Liquid cooling assemblies for electronic components on printed circuit boards and computing devices including the same

Abstract

We provide advanced liquid cooling-based thermal management systems, liquid cooling assemblies, and computing devices for electronic components on printed circuit boards. [Solution] The liquid cooling assembly consists of at least two heatsinks, and is pressed onto the heat dissipation area of ​​at least one electronic component 221-224 mounted on a printed circuit board using a mechanically isolated group of clamping elements (screws 112A-112D) such that the pressure applied by at least one first heatsink 110 does not substantially affect the pressure applied by at least one second heatsink. At least one second heatsink is further configured to press substantially uniformly onto the heat dissipation area of ​​IC 230.

Description

Technical Field

[0001] Cross-Reference to Related Applications This application claims the benefit of priority from U.S. Patent Application No. 19 / 058,176 entitled "LIQUID COOLING ASSEMBLY FOR ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS AND COMPUTING DEVICE INCLUDING SAME" filed on February 20, 2025, U.S. Patent Application No. 19 / 216,235 entitled "LIQUID COOLING ASSEMBLY FOR DUAL-SIDED THERMAL MANAGEMENT AND COMPUTING DEVICE INCLUDING THE SAME" filed on May 22, 2025, and U.S. Patent Application No. 19 / 381,236 filed on November 6, 2025, the entire contents of each of which are incorporated herein by reference in their entirety.

[0002] The present invention relates to the technical field of microelectronics and electronics, and in particular to an advanced liquid cooling-based thermal management system for electronic components on printed circuit boards. Background Art

[0003] In the field of microelectronics and electronics, efficient thermal management is critical to ensure optimal performance and service life of electronic components. As electronic circuits become increasingly complex and densely packed, the challenge of effectively dissipating heat has intensified. Conventional cooling methods such as air cooling by fans or passive solutions are often insufficient to address the heat demand of modern high-performance electronic devices. These conventional solutions may lead to overheating, reduced efficiency, and potential damage to sensitive components, necessitating the development of more advanced cooling technologies.

[0004] Liquid cooling systems are emerging as a promising alternative, offering superior heat dissipation capabilities by circulating a fluid to absorb and transfer heat away from components. However, existing heat dissipation problems are further exacerbated by the fact that different components on a PCB can exhibit varying power densities, leading to significantly different heat dissipation requirements. Existing solutions often lack flexibility and adaptability, particularly when dealing with varying thermal loads across different components of a system. This limitation can result in uneven cooling, inefficient energy use, and increased complexity in system design and maintenance.

[0005] In addition to thermal management challenges, mechanical tolerances between the various components of a printed circuit board (PCB) can cause significant problems. These tolerances can arise from manufacturing limitations such as soldering, leading to large, slightly non-parallel heat dissipation areas. When using a single rigid cooling element, such as a heatsink, which must simultaneously and properly contact the heat dissipation areas of numerous components, any geometric mismatch between components can negatively affect contact. Since optimal heat transfer depends on precise contact between the heatsink and the components, mismatches can dramatically reduce cooling efficiency.

[0006] Another important aspect to consider alongside cooling efficiency is design compactness. Often, the volume within the device housing is limited, making it crucial to develop a cooling system that fits within the device's spatial constraints, in addition to effectively managing heat. This requires a balance between performance and design compactness to ensure that the cooling solution does not compromise the overall functionality and form factor of the electronic device. [Overview of the project]

[0007] Therefore, there is a need for liquid cooling assemblies that offer improvements in the fields of microelectronics and electronics. Specifically, there is a need for solutions that can be easily adjusted to relax mechanical tolerances between different electrical components of the target PCB and can be adapted to address the diverse thermal loads presented by the electrical components while maintaining the compactness of the design. Thereby, such solutions will increase the overall heat dissipation efficiency of the thermal management system. There is a further need for computing devices that include such improved liquid cooling assemblies that improve the aforementioned fields by increasing device operating efficiency, and specifically enable long-term stable operation in computationally intensive regimes due to highly efficient thermal management.

[0008] In a comprehensive embodiment, the present invention may cover a liquid cooling assembly. The liquid cooling assembly may include at least one first heatsink and at least one second heatsink, which are fluidly connectable to a liquid coolant distribution unit via common inlet and outlet connections, and which are thermally coupled to at least one first electronic component and at least one second electronic component mounted on a printed circuit board (PCB) by being pressed onto the heat dissipation areas of the at least one first electronic component and at least one second electronic component, respectively, using mechanically isolated groups of clamping elements such that the pressure applied by at least one first heatsink does not substantially affect the pressure applied by at least one second heatsink.

[0009] In another comprehensive embodiment, the present invention may cover a computing device. The computing device may include a printed circuit board (PCB) comprising at least one first electronic component and at least one second electronic component mounted on the printed circuit board (PCB), at least one first heatsink and at least one second heatsink, which are fluidly connectable to a liquid coolant distribution unit via common inlet and outlet connections, and which are thermally coupled to the at least one first electronic component and at least one second electronic component by being pressed onto the heat dissipation areas of the at least one first electronic component and at least one second heatsink, respectively, using mechanically isolated groups of clamping elements such that the pressure applied by the at least one first heatsink does not substantially affect the pressure applied by the at least one second heatsink.

[0010] In some embodiments, the at least one first heat sink may include an internal cavity that is fluidically connectable to a liquid coolant distribution unit and configured to form a first liquid coolant circulation path together with the liquid coolant distribution unit. The at least one second heat sink may include an internal cavity that is fluidically connectable to the internal cavity of the at least one first heat sink and configured to form a second liquid coolant circulation path together with the liquid coolant distribution unit.

[0011] In some embodiments, the inner cavity of at least one second heat sink may be fluidly connected to a liquid coolant distribution unit via the inner cavity of at least one first heat sink.

[0012] In some embodiments, the at least one first heat sink may have a frame-shaped structure sized to correspond to the dimensions of the peripheral area of ​​the PCB. The at least one second heat sink may be configured to be substantially positioned within the frame-shaped structure when the liquid cooling assembly is mounted on the PCB.

[0013] In some embodiments, each of the at least one first heat sink and the at least one second heat sink may include an internal cavity. The internal cavity of the at least one second heat sink may be fluidically connectable to the internal cavity of the at least one first heat sink from the inside of the frame-shaped structure.

[0014] In some embodiments, the liquid cooling assembly may further include a base member having at least two groups of mounting openings configured to align with the mounting openings of each group of PCBs when positioned adjacent to the bottom side of the PCB in the assembled state of the liquid cooling assembly. The mechanically isolated group clamping elements may include first group clamping elements configured to press the at least one first heatsink substantially uniformly onto the heat dissipation area of ​​the at least one first electronic component when fastened to the base member through the first group of mounting openings of the base member and the mounting openings of each group of PCBs in the assembled state. The mechanically isolated group of clamping elements may further include a second group of clamping elements configured, when assembled, to secure and clamp the at least one second heatsink to the base member through the second group of mounting openings in the base member and the respective group of mounting openings in the PCB, thereby pressing the second heatsink substantially uniformly onto the heat dissipation area of ​​the at least one second electronic component.

[0015] In some embodiments, at least one of the first or second heat sinks may include a plurality of standoffs, in the assembled state, having openings configured to separate each heat sink from the PCB and to receive the clamping elements of each group.

[0016] In some embodiments, the standoff and the clamping element may be configured to avoid mechanical interference with the PCB.

[0017] In some embodiments, the liquid cooling assembly may be further configured to divide the input liquid coolant flow passing through a common inlet connection between the first heatsink and the second heatsink in a predetermined ratio.

[0018] In some embodiments, the predetermined ratio may be defined in correspondence with the expected power consumption ratio between the at least one first electronic component and the at least one second electronic component.

[0019] In some embodiments, the liquid cooling assembly may be further configured to divide the input liquid coolant flow by guiding a first portion of it through the input channel of the at least one first heatsink and a second portion of it through the input channel of the at least one second heatsink, wherein the input channels of the at least one first heatsink and the at least one second heatsink are sized in accordance with the predetermined ratio.

[0020] In some embodiments, (i) at least one of the at least one first heat sink and (ii) at least one of the at least one second heat sink may include an inner cavity having an output channel adjacent to the upper wall of the heat sink, and may be fluidly connected to a liquid coolant distribution unit through the output channel.

[0021] In some embodiments, at least one of (i) said at least one first heat sink and (ii) said at least one second heat sink may comprise an inner cavity provided with a plurality of inner channels, said inner cavity being shaped to substantially evenly distribute a liquid coolant flow passing through the inner cavity among the plurality of inner channels.

[0022] In some embodiments, at least one of (i) said at least one first heat sink and (ii) said at least one second heat sink may be configured to be thermally coupled to said at least one first electronic component or said at least one second electronic component, respectively, via a thermal pad attached to a heat dissipation area of said at least one first electronic component or said at least one second electronic component.

[0023] The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of this specification. However, the invention, together with its objects, features, and advantages, may be best understood by reference to the following detailed description when read in conjunction with the accompanying drawings, both with respect to its construction and method of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] [Figure 1] It is an isometric view of a liquid cooling assembly and a computing device, according to some embodiments of the present invention. [Figure 2A] It is an isometric view of a PCB, according to some embodiments of the present invention. [Figure 2B] It is an isometric view of a top side of a first heat sink, according to some embodiments of the present invention. [Figure 2C] It is an enlarged isometric view of an outlet channel of a first heat sink, according to some embodiments of the present invention. [Figure 2D] It is an isometric view of a bottom side of a first heat sink, according to some embodiments of the present invention. [Figure 2E]It is an isometric view of a first heat sink cover according to some embodiments of the present invention. [Figure 2F] It is an isometric view of a base member of a liquid cooling assembly according to some embodiments of the present invention. [Figure 2G] It is an isometric view of a top side of a second heat sink connected to inlet and outlet flexible tubes according to some embodiments of the present invention. [Figure 2H] It is a front view of a second heat sink according to some embodiments of the present invention. [Figure 2I] It is an enlarged bottom view of a communicating portion of a second heat sink shown transparently according to some embodiments of the present invention. [Figure 2J] It is a bottom view of a second heat sink with its inner cavity shown transparently according to some embodiments of the present invention. [Figure 2K] It is an enlarged bottom view of a second heat sink with its inner cavity shown transparently according to some embodiments of the present invention. [Figure 3A] It is an exploded view of a liquid cooling assembly and a computing device, showing connection of a first heat sink to a PCB. [Figure 3B] It is an exploded view of a liquid cooling assembly and a computing device, showing connection of a second heat sink to a PCB. [Figure 4] It is a top view of a liquid cooling assembly having a first heat sink and a second heat sink shown partially transparently, illustrating a first liquid coolant circulation path and a second liquid coolant circulation path according to some embodiments of the present invention. DETAILED DESCRIPTION OF EMBODIMENTS

[0025] For the sake of simplicity and clarity, it should be understood that the elements shown in the diagrams are not necessarily drawn to scale. For example, the dimensions of some elements may be exaggerated relative to others for clarity. Furthermore, reference numbers may be repeated between diagrams to indicate corresponding or similar elements where deemed appropriate.

[0026] Those skilled in the art will recognize that the present invention can be embodied in other specific forms without departing from its spirit or essential features. Therefore, the embodiments described herein should be considered in all respects as illustrative and not limiting to the invention as described herein. Accordingly, the scope of the invention is indicated by the appended claims rather than the foregoing description, and therefore, all modifications within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention.

[0027] The following detailed description includes numerous specific details to provide a complete understanding of the invention. However, it will be understood by those skilled in the art that the invention can be carried out without these specific details. In other examples, known methods, procedures, and components are not described in detail so as not to obscure the invention. Some features or elements described in relation to one embodiment may be combined with features or elements described in relation to other embodiments. For clarity, discussion of the same or similar features or elements may not be repeated.

[0028] Embodiments of the present invention are not limited in this respect, but as used herein, the terms “multiple” and “one or more” may include, for example, “many” or “two or more.” The terms “multiple” or “one or more” may be used throughout this specification to describe two or more components, devices, elements, units, parameters, etc. The term “set” may include one or more items as used herein.

[0029] As used herein, the term “fluid connection” refers to a path that allows fluid to flow between two components of the system of the present invention, the two components may be joined directly or indirectly to one another. Similarly, as used herein, the terms “fluidically coupled,” “fluidly connected,” or “fluidly connectable” refer to a connection between two components that allows fluid to flow from one component to the other, the connection may be direct or indirect (through an intermediate component) that allows fluid to flow through it.

[0030] In the context of the present invention, the term “flexible fluid connection” should be understood to mean a mechanically flexible connection that facilitates the transfer of fluid between connectable components, such as a connection that can be achieved by using a flexible tube or similar component designed to accommodate and mitigate mechanical tolerances and mismatches between connectable components.

[0031] In some embodiments of the present invention, the terms “central region” and “peripheral region” are used to describe the relative positioning of at least two elements with respect to the geometric center of another element (for example, in relation to a printed circuit board (PCB)). For example, if a first electronic component is described as being located in the central region of the PCB and a second electronic component is described as being in the peripheral region, this indicates that the first component is located closer to the geometric center of the PCB than the second component. It should be understood that such terminology does not impose any specific limitations on the exact distance from the center, and the use of “central” or “peripheral” should not be construed as limiting the scope of this disclosure in this respect.

[0032] Please understand that the terms "first" and "second" are used solely to clearly distinguish between elements and do not imply any specific order or sequence unless otherwise specified.

[0033] Unless otherwise specified, embodiments of the methods described herein are not bound to any particular order or sequence. In addition, some embodiments or elements of the methods described may occur or be performed simultaneously, at the same time, in parallel, or repeatedly.

[0034] According to the concept of the present invention, the proposed configuration enables efficient thermal management by allowing separate cooling paths for different components that may have varying thermal loads. Flexible fluid connections between heat sinks provide adaptability to mechanical tolerances and mismatches on the PCB, ensuring effective thermal contact and heat dissipation. By sharing common inlets and outlets, the system simplifies the design, reduces the complexity of the cooling assembly, makes the assembly more compact, and facilitates integration into electronic devices in limited spaces. This arrangement addresses the diverse thermal requirements of modern high-performance electronic devices, improving overall heat dissipation efficiency.

[0035] Therefore, the proposed computing device, including such an improved liquid cooling assembly, can provide long-term stable operation in computationally intensive regimes due to highly efficient thermal management, while having a compact design.

[0036] Herein, we refer to Figure 1, which shows an isometric view of a liquid cooling assembly 100 and a computing device 400 according to some embodiments of the present invention.

[0037] For clarity and brevity, the following description may, in some respects, relate only to liquid cooling assemblies. However, since the proposed computing device may include a liquid cooling assembly in all embodiments considered herein, it should be understood that the same principles and descriptions may apply equally to the proposed computing device.

[0038] Furthermore, for the sake of clarity and conciseness, descriptions of similar or identical components shown in the provided diagrams may be omitted.

[0039] As shown in Figure 1, in some embodiments, the computing device 400 may include a printed circuit board (PCB) 200 (described in detail with reference to Figure 2A) on which a plurality of electronic components are mounted.

[0040] A printed circuit board (PCB) is a fundamental component in electronic devices, serving as a platform for mounting and interconnecting various electronic components. A PCB (such as a PCB200) typically consists of a non-conductive substrate, usually made of glass fiber, composite epoxy, or other laminate materials, onto which conductive paths are etched or printed. These paths are often made of copper and facilitate electrical connections between the electrical components mounted on them.

[0041] As is well known, heatsinks are essential components in thermal management systems for PCBs. They are generally designed to dissipate heat generated by electronic components such as microprocessors and power transistors to prevent overheating and ensure optimal performance.

[0042] In some embodiments, the liquid cooling assembly 100 may include at least one first heat sink (e.g., heat sink 110) and at least one second heat sink (e.g., heat sink 120).

[0043] In some embodiments, the heatsink 110 may have a frame-shaped structure sized to correspond to the dimensions of the peripheral area of ​​the PCB 200, as shown in Figure 1.

[0044] In some embodiments, the heatsink 120 may be configured to be positioned substantially within the frame-shaped structure of the heatsink 110 when the liquid cooling assembly 100 is mounted on the PCB 200 (i.e., when the device 400 is assembled as shown in Figure 1).

[0045] In some embodiments, the inner cavity 116 of the heatsink 110 (described in detail with reference to Figure 2B) may be closed from above with a cover 111. The cover 111 may be welded to the body of the heatsink 110 to hermetically seal the inner cavity 116.

[0046] In some embodiments, the heatsink 120 may include portions 121 and 122 (described in more detail with reference to Figures 2G to 2K).

[0047] In some embodiments, the liquid cooling assembly 200 may further include at least one flexible inlet tube 132B and at least one flexible outlet tube 132A. In some embodiments, the heat sinks 110 and 120 may have internal cavities for circulating the liquid coolant (e.g., internal cavities 116 and 126 shown in Figures 2B and 2J, respectively). In some embodiments, the tubes 132A and 132B may fluidly connect the internal cavities of the heat sinks 110 and 120 from inside the frame-shaped structure, as shown in Figure 1. Tube 132A may be connected to the internal cavities 116 and 126 of the heat sinks 110 and 120 via fittings 133A and 131A, respectively. Tube 132B may be connected to the internal cavities 116 and 126 of the heat sinks 110 and 120 via fittings 133B and 131B, respectively.

[0048] In some embodiments, the heat sinks 110 and 120 may be made from a material having high thermal conductivity, such as aluminum or copper, as is generally known in the art.

[0049] In some embodiments, the heatsink 110 and / or heatsink 120 may also be referred to as a cold plate. Both “heatsink” and “cold plate” are commonly known names for such components of a thermal management system and may be used interchangeably in this context.

[0050] In some embodiments, the liquid cooling assembly 100 may further include a base member 150. In the assembled state of assembly 100, the base member 150 may be positioned adjacent to the bottom side of the PCB 200. The base member 150 is used to attach the heat sinks 110 and 120 to the PCB 200 while avoiding unnecessary mechanical interference between the heat sinks 110 and 120 and the PCB 200, thereby ensuring high efficiency of heat dissipation. For example, the heat sink 110 may be attached to the base member 150 via screws 112A to 112D.

[0051] In some embodiments, the liquid cooling assembly 100 may be fluidically connected to a liquid coolant distribution unit (not shown) via, for example, an inlet fitting 141B and an outlet fitting 141A (also referred to herein as an inlet connector and an outlet connector).

[0052] As is well known, liquid coolant distribution units (CDUs) are critical components in thermal management, particularly in computer systems for data centers. Their primary function is to manage and regulate the distribution of coolant to ensure efficient thermal management. Thus, in some embodiments, the computing device 400 may be part of a larger system, and the CDU is connected to a number of components of that system in a way that allows it to operate simultaneously.

[0053] The components of the liquid cooling assembly 100 and the computing device 400 will be described in more detail with reference to Figures 2A to 2K.

[0054] Figure 2A illustrates PCB 200 (component side) according to several embodiments of the present invention. It should be understood that the embodiments of PCB 200 shown herein are provided for illustrative purposes only, as non-exclusive examples. The provided embodiments of PCB 200 are intended to clarify how electronic components requiring thermal management can be positioned and how the design of the liquid cooling assembly 100 can be adapted to the PCB layout topology to effectively dissipate heat. Furthermore, when considering computing device 400, the concept of the present invention primarily relates to a form of thermal management that can potentially improve the performance of a wide variety of computing devices. Therefore, the present invention is not related to any particular function of computing device 400. Accordingly, the present invention should be considered not to be limited to any particular type of computing device or its intended use, nor to any particular PCB or its intended use.

[0055] As shown in Figure 2A, the PCB 200 may include a wide range of components such as resistors, capacitors, diodes, transistors, and integrated circuits (ICs), each performing a specific function within the electronic system. Additionally, in some embodiments, the PCB 200 may incorporate connectors, switches, and other mechanical components for interfacing with external devices or systems. As is well known, PCB design plays a crucial role in creating customized liquid cooling assemblies because it determines the layout and placement of components, influencing the overall performance, reliability, thermal characteristics, and manufacturability of the electronic device.

[0056] In some embodiments, the PCB200 may include power-intensive electronic components that require thermal management for normal operation.

[0057] In some specific embodiments, the PCB 200 may include an integrated circuit (IC) 230 mounted in the central region of the PCB 200. In some embodiments, the IC 230 may be a system-on-a-chip (SoC), a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), an application-specific standard product (ASSP), or a similar electronic component known in the art. The IC 230 may perform data processing, memory storage, signal processing, power management, or other functions, as known in the art.

[0058] In some specific embodiments, the PCB 200 may further include a group of auxiliary electronic components mounted in the peripheral region of the PCB 200. In some embodiments, the auxiliary electronic components may include various elements mounted in the peripheral region of the PCB, such as power transistors, resistors, capacitors, inductors, diodes, and connectors, and may also include auxiliary chips, controllers, or similar components configured to support the main functions of IC 230. The group of auxiliary electronic components may include power-intensive components 221, 222, 223, 224, and 225 that require heat dissipation for normal operation.

[0059] In some embodiments, the PCB 200 may include two groups of mounting openings. The first group, comprising mounting openings 210A to 210D, may be configured for mounting a heatsink 110, as detailed in Figure 3A. The second group, comprising mounting openings 240A to 240D, may be configured for mounting a heatsink 120, as detailed in Figure 3B.

[0060] Here, we refer to Figures 2B to 2D, which show some embodiments of the heat sink 110 in the present invention.

[0061] As shown in Figure 2B, an isometric view of the top surface of a heat sink 110 according to several embodiments of the present invention is illustrated.

[0062] As shown in Figure 2B, the heatsink 110 may have an inner cavity 116 around its frame-shaped structure. The inner cavity 116 may be divided into sections 116A, 116B, and 116C. Section 116A may be connected to section 116B via an input channel 115A. Section 116B may be connected to section 116C via an output channel 115B. In section 116A, the heatsink 110 may further include an inlet opening 117B. In section 116C, the heatsink 110 may further include an outlet opening 117A. The inner cavity 116 can be fluidly connected to a liquid coolant distribution unit (not shown) and, together with the liquid coolant distribution unit, may be configured to form a liquid coolant circulation path (also referred to herein as the “first” liquid coolant circulation path) from the liquid coolant distribution unit through the inlet opening 117B to section 116A, through the input channel 115A to section 116B, through the output channel 115B to section 116C, and through the outlet opening 117A to the liquid coolant distribution unit. The aspects of the liquid coolant circulation will be further described in more detail with reference to Figure 4. By providing liquid coolant circulation around the frame-shaped structure, assembly 100 enables efficient heat dissipation from electronic components thermally coupled to the heat sink 110.

[0063] In some embodiments, the inner cavity 116 may include a plurality of inner channels 114A to 114E. The inner cavity 116 may be molded to distribute the liquid coolant flow passing through the inner cavity substantially evenly among its plurality of inner channels. For example, in some embodiments, the heat sink 110 may have projections 118A to 118D configured to guide the flow so as to distribute the flow between each of the inner channels 114A to 114E (further described in more detail with reference to Figure 4).

[0064] As shown in Figure 2B, the inner channels 114A to 114E may be formed by a series of separating inner walls positioned along the flow direction. This configuration not only ensures a uniform flow distribution but also significantly increases the heat conduction area of ​​the heat sink 110 that is in direct contact with the liquid coolant flow, thereby improving heat dissipation efficiency.

[0065] From the inside of the frame-shaped structure, the heatsink 110 may further include openings 117C and 117D for providing fluid connections with a heatsink 120 (not shown). Thereafter, section 116A of the inner cavity 116 can be configured such that the flow entering through the inlet opening 117B is divided into two paths: a first path proceeds through section 116B of the inner cavity 116 via the input channel 115A, and a second path proceeds to the heatsink 120 via opening 117D and tube 132B (not shown). Section 116C is then configured such that the flow, after passing through section 116B of the inner cavity 116, enters through the output channel 115B, exits through the outlet opening 117A, and mixes with the flow returning from the heatsink 120 via tube 132A (not shown) and opening 117C.

[0066] The heatsink 110 may also include through-mount openings 113A to 113D for mounting onto the PCB 200 using a base member 150 (not shown) and screws 112A to 112D (not shown).

[0067] Figure 2C is an enlarged isometric view (labeled "A" in Figure 2C) of an output channel 115B connecting sections 116B and 116C of the inner cavity 116, according to some embodiments of the present invention. Figure 2C also shows two inner channels 114E separated by an inner wall. It should be understood that the input channel 115A and inner channel 114D may have configurations symmetric to the configuration shown in Figure 2C.

[0068] In Figures 2B and 2C, elements positioned within the cavity 116, such as channels 114A-114E and channels 115A and 115B, are seen without upper walls. However, when the heat sink 110 is covered with a cover 111 (as shown in Figure 1), the upper walls of these elements may be formed by the inside of the cover 111. Thus, with the cover 111 in place, each of the channels 114A-114E and 115A-115B may have a closed or substantially closed shape (e.g., rectangular) in cross-section.

[0069] Figure 2D is an isometric view of the bottom side of a heat sink 110 according to several embodiments of the present invention. As shown in Figure 2D, from the bottom side, the heat sink 110 may include a group of contact surfaces 119A to 119F configured to be thermally coupled to the heat dissipation regions of the respective auxiliary electronic components 221 to 225 of the PCB 200. For example, surface 119A may be coupled to component 221, surface 119B may be coupled to component 222, surface 119F may be coupled to component 223, surfaces 119C to 119D may be coupled to component 225, and surface 119E may be coupled to component 224.

[0070] In some embodiments, thermal pads may be used to perform the thermal coupling (for example, thermal pads 221A, 222A, 223A, 224A, and 230A, as shown in Figure 2A).

[0071] As is known in the art, thermal pads are soft, thermally conductive materials used to fill the gap between a heat-generating component and a heat sink. They help improve heat transfer and ensure efficient thermal management in electronic devices. In some embodiments, thermal pads may be made from silicone or other thermally conductive materials infused with ceramic or metal particles to improve thermal conductivity. Thus, thermal pads can provide conformal interfaces between non-flat surfaces (e.g., contact surfaces 119A-119F and the surfaces of their respective components 221-225), ensuring good thermal contact along the entire heat dissipation area and reducing thermal resistance.

[0072] In some embodiments, the heat sink 110 may be configured to be thermally coupled to the components 221-225, for example, via thermal pads attached to its heat dissipation area, by having contact surfaces 119A-119F that are sized and positioned according to the layout and dimensions of the components 221-225.

[0073] Therefore, it should be understood that, depending on the particular embodiment, the heatsink 110 may be custom-designed to suit the specific configuration, layout, and content of the electronic components on the target PCB (such as PCB200) in order to meet its thermal management requirements.

[0074] In the context of this specification, the term “contact surface” applies to thermal coupling and should not be confused with the term “contact surface” applied to electrical coupling.

[0075] Figure 2E shows an isometric view of the cover 111 of the heat sink 110 according to some embodiments of the present invention. In some embodiments, the cover 111 may be made from the same material as the heat sink 110 (e.g., aluminum or copper).

[0076] During the manufacturing process of the liquid cooling assembly 100, a blank of the desired material having the approximate dimensions of the heat sink 110 to be manufactured can be obtained. The blank is then machined to achieve the desired dimensions and to form the inner cavity 116 and contact surfaces 119A-119F. Next, openings 117A-117D and 113A-113D can be drilled. Subsequently, a cover 111, machined to match the dimensions of the inner cavity 116, is positioned to cover the cavity 116 and welded around its perimeter to seal the inner volume of the cavity 116 and complete the form of channels 114A-114E and 115A-115B. Finally, the inner cavity 116 can be cleaned under high pressure through the openings 117A-117D to remove any debris remaining from the machining process.

[0077] Figure 2F shows an isometric view of the base member 150 of a liquid cooling assembly 100 according to several embodiments of the present invention.

[0078] The base member 150 may have at least two groups of mounting openings, each configured to align with the respective groups of mounting openings on the PCB 200 when the base member 150 is positioned adjacent to the bottom surface of the PCB 200. For example, the first group of mounting openings 210A to 210D on the PCB 200 (shown in Figure 2A) may align with the first group of mounting openings 151A to 151D on the base member 150, and the second group of mounting openings 240A to 240D on the PCB 200 (shown in Figure 2A) may align with the second group of mounting openings 152A to 152D on the base member 150. This positioning will be described in more detail with reference to Figures 3A to 3B.

[0079] It should be understood that in some embodiments, the base member 150 can be considered an optional element, and the liquid cooling assembly 100 does not have to include it. In such embodiments, the liquid cooling assembly may be mounted to the PCB 200 using the same or similar mounting elements as in embodiments having the base member 150, although the connection in these scenarios may be made directly to the PCB 200. Furthermore, in some embodiments, other common parts of the device 400 may be used as the base member 150. For example, in some embodiments, a reinforcing material (a standard OEM element for this purpose) may be used as the base member 150.

[0080] As is known in the art, reinforcing materials are mechanical components used in printed circuit boards (PCBs) to provide additional support and rigidity. Reinforcing materials are useful for reinforcing areas of the PCB that need to be more stable, rather than electrical components. This is particularly useful in flexible PCBs, where the reinforcing materials help maintain the integrity of solder joints and support components that could otherwise put stress on the flexible material.

[0081] Figures 2G and 2H illustrate isometric views of the top side of a heat sink 120 according to several embodiments of the present invention, respectively, and Figure 2H illustrates a front view of the heat sink 120. The heat sink 120 may include portions 121 and 122. As shown in Figure 2H, portion 121 may include inlet openings 123B and outlet openings 123A, respectively, for guiding liquid coolant into and out of an inner cavity 126 (shown in Figure 2I) positioned within portion 122. As shown in Figure 2G, the inlet openings 123B and outlet openings 123A may be attached to flexible tubes 132B and 132A via fittings 131B and 131A, respectively, and then attached to sections 116A and 116C of the inner cavity 116 of the heat sink 110 (shown in Figure 2B) via fittings 133B and 133A, respectively.

[0082] As shown in Figure 2H, in some embodiments, from the bottom side, portion 122 may include a contact surface 124, which may be configured to be thermally coupled to the heat dissipation area of ​​IC230 on PCB200 (shown in Figure 2A) via the surface 124. In particular, the contact surface 124 may be sized according to the dimensions of IC230, and portion 122 of the heat sink 120 may be thermally coupled to IC230 via thermal pads(s) attached to its heat dissipation area, as considered, for example, with reference to Figure 2D.

[0083] Figure 2I shows an enlarged bottom view of a transparently shown communicating portion (part 121) of a heat sink 120 according to several embodiments of the present invention. Part 121 may have an inner channel connecting openings 123B and 123D, thereby configured to direct the liquid coolant flow received through opening 123B into an inner cavity 126 (shown in Figure 2J). Part 121 may further have an inner channel connecting openings 123A and 123C, thereby configured to direct the liquid coolant flow from cavity 126 to inner cavity 116 through opening 123A.

[0084] Figure 2J shows a bottom view of a heatsink 120 in which the inner cavity 126 is transparent, according to some embodiments of the present invention. Figure 2K shows an enlarged bottom view (labeled "B" in Figure 2J) of the heatsink 120 in which the inner cavity 126 is transparent, according to some embodiments of the present invention.

[0085] The inner cavity 126 may be sized according to the dimensions of IC230. The cavity 126 may have a symmetrical configuration divided into two sections separated by a wall 129. Each of these sections may include two subsections separated by transverse channels 126A and 126B. Each subsection may include a plurality of longitudinal inner channels separated by a longitudinal wall 128 (which may also be called a “fin”), thereby increasing the surface area for heat transfer. From two sides of the cavity 126, the sections are connected via transverse channels 126C and 126D. The inner cavity 126 may further include an inlet opening 125A and an outlet opening 125B, respectively, so that each opening is adjacent to the respective section of the cavity 126. In other words, the inner cavity 126 is configured to provide fluid connectivity between the openings 125A and 125B through a plurality of longitudinal inner channels and transverse channels 126C and 126D.

[0086] At the corners of section 122, the heatsink 120 may have mounting openings 127A to 127D for positioning standoffs 122A to 122D, as will be described in detail with reference to Figure 3B.

[0087] As described above, the liquid cooling assembly 100 may include two heat sinks 110 and 120, each configured to dissipate heat from the respective components of the PCB 200 when installed. The heat sinks 110 and 120 are flexibly fluidically connected via tubes 132A and 132B, allowing them to move freely relative to each other. This flexibility can compensate for mechanical tolerances of the respective components (e.g., tolerances between IC 230 and auxiliary components 221-225).

[0088] To take advantage of this flexible connection, it is further suggested herein that heatsinks 110 and 120 are configured to be thermally coupled to each component of the PCB 200 by being pressed onto their heat dissipation areas (e.g., via thermal pads as described above) using a mechanically isolated group of clamping elements.

[0089] The term “mechanically isolated” is used herein to describe configurations in which the clamping elements of each group are designed and configured to adjust the pressure and positioning of each heat sink (110 or 120) without affecting the pressure and positioning of the other heat sink (120 or 110, respectively).

[0090] These aspects of positioning will be further described with reference to Figures 3A and 3B.

[0091] Figure 3A shows an exploded view of the liquid cooling assembly 100 (computing device 400) illustrating the connection of the heatsink 110 to the PCB 200.

[0092] In some embodiments, the mechanically isolated group of fastening elements may include a first group of fastening elements. The first group of fastening elements may include fastening elements (e.g., spring-biased screws 112A to 112D) coupled with elastic elements (e.g., coil spring washers 112A2 to 112D2). When coupled with the coil spring washers 112A2 to 112D2, the spring-biased screws 112A to 112D may, in their assembled state, be configured to secure the heat sink 110 to the base member 150 through the first group of mounting openings in the base member 150 (e.g., openings 151A to 151D as shown in Figure 2F) and the respective group of mounting openings in the PCB (e.g., openings 210A to 210D). The first group of fastening elements (e.g., spring-biased screws 112A to 112D coupled with coil spring washers 112A2 to 112D2) may be further configured to press the heat sink 110 substantially uniformly onto the heat dissipation areas of the auxiliary components 221 to 225 (via contact surfaces 119A to 119F) when fastened.

[0093] In particular, in order to thermally bond the heat sink 110 to the auxiliary components 221-225, each of the screws 112A-112D may be screwed through the respective openings 113A-113D of the heat sink 110 and then bonded to one of the retaining rings 112A1-112D1, respectively. Next, the screws 112A-112D may be screwed into the openings 210A-210D of the PCB 200 and the openings 151A-151D of the base member 150, respectively. Finally, the screws 112A-112D may be secured from the bottom side of the base member 150 by coil spring washers 112A2-112D2, respectively.

[0094] As further shown in Figure 3A, the inlet fitting 141B and the outlet fitting 141A may be connected to the heatsink 110 via openings 117B and 117A, respectively.

[0095] Figure 3B shows an exploded view of the liquid cooling assembly 100 and computing device 400, illustrating the connection of the heatsink 120 to the PCB 200.

[0096] In some embodiments, the mechanically isolated group of fastening elements may include a second group of fastening elements. The second group of fastening elements may include fastening elements (e.g., spring-biased screws 122A2-122D2) coupled with elastic elements (e.g., springs 122A1-122D1). When coupled with springs 122A1-122D1, the spring-biased screws 122A2-122D2 may, in their assembled state, be configured to secure the heat sink 120 to the base member 150 through the second group of mounting openings in the base member 150 (e.g., openings 152A-152D as shown in Figure 2F) and the respective group of mounting openings in the PCB 200 (e.g., openings 240A-240D). The second group of clamping elements (e.g., spring-biased screws 122A2-122D2 coupled with springs 122A1-122D1) may be further configured to press the heat sink 120 substantially uniformly onto the heat dissipation area of ​​IC230 (via a contact surface 124 as shown in Figure 2H) when tightened.

[0097] In some embodiments, the heatsink 120 may further include a plurality of standoffs 122A to 122D, each having a threaded opening (not shown) configured to separate the heatsink 120 from the surface of the PCB 200 and to receive spring-driven screws 122A2 to 122D2, respectively. In some embodiments, the standoffs 122A to 122D and the spring-driven screws 122A2 to 122D2 are configured to avoid mechanical interference with the PCB 200. Therefore, in order to thermally couple the heatsink 120 to the IC230, standoffs 122A to 122D can be installed in the openings 127A to 127D of section 122, respectively (as shown in Figure 2J), and then screws 122A2 to 122D2 can be coupled to the springs 122A1 to 122D1, the openings 152A to 152D of the base member 150, and the openings 240A to 240D of the PCB 200, respectively. Finally, screws 122A2 to 122D2 can be screwed into the threaded openings of the standoffs 122A to 122D and tightened until proper contact is achieved between the contact surface 124 and the heat dissipation surface of the IC230.

[0098] This enables the aforementioned mechanically isolated coupling of heat sinks 110 and 120 to their respective components of the PCB 200, taking advantage of the benefits of a flexible fluid connection between heat sinks 110 and 120, thereby providing the desired relaxation of mechanical tolerances between these components.

[0099] Additionally, in some embodiments, to avoid undesirable mechanical interference, the diameters of the screws 112A-112D, standoffs 122A-122D, and screws 122A2-122D2 can be made smaller than the diameters of their respective mounting openings (e.g., openings 210A-210D and 240A-240D). This adjustment may help avoid or minimize contact between the mounting elements and the PCB 200.

[0100] It should be understood that the use of screws as fastening elements and springs or coil spring washers as elastic elements, as described in certain embodiments (e.g., spring-biased screws 112A-112D coupled with coil spring washers 112A2-112D2, and spring-biased screws 122A2-122D2 coupled with springs 122A1-122D1), is merely illustrative. Other types of fastening elements (e.g., clamps, bolts, rivets, or latches) and elastic elements (e.g., elastomer pads, leaf springs, or Belleville washers) may also be used depending on specific design requirements and material suitability. Therefore, this disclosure is not limited to any particular type of fastening or elastic mechanism.

[0101] Figure 4 shows a top view of a liquid cooling assembly 100 having partially transparent heatsinks 110 and 120, illustrating a first liquid coolant circulation path and a second liquid coolant circulation path according to several embodiments of the present invention.

[0102] According to the concept of the present invention, in some embodiments, the inner cavity 116 of the heat sink 110 may be configured to be fluidly connectable to a liquid coolant distribution unit (not shown) and to form a first liquid coolant circulation path together with the liquid coolant distribution unit. In some embodiments, the inner cavity 126 of the heat sink 120 may be configured to be in a flexible fluid connection with the inner cavity 116 of the heat sink 110, sharing common inlet and outlet connections (via openings 117A and 117B and fittings 141A and 141B to the liquid coolant distribution unit) with the first liquid coolant circulation path and to form a second liquid coolant circulation path together with the liquid coolant distribution unit (not shown).

[0103] As shown in Figure 4, the liquid coolant flow 301 can enter the liquid cooling assembly 100 via the fitting 141B. Next, in section 116A of cavity 116, the flow can be divided into two flows, one of which is then directed through the inner cavity 116 of heat sink 110, and the other flow is directed through the inner cavity 226 of heat sink 120, thereby forming the two liquid coolant circulation paths. The first liquid coolant circulation path is indicated by a dashed line and arrow, and the second liquid coolant circulation path is indicated by a dotted line and arrow.

[0104] Following the first liquid coolant circulation path, the flow enters section 116B via the input channel 115A. Within section 116B, the flow is separated into multiple flows 312 passing through the inner channel 114A (not shown). The flow is then deflected by a projection 118C (shown in Figure 2B), thereby separating into multiple flows 313 that form multiple flows 314 passing through the inner channel 114B. As can be seen, the length of the inner channel walls varies. The proposed configuration provides efficient and substantially uniform separation of the flows 313 between the inner channels 114B. After passing through channel 114B, the flows 315 are deflected by the projection 118A, thereby forming a flow 316 that is substantially uniformly separated between the inner channels 114C (shown in Figure 2B). Subsequently, the flows 317 are deflected by the projection 118B and pass through the output channel 115B, exiting section 116B and entering section 116C. In section 116C, the flow is mixed with the output flow from the second liquid coolant circulation path (which proceeds through the heat sink 120) to form a flow 302 that exits the liquid cooling assembly through a common outlet connection, i.e., fitting 141A. It should be understood that sections 116A and 116C are separated by an inner wall 114F.

[0105] Following the second liquid coolant circulation path, flow 321 proceeds through tube 132B and enters the inner cavity 126 through opening 125A. The flow then proceeds through lateral channel 126A and is divided into numerous partial flows that pass through the longitudinal inner channel separated by the longitudinal wall 128 in the opposite longitudinal direction. After passing through the longitudinal inner channel, the flow is mixed again (e.g., flow 322) and led through lateral channels 126C and 126D. After passing through channels 126C and 126D, the flow is again divided into numerous partial flows (e.g., flow 324) that pass through the longitudinal inner channel. Next, flow 324 is combined again in lateral channel 126B and exits the inner cavity 126 through opening 125B. The flow 325 is then led through tube 132A to section 116C, where it mixes with the flow in the first liquid coolant circulation path. Finally, the liquid coolant flow 302 exits the liquid coolant assembly 100 through a common outlet connection, namely the opening 117A and the fitting 141A.

[0106] According to the concept of the present invention, the size and position of channels 115A and 115B can be one of the important aspects of liquid cooling efficiency. Since the separation between liquid cooling circulation paths can be performed passively, the size and position can be predetermined by the ratio in which the flow 301 is divided into the first and second liquid coolant circulation paths. Thus, the liquid cooling assembly 100 may be further configured to divide the input liquid coolant flow 301 between the first liquid coolant circulation path and the second liquid coolant circulation path in a predetermined ratio.

[0107] In some embodiments, the ratio may be determined at the design stage in accordance with the expected power consumption ratio between each component of the PCB 200, for example, between IC 230 and the group of auxiliary components 221-225.

[0108] It should be understood that the ratio can vary significantly depending on the embodiment. For example, in some power-intensive embodiments, the expected power consumption of IC230 may be up to 800W, while the power consumption of the auxiliary components may be up to 200W. Therefore, the ratio may be 1 / 4.

[0109] Therefore, in order to provide a desired ratio, the input channels of the heatsink 110 (e.g., input channel 115A) and the input channels of the heatsink 120 (e.g., opening 125A) can be sized in accordance with the predetermined ratio. Furthermore, in order to provide a desired ratio, the output channels of the heatsink 110 (e.g., output channel 115B) and the output channels of the heatsink 120 (e.g., opening 125B) can be sized in accordance with the predetermined ratio.

[0110] During the design phase, input data for designing the liquid cooling assembly 100 may include the quantity and layout of ICs and critical auxiliary components requiring thermal management, as well as their expected power consumption. Next, the dimensions of the input channel 115A and output channel 115B can be determined in relation to the sizes of the openings 125A and 125B, corresponding to the expected power consumption ratio. Then, the required flow rates for the fittings 141A and 141B can be determined based on the maximum power consumption.

[0111] Thus, the proposed invention further contributes to improvements in the relevant technical field by simplifying the manufacturing process for producing customized liquid cooling assemblies.

[0112] One common problem in liquid fluid circulation systems is airlocks. Airlocks occur when air becomes trapped within the system, often in the upper section, obstructing the proper flow of liquid. This can significantly impair the system's efficiency and cooling performance.

[0113] To avoid airlock issues, it is proposed that the input channel 115A and output channel 115B of the heatsink 110 be positioned adjacent to the upper wall of the inner cavity 116. For example, in the illustrated embodiment, channels 115A and 115B have a rectangular cross-section, and the upper wall is formed by the cover 111. This arrangement allows channels 115A and 115B to be adjacent to the upper wall, effectively mitigating the airlock problem. Any air bubbles that may enter the cavity 116 can easily pass through and exit the liquid cooling assembly.

[0114] The same concept can be further applied to the heatsink 120. The openings 125A and 125B can be made in the upper wall of the inner cavity 126 (and thus adjacent to it), as shown in Figure 2J, for example, and the airlock problem can be effectively mitigated.

[0115] Therefore, the described configuration of the liquid cooling assembly 100 can effectively apply the heat sinks 110 and 120 to absorb heat from the components of the PCB 200 and transfer the heat to the liquid medium (also referred to herein as the "liquid coolant") by convection and radiation.

[0116] In some embodiments, the liquid coolant may include water, glycol mixtures, and / or dielectric fluids, or other liquids having high thermal conductivity and heat capacity, as is generally known in the art.

[0117] It should be understood that all considerations regarding flow direction, including terms such as "input," "output," "inlet," "outlet," "go in," "go out," and similar terms, are provided for clarity only and should not be considered to limit the scope of the invention. Therefore, in some embodiments, the flow direction may be reversed, and all relevant elements should be considered to provide the opposite function, e.g., "output" instead of "input."

[0118] As can be seen from the provided description, the claimed invention represents a liquid cooling assembly that provides an improvement in the field of microelectronics and electronics engineering. Specifically, the proposed solution is readily adjustable to relax mechanical tolerances between different electrical components of the PCB in question and is adaptable to address the diverse thermal loads presented by the electrical components while maintaining the compactness of the design. Thereafter, the proposed solution enhances the overall heat dissipation efficiency of the thermal management system.

[0119] The present invention further represents a computing device including such an improved liquid cooling assembly, which further improves the aforementioned technical field by increasing the device operating efficiency, specifically enabling long-term stable operation in computationally intensive regimes due to highly efficient thermal management.

[0120] Unless otherwise specified, embodiments of the methods described herein are not bound to any particular order or sequence. Furthermore, all formulas described herein are intended only as examples, and other or different formulas may be used. In addition, some of the embodiments or elements of the described methods may occur or be performed at the same time.

[0121] While specific features of the present invention have been illustrated and described herein, many modifications, substitutions, alterations, and equivalents will come to mind for those skilled in the art. Therefore, it should be understood that the appended claims are intended to cover all such modifications and alterations that fall within the true spirit of the invention.

[0122] Various embodiments are presented. Each of these embodiments may, of course, include features from other embodiments presented, and embodiments not specifically described may include various features described herein.

Claims

1. A liquid cooling assembly, At least one first heatsink and at least one second heatsink, which are fluidly connectable to a liquid coolant distribution unit via common inlet and outlet connections, and are configured to be thermally coupled to at least one first electronic component and at least one second electronic component mounted on a printed circuit board (PCB) by being pressed onto the heat dissipation areas of the at least one first electronic component and at least one second electronic component, respectively, using mechanically isolated groups of clamping elements such that the pressure applied by the at least one first heatsink does not substantially affect the pressure applied by the at least one second heatsink. A liquid cooling assembly equipped with the following features.

2. The at least one first heat sink is fluidly connectable to the liquid coolant distribution unit and comprises an inner cavity configured to form a first liquid coolant circulation path together with the liquid coolant distribution unit, The at least one second heat sink is fluidly connectable to the inner cavity of the at least one first heat sink and comprises an inner cavity configured to form a second liquid coolant circulation path together with the liquid coolant distribution unit. The liquid cooling assembly according to claim 1.

3. The liquid cooling assembly according to claim 2, wherein the inner cavity of at least one second heat sink is fluidly connectable to the liquid coolant distribution unit via the inner cavity of at least one first heat sink.

4. The at least one first heat sink has a frame-shaped structure sized to correspond to the dimensions of the peripheral area of ​​the PCB, The at least one second heat sink is configured to be positioned substantially within the frame-shaped structure when the liquid cooling assembly is mounted on the PCB. The liquid cooling assembly according to any one of claims 1 to 3.

5. The liquid cooling assembly according to claim 4, wherein each of the at least one first heat sink and the at least one second heat sink comprises an internal cavity, and the internal cavity of the at least one second heat sink is fluidly connectable from the inside of the frame-shaped structure to the internal cavity of the at least one first heat sink.

6. A base member having at least two groups of mounting openings configured to align with the mounting openings of each group of PCBs when positioned adjacent to the bottom surface side of the PCB in the assembled state of the liquid cooling assembly. Furthermore, The clamping elements of the mechanically isolated group, In the assembled state, the first group of clamping elements is configured to fix and tighten the at least one first heatsink to the base member through the first group of mounting openings of the base member and the respective group of mounting openings of the PCB, thereby pressing the first heatsink substantially uniformly onto the heat dissipation area of ​​the at least one first electronic component, In the assembled state, the second group of clamping elements is configured to fix and tighten the at least one second heatsink to the base member through the second group of mounting openings of the base member and the respective group of mounting openings of the PCB, thereby pressing the second heatsink substantially uniformly onto the heat dissipation area of ​​the at least one second electronic component. A liquid cooling assembly according to any one of claims 1 to 3, comprising:

7. The liquid cooling assembly according to claim 6, wherein at least one of the first heat sink or the second heat sink comprises a plurality of standoffs having openings configured to separate the respective heat sinks from the PCB and to receive the clamping elements of the respective groups when assembled.

8. The liquid cooling assembly according to claim 7, wherein the standoff and the clamping element are configured to avoid mechanical interference with the PCB.

9. The liquid cooling assembly according to any one of claims 1 to 3, further configured to divide the input liquid coolant flow passing through the common inlet connection between the first heat sink and the second heat sink in a predetermined ratio.

10. The liquid cooling assembly according to claim 9, wherein the predetermined ratio is defined in correspondence with the expected power consumption ratio between the at least one first electronic component and the at least one second electronic component.

11. The liquid cooling assembly according to claim 9, further configured to divide the input liquid coolant flow by guiding a first portion thereof through an input channel of the at least one first heatsink and a second portion thereof through an input channel of the at least one second heatsink, wherein the input channels of the at least one first heatsink and the input channels of the at least one second heatsink are sized in accordance with the predetermined ratio.

12. (i) at least one of the at least one first heat sink and (ii) at least one second heat sink comprises an inner cavity having an output channel adjacent to the upper wall of the heat sink, and is fluidly connectable to the liquid coolant distribution unit through the output channel, according to any one of claims 1 to 3.

13. (i) at least one of the at least one first heat sink and (ii) the at least one second heat sink comprises an inner cavity having a plurality of inner channels, wherein the inner cavity is shaped to distribute a liquid coolant flow passing through the inner cavity substantially evenly among the plurality of inner channels.

14. The liquid cooling assembly according to any one of claims 1 to 3, wherein at least one of the at least one first heat sink and (ii) the at least one second heat sink is configured to be thermally coupled to the at least one first electronic component or the at least one second electronic component via a thermal pad attached to the heat dissipation area of ​​the at least one first electronic component or the at least one second electronic component.

15. A computing device, A printed circuit board (PCB) comprising at least one first electronic component and at least one second electronic component mounted on the printed circuit board (PCB), At least one first heatsink and at least one second heatsink, which are fluidly connectable to a liquid coolant distribution unit via common inlet and outlet connections, and which are thermally coupled to the at least one first electronic component and the at least one second electronic component by being pressed onto the heat dissipation areas of the at least one first electronic component and the at least one second electronic component, respectively, using mechanically isolated groups of clamping elements such that the pressure applied by the at least one first heatsink does not substantially affect the pressure applied by the at least one second heatsink. A computing device equipped with [a certain feature].

16. The at least one first heat sink is fluidly connectable to the liquid coolant distribution unit and comprises an inner cavity configured to form a first liquid coolant circulation path together with the liquid coolant distribution unit, The at least one second heat sink is fluidly connected to the inner cavity of the at least one first heat sink and comprises an inner cavity configured to form a second liquid coolant circulation path together with the liquid coolant distribution unit. The computing device according to claim 15.

17. The computing device according to claim 16, wherein the inner cavity of at least one second heat sink is fluidly connectable to the liquid coolant distribution unit via the inner cavity of at least one first heat sink.

18. The at least one first heat sink has a frame-shaped structure sized to correspond to the dimensions of the peripheral area of ​​the PCB, The computing device according to any one of claims 16 to 17, wherein the at least one second heat sink is substantially positioned within the frame-shaped structure.

19. The computing device according to claim 18, wherein the inner cavity of at least one second heat sink is fluidly connectable to the inner cavity of at least one first heat sink from the inside of the frame-shaped structure.

20. The computing device according to any one of claims 15 to 17, wherein at least one of the at least one first heat sink and (ii) the at least one second heat sink comprises an inner cavity having an output channel adjacent to the upper wall of the heat sink and is fluidly connectable to the liquid coolant distribution unit through the output channel.

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