Plate for electrochemical cell unit

Abstract

When compressive force is applied to seal the interface between cell units, this suppresses the reduction or change in the height of the channel structure within the cell unit. [Solution] A plate for an electrochemical cell unit, an electrochemical cell unit comprising the plate, a stack of electrochemical cell units comprising the plate, and a method for manufacturing the same. The plate comprises at least one fluid port, and at least one of reinforcement and strengthening is performed on the plate in a region at least partially surrounding the at least one fluid port.

Description

[[Technical Field]]

[0001] The present invention relates to a plate for an electrochemical cell unit, an electrochemical cell unit, a stack of electrochemical cell units, and methods for producing the same. [[Background Art]]

[0002] Some electrochemical cell units (or simply "cell units") can generate electricity by using an electrochemical conversion process that oxidizes fuel to produce electricity. Some electrochemical cell units can also or alternatively operate as regenerative fuel cell (or reverse fuel cell) units, and are well known for example as electrolyzer cell units for producing hydrogen and oxygen from water, or carbon monoxide and oxygen from carbon dioxide. They may have a tubular or planar configuration. For planar electrochemical cell units, for example, 100 to 400 or more electrochemical cell units may be stacked in a stacked configuration in one stack, and the individual electrochemical cell units are for example arranged electrically in series. For convenience, "cell unit" is used to refer to "electrochemical cell unit" including fuel cell units or electrolyzer cell units.

[0003] Solid oxide fuel cells (SOFCs), which generate electricity, are based on a solid oxide electrolyte that conducts negative oxygen ions from the cathode to the anode on the other side of the electrolyte. Thus, the fuel or reformed fuel is in contact with the anode (fuel electrode), and an oxidizer, such as air or an oxygen-rich fluid, is in contact with the cathode (oxygen electrode). Conventional ceramic-supported (e.g., anode-supported) SOFCs have low mechanical strength and are prone to breakage. Therefore, metal-supported SOFCs have been developed in which the active fuel cell component layer is supported on a metal substrate. In these cells, the ceramic layer can be made very thin to perform only electrochemical functions; that is, the ceramic layer is not self-supporting but rather a thin coating / film laid on and supported on a metal substrate. Such metal-supported SOFC stacks are more robust, less expensive, have better thermal properties, and can be manufactured using conventional metal welding techniques than ceramic-supported SOFCs.

[0004] Solid oxide electrolytic cells (SOECs) may have a similar structure to SOFCs, but they operate to achieve the electrolysis of fuels. For example, by inputting electrical energy and using a solid oxide electrolyte (or other electrolytes mentioned above), they electrolyze water to produce hydrogen gas and oxygen.

[0005] Each cell unit in a stack of cell units typically includes a cell layer comprising an electrochemically active cell region (EACR) and an interconnect. The interconnect typically contacts one side of the cell layer of a cell unit in a stack of cell units and may also contact the opposite side of the cell layer of an adjacent cell unit. Some interconnects are also configured to separate fluid volumes located on either side of the interconnect (e.g., fuel volume and oxidizer volume). [Overview of the project] [Problems that the invention aims to solve]

[0006] Fluid ports in a cell unit supply and / or discharge fluid from one or both of the fluid volumes. Channel structures within the cell unit provide fluid communication between the fluid ports and the respective fluid volumes. The fluid volumes of the cell unit (i.e., the fuel volume and the oxygen volume) are separated from each other to prevent mixing of fluids from each volume. Seals between cell units act to seal these volumes from each other while allowing the transport of fluid between the cell units. Compressive forces are usually required to bias the seals to contact the cell units and seal the interfaces between the cell units. However, these compressive forces also act to compress the cell units, which may result in a decrease or change in the height of the channel structures within the cell units, or impart other stresses and bending forces to the cell units.

[0007] This disclosure seeks to address, overcome, or mitigate at least one of the shortcomings of the prior art. [Means for solving the problem]

[0008] According to one embodiment, a plate for an electrochemical cell unit is provided, comprising at least one fluid port, wherein at least one of reinforcement and strengthening is performed on the plate in a region at least partially (e.g., locally) surrounding the at least one fluid port. As a result, the plate is reinforced and / or strengthened around the at least one fluid port (e.g., locally or proximal thereto).

[0009] In the region at least partially surrounding a port, the plate is locally reinforced and / or strengthened, resulting in greater resistance to bending compared to the rest of the plate. Fluid ports are typically surrounded by a sealant. This region may be configured to be in contact with the sealant. The plate is more resistant to bending in the region where it and the electrochemical cell units fabricated from it are subjected to relatively high forces due to the forces required to seal a typical sealant surrounding at least one fluid port and to seal the fluid inside the fluid port from the volume outside the fluid port. Consequently, deflection of the plate and cell units around the port is reduced, the plate and cell units become flatter, and their handling and performance are improved. Typically, a portion of this region spans a channel that provides fluid communication between at least one fluid port and the fluid volume bounded by the plate. Reinforcement and / or strengthening reduces or eliminates bending of the plate into the channel. Thus, the plate can be used to achieve a consistent and predictable fluid distribution. Localized reinforcement or strengthening of the plate increases its resistance to bending around the port, which can be advantageous for sealing while maintaining adaptability in other areas. In other words, the plate becomes stiffer and / or stronger in that area than outside that area (e.g., the untreated, non-corrugated, or non-coined areas of the plate) and / or the same area of ​​the same material precursor plate (i.e., without reinforcement and / or strengthening). The higher stiffness and / or strength may be relative to the portion of the plate between the area (surrounding the port) and a second portion of the plate configured to support or cover the electrochemically active cell area of ​​the electrochemical cell unit. Preferably, the plate is not reinforced or strengthened outside that area.

[0010] As those skilled in the art will understand, strength [unit: N / m 2Strength is the maximum stress that a material can withstand before it deforms (plastically) or breaks. In this specification, strength is preferably related to yield strength, and therefore, as strength increases, yield strength increases, and accordingly, the maximum stress before deformation increases. As will be understood by those skilled in the art, stiffness [in units N / m] is the rigidity or resistance to bending.

[0011] The plate may be a metal plate, preferably a stainless steel plate.

[0012] Preferably, in that region, the plate is reinforced by corrugations. Corrugations will be understood as local bends from the plane of the plate, for example, forming a ridge on one side of the plate and a groove on the opposite side of the plate. Corrugations are cost-effective to manufacture and can be pressed or formed simultaneously with other pressing, forming, or cutting steps on the plate of the electrochemical cell unit, for example, while providing at least one fluid port and / or pressing or forming dimples or other features on the plate. The corrugations may be substantially coaxial with at least one fluid port. This may be preferable for some sealing materials. Alternatively, the corrugations are substantially radially aligned from at least one fluid port. As a result, the extent of the corrugations can be configured to coincide with at least half the length of the channel for fluid communication between at least one fluid port and the fluid volume. In some cases, to ensure a reliable seal between the sealing material and the plate, the corrugations do not traverse the radial length of the sealing material.

[0013] Preferably, the corrugated portion is configured to traverse a fluid channel (and / or elongated slot) for transporting fluid to and from at least one fluid port. The corrugated portion is configured to reinforce the plate and prevent or reduce the plate from bending into the channel (and / or elongated slot), thereby reducing the fluid resistance within the channel (and / or elongated slot). The extent of the corrugated portion can be configured to coincide with at least half the length of the channel (and / or elongated slot) for fluid communication between at least one fluid port and the fluid volume.

[0014] Preferably, the corrugated portion has an amplitude of at least half the thickness of the plate material. Preferably, the amplitude is less than half the thickness of the material, and more preferably less than 1.5 times the thickness. Such an amplitude improves rigidity while maintaining the integrity and sealing performance of the material.

[0015] Preferably, the waveform section includes a plurality of waveform sections, for example, a plurality of coaxial waveform sections or a plurality of radial waveform sections configured to correspond to each channel (and / or elongated slot). In this way, the waveform section is configured to prevent or reduce plate bending over the length of the channel (and / or slot) (or each of them).

[0016] Preferably, in that region, the plate is reinforced by coining. Coining is understood to be a manufacturing process that typically processes a metal plate with high pressing pressure to have varying thicknesses locally. The thickness in that region can vary between 80 and 130% of the thickness of the material outside the material. Coining is cost-effective and can be performed simultaneously with other pressing, forming, or cutting steps on the plate of the electrochemical cell unit.

[0017] Preferably, in that region, the plate is strengthened by at least one of heat treatment, work hardening, and chemical modification. Heat treatment involves heating and cooling the plate to harden the plate in that region. Alternatively or in addition, the plate can be work hardened in that region by repeatedly deforming the plate in that region. Alternatively or in addition, the plate can be chemically modified in that region; for example, the plate can be quenched by a hardening treatment. Quenching acts to increase the strength of the outer surface of the plate. Quenching is a method typically used to process metal plates, resulting in a (thin) outer layer of metal that is harder than the larger volume of metal beneath the hardened layer.

[0018] Preferably, the region coincides with at least a portion of the region of the plate configured to receive the sealing material. The sealing material (including a gasket, e.g., a vermiculite-based gasket) is used around the fluid port and typically requires the application of compressive forces. Reinforcement and / or strengthening of the plate in the region reduces deformation in that region caused by forces applied through the sealing material.

[0019] Preferably, the region is the area between at least one port edge and 3 cm from there (i.e., radially outward from the port edge). This is advantageous as it corresponds to the region of the plate configured to receive the sealant (and optionally the vicinity of the periphery of that region) and is therefore able to receive forces associated with the sealant.

[0020] Preferably, the region is within an angular range of at most 180 degrees, more preferably at most 150 degrees, and even more preferably at most 120 degrees around at least one fluid port. This may lead to a more cost-effective and simpler or better sealing of the port, while providing a region configured to correspond to a channel (and / or elongated slot) or a plurality thereof.

[0021] Preferably, the thickness of the plate material is 0.15 to 0.5 mm, more preferably 0.15 to 0.4 mm. Preferably, the plate comprises stainless steel.

[0022] According to one aspect, there is provided an electrochemical cell unit, a cell layer comprising an electrochemically active cell region (EACR), and an interconnect, wherein the cell layer and the interconnect are stacked one on top of the other in the stacking direction to form the electrochemical cell unit, at least one of the cell layer and the interconnect comprises the plate according to any one of the preceding claims, there is provided the electrochemical cell unit.

[0023] Preferably, at least one of the cell layer and the interconnect is provided with at least one fluid port, and at least one of reinforcement and strengthening is performed around the at least one fluid port. Such reinforcement and / or strengthening is performed in a region where the cell layer and / or the interconnect is configured to be in contact with a sealing material.

[0024] Preferably, the at least one fluid port comprises aligned through-holes in each of the cell layer and the interconnect.

[0025] Preferably, the interconnect comprises the plate. In other words, the interconnect is reinforced and / or strengthened around the at least one fluid port. In some cases, the cell layer is also reinforced and / or strengthened around the at least one fluid port. Preferably, the cell layer is not reinforced and / or strengthened around the at least one fluid port, for example, because reinforcement of only one of the interconnect and the cell layer is sufficient and / or because the thickness of the interconnect is smaller than the thickness of the cell layer, for example the substrate thereof.

[0026] Preferably, the cell layer and the interconnect are superimposed in a spaced-apart relationship from each other, defining a fluid volume therebetween, and at least one fluid port is in fluid communication with the fluid volume. In other words, the cell layer and the interconnect enclose a fluid volume, which may also be referred to as a first fluid volume. Such definition or enclosure of the first fluid volume is preferably effected as a result of a fluid seal between the cell layer and the interconnect (e.g., welding, brazing, or a gasket, preferably welding or brazing for electrical connection) by directly abutting the cell layer and the interconnect, for example at their outer peripheries. A support structure, for example a structured region of an interconnect comprising protrusions extending towards the cell layer (preferably also extending away from the cell layer), maintains the space between the interconnect and the cell layer, whereby the fluid volume can be defined.

[0027] Preferably, the cell layer has an outer peripheral portion and a central portion surrounded by the outer peripheral portion, the central portion of the cell layer supports the EACR, the interconnect has an outer peripheral portion and a central portion surrounded by the outer peripheral portion, the central portion of the cell layer and the central portion of the interconnect define the fluid volume therebetween, and the at least one fluid port is provided in the outer peripheral portion and is in fluid communication with the fluid volume. Preferably, the central portion of the interconnect comprises a structured region, said structured region being structured by a plurality of first protrusions extending towards the cell layer and / or a plurality of second protrusions extending away from the cell layer. Preferably, the fluid guide insert is offset from the structured region in the central portion of the interconnect. The cell layer and the interconnect can be directly joined at the outer peripheral portion (for example, by welding or brazing). The at least one fluid port can be provided by a through hole extending through the interconnect (for example, the central portion thereof), the fluid guide insert, and the cell layer (for example, the central portion thereof).

[0028] Preferably, at least one of the reinforcement and strengthening is configured to reduce or prevent bending of the region within a channel (or multiple channels) for transporting fluid between at least one fluid port and a fluid volume. In other words, the reinforcement and / or strengthening is configured to reduce or prevent bending of the interconnect and / or cell layer to the other of the interconnect and / or cell layer in order to maintain the height of the channel. Such bending reduces the height of the channel and reduces the flow rate through the channel to or from the fluid volume.

[0029] Preferably, the electrochemical cell unit further comprises a fluid guide insert positioned within the fluid volume, the fluid guide insert having a plurality of elongated slots, the elongated slots defining channels for transporting fluid between at least one fluid port and the fluid volume, the region of which coincides with the elongated slots. The fluid guide insert may also be a further plate of the cell unit (i.e., a freestanding component) and can be positioned between the cell layer and the interconnect. Reinforcement and / or strengthening is configured to act against bending into the slots, thereby maintaining the height of the slots and the flow rate of fluid entering and leaving the fluid volume through the slots. The fluid guide insert may be configured to transmit the compressive force applied to the cell units when compressing the sealing material between the cell units from the cell layer to the interconnect and vice versa. The slots allow for fluid transport, and the region surrounding the slots transmits the compressive force.

[0030] Preferably, the electrochemical cell unit further comprises at least one sealing material (e.g., a gasket) surrounding each of at least one fluid ports and positioned on the side opposite to the fluid volume of the interconnect or cell layer, and the fluid guide insert has a range extending beyond the range of the sealing material. Compression in the stacking direction is configured to ensure contact between the interconnect or cell layer and the sealing material (and, in a stack of cell units, between the sealing material and the other of the interconnect and cell layer of an adjacent cell unit). Compressive force is applied to seal the interface between the cell layer and / or interconnect and the sealing material, and reinforcement and / or strengthening coincides with at least the area in contact with the sealing material. Reinforcement and / or strengthening is configured to respond to / resist deformation in response to compression of the interconnect / cell layer.

[0031] Preferably, the interconnect has a first side and a second side, the second side configured to face a fluid volume, and the interconnect has at least one fluid transfer feature to guide fluid at the second side of the interconnect for fluid communication between at least one fluid port and the fluid volume. The at least one fluid transfer feature may be at least one bridge dimple forming a projection on the first side of the interconnect and a corresponding recess on the second side of the interconnect, the recess being for guiding fluid at the second side of the interconnect. The bridge dimple may be outside the region of the interconnect configured to contact a sealing material. The recess enables fluid communication between the fluid port (specifically, an elongated slot in an insert) and the fluid volume. Alternatively, instead of a bridge dimple, the fluid transfer feature may be a locally thinned plate (e.g., by machining the second side of the interconnect). Preferably, each elongated slot has a distal end region, at least one distal end region of the elongated slot is closed by the web of the fluid guide insert, and at least one bridge dimple extends away from the fluid guide insert, across the web, and forms a fluid bypass around the web. The number of fluid transfer features or bridge dimples may range from one per fluid port to the number of elongated slots (i.e., channels) associated with the fluid port. For example, if four elongated slots are associated with a fluid port (e.g., extending radially from there), then there are one to four fluid transfer features or bridge dimples that enable fluid communication between the port and the fluid volume.

[0032] Preferably, the cell layer includes a substrate supporting a flat cell chemical layer that forms the EACR. Preferably, at least one fluid port (a through-hole forming it) is provided on the substrate (i.e., on the outside of the EACR). Preferably, the substrate is a metal substrate. Preferably, the substrate and / or interconnects include stainless steel.

[0033] Preferably, the substrate has first and second sides and a porous region that provides fluid communication between these sides, and a planar cell chemical layer including a fuel electrode layer, an electrolyte, and an air electrode layer is coated or deposited on the porous region on the first side and supported by the porous region. The second side of the substrate can boundary a fluid volume, and the porous region allows fluid communication (supply and / or discharge) with the cell chemical layer closest to the first side of the substrate (i.e., one of the electrode layers).

[0034] Preferably, the thickness of the cell layer (specifically the substrate) and / or the interconnect material is 0.15 to 0.5 mm. Preferably, the thickness of the interconnect material is thinner than the thickness of the cell layer (specifically the substrate), and reinforcement and / or strengthening is performed in the interconnect. This makes it possible to use relatively lower-grade and less expensive materials for the interconnect than for the cell layer (specifically the substrate).

[0035] According to one embodiment, a stack of electrochemical cell units is provided, comprising a plurality of electrochemical cell units according to the above embodiment, stacked in the stack direction with sealing material between the electrochemical cell units surrounding each of at least one fluid port. There may be one seal for at least one fluid port. The seal may be a gasket, for example, a vermiculite-based gasket. Compressive force applied along the stack direction can bias the sealing material to contact the cell layers and interconnects of adjacent cell units.

[0036] According to one embodiment, a method for manufacturing a plate for an electrochemical cell unit, A plate for an electrochemical cell unit, equipped with at least one fluid port, The plate is reinforced or strengthened in an area that at least partially encloses at least one fluid port, A method including this is provided.

[0037] At least one fluid port may include or consist of a through-hole in the plate.

[0038] Preferably, the reinforcement of the plate includes forming a corrugated portion or coining the region as described above.

[0039] Preferably, strengthening the plate includes heat treatment, work hardening, or chemical modification in the region as described above.

[0040] Preferably, the region is as described above.

[0041] According to one embodiment, a method for manufacturing an electrochemical cell unit is provided, comprising: providing a cell layer having an EACR; providing an interconnect; and stacking the cell layer and the interconnect in a stacking direction to form an electrochemical cell unit, wherein at least one of the cell layer and the interconnect includes a plate having at least one fluid port, and the plate is reinforced and strengthened in a region at least partially surrounding the at least one fluid port. The cell unit may relate to the above embodiment.

[0042] According to one embodiment, a method is provided for manufacturing a stack by preparing a plurality of electrochemical cell units according to the above embodiment, preparing a plurality of seals, stacking the electrochemical cell units together with sealing material between the electrochemical cell units in a stacking direction, and surrounding each of the fluid ports of at least one fluid port.

[0043] Herein, with reference to the attached drawings (which are not to scale), the features of this disclosure will be described in more detail, as various examples and merely examples. [Brief explanation of the drawing]

[0044] [Figure 1] This is a simplified schematic cross-sectional view of a cell unit. [Figure 2A] This is an exploded view of an example cell unit. [Figure 2B] This is a cross-sectional view of an exemplary cell unit. [Figure 3A] This is an exploded view of a further illustrative cell unit. [Figure 3B] Further illustrative cross-sectional view of a cell unit. [Figure 3C] Further illustrative cross-sectional view of a cell unit. [Figure 4] A simplified schematic plan view of a further illustrative cell unit. [Figure 5] A simplified schematic plan view of a further illustrative cell unit. [Figure 6] Further illustrative: A simplified schematic plan view of a portion of a cell unit. [Figure 7] Further illustrative: A simplified schematic plan view of a portion of a cell unit. [Figure 8] Further illustrative: A simplified schematic plan view of a portion of a cell unit. [Figure 9] Further illustrative: A simplified schematic plan view of a portion of a cell unit. [Figure 10] This figure shows an exemplary force-distance curve for a material. [Figure 11] This figure shows an exemplary manufacturing method for the plate. [Figure 12] This figure shows an exemplary manufacturing method for a cell unit. [Modes for carrying out the invention]

[0045] The drawings are included for illustrative purposes only. In the following drawings and description, the same reference numerals are used for similar elements in different drawings. Some of the drawings show only one or two electrochemical cell units in a stack (hereinafter each simply referred to as a "cell unit"). In various examples, multiple cells are provided. In further examples (not shown), multiple electrochemical cell stacks are provided, and in even further examples, multiple electrochemical cell stacks are provided, each containing multiple electrochemical cells. It should be understood that the inlets, outlets (off-gas), ducts, and manifolds of the fuel volume and oxygen volume, and their configurations, are modified as appropriate depending on such embodiments, and this will be readily apparent to those skilled in the art. The cell units may be fuel cell units such as SOFC units, or electrolyzer cell units such as SOEC units.

[0046] Figure 1 shows a simplified schematic diagram of a cell unit (comprising a cell layer and interconnects) and the interconnects of adjacent cell units (e.g., those placed in a stack). This shows a cell layer 114 and two adjacent interconnects 112a and 112b. These three components are intended to illustrate the stacking of cell units, and it should be understood that a cell unit (i.e., a repeating unit) is constructed from one cell layer 114 and one interconnect 112, and that multiple cell units can be stacked successively to form a stack of cell units, regardless of whether the interconnect is above (112b) or below (112a) the cell layer.

[0047] The cell layer includes an electrochemically active cell region (EACR) 150. The electrochemically active cell region 150 may be self-supporting (e.g., fuel electrode-supported or electrolyte-supported) or supported by a support structure. In the latter case, as shown in Figure 1, the support structure, e.g., a support plate, has a fluid communication region provided by a porous region 155 for fluid communication between the electrochemically active cell region 150 and the first fluid volume 160. If the EACR is self-supporting, it typically has a support structure that extends beyond the boundary of the EACR, is fixed to the support structure, is handled together with the support structure, and is supported by the support structure, the support structure having a region (e.g., a through hole or porous region) that allows fluid communication with one of the electrodes of the EACR. The EACR 150 comprises a first electrode, an electrolyte, and a counter electrode. The first electrode is located between the electrolyte and the support structure and may be a fuel electrode (and therefore, when the electrolyte is an oxygen ion conductor, the counter electrode is an oxygen electrode). EACR150 is a region configured to fluidly communicate separate fluid volumes (first and second fluid volumes) located on the sides of EACR150 and the cell layer 100. EACR150 may be a region of the cell layer 100 where the first electrode, electrolyte, and counter electrode each overlap the fluid communication region of the support structure.

[0048] The cell layer 114 and the interconnects 112a and 112b each have a first side and a second side. The first side 113a of each interconnect 112 faces the second side 115b of each cell layer 114. The second side 113b of each interconnect 112 faces the first side 115a of each cell layer 114.

[0049] The first fluid volume 160 is defined between the first side 115a of the cell layer 114 and the second side 113b of the interconnect 112. The second fluid volume 165 is defined between the second side 115b of the cell layer 114 and the first side 113a of the interconnect 112.

[0050] The first fluid volume 160 may relate to the delivery of a first fluid (e.g., fuel) to a first side of the cell layer 114, i.e., to a layer of electrochemically active cell region 150 that is in fluid communication with the first fluid flow region 160. In this case, the first fluid volume is in fluid communication with the EACR 150 (specifically, its first electrode) via a porous region 155 of the substrate (e.g., support plate) if the cell layer 114 comprises a substrate supporting the electrochemically active cell region 150. The first fluid volume 160 may also relate to the discharge of products of electrochemical reactions in the electrochemically active cell region 150 (and discharge of unused fuel).

[0051] The second fluid volume 165 may relate to the delivery of a second fluid (e.g., an oxidizer or sweep gas) and / or the discharge of products of the electrochemical reaction in the electrochemically active cell region 150. In the case of electrolytic cell operation, a sweep gas may be supplied (and discharged) through the second fluid volume to assist in the discharge of the second products of the electrochemical cell reaction. The sweep gas may be, for example, oxygen, an oxidizer, air, or another suitable gas. In the case of fuel cell operation, an oxidizer (e.g., air) is supplied to the second fluid volume for consumption in the electrochemical cell operation. Any excess oxidizer may be supplied for its function as a coolant.

[0052] A cell unit (i.e., a repeating unit, where multiple units form a stack) comprises one cell layer 114 and one interconnect 112, which can be attached to or joined to one another as a single subassembly or component. In one example, a cell unit 100 is formed from a cell layer 114 and an interconnect 112a, and these components enclose a first fluid volume 160 between a second side 113b of the interconnect and a first side 115a of the cell layer. When two cell units 100 are stacked, a boundary of a second fluid flow volume 165, sometimes referred to as a second fluid volume 165, is defined between the second side 115b of the cell layer 114 of the first cell unit 100 and the first side 113a of the interconnect 112b of a second adjacent (i.e., neighboring) cell unit 100. In an alternative example, the cell unit 170 is formed from a cell layer 114 and an interconnect 112b, and these components enclose a second fluid volume 165 between the first side 113a of the interconnect 112b and the second side 115b of the cell layer 114. When two cell units 170 are stacked, the boundary of the first fluid volume 160 is defined between the first side 115a of the cell layer 114 of the first cell unit 100 and the second side 113b of the interconnect 112a of the second adjacent (i.e., neighboring) cell unit 170.

[0053] The cell layer is typically (substantially) planar, at least within the planar region of the electrochemically active cell region 150. The interconnect is typically formed from a planar sheet, such as a metal sheet.

[0054] Preferably, conductive features are formed on the first side 113a of the interconnect 112. For example, they are conductive protrusions. Such protrusions may be printed features or features formed by pressing, for example, a metal sheet. The protrusions may take the form of individual dimples, or alternatively, they may take the form of ribs or the like. They protrude into the corresponding fluid volume 165 and serve to electrically contact the electrochemically active cell region 150 of the cell layer 114 (its second side 115b) while simultaneously separating the cell layer 114 from the upper interconnect 112b.

[0055] Instead of protrusions (e.g., dimples), conductive features may include a porous layer formed (e.g., deposited or coated) on the first side 113a of the interconnect. Alternatively or in addition, the porous layer may be formed (e.g., deposited or coated) on the second side 115b of the cell layer 114, specifically on the electrochemically active cell region 150. Such a porous layer may also be provided as its own component in the stack (e.g., an expanded metal sheet or mesh). As can be seen from some illustrated examples below, protrusions or other features may be provided on the second side 113b of the interconnect 112. The protrusions or porous layer may also act for the purpose of transmitting compressive forces through or between cell units in the stack.

[0056] Through-holes are provided in both the cell layer (outside the EACR) and the interconnect, and the through-holes in the cell layer and interconnect are aligned to form fluid ports. The through-holes may be provided at multiple locations (in the plan view / across the cell layer and interconnect) to form a plurality of corresponding fluid ports. For example, there may be 1 to 10 fluid ports in a single cell unit. The fluid ports supply fluid to one or both of the fluid volumes and / or discharge fluid from one or both of the fluid volumes. In the following example, typically at least one fluid port supplies fluid to the first fluid volume 160 and at least one fluid port discharges fluid from the first fluid volume 160. In other examples, at least one fluid port may supply fluid to one of the fluid volumes or discharge fluid from one of the fluid volumes.

[0057] A sealing material is provided between (in contact with) the cell layer and the interconnect, surrounding at least one fluid port, thereby enabling fluid communication of a given type of fluid volume (e.g., a first fluid volume) between adjacent cell units. For example, a sealing material may be provided between the first side 113a of the interconnect 112a and the second side 115b of the cell layer 114 to enable fluid communication between the first fluid volumes 160 of adjacent cell units. The sealing material typically requires compressive force to seal to the receiving surface (i.e., the first side 113a of the interconnect 112a and the second side 115b of the cell layer 114). A support structure within or traversing the first fluid volume responds to and transmits the compressive force between the second side 113b of the interconnect 112b and the second side 115a of the cell layer 114. The support structure also provides fluid communication (e.g., a channel) between the fluid port and the first fluid volume. In the following description, it is assumed that the sealing material is located between the first side 113a of the interconnect 112a and the second side 115b of the cell layer 114, but it will be understood that the sealing material may also be located between the second side 113b of the interconnect 112a and the first side 115a of the cell layer 114 to enable fluid communication between the second fluid volumes 165 of adjacent cell units.

[0058] The cell layer and / or interconnect may be formed by a plate, which is reinforced or strengthened in the region surrounding the fluid port. Such reinforcement or strengthening acts to reduce or eliminate the bending of the plate into the fluid communication structure. As a result, the flow rate and predictability of the fluid communication between the port and the fluid volume are maintained.

[0059] Figure 2A shows an exploded view of an exemplary cell unit 200 comprising a cell layer 114 and an interconnect 112. Cell unit 200 corresponds to cell unit 100 in Figure 1. Figure 2A shows the lower and upper exploded perspective views. Figure 2B shows a cross-section (ZZ as shown in the exploded view) of one cell unit. In this example, the cell layer comprises a substrate or support plate on which an electrochemically active cell region (EACR) is placed. The EACR comprises a first electrode, a counter electrode, and an electrolyte placed between these electrodes. The first electrode is between the electrolyte and the substrate and may be a fuel electrode (cathode in the electrolytic operation), in which case the counter electrode is an oxygen electrode (anode in the electrolytic operation). The substrate comprises a porous region on which the EACR is placed, the porous region providing fluid communication between the first fluid volume 160 and the first electrode. The porous region is preferably a drilled (e.g., laser-drilled) region of the substrate or an inherently porous region. In this example, the substrate is a metal plate that supports the EACR, which may be coated or deposited on the substrate. Such a metal plate is self-supporting and provides support for the EACR.

[0060] The interconnect 112 may be a plate, such as a metal plate, and is freestanding. In this example, the interconnect has a flanged outer periphery. As a result, in the cell unit, the outer periphery of the interconnect contacts the outer periphery of the cell layer 114 and is joined / sealed (e.g., by welding the outer periphery). Specifically, the second side 112 of the interconnect contacts the first side (of the substrate) of the cell layer 114 at its outer periphery. On the other hand, the flanged outer periphery means that in the central region (inward from the outer periphery), the interconnect 112 and the cell layer 114 are positioned apart from each other to form a first fluid volume 160. It will be understood that the height of the first fluid volume 160 can be formed by providing a flanged outer periphery on one or both of the cell layer and the interconnect.

[0061] In this example, a plurality of protrusions 232, 236 are provided in the central region of the interconnect 112. The upward-facing protrusions 232 project toward the first side of the cell layer 114. The downward-facing protrusions 236 project toward the second side 114 of the cell layer of an adjacent cell unit in the stack of cell units. The upward-facing protrusions 232 are configured to contact the first side of the cell layer 114, specifically the porous region of the substrate. The downward-facing protrusions 236 are configured to contact the EACR (outermost layer) of an adjacent cell unit. In this way, the protrusions 232, 236 are configured to provide support and transmit compressive forces through the cell units and stack. The protrusions 232, 236 are pressed or formed on the interconnect, so that the protrusions (convex portions) on one side of the interconnect form recesses (concave portions) on the opposite side. The interconnect is configured to separate the first fluid volume from the second fluid volume. Preferably, the protrusions do not define the fluid flow; that is, they are not channels or do not form channels. In such cases, each protrusion preferably has an aspect ratio (length to width in a plan view) of less than 5, more preferably less than 2, and is preferably elliptical or circular in cross-section (plan view).

[0062] In this example, each cell unit has two fluid ports, but it may have a different number of fluid ports (e.g., 1, 3, 4, 6, etc.). Each fluid port is provided by aligned through holes in the cell layer 114 and the interconnect 112.

[0063] A fluid guide insert 253 is positioned between the cell layer 114 of the cell unit and the interconnect 112, surrounding each fluid port. It has through-holes that are aligned with the through-holes in the cell layer 114 and the interconnect 112 to form the fluid ports. The insert 253 is provided with at least one elongated slot 254 (also called a channel, in this case three slots or channels, but more or fewer, e.g., two, four, five) for fluid communication with the (first) fluid volume 160 enclosed between the second side of the interconnect and the first side of the cell layer. The fluid guide insert also transmits compressive force (indicated by the arrow in Figure 2B) through the cell unit, which is used to bias a sealing material (e.g., a gasket) 234 to come into contact with the interconnect 112 of the cell unit and the cell layer 114 of the adjacent cell unit (a force that fluidly seals the interface).

[0064] One fluid guide insert 253a is associated with a fluid inlet port. This fluid guide insert 253 is positioned such that its hole 256 contributes to forming a fluid port, i.e., a fluid inlet port, in the cell unit. The fluid guide insert 253 associated with the fluid inlet port is configured to transport fluid from the fluid inlet port to the fluid volume 160. Specifically, the fluid flows from the fluid inlet port through the elongated slot 254 (forming a channel) of the insert 253 to the first fluid volume 160. A second fluid port, having a similar structure to the fluid inlet port and associated with a fluid guide insert 253b, exists to discharge fluid from the fluid volume, and the second fluid discharge port is located at the opposite end of the cell unit from the fluid inlet port, with the EACR 150 located between these ports.

[0065] The multiple slots 254 of the fluid guide insert 253 can diffuse the fluid along a direction perpendicular to the direction between the inlet port and the discharge port. It will be understood that multiple ports for inlet and discharge may be provided, each port may be associated with one fluid guide insert, or multiple ports may be associated with a single fluid guide insert (for example, one fluid guide insert for multiple inlet ports and a second fluid guide insert for multiple discharge ports).

[0066] The elongated slot 254 has a proximal end region located near (or adjacent to) the port, and a distal end region located distal to the port (i.e., the end opposite the proximal end region of the slot) and near the EACR 150. In this example, the proximal end region of the elongated slot 254 is open; that is, it opens to the through hole 256. In this example, the distal end region of the elongated slot 254 is closed by its respective web 262. The interconnect 112 includes bridge dimples 268 that extend away from the fluid-guiding insert 253 and span each of the webs 262, forming a fluid bypass around the web 262. Thus, the bridge dimples 268 fluidly connect each elongated slot 254 to the first fluid volume 160 by allowing fluid to exit from the plane of the insert 253 around each web 262. In this example, each of the elongated slots 254 is associated with its respective bridge dimple 268. Alternatively, several webs 262 may be associated with a common bridge dimple 268, or several bridge dimples 268 may be associated with a common web 262. It will be understood that a single elongated slot may be open at its distal end without compromising the structural integrity of the fluid guide insert 253. In such a case, a bridge dimple is not required for fluid communication between the port and the first fluid volume 160 via the elongated slot with the open distal end.

[0067] On the first side 112 of the interconnect (facing away from the first fluid volume 160), the bridge dimple 268 forms a projection extending away from the enclosed fluid volume. A sealing material (e.g., a gasket) 234 can be positioned directly adjacent to the projection of the bridge dimple 268 such that the outer circumference of the sealing material 234 is in direct contact with the projection. Thus, these projections restrict the movement of the sealing material 234 and assist in the positioning of the sealing material.

[0068] On the first side 112 of the interconnect (the side facing away from the fluid guide insert), the bridge dimple 268 forms a projection that extends away from the fluid guide insert and toward the second side of the cell layer (for example, of an adjacent cell unit in the stack), specifically, in this example toward the second side of the support plate 114.

[0069] In this example, the bridge dimple 268 is formed or pressed into the interconnect 112. Preferably, the bridge dimple 268 is formed or pressed in the same steps as the upward projection 232 and / or downward projection 236 and / or flanged outer periphery of the interconnect 112. Alternatively, the bridge dimple and / or flanged outer periphery may be formed or pressed into the substrate in the same steps.

[0070] The fluid guide insert 253 is constructed flat (i.e., planar). The fluid guide insert is a self-supporting component that can be handled and positioned between the interconnect and the cell layer before the interconnect and the cell layer are attached to their outer periphery. In the assembled cell unit, the first surface (first side) of the fluid guide insert 253 is in direct contact with the opposing surface (second side) of the interconnect 112. The second surface (second side opposite to the first side) of the fluid guide insert 253 is in direct contact with the opposing surface (first side) of the cell layer, i.e., the support plate. Thus, around the fluid port, the fluid guide insert 253 transmits compressive force (indicated by arrows in Figure 2B) between the cell layer 114 and the interconnect 112. This can increase the mechanical stability of the cell unit. The compressive force is intended to bias the sealing material, such as a gasket, such as a vermiculite-based gasket, to contact the cell layer and interconnect, thereby sealing between them and around the fluid port. Specifically, the fluid guide insert 253 can prevent deformation of the cell layer and interconnect 112 due to the compressive force. Nevertheless, the cell layer and interconnect are not supported by the insert 253 in areas that traverse the elongated slot 254 of the insert, and in these areas, the compressive force applied by the sealing material acts to bend the cell layer and interconnect into the slot 254 of the insert. This bending can be reduced or eliminated by strengthening and / or reinforcing the interconnect and / or cell layer in areas configured to receive (i.e., contact with) the sealing material, particularly in areas where the interconnect and / or cell layer traverse the slot 254. To reduce the cost of the cell unit, the interconnect may be manufactured from a thinner or lower-grade metal than the cell layer (specifically its substrate), and therefore, the interconnect is preferably reinforced and / or strengthened.

[0071] Figure 3A is an exploded perspective view of two further exemplary cell units 300 in a stacked arrangement. Figures 3B and 3C are cross-sectional views of cell unit 300 along lines AA and BB shown in Figure 3A, respectively. Only the differences between cell unit 300 and cell unit 200 will be described. Cell unit 300 includes a spacer 353 (also called a spacer plate) instead of the flanged periphery and insert of cell unit 200. The spacer plate 353 is a frame-shaped component (i.e., having a closed periphery and a hollow central region) between the first side of the cell layer 114 and the second side 312 of the interconnect. The spacer plate 353, cell layer 114, and interconnect 312 are sealed together at their peripheries (for example, by welding these three plates at their peripheries). The spacer 353 is self-supporting and can therefore be handled independently of the cell layer 114 and interconnect 312.

[0072] In this case, the thickness of the spacer acts to separate the central regions of the interconnect 312 and the cell layer 114 from each other, forming a first fluid volume 160 between them. In other words, the spacer replaces the function of the flanged outer periphery of the cell unit 200; therefore, in this example, the interconnect 312 does not have a flanged outer periphery. The spacer plate has through-holes that are aligned with the through-holes of the cell layer 114 and the interconnect 312 to form fluid ports. In this case, there are four fluid ports, but it will be understood that other numbers of fluid ports are possible as described above. The spacer plate has one or more channels for fluid communication between the fluid ports and the first fluid volume 160. In this case, each port is provided with one channel in the form of an elongated slot between the port and the first fluid volume 160. The distal end of the elongated slot is open. It will be understood that each port may have one or more elongated slots, and that the distal ends of one or more of the slots may be closed by a web. In the latter case, the cell layer 114 or interconnect 312 is provided with bridge dimples, similar to the cell unit 200.

[0073] The interconnect 312 comprises upward-facing projections 232 similar to those of the cell unit 200, and printed or deposited downward-facing projections 336, in contrast to the pressed or formed projections 236 of the cell unit 200. It will be understood that such printed or deposited projections may be provided, further or alternatively, on both the second side of the cell layer (specifically the outermost layer of the EACR, e.g., the counter electrode, or the sacrificial layer thereon) and the first side of the interconnect. Alternatively, the projections may be machined or etched into the printed or deposited layer on the first side of the interconnect or the second side of the cell layer. The height of such feature portions may be easy to control and may be relatively easy to manufacture. Alternatively, instead of projections 236, 336, a porous layer (of a given thickness over the entire region of the electrochemically active cell area) may be used, which is adapted to contact the electrochemically active cell region and separate the interconnect from the electrochemically active cell region.

[0074] The spacer 353 of the cell unit 300 can be used with interconnects having pressed or formed projections that protrude upward and downward (similar to projections 232 and 236), and it will be understood that, alternatively, the printed, deposited, or machined projection 336 can be used with interconnects having a flanged outer periphery.

[0075] In the assembled cell unit, the first surface (first side) of the spacer 353 is in direct contact with the opposing surface (second side) of the interconnect 312. The second surface (second side opposite to the first side) of the spacer 353 is in direct contact with the opposing surface (first side) of the cell layer, i.e., the support plate. Therefore, around the fluid port, the spacer 353 transmits compressive force between the cell layer 114 and the interconnect 112. This can increase the mechanical stability of the cell unit. The compressive force is intended to bias a sealing material, such as a gasket, such as a vermiculite-based gasket, to contact the cell layer and the interconnect, thereby sealing between them and around the fluid port. Specifically, the spacer 353 can prevent deformation of the cell layer and the interconnect 112 due to the compressive force. Nevertheless, the cell layer and interconnect are not supported by the spacer 353 in the regions that traverse the elongated slot 354 of the spacer, and in these regions, the compressive force applied by the sealant acts to bend the cell layer and interconnect into the slot 354 of the spacer. This bending can be reduced or eliminated by strengthening and / or reinforcing the interconnect and / or cell layer in the regions configured to receive (i.e., contact with) the sealant, particularly in the regions where the interconnect and / or cell layer traverse the slot 354. To reduce the cost of the cell unit, the interconnect may be manufactured from a thinner or lower-grade metal than the cell layer (specifically its substrate), and therefore, it is preferable that the interconnect be strengthened and / or reinforced.

[0076] Figure 4 is a schematic plan view of the cell unit 400. This figure shows the second side 114 of the cell layer. The cell unit 400 is similar to those described with reference to Figures 1 to 3, but includes six fluid ports 440. Three of the fluid ports 440 (for example, those on the left side of the figure) may be for delivery to a first fluid volume, and the remaining three may be for discharge from the first fluid volume. If inserts are used, one insert may have three through holes and associated channels, so that one insert may be associated with three ports for fluid delivery, and a second insert may be associated with three ports for discharge. The dashed area 435 indicates an area surrounding the fluid ports and is configured to receive a sealing material. That is, a fluid sealing material that contacts the second side of the cell layer and the first side of the interconnect and seals their interface contacts and is received by area 435. The interconnect and / or cell layer may be reinforced or strengthened in region 435 with respect to the region of the interconnect and / or cell layer outside region 435, and / or reinforced with respect to the precursor plate.

[0077] Figure 5 is a schematic plan view of a further cell unit 500. Similar to Figure 4, the dashed region 435 indicates a region surrounding a fluid port and is configured to receive a sealing material. That is, a fluid sealing material that contacts the second side of the cell layer and the first side of the interconnect and seals their interface is contacted and received by region 435. The interconnect and / or cell layer may be reinforced or strengthened in region 435 with respect to the region of the interconnect and / or cell layer outside of region 435, and / or reinforced with respect to the precursor plate. In this case, the cell unit 500 comprises four fluid ports 540. Two of the fluid ports 540 (for example, those on the left side of the figure) may be for delivery to a first fluid volume, and the remaining two may be for discharge from the first fluid volume. It will be understood that the cell unit may have more or fewer fluid ports than those shown in Figures 4 and 5.

[0078] Figure 6 is a schematic plan view of a portion of the cell unit 600. One fluid port 640 is shown in detail. This figure is of the first side 112 of the interconnect, with the projection covered by the central region simplified and labeled 232, 236, and 336. The dashed region 435 shows the region surrounding the fluid port 640 (both the second side of the cell layer and the first side of the interconnect) configured to receive a sealant, in which the interconnect and / or cell layer may be reinforced or abutted with respect to the region of the interconnect and / or cell layer outside region 435 and / or reinforced with respect to the precursor plate. Within region 435 is a reinforcement feature 670. The reinforcement feature 670 surrounds the fluid port 640 and, in this case, is coaxial with the fluid port 640. The reinforcing feature 670 traverses a channel (e.g., a spacer or insert) for fluid communication between the fluid port and the first fluid volume, reducing or eliminating bending of the reinforced plate within the channel. The reinforcing feature 670 may also be a corrugated portion which is a feature pressed or formed on the cell layer and / or interconnect, preferably the interconnect, and the corrugated portion protrudes from the channel (elongated slots 254, 354) and reinforces the plate on which the corrugated portion is provided. The corrugated portion has an amplitude of at least half the thickness of the plate material. Preferably, the amplitude is less than half the thickness of the material, and more preferably less than 1.5 of the thickness. Alternatively, the reinforcing feature 670 is a coined feature, in which case the reinforced plate (one of the cell layer and / or interconnect, preferably the latter) is locally thicker at the reinforcing feature 670 than outside the feature due to the coining process. The thickness in this region can be varied between 80 and 130%, preferably between 105 and 125%, of the thickness of the material outside the coined material.

[0079] Note that the reinforced plate has a non-planar sealing surface. In the case of adaptable seals such as gaskets (e.g., vermiculite gaskets), the adaptable seal is usually flexible enough to form around the reinforced feature. In the case of other less adaptable sealing materials (such as glass seals), a reinforced feature 670 surrounding the fluid port 640 may achieve a better seal than a reinforced feature partially surrounding the fluid port as shown in Figure 7.

[0080] Figure 7 is a schematic plan view of a portion of a cell unit 700 similar to cell unit 600, illustrating only the differences. In this case, the reinforcing feature 770 partially surrounds the fluid port 740. The reinforcing feature 770 crosses a channel (e.g., a spacer or insert) for fluid communication between the fluid port 740 and the first fluid volume. In this way, the reinforcing feature 770 reduces or eliminates bending of the reinforced plate within the channel. A second reinforcing feature 771 may be provided, which also partially surrounds the fluid port, in this case located in a region angularly opposite to the fluid port relative to the reinforcing feature 770. This feature may also cross a channel or may exist to reinforce the plate and cell unit to reduce bending from the seal by making the distribution and response of the load applied by the seal more symmetrical.

[0081] Figure 8 is a schematic plan view of a portion of cell unit 800 similar to cell unit 700, illustrating only the differences. In this case, the additional reinforcing feature 870 is depicted as an example to show that multiple coaxial reinforcing features of different radii may be provided in region 435.

[0082] Note that Figures 6-8 show reinforcing features coaxial with the fluid port (i.e., at a certain distance from its edge), but it will be understood that this is not necessarily required. For example, linear reinforcing features, or reinforcing features having multiple linear sections (which may be joined by bends or are separate) that traverse the channel, act to reduce or eliminate bending of the reinforced plate within the channel.

[0083] Figure 9 is a schematic plan view of a portion of cell unit 900, similar to cell units 600, 700, and 800, illustrating only the differences. In this case, each reinforcing feature 970 is aligned with (i.e., on) its respective channel. Each reinforcing feature 970 reduces or eliminates bending of the reinforced plate within its respective channel. In the example in Figure 9, three reinforcing features 970 are shown, which may correspond to the three channels (elongated slots 254) shown in Figure 2.

[0084] The aforementioned fluid port is formed by a circular through-hole. However, other shapes of fluid ports are possible, such as elliptical or rectangular, and the area around the port (i.e., configured to receive the sealing material) can be similarly reinforced or strengthened as described herein.

[0085] In alternative examples, region 435 may be further strengthened by one or more of the following: heat treatment, work hardening, and chemical modification. For example, region 435 and / or the plate may be heated and cooled to harden the plate around the fluid port (interconnect and / or cell layer / substrate). Alternatively or in addition, region 435 and / or the plate may be work-hardened in that region by repeatedly deforming the plate in that region. Alternatively or in addition, the region and / or the plate may be chemically modified in that region, for example, the region may be quenched by a hardening treatment. Quenching acts to increase the strength of the outer surface of the region. Quenching is a method of working with metal, resulting in a (thin) outer layer of metal that is harder than the larger volume of metal beneath the hardened layer.

[0086] Figure 10 is an exemplary force-displacement curve to aid in illustrating the effects of plate reinforcement and / or strengthening as described herein. The force-displacement curve has an elastic region in which force and displacement (due to force) are directly proportional, in which the curve is a straight line and the slope of the line corresponds to stiffness. Outside the elastic region, where force and displacement are large, is the plastic region. The transition between the elastic and plastic regions is defined by the yield stress. Reinforcement by corrugation or coining as described herein increases the slope of the line in the elastic region, and therefore the displacement (bending) of the reinforced plate into the channel for a given force is reduced. Reinforcement by heat treatment, work hardening, or chemical modification as described herein increases the yield strength, thereby increasing the force and displacement at which the plastic region begins, and therefore the permanent displacement (bending) of the reinforced plate into the channel is reduced or avoided.

[0087] Figure 11 shows a method 1100 for manufacturing a plate for an electrochemical cell unit. In step 1110, method 1100 includes preparing a plate for an electrochemical cell unit having at least one fluid port. In step 1120, method includes performing at least one of reinforcement or strengthening on the plate in a region at least partially surrounding the at least one fluid port. Reinforcement of the plate may be performed in step 1130 by corrugating or coining the plate. Strengthening of the plate may be performed in step 1140 by heat treatment, work hardening, or chemical modification of the plate. Step 1130 may be performed concurrently with pressing or forming one or more of a flanged periphery, bridge dimples, or projections.

[0088] Figure 12 shows a method 1200 for manufacturing a plate for an electrochemical cell unit. In step 1210, method 1200 includes preparing a cell layer having an electrochemically active cell region (EACR). In step 1220, method 1200 includes preparing an interconnect. In step 1230, method 1200 includes stacking the cell layer and the interconnect in a stacking direction to form an electrochemical cell unit, wherein at least one of the cell layer and the interconnect includes a plate having at least one fluid port, and the plate is reinforced and / or strengthened in a region at least partially surrounding the at least one fluid port. Method 1200 may include step 1240 after either step 1210 or 1220, in a region at least partially surrounding the at least one fluid port provided in the cell layer and / or interconnect. The reinforcement and / or strengthening may be carried out by one of steps 1130 and 1140.

[0089] In the above description, region 435 is preferentially strengthened and / or reinforced, preferably making the plate in that region (i.e., surrounding the fluid port) stronger or harder. However, it will be understood that some techniques, such as in-furnace heat treatment, cannot specifically alter the properties of the precursor plate only in that region, while localized heat treatment, such as induction heating or laser heating, can alter the properties of the precursor plate only in the target region (i.e., that region). In other words, reinforcement can be optionally carried out in that region (i.e., the portion of the plate configured to receive the sealant or a portion thereof), as well as in the portion of the plate between that region and the outer periphery of the plate, and in the central region of the plate (the central region with projections or supporting the EACR). Alternatively, substantially the entire plate may be reinforced / strengthened.

[0090] This disclosure is not limited to the examples given above, and other examples that do not deviate from the scope of the appended claims will be readily apparent to those skilled in the art. These and other features are described above merely as examples. Modifications of detail can be made within the scope of the claims.

Claims

1. A plate for an electrochemical cell unit, A plate having at least one fluid port, wherein at least one of reinforcement and strengthening is performed on the plate in a region at least partially surrounding the at least one fluid port.

2. The plate according to claim 1, wherein in the region, the plate is reinforced by a corrugated portion.

3. The plate according to claim 2, wherein the corrugated portion is configured to traverse a channel for transporting fluid to and from the at least one fluid port.

4. The plate according to any one of the claims, wherein in the region, the plate is reinforced by coining.

5. The plate according to any one of the claims, wherein in the region, the plate is strengthened by at least one of heat treatment, work hardening, and chemical modification.

6. The plate according to any one of the claims, wherein the region coincides with at least a portion of the region of the plate configured to receive a sealing material.

7. The plate according to any one of the claims, wherein the region is within an angular range of at most 180 degrees around the at least one fluid port.

8. An electrochemical cell unit, A cell layer having an electrochemically active cell region (EACR), Interconnect and Equipped with, The cell layer and the interconnect are stacked in the stacking direction to form an electrochemical cell unit. At least one of the cell layer and the interconnect comprises the plate described in any one of the claims. Electrochemical cell unit.

9. The electrochemical cell unit according to claim 8, wherein the at least one fluid port includes aligned through holes in the cell layer and the interconnect, respectively.

10. The electrochemical cell unit according to claim 8 or 9, wherein the interconnect includes the plate.

11. The electrochemical cell unit according to any one of claims 8 to 10, wherein the cell layer and the interconnect are superimposed with space between them, defining a fluid volume between them, and the at least one fluid port is in fluid communication with the fluid volume.

12. The electrochemical cell unit according to claim 11, wherein at least one of the reinforcements and strengthenings is configured to reduce or prevent the region from bending in a channel for transporting fluid between the at least one fluid port and the fluid volume.

13. The electrochemical cell unit according to claim 11 or 12, further comprising a fluid guide insert disposed within the fluid volume, wherein the fluid guide insert has a plurality of elongated slots, the elongated slots defining channels for transporting fluid between the at least one fluid port and the fluid volume, and the region coinciding with the elongated slots.

14. The electrochemical cell unit according to claim 13, further comprising at least one seal surrounding each of the at least one fluid ports and positioned on the interconnect or on the side of the cell layer opposite to the interconnect, wherein the fluid guide insert extends beyond the range of the seal.

15. The electrochemical cell unit according to any one of claims 11 to 14, wherein the interconnect has a first side and a second side, the second side being configured to face the fluid volume, and the interconnect has at least one fluid transfer feature at the second side of the interconnect to guide the fluid for fluid communication between the at least one fluid port and the fluid volume.

16. The electrochemical cell unit according to any one of claims 8 to 15, wherein the cell layer includes a substrate that supports a planar cell chemical layer forming an EACR.

17. A stack of electrochemical cell units, comprising a plurality of electrochemical cell units according to any one of claims 8 to 16, which surround each of the at least one fluid ports and are stacked in the stacking direction together with a sealing material between the electrochemical cell units.

18. A method for manufacturing a plate for an electrochemical cell unit, A plate for an electrochemical cell unit, having at least one fluid port, In the region that at least partially surrounds the at least one fluid port, the plate is reinforced or strengthened by at least one of the following: A method that includes this.

19. A method for manufacturing an electrochemical cell unit, To prepare a cell layer that has an electrochemically active cell region (EACR), To prepare the interconnect, The electrochemical cell unit is formed by stacking the cell layer and the interconnect in the stacking direction. The cell layer and the interconnect include at least one of which includes a plate having at least one fluid port, and the plate is reinforced and strengthened in a region at least partially surrounding the at least one fluid port. method.

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