Light-emitting device

Abstract

The objective is to reduce the decrease in light output of light-emitting devices caused by volatile organic compounds having conjugated double bonds, and at the same time, to reduce the decrease in energy efficiency of lighting fixtures and other devices that use light-emitting devices. [Solution] A light-emitting device comprising: a light-emitting element; a plate-shaped light-transmitting member covering the top surface of the light-emitting element; an adhesive member positioned between the light-emitting element and the light-transmitting member and having polysiloxane or porous amorphous silica; a first sealing member covering the side surface of the light-emitting element and the side surface of the adhesive member; and a second sealing member covering the outer surface of the first sealing member and the side surface of the light-transmitting member, wherein the adsorption capacity of the material of the second sealing member for volatile organic compounds having conjugated double bonds is greater than the adsorption capacity of the material of the first sealing member for volatile organic compounds.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a light emitting device using a light emitting element. BACKGROUND ART

[0002] Light emitting devices using light emitting elements such as light emitting diode (LED) chips have been widely used in various lighting applications. Silicone resin is sometimes used as a material for sealing members of light emitting elements or optical members used in combination with light emitting elements, in consideration of the balance between various properties such as optical properties like transparency, moldability, and mass per unit volume. Silicone resin is a polymer having siloxane bonds of an inorganic skeleton in the main chain and organic groups such as methyl groups and phenyl groups in the side chains, and is a polysiloxane having a three-dimensional irregular network structure.

[0003] Volatile organic compounds (VOCs) are contained in additives included in resin-molded products such as resin-coated wiring and rubber packings present inside lighting fixtures and the like, and in organic solvents such as inks and adhesives. The VOCs are contained in outgassing released from components such as resin-coated wiring, inks, rubber packings, and adhesives. VOCs can also enter the interior of lighting fixtures and the like from the external environment of the lighting fixtures and the like. When VOCs remain inside a lighting fixture or the like, the three-dimensional irregular network structure having siloxane bonds adsorbs VOCs. The adsorbed VOCs may include those that discolor and reduce the light output of the lighting fixture or the like (see Patent Document 1 and Non-Patent Document 1). The discoloration of adsorbed VOCs is considered to be caused by the fact that conjugated double bonds of the adsorbed VOCs are linked by the light and heat emitted from the light emitting element, resulting in absorption of visible light. PRIOR ART DOCUMENTS PATENT DOCUMENTS

[0004] Patent Document 1 Japanese Unexamined Patent Publication No. 2023-134071 NON-PATENT DOCUMENTS

[0005] Non-Patent Document 1 Vossloh-Schwabe, “CHEMICAL INCOMPATIBILITIES AFFECTING LEDS” (https: / / www.vossloh-schwabe.com / fileadmin / user_upload / Chemical_Incompatibility_EN.pdf) [Overview of the project] [Problems that the invention aims to solve]

[0006] Patent Document 1 discloses a method for improving discoloration caused by volatile organic compounds by irradiating a light-emitting device with an LED element that emits blue light and an LED element that emits ultraviolet light having an emission peak wavelength in the range of 260 nm to 300 nm. This method requires an LED element that emits ultraviolet light, power supplied to the LED element, and a power control circuit, which leads to an increase in the number of components of the lighting fixture and a decrease in power consumption efficiency (lumens per watt, lm / W). This disclosure aims to reduce the decrease in light output of light-emitting devices caused by VOCs having conjugated double bonds, and at the same time reduce the decrease in power consumption efficiency of lighting fixtures and other devices that use light-emitting devices. [Means for solving the problem]

[0007] A light-emitting device comprising: a light-emitting element; a plate-shaped light-transmitting member covering the top surface of the light-emitting element; an adhesive member positioned between the light-emitting element and the light-transmitting member and having polysiloxane or porous amorphous silica; a first sealing member covering the side surface of the light-emitting element and the side surface of the adhesive member; and a second sealing member covering the outer surface of the first sealing member and the side surface of the light-transmitting member, wherein the adsorption capacity of the material of the second sealing member for volatile organic compounds (VOCs) having conjugated double bonds is greater than the adsorption capacity of the material of the first sealing member for volatile organic compounds (VOCs). [Effects of the Invention]

[0008] This reduces the adsorption of VOCs containing conjugated double bonds by the adhesive member located between the light-emitting element and the light-transmitting member, thereby reducing the decrease in light output of the light-emitting device due to the discoloration of the adsorbed VOCs. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram showing a top view of the light-emitting device of the first embodiment. [Figure 2] This is a schematic longitudinal section diagram along line II-II in Figure 1. [Figure 3] This is a schematic longitudinal section diagram along line III-III in Figure 1. [Figure 4] This is a schematic longitudinal cross-sectional view of the intermediate product of the first embodiment. [Figure 5] This is a schematic longitudinal cross-sectional view of an intermediate product of a modified example of the first embodiment. [Figure 6] This is a schematic diagram showing a top view of a modified example of the first embodiment. [Figure 7] Figure 6 is a schematic longitudinal section diagram along the line VII-VII. [Figure 8] This is a schematic diagram showing a top view of the light-emitting device of the second embodiment. [Figure 9] Figure 8 is a schematic longitudinal section diagram of the IX-IX line. [Figure 10] This is a schematic longitudinal cross-sectional view of the first modified example of the second embodiment. [Figure 11] This is a schematic longitudinal cross-sectional view of a second modified example of the second embodiment. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, the light-emitting device described below is intended to embody the technical idea of the present invention, and unless specifically stated, the present invention is not limited to the following. In addition, the content described in one embodiment is also applicable to other embodiments and modified examples. Each drawing schematically shows an embodiment of the present disclosure, so the scale, spacing, or positional relationship of each member may be exaggerated, or the illustration of a part of the members may be omitted. In the following description, components having substantially the same function are denoted by common reference numerals, and the description thereof may be omitted. "Top surface" means the uppermost surface or the highest surface, and "upper surface" means a surface facing upward or a surface on the upper side. "Outer side surface" means the outer side surface of the annular body, and "inner side surface" means the side surface on the perforation side of the annular body. "Covering a surface" includes both cases of covering the surface in direct contact therewith and covering the surface in indirect contact therewith.

[0011] <First Embodiment> A light-emitting device 100 according to a first embodiment of the present invention will be described below with reference to FIGS. 1 to 3.

[0012] As shown in FIGS. 1 to 3, the light-emitting device 100 includes a light-emitting element 10, a light-transmitting member 20 on a top surface thereof, an adhesive member 30 between the light-emitting element 10 and the light-transmitting member 20, a first sealing member 40 covering side surfaces of these components, and a second sealing member 50 covering an outer side surface of the first sealing member. Furthermore, the light-emitting device 100 also includes a base body 60 having wiring 62 electrically connected to the light-emitting element 10, and a third sealing member 70 located between the base body 60 and the first sealing member 40.

[0013] (Light-Emitting Element) The light-emitting element 10 comprises a semiconductor multilayer structure and a pair of electrodes on the same surface side of the semiconductor multilayer structure. A surface (top surface) opposite to the surface (bottom surface) provided with the pair of electrodes of the light-emitting element 10 serves as a main light-emitting surface. A side surface is located between the top surface and the bottom surface. The light-emitting element 10 may further comprise a substrate that supports the semiconductor multilayer structure on the top surface side thereof. The light-emitting element 10 can emit visible light generated in the semiconductor multilayer structure by passing an electric current between the pair of electrodes. The light-emitting element 10 is, for example, a blue LED chip that emits blue light. The blue LED chip comprises, for example, a sapphire substrate, an AlGaInN-based semiconductor multilayer structure including a p-n junction, and the pair of electrodes.

[0014] (Light-transmissive member) The light-transmissive member 20 is disposed so as to cover the top surface of the light-emitting element 10. The bottom surface of the light-transmissive member 20 faces the top surface of the light-emitting element 10 and is a surface on which visible light from the light-emitting element 10 is incident. The top surface of the light-transmissive member 20 exposed from the first sealing member 40 is used as the light-emitting surface of the light-emitting device 100.

[0015] The light-transmissive member 20 can transmit visible light from the light-emitting element 10. For the transmittance of the light-transmissive member 20 with respect to visible light from the light-emitting element 10, for example, 60% or higher is preferable, 80% or higher is more preferable, and 90% or higher is even more preferable. The light-transmissive member 20 may also serve as a wavelength conversion member. The material of the plate-shaped light-transmissive member 20 is, for example, a composite material such as inorganic glass, inorganic single crystals (including phosphor single crystals), inorganic compound sintered bodies (including sintered bodies of phosphor particles), glass containing phosphor crystal particles, resin molded articles containing phosphor crystal particles, and glass with a resin film containing phosphor crystal particles. Examples of the phosphor include Ce-doped yttrium aluminum garnet phosphors, β-sialon-based phosphors, manganese-activated fluoride-based phosphors, and the like. In the examples shown in FIGS. 1 to 3, the plate-shaped light-transmissive member 20 has a rectangular parallelepiped shape, and a side surface is located between the top surface and the opposite surface (bottom surface) thereof.

[0016] If the top surface of the light-transmitting member 20 is an inorganic single crystal, inorganic glass, or inorganic compound sintered body, or if the bottom surface of the light-transmitting member 20 is an inorganic single crystal, inorganic glass, or inorganic compound sintered body, gases such as volatile organic compounds (VOCs) will have difficulty passing through the light-transmitting member 20. As a result, the amount of VOCs that reach the adhesive member 30 and are adsorbed will decrease. It is preferable that the top or bottom surface of the light-transmitting member 20 be an inorganic single crystal, inorganic glass, or inorganic compound sintered body.

[0017] (Adhesive material) The adhesive member 30 is located between the top surface of the light-emitting element 10 and the bottom surface of the light-transmitting member 20. In the example shown in Figure 2, the adhesive member 30 adheres the light-emitting element 10 and the light-transmitting member 20. The adhesive member 30 is light-transmitting. Here, light-transmitting refers to the property of being able to transmit 60% or more of the visible light from the light-emitting element 10. It is more preferable that the adhesive member 30 transmits 80% or more of the visible light from the light-emitting element 10. Light emitted from the top surface of the light-emitting element 10 passes through the adhesive member 30 and is incident on the bottom surface of the light-transmitting member 20.

[0018] The adhesive member 30 mainly consists of polysiloxane or porous amorphous silica. Here, "main component" means that it accounts for 50% or more of the total volume of the adhesive member 30. Polysiloxane is another name for silicone, and is a polymer that has siloxane bonds (silicon-oxygen-silicon (Si-O-Si) bonds) in its main chain and organic groups in all or part of its side chains, and has a three-dimensional irregular network structure. Porous amorphous silica has an irregular network structure in which SiO4 tetrahedra are linked. In other words, both polysiloxane and porous amorphous silica have silicon-oxygen-silicon bonds and a three-dimensional irregular network structure, and can adsorb VOCs. Whether the adhesive member 30 mainly consists of polysiloxane or porous amorphous silica can be appropriately selected according to the performance required of the light-emitting device 100.

[0019] It is preferable that the refractive index of the adhesive member 30 be close to that of the semiconductor multilayer structure of the light-emitting element 10 in order to improve the efficiency of light extraction from the light-emitting element 10. When the adhesive member 30 contains polysiloxane, the refractive index of polysiloxane (silicone resin) having only methyl groups in its side chains is about 1.41, but by substituting methyl groups with phenyl groups and increasing the mole fraction of phenyl groups in the substituent, it is possible to increase the refractive index of the silicone resin to 1.5 or higher. When the adhesive member 30 contains polysiloxane, a silicone resin having phenyl groups in its side chains is preferred as the material for the adhesive member 30 in order to improve the efficiency of light extraction.

[0020] If the adhesive member 30 is exposed to high temperatures of 200°C or higher, the silicone resin may deteriorate, so it is preferable that the adhesive member 30 has porous amorphous silica, which is an inorganic material. Porous amorphous silica can be obtained, for example, by hydrolyzing polysilazanes such as perhydropolysilazane (PHPS) and methylpolysilazane. By introducing hydroxyl groups to the top surface of the light-emitting element 10 and the bottom surface of the light-transmitting member 20 by plasma treatment or the like before applying the polysilazane to the top surface of the light-emitting element 10 or the bottom surface of the light-transmitting member 20, the adhesive force between the top surface of the light-emitting element 10 and the bottom surface of the light-transmitting member 20 is strengthened.

[0021] (First sealing member) In the examples shown in Figures 2 and 3, the first sealing member 40 covers the side surface of the light-emitting element 10, covering the light-emitting element 10 so that a portion of the surface of the pair of electrodes is exposed, covers the side surface of the light-transmitting member 20, exposes the top surface of the light-transmitting member 20, and covers the side surface of the adhesive member 30. As shown in Figure 1, in a top view, the first sealing member 40 is arranged continuously and seamlessly around the light-emitting element 10.

[0022] The first sealing member 40 preferably has high light reflectivity to visible light from the light-emitting element 10. Here, light reflectivity refers to a reflectance of 60% or more of visible light from the light-emitting element 10. Preferably, the reflectance of the first sealing member 40 to visible light from the light-emitting element 10 is 70% or more, and more preferably 80% or more. This is because the first sealing member 40 reflects light that reaches the side surface of the light-emitting element 10, reflects light that reaches the side surface of the adhesive member 30, and reflects light that reaches the side surface of the light-transmitting member 20, thereby increasing the luminous efficiency of the light-emitting device.

[0023] The first sealing member 40 is formed by curing a liquid curable resin composition, which is obtained by mixing a filler such as an inorganic coloring pigment into a liquid transparent resin. The liquid curable resin composition can be cured by heating or ultraviolet irradiation. The material of the first sealing member 40 is, for example, a light-reflective SMC such as white silicone molding compound (SMC). SMC is a molding material obtained by mixing a filler such as an inorganic coloring pigment, a curing catalyst, etc. into a silicone resin. When a light-reflective SMC is used as the material for the first sealing member 40, the first sealing member 40 is formed by a resin molding method using a mold.

[0024] (Second sealing member) The second sealing member 50 is positioned to cover the outer surface of the first sealing member 40. In other words, the second sealing member 50 is positioned so that most of the visible light from the light-emitting element 10 is blocked by the first sealing member 40, and the temperature rise due to the heat generated by the light-emitting element 10 is also small.

[0025] The material of the second sealing member 50 is, for example, a mixture of multiple inorganic materials, and includes a light reflecting material and a support member that supports the light reflecting material, wherein the support member contains porous silica and alkali metals. Alternatively, the support member of the second sealing member 50 may be montmorillonite clay or kaolinite clay containing zeolite such as mordenite.

[0026] The adsorption capacity of the second sealing member 50 for VOCs having conjugated double bonds, such as benzene, toluene, and xylene, is greater than that of the first sealing member 40 for the same VOCs. Adsorption capacities can be compared, for example, by comparing the results of thermal desorption spectrometry (TDS) or adsorption isotherm measurements.

[0027] When the adhesive member 30 and the first sealing member 40 adsorb VOCs having conjugated double bonds, the adsorbed VOCs having conjugated double bonds discolor due to visible light and heat from the light-emitting element 10, and their reflectivity to visible light decreases. The second sealing member 50 reduces the amount of VOCs having conjugated double bonds from outside the light-emitting device that reaches the adhesive member 30 and the first sealing member 40, thereby reducing the decrease in the light output of the light-emitting device caused by the discoloration of VOCs having conjugated double bonds. Even if the VOCs having conjugated double bonds adsorbed on the second sealing member 50 discolor, most of the visible light from the light-emitting element 10 is blocked by the first sealing member 40, so it hardly causes a decrease in the light output of the light-emitting device.

[0028] (Base) The substrate 60 has a base material 61 and wiring 62. The substrate 60 is, for example, a PCB (Printed Circuit Board), a ceramic substrate with wiring, or a PLCC (Plastic leaded chip carrier) for LEDs. The substrate 60 may also include a heat dissipation member. The base material 61 is, for example, an insulating plate material such as aluminum nitride (AlN) or a ceramic plate or CEM-3 or FR-4 used as a base material for PCB substrates. The wiring 62 has at least one pair of conductors corresponding to the pair of electrodes of the light-emitting element 10. When active or passive elements other than the light-emitting element 10 are mounted on the substrate 60, the wiring 62 also has conductors that are electrically connected to them.

[0029] The permeability of the base material 61 to VOCs having conjugated double bonds (volatile organic compound (VOC) permeability) is preferably lower than that of the first sealing member 40 in order to reduce the amount of VOCs having conjugated double bonds that reach the first sealing member 40. In other words, the performance of the base material 61 in preventing the permeation of VOCs having conjugated double bonds (gas barrier property) is preferably higher than that of the first sealing member 40 in preventing the permeation of VOCs having conjugated double bonds. VOC permeability can be compared based on the results of a gas permeability test for VOCs.

[0030] (Third sealing member) The third sealing member 70 is positioned between the intermediate body 80, which includes the light-emitting element 10, and the base body 60. In other words, the third sealing member 70 and the base body 60 are positioned sequentially from the bottom side of the light-emitting element 10 toward the base body 60. The third sealing member 70 is an underfill that reinforces the connection between the intermediate body 80 and the base body 60, allows heat emitted by the light-emitting element 10 to dissipate to the base body 60, and reflects light from the light-emitting element 10 that has passed through the first sealing member 40 toward the light-emitting element 10. The third sealing member 70 may also be in contact with and cover a part of the side surface of the intermediate body 80, which is the outer surface of the first sealing member 40.

[0031] The third sealing member 70 is formed by curing a liquid curable resin composition. Examples of resins used in the liquid curable resin composition include epoxy resins and silicone resins. Since the thermal expansion coefficient of resins is generally larger than that of metals and semiconductors, fillers are mixed into the resin to lower the thermal expansion coefficient. The third sealing member 70 contains silicon dioxide (SiO2) particles, titanium dioxide (TiO2) particles, aluminum oxide (Al2O3) particles, magnesium oxide (MgO) particles, aluminum nitride (AlN) particles, boron nitride (BN) particles, silicon carbide (SiC) particles, etc., as fillers. The third sealing member 70 is, for example, a silicone resin that is reflective to visible light from the light-emitting element 10.

[0032] The interface between the third sealing member 70 and the substrate 60 can become a pathway for VOCs having conjugated double bonds to reach the adhesive member 30 and the first sealing member 40, so it is preferable that the third sealing member 70 adheres closely to the substrate 60 and does not peel off. By including a filler having a negative coefficient of thermal expansion in the third sealing member, the peeling of the third sealing member 70 from the substrate 60 can be reduced. Examples of filler materials having a negative coefficient of thermal expansion include Invar alloy, cordierite, β-eucryptite, zirconium tungstate, zirconium phosphate, and zeolite, but an insulating filler material is preferred due to concerns about short-circuit failures. A zeolite capable of gas adsorption is preferable for the third sealing member 70 to also perform the role of the second sealing member 50. In this case, the third sealing member 70 reduces the amount of VOCs having conjugated double bonds that can reach the adhesive member 30 and the first sealing member 40 from outside the light-emitting device by passing through the interface between the third sealing member 70 and the substrate 60. Even if the VOCs having conjugated double bonds adsorbed on the third sealing member 70 change color, since most of the visible light from the light-emitting element 10 is blocked by the first sealing member 40, it hardly causes any decrease in the light output of the light-emitting device.

[0033] An example of the manufacturing process for the light-emitting device 100 is described below.

[0034] (Steps to prepare the intermediate) Multiple intermediate bodies 80 are prepared. Here, preparation means procurement or manufacturing. As shown in Figure 4, the intermediate body 80 comprises a light-emitting element 10, a light-transmitting member 20, an adhesive member 30 located between the light-emitting element 10 and the light-transmitting member 20, and a first sealing member 40 covering their sides.

[0035] (Steps to arrange intermediates) Intermediate bodies 80 are placed one by one on a substrate where base bodies 60 are arranged vertically and horizontally, corresponding to each base body 60. Semiconductor elements are placed one by one between intermediate bodies 80 and adjacent intermediate bodies 80 in either the row or column direction of the placed intermediate bodies 80. Flip-chip mounting can be used for arranging the intermediate bodies 80 and semiconductor elements. Examples of bonding materials for flip-chip mounting include gold bumps, solder, and conductive adhesives such as silver paste, and the bonding material for flip-chip mounting can be appropriately selected according to the performance required of the light-emitting device 100.

[0036] (Step of placing the third sealing member) The dispenser nozzle is moved along the sides of the multiple intermediates 80 and the multiple semiconductor elements to position the liquid curable resin composition that will become the third sealing member 70 around the multiple intermediates 80 and the multiple semiconductor elements. The liquid curable resin composition that will become the third sealing member 70 penetrates and fills the space between the first sealing member 40 located below the light-emitting element 10 and the substrate 60, and between the semiconductor elements and the substrate 60, by capillary action. Then, the liquid curable resin composition that will become the third sealing member 70 is heat-cured to form the third sealing member 70. In the above, a dispenser was used, but other methods such as injection molding may also be used.

[0037] (Step of placing the second sealing member) The dispenser nozzle is moved along the sides of the multiple intermediates 80 and the sides of the multiple semiconductor elements to place the second sealing member 50 on the substrate 60. The second sealing member 50 covers the entire upper surface of the multiple semiconductor elements.

[0038] (A process of separating each light-emitting device) Multiple light-emitting devices 100 are formed by simultaneously cutting the second sealing member 50 and the substrate 60 along the cutting lines. The cutting lines are arranged between intermediate bodies 80 in either the row direction or the column direction, and between intermediate bodies 80 and semiconductor elements in either the row direction or the column direction, so as to include at least one intermediate body 80 and one semiconductor element.

[0039] Instead of the intermediate 80 shown in Figure 4 above, the intermediate 81 shown in Figure 5 may be used. The sides of the light-emitting element 10 and the adhesive member 30 are covered with the first sealing member 40. The light-transmitting member 20 covers the top surface of the adhesive member 30 and the top surface of the first sealing member 40. The sides of the light-transmitting member 20 are not covered with the first sealing member 40.

[0040] When the intermediate 81 is used, the light-emitting device 101 becomes a modified version of the first embodiment as shown in Figures 6 and 7.

[0041] <Second Embodiment> A second embodiment of the light-emitting device 200 according to the present invention will be described below with reference to Figures 8 and 9. In the description of the components used in the light-emitting device 200, the same components used in the light-emitting device 100 will be omitted as appropriate, and the other components will be described in detail.

[0042] As shown in Figure 8, the light-emitting device 200 comprises, in a top view, a first sealing member 40, a fourth sealing member 90, and a second sealing member 50 in order from the light-transmitting member 20 outward. The first sealing member 40 is arranged continuously and seamlessly around the light-transmitting member 20, the fourth sealing member 90 is arranged continuously and seamlessly around the first sealing member 40, and the second sealing member 50 is arranged continuously and seamlessly around the fourth sealing member 90. As shown in Figure 9, the light-emitting device 200 comprises a base 60, a light-emitting element 10 located on the upper surface of the base 60, a third sealing member 70 located between the upper surface of the base 60 and the light-emitting element 10, and a light-transmitting member 20 located on the top surface of the light-emitting element 10 via an adhesive member 30.

[0043] The material of the first sealing member 40 is, for example, a white resin obtained by mixing titanium dioxide (TiO2) particles or the like as a filler into a methyl silicone resin. The first sealing member 40 is formed by, for example, coating it using a dispenser, so that it is continuously arranged around the light-emitting element 10 when viewed from above, and then cured. The first sealing member 40 may contain a fiber reinforcing material. The fiber reinforcing material mixed into the first sealing member 40 reduces the occurrence of cracks in the first sealing member 40 due to changes over time, and reduces the possibility that these cracks become a pathway for VOCs with conjugated double bonds to reach the adhesive member 30. The material of the fiber reinforcing material includes, for example, glass fibers, alumina nanofibers, and cellulose nanofibers. Cellulose nanofibers are derived from plant fibers and have a low environmental impact, have a lower specific gravity than glass fibers, and when blended into the resin, they reduce dimensional changes during curing.

[0044] The third sealing member 70 may be hidden by the first sealing member 40 or may protrude from the first sealing member 40 when viewed from above. In the light-emitting device 200, the third sealing member 70 covers the bottom surface of the light-emitting element 10, except for the bottom surface of the pair of electrodes of the light-emitting element 10. In this case, it is preferable that the adsorption capacity of the third sealing member 70 for VOCs having conjugated double bonds is smaller than the adsorption capacity of the second sealing member 50 for VOCs having conjugated double bonds. This is because it is possible to reduce the discoloration of the adsorbed VOCs having conjugated double bonds due to the visible light and heat emitted by the light-emitting element 10, which reduces the decrease in reflectivity to visible light.

[0045] (Fourth sealing member) As shown in Figure 9, the fourth sealing member 90 is positioned between the outer surface of the third sealing member 70 and the outer surface of the first sealing member 40 and the inner surface of the second sealing member 50. The fourth sealing member 90 covers the outer surface of the first sealing member 40 and the surface of the third sealing member 70 that protrudes from the first sealing member 40, and is in contact with the upper surface of the base body 60. The fourth sealing member 90 is continuously and seamlessly arranged from the top surface of the light-emitting device 200 on the side of the light-transmitting member 20 to the base body 60 and is in contact with the base body 60. The fourth sealing member 90 may also cover a portion of the top surface of the first sealing member 40. The VOC permeability of the fourth sealing member 90 is less than that of the first sealing member 40. As a result, the fourth sealing member 90 reduces the amount of VOC that passes through the fourth sealing member 90, reaches the first sealing member 40, and is adsorbed into its interior.

[0046] The material of the fourth sealing member 90 is, for example, a phenyl silicone resin containing titanium dioxide (TiO2) particles as a filler, epoxy resin, cellulose nanofiber, silicon dioxide (SiO2), aluminum oxide (Al2O3), niobium oxide (Nb2O5), tantalum oxide (Ta2O5), aluminum nitride (AlN), silicon nitride (SiN) x The material is an insulating film, layered silicate, or inorganic plate-like crystal aggregate, or a multilayer film thereof, comprising at least one selected from the group consisting of silicon dioxide (SiON), silicon carbide (SiC), zirconium oxide (ZrO2), hafnium oxide (HfO2), titanium oxide (TiO2), zinc oxide (ZnO), indium oxide (In2O3), tin oxide (SnO2), and titanium nitride (TiN).

[0047] For forming the fourth sealing member 90, methods such as dispensing, spray coating, casting, sputtering, and atomic deposition can be used as appropriate depending on the material.

[0048] The intermediate body 80 shown in Figure 4 or the intermediate body 81 shown in Figure 5 may be used. In these cases, the third sealing member 70 is located between the upper surface of the base body 60 and the bottom surface of the first sealing member 40.

[0049] When the intermediate 80 is used, the light-emitting device 201 becomes a first modified example of the second embodiment as shown in Figure 10.

[0050] Furthermore, when the intermediate 81 is used, the light-emitting device 202 becomes a second modified example of the second embodiment as shown in Figure 11. [Industrial applicability]

[0051] The light-emitting devices according to each embodiment of this disclosure can be used as light sources for general indoor lighting fixtures, vehicle lighting fixtures, backlights for information terminal equipment, streetlights, traffic signals, and other lighting fixtures. [Explanation of Symbols]

[0052] 10 light-emitting elements 20 Light-transmitting member 30 Adhesive members 40 First sealing member 50 Second sealing member 60 Substrate 70 Third sealing member 80 Intermediate 81 Intermediate 90 Fourth sealing member 100 Light-emitting devices 101 Light-emitting device 200 Light-emitting devices 201 Light-emitting device 202 Light-emitting device ------------------------------------

Claims

1. Light-emitting element and A plate-shaped light-transmitting member that covers the top surface of the light-emitting element, An adhesive member is located between the light-emitting element and the light-transmitting member and is made of polysiloxane or porous amorphous silica, A first sealing member that covers the side surface of the light-emitting element and the side surface of the adhesive member, The device comprises a second sealing member that covers the outer surface of the first sealing member and the side surface of the light-transmitting member, The adsorption capacity of the second sealing member for volatile organic compounds having conjugated double bonds is greater than the adsorption capacity of the first sealing member for the volatile organic compounds. Light-emitting device.

2. The light-emitting device according to claim 1, wherein the first sealing member covers the side surface of the light-transmitting member.

3. A substrate having wiring electrically connected to the light-emitting element, The light-emitting device according to claim 1 or 2, wherein a third sealing member is provided between the light-emitting element and the substrate on the bottom side of the light-emitting element.

4. The light-emitting device according to claim 3, wherein the third sealing member includes a filler having a negative coefficient of thermal expansion.

5. A substrate having wiring electrically connected to the light-emitting element, The device comprises a fourth sealing member located between the outer surface of the first sealing member and the inner surface of the second sealing member, in contact with the base body, and continuous from the side of the light-transmitting member to the base body, The light-emitting device according to claim 1 or 2, wherein the permeability of the fourth sealing member to volatile organic compounds is lower than that of the first sealing member to volatile organic compounds.

6. The light-emitting device according to claim 1 or 2, wherein the top or bottom surface of the light-transmitting member is made of an inorganic single crystal, inorganic glass, or an inorganic compound sintered body.

7. The light-emitting device according to claim 2, wherein the first sealing member includes a fiber-reinforced material.

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