Electrical circuits

Abstract

In the manufacturing process of electrical circuits using conductive ink, the use of an insulating layer contributes to making it easier to set the electrical characteristics of the electrical circuit. [Solution] The electrical circuit 1 is an electrical circuit in which a semiconductor element 11 having one or more metal connection terminals 110, which is coated with conductive ink 14 that changes from a non-conductive state to a conductive state in response to the application of a predetermined physical change, is stacked on a non-conductive circuit board 10 such that at least one of the one or more connection terminals 110 is in contact with the conductive ink 14, and an insulating layer 13 is applied to a predetermined area including at least a portion of the area where the conductive ink 14 is applied, thereby applying a physical change, and exhibits electrical characteristics based on the pattern of the predetermined area.

Description

Technical Field

[0001] The present invention relates to an electric circuit.

Background Art

[0002] In the production of electric circuit boards, a method using conductive ink has been developed. For example, there is a semiconductor chip mounting method in which a circuit pattern is formed by printing conductive ink on a base material, a semiconductor chip having bump electrodes is aligned thereon, and then the bump electrodes are connected to the circuit pattern by heating and pressing, and the bottom surface of the semiconductor chip and the surface of the substrate are molded with an insulating resin (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the technique of Patent Document 1 described above (hereinafter, the prior art), an insulating layer is used to mold a semiconductor chip after performing a heat treatment on the conductive ink, but there is a problem in the method of using the insulating layer in the process of generating an electric circuit by performing a heat treatment on the conductive ink.

[0005] An object of the present invention is to provide an electric circuit that contributes to making it possible to easily set the electrical characteristics of the electric circuit by using an insulating layer in the manufacturing process of an electric circuit using conductive ink.

Means for Solving the Problems

[0006] An electrical circuit according to one aspect of the present invention is an electrical circuit in which a conductive ink that changes from a non-conductive state to a conductive state in response to the application of a predetermined physical change is applied, and semiconductor elements having one or more metal connection terminals are stacked on a non-conductive circuit board such that at least one of the one or more connection terminals is in contact with the conductive ink, and an insulating layer is applied to a predetermined area including at least a portion of the area where the conductive ink is applied, and the electrical characteristics are based on the pattern of the predetermined area. [Effects of the Invention]

[0007] According to the present invention, in the manufacturing process of an electrical circuit using conductive ink, the use of an insulating layer can contribute to easily setting the electrical characteristics of the electrical circuit. [Brief explanation of the drawing]

[0008] [Figure 1] This figure shows an example of the configuration of an electrical circuit according to Embodiment 1 of the present invention. [Figure 2] This figure shows an example of the manufacturing process for an electrical circuit according to Embodiment 1 of the present invention. [Figure 3] This figure shows an example of an electrical circuit in which an insulating layer is applied to a first predetermined area and a second predetermined area coated with conductive ink. [Figure 4] This figure shows examples of circuit patterns when a physical change is applied to a first predetermined area and a second predetermined area coated with conductive ink, with an insulating layer covering them. [Figure 5] This figure shows another example of an electrical circuit in which an insulating layer is applied to a first predetermined area and a second predetermined area coated with conductive ink. [Figure 6] The figure shows other examples of circuit patterns when a physical change is applied to a first predetermined area and a second predetermined area coated with conductive ink, and an insulating layer is applied over them. [Figure 7] This figure shows another first example of the manufacturing process for an electrical circuit according to Embodiment 1 of the present invention. [Figure 8]This figure shows another second example of the manufacturing process for an electrical circuit according to Embodiment 1 of the present invention. [Figure 9] This figure shows a third example of the manufacturing process for an electrical circuit according to Embodiment 1 of the present invention. [Modes for carrying out the invention]

[0009] (The circumstances leading to the invention of one aspect of the present invention)

[0010] Conventional technology involves using a conductive ink containing a heat-reactive adhesive resin, and then applying a heat treatment to the conductive pattern formed by the conductive ink and the semiconductor element to bond and fix the conductive pattern to the electrodes of the semiconductor element, thereby electrically connecting them.

[0011] In such cases, in conventional technology, to compensate for the weak degree of adhesive fixation using adhesive resin, an insulating layer is used to further mold the semiconductor element and fix it to the circuit board. In other words, adhesive fixation based solely on heat-reactive adhesive resin is insufficient for bonding the conductive pattern to the semiconductor element.

[0012] In this regard, the inventors of the present invention first found that it is useful to adhere the circuit pattern formed by the conductive ink to the semiconductor element by adhesive bonding based on metallic bonding using copper particles and copper hydride contained in the conductive ink and the metal connection terminals of the semiconductor element. On the other hand, when a physical change such as heating is applied to the circuit board containing the conductive ink and semiconductor element, the copper particles contained in the conductive ink are heated red-hot and changed into copper oxide (CuO), which causes a problem in which the resistance value of the circuit pattern formed by the conductive ink increases.

[0013] Therefore, the inventors of the present invention conceived of an electrical circuit in which the electrical characteristics of the electrical circuit can be easily set by using an insulating layer in the manufacturing process of an electrical circuit using conductive ink, and thus invented one aspect of the present invention.

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments, components having the same function are denoted by the same reference numerals, and redundant descriptions are omitted. The embodiments described below show a specific example of the present disclosure. The configurations shown in the embodiments, the processes in the flowcharts, the order of the processes, etc. are examples and do not limit the technology of the present disclosure.

[0015] (Embodiment 1) The configuration of the electric circuit 1 according to this embodiment will be described with reference to FIG. 1 and the like. FIG. 1 is a diagram showing an example of the configuration of the electric circuit 1 according to Embodiment 1 of the present invention. FIG. 1(a) is a plan view showing the semiconductor element 11 laminated on the circuit board 10 as seen from above, and FIG. 1(b) is a front view of the electric circuit 1.

[0016] In FIG. 1, the electric circuit 1 includes a non-conductive circuit board 10, a semiconductor element 11 having one or more metal connection terminals 110, a circuit pattern 12 that has changed from a non-conductive state to a conductive state in response to applying a predetermined physical change to the conductive ink 12 applied to the circuit board 10, and an insulating layer 13 covering part or all of the conductive ink. In the present disclosure, the semiconductor element 11 may also mean including the connection terminal 110.

[0017] As shown in FIG. 1, the circuit pattern 12 is a state in which the insulating layer 13 covers a range including at least a predetermined range of the conductive ink, and the conductive ink has changed to a conductive state by applying a physical change such as heating. In FIG. 1(a), the circuit pattern 12 is covered with the insulating layer 13 and is shown by a dotted line for convenience of explanation. Note that the conductive ink 14 described later in FIG. 2 may be in a state where it is applied to the circuit board 10 and dried to remove unnecessary organic solvents.

[0018] Note that the heights, widths, depths, etc., dimensions, shapes, and arrangements of the circuit board 10, semiconductor element 11, circuit pattern 12, and insulating layer 13 in FIGS. 1(a) and 1(b) are merely examples, and unless otherwise specified below, the scope of the present disclosure is not limited by their specific details. For example, the number of connection terminals 110 included in the semiconductor element 11 shown in FIG. 1 is an example and is not limited thereto. For example, in FIG. 1(b), each of the connection terminals 110a and 110b of the semiconductor element 11 is laminated on the conductive inks 12a and 12b, and a gap is provided between the circuit board 10 and the connection terminals 110. However, for example, at least a part of the semiconductor element 11 such as the connection terminals 110 may be in contact with the circuit board 10.

[0019] The circuit board 10 may be, for example, a planar substrate. In the present disclosure, the planar substrate may mean a substrate whose shape is not fixed to be curved. For example, the material of the circuit board 10 may be paper, epoxy resin, polyimide, PET (polyethylene terephthalate), polymer film, or the like. The material of the circuit board 10 is an example, and the scope of the present disclosure is not limited by its specific details.

[0020] The semiconductor element 11 may be an element having one or more metal connection terminals 110. As shown in FIGS. 1(a) and 1(b), the semiconductor element 11 may be mounted on the circuit board 10 such that at least one of the one or more connection terminals 110 is in contact with the conductive ink. The semiconductor element 11 may be an element having functions such as a transistor, resistor, capacitor, or the like. The semiconductor element 11 may be referred to as a semiconductor chip. Note that the type of the semiconductor element 11 may be, for example, a surface mount component or the like, and the material of the semiconductor element 11 may be, for example, silicon germanium, gallium nitride, or the like. The scope of the present disclosure is not limited by the specific details of the type or material of the element.

[0021] As will be described in detail later, the circuit pattern 12 corresponds to at least a predetermined range of the pattern within the area to which conductive ink 14, which changes from a non-conductive state to a conductive state in response to the application of a predetermined physical change, is applied. It may also be a pattern in which the conductive ink 14 changes from a non-conductive state to a conductive state by applying a physical change such as heating to at least that predetermined range. The circuit pattern 12, that is, the pattern within the predetermined range, affects the electrical characteristics of the electrical circuit 1.

[0022] In this disclosure, the application of a predetermined physical change may be sintered by heating to a predetermined temperature or higher. When heating to a predetermined temperature or higher, a predetermined range described later may be heated using a thermal print. In the following description, the application of a predetermined physical change is described as performing a heat treatment, but this is just an example and is not limited to this; for example, it may be a heat treatment and a pressurizing treatment.

[0023] The conductive ink 14 for forming the circuit pattern 12 may be made of a material containing particles of a predetermined metal and a hydride of said metal. The metal particles may be fine particles having electrical conductivity, for example, copper particles. In this case, the metal hydride may be copper hydride (CuH), which is a copper hydride. Furthermore, the conductive ink 14 may contain an organic solvent that uniformly disperses and holds the conductive particles, such as the metal particles. Depending on the material and content of the conductive particles, the conductive ink 14 may exhibit conductivity by, for example, heating or sintering at a high temperature as a predetermined physical change.

[0024] The insulating layer 13 may be an insulator whose surface is at least substantially covered with a non-conductive material. The material of the insulating layer 13 may be, for example, polyvinyl chloride, fluororesin, paper, or wood, and the scope of this disclosure is not limited by the specific material. As described later, the insulating layer 13 may cover at least a predetermined area of ​​the area to which the conductive ink 14 is applied in a process of applying a physical change such as heating to an object containing the conductive ink 14. By doing so, when the insulating layer 13 is applied to an area including at least a predetermined area of ​​the area to which the conductive ink 12 is applied and a physical change is applied, an electrical circuit 1 exhibiting electrical characteristics based on the pattern of the predetermined area can be formed.

[0025] In other words, specifically, for example, a physical change may be applied to an object containing conductive ink 12 while the insulating layer 13 covers a predetermined area, which is the entire area where conductive ink 12 is applied. In this case, the insulating layer 13 does not need to cover the area on the circuit board 10 where conductive ink 12 is not applied. The insulating layer 13 may cover part or all of the area on the circuit board 10 where conductive ink 12 is not applied.

[0026] Alternatively, for example, a physical change may be applied to an object containing the conductive ink 12 while the insulating layer 13 covers a predetermined area, which is a part of the area where the conductive ink 12 is applied. In this case, the insulating layer 13 does not need to cover the area on the circuit board 10 where the conductive ink 12 is not applied. On the other hand, in this case, the insulating layer 13 may cover part or all of the area on the circuit board 10 where the conductive ink 12 is not applied. That is, a physical change may be applied to an object containing the conductive ink 12 while the insulating layer 13 covers a predetermined area that includes the first part of the area where the conductive ink 12 is applied, but does not include the second part, and all or part of the area on the circuit board 10 where the conductive ink 12 is not applied. Further details will be described later.

[0027] Figure 2 shows an example of the manufacturing process of an electrical circuit according to Embodiment 1 of the present invention. As shown in Figure 2(a), conductive ink 14 is applied to a circuit board 10, and a semiconductor element 11 having one or more metal connection terminals 110 may be stacked so that at least one of the connection terminals is in contact with the conductive ink 14. Next, as shown in Figure 2(b), at least a predetermined area of ​​the area where the conductive ink 14 is applied may be covered with an insulating layer 13. Furthermore, as shown in Figure 2(c), a physical change such as heating may be applied to an object containing at least the conductive ink 14, and the conductive ink 14 may be sintered to form a circuit pattern 12 corresponding to the predetermined area.

[0028] The configuration and manufacturing process of the electrical circuit 1 according to this embodiment have been described above with reference to Figures 1 and 2.

[0029] In this disclosure, the insulating layer 13 only needs to cover a predetermined area of ​​at least a portion of the area to which the conductive ink 14 is applied during a process in which a physical change such as heating is applied to the conductive ink 14. Specifically, for example, when a physical change such as heating is applied to the conductive ink 14, which contains copper particles and copper hydride, the resistance of the circuit pattern 12 usually increases due to the presence of copper hydride. However, when a physical change is applied with the conductive ink 14 covered by the insulating layer 13 as in this disclosure, the copper hydride decomposes into copper and gaseous hydrogen, and copper is produced by a chemical reaction between gaseous hydrogen and copper oxide, thus reducing the resistance of the circuit pattern 12.

[0030] Furthermore, if the insulating layer 13 covers the area where the connection terminal 110 of the semiconductor element 11 and the conductive ink 14 come into contact, the circuit pattern 12 corresponding to a predetermined pattern and the metal connection terminal 110 may be fixed together by metallic bonding between the metal contained in the connection terminal 110, the copper particles contained in the conductive ink 14, and the copper generated during the heating process of the conductive ink 14.

[0031] In other words, the predetermined range includes the area in which at least one of the one or more connection terminals is in contact with the conductive ink 12, and the pattern in the predetermined range and the connection terminal 110 may be fixed together by a metallic bond. This makes it possible to firmly fix the semiconductor element 11 to the electrical circuit 1 without relying on a mold using an insulator.

[0032] Figure 3 shows an example of an electrical circuit in which an insulating layer is applied to a first predetermined area and a second predetermined area coated with conductive ink 14. Figure 4 shows an example of each circuit pattern 12 when a physical change is applied to the first predetermined area and the second predetermined area coated with conductive ink 14 and covered with an insulating layer.

[0033] The following explanation, with reference to Figures 3 and 4, describes how a circuit pattern 12 is formed in a predetermined area covered by the insulating layer 13 when a physical change is applied while the conductive ink 14 is covered by the insulating layer 13.

[0034] As shown in Figure 3(a), for example, when a physical change is applied to an object containing conductive ink 14 while a portion of the area coated with conductive ink 14 is covered with an insulating layer 13, a circuit pattern 12 corresponding to the portion blacked out in Figure 4(a) may be formed. In this case, in Figure 4(a), the area 15 enclosed by the dashed line adjacent to the circuit pattern 12 is an area where the conductive ink 14 has been sintered, but it is an area with a high copper oxide content and exhibits high resistance, and its substantial contribution to the electrical characteristics exhibited by the circuit pattern 12 is small.

[0035] On the other hand, as shown in Figure 3(b), for example, if a physical change is applied to an object containing the conductive ink 14 while the entire area coated with conductive ink 14 is covered with an insulating layer 13, a circuit pattern 12 corresponding to the entire area blacked out in Figure 4(b) may be formed. In this case, the electrical characteristics of the circuit pattern 12 in Figure 4(b) may have an inductance component or a conductance component added to them, compared to the electrical characteristics of the circuit pattern 12 in Figure 4(a).

[0036] Although the insulating layer 13 is not shown in Figures 4(a) and (b), for example, in the manufacturing process of the electrical circuit 1, the insulating layer 13 that covers the conductive ink 14 when a physical change is applied may be fixed to the circuit pattern 12 after the physical change is applied, or it may be separated, as will be described later. This explanation may also be applied to the explanation of Figure 6, which will be described later.

[0037] Figures 3 and 4 illustrate how the electrical characteristics of the electrical circuit 1 change when a portion of the area coated with conductive ink 14 is covered with the insulating layer 13, and when the entire area coated with conductive ink 14 is covered with the insulating layer 13. However, for example, the electrical characteristics may be controlled by covering a first portion of the area coated with conductive ink 14 with the insulating layer 13, and covering a second portion different from the first portion with the insulating layer 13.

[0038] Figure 5 shows another example of an electrical circuit in which an insulating layer is applied to a first predetermined area and a second predetermined area coated with conductive ink. Figure 6 shows another example of the circuit patterns when a physical change is applied when an insulating layer is applied to the first predetermined area and the second predetermined area coated with conductive ink.

[0039] As shown in Figure 5(a), for example, when a physical change is applied to an object containing conductive ink 14 while a first portion of the area coated with conductive ink 14 is covered with an insulating layer 13, a circuit pattern 12 corresponding to the first portion area blacked out in Figure 6(a) may be formed. In this case, in Figure 6(a), the area 15 enclosed by the dashed line adjacent to the circuit pattern 12 is an area where the conductive ink 14 has been sintered, but it is an area with a high copper oxide content and exhibits high resistance, and its substantial contribution to the electrical characteristics exhibited by the circuit pattern 12 is small.

[0040] On the other hand, as shown in Figure 5(b), for example, if a physical change is applied to an object containing conductive ink 14 while a second portion different from the first portion of the area coated with conductive ink 14 is covered with an insulating layer 13, a circuit pattern 12 corresponding to the area of ​​the second portion blacked out in Figure 6(b) may be formed. In such a case, for example, when the electrical circuit 1 is connected to a circuit not shown, the connection configuration with the circuit not shown may be selectable by whether to form the circuit pattern 12 in Figure 6(a) or the circuit pattern 12 in Figure 6(b).

[0041] In other words, the electrical circuit 1 may exhibit first electrical characteristics when the insulating layer 13 covers a first predetermined area, and on the other hand, when the insulating layer 13 covers a second predetermined area different from the first predetermined area, it may exhibit second electrical characteristics different from the first electrical characteristics.

[0042] Furthermore, in Figures 4(a) and 6, even if the region 15 enclosed by the dashed line is covered with an insulating layer of the same material as the insulating layer 13 or a different material, and even if a physical change such as heating is applied to the object including region 15, the electrical characteristics exhibited by the electrical circuit 1 do not change. That is, when the insulating layer covers a first predetermined range and a physical change is applied, the first electrical characteristics are exhibited. On the other hand, when the insulating layer covers a first predetermined range and a physical change is applied, and furthermore, when the insulating layer covers a third predetermined range that includes the first predetermined range but is different from the first predetermined range, the first electrical characteristics may also be exhibited.

[0043] The above explanation, with reference to Figures 3 to 6, describes how, when a physical change is applied to the conductive ink 14 covered by the insulating layer 13, a circuit pattern 12 corresponding to a predetermined area covered by the insulating layer 13 is formed.

[0044] As described above, the electrical circuit 1 is an electrical circuit in which a semiconductor element 11 having one or more metal connection terminals 110, which is coated with conductive ink that changes from a non-conductive state to a conductive state in response to the application of a predetermined physical change, is stacked on a non-conductive circuit board 10 such that at least one of the one or more connection terminals 110 is in contact with the conductive ink, and an insulating layer 13 is applied to a range including at least a predetermined range of the area where the conductive ink is applied, thereby applying a physical change, and may exhibit electrical characteristics based on a predetermined range pattern 12.

[0045] This makes it possible to easily set the electrical characteristics of an electrical circuit by using an insulating layer in the manufacturing process of an electrical circuit using conductive ink.

[0046] In other words, by selectively covering a predetermined area of ​​conductive ink 14 applied to a non-conductive circuit board 10 with an insulating layer 13, and then applying a physical change such as sintering, the area covered with the insulating layer 13 can be formed as a circuit pattern 12. The circuit pattern 12 exhibits electrical characteristics on the circuit board 10 that correspond to the shape of the predetermined pattern covering the insulating layer 13. For example, the resistance, capacitance, and inductance values ​​of the circuit pattern 12 connected to the semiconductor element 11 can be set according to the shape of the circuit pattern 12.

[0047] The insulating layer 13 may be fixed to a predetermined area, and a physical change may be applied to the predetermined area to which the insulating layer 13 is fixed. That is, after the conductive ink 14 is applied to the circuit board 10, the insulating material constituting the insulating layer 13 may be applied so as to cover the conductive ink 14. The timing of the placement of the semiconductor element 11 on the circuit board 10 may be before or after the insulating material is applied to the conductive ink 14.

[0048] In such cases, as described above, the circuit pattern 12 can be selectively formed by selecting a portion of the area to which the conductive ink 14 is applied and applying an insulating material to that portion. Specifically, the circuit pattern 12 can be freely selected by selecting the area to which the insulating layer 13 is applied after the conductive ink 14 has been applied and before any physical change is applied. That is, the predetermined area may further be a selected portion of the area to which the conductive ink 14 is applied.

[0049] On the other hand, if the insulating layer 13 covers the conductive ink 14 and a physical change is applied, and then the conductive ink 14 is subjected to a treatment such as heating, resulting in the formation of the circuit pattern 12, the insulating layer 13 may be separated from the circuit pattern 12.

[0050] Figure 7 shows another first example of the manufacturing process of an electrical circuit according to Embodiment 1 of the present invention. As shown in Figure 7(a), when conductive ink 14 is applied to a circuit board 10 and a semiconductor element 11 is installed, an insulating layer 13 may be provided so as to cover the circuit board 10, the conductive ink 14, and the semiconductor element 11. In this case, as shown in Figure 7(c), a physical change such as heating may be applied to the object including at least the conductive ink 14, and a circuit pattern 12 may be formed based on the conductive ink 14. Then, as shown in Figure 7(d), the insulating layer 13 may be separated after a physical change has been applied to the conductive ink 14, etc. That is, the insulating layer 13 may be temporarily adhered to a predetermined area, and after a physical change is applied to the predetermined area to which the insulating layer 13 is temporarily adhered, the insulating layer 13 may be separated from the predetermined area. The predetermined area may further be the entire area to which the conductive ink 14 is applied.

[0051] In such cases, the insulating layer 13 may be, for example, an insulating material applied to the conductive ink 14, or an insulating material temporarily laminated to cover the conductive ink 14 and the semiconductor element 11.

[0052] Figure 8 shows another second example of the manufacturing process of an electrical circuit according to Embodiment 1 of the present invention. For example, as shown in Figure 8(a), the insulating layer 13 may be pressed and brought into contact with the conductive ink 14 and semiconductor element 11 applied to the circuit board 10 from above. Then, as shown in Figure 8(b), while the insulating layer 13 is covering the object containing the conductive ink 14, a physical change such as heating may be applied to separate the insulating layer 13, as shown in Figure 8(c). In this case, the insulating layer 13 may be, for example, an elastic press material containing an insulator as its material.

[0053] The function of applying a physical change to the conductive ink 14 may be provided by the insulating layer 13, or by a separate component not shown. This explanation may also be applicable to the following explanation.

[0054] Figure 9 shows a third example of the manufacturing process of an electrical circuit according to Embodiment 1 of the present invention. For example, as shown in Figure 9(a), a circuit board 10 on which conductive ink 14 is applied and semiconductor elements 11 are mounted may be transported toward an elastic insulating layer 13 by a transport device such as a belt conveyor. Then, as shown in Figure 9(b), with the insulating layer 13 covering the object containing the conductive ink 14, a physical change such as heating may be applied, and as shown in Figure 9(c), the circuit board 10 may be transported toward the insulating layer 13 by a transport device such as a belt conveyor.

[0055] As described above with reference to Figures 8 and 9, the insulating layer 13 is elastic, and when the semiconductor element 11 is pressed against the circuit board 10 by the insulating layer 13, a physical change may be applied to a predetermined range.

[0056] Furthermore, for purposes such as preventing external damage to the semiconductor element 11, an insulating film may be applied to the semiconductor element 11 after the circuit pattern 12 has been formed. In other words, the semiconductor element 11 may be fixed to the circuit board 10 by a film different from the insulating layer 13 when a physical change is applied to the circuit board 10.

[0057] Furthermore, the thickness to which the conductive ink 14 is applied may be changed in at least a portion of the area to which the conductive ink 14 is applied to adjust the resistance value. For example, if the resistance of the metal particles used in the conductive ink 14 is low, the film thickness of the conductive ink 14 may be partially reduced to make it easier to obtain a higher resistance value.

[0058] Furthermore, when heating the conductive ink 14, for example, the sintering process may be shortened to a shorter time than predetermined to increase the resistance per unit length by resulting in an insufficiently sintered state of the conductive ink 14. This allows for a wider range of resistance adjustment by controlling the sintering state of the conductive ink 14. In addition, to finely control the resistance per unit length, instantaneous heating may be performed on the sintered area one or more times to stably and finely control the resistance per unit length. By controlling the sintering state in this way, the resistance per unit length can be controlled more broadly and precisely, enabling the realization of a wide range of resistance values.

[0059] In the above description of the embodiments, explanations of known technologies related to each function and each information processing have been omitted.

[0060] In the above explanation, "at least one of A, B, and C is included" may also mean "one or two or more of A, B, and C are included." [Industrial applicability]

[0061] The circuit board according to the present invention is effective for all technologies related to electrical circuits. [Explanation of Symbols]

[0062] 1. Electrical Circuit 10 Circuit boards 11 Semiconductor devices 12 Circuit Patterns 13 Insulating layer 14 Conductive ink 110 Metal connector

Claims

1. An electrical circuit is formed by applying the physical change to a non-conductive circuit board, on which a semiconductor element having one or more metal connectors is mounted such that at least one of the one or more connectors is in contact with the conductive ink, and covering a predetermined area including at least a portion of the area on which the conductive ink is applied with an insulating layer. The electrical characteristics are based on the pattern within the predetermined range. Electrical circuit.

2. The application of the aforementioned physical change is sintering by heating to a predetermined temperature or higher. The circuit board according to claim 1.

3. The conductive ink comprises particles of a predetermined metal and a hydride of the said metal. The circuit board according to claim 1.

4. The predetermined range includes the range in which at least one of the one or more connection terminals is in contact with the conductive ink, and the pattern in the predetermined range and the connection terminal are fixed by a metallic bond. The electrical circuit according to claim 1.

5. When the insulating layer covers a first predetermined area, it exhibits first electrical characteristics. On the other hand, when the insulating layer covers a second predetermined range different from the first predetermined range, it exhibits second electrical characteristics different from the first electrical characteristics. The electrical circuit according to claim 1.

6. When the insulating layer is covered over a first predetermined area and the physical change is applied, the first electrical characteristics are observed. On the other hand, when the insulating layer covers the first predetermined range and the physical change is applied, and further, when the insulating layer covers a third predetermined range that includes the first predetermined range but is different from the first predetermined range, the first electrical characteristics are exhibited. The electrical circuit according to claim 1.

7. The insulating layer is fixed to the predetermined range, and the physical change is applied to the predetermined range to which the insulating layer is fixed. The electrical circuit according to claim 1.

8. The predetermined range is further a selected portion of the range to which the conductive ink is applied. The electrical circuit according to claim 7.

9. The insulating layer is temporarily in close contact with the predetermined range, and after the physical change is applied to the predetermined range to which the insulating layer is temporarily in contact, the insulating layer is separated from the predetermined range. The electrical circuit according to claim 1.

10. The predetermined range further includes the entire range to which the conductive ink is applied. The electrical circuit according to claim 9.

11. The insulating layer is elastic, and the physical change is applied to the predetermined range when the semiconductor element is pressed against the circuit board by the insulating layer. The electrical circuit according to claim 9.

12. The semiconductor element is fixed to the circuit board by a coating different from the insulating layer when the physical change is applied to the circuit board. The circuit board according to claim 1.

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