Heat dissipation package structure and method for manufacturing the same

Abstract

The present invention provides a method for manufacturing a heat dissipation package structure. [Solution] The manufacturing method for the heat dissipation package structure 100 according to the present invention involves preparing a plurality of heat dissipation layers having a main body portion 111 and a carrier portion 112. The main body portion 111 has an outer surface 111a and an inner surface 111b, and the carrier portion 112 is provided as a protrusion on the inner surface 111b (heat dissipation layer preparation step). An uncured thermal conductive material 120 is formed on the carrier surface 112a of the carrier portion 112, and the uncured thermal conductive material 120 is restricted to flow on the carrier surface 112a (thermal conductive material formation step). Next, a plurality of electronic elements 130 are joined to the uncured thermal conductive material 120, thereby connecting each electronic element 130 to each heat dissipation layer (heat dissipation layer connection step). By restricting the flow region of the uncured thermal conductive material 120 on the carrier surface 112a, the cohesive force of the uncured thermal conductive material 120 prevents the plurality of electronic elements 130 from shifting.

Description

Technical Field

[0001] The present invention relates to a heat dissipation package structure capable of preventing displacement of an electronic element when the electronic element is bonded to a heat dissipation layer due to the cohesive force of an uncured thermally conductive material, and a method for manufacturing the same. Background Art

[0002] Along with the increase in the operation speed of integrated circuits and the reduction in the volume of integrated circuits, electronic elements (e.g., chips) generate high heat, which may affect the operation speed or damage the electronic elements. In order to reduce the temperature of electronic elements, a heat dissipation structure (e.g., a heat sink) is usually bonded onto a package body or an electronic element to dissipate heat from the electronic element. Summary of the Invention Problem to be Solved by the Invention

[0003] However, conventional heat dissipation structures are attached onto the package body or the electronic element after the packaging manufacturing process, which causes the problem that it is difficult to align the positions, thus affecting manufacturing efficiency.

[0004] Therefore, the present inventor considered that the above-mentioned drawbacks can be improved, and as a result of intensive studies, arrived at the proposal of the present invention that effectively improves the above-mentioned problems with a rational design.

[0005] The present invention has been made in view of such conventional problems. To solve the above problems, the main object of the present invention is to provide a heat dissipation package structure and a manufacturing method thereof. That is, since the flow region of the uncured thermally conductive material on the carrier surface of the carrier portion of the heat dissipation layer is restricted, when the electronic element is bonded to the heat dissipation layer via the uncured thermally conductive material, it is possible to prevent displacement of the electronic element caused by the cohesive force of the uncured thermally conductive material. Means for Solving the Problem

[0006] To achieve the above objective, a method for manufacturing a heat dissipation package structure according to one aspect of the present invention includes a step of preparing a plurality of heat dissipation layers comprising a main body and a carrier, wherein the main body has an outer surface and an inner surface, the inner surface has a first region and a second region defined, and the carrier is provided protruding from the first region, with the second region exposed, and a step of forming an uncured thermal conductive material on the carrier surface of the carrier, wherein the uncured thermal conductive material is restricted to flow on the carrier surface. The process includes: a process in which a plurality of electronic elements are bonded to the uncured thermal conductive material, and each of the electronic elements is connected to each of the heat dissipation layers; a process for forming a sealing material, wherein the plurality of heat dissipation layers and the plurality of electronic elements are covered with the sealing material to form a plurality of connected heat dissipation package structures, each of the heat dissipation package structures having one of the heat dissipation layers and one of the electronic elements; and a process for cutting the sealing material, wherein the plurality of heat dissipation package structures are divided.

[0007] To solve the above-mentioned problems and achieve the objective, another aspect of the present invention provides a heat dissipation package structure comprising a heat dissipation layer, a thermally conductive material, an electronic element, and a sealing member. The heat dissipation layer has a main body portion and a carrier portion, the main body portion has an outer surface and an inner surface, the inner surface has a first region and a second region defined, and the carrier portion is provided as a protrusion on the first region. The thermally conductive material is placed on the carrier surface of the carrier portion, and the flow region of the thermally conductive material before curing is limited to the carrier surface. The electronic element is bonded to the thermally conductive material. The heat dissipation layer and the electronic element are covered by the sealing member, and the outer surface is exposed. [Effects of the Invention]

[0008] As the present invention is configured as described above, it produces the following effects. In this invention, the flow region of the uncured thermal conductive material is restricted by the carrier portion installed in the first region, thereby preventing displacement of multiple electronic elements when they are bonded to the heat dissipation layer due to the cohesive force of the uncured thermal conductive material.

[0009] Other objects, structures, and effects of the present invention will become apparent from the following section on embodiments of the invention. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic cross-sectional view showing a method for manufacturing a heat dissipation package structure according to one embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view showing a method for manufacturing a heat dissipation package structure according to one embodiment of the present invention. [Figure 3] This is a schematic cross-sectional view showing a method for manufacturing a heat dissipation package structure according to one embodiment of the present invention. [Figure 4] This is a schematic cross-sectional view showing a method for manufacturing a heat dissipation package structure according to one embodiment of the present invention. [Figure 5] This is a schematic cross-sectional view showing a method for manufacturing a heat dissipation package structure according to one embodiment of the present invention. [Figure 6] This is a schematic cross-sectional view showing a method for manufacturing a heat dissipation package structure according to one embodiment of the present invention. [Figure 7] This is a schematic cross-sectional view showing a method for manufacturing a heat dissipation package structure according to one embodiment of the present invention. [Figure 8] This is a schematic cross-sectional view showing a method for manufacturing a heat dissipation package structure according to one embodiment of the present invention. [Figure 9] This is a schematic cross-sectional view showing a heat dissipation package structure according to one embodiment of the present invention. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described in detail below. However, the present invention is not limited thereto, and various modifications are possible within the scope described. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of the present invention.

[0012] Next, an example of a specific embodiment of the manufacturing method of the heat dissipation package structure of this disclosure will be described with reference to Figures 1 to 9.

[0013] The method for manufacturing a heat dissipation package structure according to the present invention is used to form a plurality of heat dissipation package structures 100. In the example shown in Figure 1, a plurality of heat dissipation layers 110 are placed on a carrier 200, and each heat dissipation layer 110 has a main body portion 111 and a carrier portion 112. In this embodiment, a release film 210 is formed on the carrier 200 by a method such as coating, and the plurality of heat dissipation layers 110 are attached to the carrier 200 by the release film 210. The carrier 200 can be selected from a carrier such as glass or ceramic, and the plurality of heat dissipation layers 110 can be selected from copper or other heat dissipation materials, and the plurality of heat dissipation layers 110 are formed by a method such as electroplating or etching. In the etching method, a heat sink is etched as a plurality of heat dissipation layers 110.

[0014] In the example shown in Figure 1, the main body 111 of each heat dissipation layer 110 has an outer surface 111a and an inner surface 111b, and a first region 111c and a second region 111d are defined on the inner surface 111b. The second region 111d is located outside the first region 111c, and preferably the second region 111d surrounds the first region 111c.

[0015] As shown in Figure 1, the carrier portion 112 is installed in the first region 111c, with the second region 111d exposed, and each heat dissipation layer 110 is installed on the carrier 200 by its outer surface 111a. In this embodiment, the outer surface 111a of each heat dissipation layer 110 is attached to the release film 210. The first thickness D1 of the main body portion 111 is not less than the second thickness D2 of the carrier portion 112, and the difference between the first thickness D1 and the second thickness D2 is not less than 0 μm and not more than 35 μm, thereby preventing warping of each heat dissipation layer 110. Preferably, the first thickness D1 is not less than 5 μm and not more than 40 μm, and the second thickness D2 is not less than 5 μm and not more than 10 μm.

[0016] As shown in Figure 2, an uncured thermal conductive material 120 is formed on the carrier surface 112a of the carrier portion 112. The thermal conductive material 120 may be tin or other thermal conductive materials, and the thermal conductive material 120 may change from a fluid to a solid. Because the carrier portion 112 is convex to the first region 111c, the uncured thermal conductive material 120 is limited to the carrier surface 112a.

[0017] As shown in Figure 3, each electronic element 130 is connected to each heat dissipation layer 110 by being bonded to the uncured thermal conductive material 120. Because the uncured thermal conductive material 120 is limited to the carrier surface 112a, it is possible to prevent the multiple electronic elements 130 from shifting due to the cohesive force of the uncured thermal conductive material 120 when each electronic element 130 is bonded to each heat dissipation layer 110.

[0018] In this embodiment, each electronic element 130 has a plurality of conductive connection elements 131, the plurality of conductive connection elements 131 are formed on the active surface 130a of each electronic element 130, and the plurality of conductive connection elements 131 can be selected from conductive pins or conductive pads (see FIG. 3). Preferably, each electronic element 130 further has a back-side metallization (BSM) layer 132, the back-side metallization layer 132 is formed on the back surface 130b of each electronic element 130, and each electronic element 130 is bonded to the uncured thermally conductive material 120 through the back-side metallization layer 132.

[0019] As shown in FIG. 4, a sealing material 140 is formed on a carrier 200, and the plurality of heat dissipation layers 110 and the plurality of electronic elements 130 are covered by the sealing material 140, thereby forming a plurality of connected heat dissipation package structures 100. Each heat dissipation package structure 100 includes at least one heat dissipation layer 110 and one electronic element 130.

[0020] As shown in FIG. 5, by grinding the sealing material 140, the plurality of conductive connection elements 131 are exposed from the exposed surface 141 of the sealing material 140. Next, the sealing material 140 is cleaned to remove contaminants or oxide layers on the plurality of conductive connection elements 131. In different embodiments, when the sealing material 140 is formed, the plurality of conductive connection elements 131 are exposed from the exposed surface 141, eliminating the need to grind the sealing material 140.

[0021] As shown in FIG. 6, a plurality of grooves 142 are formed on the exposed surface 141, and each groove 142 is respectively located between a plurality of adjacent heat dissipation package structures 100.

[0022] As shown in Figure 7, a redistribution layer 150 is formed on the exposed surface 141 and the plurality of grooves 142, and the redistribution layer 150 is electrically connected to the plurality of electronic elements 130. In this embodiment, the redistribution layer 150 is electrically connected to the plurality of conductive connection elements 131 of each electronic element 130. The redistribution layer 150 has a plurality of conductive pads 151 and a plurality of side pads 152, the plurality of conductive pads 151 are located on the exposed surface 141, and the plurality of side pads 152 are located in the plurality of grooves 142. Next, a plurality of protective layers 160 are formed on the redistribution layer 150, and the plurality of conductive pads 151 and the plurality of side pads 152 are exposed from the plurality of protective layers 160. In different embodiments, the redistribution layer 150 and the protective layers 160 may be formed sequentially on the exposed surface 141 so as to overlap. Preferably, a bonding layer (not shown, e.g., a gold layer) may be formed on the plurality of conductive pads 151 and the plurality of side pads 152.

[0023] As shown in Figure 8, finally, the carrier 200 and release film 210 are removed, the outer surface 111a of the main body 111 is exposed, and the sealing material 140 and rewiring layer 150 are cut along the multiple grooves 142, dividing the multiple heat dissipation package structures 100, the sealing material 140 becoming multiple sealing members 140a that cover the multiple heat dissipation layers 110 and the multiple electronic elements 130, each groove 142 becoming a recess 142a located on the side surface 140b of each sealing member 140a, and each side pad 152 is retained in the recess 142a.

[0024] As shown in Figure 9, the heat dissipation package structure 100 formed by the above method comprises a heat dissipation layer 110, a thermally conductive material 120, an electronic element 130, and a sealing member 140a. The heat dissipation layer 110 has a main body portion 111 and a carrier portion 112, the carrier portion 112 is convex to a first region 111c of the inner surface 111b, and the second region 111d is exposed. The electronic element 130 is bonded to the thermally conductive material 120, and the carrier surface 112a restricts the flow region of the uncured thermally conductive material 120, thereby preventing the electronic element 130 from shifting due to the cohesive force of the uncured thermally conductive material 120. The heat dissipation layer 110 and the electronic element 130 are covered by the sealing member 140a, and the outer surface 111a of the main body portion 111 is exposed. The side surface 140b of the sealing member 140a has a recess 142a.

[0025] In this embodiment, the heat dissipation package structure 100 further comprises a rewiring layer 150 and a protective layer 160. The rewiring layer 150 has a plurality of conductive pads 151 located on the sealing member 140a and side pads 152 located in the recess 142a, and the plurality of conductive pads 151 and side pads 152 are exposed from the protective layer 160.

[0026] In the example shown in Figure 9, when the heat dissipation package structure 100 is bonded to the circuit board 300 by a bonding element 400 (for example, a solder ball), the side pad 152 located in the recess 142a allows for an increase in the bonding area between the bonding element 400 and the heat dissipation package structure 100, thereby preventing the heat dissipation package structure 100 from detaching from the circuit board 300.

[0027] The present invention is not limited to the embodiments described above, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention. [Explanation of Symbols]

[0028] 100 Heat dissipation package structure 110 Heat dissipation layer 111 Main body 111a Exterior 111b Inside 111c First area 111d Second area 112 Career Department 112a Carrier surface 120 Thermally conductive materials 130 Electronic Elements 130a active surface 130b Reverse side 131 Conductive connecting element 132 Metal layer on the back 140 Sealing material 140a Sealing member 140b side 141 Exposed surface 142 Groove 142a Recess 150 redistribution layer 151 Conductive pad 152 Side pads 160 protective layer 200 carriers 210 Release Film 300 circuit boards 400 junction elements D1 First thickness D2 Second thickness

Claims

1. A heat dissipation layer preparation step comprising: a step of preparing a plurality of heat dissipation layers having a main body and a carrier, wherein the main body has an outer surface and an inner surface, the inner surface has a first region and a second region defined therein, and the carrier is provided protruding from the first region, with the second region exposed; A step of forming an uncured thermal conductive material on the carrier surface of the carrier portion, wherein the uncured thermal conductive material is restricted to flow on the carrier surface, A heat dissipation layer connection step is performed in which multiple electronic elements are bonded to the uncured thermal conductive material, and each of the electronic elements is connected to each of the heat dissipation layers, A process for forming a sealing material, wherein the sealing material covers the plurality of heat dissipation layers and the plurality of electronic elements, thereby forming a plurality of connected heat dissipation package structures, each of which comprises a sealing material forming process having one heat dissipation layer and one electronic element, A method for manufacturing a heat dissipation package structure, characterized by including a step of cutting the sealing material, wherein the plurality of connected heat dissipation package structures are divided.

2. The method for manufacturing a heat dissipation package structure according to claim 1, characterized in that the second region is located outside the first region.

3. The method for manufacturing a heat dissipation package structure according to claim 2, characterized in that the second region surrounds the first region.

4. The method for manufacturing a heat dissipation package structure according to claim 1, characterized in that the first thickness of the main body portion is greater than or equal to the second thickness of the carrier portion.

5. The method for manufacturing a heat dissipation package structure according to claim 4, characterized in that the difference between the first thickness and the second thickness is 0 μm or more and 35 μm or less.

6. The method for manufacturing a heat dissipation package structure according to claim 5, characterized in that the first thickness is 5 μm or more and 40 μm or less, and the second thickness is 5 μm or more and 10 μm or less.

7. The method for manufacturing a heat dissipation package structure according to claim 1, characterized in that each of the electronic elements has a back metal layer, the back metal layer is formed on the back surface of each of the electronic elements, and each of the electronic elements is bonded to the uncured thermal conductive material by the back metal layer.

8. The method for manufacturing a heat dissipation package structure according to claim 1, characterized in that, after the sealing material is formed, a plurality of grooves are formed on the exposed surface of the sealing material, and each of the grooves is located between adjacent plurality of connected heat dissipation package structures.

9. A method for manufacturing a heat dissipation package structure according to claim 8, characterized in that, after the plurality of grooves are formed, a rewiring layer is formed on the exposed surface and the plurality of grooves, and a protective layer is formed on the rewiring layer, the rewiring layer is connected to the plurality of electronic elements, the rewiring layer has a plurality of conductive pads and a plurality of side pads, the plurality of conductive pads are located on the exposed surface, each of the side pads is located in each of the grooves, and the protective layer exposes the plurality of conductive pads and the plurality of side pads.

10. The heat dissipation package structure manufacturing method according to claim 9, characterized in that, after the rewiring layer and the protective layer are formed, the sealing material is cut along the plurality of grooves so that the sealing material becomes a plurality of sealing members, each groove is located in a recess on the side surface of each sealing member, each heat dissipation layer and each electronic element are covered by each sealing member, and each side pad is retained in the recess.

11. The heat dissipation package structure manufacturing method according to claim 9, characterized in that each of the electronic elements has a plurality of conductive connecting elements, the plurality of conductive connecting elements are exposed on the exposed surface and are electrically connected to the rewiring layer.

12. The heat dissipation package structure manufacturing method according to claim 11, characterized in that the sealing material is ground so that the plurality of conductive connecting elements are exposed on the exposed surface before the plurality of grooves are formed.

13. The heat dissipation package structure manufacturing method according to claim 1, characterized in that each heat dissipation layer is installed on the carrier by its outer surface, and the carrier is removed before the sealing material is cut.

14. The device has a main body and a carrier, the main body having an outer surface and an inner surface, the inner surface having a first region and a second region defined therein, and the carrier has a heat dissipation layer that protrudes from the first region and exposes the second region, The thermal conductive material, which is placed on the carrier surface of the carrier portion and is restricted to flow on the carrier surface before curing, An electronic element bonded to the aforementioned thermally conductive material, A heat dissipation package structure characterized by comprising a sealing member on which the heat dissipation layer and the electronic element are covered and whose outer surface is exposed.

15. The heat dissipation package structure according to claim 14, characterized in that the second region is located outside the first region.

16. The heat dissipation package structure according to claim 14, characterized in that the second region surrounds the first region.

17. The heat dissipation package structure according to claim 14, characterized in that the first thickness of the main body portion is greater than or equal to the second thickness of the carrier portion.

18. The heat dissipation package structure according to claim 17, characterized in that the difference between the first thickness and the second thickness is 0 μm or more and 35 μm or less.

19. The heat dissipation package structure according to claim 18, characterized in that the first thickness is 5 μm or more and 40 μm or less, and the second thickness is 5 μm or more and 10 μm or less.

20. The heat dissipation package structure according to claim 14, further comprising a redistribution layer and a protective layer, wherein the redistribution layer is electrically connected to the electronic element, the redistribution layer is covered by the protective layer, the side surface of the sealing member has a recess, the redistribution layer has a plurality of conductive pads and side pads, the plurality of conductive pads are located on the sealing member, the side pads are located in the groove, and the protective layer exposes the plurality of conductive pads and the side pads.

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