Immersion cooling assembly for controlling the temperature of electronic devices inside a vehicle
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-01-30
- Publication Date
- 2026-08-14
Smart Images
Figure 2026131592000001_ABST
Abstract
Description
Technical Field
[0001] This specification generally relates to devices for controlling the temperature of an electronic device in a mobile environment, and more particularly, to devices for controlling the temperature of an electronic device that reduces sloshing of a liquid coolant in a mobile environment.
Background Art
[0002] Immersion cooling systems for electronic devices are typically used in a fixed environment, such as a building floor, server rack, and / or an equivalent thereof, supported by a fixed environment. The use of an immersion cooling system for an electronic device in a mobile environment, such as a mobile environment supported by a moving vehicle, can cause sloshing of the liquid coolant and reduce cooling performance.
[0003] Therefore, there is a need for a device for controlling the temperature of an electronic device that reduces sloshing of a liquid coolant in a mobile environment.
Summary of the Invention
[0004] In one embodiment, an immersion cooling assembly for controlling the temperature of an electronic device in a mobile environment includes a tank and a liquid coolant disposed within the tank. The immersion cooling assembly includes a first electronic device disposed within the tank and at least partially immersed in the liquid coolant. The immersion cooling assembly includes a second electronic device disposed within the tank and at least partially immersed in the liquid coolant, the second electronic device being spaced apart from the first electronic device along a lateral direction. The immersion cooling assembly includes a perforated baffle disposed within the tank between the first electronic device and the second electronic device along the lateral direction and at least partially immersed in the liquid coolant. The perforated baffle is configured to break up coolant vapor bubbles formed in the liquid coolant caused by heat generated by the first electronic device or the second electronic device and / or reduce sloshing of the liquid coolant.
[0005] In another embodiment, an immersion cooling assembly for controlling the temperature of an electronic device in a moving environment includes a tank and a liquid coolant disposed within the tank. The immersion cooling assembly includes an electronic device disposed within the tank and immersed in the liquid coolant. The immersion cooling assembly includes a perforated baffle disposed within the tank directly above the electronic device and at least partially immersed in the liquid coolant. The perforated baffle is configured to break gaseous bubbles in the coolant and / or reduce sloshing of the liquid coolant caused by the heat generated by the electronic device.
[0006] These and additional features provided by the embodiments described herein will be better understood by referring to the following detailed description in conjunction with the drawings. While specific embodiments are specified, it will be understood that elements of one described embodiment may be combined with elements of separately specified embodiments. [Brief explanation of the drawing]
[0007] [Figure 1] Figure 1 schematically shows a perspective view of a vehicle having an exemplary immersion cooling assembly according to one or more embodiments shown and described herein. [Figure 2] Figure 2 schematically shows a cross-sectional view of an exemplary immersion cooling assembly of Figure 1 according to one or more embodiments shown and described herein. [Figure 3] Figure 3 schematically shows a cross-sectional view of another exemplary immersion cooling assembly according to one or more embodiments shown and described herein. [Figure 4] Figure 4 schematically illustrates the grid structure used in an exemplary immersion cooling assembly. [Modes for carrying out the invention]
[0008] The embodiments shown in the drawings are essentially illustrative and exemplary, and are not intended to limit the subject matter of the present application as defined by the claims. The following detailed description of the exemplary embodiments can be better understood in conjunction with the following drawings, in which similar structures are indicated by the same reference numerals.
[0009] Embodiments described herein relate to immersion cooling assemblies for controlling the temperature of electronic devices in a moving environment such as a vehicle. The immersion cooling assembly generally includes a tank, a liquid coolant disposed within the tank, one or more electronic devices disposed within the tank and at least partially immersed in the liquid coolant, and one or more perforated baffles disposed within the tank and at least partially immersed in the liquid coolant. The perforated baffles can control the kinematics of the liquid coolant to reduce or eliminate, for example, sloshing of the liquid coolant, thereby increasing the heat transfer efficiency when removing heat from the electronic devices. Various embodiments of immersion cooling assemblies for controlling the temperature of electronic devices in a vehicle are described in more detail herein.
[0010] The terms relating to direction used herein (e.g., up, down, right, left, front, back, upper side, lower side) are used solely for reference to what is depicted in the drawings and are not intended to mean absolute directions. The terms “vertical,” “up,” “down,” and / or their equivalents mean the vertical direction of an exemplary immersion cooling assembly (i.e., the + / -Y direction as shown in Figures 2 and 3). That is, the term “up” is generally defined as pointing in the positive Y direction of the coordinate axes shown in the drawings. “Down” is generally defined as pointing in the negative Y direction of the coordinate axes shown in the drawings. The term “lateral” and their equivalents generally mean directions perpendicular to the vertical (i.e., the + / -Y direction as shown in Figures 2 and 3), such as generally the front-back direction and / or generally the left-right direction.
[0011] A range can be expressed herein as "approximately" from one specific value and / or "approximately" from another specific value. When such a range is expressed, another embodiment includes one specific value and / or another specific value. Similarly, when a value is expressed as an approximation by the use of the antecedent "approximately," it will be understood that a specific value forms another embodiment. Furthermore, it will be understood that each endpoint of a range is important in relation to the other endpoints, and also important when viewed independently of the other endpoints.
[0012] In this specification, the singular forms "a," "an," and "the" are interpreted as including the plural form unless the context clearly indicates otherwise. Therefore, for example, a reference to a component "a" includes embodiments having two or more such components unless the context clearly indicates otherwise.
[0013] Wherever possible, the same reference numeral is used throughout the drawing to refer to the same or similar parts.
[0014] Referring to Figure 1, a vehicle 10 having an exemplary immersion cooling assembly 12 is schematically depicted. The immersion cooling assembly 12 is configured to utilize a liquid coolant 14 as a heat transfer medium to control the temperature of one or more electronic devices 16, 18 ( schematically shown in Figures 2 and 3).
[0015] Vehicle 10 is, for example, a car, van, sports utility vehicle, bus, boat, airplane, and / or other type of vehicle configured for transportation. Vehicle 10 operates in autonomous mode, i.e., with or without limited human input. An exemplary immersion cooling assembly 12 is supported by, for example, the vehicle 10, under the bonnet 11 in the front vehicle compartment 13 (illustrated), in the rear vehicle compartment (not shown), supported by, for example, the roof of the vehicle, and in a housing that includes sensors for autonomous operation of Vehicle 10, such as cameras, LIDAR sensors and / or equivalents thereof (not shown), or in other suitable structures of Vehicle 10, and is fixed to, for example, Vehicle 10. An exemplary immersion cooling assembly 12 is shown schematically and is not shown to an exact scale, for example, relative to the indicated size of Vehicle 10.
[0016] Referring to Figures 2 and 3, one or more electronic devices 16, 18 facilitate the operation of various components and / or systems of the vehicle 10 that depend on each of the one or more electronic devices 16, 18 for information processing, analysis, generation of electronic commands and / or similar processing. For example, but not limited to, the operation of the vehicle 10 in autonomous mode. For example, each of the one or more electronic devices 16, 18 is configured to analyze image data (e.g., captured by a camera or LIDAR device 15), identify objects around the vehicle 10, and navigate the vehicle 10 to avoid contact with the identified objects, but is not limited to these.
[0017] The liquid coolant 14 includes, but is not limited to, water, ethylene glycol (EG), propylene glycol (PG), and / or equivalents thereof. The liquid coolant 14 may be a dielectric liquid that provides electrical insulation to one or more electronic devices 16, 18. For example, the liquid coolant 14 includes mineral oil, n-hexane, n-heptane, natural castor oil ester, refined dried castor oil, Hatcol® 5005 synthetic ester, silicone oil, Fluorinert® FC-72, Novec® 649, Novec 7100, polychlorinated biphenyls, purified water, liquid nitrogen, liquid helium, liquid argon, or other suitable dielectric liquids.
[0018] The exemplary immersion cooling assembly 12 is a single-phase or two-phase cooler. As a single-phase cooler, the liquid coolant 14 maintains a single-phase state, i.e., a liquid state. In other words, when the exemplary immersion cooling assembly 12 is a single-phase cooler, the liquid coolant 14 maintains a liquid phase state during operation, and its temperature simply changes as it removes heat from one or more electronic devices 16, 18. As a two-phase cooler, the liquid coolant 14 changes its phase state, i.e., from liquid to gas and from gas to liquid. In other words, when the exemplary immersion cooling assembly 12 is a two-phase cooler, the liquid coolant 14 may change from a liquid state to a gaseous state as it removes heat from one or more electronic devices 16, 18. The liquid coolant 14 changes state to a gas when heated to its boiling point. For example, water as the liquid coolant 14 changes phase from liquid to gas when heated to 100°C by one or more electronic devices 16, 18 at a pressure of 1 atmosphere (atm).
[0019] Continuing to refer to Figures 2 and 3, the exemplary immersion cooling assembly 12 includes a tank 20 for containing a liquid coolant 14 and supporting one or more components of the exemplary immersion cooling assembly 12, such as electronic devices 16, 18. The tank 20 includes, for example, a base 22 and side walls 24 joined to and extending from the base 22. The side walls 24 surround the base 22. For example, pairs of side walls 24 spaced apart from each other along the lateral direction (i.e., the + / -X direction) extend upward from both ends of the base 22 along the vertical direction (i.e., the + / -Y direction), but are not limited to these. Another pair of side walls 24 (not shown) are spaced apart from each other along directions perpendicular to both the lateral (i.e., + / -X direction) and vertical (i.e., + / -Y direction) directions, extending upward along the vertical (i.e., + / -Y direction) from both ends of the base 22, and extending along the lateral (i.e., + / -X direction) from one of the side walls 24 spaced apart from each other along the lateral (i.e., + / -X direction) to the other of the side walls 24 spaced apart from each other along the lateral (i.e., + / -X direction).
[0020] The base 22 and side walls 24 define the chamber 26. The base 22 defines the bottom surface of the chamber 26, and the side walls 24 define the sides of the chamber 26. The tank 20 includes a top wall 28 connected to the side wall on the opposite side of the base 22. The top wall 28 further defines the chamber 26, for example, covering or defining the upper side of the chamber 26. One or more components of the tank 20, e.g., the base 22, side walls 24 and / or top wall 28, may be monolithic. For the purposes of this disclosure, “monolithic” means a single-piece unit, i.e., a continuous piece of material without any fasteners, joints, welds, adhesives and / or equivalents thereof that fasten multiple parts together. For example, the tank 20 may be formed by a general injection molding operation, 3D printing in the same operation, a press operation, etc. Alternatively, the components of the tank 20, such as the base 22, side walls 24, and / or top wall 28, may be formed individually and fastened to each other by fasteners such as, for example, welding, screws, rivets, nuts and bolts, adhesives, epoxy, and / or other suitable structures and / or processes, but are not limited to these. The tank 20 may be formed from metal, plastic, fiberglass, or other suitable material.
[0021] The liquid coolant 14 is placed in a chamber 26 of the tank 20 and is held in place by the chamber 26 of the tank 20. For example, the chamber 26 defined by the tank 20 may, but is not limited to, be at least partially filled with the liquid coolant 14. The liquid coolant 14 in the chamber 26 may be spaced apart from the upper wall 28 to provide, for example, a space 30 within the chamber 26 where the liquid coolant 14 is generally absent. In other words, the tank 20 may contain fluids other than the liquid coolant 14, such as a gas placed in the tank 20 together with the liquid coolant 14. The fluids and the liquid coolant 14 are generally kept separate from each other, for example, by gravity.
[0022] One or more electronic devices 16, 18 are located within the chamber 26 of the tank 20. For example, an exemplary immersion cooling assembly 12 includes, but is not limited to, a first electronic device 16 and a second electronic device 18 located within the chamber 26 of the tank 20. It should be understood that fewer (e.g., just one) or more (e.g., three or more) electronic devices 16, 18 may be located within the chamber 26 of the tank 20.
[0023] One or more electronic devices 16, 18 are configured to process information and / or command vehicle components to facilitate the autonomous operation of one or more vehicle systems, such as, for example, a braking system, a steering system, a propulsion system, and equivalents thereof. Each of the one or more electronic devices 16, 18 includes, for example, a circuit board assembly 34 mounted on a direct-bonded copper (DBC) substrate 36. For example, in some embodiments, the circuit board assembly 34 is a printed circuit board (PCB). In other embodiments, the circuit board assembly 34 may be flexible, rigid, high-density interconnect, and / or equivalents thereof. Furthermore, in some embodiments, the circuit board assembly 34 is a single layer. In other embodiments, the circuit board assembly 34 may be multiple layers.
[0024] For each of the one or more electronic devices 16, 18, the circuit board assembly 34 may be a power-supplied device that includes one or more insulated gate bipolar transistors (IGBTs), one or more metal-oxide-semiconductor field-effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), and / or their equivalents. For example, the circuit board assembly 34 includes, but is not limited to, semiconductors, control / drive / protection electronic circuits, power devices, and / or passive components incorporated therein. For each of the one or more electronic devices 16, 18, the circuit board assembly 34 includes a plurality of dielectric layers and a plurality of power layers. The power layer may include a dielectric material and a conductor material. The dielectric layer includes a dielectric material and conductive vias that provide electrical communication or paths between adjacent power layers. In other words, the power layer includes a conductive (e.g., copper) pattern, and the dielectric layer includes a conductive (e.g., copper) path that connects the conductive patterns, whereby the circuit board assembly 34 for each of the one or more electronic devices 16, 18 functions and / or operates as desired.
[0025] The DBC substrate 36 includes a ceramic base 38 and a copper layer 40 on the opposite side of the circuit board assembly 34. The ceramic base 38 is configured to electrically insulate the circuit board assembly 34 from the copper layer 40. Materials other than ceramic may be used for the DBC substrate 36. For example, the base 38 may be aluminum or other materials generally having a high thermal conductivity, but is not limited thereto. The dielectric layer is included between the base 38 and the copper layer 40 to insulate the base 38 and the copper layer 40 using techniques known to those skilled in the art, for example, when the base 38 is an electrically conductive material.
[0026] During operation of the electronic devices 16, 18, the circuit board assembly 34 generates heat. The generated heat is dissipated from the circuit board assembly 34 by the DBC substrate 36, and for example, the temperature of the circuit board assembly 34 is maintained below the maximum operating temperature of the circuit board assembly 34. For example, the maximum operating temperature is generally in the range of about 90 °C to about 110 °C. The heat flows through the base 38 to the copper layer 40 of the DBC substrate 36. In the copper layer 40, the heat is absorbed by the liquid coolant 14 held in the chamber 26 of the tank 20, for example, causing a phase change of the coolant 14 to a gas and generating gas bubbles 42.
[0027] One or more electronic devices 16, 18 (for example, the first electronic device 16 and the second electronic device 18) are spaced apart from each other along the lateral direction (i.e., the + / - X direction). Each of the one or more electronic devices 16, 18 within the chamber 26 of the tank 20 is elongated along the vertical direction (i.e., the + / - Y direction). That is, the height of each of the one or more electronic devices 16, 18 along the vertical direction (i.e., the + / - Y direction) is longer than the width of each of the one or more electronic devices 16, 18 along the lateral direction (i.e., the + / - X direction). The first electronic device 16 and the second electronic device 18 are oriented such that the phase transition surfaces 17 of the first electronic device 16 and the phase transition surfaces 19 of the second electronic device 18 face each other. For example, the copper layer 40 of the first electronic device 16 faces the copper layer 40 of the second electronic device 18, but is not limited thereto. In other words, the copper layer 40 of the first electronic device 16 and the copper layer 40 of the second electronic device 18 are respectively between the circuit board assembly 34 and the ceramic base 38 of the first electronic device 16 and between the circuit board assembly 34 and the ceramic base 38 of the second electronic device 18.
[0028] As schematically depicted in Figures 2 and 3, one or more electronic devices 16, 18 are completely immersed in the liquid coolant 14, i.e., completely enveloped by the liquid coolant 14. That is, the upper surface 32 of the liquid coolant 14 in the chamber 26 of the tank 20 is above the uppermost distal end of one or more electronic devices 16, 18 along the vertical direction (i.e., the + / -Y direction). One or more electronic devices 16, 18 may be partially immersed in the liquid coolant 14 in the tank 20 (not shown). That is, one or more electronic devices 16, 18 may extend from within the liquid coolant 14 in the tank 20 above the upper surface 32 of the liquid coolant 14 in the tank 20 along the vertical direction (i.e., the + / -Y direction).
[0029] An exemplary immersion cooling assembly 12 includes a condenser 44. The condenser 44 is located in a chamber 26 of the tank 20 above the liquid coolant 14 in the vertical direction (i.e., the + / -Y direction). For example, the condenser 44 is located in a chamber 26 adjacent to the upper wall 28, in a space 30 above the upper surface 32 of the liquid coolant 14. The condenser 44 is included in the exemplary immersion cooling assembly 12 and removes heat from the gaseous coolant in the space 30, resulting in a phase transition from gas to liquid. The condenser 44 utilizes efficient heat transfer that occurs during the phase transition, in this case, efficient heat transfer that occurs while the gaseous coolant fluid condenses into a liquid phase. The gaseous coolant contacts the outer surface of the condenser 44 at a higher temperature than the secondary fluid circulating through the condenser 44. As the gaseous coolant cools, it reaches its saturation temperature and condenses into a liquid along the outer surface of the condenser 44, releasing a large amount of latent heat. When this process occurs, the amount of gaseous coolant held in the chamber 26 of the tank 20 decreases, and the amount of liquid coolant 14 increases.
[0030] One or more perforated baffles 46, 48, 50, 52 are provided in the tank 20 to reduce sloshing and / or other agitation of the liquid coolant 14. For example, as will be further described below, one or more perforated baffles 46, 48 reduce the lateral (i.e., + / -X direction) and / or vertical (i.e., + / -Y direction) movement of the liquid coolant 14 in the tank 20, and break up and generally disperse bubbles 42 in the liquid coolant 14, for example, bubbles 42 in the liquid coolant 14 that are generated when the liquid coolant 14 undergoes a phase change from a liquid state to a gas state in response to sufficient heat being transferred from one or more electronic devices 16, 18 to the liquid coolant 14. One or more perforated baffles 46, 48, 50, 52 are positioned along the vertical (i.e., + / -Y direction) between the base 22 and the condenser 44. Each of the perforated baffles 46, 48, 50, and 52 is fully or partially immersed in the liquid coolant 14, as will be described later. One or more of the perforated baffles 46, 48, 50, and 52 may extend across the entire chamber 26, for example from one side wall 24 to the opposite side wall 24, as will be described later. One or more of the perforated baffles 46, 48, 50, and 52 are supported by the tank 20 and fixed to, for example, the base 22 and / or side walls 24.
[0031] Each perforated baffle 46, 48, 50, 52 includes one or more openings 54, 56, 58 that allow a fluid such as liquid coolant 14 and / or bubbles 42 to flow from one side of the perforated baffle 46, 48, 50, 52 to the other side. The openings 54, 56, 58 may be the same size as each other and / or may be of different sizes. The openings 54, 56, 58 may be evenly distributed or not. The openings 54, 56, 58 may be circular or any shape, including irregular shapes.
[0032] As one non-limiting example, the openings 54, 56, and 58 are provided by through holes penetrating the perforated baffles 46, 48, 50, and 52. The openings 54, 56, and 58 extend along the lateral direction (i.e., the + / -X direction), the vertical direction (i.e., the + / -Y direction), and / or directions intersecting the lateral direction (i.e., the + / -X direction) and the vertical direction (i.e., the + / -Y direction).
[0033] As another non-limiting example, the perforated baffles 46, 48, 50, 52 include a grid structure 60, for example, as shown in Figure 4. The grid structure 60 includes interconnected porous unit cells 62 arranged periodically and regularly. The interconnected porous unit cells 62 are open cells to provide openings 54, 56, 58, i.e., fluid can flow into and through each unit cell 62. The unit cells 62 are, for example, hexagonal, octagonal, or other suitable shapes, but are not limited thereto. The grid structure 60 is provided, for example, by additive manufacturing or other suitable process.
[0034] The examples shown for perforated baffles 46, 48, 50, and 52 having openings 54, 56, and 58 are non-limiting, and other baffles such as screens, honeycomb cores, and simple perforated plates (i.e., plates with holes of various sizes) can be realized using either additive or subtractive manufacturing processes.
[0035] As used herein, the terms “additively manufactured” or “additive manufacturing technique or process” generally mean a manufacturing process that “constructs” a three-dimensional component layer by layer by stacking layers of material sequentially on top of each other. The sequential layers generally fuse together to form a unified component, which may have various integrated subcomponents. While additive manufacturing techniques are described herein as being able to manufacture complex objects by constructing them point by point, layer by layer, typically in a vertical direction, other manufacturing methods are also possible and within the scope of this subject. For example, while the description herein refers to adding material to form sequential layers, those skilled in the art will understand that the methods and structures disclosed herein can be carried out with any additive manufacturing technique or manufacturing technique. For example, in embodiments of the present invention, a layer-additive process, a layer-subtractive process, or a hybrid process may be used.
[0036] Appropriate additive manufacturing techniques in accordance with this disclosure include, but are not limited to, fused deposition modeling (FDM), selective laser sintering (SLS), 3D printing by means of inkjet and laser jet, stereolithography (SLA), direct selective laser sintering (DSLS), electron beam sintering (EBS), electron beam melting (EBM), direct laser additive manufacturing (LENS), laser net-shape manufacturing (LNSM), direct metal additive manufacturing (DMD), digital light processing (DLP), direct selective laser melting (DSLM), selective laser melting (SLM), direct metal laser melting (DMLM), and other known processes.
[0037] The additive manufacturing processes described herein are used to form components using any suitable material. For example, the material may be plastic, metal, concrete, ceramic, polymer, epoxy, photopolymer resin, or other suitable material in solid, liquid, powder, sheet material, wire, or other suitable form. More specifically, according to exemplary embodiments of this subject, the additive manufactured components described herein are formed from some, all, or some combination of materials including, but not limited to, pure metals, nickel alloys, chromium alloys, titanium, titanium alloys, magnesium, magnesium alloys, aluminum, aluminum alloys, and nickel or cobalt-based superalloys (e.g., available under the name Inconel®, available from Special Metals Corporation). These materials are examples of suitable materials for use in the additive manufacturing processes described herein and are generally referred to as “additive materials.”
[0038] In addition, those skilled in the art will understand that various materials and methods may be used to join these materials and are intended to be within the scope of this disclosure. As used herein, “fusion” means any suitable process for creating a bonded layer of any of the materials described above. For example, if an object is made of polymers, fusion means creating a thermosetting bond between polymer materials. If the object is epoxy, the bond is formed by a crosslinking process. If the material is ceramic, the bond is formed by a sintering process. If the material is powder metal, the bond is formed by a melting or sintering process. Those skilled in the art will understand that other methods are possible for fusing materials to create components by additive manufacturing, and that the subject matter of this disclosure may be carried out in these ways.
[0039] In addition, the additive manufacturing processes disclosed herein enable the formation of a single component from multiple materials. Therefore, the components described herein may be formed from any suitable mixture of the above materials. For example, a component may comprise multiple layers, segments, or parts formed using various materials, processes, and / or various additive manufacturing machines. In this embodiment, components having various materials and material properties are constructed to meet the requirements of any particular application. Furthermore, while the components described herein are constructed entirely by additive manufacturing processes, it should be understood that in alternative embodiments, all or part of these components may be formed via casting, machining, and / or other suitable manufacturing processes. Therefore, any suitable combination of materials and manufacturing methods may be used to form these components.
[0040] Here, we describe an exemplary additive manufacturing process. The additive manufacturing process assembles components using three-dimensional (3D) information of those components, such as a three-dimensional computer model of the component. Therefore, the three-dimensional design model of the component is defined before manufacturing. In this regard, a model or prototype of the component may be scanned to determine the three-dimensional information of the component. As another example, the component model is constructed using an appropriate computer-aided design (CAD) program to define the three-dimensional design model of the component.
[0041] The design model includes 3D numerical coordinates of the entire configuration of the component, including both the external and internal surfaces of the component. For example, the design model defines the body, surfaces, and / or internal passages such as, for example, openings 54, 56, 58, support structures, and their equivalents. In one exemplary embodiment, the 3D design model is transformed into multiple slices or segments along, for example, the central axis of the component (e.g., vertical) or other appropriate axis. Each slice defines a thin cross-section of the component for a given height of the slice. Multiple consecutive cross-sectional slices together form a 3D component. The component is "built" slice by slice or layer by layer until complete.
[0042] In this embodiment, the components described herein are assembled using an additive manufacturing process, or more specifically, each layer is formed sequentially by fusing or polymerizing plastics using laser energy or heat, or by sintering or melting powdered metals. For example, certain types of additive manufacturing processes use electromagnetic radiation, such as an energy beam, an electron beam, or a laser beam, to sinter or melt powdered materials. Any suitable laser and laser parameters may be used, including considerations regarding laser power, laser beam spot size, and scanning speed. The material to be manufactured is formed from any suitable powder or material.
[0043] The condenser 44 is positioned above one or more perforated baffles 46, 48, 50, 52 of the exemplary immersion cooling assembly 12 in the vertical direction (i.e., the + / -Y direction). The condenser 44 is positioned above one or more electronic devices 16, 18 located within the tank 20 of the exemplary immersion cooling assembly 12 in the vertical direction (i.e., the + / -Y direction). For example, but not limited to, the condenser 44 is positioned within the tank 20 above the upper surface 32 of the liquid coolant 14 in the tank 20 (e.g., space 30) and along the vertical direction (i.e., the + / -Y direction).
[0044] Referring to Figure 2, one or more perforated baffles 46, 48, for example, a first perforated baffle 46 and a second perforated baffle 48, are positioned in the tank 20 along the lateral direction (i.e., the + / -X direction) between the first electronic device 16 and the second electronic device 18. The first perforated baffle 46 and / or the second perforated baffle 48 control the lateral movement of fluid in the tank 20. For example, the first perforated baffle 46 and / or the second perforated baffle 48 allow fluid to flow laterally through the openings 54 of the first perforated baffle 46 and the second perforated baffle 48.
[0045] The first perforated baffle 46 and / or the second perforated baffle 48 are elongated along the vertical direction (i.e., the + / -Y direction). That is, the height of the first perforated baffle 46 and / or the second perforated baffle along the vertical direction (i.e., the + / -Y direction) is greater than the width of the first perforated baffle 46 and / or the second perforated baffle along the lateral direction (i.e., the + / -X direction). The first perforated baffle 46 and / or the second perforated baffle 48 extend from one side wall 24 (not shown) to the other side wall 24 (not shown) of a pair of side walls 24 (not shown) that are spaced apart from each other along a direction perpendicular to both the lateral direction (i.e., the + / -X direction) and the vertical direction (i.e., the + / -Y direction). The first perforated baffle 46 and / or the second perforated baffle are generally planar and perpendicular to the transverse direction (i.e., the + / -X direction).
[0046] Although two perforated baffles 46, 48 are shown between the first electronic device 16 and the second electronic device 18, it should be understood that fewer (i.e., 0 or 1) or more (i.e., more than 2) perforated baffles may be arranged between the first electronic device 16 and the second electronic device.
[0047] One or more perforated baffles 46, 48 positioned between the first electronic device 16 and the second electronic device 18 are completely immersed in the liquid coolant 14 in the tank 20. That is, the upper surface 32 of the liquid coolant 14 in the tank 20 is above the uppermost distal end of one or more perforated baffles 46, 48 positioned between the first electronic device 16 and the second electronic device 18, along the vertical direction (i.e., the + / -Y direction). One or more perforated baffles 46, 48 positioned between the first electronic device 16 and the second electronic device 18 may be partially immersed in the liquid coolant 14 in the tank 20 (not shown). That is, one or more perforated baffles 46, 48 positioned between the first electronic device 16 and the second electronic device 18 may extend from within the liquid coolant 14 in the tank 20 above the upper surface 32 of the liquid coolant 14 in the tank 20, along the vertical direction (i.e., the + / -Y direction).
[0048] The first perforated baffle 46 is spaced laterally (i.e., in the + / -X direction) from the second perforated baffle 48, defining a flow path 64 between the first perforated baffle 46 and the second perforated baffle 48. The flow path 64 is elongated in the vertical direction (i.e., in the + / -Y direction). The flow path 64 does not have to have other components inside it. For example, the flow path 64 does not have, but is not limited to, any electronic devices placed inside it. The condenser 44 is positioned above the flow path 64 in the vertical direction (i.e., in the + / -Y direction). The condenser 44 may be directly above the flow path 64. That is, the condenser 44 and the flow path 64 may overlap in the lateral direction (i.e., in the + / -X direction).
[0049] One or more perforated baffles 46, 48, positioned between the first electronic device 16 and the second electronic device 18, for example, the first perforated baffle 46 and the second perforated baffle 48, disrupt the gaseous bubbles 42 of the coolant formed in the liquid coolant 14. That is, the first perforated baffle 46 and the second perforated baffle 48 disperse the gaseous bubbles 42 of the coolant formed in the liquid coolant 14. For example, the openings 54 of the first perforated baffle 46 and the second perforated baffle 48 are smaller than, but not limited to, the average size of the bubbles 42 formed by the electronic devices 16, 18 during the operation of the first electronic device 16 and the second electronic device 18. The average size of the bubbles 42 is predetermined, for example, by measuring the size of the bubbles 42 using photographic techniques, which include taking images of the bubbles 42 with a camera and then analyzing the images to calculate the bubble diameter based on pixel measurements. During operation, bubbles 42 formed by the electronic devices 16 and 18 flow into the flow path 64 through the opening 54 of the first perforated baffle 46 or the second perforated baffle 48, for example, due to lateral forces generated during the movement of the vehicle 10. As the bubbles 42 formed by the electronic devices 16 and 18 flow through the first perforated baffle 46 or the second perforated baffle 48, they are broken into smaller bubbles 42 within the flow path 64. Within the flow path 64, the bubbles 42 rise upward through the fluid toward the condenser 44.
[0050] Referring to Figure 3, in some embodiments, one or more perforated baffles 50, 52, for example, a third perforated baffle 50 and a fourth perforated baffle 52, are positioned in the tank 20 directly above one or more electronic devices 16, 18 along the vertical direction (i.e., the + / -Y direction). That is, the third perforated baffle 50 and / or the fourth perforated baffle 52 overlap the first electronic device 16 and / or the second electronic device 18 along the lateral direction (i.e., the + / -X direction) and a direction perpendicular to both the lateral direction (i.e., the + / -X direction) and the vertical direction (i.e., the + / -Y direction).
[0051] The third perforated baffle 50 and the fourth perforated baffle 52 control the vertical movement of fluid within the tank 20. For example, the third perforated baffle 50 and the fourth perforated baffle 52 allow fluid to flow from one side of each perforated baffle 50, 52 to the other side through the openings 56, 58 of the third perforated baffle 50 and the fourth perforated baffle 52.
[0052] The third perforated baffle 50 and the fourth perforated baffle 52 are located below the condenser 44. That is, the third perforated baffle 50 and the fourth perforated baffle 52 are positioned within the tank 20 between one or more electronic devices 16, 18 and the condenser 44, and along the vertical direction (i.e., the + / -Y direction). The third perforated baffle 50 and the fourth perforated baffle 52 may also be located directly below the condenser 44.
[0053] The fourth perforated baffle 52 is positioned above the third perforated baffle 50 along the vertical direction (i.e., the + / -Y direction). For example, the fourth perforated baffle 52 is positioned between the condenser 44 and the third perforated baffle 50 along the vertical direction (i.e., the + / -Y direction), but is not limited to this.
[0054] The third perforated baffle 50 and / or the fourth perforated baffle 52 extend along the lateral direction (i.e., the + / -X direction) from one side wall 24 of a pair of side walls 24 spaced apart along the lateral direction (i.e., the + / -X direction) to the other side wall 24 over one or more electronic devices 16, 18. The third perforated baffle 50 and / or the fourth perforated baffle 52 extend along a direction perpendicular to both the lateral direction (i.e., the + / -X direction) and the vertical direction (i.e., the + / -Y direction) from one side wall 24 (not shown) of a pair of side walls 24 (not shown) spaced apart along a direction perpendicular to both the lateral direction (i.e., the + / -X direction) and the vertical direction (i.e., the + / -Y direction) to the other side wall 24 (not shown) over the electronic devices 16, 18. The third perforated baffle 50 and / or the fourth perforated baffle 52 are generally planar and perpendicular to the vertical direction (i.e., the + / -Y direction).
[0055] The third perforated baffle 50 and / or the fourth perforated baffle 52 are elongated along the lateral direction (i.e., the + / -X direction). That is, the width of the third perforated baffle 50 and / or the fourth perforated baffle 52 along the lateral direction (i.e., the + / -X direction) is greater than the height of the third perforated baffle 50 and / or the fourth perforated baffle 52 along the vertical direction (i.e., the + / -Y direction). Although it is shown that two perforated baffles 50, 52 are positioned above the first electronic device 16 and the second electronic device 18, it should be understood that fewer (i.e., 0 or 1) or more (i.e., more than 2) perforated baffles may be positioned above the first electronic device 16 and the second electronic device 18.
[0056] One or more perforated baffles 50, 52 positioned above one or more electronic devices 16, 18 are completely immersed in the liquid coolant 14 in the tank 20. That is, the upper surface 32 of the liquid coolant 14 in the tank 20 is above the uppermost distal end of the one or more perforated baffles 50, 52 positioned above one or more electronic devices 16, 18 along the vertical direction (i.e., the + / -Y direction). For example, but not limited to, both the third perforated baffle 50 and the fourth perforated baffle 52 are completely immersed in the liquid coolant 14. Alternatively, the fourth perforated baffle 52 may be positioned above or partially immersed in the liquid coolant 14 together with the third perforated baffle 50 which is completely immersed in the liquid coolant 14 (not shown), or the fourth perforated baffle 52 may be positioned above the upper surface 32 of the liquid coolant 14 together with the third perforated baffle 50 which is partially immersed in the liquid coolant 14 (not shown).
[0057] One or more perforated baffles 50, 52, for example, a third perforated baffle 50 and a fourth perforated baffle 52, positioned above one or more electronic devices 16, 18 within the tank 20, disrupt the gaseous bubbles 42 of the coolant formed in the liquid coolant 14. That is, the third perforated baffle 50 and the fourth perforated baffle 52 disperse the gaseous bubbles 42 of the coolant formed in the liquid coolant 14 into smaller bubbles 42. For example, the openings 56, 58 of the third and fourth perforated plates are smaller than the average size of the bubbles 42 formed by the electronic devices 16, 18 during operation, but are not limited to these.
[0058] When two or more perforated baffles 50, 52, for example a third perforated baffle 50 and a fourth perforated baffle 52, are positioned above one or more electronic devices 16, 18 in the tank 20, such perforated baffles 50, 52 crush the gas-phase bubbles 42 of the coolant formed in the liquid coolant 14, for example, first into bubbles 42 smaller than the bubbles 42 initially formed in the liquid coolant 14 by one or more electronic devices 16, 18, and then progressively crush them into even smaller bubbles 42. For example, but not limited to, the opening 56 of the third perforated baffle 50 is smaller than the opening 58 of the fourth perforated baffle 52, for example, in terms of width, diameter, and / or cross-sectional area. The sizes of the openings 56, 58 of the third perforated baffle 50 and / or the fourth perforated baffle 52 are measured, for example, along the lateral direction (i.e., the + / -X direction). In addition or alternatively, the opening 56 of the third perforated baffle 50 may be offset from the opening 58 of the fourth perforated baffle 52 along the lateral direction (i.e., the + / -X direction). That is, the opening 56 of the third perforated baffle 50 and the opening 58 of the fourth perforated baffle 52 may be positioned such that the opening 56 of the third perforated baffle 50 and the opening 58 of the fourth perforated baffle 52 do not completely overlap along the lateral direction (i.e., the + / -X direction). The opening 56 of the third perforated baffle 50 and the opening 58 of the fourth perforated baffle 52 may be positioned such that the opening 56 of the third perforated baffle 50 does not overlap with any of the openings 54, 56, or 58 of the fourth perforated baffle 52 along the lateral direction (i.e., the + / -X direction).
[0059] During operation, bubbles 42 formed by the electronic devices 16 and 18 flow upward toward the third perforated baffle 50 and pass through the opening 56 of the third perforated baffle 50. As they flow through the opening 56 of the third perforated baffle 50, the size of the bubbles 42 decreases. From the opening 56 of the third perforated baffle 50, the bubbles 42 flow upward toward the fourth perforated baffle 52 and, for example, contact the solid part of the fourth perforated baffle between the openings 58 of the fourth perforated baffle 52. Subsequently, the bubbles 42 flow through the opening 58 of the fourth perforated plate, their size decreases further, and they disperse.
[0060] The third perforated baffle 50 and / or the fourth perforated baffle 52 shown in Figure 3 may be used in combination with the first perforated baffle 46 and / or the second perforated baffle 48 shown in Figure 2 (not shown). In such a combination, the third perforated baffle 50 and / or the fourth perforated baffle 52 are positioned above one or more perforated baffles 46, 48 between the first electronic device 16 and the second electronic device 18, along the vertical direction (i.e., the + / -Y direction).
[0061] As described above, it will be understood that in this specification, an immersion cooling assembly is defined as an immersion cooling assembly in a vehicle or other moving environment, configured to control the temperature of one or more electronic devices and to reduce sloshing of a liquid coolant during vehicle operation.
[0062] The adjectives “first,” “second,” and their equivalents are used throughout this document as identifiers and are not intended to imply importance or order.
[0063] Note that the term “generally” is used herein to describe the degree of uncertainty inherent in any quantitative comparison, value, measurement, or other expression. Furthermore, it is used herein to indicate the degree to which a quantitative expression may deviate from a defined standard without altering the fundamental function of the subject matter.
[0064] While specific embodiments have been illustrated and described herein, it should be understood that various other changes and modifications can be made without departing from the spirit and scope of the subject matter described in the claims. Furthermore, while various aspects of the subject matter described in the claims have been described herein, it is not necessary to use such aspects in combination. Therefore, the appended claims are intended to cover all changes and modifications within the scope of the subject matter described in the claims.
Claims
1. An immersion cooling assembly for controlling the temperature of electronic devices in a mobile environment, Tank and, A liquid coolant placed inside the aforementioned tank, A first electronic device disposed within the tank and at least partially immersed in the liquid coolant, A second electronic device disposed within the tank and at least partially immersed in the liquid coolant, the second electronic device spaced laterally apart from the first electronic device, A perforated baffle is positioned in the tank between the first electronic device and the second electronic device along the lateral direction and is at least partially immersed in the liquid coolant. Equipped with, An immersion cooling assembly wherein the perforated baffle is configured to break gaseous bubbles in the liquid coolant formed in the coolant and / or reduce sloshing of the liquid coolant, caused by heat generated by the first or second electronic device.
2. The immersion cooling assembly according to claim 1, wherein the perforated baffle is elongated along the vertical axis.
3. The immersion cooling assembly according to claim 1, wherein the perforated baffle includes a grid structure.
4. The immersion cooling assembly according to claim 1, further comprising a second perforated baffle disposed in the tank between the first electronic device and the second electronic device along the lateral direction.
5. The immersion cooling assembly according to claim 4, wherein the perforated baffle is spaced apart from the second perforated baffle along the lateral direction, defining a flow path between the perforated baffle and the second perforated baffle.
6. The immersion cooling assembly according to claim 5, further comprising a condenser positioned above the flow path.
7. The immersion cooling assembly according to claim 1, further comprising a second perforated baffle positioned above the first electronic device and the second electronic device.
8. The immersion cooling assembly according to claim 7, wherein the second perforated baffle is elongated along the lateral direction.
9. The immersion cooling assembly according to claim 8, wherein the second perforated baffle is immersed in the liquid coolant.
10. The immersion cooling assembly according to claim 9, further comprising a third perforated baffle positioned above the second perforated baffle.
11. The immersion cooling assembly according to claim 10, wherein the opening of the third perforated baffle is smaller than the opening of the second perforated baffle.
12. The immersion cooling assembly according to claim 10, wherein the opening of the third perforated baffle is offset from the opening of the second perforated baffle.
13. An immersion cooling assembly for controlling the temperature of electronic devices in a mobile environment, Tank and, A liquid coolant placed inside the aforementioned tank, An electronic device disposed in the tank and immersed in the liquid coolant, A perforated baffle positioned in the tank directly above the electronic device and at least partially immersed in the liquid coolant, Equipped with, An immersion cooling assembly wherein the perforated baffle is configured to break gaseous bubbles in the liquid coolant formed in the liquid coolant and / or reduce sloshing of the liquid coolant, caused by the heat generated by the electronic device.
14. The immersion cooling assembly according to claim 13, wherein the perforated baffle includes a grid structure.
15. The immersion cooling assembly according to claim 13, further comprising a condenser positioned above the perforated baffle.
16. The immersion cooling assembly according to claim 13, wherein the perforated baffle is elongated along the transverse direction and is completely immersed in the liquid coolant.
17. The immersion cooling assembly according to claim 13, wherein the tank includes a first side wall and a second side wall opposite to the first side wall, and the perforated baffle extends from the first side wall over the electronic device to the second side wall.
18. The immersion cooling assembly according to claim 13, further comprising a second perforated baffle positioned in the tank directly above the electronic device and above the perforated baffle, wherein the second perforated baffle is at least partially immersed in the liquid coolant.
19. The immersion cooling assembly according to claim 18, wherein the opening of the second perforated baffle is smaller than the opening of the perforated baffle.
20. The immersion cooling assembly according to claim 18, wherein the opening of the second perforated baffle is offset from the opening of the perforated baffle.