Electronic devices

Abstract

To provide an electronic device with improved ease of disassembly and electromagnetic compatibility. [Solution] The electronic device 1 comprises a plate-shaped substrate 10 on which electronic components 11 are mounted, and a housing portion 20 that houses the substrate 10. The housing portion 20 has a substrate support portion 24 that supports the substrate 10 from one side S1. The electronic device 1 further comprises a conductive member 40 that is fixed to the housing portion 20 on the opposite side of the substrate 10 from the substrate support portion 24, and a conductive elastic member 50 that is conductive and elastic and is positioned between the other side S2 of the substrate 10 and the conductive member 40. A clamping holding portion H2 is formed in which the substrate 10 is held in the housing portion 20 while sandwiched between the substrate support portion 24 and the conductive elastic member 50.

Description

Technical Field

[0004] , ,

[0006] , , , , , ,

[0005] , , ,

[0003] , , , , , , ,

[0001] The disclosure according to this specification relates to an electronic device.

Background Art

[0002] In Patent Document 1, in an electronic device, a non-conductive elastic member such as acrylic rubber is sandwiched between a case portion to hold an electronic substrate on which electronic components are mounted.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Now, with the shift to a circular economy, an improvement in the easy disassembly of electronic devices is required. When sandwiching a non-conductive elastic member for holding an electronic substrate is used, it may be possible to facilitate the disassembly of the device when the electronic device is recycled. However, when using a non-conductive elastic member, the conductivity between the electronic substrate and the case portion is insufficient, and it is difficult to obtain electromagnetic compatibility (Electro Magnetic Compatibility) that can withstand the high functionality of the electronic device.

[0005] One of the objects according to the disclosure of this specification is to provide an electronic device with improved easy disassembly and electromagnetic compatibility.

Means for Solving the Problems

[0006] One of the aspects disclosed herein is an electronic device including a plate-shaped substrate (10) on which electronic components (11) are mounted and a housing portion (20, 320, 420) that stores the substrate, The housing portion has a substrate support portion (24) that supports the substrate from one surface (S1) side, A conductive member (40) having conductivity is positioned on the opposite side of the substrate from the substrate support portion, so as to be fixed to the housing portion, The substrate is further provided with conductive elastic members (50, 450) which are arranged between the other surface (S2) of the substrate and the conductive member, and which are conductive and elastic. A clamping and holding portion (H2, H3, H4, H5) is formed in which the substrate is held in the housing portion while sandwiched between the substrate support portion and the conductive elastic member.

[0007] In this embodiment, the housing holds the substrate by being sandwiched between the substrate support and the elastic member. This type of holding makes it easy to separate the substrate from the housing when the electronic device is recovered. The elastic member used for sandwiching is a conductive elastic member having both conductivity and elasticity, and furthermore, the conductive elastic member is positioned between the substrate and a conductive member that is fixed to the housing. As a result, good conductivity is achieved in the path from the substrate through the conductive elastic member and the conductive member to the housing, ensuring the electromagnetic shielding function of the electronic device. Thus, an electronic device with improved ease of disassembly and electromagnetic compatibility can be provided.

[0008] The symbols in parentheses included in the claims, etc., are illustrative examples illustrating the correspondence with the embodiments described later, and are not intended to limit the technical scope. [Brief explanation of the drawing]

[0009] [Figure 1] Top view of a circuit board in an electronic device. [Figure 2] A cross-sectional view showing the cross-section of an electronic device along the line II-II in Figure 1. [Figure 3] An enlarged cross-sectional view showing a magnified view of the clamping and holding portion. [Figure 4] Top view showing the land and solder. [Figure 5] A cross-sectional view showing the cross-section of an electronic device. [Figure 6] A cross-sectional view showing the cross-section of an electronic device. [Figure 7] A perspective view showing a conductive elastic member having a through hole. [Modes for carrying out the invention]

[0010] Several embodiments will be described below with reference to the drawings. In each embodiment, the same reference numerals are used for corresponding components, and redundant explanations may be omitted. If only a part of the configuration is described in each embodiment, the configuration of other embodiments described earlier can be applied to the other parts of that configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations from multiple embodiments can be partially combined even if not explicitly stated, as long as there are no particular problems with the combination.

[0011] (First Embodiment) The electronic device 1 of the first embodiment is an ECU (Electronic Control Unit) configured to be mounted on a vehicle as a mobile device. The electronic device 1 includes a circuit board 10, a housing 20, a conductive member 40, and a conductive elastic member 50.

[0012] As shown in Figure 1, the substrate 10 is arranged to be stored in the storage space SS inside the device, and is formed as a flat plate with a rectangular outer contour and a pair of surfaces, mainly made of a synthetic resin such as epoxy resin. The pair of surfaces are the first opposing surface S1 that faces the first housing component 21, which will be described later, and the second opposing surface S2 that faces the second housing component 31.

[0013] The substrate 10 has multiple electronic components 11 mounted on at least one of its surfaces S1 and S2. These multiple electronic components 11 may include, for example, IC chips used in processors and memory, or they may include capacitors, inductors, transformers, switches, etc. Furthermore, the substrate 10 may have conductive patterns formed on at least one of its surfaces S1 and S2 using a conductive metal material such as copper foil to facilitate electrical connections between the electronic components 11 and with the outside world. Thus, the substrate 10 is configured with circuits for control.

[0014] Further, a plurality of positioning holes 13 are formed in the substrate 10. In the present embodiment, two pairs of positioning holes 13 are provided on the diagonal line of the rectangular substrate 10, but the arrangement and the number of installations are not limited to this. For one substrate 10, one or more pairs of positioning holes 13 may be provided. The positioning holes 13 may be provided in one pair, three pairs, or five pairs. The total number of the positioning holes 13 may be odd.

[0015] Each positioning hole 13 is formed as, for example, a columnar hole so as to penetrate between both surfaces. Each positioning hole 13 may be referred to as a so-called through hole. At least a part of the positioning holes 13 may be formed in a shape other than the columnar shape, for example, a frustum shape, a quadrangular column shape, or the like.

[0016] Lands 14 and 15 may be formed so as to surround each positioning hole 13. Each of the lands 14 and 15 is formed in an annular shape surrounding the opening of the positioning hole 13 by a metal material having conductivity such as copper. The surface of each of the lands 14 and 15 is formed in a flat planar shape. In the present embodiment, the land 14 is provided on the first opposing surface S1, and the land 15 is provided on the second opposing surface S2.

[0017] Furthermore, a connector portion 12 is connected to the outer peripheral portion of the substrate 10. The connector portion 12 is configured to be able to connect a cable from outside the device and is further configured to be able to input and output an electrical signal to and from outside the device by being electrically connected to the conduction pattern of the substrate 10.

[0018] As shown in FIG. 2, the housing portion 20 is configured by combining a first housing component 21 and a second housing component 31. The first housing component 21 is formed in a hollow box shape from a conductive material such as, for example, aluminum, iron, magnesium, or conductive plastic. The first housing component 21 may be referred to as a box-shaped component. The first housing component 21 has a bottom wall portion 23 and side wall portions 22. The bottom wall portion 23 is arranged to face the first opposing surface S1 of the substrate 10. Further, the first housing component 21 has an opening 21a in the upper portion where the second housing component 31 is arranged. The opening 21a is formed by the upper end portions of the side wall portions 22.

[0019] Furthermore, the first housing component 21 has substrate support portions 24 corresponding to the positions and total number of the positioning holes 13. For example, the substrate support portions 24 are provided at positions facing the positioning holes 13, and the same number (four in this embodiment) as the total number of the positioning holes 13. When a plurality of positioning holes 13 exist in positions close to each other, one substrate support portion 24 may be provided for the plurality of positioning holes 13.

[0020] Each substrate support portion 24 is formed in a columnar shape that protrudes from the bottom wall portion 23 toward the corresponding positioning hole 13. Each substrate support portion 24 has a tip plane 24a formed in a planar shape, and the tip plane 24a is in surface contact with the first opposing surface S1 of the substrate 10. For example, the tip plane 24a is in surface contact with the portion surrounding the corresponding positioning hole 13 in its entirety, and is in surface contact with, for example, the land 14.

[0021] Furthermore, the first housing component 21 has positioning protrusions 25 that protrude from each tip plane 24a into the positioning holes 13, corresponding to the positions and total number of the positioning holes 13. The same number (four in this embodiment) as the total number of the positioning holes 13 of the positioning protrusions 25 are provided. Each positioning protrusion 25 is formed, for example, in a hemispherical shape so as to fit the shape of the corresponding positioning hole 13, but may also be formed in other columnar shapes, frustum shapes, etc.

[0022] Each positioning projection 25 may be formed with substantially the same diameter as the diameter of the corresponding positioning hole 13. In this way, by positioning at multiple locations on a single substrate 10, movement in the direction along the surfaces S1 and S2 of the substrate 10 is restricted. In this embodiment, each positioning projection 25 does not penetrate the corresponding positioning hole 13, but rather its top is positioned inside the positioning hole 13.

[0023] The second housing component 31 is a component mainly consisting of a flat plate portion 31a formed in a flat shape from a conductive material such as aluminum, iron, magnesium, or conductive plastic. The second housing component 31 functions as a cover component that closes the opening 21a formed in the first housing component 21.

[0024] The second housing component 31 is fixedly held to the first housing component 21 by its outer circumference. Specifically, the second housing component 31 may be fastened to the first housing component 21 by screws, for example, via the upper end of the side wall portion 22. The second housing component 31 may be engaged with the first housing component 21 by a snap fit. The second housing component 31 may be bonded to the first housing component 21 using an adhesive.

[0025] The second housing component 31 has elastic member support portions 32 corresponding to the positions and total number of positioning holes 13. For example, the elastic member support portions 32 are provided in the same number as the total number of positioning holes 13 (four in this embodiment) at positions facing the positioning holes 13. If multiple positioning holes 13 are located close to each other, one elastic member support portion 32 may be provided for each of the multiple positioning holes 13.

[0026] Each elastic member support portion 32 is formed in a cylindrical shape that protrudes from the flat plate portion 31a toward the positioning hole 13. The shape of each elastic member support portion 32 only needs to be formed in a cylindrical shape that matches the shape of the corresponding conductive elastic member 50, and may be cylindrical or rectangular. Each elastic member support portion 32 opens toward the substrate 10 side, and the flat plate portion 31a constitutes the bottom portion 32a. Each elastic member support portion 32 may be formed of the same material as the flat plate portion 31a, or of another material that does not have conductivity, as long as it is configured to support the elastic member support portion 32 described later.

[0027] The conductive member 40 is provided in correspondence to at least some of the multiple elastic member support portions 32. The conductive member 40 only needs to be provided in one or more locations, and in this embodiment it is provided in two locations.

[0028] Each conductive member 40 is configured to be fixed to the bottom 32a of the corresponding elastic member support 32. Each conductive member 40 is formed by applying, extruding, pouring, etc., a liquid or gel-like raw material onto the bottom 32a, and then curing the raw material. Some or all of the conductive members 40 may remain in a gel-like state due to the raw material not curing.

[0029] Each conductive member 40 is electrically conductive, and more preferably has higher conductivity than the conductive elastic member 50. For example, the conductive member 40 may be a silicone resin mixed with a filler made of a highly conductive substance such as a metal. Solder may also be used for the conductive member 40.

[0030] The conductive elastic members 50 are provided in a number corresponding to the total number of elastic member support portions 32. In this embodiment, the number of conductive elastic members 50 is the same as the total number of elastic member support portions 32 (four in this embodiment). In other words, the total number of conductive elastic members 50 is the same as the total number of positioning holes 13, substrate support portions 24, and positioning protrusions 25.

[0031] Each conductive elastic member 50 is formed in a columnar shape to match the shape of the corresponding elastic member support portion 32. For example, in this embodiment, each conductive elastic member 50 is formed in a cylindrical shape, but it may be formed in other shapes such as a rectangular prism. Each conductive elastic member 50 is supported by the elastic member support portion 32 by fitting one end 51 into the inside of the cylindrical elastic member support portion 32.

[0032] The end portion 51 corresponding to the elastic member support portion 32 to which the conductive member 40 is fixed is in close contact with the conductive member 40. On the other hand, the end portion 51 corresponding to the elastic member support portion 32 to which the conductive member 40 is not set is in close contact with the bottom portion 32a. The other end portion 52 of each conductive elastic member 50 is positioned to face the individually corresponding positioning hole 13 and is in close contact with the land 15 formed around the positioning hole 13.

[0033] The conductive elastic member 50 is mainly made of synthetic rubber mixed with a filler made of a highly conductive substance such as metal, and is conductive and elastic. The substrate 10 is sandwiched between the substrate support part 24 and the conductive elastic member 50 in a way that the elasticity of the conductive elastic member 50 absorbs manufacturing dimensional variations. In this way, multiple types of clamping and holding parts H1 and H2 are formed in the storage space SS formed inside the electronic device 1.

[0034] In particular, in this embodiment, each conductive elastic member 50 is positioned on the opposite side of the substrate 10 from the substrate support portion 24, and is positioned opposite the substrate support portion 24 in the thickness direction of the substrate 10. Therefore, the effect of the deflection of the substrate 10 can be suppressed in each clamping and holding portion H1, H2, and an efficient clamping force can be provided to the substrate 10. On the other hand, when retrieving the electronic device 1, the fixed holding of the second housing component 31 to the first housing component 21 is released by removing screws, etc., and the clamped state is automatically released, making it possible to easily remove the substrate 10 from the housing portion 20.

[0035] Of the multiple types of clamping and holding parts H1 and H2, clamping and holding part H1 has a structure in which the conductive member 40 is not installed. In clamping and holding part H1, the land 15 of the substrate 10 and the end 52 of the conductive elastic member 50 are in close contact, and the end 51 of the conductive elastic member 50 is in close contact with the second housing component 31. As a result, the conductivity from the land 15 of the substrate 10 to the second housing component 31 is good.

[0036] Of the multiple types of clamping and holding parts H1 and H2, the clamping and holding part H2 has a structure in which a conductive member 40 is provided. In the clamping and holding part H1, the land 15 of the substrate 10 and the end 52 of the conductive elastic member 50 are in close contact, and the end 51 of the conductive elastic member 50 is in close contact with the conductive member 40. Furthermore, the conductive member 40 is fixed to the second housing component 31. As a result, the conductivity from the land 15 of the substrate 10 to the second housing component 31 is good, and an electromagnetic shielding function that can withstand the increased functionality of the electronic device 1 is ensured. In particular, when the conductive member 40 is solid, the presence of the conductive member 40 causes the end 51 of the conductive elastic member 50 to deform into the conductive member 40, thereby increasing the adhesion and contributing to an even greater improvement in the electromagnetic shielding function than the clamping and holding part H1. Also, when the conductive member 40 is gel-like, the conductive member 40 fits the shape of the end 51 of the conductive elastic member 50, increasing the adhesion.

[0037] Furthermore, the positioning hole 13 may be filled with a conductive member made of silicone resin mixed with a filler made of a highly conductive substance such as solder or metal, which is formed from the same material as the conductive member 40. In this way, the conductive member and the end portion 51 of the conductive elastic member 50 come into contact.

[0038] According to the first embodiment described above, the housing 20 holds the substrate 10 while sandwiched between the substrate support 24 and the elastic member. With this type of holding, it is easy to separate the substrate 10 from the housing 20 when the electronic device 1 is recovered. The elastic member used for sandwiching is a conductive elastic member 50 having conductivity and elasticity, and furthermore, the conductive elastic member 50 is positioned between the conductive member 40, which is fixed to the housing 20, and the substrate 10. As a result, good conductivity is achieved in the path from the substrate 10 through the conductive elastic member 50 and the conductive member 40 to the housing 20, and the electromagnetic shielding function of the electronic device 1 is ensured. Thus, an electronic device 1 with improved ease of disassembly and electromagnetic compatibility can be provided.

[0039] Furthermore, according to the first embodiment, multiple clamping and holding portions H2 are formed on the same substrate 10. In this way, multiple paths are formed from the substrate 10 through the conductive elastic member 50 and the conductive member 40 to the housing portion 20. Therefore, electromagnetic compatibility can be improved.

[0040] Furthermore, according to the first embodiment, a clamping holding portion H2 and a holding portion H1, which is separate from the clamping holding portion H2 and does not have a conductive member 40 installed on the same substrate 10, are formed. Since the holding portions H1 and H2 are configured by adjusting the presence or absence of the conductive member 40 to achieve the required electromagnetic compatibility, a highly useful electronic device 1 can be provided.

[0041] Furthermore, according to the first embodiment, the substrate 10 has conductive lands 15 on its surface that are arranged to be in contact with the conductive elastic member 50 at a position facing the conductive elastic member 50. Such contact can improve the electrical conductivity between the substrate 10 and the conductive elastic member 50.

[0042] Furthermore, according to the first embodiment, the substrate support portion 24 and the conductive elastic member 50 are arranged opposite each other in the thickness direction of the substrate 10, with the substrate 10 in between. This arrangement suppresses the effect of the deflection of the substrate 10 and provides an efficient clamping force to the substrate 10.

[0043] Furthermore, according to the first embodiment, the substrate 10 has a positioning hole 13 as a substrate hole formed between the substrate support portion 24 and the conductive elastic member 50. The housing portion 20 has a projection 25 that protrudes from the substrate support portion 24 into the positioning hole 13. The insertion of the projection 25 into the positioning hole 13 makes it easier to determine the position of the substrate 10 and also makes it easier to remove the substrate 10 from the housing portion 20 when retrieving it.

[0044] Furthermore, according to the first embodiment, the substrate 10 has a positioning hole 13 between the substrate support portion 24 and the conductive elastic member 50, which is a hole filled with a conductive filling conductive member, separate from the conductive member 40, and the filling conductive member is in contact with the conductive elastic member 50. Such contact can improve the electrical conductivity between the substrate 10 and the conductive elastic member 50.

[0045] (Second Embodiment) As shown in Figures 3 and 4, the second embodiment is a modified version of the first embodiment. The second embodiment will be described focusing on the differences from the first embodiment.

[0046] In the electronic device 201 of the second embodiment, the configuration of the substrate 210 differs from that of the first embodiment. As a result, instead of the clamping and holding portion H2 of the first embodiment, a clamping and holding portion H3 shown in Figure 3 is formed. In the clamping and holding portion H3, multiple solders 216 are fixed to the surface of the land 215 on the substrate 210 that faces the conductive elastic member 50. Here, the solder 216 is mainly formed from a material having higher conductivity than the conductive elastic member 50.

[0047] As shown in Figure 4, multiple solder 216 are formed in a ball shape on the surface of an annular land 215, spaced apart from each other. For example, the multiple solder 216 are arranged in an annular shape having a diameter substantially intermediate between the inner and outer diameters of the land 215. For example, eight ball-shaped solder 216 are provided for one land 215, but there may be any number. The solder 216 may also be called welcoming solder.

[0048] The formation of the solder 216 in this manner results in the surface of the land 215 having an uneven shape. Furthermore, the end 52 of the conductive elastic member 50 undergoes deformation that causes it to bite into the multiple solder 216, thereby increasing the adhesion between the conductive elastic member 50 and the substrate 210, and further improving the conductivity.

[0049] According to the second embodiment described above, the substrate 210 has solder 216 that is fixed to a portion of the surface of the land 215 and arranged to be in contact with the conductive elastic member 50 together with the land 215. Such contact can improve the conductivity between the substrate 210 and the conductive elastic member 50.

[0050] (Third embodiment) As shown in Figure 5, the third embodiment is a modification of the first embodiment. The third embodiment will be described focusing on the differences from the first embodiment.

[0051] In the third embodiment of the electronic device 301, the configuration of the housing portion 320 and the first housing component 321 differs from that of the first embodiment. As a result, the clamping and holding portion H4 shown in Figure 5 is formed instead of the clamping and holding portion H2 of the first embodiment.

[0052] Specifically, in the clamping and holding portion H4, the first housing component 321 has a projection 325 that projects linearly from the tip surface 24a of the substrate support portion 24 into the through hole 313. This projection 325 is formed in a cylindrical shape, but it may have other shapes such as a rectangular prism as long as it can project into the through hole 313. The projection 325 may be formed smaller than the diameter of the through hole 313, in which case it may have a function of substantially guiding the position of the substrate 10, but may not be able to be said to have a positioning function. The through hole 313 has substantially the same shape as the positioning hole 13 of the first embodiment, but depending on the relationship with the diameter of the projection 325 described above, it may have a function of substantially guiding the position of the substrate 10, but may not be able to be said to have a positioning function.

[0053] The projection 325 is provided so as to penetrate the through hole 313. The projection height of the projection 325 is substantially equal to or slightly greater than the thickness of the substrate 10. The top 325a of the projection 325 is formed in a planar shape so as to be substantially parallel to the tip plane 24a.

[0054] As a result, the top portion 325a and the end portion 52 of the conductive elastic member 50 are in surface contact. More specifically, it is preferable that the elastic reaction force of the conductive elastic member 50 be used to ensure that the top portion 325a and the end portion 52 of the conductive elastic member 50 are in close contact.

[0055] According to the third embodiment described above, the through-hole 313, which serves as a substrate hole, is formed to penetrate the portion of the substrate 10 sandwiched between the substrate support portion 24 and the conductive elastic member 50. The projection 325 has its top portion 325a in contact with the end portion 52 of the conductive elastic member 50. This contact allows for the formation of a path for electrical conduction from the conductive elastic member 50 to the substrate support portion 24, thereby enhancing the electromagnetic shielding function.

[0056] (Fourth Embodiment) As shown in Figures 6 and 7, the fourth embodiment is a modified version of the third embodiment. The fourth embodiment will be described focusing on the differences from the third embodiment.

[0057] In the electronic device 401 of the fourth embodiment, the configuration of the housing portion 420, the first housing component 421, and the conductive elastic member 450 differs from that of the third embodiment. As a result, the clamping and holding portion H5 shown in Figure 6 is formed instead of the clamping and holding portion H4 of the third embodiment.

[0058] Specifically, the conductive elastic member 450, which is positioned between the substrate 10 and the conductive member 40 in the clamping and holding portion H5, has a columnar through-hole 453 that penetrates through both ends 451 and 452, as shown in Figure 7. As a result, the conductive elastic member 450 is formed in a cylindrical shape. In this embodiment, the through-hole 453 is formed in a cylindrical shape, but it may be formed in other shapes such as a rectangular prism. The diameter of the through-hole 453 is the same as the diameter of the projection 425, which will be described later.

[0059] As shown in Figure 6, in the first housing component 421, the projection 425 protruding from the tip surface 24a of the substrate support portion 24 penetrates the through hole 313 of the substrate 10 and further protrudes into the through hole 453 of the conductive elastic member 450. Due to the diameter setting described above, the projection 425 is in a state of being press-fitted into the through hole 453.

[0060] Furthermore, the projection 425 is configured such that its top portion 425a is in contact with the conductive member 40. On the other hand, the top portion 425a may be located in the middle of the through hole 453, in which case it will be spaced apart and not in contact with the conductive member 40.

[0061] According to the fourth embodiment described above, the through-hole 453, which serves as a substrate hole, is formed to penetrate the portion of the substrate 10 sandwiched between the substrate support portion 24 and the conductive elastic member 450. The conductive elastic member 450 has a through-hole 453, which serves as a member hole arranged to communicate with the through-hole 453. The projection 425 is in contact with the conductive member 40 through the through-hole 452. This contact allows for the formation of conductive paths on both sides of the housing portion 20. Furthermore, the projection 425 is in contact with the conductive elastic member 450 while being press-fitted into the through-hole 453. This press-fit contact allows for the formation of a conductive path from the conductive elastic member 450 to the substrate support portion 24, thereby enhancing the electromagnetic shielding function.

[0062] (Other embodiments) Although several embodiments have been described above, this disclosure is not limited to those embodiments and can be applied to various embodiments and combinations without departing from the spirit of this disclosure.

[0063] In another embodiment, the lands 15 may not be provided in the clamping and holding parts H1, H2, etc., so as to surround the positioning hole 13.

[0064] In another embodiment, in the clamping and holding portions H1, H2, etc., the substrate 10 does not need to have a positioning hole 13 between the substrate support portion 24 and the conductive elastic member 50. In this case, a positioning projection 25 protruding from the substrate support portion 24 does not need to be provided.

[0065] In another embodiment, in the clamping and holding parts H1, H2, etc., the substrate support part 24 and the conductive elastic member 50 do not have to be positioned opposite each other in the thickness direction of the substrate 10, with the substrate 10 in between. That is, the substrate support part 24 and the conductive elastic member 50 do not have to be positioned slightly offset in the extending direction of the substrate 10, with the substrate 10 in between.

[0066] In another embodiment relating to the third embodiment, the projection 325 may have a positioning function for the substrate 310 by forming the projection 325 to have approximately the same diameter as the through hole 313. Even if the diameters are different, the projection 325 may be provided with a positioning mechanism such as a flange to realize the positioning function.

[0067] In the fourth embodiment, the conductive elastic member 450 may have a bottomed hole instead of a columnar through hole 453 that penetrates between both ends 451 and 452. The projection 425 may be formed to a projection height that matches the depth of the bottomed hole and press-fitted into the bottomed hole.

[0068] In other embodiments, the mobile body on which the electronic device 1 is installed may be a ship, aircraft, railway vehicle, or the like, other than a vehicle. The mobile body on which the electronic device 1 is installed may also be an unmanned mobile body.

[0069] In other embodiments, the electronic device 1 does not have to be mounted on a mobile device. For example, the electronic device 1 may be mounted on consumer goods such as refrigerators and microwave ovens, communication equipment, power equipment, etc.

[0070] In another embodiment, the housing portion 20 may have fins for heat dissipation.

[0071] (Disclosure of technical ideas) This specification discloses several technical concepts, as listed in the following paragraphs. Some paragraphs are written in a multiple dependent form, where subsequent paragraphs alternately refer to preceding paragraphs. These paragraphs written in a multiple dependent form define several technical concepts.

[0072] <Technical philosophy 1> An electronic device comprising a plate-shaped substrate (10) on which electronic components (11) are mounted, and a housing portion (20, 320, 420) for housing the substrate, The housing portion has a substrate support portion (24) that supports the substrate from one side (S1), A conductive member (40) having conductivity is arranged on the opposite side of the substrate support portion, across the substrate, so as to be fixed to the housing portion, The system further comprises a conductive elastic member (50, 450) which is disposed between the other surface (S2) of the substrate and the conductive member, and which is conductive and elastic. An electronic device having clamping holding portions (H2, H3, H4, H5) formed in which the substrate is held in the housing portion while sandwiched between the substrate support portion and the conductive elastic member.

[0073] <Technical philosophy 2> The aforementioned clamping and holding portion is formed at multiple locations on the same substrate, as described in technical concept 1 of the electronic device.

[0074] <Technical philosophy 3> The electronic device according to technical concept 1 or 2, wherein the same substrate has a clamping holding portion and a holding portion (H1) separate from the clamping holding portion, the holding portion having no conductive member installed relative to the clamping holding portion.

[0075] <Technical philosophy 4> The electronic device according to any one of the technical concepts 1 to 3, wherein the substrate has conductive lands (15, 215) arranged on its surface at a position facing the conductive elastic member so as to be in contact with the conductive elastic member.

[0076] <Technical philosophy 5> The electronic device according to technical concept 4, wherein the substrate further comprises solder (216) fixed to a portion of the surface of the land and arranged to be in contact with the conductive elastic member together with the land.

[0077] <Technical philosophy 6> The electronic device according to any one of technical ideas 1 to 5, wherein the substrate support portion and the conductive elastic member are arranged opposite each other in the thickness direction of the substrate, with the substrate in between.

[0078] <Technical philosophy 7> The substrate has substrate holes (13, 313) formed between the substrate support portion and the conductive elastic member, The electronic device according to technical concept 6, wherein the housing portion further has protrusions (25, 325, 425) that project from the substrate support portion into the interior of the substrate hole.

[0079] <Technical philosophy 8> The aforementioned substrate hole is formed to penetrate the portion of the substrate sandwiched between the substrate support portion and the conductive elastic member, The electronic device according to technical concept 7, wherein the projection has its top portion (325a) in contact with the end portion (52) of the conductive elastic member.

[0080] <Technical philosophy 9> The aforementioned substrate hole is formed to penetrate the portion of the substrate sandwiched between the substrate support portion and the conductive elastic member, The conductive elastic member has a member hole (453) that is arranged to communicate with the substrate hole, The electronic device according to technical concept 7, wherein the projection is in contact with the conductive member through the member hole.

[0081] <Technical Thought 10> The electronic device according to technical concept 6, wherein the substrate has a substrate hole (13) between the substrate support portion and the conductive elastic member, which is filled with a conductive filling conductive member, separate from the conductive member, and the filling conductive member is in contact with the conductive elastic member. [Explanation of symbols]

[0082] 1: Electronic device, 10: Substrate, 24: Substrate support part, 20, 320, 420: Housing part, 50, 450: Conductive elastic member, H2, H3, H4, H5: Clamping and holding part, S1: First opposing surface, S2: Second opposing surface

Claims

1. An electronic device comprising a plate-shaped substrate (10) on which electronic components (11) are mounted, and a housing portion (20, 320, 420) for housing the substrate, The housing portion has a substrate support portion (24) that supports the substrate from one side (S1), A conductive member (40) having conductivity is arranged on the opposite side of the substrate support portion, across the substrate, so as to be fixed to the housing portion, The substrate is further provided with conductive elastic members (50, 450) which are disposed between the other surface (S2) of the substrate and the conductive member and are conductive and elastic. An electronic device having clamping holding portions (H2, H3, H4, H5) formed in which the substrate is held in the housing portion while sandwiched between the substrate support portion and the conductive elastic member.

2. The electronic device according to claim 1, wherein the clamping and holding portion is formed at multiple locations on the same substrate.

3. The electronic device according to claim 1 or 2, wherein the same substrate has a clamping holding portion and a holding portion (H1) separate from the clamping holding portion, the holding portion having no conductive member installed relative to the clamping holding portion.

4. The electronic device according to claim 1, wherein the substrate has conductive lands (15, 215) arranged on its surface at a position facing the conductive elastic member so as to be in contact with the conductive elastic member.

5. The electronic device according to claim 4, wherein the substrate further comprises solder (216) fixed to a portion of the surface of the land and arranged to be in contact with the conductive elastic member together with the land.

6. The electronic device according to claim 1, wherein the substrate support portion and the conductive elastic member are arranged opposite each other in the thickness direction of the substrate, with the substrate in between.

7. The substrate has substrate holes (13, 313) formed between the substrate support portion and the conductive elastic member, The electronic device according to claim 6, wherein the housing portion further has protrusions (25, 325, 425) that project from the substrate support portion into the interior of the substrate hole.

8. The aforementioned substrate hole is formed to penetrate the portion of the substrate sandwiched between the substrate support portion and the conductive elastic member, The electronic device according to claim 7, wherein the top portion (325a) of the projection is in contact with the end portion (52) of the conductive elastic member.

9. The aforementioned substrate hole is formed to penetrate the portion of the substrate sandwiched between the substrate support portion and the conductive elastic member, The conductive elastic member has a member hole (453) that is arranged to communicate with the substrate hole, The electronic device according to claim 7, wherein the projection is in contact with the conductive member through the member hole.

10. The electronic device according to claim 6, wherein the substrate has a substrate hole (13) between the substrate support portion and the conductive elastic member, the substrate hole (13) being filled with a conductive filling conductive member, which is different from the conductive member, and the filling conductive member is in contact with the conductive elastic member.

Images