Ceramic wiring components

Abstract

To provide a ceramic wiring member that can suppress the scattering of splatter into the frame portion of the joint layer when welding the cover plate to the metallized layer. [Solution] The ceramic wiring member comprises a ceramic body and a metallized layer containing a conductor as its main component. The body includes a plate portion and a frame portion that is positioned in contact with the periphery of the main surface of the plate portion and has a frame shape when viewed in the thickness direction of the plate portion. The frame portion has a first outer surface, a first inner surface located away from the first outer surface, and a second main surface located on the opposite side of the main surface and connected to the first outer surface and the first inner surface. The metallized layer is positioned in contact with the second main surface. The metallized layer has a second outer surface and a second inner surface located away from the second outer surface. When viewed in the thickness direction, the second inner surface is positioned away from the first inner surface in the direction from the first inner surface toward the first outer surface. The second outer surface has a portion that is continuous with the first outer surface.

Description

Technical Field

[0001] The present disclosure relates to a ceramic wiring member.

Background Art

[0002] A ceramic wiring member including a ceramic main body and a conductive metallization layer is known (see, for example, Patent Document 1 below). In the ceramic wiring member described in Patent Document 1, the main body includes a plate portion, and a frame portion disposed in contact with a peripheral portion of a main surface of the plate portion and having a frame shape when viewed in a thickness direction of the plate portion. The frame portion includes a second main surface located on an opposite side of the main surface, a first outer side surface, and a first inner side surface. The metallization layer is disposed in contact with the second main surface. The metallization layer includes a third main surface located on an opposite side of the second main surface, a second outer side surface, and a second inner side surface. Each of the second outer side surface and the second inner side surface is located apart from each of the first outer side surface and the first inner side surface.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] To mount electronic components on a ceramic wiring member and seal the electronic components, the electronic components are mounted on the main surface of the plate portion of the ceramic wiring member, surrounded by the frame portion. Then, the periphery of the metal lid and the frame portion are brought into contact, and with the bonding layer formed on the lower surface of the lid in contact with the metallized layer, a current is passed through the roller electrode while pressing it against the periphery of the lid plate. At this time, the fluid bonding layer material may splatter (splash) inside the frame portion. If the splattered bonding layer material adheres to an electronic component mounted inside the frame portion, such as a quartz crystal oscillator, it may cause a defect in the characteristics of the electronic component (quartz crystal oscillator). In the ceramic wiring member described in Patent Document 1, the second inner surface of the metallized layer is located away from the first inner surface of the frame portion, so the splattering of the bonding layer can be suppressed.

[0005] There is a need to further suppress the scattering of the joint layer into the frame.

[0006] This disclosure provides a ceramic wiring member that can suppress the scattering of splatter into the frame portion of the joint layer when welding the cover plate to the metallized layer. [Means for solving the problem]

[0007] A ceramic wiring member according to this disclosure comprises a ceramic body and a metallized layer containing a conductor as its main component. The body includes a plate portion and a frame portion disposed in contact with the periphery of the main surface of the plate portion and having a frame shape when viewed in the thickness direction of the plate portion. The frame portion has a first outer surface, a first inner surface located away from the first outer surface, and a second main surface located on the opposite side of the main surface and connected to the first outer surface and the first inner surface. The metallized layer is disposed in contact with the second main surface. The metallized layer has a second outer surface and a second inner surface located away from the second outer surface. When viewed in the thickness direction, the second inner surface is located away from the first inner surface in the direction from the first inner surface toward the first outer surface. The second outer surface has a portion that is continuous with the first outer surface. [Effects of the Invention]

[0008] In the ceramic wiring member according to this disclosure, when welding the cover plate to the metallized layer, the scattering of splatter into the frame portion of the joint layer can be suppressed. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a plan view of an embodiment of a ceramic wiring member according to the present disclosure. [Figure 2] Figure 2 is a cross-sectional view of the ceramic wiring member shown in Figure 1. [Figure 3] Figure 3 is an explanatory diagram illustrating the process of sequentially preparing the green wiring member assembly and the ceramic wiring member assembly. [Figure 4] Figure 4 is an explanatory diagram of the process of separating a ceramic wiring component assembly into individual pieces. [Figure 5] Figure 5 is a cross-sectional view of step (1) in the manufacturing method of an electronic module. [Figure 6] Figure 6 is a cross-sectional view of step (2) in the manufacturing method of an electronic module. [Figure 7A] Figure 7A is a cross-sectional view of a part of the first modified example of the ceramic wiring member. [Figure 7B] Figure 7B is a cross-sectional view of a further modification of the first modification. [Figure 7C] Figure 7C is a cross-sectional view of a further modification of the first modification. [Figure 8] Figure 8 is a cross-sectional view of a second modified example of the ceramic wiring member. [Figure 9] Figure 9 is a cross-sectional view of a part of a third modified example of the ceramic wiring member. [Figure 10] Figure 10 is a cross-sectional view of a portion of a green wiring assembly used to manufacture the ceramic wiring component shown in Figure 9. [Figure 11] Figure 11 is a cross-sectional view of a portion of a ceramic wiring assembly obtained by firing and plating the green wiring assembly shown in Figure 10. [Figure 12] Figure 12 is a partial cross-sectional view of a green wiring member assembly for manufacturing a fourth modified example of a ceramic wiring member. [Figure 13] FIG. 13 is a partial cross-sectional view of a ceramic wiring member assembly obtained by firing and plating the green wiring member assembly shown in FIG. 12. [Figure 14] FIG. 14 is a partial cross-sectional view of a fourth modification of the ceramic wiring member. DETAILED DESCRIPTION OF EMBODIMENTS

[0010] SUMMARY OF EMBODIMENTS A ceramic wiring member according to the present disclosure includes a ceramic main body, and a metallized layer containing a conductor as a main component. The main body includes a plate portion, and a frame portion disposed in contact with a peripheral portion of a main surface of the plate portion and having a frame shape when viewed in a thickness direction of the plate portion. The frame portion has a first outer side surface, a first inner side surface positioned apart from the first outer side surface, and a second main surface positioned on the opposite side of the main surface and connected to the first outer side surface and the first inner side surface. The metallized layer is disposed in contact with the second main surface. The metallized layer has a second outer side surface and a second inner side surface positioned apart from the second outer side surface. When viewed in the thickness direction, the second inner side surface is positioned apart from the first inner side surface in a direction from the first inner side surface toward the first outer side surface. The second outer side surface has a portion continuous with the first outer side surface.

[0011] In this ceramic wiring member, since the second outer side surface has a portion continuous with the first outer side surface, a molten bonding layer can be attracted to the vicinity of the second outer side surface. Therefore, the amount of the bonding layer corresponding to the second inner side surface can be reduced, and scattering of the bonding layer to the inner side can be suppressed.

[0012] In this ceramic wiring member, the entire second outer side surface may be continuous with the entire first outer side surface. In this ceramic wiring member, since the entire second outer side surface is continuous with the entire first outer side surface, a molten bonding layer can be attracted to the vicinity of the second outer side surface. Therefore, the amount of the bonding layer corresponding to the second inner side surface can be reduced, and scattering of the bonding layer to the inner side can be further suppressed.

[0013] In this ceramic wiring member, the metallized layer may have at least one of an opening and a recess located between the second outer surface and the second inner surface. In this ceramic wiring member, molten bonding layer can be drawn into at least one of the opening and the recess. Therefore, the amount of the bonding layer corresponding to the second inner surface can be reduced, and scattering of the bonding layer to the inside can be suppressed.

[0014] [Specific Examples of Embodiments] Specific embodiments of the ceramic wiring member of the present disclosure will be described with reference to FIG. 1 and FIG. 2. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and repeated description thereof will be omitted. FIG. 1 is a plan view of an embodiment of the ceramic wiring member according to the present disclosure. FIG. 2 is a cross-sectional view of the ceramic wiring member shown in FIG. 1. FIG. 2 is a cross-sectional view taken along line XX in FIG. 1 (a cutting line parallel to the longitudinal direction of the ceramic wiring member).

[0015] [Basic Configuration of Ceramic Wiring Member 1] The ceramic wiring member 1 includes a main body 2, a metallized layer 3, and a conductor layer (not shown).

[0016] [Main Body 2] The main body 2 includes a plate portion 21 and a frame portion 22. The plate portion 21 has a rectangular flat plate shape. For example, when viewed in the thickness direction TD, the plate portion 21 may have a rectangular shape with one side 20 being 0.8 to 3 mm. The plate portion 21 has a thickness. The thickness of the plate portion 21 may be, for example, 100 to 300 μm. The plate portion 21 has two main surfaces 211 and 212. Each of the two main surfaces 211 and 212 is orthogonal to the thickness direction TD.

[0017] The frame portion 22 is disposed in contact with the peripheral portion of the main surface 211 of the plate portion 21. The frame portion 22 has a frame shape when viewed in the thickness direction TD of the plate portion 21. The frame portion 22 has a rectangular frame shape. The frame portion 22 has a second main surface 221, a first outer surface 223, a first inner surface 224, and a third main surface 222.

[0018] The second main surface 221 is located on the opposite side of the main surface 211 in the frame portion 22. The second main surface 221 is parallel to the main surface 211.

[0019] The first outer surface 223 forms the outer shape of the frame portion 22 when viewed in the thickness direction TD. The first outer surface 223 is continuous with the outer end of the second main surface 221. The first outer surface 223 is connected to the second main surface 221.

[0020] The first inner surface 224 is continuous with the second main surface 221. The first inner surface 224 defines the internal space of the frame portion 22. The first inner surface 224 is located away from the first outer surface 223 when viewed in the thickness direction TD. The first inner surface 224 is located inward relative to the first outer surface 223. The first inner surface 224 is connected to the second main surface 221. As a result, the second main surface 221 is connected to the first outer surface 223 and the first inner surface 224.

[0021] The third main surface 222 is connected to the first inner surface 224 and the first outer surface 223. The third main surface 222 is in contact with the main surface 211. Note that because the third main surface 222 and the main surface 211 of the plate portion 21 are joined by sintering, the interface (boundary) between the main surface 211 and the third main surface 222 may not be clearly visible.

[0022] The main body 2 is made of ceramic. The main body 2 is insulating. The thickness of the plate portion 21 is, for example, 50 μm or more and 200 μm or less. The thickness of the frame portion 22 is, for example, 100 μm or more and 250 μm or less. The width of the frame portion 22 is, for example, 80 μm or more and 400 μm or less.

[0023] [Metalized Layer 3] The metallized layer 3 is positioned in contact with the second main surface 221. The metallized layer 3 is continuous along the edge 20 of the main body 2. The metallized layer 3 has a fourth main surface 34, a second outer surface 31, and a second inner surface 32. The metallized layer 3 is continuous between the second outer surface 31 and the second inner surface 32.

[0024] The fourth main surface 34 is located away from the second main surface 221 in the thickness direction TD. The second outer surface 31 is continuous with the outer end of the fourth main surface 34. The second outer surface 31 has a portion that is continuous with the first outer surface 223. In this disclosure, the entirety of the second outer surface 31 is continuous with the entirety of the first outer surface 223. The second outer surface 31 and the first outer surface 223 may be flush. When viewed in the thickness direction TD, the second outer surface 31 forms the outer shape of the metallized layer 3.

[0025] Viewed in the thickness direction TD, the second inner surface 32 is located away from the first inner surface 224 in the direction from the first inner surface 224 toward the first outer surface 223. Therefore, the second inner surface 32 is located on the second main surface 221. Viewed in the thickness direction TD, the second inner surface 32 is located inside the second outer surface 31. Viewed in the thickness direction TD, the second inner surface 32 is located between the first outer surface 223 and the first inner surface 224 on one side 20 of the frame portion 22. The entirety of the second inner surface 32 is located away from the first inner surface 224, outside the entirety of the first inner surface 224, when viewed in the thickness direction TD. The second inner surface 32 is not continuous with the first inner surface 224 and is independent of the first inner surface 224. Viewed in the thickness direction TD, the second inner surface 32 is located between the second outer surface 31 and the first inner surface 224 on one side 20 of the frame portion 22.

[0026] The metallized layer 3 mainly contains a conductor. The conductor may be at least one selected from the group consisting of copper, tungsten, and molybdenum. In addition to the main component described above, the metallized layer 3 may also contain ceramic particles. The material of the ceramic particles may be the same as the ceramic of the main body 2. The metallized layer 3 may be plated with nickel, gold, or the like. The thickness of the metallized layer 3 is preferably 5 μm or more in order to form a uniform metallized layer 3 by screen printing. On the other hand, the thickness of the metallized layer 3 is preferably 50 μm or less in order to reduce the height of the ceramic wiring member 1. The distance from the second inner surface 32 to the first inner surface 224 when viewed in the thickness direction TD is preferably 20 μm or more. If the distance from the second inner surface 32 to the first inner surface 224 is above the lower limit described above, the scattering of the bonding layer 52 (described later) into the frame portion 22 can be effectively suppressed. However, the width of the metallized layer 3 is preferably 50 μm or more. Having a thickness of 50 μm or more ensures sufficient bonding strength with the lid 5.

[0027] [Conductor layer] A conductive layer, not shown in the figure, is arranged on the main surface 211, for example, surrounded by the frame portion 22. The material of the conductive layer is a conductor. The conductive layer may contain at least one of the following metals as its main component: copper, tungsten, and molybdenum. In addition to the main component mentioned above, the conductive layer may also contain ceramic particles. The material of the ceramic particles may be the same as the ceramic of the main body 2. The metallized layer 3 may be plated with nickel, gold, or the like. The composition of the conductive layer may be the same as the composition of the metallized layer.

[0028] [Manufacturing method for ceramic wiring member 1 and manufacturing method for electronic module 100] The manufacturing method for the ceramic wiring member 1 and the manufacturing method for the electronic module 100 will be explained with reference to Figures 3 to 6. Figure 3 is an explanatory diagram of the process of sequentially preparing the green wiring member assembly and the ceramic wiring member assembly. Figure 4 is an explanatory diagram of the process of separating the ceramic wiring member assembly into individual pieces. Figure 5 is a cross-sectional view of step (1) in the manufacturing method of the electronic module. Figure 6 is a cross-sectional view of step (2) in the manufacturing method of the electronic module.

[0029] As shown in Figure 3, in the manufacturing method of the ceramic wiring member 1, first, a green wiring member assembly 10A is prepared. The green wiring member assembly 10A comprises a first green wiring member 11A and a second green wiring member 12A. The first green wiring member 11A and the second green wiring member 12A are adjacent to each other in a direction perpendicular to the thickness direction TD. Each of the first green wiring member 11A and the second green wiring member 12A comprises a green body 2A and a green wiring layer 3A. The green body 2A is an insulator containing ceramic powder. Specifically, the green body 2A contains ceramic powder and resin (binder). The green body 2A includes the plate portion 21 and frame portion 22 described above. However, the frame portion 22 of the green body 2A of the first green wiring member 11A does not yet include the first outer surface 223 (see Figure 4) and the second outer surface 31 (see Figure 4) that face the second green wiring member 12A. The frame portion 22 of the green body 2A of the second green wiring member 12A does not yet include the first outer surface 223 (see Figure 4) and the second outer surface 31 (see Figure 4) that face the first green wiring member 11A. The green wiring member assembly 10A includes a continuous portion 25 in which the frame portion 22 of the first green wiring member 11A and the frame portion 22 of the second green wiring member 12A are continuous. The continuous portion 25 may include a cut (not shown) cut from the second main surface 221.

[0030] The green wiring layer 3A is a conductor containing conductive powder. Specifically, the green wiring layer 3A is formed by screen printing of a conductive paste containing conductive powder, resin, and solvent. The green wiring member assembly 10A may include a second continuous portion 35 in which the green wiring layer 3A of the adjacent first green wiring member 11A and the green wiring layer 3A of the second green wiring member 12A are continuous. Although not shown in Figure 3, the green wiring member assembly 10A does not have to include the second continuous portion 35. In other words, the green wiring layer 3A of the first green wiring member 11A may be independent of the green wiring layer 3A of the second green wiring member 12A by including a notch (not shown) cut from the fourth main surface 34 in the second continuous portion 35.

[0031] Subsequently, the green wiring member assembly 10A is fired. This produces the ceramic wiring member assembly 10. The ceramic wiring member assembly 10 comprises a first ceramic wiring member 11 and a second ceramic wiring member 12. Each of the first ceramic wiring member 11 and the second ceramic wiring member 12 has a body 2, a metallized layer 3, and a conductor layer.

[0032] As shown in Figure 4, the continuous portion 25 (see Figure 3) in the ceramic wiring member assembly 10 is then broken. Specifically, the continuous portion 25 and the second continuous portion 35 (Figure 3) are broken (see dashed line in Figure 3). The continuous portion 25 may also be cut. As a result, the first ceramic wiring member 11 and the second ceramic wiring member 12 are separated into individual pieces. In each of the first ceramic wiring member 11 and the second ceramic wiring member 12, a first outer surface 223 and a second outer surface 31 facing each other are formed.

[0033] The manufacturing method for the electronic module 100 comprises steps (1) and (2). As shown in Figure 5, in step (1), the electronic component 4 is mounted on the main surface 211 of the ceramic wiring member 1 described above, surrounded by the frame portion 22. Specifically, the electronic component 4 is electrically connected to a conductor layer (not shown).

[0034] In step (2), first, the lid 5 is prepared. The lid 5 includes a lid plate 51 and a bonding layer 52. The lid plate 51 may have a flat shape. The lid plate 51 includes two main surfaces 511 and 512. The lid plate 51 is made of metal. Examples of metals include Kovar, which is an alloy containing iron, nickel, and cobalt. The lid plate 51 may be plated with, for example, nickel, tin, etc.

[0035] The bonding layer 52 is positioned in contact with the main surface 511 of the cover plate 51. The bonding layer 52 may be positioned over the entire main surface 511. The bonding layer 52 is made of metal brazing material. The metal brazing material is not limited. Examples of metal brazing materials include silver-copper brazing and gold-tin brazing. The ratio of the bonding layer 52 to the thickness of the cover plate 51 may be, for example, 0.01 or more and 0.2 or less. The thickness of the bonding layer 52 is, for example, 5 μm or more and 20 μm or less.

[0036] As shown in Figure 6, in step (2), the peripheral portion 50 and frame portion 22 of the prepared lid 5 are brought facing each other, and with the bonding layer 52 and the metallizing layer 3 in contact, the roller electrodes 6A and 6B are pressed against the peripheral portion 50 of the lid plate 51, and current is passed through the roller electrodes 6A and 6B. As a result, the lid plate 51 is welded to the metallizing layer 3 via the bonding layer 52. The two roller electrodes 6A and 6B are movable (rotatably moved) in the depth direction of the paper while in contact with at least both end edges of the main surface 512 of the lid plate 51.

[0037] By applying current to the roller electrodes 6A and 6B, the bonding layer 52 in contact with the metallized layer 3 melts, joining the peripheral portion 50 of the lid 5 to the frame portion 22.

[0038] The electronic module 100 is manufactured by the manufacturing method described above. The electronic module 100 comprises a ceramic wiring member 1, an electronic component 4, and a lid 5.

[0039] When the bonding layer 52 melts and the roller electrodes 6A and 6B move, the bonding layer 52 (or its material) that comes into contact with the metallized layer 3 tends to splatter (splash) into the inside of the frame portion 22. However, in this disclosure, the second inner surface 32 of the metallized layer 3 is located away from the first inner surface 224 when viewed in the thickness direction TD, so the splattering of the bonding layer 52 into the inside of the frame portion 22 as described above can be suppressed.

[0040] Furthermore, since the second outer surface 31 of the metallized layer 3 has a portion that is continuous with the first outer surface 223, the molten bonding layer 52 can be drawn into this portion. Therefore, the amount of bonding layer 52 corresponding to the second outer surface 31 can be reduced, further suppressing the scattering of the bonding layer 52 into the frame portion 22.

[0041] [First variation] A first modified example of the ceramic wiring member will be described with reference to Figures 7A to 7C. Figure 7A is a partial cross-sectional view of the first modified example of the ceramic wiring member. Figure 7B is a partial cross-sectional view of a further modified example of the first modified example. Figure 7C is a partial cross-sectional view of a further modified example of the first modified example.

[0042] As shown in Figure 7A, the metallized layer 3 may have an opening 33. The opening 33 is located between the second outer surface 31 and the second inner surface 32. The opening 33 penetrates the metallized layer 3 in the thickness direction TD. The presence of the opening 33 in the metallized layer 3 makes it easier to draw in the molten excess bonding layer 52 (see Figure 6) near the second outer surface 31. The opening 33 can be easily formed during the screen printing process. In addition, multiple openings 33 may be formed in a line from the first inner surface 224 toward the first outer surface 223 when viewed in the thickness direction TD.

[0043] As shown in Figure 7B, the metallized layer 3 may have a recess 330 instead of, or in addition to, the opening 33. Having a recess 330 in the metallized layer 3 makes it easier to draw in the molten excess bonding layer 52 (see Figure 6). Furthermore, a metallized layer 3 having a recess 330 can be formed by performing multiple screen printing operations.

[0044] At least one of the opening 33 and the recess 330 may be formed in a continuous frame shape along the four sides 20 (see Figure 1) (over the entire circumference) in the metallized layer 3, or it may be formed discontinuously in a frame shape. Preferably, from the viewpoint of reliably absorbing the bonding layer 52 over the entire circumference of the metallized layer 3, at least one of the opening 33 and the recess 330 is formed in a continuous frame shape along the four sides 20 (over the entire circumference) in the metallized layer 3.

[0045] As shown in Figure 7C, a groove 227 may be provided on the second main surface 221 of the frame portion 22. The groove 227 is V-shaped. A metallized layer 3 is provided along the inner surface 228 of the groove 227. The metallized layer 3 has a shape that follows the shape of the inner surface 228 of the groove 227. The modified form in Figure 7C allows for a deeper groove 227 compared to the modified forms in Figures 7A and 7B. Therefore, it becomes easier to draw in the molten excess bonding layer 52 (see Figure 6). To manufacture the ceramic wiring member 1 of the modified form in Figure 7C, a V-shaped groove 227 is provided on the second main surface 221 of the portion corresponding to the frame portion 22 in the green wiring member assembly 10A (see Figure 3) before firing using a blade or laser. Then, a green wiring layer 3A (see Figure 3) is formed by screen printing. This provides a metallized layer 3 on the inner surface 228 of the groove 227. As a modified example, if the green wiring layer 3A is formed by screen printing and then the groove 227 is formed with a laser, a result can be obtained in which the metallized layer 3 is not formed on at least a portion of the inner surface 228 of the groove 227. However, even in this modified example, it is possible to invite a certain amount of excess bonding layer 52.

[0046] The grooves 227 may be formed continuously in a frame shape along the frame portion 22 (over the entire circumference), or they may be formed discontinuously in a frame shape. Preferably, from the viewpoint of reliably absorbing the bonding layer 52 over the entire circumference of the metallized layer 3, the grooves 227 are formed continuously in a frame shape along the frame portion 22 (over the entire circumference). Also, when viewed in the thickness direction TD, multiple grooves 227 may be formed in a line from the first inner surface 224 toward the first outer surface 223.

[0047] [Second variation] A second modified example of the ceramic wiring member will be described with reference to Figure 8. Figure 8 is a cross-sectional view of the second modified example of the ceramic wiring member.

[0048] As shown in Figure 8, the second outer surface 31 of the metallized layer 3 may include a portion 310 that is continuous with the first outer surface 223 and a portion 315 that is discontinuous with the first outer surface 223. Comparing the second modified example with the embodiment, the embodiment is preferred. In the embodiment of Figure 2, the area of ​​the metallized layer 3 in contact with the bonding layer 52 (contact area) is increased, the amount of bonding layer 52 that can be drawn onto the second outer surface 31 is increased, and the amount of bonding layer 52 corresponding to the second inner surface 32 is decreased, thereby further suppressing the scattering of the bonding layer 52 inward.

[0049] [Third variation] A third modified example of the ceramic wiring member will be described with reference to Figures 9 to 11. Figure 9 is a partial cross-sectional view of the third modified example of the ceramic wiring member. Figure 10 is a partial cross-sectional view of a green wiring member assembly for manufacturing the ceramic wiring member shown in Figure 9. Figure 11 is a partial cross-sectional view of a ceramic wiring member assembly obtained by firing and plating the green wiring member assembly shown in Figure 10.

[0050] As shown in Figure 9, the first outer surface 223 of the frame portion 22 includes a curved portion 225. The curved portion 225 bends with respect to a straight line along the thickness direction TD. The boundary portion of the frame portion 22 between the first outer surface 223 and the second main surface 221 has a curved shape. The curved portion 225 is located at the upper end of the first outer surface 223. The portion of the first outer surface 223 below the curved portion 225 is a straight portion 226. The straight portion 226 follows a straight line along the thickness direction TD. The straight line is perpendicular to the third main surface 222.

[0051] In the third modified example, the metallized layer 3 includes a main portion 36 and a protective layer 37. The main portion 36 is positioned in contact with the second main surface 221. The main portion 36 is the body of the metallized layer 3. The material of the main portion 36 includes, for example, the main components described above, and specifically, only the main components described above. The thickness of the main portion 36 is, for example, 5 μm or more and 50 μm or less.

[0052] The protective layer 37 is positioned in contact with the surface of the main portion 36. The protective layer 37 is a coating layer that covers the main portion 36. The protective layer 37 includes at least the fourth main surface 34 and the second outer surface 31. The second outer surface 31 of the protective layer 37 and the first outer surface 223 of the frame portion 22 are continuous. The protective layer 37 may be a plating layer. The material of the protective layer 37 includes at least one metal, either nickel or gold. The thickness of the protective layer 37 is 10 μm or less.

[0053] To manufacture the third modified ceramic wiring member 1, first, a green wiring member assembly 10A is prepared as shown in Figure 10. The green wiring member assembly 10A includes main parts 36 corresponding to the first green wiring member 11A and the second green wiring member 12A, respectively. The first green wiring member 11A and the second green wiring member 12A do not yet have a protective layer 37 (see Figure 9). As shown by the dashed lines in Figure 10, the green wiring member assembly 10A includes the continuous part 25 and the second continuous part 35 described above.

[0054] Subsequently, a blade (not shown) is pressed against the continuous section 25 and the second continuous section 35 from the main section 36 side. This divides the second continuous section 35. A notch 38 is formed at the upper end of the continuous section 25. The lower part of the notch 38 is a weak part of the main body 2 with lower mechanical strength compared to the surrounding part of the notch 38.

[0055] Subsequently, as shown in Figure 11, a protective layer 37 is formed on the surface of the main part 36 by plating.

[0056] Subsequently, as shown by the dashed line in Figure 11, stress is applied to the cut 38 to separate the ceramic wiring member assembly 10 into individual pieces. The lower part of the cut 38 in the main body 2 breaks.

[0057] [Fourth variation] A fourth modified example of the ceramic wiring member will be described with reference to Figures 12 to 14. Figure 12 is a partial cross-sectional view of a green wiring member assembly for manufacturing the fourth modified example of the ceramic wiring member. Figure 13 is a partial cross-sectional view of a ceramic wiring member assembly obtained by firing and plating the green wiring member assembly shown in Figure 12. Figure 14 is a partial cross-sectional view of the fourth modified example of the ceramic wiring member.

[0058] As shown in Figure 12, in the fourth modification, the laser is irradiated from the main portion 36 side onto the continuous portion 25 and the second continuous portion 35. The second continuous portion 35 is divided, and a notch 38 is formed at the upper end of the continuous portion 25. As shown in Figure 12, in the fourth modification, when viewed in the thickness direction TD, the notch 38 in the main body 2 is located away from the outer surface 361 of the main portion 36. The outer surface 361 is located outside the notch 38.

[0059] Subsequently, as shown in Figure 13, a protective layer 37 is formed on the surface (outer surface 361) of the main part 36 by plating. The cut 38 and the protective layer 37 are continuous.

[0060] Subsequently, as shown in Figure 14, the ceramic wiring member assembly 10 is separated into individual pieces. This results in the production of the first ceramic wiring member 11 and the second ceramic wiring member 12.

[0061] The embodiments disclosed herein should be understood to be illustrative in all respects and not restrictive in any way. The scope of this disclosure is defined not by the foregoing description but by the claims, and all modifications within the meaning and scope equivalent to the claims are intended. [Explanation of Symbols]

[0062] 1 Ceramic wiring member, 2 Main body, 2A Green main body, 3 Metallized layer, 3A Green wiring layer, 4 Electronic component, 5 Cover, 6A Roller electrode, 6B Roller electrode, 10 Ceramic wiring member assembly, 10A Green wiring member assembly, 11 First ceramic wiring member, 11A First green wiring member, 12 Second ceramic wiring member, 12A Second green wiring member, 20 Side, 21 Plate section, 22 Frame section, 25 Continuous section, 31 Second outer surface, 32 Second inner surface, 33 Opening, 34 Fourth main surface, 35 Second continuous section, 36 Main section, 37 Protective layer, 38 Cutout, 50 Surround section, 51 Cover plate, 52 Bonding layer, 100 Electronic module, 211 Main surface, 212 Main surface, 221 Second main surface, 222 Third main surface, 223 First outer surface, 224 First inner surface, 225 curved section, 226 straight section, 227 groove, 228 inner surface, 310 continuous section, 315 discontinuous section, 330 recess, 361 outer surface, 511 main surface, 512 main surface, TD thickness direction.

Claims

1. It comprises a ceramic body and a metallized layer containing a conductor as its main component, The aforementioned main body is The board part, It includes a frame portion that is positioned in contact with the periphery of the main surface of the plate portion and has a frame shape when viewed in the thickness direction of the plate portion, The frame portion has a first outer surface, a first inner surface located away from the first outer surface, and a second main surface located on the opposite side of the main surface and connected to the first outer surface and the first inner surface. The metallized layer is disposed in contact with the second main surface, The metallized layer has a second outer surface and a second inner surface located away from the second outer surface. Viewed in the thickness direction, the second inner surface is located away from the first inner surface in the direction from the first inner surface toward the first outer surface, The second outer surface has a portion that is continuous with the first outer surface, and is a ceramic wiring member.

2. The ceramic wiring member according to claim 1, wherein the entirety of the second outer surface is continuous with the entirety of the first outer surface.

3. The ceramic wiring member according to claim 1 or claim 2, wherein the metallized layer has at least one of an opening and a recess located between the second outer surface and the second inner surface.

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