preferable, 0.0027 N / mm 2 or more is still more preferable, 0.0029 N / mm 2 or more is even more preferable, 0.003 N / mm 2 or more is particularly preferable. Also, from the viewpoint of the thickness of the resin composition, the above load is 0.006 N / mm 2 or less is preferable, 0.0055 N / mm 2 or less is more preferable, 0.0053 N / mm 2 or less is still more preferable, 0.0051 N / mm 2 or less is even more preferable, 0.005 N / mm 2 or less is particularly preferable.

[0094] The heating performed to cure the resin composition is not particularly limited as long as the coating film of the resin composition is cured and the resin joint is formed. For example, when forming a resin joint using a silicone resin, 100 to 150 °C is preferable. Also, the heating time at that time is not particularly limited, but for example, 0.5 to 5 hours is preferable. For example, when forming a resin joint using an epoxy resin, 50 to 150 °C is preferable. Also, the heating time at that time is not particularly limited, but for example, 0.5 to 2 hours is preferable.

[0095] The preferable embodiments of the joint regions A and B of the resin composition joint formed as described above are the same as the preferable embodiments of the joint regions A and B in the above 《Cover member with outer frame》, respectively.

[0096] In addition, in the manufacturing method according to the present embodiment, as described above, in step 1, it is preferable from the viewpoint of productivity to prepare a large number of wall parts as wall parts made of integrated ceramics. Specifically, multiple holes (through-holes) of the desired size and shape are made in the ceramic plate to prepare a wall section with multiple sections. A schematic top view is shown in Figure 8(a), and a schematic side view is shown in Figure 8(b). This results in a wall section 31 in which four side wall sections 302, 303, 304, and 305 made of ceramic are integrated.

[0097] As shown in Figure 8(c), a coating film 35 of a resin composition is formed on one end face of the multi-part wall portion 31, and an upper wall portion 301 made of a translucent material is temporarily joined thereon. By heating under load to cure the resin composition, a multi-part cover member with an outer frame is obtained, as shown in Figure 8(d), in which the translucent material serves as the upper wall portion 301 and is joined to the end faces of the four ceramic wall portions 31 (302, 303, 304, 305) via resin joints 33. Finally, by cutting along the dashed line shown in Figure 8(e) as the dicing line, multiple individual pieces of the cover member with an outer frame are obtained.

[0098] The above example shows a case where the top wall is made of a translucent material and the four side walls are made of ceramic. However, by not making through holes in the ceramic plate and by shifting the dicing lines, a cover member with an outer frame can be obtained in which one side wall is made of a translucent material and the remaining three side walls and the top wall are made of ceramic.

[0099] The method for cutting the material into individual pieces is not particularly limited, but methods such as laser dicing using a laser beam, blade dicing using a dedicated blade, or a combination of multiple cutting methods can be employed. Among these, blade dicing is preferred from the viewpoint of cutting performance. [Examples]

[0100] The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Examples 1 to 3 are examples of actual cases, while Examples 4 and 5 are comparative examples.

[0101] [Example Test] <Example 1> A translucent glass plate measuring 50mm x 50mm x 0.3mm thick (SCHOTT, D263) was prepared. As a wall section made of a multi-piece integrated ceramic, holes measuring 4.7 mm x 2.35 mm x 2.4 mm in depth were formed at 3.3 mm intervals in a glass ceramic plate measuring 50 mm x 50 mm x 2.7 mm in thickness. 10 g of silicone resin (Shin-Etsu Chemical Co., Ltd., SCR series) was mixed and coated onto a release film (Takiron CI Co., Ltd., PET-6010) to a thickness of 200 μm using the doctor blade method to form a silicone resin coating. After pressing the wall portion made of the multi-cavity integrated ceramic onto this coating, the release film was peeled off. As a result, a silicone resin coating with an average thickness of 100 μm was transferred to the end face of the wall portion made of the multi-cavity integrated ceramic. Next, the glass plate prepared above was temporarily bonded to the end face of the wall portion made of the integrated ceramics via the transferred coating film. 2 By heating at 150°C for 240 minutes under load, the silicone resin was cured, resulting in a multi-piece framed cover member in which the outer edge of the main surface of the glass plate and the end face of the ceramic were joined at the resin joint. Finally, by dicing, 208 framed cover members were obtained, each consisting of one side wall made of glass plate and three side walls and a top wall made of ceramic. The main surface of the upper wall is 5.3 mm x 3 mm, the side wall made of glass plate and the opposing side wall made of ceramic are 5.3 mm x 1.3 mm, and the opposing pair of side walls made of ceramic are 3 mm x 1.3 mm.

[0102] <Example 2> Except for setting the average thickness of the silicone resin coating film to 100 μm, 208 cover members with outer frames were obtained in the same manner as in Example 1.

[0103] <Example 3> Except for setting the average thickness of the silicone resin coating film to 50 μm, 208 cover members with outer frames were obtained in the same manner as in Example 1.

[0104] <Example 4> Except for mixing 10g of silicone resin (Shin-Etsu Chemical Co., Ltd., SCR series) and coating it to a thickness of 50μm onto the wall portion made of the multi-cavity integrated ceramic by a printing method, and then drying it, a silicone resin coating with an average thickness of 15μm was formed on the end face of the wall portion made of the multi-cavity integrated ceramic, and 208 cover members with outer frames were obtained in the same manner as in Example 1.

[0105] <Example 5> Except for setting the silicone resin coating thickness to 10 μm and forming a silicone resin coating with an average thickness of 7 μm on the end faces of the wall portion made of a multi-cavity integrated ceramic, 208 cover members with outer frames were obtained in the same manner as in Example 4.

[0106] "evaluation" <Joining area A / Jointing area B> Microscopic observation of the resin joint was performed. If the entire end face of the ceramic wall was joined to the main surface of the glass plate wall, the shape of the joint region A was good and it was marked with "○" as the joint region A was formed. If only a part of the end face of the ceramic wall was joined, the shape of the joint region A was poor and it was marked with "×" as the joint region A was not formed, as indicated in "Presence" of "Joint Region A" in Table 1. Regarding bonding region B, if a bonding region is formed on both the main surface of the ceramic wall and the main surface of the glass wall from the boundary with bonding region A, it is marked as "○" indicating that bonding region B is formed, and if it cannot be said that bonding region B is formed, it is marked as "×" and shown in the "Presence" column of "Bonding Region B" in Table 1. As an example, Figure 6 shows a microscopic image of Example 1, and Figure 7 shows a microscopic image of Example 5. In Example 1, as enclosed by the dashed line, the entire end surface of the wall made of ceramic is joined, and it can be said that a joint region A is formed. Also, as enclosed by the dotted line, both the main surface of the wall made of ceramic and the main surface of the wall made of glass plate inside the boundary with joint region A are joined, and it can be said that a joint region B is formed. On the other hand, in Example 5, as indicated by the dotted line, only about half of the end face of the ceramic wall is joined, and it cannot be said that the entire surface is joined. Therefore, it can be said that joining region A is not formed. Furthermore, joining region B does not exist.

[0107] The average thickness of bonding region A was determined from microscopic images. Specifically, the average thickness was determined by resin embedding of the individual outer frame cover members and then cross-sectional polishing. The results are shown in Table 1 under "Average Thickness (μm)" for "Bonding Region A". The average width of the area in contact with the main surface of the glass plate (width of BG in Figure 8) and the average width of the area in contact with the main surface of the ceramic (width of BC in Figure 8) were determined from the boundary between bonding area B and bonding area A. Specifically, the average widths were determined by polishing the cross-section of the individualized outer frame cover members after resin embedding. The results are shown in Table 1 under "Bonding Area B" as "BG: Average glass plate width (μm)" and "BC: Average ceramic width (μm)". Furthermore, the ratio of the average widths of the glass plate (BG) and the average widths of the ceramics (BC) was calculated as BG / BC, and is shown in Table 1 under "Average Width Ratio (BG / BC)" for "Bonding Region B".

[0108] <Airtightness: Leak path occurrence rate> For each example, the leak path occurrence rate was evaluated by immersing all 10 framed cover members obtained in the experiment with highly permeable ink. Leak paths were determined to have occurred when it was confirmed that the highly permeable ink had penetrated the interior, and the percentage of such cases was calculated. The results are shown in Table 1 under "Leak Path Occurrence Rate".

[0109] <Airtightness: Vacuum method> The airtightness of the framed cover members obtained in each example was evaluated by evacuating them to a vacuum and detecting helium leakage when helium gas was sprayed from the outside. Specifically, the pressure at which helium leakage to the outside of the framed cover member was confirmed was measured, and the "Pressure (vacuum method) (Pa·m)" in Table 1 was used. 3 It was shown as " / sec)".

[0110] <Airtightness: Bubble leak (Fluorinert)> The framed cover members obtained in each example were integrated with a glass substrate via a sealing layer. Specifically, by forming a sealing layer on the framed cover member, an apparatus was obtained in which the framed cover member and the substrate were hermetically sealed via the sealing layer. Although no optical elements were provided on the substrate for the purpose of testing airtightness, the results can be considered equivalent to those of a semiconductor device equipped with optical elements. Specifically, the device obtained above was immersed in Fluorinert, and the presence or absence of bubble formation was checked upon submersion. The results are shown in Table 1, "Bubble Leak Test." Devices that did not produce bubbles were marked with "○" for good airtightness, and devices that produced bubbles were marked with "×" for low airtightness.

[0111] <Airtightness: Pressurization method> Using the outer frame cover members obtained in each example, an apparatus was constructed in the same manner as described above for "Airtightness: Bubble Leak (Fluorinert)". When the inside of the apparatus was pressurized with helium gas, leakage of helium gas to the outside of the apparatus was detected. Specifically, the pressure at which helium gas leakage outside the device is detected is measured, and the "Pressure (Pressurization Method) (Pa·m)" in Table 1 is calculated. 3 It was shown as " / sec)".

[0112] [Table 1]

[0113] In all of the framed cover members in Examples 1 to 3, high airtight sealing was achieved by having a joint area A and a joint area B as resin joints. In contrast, in Example 4, even though joint area A was formed, joint area B was not formed, resulting in a high leak path occurrence rate of 50%, and the airtightness was worsened by more than three orders of magnitude in both the vacuum method and the pressurized method. [Explanation of Symbols]

[0114] 10,20 Cover component with outer frame 11,21,31 Wall section 101,201,301 Upper wall part 102, 103, 104, 105, 202, 203, 204, 205, 302, 303, 304, 305 Side wall section 102c,104c end face 12,22 Lower opening 13,23,33 Resin joint 13A,23A Junction area A 13B,23B Joint area B 35 Coating film

Claims

1. A cover member with an outer frame that covers an optical element on a substrate on which an optical element is installed and seals the substrate, The aforementioned cover member with an outer frame has a wall portion and a lower opening, and has an inverted concave cross-sectional shape. The aforementioned wall consists of an upper wall and four side wall sections. The upper wall portion and the four side wall portions are each rectangular flat plates having a pair of opposing main surfaces and end surfaces. The upper wall and the four side walls are made of, in one or two parts, a translucent material, and the others, ceramics. The wall portion made of the translucent material is joined to an adjacent wall portion made of the ceramic by a resin joint. The resin joint consists of a joint region A and a joint region B adjacent to the joint region A. The joining region A is a region where the entire surface of one end face of one of the wall portions made of the translucent material and the wall portion made of the ceramics are joined to one side of the outer edge of the inner main surface of the other wall portion. The joining region B is a region in which the inner main surface of the wall made of the translucent material and the inner main surface of the wall made of the ceramic are joined together, so as to fill the entire corner formed by the wall made of the translucent material and the wall made of the ceramic.

2. The cover member with an outer frame according to claim 1, wherein the joining region A and the joining region B are composed of the same cured resin composition and are seamlessly integrated.

3. The cover member with an outer frame according to claim 1, wherein the average thickness of the bonding region A is 10 to 50 μm.

4. The cover member with an outer frame according to claim 1, wherein the average width of the joining region B in contact with the main inner surface of the wall made of the translucent material is 50 to 200 μm.

5. The cover member with an outer frame according to claim 1, wherein the average width of the joining region B in contact with the main inner surface of the wall portion made of ceramics is 50 to 200 μm.

6. The cover member with an outer frame according to claim 1, wherein the ratio of the width of the joining region B that is in contact with the inner main surface of the wall made of the ceramic to the width of the light-transmitting material that is in contact with the inner main surface of the wall made of the ceramic is 0.5 to 2.

0.

7. The cover member with an outer frame according to claim 1, wherein the entire surface of one end face of the wall made of the ceramic and one side of the outer edge of the inner main surface of the wall made of the translucent material are joined together.

8. The cover member with an outer frame according to claim 1, wherein the ceramic is glass ceramic, alumina, aluminum nitride, boron nitride, silicon carbide, zirconia, or silicon nitride.

9. The cover member with an outer frame according to claim 1, wherein the surface roughness Ra of the bonding surface of the ceramics, which is bonded by the resin bonding portion, is 10 to 50 μm.

10. The cover member with an outer frame according to claim 1, wherein the light-transmitting material is made of glass, silicon, sapphire, or a resin material.

11. The cover member with an outer frame according to claim 1, wherein the resin joint portion is made of at least one cured resin composition selected from the group consisting of silicone resin, epoxy resin, acrylic resin, epoxyamine resin, polyurethane resin, phenolic resin, and cyanoacrylate resin.

12. The cover member with an outer frame according to claim 1, wherein the optical element is a light-emitting element.

13. The cover member with an outer frame according to claim 1, wherein the wall portion is made of a light-transmitting material for the upper wall portion and the four side wall portions are made of ceramics.

14. The cover member with an outer frame according to claim 1, wherein one of the four side wall portions is made of a light-transmitting material, and the remaining three side wall portions and the upper wall portion are made of ceramics.

15. The cover member with an outer frame according to claim 1, wherein the wall portion has two opposing side wall portions made of a light-transmitting material, and the remaining two opposing side wall portions and the upper wall portion made of ceramics.

16. A cover member with an outer frame as described in any one of claims 1 to 15, a substrate, and an optical element provided on the substrate, A semiconductor optical device in which the outer frame cover member and the substrate are integrated via a sealing layer, and the optical element is hermetically sealed.

17. A method for manufacturing a cover member with an outer frame that covers an optical element on a substrate and seals the optical element to the substrate, To provide a wall made of ceramic with four integrated side walls, a wall made of ceramic with three integrated side walls and an upper wall, or a wall made of ceramic with a pair of opposing side walls and an upper wall integrated. Forming a coating of resin composition on a release film using the doctor blade method. After pressing the end face of the wall portion made of the integrated ceramics against the coating film, the release film is peeled off from the coating film, and the coating film is transferred to the end face of the wall portion made of the integrated ceramics. To temporarily bond a translucent material to the end face of the wall portion made of the integrated ceramics via the transferred coating film, and A method for manufacturing a cover member with an outer frame, comprising applying a load to a wall portion made of integrated ceramics to which the translucent material is temporarily bonded, heating to cure the resin composition, and bonding the translucent material.

18. The thickness of the aforementioned coating film is set to 30 to 500 μm. The method for manufacturing a cover member with an outer frame according to claim 17, wherein the average thickness of the cured resin composition is 10 to 50 μm.

19. The aforementioned load is 0.002 to 0.006 N / mm². ２ A method for manufacturing a cover member with an outer frame according to claim 17 or 18, wherein the load is applied.

20. As the wall portion made of the integrated ceramic, multiple wall portions are prepared by making several holes of the desired size and shape in the ceramic plate. A method for manufacturing a framed cover member according to claim 17 or 18, comprising curing the resin composition and then dicing it to form individual pieces to obtain a plurality of framed cover members.

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