Quantum devices

Abstract

This invention provides a quantum device that can improve the electrical characteristics of the connection point. [Solution] The quantum device comprises a quantum chip, an interposer on which the quantum chip is mounted, a first movable pin having a first barrel with its first end on the first side in the axial direction and a first plunger that is movable in the axial direction relative to the first barrel, a first dielectric member, and an outer conductor located on the outer circumference of the first plunger with the first dielectric member in between, and in contact with the interposer. The first plunger has a first tip portion that protrudes in the axial direction from the first end and is in contact with the interposer. The first dielectric member covers the outer circumference of the first tip portion from the first end to the interposer.

Description

Technical Field

[0001] This disclosure relates to quantum devices.

Background Art

[0002] As disclosed in Patent Document 1, in a quantum device in which a quantum chip using superconductivity is flip-chip (FC (Flip Chip)) mounted on an interposer, a structure using a socket having movable pins has been proposed. For example, Patent Document 1 discloses a quantum device in which a socket is arranged opposite to an interposer on which a quantum chip is mounted, and a substrate is arranged on the other end surface of the socket.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the quantum device disclosed in Patent Document 1, for example, the characteristic impedances of the connection parts when the socket and the interposer, and the socket and the substrate are electrically connected to each other may be difficult to match. For this reason, the electrical characteristics of the connection part may deteriorate.

[0005] An object of this disclosure is to provide a quantum device that solves any of the above problems.

Means for Solving the Problems

[0006] A quantum device according to one aspect of the present disclosure comprises a quantum chip, an interposer on which the quantum chip is mounted, a socket having a first movable pin having a first barrel with a first end on a first axial side and a first plunger that is movable in the axial direction relative to the first barrel, a first dielectric member, and an outer conductor located on the outer circumference of the first plunger with the first dielectric member in between and in contact with the interposer, wherein the first plunger has a first tip portion that protrudes in the axial direction from the first end and is in contact with the interposer, and the first dielectric member covers the outer circumference of the first tip portion from the first end to the interposer. [Effects of the Invention]

[0007] According to the above embodiment, the electrical characteristics of the connection can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] This is a side view of the quantum device related to this disclosure. [Figure 2] This is a cross-sectional view of the quantum device related to this disclosure. [Figure 3] This is a partial cross-sectional view of the first movable pin relating to this disclosure. [Figure 4] This is a cross-sectional view taken along line IV-IV in Figure 1. [Figure 5] Figure 1 is a cross-sectional view along the VV line. [Figure 6] This is a cross-sectional view of the socket relating to Comparative Example 1. [Figure 7] This is a partial cross-sectional view of the first movable pin according to Modification 1 of this disclosure. [Figure 8] These are cross-sectional views of the socket relating to Modifications 2 and 3 of this disclosure. [Figure 9] Figure 8 shows enlarged views of the first and second ends. [Figure 10] These are enlarged cross-sectional views of the first and second ends of the socket according to Modifications 4 and 5 of this disclosure. [Figure 11] This is a cross-sectional view of the quantum device related to this disclosure. [Figure 12] It is a perspective view of the socket according to the present disclosure as viewed from the XII direction shown in FIG. 11. [Figure 13] It is a cross-sectional view of the socket according to Comparative Example 2. [Figure 14] It is a cross-sectional view of the first movable pin, the external conductor, and the first dielectric member according to Modification 4 of the present disclosure. [Figure 15] It is a plan view of the first movable pin and the second movable pin according to Modification 5 of the present disclosure. [Figure 16] It is a cross-sectional view of the socket according to the present disclosure.

Mode for Carrying Out the Invention

[0009] Hereinafter, each embodiment will be described with reference to the drawings. In all the drawings, the same or corresponding components are denoted by the same reference numerals, and common descriptions are omitted.

[0010] <First Embodiment> Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings.

[0011] (Configuration) As shown in FIG. 1, the quantum device 1 according to the present embodiment includes a quantum chip 2, an interposer 3, a socket 4, and a printed circuit board 5.

[0012] (Configuration of Quantum Chip and Interposer) The quantum chip 2 includes a superconducting material. The superconducting material includes, for example, a superconducting metal that functions as a superconductor at extremely low temperatures. The quantum chip 2 is electrically connected to the interposer 3. The quantum chip 2 is mounted on the mounting surface 3a on the -Z direction side of the interposer 3 by flip chip connection. On the opposing surface 3b on the +Z direction side of the interposer 3, a socket 4 is installed. The opposing surface 3b may be, for example, a plane facing the +Z direction. The interposer 3 may be located, for example, between the quantum chip 2 and the socket 4. The interposer 3 may be provided, for example, to increase the number of external terminals. The interposer 3 may have a plurality of wirings that expand the pitch between the terminals of the quantum chip 2 from the surface facing the -Z direction to the end face facing the +Z direction.

[0013] (Configuration of the socket) The socket 4 is electrically connected to each of the interposer 3 and the printed circuit board 5. The socket 4 is located between the interposer 3 and the printed circuit board 5. The socket 4 relays the electrical connection between the interposer 3 and the printed circuit board 5. One end face of the socket 4 facing the -Z direction faces the interposer 3. The other end face of the socket 4 facing the +Z direction faces the printed circuit board 5.

[0014] As shown in FIG. 2, the socket 4 includes a first movable pin 6, an external conductor 7, a first dielectric member 8, a second dielectric member 9, a third dielectric member 41, and a housing 42. The socket 4 has a cylindrical coaxial structure with the first movable pin 6 as the central conductor (signal).

[0015] Hereinafter, the direction in which the first plunger described later moves with respect to the first barrel described later is referred to as the Z direction. One side of the Z direction (the direction from the interposer to the socket) is referred to as the +Z direction. The other side of the Z direction (the direction opposite to the +Z direction) is referred to as the -Z direction. The Z direction is an example of the axial direction. The -Z direction is an example of the first side of the axial direction. The +Z direction is an example of the second side of the axial direction.

[0016] Also, the direction intersecting the Z direction is referred to as the X direction. One side of the X direction is referred to as the +X direction. The other side of the X direction (the direction opposite to the +X direction) is referred to as the -X direction. For example, the X direction may be orthogonal to the Z direction.

[0017] Furthermore, the direction that intersects the Z and X directions is called the Y direction. One side of the Y direction is called the +Y direction. The other side of the Y direction (opposite to the +Y direction) is called the -Y direction. For example, the Y direction may be perpendicular to both the Z direction and the X direction.

[0018] (Configuration of movable pins) As shown in Figure 3, the first movable pin 6 comprises a first barrel 61, a first plunger 62, a second plunger 63, and a spring 64. The first movable pin 6 may be of a type where both the first plunger 62 and the second plunger 63 are movable at both ends, allowing them to move in the Z direction relative to the first barrel 61. The first plunger 62 and the second plunger 63 are held at both ends of the first barrel 61 in the Z direction (longitudinal direction) via the spring 64.

[0019] The first barrel 61 has a cylindrical shape with a central axis extending in the Z direction. The first barrel 61 holds a first plunger 62 on its -Z side. The first barrel 61 holds a second plunger 63 on its +Z side. The first barrel 61 has a first end 61a on the -Z direction side and a second end 61b on the +Z direction side.

[0020] The first barrel 61 has a first hole 61c and a second hole 61d. The first hole 61c extends in the -Z direction from the hollow interior of the first barrel 61 toward the exterior of the first barrel 61. The first hole 61c opens in the -Z direction at the first end 61a. The second hole 61d extends in the +Z direction from the hollow interior of the first barrel 61 toward the exterior of the first barrel 61. The second hole 61d opens in the +Z direction at the second end 61b. The first barrel 61 may be formed of, for example, a conductive metallic material.

[0021] The first plunger 62 comprises a first base 65 and a first tip 67. The first tip 67 extends from the first base 65 in the -Z direction. The first plunger 62 is movable in the Z direction relative to the first barrel 61. The first plunger 62 is housed within the first barrel 61, except for a portion of the first tip 67 (the portion protruding from the first end 61a). The first plunger 62 and the first barrel 61 are in conductive contact. The first plunger 62 may be arranged coaxially with the first barrel 61, for example. The first plunger 62 may be formed of, for example, a conductive metallic material.

[0022] The first base portion 65 may be, for example, a disc shape having an outer diameter larger than the diameter of the first hole 61c. The first tip portion 67 extends from the first base portion 65 through the first hole 61c and protrudes from the first end portion 61a in the -Z direction. The first tip portion 67 is in contact with the interposer 3 when it is moved in the -Z direction (see Figure 2). For example, the first tip portion 67 may be integrally molded with the first base portion 65.

[0023] The second plunger 63 comprises a second base 66 and a second tip 68. The second tip 68 extends from the second base 66 in the +Z direction. The second plunger 63 may, for example, be movable in the Z direction relative to the first barrel 61. The second plunger 63 is housed within the first barrel 61, except for a portion of the second tip 68 (the portion protruding from the second end 61b). The second plunger 63 and the first barrel 61 are in conductive contact. The second plunger 63 may be arranged coaxially with the first barrel 61, for example. The second plunger 63 may be formed of, for example, a conductive metallic material.

[0024] The second base portion 66 may be disc-shaped, for example, having an outer diameter larger than the diameter of the second hole 61d. The second tip portion 68 extends from the second base portion 66 through the second hole 61d and protrudes from the second end portion 61b in the +Z direction. The second tip portion 68 is in contact with the printed circuit board 5 when it is moved in the +Z direction (see Figure 2). For example, the second tip portion 68 may be integrally molded with the second base portion 66.

[0025] The spring 64 extends in the Z direction. The spring 64 is housed throughout the first barrel 61. The -Z side of the spring 64 is in contact with the +Z side of the first plunger 62. The +Z side of the spring 64 is in contact with the -Z side of the second plunger 63.

[0026] The spring 64 can bias the first plunger 62 and the second plunger 63 in the Z direction. The spring 64 can bias the first plunger 62 and the second plunger 63 away from each other. The spring 64 may be, for example, a coil spring that extends and expands in the Z direction.

[0027] The interposer 3 and the terminals (pads) of the printed circuit board 5 prevent the first plunger 62 and the second plunger 63 from separating in the Z direction, thereby biasing the first plunger 62 and the second plunger 63 with the spring 64 so that they separate from each other in the Z direction. As a result, the first tip portion 67 and the second tip portion 68 protruding from the first barrel 61 are biased to move elastically in the Z direction.

[0028] (Outer conductor configuration) As shown in Figures 2, 4, and 5, the outer conductor 7 has a cylindrical shape with a central axis extending in the Z direction. The first movable pin 6 is housed in the hollow portion of the outer conductor 7. The outer conductor 7 and the first barrel 61 are arranged coaxially.

[0029] As shown in Figures 2 and 4, the outer conductor 7 is located on the outer circumference of the first tip portion 67 of the first plunger 62, with the first dielectric member 8 in between. The outer conductor 7 is in contact with the interposer 3 on the -Z direction side. The outer conductor 7 has a first surface 7a that is in contact with the opposing surface 3b of the interposer 3 along the XY plane on the -Z direction side. The first surface 7a may be, for example, an annular plane that is aligned with the XY plane and oriented in the -Z direction.

[0030] As shown in Figures 2 and 5, the outer conductor 7 is located on the outer circumference of the second tip portion 68 of the second plunger 63, with the second dielectric member 9 in between. The outer conductor 7 is in contact with the interposer 3 on the -Z direction side. The outer conductor 7 is in contact with the printed circuit board 5 on the +Z direction side. The outer conductor 7 has a second surface 7b on the +Z direction side that is in contact with the opposing surface 5a of the printed circuit board 5, which will be described later. The second surface 7b may be, for example, an annular plane that is aligned with the XY plane and oriented in the +Z direction.

[0031] The outer conductor 7 may also be a GND (GROUND) conductor (a grounded conductor). The outer conductor 7 may be formed of, for example, a conductive metallic material.

[0032] (Configuration of the first dielectric component) As shown in Figures 2 and 4, the first dielectric member 8 covers the outer circumference of the first tip portion 67 from the first end 61a of the first barrel 61 to the interposer 3. The first dielectric member 8 has a cylindrical or disc shape with a central axis extending in the Z direction. The first dielectric member 8 is arranged coaxially with the outer conductor 7 and the first tip portion 67. The first dielectric member 8 may be formed of, for example, an electrically insulating resin material.

[0033] The first dielectric member 8 may have a thickness in the Z direction equal to, for example, the distance between the first end 61a of the first barrel 61 and the interposer 3. That is, the thickness of the first dielectric member 8 in the Z direction may be approximately the same as, for example, the length of the portion of the first tip 67 that protrudes from the first end 61a. On the other hand, the length of the outer conductor 7 that extends further in the -Z direction relative to the position of the first end 61a of the first barrel 61 may be approximately the same as, for example, the length of the portion of the first tip 67 that protrudes from the first end 61a. These configurations adjust the characteristic impedance up to the tip of the first plunger 62.

[0034] (Configuration of the second dielectric component) As shown in Figures 2 and 5, the second dielectric member 9 covers the outer circumference of the second tip portion 68 from the second end 61b of the first barrel 61 to the printed circuit board 5. The second dielectric member 9 has a cylindrical or disc shape with a central axis extending in the Z direction. The second dielectric member 9 is arranged coaxially with the outer conductor 7 and the second tip portion 68. The first dielectric member 8 may be formed of, for example, an electrically insulating resin material.

[0035] The second dielectric member 9 may have a thickness in the Z direction equal to, for example, the distance between the second end 61b of the first barrel 61 and the printed circuit board 5. That is, the thickness of the second dielectric member 9 in the Z direction may be approximately the same as, for example, the length of the portion of the second tip 68 that protrudes from the second end 61b. On the other hand, the length of the outer conductor 7 that extends further in the +Z direction relative to the position of the second end 61b of the first barrel 61 in the Z direction may be approximately the same as, for example, the length of the portion of the second tip 68 that protrudes from the second end 61b. These configurations adjust the characteristic impedance up to the tip of the second plunger 63.

[0036] (Configuration of the third dielectric member) As shown in Figures 2 and 4, the third dielectric member 41 covers the outer circumference of the first barrel 61 from the first end 61a to the second end 61b. The third dielectric member 41 has a cylindrical shape with a central axis extending in the Z direction. The third dielectric member 41 is arranged coaxially with the outer conductor 7 and the first barrel 61. The third dielectric member 41 may be formed of, for example, an electrically insulating resin material.

[0037] The -Z side of the third dielectric member 41 may, for example, be in contact with the +Z side of the first dielectric member 8, or it may be slightly away from the +Z side of the first dielectric member 8 to such an extent that it does not affect the impedance characteristics. The +Z side of the third dielectric member 41 may, for example, be in contact with the -Z side of the second dielectric member 9, or it may be slightly away from the -Z side of the second dielectric member 9 to such an extent that it does not affect the impedance characteristics.

[0038] (Enclosure configuration) The housing 42 supports the outer conductor 7 from its outer circumference. The housing 42 covers the outer circumference of the outer conductor 7. The outer conductor 7 penetrates the housing 42 in the Z direction. -In the Z direction, the housing 42 may be separated from the opposing surface 3b of the interposer 3. +In the Z direction, the housing 42 may be separated from the opposing surface 5a of the printed circuit board 5, which will be described later. The housing 42 may be formed of, for example, an electrically insulating resin material.

[0039] (Printed circuit board configuration) The printed circuit board 5 is electrically connected to the quantum chip 2 via the interposer 3 and socket 4. The printed circuit board 5 may also be connected to the quantum chip 2 via the interposer 3 and socket 4 in a manner that allows for the transmission of electromagnetic waves, such as microwaves. The printed circuit board 5 is located on the +Z side relative to the socket 4. The printed circuit board 5 has an opposing surface 5a on the -Z side that aligns with the XY plane. The opposing surface 5a is in contact with the second surface 7b of the outer conductor 7.

[0040] (operation) In the quantum device 1, electrical signals are transmitted and received between the printed circuit board 5 and the quantum chip 2 via the interposer 3 and socket 4. For example, electromagnetic waves such as microwaves may be transmitted and received between the printed circuit board 5 and the quantum chip 2 via the interposer 3 and socket 4. In this case, the electromagnetic waves are transmitted through a transmission path extending in the Z direction, which is formed by the first movable pin 6, the outer conductor 7, the first dielectric member 8, the second dielectric member 9, and the third dielectric member 41.

[0041] (Mechanism of Action and Effects) In the quantum device 1 of this embodiment, the first dielectric member 8 covers the outer circumference of the first tip portion 67 from the first end 61a (of the first barrel 61) to the interposer 3. With this configuration, the characteristic impedance from the first end 61a to the portion where the first tip 67 is in contact with the interposer 3 can be adjusted by the first dielectric member 8. Therefore, the characteristic impedances of the interposer 3, socket 4, and connection point can be matched. Therefore, the electrical characteristics of the connection can be improved.

[0042] As Comparative Example 1, as shown in Figure 6, when a cylindrical coaxial structure including a first movable pin 96 and an outer conductor 97 is formed in the socket 94, the plunger portion of the first movable pin 96 protrudes from the surface of the dielectric members 98 and 99. In this configuration, the dielectric members 98 and 99 only cover up to part of the plunger portion. Therefore, the characteristic impedance is not adjusted in the portion that is not covered by the dielectric members 98 and 99. Consequently, the characteristic impedance of the connection points when the socket 94 and the interposer 3, and the socket 94 and the printed circuit board 5 are electrically connected to each other is not matched.

[0043] In contrast to Comparative Example 1, in this embodiment, as described above, the first dielectric member 8 covers the outer circumference of the first tip portion 67 from the first end 61a to the interposer 3. Therefore, the characteristic impedances of the interposer 3, the socket 4, and the connection portion can be matched.

[0044] According to the quantum device 1 of this embodiment, the second dielectric member 9 covers the outer circumference of the second tip portion 68 from the second end 61b (of the first barrel 61) to the printed circuit board 5. With this configuration, the characteristic impedance from the second end 61b to the portion where the second tip 68 is in contact with the printed circuit board 5 can be adjusted by the second dielectric member 9. This makes it possible to match the characteristic impedance of the connection between socket 4 and printed circuit board 5. Therefore, the electrical characteristics of the connection can be improved.

[0045] For example, in this embodiment, as described above, the second dielectric member 9 covers the outer circumference of the second tip portion 68 from the second end 61b to the printed circuit board 5, in contrast to Comparative Example 1. Therefore, the characteristic impedances of the printed circuit board 5, the socket 4, and the connection portion can be matched.

[0046] According to the quantum device 1 of this embodiment, the first dielectric member 8 has a thickness equal to the distance between the first end 61a (of the first barrel 61) and the interposer 3. This configuration allows the gap between the first end 61a and the interposer 3 to be filled with the first dielectric member 8. Therefore, it is easier to keep the characteristic impedance of the transmission line between the first barrel 61 and the interposer 3 constant. Therefore, the electrical characteristics of the connection can be improved.

[0047] According to the quantum device 1 of this embodiment, the second dielectric member 9 has a thickness equal to the distance between the second end 61b (of the first barrel 61) and the printed circuit board 5. This configuration allows the gap between the second end 61b and the printed circuit board 5 to be filled with the second dielectric member 9. Therefore, it is easier to keep the characteristic impedance of the transmission path between the first barrel 61 and the printed circuit board 5 constant. Therefore, the electrical characteristics of the connection can be improved.

[0048] According to the quantum device 1 of this embodiment, the socket 4 has a cylindrical coaxial structure with the first movable pin 6 as the central conductor. This configuration makes it easier to transmit electromagnetic waves, such as microwaves, between the socket 4 and the interposer 3. Furthermore, it becomes easier to transmit electromagnetic waves, such as microwaves, between the socket 4 and the printed circuit board 5.

[0049] According to the quantum device 1 of this embodiment, the external conductor 7 has a plane that is in contact with the interposer 3 on the -Z direction side. This configuration improves the connection stability between the interposer 3 and the external conductor 7.

[0050] According to the quantum device 1 of this embodiment, the outer conductor 7 has a plane that is in contact with the printed circuit board 5 on the +Z direction side. This configuration improves the connection stability between the printed circuit board 5 and the external conductor 7.

[0051] (Variation 1) In the above embodiment, the first movable pin 6 is shown as having movable ends so that each of the first plunger 62 and the second plunger 63 is movable in the Z direction relative to the first barrel 61. However, the second plunger may be configured in any way as long as the first tip portion 67 and the second tip portion 68 protruding from the first barrel 61 are biased to move elastically in the Z direction. As shown in Figure 7, in a modified example 1, the first movable pin 6 may include a second plunger 69 fixed to the first barrel 61. That is, the first movable pin 6 may be of the type where only the first plunger 62 of the first plunger 62 and the second plunger 69 can move in the Z direction relative to the first barrel 61. Even with this modified example 1, the first tip portion 67 and the second tip portion 68 protruding from the first barrel 61 are biased to move elastically in the Z direction.

[0052] (Modifications 2 and 3) In the above embodiment, an example is shown where the first surface 7a is an annular plane facing the -Z direction. However, the first surface 7a may be configured in any way as long as it is in contact with the opposing surface 3b of the interposer 3. As shown in Figures 8 and 9, in a modified example 2, the first surface 7a may have multiple protrusions. The first surface 7a may have a multi-point crown shape, for example, as a shape having multiple protrusions. Furthermore, as shown in Figure 10, in modification 3, the first surface 7a may have only one projection. In this case, the position of the projection on the first surface 7a may be equidistant from the inner and outer surfaces of the outer conductor 7, as shown by the solid line in Figure 10. Alternatively, the position of the projection on the first surface 7a may be shifted in the Y direction from the position equidistant from the inner and outer surfaces of the outer conductor 7, as shown by the dashed or dotted line in Figure 10. These modified examples 2 and 3 also improve the connection stability between the interposer 3 and the external conductor 7.

[0053] (Modifications 4 and 5) In the above embodiment, an example is shown where the second surface 7b is an annular plane facing the +Z direction. However, the second surface 7b may be configured in any way as long as it is in contact with the opposing surface 5a of the printed circuit board 5. As shown in Figures 8 and 9, in Modification 4, the second surface 7b may have multiple protrusions. The second surface 7b may have a multi-point crown shape, for example, as a shape having multiple protrusions. Furthermore, as shown in Figure 10, in modification 5, the second surface 7b may have only one projection. In this case, the position of the projection on the second surface 7b may be at a position equidistant from the inner and outer surfaces of the outer conductor 7, as shown by the solid line in Figure 10. Alternatively, the position of the projection on the second surface 7b may be at a position shifted in the Y direction from the position equidistant from the inner and outer surfaces of the outer conductor 7, as shown by the dashed or dotted line in Figure 10. These modified examples 4 and 5 also improve the connection stability between the printed circuit board 5 and the external conductor 7.

[0054] <Second Embodiment> An embodiment of the present disclosure will be described below with reference to the figures. The configuration of quantum device 101, other than that described below, is the same as that of quantum device 1.

[0055] (composition) As shown in Figure 11, the quantum device 101 according to this embodiment comprises a quantum chip 2, an interposer 3, a socket 104, and a printed circuit board 5.

[0056] (Socket configuration) Socket 104 is electrically connected to both the interposer 3 and the printed circuit board 5. Socket 104 is located between the interposer 3 and the printed circuit board 5. Socket 104 relays the electrical connection between the interposer 3 and the printed circuit board 5. One end face of socket 104, facing the -Z direction, is opposite the interposer 3. The other end face of socket 104, facing the +Z direction, is opposite the printed circuit board 5.

[0057] The socket 104 comprises a first movable pin 6, a plurality of second movable pins 107 (outer conductors), a first dielectric member 108, a second dielectric member 109, and a housing 142.

[0058] (Outer conductor configuration) Each of the multiple second movable pins 107 comprises a second barrel 171, a third plunger 172, and a fourth plunger 173. The second movable pin 107 may, for example, further include a spring similar to that of the first movable pin 6 within the second barrel 171. The second movable pin 107 may be a double-ended movable type that can move in the Z direction, similar to the first movable pin 6. That is, the third plunger 172 and the fourth plunger 173 may each be movable in the Z direction relative to the second barrel 171. The third plunger 172 and the fourth plunger 173 may be held at both ends of the second barrel 171 in the Z direction (longitudinal direction) via springs, similar to the first plunger 62 and the second plunger 63. The second movable pin 107 may be a GND conductor (grounded conductor).

[0059] As shown in Figure 12, the multiple second movable pins 107 surround the outer circumference of the first movable pin 6. The multiple second movable pins 107 are arranged on a circle C centered on the first movable pin.

[0060] The second barrel 171 has a cylindrical shape with a central axis extending in the Z direction. As shown in Figure 11, the second barrel 171 holds a third plunger 172 on its -Z side. The second barrel 171 holds a fourth plunger 173 on its +Z side. The second barrel 171 has a third end 171a on its -Z side and a fourth end 171b on its +Z side. The second barrel 171 may be formed of, for example, a conductive metallic material.

[0061] The third plunger 172 has a third tip portion 177 extending in the -Z direction. The third tip portion 177 protrudes in the -Z direction from the third end 171a. The third plunger 172 is movable in the Z direction relative to the second barrel 171. The third plunger 172 is housed within the second barrel 171, except for a portion of the third tip portion 177 (the portion protruding from the third end 171a). The third tip portion 177 is in contact with the interposer 3 when moved in the -Z direction. The third plunger 172 and the second barrel 171 are in conductive contact. The third plunger 172 may be arranged coaxially with the second barrel 171, for example. The third plunger 172 may be formed of, for example, a conductive metallic material.

[0062] The fourth plunger 173 has a fourth tip portion 178 extending in the +Z direction. The fourth tip portion 178 protrudes in the +Z direction from the fourth end 171b. The fourth plunger 173 may be movable in the Z direction relative to the second barrel 171, for example. The fourth plunger 173 is housed within the second barrel 171, except for a portion of the fourth tip portion 178 (the portion protruding from the fourth end 171b). The fourth tip portion 178 is in contact with the printed circuit board 5 when moved in the +Z direction. The fourth plunger 173 and the second barrel 171 are in conductive contact. The fourth plunger 173 may be arranged coaxially with the second barrel 171, for example. The fourth plunger 173 may be formed of, for example, a conductive metallic material.

[0063] (Configuration of the first dielectric component) The first dielectric member 108 covers the outer circumference of the first tip portion 67 from the first end 61a of the first barrel 61 to the interposer 3. The first dielectric member 108 has a plate shape with its thickness in the Z direction and extends along the XY plane. Furthermore, the first dielectric member 108 covers the outer circumference of each third tip portion 177 from the third end 171a of the second barrel 171 to the interposer 3. The first dielectric member 108 may be formed of, for example, an electrically insulating resin material.

[0064] The first dielectric member 108 may have a thickness in the Z direction equal to, for example, the distance between the first end 61a of the first barrel 61 and the interposer 3. That is, the thickness of the first dielectric member 108 in the Z direction may be approximately the same as, for example, the length of the portion of the first tip 67 that protrudes from the first end 61a.

[0065] The first dielectric member 108 may have a thickness in the Z direction equal to, for example, the distance between the third end 171a of the second barrel 171 and the interposer 3. That is, the thickness of the first dielectric member 108 in the Z direction may be approximately the same as, for example, the length of the portion of the third tip 177 that protrudes from the third end 171a.

[0066] The configuration of these first dielectric members 108 adjusts the characteristic impedance up to the tip of the first plunger 62.

[0067] (Configuration of the second dielectric component) The second dielectric member 109 covers the outer circumference of the second tip portion 68 from the second end 61b of the first barrel 61 to the printed circuit board 5. The second dielectric member 109 has a plate shape with its thickness in the Z direction and extends along the XY plane. Furthermore, the second dielectric member 109 covers the outer circumference of each fourth tip portion 178 from the fourth end 171b of the second barrel 171 to the printed circuit board 5. The second dielectric member 109 may be formed of, for example, an electrically insulating resin material.

[0068] The second dielectric member 109 may have a thickness in the Z direction equal to, for example, the distance between the second end 61b of the first barrel 61 and the printed circuit board 5. That is, the thickness of the second dielectric member 109 in the Z direction may be approximately the same as, for example, the length of the portion of the second tip portion 68 that protrudes from the second end 61b.

[0069] The second dielectric member 109 may have a thickness in the Z direction equal to, for example, the distance between the fourth end 171b of the second barrel 171 and the printed circuit board 5. That is, the thickness of the second dielectric member 109 in the Z direction may be approximately the same as, for example, the length of the portion of the fourth tip portion 178 that protrudes from the fourth end 171b.

[0070] The configuration of these second dielectric members 109 adjusts the characteristic impedance up to the tip of the second plunger 63.

[0071] (Enclosure configuration) The housing 142 integrally supports the first movable pin 6, a plurality of second movable pins 107, the first dielectric member 108, and the second dielectric member 109. The housing 142 covers the outer circumference of the first movable pin 6 and the outer circumference of the second movable pins 107. The first movable pin 6 penetrates the housing 142 in the Z direction. The second movable pins 107 penetrate the housing 142 in the Z direction.

[0072] On the -Z side, the housing 142 may face the interposer 3 via the first dielectric member 108. The -Z side of the housing 142 may, for example, be in surface contact with the interposer 3. On the +Z side, the housing 142 may face the printed circuit board 5 via the second dielectric member 109. The +Z side of the housing 142 may, for example, be in surface contact with the printed circuit board 5. The housing 142 may be formed of, for example, an electrically insulating resin material.

[0073] (Printed circuit board configuration) The printed circuit board 5 is electrically connected to the quantum chip 2 via the interposer 3 and socket 104. The printed circuit board 5 may also be connected to the quantum chip 2 via the interposer 3 and socket 104 in a manner that allows for the transmission of electromagnetic waves, such as microwaves. The printed circuit board 5 is positioned on the +Z side relative to the socket 104.

[0074] (operation) In the quantum device 101, electrical signals are transmitted and received between the printed circuit board 5 and the quantum chip 2 via the interposer 3 and socket 104. For example, electromagnetic waves such as microwaves may be transmitted and received between the printed circuit board 5 and the quantum chip 2 via the interposer 3 and socket 104. In this case, the electromagnetic waves are transmitted through a transmission path extending in the Z direction, which is formed by the first movable pin 6, a plurality of second movable pins 107, the first dielectric member 108, and the second dielectric member 109.

[0075] (Mechanism of Action and Effects) In the quantum device 101 of this embodiment, the first dielectric member 108 covers the outer circumference of the first tip portion 67 from the first end 61a (of the first barrel 61) to the interposer 3. With this configuration, the characteristic impedance from the first end 61a to the portion where the first tip 67 is in contact with the interposer 3 can be adjusted by the first dielectric member 108. This allows the characteristic impedances of the interposer 3, socket 104, and connection point to be matched. Therefore, the electrical characteristics of the connection can be improved.

[0076] As a comparative example 2, as shown in Figure 13, the socket 194 includes a first movable pin 96 and a plurality of second movable pins 197, and the plunger portion of the first movable pin 96 protrudes without being covered by the first dielectric member 108 and the second dielectric member 109. In this configuration, the characteristic impedance of the plunger portion of the first movable pin 96 is not adjusted. Therefore, the characteristic impedance of the connection points when the socket 194 and the interposer 3, and the socket 194 and the printed circuit board 5 are electrically connected to each other is not matched.

[0077] In contrast to Comparative Example 2, in this embodiment, as described above, the first dielectric member 108 covers the outer circumference of the first tip portion 67 (which is surrounded by a plurality of third tip portions 177) from the first end 61a to the interposer 3. Therefore, the characteristic impedances of the interposer 3, the socket 104, and the connection portion can be matched.

[0078] In the quantum device 1 of this embodiment, the second dielectric member 109 covers the outer circumference of the second tip portion 68 from the second end 61b (of the first barrel 61) to the printed circuit board 5. With this configuration, the characteristic impedance from the second end 61b to the portion where the second tip 68 is in contact with the printed circuit board 5 can be adjusted by the second dielectric member 109. This makes it possible to match the characteristic impedance of the connection between socket 104 and printed circuit board 5. Therefore, the electrical characteristics of the connection can be improved.

[0079] For example, in this embodiment, as described above, compared to Comparative Example 2, the second dielectric member 109 covers the outer circumference of the second tip portion 68 (which is surrounded by a plurality of fourth tip portions 178) from the second end 61b to the printed circuit board 5. Therefore, the characteristic impedance of the printed circuit board 5, the socket 104, and the connection portion can be matched.

[0080] According to the quantum device 101 of this embodiment, the first dielectric member 108 has a thickness equal to the distance between the first end 61a (of the first barrel 61) and the interposer 3. This configuration allows the gap between the first end 61a and the interposer 3 to be filled with the first dielectric member 108. Therefore, it is easier to keep the characteristic impedance of the transmission line between the first barrel 61 and the interposer 3 constant. Therefore, the electrical characteristics of the connection can be improved.

[0081] In the quantum device 101 of this embodiment, a plurality of second movable pins 107 surround the first movable pin 6. This configuration makes it easier to transmit electromagnetic waves, such as microwaves, between the socket 104 and the interposer 3. Furthermore, it becomes easier to transmit electromagnetic waves, such as microwaves, between the socket 104 and the printed circuit board 5.

[0082] In the quantum device 101 of this embodiment, the multiple second movable pins 107 are arranged on a circumference centered on the first movable pin 6. This configuration makes it easier to transmit electromagnetic waves, such as microwaves, between the socket 104 and the interposer 3. Furthermore, it becomes easier to transmit electromagnetic waves, such as microwaves, between the socket 104 and the printed circuit board 5.

[0083] <Other variations> The transmission structure in the socket of each of the embodiments described above may be integrated. As a fourth modification, as shown in Figure 14, the cylindrical coaxial structure may be integrated in the socket 4. As a fifth modification, as shown in Figure 15, in the socket 104, the set of the first movable pin 6 and the multiple second movable pins 107 may be integrated. However, compared to the socket 104 of the fifth modification, the socket 4 of the fourth modification does not use movable pins for GND (multiple second movable pins 107), thus enabling space saving (miniaturization) and making it suitable for high integration.

[0084] <Third Embodiment> An embodiment of this disclosure will be described below with reference to the figures.

[0085] (composition) As shown in Figure 16, the quantum device 301 of this embodiment comprises a quantum chip 302, an interposer 303, and a socket 304. The interposer 303 is equipped with a quantum chip 302. The socket 304 comprises a first movable pin 306, an outer conductor 307, and a first dielectric member 308. The first movable pin 306 comprises a first barrel 361 and a first plunger 362. The first barrel 361 has a first end 361a on the first side in the axial direction DA. The first plunger 362 is movable in the axial direction DA relative to the first barrel 361. The outer conductor 307 is located on the outer circumference of the first plunger 362, with the first dielectric member 308 in between, and is in contact with the interposer 303. The first plunger 362 has a first tip portion 367 that protrudes axially DA from the first end 361a and is in contact with the interposer 303. The first dielectric member 308 covers the outer circumference of the first tip portion 367 from the first end 361a to the interposer 303.

[0086] (Mechanism of Action and Effects) According to the quantum device 301 of this embodiment, the first dielectric member 308 covers the outer circumference of the first tip portion 367 from the first end 361a (of the first barrel 361) to the interposer 303. With this configuration, the characteristic impedance from the first end 361a to the portion where the first tip 367 is in contact with the interposer 303 can be adjusted by the first dielectric member 308. This allows the characteristic impedances of the interposer 303, socket 304, and connection point to be matched. Therefore, the electrical characteristics of the connection can be improved.

[0087] Although the present disclosure has been described above with reference to embodiments, the present disclosure is not limited to the embodiments described above. Various modifications to the structure and details of the present disclosure are possible, as can be understood by those skilled in the art within the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0088] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0089] (Note 1) Quantum chips and The interposer on which the aforementioned quantum chip is implemented, A socket comprising: a first movable pin having a first barrel with a first end on the first side in the axial direction and a first plunger that is movable in the axial direction relative to the first barrel; a first dielectric member and an outer conductor located on the outer circumference of the first plunger, sandwiching the first dielectric member, and in contact with the interposer; Equipped with, The first plunger has a first tip portion that protrudes axially from the first end and is in contact with the interposer, The first dielectric member covers the outer circumference of the first tip portion from the first end to the interposer. Quantum devices.

[0090] (Note 2) The socket further comprises a printed circuit board located on the second axial side, The first barrel has a second end on the second side in the axial direction, which is opposite to the first side. The first movable pin has a second plunger that is movable in the axial direction relative to the first barrel. The second plunger has a second tip portion that protrudes axially from the second end and is in contact with the printed circuit board. The outer conductor is in contact with the printed circuit board. The socket further comprises a second dielectric member that covers the outer circumference of the second tip portion from the second end to the printed circuit board. The quantum device described in Appendix 1.

[0091] (Note 3) The first dielectric member has a thickness equal to the distance between the first end and the interposer in the axial direction. A quantum device as described in Appendix 1 or 2.

[0092] (Note 4) The socket has a cylindrical coaxial structure with the first movable pin as the central conductor. A quantum device described in any one of the appendices 1 to 3.

[0093] (Note 5) The socket has a cylindrical coaxial structure with the first movable pin as the central conductor, The outer conductor has a plane on the first axial side that is in contact with the interposer. A quantum device described in any one of the appendices 1 to 3.

[0094] (Note 6) The socket has a cylindrical coaxial structure with the first movable pin as the central conductor, The outer conductor has a projection on the first axial side that is in contact with the interposer. A quantum device described in any one of the appendices 1 to 3.

[0095] (Note 7) The socket has a cylindrical coaxial structure with the first movable pin as the central conductor, The outer conductor has a plane on the second axial side that is in contact with the printed circuit board. The quantum device described in Appendix 2.

[0096] (Note 8) The socket has a cylindrical coaxial structure with the first movable pin as the central conductor, The outer conductor has a projection on the second axial side that is in contact with the printed circuit board. The quantum device described in Appendix 2.

[0097] (Note 9) The outer conductor comprises a plurality of second movable pins surrounding the first movable pin. A quantum device as described in Appendix 1 or 2.

[0098] (Note 10) The plurality of second movable pins are arranged on a circumference centered on the first movable pin. Quantum devices as described in Appendix 9. [Explanation of Symbols]

[0099] 1. Quantum devices 2 Quantum Chips 3 Interposer 3a Implementation side 3b Opposite surface 4 sockets 5 Printed circuit boards 5a Opposing surface 6. First movable pin 7. Outer conductor 7a Front page 7b Second side 8. First dielectric member 9. Second dielectric member 41 Third dielectric member 42 cabinets 61 First Barrel 61a First end 61b Second end 61c First hole 61d Second hole 62 First Plunger 63 Second plunger 64 Springs 65 First base 66 Second base 67 First tip 68 Second tip 69 Second plunger 94 sockets 96 First movable pin 97 Outer conductor 98 Dielectric materials 99 Dielectric materials 101 Quantum Devices 104 Socket 107 Second movable pin (outer conductor) 108 First dielectric member 109 Second dielectric member 142 cabinets 171 Second barrel 171a third end 171b Fourth end 172 Third Plunger 173 Fourth Plunger 177 Third tip 178 Fourth tip 194 sockets 197 Second movable pin 301 Quantum Devices 302 Quantum Chips 303 Interposer 304 socket 306 First movable pin 307 Outer conductor 308 First dielectric member 361 First Barrel 361a first end 362 First Plunger 367 First tip C circumference DA axis direction

Claims

1. Quantum chips and The interposer on which the aforementioned quantum chip is implemented, A socket comprising: a first movable pin having a first barrel with a first end on the first side in the axial direction and a first plunger that is movable in the axial direction relative to the first barrel; a first dielectric member and an outer conductor located on the outer circumference of the first plunger, sandwiching the first dielectric member, and in contact with the interposer; Equipped with, The first plunger has a first tip portion that protrudes axially from the first end and is in contact with the interposer, The first dielectric member covers the outer circumference of the first tip portion from the first end to the interposer. Quantum devices.

2. The socket further comprises a printed circuit board located on the second axial side, The first barrel has a second end on the second side in the axial direction, which is opposite to the first side. The first movable pin has a second plunger that is movable in the axial direction relative to the first barrel. The second plunger has a second tip portion that protrudes axially from the second end and is in contact with the printed circuit board. The outer conductor is in contact with the printed circuit board. The socket further comprises a second dielectric member that covers the outer circumference of the second tip portion from the second end to the printed circuit board. The quantum device according to claim 1.

3. The first dielectric member has a thickness equal to the distance between the first end and the interposer in the axial direction. The quantum device according to claim 1 or 2.

4. The socket has a cylindrical coaxial structure with the first movable pin as the central conductor. The quantum device according to claim 1 or 2.

5. The socket has a cylindrical coaxial structure with the first movable pin as the central conductor, The outer conductor has a plane on the first axial side that is in contact with the interposer. The quantum device according to claim 1 or 2.

6. The socket has a cylindrical coaxial structure with the first movable pin as the central conductor, The outer conductor has a projection on the first axial side that is in contact with the interposer. The quantum device according to claim 1 or 2.

7. The socket has a cylindrical coaxial structure with the first movable pin as the central conductor, The outer conductor has a plane on the second axial side that is in contact with the printed circuit board. The quantum device according to claim 2.

8. The socket has a cylindrical coaxial structure with the first movable pin as the central conductor, The outer conductor has a projection on the second axial side that is in contact with the printed circuit board. The quantum device according to claim 2.

9. The outer conductor comprises a plurality of second movable pins surrounding the first movable pin. The quantum device according to claim 1 or 2.

10. The plurality of second movable pins are arranged on a circumference centered on the first movable pin. The quantum device according to claim 9.

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