Liquid cooling assembly for bilateral thermal management and computing device containing the same

Abstract

We provide advanced liquid cooling-based thermal management systems, liquid cooling assemblies, and computing devices for electronic components on printed circuit boards. [Solution] The computing device 400 includes a printed circuit board (PCB) 200 which includes a plurality of electronic components mounted thereon. The liquid cooling assembly 100 includes at least one first heatsink 110, at least one second heatsink 150, and at least one third heatsink 120. The heatsink 120 is positioned substantially within the frame-shaped structure of the heatsink 110 when the liquid cooling assembly 100 is mounted on the PCB 200. The heatsink 150 is positioned from the bottom side of the PCB 200, directly opposite the heatsinks 110 and 120.

Description

Technical Field

[0001] Cross-Reference to Related Applications The present application claims the benefit of priority from U.S. Patent Application No. 19 / 058,176 entitled "LIQUID COOLING ASSEMBLY FOR ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS AND COMPUTING DEVICE INCLUDING SAME" filed on February 20, 2025, U.S. Patent Application No. 19 / 216,235 entitled "LIQUID COOLING ASSEMBLY FOR DUAL-SIDED THERMAL MANAGEMENT AND COMPUTING DEVICE INCLUDING THE SAME" filed on May 22, 2025, and U.S. Patent Application No. 19 / 381,236 filed on November 6, 2025, the entire contents of all of which are incorporated herein by reference.

[0002] The present invention relates to the technical field of microelectronics and electronic engineering, and in particular to an advanced liquid cooling-based thermal management system for electronic components on printed circuit boards.

Background Art

[0003] In the field of microelectronics and electronic engineering, efficient thermal management is critical to ensure optimal performance and service life of electronic components. As electronic circuits become increasingly complex and higher in density, the challenge of effectively dissipating heat has become more prominent. Conventional cooling methods such as air cooling by fans or passive solutions are often insufficient to address the heat demand of modern high-performance electronic devices. These conventional solutions may lead to overheating, reduced efficiency, and potential damage to sensitive components, necessitating the development of more advanced cooling technologies.

[0004] Liquid cooling systems are emerging as a promising alternative, offering superior heat dissipation capabilities by circulating a fluid to absorb and transfer heat away from components. However, existing heat dissipation problems are further exacerbated by the fact that different components on a PCB can exhibit varying power densities, leading to significantly different heat dissipation requirements. Existing solutions often lack flexibility and adaptability, particularly when dealing with varying thermal loads across different components of a system. This limitation can result in uneven cooling, inefficient energy use, and increased complexity in system design and maintenance.

[0005] Recently, vertical power supply technology has emerged as an innovative approach in high-performance computing systems. This technology involves the vertical integration of power supply components through the PCB, creating a direct power path between the power source and the components requiring power. By shortening the power supply path, this technology significantly reduces power loss, improves power integrity, and enhances overall system efficiency. In addition, vertical power supply enables higher current density and more precise voltage regulation, which is crucial for powering advanced integrated circuits with increasingly demanding power requirements.

[0006] In addition to thermal management challenges, mechanical tolerances between the various components of a printed circuit board (PCB) can cause significant problems. These tolerances can arise from manufacturing limitations such as soldering, leading to large, slightly non-parallel heat dissipation areas. When using a single rigid cooling element, such as a heatsink, which must simultaneously and properly contact the heat dissipation areas of numerous components, any geometric mismatch between components can negatively affect contact. Since optimal heat transfer depends on precise contact between the heatsink and the components, mismatches can dramatically reduce cooling efficiency.

[0007] Another important aspect to consider alongside cooling efficiency is design compactness. Often, the volume within the device housing is limited, making it crucial to develop a cooling system that fits within the device's spatial constraints, in addition to effectively managing heat. This requires a balance between performance and design compactness to ensure that the cooling solution does not compromise the overall functionality and form factor of the electronic device. [Overview of the project]

[0008] The emergence of vertical power supply technology necessitates the development of new thermal management system designs. Conventional cooling solutions are not optimized for the unique thermal challenges presented by this technology, which arise from positioning heat-generating components on both sides (faces) of the PCB. This bi-sided component arrangement requires a cooling solution that can simultaneously and effectively address the thermal management needs on both sides of the substrate.

[0009] Therefore, there is a need for liquid cooling assemblies that provide improvements in the fields of microelectronics and electronics. Specifically, there is a need for effective cooling solutions for vertically powered systems that provide liquid cooling for electronic components located on both sides of a PCB while fitting within the spatial constraints of modern electronic devices. There is an even greater need for solutions that are easily adjustable to relax mechanical tolerances between different electrical components of the target PCB and are adaptable to address the diverse thermal loads presented by the electrical components while maintaining design compactness. Such solutions would thereby increase the overall heat dissipation efficiency of the thermal management system and represent a significant advance in thermal management technology for next-generation computing systems. There is a further need for computing devices that include such improved liquid cooling assemblies that improve the aforementioned fields by increasing device operating efficiency, specifically enabling long-term stable operation in computationally intensive regimes due to highly efficient thermal management.

[0010] To address the aforementioned needs, the following is proposed:

[0011] In a comprehensive embodiment, the present invention may cover a liquid cooling assembly. The liquid cooling assembly may include at least one first heatsink configured to be thermally coupled to at least one first electronic component, and at least one second heatsink configured to be thermally coupled to at least one second electronic component. The at least one first heatsink and the at least one second heatsink may be configured to be assembled on opposite sides of a printed circuit board (PCB). The at least one first heatsink may have an inner cavity that is fluidly connectable to a liquid coolant distribution unit and may be configured to form a first liquid coolant circulation path together with the liquid coolant distribution unit. The at least one second heatsink may have an inner cavity that is fluidly connected to the inner cavity of the at least one first heatsink and, when the liquid cooling assembly is assembled, is configured to form a second liquid coolant circulation path together with the liquid coolant distribution unit, sharing common inlet and outlet connections to the liquid coolant distribution unit with the first liquid coolant circulation path. The inner cavity of the at least one first heat sink may be configured to be fluidly connected to the inner cavity of the at least one second heat sink via an inlet communication channel and an outlet communication channel through at least one mounting opening or at least one recess of the PCB.

[0012] In another comprehensive embodiment, the present invention may cover a computing device. The computing device may include a printed circuit board (PCB) comprising (i) at least one first electronic component and at least one second electronic component mounted on opposite sides of the printed circuit board (PCB), and (ii) at least one mounting opening or at least one recess; and at least one first heat sink thermally coupled to the at least one first electronic component; and at least one second heat sink thermally coupled to the at least one second electronic component. The at least one first heat sink may have an internal cavity that is fluidically connectable to a liquid coolant distribution unit and may be configured to form a first liquid coolant circulation path together with the liquid coolant distribution unit. The at least one second heat sink may include an internal cavity that is fluidically connected to the internal cavity of the at least one first heat sink via an inlet communication channel and an outlet communication channel through the at least one mounting opening or at least one recess. The inner cavity of at least one second heatsink may be further configured to form a second liquid coolant circulation path together with the liquid coolant distribution unit, while sharing common inlet and outlet connections to the liquid coolant distribution unit with the first liquid coolant circulation path.

[0013] In some embodiments, each of the inlet communication channel and the outlet communication channel may be configured to be in a permanent connection with one of (a) the inner cavity of the at least one first heatsink and (b) the inner cavity of the at least one second heatsink, and to provide, in the assembled state, a removable fluid-tight connection to the other of (a) the inner cavity of the at least one first heatsink and (b) the inner cavity of the at least one second heatsink.

[0014] In some embodiments, the liquid cooling assembly may further include at least one third heatsink configured to be thermally coupled to at least one third electronic component. The at least one third heatsink may have an inner cavity in which it is in a flexible fluid connection with the inner cavity of the at least one first heatsink and may be configured to form a third liquid coolant circulation path together with the liquid coolant distribution unit, sharing common inlet and outlet connections to the liquid coolant distribution unit with the first and second liquid coolant circulation paths.

[0015] In some embodiments, the at least one first heat sink may have a frame-shaped structure sized to correspond to the dimensions of the peripheral area of ​​the PCB, and the at least one third heat sink may be configured to be substantially positioned within the frame-shaped structure when the liquid cooling assembly is mounted on the PCB.

[0016] In some embodiments, the flexible fluid connection may include at least one flexible inlet tube and at least one flexible outlet tube that fluidly connect the inner cavity of the at least one third heat sink to the inner cavity of the at least one first heat sink from inside the frame-shaped structure.

[0017] In some embodiments, the at least one first heat sink and the at least one third heat sink may be configured to be thermally coupled to the at least one first electronic component and the at least one third electronic component by pressing them onto the heat dissipation areas of the at least one first electronic component and the at least one third electronic component using a mechanically isolated group of clamping elements, respectively.

[0018] In some embodiments, the liquid cooling assembly may further include a base member having at least two groups of mounting openings, each having at least one mounting opening. The mechanically isolated groups of fastening elements may include a first group of fastening elements configured, when assembled, to fasten the at least one first heatsink to the base member through the first group of mounting openings of the base member and the respective groups of mounting openings of the PCB, and to press the first heatsink substantially uniformly over the heat dissipation area of ​​the at least one first electronic component; and a second group of fastening elements configured, when assembled, to fasten the at least one third heatsink to the base member through the second group of mounting openings of the base member and the respective groups of mounting openings of the PCB, wherein the second group of fastening elements includes an elastic element and, when tightened, is configured to press the third heatsink substantially uniformly over the heat dissipation area of ​​the at least one third electronic component.

[0019] In some embodiments, the at least one second heat sink may be integrated with the base member.

[0020] In some embodiments, at least one of the first or third heat sinks may include a plurality of standoffs in the assembled state, each of which has openings configured to separate the respective heat sinks from the PCB and to receive fastening elements for each group.

[0021] In some embodiments, the standoff and the fastening element may be configured to avoid mechanical interference with the PCB.

[0022] In some embodiments, the at least one first heat sink and the at least one second heat sink may be configured to be thermally coupled to the at least one first electronic component and the at least one second electronic component via thermal pads attached to the heat dissipation areas of the at least one first electronic component and the at least one second electronic component, and the at least one third heat sink may be configured to be thermally coupled to the at least one third electronic component via a thermal paste covering the heat dissipation area of ​​the at least one third electronic component.

[0023] In some embodiments, the liquid cooling assembly may be further configured to divide the input liquid coolant flow passing through a common inlet connection into the first liquid coolant circulation path, the second liquid coolant circulation path, and the third liquid coolant circulation path in a predetermined ratio.

[0024] In some embodiments, the predetermined ratio may be defined in relation to the expected power consumption ratio between the at least one first electronic component, the at least one second electronic component, and the at least one third electronic component.

[0025] In some embodiments, the liquid cooling assembly may be further configured to divide the input liquid coolant flow by guiding a first portion through the input channel of the at least one first heatsink, a second portion through the input channel of the at least one second heatsink, and a third portion through the input channel of the at least one third heatsink, wherein the input channels of the at least one first heatsink, the at least one second heatsink, and the at least one third heatsink are sized in accordance with the predetermined ratio.

[0026] In some embodiments, at least one of (i) said at least one first heat sink, (ii) said at least one second heat sink, and (iii) said at least one third heat sink may comprise an input channel and an output channel adjacent to an upper wall of a respective inner cavity of said at least one first heat sink, said at least one second heat sink, and said at least one third heat sink.

[0027] In some embodiments, an inner cavity of at least one of (i) said at least one first heat sink, (ii) said at least one second heat sink, and (iii) said at least one third heat sink may comprise a plurality of inner channels, and is shaped to substantially evenly distribute a liquid coolant flow passing through the inner cavity among the plurality of inner channels of the inner cavity.

[0028] In some embodiments, at least one of said at least one first heat sink, said at least one second heat sink, and said at least one third heat sink is configured to be thermally coupled to said at least one first electronic component, said at least one second electronic component, and said at least one third electronic component, respectively, via a direct-to-chip (D2C) liquid cooling arrangement.

[0029] The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of this specification. However, the invention, both as to its construction and its method of operation, together with its objects, features, and advantages, may be best understood from the following detailed description when read in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] [Figure 1] Fig. 1 is an isometric view of a liquid cooling assembly and a computing device, in accordance with some embodiments of the present invention. [Figure 2A] This is an isometric view of the top surface (upper side) of a PCB according to several embodiments of the present invention. [Figure 2B] This is an isometric view of the bottom side (bottom surface) of a PCB according to several embodiments of the present invention. [Figure 2C] This is an isometric view of the top surface of a first heat sink according to several embodiments of the present invention. [Figure 2D] This is an enlarged isometric view of the output channel of a first heat sink according to some embodiments of the present invention. [Figure 2E] This is an isometric view of the bottom side of a first heat sink according to several embodiments of the present invention. [Figure 2F] This is an isometric view of the upper surface of a second heat sink according to some embodiments of the present invention. [Figure 2G] This is an isometric view of the bottom side of a second heatsink of a liquid cooling assembly according to some embodiments of the present invention. [Figure 2H] This is an isometric view of the bottom side of a second heatsink of a (coverless) liquid cooling assembly according to some embodiments of the present invention. [Figure 2I] This is an isometric view of the upper side of a third heat sink connected to inlet and outlet flexible tubes, according to some embodiments of the present invention. [Figure 2J] This is a front view of a third heat sink (shown transparently) according to some embodiments of the present invention. [Figure 2K] This is a side view of a third heat sink (shown transparently) according to some embodiments of the present invention. [Figure 2L] This is a partial top view of a second heat sink (shown transparently) according to some embodiments of the present invention. [Figure 3A] This is an exploded view of a liquid cooling assembly and computing device showing the connection of a first heatsink to a PCB according to some embodiments of the present invention. [Figure 3B]This is an exploded view of a liquid cooling assembly and computing device showing the connection of second and third heat sinks to a PCB according to some embodiments of the present invention. [Figure 4A] This is a top view of a liquid cooling assembly having a partially transparent first heat sink illustrating a first liquid coolant circulation path according to some embodiments of the present invention. [Figure 4B] This is an isometric view of a liquid cooling assembly having a partially transparent second heat sink illustrating a second liquid coolant circulation path according to some embodiments of the present invention. [Figure 4C] This is a top view of a liquid cooling assembly having a partially transparent third heat sink illustrating a third liquid coolant circulation path according to some embodiments of the present invention. [Modes for carrying out the invention]

[0031] For the sake of simplicity and clarity, it should be understood that the elements shown in the diagrams are not necessarily drawn to scale. For example, the dimensions of some elements may be exaggerated relative to others for clarity. Furthermore, reference numbers may be repeated between diagrams to indicate corresponding or similar elements where deemed appropriate.

[0032] Those skilled in the art will recognize that the present invention can be embodied in other specific forms without departing from its spirit or essential features. Therefore, the embodiments described herein should be considered in all respects as illustrative and not limiting to the invention as described herein. Accordingly, the scope of the invention is indicated by the appended claims rather than the foregoing description, and therefore, all modifications within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention.

[0033] The following detailed description includes numerous specific details to provide a complete understanding of the invention. However, it will be understood by those skilled in the art that the invention can be carried out without these specific details. In other examples, known methods, procedures, and components are not described in detail so as not to obscure the invention. Some features or elements described in relation to one embodiment may be combined with features or elements described in relation to other embodiments. For clarity, discussion of the same or similar features or elements may not be repeated.

[0034] Embodiments of the present invention are not limited in this respect, but as used herein, the terms “multiple” and “one or more” may include, for example, “many” or “two or more.” The terms “multiple” or “one or more” may be used throughout this specification to describe two or more components, devices, elements, units, parameters, etc. The term “set” may include one or more items as used herein.

[0035] As used herein, the term “fluid connection” refers to a path that allows fluid to flow between two components of the system of the present invention, the two components may be joined directly or indirectly to one another. Similarly, as used herein, the terms “fluidically coupled,” “fluidly connected,” or “fluidly connectable” refer to a connection between two components that allows fluid to flow from one component to the other, the connection may be direct or indirect (through an intermediate component) that allows fluid to flow through it.

[0036] In the context of the present invention, the term “flexible fluid connection” should be understood to refer to a mechanically flexible connection that enables the transfer of fluid between connectable components. For example, such a connection may be implemented using a flexible tube or similar component, which can be deformed between connected components to accommodate mechanical tolerances and mismatches while maintaining the fluid path between them.

[0037] In some embodiments of the present invention, the terms “central region” and “peripheral region” are used to describe the relative positioning of at least two elements with respect to the geometric center of another element (for example, in relation to a printed circuit board (PCB)). For example, if a first electronic component is described as being located in the central region of the PCB and a second electronic component is described as being in the peripheral region, this indicates that the first component is located closer to the geometric center of the PCB than the second component. It should be understood that such terminology does not impose any specific limitations on the exact distance from the center, and the use of “central” or “peripheral” should not be construed as limiting the scope of this disclosure in this respect.

[0038] Please understand that the terms “first,” “second,” and “third” are used solely to clearly distinguish elements and do not imply any specific order or sequence unless otherwise specified.

[0039] Unless otherwise specified, embodiments of the methods described herein are not bound to any particular order or sequence. In addition, some embodiments or elements of the methods described may occur or be performed simultaneously, at the same time, in parallel, or repeatedly.

[0040] According to the concept of some embodiments of the present invention, the proposed configuration is positioned on both opposite sides (both sides) of the PCB, enabling efficient thermal management for solutions applying vertical power supply technology by allowing separate cooling paths for electronic components with varying thermal densities. As used herein, the terms “both opposite sides” and “both opposite sides” when referring to the PCB can refer to two opposing planes of the substrate (e.g., the top surface and the bottom surface) and can be used interchangeably throughout this disclosure. By sharing common inlets and outlets, the system simplifies the design, reduces the complexity of the cooling assembly, makes the assembly more compact, and facilitates integration with electronic devices in limited space.

[0041] As further suggested herein, optionally, fluid connections between heat sinks provide adaptability to mechanical tolerances and mismatches on the PCB, ensuring effective thermal contact and heat dissipation.

[0042] As a result, the proposed liquid cooling assembly can address the diverse thermal requirements of modern high-performance electronic devices and improve overall heat dissipation efficiency.

[0043] Therefore, computing devices including such improved liquid-cooled assemblies as proposed herein can have a compact design while providing long-term stable operation in computationally intensive regimes due to highly efficient thermal management.

[0044] Herein, we refer to Figure 1, which shows an isometric view of a liquid cooling assembly 100 and a computing device 400 according to some embodiments of the present invention.

[0045] For clarity and brevity, the following description may, in some respects, relate only to liquid cooling assemblies. However, since the proposed computing device may include a liquid cooling assembly in all embodiments considered herein, it should be understood that the same principles and descriptions may apply equally to the proposed computing device.

[0046] Furthermore, for the sake of clarity and conciseness, descriptions of similar or identical components shown in the provided diagrams may be omitted.

[0047] As shown in Figure 1, in some embodiments, the computing device 400 may include a printed circuit board (PCB) 200 that includes a plurality of electronic components mounted thereon, particularly components mounted on both opposite sides (described in detail with reference to Figures 2A and 2B).

[0048] A printed circuit board (PCB) is a fundamental component in electronic devices, serving as a platform for mounting and interconnecting various electronic components. A PCB (such as a PCB200) typically consists of a non-conductive substrate, usually made of glass fiber, composite epoxy, or other laminate materials, onto which conductive paths are etched or printed. These paths are often made of copper and facilitate electrical connections between the electrical components mounted on them.

[0049] As is well known, heatsinks are essential components in thermal management systems for PCBs. They are generally designed to dissipate heat generated by electronic components such as microprocessors and power transistors to prevent overheating and ensure optimal performance.

[0050] In some embodiments, the liquid cooling assembly 100 may include at least one first heat sink (e.g., heat sink 110), at least one second heat sink (e.g., heat sink 150), and at least one third heat sink (e.g., heat sink 120).

[0051] In some embodiments, the heatsink 110 may have a frame-shaped structure sized to correspond to the dimensions of the peripheral area of ​​the PCB 200, as shown in Figure 1.

[0052] In some embodiments, the heatsink 120 may be configured to be positioned substantially within the frame-shaped structure of the heatsink 110 when the liquid cooling assembly 100 is mounted on the PCB 200 (i.e., when the device 400 is assembled as shown in Figure 1).

[0053] In some embodiments, the heatsink 150 may be positioned from the bottom side (opposite side) of the PCB 200, directly opposite the heatsinks 110 and 120 (i.e., when the device 400 is assembled as shown in Figure 1).

[0054] For clarity, in the examples shown in the figures and throughout this disclosure, the “first” heatsink will be referred to as heatsink 110, the “second” heatsink as heatsink 150, and the “third” heatsink as heatsink 120. However, such references should not be considered to impose any limitations on the scope of the invention as set forth by the appended set of claims. For example, in some alternative embodiments, the “first” heatsink may be heatsink 120, the “second” heatsink may be heatsink 150, and the “third” heatsink may be heatsink 110.

[0055] In some embodiments, the heatsink 120 may include portions 121 and 122 (described in more detail with reference to Figures 2I to 2L).

[0056] In some embodiments, the liquid cooling assembly 200 may further include at least one flexible inlet tube 132B and at least one flexible outlet tube 132A. In some embodiments, the heat sinks 110, 150 and 120 may have internal cavities for circulating the liquid coolant (e.g., internal cavities 116, 157 and 126 shown in Figures 2C, 2H and 2L, respectively). In some embodiments, tubes 132A and 132B may fluidly connect the internal cavities of the heat sinks 110 and 120 from inside the frame-shaped structure, as shown in Figure 1. Tube 132A may be connected to the internal cavities 116 and 126 of the heat sinks 110 and 120 via fittings 133A and 131A, respectively. Tube 132B can be connected to the inner cavities 116 and 126 of the heatsinks 110 and 120 via fittings 133B and 131B, respectively.

[0057] In some embodiments, the inner cavity 116 of the heatsink 110 (described in detail with reference to Figure 2B) may be closed from above with a cover 111. The cover 111 may be welded to the body of the heatsink 110 to hermetically seal the inner cavity 116.

[0058] In some embodiments, the heat sinks 110, 150, and 120 may be made from a material having high thermal conductivity, such as aluminum or copper, as is generally known in the art.

[0059] In some embodiments, heatsink 110, and / or heatsink 150, and / or heatsink 120 may also be referred to as cold plates. Both “heatsink” and “cold plate” are commonly known names for such components of a thermal management system and may be used interchangeably in this context.

[0060] In some embodiments, the liquid cooling assembly 100 may further include a base member that can be positioned adjacent to the bottom side of the PCB 200 in the assembled state of the assembly 100. In certain embodiments (for example, as shown), a second heat sink (heat sink 150) may be integrated with the base member or serve as the base member itself, thereby forming a single structural element. In such a configuration, the heat sink 150 facilitates the attachment of the heat sinks 110 and 120 to the PCB 200 while avoiding unnecessary mechanical interference between the heat sinks 110 and 120 and the PCB 200, thereby ensuring high efficiency of heat dissipation. For example, the heat sink 110 may be attached to the heat sink 150 via fastening elements (e.g., screws 250E1-250H1) shown in Figure 3A.

[0061] In some embodiments, the heatsink 150 (when integrated with the base member) may function (and may be called) as a reinforcing element, which is a standard OEM element that is a mechanical component used in printed circuit boards (PCBs) to provide additional support and rigidity. As is known in the art, reinforcing elements are useful for reinforcing areas of the PCB that need to be more stable, rather than electrical components. This may be particularly useful in flexible PCBs, where the reinforcing elements help maintain the integrity of solder joints and support components that could otherwise put stress on the flexible material.

[0062] It should be understood that in some alternative embodiments (not shown), the base member may be implemented as a separate element. In such cases, the heatsink 150 may be detachably connectable to the base member, or it may be directly connectable to the PCB 200 without requiring any mechanical connection to the base member.

[0063] In some embodiments, the liquid cooling assembly 100 may be fluidly connected to a liquid coolant distribution unit (e.g., a liquid coolant distribution unit 300 schematically shown in Figures 4A to 4C) via, for example, an inlet fitting 141B and an outlet fitting 141A (also referred to herein as an inlet connection and an outlet connection).

[0064] As is well known, liquid coolant distribution units (CDUs) are critical components in thermal management, particularly in computer systems for data centers. Their primary function is to manage and regulate the distribution of coolant to ensure efficient thermal management. Thus, in some embodiments, the computing device 400 may be part of a larger system, and the CDU is connected to a number of components of that system in a way that allows it to operate simultaneously.

[0065] In some embodiments, the computing device 400 may be further connected to a motherboard (also called a universal baseboard (UBB)) via high-speed connectors 225A and 225B located at the bottom of the PCB 200, for example (as shown in Figure 2B). Such high-speed connectors may require a strong physical connection to function properly. To ensure such a connection, the computing device 200 may be configured to be secured to the motherboard, for example, via fastening elements (screws 112A-112D).

[0066] As illustrated, in some embodiments, the heat sinks 110, 150, and 120 may be configured to be thermally coupled via a direct-to-chip (D2C) liquid cooling configuration to a group of power-intensive components 221 and 222 (shown in Figure 2A, also referred herein as “at least one first electronic component” or “first group of auxiliary electronic components”), a group of power-intensive components 223 and 224 (shown in Figure 2B, also referred herein as “at least one second electronic component” or “second group of auxiliary electronic components”), and an integrated circuit (IC) 230 (shown in Figure 2A, also referred herein as “at least one third electronic component”).

[0067] As used herein, the term direct-to-chip (D2C) liquid cooling configuration refers to a cooling arrangement in which one or more liquid cooling heatsinks (e.g., heatsinks 110, 120, and 150) are positioned in direct thermal contact with the surface of electronic components (e.g., components 221-224 and IC230) typically via a thermal interface material such as a thermal paste or thermal pad. In such a configuration, the liquid coolant circulates within the internal cavity of the heatsink and does not come into direct contact with the electronic components or printed circuit board (PCB). This should be clearly distinguished from immersion cooling, in which the entire electronic assembly is submerged in a dielectric liquid coolant.

[0068] The components of the liquid cooling assembly 100 and the computing device 400 will be described in more detail with reference to Figures 2A to 2L.

[0069] Figure 2A illustrates the top view of PCB 200 according to several embodiments of the present invention. It should be understood that the embodiments of PCB 200 shown herein are provided for illustrative purposes only and are non-exclusive examples. The provided embodiments of PCB 200 are intended to clarify how electronic components requiring thermal management can be positioned and how the design of the liquid cooling assembly 100 can be adapted to the PCB layout topology to effectively dissipate heat. Furthermore, when considering computing device 400, the concept of the present invention primarily relates to a form of thermal management that can potentially improve the performance of a wide variety of computing devices. Therefore, the present invention is not related to any particular function of computing device 400. Accordingly, the present invention should be considered not to be limited to any particular type of computing device or its intended use, nor to any particular PCB or its intended use.

[0070] PCB200 may include a wide range of components such as resistors, capacitors, diodes, transistors, and integrated circuits (ICs), each performing a specific function within the electronic system. Additionally, in some embodiments, PCB200 may incorporate connectors (e.g., connectors 225A and 225B), switches, and other mechanical components for interfacing with external devices or systems. As is well known, PCB design plays a crucial role in creating customized liquid cooling assemblies because it determines the layout and placement of components, influencing the overall performance, reliability, heat dissipation characteristics, and manufacturability of the electronic device.

[0071] In some embodiments, the PCB200 may include power-intensive electronic components that require thermal management for normal operation.

[0072] In some specific embodiments, the PCB 200 may include an integrated circuit (IC) 230 mounted on its upper side in the central region of the PCB 200. In some embodiments, the IC 230 may be a system-on-a-chip (SoC), a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), an application-specific standard product (ASSP), or a similar electronic component known in the art. The IC 230 may perform data processing, memory storage, signal processing, power management, or other functions, as known in the art.

[0073] In some specific embodiments, the PCB 200 may further include a group of auxiliary electronic components mounted thereon. In some embodiments, the auxiliary electronic components may include various elements mounted in the peripheral area of ​​the PCB 200, such as power transistors, resistors, capacitors, inductors, diodes, and connectors, and may also include auxiliary chips, controllers, or similar components configured to support the main functions of the IC 230. The group of auxiliary electronic components may include power-intensive components 221 and 222 mounted on the top side of the PCB 200 and a group of power-intensive components (e.g., components 223 and 224) mounted on the bottom side of the PCB 200. Components 221, 222, 223, and 224 may require heat dissipation to maintain normal operation.

[0074] In some embodiments, the PCB 200 may include several groups of mounting openings. For example, a first group comprising mounting openings 250E to 250H may be configured for mounting a heatsink 110, as detailed in Figure 3A. A second group comprising mounting openings 240A to 240D may be configured for mounting a heatsink 120, as detailed in Figure 3B. A third group comprising mounting openings 250A to 250D may be configured for mounting a heatsink 150, as shown in Figures 3A and 3B. A fourth group comprising mounting openings 210A to 210D may be configured for mounting a device 400 to a motherboard (UBB) (the assembly is partially shown in Figure 3A). In some embodiments, the PCB 200 may further include a pair of mounting openings 220A and 220B configured to establish a fluid connection between the inner cavity 116 of the heatsink 110 and the inner cavity 157 of the heatsink 150, as further described with reference to Figures 2E, 2F, and 4B.

[0075] Here, we refer to Figures 2C to 2E, which show some embodiments of the heat sink 110 in the present invention.

[0076] As shown in Figure 2C, an isometric view of the top surface of a heat sink 110 according to several embodiments of the present invention is illustrated.

[0077] As shown in Figure 2C, the heatsink 110 may have an inner cavity 116 around its frame-shaped structure. The inner cavity 116 may be divided into sections 116A, 116B, and 116C. Section 116A may be connected to section 116B via an input channel 115A. Section 116B may be connected to section 116C via an output channel 115B. In section 116A, the heatsink 110 may further include an inlet opening 117B. In section 116C, the heatsink 110 may further include an outlet opening 117A. The inner cavity 116 can be fluidly connected to a liquid coolant distribution unit (e.g., the liquid coolant distribution unit 300 shown in Figures 4A-4C) and, together with the liquid coolant distribution unit, may be configured to form a liquid coolant circulation path (also referred to herein as the “first” liquid coolant circulation path) from the liquid coolant distribution unit through the inlet opening 117B to section 116A, through the input channel 115A to section 116B, through the output channel 115B to section 116C, and through the outlet opening 117A to the liquid coolant distribution unit. The aspects of the liquid coolant circulation will be described in more detail with reference to Figure 4A. By providing liquid coolant circulation around the frame-shaped structure, assembly 100 enables efficient heat dissipation from the electronic components thermally coupled to the heat sink 110.

[0078] In some embodiments, the inner cavity 116 may include a plurality of inner channels 114A to 114E. The inner cavity 116 may be molded to distribute the liquid coolant flow passing through the inner cavity substantially evenly among its plurality of inner channels. For example, in some embodiments, the heat sink 110 may have projections 118A to 118D configured to guide the flow so as to distribute the flow between each of the inner channels 114A to 114E (further described in more detail with reference to Figure 4A).

[0079] As shown in Figure 2C, the inner channels 114A to 114E may be formed by a series of separating inner walls positioned along the flow direction. This configuration not only ensures a uniform flow distribution but also significantly increases the heat conduction area of ​​the heat sink 110 that is in direct contact with the liquid coolant flow, thereby improving heat dissipation efficiency.

[0080] In some embodiments, the heatsink 110 may further include openings 117E and 117F located in sections 116A and 116C, respectively (as further described with reference to Figures 2F and 4B), configured to provide a fluid connection between the inner cavity 116 of the heatsink 110 and the inner cavity 157 of the heatsink 150. From inside the frame-shaped structure, the heatsink 110 may further include openings 117C and 117D for providing a fluid connection with a heatsink 120 (not shown). Thereafter, section 116A of the inner cavity 116 may be configured such that the flow entering through the inlet opening 117B is divided into three paths: a first path proceeds through section 116B of the inner cavity 116 via the input channel 115A; a second path proceeds through opening 117E to the heatsink 150; and a third path proceeds through opening 117D and tube 132B (not shown) to the heatsink 120. Next, section 116C may be configured such that the flow, after passing through section 116B of the inner cavity 116, enters through output channel 115B and exits through outlet opening 117A, mixing with the flow returning from heat sink 150 through opening 117F, as well as the flow returning from heat sink 120 through tube 132A (not shown) and opening 117C.

[0081] The heatsink 110 may also include through-mount openings 113A to 113D for mounting the entire computing device 400 onto a motherboard (not shown) using fastening elements (e.g., screws 112A to 112D) (not shown).

[0082] Figure 2D is an enlarged isometric view (labeled "A" in Figure 2C) of an output channel 115B connecting sections 116B and 116C of the inner cavity 116, according to some embodiments of the present invention. Figure 2D also shows two inner channels 114E separated by an inner wall, and an opening 117F. It should be understood that the input channel 115A, inner channel 114D, and opening 117E may have configurations symmetrical to the configuration shown in Figure 2D.

[0083] In Figures 2C and 2D, elements positioned within the cavity 116, such as channels 114A-114E and channels 115A and 115B, are seen without upper walls. However, when the heat sink 110 is covered with a cover 111 (as shown in Figure 1), the upper walls of these elements may be formed by the inside of the cover 111. Thus, with the cover 111 in place, each of the channels 114A-114E and 115A-115B may have a closed or substantially closed shape (e.g., rectangular) in cross-section.

[0084] Figure 2E is an isometric view of the bottom side of a heat sink 110 according to several embodiments of the present invention. As shown in Figure 2E, the heat sink 110 may include contact surfaces 119A and 119B configured to be thermally coupled to the heat dissipation areas of the respective auxiliary electronic components 221 and 222 of the PCB 200, from the bottom side (for example, surface 119A may be coupled to component 221, and surface 119B may be coupled to component 222).

[0085] In some embodiments, thermal pads 221A and 222A (shown in Figure 2A) may be used to perform the thermal coupling.

[0086] As is known in the art, thermal pads are soft, thermally conductive materials used to fill the gap between a heat-generating component and a heat sink. They help improve heat transfer and ensure efficient thermal management in electronic devices. In some embodiments, thermal pads may be made from silicone or other thermally conductive materials infused with ceramic or metal particles to improve thermal conductivity. Thus, thermal pads can provide conformal interfaces between non-flat surfaces (e.g., contact surfaces 119A-119B and the surfaces of their respective components 221-222), ensuring good thermal contact along the entire heat dissipation area and reducing thermal resistance.

[0087] In some embodiments, the heat sink 110 may be configured to be thermally coupled to components 221 and 222, for example, via thermal pads 221A and 222A attached to their respective heat dissipation areas, by having contact surfaces 119A and 119B sized and positioned according to the layout and dimensions of components 221 and 222. In some embodiments, the thermal pads 221A and 222A may have a thickness that allows for easing of slight mechanical tolerances in the interposition of components 221 and 222, for example, due to manufacturing constraints (e.g., soldering).

[0088] Therefore, it should be understood that, depending on the particular embodiment, the heatsink 110 may be custom-designed to suit the specific configuration, layout, and content of the electronic components on the target PCB (such as PCB200) in order to meet its thermal management requirements.

[0089] In the context of this specification, the term “contact surface” applies to thermal coupling and should not be confused with the term “contact surface” applied to electrical coupling.

[0090] As shown in Figure 2E, in some embodiments, the heatsink 110 may include openings 113E to 113H on the bottom side, configured to secure the heatsink 110 to the PCB 200 and the heatsink 150 using fastening elements (for example, by screwing in screws 250E1 to 250H1), such as those shown and described with reference to Figure 3A.

[0091] In some embodiments, the cover 111 (shown in Figure 1) may be made from the same material as the heatsink 110 (e.g., aluminum or copper).

[0092] During the manufacturing process of the liquid cooling assembly 100, a blank of the desired material having the approximate dimensions of the heat sink 110 to be manufactured can be obtained. The blank is then machined to achieve the desired dimensions and to form the inner cavity 116 and contact surfaces 119A and 119B. Next, openings 117A-117F and 113A-113H can be drilled, and openings 113E-113H can be further threaded. Subsequently, a cover 111, machined to match the dimensions of the inner cavity 116, is positioned to cover the cavity 116 and welded around its perimeter to seal the inner volume of the cavity 116 and complete the form of channels 114A-114E and 115A-115B. Finally, the inner cavity 116 can be cleaned under high pressure through openings 117A-117D to remove any debris remaining from the machining process.

[0093] Figures 2F to 2H show isometric views of the heatsink 150 of a liquid cooling assembly 100 according to several embodiments of the present invention.

[0094] The heat sink 150 (integrated with the base member) may have a group of mounting openings, each configured to align with the respective group of mounting openings on the PCB 200 when the base member 150 is positioned adjacent to the bottom surface of the PCB 200. This positioning is shown in detail in Figures 3A and 3B.

[0095] For example, the first group of mounting openings 250E to 250H on the PCB 200 (shown in Figure 2A) may be aligned with the first group of mounting openings 153E to 153H on the heat sink 150, and the second group of mounting openings 240A to 240D on the PCB 200 (shown in Figure 2A) may be aligned with the second group of mounting openings 152A to 152D on the base member 150.

[0096] In some embodiments, the third group of mounting openings 250A to 250D on the PCB 200 (shown in Figure 2A) may be aligned with the third group of mounting openings 153A to 153D on the heatsink 150. The fourth group of mounting openings 210A to 210D on the PCB 200 (shown in Figure 2A) may be aligned with the fourth group of mounting openings 151A to 151D on the heatsink 150.

[0097] As described herein, element 150 can perform a number of functions. For example, element 150 can function as a mating component for connecting heatsinks 110 and 120 to PCB 200, while avoiding or mitigating mechanical interference between undesirable components with PCB 200 (e.g., springs 122A1-122D1 and screws 122A2-122D2 shown in Figure 3B) and preventing thermal interference between them. At the same time, element 150 can also function as a reinforcement, improving the rigidity of PCB 200 and preventing its bending. This, in turn, can greatly improve the reliability of the PCB and maintain the integrity of the thermal coupling of heatsinks 110, 120 and 150. Finally, element 150 can function as a heatsink (heatsink 150), dissipating heat from electronic components 223 and 224 located on the bottom side of PCB 200. This multifunctional application provides synergistic effects and further contributes to the aforementioned technological advancements by increasing the compactness and functional efficiency of the design of the liquid cooling assembly 100, and therefore the computing device 400.

[0098] Figures 2G and 2H show the bottom side of the heatsink 150 with and without a cover 156, respectively. In some embodiments, the heatsink 150 may further include an inner cavity 157, as shown in Figure 2H. In some embodiments, the inner cavity 157 may include a plurality of inner channels 158. The inner cavity 157 may be molded to distribute the liquid coolant flow passing through the inner cavity substantially evenly among its plurality of inner channels (as shown in Figure 4B).

[0099] In some embodiments, the cover 156 may be joined to the body of the heat sink 150 by brazing, soldering, friction stir welding (FSW), or any other welding technique suitable for the selected material. It should be understood that the same may apply to the cover 111 and the body of the heat sink 110.

[0100] Similar to the inner channels 114A-114E shown in Figure 2C, the inner channel 158 may be formed by a series of separating inner walls positioned along the flow direction. This configuration not only ensures a uniform flow distribution but also significantly increases the heat conduction area of ​​the heat sink 110 that is in direct contact with the liquid coolant flow, thereby improving heat dissipation efficiency.

[0101] In some embodiments, the heat sink 150 may further include an inlet communication channel (e.g., nipple 154B) and an outlet communication channel (e.g., nipple 154A) fluidly connected to an inner cavity 157, so that a liquid coolant flow entering the cavity 157 from the inlet communication channel (e.g., nipple 154B) passes through a pair of inner channels 158 before exiting through the outlet communication channel (e.g., nipple 154A). The nipples 154A, 154B and the openings 117F and 117E of the heat sink 110 (shown in Figure 2E) may be configured in the assembled state so that the nipples 154A and 154B are inserted into the openings 117F and 117E, respectively. Each of the nipples 154A and 154B may include an annular groove (not shown) and optionally a sealing element such as an elastic O-ring (O-rings 154A1 and 154B1, respectively) positioned within the groove. In some embodiments, the O-rings 154A1 and 154B1 may have an outer diameter larger than the diameter of the openings 117F and 117E, thereby sealing the gap between the outer walls of the nipples 154A and 154B and the inner walls of the openings 117F and 117E, respectively, when assembled.

[0102] Therefore, in some embodiments, inlet and outlet communication channels (e.g., nipples 154A and 154B) may be configured to be in a permanent connection with the inner cavity 157 of the heatsink 150 and, in the assembled state, to provide a removable fluid-tight connection to the inner cavity 116 of the heatsink 110.

[0103] It should be understood that in some alternative embodiments, the inlet and outlet communication channels (e.g., nipples 154A and 154B) may be configured to be permanently connected to the inner cavity 116 of the heatsink 110 and, when assembled, provide a removable fluid-tight connection to the inner cavity 157 of the heatsink 150. In some further alternative embodiments, one of the inlet and outlet communication channels (e.g., nipples 154A and 154B) may be permanently connected to one of the inner cavities 116 and 157, and the other of the inlet and outlet communication channels (e.g., nipples 154A and 154B) may be permanently connected to the other of the inner cavities 116 and 157, and each of the inlet and outlet communication channels (e.g., nipples 154A and 154B) may, when assembled, provide a fluid-tight connection to each of the cavities 116 and 157.

[0104] It should be understood that the use of nipples (e.g., nipples 154A and 154B) as inlet and outlet communication channels, as described in some embodiments herein, is merely illustrative. Other fluid connection structures, such as hoses, couplings, and quick-connect fittings, may also be used depending on design and functional requirements. Therefore, this disclosure is not limited to any particular type or configuration of inlet and outlet communication channels.

[0105] As described above with reference to Figure 2A, the PCB 200 may include mounting openings 220A and 220B, and in the assembled state, the inner cavity 116 may be configured to be fluidly connected to the inner cavity 157 via nipples 154A and 154B through mounting openings 220A and 220B, respectively.

[0106] Such a configuration of the fluid connection between heatsinks 110 and 150 can provide improvements in the aforementioned field by ensuring highly efficient heat dissipation of electronic components located on opposite sides of PCB 200, while maintaining the efficiency and compactness of the overall integrated design of the liquid cooling assembly 100 and computing device 400. In particular, this improvement can be achieved by providing a fluid connection between heatsinks 110 and 150 through openings 220A and 220B in PCB 200, and configuring heatsinks 110 and 150 to share common inlet and outlet connections to the liquid coolant distribution unit (e.g., through fittings 141A and 141B).

[0107] Additionally or alternatively, in some embodiments, recesses formed in the PCB 200 may be used instead of the mounting openings 220A and 220B. It should be understood that, without exceeding the scope of the present invention, other structural configurations functionally equivalent to the mounting openings 220A and 220B, or recesses such as passages, channels, ports, mounting interfaces, sockets, etc., may also be used.

[0108] As used herein, the term “opening” may refer to a through-hole or passage that extends completely through the body of a printed circuit board (e.g., PCB200) and typically encloses an inserted element (e.g., nipples 154A and 154B) along its entire circumference. In contrast, “recess” may refer to a partial cutout or indentation, such as a semicircular or U-shaped notch, formed on the edge of the PCB (e.g., PCB200), that accommodates an element without completely enclosing it. Both configurations allow for the positioning or mounting of an element, although a recess may not define a completely enclosed boundary around the inserted element.

[0109] In Figure 2H, elements positioned within the cavity 157, such as the channel 158, are seen without bottom walls (the heatsink 150 is shown upside down), but it should be understood that when the heatsink 150 is covered with the cover 156 (as shown in Figure 2G), the bottom walls of these elements may be formed by the inside of the cover 156. Thus, with the cover 156 in place, each of the channels 158 may have a closed or substantially closed shape (e.g., rectangular) in cross-section.

[0110] As shown in Figure 2F, the heat sink 150 may further include contact surfaces 155A and 155B configured to thermally couple with the heat dissipation regions of the respective auxiliary electronic components 223 and 224 assembled on the bottom side of the PCB 200, from the top side. As shown in Figure 2F, the contact surfaces 155A and 155B may be formed as recesses made on the outer surface of the heat sink 150, so that the heat dissipation regions of the components 223 and 224 can be thermally coupled to the heat sink 150 near the upper wall of the channel 158 in the assembled state to improve heat dissipation efficiency.

[0111] Here, refer to Figures 2I to 2L. Figure 2I shows an isometric view of the top side of a heat sink 120 according to several embodiments of the present invention, Figure 2J shows a front view of the heat sink 120 (shown transparently), Figure 2K shows a side view of the heat sink 120 (shown transparently), and Figure 2L shows a partial top view of the heat sink 120 (shown transparently).

[0112] The heat sink 120 may include portions 121 and 122. As shown in Figure 2J, portion 121 may include an inlet opening 123B and an outlet opening 123A, respectively, for guiding liquid coolant into and out of an inner cavity 126 (shown in Figure 2L) located within portion 122. As shown in Figure 2I, the inlet opening 123B and the outlet opening 123A may be attached to flexible tubes 132B and 132A, respectively, via fittings 131B and 131A. From other ends, the flexible tubes 132B and 132A may be connected (as shown in Figure 1) to sections 116A and 116C of the inner cavity 116 of the heat sink 110, respectively, via fittings 133B and 133A.

[0113] As shown in Figures 2J and 2K, in some embodiments, from the bottom side, portion 122 may include a contact surface 124 and be configured to be thermally coupled to the heat dissipation area of ​​IC230 on PCB200 (shown in Figure 2A) via the surface 124. In particular, the contact surface 124 may be sized according to the dimensions of IC230, and portion 122 of the heat sink 120 may be thermally coupled to IC230, for example, via a thermal paste 231 covering its heat dissipation area.

[0114] In the latest high-performance computing solutions, ICs can consume power levels of up to 1500W, but require operating temperatures to remain below 90°C for proper functionality. Given their relatively small physical dimensions, these conditions present significant thermal management challenges. In such cases, it is advantageous for a heatsink to make substantially direct contact with the heat dissipation area of ​​the IC, pressing firmly against it, to provide efficient heat dissipation, which would make the use of thermal pads unsuitable for such solutions. In some embodiments, the contact surface of the heatsink is polished to a surface roughness that can match the surface roughness of the IC. For example, the upper surface of IC230 may be made to a surface roughness of about 30 microns. In some embodiments, the contact surface 124 of the heatsink 120 may also be polished to achieve a similar roughness. In such cases, when the heat dissipation area of ​​IC230 is in direct contact with the contact surface 124 of the heatsink 120, the maximum gap between them may be up to 60 microns. To provide adequate heat dissipation, such gaps may be filled with a thermally conductive material, such as a thermal paste (e.g., thermal paste 231 shown in Figures 2J to 2L).

[0115] Thermal paste, also known as thermal compound or thermal grease, is a substance applied between a heat-generating component (such as a CPU or GPU) and a heatsink. Its primary function is to fill microscopic defects on the surface of these components, ensuring better thermal conductivity and efficient heat transfer. This helps maintain an optimal operating temperature, prevents overheating, and thereby improves the performance and lifespan of electronic devices.

[0116] The aforementioned heat dissipation challenges related to the IC further require the use of mechanically isolated groups of fastening elements to press the heat sinks 110, 120, and 150 onto the heat dissipation areas of their respective electronic components, as proposed herein. In particular, using fastening elements such as spring-driven screws 122A2-122D2 to secure heat sink 120 allows for a substantially uniform predetermined pressure on the heat dissipation area of ​​IC 230 when tightened (as shown in Figure 3B), while the flexible fluid connection between heat sink 110 and heat sink 120 helps to mitigate misalignments between IC 230 and components 221-222, and subsequently the necessary misalignments between heat sinks 110 and 120. When fastening elements (e.g., screws 122A2-122D2) are tightened and elastic elements (e.g., springs 122A1-122D1) are compressed, the thermal paste spreads, filling the gap between the contact surface 124 and the heat dissipation area of ​​IC230, thereby providing a suitable thermal bond between them.

[0117] As shown in Figures 2J and 2K, section 121 may have an inner channel connecting openings 123B and 123D, thereby configured to direct the liquid coolant flow received through opening 123B into the inner cavity 126 (shown in Figure 2L). Section 121 may further have an inner channel connecting openings 123A and 123C, thereby configured to direct the liquid coolant flow from cavity 126 to the inner cavity 116 through opening 123A.

[0118] The inner cavity 126 may be sized according to the dimensions of IC230. The cavity 126 may have a symmetrical configuration divided into four sections separated by walls 129A-129C. Each of these sections may include two subsections separated by transverse channels 126A1, 126A2 and 126B1 and 126B2, respectively. Section 121 may be connected to section 122 via an inlet opening 125B and an outlet opening 125A, each of which is coupled to transverse channels 126B and 126A, respectively. Channel 126B may be configured to distribute the flow substantially evenly between channels 126B1 and 126B2, and channel 126A may be configured to distribute the flow substantially evenly between channels 126A1 and 126A2. Each subsection may include a plurality of longitudinal inner channels separated by longitudinal walls 128 (which may also be called "fins"), thereby increasing the surface area for heat transfer. From two sides of the cavity 126, the sections are connected via lateral channels 126C and 126D. Thus, in such a configuration, each of the openings 125A and 125B is adjacent to each pair of sections of the cavity 126. In other words, the inner cavity 126 is configured to provide fluid connections between the openings 125A and 125B through a plurality of longitudinal inner channels as well as lateral channels 126C and 126D.

[0119] As shown in Figures 2I to 2K and as described in detail with reference to Figure 3B, the heatsink 120 may have standoffs 122A to 122D at the corners of portion 122. Portion 122 may also include openings 127A to 127D for connecting the computing device 110 to the motherboard via fastening elements (e.g., screws 112A to 112D).

[0120] As described above, the liquid cooling assembly 100 may include two heat sinks 110 and 120, each configured to dissipate heat from the respective components of the PCB 200 when installed. The heat sinks 110 and 120 are flexibly fluidically connected via tubes 132A and 132B, allowing them to move freely relative to each other. This flexibility can compensate for mechanical tolerances of the respective components (e.g., tolerances between IC 230 and auxiliary components 221-225).

[0121] To take advantage of this flexible connection, it is further suggested herein that heatsinks 110 and 120 are configured to be thermally coupled to each component of the PCB 200 by being pressed onto their heat dissipation areas (e.g., via thermal pads as described above) using a mechanically isolated group of clamping elements.

[0122] The term “mechanically isolated” is used herein to describe configurations in which the clamping elements of each group are designed and configured to adjust the pressure and positioning of each heat sink (110 or 120) without affecting the pressure and positioning of the other heat sink (120 or 110, respectively).

[0123] These aspects of positioning will be further described with reference to Figures 3A and 3B.

[0124] Figure 3A shows an exploded view of the liquid cooling assembly 100 (computing device 400) illustrating the connection of the heatsink 110 to the PCB 200.

[0125] As described above, the computing device 400 may be secured to a motherboard (not shown) using fastening elements (e.g., screws 112A-112D). Each of the screws 112A-112D may be connected (e.g., screwed in) through the respective openings 113A-113D of the heatsink 110 and then coupled to one of the retaining rings 112A1-112D1, respectively. Next, the screws 112A-112D may be screwed into the openings 210A-210D of the PCB 200 and the openings 151A-151D of the base member 150 (shown in Figure 2F), respectively. Finally, the screws 112A-112D may be secured from the bottom side of the base member 150 by coil spring washers 112A2-112D2, respectively. Spring washers 112A2-112D2 facilitate the disconnection of computing device 400 from the motherboard by pushing it away from the motherboard (as the high-speed connectors 225A and 225B shown in Figure 2B may be difficult to disconnect).

[0126] In some embodiments, the mechanically isolated group fastening elements may include first group fastening elements (e.g., screws 250E1-250H1) configured to fasten the heat sink 110 to the heat sink 150 through the first group mounting openings of the heat sink 150 (e.g., openings 153E-153H, as shown in Figure 2F) and the respective group mounting openings of the PCB 200 (e.g., openings 250E-250H) when assembled. The first group fastening elements (e.g., screws 250E1-250H1) may be further configured to press the heat sink 110 substantially uniformly onto the heat dissipation areas of the auxiliary components 221 and 222 (via contact surfaces 119A and 119B) when tightened.

[0127] As further shown in Figure 3A, the inlet fitting 141B and the outlet fitting 141A may be connected to the heatsink 110 via openings 117B and 117A, respectively.

[0128] The heat sink 150 can be fastened to the PCB using fastening elements (e.g., screws 250A1 to 250D1) through openings 250A to 250D in the PCB 200 (shown in Figure 2A) and openings 153A to 153D (e.g., threaded openings) in the heat sink 150 (shown in Figure 2F).

[0129] Figure 3B shows an exploded view of the liquid cooling assembly 100 and computing device 400, illustrating the connections of heatsinks 120 and 150 to PCB 200.

[0130] In some embodiments, the mechanically isolated group of fastening elements may include a second group of fastening elements (e.g., spring-biased screws 122A2-122D2) configured to fasten the heat sink 120 to the base member 150 through the second group of mounting openings 152A-152D of the base member 150 and the respective group of mounting openings (e.g., openings 240A-240D) of the PCB 200 when assembled. The second group of fastening elements (e.g., screws 122A2-122D2) may be further configured to press the heat sink 120 substantially uniformly onto the heat dissipation area of ​​the IC 230 (via the contact surface 124 shown in Figures 2J-2K) when tightened.

[0131] In some embodiments, the heat sink 120 may further include a plurality of standoffs 122A to 122D, each having an opening (not shown) configured to separate the heat sink 120 from the surface of the PCB 200 and to receive a second group of fastening elements (e.g., screws 122A2 to 122D2). In some embodiments, the standoffs 122A to 122D and the spring-biased screws 122A2 to 122D2 are configured to avoid mechanical interference with the PCB 200. Thus, to thermally couple the heat sink 120 to the IC 230, the fastening elements (e.g., screws 122A2 to 122D2), together with elastic elements (e.g., springs 122A1 to 122D1), may be coupled through openings 152A to 152D (e.g., threaded) in the base member 150 and openings 240A to 240D in the PCB 200, respectively. Finally, screws 122A2-122D2 can be screwed into the threaded openings of standoffs 122A-122D and tightened until proper contact is achieved between the contact surface 124 and the heat dissipation surface of IC230.

[0132] This enables the aforementioned mechanically isolated coupling of heat sinks 110 and 120 to their respective components of the PCB 200, taking advantage of the benefits of a flexible fluid connection between heat sinks 110 and 120, thereby providing the desired relaxation of mechanical tolerances between these components.

[0133] Additionally, in some embodiments, to avoid undesirable mechanical interference, the diameters of the standoffs 122A-122D and fastening elements (e.g., screws 122A2-122D2) can be made smaller than the diameters of their respective mounting openings (e.g., openings 240A-240D). This adjustment may help avoid or minimize contact between the mounting elements and the PCB 200.

[0134] As can be seen in Figures 3A and 3B, when heatsinks 110 and 150 are attached to PCB 200, nipples 154A and 154B are screwed through openings 220A and 220B in PCB 200 and inserted into openings 117F and 117E in heatsink 110 (shown in Figure 2E), respectively, to provide a removable fluid-tight connection between heatsinks 110 and 150, as described above.

[0135] It should be understood that the use of screws as fastening elements and springs as elastic elements, as described in certain embodiments (e.g., spring-biased screws 122A2-122D2), is merely illustrative. Depending on specific design requirements and material suitability, other types of fastening elements (e.g., clamps, bolts, rivets, or latches) and elastic elements (e.g., elastomer pads, leaf springs, or Belleville washers) may also be used. Therefore, this disclosure is not limited to any particular type of fastening or elastic mechanism.

[0136] Figure 4A shows a top view of a liquid cooling assembly 100 having a partially transparent heatsink 110 illustrating a first liquid coolant circulation path according to several embodiments of the present invention.

[0137] According to the concept of some embodiments of the present invention, in some embodiments, the inner cavity 116 of the heat sink 110 may be configured to be fluidly connectable to a liquid coolant distribution unit 300 (shown schematically) and to form a first liquid coolant circulation path together with the liquid coolant distribution unit.

[0138] As shown in Figure 4A, the liquid coolant flow 301 can enter the liquid cooling assembly 100 via the fitting 141B. Next, in section 116A of cavity 116, the flow can be divided into three flows: the first flow is then directed through the inner cavity 116 of heat sink 110, the second flow is directed through the inner cavity 157 of heat sink 150, and the third flow is directed through the inner cavity 126 of heat sink 120, thereby forming the three liquid coolant circulation paths. The first liquid coolant circulation path is indicated by a dashed line and arrow.

[0139] Following the first liquid coolant circulation path, the flow enters section 116B via input channel 115A. Within section 116B, the flow 331 formed after passing through channel 151A is separated into multiple flows 312 passing through inner channel 114A. The flow is then separated into multiple flows 313 forming multiple flows 314 passing through inner channel 114B. As can be seen, the length of the inner channel walls varies. The proposed configuration provides efficient and substantially uniform separation of the flows 313 between the inner channels 114B. After passing through channel 114B, the flows 315 are deflected to form a substantially uniformly separated flow 316 between the inner channels 114C. Subsequently, the flows 317 are deflected by projections 118C and 118D and pass through output channel 115B, exiting section 116B and entering section 116C. In section 116C, the flow is mixed with the output flows from the second and third liquid coolant circulation paths (which proceed through the heat sinks 150 and 120, respectively) to form a flow 302 that exits the liquid cooling assembly through a common outlet connection, i.e., fitting 141A. It should be understood that sections 116A and 116C are separated by an inner wall 114F.

[0140] Figure 4B shows an isometric view of the liquid cooling assembly 100, partially illustrating the heatsink 110 and partially illustrating the heatsink 150 in transparency. Figure 4B also shows a second liquid coolant circulation path according to several embodiments of the present invention.

[0141] In some embodiments, the inner cavity 157 of the heatsink 150 may be configured to fluidly connect with the inner cavity 116 of the heatsink 110, sharing a first liquid coolant circulation path and common inlet and outlet connections (via openings 117A and 117B and fittings 141A and 141B to the liquid coolant distribution unit 300), and together with the liquid coolant distribution unit 300 (as schematically shown), to form a second liquid coolant circulation path.

[0142] Following the second liquid coolant circulation path, flow 321 can proceed through opening 117E and nipple 154B and enter the inner cavity 157 of the heat sink 150. The flow can then be guided by the inner wall of cavity 157 through a set of inner channels 158, distributed substantially uniformly among them, forming flow 324. After passing through channels 158, flow 324 can form flow 325, which is then mixed to form flow 326. Flow 326 can then exit cavity 157 through nipple 154A. Next, through opening 117F, flow 327 can enter section 116C of inner cavity 116, where it mixes with the output flows from the first and third liquid coolant circulation paths (proceeding through heat sinks 110 and 120, respectively) to form flow 302, which exits the liquid cooling assembly through a common outlet connection, i.e., fitting 141A.

[0143] Figure 4C shows an isometric view of the liquid cooling assembly 100 with the heat sink 120 partially transparent. Figure 4C shows a third liquid coolant circulation path according to several embodiments of the present invention.

[0144] In some embodiments, the inner cavity 126 of the heatsink 120 is in a flexible fluid connection with the inner cavity 116 of the heatsink 110, sharing common inlet and outlet connections (via openings 117A and 117B and fittings 141A and 141B to the coolant distribution unit 300) with a first coolant circulation path and a second coolant circulation path, and together with the coolant distribution unit 300 (as schematically shown), it may be configured to form a third coolant circulation path.

[0145] Following the third liquid coolant circulation path, flow 331 proceeds through tube 132B and enters the inner cavity 126 through opening 125B. The flow then proceeds through lateral channel 126B and is divided into numerous partial flows that pass through the longitudinal inner channel separated by the longitudinal wall 128 in the opposite longitudinal direction. After passing through the longitudinal inner channel, the flow is mixed again (e.g., flows 332 and 333) and led through lateral channels 126C and 126D. After passing through channels 126C and 126D, the flow is again divided into numerous partial flows (e.g., flow 334) that pass through the longitudinal inner channel. Next, flow 334 is mixed again in lateral channel 126A and exits the inner cavity 126 through opening 125A. Flow 335 is then led through tube 132A to section 116C, where it mixes with the flows of the first and second liquid coolant circulation paths. Finally, the liquid coolant flow 302 exits the liquid coolant assembly 100 through a common outlet connection, namely the opening 117A and the fitting 141A.

[0146] According to the concept of the present invention, the size and location of channels 115A and 115B, and openings 117E and 117F, can be one of the important aspects of liquid cooling efficiency. Since separation between liquid cooling circulation paths can be performed passively, the separation can be preset by the ratio in which the flow 301 is divided into first, second, and third liquid coolant circulation paths. Thus, the liquid cooling assembly 100 may be further configured to divide the input liquid coolant flow 301 between the first liquid coolant circulation path, the second liquid coolant circulation path, and the third liquid coolant circulation path in a predetermined ratio.

[0147] In some embodiments, the ratio may be determined at the design stage in accordance with the expected power consumption ratio between each component of the PCB200, for example, between IC230 and the group of auxiliary components 223-224 and the group of auxiliary components 221-222.

[0148] It should be understood that the ratio can vary significantly depending on the embodiment. For example, in some power-intensive embodiments, the expected power consumption of IC230 may be up to 1200W, the power consumption of auxiliary components 221-222 may be up to 200W, and the power consumption of auxiliary components 223-224 may be up to 100W. Therefore, the ratio may be 2:1:12.

[0149] Therefore, in order to provide a desired ratio, the input channels of heatsink 110 (e.g., input channel 115A), the input channels of heatsink 150 (e.g., opening 117E), and the input channels of heatsink 120 (e.g., opening 125B) can be sized in accordance with the predetermined ratio. Furthermore, in order to provide a desired ratio, the output channels of heatsink 110 (e.g., output channel 115B), the output channels of heatsink 150 (e.g., opening 117F), and the output channels of heatsink 120 (e.g., opening 125B) can be sized in accordance with the predetermined ratio.

[0150] During the design phase, input data for designing the liquid cooling assembly 100 may include the quantity and layout of ICs and critical auxiliary components requiring thermal management, as well as their expected power consumption. Next, the dimensions of the input channels 115A and 115B, and the openings 117E and 117F, can be determined in relation to the sizes of the openings 125A and 125B, corresponding to the expected power consumption ratios. Then, the required flow rates for the fittings 141A and 141B can be determined based on the maximum power consumption.

[0151] Thus, the proposed invention further contributes to improvements in the relevant technical field by simplifying the manufacturing process for producing customized liquid cooling assemblies.

[0152] One common problem in liquid fluid circulation systems is airlocks. Airlocks occur when air becomes trapped within the system, often in the upper section, obstructing the proper flow of liquid. This can significantly impair the system's efficiency and cooling performance.

[0153] To avoid airlock issues, it is proposed that the input channel 115A and output channel 115B of the heatsink 110 be positioned adjacent to the upper wall of the inner cavity 116. For example, in the illustrated embodiment, channels 115A and 115B have a rectangular cross-section, and the upper wall is formed by the cover 111. This arrangement allows channels 115A and 115B to be adjacent to the upper wall, effectively mitigating the airlock problem. Any air bubbles that may enter the cavity 116 can easily pass through and exit the liquid cooling assembly.

[0154] The same concept can be further applied to heatsinks 120 and 150. Openings 125A and 125B can be made in the upper wall of the inner cavity 126 (and thus adjacent to it), as shown, for example, in Figures 2J and 2K, which can effectively mitigate the airlock problem. The same applies to the configuration of nipples 154A and 154B, as nipples 154A and 154B can be coupled to the upper wall of the inner cavity 157 (as shown in Figure 2H).

[0155] Therefore, the described configuration of the liquid cooling assembly 100 can effectively apply the heat sinks 110, 150 and 120 to dissipate heat from the components of the PCB 200 and transfer heat to the liquid medium (also referred to herein as “liquid coolant”) by convection and radiation.

[0156] In some embodiments, the liquid coolant may include water, glycol mixtures, and / or dielectric fluids, or other liquids having high thermal conductivity and heat capacity, as is generally known in the art.

[0157] It should be understood that all considerations regarding flow direction, including terms such as "input," "output," "inlet," "outlet," "go in," "go out," and similar terms, are provided for clarity only and should not be considered to limit the scope of the invention. Therefore, in some embodiments, the flow direction may be reversed, and all relevant elements should be considered to provide the opposite function, e.g., "output" instead of "input."

[0158] As can be seen from the provided description, the present invention represents a liquid cooling assembly that provides an improvement in the field of microelectronics and electronics engineering. Specifically, the present invention represents an effective cooling solution for systems using vertical power supply and provides liquid cooling for electronic components located on both sides of a PCB while fitting within the spatial constraints of modern electronic devices. The proposed solution is readily adjustable to relax mechanical tolerances between different electrical components of the PCB in question and is adaptable to address the diverse thermal loads presented by the electrical components while maintaining the compactness of the design. The provided invention enhances the overall heat dissipation efficiency of the thermal management system and represents a significant advance in thermal management technology for next-generation computing systems. The present invention further provides computing devices incorporating such improved liquid cooling assemblies, thereby improving the aforementioned field by increasing the device operating efficiency, specifically enabling long-term stable operation in computationally intensive regimes due to highly efficient thermal management.

[0159] Unless otherwise specified, embodiments of the methods described herein are not bound to any particular order or sequence. Furthermore, all formulas described herein are intended only as examples, and other or different formulas may be used. In addition, some of the embodiments or elements of the described methods may occur or be performed at the same time.

[0160] While specific features of the present invention have been illustrated and described herein, many modifications, substitutions, alterations, and equivalents will come to mind for those skilled in the art. Therefore, it should be understood that the appended claims are intended to cover all such modifications and alterations that fall within the true spirit of the invention.

[0161] Various embodiments are presented. Each of these embodiments may, of course, include features from other embodiments presented, and embodiments not specifically described may include various features described herein.

Claims

1. A liquid cooling assembly, A first heat sink configured to be thermally coupled to at least one first electronic component, A second heat sink configured to be thermally coupled to at least one second electronic component, A liquid cooling assembly comprising, The at least one first heat sink and the at least one second heat sink are configured to be assembled on opposite sides of a printed circuit board (PCB), The at least one first heat sink has an internal cavity that can be fluidly connected to a liquid coolant distribution unit and is configured to form a first liquid coolant circulation path together with the liquid coolant distribution unit. A liquid cooling assembly comprising an inner cavity configured to form a second liquid coolant circulation path together with the liquid coolant distribution unit, while sharing common inlet and outlet connections to the liquid coolant distribution unit with the first liquid coolant circulation path when the liquid cooling assembly is assembled, wherein the at least one second heat sink is fluidly connected to the inner cavity of the at least one first heat sink via an inlet communication channel and an outlet communication channel through at least one mounting opening or at least one recess of the PCB, and the inner cavity is configured to form a second liquid coolant circulation path together with the liquid coolant distribution unit, while sharing common inlet and outlet connections to the liquid coolant distribution unit with the first liquid coolant circulation path.

2. The liquid cooling assembly according to claim 1, wherein each of the inlet communication channel and the outlet communication channel is in a permanent connection to one of (a) the inner cavity of the at least one first heat sink and (b) the inner cavity of the at least one second heat sink, and is configured in the assembled state to provide a removable fluid-tight connection to the other of (a) the inner cavity of the at least one first heat sink and (b) the inner cavity of the at least one second heat sink.

3. The present invention further comprises at least one third heat sink configured to be thermally coupled to at least one third electronic component, The liquid cooling assembly according to any one of claims 1 to 2, wherein the at least one third heat sink has an inner cavity in which it is in a flexible fluid connection with the inner cavity of the at least one first heat sink, and is configured to form a third liquid coolant circulation path together with the liquid coolant distribution unit, sharing common inlet and outlet connections to the liquid coolant distribution unit with the first liquid coolant circulation path and the second liquid coolant circulation path.

4. The at least one first heat sink has a frame-shaped structure sized to correspond to the dimensions of the peripheral area of ​​the PCB, The at least one third heat sink is configured to be positioned substantially within the frame-shaped structure when the liquid cooling assembly is mounted on the PCB. The liquid cooling assembly according to claim 3.

5. The liquid cooling assembly according to claim 4, wherein the flexible fluid connection comprises at least one flexible inlet tube and at least one flexible outlet tube that fluidly connect the inner cavity of the at least one third heat sink to the inner cavity of the at least one first heat sink from the inside of the frame-shaped structure.

6. The liquid cooling assembly according to claim 3, wherein the at least one first heat sink and the at least one third heat sink are configured to be thermally coupled to the at least one first electronic component and the at least one third electronic component by pressing them onto the heat dissipation areas of the at least one first electronic component and the at least one third electronic component using a mechanically isolated group of clamping elements, respectively.

7. Base member having at least two groups of mounting openings, each having at least one mounting opening Furthermore, The clamping elements of the mechanically isolated group, In the assembled state, the first group of fastening elements is configured to fix and tighten the at least one first heat sink to the base member through the first group of mounting openings of the base member and the respective group of mounting openings of the PCB, thereby pressing the first heat sink substantially uniformly onto the heat dissipation area of ​​the at least one first electronic component, A second group of fastening elements configured to secure the at least one third heatsink to the base member through the second group of mounting openings of the base member and the respective group of mounting openings of the PCB, wherein the second group of fastening elements includes an elastic element and, when tightened, is configured to press the third heatsink substantially uniformly onto the heat dissipation area of ​​the at least one third electronic component, The liquid cooling assembly according to claim 6, comprising:

8. The liquid cooling assembly according to claim 7, wherein the at least one second heat sink is integrated with the base member.

9. The liquid cooling assembly according to claim 7, wherein at least one of the first heat sink or the third heat sink comprises a plurality of standoffs having openings configured to separate the respective heat sinks from the PCB and to receive fastening elements of the respective groups when assembled.

10. The liquid cooling assembly according to claim 9, wherein the standoff and the fastening element are configured to avoid mechanical interference with the PCB.

11. The liquid cooling assembly according to claim 7, wherein the at least one first heat sink and the at least one second heat sink are configured to be thermally coupled to the at least one first electronic component and the at least one second electronic component via thermal pads attached to the heat dissipation areas of the at least one first electronic component and the at least one second electronic component, respectively, and the at least one third heat sink is configured to be thermally coupled to the at least one third electronic component via a thermal paste covering the heat dissipation area of ​​the at least one third electronic component.

12. The liquid cooling assembly according to claim 3, further configured to divide the input liquid coolant flow passing through the common inlet connection into the first liquid coolant circulation path, the second liquid coolant circulation path, and the third liquid coolant circulation path in a predetermined ratio.

13. The liquid cooling assembly according to claim 12, wherein the predetermined ratio is defined in correspondence with the expected power consumption ratio between the at least one first electronic component, the at least one second electronic component, and the at least one third electronic component.

14. The liquid cooling assembly according to claim 12, further configured to divide the input liquid coolant flow by guiding a first portion through the input channel of the at least one first heatsink, a second portion through the input channel of the at least one second heatsink, and a third portion through the input channel of the at least one third heatsink, wherein the input channels of the at least one first heatsink, the at least one second heatsink, and the at least one third heatsink are sized in accordance with the predetermined ratio.

15. The liquid cooling assembly according to claim 3, wherein at least one of the at least one first heat sink, the at least one second heat sink, and the at least one third heat sink each comprises an input channel and an output channel adjacent to the upper wall of the inner cavity of the at least one first heat sink, the at least one second heat sink, and the at least one third heat sink.

16. The liquid cooling assembly according to claim 3, wherein at least one of the inner cavities of the at least one first heat sink, the at least one second heat sink, and the at least one third heat sink comprises a plurality of inner channels and is molded to distribute a liquid coolant flow passing through the inner cavity substantially evenly among the plurality of inner channels of the inner cavity.

17. The liquid cooling assembly according to claim 3, wherein at least one of the at least one first heat sink, the at least one second heat sink, and the at least one third heat sink is configured to be thermally coupled to the at least one first electronic component, the at least one second electronic component, and the at least one third electronic component via a direct-to-chip (D2C) liquid cooling configuration.

18. A computing device, A printed circuit board (PCB) comprising (i) at least one first electronic component and at least one second electronic component, and (ii) at least one mounting opening or at least one recess, mounted on both opposite sides of the printed circuit board (PCB), At least one first heat sink thermally coupled to the at least one first electronic component, At least one second heat sink thermally coupled to the at least one second electronic component, A computing device that has, The at least one first heat sink has an internal cavity that can be fluidly connected to a liquid coolant distribution unit and is configured to form a first liquid coolant circulation path together with the liquid coolant distribution unit. A computing device comprising an inner cavity that, together with the liquid coolant distribution unit, forms a second liquid coolant circulation path, with the liquid coolant distribution unit, while sharing common inlet and outlet connections to the liquid coolant distribution unit with the first liquid coolant circulation path.

19. The computing device according to claim 18, wherein each of the inlet communication channel and the outlet communication channel is in a permanent connection with one of (a) the inner cavity of the at least one first heatsink and (b) the inner cavity of the at least one second heatsink, and is in a removable fluid-tight connection with the other of (a) the inner cavity of the at least one first heatsink and (b) the inner cavity of the at least one second heatsink.

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