Resistor module

Abstract

This suppresses the increase in mounting area when mounting multiple resistors. [Solution] The resistor module 100 comprises a resistor group 20 including a plurality of resistors 1a to 1f, a first metal plate 2, and a second metal plate 3. The first metal plate 2 is connected to one end of the resistor group 20 so as to sandwich the resistor group 20. The second metal plate 3 is connected to the other end of the resistor group 20.

Description

Technical Field

[0001] The present disclosure relates to a resistor module.

Background Art

[0002] For example, Japanese Unexamined Patent Publication No. 2013-254983 (Patent Document 1) describes a chip resistor. The chip resistor described in Patent Document 1 is surface-mounted.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

[0004] [Summary] When the chip resistor described in Patent Document 1 is used as, for example, a discharge resistor, it is conceivable to surface-mount a plurality of chip resistors. In this case, an installation area corresponding to the number of chip resistors is required, which becomes a factor that increases the size of a device including the chip resistors. Accordingly, an object of the present disclosure is to suppress an increase in mounting area when mounting a plurality of resistors.

[0005] The resistor module of the present disclosure includes a resistor group including a plurality of resistors, a first metal plate, and a second metal plate. The first metal plate is connected to one end of the resistor group so as to sandwich the resistor group therebetween. The second metal plate is connected to the other end of the resistor group.

Brief Description of Drawings

[0006] [Figure 1] It is a schematic side view of the resistor module according to the present embodiment. [Figure 2] It is a top view of the resistor module shown in FIG. 1. [Figure 3] It is a schematic side view showing a first modification of the resistor module according to the present embodiment. [Figure 4]This is a schematic side view showing a second modified example of the resistor module according to this embodiment.

[0007] [Detailed explanation] A resistor module according to an embodiment of the present disclosure will be described below. In the following drawings, the same reference numerals are used for identical or corresponding parts, and redundant descriptions will not be repeated.

[0008] (Resistor module configuration) Figure 1 is a schematic side view of the resistor module according to this embodiment. Figure 2 is a top view of the resistor module shown in Figure 1. The configuration of the resistor module 100 according to this disclosure will be described below with reference to the drawings.

[0009] As shown in Figures 1 and 2, the resistor module 100 mainly comprises a resistor group 20 including a plurality of resistors 1a to 1f, a first metal plate 2, a second metal plate 3, and solders 4, 5, and 6. The resistor group 20 is sandwiched between the first metal plate 2 and the second metal plate 3. Specifically, the first metal plate 2 is connected to one end of the resistor group 20 via solder 4, so as to sandwich the resistor group 20 between itself and the second metal plate 3. The second metal plate 3 is connected to the other end of the resistor group 20, which is located opposite to the first end, via solder 6.

[0010] The first metal plate 2 is a flat metal member having a bent portion. As shown in Figure 1, the side view of the first metal plate 2 is L-shaped. The first metal plate 2 includes a resistive connection portion 2a, an extended portion 2c, and a terminal portion 2b. The resistive connection portion 2a and the extended portion 2c are connected. The extending directions of the resistive connection portion 2a and the extended portion 2c are the same. However, the extending directions of the resistive connection portion 2a and the extending portion 2c may be different. The extended portion 2c and the terminal portion 2b are connected. In the extended portion 2c, the end opposite to the end connected to the resistive connection portion 2a is connected to the terminal portion 2b. The connection between the terminal portion 2b and the extended portion 2c is the bent portion 2d.

[0011] The extending directions of the resistive connection portion 2a and the extending portion 2c are different from the extending direction of the terminal portion 2b. The angle between the extending direction of the resistive connection portion 2a and the extending direction of the terminal portion 2b (first bending angle) is, for example, 70° or more and 110° or less. This bending angle may also be 80° or more and 100° or less, or 90°.

[0012] The second metal plate 3 has basically the same configuration as the first metal plate 2. That is, as shown in Figure 1, the side view shape of the second metal plate 3 is L-shaped. The second metal plate 3 includes a resistive connection portion 3a, an extended portion 3c, and a terminal portion 3b. The resistive connection portion 3a and the extended portion 3c are connected. The extending directions of the resistive connection portion 3a and the extended portion 3c are the same. However, the extending directions of the resistive connection portion 3a and the extending portion 3c may be different. The extended portion 3c and the terminal portion 3b are connected. In the extended portion 3c, the end opposite to the end connected to the resistive connection portion 3a is connected to the terminal portion 3b. The connection between the terminal portion 3b and the extended portion 3c is the bent portion 3d.

[0013] The extending directions of the resistive connection portion 3a and the extending portion 3c are different from the extending direction of the terminal portion 3b. The angle between the extending direction of the resistive connection portion 3a and the extending direction of the terminal portion 3b (second bending angle) is, for example, 70° or more and 110° or less. This bending angle may also be 80° or more and 100° or less, or 90°. In the first metal plate 2 and the second metal plate 3, the terminal portions 2b and 3b are arranged at a distance from the resistive connection portions 2a and 3a. The terminal portion 2b is arranged to extend from the bending portion 2d toward the second metal plate 3. The terminal portion 3b is arranged to extend from the bending portion 3d toward the first metal plate 2.

[0014] The first metal plate 2 and the second metal plate 3 are arranged to face each other. At this time, the resistive connection portion 2a of the first metal plate 2 and the resistive connection portion 3a of the second metal plate 3 are arranged to face each other and extend parallel to each other. The resistor group 20 is arranged so as to be sandwiched between the two resistive connection portions 2a and 3a. The resistor group 20 is connected to the resistive connection portions 2a and 3a via solder 4 and 6.

[0015] The resistor group 20 includes six resistors 1a, 1b, 1c, 1d, 1e, and 1f, as shown in Figure 1, for example. The resistors 1a to 1f included in the resistor group 20 are planar mount type resistors. As shown in Figure 1, resistors 1a, 1b, and 1c are arranged at intervals so as to be stacked along the extending direction of the resistor connection portion 2a. In other words, resistors 1a, 1b, and 1c are arranged in multiple rows away from the terminal portion 2b. Resistors 1d, 1e, and 1f are arranged at intervals so as to be stacked along the extending direction of the resistor connection portion 3a. In other words, resistors 1d, 1e, and 1f are arranged in multiple rows away from the terminal portion 3b. Resistors 1a, 1b, and 1c are arranged adjacent to resistors 1d, 1e, and 1f. Resistors 1a, 1b, and 1c and resistors 1d, 1e, and 1f are connected by solder 5. In other words, resistors 1a, 1b, 1c and resistors 1d, 1e, 1f are connected in series, bridging the gap between the first metal plate 2 and the second metal plate 3.

[0016] Resistors 1a and 1d are arranged side by side in the horizontal direction (perpendicular to the surface of the resistor connection part 2a). Resistors 1b and 1e, and resistors 1c and 1f are also arranged side by side. In Figure 1, the resistor group 20 consists of multiple resistors 1a to 1f arranged in a 3x2 matrix when viewed from the side. In Figure 2, the top view shows a case where there is one row of resistors connected in series between the first metal plate 2 and the second metal plate 3, but there may be multiple rows of resistors connected in series.

[0017] Each resistor 1a to 1f includes two electrodes and a resistive element sandwiched between the two electrodes. One electrode 10 of resistors 1a, 1b, and 1c is connected to a resistive connection part 2a via solder 4. The electrodes 10 of resistors 1a, 1b, and 1c connected to solder 4 constitute one end of the resistor group 20. The other electrode 10 of resistors 1a, 1b, and 1c is connected to one electrode 10 of resistors 1d, 1e, and 1f via solder 5. The other electrode 10 of resistors 1d, 1e, and 1f is connected to a resistive connection part 3a via solder 6. The electrodes 10 of resistors 1d, 1e, and 1f connected to solder 6 constitute the other end of the resistor group 20. Fillet portions 4a and 4b are formed at the upper and lower ends of solder 4, respectively. Fillet portions 6a and 6b are formed at the upper and lower ends of solder 6, respectively. The upper and lower surfaces of solder 5 are curved in a convex shape outwards.

[0018] Any metal material can be used to make up the first metal plate 2 and the second metal plate 3, but for example, copper or a copper alloy can be used. The first metal plate 2 and the second metal plate 3 may have a coating layer such as a plating layer on the surface of a base material. The base material may be made of a metal material such as the copper mentioned above. Any conductive material can be used to make up the plating layer. The thickness t of the first metal plate 2 and the second metal plate 3 (specifically the resistive connection parts 2a, 3a and the extended parts 2c, 3c) may be 0.01 mm or more and 1.00 mm or less. Preferably, the thickness t is 0.05 mm or more and 0.40 mm or less.

[0019] The first metal plate 2 and the second metal plate 3 are preferably made of a material and sized to be easily deformable so as to absorb thermal stress caused by heat generation in the resistor group 20. For example, at least one of the resistor connection portions 2a, 3a and the extension portions 2c, 3c may include a deformable portion that is easily elastically deformable. The deformable portion may be a portion having a thickness thinner than the thickness of the terminal portions 2b, 3b, for example. Alternatively, the deformable portion may be a bent portion formed by locally bending the resistor connection portion 2a, 3a or the extension portion 2c, 3c.

[0020] (Configuration of First Modification of Resistor Module) FIG. 3 is a schematic side view showing a first modification of the resistor module according to the present embodiment. The resistor module 100 shown in FIG. 3 basically has the same configuration as the resistor module 100 shown in FIGS. 1 and 2, except that the configurations of the first metal plate 2 and the second metal plate 3 are different from those of the resistor module 100 shown in FIGS. 1 and 2.

[0021] That is, in the resistor module 100 shown in FIG. 3, the terminal portions 2b and 3b are arranged not to extend below the resistor group 20 but to extend outside the resistor group 20 in a plan view. From a different perspective, the terminal portion 2b of the first metal plate 2 extends in a direction opposite to the direction where the second metal plate 3 is located as viewed from the bent portion 2d. The terminal portion 3b of the second metal plate 3 extends in a direction opposite to the direction where the first metal plate 2 is located as viewed from the bent portion 3d.

[0022] With such a configuration, the same effects as those of the resistor module 100 shown in FIGS. 1 and 2 can also be obtained.

[0023] (Configuration of Second Modification of Resistor Module) FIG. 4 is a schematic side view showing a second modification of the resistor module according to the present embodiment. The resistor module 100 shown in FIG. 4 basically has the same configuration as the resistor module 100 shown in FIGS. 1 and 2, except that the configuration of the resistor group 20 is different from that of the resistor module 100 shown in FIGS. 1 and 2.

[0024] That is, in the resistor module 100 shown in FIG. 4, the resistor group 20 includes nine resistors 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i. In the resistor group 20 shown in FIG. 4, the plurality of resistors 1a to 1i are arranged in a 3-row and 3-column matrix in a side view.

[0025] Resistors 1a, 1b, and 1c are arranged at intervals so as to be stacked along the extending direction of the resistor connection section 2a. Resistors 1d, 1e, and 1f are arranged at intervals so as to be stacked along the extending direction of the resistor connection section 2a. Resistors 1g, 1h, and 1i are arranged at intervals so as to be lined up in multiple rows along the direction away from the terminal section 3b (the extending direction of the resistor connection section 3a). Resistors 1a, 1b, and 1c are arranged adjacent to resistors 1d, 1e, and 1f. Resistors 1g, 1h, and 1i are arranged adjacent to resistors 1d, 1e, and 1f. Resistors 1d, 1e, and 1f are arranged in the region opposite to the region where resistors 1a, 1b, and 1c are located, as viewed from resistors 1d, 1e, and 1f. Resistors 1a, 1b, and 1c and resistors 1d, 1e, and 1f are connected by solder 5. Resistors 1g, 1h, and 1i are connected to resistors 1d, 1e, and 1f by solder 5. In other words, resistors 1a, 1b, and 1c, resistors 1d, 1e, and 1f, and resistors 1g, 1h, and 1i are connected in series between the first metal plate 2 and the second metal plate 3.

[0026] Resistors 1a, 1d, and 1g are arranged side by side in the horizontal direction (perpendicular to the surface of the resistor connection part 2a). Resistors 1b, 1e, and 1h are also arranged side by side in the horizontal direction. Resistors 1c, 1f, and 1i are also arranged side by side in the horizontal direction.

[0027] The configurations of resistors 1a to 1i are the same as those of resistors 1a to 1f shown in Figures 1 and 2. One electrode 10 of resistors 1a, 1b, and 1c is connected to the resistor connection part 2a via solder 4. The electrodes 10 of resistors 1a, 1b, and 1c connected to solder 4 constitute one end of the resistor group 20. The other electrode 10 of resistors 1a, 1b, and 1c is connected to one electrode 10 of resistors 1d, 1e, and 1f via solder 5. The other electrode 10 of resistors 1d, 1e, and 1f is connected to one electrode 10 of resistors 1g, 1h, and 1i via solder 5. The other electrode 10 of resistors 1g, 1h, and 1i is connected to the resistor connection part 3a via solder 6. The electrodes 10 of resistors 1g, 1h, and 1i connected to solder 6 constitute the other end of the resistor group 20.

[0028] (action) The resistor module 100 according to this disclosure comprises a resistor group 20 including a plurality of resistors 1a to 1i, a first metal plate 2, and a second metal plate 3. The first metal plate 2 is connected to one end of the resistor group 20 so as to sandwich the resistor group 20. The second metal plate 3 is connected to the other end of the resistor group 20.

[0029] In this way, when mounting the resistor module 100 on a mounting surface such as the surface of a circuit board, it is sufficient for parts of the first metal plate 2 and the second metal plate 3 (terminal portions 2b and 3b) to be connected to the mounting surface. As a result, compared to directly surface-mounting multiple resistors 1a to 1i on a mounting surface such as the surface of a circuit board, it is possible to mount multiple resistors 1a to 1i while reducing the area occupied by the resistor module 100 on the mounting surface (area of ​​the connection portion).

[0030] Furthermore, in the resistor group 20 sandwiched between the first metal plate 2 and the second metal plate 3, multiple resistors 1a to 1i can be arranged three-dimensionally. In this respect as well, the projected area of ​​the resistor module 100 relative to the mounting surface can be reduced compared to the case where multiple resistors 1a to 1i are directly mounted on the mounting surface as described above.

[0031] Now, consider the case where resistors 1a to 1i are directly connected to the mounting surface using a bonding material such as solder. In this case, thermal stress is generated due to the heat generated by the current flowing through the resistors 1a to 1i. This thermal stress can cause problems such as cracks to form in the bonding material. On the other hand, in the resistor module 100 according to this disclosure, the resistor group 20 is held between the first metal plate 2 and the second metal plate 3. Therefore, thermal stress caused by the heat generated by the current flowing through the resistor group 20 can be alleviated by the deformation of the first metal plate 2 and the second metal plate 3. As a result, it is possible to suppress the occurrence of damage such as cracks in the joints (for example, solder 4, 6) between the resistors 1a to 1i and the first metal plate 2 and the second metal plate 3 due to the thermal stress.

[0032] In the resistor module 100 described above, each of the first metal plate 2 and the second metal plate 3 includes resistor connection portions 2a and 3a and terminal portions 2b and 3b. The resistor connection portions 2a and 3a are connected to the resistor group 20. The terminal portions 2b and 3b are spaced apart from the resistor connection portions 2a and 3a.

[0033] In this case, the resistor module 100 can be mounted by connecting its terminals 2b and 3b to the mounting surface. In other words, the area occupied by the resistor module 100 on the mounting surface is the area of ​​terminals 2b and 3b. Therefore, the area required to mount multiple resistors 1a to 1i can be reduced compared to mounting multiple resistors 1a to 1i directly side by side on the mounting surface.

[0034] In the resistor module 100 described above, the extension direction of the terminal portions 2b and 3b is different from the extension direction of the resistor connection portions 2a and 3a.

[0035] In this case, if the terminals 2b and 3b are positioned along the mounting surface and connected to it, the extension direction of the resistor connection parts 2a and 3a will be different from the extension direction of the mounting surface. In other words, the extension direction of the resistor connection parts 2a and 3a will be in the direction of protrusion from the mounting surface, and the resistor group 20 will be positioned away from the mounting surface. Therefore, since the resistor group 20 will be positioned in an area away from the mounting surface, the number of resistors 1a to 1i included in the resistor group 20 can be increased without increasing the installation area of ​​the resistor module 100 on the mounting surface.

[0036] In the resistor module 100 described above, as shown in Figures 1, 3, and 4, the multiple resistors 1a to 1i are arranged in multiple rows in a direction away from the terminal portions 2b and 3b.

[0037] In this case, multiple resistors 1a to 1i are stacked in a direction away from the terminals 2b and 3b connected to the mounting surface, that is, away from the mounting surface. Therefore, multiple resistors 1a to 1i can be mounted without increasing the area occupied by the resistor module 100 on the mounting surface.

[0038] In the resistor module 100 described above, at least some of the multiple resistors 1a to 1i are connected in series between the first metal plate 2 and the second metal plate 3.

[0039] In this case, a circuit configuration can be realized in which some of the resistors 1a to 1i are connected in series in the resistor module 100.

[0040] The various aspects of this disclosure are summarized below as an appendix.

[0041] (Note 1) A group of resistors including multiple resistors, A resistor module comprising a first metal plate connected to one end of the resistor group and a second metal plate connected to the other end of the resistor group, so as to sandwich the resistor group.

[0042] (Note 2) The resistor module according to Appendix 1, wherein each of the first metal plate and the second metal plate includes a resistor connection portion connected to the resistor group and a terminal portion spaced apart from the resistor connection portion.

[0043] (Note 3) The resistor module as described in Appendix 2, wherein the extending direction of the terminal portion is different from the extending direction of the resistor connection portion.

[0044] (Note 4) The resistor module as described in Appendix 2 or Appendix 3, wherein the plurality of resistors are arranged in multiple rows in a direction away from the terminal portion.

[0045] (Note 5) A resistor module according to any one of the appendices 1 to 4, wherein at least some of the plurality of resistors are connected in series between the first metal plate and the second metal plate.

[0046] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The basic scope of this disclosure is indicated by the claims rather than the foregoing description and is intended to include all modifications in the sense and scope equivalent to the claims. [Explanation of Symbols]

[0047] 1a~1i resistor, 2 first metal plate, 2a,3a resistance connection part, 2b,3b terminal part, 2c,3c extension part, 2d,3d bent part, 3 second metal plate, 4,5,6 solder, 4a,4b,6a,6b fillet part, 10 electrode, 20 resistor group, 100 resistor module.

Claims

1. A group of resistors including multiple resistors, A first metal plate is connected to one end of the resistor group so as to sandwich the resistor group, A resistor module comprising a second metal plate connected to the other end of the resistor group.

2. The resistor module according to claim 1, wherein each of the first metal plate and the second metal plate includes a resistor connection portion connected to the resistor group and a terminal portion spaced apart from the resistor connection portion.

3. The resistor module according to claim 2, wherein the extending direction of the terminal portion is different from the extending direction of the resistor connection portion.

4. The resistor module according to claim 2, wherein the plurality of resistors are arranged in multiple rows in a direction away from the terminal portion.

5. The resistor module according to any one of claims 1 to 4, wherein at least some of the plurality of resistors are connected in series to connect the first metal plate and the second metal plate.

Images