Resin composition for gas barrier film, gas barrier film, and laminated film

Abstract

The present invention provides a resin composition for gas barrier films that exhibits excellent gas barrier properties, tear strength, and appearance. [Solution] A resin composition for a gas barrier film according to one aspect of the present invention comprises a liquid crystal polymer having a melting point of 230°C or less and a phenoxy resin, wherein the phenoxy resin has epoxy groups at only one end of the main chain or at only both ends of the main chain.

Description

[Technical Field]

[0001] The present invention relates to a resin composition for gas barrier films, a gas barrier film, and a laminated film. [Background technology]

[0002] Conventionally, liquid crystal polymers have been widely used in the electrical and electronics industry as materials for components of various products due to their excellent properties such as high gas barrier properties, high heat resistance, and dimensional stability. For example, Patent Document 1 discloses a liquid crystal polyester resin composition, molded articles, and composite members characterized by comprising a liquid crystal polyester and a bisphenol-type epoxy compound having epoxy groups at both ends of the main chain and at the ends of the side chains. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2011-137064 [Overview of the project] [Problems that the invention aims to solve]

[0004] However, the liquid crystal polyester resin composition described in Patent Document 1 has not been studied for molding into a gas barrier film. When this composition is molded into a gas barrier film, the epoxy groups at the ends of the side chains of the bisphenol-type epoxy compound tend to crosslink with the carboxyl groups at the ends of the liquid crystal polyester. As a result of this crosslinking, unmelted material is generated, leading to a problem of poor appearance of the gas barrier film.

[0005] In view of the above, one aspect of the present invention aims to provide a resin composition for gas barrier films that is excellent in gas barrier properties, tear strength, and appearance. [Means for solving the problem]

[0006] A resin composition for a gas barrier film according to one aspect of the present invention comprises a liquid crystal polymer having a melting point of 230°C or lower and a phenoxy resin, wherein the phenoxy resin has epoxy groups at only one end of the main chain or at only both ends of the main chain. [Effects of the Invention]

[0007] According to one aspect of the present invention, a resin composition for gas barrier films with excellent gas barrier properties, tear strength, and appearance can be provided. [Modes for carrying out the invention]

[0008] Embodiments of the present invention will be described below. In this specification, unless otherwise specified, the "~" indicating a numerical range means that the numbers before and after it are included as the lower and upper limits.

[0009] <Resin composition for gas barrier film> The resin composition for gas barrier films of this embodiment comprises a liquid crystal polymer (A) having a melting point of 230°C or lower, and a phenoxy resin (B). Furthermore, the phenoxy resin (B) has epoxy groups at only one end of the main chain, or at only both ends of the main chain. This makes it possible to provide a resin composition for gas barrier films with excellent gas barrier properties, tear strength, and appearance.

[0010] Specifically, according to the resin composition for gas barrier films of this embodiment, a gas barrier film with excellent gas barrier properties can be formed due to the gas barrier properties of the liquid crystal polymer (A) and the hydrogen bonding derived from the hydroxyl groups of the phenoxy resin (B). In this specification, gas barrier properties refer to the property of blocking gases, and include water vapor barrier properties that block water vapor and oxygen barrier properties that block oxygen.

[0011] Further, since the phenoxy resin (B) has an epoxy group only at one terminal of the main chain or only at both terminals of the main chain, that is, it does not have an epoxy group in a side chain, crosslinking formation between the phenoxy resin (B) and the liquid crystal polymer (A) that causes unmelted products can be suppressed. Therefore, according to the resin composition for a gas barrier film of the present embodiment, the occurrence of defective structures such as granular foreign matters can be suppressed, and a gas barrier film having excellent appearance can be formed.

[0012] Further, according to the resin composition for a gas barrier film of the present embodiment, an aluminum-free (aluminum-free) gas barrier film can be formed, so that the amount of CO₂ generated in the production and disposal processes can be reduced. Also, at the time of disposal, the gas barrier film can be disposed of as plastic waste, so it can be easily sorted and collected. Furthermore, since the resin composition for a gas barrier film of the present embodiment is aluminum-free, it can be used for products used in production lines employing a metal detector that detects metallic foreign matters and the like.

[0013] [Liquid Crystal Polymer (A)] The melting point of the liquid crystal polymer (A) is preferably 220° C. or lower. When the melting point of the liquid crystal polymer (A) is 220° C. or lower, the molding temperature can be made relatively low, and changes of the phenoxy resin (B) due to thermal decomposition or the like can be suppressed. Therefore, according to the resin composition for a gas barrier film of the present embodiment, a gas barrier film having more excellent tear strength can be formed.

[0014] Examples of monomer components constituting the liquid crystal polymer (A) include one or more selected from terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-biphenyldicarboxylic acid, hydroquinone, resorcinol, 2,6-dihydroxynaphthalene, 4,4'-biphenol, p-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 4-aminobenzoic acid, 4-aminophenol, 1,4-phenylenediamine, and the like.

[0015] The liquid crystal polymer (A) preferably contains a terephthalic acid component as a monomer component constituting the liquid crystal polymer (A). Thereby, according to the resin composition for a gas barrier film of the present embodiment, a gas barrier film having more excellent gas barrier properties can be formed.

[0016] The liquid crystal polymer (A) preferably contains a hydroquinone component as a monomer component constituting the liquid crystal polymer (A). Thereby, according to the resin composition for a gas barrier film of the present embodiment, a gas barrier film having more excellent gas barrier properties can be formed.

[0017] The liquid crystal polymer (A) preferably contains a p-hydroxybenzoic acid component and a 6-hydroxy-2-naphthoic acid component as monomer components constituting the liquid crystal polymer (A). When the liquid crystal polymer (A) contains a p-hydroxybenzoic acid component and a 6-hydroxy-2-naphthoic acid component as monomer components, according to the resin composition for a gas barrier film of the present embodiment, a gas barrier film having more excellent gas barrier properties and tear strength can be formed. From the viewpoint of improving gas barrier properties, the liquid crystal polymer (A) more preferably contains a p-hydroxybenzoic acid component and a 6-hydroxy-2-naphthoic acid component as main components among the monomer components. Here, the term "main component" means that the content of the component is 50 mol% or more based on all monomer components constituting the liquid crystal polymer (A).

[0018] The monomer components constituting the liquid crystal polymer (A) are preferably aromatic compounds. Thereby, according to the resin composition for a gas barrier film of the present embodiment, a gas barrier film having more excellent gas barrier properties can be formed.

[0019] Examples of liquid crystal polymers (A) include VECTORA® and ZENITE® manufactured by Celanese, UENO LCP® manufactured by Ueno Pharmaceutical Co., Ltd., LAPEROS® manufactured by Polyplastics, Inc., XYDAR® manufactured by ENEOS Corporation, and Sumika Super® LCP® manufactured by Sumitomo Chemical Co., Ltd.

[0020] [Phenoxy resin (B)] Phenoxy resin (B) is a resin synthesized from bisphenols and epichlorohydrin, and phenoxy resin (B) has epoxy groups at only one end of the main chain, or at only both ends of the main chain. Specifically, phenoxy resin (B) is the phenoxy resin shown in the following formula (1).

[0021] [ka]

[0022] In the above equation (1), R 1 and R 2 One or both of them contain an epoxy group. 1 It is a glycidyl group (2,3-epoxypropyl group), R 3 R may be a hydrogen group, 1 and R 3 Both may be glycidyl groups. Also, substituents R of bisphenols may be 3 , R 4 These can be independently defined as hydrogen groups or alkyl groups such as methyl or ethyl groups.

[0023] In the above formula (1), the number-average degree of polymerization n is preferably 40 or more and 800 or less, more preferably 50 or more and 500 or less, and even more preferably 100 or more and 300 or less. The number-average degree of polymerization n can be measured by GPC (Gel Permeation Chromatography, on a polystyrene basis).

[0024] As the phenoxy resin (B), for example, the substituent R of the bisphenol in the above formula (1) 3 and R 4 is a bisphenol A (BPA) type phenoxy resin in which both are CH₃, R 3 and R 4 is a bisphenol F (BPF) type phenoxy resin in which both are H, a BPA / BPF copolymerized phenoxy resin obtained by copolymerizing bisphenol A type and bisphenol F type, R 3 and R 4 includes bisphenol B type phenoxy resin wherein one of is CH₃ and the other is H. Among these, the phenoxy resin (B) is preferably a bisphenol A type phenoxy resin. Thereby, according to the resin composition for a gas barrier film, a gas barrier film having more excellent gas barrier properties, tear strength, and appearance can be formed.

[0025] The weight average molecular weight (Mw) of the phenoxy resin (B) is preferably 10,000 or more and 200,000 or less, more preferably 20,000 or more and 150,000 or less, and still more preferably 30,000 or more and 100,000 or less. When the average molecular weight of the phenoxy resin (B) is determined by GPC, for example, tetrahydrofuran (THF) is used as the GPC eluent, and the determination can be performed using a column obtained by connecting TSKgel G4000H and TSKgel G3000H (both manufactured by Tosoh Corporation).

[0026] Examples of phenoxy resin (B) include PHENOXY® manufactured by HUNTSMAN, and Phenotot® manufactured by Nippon Steel Chemical & Material Co., Ltd.: YP-50 (Mw 60,000-80,000, BPA type), YP-50S (Mw 50,000-70,000, BPA type), YP-55U (Mw 40,000-45,000, BPA type), YP-70 (Mw 50,000-60,000, BPA / BPF copolymer type), ZX-1356-2 (Mw 60,000 Examples include 0-80,000 (BPA / BPF copolymer type), FX-316 (Mw 40,000-60,000, BPF type), phenoxy type grades 1256 (molecular weight approximately 50,000, BPA type), 4250 (molecular weight approximately 60,000, BPA / BPF copolymer type), 4275 (molecular weight approximately 60,000, BPA / BPF copolymer type), 1255HX30, YX8100BH30, YX6954BH30, and PKHB, PKHC, PKHH, PKHJ from Tomoe Engineering Co., Ltd.

[0027] The melt flow rate of phenoxy resin (B), measured under conditions of a temperature of 230°C and a load of 2.16 kgf, is preferably 9 g / 10 min to 11 g / 10 min, and more preferably 10 g / 10 min to 11 g / 10 min. By having the melt flow rate of phenoxy resin (B) within the above range, a gas barrier film with superior tear strength can be formed using the resin composition for gas barrier films.

[0028] The glass transition temperature Tg of the phenoxy resin (B) is preferably 70°C to 90°C, and more preferably 80°C to 90°C. By having the glass transition temperature Tg of the phenoxy resin (B) within the above range, the resin composition for gas barrier films can form a gas barrier film with superior tear strength.

[0029] The content of liquid crystal polymer (A) is preferably 80% to 99% by mass and the content of phenoxy resin (B) is preferably 1% to 20% by mass relative to the total (100% by mass) of the resin composition for gas barrier films. More preferably, the content of liquid crystal polymer (A) is 85% to 95% by mass and the content of phenoxy resin (B) is 5% to 15% by mass. By having the content of liquid crystal polymer (A) and phenoxy resin (B) within the above ranges, the resin composition for gas barrier films can form a gas barrier film with superior gas barrier properties, tear strength, and appearance.

[0030] <Gas barrier film> The gas barrier film of this embodiment includes the resin composition for the gas barrier film of this embodiment. The composition of the resin composition for the gas barrier film is the same as described above and is therefore omitted. With this composition, the gas barrier film of this embodiment has excellent gas barrier properties, tear strength, and appearance.

[0031] The thickness of the gas barrier film is not particularly limited, but may be between 10 μm and 200 μm, and preferably between 15 μm and 120 μm.

[0032] The gas barrier film may contain additives as components other than the resin composition for the gas barrier film of this embodiment. The additives are not particularly limited, but examples include antioxidants, lubricants, antiblocking agents, stabilizers, UV absorbers, flame retardants, antistatic agents, and colorants.

[0033] Gas barrier films are preferably formed by extrusion molding. Examples of extrusion molding include T-die molding and inflation molding, but T-die molding is particularly preferred. Gas barrier films may be manufactured by heat-treating the film with a cooling roll after T-die molding. When continuously forming long films, it is preferable to wind the long molded gas barrier film after molding to improve productivity. Furthermore, when manufacturing laminated films using the molded gas barrier film, it is preferable to uniaxially stretch and biaxially stretch the gas barrier film before lamination. This improves the strength and heat deformation resistance of the gas barrier film.

[0034] <Laminated film> The laminated film of this embodiment comprises the gas barrier film of this embodiment and a resin layer laminated on one side of the gas barrier film, wherein the resin layer contains a resin other than the liquid crystal polymer (A) and phenoxy resin (B). The configuration of the gas barrier film is the same as described above and is therefore omitted. With this configuration, the laminated film of this embodiment has excellent gas barrier properties, tear strength, and appearance, and can exhibit the functions of the resin layer.

[0035] The material constituting the resin layer is not particularly limited, but for example, it may include polyester resin. Examples of polycarboxylic acid components constituting the polyester resin contained in the resin layer include one or more selected from terephthalic acid, isophthalic acid, naphthalene-1,4-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, adipic acid, sebacic acid, etc.

[0036] Examples of polyhydric alcohol components constituting the polyester resin, other than diethylene glycol, include one or more selected from ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexamethylenediol, cyclopentanedimethanol, cyclohexanedimethanol, neopentyl glycol, 2,2-diethyl-1,3-propanediol, 2,2-dipropyl-1,3-propanediol, 2-propyl-2-methyl-1,3-propanediol, 2-propyl-2-ethyl-1,3-propanediol, 2-isopropyl-2-methyl-1,3-propanediol, 2-isopropyl-2-ethyl-1,3-propanediol, 2-butyl-2-methyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, etc. Note that this polyester resin is non-liquid crystallinity and differs from liquid crystal polymer (A).

[0037] The polyester resin is preferably a modified polyethylene terephthalate composed of a dicarboxylic acid component consisting of terephthalic acid, and a diol component containing diethylene glycol, ethylene glycol, and 1,4-butanediol. This results in a laminated film with superior gas barrier properties and tear strength.

[0038] The glass transition temperature (Tg) of the polyester resin is preferably between -10°C and 40°C, and more preferably between 10°C and 30°C. A glass transition temperature (Tg) of -10°C to 40°C allows for improved flexibility of the polyester resin, resulting in a laminated film with superior tear strength.

[0039] If the thickness of the gas barrier film is A and the thickness of the resin layer is B, then B / A is preferably 0.1 to 0.4, and more preferably 0.2 to 0.3. When B / A is 0.1 to 0.4, the laminated film has superior gas barrier properties and tear strength.

[0040] The thickness of the laminated film is not particularly limited, but may be 70 μm to 90 μm relative to a total thickness of 100 μm, and the thickness of the resin layer may be 10 μm to 30 μm. When the thickness of the laminated film is 70 μm to 90 μm and the thickness of the resin layer is 10 μm to 30 μm, the laminated film has superior gas barrier properties and tear strength.

[0041] It is preferable that the laminated film is formed by co-extrusion molding. Co-extrusion molding allows for the simultaneous melt-extrusion of the materials constituting the gas barrier film and the materials constituting the resin layer, thereby forming the film. This increases the adhesive strength between the gas barrier film and the resin layer compared to when the gas barrier film and the resin layer are laminated by a lamination method.

[0042] Furthermore, since the liquid crystal polymer (A) constituting the gas barrier film has a melting point of 230°C or lower, the heating temperature during co-extrusion molding can be kept relatively low, and changes in the resin, such as the polyester resin constituting the resin layer, due to thermal decomposition can be suppressed. Therefore, the laminated film can exhibit excellent tear strength. Even when a long laminated film is continuously molded and the long molded film is wound up after molding, the laminated film has excellent tear strength, so tearing can be suppressed.

[0043] The resin composition for gas barrier films, the gas barrier film, and the laminated film of this embodiment can be used in industrial applications such as encapsulants for electronic devices, encapsulants for fuel cells, and optical communication components. Furthermore, because the resin composition for gas barrier films, the gas barrier film, and the laminated film are heat-resistant, they can also be used in high-temperature environments.

[0044] As described above, embodiments have been explained, but these embodiments are presented as examples only, and the present invention is not limited by these embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, substitutions, and modifications are possible without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Examples]

[0045] The present invention will be specifically described below with reference to examples. However, the present invention is not limited to these examples.

[0046] In Examples 1 and 2 and Comparative Examples 1 to 4, the raw materials were mixed in the proportions shown in Table 1, melted, and then extruded using a T-die extruder to obtain a gas barrier film with a thickness of 100 μm.

[0047] [Table 1]

[0048] The details of each raw material shown in Table 1 are as follows. Here, ρ represents density, Tm represents melting point, and IV represents intrinsic viscosity. The intrinsic viscosity is the value (dl / g) measured at 30°C in a mixed solvent of phenol / 1,1,2,2-tetrachloroethane in a mass ratio of 1 / 1.

[0049] "LCP" - UENO LCP (registered trademark) A-8100 (low melting point liquid crystal polymer, ρ = 1.40 g / cm³) 3 (Tm=220℃, manufactured by Ueno Pharmaceutical Co., Ltd.) "Phenoxy resin" ... Phenotot (registered trademark) YP-50S (Bisphenol A type phenoxy resin, MFR = 10.2g / 10min (temperature 230℃, load 2.16kgf), ρ = 1.18g / cm²) 3 (Tg=84℃, Mw=40,000, manufactured by Nippon Steel Chemical & Material Co., Ltd.) "E-GMA" ... BondFirst (registered trademark) BF-2C (ethylene-glycidyl methacrylate (GMA) copolymer (GMA 6% by mass, GMA 1.24 mol%), ρ = 0.930 g / cm³) 3 (Tm=105℃, MFR=3g / 10min (temperature 190℃, load 2.16kgf), MFR=8.4g / min (temperature 230℃, load 2.16kgf), manufactured by Sumitomo Chemical Co., Ltd.) "PET" ... Homo-PET (ρ=1.34g / cm³) 3 (IV=0.75, Tm=255℃)

[0050] Next, each of the obtained gas barrier films was evaluated as follows.

[0051] (Oxygen permeability, water vapor permeability) The oxygen permeability and water vapor permeability of the prepared film were measured in accordance with JIS K 7126-2 and JIS K 7129-2. 2 • Less than 1 day and oxygen permeability of 0.47 cc / m³ 2 A water vapor transmission rate of less than 0.10 g / m³ is considered acceptable. 2 • More than 1 day, or oxygen permeability of 0.47 cc / m³ 2 Applicants with a minimum of one day ATM were deemed unsuccessful.

[0052] (tear strength) In accordance with JIS K 7128-1, a 75mm long slit was made in the center of a 150mm x 50mm sample using the trouser tearing method. The tear strength in the flow direction was measured with a chuck width of 50mm and a tensile speed of 200mm / min. A tear strength of 0.29N or higher was considered acceptable, and anything below 0.29N was considered unacceptable.

[0053] (Film appearance) The appearance of the fabricated gas barrier film was visually inspected and evaluated based on the following evaluation criteria. A was considered a pass, and B was considered a fail. [Evaluation Criteria] A: No unmelted material (granular foreign matter) B: There are two or more unmelted pieces with a diameter of 1 mm or more within a 10 cm square area.

[0054] (processability) The film-forming properties and winding operability of the obtained film were confirmed when the raw material for gas barrier film was extruded using a T-die extruder. The overall evaluation of film-forming properties and winding operability was performed based on the following evaluation criteria. A was considered a pass, and B was considered a fail. [Evaluation Criteria] A: Good B: Bad

[0055] The evaluation results are shown in Table 2.

[0056] [Table 2]

[0057] In Examples 1 and 2, films were formed by extrusion molding, and the resulting gas barrier films passed all evaluations regarding gas barrier properties (oxygen permeability and water vapor permeability), tear strength, film appearance, and processability. In the gas barrier films of Examples 1 and 2, although the oxygen permeability and water vapor permeability tended to decrease as the phenoxy resin blending ratio increased, the oxygen permeability remained at 0.47 cc / m². 2 • Less than day·atm, water vapor transmission rate is 0.1 g / m³ 2 It was confirmed that the gas barrier properties were high, with a lifespan of less than 1 day.

[0058] In Comparative Example 1, although the gas barrier film exhibited excellent gas barrier properties and film appearance, intermittent tearing occurred in the flow direction during winding, preventing stable processing. This is because the tear strength in the flow direction was lower than that of the gas barrier films in Examples 1 and 2.

[0059] Although the gas barrier films of Comparative Examples 2 and 3 had good processability, they exhibited a greater amount of unmelted material in their appearance compared to Examples 1 and 2. This is because the phenoxy resin contained in the raw materials of Examples 1 and 2 has epoxy groups located only at both ends of the main chain, resulting in fewer parts that react with the liquid crystal polymer, whereas the E-GMA copolymer contained in the raw materials of Comparative Examples 2 and 3 has three or more graft-polymerized epoxy groups on the molecular side chains, resulting in many parts that react with the carboxyl groups at the ends of the liquid crystal polymer, making it prone to gelation through crosslinking.

[0060] Furthermore, when comparing phenoxy resin and E-GMA with liquid crystal polymer at the same blending ratio (Example 1 and Comparative Example 2, Example 2 and Comparative Example 3), the gas barrier films of Comparative Examples 2 and 3 had higher oxygen permeability and water vapor permeability than the gas barrier films of Examples 1 and 2, respectively, meaning they had lower gas barrier properties.

[0061] When comparing phenoxy resin and PET with liquid crystal polymer at the same mixing ratio (Example 1 and Comparative Example 4), the gas barrier film of Comparative Example 4 had a water vapor transmission rate that was more than twice as high as the gas barrier film of Example 1.

[0062] (Aspects of the present invention) The present invention includes the following embodiments. <Aspect 1> It comprises a liquid crystal polymer having a melting point of 230°C or lower and a phenoxy resin. The phenoxy resin is a resin composition for gas barrier films having epoxy groups at only one end of the main chain, or at only both ends of the main chain. <Aspect 2> The resin composition for gas barrier films according to Embodiment 1 is wherein the melt flow rate of the phenoxy resin, measured under the conditions of a temperature of 230°C and a load of 2.16 kgf, is 9 g / 10 min or more and 11 g / 10 min or less. <Aspect 3> The phenoxy resin is a bisphenol A type phenoxy resin, as described in embodiment 1 or 2 of the resin composition for gas barrier films. <Aspect 4> The liquid crystal polymer is a resin composition for gas barrier films according to any one of embodiments 1 to 3, comprising a terephthalic acid component as a monomer component constituting the liquid crystal polymer. <Aspect 5> The liquid crystal polymer is a resin composition for gas barrier films according to any one of embodiments 1 to 4, comprising a hydroquinone component as a monomer component constituting the liquid crystal polymer. <Aspect 6> The liquid crystal polymer is a resin composition for gas barrier films according to any one of embodiments 1 to 5, comprising a p-hydroxybenzoic acid component and a 6-hydroxy-2-naphthoic acid component as monomer components constituting the liquid crystal polymer. <Aspect 7> A gas barrier film comprising the resin composition for gas barrier films described in any one of embodiments 1 to 6. <Aspect 8> This is a gas barrier film according to embodiment 7, which is formed by extrusion molding. <Pattern 9> A gas barrier film according to embodiment 7 or 8, The gas barrier film has a resin layer laminated on at least one surface, The resin layer is a laminated film containing resins other than the liquid crystal polymer and the phenoxy resin. <Aspect 10> This is a laminated film according to embodiment 9, which is formed by co-extrusion molding.

Claims

1. It comprises a liquid crystal polymer having a melting point of 230°C or lower and a phenoxy resin. The phenoxy resin is a resin composition for gas barrier films having epoxy groups at only one end of the main chain, or at only both ends of the main chain.

2. The resin composition for a gas barrier film according to claim 1, wherein the melt flow rate of the phenoxy resin, measured under the conditions of a temperature of 230°C and a load of 2.16 kgf, is 9 g / 10 min or more and 11 g / 10 min or less.

3. The resin composition for gas barrier films according to claim 2, wherein the phenoxy resin is a bisphenol A type phenoxy resin.

4. The resin composition for gas barrier films according to claim 3, wherein the liquid crystal polymer comprises a terephthalic acid component as a monomer component constituting the liquid crystal polymer.

5. The resin composition for gas barrier films according to claim 4, wherein the liquid crystal polymer comprises a hydroquinone component as a monomer component constituting the liquid crystal polymer.

6. The resin composition for gas barrier films according to claim 5, wherein the liquid crystal polymer comprises a p-hydroxybenzoic acid component and a 6-hydroxy-2-naphthoic acid component as monomer components constituting the liquid crystal polymer.

7. A gas barrier film comprising the resin composition for gas barrier films according to any one of claims 1 to 6.

8. The gas barrier film according to claim 7, which is formed by extrusion molding.

9. The gas barrier film according to claim 7, The gas barrier film has a resin layer laminated on at least one surface, The resin layer is a laminated film containing resins other than the liquid crystal polymer and the phenoxy resin.

10. The laminated film according to claim 9, which is formed by co-extrusion molding.

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