Optical sensor device and imaging device

Abstract

To provide an optical sensor device and an imaging device that can suppress the increase in weight. [Solution] The optical sensor device 10 comprises a substrate 20, an optical sensor element 30 disposed on one side 20a of the substrate 20, a frame member 40 having a first surface 40a to which the first surface 20a of the substrate 20 is fixed and surrounding the optical sensor element 30, a light-transmitting member 50 fixed to a second surface 40b of the frame member 40 opposite to the first surface 40a and covering one side of the optical sensor element 30, and a heat-conducting member 60 having thermal conductivity. The frame member 40 has a projection 43 that protrudes from the first surface 40a to the other side opposite to the first side and faces the side surface 20c of the substrate 20, and the heat-conducting member 60 is filled between the side surface 20c of the substrate 20 and the projection 43.

Description

Technical Field

[0001] The present disclosure relates to an optical sensor device and an imaging device.

Background Art

[0002] Conventionally, an optical sensor device has been disclosed that includes a substrate, an optical sensor element disposed on one surface of the substrate, a frame member surrounding the optical sensor element, and a light-transmitting member fixed to the frame member and covering one side of the optical sensor element (see, for example, Patent Document 1). Patent Document 1 discloses an imaging element package including a solid-state imaging element, a circuit board that supports the back surface of the solid-state imaging element, a light-transmitting substrate facing the light-receiving surface of the solid-state imaging element, and a resin frame portion that houses the solid-state imaging element.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in an optical sensor device such as that of Patent Document 1, it is required to dissipate heat generated by an optical sensor element and / or electronic components mounted on a substrate. Therefore, for example, it is conceivable to provide a heat-dissipating metal plate on the back surface side of the substrate, but in this case, there is a problem that the optical sensor device becomes heavier.

[0005] Therefore, an object of the present disclosure is to provide an optical sensor device and an imaging device capable of suppressing weight increase.

Means for Solving the Problems

[0006] To solve the above problems, one embodiment of the optical sensor device in this disclosure comprises a substrate, an optical sensor element disposed on one side of the substrate, a frame member having a first surface to which the one side of the substrate is fixed and surrounding the optical sensor element, a light-transmitting member fixed to a second surface of the frame member opposite to the first surface and covering the one side of the optical sensor element, and a heat-conducting member having thermal conductivity, wherein the frame member has a projection that protrudes from the first surface to the other side opposite to the one side and faces the side surface of the substrate, and the heat-conducting member is filled between the side surface of the substrate and the projection.

[0007] Furthermore, in order to solve the above problems, one embodiment of the imaging device in this disclosure comprises an optical sensor device for imaging a subject, and an imaging optical system for guiding light from the subject to the optical sensor device. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide an optical sensor device and an imaging device that can suppress the increase in weight. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic diagram showing the configuration of an imaging device equipped with an optical sensor device according to one embodiment of the present disclosure. [Figure 2] Figure 2 is an end view showing the structure of an optical sensor device according to one embodiment of the present disclosure. [Figure 3] Figure 3 is a diagram showing an optical sensor device according to one embodiment of the present disclosure, viewed from the substrate side. [Figure 4] Figure 4 is an enlarged view showing the structure around a protruding portion of an optical sensor device according to one embodiment of the present disclosure. [Figure 5] Figure 5 is a diagram showing an optical sensor device according to one embodiment of the present disclosure, viewed from the light-transmitting member side. [Figure 6] Figure 6 is an end view showing the structure of an optical sensor device according to the first modified example of this disclosure. [Figure 7]Figure 7 is an enlarged view showing the structure around the protruding portion of the optical sensor device according to the first modified example of this disclosure. [Figure 8] Figure 8 is an end view showing the structure of the optical sensor device according to the second modified example. [Figure 9A] Figure 9A is an end view showing an example of the structure of a light sensor device according to the third modified example. [Figure 9B] Figure 9B is an end view showing another example of the structure of the optical sensor device according to the third modified example. [Figure 10] Figure 10 is an end view showing the structure of the optical sensor device according to the fourth modified example. [Figure 11] Figure 11 shows the optical sensor device according to the fourth modified example, viewed from the light-transmitting member side. [Modes for carrying out the invention]

[0010] Embodiments for implementing this technology will be described below. Note that the following embodiments are all specific examples of this disclosure, and the numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps are examples only and do not limit this disclosure. Furthermore, coordinate axes may be shown in the drawings used to describe the following embodiments. In these embodiments, the X, Y, and Z axes represent the three axes of a three-dimensional Cartesian coordinate system. Also, in these embodiments, the Z axis indicates a direction perpendicular to one side 20a of the substrate 20. Furthermore, in this specification, "plan view" means a view from the Z-axis direction.

[0011] (Embodiment) Figure 1 is a schematic diagram showing the configuration of an imaging device 200 equipped with an optical sensor device 10 according to one embodiment of the present disclosure. Figure 2 is an end view showing the structure of the optical sensor device 10 according to one embodiment of the present disclosure. Note that in Figures 2 and beyond, hatching may not be applied even to cross-sections for the sake of simplifying the drawings.

[0012] As shown in FIG. 1, the imaging device 200 constitutes a camera module such as a camera or an endoscope. Specifically, the imaging device 200 includes an optical sensor device 10, a lens 110 as an imaging optical system that guides light from a subject to the optical sensor device 10, and a housing 120 that houses these components. The housing 120 is made of a material having thermal conductivity, such as metal. Note that the shape and structure of the housing 120 are not particularly limited as long as the optical sensor device 10 and the lens 110 can be fixed at predetermined positions. The lens 110 is an example of the "imaging optical system" of the present invention.

[0013] The optical sensor device 10 captures an image of a subject by receiving the light that has passed through the lens 110. The optical sensor device 10 includes a substrate 20, an optical sensor element 30, a frame member 40, a light-transmitting member 50, and a heat-conducting member 60 (see FIG. 2).

[0014] As shown in FIG. 2, the substrate 20 supports the optical sensor element 30. Specifically, the substrate 20 is formed in a plate shape having a predetermined thickness (for example, 0.5 mm or more and 2 mm or less). The substrate 20 has a rectangular shape in plan view. The substrate 20 has one surface 20a located on one side (the positive direction of the Z axis), another surface 20b located on the side opposite to the one surface 20a (the negative direction of the Z axis), and a side surface 20c that connects the one surface 20a and the other surface 20b. The substrate 20 has, for example, an insulating base material and metal wirings (not shown) provided on the surface and inside of the base material. The substrate 20 is not particularly limited, but for example, an LTCC (Low Temperature Co-fired Ceramics) substrate or a glass epoxy substrate can be used.

[0015] The optical sensor element 30 is disposed on one surface 20a of the substrate 20. Specifically, the optical sensor element 30 has a thickness thinner than that of the substrate 20, for example. The optical sensor element 30 has a rectangular shape in a plan view. The optical sensor element 30 is fixed to one surface 20a of the substrate 20 using a die attach material 61. The optical sensor element 30 has a light receiving surface 30a located on one side (opposite to the substrate 20). The light receiving surface 30a is provided with a pixel array 31 including a plurality of pixels having a photoelectric conversion function and a plurality of pad electrodes 32 disposed around the pixel array 31. The pad electrodes 32 of the optical sensor element 30 are electrically connected to the substrate 20 using metal wires 62.

[0016] FIG. 3 is a view showing the optical sensor device 10 according to an embodiment of the present disclosure from the substrate 20 side. As shown in FIGS. 2 and 3, the optical sensor device 10 includes a plurality of electronic components 63 provided on the substrate 20. Examples of the electronic components 63 include capacitors and resistors. In the present embodiment, the electronic components 63 are fixed (mounted) on the other surface 20b of the substrate 20. Further, the electronic components 63 are mounted on a portion of the other surface 20b of the substrate 20 that is separated from the periphery by a predetermined distance (for example, several mm or more).

[0017] The frame member 40 surrounds the periphery of the optical sensor element 30. Specifically, the frame member 40 has a frame body 41 having a substantially rectangular shape, for example, in a plan view. The frame member 40 has a housing portion 42 for housing the optical sensor element 30. The housing portion 42 is formed in the frame body 41 of the frame member 40. The housing portion 42 has a rectangular shape, for example, in a plan view. The housing portion 42 has an area larger than that of the optical sensor element 30 and smaller than that of the substrate 20 in a plan view. Note that the frame body 41 and the housing portion 42 of the frame member 40 may have a shape other than a rectangular shape in a plan view.

[0018] As shown in Figure 2, the frame member 40 has a first surface 40a to which one side 20a of the substrate 20 is fixed, and a second surface 40b opposite to the first surface 40a. Specifically, the first surface 40a and the second surface 40b are formed on the frame body 41. The periphery of one side 20a of the substrate 20 is fixed to the first surface 40a via an adhesive layer 64. The periphery of the other side 50b of the light-transmitting member 50 (described later) is fixed to the second surface 40b via an adhesive layer 65. As a result, the housing portion 42 of the frame member 40 is a sealed space.

[0019] In this embodiment, the frame member 40 has a projection 43 that protrudes from the first surface 40a to the opposite side (negative direction of the Z-axis) and faces the side surface 20c of the substrate 20. The frame body 41 and the projection 43 are integrally formed using, for example, a resin such as epoxy resin and / or metal. The frame body 41 and the projection 43 may be formed using the same material. Alternatively, the frame body 41 and the projection 43 may be formed using different materials. For example, one of the frame body 41 and the projection 43 may be formed of resin and the other of metal. In this embodiment, the frame body 41 and the projection 43 are integrally formed using a resin such as epoxy resin. By integrally forming the frame body 41 and the projection 43, distortion at high temperatures can be suppressed. The detailed structure around the projection 43 will be described later.

[0020] The light-transmitting member 50 is light-transmitting. The light-transmitting member 50 transmits light that has passed through the lens 110. The light-transmitting member 50 is fixed to the second surface 40b of the frame member 40, opposite to the first surface 40a, and covers one side (positive Z-axis direction) of the light sensor element 30. Specifically, the light-transmitting member 50 has, for example, a rectangular shape in plan view. The light-transmitting member 50 has a larger area than the housing portion 42 of the frame member 40 in plan view. The light-transmitting member 50 may have a shape other than rectangular in plan view.

[0021] The light-transmitting member 50 is, for example, a plate-shaped member. The light-transmitting member 50 has one surface 50a located on one side (positive direction of the Z axis) and another surface 50b located on the opposite side of the surface 50a (negative direction of the Z axis). The periphery of the other surface 50b of the light-transmitting member 50 is fixed to the second surface 40b of the frame member 40.

[0022] The material of the light-transmitting member 50 is not particularly limited, but for example, it is glass. Specifically, examples of materials for the light-transmitting member 50 include borosilicate glass, quartz glass, and heat-resistant glass.

[0023] The heat conductive member 60 has thermal conductivity and is filled between the side surface 20c of the substrate 20 and the protrusion 43. A higher thermal conductivity of the heat conductive member 60 is preferable. The thermal conductivity of the heat conductive member 60 is, for example, 0.5 [W / m·K] or higher, and preferably 1.0 [W / m·K] or higher.

[0024] The heat conductive member 60 has a lower modulus of elasticity than, for example, the substrate 20 and the frame member 40. Specifically, the heat conductive member 60 is a gel-like material such as silicone gel, acrylic gel, or urethane gel. In this embodiment, the heat conductive member 60 is silicone gel. The modulus of elasticity of the heat conductive member 60 is preferably 300 [MPa] or less, and more preferably 100 [MPa] or less. The modulus of elasticity of the substrate 20 and the frame member 40 is, for example, several [GPa] to several tens of [GPa]. The heat conductive member 60 may be a material other than a gel-like material, such as rubber.

[0025] Next, the structure around the protruding portion 43 will be described with reference to Figures 4 and 5. Figure 4 is an enlarged view showing the structure around the protruding portion 43 of the optical sensor device 10 according to one embodiment of the present disclosure. Figure 5 is a view of the optical sensor device 10 according to one embodiment of the present disclosure from the light-transmitting member 50 side.

[0026] As shown in Figures 3 to 5, the protrusion 43 is provided along the housing portion 42. Specifically, the protrusion 43 is formed to extend linearly along the housing portion 42. The protrusion 43 is also provided on the first surface 40a of the frame member 40 at a predetermined distance from the housing portion 42. The substrate 20 is fixed to the portion of the first surface 40a of the frame member 40 that is on the housing portion 42 side relative to the protrusion 43.

[0027] As shown in Figure 4, the protruding portion 43 has a substantially rectangular shape in cross-sectional view, for example. The protruding portion 43 has a first side surface 43a located on the side of the housing portion 42, a second side surface 43b located on the opposite side from the housing portion 42 (outside the frame member 40), and a connecting surface 43c that connects the first side surface 43a and the second side surface 43b. The connecting surface 43c is the surface facing the other side (negative direction of the Z axis).

[0028] The first side surface 43a faces the side surface 20c of the substrate 20. Specifically, the first side surface 43a extends substantially parallel to the side surface 20c of the substrate 20. The heat conductive member 60 is filled between the first side surface 43a and the side surface 20c of the substrate 20. The heat conductive member 60 is in contact with at least the first side surface 43a of the protrusion 43. In this embodiment, the heat conductive member 60 is also in contact with the connection surface 43c of the protrusion 43.

[0029] The first side surface 43a is close to the side surface 20c of the substrate 20, and the distance L1 between the first side surface 43a and the side surface 20c of the substrate 20 is, for example, a few millimeters or less, and in this embodiment, it is 1 mm or less. The distance L1 between the first side surface 43a and the side surface 20c of the substrate 20 is, for example, shorter than the protrusion height H1 of the protrusion 43.

[0030] The connection surface 43c of the protrusion 43 is formed, for example, on a flat surface. The position of the connection surface 43c in the Z-axis direction is not particularly limited, but for example, the connection surface 43c is located on the other side (negative Z-axis direction) of one side 20a of the substrate 20 and on one side (positive Z-axis direction) of the other side 20b of the substrate 20.

[0031] Furthermore, in this embodiment, in a plan view, the protrusion 43 is provided on at least the portion of the frame member 40 that faces the high-heat-generating component 63a or the high-heat-generating portion 33.

[0032] Specifically, as shown in Figure 3, the multiple electronic components 63 include a high-heat-generating component 63a that generates more heat than the other electronic components 63. The protrusion 43 is provided in a plan view on at least the portion of the frame member 40 that faces the high-heat-generating component 63a.

[0033] Alternatively, as shown in Figure 5, the optical sensor element 30 has a high-heat-generating portion 33 that generates more heat than other parts. The protruding portion 43 is provided in a plan view of at least the portion of the frame member 40 that faces the high-heat-generating portion 33.

[0034] In this embodiment, the high-heat-generating component 63a or high-heat-generating portion 33 is located closest to, for example, two of the four sides 21 (see Figure 3) of the substrate 20, namely sides 21a and 21b (see Figure 3). The protrusion 43 is positioned opposite to these two sides 21a and 21b. Furthermore, the protrusion 43 faces the portion of the two sides 21a and 21b that is closest to the high-heat-generating component 63a or high-heat-generating portion 33.

[0035] Furthermore, as shown in Figure 3, the frame member 40 has mounting portions 44 provided at a different position from the protruding portion 43 and attached to a member other than the optical sensor device 10. Specifically, the frame member 40 has a plurality of mounting portions 44 provided in a region that does not overlap with the protruding portion 43 and the substrate 20 in a plan view. The plurality of mounting portions 44 include, for example, screw holes and positioning holes. The mounting portions 44 are, for example, parts for attaching the frame member 40 to a member other than the optical sensor device 10 (in this case, the housing 120, etc.).

[0036] Next, an example of a manufacturing method for the optical sensor device 10 will be briefly described.

[0037] With the other side 20b of the substrate 20 facing upwards, the electronic component 63 is placed on the other side 20b of the substrate 20 and mounted to the substrate 20 by heating it with a hot plate or curing oven. Next, with one side 20a of the substrate 20 facing upwards, the die attach material 61 is applied to the one side 20a of the substrate 20 and the optical sensor element 30 is placed on the die attach material 61. Then, the optical sensor element 30 is fixed to the substrate 20 by heating the substrate 20 with a hot plate or curing oven. After that, the pad electrodes 32 of the optical sensor element 30 and the substrate 20 are electrically connected by wire bonding.

[0038] Next, the first surface 40a of the frame member 40 is fixed to one surface 20a of the substrate 20 using the adhesive layer 64. Then, the other surface 50b of the light-transmitting member 50 is fixed to the second surface 40b of the frame member 40 using the adhesive layer 65.

[0039] Next, in this embodiment, a heat conductive member 60 is filled between the side surface 20c of the substrate 20 and the protruding portion 43 of the frame member 40.

[0040] The optical sensor device 10 is manufactured as described above. The adhesive layers 64, 65 and the heat conductive member 60 are heated and cured as needed. The adhesive layer 65 may be, for example, a UV (ultraviolet) curing resin, and may be cured by irradiating the adhesive layer 65 with UV light and then heating it.

[0041] As described above, the optical sensor device 10 according to this embodiment comprises a substrate 20, an optical sensor element 30 disposed on one surface 20a of the substrate 20, a frame member 40 having a first surface 40a to which the first surface 20a of the substrate 20 is fixed and surrounding the optical sensor element 30, a light-transmitting member 50 fixed to a second surface 40b of the frame member 40 opposite to the first surface 40a and covering one side (positive Z-axis direction) of the optical sensor element 30, and a heat-conducting member 60 having thermal conductivity. The frame member 40 has a projection 43 that protrudes from the first surface 40a to the other side opposite to the first side (negative Z-axis direction) and faces the side surface 20c of the substrate 20, and the heat-conducting member 60 is filled between the side surface 20c of the substrate 20 and the projection 43.

[0042] Thus, the frame member 40 has a projection 43 that protrudes from the first surface 40a to the other side and faces the side surface 20c of the substrate 20, and the heat conductive member 60 is filled between the side surface 20c of the substrate 20 and the projection 43. As a result, heat generated by the optical sensor element 30, etc. and transferred to the substrate 20 can be transferred from the side surface 20c of the substrate 20 to the projection 43 of the frame member 40 via the heat conductive member 60. Therefore, for example, it is not necessary to provide a metal plate for heat dissipation on the other side 20b of the substrate 20, thus preventing the optical sensor device 10 from becoming heavier. Also, since it is not necessary to provide a metal plate on the other side 20b of the substrate 20, it is not possible to prevent the optical sensor device 10 from becoming larger in the thickness direction (Z-axis direction).

[0043] Furthermore, in this embodiment, as described above, the heat conductive member 60 has a lower elastic modulus than the substrate 20 and the frame member 40. This allows the heat conductive member 60 to absorb the strain between the substrate 20 and the frame member 40 caused by heat.

[0044] Furthermore, in this embodiment, as described above, the frame member 40 is provided at a position different from the protruding portion 43 and has a mounting portion 44 that is attached to a member other than the optical sensor device 10. This makes it easy to prevent the optical sensor device 10 from being unable to be attached to another member due to the protruding portion 43.

[0045] Furthermore, in this embodiment, as described above, the substrate 20 is provided with a plurality of electronic components 63, the plurality of electronic components 63 include a high-heat generating component 63a that generates more heat than other electronic components 63, or the light sensor element 30 has a high-heat generating portion 33 that generates more heat than other parts, and in a plan view perpendicular to one surface 20a of the substrate 20, the protrusion 43 is provided on the part of the frame member 40 that faces the high-heat generating component 63a or the high-heat generating portion 33. This makes it possible to suppress the length of the distance between the high-heat generating component 63a or the high-heat generating portion 33 and the protrusion 43, thereby further improving the heat dissipation of the light sensor device 10.

[0046] (First variation) Next, with reference to Figure 6, a first modified optical sensor device 10 according to the present disclosure will be described. Figure 6 is an end view showing the structure of the first modified optical sensor device 10. Figure 7 is an enlarged view showing the structure around the protruding portion 43 of the first modified optical sensor device 10 according to the present disclosure.

[0047] As shown in Figure 6, in the first modified example, the optical sensor device 10 is equipped with a flexible heat dissipation sheet 70 attached to the protrusion 43. The heat dissipation sheet 70 is a sheet for dissipating heat generated by the optical sensor device 10 to the outside of the optical sensor device 10. The heat dissipation sheet 70 is fixed to the protrusion 43 via an adhesive layer 75. In the first modified example, as shown in Figure 7, one end 71 of the heat dissipation sheet 70 (the end facing the side surface 20c of the substrate 20) is fixed to the connection surface 43c of the protrusion 43 via the adhesive layer 75.

[0048] The heat dissipation sheet 70 is made of a sheet having high thermal conductivity. For example, the heat dissipation sheet 70 is made of a graphite sheet having a thermal conductivity of 200 to 2000 [W / m·K], or a metal sheet having a thermal conductivity of 200 to 400 [W / m·K]. In the first modified example, the heat dissipation sheet 70 is made of a graphite sheet. The graphite sheet has anisotropic thermal conductivity, and for example, the thermal conductivity in the plane direction (a direction intersecting the thickness direction) is greater than the thermal conductivity in the thickness direction. In the first modified example, the thermal conductivity in the plane direction is several to tens of times greater than the thermal conductivity in the thickness direction. By using a sheet having anisotropic thermal conductivity as the heat dissipation sheet 70, the heat generated by the optical sensor element 30 and the electronic component 63 can be easily transferred to the outside of the frame member 40.

[0049] Although not shown in the diagram, the other end of the heat dissipation sheet 70 (the end opposite to the one end 71) is in contact with a component other than the optical sensor device 10 (in this case, the housing 120, etc.). In the first modified example, the heat dissipation sheet 70 is in contact with the housing 120 with a portion of it bent. The heat dissipation sheet 70 may be fixed to the housing 120 using, for example, an adhesive (not shown), or it may not be fixed to the housing 120.

[0050] Furthermore, the heat dissipation sheet 70 has a thickness of, for example, 0.01 mm to 0.5 mm. This allows the heat dissipation sheet 70 to bend easily. Because the heat dissipation sheet 70 is flexible in this way, the optical sensor device 10 can be easily moved relative to the housing 120, for example, during image stabilization.

[0051] The adhesive layer 75 has a lower modulus of elasticity than the substrate 20 and the frame member 40. Specifically, the adhesive layer 75 may be a gel-like material such as silicone gel, acrylic gel, or urethane gel, or it may be composed of a resin containing metal. The modulus of elasticity of the adhesive layer 75 is preferably 300 MPa or less, and more preferably 100 MPa or less.

[0052] Furthermore, the adhesive layer 75 is in contact with the heat conductive member 60. That is, the heat conductive member 60 is in contact with the side surface 20c of the substrate 20, the first side surface 43a of the protrusion 43, and the adhesive layer 75. For this reason, it is preferable that the adhesive layer 75 has a high thermal conductivity. The thermal conductivity of the adhesive layer 75 is, for example, 0.5 [W / m·K] or more, and preferably 1.0 [W / m·K] or more. The material of the adhesive layer 75 is not particularly limited, but in the first modified example, the adhesive layer 75 is made of, for example, a resin containing a conductive filler. The adhesive layer 75 may also be, for example, a sheet-like member.

[0053] The position of one end 71 of the heat dissipation sheet 70 (the end facing the side surface 20c of the substrate 20) in the Z-axis direction is not particularly limited, but for example, it is located on the other side of the substrate 20 (negative Z-axis direction) than the other side 20a of the substrate 20, and on the other side of the substrate 20 (positive Z-axis direction) than the other side 20b of the substrate 20. In the first modified example, the position of one end 71 of the heat dissipation sheet 70 in the Z-axis direction is located in the center of the substrate 20 in the thickness direction (Z-axis direction). The center of the substrate 20 in the thickness direction is, for example, the central part when the substrate 20 is divided into three equal parts in the thickness direction.

[0054] Next, an example of a manufacturing method for the optical sensor device 10 according to the first modified example will be briefly described.

[0055] The procedure is the same as in the above embodiment until the other surface 50b of the light-transmitting member 50 is fixed to the second surface 40b of the frame member 40.

[0056] Next, in the first modified example, the heat dissipation sheet 70 is fixed to the protruding portion 43 of the frame member 40 using the adhesive layer 75. Then, the heat conductive member 60 is filled between the side surface 20c of the substrate 20 and the protruding portion 43 of the frame member 40. At this time, in the first modified example, the heat conductive member 60 is filled so that it is in contact with the heat dissipation sheet 70.

[0057] As described above, the optical sensor device 10 according to the first modified example is manufactured. The adhesive layer 75 and the heat conductive member 60 are heated and cured as needed.

[0058] In the first modified example, as described above, a flexible heat dissipation sheet 70 is attached to the protrusion 43, and the heat conductive member 60 is in contact with the heat dissipation sheet 70. This allows heat from the substrate 20 to be transferred to the heat dissipation sheet 70 via the heat conductive member 60, thereby further improving the heat dissipation performance of the optical sensor device 10.

[0059] Furthermore, in the first modified example, as described above, the heat dissipation sheet 70 has anisotropic thermal conductivity, and the thermal conductivity in the plane direction intersecting the thickness direction of the heat dissipation sheet 70 is higher than the thermal conductivity in the thickness direction of the heat dissipation sheet 70. As a result, the heat from the substrate 20 can be efficiently transferred from one end 71 to the other end of the heat dissipation sheet 70, so that, for example, the heat from the substrate 20 can be efficiently dissipated to a component other than the optical sensor device 10 (in this case, the housing 120, etc.).

[0060] Other structures, manufacturing methods, and effects of the first modified example are the same as those of the embodiments described above.

[0061] (Second variation) Next, with reference to Figure 8, a second modified optical sensor device 10 of the present disclosure will be described. Figure 8 is an end view showing the structure of the second modified optical sensor device 10. In the second modified example, a part of the first modified example shown in Figure 6 is modified for explanation, but for example, a part of the above embodiment may also be modified.

[0062] As shown in Figure 8, in the second modified example, the substrate 20 includes a core material 22 having high thermal conductivity. Specifically, the substrate 20 has a core material 22, an insulating layer 23 disposed on both sides of the core material 22, and a wiring layer (not shown) disposed inside or on the surface of the insulating layer 23. The core material 22 extends along one side 20a of the substrate 20. The core material 22 is a metal plate, formed from a metal such as copper or aluminum. In the second modified example, the core material 22 is a copper plate. The core material 22 also has a thickness of, for example, several hundred μm to several mm. For example, the core material 22 has a thickness of 1 mm to 2 mm.

[0063] The substrate 20 has a thermal conductivity at least twice that of a typical printed circuit board (for example, about 0.3 [W / m·K]). Specifically, the substrate 20 has a thermal conductivity of 1.0 [W / m·K] or higher. Preferably, the substrate 20 has a thermal conductivity of 1.5 [W / m·K] or higher, and more preferably, a thermal conductivity of 2.0 [W / m·K] or higher.

[0064] In the second modified example, the protrusion 43 is formed such that the heat dissipation sheet 70 is located on the extension of the core material 22. Specifically, when viewed from the direction in which the substrate 20 extends (the X-axis or Y-axis direction perpendicular to the Z-axis), one end 71 of the heat dissipation sheet 70 is positioned to overlap with the substrate 20.

[0065] In the second modified example, the heat conductive member 60 is in contact with the core material 22 and the heat dissipation sheet 70.

[0066] In the second modified example, as described above, the substrate 20 includes a core material 22 that has thermal conductivity and extends along one side 20a. This allows heat generated by the optical sensor element 30, etc., to be efficiently transferred to the side surface 20c of the substrate 20. As a result, the heat dissipation of the optical sensor device 10 can be further improved.

[0067] Furthermore, in the second modified example, as described above, a flexible heat dissipation sheet 70 is attached to the protrusion 43, and the protrusion 43 is formed such that the heat dissipation sheet 70 is located on the extension of the core material 22, and the heat conductive member 60 is in contact with the core material 22 and the heat dissipation sheet 70. By forming the protrusion 43 in this way such that the heat dissipation sheet 70 is located on the extension of the core material 22, it is possible to suppress an increase in the distance between the core material 22 and the heat dissipation sheet 70. As a result, the heat dissipation performance of the optical sensor device 10 can be further improved.

[0068] Other structures, manufacturing methods, and effects of the second modified example are the same as those of the above embodiment and the first modified example.

[0069] (Third variation) Next, an optical sensor device 10 according to a third modification of the present disclosure will be described with reference to Figures 9A and 9B. Figure 9A is an end view showing an example of the structure of the optical sensor device 10 according to the third modification. Figure 9B is an end view showing another example of the structure of the optical sensor device 10 according to the third modification.

[0070] As shown in Figures 9A and 9B, in the third modified example, the position of one end 71 of the heat dissipation sheet 70 in the Z-axis direction is located on one or the other side in the Z-axis direction relative to the center P20 in the thickness direction of the substrate 20. Therefore, when viewed from the direction in which the substrate 20 extends (the X-axis direction or Y-axis direction perpendicular to the Z-axis direction), one end 71 of the heat dissipation sheet 70 does not overlap with the center P20 in the thickness direction of the substrate 20. Specifically, as shown in Figure 9A, one end 71 of the heat dissipation sheet 70 is located in the negative Z-axis direction relative to the center P20 in the thickness direction of the substrate 20. Alternatively, as shown in Figure 9B, one end 71 of the heat dissipation sheet 70 is located in the positive Z-axis direction relative to the center P20 in the thickness direction of the substrate 20.

[0071] In the third modified example, when the heat generated by the optical sensor element 30 is greater than that generated by the electronic component 63, one end 71 of the heat dissipation sheet 70 is positioned in the negative direction of the Z-axis relative to the center P20 in the thickness direction of the substrate 20, as shown in Figure 9A. On the other hand, when the heat generated by the optical sensor element 30 is less than that generated by the electronic component 63, one end 71 of the heat dissipation sheet 70 is positioned in the positive direction of the Z-axis relative to the center P20 in the thickness direction of the substrate 20, as shown in Figure 9B.

[0072] In the third modified example, as described above, when the amount of heat generated by the optical sensor element 30 is greater than the amount of heat generated by the electronic component 63, one end 71 of the heat dissipation sheet 70 is positioned in the negative direction of the Z axis relative to the center P20. On the other hand, when the amount of heat generated by the optical sensor element 30 is less than the amount of heat generated by the electronic component 63, one end 71 of the heat dissipation sheet 70 is positioned in the positive direction of the Z axis relative to the center P20. In other words, one end 71 of the heat dissipation sheet 70 is positioned to face the part of the side surface 20c of the substrate 20 that is farther away from the component that generates more heat (optical sensor element 30 or electronic component 63). For example, as shown by the arrow in Figure 9A, heat from the optical sensor element 30 is easily transferred to the part of the side surface 20c of the substrate 20 that is farther away from the optical sensor element 30. Also, as shown by the arrow in Figure 9B, heat from the electronic component 63 is easily transferred to the part of the side surface 20c of the substrate 20 that is farther away from the electronic component 63. Therefore, by positioning one end 71 of the heat dissipation sheet 70 so as to face the portion of the side surface 20c of the substrate 20 that is far from components that generate a large amount of heat (optical sensor element 30 or electronic component 63), heat from the substrate 20 can be dissipated more efficiently through the heat dissipation sheet 70.

[0073] The other structures, manufacturing methods, and effects of the third modification are the same as those of the first modification described above.

[0074] (Fourth variation) Next, a fourth modified optical sensor device 10 of the present disclosure will be described with reference to Figures 10 and 11. Figure 10 is an end view showing the structure of the fourth modified optical sensor device 10. Figure 11 is a view showing the fourth modified optical sensor device 10 from the light-transmitting member 50 side. In the fourth modified example, a part of the first modified example shown in Figure 6 is modified for explanation, but for example, a part of the above embodiment, the second modified example, or the third modified example may also be modified.

[0075] As shown in Figure 10, in the fourth modified example, the frame member 40 has a concave region R2. Specifically, as shown in Figure 11, in a plan view, the frame member 40 has a mounting portion forming region R1 in which the mounting portion 44 is formed, and a concave region R2 which is formed in a concave shape.

[0076] The concave region R2 is provided in the frame body 41. The concave region R2 has a thinner thickness than the rest of the frame body 41. In the fourth modified example, the concave region R2 is a region where a part of the second surface 40b of the frame member 40 is recessed toward the first surface 40a side (negative direction of the Z axis). In other words, the concave region R2 is a region where the surface (second surface 40b) opposite to the protruding portion 43 of the frame member 40 is formed in a concave shape. Also, in the fourth modified example, in a plan view, a part of the concave region R2 and at least a part of the protruding portion 43 overlap. In the example shown in Figure 11, in a plan view, a part of the concave region R2 and the entire protruding portion 43 overlap.

[0077] In the fourth modified example, as described above, the frame member 40 has a concave region R2 formed in a concave shape. This suppresses an increase in the mass of the frame member 40. Therefore, for example, when image stabilization is performed, it is possible to suppress the difficulty of the optical sensor device 10 moving relative to the housing 120.

[0078] Furthermore, the concave region R2 is a region formed in a concave shape on the surface (second surface 40b) of the frame member 40 opposite to the protruding portion 43. This allows at least a portion of the concave region R2 and at least a portion of the protruding portion 43 to overlap in a plan view. As a result, the concave region R2 can be made larger, which further suppresses the increase in the mass of the frame member 40.

[0079] The other structures, manufacturing methods, and effects of the fourth modified example are the same as those of the embodiments described above.

[0080] The optical sensor device and imaging device relating to this disclosure have been described above based on embodiments and modifications, but this disclosure is not limited to these embodiments and modifications. Within the scope of this disclosure, various modifications conceivable by those skilled in the art, as well as other forms constructed by combining some of the components of the embodiments and modifications, are also included, as long as they do not depart from the spirit of this disclosure.

[0081] For example, the above embodiments describe an imaging device 200 equipped with an optical sensor device 10, but this disclosure is not limited to this, and can be applied to devices other than imaging devices as long as they are equipped with an optical sensor element 30 that detects light. [Industrial applicability]

[0082] This disclosure can be used in optical sensor devices and imaging devices, etc. [Explanation of Symbols]

[0083] 10. Optical sensor device 20 circuit boards 20a One side 20c side 22 Core material 30 Light sensor elements 33 High-heat generating section 40 Frame members 40a Page 1 40b 2nd side 43 Protrusion 44 Mounting part 50 Light-transmitting member 60 Heat conductive material 63 Electronic Components 63a High-heat generating components 70 Heat dissipation sheets 110 Lens (Imaging Optical System) 200 Imaging device

Claims

1. circuit board and A light sensor element is disposed on one side of the substrate, The substrate has a first surface to which one side is fixed, and a frame member that surrounds the optical sensor element, A light-transmitting member is fixed to the second surface of the frame member opposite to the first surface, and covers one side of the light sensor element. A thermal conductive member having thermal conductivity, Equipped with, The frame member has a projection that extends from the first surface to the other side opposite to the one side, and that faces the side surface of the substrate. The heat conductive member is filled between the side surface of the substrate and the protrusion. Optical sensor device.

2. The aforementioned protruding portion is equipped with a flexible heat dissipation sheet, The heat conductive member is in contact with the heat dissipation sheet. The optical sensor device according to claim 1.

3. The heat dissipation sheet has anisotropic thermal conductivity, The thermal conductivity of the heat dissipation sheet in a plane direction intersecting the thickness direction is higher than the thermal conductivity of the heat dissipation sheet in the thickness direction. The optical sensor device according to claim 2.

4. The heat conductive member has a lower elastic modulus than the substrate and the frame member. The optical sensor device according to any one of claims 1 to 3.

5. The frame member is provided at a position different from the protruding portion and has a mounting portion that is attached to a member other than the optical sensor device. The optical sensor device according to any one of claims 1 to 4.

6. The substrate has thermal conductivity and includes a core material extending along one of its surfaces. The optical sensor device according to any one of claims 1 to 5.

7. The aforementioned protruding portion is equipped with a flexible heat dissipation sheet, The protruding portion is formed such that the heat dissipation sheet is located on the extension line of the core material. The heat conductive member is in contact with the core material and the heat dissipation sheet. The optical sensor device according to claim 6.

8. The substrate comprises a plurality of electronic components, and the plurality of electronic components include a high-heat generating component that generates more heat than other electronic components. or The aforementioned optical sensor element has a high-heat-generating part that generates more heat than other parts, In a plan view perpendicular to the one surface of the substrate, the protrusion is provided on the portion of the frame member facing the high-heat-generating component or the high-heat-generating portion. The optical sensor device according to any one of claims 1 to 7.

9. A light sensor device according to any one of claims 1 to 8 for capturing an image of a subject, An imaging optical system that guides light from the subject to the light sensor device, An imaging device equipped with the following features.

Images