Heating device

Abstract

To provide a heating device that can efficiently heat a heating element. [Solution] The heating element 20 includes a multilayer film 22 that generates heat by the absorption and release of hydrogen, a sealed container housing the heating element 20, an introduction line for introducing a hydrogen-containing gas into the sealed container, an outlet line for releasing the gas used to generate heat in the heating element 20 due to the absorption and release of hydrogen in the heating element 20, a piezoelectric element 31 provided on the heating element 20 that vibrates and generates heat when an AC voltage is applied, and a power supply 19 that applies an AC voltage to the piezoelectric element 31.

Description

Technical Field

[0001] The present invention relates to a heating device.

Background Art

[0002] In recent years, a heating device has been proposed that includes a sealed container to which a gas containing hydrogen is supplied, a heating element that generates heat by hydrogen absorption and release, and a heater that heats the heating element (see Patent Document 1). The heating element and the heater are housed in the space inside the sealed container. In the heating device of Patent Document 1, after hydrogen is absorbed by the heating element, evacuation inside the sealed container and heating of the heating element are performed, so that hydrogen permeates through the interface of different substances by quantum diffusion in the heating element, or hydrogen diffuses through the interface of different substances by quantum diffusion, generating excess heat.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the heating device disclosed in Patent Document 1, a gap is provided between the heater and the heating element. Therefore, the heating element cannot be efficiently heated by the heater.

[0005] An object of the present invention is to provide a heating device capable of efficiently heating a heating element.

Means for Solving the Problems

[0006] The heating device according to the present invention comprises a heating element including a multilayer film that generates heat by the absorption and release of hydrogen, a sealed container housing the heating element, an introduction line for introducing a hydrogen-containing gas into the sealed container, an outlet line for discharging the gas that has been used to generate heat in the heating element by the absorption and release of hydrogen in the heating element, a piezoelectric element provided on the heating element that vibrates and generates heat when an AC voltage is applied, and a power supply for applying an AC voltage to the piezoelectric element. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a heating device that can efficiently heat a heating element. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic diagram illustrating the configuration of a heat utilization system equipped with a heat generating device according to the first embodiment. [Figure 2] This is a cross-sectional view showing the configuration of a heating module included in a heating device according to the first embodiment. [Figure 3] This is a cross-sectional view showing the configuration of a heating module included in a heating device according to the second embodiment. [Figure 4] This is a cross-sectional view showing the configuration of a heating module included in a heating device according to the third embodiment. [Figure 5] This is a cross-sectional view showing the configuration of a heating module included in a heating device according to the fourth embodiment. [Modes for carrying out the invention]

[0009] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the following description and drawings, common components are denoted by the same reference numerals. Descriptions of components denoted by the same reference numerals will be omitted as appropriate.

[0010] (1) Heating device and heat utilization system according to the first embodiment Figure 1 is a schematic diagram illustrating the configuration of a heat utilization system 1 equipped with a heat generating device 3 according to the first embodiment. In Figure 1, the heat utilization system 1 comprises a piping route 2 through which a heat exchange medium flows, a heat generating device 3 that heats the heat medium flowing through the piping route 2, and a heat utilization device 4 that utilizes the heat medium heated by the heat generating device 3 as a heat source. The heat generating device 3 and the heat utilization device 4 are incorporated into the piping route 2. The piping route 2 forms a circulation path between the heat generating device 3 and the heat utilization device 4.

[0011] As a heat transfer medium, a gas or liquid can be used, and one with excellent thermal conductivity and chemical stability is preferred. Examples of gases include helium, argon, hydrogen, nitrogen, water vapor, air, and carbon dioxide. Examples of liquids include water, molten salts (such as KNO3 (40%)-NaNO3 (60%)), and liquid metals (such as Pb). Alternatively, a multiphase heat transfer medium in which solid particles are dispersed in a gas or liquid may be used. The solid particles may be metals, metal compounds, alloys, or ceramics. Examples of metals include Cu, Ni, Ti, and Co. Examples of metal compounds include oxides, nitrides, and silicides of the above metals. Examples of alloys include stainless steel and chromium-molybdenum steel. Examples of ceramics include alumina. In this embodiment, helium gas is used as the heat transfer medium, but it can be appropriately changed without departing from the spirit of the present invention.

[0012] The heating device 3 comprises a sealed container 5, a hydrogen tank 6 connected to the sealed container 5, a vacuum pump 7 connected to the sealed container 5, and a heating module 8 housed in the sealed container 5.

[0013] The sealed container 5 has heat resistance and pressure resistance. The sealed container 5 is made of, for example, stainless steel or heat-resistant non-ferrous alloy steel. The material used for the sealed container 5 is appropriate to the operating temperature. For example, stainless steel is used when the operating temperature is up to about 700°C, and heat-resistant non-ferrous alloy steel is used when the operating temperature exceeds 700°C. The sealed container 5 is formed in a cylindrical shape. The sealed container 5 consists of a body, an upper lid provided at the upper end of the body, and a lower lid provided at the lower end of the body. The upper end of the body is airtightly closed with the upper lid, and the lower end of the body is airtightly closed with the lower lid, thereby partitioning the space 9 inside the sealed container 5. The shape of the sealed container 5 is not limited to a cylindrical shape, but may also be elliptical, rectangular, spherical, etc. In the heating device 3, the upper lid side of the sealed container 5 is considered the upper side, and the lower lid side of the sealed container 5 is considered the lower side. The sealed container 5 houses the heating element 20 (see Figure 2), which will be described later.

[0014] The heating device 3 has an introduction pipe 10 that connects the sealed container 5 and the hydrogen tank 6, and an exhaust pipe 11 that connects the sealed container 5 and the vacuum pump 7. The introduction pipe 10 extends from the bottom lid of the sealed container 5 and is connected to the hydrogen tank 6, guiding the hydrogen-based gas stored in the hydrogen tank 6 into the internal space 9 of the sealed container 5. The introduction pipe 10 constitutes an introduction line for introducing hydrogen-containing gas (hydrogen-based gas) into the sealed container 5. The exhaust pipe 11 extends from the top lid of the sealed container 5 and is connected to the vacuum pump 7, guiding the hydrogen-based gas that is drawn from the internal space 9 of the sealed container 5 to the vacuum pump 7. The exhaust pipe 11 constitutes an outlet line for dischargering the hydrogen-containing gas (hydrogen-based gas) that has been used to generate heat in the heating element 20 through the absorption and release of hydrogen in the heating element 20, which will be described later.

[0015] The inlet pipe 10 has a supply valve 12 installed between the sealed container 5 and the hydrogen tank 6. The supply valve 12 adjusts the flow rate of the hydrogen-based gas flowing through the inlet pipe 10. For example, an electromagnetic valve or an air valve can be used for the supply valve 12. The inlet pipe 10 may also have a pressure sensor that detects the pressure of the hydrogen-based gas flowing through the inlet pipe 10.

[0016] The exhaust pipe 11 has an exhaust valve 13 provided between the sealed container 5 and the vacuum pump 7. For the exhaust valve 13, for example, an electromagnetic valve, an air valve, or the like is used. The exhaust pipe 11 may have a pressure sensor that detects the pressure of the space 9 inside the sealed container 5 through which the exhaust pipe 11 flows.

[0017] When the exhaust valve 13 is closed and the supply valve 12 is opened, it becomes possible to supply a hydrogen-based gas from the hydrogen tank 6 to the space 9 inside the sealed container 5. When the supply valve 12 is closed and the exhaust valve 13 is opened, it becomes possible to discharge the hydrogen-based gas in the space 9 inside the sealed container 5 by the vacuum pump 7.

[0018] The hydrogen tank 6 stores a hydrogen-based gas. In this example, when the supply valve 12 is opened, the hydrogen-based gas is supplied from the high-pressure hydrogen tank 6 to the low-pressure space 9 inside the sealed container 5 through the introduction pipe 10. The hydrogen-based gas is a gas containing isotopes of hydrogen. As the hydrogen-based gas, at least one of deuterium gas and light hydrogen gas is used. The light hydrogen gas includes a mixture of naturally existing light hydrogen and deuterium, that is, a mixture in which the abundance ratio of light hydrogen is 99.985% and the abundance ratio of deuterium is 0.015%. The introduction pipe 10 may have a pump that sends out the hydrogen-based gas stored in the hydrogen tank 6 to the space 9 inside the sealed container 5.

[0019] The vacuum pump 7 discharges the hydrogen-based gas from the inside of the sealed container 5 through the exhaust pipe 11. By driving the vacuum pump 7, the space 9 inside the sealed container 5 is decompressed. The vacuum pump 7 is composed of, for example, a turbo molecular pump and a dry pump. The turbo molecular pump adjusts the rotational speed of the turbine blades based on a control signal input from a control unit 14 described later. The decompression speed of the space 9 is adjusted according to the rotational speed of the turbo molecular pump.

[0020] The piping path 2 is connected to a storage container 15 that stores the sealed container 5 of the heat generating device 3. The storage container 15 has heat insulation properties and pressure resistance. The storage container 15 is formed, for example, from stainless steel, heat-resistant non-ferrous alloy steel, etc. As the material of the storage container 15, a material corresponding to the use temperature is used. For example, when the use temperature is up to about 700°C, stainless steel is used, and when the use temperature exceeds 700°C, heat-resistant non-ferrous alloy steel is used.

[0021] The heat medium flowing into the interior of the storage container 15 from the piping path 2 flows along the outer surface of the sealed container 5 stored inside the storage container 15 and is heated by the heat generating module 8 housed in the sealed container 5. The temperature of the heat medium rises inside the storage container 15, and a high-temperature heat medium is obtained. The high-temperature heat medium flows out from the storage container 15 into the piping path 2 and flows into the heat utilization device 4.

[0022] The heat utilization device 4 includes a power generation unit 42 that generates electricity based on the heat medium (helium gas in this example) heated by the heat generating device 3, a pressure pump 43 that sends out the heat medium from the power generation unit 42 toward the storage container 15, and a flow control valve 44 provided between the pressure pump 43 and the storage container 15.

[0023] The power generation unit 42 includes a compressor (not shown) that compresses the high-temperature heat medium supplied from the storage container 15, a gas turbine 42a that is driven based on the high-temperature and high-pressure heat medium compressed by the compressor, and a generator 42b connected to the gas turbine 42a. In the power generation unit 42, the temperature of the heat medium is adjusted, for example, within a range of 600°C or higher and 1500°C or lower. The output shaft of the gas turbine 42a is connected to the input shaft of the generator 42b. When the turbine blades of the gas turbine 42a rotate, the rotor of the generator 42b is driven, and electricity is generated (power generation) by the generator 42b. The heat medium that has been used for heat in the power generation unit 42 flows out from the power generation unit 42 and flows into the pressure pump 43.

[0024] The pressure pump 43 sends the heat transfer medium supplied from the power generation unit 42 towards the containment vessel 15 at a predetermined pressure. For example, a metal bellows pump is used for the pressure pump 43.

[0025] The flow control valve 44 adjusts the flow rate of the heat transfer medium flowing from the pressure pump 43 to the containment vessel 15. For example, a variable leak valve is used for the flow control valve 44.

[0026] The heating device 3 includes a temperature sensor 17 that detects the temperature of the heating module 8, and a control unit 14 that is electrically connected to a vacuum pump 7, a supply valve 12, an exhaust valve 13, the temperature sensor 17, and a power supply 19. The temperature sensor 17 outputs a detection signal that identifies the detected temperature. The control unit 14 includes, for example, a microprocessor (MPU) that performs arithmetic processing based on application programs stored in read-only memory (ROM) or other storage units, and random access memory (RAM) that temporarily holds programs and data during arithmetic processing.

[0027] The control unit 14 outputs control signals to control the operation of the vacuum pump 7, supply valve 12, exhaust valve 13, and power supply 19, respectively, based on the detection signal output from the temperature sensor 17. The vacuum pump 7, supply valve 12, exhaust valve 13, and power supply 19 operate based on the control signals input from the control unit 14.

[0028] The control unit 14 closes the supply valve 12, opens the exhaust valve 13, and drives the vacuum pump 7 to discharge (vacuum evacuum) the hydrogen-based gas from the space 9 inside the sealed container 5.

[0029] The control unit 14 stops the operation of the vacuum pump 7, closes the exhaust valve 13, and opens the supply valve 12, thereby supplying hydrogen-based gas to the space 9 inside the sealed container 5.

[0030] Figure 2 is a cross-sectional view showing the configuration of the heat-generating module 8. The heat-generating module 8 comprises a heat-generating element 20 that generates heat by the absorption and release of hydrogen, and a piezoelectric element 31 provided on the heat-generating element 20.

[0031] The heating element 20 comprises a support 21 (also referred to as a "base") made of a hydrogen-absorbing metal, hydrogen-absorbing alloy, or proton conductor, and a multilayer film 22 provided on the support 21. The multilayer film 22 has a first layer 23 less than 1000 nm thick made of a hydrogen-absorbing metal or hydrogen-absorbing alloy, and a second layer 24 less than 1000 nm thick made of a hydrogen-absorbing metal, hydrogen-absorbing alloy, or ceramic different from the first layer 23. A heterogeneous material interface 25 is formed between the first layer 23 and the second layer 24, and between the support 21 and the multilayer film 22. The heterogeneous material interface 25 allows hydrogen atoms to pass through. The heating element 20 generates excess heat when hydrogen atoms pass through the heterogeneous material interface 25 by quantum diffusion, or when hydrogen atoms diffuse through the heterogeneous material interface 25 by quantum diffusion. As the heating element 20, heating elements disclosed in International Publications WO2018 / 230447, WO2020 / 122097, WO2020 / 122098, etc., can be used. The detailed configuration, function, and manufacturing method of the heating element 20 are the same as those disclosed in International Publications WO2018 / 230447, WO2020 / 122097, WO2020 / 122098, etc., and therefore will not be explained here.

[0032] Excess heat generation in the heating element 20 occurs when the heating element 20 is heated above a predetermined temperature. In this embodiment, the piezoelectric element 31 of the heating module 8 heats the heating element 20. The predetermined temperature is, for example, 300°C or higher, more preferably 500°C or higher, and even more preferably 600°C or higher.

[0033] The piezoelectric element 31 vibrates and generates heat when an AC voltage is applied. Specifically, the piezoelectric element 31 has polarization within its crystal lattice and deforms due to the electric potential (inverse piezoelectric effect). In addition, the piezoelectric element 31 generates an electric potential when subjected to external stress (piezoelectric effect).

[0034] The piezoelectric element 31 is bonded to the support 21 and the electrode 32. The piezoelectric element 31 is provided between the support 21 and the electrode 32. The support 21 is connected to the power supply 19 via a conductive wire 18a, and the electrode 32 is connected to the power supply 19 via a conductive wire 18b. In other words, the piezoelectric element 31 is connected to the power supply 19 via the support 21 and the conductive wire 18a, and also via the electrode 32 and the conductive wire 18b.

[0035] The power supply 19 is capable of outputting an AC voltage. The power supply 19 is capable of adjusting the frequency of the AC voltage and outputs an AC voltage in the range of several Hz to several MHz. The support 21 is formed from a conductive material. Therefore, the AC voltage output from the power supply 19 is applied to the piezoelectric element 31 via the support 21. In addition to the AC voltage, the power supply 19 may also be capable of outputting a continuous voltage fluctuation of a square wave (square wave voltage).

[0036] When the power supply 19 applies an AC voltage to the piezoelectric element 31, the piezoelectric element 31 repeatedly deforms and vibrates at the frequency of the applied AC voltage, generating heat. Since the piezoelectric element 31 is mounted on the support 21 of the heating element 20, the heat generated by the piezoelectric element 31 is transferred to the heating element 20 without the need for a fluid. Therefore, the heating element 20 can be heated efficiently. In addition to heating by the piezoelectric element 31, the vibration is expected to accelerate the reaction of hydrogen taken into the heating element 20.

[0037] The heat generation temperature of the piezoelectric element 31 is, for example, 300°C or higher, more preferably 500°C or higher, and even more preferably 600°C or higher.

[0038] The heating element 20 includes a support 21 that supports the multilayer film 22. The support 21 is provided between the multilayer film 22 and the piezoelectric element 31. Therefore, the support 21 weakens the vibrations of the piezoelectric element 31 and transmits them to the multilayer film 22. Thus, damage to the multilayer film 22 due to vibrations of the piezoelectric element 31 can be prevented, and damage to the heating element 20 can be prevented.

[0039] The power supply 19 applies an alternating current to the piezoelectric element 31 via the support 21. Therefore, the support 21 also serves as an electrode. Consequently, there is no need to provide an electrode separate from the support 21, which simplifies the heating module 8 and the heating device 3.

[0040] The piezoelectric element 31 may be formed from an oxide-based piezoelectric material, but it is preferable that it be formed from a nitride-based piezoelectric material. In this case, the piezoelectric element 31 can withstand high temperatures of 900°C or higher. Therefore, even if the temperature of the piezoelectric element 31 exceeds 900°C due to excessive heat from the heating element 20, damage to the piezoelectric element 31 can be prevented, and the heat resistance of the heating device 3 can be improved.

[0041] Examples of nitride-based piezoelectric materials include aluminum nitride (AlN), scandium aluminum nitride (ScAlN), gallium nitride (GaN), and magnesium niobium nitride (MgNbN). Examples of oxide-based piezoelectric materials include lead zirconate titanate (PZT) and lanthanum nickelate (LaNiO3, abbreviated as LNO).

[0042] The heating element 20 and the piezoelectric element 31 can be integrally molded using a semiconductor process. Therefore, the manufacturing process of the heating module 8 can be automated using a semiconductor process, making it easy to manufacture the heating module 8. Furthermore, by automating the manufacturing of the heating module 8 using a semiconductor process, contamination-free manufacturing becomes possible, as well as high-precision processing. The shape of the piezoelectric element 31 deposited on the heating element 20 may be a polygonal shape such as a square or rhombus, a circle, an ellipse, a comb-shaped shape, etc.

[0043] The temperature sensor 17 shown in Figure 1 has, for example, a thermocouple provided on the heating element 20 (see Figure 2) to detect the temperature of the heating element 20. The temperature sensor 17 may also have, for example, a thermocouple provided on the piezoelectric element 31 (see Figure 2) to detect the temperature of the piezoelectric element 31.

[0044] The control unit 14 controls the heating temperature of the piezoelectric element 31 (see Figure 2) in the heating module 8 by controlling the power output from the power supply 19. By controlling the heating temperature of the piezoelectric element 31, it is possible to maintain the temperature of the heating element 20 within the optimal temperature range for heating (for example, 50°C to 1500°C).

[0045] The operation and effects of the heating device 3 according to this embodiment will now be explained. First, the exhaust valve 13 is opened and the vacuum pump 7 is driven. The space 9 inside the sealed container 5 is evacuated by vacuum. The vacuum pump 7 is stopped, the exhaust valve 13 is closed, and the power supply 19 is driven. An AC voltage is applied to the piezoelectric element 31 from the power supply 19 via conductive wires 18a and 18b. The piezoelectric element 31 generates heat when the AC voltage is applied, heating the heating element 20 without the need for a fluid.

[0046] When the temperature of the heating element 20 rises to 300°C, the supply valve 12 is opened, and hydrogen-based gas flows from the hydrogen tank 6 into the space 9 inside the sealed container 5. The space 9 inside the sealed container 5 is filled with hydrogen-based gas. The heating element 20 absorbs hydrogen. Specifically, hydrogen molecules in space 9 are adsorbed onto the surface of the multilayer film 22 of the heating element 20 (the side opposite to the support 21), and these hydrogen molecules dissociate into two hydrogen atoms. Then, the dissociated hydrogen atoms penetrate (absorb) into the interior of the multilayer film 22.

[0047] After hydrogen is absorbed into the heating element 20, the supply valve 12 is closed. The output of the power supply 19 is controlled so that the temperature of the heating element 20 is set to any temperature within the optimal temperature range for heating (for example, around 700°C). At this time, the exhaust valve 13 is opened and the vacuum pump 7 is driven. Hydrogen-based gas is discharged from the space 9 inside the sealed container 5. The heating element 20 releases hydrogen. Specifically, hydrogen atoms that have penetrated into the multilayer film 22 return to the surface of the multilayer film 22, recombine, and are released as hydrogen molecules. As a result, hydrogen atoms permeate the heterogeneous interface 25 by quantum diffusion, or hydrogen atoms diffuse through the heterogeneous interface 25 by quantum diffusion, generating excess heat in the heating element 20. The excess heat from the heating element 20 heats the heat transfer medium flowing along the outer surface of the sealed container 5. The excess heat recovered by the heat transfer medium is used as thermal energy.

[0048] As described above, the piezoelectric element 31 is provided on the heating element 20. Therefore, the heat generated by the piezoelectric element 31 is transferred to the heating element 20 without the need for a fluid. Consequently, the heating device 3 can efficiently heat the heating element 20.

[0049] The heat utilization system 1 uses a heat transfer medium heated by a heat generating device 3 equipped with a heat generating element 20 that generates heat by the absorption and release of hydrogen as a heat source, thus enabling the supply of energy inexpensively, cleanly, and safely.

[0050] The present invention is not limited to the embodiments described above, and can be modified as appropriate without departing from the spirit of the invention. Other embodiments will be described below. In the drawings and descriptions of other embodiments, the same or equivalent components and members as in the above embodiments will be denoted by the same reference numerals. Descriptions that overlap with the above embodiments will be omitted as appropriate, and the descriptions will focus on configurations that differ from the above embodiments.

[0051] (2) Heating device and heat utilization system according to the second embodiment Figure 3 is a cross-sectional view showing the configuration of the heat-generating module 8A included in the heat-generating device 3A according to the second embodiment. The schematic diagram of the heat utilization system according to this embodiment is substantially the same as the schematic diagram of the heat utilization system 1 shown in Figure 1, so its illustration is omitted here.

[0052] As shown in Figure 3, the heating module 8A includes a first substrate 33 provided between the support 21 and the piezoelectric element 31, and a second substrate 34 provided between the electrode 32 and the piezoelectric element 31. The first substrate 33 and the second substrate 34 are, for example, silicon substrates. The first substrate 33 and the second substrate 34 may also be sapphire substrates. The first substrate 33 may be a silicon substrate and the second substrate 34 may be a sapphire substrate, or the first substrate 33 may be a sapphire substrate and the second substrate 34 may be a silicon substrate.

[0053] In this embodiment as well, the piezoelectric element 31 is provided on the heating element 20 via the first substrate 33. Therefore, the heat generated by the piezoelectric element 31 is transferred to the heating element 20 without the need for a fluid. Consequently, the heating device 3A can efficiently heat the heating element 20.

[0054] The heat utilization system uses a heat transfer medium heated by a heat generating device 3A, which is equipped with a heat generating element 20 that generates heat by the absorption and release of hydrogen, as a heat source, thus enabling the supply of energy inexpensively, cleanly, and safely.

[0055] (3) Heating device and heat utilization system according to the third embodiment Figure 4 is a cross-sectional view showing the configuration of the heat generation module 8B included in the heat generation device 3B according to the third embodiment. The schematic diagram of the heat utilization system according to this embodiment is substantially the same as the schematic diagram of the heat utilization system 1 shown in Figure 1, so its illustration is omitted here.

[0056] As shown in Figure 4, in the heating module 8B, the piezoelectric element 31B has a surface 35 that is smaller than the surface 26 of the support 21, and surface 35 is bonded to surface 26 of the support 21. In other words, the piezoelectric element 31B is divided and deposited over an area smaller than the area of ​​surface 26 of the heating element 20. The electrode 32B has a surface 37 that is the same size as the surface 36 of the piezoelectric element 31B, and surface 37 is bonded to surface 36 of the piezoelectric element 31B.

[0057] In this embodiment as well, the piezoelectric element 31B is provided on the heating element 20. Therefore, the heat generated by the piezoelectric element 31B is transferred to the heating element 20 without the need for a fluid. Consequently, the heating device 3B can efficiently heat the heating element 20.

[0058] The heat utilization system uses a heat transfer medium heated by a heat generating device 3B, which is equipped with a heat generating element 20 that generates heat by the absorption and release of hydrogen, as a heat source, thus enabling the supply of energy inexpensively, cleanly, and safely.

[0059] (4) Heating device and heat utilization system according to the fourth embodiment Figure 5 is a cross-sectional view showing the configuration of the heat generation module 8C provided in the heat generation device 3C according to the fourth embodiment. The schematic diagram of the heat utilization system according to this embodiment is substantially the same as the schematic diagram of the heat utilization system 1 shown in Figure 1, so its illustration is omitted here.

[0060] As shown in Figure 5, the heating module 8C further comprises a heating element 20C. The piezoelectric element 31 is provided between the support 21 of the heating element 20 and the support 21C of the heating element 20C, and is bonded to the support 21 and the support 21C. The support 21C is made of a conductive material and is connected to the power supply 19 via a conductive wire 18b.

[0061] In this embodiment as well, the piezoelectric element 31 is provided on the heating element 20 and the heating element 20C. Therefore, the heat generated by the piezoelectric element 31 is transferred to the heating element 20 and the heating element 20C without the need for a fluid. Consequently, the heating device 3C can efficiently heat the heating element 20 and the heating element 20C.

[0062] The heat utilization system uses a heat transfer medium heated by a heating device 3C, which includes a heating element 20 and a heating element 20C that generate heat through the absorption and release of hydrogen, as a heat source, thus enabling the supply of energy inexpensively, cleanly, and safely. [Explanation of symbols]

[0063] 3, 3A, 3B, 3C heating device 5. Airtight container 10 Introductory tube 11 Exhaust pipe 12 Supply valve 13 Exhaust valve 19 Power supply 20°C heating element 21, 21C support 22 Multilayer film 31, 31B Piezoelectric element

Claims

1. A heating element containing a multilayer film that generates heat through the absorption and release of hydrogen, A sealed container for housing the heating element, An introduction line for introducing a gas containing hydrogen into the aforementioned sealed container, A discharge line for dischargeing the gas that has been used to generate heat in the heating element by the absorption and release of hydrogen in the heating element, A piezoelectric element provided on the heating element, which vibrates and generates heat when an AC voltage is applied, The system comprises a power supply for applying an AC voltage to the piezoelectric element, Heating device.

2. The heating element further comprises a support that supports the multilayer film, The support is provided between the multilayer film and the piezoelectric element. The heating device according to claim 1.

3. The support is formed from a conductive material, The power supply applies an AC voltage or a square wave voltage to the piezoelectric element via the support. The heating device according to claim 2.

4. The piezoelectric element is formed from a nitride-based piezoelectric material. The heating device according to claim 1.

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