Light-emitting device

Abstract

To improve the durability of flexible light-emitting devices. [Solution] The light-emitting part 140 is formed on one surface 101 of the substrate 100. The light-emitting part 140 also has a first electrode 110, an organic layer 120, and a second electrode 130. The covering member 180 covers the light-emitting part 140. The integrated circuit 300 is arranged on one surface 101 of the substrate 100. The integrated circuit 300 is electrically connected to at least one of the first electrode 110 and the second electrode 130. The protective member 400 is located in the region 105 between the covering member 180 and the integrated circuit 300. The protective member 400 is also provided so as to expose the entire first surface 301 of the integrated circuit 300 that is opposite to the substrate 100.

Description

[Technical Field]

[0001] The present invention relates to a light-emitting device, an electronic device, and a method for manufacturing a light-emitting device. [Background Art]

[0002] In recent years, development of light-emitting devices using organic EL has been progressing. This light-emitting device is used as a lighting device and a display device, and has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode. Flexible light-emitting devices using resin or thin glass substrates have been developed.

[0003] Patent Document 1 describes that covering most of a transparent substrate except a portion where a semiconductor chip and a flexible printed circuit board are mounted with a protective member improves the strength of most of the transparent substrate. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2010-27502 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] Particularly when a glass substrate is used, compared with a resin substrate, less deterioration factors permeate into the light-emitting portion, so the life of the light-emitting portion can be prolonged. On the other hand, there has been a problem that durability when curved is inferior. When the substrate is curved, stress tends to concentrate particularly between an integrated circuit provided on the substrate and a sealing member, which is likely to cause cracking or the like.

[0006] An example of the problem to be solved by the present invention is improving the durability of a flexible light-emitting device. [Means for Solving the Problem]

[0007] The first invention is, circuit board and A light-emitting portion formed on one side of the substrate, having a first electrode, an organic layer, and a second electrode, A covering member that covers the light-emitting part, An integrated circuit is disposed on one of the aforementioned surfaces and electrically connected to at least one of the first electrode and the second electrode, A protective member located in the region between the covering member and the integrated circuit is provided, The protective member is a light-emitting device provided so as to expose the entire first surface of the integrated circuit opposite to the substrate.

[0008] The second invention is, A light-emitting device according to the first invention is provided, Electronic device in which at least a portion of the substrate is curved That is the case.

[0009] The third invention is, A step of forming a light-emitting portion having a first electrode, an organic layer, and a second electrode on one side of a substrate, A step of providing an integrated circuit on one of the aforementioned surfaces that is electrically connected to at least one of the first electrode and the second electrode, The process of covering the light-emitting part with a covering member, The process includes forming a protective member in the region between the covering member and the integrated circuit, In the process of forming the protective member, the protective member is provided such that the entire first surface of the integrated circuit opposite to the substrate is exposed. This is a method for manufacturing a light-emitting device. [Brief explanation of the drawing]

[0010] The aforementioned objectives, as well as other objectives, features, and advantages, will become even clearer from the preferred embodiments described below and the accompanying drawings.

[0011] [Figure 1] This is a cross-sectional view showing the configuration of a light-emitting device according to an embodiment. [Figure 2]It is a plan view showing the configuration of a light-emitting device according to an embodiment. [Figure 3] It is a diagram with the protective member, integrated circuit, covering member and sealing film removed from FIG. 2. [Figure 4] It is a diagram with the second electrode removed from FIG. 3. [Figure 5] It is a diagram with the insulating layer and the organic layer removed from FIG. 4. [Figure 6] It is a plan view showing an example of the positional relationship between the covering member and the integrated circuit. [Figure 7] It is a plan view showing an example of the positional relationship between the covering member and the integrated circuit. [Figure 8] It is a cross-sectional view showing a modification of the light-emitting device. [Figure 9] It is a cross-sectional view showing a modification of the light-emitting device. [Figure 10] It is a cross-sectional view showing a modification of the light-emitting device. [Figure 11] It is a cross-sectional view showing a modification of the light-emitting device. [Figure 12] It is a cross-sectional view showing the configuration of an electronic device including the light-emitting device. [Figure 13] It is a diagram with the protective member, covering member and integrated circuit removed from FIG. 18. [Figure 14] It is a diagram with the partition wall, second electrode, organic layer and insulating layer removed from FIG. 13. [Figure 15] It is a cross-sectional view taken along line B-B of FIG. 13. [Figure 16] It is a cross-sectional view taken along line C-C of FIG. 13. [Figure 17] It is a cross-sectional view taken along line D-D of FIG. 13. [Figure 18] It is a plan view showing the configuration of a light-emitting device according to Example 1. Mode for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are assigned to similar components, and the description thereof will be omitted as appropriate.

[0013] Figure 1 is a cross-sectional view showing the configuration of the light-emitting device 10 according to this embodiment, and Figure 2 is a plan view showing the configuration of the light-emitting device 10 according to this embodiment. Figure 1 is a cross-sectional view AA of Figure 2.

[0014] The light-emitting device 10 according to this embodiment comprises a substrate 100, a light-emitting section 140, a covering member 180, an integrated circuit 300, and a protective member 400. The light-emitting section 140 is formed on one surface (hereinafter also referred to as the "first surface") 101 of the substrate 100. The light-emitting section 140 also has a first electrode 110, an organic layer 120, and a second electrode 130. The covering member 180 covers the light-emitting section 140. The integrated circuit 300 is arranged on one surface 101 of the substrate 100. The integrated circuit 300 is electrically connected to at least one of the first electrode 110 and the second electrode 130. The protective member 400 is located in a first region 105 between the covering member 180 and the integrated circuit 300. The protective member 400 is also provided so as to expose the entire first surface 301 of the integrated circuit 300 that is opposite to the substrate 100. A detailed explanation follows below.

[0015] The substrate 100 of the light-emitting device 10 is formed of a translucent material such as glass or a translucent resin. However, if the light-emitting device 10 is a top-emission type as described later, the substrate 100 may be formed of a material that does not have translucency. The substrate 100 is a polygon, such as a rectangle. Here, the substrate 100 is flexible. The thickness of the substrate 100 is, for example, 10 μm or more and 1000 μm or less. In particular, if the substrate 100 is a flexible glass substrate, the thickness of the substrate 100 is, for example, 200 μm or less. When the substrate 100 is made flexible with a resin material, the material of the substrate 100 is formed by including, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. Also, when the substrate 100 contains a resin material, in order to suppress moisture from permeating through the substrate 100, SiN is added to at least the light-emitting surface (preferably both sides) of the substrate 100. x An inorganic barrier film such as silicon is formed.

[0016] A light-emitting section 140 is formed on the substrate 100. The light-emitting section 140 has a structure for generating light, such as an organic EL element. This organic EL element has a configuration in which a first electrode 110, an organic layer 120, and a second electrode 130 are stacked in this order.

[0017] The configuration of the light-emitting section 140 will be described in detail with reference to Figures 3 to 5. Figure 3 is a diagram obtained by removing the protective member 400, integrated circuit 300, covering member 180, and sealing film 190 from Figure 2. In this diagram, the integrated circuit 300 and covering member 180 are shown with dashed lines. Figure 4 is a diagram obtained by removing the second electrode 130 from Figure 3. Figure 5 is a diagram obtained by removing the insulating layer 150 and the organic layer 120 from Figure 4.

[0018] The first electrode 110 is a transparent electrode that is light-transmitting. The transparent conductive material constituting the transparent electrode is a metal-containing material, such as a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). The thickness of the first electrode 110 is, for example, 10 nm to 500 nm. The first electrode 110 is formed, for example, by sputtering or vapor deposition. The first electrode 110 may also be a carbon nanotube or a conductive organic material such as PEDOT / PSS.

[0019] The light-emitting device 10 further includes an insulating layer 150. The insulating layer 150 defines the light-emitting portion 140. The insulating layer 150 is formed of a photosensitive resin material such as polyimide, and surrounds the portion of the first electrode 110 that will become the light-emitting portion 140. A portion of the second electrode 130 is located on the insulating layer 150. Also, when viewed from a direction perpendicular to the substrate 100, a portion of the insulating layer 150 extends beyond the second electrode 130.

[0020] The second electrode 130 includes a metal layer made of a metal selected from a first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from this first group. In this case, the second electrode 130 has light-shielding properties. The thickness of the second electrode 130 is, for example, 10 nm to 500 nm. However, the second electrode 130 may be formed using the material exemplified as the material for the first electrode 110. The second electrode 130 is formed, for example, by sputtering or vapor deposition.

[0021] The materials of the first electrode 110 and the second electrode 130 described above are examples for the case where light passes through the substrate 100, that is, when light is emitted from the light-emitting device 10 through the substrate 100 (i.e., bottom emission type). In other cases, light may pass through the opposite side of the substrate 100. That is, when light is emitted from the light-emitting device 10 without passing through the substrate 100 (i.e., top emission type). In the top emission type, one of two types of stacked structures can be adopted: inverted stacking type and forward stacking type. In the inverted stacking type, the materials of the first electrode 110 and the second electrode 130 are reversed compared to the bottom emission type. That is, the material of the first electrode 110 is the same as the material of the second electrode 130 described above, and the material of the second electrode 130 is the same as the material of the first electrode 110 described above. In the other type of sequential deposition, the material for the first electrode 110 is formed on top of the material for the second electrode 130 described above, and then an organic layer 120 is formed on top of that, and then a thin film of the second electrode 130 is formed on top of that, so that light is extracted from the side opposite to the substrate 100. The material to be thinly deposited is, for example, the material exemplified as the material for the second electrode 130 or an MgAg alloy. When formed with Al or Ag, the thickness of the second electrode 130 is preferably 30 nm or less. The light-emitting device 10 according to this embodiment may have either a bottom emission type or one of the two top emission types described above.

[0022] The organic layer 120 has a structure in which, for example, a hole injection layer, an emissive layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the emissive layer. An electron transport layer may also be formed between the emissive layer and the electron injection layer. The organic layer 120 may be formed by vapor deposition. At least one layer of the organic layer 120, for example, the layer in contact with the first electrode, may be formed by a coating method such as inkjet, printing, or spraying. In this case, the remaining layers of the organic layer 120 are formed by vapor deposition. Alternatively, all layers of the organic layer 120 may be formed using a coating method.

[0023] The light-emitting portion 140 is sealed by a sealing film 190 (see Figure 1). The sealing film 190 is formed on at least the surface of the substrate 100 on which the light-emitting portion 140 is formed, and covers the light-emitting portion 140. However, the first terminal 112 and the second terminal 132, which will be described later, are not covered by the sealing film 190. The sealing film 190 is formed of, for example, an insulating material, and more specifically, an inorganic material such as aluminum oxide or titanium oxide. The thickness of the sealing film 190 is preferably 300 nm or less. The thickness of the sealing film 190 is, for example, 50 nm or more.

[0024] The sealing film 190 is formed, for example, using the ALD (Atomic Layer Deposition) method. In this case, the step coverage of the sealing film 190 is improved. In this case, the sealing film 190 may also have a multilayer structure in which multiple layers are stacked. In this case, it may have a structure in which a first sealing layer made of a first material (e.g., aluminum oxide) and a second sealing layer made of a second material (e.g., titanium oxide) are repeatedly stacked. The bottom layer may be either the first sealing layer or the second sealing layer. The top layer may also be either the first sealing layer or the second sealing layer. Furthermore, the sealing film 190 may be a single layer in which the first material and the second material are mixed.

[0025] However, the sealing film 190 may be formed using other film formation methods, such as CVD or sputtering. In this case, the sealing film 190 is formed of an insulating film such as SiO2 or SiN, and its thickness is, for example, 10 nm to 1000 nm.

[0026] Furthermore, a covering member 180 is provided on top of the sealing film 190 to further protect the sealing film 190. The covering member 180 is formed using an epoxy or acrylic resin. The covering member 180 may or may not have a sealing function.

[0027] The covering member 180 may be formed using, for example, translucent glass or resin. In that case, the covering member 180 is a polygon or circle similar to the substrate 100 and is fixed to the light-emitting part 140 via an adhesive layer. The covering member 180 may also have a shape with a recess in the center. In this case, the edges of the covering member 180 are fixed to the substrate 100 with adhesive. This seals the space enclosed by the covering member 180 and the substrate 100. The light-emitting part 140 is then located within this sealed space. The sealing film 190 is not required.

[0028] Furthermore, a desiccant may be placed in the space sealed by the covering member 180. The desiccant contains, for example, a drying agent such as CaO or BaO. For example, the desiccant is fixed to the surface of the covering member 180 that faces the substrate 100.

[0029] Furthermore, the light-emitting device 10 is further provided with terminals formed on the first surface 101 of the substrate 100 and electrically connected to the first electrode 110 or the second electrode 130. The terminals are connected to the integrated circuit 300. In the example shown in this figure, the light-emitting device 10 includes a first terminal 112, a first lead wire 114, a second terminal 132, and a second lead wire 134. The first terminal 112 and the second terminal 132 are the terminals described above. The first terminal 112, the first lead wire 114, the second terminal 132, and the second lead wire 134 are all formed on the same surface of the substrate 100 as the light-emitting part 140. The first terminal 112 and the second terminal 132 are located outside the covering member 180. The first lead wire 114 connects the first terminal 112 to the first electrode 110, and the second lead wire 134 connects the second terminal 132 to the second electrode 130. In other words, both the first lead wire 114 and the second lead wire 134 extend from the inside to the outside of the covering member 180.

[0030] The first terminal 112, the second terminal 132, the first lead wire 114, and the second lead wire 134 each have a layer formed of the same material as the first electrode 110. Furthermore, at least one portion of the first terminal 112, the second terminal 132, the first lead wire 114, and the second lead wire 134 may have a metal film (not shown) with lower resistance than the first electrode 110 on this layer. This metal film does not need to be formed on all of the first terminal 112, the second terminal 132, the first lead wire 114, and the second lead wire 134. The layers of the first terminal 112, the first lead wire 114, the second terminal 132, and the second lead wire 134 that are formed of the same material as the first electrode 110 are formed using the same process as the first electrode 110. Therefore, the first electrode 110 is integrated with at least a portion of the layer of the first terminal 112. Furthermore, if these have a metal film, the light transmittance of the first terminal 112, the first lead wire 114, the second terminal 132, and the second lead wire 134 will be lower than the light transmittance of the substrate 100.

[0031] Returning to Figure 1, the integrated circuit 300 has a plurality of electrodes 305 on the surface facing the substrate 100. The plurality of electrodes 305 include the positive and negative terminals of the integrated circuit 300. The first terminal 112 and the second terminal 132 and the electrodes 305 of the integrated circuit 300 are electrically connected via an anisotropic conductive resin layer 310. The anisotropic conductive resin layer 310 has a structure in which a plurality of conductive particles are mixed in an insulating resin. The conductive particles are, for example, metal particles, but they may also be formed by depositing a metal such as gold on the surface of insulating particles such as resin particles. The first terminal 112 is connected to the positive terminal of the integrated circuit 300, and the second terminal 132 is connected to the negative terminal of the integrated circuit 300, so that the first terminal 112 and the second terminal 132 can conduct electricity with the integrated circuit 300. The integrated circuit 300 is fixed to the substrate 100 via the anisotropic conductive resin layer 310.

[0032] When the light-emitting device 10 has multiple light-emitting units 140, one first lead wire 114 and one second lead wire 134 are formed for each light-emitting unit 140. All of the multiple first lead wires 114 are connected to the same first terminal 112, and all of the multiple second lead wires 134 are connected to the same second terminal 132. However, one first lead wire 114 and one second lead wire 134 may be formed for each of the multiple light-emitting units 140. In this case, one first lead wire 114 may be connected to each first terminal 112, and one second lead wire 134 may be connected to each second terminal 132.

[0033] The integrated circuit 300 is, for example, a semiconductor integrated circuit (IC) and functions as a control circuit for the light-emitting unit 140. The integrated circuit 300 is fixed such that its second surface 302, opposite to the first surface 301, faces the first surface 101 of the substrate 100. The shape and size of the integrated circuit 300 are not particularly limited, but for example, the height h from the first surface 101 of the substrate 100 to the first surface 181 of the covering member 180 opposite to the substrate 100. C The height h is the distance from the first surface 101 of the substrate 100 to the first surface 301 of the integrated circuit 300 on the opposite side of the substrate 100. ICIt is lower. The integrated circuit 300 has multiple electrodes 305, which, as described above, are electrically connected to terminals (first terminal 112, second terminal 132) connected to the first electrode 110 or the second electrode 130.

[0034] The light-emitting device 10 may have a plurality of integrated circuits 300 on the first surface 101 of the substrate 100. In that case, the protective members 400 are provided in the region between the integrated circuits 300 and the covering member 180.

[0035] As described above, the protective member 400 is located in the first region 105 between the covering member 180 and the integrated circuit 300. Preferably, the protective member 400 covers at least the entirety of the substrate 100 in the first region 105. The protective member 400 may also further cover at least a portion of the first surface 181 of the covering member 180 that is opposite to the substrate 100. Furthermore, the protective member 400 may further cover a portion of the substrate 100 other than the first region 105.

[0036] Figures 6 and 7 are plan views showing examples of the positional relationship between the covering member 180 and the integrated circuit 300. The first region 105 will be described with reference to Figures 6 and 7. In the example shown, the main component of the integrated circuit 300 (for example, an inorganic material such as silicon) and the covering member 180 are rectangular when viewed from a direction perpendicular to the substrate. Note that the integrated circuit 300 may also have leads in addition to the main component. The first region 105 can be described as a rectangular region with two opposing sides: the portion 304 of the side of the integrated circuit 300 that faces the covering member 180, and the portion 184 of the side of the covering member 180 that faces the integrated circuit 300, when viewed from a direction perpendicular to the substrate 100. Figure 6 shows an example where the entire side surface 303 of the integrated circuit 300 faces the side surface 183 of the covering member 180, and Figure 7 shows an example where only a part of the side surface 303 faces the side surface 183 of the covering member 180.

[0037] Furthermore, as shown in Figure 7, if only a portion of the side surface 303 faces the side surface 183 of the covering member 180, it is preferable that the protective member 400 covers the entire second region 106 in addition to the first region 105. Here, the second region 106 is a rectangular region adjacent to the first region 105. Also, one side of the second region 106 is one side of the first region 105 perpendicular to the side surface 303 of the integrated circuit 300, and the other side of the second region 106 is a line connecting one corner of the integrated circuit 300 to the end of the portion 304.

[0038] The protective member 400 is made of, for example, an epoxy or acrylic resin. The protective member 400 can be formed by applying a resin material and allowing it to solidify after fixing the covering member 180 and the integrated circuit 300 to the first surface 101 of the substrate 100. It is preferable that the protective member 400 has appropriate elasticity and flexibility in its solidified state.

[0039] In the light-emitting device 10 according to this embodiment, the protective member 400 covers the first region 105 of the first surface 101 of the substrate 100, thereby reducing the stress concentrated in the first region 105 of the substrate 100 when the substrate 100 is bent, and preventing cracks from occurring in the substrate 100. Therefore, the durability of the light-emitting device 10 can be improved.

[0040] Returning to Figure 1, the protective member 400 will be further described. Preferably, the protective member 400 is in contact with at least one side surface 303 perpendicular to the first surface 301 of the integrated circuit 300. Also, the height from the first surface 101 of the substrate 100 to the first surface 301 of the integrated circuit 300 is h IC In this case, the protective member 400 is located on the side surface 303 of the integrated circuit 300, from the first surface 101 of the substrate 100 to h IC It is more preferable that the area up to a height of 2 is covered. This would further reduce the stress concentrated in the first region 105 of the substrate 100 when the substrate 100 is curved, thereby improving the durability of the light-emitting device 10.

[0041] On the other hand, the protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300 that is opposite to the substrate 100. This prevents the overall thickness of the light-emitting device 10 from increasing due to the light-emitting section 140. Here, it is preferable that the first surface 301 of the integrated circuit 300 has water-repellent properties. Specifically, it is preferable that the contact angle of the first surface 301 of the integrated circuit 300 with respect to water be 90° or more, and more preferably 150° or more. For example, water-repellency can be imparted to the first surface 301 by applying a water-repellent treatment or a water-repellent coating to the surface of the integrated circuit 300. In this case, when the protective member 400 is formed by a coating method, the first surface 301 of the integrated circuit 300 will repel the resin material. Therefore, the light-emitting device 10 can be efficiently manufactured while preventing the first surface 301 from being covered by the protective member 400. The side surface 303 of the integrated circuit 300 may or may not have water-repellent properties.

[0042] Preferably, the protective member 400 is in contact with the first surface 101 of the substrate 100 over the entire first region 105. However, if a coating layer or the like is formed on the first surface 101 of the substrate 100 in the first region 105, the protective member 400 does not need to be in contact with the first surface 101 of the substrate 100.

[0043] Figures 8 to 11 are cross-sectional views showing modified examples of the light-emitting device 10. Figures 8 to 11 correspond to Figure 1. In the example of Figure 8, the surface of the protective member 400 is convex toward the opposite side from the first surface 101 of the light-emitting device 10. The protective member 400 covers at least a portion of the first surface 181 of the covering member 180.

[0044] In the example shown in Figure 9, the surface of the protective member 400 is concave toward the side opposite to the first surface 101 of the light-emitting device 10. Furthermore, the protective member 400 does not cover either the first surface 301 of the integrated circuit 300 or the first surface 181 of the covering member 180.

[0045] In the example shown in Figure 10, the protective member 400 covers only a portion of the side surface 303 of the integrated circuit 300. In this example, the protective member 400 covers the side surface 303 of the integrated circuit 300 from the first surface 101 of the substrate 100 to h IC It covers an area up to a height of at least / 2.

[0046] In the example shown in Figure 11, the protective member 400 covers only a portion of the side surface 183 of the covering member 180. Also, the protective member 400 covers only a portion of the side surface 303 of the integrated circuit 300. In this example, the protective member 400 covers the side surface 183 of the covering member 180 from the first surface 101 to the h of the substrate 100. C It covers at least an area up to a height of / 2, and of the side surface 303 of the integrated circuit 300, from the first surface 101 of the substrate 100 to h IC It covers an area up to a height of at least / 2.

[0047] As shown in these variations, the shape of the protective member 400 may vary depending on the viscosity and amount of resin material used to form the protective member 400, the wettability of the surfaces of the integrated circuit 300 and the covering member 180, and so on.

[0048] In these modified examples, the protective member 400 covers the first region 105 of the first surface 101 of the substrate 100, thereby reducing the stress concentrated in the first region 105 of the substrate 100 when the substrate 100 is bent, and preventing cracks from occurring in the substrate 100. Therefore, the durability of the light-emitting device 10 can be improved.

[0049] A method for manufacturing the light-emitting device 10 is described below. This manufacturing method includes the steps of forming a light-emitting section 140, providing an integrated circuit 300 on the first surface 101 of the substrate 100, covering the light-emitting section 140 with a covering member 180, and forming a protective member 400. In the step of forming the light-emitting section 140, a light-emitting section 140 having a first electrode 110, an organic layer 120, and a second electrode 130 is formed on the first surface 101 of the substrate 100. In the step of providing the integrated circuit 300, the integrated circuit 300 is electrically connected to at least one of the first electrode 110 and the second electrode 130. In the step of forming the protective member 400, the protective member is formed in the first region 105 between the covering member 180 and the integrated circuit 300. Furthermore, in the step of forming the protective member 400, the protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300 opposite to the substrate 100. This will be explained in detail below.

[0050] First, a first electrode 110 is formed on the first surface 101 of the substrate 100. In this process, a first terminal 112 and a second terminal 132 are also formed. Next, an insulating layer 150, an organic layer 120, and a second electrode 130 are formed in this order (the process of forming the light-emitting part 140).

[0051] Next, an anisotropic conductive resin layer 310 is formed on the first surface 101 of the substrate 100, in the area including the first terminal 112 and the second terminal 132, where the integrated circuit 300 is to be placed. Then, the integrated circuit 300 is placed and fixed on the first surface 101 of the substrate 100 via the anisotropic conductive resin layer 310. At this time, the first terminal 112 and the second terminal 132 are electrically connected to the electrodes 305 of the integrated circuit 300 via a plurality of conductive particles (step of providing the integrated circuit 300). Note that the conductivity of the anisotropic conductive resin layer 310 in the direction parallel to the substrate 100 is low, so the first terminal 112 and the second terminal 132 do not short-circuit.

[0052] Next, a sealing film 190 and a covering member 180 are formed on the first surface 101 of the substrate 100 so as to cover the light-emitting part 140 (covering step).

[0053] Next, a resin material for forming a protective member 400 is applied to the first region 105 between the covering member 180 and the integrated circuit 300 and allowed to solidify (step for forming the protective member 400). The resin material can be applied only to the desired region using, for example, a dispenser.

[0054] Furthermore, after the step of providing the integrated circuit 300 and before the step of forming the protective member 400, the process may include a step of applying a water-repellent treatment to at least the first surface 301 of the integrated circuit 300. In this way, the first surface 301 of the integrated circuit 300 repels the resin material, allowing for efficient manufacturing of the light-emitting device 10 while preventing the first surface 301 from being covered by the protective member 400.

[0055] The light-emitting device 10 can be used not only when the substrate 100 is flat, but also when at least a portion of the substrate 100 is curved. Furthermore, in the light-emitting device 10, the substrate 100 may be fixed in a state in which at least a portion is curved.

[0056] Figure 12 is a cross-sectional view showing the configuration of an electronic device 50 equipped with a light-emitting device 10. In the electronic device 50, at least a portion of the substrate 100 is curved. The electronic device 50 includes a fixing member 510, and the light-emitting device 10 is fixed to the fixing member 510 with the substrate 100 in a curved state. The electronic device 50 is, for example, an advertising board, a portable terminal (including a wearable terminal), etc.

[0057] As described above, according to this embodiment, a protective member 400 is provided in the first region 105 between the covering member 180 and the integrated circuit 300. Therefore, when the substrate 100 is bent, the stress concentrated in the first region 105 of the substrate 100 can be reduced, and cracks or the like can be prevented from occurring in the substrate 100. Thus, the durability of the light-emitting device 10 can be improved.

[0058] Furthermore, the protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300, which is opposite to the substrate 100. Therefore, it is possible to avoid increasing the overall thickness of the light-emitting device 10 due to the light-emitting section 140.

[0059] (Example 1) Figure 18 is a plan view showing the configuration of the light-emitting device 10 according to Embodiment 1. The light-emitting device 10 according to this embodiment is the same as the light-emitting device 10 according to the embodiment, except for the points described below. Figure 13 is a view obtained by removing the protective member 400, the covering member 180, and the integrated circuit 300 from Figure 18. In this figure, the covering member 180 and the integrated circuit 300 are shown with dashed lines. Figure 14 is a view obtained by removing the partition wall 170, the second electrode 130, the organic layer 120, and the insulating layer 150 from Figure 13. Figure 15 is a cross-sectional view of Figure 13 BB, Figure 16 is a cross-sectional view of Figure 13 CC, and Figure 17 is a cross-sectional view of Figure 13 DD. However, in Figures 15 to 17, the sealing film 190 and the covering member 180 are omitted.

[0060] The light-emitting device 10 according to this embodiment is a display and includes a substrate 100, a first electrode 110, a light-emitting section 140, an insulating layer 150, a plurality of openings 152, a plurality of openings 154, a plurality of first lead wires 114, an organic layer 120, a second electrode 130, a plurality of second lead wires 134, and a plurality of partition walls 170.

[0061] The first electrode 110 extends in a line in the first direction (the Y direction in Figure 13). The end of the first electrode 110 is connected to the first lead wire 114.

[0062] The first lead wire 114 is a wire that connects the first electrode 110 to the first terminal 112. In the example shown in this figure, one end of the first lead wire 114 is connected to the first electrode 110, and the other end of the first lead wire 114 is the first terminal 112. A conductor layer 182 is formed on the first terminal 112 and on the first lead wire 114. The conductor layer 182 is formed using a metal with lower resistance than the first electrode 110, such as Al or Ag. A portion of the first lead wire 114 is covered by an insulating layer 150.

[0063] As shown in Figures 13 and 15-17, the insulating layer 150 is formed on and between the multiple first electrodes 110. Multiple openings 152 and multiple openings 154 are formed in the insulating layer 150. Multiple second electrodes 130 extend parallel to each other in a direction intersecting the first electrodes 110 (for example, a perpendicular direction: the X direction in Figure 13). A partition wall 170, which will be described in detail later, extends between the multiple second electrodes 130. The openings 152 are located at the intersections of the first electrodes 110 and the second electrodes 130 in a plan view. Specifically, the multiple openings 152 are aligned in the direction in which the first electrodes 110 extend (the Y direction in Figure 13). Also, the multiple openings 152 are aligned in the direction in which the second electrodes 130 extend (the X direction in Figure 13). Therefore, the multiple openings 152 are arranged to form a matrix.

[0064] The opening 154 is located in a region that overlaps with one end of each of the multiple second electrodes 130 in a plan view. The opening 154 is also positioned along one side of the matrix formed by the opening 152. When viewed in the direction along this side (for example, the Y direction in Figure 13, i.e., the direction along the first electrode 110), the openings 154 are positioned at predetermined intervals. A portion of the second lead wiring 134 is exposed through the opening 154. The second lead wiring 134 is connected to the second electrode 130 via the opening 154.

[0065] The second lead wire 134 is a wire that connects the second electrode 130 to the second terminal 132, and has a layer made of the same material as the first electrode 110. One end of the second lead wire 134 is located below the opening 154, and the other end of the second lead wire 134 is led out to the outside of the insulating layer 150. In the example shown in this figure, the other end of the second lead wire 134 is the second terminal 132. A portion of the second lead wire 134 is covered by the insulating layer 150.

[0066] An organic layer 120 is formed in the region overlapping with the aperture 152. The hole injection layer of the organic layer 120 is in contact with the first electrode 110, and the electron injection layer of the organic layer 120 is in contact with the second electrode 130. Therefore, the light-emitting portion 140 is located in each of the regions overlapping with the aperture 152.

[0067] In the examples shown in Figures 15 and 16, each layer constituting the organic layer 120 extends beyond the opening 152. As shown in Figure 13, the organic layer 120 may or may not be formed continuously between adjacent openings 152 in the direction in which the partition wall 170 extends. However, as shown in Figure 17, the organic layer 120 is not formed in the opening 154.

[0068] As shown in Figures 13, 15-17, the second electrode 130 extends in a second direction (the X direction in Figure 13) that intersects the first direction. A partition wall 170 is formed between adjacent second electrodes 130. The partition wall 170 extends parallel to the second electrode 130, i.e., in the second direction. The substrate of the partition wall 170 is, for example, an insulating layer 150. The partition wall 170 is a photosensitive resin, such as a polyimide resin, and is formed into a desired pattern by exposure and development. The partition wall 170 may also be made of a resin other than a polyimide resin, such as an epoxy resin, an acrylic resin, or an inorganic material such as silicon dioxide.

[0069] The partition wall 170 has a cross-section that is an inverted trapezoid. That is, the width of the upper surface of the partition wall 170 is greater than the width of the lower surface of the partition wall 170. Therefore, if the partition wall 170 is formed in front of the second electrode 130, multiple second electrodes 130 can be formed at once by forming the second electrode 130 on one side of the substrate 100 using a vapor deposition method or a sputtering method. In addition, the partition wall 170 also has the function of dividing the organic layer 120.

[0070] Next, the method for manufacturing the light-emitting device 10 in this embodiment will be described. The method for manufacturing the light-emitting device 10 in this embodiment is the same as the method for manufacturing the light-emitting device 10 in the embodiment, except for the step of forming the light-emitting part 140. First, the first electrode 110, the first lead wiring 114, and the second lead wiring 134 are formed on the substrate 100. The method for forming these is the same as the method for forming the first electrode 110 in the embodiment.

[0071] Next, an insulating layer 150 is formed, followed by a partition wall 170. Then, an organic layer 120 and a second electrode 130 are formed.

[0072] Then, in the same manner as in the embodiment, the steps of providing the integrated circuit 300, covering it, and forming the protective member 400 are carried out.

[0073] In this embodiment, similar to the previous embodiment, a protective member 400 is provided in the first region 105 between the covering member 180 and the integrated circuit 300. Therefore, when the substrate 100 is bent, the stress concentrated in the first region 105 of the substrate 100 is reduced, preventing cracks from occurring in the substrate 100. Thus, the durability of the light-emitting device 10 can be improved.

[0074] Furthermore, the protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300, which is opposite to the substrate 100. Therefore, it is possible to avoid increasing the overall thickness of the light-emitting device 10 due to the light-emitting section 140.

[0075] The embodiments and examples described above with reference to the drawings are illustrative examples of the present invention, and various other configurations can also be adopted.

Claims

[Claim 1] circuit board and A light-emitting portion is formed on one side of the substrate and has a first electrode, an organic layer, and a second electrode, A covering member that covers the light-emitting portion, An integrated circuit is arranged on one of the aforementioned surfaces and electrically connected to at least one of the first electrode and the second electrode, A protective member located in the region between the covering member and the integrated circuit is provided, The protective member is a light-emitting device provided so as to expose the entire first surface of the integrated circuit opposite to the substrate.

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