Method for manufacturing a light-emitting device

Abstract

In a method for manufacturing a light-emitting device having a light-emitting element, the separation of the light-emitting element from the substrate is made more reliable. [Solution] The method includes: a first preparation step of preparing a transfer member 200 having a resin member 220 having a plurality of second through holes 220x communicating with each of the first through holes on the surface of a substrate having a plurality of first through holes 210x; a second preparation step of preparing a structure 300 comprising a support substrate 310 having a support member on its surface and a plurality of light-emitting elements 20 supported on the support substrate via the support member; a first transfer step of arranging the structure and the transfer member so that each of the light-emitting elements faces a corresponding second through hole, and transferring the light-emitting elements from the structure to the transfer member; a third preparation step of preparing a mounting substrate having a plurality of terminals; a second transfer step of arranging the transfer member and the mounting substrate so that each of the light-emitting elements faces a corresponding terminal, and transferring the light-emitting elements from the transfer member to the mounting substrate; and a removal step of removing the substrate and the resin member.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a light-emitting device.

Background Art

[0002] There is known a method for manufacturing a semiconductor device in which a semiconductor chip is mounted on a mounting substrate using an element transfer member having a base material with a plurality of first through holes penetrating in the thickness direction and a resin layer disposed on the base material and having a plurality of second through holes each communicating with a corresponding one of the plurality of first through holes. This method for manufacturing a semiconductor device includes a step of adsorbing a plurality of semiconductor chips through respective ones of the plurality of second through holes of the element transfer member to hold the plurality of semiconductor chips on the element transfer member, and a step of mounting the plurality of semiconductor chips held on the element transfer member on the mounting substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to more reliably separate a light-emitting element from a base material in a method for manufacturing a light-emitting device having the light-emitting element.

Means for Solving the Problems

[0005] A method for manufacturing a light-emitting device according to one embodiment of the present disclosure includes: a first preparation step of preparing a transfer member provided on the surface of a substrate having a plurality of first through holes, the transfer member having a plurality of second through holes communicating with each of the plurality of first through holes; a second preparation step of preparing a structure comprising a support substrate having a support member on its surface, and a plurality of light-emitting elements supported on the support substrate via the support member; a first transfer step of arranging the structure and the transfer member so that each of the plurality of light-emitting elements faces the corresponding plurality of second through holes, and transferring the plurality of light-emitting elements from the structure to the transfer member; a third preparation step of preparing a mounting substrate having a plurality of terminals; a second transfer step of arranging the transfer member and the mounting substrate so that each of the plurality of light-emitting elements faces the corresponding plurality of terminals, and transferring the plurality of light-emitting elements from the transfer member to the mounting substrate; and a removal step of removing the substrate and the resin member. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, in a method for manufacturing a light-emitting device having a light-emitting element, the separation of the light-emitting element from the substrate can be performed more reliably. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic cross-sectional view showing a light-emitting device according to the first embodiment. [Figure 2A] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2B] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2C] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2D] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2E] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2F]This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2G] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2H] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2I] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2J] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 2K] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to the first embodiment. [Figure 3A] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to a modified example 1 of the first embodiment. [Figure 3B] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to a modified example 1 of the first embodiment. [Figure 4] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to a modified example 2 of the first embodiment. [Figure 5] This figure schematically shows an example of the manufacturing process for a method of manufacturing a light-emitting device according to a modified example 3 of the first embodiment. [Modes for carrying out the invention]

[0008] Hereinafter, a manufacturing method for an embodiment of the present disclosure and a light-emitting device obtained by said manufacturing method (hereinafter sometimes referred to as the "light-emitting device according to the embodiment") will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (for example, "up," "down," and other terms including those terms) will be used as needed. However, the use of such terms is for the purpose of facilitating the understanding of the invention with reference to the drawings, and the meaning of such terms does not limit the technical scope of the present disclosure. Furthermore, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or components.

[0009] Further, the embodiments described below illustrate a light-emitting device and the like for embodying the technical idea of the present disclosure, and do not limit the present disclosure thereto. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present disclosure only thereto, but are intended to be illustrative unless otherwise specifically described. Further, the content described in one embodiment is applicable to other embodiments and modifications. In addition, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid excessive complexity of the drawings, a schematic diagram in which some elements are omitted or an end view showing only the cut surface as a cross-sectional view may be used.

[0010] <First Embodiment> [Light-Emitting Device] As a premise for explaining the manufacturing method of the light-emitting device according to the first embodiment, referring to FIG. 1, a configuration example of the light-emitting device 1 will be described. FIG. 1 is a cross-sectional view schematically showing the light-emitting device according to the first embodiment. FIG. 1 shows a cross-section cut through the first surface of the light-emitting element and a plurality of electrodes. As shown in FIG. 1, the light-emitting device 1 according to the first embodiment includes a mounting substrate 10, a plurality of light-emitting elements 20, a plurality of conductive members 30, and a light-reflective member 40. The light-emitting device 1 may not have the light-reflective member 40. In the light-emitting device 1, a plurality of light-emitting elements 20 are arranged on the mounting substrate 10. For example, a plurality of light-emitting elements 20 are arranged in a matrix on the mounting substrate 10.

[0011] The mounting substrate 10 has a flat base material 11 and a plurality of terminals 12 arranged on the base material 11. The plurality of terminals 12 are arranged apart from each other on the surface 11a of the base material 11. The light-emitting element 20 has a first surface 20a, a second surface 20b on which a plurality of electrodes 22 are arranged on the opposite side of the first surface 20a, and one or more side surfaces 20c connecting the first surface 20a and the second surface 20b.

[0012] In each light-emitting element 20, each electrode 22 is arranged to face each terminal 12. The plurality of electrodes 22 of each light-emitting element 20 only needs to have an anode-side electrode and a cathode-side electrode, and may have three or more electrodes. The plurality of terminals 12 facing the plurality of electrodes 22 of each light-emitting element 20 only needs to have an anode-side terminal and a cathode-side terminal, and may have three or more terminals. The plurality of electrodes 22 of the light-emitting element 20 and the plurality of terminals 12 of the mounting substrate 10 facing them are electrically connected by a conductive member 30.

[0013] The light-reflective member 40 is provided on the surface 11a of the base material 11, exposes the first surface 20a of the light-emitting element 20, and covers the second surface 20b and the side surface 20c. Further, the light-reflective member 40 may cover the side surfaces of the terminal 12, the electrode 22, and the conductive member 30.

[0014] When the light-reflective member 40 covers the side surface 20c of the light-emitting element 20, the light emitted from the side surface 20c of the light-emitting element 20 is reflected by the light-reflective member 40. Further, when the light-reflective member 40 covers the second surface 20b of the light-emitting element 20, the light traveling downward of the light-emitting element 20 is reflected by the light-reflective member 40. Thereby, the light extraction efficiency in the light-emitting device 1 can be improved. Further, the light-reflective member 40 can clarify the boundary between the light-emitting area and the non-light-emitting area when the light-emitting element 20 is individually lit. Thereby, the contrast ratio between the light-emitting area and the non-light-emitting area is improved.

[0015] Hereinafter, each component of the light-emitting device 1 will be described.

[0016] (Mounting substrate 10) The substrate 11 is, for example, approximately rectangular in shape when viewed from above. However, its shape is not limited to this. The substrate 11 may be transparent or opaque. Examples of transparent substrate materials include glass, quartz, sapphire, ceramics (e.g., transparent alumina), and organic films (e.g., PET). Examples of opaque substrate materials include semiconductors (e.g., Si, Ge, GaAs, InP), ceramics (e.g., alumina, aluminum nitride, silicon nitride), and organic materials (e.g., FR4). An application-specific integrated circuit (ASIC) substrate may be used as the mounting substrate 10.

[0017] Examples of terminals 12 include metals such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, and Ni, and / or alloys containing at least these metals. On the surface 11a of the substrate 11, areas where terminals 12 are not located may or may not be covered with an insulating film.

[0018] (light-emitting element) The light-emitting element 20 is, for example, roughly rectangular or roughly square in plan view. However, the shape is not limited to these. The light-emitting element 20 can be, for example, a square with sides of 40 μm or more and 100 μm or less in plan view. In the light-emitting element 20, the first surface 20a and the second surface 20b are, for example, parallel. The side surface 20c may be perpendicular to the first surface 20a, or it may be inclined with respect to the first surface 20a. In the example in Figure 1, the opposing side surfaces 20c are inclined in a direction that narrows from the first surface 20a side to the second surface 20b side in cross-sectional view.

[0019] The light-emitting element 20 comprises a semiconductor stack and positive and negative electrodes 22 positioned on the second surface 20b, which is the surface of the semiconductor stack. The light-emitting element 20 is flip-chip mounted on the mounting substrate 10 with the second surface 20b, on which the electrodes 22 are positioned, facing the mounting substrate 10. In this case, the first surface 20a, which is located opposite the second surface 20b, becomes the main light extraction surface of the light-emitting element 20.

[0020] In the light-emitting device 1, the multiple light-emitting elements 20 may be arranged in a matrix in a two-dimensional manner on the mounting substrate 10. In this case, the light-emitting elements 20 can be arranged in alignment with predetermined spacing in each direction of the matrix. For example, the number of light-emitting elements 20 provided in the light-emitting device 1 can be 100 to 2,000,000, preferably 1,000 to 500,000, and more preferably 3,000 to 150,000. By providing 100 or more light-emitting elements in the light-emitting device 1, it becomes possible to perform road projection including simple messaging when used for applications such as road projection in vehicle headlights. Furthermore, by providing 2,000,000 or fewer light-emitting elements in the light-emitting device 1, high-definition road projection can be achieved, the light-emitting device 1 can be made smaller, and each light-emitting element 20 can emit light of sufficient brightness when individually lit.

[0021] The light-emitting element 20 can be selected to emit light at any wavelength. For example, a nitride semiconductor (In) can be used as a light-emitting element 20 that emits blue light or green light. X Al Y Ga 1-X-Y A configuration using N (0 ≤ X, 0 ≤ Y, X + Y ≤ 1) can be selected. Furthermore, semiconductors represented by GaAlAs and AlInGaP can be used as the light-emitting element 20 that emits red light. In addition, semiconductor light-emitting elements made of materials other than these can also be used. The composition and emission color of the light-emitting element 20 can be appropriately selected according to the purpose.

[0022] (Conductive material) The conductive member 30 can be made of, for example, copper (Cu) or gold (Au). The conductive member 30 may also be made of zinc (Zn), chromium (Cr), and / or nickel (Ni), etc. The thickness of the conductive member 30 can be, for example, 3 μm or more and 10 μm or less.

[0023] (Light-reflective material) The light-reflective member 40 is preferably made of a soft resin with relatively low elasticity and excellent shape conformability. Suitable materials for the light-reflective member 40 include resin materials with good transmittance and insulation properties, such as thermosetting resins like epoxy resins and silicone resins. Furthermore, the light-reflective member 40 is preferably made of a white resin containing particles of a light-reflective substance in the base resin. Examples of light-reflective substances include titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, and glass fillers.

[0024] [Manufacturing method for a light-emitting device according to the first embodiment] Next, a method for manufacturing the light-emitting device 1 according to the first embodiment will be described. The method for manufacturing the light-emitting device 1 according to the first embodiment includes: a first preparation step of preparing a transfer member on the surface of a substrate having a plurality of first through holes, the transfer member having a plurality of second through holes communicating with each of the plurality of first through holes; a second preparation step of preparing a structure comprising a support substrate having a support member on its surface, and a plurality of light-emitting elements supported on the support substrate via the support member; a first transfer step of arranging the structure and the transfer member so that each of the plurality of light-emitting elements faces the corresponding plurality of second through holes, and transferring the plurality of light-emitting elements from the structure to the transfer member; a third preparation step of preparing a mounting substrate having a plurality of terminals; a second transfer step of arranging the transfer member and the mounting substrate so that each of the plurality of light-emitting elements faces the corresponding plurality of terminals, and transferring the plurality of light-emitting elements from the transfer member to the mounting substrate; and a removal step of removing the support substrate and the support member.

[0025] The following describes each manufacturing process of the light-emitting device according to the first embodiment, with reference to the drawings.

[0026] Figures 2A to 2K schematically show an example of the manufacturing process for a light-emitting device according to the first embodiment. Specifically, Figure 2A is a view of the transfer member 200 from the surface 210a side of the base material 210, and Figure 2B is a cross-sectional view along the line IIB-IIB in Figure 2A. Figures 2C to 2E and Figures 2G to 2K are cross-sectional views corresponding to Figure 2B. Figure 2F is a view of the light-emitting element 20 and the transfer member 200 from the first surface 20a side of the light-emitting element 20. Viewing from the surface 210a side of the base material 210 means, for example, viewing the object from a direction perpendicular to the surface 210a. Viewing from the first surface 20a side of the light-emitting element 20 means, for example, viewing the object from a direction perpendicular to the first surface 20a of the light-emitting element 20.

[0027] (1st preparation step) First, as shown in Figures 2A and 2B, a transfer member 200 is prepared, in which a resin member 220 having a plurality of second through holes 220x communicating with each of the plurality of first through holes 210x is provided on the surface 210a of a substrate 210 having a plurality of first through holes 210x. The first through holes 210x and the second through holes 220x can be arranged, for example, in a matrix in the area where the light-emitting element 20 is to be transferred. In the description of the manufacturing method, "prepare" a member is not limited to manufacturing the member, but also includes acquiring the member by purchasing it, receiving it, etc.

[0028] Specifically, first, a base material 210, such as a glass substrate, is prepared. Then, a material that will become the resin member 220 is placed on the surface 210a of the base material 210. The resin member 220 can be placed, for example, using a screen printing method. It is preferable that the resin member 220 is adhesive. The adhesiveness of the resin member 220 makes it possible to attach and support the light-emitting element 20, which will be placed on it later, onto the resin member 220. For example, a silicone-based resin can be suitably used as the resin member 220.

[0029] The inner surfaces of the first through-hole 210x and the second through-hole 220x may or may not be perpendicular to the surface 210a of the base material 210. The first through-hole 210x and the second through-hole 220x can be provided simultaneously in the base material 210 and the resin member 220 after the resin member 220 has been provided over the entire surface 210a of the base material 210. This simplifies the first preparation step. The first through-hole 210x and the second through-hole 220x can be provided simultaneously in the base material 210 and the resin member 220 by irradiating them with laser light from either the base material 210 side or the resin member 220 side.

[0030] Alternatively, the first through-holes 210x and the second through-holes 220x do not have to be provided at the same time. For example, after providing the resin member 220 to the entire surface 210a of the base material 210, the first through-holes 210x may be provided by irradiating laser light from the base material 210 side, and the second through-holes 220x may be provided by irradiating laser light from the resin member 220 side. Alternatively, the resin member 220 with the second through-holes 220x may be bonded to the surface 210a of the base material 210 that has the first through-holes 210x.

[0031] When viewed from the surface 210a side of the substrate 210, it is preferable that the opening area of ​​the second through-hole 220x is greater than or equal to the opening area of ​​the first through-hole 210x and less than the area of ​​the first surface 20a of the light-emitting element 20 to be transferred in a later process. Here, the opening area of ​​the first through-hole 210x is the area of ​​the opening in the plane including the surface 210a, and the opening area of ​​the second through-hole 220x is the area of ​​the opening on the surface opposite to the surface 210a of the resin member 220. Furthermore, when viewed from the surface 210a side of the substrate 210, it is preferable that the center of the second through-hole 220x and the center of the first through-hole 210x coincide. In this specification, an error of plus or minus 10 μm is permitted for the center coincidence.

[0032] In the first embodiment, when viewed from the surface 210a side of the substrate 210, the first through-hole 210x is circular, and the second through-hole 220x is a larger diameter circle than the first through-hole 210x. When viewed from the surface 210a side of the substrate 210, the first through-hole 210x and the second through-hole 220x may be elliptical or other shapes other than circular. When viewed from the surface 210a side of the substrate 210, a portion of the outer edges of the first through-hole 210x and the second through-hole 220x may protrude from the outer edge of the first surface 20a of the light-emitting element 20 to be transferred in a later process. For example, slit-shaped first through-hole 210x and second through-hole 220x may be provided so as to span the first surface 20a of a plurality of light-emitting elements 20 to be transferred in a later process.

[0033] (Second preparation process) Next, as shown in Figure 2C, a structure 300 is prepared comprising a support substrate 310 on which a support member 320 is provided on its surface, and a plurality of light-emitting elements 20 supported by the support substrate 310 via the support member 320. The plurality of light-emitting elements 20 are arranged so that the second surface 20b of each light-emitting element 20 is in contact with the support member 320 on the support substrate 310. For example, 100 to 2,000,000 light-emitting elements 20 can be arranged in a matrix on the support member 320. In the illustrated example, a release layer 330 is placed between the support substrate 310 and the support member 320. The release layer 330 can be placed as needed.

[0034] The support substrate 310 is not particularly limited in material as long as it has a transmittance of a certain level or higher to the laser light described later, but for example, sapphire, glass, silicon, etc. can be used. The support member 320 can be made of materials mainly composed of thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, phenolic resin, or thermoplastic resins such as polycarbonate resin, acrylic resin, methylpentene resin, or polynorbornene resin.

[0035] The release layer 330 is not particularly limited as long as it is made of a material that disappears upon irradiation with laser light as described later, but materials mainly composed of epoxy resin, acrylic resin, or polyimide resin can be used, for example, a mixture of fluorene monomer and propylene glycol monomethyl ether acetate (PGMAE) can be used. As the laser light, for example, light having an emission peak wavelength in the wavelength range of 250 nm to 400 nm can be used.

[0036] (1st transfer process) Next, as shown in Figure 2D, the structure 300 and the transfer member 200 are arranged so that each of the multiple light-emitting elements 20 faces a corresponding multiple second through-holes 220x, and the multiple light-emitting elements 20 are transferred from the structure 300 to the transfer member 200. Specifically, for example, laser light L is irradiated onto the support member 320 and the release layer 330 via the support substrate 310. As a result, the release layer 330 disappears, and the support member 320 and the multiple light-emitting elements 20 can be transferred onto the transfer member 200.

[0037] In Figure 2D, some of the light-emitting elements 20 and support members 320 have already been transferred, and the left-side light-emitting elements 20 and support members 320 are shown being transferred onto the transfer member 200 by irradiation with laser light L. Figure 2E shows the state after all of the light-emitting elements 20 and support members 320 have been transferred. As shown in Figure 2F, which is a view from below of Figure 2E, the light-emitting elements 20 are transferred so that a portion of the first surface 20a is exposed within the first through-hole 210x and the second through-hole 220x. This reduces the possibility of foreign matter being trapped between the light-emitting elements 20 and the support members 320.

[0038] When viewed from the first surface 20a side of the light-emitting element 20, it is preferable that the center of the first surface 20a coincides with the centers of the first through-hole 210x and the second through-hole 220x. This allows the light-emitting element 20 to be stably held on the transfer member 200. Center alignment can be achieved, for example, by image processing using alignment marks.

[0039] Next, as shown in Figure 2G, the support members 320 on each light-emitting element 20 are removed. The support members 320 can be removed, for example, by reactive ion etching (RIE).

[0040] (3rd preparation step) Next, as shown in Figure 2H, a mounting substrate 10 having a plurality of terminals 12 is prepared. The plurality of terminals 12 are arranged, for example, on the surface 11a of a base material 11. The mounting substrate 10 can be prepared, for example, by forming a plurality of pairs of terminals 12 on the surface 11a of a flat base material 11 such as a silicon plate using a plating method, sputtering method, vapor deposition method, or the like.

[0041] The third preparation step preferably includes the step of providing a holding portion 70 between a plurality of terminals 12 on the surface 11a of the base material 11. For example, a holding portion 70 having a planar size smaller than the planar size of the light-emitting element 20 in a cross-sectional view can be formed in the area on which the light-emitting element 20 is placed.

[0042] The holding portion 70 can be formed using photolithography or screen printing. Photolithography is preferred because it can form fine patterns. It is preferable that the holding portion 70 is adhesive. The adhesiveness of the holding portion 70 makes it possible to attach and support the light-emitting element 20, which will be placed on it later, onto the holding portion 70.

[0043] The retaining portion 70 is preferably made of a material that has the above-mentioned adhesive properties and also possesses chemical resistance to plating when forming the conductive member 30 in a later process. For example, the retaining portion 70 can be made of a phenolic resin, epoxy resin, silicone resin, or acrylic resin. The retaining portion 70 is, for example, a resist.

[0044] The cross-sectional shape of the holding portion 70 may be rectangular or square. That is, the contact surface (top surface) and the side surface of the holding portion 70 that contact the light-emitting element 20 can be in a substantially perpendicular relationship. This makes it possible to accurately secure the contact area between the light-emitting element 20 and the holding portion 70, and the area where the conductive member 30 that will later connect the terminals 12 of the mounting substrate 10 and the electrodes 22 of the light-emitting element 20 will be placed.

[0045] The cross-sectional shape of the retaining portion 70 may be tapered. It may be a shape in which the width widens from the surface 11a of the base material 11 toward the light-emitting element 20, or a shape in which the width narrows from the surface 11a of the base material 11 toward the light-emitting element 20. If the shape widens from the surface 11a of the base material 11 toward the light-emitting element 20, the contact area between the light-emitting element 20 and the retaining portion 70 can be increased, making it possible to attach the light-emitting element 20 and the retaining portion 70 more securely.

[0046] The holding portion 70 is preferably thicker than the terminal 12. By forming a holding portion 70 that is thicker than the terminal 12, when the light-emitting element 20 is later placed on the holding portion 70, the terminal 12 provided on the substrate 11 and the electrodes 22 of the light-emitting element 20 placed on the holding portion 70 can be separated from each other and face each other with the holding portion 70 in between. The thickness of the holding portion 70 can be, for example, 5 μm or more and 20 μm or less.

[0047] (Second transfer process) Next, as shown in Figure 2I, the transfer member 200 and the mounting substrate 10 are arranged so that each of the multiple light-emitting elements 20 faces a corresponding set of terminals 12, and the multiple light-emitting elements 20 are transferred from the transfer member 200 to the mounting substrate 10. In the second transfer step of this embodiment, an example is shown in which the multiple light-emitting elements 20 are transferred by bringing them into contact with the holding portion 70.

[0048] Specifically, first, each terminal 12 is placed on the mounting substrate 10 with its terminal 12 facing upwards. Then, the transfer member 200 is placed on the mounting substrate 10 so that each electrode 22 faces its respective terminal 12. At this time, the upper surface of the holding portion 70 is in contact with the second surface 20b located between adjacent electrodes 22 on each light-emitting element 20. A portion of the upper surface of the holding portion 70 may cover the ends of the electrodes 22. Each electrode 22 of the light-emitting element 20 and each terminal 12 of the mounting substrate 10 are spaced apart. Next, the light-emitting element 20 and the mounting substrate 10 are heated to a predetermined temperature, and the light-emitting element 20 is pressed towards the mounting substrate 10 via the transfer member 200. At this time, the light-emitting element 20 and the mounting substrate 10 are thermocompressed together via the holding portion 70. That is, the holding portion 70 softens, and the light-emitting element 20 and the mounting substrate 10 are joined together via the holding portion 70 due to the adhesive properties of the holding portion 70. The predetermined temperature is set to a temperature higher than the temperature at which the holding portion 70 softens.

[0049] When viewed from the surface 210a side of the substrate 210, the opening area of ​​the second through-hole 220x is greater than or equal to the opening area of ​​the first through-hole 210x, and less than the area of ​​the first surface 20a of the light-emitting element 20, thereby allowing the light-emitting element 20 to be evenly pressed toward the mounting substrate 10 via the transfer member 200. If the opening area of ​​the second through-hole 220x is smaller than the opening area of ​​the first through-hole 210x, the resin member 220 will flow out into the first through-hole 210x when the light-emitting element 20 is pressed toward the mounting substrate 10 via the transfer member 200. Therefore, it becomes difficult to evenly pressurize the light-emitting element 20 toward the mounting substrate 10.

[0050] (Removal process) Next, as shown in Figure 2J, the base material 210 and resin member 220 constituting the transfer member 200 are removed. For example, with the mounting substrate 10 fixed, the transfer member 200 can be detached from the light-emitting element 20 by applying force in the direction of the arrow in Figure 2J using a suction jig or the like. The viscosity of the holding part 70 is preferably equal to or greater than the viscosity of the resin member 220. If the viscosity of the holding part 70 is equal to or greater than the viscosity of the resin member 220, the adhesion force between the light-emitting element 20 and the holding part 70 exceeds the adhesion force between the light-emitting element 20 and the resin member 220. Therefore, in this step, the interface between the second surface 20b of the light-emitting element 20 and the upper surface of the holding part 70 does not detach, while the interface between the first surface 20a of the light-emitting element 20 and the lower surface of the resin member 220 detaches. This reduces the risk that the light-emitting element 20 will detach from the holding part 70 and be carried away together with the transfer member 200.

[0051] (A process of forming a conductive member and arranging a light-reflective member) Next, as shown in Figure 2K, a conductive member 30 is formed to electrically connect the pair of electrodes 22 of the light-emitting element 20 to the pair of terminals 12 of the mounting substrate 10. Then, the holding portion 70 is removed and the light-reflective member 40 is placed. As a result, one of the pair of electrodes 22 is electrically connected to one of the pair of terminals 12 via the conductive member 30, and the other of the pair of electrodes 22 is electrically connected to the other of the pair of terminals 12 via the conductive member 30. The conductive member 30 can be formed, for example, by electroplating or electroless plating. Specifically, the conductive member 30 can be formed, for example, by copper plating or gold plating. The conductive member 30 may also be formed by plating of zinc (Zn), chromium (Cr), and / or nickel (Ni).

[0052] The retaining portion 70 may be removed by immersing it in a stripping solution that can remove the retaining portion 70, or by other methods. For example, any stripping solution may be sprayed onto the retaining portion 70 using a nozzle inside a chamber. The retaining portion 70 is dissolved by this stripping solution, and the dissolved retaining portion 70 is then sent out from the base material 11 using a predetermined gas or the like.

[0053] The stripping solution may be a mixture containing sulfuric acid and an organic solvent. As the organic solvent, at least one solvent selected from the group consisting of alcohol-based solvents such as 2-propanol, ketone-based solvents such as acetone, ester-based solvents such as ethyl acetate, and ether-based solvents can be used. Examples of gases used to deliver the dissolved retaining part 70 include argon gas and nitrogen gas.

[0054] The light-reflective member 40 is arranged, for example, by placing an uncured white resin on the mounting substrate 10 to cover a plurality of light-emitting elements 20, and allowing the white resin to flow to fill the spaces between the opposing sides 20c of adjacent light-emitting elements 20, and between the second surface 20b of the light-emitting elements 20 and the surface 11a of the substrate 11. The white resin is then cured to form the light-reflective member 40. The uncured white resin can be placed on the mounting substrate 10 by, for example, potting, spraying, or printing. If the first surface 20a of the light-emitting elements 20 is covered with white resin, the first surface 20a is exposed by polishing or the like.

[0055] Through the above process, a light-emitting device 1 can be manufactured in which multiple light-emitting elements 20 are mounted on a mounting substrate 10.

[0056] Thus, in the manufacturing method of the light-emitting device 1, a structure 300 is prepared which includes a transfer member 200 having a plurality of first through holes 210x and second through holes 220x that communicate with each other, and a plurality of light-emitting elements 20 supported on a support substrate 310 via a support member 320. Then, in the first transfer step, the structure 300 and the transfer member 200 are arranged so that each of the plurality of light-emitting elements 20 faces a corresponding plurality of second through holes 220x, and the plurality of light-emitting elements 20 are transferred from the structure 300 to the transfer member 200. Because the transfer member 200 has first through holes 210x and second through holes 220x, the contact area between the transfer member 200 and the light-emitting elements 20 in the first transfer step is reduced compared to the case where the transfer member 200 does not have first through holes 210x and second through holes 220x. As a result, the adhesion force between the transfer member 200 and the light-emitting element 20 is reduced, which reduces the rate at which the light-emitting element 20 is carried away together with the substrate 210 when the substrate 210 and resin member 220 are removed during the removal process, and makes it possible to more reliably separate the light-emitting element 20 from the substrate 210. As a result, the illumination rate of the light-emitting device 1 can be improved.

[0057] Furthermore, since the contact area between the transfer member 200 and the light-emitting element 20 in the first transfer process is reduced, the amount of foreign matter trapped between the transfer member 200 and the light-emitting element 20 can be reduced. This improves the transfer rate of the light-emitting element 20.

[0058] <Example 1> Figures 3A and 3B schematically show an example of the manufacturing process for a light-emitting device according to Modification 1 of the First Embodiment. Specifically, Figure 3A shows the transfer member 200 viewed from the surface 210a side of the base material 210. Figure 3B shows the light-emitting element 20 and the transfer member 200 viewed from the first surface 20a side of the light-emitting element 20 after the first transfer step. Note that in Figure 3B, for convenience, the diagonal line D of the first surface 20a of the light-emitting element 20 is shown. The diagonal line D is a virtual line and does not actually exist.

[0059] In Modification 1 of the First Embodiment, as shown in Figure 3A, the first through-hole 210x and the second through-hole 220x are rectangular when viewed from the surface 210a side of the base material 210. When viewed from the surface 210a side of the base material 210, the first through-hole 210x and the second through-hole 220x may be square or rectangular.

[0060] In the example shown in Figure 3B, when viewed from the first surface 20a side of the light-emitting element 20, the first through-hole 210x, the second through-hole 220x, and the first surface 20a of the light-emitting element 20 are square. Furthermore, each side of the first through-hole 210x and the second through-hole 220x is parallel to one of the diagonals D of the first surface 20a of the light-emitting element 20.

[0061] Even when the first through-hole 210x and the second through-hole 220x are rectangular when viewed from the surface 210a side of the base material 210, the light-emitting device can be manufactured using the same manufacturing method as in the first embodiment. When the first through-hole 210x and the second through-hole 220x are rectangular, the contact area between the transfer member 200 and the four corners of the first surface 20a of the light-emitting element 20 can be increased compared to when the opening area is the same but circular. As a result, when the light-emitting element 20 is pressed towards the mounting substrate 10 in the second transfer step, the light-emitting element 20 is more easily pressed evenly, and the load on the light-emitting element 20 can be reduced.

[0062] <Modification 2> Figure 4 is a schematic diagram showing an example of the manufacturing process for a light-emitting device according to Modification 2 of the First Embodiment. Specifically, Figure 4 is a schematic cross-sectional view showing the first transfer step. In the manufacturing method for a light-emitting device according to Modification 2 of the First Embodiment, all steps except the first transfer step may be the same as the manufacturing method for a light-emitting device according to the First Embodiment. In Figure 4, arrow V schematically indicates the direction in which gas is drawn.

[0063] In the second modification of the first embodiment, as shown in Figure 4, in the first transfer step, a laser beam L is irradiated from the first through-hole 210x side while sucking the gas inside the first through-hole 210x in the direction of arrow V, thereby transferring the multiple light-emitting elements 20 from the structure 300 to the transfer member 200. Suction can be performed, for example, using a vacuum suction device.

[0064] In this method, the light-emitting element 20 is transferred in a straight line toward the first through-hole 210x and the second through-hole 220x, so the position of the light-emitting element 20 after transfer is less likely to deviate from the desired position, and the transfer rate of the light-emitting element 20 can be improved. In addition, although repair may be performed if the position of the light-emitting element 20 after transfer deviates from the desired position, this method reduces the positional deviation of the light-emitting element 20, making it possible to reduce the number of repairs required and streamlining the manufacturing process of the light-emitting device 1.

[0065] Furthermore, if the first surface 20a of the light-emitting element 20 is square, it is preferable that the first through-hole 210x and the second through-hole 220x have a shape that is symmetrical four times when viewed from the first surface 20a side, and that the center of the first surface 20a coincides with the centers of the first through-hole 210x and the second through-hole 220x. This allows force to be applied evenly to the light-emitting element 20 by gas attraction.

[0066] <Variation 3> Figure 5 is a schematic diagram showing an example of the manufacturing process for a light-emitting device according to Modification 3 of the First Embodiment. Specifically, Figure 5 is a schematic cross-sectional view showing the removal process. In the manufacturing method for a light-emitting device according to Modification 3 of the First Embodiment, all steps except the removal process may be the same as the manufacturing method for a light-emitting device according to the First Embodiment. In Figure 5, the arrows schematically indicate the direction of gas flow.

[0067] In the third modification of the first embodiment, as shown in Figure 5, a collet 400 having a recess 410 and a gas flow path 420 is prepared in the removal step. The end face 410a surrounding the outer circumference of the recess 410 of the collet 400 is brought into contact with the outer circumference of the back surface 210b of the base material 210. This creates a space surrounded by the light-emitting element 20, the transfer member 200, and the recess 410 of the collet 400. Next, using the collet 400, gas is discharged from the first through-hole 210x side into the first through-hole 210x in the direction of the arrow, and a force is applied to the transfer member 200 in a direction away from the light-emitting element 20, thereby removing the base material 210 and resin member 220 that constitute the transfer member 200.

[0068] This method makes it easier to separate the transfer member 200 from the light-emitting element 20, thereby reducing the rate at which the light-emitting element 20 is carried away together with the substrate 210, and ensuring more reliable separation between the light-emitting element 20 and the substrate 210.

[0069] Furthermore, if the first surface 20a of the light-emitting element 20 is square, it is preferable that the first through-hole 210x and the second through-hole 220x have a shape that is symmetrical four times when viewed from the first surface 20a side, and that the center of the first surface 20a coincides with the centers of the first through-hole 210x and the second through-hole 220x. This allows force to be applied evenly to the light-emitting element 20 by the discharge of gas.

[0070] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0071] In addition to the embodiments described above, the following further notes are disclosed. (Note 1) A first preparation step of preparing a transfer member, wherein a resin member having a plurality of second through holes communicating with each of the plurality of first through holes is provided on the surface of a substrate having a plurality of first through holes, A second preparation step involves preparing a structure comprising a support substrate having a support member on its surface, and a plurality of light-emitting elements supported on the support substrate via the support member, A first transfer step involves arranging the structure and the transfer member such that each of the plurality of light-emitting elements faces the corresponding plurality of second through-holes, and transferring the plurality of light-emitting elements from the structure to the transfer member. A third preparation step involves preparing a mounting board having multiple terminals, A second transfer step involves arranging the transfer member and the mounting substrate so that each of the plurality of light-emitting elements faces the corresponding plurality of terminals, and transferring the plurality of light-emitting elements from the transfer member to the mounting substrate. A method for manufacturing a light-emitting device, comprising a removal step of removing the substrate and the resin member. (Note 2) Viewed from the surface side, the opening area of ​​the second through-hole is greater than or equal to the opening area of ​​the first through-hole, and less than the area of ​​the first surface of the light-emitting element. The method for manufacturing a light-emitting device according to Appendix 1, wherein in the first transfer step, the light-emitting element is transferred such that a portion of the first surface is exposed in the first through-hole and the second through-hole. (Note 3) The method for manufacturing a light-emitting device as described in Appendix 2, wherein, when viewed from the surface side, the first through hole and the second through hole are rectangular. (Note 4) The method for manufacturing a light-emitting device according to Appendix 3, wherein, when viewed from the surface side, the first through hole, the second through hole, and the first surface of the light-emitting element are square, and each side of the first through hole and the second through hole is parallel to one of the diagonals of the first surface of the light-emitting element. (Note 5) A method for manufacturing a light-emitting device according to any one of appendices 1 to 4, wherein in the first transfer step, the plurality of light-emitting elements are transferred from the structure to the transfer member while sucking gas from the first through-hole side to the first through-hole side. (Note 6) A method for manufacturing a light-emitting device according to any one of appendices 1 to 5, wherein in the removal step, the substrate and the resin member are removed while discharging gas from the first through-hole side into the first through-hole. (Note 7) The method for manufacturing a light-emitting device according to any one of appendices 1 to 6, wherein the first preparation step involves providing the resin member over the entire surface of the substrate, and then simultaneously providing the first through-hole and the second through-hole in the substrate and the resin member. (Note 8) The third preparation step includes the step of providing a holding portion between the plurality of terminals, The second transfer step involves transferring the plurality of light-emitting elements by bringing them into contact with the holding portion. The method for manufacturing a light-emitting device according to any one of appendices 1 to 7, wherein the viscosity of the holding portion is equal to or greater than the viscosity of the resin member. [Explanation of Symbols]

[0072] 1. Light-emitting device 10 Mounting board 11 Base material 11a surface 12 terminals 20 Light-emitting elements 20a Page 1 20b 2nd side 20c side 22 electrodes 30 Conductive material 40 Light-reflective material 70 Holding part 200 Transfer Member 210 Base material 210a surface 210b back side 210x 1st through hole 220 Resin component 220x 2nd through hole 300 structures 310 Support substrate 320 Support Member 330 Delamination layer 400 Collets 410 recess 410a end face 420 Gas flow path

Claims

1. A first preparation step of preparing a transfer member, wherein a resin member having a plurality of second through holes communicating with each of the plurality of first through holes is provided on the surface of a substrate having a plurality of first through holes, A second preparation step involves preparing a structure comprising a support substrate having a support member on its surface, and a plurality of light-emitting elements supported on the support substrate via the support member, A first transfer step involves arranging the structure and the transfer member such that each of the plurality of light-emitting elements faces the corresponding plurality of second through-holes, and transferring the plurality of light-emitting elements from the structure to the transfer member. A third preparation step involves preparing a mounting board having multiple terminals, A second transfer step involves arranging the transfer member and the mounting substrate so that each of the plurality of light-emitting elements faces the corresponding plurality of terminals, and transferring the plurality of light-emitting elements from the transfer member to the mounting substrate. A method for manufacturing a light-emitting device, comprising a removal step of removing the substrate and the resin member.

2. Viewed from the surface side, the opening area of ​​the second through-hole is greater than or equal to the opening area of ​​the first through-hole, and less than the area of ​​the first surface of the light-emitting element. The method for manufacturing a light-emitting device according to claim 1, wherein in the first transfer step, the light-emitting element is transferred such that a portion of the first surface is exposed in the first through-hole and the second through-hole.

3. The method for manufacturing a light-emitting device according to claim 2, wherein the first through-hole and the second through-hole are rectangular when viewed from the surface side.

4. The method for manufacturing a light-emitting device according to claim 3, wherein, when viewed from the surface side, the first through hole, the second through hole, and the first surface of the light-emitting element are square, and each side of the first through hole and the second through hole is parallel to any diagonal of the first surface of the light-emitting element.

5. A method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein in the first transfer step, the plurality of light-emitting elements are transferred from the structure to the transfer member while sucking gas from the first through-hole side to the first through-hole side.

6. A method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein in the removal step, the substrate and the resin member are removed while discharging gas from the first through-hole side into the first through-hole.

7. The method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein the first preparation step involves providing the resin member over the entire surface of the substrate, and then simultaneously providing the first through-hole and the second through-hole in the substrate and the resin member.

8. The third preparation step includes the step of providing a holding portion between the plurality of terminals, The second transfer step involves transferring the plurality of light-emitting elements by bringing them into contact with the holding portion. The method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein the viscosity of the holding portion is equal to or greater than the viscosity of the resin member.

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