Energy radiative cooling system

Abstract

Conventional fan cooling and cooling methods using heat sinks and heat exchangers cannot meet the needs of high-speed computing servers that generate large amounts of heat. Liquid cooling systems have problems such as the possibility of leaked liquid causing short circuits and even damage to electronic components if components such as conduits and connectors that transport the liquid are damaged or cracked. This energy radiant cooling system solves these problems. [Solution] The energy radiant cooling system of the present invention provides a refrigeration area and a heat source area separated by a metal separator plate inside a server rack, the metal separator plate serves as a heat exchange member between the refrigeration area and the heat source area, a refrigeration device is installed in the refrigeration area, and the refrigerant pipes of the refrigeration device are brought into contact with the metal separator plate, thereby exchanging heat with the metal separator plate by radiation, lowering the temperature of the heat source area, and the refrigeration device removes the heat absorbed by the metal separator plate.

Description

Technical Field

[0001] The present invention relates to a cooling and temperature reduction system, and in particular to an energy radiative cooling and temperature reduction system capable of effectively improving heat dissipation efficiency without requiring the use of liquid-cooled heat dissipation. Background Art

[0002] "Heat dissipation" has become a frequently discussed topic in the current era of Industry 4.0 and information technology. This is because all facilities and devices that perform mechanical work generate heat, and if this heat cannot be removed in a timely and effective manner, it may affect working efficiency, or in some cases even lead to work stoppage.

[0003] A heat dissipation module is a technology or structure designed to effectively dissipate or suppress heat generated within facilities or systems. These modules usually include various heat dissipation members to assist in temperature control of the facility and ensure its normal operation. Heat dissipation modules can adopt various heat dissipation technologies to improve operation efficiency and reliability, among which the most common ones are air cooling, water cooling, and immersion cooling.

[0004] Servers usually operate for long periods of time, need to process large amounts of data and applications, and generate a large amount of heat. If this heat is not effectively handled, server performance will degrade, and it may even cause hardware damage. Conventional server heat dissipation methods and technologies are described below.

[0005] Fan cooling system: Servers are usually equipped with a fan cooling system that extracts air from inside the server chassis to cool internal components. However, as high-speed computing servers become increasingly common, conventional fan cooling methods can no longer meet demand.

[0006] Heat sinks and heat sinks: Heat sinks and heat sinks are devices that promote heat dissipation by increasing the surface area. Typically, they are connected to CPUs and other high-temperature devices, transferring heat to large-area aluminum or copper heat sinks to improve heat dissipation efficiency. However, this type of heat dissipation method also fails to meet the needs of high-speed computing servers.

[0007] Liquid Cooling Systems: Some high-performance servers use liquid cooling systems, which remove heat by circulating liquid through conduits and heat sinks. These systems are generally more effective than air cooling and are particularly suitable for servers requiring highly efficient heat dissipation. However, if components such as conduits and connectors used to transport the liquid are damaged or cracked, the leaked liquid can cause short circuits and even damage to electronic components. [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] The object of the present invention is to provide an energy radiant cooling system that can solve the problems that conventional fan cooling and cooling methods using heat sinks and heat sinks cannot meet the needs of high-speed computing servers that generate a large amount of heat, and that liquid cooling systems have the potential to cause short circuits and even damage to electronic components if components such as conduits and connectors that transport the liquid are damaged or cracked and leak the liquid occurs. [Means for solving the problem]

[0009] The present invention will now be described. The energy radiant cooling system described in claim 1 includes a refrigeration area where a refrigeration device is installed, a heat source area adjacent to the refrigeration area where a humidity controller is installed, and a metal separator plate installed between the refrigeration area and the heat source area, which serves as a heat exchange member between the refrigeration area and the heat source area, wherein the refrigeration device includes a refrigerant pipe, the refrigerant pipe is in contact with the surface of the first side surface of the metal separator plate, a recessed groove is formed on the first side surface of the metal separator plate, the refrigerant pipe is installed in the recessed groove and in contact with the metal separator plate, a plurality of fins are formed on the second side surface of the metal separator plate, the fins extend to the heat source area, wherein the heat source area is a server rack, and the refrigeration area is a space inside the server rack partitioned by the metal separator plate, a fan is installed on the side wall of the server rack, the refrigeration device includes a refrigerator, the refrigerator is installed outside the server rack and connected to both ends of the refrigerant pipe via an input pipeline and an output pipeline. [Effects of the Invention]

[0010] According to the energy radiative cooling system of the present invention, the heat generated in the heat source area is efficiently exchanged with the cold metal isolation plate by radiation, thereby lowering the temperature of the heat source area. The refrigeration device removes the heat absorbed by the metal isolation plate, completely avoiding problems such as short circuits caused by liquid and damage to electronic components.

[0011] In one embodiment of the present invention, the refrigerant pipe can be brought into contact with the surface of the first side of the metal separator plate. This removes the heat absorbed by the separator metal plate through the refrigerant pipe.

[0012] In another embodiment of the present invention, a recessed groove is formed on the first side surface of the metal isolation plate, and the refrigerant pipe is installed in the recessed groove and in contact with the metal isolation plate. This increases the contact area between the refrigerant pipe and the metal isolation plate, allowing the refrigerant pipe to more efficiently remove the heat absorbed by the isolation metal plate.

[0013] Preferably, in the present invention, a plurality of fins may be formed on the second side surface of the metal isolation plate, and the plurality of fins extend to the heat source area. This increases the contact area between the metal isolation plate and the heat source area, allowing heat to be absorbed more efficiently.

[0014] Preferably, the present invention may involve installing fans on the side walls of the server rack. This helps to remove heat from the heat source area and further improves the heat dissipation cooling efficiency. [Brief explanation of the drawing]

[0015] [Figure 1] This is a three-dimensional diagram of an embodiment in which the cooling and temperature control system of the present invention is applied to a server rack. [Figure 2] This is a front view of an embodiment in which the cooling and temperature control system of the present invention is applied to a server rack. [Figure 3] Figure 2 is a side cross-sectional view. [Figure 4] This is a plan view of another embodiment in which a refrigerant pipe is arranged on the first side surface of the metal isolation plate of the present invention. [Figure 5] Figure 4 is a cross-sectional view along the VV direction. [Modes for carrying out the invention]

[0016] Figures 1 to 3 show an example of applying the radiant cooling system of the present invention to a server rack. In this example, the inside of the rack is partitioned by a metal separator plate 20 with excellent thermal conductivity, and a refrigeration zone 10 and a heat source zone 40 are provided, with the refrigeration zone 10 and the heat source zone 40 being placed next to each other. More specifically, the heat source zone 40 is located at the front of the rack, and the door can be opened to put in and take out the server 401, while the refrigeration zone 10 is located at the rear of the rack, and after the heat generated by the server 401 is absorbed by the metal separator plate 20, the heat can be removed by a refrigeration device 30 located in the refrigeration zone 10. Preferably, the first side of the metal separator plate 20 (i.e., the side facing the rear of the rack) is brought into contact with the refrigeration device 30 and connected, and a plurality of fins 201 are formed on the second side of the metal separator plate 20 (i.e., the side facing the front of the rack), and the fins 201 are extended to the heat source area 40, thereby increasing the area of ​​the metal separator plate 20 that is in contact with heat, and becoming a heat exchange member between the refrigeration area and the heat source area.

[0017] The refrigeration system 30 includes a refrigerator 301 and a refrigerant pipe 302, the refrigerator 301 being located outside the server rack, the refrigerant pipe 301 being able to contact the first side surface of the metal separator plate 20, the first opening 3021 and second opening 3022 located at both ends of the refrigerant pipe 301 being connected to output pipe 304 and output pipe 303 respectively, the output pipe 304 and input pipe 303 being connected to the outlet and inlet of the refrigerator 301 respectively. The refrigerator 301 includes a refrigeration circulation member composed of a compressor, a drive motor, a condenser, an expansion valve, and a refrigerant pipe 301 (i.e., an evaporator), and in the refrigeration circulation process, the compressor draws in the refrigerant gas after evaporation by the evaporator is complete, and then compresses it to become a high-pressure gaseous refrigerant. In the condenser, the high-pressure gaseous refrigerant is condensed into a high-pressure, room-temperature liquid refrigerant by the cooling and heat dissipation of the surrounding air and water. The high-pressure liquid refrigerant exiting the condenser is reduced in pressure by the expansion valve, and the flowing refrigerant becomes low-pressure liquid refrigerant. The low-pressure liquid refrigerant is transported to the refrigerant pipe 301, where the metal isolation plate 20 absorbs heat conducted from the heat source area 40, then evaporates to become gaseous refrigerant, which returns to the compressor to perform the next refrigeration cycle.

[0018] In one embodiment of the present invention, the refrigerant pipe 301 can be brought into contact with the surface of the first side of the metal separator 20 (see FIG. 3). Alternatively, in another embodiment of the present invention, a recessed groove 202 corresponding to the bypass shape of the refrigerant pipe 301 is formed on the first side of the metal separator 20 (see FIG. 4 and FIG. 5), and the refrigerant pipe 301 is disposed in the recessed groove 202 to expand the contact area of the metal separator 20, whereby the heat absorbed by the separating metal plate 20 can be removed by the refrigerant pipe 301 with higher efficiency.

[0019] With the cooling and temperature reducing system of the present invention described above, when the server 401 in the heat source area 40 operates, the generated heat is absorbed by the metal separator 20 and the fins 201 through radiation, and high-efficiency heat exchange is performed by the cold refrigerant pipe 301, whereby the temperature of the heat source area 40 can be efficiently reduced, and the heat can be removed by the refrigeration device 30. Throughout the entire cooling and temperature reducing process, the server does not contact any liquid at all, so problems such as liquid causing short circuits in circuits or damaging electronic components can be avoided.

[0020] Furthermore, in the present invention, a fan 60 and a humidity controller 50 are disposed on the side wall of the server rack (see FIG. 1 and FIG. 2). The fan 60 assists in removing heat from the heat source area 40, which further improves the heat dissipation and cooling efficiency, and the humidity controller 50 can monitor the humidity in the heat source area 40 to prevent excessively high humidity from adversely affecting the server. [Description of Symbols]

[0021] 10 Refrigeration area 20 Metal separator 201 Fin 202 Recessed groove 30 Refrigeration device 301 Refrigerator 302 Refrigerant pipe 3021 First opening 3022 Second opening 303 Input pipeline 304 Output pipeline 40 Heat source area 401 Server 50 Humidity controller 60 fans

Claims

[Claim 1] An energy radiative cooling system, A refrigerated area where refrigeration equipment is installed, Adjacent to the aforementioned refrigeration area is a heat source area where a humidity controller is installed, A metal separator plate is installed between the refrigeration area and the heat source area, and serves as a heat exchange member between the refrigeration area and the heat source area. An energy radiant cooling system comprising, wherein the refrigeration device includes a refrigerant pipe, the refrigerant pipe contacts the surface of the first side of the metal separator, a recessed groove is formed on the first side of the metal separator, the refrigerant pipe is installed in the recessed groove and contacts the metal separator, a plurality of fins are formed on the second side of the metal separator, the fins extend to the heat source area, the heat source area is a server rack, the refrigeration area is a space inside the server rack partitioned by the metal separator, a fan is installed on the side wall of the server rack, the refrigeration device includes a chiller, the chiller is installed outside the server rack and connected to both ends of the refrigerant pipe via an input pipeline and an output pipeline.

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