Printed circuit board and method for manufacturing a printed circuit board

Abstract

The present invention provides a printed circuit board with improved structural stability, which can be used as a bridge board. Furthermore, it provides a manufacturing method that enables the efficient production of printed circuit boards. [Solution] One embodiment of the present invention provides a printed circuit board comprising a main portion including a plurality of insulating layers and a plurality of conductive layers stacked in a first direction, a margin portion disposed on the outside of the main portion in the lateral direction and including an insulator connected to the insulating layers of the main portion, and at least one pad disposed on the main portion, wherein, with respect to the first direction, at least a portion of the upper surface of the margin portion is located above the cover surface, with respect to the first direction, when the upper surface of the main portion is covered by the pad and the uncovered surface is an open surface.

Description

[Technical Field]

[0001] The present invention relates to a printed circuit board and a method for manufacturing a printed circuit board. [Background Art]

[0002] Recently, with the development of technologies such as artificial intelligence (Artificial Intelligence, AI), packages including memory chips such as HBM (High Bandwidth Memory) for geometrically increasing data processing and processor chips such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field Programmable Gate Array) and the like have been used. In this regard, as the development of semiconductor microfabrication process technology is delayed and the problem of rapid cost increase accompanying miniaturization has emerged, the importance of packaging technology has emerged, and major companies are focusing on securing competitiveness in advanced semiconductor packaging technology. In order to meet such technical requirements, technologies using silicon interposers have been developed, but there are limitations to commercialization due to price problems and complicated assembly processes. [Summary of the Invention] [Problems to be Solved by the Invention]

[0003] One of the objects of the present invention is to provide a printed circuit board capable of improving structural stability, and such a printed circuit board can be suitably used as a bridge substrate. Further, according to the present invention, it is possible to provide a manufacturing method capable of efficiently manufacturing a printed circuit board. [Means for Solving the Problems]

[0004] In order to solve the above-mentioned problems, an embodiment of the present invention provides: The present invention provides a printed circuit board comprising a main portion including a plurality of insulating layers and a plurality of conductive layers stacked in a first direction, a margin portion disposed on the outside of the main portion in the lateral direction and including an insulator connected to the insulating layers of the main portion, and at least one pad disposed on the main portion, wherein when the upper surface of the main portion covered by the pad is defined as the cover surface and the uncovered surface is defined as the open surface, at least a portion of the upper surface of the margin portion is located above the cover surface with respect to the first direction.

[0005] In one embodiment, the insulating layer of the main portion and the insulating material of the margin portion can be an integrated structure.

[0006] In one embodiment, the area of ​​the margin portion located above the cover surface and the area located below it can be an integrated structure.

[0007] In one embodiment, the insulating layer of the main portion and the insulating material of the margin portion can be made of the same material.

[0008] In one embodiment, the margin portion does not need to include a conductor layer connected to the conductor layer of the main portion.

[0009] In one embodiment, the margin portion does not need to include a conductive layer.

[0010] In one embodiment, a portion of the margin can come into contact with the side surface of the pad.

[0011] In one embodiment, the outer surface of the margin portion can be a cut surface.

[0012] In one embodiment, when the second and third directions are perpendicular to each other while being perpendicular to the first direction, the margin portion may be positioned outside the main portion in the second and third directions.

[0013] In one embodiment, the height of the upper surface of the margin portion can decrease as it moves outward in the lateral direction.

[0014] In one embodiment, the upper surface of the margin portion may include a curved surface with a concave shape.

[0015] In one embodiment, the entire upper surface area of ​​the margin portion can be located above the cover surface of the main portion.

[0016] In one embodiment, at least a portion of the upper surface of the margin can be located below the upper surface of the pad.

[0017] In one embodiment, the entire area of ​​the upper surface of the margin portion can be located below the upper surface of the pad.

[0018] In one embodiment, the cover surface and the open surface can be positioned at substantially the same level with respect to the first direction.

[0019] In one embodiment, the open surface may be a substantially flat surface.

[0020] In one embodiment, the open surface can be positioned above the cover surface with respect to the first direction.

[0021] In one embodiment, the open surface may include a curved surface.

[0022] In one embodiment, with reference to the first direction, at least a portion of the upper surface of the margin can be located below the open surface.

[0023] In one embodiment, the open surface may be a substantially flat surface.

[0024] In one embodiment, the uppermost portion of the top surface of the margin portion may be positioned at substantially the same level as the open surface.

[0025] In one embodiment, at least a portion of the top surface of the margin portion may be positioned above the open surface with reference to the first direction.

[0026] In one embodiment, a plurality of said pads are provided, and a distance between adjacent ones of said plurality of pads may be shorter than a width of said margin portion.

[0027] In one embodiment, the open surface is a substantially flat surface, and the top surface of the margin portion may include a curved surface.

[0028] In one embodiment, the top surface of the margin portion may be a substantially flat surface.

[0029] In one embodiment, the conductor layer may be disposed inward in the lateral direction than the one of the at least one pad that is disposed outermost in the lateral direction.

[0030] In one embodiment, the margin portion may include a separate conductor layer separated from the conductor layer of the main portion.

[0031] In one embodiment, a part of the conductor layer may be disposed outward in the lateral direction than the one of the at least one pad that is disposed outermost in the lateral direction.

[0032] In one embodiment, the margin portion may include a part of the conductor layer of the main portion.

[0033] Another aspect of the present invention is The present invention provides a printed circuit board comprising a substrate portion and a bridge substrate embedded in the substrate portion, wherein the bridge substrate comprises a main portion including a plurality of insulating layers and a plurality of conductive layers stacked in a first direction, a margin portion disposed on the lateral side of the main portion and including an insulator connected to the insulating layers of the main portion, and at least one pad disposed on the main portion, wherein, with reference to the first direction, at least a portion of the upper surface of the margin portion is located above the lower surface of the pad.

[0034] In one embodiment, the bridge substrate may be placed in the recess of the substrate portion.

[0035] In one embodiment, the material may further include an insulating material that fills the recess and covers the bridge substrate.

[0036] In one embodiment, the insulating material can form an interface with the insulator in the margin portion.

[0037] In one embodiment, the insulating material and the insulating material of the margin portion may be made of different materials.

[0038] In one embodiment, the material may further include a plurality of via layers that penetrate the insulating material and are connected to the pads of the bridge substrate.

[0039] In one embodiment, the conductor layer of the bridge substrate and the substrate portion include a plurality of conductor patterns, and the average distance between the plurality of conductor patterns of the bridge substrate may be shorter than the average distance between the plurality of conductor patterns of the substrate portion.

[0040] Another aspect of the present invention is A method for manufacturing a printed circuit board is manufactured, comprising the steps of: forming a substrate laminate by stacking multiple insulating layers and multiple conductive layers; forming multiple pads on multiple printed circuit board regions of the substrate laminate; filling the margin regions between adjacent printed circuit board regions with an insulator; and dicing the margin regions filled with the insulator to separate the substrate laminate into unit substrates.

[0041] In one embodiment, the step of forming the substrate laminate may include the step of preparing carriers and the step of repeatedly forming the plurality of insulating layers and the plurality of conductive layers on the carriers.

[0042] In one embodiment, the process may further include the steps of attaching a transfer substrate to the substrate laminate and separating the carrier from the substrate laminate.

[0043] In one embodiment, before the step of filling the insulator, the height of the upper surface of the margin region may be lower than the height of the upper surface of the printed circuit board region.

[0044] In one embodiment, during the step of filling the insulator, the insulator may be filled to a height higher than the area of ​​the upper surface of the substrate laminate that is covered by the plurality of pads.

[0045] In one embodiment, during the step of filling the insulator, a portion of the insulator can also be filled into the printed circuit board area.

[0046] In one embodiment, during the step of filling the insulator, a portion of the insulator can cover the plurality of pads.

[0047] In one embodiment, the method may further include the step of removing at least a portion of the insulator that has been filled into the printed circuit board area. [Effects of the Invention]

[0048] In the case of a printed circuit board according to one example of the present invention, structural stability can be improved. In particular, when such a printed circuit board is used as a bridge board, mountability within the master board can be greatly improved, thereby improving the performance and reliability of the printed circuit board. Furthermore, the printed circuit board can be efficiently manufactured through the manufacturing method of the printed circuit board according to one example of the present invention. [Brief explanation of the drawing]

[0049] [Figure 1] This is a block diagram illustrating an example of an electronic equipment system. [Figure 2] This is a schematic cross-sectional view showing an example of a printed circuit board. [Figure 3] Figure 2 is a plan view of a printed circuit board seen from one direction. [Figure 4] This is a schematic cross-sectional view showing a modified example of a printed circuit board. [Figure 5] This is a schematic cross-sectional view showing a modified example of a printed circuit board. [Figure 6] This is a schematic cross-sectional view showing a modified example of a printed circuit board. [Figure 7] This is a schematic cross-sectional view showing a modified example of a printed circuit board. [Figure 8] This is a schematic cross-sectional view showing a modified example of a printed circuit board. [Figure 9] This is a schematic cross-sectional view showing a modified example of a printed circuit board. [Figure 10] This shows an example of the manufacturing process for printed circuit boards. [Figure 11] This shows an example of the manufacturing process for printed circuit boards. [Figure 12] This shows an example of the manufacturing process for printed circuit boards. [Figure 13] This shows an example of the manufacturing process for printed circuit boards. [Figure 14] This shows an example of the manufacturing process for printed circuit boards. [Figure 15]This shows an example of the manufacturing process for printed circuit boards. [Figure 16] This is a schematic cross-sectional view showing a modified example of a printed circuit board. [Figure 17] This is a schematic cross-sectional view showing an example of a printed circuit board including a bridge board. [Modes for carrying out the invention]

[0050] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0051] electronic equipment Figure 1 is a block diagram illustrating an example of an electronic equipment system.

[0052] Referring to the drawing, the electronic device 1000 houses a main board 1010. The main board 1010 is physically and / or electrically connected to chip-related components 1020, network-related components 1030, and other components 1040, etc. These are also coupled with other electronic components, which will be described later, to form various signal lines 1090.

[0053] Chip-related components 1020 include, but are not limited to, memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPUs), graphics processors (e.g., GPUs), digital signal processors, cryptographic processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs). Furthermore, these chip-related components 1020 can be combined with each other. Chip-related components 1020 can also be in the form of a package containing the aforementioned chips and electronic components.

[0054] Network-related component 1030 includes, but is not limited to, any other wireless and wired protocols designated as Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth®, 3G, 4G, 5G, and later. It may also include any other numerous wireless or wired standards and protocols. Furthermore, network-related component 1030 can be combined with chip-related component 1020.

[0055] Other components 1040 include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCCs (low-temperature co-firing ceramics), EMI (electromagnetic interference) filters, and MLCCs (multi-layer ceramic capacitors). However, they are not limited to these, and may also include passive elements in the form of chip components used for various other applications. Furthermore, other components 1040 can be combined with chip-related components 1020 and / or network-related components 1030.

[0056] Depending on the type of electronic device 1000, it may include other electronic components that are physically and / or electrically connected to the main board 1010, or not connected. Examples of other electronic components include a camera module 1050, an antenna module 1060, a display 1070, and a battery 1080. However, it is not limited to these, and may also include audio codecs, video codecs, power amplifiers, compasses, accelerometers, gyroscopes, speakers, mass storage devices (e.g., hard disk drives), CDs (compact disks), DVDs (digital versatile disks), etc. In addition, depending on the type of electronic device 1000, it may also include other electronic components used for various purposes.

[0057] Electronic device 1000 can be a smartphone, personal digital assistant, digital video camera, digital still camera, network system, computer, monitor, tablet, laptop, netbook, television, video game, smartwatch, automobile, etc. However, it is not limited to these, and can also be any other electronic device that processes data.

[0058] Printed circuit board Figure 2 is a schematic cross-sectional view showing an example of a printed circuit board, and Figure 3 is a plan view of the printed circuit board of Figure 2 viewed from one direction. Referring to Figures 2 and 3, the printed circuit board 100 according to this embodiment includes a main portion 110 containing a plurality of insulating layers 111 and a plurality of conductive layers 112 stacked in a first direction D1, a margin portion 120, and at least one pad 130, where the upper surface of the margin portion 120 is formed to be relatively high. Specifically, when the upper surface of the main portion 110 covered by the pad 130 is called the cover surface S2 and the uncovered surface is called the open surface S3, at least a part of the upper surface S1 of the margin portion 120 is located above the cover surface S2 of the main portion 110 with respect to the first direction D1. When comparing surface levels without further explanation below, the first direction D1 is used as the reference, and surfaces located higher in the drawings correspond to higher levels. Generally, in a printed circuit board 100, the margin portion 120 has fewer conductive layers than the main portion 110 and is formed thinner than the margin portion 120. However, in this case, the possibility of defects occurring during the manufacturing process of the printed circuit board 100 is high, and structural stability may be low when used as a bridge board or the like. In this embodiment, the height of the upper surface S1 of the margin portion 120 is made higher than at least a part of the main portion 110, for example, the cover surface S2 covered by the pad 130, thereby reducing the defect rate during the manufacturing process and improving structural stability. The printed circuit board 100 is suitable for use as a bridge board, but can also be used as a general-purpose board other than a bridge board. The main components of the printed circuit board 100 will be described in detail below.

[0059] The main section 110 is the region in the printed circuit board 100 that performs the main function of the board, and includes a plurality of insulating layers 111 and a plurality of conductor layers 112 stacked in a first direction D1. The insulating layer 111 contains an insulating material, which may be an organic insulating material such as a photosensitive insulating material PID. When a photosensitive insulating material PID is used as the material for the insulating layer 111, the thickness of the insulating layer 111 can be minimized and photovia holes can be formed, so the plurality of conductor layers 112 can be designed at high density. However, the material for the insulating layer 111 is not limited to this, and other organic insulating materials such as ABF can also be used. If necessary, an inorganic insulating material such as silicon may also be included. Multiple insulating layers 111 can be stacked, and the number of layers stacked here is not particularly limited. In this case, the boundaries between the plurality of insulating layers 111 may be distinguishable or uncertain.

[0060] When used as a bridge substrate, for example, the multiple conductor layers 112 can provide die-to-die interconnection paths, and the number of layers is not particularly limited. The multiple conductor layers 112 can perform various functions depending on the design of the layer, and can include at least signal patterns. Each of the multiple conductor layers 112 can include line patterns, plane patterns, and / or pad patterns. Each of the multiple conductor layers 112 can include metallic materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Each of the multiple conductor layers 112 can include electroless plating layers (or chemical copper) and / or electroplating layers (or electrolytic copper), and may include sputtering layers if necessary.

[0061] When the printed circuit board 100 is used as a bridge board, the multiple conductor layers 112 can have an even higher circuit density of the conductor patterns (312 in Figure 14) included in the master board, which will be described later with respect to the embodiment in Figure 17. The multiple conductor layers 112 may have two high-density wiring layers and one ground layer, and the ground layer may omit line patterns for signal transmission, but is not limited to this. The high-density wiring layers may have only one design rule for line / space, for example, L / S being 2μm / 2μm or 1μm / 1μm, but is not limited to this. The multiple conductor layers 112 can be electrically connected to each other via conductive vias 113. Each conductive via 113 may contain a metallic material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Each conductive via 113 may include an electroless plating layer (or chemical copper) and / or an electroplating layer (or electrolytic copper), and may also include a sputtering layer if necessary. Each conductive via 113 may be a filled-type via hole filled with metallic material, but is not limited to this; it may also be a conformal-type via where metallic material is arranged along the wall surface of the via hole. Each conductive via 113 may have a tapered shape in cross-section, with the width of the upper end being wider than the width of the lower end. Each conductive via 113 can perform various functions depending on the design of the corresponding layer, and may include, for example, ground vias, power vias, signal vias, etc. Here, the signal via may include vias for transmitting various signals other than ground vias, power vias, etc., such as data signals. Depending on the upper and lower connection configuration, the conductive via 113 may include stacked vias and / or staggered vias.

[0062] The margin portion 120 is located on the outside of the main portion 110 in the lateral direction and includes an insulator 121 connected to the insulating layer 111 of the main portion 110. Here, the lateral direction of the main portion 110 may include a second direction D2 perpendicular to the first direction D1. Furthermore, a third direction D3 can be defined as a direction perpendicular to both the first direction D1 and the second direction D2. The insulator 121 of the margin portion 120 may include an organic insulating material such as a photosensitive insulating material PID, and may include the same material as the insulating layer 111 of the main portion 110. However, the insulator 121 of the margin portion 120 may also include an inorganic insulating material such as silicon. Regarding the manufacturing process, the insulating layer 111 of the main portion 110 and the insulator 121 of the margin portion 120 are obtained by laminating the same insulating layer. This allows the insulating layer 111 of the main portion 110 and the insulator 121 of the margin portion 120 to have an integrated structure. Furthermore, the insulating layer 111 of the main section 110 and the insulator 121 of the margin section 120 can be made of the same material.

[0063] As will be described later, the margin portion 120 can be provided as a dicing region for separating unit substrates during the manufacturing process of the printed circuit board 100. However, if the thickness of the margin portion 120 is thin, there is a high possibility of defects occurring in the printed circuit board 100 (for example, defects where the substrate is not separated from the carrier). In this embodiment, the margin portion 120 is formed relatively thick to ensure structural stability, and specifically, at least a portion of the upper surface S1 of the margin portion 120 is located above the cover surface S2 of the upper surface of the main portion 110. As will be described later, the margin portion 120 can be thickened by adding an insulator to the dicing region. When a subsequent curing process is performed, the region of the margin portion 120 located above the cover surface S2 and the region located below the cover surface S2 are not distinguished by a boundary and can form an integrated structure. As described above, when the margin portion 120 is formed thickly and the upper surface S1 is located above the cover surface S2 of the main portion 110, the pads 130 and the like can be effectively protected, and when used as a bridge substrate, the contact area with the base substrate is increased, improving structural stability. Furthermore, if the margin portion 120 is thin, there is a possibility of debonding failures occurring when separating the printed circuit board 100 from the carrier, but by forming the margin portion 120 thickly as in this embodiment, such failures can be reduced.

[0064] In this embodiment, the margin portion 120 does not have to include a conductor layer connected to the conductor layer 112 of the main portion 110. In other words, the conductor layer 112 of the main portion 110 may have its extension in the lateral direction, for example, in the second direction D2, limited and may not extend to the margin portion 120. This allows the dicing process to be carried out effectively via the margin portion 120. Furthermore, since the margin portion 120 does not include conductor layers connected to the conductor layer 112 of the main portion 110, nor conductor layers not connected thereto, it may not include any conductor layer at all.

[0065] At least one pad 130 is placed on the main section 110, and multiple pads 130 may be provided as in this embodiment. In this case, the surface on the main section 110 covered by the pad 130 can be defined as the covered surface S2, and the uncovered surface can be defined as the open surface S3. The pad 130 can perform various functions, including signal pads, ground pads, power pads, etc., and may include at least one signal pad 130. The pad 130 may include metallic materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. The pad 130 can be formed in a plating process and may include, but is not limited to, an electroless plating layer (or chemical copper) and an electroplating layer (or electrolytic copper). The pad 130 may include a sputtering layer if necessary. The pad 130 can be connected to the uppermost conductive layer 112 of the conductive layers 112 via the uppermost conductive via 113 of the conductive vias 113.

[0066] When we specifically examine the shape of the margin portion 120, and in particular the shape of the upper surface S1 of the margin portion 120, first, a part of the margin portion 120 can come into contact with the side surface of the pad 130. The outer surface of the margin portion 120 can be a cut surface, which corresponds to the case where the margin portion 120 is provided as a dicing area for separation into a unit substrate, as described above. Referring to Figure 3, the margin portion 120 may be located outside the main portion 110 in the second direction D2 and the third direction D3. In this case, the margin portion 120 can be in a form that surrounds the entire side surface of the main portion 110.

[0067] As shown in Figure 2, the upper surface S1 of the margin portion 120 can decrease in height as it moves laterally, for example, outward in the second direction D2. The upper surface S1 of the margin portion 120 can also include a concave curved surface. When the upper surface S1 of the margin portion 120 changes in height or is a curved surface, the surface area of ​​the margin portion 120 can increase, thereby improving structural stability when the printed circuit board 100 is used as a bridge board. In the case of a structure where the upper surface S1 of the margin portion 120 decreases in height as it moves laterally, for example, outward in the second direction D2, or a structure where the upper surface S1 of the margin portion 120 includes a concave curved surface, these can be formed by filling the margin portion 120 with a liquid insulator containing a photosensitive resin, as will be described later.

[0068] As shown in the configuration in Figure 2, the entire area of ​​the upper surface S1 of the margin portion 120 can be located above the cover surface S2 of the main portion 110, and as sufficient thickness of the main portion 110 is ensured, structural stability can be ensured during the debonding process that separates the printed circuit board 100 from the carrier. However, the thickness of the margin portion 120 can be limited to a range that does not excessively increase the volume of the printed circuit board 100 and interfere with the electrical connectivity of the pads 130. In this case, at least a portion of the upper surface S1 of the margin portion 120 can be located below the upper surface S4 of the pads 130, and more specifically, the entire area of ​​the upper surface S1 of the margin portion 120 can be located below the upper surface S4 of the pads 130.

[0069] On the other hand, with respect to the upper surface shape of the main portion 110, the cover surface S2 and the open surface S3 can be located at substantially the same level with respect to the first direction D1. In this case, as shown in the embodiment in Figure 2, the open surface S3 of the main portion 110 can be a substantially flat surface.

[0070] The modified embodiments will now be described with reference to Figures 4 to 9. First, in the modified form of Figure 4, there is a difference in the shape of the open surface S3 of the main portion 110. Specifically, with reference to the first direction D1, the open surface S3 of the main portion 110 can be located above the cover surface S2. In this case, as shown in the illustrated form, the open surface S3 of the main portion 110 can include a curved surface. As described above, in the process of replenishing and filling the margin portion 120 with a liquid insulator containing a photosensitive resin, etc., the liquid insulator can also be applied to the upper surface of the main portion 110, thereby obtaining a form in which the open surface S3 of the main portion 110 is located above the cover surface S2. Furthermore, if the spacing between adjacent pads 130 is relatively wide, the open surface S3 of the main portion 110 can be formed to have a curved surface. When the height of the open surface S3 of the main section 110 is increased, the bonding force between the multiple pads 130 can be increased, thereby ensuring structural stability and further reducing the occurrence of defects during the subsequent debonding process of the printed circuit board 100.

[0071] Next, in the modified form shown in Figure 5, the open surface S3 of the main portion 110 is provided as a flat surface while being located at a relatively high level, which can be achieved by reducing the width of the open surface S3. Specifically, with respect to the first direction D1, the open surface S3 of the main portion 110 may be located above the cover surface S2, and at least a portion of the upper surface S1 of the margin portion 120 may be located below the open surface S3. In this case, as shown in the illustrated form, the open surface of the main portion 110 can be a substantially flat surface. Also, the uppermost part of the upper surface S1 of the margin portion 120 may be located at substantially the same level as the open surface S3 of the main portion 110. The distance d2 between adjacent pads 130 may be shorter than the width d1 of the margin portion, so that the upper surface of the insulator filling between the pads 130 can be flat, unlike the main portion 110. In other words, the open surface S3 of the main portion 110 may be substantially flat, while the upper surface S1 of the margin portion 120 may include a curved surface. On the other hand, in the modified example shown in Figure 6, the level of the open surface S3 is slightly lower, and at least a portion of the upper surface S1 of the margin portion 120 is located above the open surface S3. This configuration is achieved by partially removing the insulator filled between the multiple pads 130, while maintaining the open surface S3 of the main portion 110 at a higher level than the cover surface S2.

[0072] In the above embodiment, the case where the upper surface S1 of the margin portion 120 has a curved surface, particularly a concave shape, is shown. However, as shown in the modified example in Figure 7, the upper surface S1 of the margin portion 120 can also be realized as a substantially flat surface.

[0073] On the other hand, in the modified example shown in Figure 8, the margin portion 120 includes a conductor layer 122, and in the modified example shown in Figure 9, the region in which the conductor layer 112 of the main portion 110 is arranged differs from the previous embodiment. That is, in the previous embodiment, the conductor layer 112 is located inward in the lateral direction from at least one pad 130, for example, the outermost pad in the second direction D2, and the margin portion 120 does not include a conductor layer connected to the conductor layer 112 of the main portion 110, or does not include any conductor layer at all. In contrast, as shown in the form in Figure 8, the margin portion 120 can include a separate conductor layer 122 that is separate from the conductor layer 112 of the main portion 110. Such a separate conductor layer 122 can be used for various purposes as needed, for example, to enhance the rigidity of the printed circuit board 100, or to perform EMI shielding. Furthermore, as shown in the configuration in Figure 9, a portion of the conductor layer 112 may be positioned further outward in the lateral direction than at least one pad 130 that is positioned furthest outward in the lateral direction, for example, in the second direction D2. In this case, the margin portion 120 may include a portion of the conductor layer 112 of the main portion 110.

[0074] Manufacturing method for printed circuit boards The following describes an example of a method for manufacturing a printed circuit board, with reference to Figures 10 to 15. The steps in this example are not necessarily in a specific order, as the context suggests, and each step can be performed in a different order.

[0075] First, as shown in Figure 10, a substrate laminate 210 is formed on a carrier 201. The carrier 201 may be a hard substrate containing glass or the like so that thermal deformation occurs with minimal effect even at high temperatures, and it can serve as a support when forming the substrate laminate 210. A seed layer 202 containing a metal such as copper or titanium can be placed on the carrier 201, and a release layer 203 for the subsequent debonding process can be placed between the carrier 201 and the seed layer 202. The release layer 203 can be formed, for example, from an inorganic insulating layer so that it can be stably peeled off even after the high-temperature reflow process. A bonding layer 204 containing a metal such as copper or titanium can be placed between the carrier 201 and the release layer 203. In the case of the substrate laminate 210, it may include a plurality of insulating layers 111 and a plurality of conductive layers 112, and conductive vias 113 connecting the plurality of conductive layers 112 may be provided. In the process of stacking multiple insulating layers 111 and multiple conductive layers 112 to form conductive vias 113, known methods for manufacturing printed circuit boards can be utilized.

[0076] The substrate stack 210 can be distinguished into numerous printed circuit board regions 110A and margin regions 120A between them. Here, the margin region 120A corresponds to the dicing region and can become the margin portion 120 described above after dicing. As shown in the configuration in Figure 10, the margin region 120A may not contain a conductive layer or may have a smaller volume of conductive layer than the printed circuit board region 110A, so it can be formed to be relatively thin. As a result, when separating the substrate stack 210 from the carrier 201, a part of the substrate stack 210 may not be separated. That is, the height of the upper surface of the margin region 120A may be lower than the height of the upper surface of the printed circuit board region 110A, and the larger this height difference, the more it can hinder structural stability in subsequent processes. On the other hand, in Figure 10, the substrate stack 210 is formed on one side of the carrier 201, but to improve process efficiency, the substrate stack 210 may be formed on both sides of the carrier 201 (upper and lower sides relative to the drawing).

[0077] Next, as shown in Figure 11, multiple pads 130 are formed on multiple printed circuit board regions 110A of the substrate laminate 210. The multiple pads 130 may include metallic materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. The multiple pads 130 can be formed in a plating process and may include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electroplated copper).

[0078] Next, as shown in Figure 12, an insulator 221 is filled into the margin region 120A between adjacent printed circuit board regions 110A. In this case, the insulator 221 may be filled to a height higher than the area covered by the multiple pads 130 on the upper surface of the substrate laminate 210. The insulator 221 can be formed in a shape where the height of the upper surface decreases as it moves away from the pads 130, for example, having a curved surface with a concave center. However, the upper surface of the insulator 221 may include a partially flat surface. The insulator 221 can be formed by selectively applying a liquid photosensitive resin to the margin region 120A, and after a subsequent curing process, it may become an integrated structure without distinguishing the boundary with the insulating layer 111. However, the insulator 221 may not be selectively applied only to the margin region 120A. For example, as shown in the modified example in Figure 15, a portion of the insulator 221 may also be filled into the printed circuit board region 110A. Furthermore, as shown in the modified example in Figure 16, the insulator 221 may be formed to cover the multiple pads 130. In this case, a further step can be taken to remove at least a portion of the insulator 221 that has filled the printed circuit board region 110A. For example, the insulator 221 formed on the multiple pads 130 can be removed by a subsequent etching step, and if necessary, a portion of the portion formed in the area between the multiple pads 130 and the margin region 120A in the printed circuit board region 110A can also be removed.

[0079] Next, as shown in Figure 13, the substrate laminate 210 can be separated from the carrier 201, and for this purpose, the transfer substrate 250 can be attached to the substrate laminate 210. The transfer substrate 250 may contain a material that has adhesive properties to separate the substrate laminate 210 from the carrier 201, for example, a PET material. In this case, as shown in the illustrated embodiment, at least a portion of the transfer substrate 250 can come into contact with the margin region 120A filled with the insulator 221, thereby effectively performing the debonding process and reducing defects in which a portion of the substrate laminate 210 is not separated from the carrier 201. However, even if the transfer substrate 250 does not come into contact with the margin region 120A, the adjacent printed circuit board region 110A is stably bonded by the thickened margin region 120A, so the debonding defects described above can be reduced. When separating the carrier 201, the seed layer 202 and the release layer 203 can separate from each other, but separation can also occur at different levels. In the case of a seed layer 202 bonded to a substrate laminate 210, at least a portion of it can be removed in a subsequent process.

[0080] Next, as shown in Figure 14, the region filled with the insulator 221, i.e., the margin region 120A, is diced (D) to separate the substrate stack 210 into unit substrates, thereby the unit substrates including the printed circuit board region 110A and a portion of the margin region 120A. As shown in the illustrated configuration, the transfer substrate 250 can be separated from the substrate stack 210 before the dicing process. For the dicing process, processes known in the field of printed circuit boards, such as utilizing a laser or other mechanical separation means, can be utilized. On the other hand, Figure 14 shows a configuration in which the seed layer 202 has been removed before the dicing process, but the seed layer 202 may be removed after the dicing process.

[0081] Printed circuit board including bridge board The following describes an example in which the printed circuit board described above is used as a bridge board. In Figure 17, the printed circuit board of Figure 2 is shown as the bridge board 100, and the base board including the bridge board 100 is shown as the printed circuit board 300. Referring to Figure 17, the printed circuit board 300 includes a substrate portion 310 and a bridge board 100 embedded in the substrate portion 310. Here, the bridge board 100 can be the printed circuit board described in the embodiment of Figure 2, and other printed circuit boards of other embodiments described above can also be used. A redundant explanation of the specific structure of the bridge board 100 will be omitted. By having the bridge board 100 have the structure described above, the bonding force with the substrate portion 310 in the margin portion 120 can be improved, thereby improving the structural stability of the printed circuit board 300.

[0082] The substrate portion 310 can be a multilayer substrate, for example, and may include a first insulating layer 311, a second insulating layer 321, a plurality of conductor patterns 312, and a plurality of first via layers 313. The bridge substrate 100 can be placed in a recess 310 of the substrate portion 310, in which case an adhesive can be used to bond the bridge substrate 100 to the substrate portion 310. The first insulating layer 311 may have a structure in which a plurality of insulating layers are laminated, and may include a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a material in which these resins are mixed with an inorganic filler such as silica, or a resin impregnated with an inorganic filler into a core material such as glass fiber (glass cloth, glass fabric), for example, an organic insulating material such as CCL (copper clad laminate), ABF (Ajinomoto build-up film), or prepreg. The second insulating layer 321 may include CCL as a core layer, in which case multiple insulating layers may be provided below the second insulating layer 321. The second insulating layer 321 may, if necessary, include other insulating materials in addition to the organic insulating material, such as glass plate.

[0083] The multiple conductor patterns 312 may include metallic materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. The multiple conductor patterns 312 may include, but are not limited to, electroless plating layers (or chemical copper) and electroplating layers (or electrolytic copper). A sputtered layer may be formed instead of chemical copper as the electroless plating layer, or both may be included. Copper foil may be further included as needed. Each of the multiple conductor patterns 312 can perform various functions depending on the design of the corresponding layer. For example, they may include ground patterns, power patterns, signal patterns, etc. These patterns may each include line patterns, plane patterns, and / or pad patterns. The conductor patterns of the bridge substrate 100 and the substrate portion 310 may have different pitches, and the pitch on the bridge substrate 100 may be shorter when considering their respective applications. Specifically, the average distance between multiple conductor patterns included in the conductor layer 112 of the bridge substrate 100 can be shorter than the average distance between multiple conductor patterns 312 of the substrate portion 310.

[0084] Multiple first via layers 313 can contain metallic material, such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Multiple first via layers 313 can perform a variety of functions depending on the design. For example, they can include ground vias, power vias, signal vias, etc. Each via layer 313 can contain, but is not limited to, an electroless plating layer (or chemical copper) and an electroplating layer (or electrolytic copper). A sputtered layer can be formed instead of chemical copper as the electroless plating layer, and both can be included. Multiple first via layers 313 can contain microvias. Here, the microvias can be filled vias that fill via holes or conformal vias arranged along the walls of via holes. The microvias can be arranged in a stacked type and / or staggered type. The microvias can have a tapered shape. The second insulating layer 321 may be provided with through vias 322 that penetrate it. The through vias 322 may include a metal layer formed on the wall surface of the through hole and a plug that fills the metal layer. The through vias 322 may have a cylindrical shape, but are not limited to this, and may also have an hourglass shape.

[0085] As shown in the illustrated configuration, the bridge substrate 100 may be placed in the recess R of the substrate portion 310. In this case, an insulating material 331 can be provided to fill the recess R and cover the bridge substrate 100. For example, the insulating material 331 can fill the space between the recess R and the bridge substrate 100, extend over the recess R and the bridge substrate 100, and cover one side of each of them. An insulating substance can be used as the forming material for the insulating material 331, for example, ABF (Ajinomoto Build-up Film) can be used, but is not limited to this. If the bridge substrate 100 is manufactured separately and placed in the substrate portion 310, the insulating material 331 can form an interface with the insulator 121 of the margin portion 120 of the bridge substrate 100. Furthermore, the insulating material 331 and the insulator 121 of the margin portion 120 may contain different materials from each other.

[0086] On the other hand, the printed circuit board 300 may further include a plurality of second via layers 333 that penetrate the insulating material 331 and are connected to the pads 130 of the bridge substrate 100. In the case of the second via layers 333, they can be applied in substantially the same form as the first via layer 313 described above. A plurality of second conductor patterns 332 are arranged on top of the insulating material 331 and are connected to the second via layers 333, and the plurality of second conductor patterns 332 may be in the form of pads. The printed circuit board 300 may further include a protective layer 341 disposed on the insulating material 331 and having openings that expose at least a portion of the conductor patterns 152. The protective layer 341 may include, but is not limited to, ABF or solder resist. The printed circuit board 300 may also further include a connecting conductor 342 disposed on the protective layer 341 and connected to the second conductor patterns 332. A conductive material can be used as the forming material for the connecting conductor 342, for example, a conductive post and / or solder ball can be used.

[0087] In this disclosure, "on a cross-section" can mean the cross-sectional shape when the object is cut vertically, or the cross-sectional shape when the object is viewed from the side. "On a plane" can mean the shape when the object is cut horizontally, or the planar shape when the object is viewed from the top or bottom.

[0088] In this disclosure, terms such as "upper," "upper," and "top surface" are used for convenience to mean the direction toward the surface on which electronic components can be mounted, based on the cross-section of the drawing, while terms such as "lower," "lower," and "bottom surface" are used to mean the opposite direction. However, these are merely definitions of directions for explanatory purposes, and the scope of the claims is not particularly limited by such descriptions of directions.

[0089] In this disclosure, thickness, width, length, depth, etc., can be measured using a scanning microscope or optical microscope based on a polished or cut cross-section of the printed circuit board. The cut cross-section can be vertical or horizontal, and the respective values ​​can be measured based on the required cut cross-section. If the values ​​are not constant, the values ​​can be determined by the average of the values ​​measured at any five points. The width of the upper and / or lower ends of vias and recesses can be measured on a cross-section of the board cut along its central axis in the thickness direction. In this disclosure, the pitch can be measured by photographing the cut cross-section of the printed circuit board with a scanning microscope or optical microscope, and the average pitch may be the average of the pitch between traces measured at any five points.

[0090] In this disclosure, the term "connected" includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, the term "electrically connected" includes both physically connected and non-connected cases. The terms "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of those components. In some cases, without departing from the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component.

[0091] The expression "example" as used in this disclosure does not mean that each embodiment is identical to another, but is provided to highlight and illustrate the unique features of each embodiment that are distinct from one another. However, the examples presented above do not preclude their implementation in combination with features of other examples. For example, even if a matter described in one example is not described in another example, it can be understood as a description related to the other example unless there is a description in the other example that contradicts or inconsistes with that matter.

[0092] The terms used in this disclosure are for illustrative purposes only and are not intended to limit the disclosure. Where otherwise, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of symbols]

[0093] 1000 electronic equipment 1010 Mainboard 1020 Chip-related components 1030 Network-related components 1040 Other parts 1050 Camera Module 1060 Antenna Module 1070 Display 1080 Battery 1090 signal line D1 1st direction D2 2nd direction D3 Third direction d1 Margin width d2 Distance between adjacent pads 130 S1 Upper surface of margin section 120 S2 Cover Surface S3 Open Surface S4 Pad 130 Top Surface 100, 300 Printed Circuit Boards 110 Main section 110A Printed Circuit Board Area 111 Insulating layer 112, 122 Conductor layer 113 Conductive via 120 Margin section 120A Margin Area 121 Insulator 130 pads 201 Careers 202 Seed Layer 203 Exfoliation layer 204 Bonding layer 210 Substrate Stack 221 Insulator 250 Transfer substrates 310 Circuit board section 311 First insulating layer 312 First Conductor Pattern 313 First via layer 321 Second insulating layer 322 Through via 331 Insulating material 332 Second Conductor Pattern 333 Second via layer 341 Protective layer 342 Connecting conductor

Claims

1. A main section comprising multiple insulating layers and multiple conductor layers stacked in a first direction, A margin portion is provided which is located on the outside of the main portion in the lateral direction and includes an insulator connected to the insulating layer of the main portion, The main portion includes at least one pad disposed on the main portion, When the upper surface of the main part is such that the surface covered by the pad is considered the cover surface and the uncovered surface is considered the open surface, A printed circuit board in which, with reference to the first direction, at least a portion of the upper surface of the margin portion is located above the cover surface.

2. The printed circuit board according to claim 1, wherein the insulating layer of the main portion and the insulating material of the margin portion are integrally structured.

3. The printed circuit board according to claim 1, wherein the area located above the cover surface and the area located below the cover surface in the margin portion are integrally structured.

4. The printed circuit board according to claim 1, wherein the insulating layer of the main portion and the insulating material of the margin portion are made of the same material.

5. The printed circuit board according to claim 1, wherein the margin portion does not include a conductor layer connected to the conductor layer of the main portion.

6. The printed circuit board according to claim 1, wherein the margin portion does not include a conductive layer.

7. The printed circuit board according to claim 1, wherein a portion of the margin portion is in contact with the side surface of the pad.

8. The printed circuit board according to claim 1, wherein the outer surface of the margin portion is a cut surface.

9. When the second and third directions are directions that are perpendicular to the first direction but also perpendicular to each other, The printed circuit board according to claim 1, wherein the margin portion is located outside the main portion in the second and third directions.

10. The printed circuit board according to claim 1, wherein the upper surface of the margin portion decreases in height as it moves outward in the lateral direction.

11. The printed circuit board according to claim 1, wherein the upper surface of the margin portion includes a curved surface with a recessed shape.

12. The printed circuit board according to claim 1, wherein the entire area of ​​the upper surface of the margin portion is located above the cover surface of the main portion.

13. The printed circuit board according to claim 1, wherein at least a portion of the upper surface of the margin portion is located below the upper surface of the pad.

14. The printed circuit board according to claim 13, wherein the entire area of ​​the upper surface of the margin portion is located below the upper surface of the pad.

15. The printed circuit board according to claim 1, wherein the cover surface and the open surface are located at substantially the same level with respect to the first direction.

16. The printed circuit board according to claim 14, wherein the open surface is substantially flat.

17. The printed circuit board according to claim 1, wherein the open surface is located above the cover surface with reference to the first direction.

18. The printed circuit board according to claim 17, wherein the open surface includes a curved surface.

19. The printed circuit board according to claim 17, wherein, with reference to the first direction, at least a portion of the upper surface of the margin portion is located below the open surface.

20. The printed circuit board according to claim 19, wherein the open surface is substantially flat.

21. The printed circuit board according to claim 20, wherein the uppermost part of the upper surface of the margin portion is located at substantially the same level as the open surface.

22. The printed circuit board according to claim 17, wherein, with reference to the first direction, at least a portion of the upper surface of the margin portion is located above the open surface.

23. The printed circuit board according to claim 1, wherein a plurality of pads are provided, and the distance between adjacent pads is shorter than the width of the margin portion.

24. The open surface is substantially flat, The printed circuit board according to claim 23, wherein the upper surface of the margin portion includes a curved surface.

25. The printed circuit board according to claim 1, wherein the upper surface of the margin portion is substantially flat.

26. The printed circuit board according to claim 1, wherein the conductive layer is positioned inward in the lateral direction from the at least one pad that is positioned furthest outward in the lateral direction.

27. The printed circuit board according to claim 1, wherein the margin portion includes a separate conductor layer separated from the conductor layer of the main portion.

28. A portion of the conductor layer is positioned laterally outward than the outermost of the at least one pads in the lateral direction, according to claim 1.

29. The printed circuit board according to claim 28, wherein the margin portion includes a portion of the conductor layer of the main portion.

30. The circuit board section, The substrate portion includes a bridge substrate embedded in the substrate portion, The aforementioned bridge board is A main section comprising multiple insulating layers and multiple conductor layers stacked in a first direction, A margin portion is provided which is located on the outside of the main portion in the lateral direction and includes an insulator connected to the insulating layer of the main portion, The main portion includes at least one pad disposed on the main portion, A printed circuit board in which, with reference to the first direction, at least a portion of the upper surface of the margin portion is located above the lower surface of the pad.

31. The printed circuit board according to claim 30, wherein the bridge substrate is arranged in the recess of the substrate portion.

32. The printed circuit board according to claim 31, further comprising an insulating material that fills the recess and covers the bridge substrate.

33. The printed circuit board according to claim 32, wherein the insulating material forms an interface with the insulator of the margin portion.

34. The printed circuit board according to claim 33, wherein the insulating material and the insulating material of the margin portion contain different materials.

35. The printed circuit board according to claim 32, further comprising a plurality of via layers that penetrate the insulating material and are connected to the pads of the bridge substrate.

36. The printed circuit board according to claim 30, wherein the conductor layer of the bridge substrate and the substrate portion include a plurality of conductor patterns, and the average distance between the plurality of conductor patterns of the bridge substrate is shorter than the average distance between the plurality of conductor patterns of the substrate portion.

37. The steps include forming a substrate laminate by stacking multiple insulating layers and multiple conductive layers, The steps include forming multiple pads on multiple printed circuit board regions of the substrate stack, The steps include filling the margin regions between adjacent printed circuit board regions with an insulator, The steps include: dicing the margin region filled with the insulator to separate the substrate laminate into unit substrates; A method for manufacturing printed circuit boards, including [the specified part of the method].

38. The method for manufacturing a printed circuit board according to claim 37, wherein the step of forming the substrate laminate includes the step of preparing a carrier and the step of repeatedly forming the plurality of insulating layers and the plurality of conductive layers on the carrier.

39. The steps include attaching a transfer substrate to the substrate laminate, The method for manufacturing a printed circuit board according to claim 38, further comprising the step of separating the carrier from the substrate laminate.

40. The method for manufacturing a printed circuit board according to claim 37, wherein, prior to the step of filling the insulator, the height of the upper surface of the margin region is lower than the height of the upper surface of the printed circuit board region.

41. The method for manufacturing a printed circuit board according to claim 40, wherein, in the step of filling the insulator, the insulator is filled to a height higher than the area covered by the plurality of pads on the upper surface of the substrate laminate.

42. The method for manufacturing a printed circuit board according to claim 37, wherein, in the step of filling the insulator, a portion of the insulator is also filled into the printed circuit board area.

43. The method for manufacturing a printed circuit board according to claim 42, wherein in the step of filling the insulator, a portion of the insulator covers the plurality of pads.

44. The method for manufacturing a printed circuit board according to claim 43, further comprising the step of removing at least a portion of the insulator that has been filled into the printed circuit board region.

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