4-methyl-1-pentene resin composition

Abstract

The present invention provides a 4-methyl-1-pentene resin composition with excellent heat aging resistance. [Solution] A 4-methyl-1-pentene resin composition (X) comprising a 4-methyl-1-pentene polymer (A), a phenolic additive (B1), a sulfuric additive (B2), and a phosphorus-based additive (B3), wherein the total content of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3) is 1.00 parts by mass or more per 100 parts by mass of the 4-methyl-1-pentene polymer (A).

Description

Technical Field

[0001] The present invention relates to a 4-methyl-1-pentene resin composition.

Background Art

[0002] A 4-methyl-1-pentene homopolymer and a 4-methyl-1-pentene / α-olefin copolymer having 4-methyl-1-pentene as a main constituent monomer are widely used in various applications because of their excellent heat resistance, mold release properties, and chemical resistance. For example, films made of these polymers utilize features such as good mold release properties and are used for flexible printed circuit board (FPC) release films, release films, etc., or utilize features such as chemical resistance, water resistance, transparency, etc., and are used for experimental instruments and mandrels for manufacturing rubber hoses.

[0003] For example, Patent Document 1 discloses a copolymer in which the constituent unit derived from 4-methyl-1-pentene is in the range of 80 to 99.9% by mass, and the constituent unit derived from at least one α-olefin having 3 to 20 carbon atoms other than 4-methyl-1-pentene is 0.1 to 20% by mass, and the ratio of the content a% by mass of the constituent unit derived from an α-olefin having 3 to 20 carbon atoms other than 4-methyl-1-pentene in the n-decane soluble component of the copolymer to the content b% by mass of the constituent unit derived from an α-olefin having 3 to 20 carbon atoms in the copolymer is within a predetermined range, and it is described that the film can be used for an FPC release film.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Although the polymer described in Patent Document 1 and the composition containing the polymer have excellent heat resistance, depending on the application, in addition to having good physical properties that serve as indicators of heat resistance, such as melting point, it may be required to have heat resistance over a longer period of time (i.e., heat aging resistance or thermal stability).

[0006] The present invention has been made in view of the above, and aims to provide a 4-methyl-1-pentene resin composition with superior heat aging resistance (thermal stability). [Means for solving the problem]

[0007] As a result of the inventor's research, it was found that the above-mentioned problems can be solved according to the following configuration example. The configuration example of the present invention is as follows. In this specification, "A~B" indicating a numerical range means A or greater and B or less. In the numerical ranges described in stages in this specification, the upper or lower limit stated in one numerical range may be replaced with the upper or lower limit of another numerical range described in stages. Furthermore, in the numerical ranges described in this disclosure, any upper or lower limit values ​​described within a numerical range may be replaced with the values ​​shown in the examples. In this specification, "n-" means normal, "i-" means iso, "s-" means secondary, and "t-" means tertiary.

[0008] [1] 4-methyl-1-pentene polymer (A), Phenolic additive (B1), Sulfur-based additive (B2), Phosphorus-based additive (B3), Includes, A 4-methyl-1-pentene resin composition (X) wherein the total content of the phenolic additive (B1), the sulfur-based additive (B2), and the phosphorus-based additive (B3) is 1.00 parts by mass or more per 100 parts by mass of the 4-methyl-1-pentene polymer (A).

[0009] [2] The 4-methyl-1-pentene resin composition (X) according to [1], wherein the phenolic additive (B1) comprises a semi-hindered phenolic antioxidant.

[0010] [3] The 4-methyl-1-pentene resin composition (X) according to [1] or [2], wherein when the total of the phenolic additive (B1), the sulfur-based additive (B2), and the phosphorus-based additive (B3) is 100% by mass, the content of the sulfur-based additive (B2) is 50% by mass or more.

[0011] [4] A molded article comprising the 4-methyl-1-pentene resin composition (X) described in any one of [1] to [3].

[0012] [5] A film, the molded article described in [4]. [Effects of the Invention]

[0013] According to the present invention, a 4-methyl-1-pentene resin composition with excellent heat aging resistance (thermal stability) is provided. [Modes for carrying out the invention]

[0014] ≪4-methyl-1-pentene resin composition (X)≫ The 4-methyl-1-pentene resin composition (X) (hereinafter also referred to as "resin composition (X)") comprises a 4-methyl-1-pentene polymer (A), a phenolic additive (B1), a sulfuric additive (B2), and a phosphorus-based additive (B3), wherein the total content of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3) per 100 parts by mass of the 4-methyl-1-pentene polymer (A) is 1.00 parts by mass or more.

[0015] <4-methyl-1-pentene polymer (A)> 4-methyl-1-pentene polymers (A) are homopolymers of 4-methyl-1-pentene or copolymers of 4-methyl-1-pentene with other monomers copolymerizable with it. Monomers copolymerizable with 4-methyl-1-pentene include at least one selected from ethylene and α-olefins having 3 to 20 carbon atoms (excluding 4-methyl-1-pentene). Specific examples of α-olefins having 3 to 20 carbon atoms include propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4,4-dimethyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4-ethyl-1-hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, and 1-eicosene. Of these, α-olefins having 6 to 20 carbon atoms, excluding 4-methyl-1-pentene, are preferred, and α-olefins having 10 to 20 carbon atoms are more preferred. Ethylene and these α-olefins can be used individually or in combination of two or more.

[0016] The 4-methyl-1-pentene polymer (A) is not particularly limited, but from the viewpoint of heat resistance, it is desirable that the constituent units derived from 4-methyl-1-pentene are preferably 50.0 mol% or more, more preferably 80.0 mol% or more, even more preferably 90.0 mol% or more, and particularly preferably 95.0 to 100 mol%, and that the total amount of constituent units derived from ethylene and at least one α-olefin having 3 to 20 carbon atoms (excluding 4-methyl-1-pentene) is preferably 50.0 mol% or less, more preferably 20.0 mol% or less, even more preferably 10.0 mol% or less, and particularly preferably 0 to 5.0 mol%.

[0017] The amounts of the structural units derived from 4-methyl-1-pentene in the 4-methyl-1-pentene polymer (A) and the structural units derived from at least one olefin selected from ethylene and α-olefins having 3 to 20 carbon atoms (excluding 4-methyl-1-pentene) can be adjusted by the amounts of the respective olefins added during the polymerization reaction.

[0018] The 4-methyl-1-pentene polymer (A) contained in the resin composition (X) preferably satisfies the following requirement (a1) or (a2), and more preferably satisfies the following requirements (a1) and (a2).

[0019] [Requirement (a1)] The intrinsic viscosity [η] of the 4-methyl-1-pentene polymer measured in decalin at 135 °C by the method described in the examples below is preferably 0.5 to 5.0 dl / g, more preferably 1.0 to 3.0 dl / g. The 4-methyl-1-pentene polymer (A) with the value of intrinsic viscosity [η] within the above range has good fluidity during molding. The intrinsic viscosity [η] can be adjusted, for example, by the amount of hydrogen added in the polymerization step when producing the 4-methyl-1-pentene polymer (A).

[0020] [Requirement (a2)] The melting point (Tm) measured by a differential scanning calorimeter (DSC) is preferably 200 to 260 °C. This melting point (Tm) is more preferably 210 to 250 °C, and even more preferably 220 to 240 °C. When the melting point (Tm) of the 4-methyl-1-pentene polymer (A) is within such a range, it is preferable because the molded body obtained from the 4-methyl-1-pentene polymer (A) has excellent heat resistance. The melting point (Tm) of the 4-methyl-1-pentene polymer (A) can be adjusted by the amount of monomers other than 4-methyl-1-pentene copolymerized with 4-methyl-1-pentene, etc.

[0021] In the present invention, the 4-methyl-1-pentene polymer (A) may be obtained by any method and is not particularly limited, but it can be produced by polymerizing 4-methyl-1-pentene with ethylene and at least one olefin selected from α-olefins having 3 to 20 carbon atoms (excluding 4-methyl-1-pentene) in the presence of an olefin polymerization catalyst. Alternatively, the 4-methyl-1-pentene polymer (A) may be produced by thermal decomposition of a high molecular weight 4-methyl-1-pentene polymer (A), or it may be purified by solvent fractionation based on differences in solubility in a solvent, or by fractional distillation based on differences in boiling points.

[0022] Conventional known catalysts for olefin polymerization, such as Ziegler catalysts containing titanium compounds and metallocene catalysts containing metallocene compounds, can be used as catalysts for olefin polymerization. Examples of catalysts for olefin polymerization to produce 4-methyl-1-pentene polymer (A) include the catalyst for olefin polymerization described in Japanese Patent Application Publication No. 2015-183332. Furthermore, the 4-methyl-1-pentene polymer (A) contained in the resin composition (X) may be a homopolymer of 4-methyl-1-pentene or a copolymer of 4-methyl-1-pentene and another monomer copolymerizable with 4-methyl-1-pentene, further modified by grafting.

[0023] In the present invention, a commercially available 4-methyl-1-pentene polymer (A) may be used as the 4-methyl-1-pentene polymer (A), and preferably a commercially available 4-methyl-1-pentene polymer (A) that satisfies the above-described requirements (a1) and (a2) may be used. Examples of commercially available 4-methyl-1-pentene polymers (A) include TPX (trademark name) manufactured by Mitsui Chemicals, Inc.

[0024] <Additives> The resin composition (X) contains a phenolic additive (B1), a sulfur-based additive (B2), and a phosphorus-based additive (B3). If one or more of the phenolic additive (B1), sulfur-based additive (B2), and phosphorus-based additive (B3) are not included, the desired heat aging resistance (thermal stability) may not be obtained.

[0025] Here, the phenolic additive (B1) preferably contains a phenolic antioxidant, and may also contain a phenolic antioxidant. Furthermore, the sulfuric additive (B2) preferably contains a sulfuric antioxidant, and may also contain a sulfuric antioxidant. In addition, the phosphorus-based additive (B3) preferably contains a phosphorus-based antioxidant, and may also contain a phosphorus-based antioxidant. In this invention, the term "antioxidant" refers to any compound having ultraviolet absorption, radical scavenging, or peroxide decomposition functions. For example, a light stabilizer having radical scavenging functions is included in the definition of an antioxidant. The following describes the phenolic additives (B1), sulfur-based additives (B2), and phosphorus-based additives (B3) separately.

[0026] [Phenol-based additive (B1)] The phenolic additive (B1) is preferably a phenolic additive. The phenolic additive may be a phenolic antioxidant. The phenolic additive (B1) may be a hindered phenolic additive or a semi-hindered phenolic additive, or a phenolic additive that does not fall into either category (hereinafter referred to as "other phenolic additives"). Among these, the phenolic additive (B1) is preferably a semi-hindered phenolic additive. Furthermore, the hindered phenolic additive, the semi-hindered phenolic additive, and the other phenolic additive may be a hindered phenolic antioxidant, a semi-hindered phenolic antioxidant, and other phenolic antioxidants, respectively.

[0027] In this specification, hindered phenolic additives refer to additives in which both ortho positions of a phenolic hydroxyl group are tert-butyl groups, or substituents that are sterically hindered to or greater than tert-butyl groups. Semi-hindered phenolic additives refer to additives in which one ortho position of a phenolic hydroxyl group is a tert-butyl group or a substituent that is sterically hindered to or greater than tert-butyl groups, but the other ortho position of the phenolic hydroxyl group is a substituent that is sterically hindered less than tert-butyl groups. For example, an additive in which one ortho position of a phenolic hydroxyl group is a tert-butyl group and the other is a hydrogen or methyl group is included in semi-hindered phenolic additives.

[0028] Compounds that act as hindered phenol antioxidants include pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, N,N′-(1,6-hexanediyl)bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionamide], 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and 2,4-bis-(n-octylthio)-6-(4-Hyd Examples include roxy-3,5-di-t-butylanilino)-1,3,5-triazine, 2,6-di-t-butyl-4-methylphenol, 2,6-di-t-butyl-4-nonylphenol, 2,2'-thiodiethylbis-(3,5-di-t-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-t-butyl-4-hydroxyhydrocinnamamide), and tetrakis-[methylene-3-(3,5'-di-t-butyl-4'-hydroxyphenyl)propionate]methane. Other oligomeric and polymeric compounds having a hindered phenol structure can also be used.

[0029] Compounds that act as semi-hindered phenolic additives include bis(3-t-butyl-4-hydroxy-5-methylbenzenepropanoic acid)ethylenebis(oxyethylene), 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, 2,4-bis[(laurylthio)methyl]-o-cresol, 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanuric acid, 4,4'-butylidene-bis-(2-t-butyl-5-methylphenol), 2,2'-thio-bis-(6-t-butyl-4-methylphenol), and 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-t-butylphenyl)-butane. Other oligomer and polymer-type compounds having a semi-hindered phenol structure can also be used.

[0030] Other compounds that act as phenolic additives include 2,2'-isobutylidene-bis-(4,6-dimethylphenol), 2,5-di-t-amylhydroquinone, 2,2'-methylene-bis-(6-(1-methylcyclohexyl)-p-cresol), and 2,4-dimethyl-6-(1-methylcyclohexyl)-phenol.

[0031] Specific examples of hindered phenol additives include H-BHT (manufactured by Honshu Chemical Industry Co., Ltd.), Irganox 259, Irganox 565, Irganox 1010, Irganox 1035, Irganox 1098, Irganox 1135, Irganox 1076, Irganox 1425WL, Irganox 1330, Irganox 3114 (all manufactured by BASF), Adeka Stab AO-20, Adeka Stab AO-50, Adeka Stab AO-60, Adeka Stab AO-330 (all manufactured by ADEKA Corporation), Smilizer BP-101, Smilizer BP-76 (both manufactured by Sumitomo Chemical Co., Ltd.), and Nocrack 200 (all manufactured by Ouchi Shinko Chemical Industry Co., Ltd.).

[0032] Specifically, the semi-hindered phenol additives include: Yoshinox BB, Yoshinox 425 (both manufactured by Mitsubishi Chemical Corporation), Irganox 245 (both manufactured by BASF), Adeka Stab AO-30, Adeka Stab AO-40, Adeka Stab AO-70, Adeka Stab AO-80 (all manufactured by ADEKA Corporation), Sumilizer GM, Sumilizer GP, Sumilizer GA-80, Sumilizer BBM-S, Sumilizer MDP-S, Sumilizer WX-R (all manufactured by Sumitomo Chemical Corporation), CYANOX CY-1790 (all manufactured by Sun Chemical Co., Ltd.), Nocrack NS-5, Nocrack NS-6, Nocrack NS-30, Nocrack 300, Nocrack NS-K (all manufactured by Ouchi Shinko Chemical Industry Co., Ltd.), HOSTANOX O3 (manufactured by Clariant Chemicals), and KEMINOX. Examples include the 179 (manufactured by Chemipro Chemical Co., Ltd.).

[0033] Other phenolic additives include Irganox 1520L, Irganox 1726 (both manufactured by BASF), Sumilizer GS (both manufactured by Sumitomo Chemical Co., Ltd.), Nocrack SP, and Nocrack DAH (both manufactured by Ouchi Shinko Chemical Industry Co., Ltd.).

[0034] [Sulfur-based additive (B2)] The sulfur-based additive (B2) is preferably a sulfur-based antioxidant.

[0035] Examples of compounds that act as sulfur-based antioxidants include 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diyl=bis[3-(dodecylthio)propionate], 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, and 2,4-bis[(laurylthio)methyl]-o-cresol. Other oligomeric and polymeric compounds having a thioether structure can also be used.

[0036] Specific examples of sulfur-based antioxidants include ADEKA AO-503, ADEKA AO-412S (both manufactured by ADEKA Corporation), Sumilizer TP-D, Sumilizer MB (both manufactured by Sumitomo Chemical Co., Ltd.), DLTP "Yoshitomi", DSTP "Yoshitomi", DMTP "Yoshitomi" (all manufactured by Mitsubishi Chemical Corporation), Nocrack NBC, Nocrack NS-10-N, Nocrack TBTU, Nocrack 400 (all manufactured by Ouchi Shinko Chemical Industry Co., Ltd.), and Irganox PS800FL, Irganox PS802FL (both manufactured by BASF Corporation).

[0037] [Phosphorus-based additive (B3)] The phosphorus-based additive (B3) is preferably a phosphorus-based antioxidant. Compounds that act as phosphorus-based antioxidants include phosphite, phosphate, phosphonic acid, phosphonic acid, and their esters. Specifically, 3,9-bis(octadecyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane, tris(isodecyl)phosphite, tris(tridecyl)phosphite, phenylisooctylphosphite, phenylisodecylphosphite, phenyldi(tridecyl)phosphite, diphenylisooctylphosphite, diphenylisodecylphosphite, diphenyltridecylphosphite, triphenylphosphite, tris(nonylphenyl)phosphite, 4,4'-isopropylidenediphenolalkylphosphite, trisnonylphenylphosphite, trisdinonylphenylphosphite, tris(2,4-di-t-butylphenyl)phosphite, tris(biphenyl)phosphite, distearylpentaerythritol diphosphite, di Examples include (2,4-di-t-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, tetratridecyl 4,4'-butylidenebis(3-methyl-6-t-butylphenol) diphosphite, hexatridecyl 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane triphosphite, 3,5-di-t-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium-bis(4-t-butylphenyl) phosphate, sodium-2,2-methylene-bis(4,6-di-t-butylphenyl) phosphate, 1,3-bis(diphenoxyphosphonyloxy)benzene, and ethylbis(2,4-di-tert-butyl-6-methylphenyl) phosphate. Furthermore, reaction products with phosphorus trichloride, 1,1'-biphenyl, and 2,4-bis(1,1-dimethylethyl)phenol can also be used as phosphorus-based antioxidants. In addition, oligomeric and polymeric compounds having phosphite structures can also be used.

[0038] Specific phosphorus-based antioxidants include Irgafos168, Irgastab FS301 FF (both manufactured by BASF), Adekastab PEP-8, Adekastab PEP-36, Adekastab PEP-36A, Adekastab HP-10, Adekastab 2112, Adekastab 2112RG, Adekastab 1178, Adekastab 1500, Adekastab C, Adekastab 135A, Adekastab 3010, Adekastab TPP, Adekastab AO-412S (all manufactured by ADEKA), GSY-P101 (manufactured by Sakai Chemical Industry Co., Ltd.), Nocrack TNP (manufactured by Ouchi Shinko Chemical Industry Co., Ltd.), and HOSTANOX P-EPQ (manufactured by Clariant Chemicals).

[0039] <Other additives that may be included in resin composition (X)> The resin composition (X) may contain other additives other than the phenolic additive (B1), sulfuric additive (B2), and phosphorus-based additive (B3), as long as the objectives of the present invention are not impaired. Examples of other additives include nucleating agents, antiblocking agents, pigments, dyes, fillers, lubricants, plasticizers, mold release agents, antioxidants (excluding phenolic additive (B1), sulfuric additive (B2), and phosphorus-based additive (B3); hereinafter also referred to as "other antioxidants"), flame retardants, antibacterial agents, surfactants, antistatic agents, weather stabilizers, heat stabilizers, anti-slip agents, foaming agents, crystallization aids, anti-fogging agents, anti-aging agents, hydrochloric acid absorbers, impact modifiers, crosslinking agents, co-crosslinking agents, crosslinking aids, adhesives, softeners, processing aids, and metal deactivators. These additives may be used individually or in combination of two or more.

[0040] The content of other additives that may be included in the resin composition (X) is preferably 20 parts by mass or less, more preferably 5 parts by mass or less, when the total of the 4-methyl-1-pentene polymer (A), phenolic additive (B1), sulfuric additive (B2), and phosphorus-based additive (B3) is 100 parts by mass. The content of other additives in the resin composition (X) may be 0 parts by mass, but may be 0.01 parts by mass or more when the total of the 4-methyl-1-pentene polymer (A), phenolic additive (B1), sulfuric additive (B2), and phosphorus-based additive (B3) is 100 parts by mass. Furthermore, the content of other additives that may be included in the resin composition (X) is preferably 2000 parts by mass or less, more preferably 500 parts by mass or less, when the total of the phenolic additive (B1), sulfuric additive (B2), and phosphorus-based additive (B3) is 100 parts by mass. The content of other additives in the resin composition (X) may be 0 parts by mass, but may be 1 part by mass or more when the total of the phenolic additive (B1), sulfuric additive (B2), and phosphorus-based additive (B3) is 100 parts by mass.

[0041] [Other antioxidants] Other antioxidants are not particularly limited as long as they are antioxidants other than phenolic additives (B1), sulfuric additives (B2), and phosphorus-based additives (B3). Examples of other antioxidants include hindered amine, benzotriazole, benzophenone, triazine, benzoate, benzimidazole, hydroxylamine, cyanoacrylate, and salicylic acid ester compounds, and known ultraviolet absorbers and antioxidants can be used. Since ultraviolet absorbers are organic compounds that have ultraviolet absorption functions, the above-mentioned other antioxidants may also include organic compounds that have ultraviolet absorption functions.

[0042] Compounds that act as hindered amine antioxidants (hindered amine light stabilizers) include poly[{6-(1,1,3,3-tetramethylbutyl)amino-1,3,5-triazine-2,4-diyl}{(2,2,6,6-tetramethyl-4-piperidyl)imino}hexamethylene{(2,2,6,6-tetramethyl-4-piperidyl)imino}], bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-bis (1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(N-methyl-2,2,6,6-tetramethyl-4-piperidyl)sebacate, N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,6-hexamethylenediamine, 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidyl)amino-N-(2, 2,6,6-tetramethyl-4-piperidyl)propionamide, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)(1,2,3,4-butanetetracarboxylate, poly[(6-morpholino-1,3,5-triazine-2,4-diyl){(2,2,6,6-tetramethyl-4-piperidyl)imino}hexamethin{(2,2,6,6-tetramethyl-4-piperidyl)imino}], dimethyl succinate and 1-(2-hydro Examples include polycondensates with oxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine and N,N'-4,7-tetrakis[4,6-bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino}-1,3,5-triazine-2-yl]-4,7-diazadecane-1,10-diamine. Other oligomeric and polymeric compounds having a hindered amine structure can also be used.

[0043] Specifically, hindered amine antioxidants (hindered amine light stabilizers) include CYASORB UV-3346, CYASORB UV-3529, CYASORB UV-3853 (all manufactured by Sun Chemical Co., Ltd.), Nocrack 224, Nocrack AW, Nocrack B, Nocrack PA, Nocrack ODA, Nocrack AD-F, Nocrack CD, Nocrack TD, Nocrack White, Nocrack DP, Nocrack 810-NA, Nocrack 6C, Nocrack G-1 (all manufactured by Ouchi Shinko Chemical Industry Co., Ltd.), Adekastab LA-52, Adekastab LA-57, Adekastab LA-63P, Adekastab LA-68, Adekastab LA- Examples include 72, Adeka Stab LA-77Y, Adeka Stab LA-77G, Adeka Stab LA-81, Adeka Stab LA-82, Adeka Stab LA-87, Adeka Stab LA-402AF, Adeka Stab LA-502XP (all manufactured by ADEKA), Tinuvin 111FDL, Tinuvin 123, Tinuvin 144, Tinuvin 292, Tinuvin 312, Tinuvin 700, Tinuvin 770, Tinuvin 5100, Chimassorb 119, Chimassorb 944, Chimassorb 2020 (all manufactured by BASF), HOSTAVIN N30, and Nylostab S-EED (all manufactured by Clariant Chemicals).

[0044] Examples of benzotriazole antioxidants include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2-hydroxy-3-t-butyl-5-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-t-octiphenyl)benzotriazole, 2-[2-hydroxy-3-(4,5,6,7-tetrahydro-1,3-dioxo-1H-isoindole-2-ylmethyl)-5-methylphenyl]-2H-benzotriazole, and 2-(2-hydroxy-3,5-di-t-pentylphenyl)benzotriazole. Other oligomeric and polymer-type compounds having a benzotriazole structure can also be used.

[0045] Specific examples of benzotriazole antioxidants include Tinuvin PS, Tinuvin99-2, Tinuvin 326, Tinuvin 327, Tinuvin 328, Tinuvin 384-2, Tinuvin900, Tinuvin928, and Tinuvin1130 (all manufactured by BASF), AdekaStab LA-29, AdekaStab LA-31RG, AdekaStab LA-31G, AdekaStab LA-32, AdekaStab LA-36, and AdekaStab LA-36RG (all manufactured by ADEKA), VIOSORB520, VIOSORB550, VIOSORB583, and VIOSORB590 (all manufactured by Kyodo Yakuhin Co., Ltd.), and Sumisorb200, Sumisorb250, Sumisorb300, Sumisorb340, and Sumisorb350 (all manufactured by Sumika Chemtex Co., Ltd.).

[0046] Examples of benzophenone-based antioxidants include 2-hydroxy-4-methoxybenzophenone, 2,4-dihydroxybenzophenone, 2-hydroxy-4-n-octoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone, and 2-hydroxy-4-chlorobenzophenone. Other oligomeric and polymer-type compounds having a benzophenone structure can also be used.

[0047] Examples of benzophenone-based antioxidants include UV-12 and UV-329 (both manufactured by Sun Chemical Co., Ltd.), Adeka Stab 1413 (manufactured by ADEKA Corporation), Viosorb 110 and Viosorb 130 (both manufactured by Kyodo Yakuhin Co., Ltd.), and Sumisorb 400 (manufactured by Sumika Chemtex Co., Ltd.).

[0048] Examples of triazine-based antioxidants include 2,4-bis(dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)1,3,5-triazine, 2,4-bis(allyl)-6-(2-hydroxyphenyl)1,3,5-triazine, 2-ethylhexanoic acid = 2-[3-hydroxy-4-(4,6-diphenyl-1,3,5-triazine-2-yl)phenoxy]ethyl, and 6,6',6''-(1,3,5-triazine-2,4,6-triyl)tris(3-hexyloxy-2-methylphenol). Other oligomeric and polymer-type compounds having a triazine structure can also be used.

[0049] Specific examples of triazine-based antioxidants include CYASORB UV-1164 (manufactured by Sun Chemical Co., Ltd.), ADEKA LA-46, ADEKA LA-F70 (both manufactured by ADEKA Corporation), and Tinuvin 400, Tinuvin 405, Tinuvin 460, Tinuvin 477, and Tinuvin 479 (all manufactured by BASF Corporation).

[0050] Examples of benzoate-based antioxidants include 2,4-di-t-butylphenyl-3,5-di-t-butyl-4-hydroxybenzoate and hexadecyl-3,5-di-t-butyl-4-hydroxybenzoate. Other oligomeric and polymer-type compounds having a benzoate structure can also be used.

[0051] Examples of benzoate-based antioxidants include Sumisorb 400 (manufactured by Sumika Chemtex Co., Ltd.) and CYASORB UV-2908 (manufactured by Sun Chemical Co., Ltd.).

[0052] Examples of benzimidazole-based antioxidants include 2-mercaptobenzimidazole and 2-mercaptomethylbenzimidazole. Other oligomeric and polymer-type compounds having a benzimidazole structure can also be used.

[0053] Examples of benzimidazole-based antioxidants include Nocrack MB, Nocrack MMB, and Nocrack MBZ (all manufactured by Ouchi Shinko Chemical Industry Co., Ltd.).

[0054] Examples of hydroxylamine-based antioxidants include dialkylamine oxides and dialkyl-N-methylamine oxides. Other oligomeric and polymer-type compounds having a hydroxylamine structure can also be used.

[0055] Specific examples of hydroxylamine-based antioxidants include IrgastabFS042 (manufactured by BASF) and GENOX EP (manufactured by Adivant).

[0056] Examples of salicylic acid ester antioxidants include phenyl salicylate, p-octylphenyl salicylate, and p-tert-butylphenyl salicylate. Other oligomer and polymer compounds having a salicylic acid ester structure can also be used.

[0057] These antioxidants can be used individually or mixed in any ratio as needed.

[0058] [Other antioxidants that have ultraviolet light absorbing properties] The resin composition (X) may contain, when using the aforementioned other antioxidants, substances among the aforementioned other antioxidants that have ultraviolet absorption properties. Examples of the aforementioned other antioxidants that have ultraviolet absorption properties include benzotriazole organic compounds, triazine organic compounds, benzophenone organic compounds, cyanoacrylate organic compounds, and salicylate organic compounds.

[0059] The content of the other antioxidants having ultraviolet absorption function is preferably 1 to 30% by mass, and more preferably 5 to 20% by mass, relative to the total amount of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3). When the content of the other antioxidants having ultraviolet absorption function relative to the total amount of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3) is within the above range, the material exhibits excellent heat aging resistance and weather resistance.

[0060] Among the other antioxidants having ultraviolet absorption function, the benzotriazole-based organic compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, a mixture of octyl-3[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole-2-yl)phenyl]propionate and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole-2-yl)phenyl]propionate, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, and 2-(3-t-butyl- Examples include 5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, ester compounds of 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxybenzenepropanoic acid with a C7-9 side chain or linear alcohol, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, and 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol.

[0061] More specifically, examples include BASF's "TINUVIN P," "TINUVIN PS," "TINUVIN 109," "TINUVIN 234," "TINUVIN 326," "TINUVIN 328," "TINUVIN 329," "TINUVIN 360," "TINUVIN 384-2," "TINUVIN 900," "TINUVIN 928," "TINUVIN 99-2," and "TINUVIN 1130," ADEKA's "ADEKA Stab LA-29," and Otsuka Chemical's "RUNA-93."

[0062] Among the other antioxidants having ultraviolet absorption function, examples of triazine-based organic compounds include 2-[4,6-di(2,4-xylyl)-1,3,5-triazine-2-yl]-5-octyloxyphenol, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, the reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and (2-ethylhexyl-glycidic acid ester), and 2,4-bis"2-hydroxy-4-butoxyphenyl"-6-(2,4-dibutoxyphenyl)-1,3-5-triazine.

[0063] More specifically, examples include "KEMISORB 102" from Chemipro Chemical Co., Ltd., "TINUVIN 400", "TINUVIN 405", "TINUVIN 460", "TINUVIN 477-DW", "TINUVIN 479", and "TINUVIN 1577" from BASF, "ADEKA LA-46" and "ADEKA LA-F70" from ADEKA Corporation, and "CYASORB UV-1164" from Sun Chemical Co., Ltd.

[0064] Among the other antioxidants having ultraviolet absorption function, examples of benzophenone-based organic compounds include 2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid hydrate, 2-hydroxy-4-n-octoxybenzophenone, and 2,2-di-hydroxy-4-methoxybenzophenone.

[0065] More specifically, examples include "KEMISORB 10," "KEMISORB 11," "KEMISORB 11S," "KEMISORB 12," and "KEMISORB 111" from Chemipro Chemical Co., Ltd., "SEESORB 101" and "SEESORB 107" from Cipro Chemical Co., Ltd., and "ADEKA Stub 1413" from ADEKA Corporation.

[0066] <4-methyl-1-pentene resin composition (X)> The total content of the phenolic additive (B1), the sulfur-based additive (B2), and the phosphorus-based additive (B3) per 100 parts by mass of the 4-methyl-1-pentene polymer (A) is 1.00 parts by mass or more. If the content is less than 1.00 part by mass, the desired heat aging resistance (thermal stability) may not be obtained. The total content of the phenolic additive (B1), the sulfur-based additive (B2), and the phosphorus-based additive (B3) per 100 parts by mass of the 4-methyl-1-pentene polymer (A) is preferably 1.05 parts by mass or more, and more preferably 1.10 parts by mass or more. The upper limit of this content is not particularly limited, but for example, it can be 2.00 parts by mass or less or 1.50 parts by mass or less.

[0067] The amount of the phenolic additive (B1) is preferably 0.01 to 1.00 parts by mass, more preferably 0.10 to 0.70 parts by mass, and even more preferably 0.20 to 0.50 parts by mass, per 100 parts by mass of the 4-methyl-1-pentene polymer (A). A resin composition (X) having the content of the phenolic additive (B1) within the above range per 100 parts by mass of the 4-methyl-1-pentene polymer (A) exhibits excellent heat aging resistance.

[0068] The amount of sulfur-based additive (B2) is preferably 0.10 to 1.50 parts by mass, more preferably 0.20 to 1.20 parts by mass, and even more preferably 0.30 to 1.00 parts by mass, per 100 parts by mass of 4-methyl-1-pentene polymer (A). A resin composition (X) having the sulfur-based additive (B2) content within the above range per 100 parts by mass of 4-methyl-1-pentene polymer (A) exhibits excellent heat aging resistance.

[0069] The amount of phosphorus-based additive (B3) is preferably 0.01 to 1.00 parts by mass, more preferably 0.10 to 0.50 parts by mass, and even more preferably 0.15 to 0.40 parts by mass, per 100 parts by mass of 4-methyl-1-pentene polymer (A). A resin composition (X) having the phosphorus-based additive (B3) content within the above range per 100 parts by mass of 4-methyl-1-pentene polymer (A) exhibits excellent heat aging resistance.

[0070] When the total amount of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3) is taken as 100% by mass, the content of the sulfuric additive (B2) is preferably 50% by mass or more, more preferably 50-60% by mass, and even more preferably 52-60% by mass. When the amount of the sulfuric additive (B2) relative to the total amount of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3) is within the above range, the heat aging resistance is improved.

[0071] Furthermore, when the total of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3) is taken as 100% by mass, the content of the phenolic additive (B1) is preferably 20 to 35% by mass or more, and more preferably 25 to 30% by mass. Moreover, when the total of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3) is taken as 100% by mass, the content of the phosphorus-based additive (B3) is preferably 10 to 30% by mass or more, and more preferably 15 to 23% by mass.

[0072] The heat aging time of the molded article of the resin composition (X), as measured by the method described in the examples below, is preferably 220 hours or more, more preferably 240 hours or more, even more preferably 255 hours or more, and particularly preferably 270 hours or more. The longer the heat aging time, the better, but it is usually 10,000 hours or less. When the heat aging time is within the above range, the resin composition (X) is less likely to age and less likely to yellow even when left in a high-temperature environment of about 190°C for a long time.

[0073] <Molded article of 4-methyl-1-pentene resin composition (X)> A molded article is obtained by molding the resin composition (X).

[0074] (1) Molding method Various known molding methods can be applied to the resin composition (X), including injection molding, extrusion molding, injection stretch blow molding, blow molding, cast molding, calendar molding, press molding, stamping molding, inflation molding, and roll molding. These molding methods allow for the processing of the desired molded articles, such as films, sheets, hollow molded articles, injection molded articles, and fibers. The molding conditions are the same as those for conventionally known 4-methyl-1-pentene polymers.

[0075] (2) Shape There are no particular restrictions on the shape of the molded article obtained from the resin composition (X). For example, it may be tubular, film-like, sheet-like, membrane-like, tape-like, plate-like, rod-like, fibrous, or nonwoven fabric-like, but film is preferred. In the following, "film" refers to a general term for planar molded products, and includes concepts such as sheets and tapes.

[0076] <Uses of 4-methyl-1-pentene resin composition (X)> Molded articles obtained from resin composition (X) can be used without restriction in applications where conventional 4-methyl-1-pentene polymers can be used, but are even more suitable for applications requiring heat aging resistance.

[0077] Examples of applications for molded articles obtained from resin composition (X) are listed below, but are not limited to these.

[0078] When the molded article obtained from the resin composition (X) is a container, examples of such containers include food containers, bottle containers, medical containers, animal cages, and laboratory equipment.

[0079] When a molded article obtained from a resin composition (X) is a packaging material, examples of such packaging materials include food packaging, pharmaceutical packaging, and cell culture bags. These packaging materials may be in the form of a film.

[0080] Other films besides the packaging materials mentioned above include, for example, release films, solar cell encapsulation sheets, battery separators, semiconductor process films, protective films, heat dissipation films, fiber composite films, release paper, and display films.

[0081] Other applications for molded articles obtained from resin composition (X) include, for example, mandrels, sheaths, hoses, tubes, interior and exterior building materials for vehicles, aircraft, and ships, electronic component encapsulation manufacturing, LED molds, high-frequency circuit applications, high-frequency cable applications, optical path wave path substrate applications, scientific and chemical laboratory equipment, medical equipment, health equipment components, sporting goods, shock absorbers, grip materials, home appliance components, adhesives, stationery, office supplies, and textiles.

[0082] Furthermore, the resin composition (X) is also suitably used in coating materials, films and sheets obtained by coating, release agents, hydrolytic agents, insulating films, adhesives, tacks, coated paper, transparent sealants, sealants, hot-melt adhesives, solvent-based adhesives, film-like adhesives, cloth tapes, kraft tapes, elastic adhesives, and the like.

[0083] Furthermore, the resin composition (X) can be processed into a fine powder by pulverization. The resulting fine powder can be used, for example, as an additive to ink compositions and paint compositions, as an additive to metallurgical powder compositions, as an additive to ceramic sintering powder compositions, as an additive to adhesives, as an additive to rubber, as a release agent for toner, as a mold release agent, and so on. Moreover, the resulting fine powder can be used as a resin additive for shafts, gears, cams, electrical components, camera components, automobile components, and household product components, as well as as a resin additive for waxes, greases, engine oils, fine ceramics, and plating. [Examples]

[0084] The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples.

[0085] ≪Methods for measuring the physical properties of polymers≫ <Content of constituent units in 4-methyl-1-pentene polymer (A)> The amount of constituent units derived from 4-methyl-1-pentene in the 4-methyl-1-pentene polymer (A), and the amount of constituent units derived from ethylene and α-olefins having 3 to 20 carbon atoms, are determined using the following apparatus and conditions: 13 The result was obtained from the 1C-NMR spectrum. A JEOL Ltd. ECP500 nuclear magnetic resonance spectrometer was used, with an orthodichlorobenzene / deuterated benzene (80 / 20 vol%) mixed solvent, a sample concentration of 55 mg / 0.6 mL, a measurement temperature of 120°C, and the observed nucleus was 13 The measurement was performed using C (125 MHz), a single-pulse proton decoupling sequence, a pulse width of 4.7 μs (45° pulse), a repetition time of 5.5 seconds, and an accumulation count of over 10,000 times, with 27.50 ppm as the reference value for chemical shift. 13 The composition of 4-methyl-1-pentene and α-olefin was quantified by 13C-NMR spectroscopy.

[0086] <Intrinsic viscosity [η]> The intrinsic viscosity [η] was measured at 135°C using decalin solvent. Specifically, approximately 20 mg of 4-methyl-1-pentene polymer (A) was dissolved in 15 ml of decalin, and the specific viscosity [η] was measured in an oil bath at 135°C. sp The specific viscosity η was measured. After diluting this decalin solution by adding 5 ml of decalin solvent, the specific viscosity η was measured in the same manner. sp The following was measured. This dilution procedure was repeated two more times, and when the concentration (C) was extrapolated to 0, the η was measured. sp The value of / C was determined as the intrinsic viscosity (see the formula below). [η] = lim(η) sp / C) (C→0)

[0087] <Melting point (Tm)> Using a Seiko Instruments DSC measuring instrument (DSC220C), approximately 5 mg of 4-methyl-1-pentene polymer (A) was packed into a measuring aluminum pan and heated to 290°C at 100°C / min. After holding at 290°C for 5 minutes, the temperature was lowered to -100°C at 10°C / min, and then heated again from -100°C to 290°C at 10°C / min. The melting point (Tm) was calculated from the peak of the crystal melting peak in the heat curve during the second heating cycle. If multiple melting peaks were detected during the second heating cycle, the one with the highest temperature was taken as the melting point (Tm).

[0088] [Manufacturing example] A 4-methyl-1-pentene polymer (A-1), which is a copolymer of 4-methyl-1-pentene, 1-hexadecene, 1-octadecene, and 1-octadecene, was obtained by changing the proportions of 4-methyl-1-pentene, 1-hexadecene, and 1-octadecene, in accordance with the polymerization method described in Comparative Example 3 of paragraph

[0159] of International Publication No. 2017 / 150265. The obtained 4-methyl-1-pentene polymer (A-1) contained 97.3 mol% of structural units derived from 4-methyl-1-pentene and 2.7 mol% of structural units derived from 1-hexadecene and 1-octadecene. Its intrinsic viscosity [η] was 2.3 dl / g, and its melting point (Tm) was 223°C.

[0089] <Raw materials> The following raw materials were used in the following examples and comparative examples. [4-methyl-1-pentene polymer (A-1)] As the 4-methyl-1-pentene polymer (A), the 4-methyl-1-pentene polymer (A-1) produced in the production example was used.

[0090] [Phenolic additive (B1)] As phenolic additives (B1), "SumilizerGA-80" (manufactured by Sumitomo Chemical Co., Ltd.) and "Irganox1010" (manufactured by BASF Corporation) were used. "SumilizerGA-80" is a semi-hindered phenolic additive, while "Irganox1010" is a hindered phenolic additive.

[0091] [Sulfur-based additive (B2)] As the sulfur-based additive (B2), "ADEKA Stab AO-412S" (manufactured by ADEKA Corporation) was used.

[0092] [Phosphorus-based additive (B3)] "ADEKA Stab PEP-8" (manufactured by ADEKA Corporation) was used as the phosphorus-based additive (B3).

[0093] <Example 1> [Preparation of resin composition (X-1) and molding of square plate] To 100 parts by mass of the 4-methyl-1-pentene polymer (A-1) obtained in the above production example, additives were added in the types and amounts listed in Table 1 and thoroughly mixed. Then, using a twin-screw extruder (manufactured by Ikegai Co., Ltd., model number: PCM43, screw diameter 43 mmφ), the mixture was granulated under the conditions of a cylinder setting temperature of 280°C, a resin extrusion rate of 20 kg / hour, and a rotation speed of 150 rpm to obtain pellets (resin composition (X-1)). The obtained resin composition (X-1) was injected into a 2 mm thick rectangular plate shape using a 70-ton injection molding machine (M70B) manufactured by Meiki Seisakusho Co., Ltd., under the conditions of cylinder temperature: 280°C and mold temperature: 60°C.

[0094] [Evaluation of thermal stability (OIT)] The thermal stability of the samples obtained above was evaluated by measuring the heat aging time using a spectrophotometer.

[0095] The following describes the method for measuring heat aging time. First, a molded body obtained by injection molding of resin composition (X-1) was placed in a constant temperature oven, and dry air was supplied while the oven was heated to 190°C. At regular intervals, the molded body was removed, and the YI value was measured using a Conical Nomita CM-3700A spectrophotometer with a D65 light source under the conditions of reflectance measurement and SCI (including specular reflection) method, before being returned to the constant temperature oven. The YI value is the yellow index value and is an indicator of the yellowing of the resin. The above procedure was repeated, and the time from the start of dry air introduction until the YI value reached 120 or higher was determined as the heat aging time. The results are shown in Table 1.

[0096] <Comparative Examples 1-4> Resin compositions and molded articles were prepared in the same manner as in Example 1, except that the types and amounts of additives listed in Table 1 were changed, and the heat aging time was evaluated. The results are shown in Table 1.

[0097] [Table 1]

[0098] ≪Results≫ The heat aging time of Example 1, which contained a phenolic additive (B1), a sulfuric additive (B2), and a phosphorus-based additive (B3), and whose total content was 1.00 parts by mass or more, was longer than that of Comparative Examples 1 and 2, in which the total content of the additives was less than 1.00 parts by mass. Furthermore, even though the total content of the additives was 1.00 parts by mass or more, the heat aging time of Example 1 was longer than that of Comparative Example 4, which did not contain the phosphorus-based additive (B3). In addition, Comparative Examples 3 and 4 show that when semi-hindered phenolic additives are used, the heat aging time tends to be longer than when hindered phenolic additives are used.

Claims

1. 4-methyl-1-pentene polymer (A), Phenolic additive (B1), Sulfur-based additive (B2), Phosphorus-based additive (B3), Includes, A 4-methyl-1-pentene resin composition (X) wherein the total content of the phenolic additive (B1), the sulfuric additive (B2), and the phosphorus-based additive (B3) is 1.00 parts by mass or more per 100 parts by mass of the 4-methyl-1-pentene polymer (A).

2. The 4-methyl-1-pentene resin composition (X) according to claim 1, wherein the phenolic additive (B1) comprises a semi-hindered phenolic antioxidant.

3. The 4-methyl-1-pentene resin composition (X) according to claim 1 or 2, wherein when the total of the phenolic additive (B1), the sulfur-based additive (B2), and the phosphorus-based additive (B3) is 100% by mass, the content of the sulfur-based additive (B2) is 50% by mass or more.

4. A molded article comprising the 4-methyl-1-pentene resin composition (X) according to claim 1 or 2.

5. The molded article according to claim 4, which is a film.

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