Electronic component manufacturing equipment, and electronic component manufacturing method

Abstract

To provide a manufacturing apparatus capable of producing electronic components with improved quality. [Solution] The manufacturing apparatus 1 comprises a spray mechanism 50, a jig 60, and an adhesive sheet 70. The jig 60 has a work surface 61 provided with a nozzle 61a from which gas 51 sent from the spray mechanism 50 is blown out. The adhesive sheet 70 has a first main surface 70a including a workpiece holding area 70a1 that adhesively holds a workpiece 101, which is a precursor of an electronic component, and a second main surface 70b located on the opposite side of the first main surface 70a. The work surface 61 includes an adhesive sheet attachment area 62 to which the second main surface 70b is attached. The nozzle 61a is formed within the adhesive sheet attachment area 62. The manufacturing apparatus 1 is configured to allow the adhesive sheet 70 to be peeled off the work surface 61 by blowing gas 51 sent from the spray mechanism 50 through the nozzle 61a while the workpiece 101 is adhesively held on the first main surface 70a.

Description

Technical Field

[0001] The present disclosure relates to an electronic component manufacturing apparatus and an electronic component manufacturing method.

Background Art

[0002] For example, in the electronic component manufacturing apparatus disclosed in Japanese Patent Laid-Open No. 4-282813 (Patent Document 1), ceramic green sheets are laminated on a working surface of a jig, thereby forming a laminated body that is a precursor of an electronic component on the working surface. The laminated body is adhered to the working surface by the adhesive force of the ceramic green sheets constituting the laminated body. After the laminated body is peeled off from the working surface, it undergoes processes such as a pressing step and a firing step, whereby a desired electronic component is obtained.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] If no countermeasure is taken when peeling the laminated body adhered to the working surface from the working surface, a considerable load is applied to the laminated body, and the load causes distortion in the laminated body, which may impair the quality of the electronic component. This problem can similarly occur when peeling the pressure-sensitive adhesive sheet from the working surface in a case where the pressure-sensitive adhesive sheet is interposed between the laminated body and the working surface.

[0005] Accordingly, the present disclosure has been made to solve the above-mentioned problem, and an object of the present disclosure is to provide a manufacturing apparatus and a manufacturing method capable of manufacturing electronic components with improved quality.

Means for Solving the Problem

[0006] An electronic component manufacturing apparatus according to this disclosure comprises a spray mechanism, a jig, and an adhesive sheet. The jig has a work surface provided with a nozzle from which gas sent from the spray mechanism is blown out. The adhesive sheet has a first main surface including a workpiece holding area for adhesively holding a workpiece that is a precursor of an electronic component, and a second main surface located on the opposite side of the first main surface. The work surface includes an adhesive sheet application area to which the second main surface is attached. The nozzle is formed within the adhesive sheet application area. The electronic component manufacturing apparatus according to this disclosure is configured to allow the adhesive sheet to be peeled off the work surface by blowing the gas sent from the spray mechanism out of the nozzle while the workpiece is adhesively held on the first main surface.

[0007] The electronic component manufacturing apparatus based on the above disclosure may further include a removal mechanism for peeling off the adhesive sheet that has been peeled off from the work surface while simultaneously peeling it away from the workpiece.

[0008] In the electronic component manufacturing apparatus based on the above disclosure, a sealing member may be provided on the work surface to surround the adhesive sheet and seal the space between the periphery of the adhesive sheet and the work surface.

[0009] The electronic component manufacturing apparatus based on the above disclosure may further include a pressing mechanism that presses the workpiece from the side opposite to the adhesive sheet when the gas is being blown out from the ejection hole.

[0010] In the electronic component manufacturing apparatus based on the above disclosure, the ejection holes may be formed in a position that does not overlap with the workpiece holding area when viewed along the direction normal to the work surface.

[0011] In the electronic component manufacturing apparatus based on the above disclosure, the workpiece may be a laminate formed by stacking ceramic green sheets.

[0012] A method for manufacturing an electronic component according to this disclosure comprises the steps of: attaching an adhesive sheet having a first main surface and a second main surface located on the opposite side of the first main surface to the work surface of a jig having a work surface provided with ejection holes, from the side of the second main surface; forming a laminate by laminating a ceramic green sheet on the first main surface of the adhesive sheet attached to the work surface; and peeling the adhesive sheet that is adhering to the laminate from the work surface by blowing gas from the ejection holes.

[0013] The method for manufacturing an electronic component based on the above disclosure may further include a step of peeling off the adhesive sheet that has been peeled off from the work surface while peeling it off from the laminate. [Effects of the Invention]

[0014] According to this disclosure, it is possible to provide a manufacturing apparatus and a manufacturing method capable of producing electronic components with improved quality. [Brief explanation of the drawing]

[0015] [Figure 1] This is a perspective view showing the appearance of a multilayer ceramic capacitor. [Figure 2] Figure 1 is a schematic cross-sectional view of a multilayer ceramic capacitor. [Figure 3] This is a schematic diagram showing an electronic component manufacturing apparatus according to an embodiment. [Figure 4] Figure 3 is a schematic front view showing an enlarged view of the vicinity of the jig. [Figure 5] Figure 3 is a schematic plan view showing an enlarged view of the area near the jig. [Figure 6] Figure 3 is a schematic bottom view showing an enlarged view of the area near the jig. [Figure 7] Figure 3 is a flowchart illustrating a method for manufacturing electronic components using the electronic component manufacturing equipment shown. [Figure 8] Figure 7 is a schematic cross-sectional view showing step S3. [Figure 9] Figure 7 is a schematic cross-sectional view showing step S3. [Figure 10] It is a schematic cross-sectional view showing step S4 shown in Fig. 7.

Mode for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the embodiments described below, a manufacturing apparatus and a manufacturing method for manufacturing a multilayer ceramic capacitor as an electronic component are exemplified. Note that the electronic component manufacturing apparatus and manufacturing method according to the embodiments described below are also applicable to manufacturing apparatuses and manufacturing methods for multilayer ceramic inductors, multilayer ceramic thermistors, and the like.

[0017] In the embodiments described below, identical or common portions are denoted by the same reference symbols in the drawings, and description thereof will not be repeated. In the drawings, L represents the length direction of the element body, W represents the width direction of the element body, and H represents the lamination direction of the element body. The element body will be described in detail later.

[0018] (Embodiment) <A. Configuration of Electronic Component> Fig. 1 is a perspective view showing the external appearance of a multilayer ceramic capacitor. Fig. 2 is a schematic cross-sectional view of the multilayer ceramic capacitor taken along line II-II in Fig. 1. First, with reference to Fig. 1 and Fig. 2, the configuration of a multilayer ceramic capacitor 100 as an electronic component manufactured by the electronic component manufacturing apparatus 1 according to an embodiment of the present invention will be described.

[0019] As shown in Fig. 1 and Fig. 2, the multilayer ceramic capacitor 100 includes an element body 110. The element body 110 has a substantially rectangular parallelepiped shape. Specifically, the element body 110 has a regular square prism shape. The element body 110 has a first main surface 110a and a second main surface 110b, a first side surface 110c and a second side surface 110d, and a first end surface 110e and a second end surface 110f. Note that the term "substantially rectangular parallelepiped" includes rectangular parallelepipeds with chamfered corners or ridges, and rectangular parallelepipeds with rounded corners or ridges.

[0020] Each of the first main surface 110a and the second main surface 110b extends along the length direction L and the width direction W. The first main surface 110a and the second main surface 110b are parallel to each other. Each of the first side surface 110c and the second side surface 110d extends along the length direction L and the stacking direction H. The first side surface 110c and the second side surface 110d are parallel to each other. Each of the first end surface 110e and the second end surface 110f extends along the width direction W and the stacking direction H. The first end surface 110e and the second end surface 110f are parallel to each other.

[0021] The base body 110 is made of a material mainly composed of dielectric ceramics. Specific examples of dielectric ceramics include, for example, BaTiO3, CaTiO3, SrTiO3, or CaZrO3. The base body 110 may also have at least one minor component, such as a Mn compound, Mg compound, Si compound, Co compound, Ni compound, or rare earth compound, added as appropriate.

[0022] As shown in Figure 2, the base body 110 consists of a dielectric layer and includes a first outer layer 115a with a first main surface 110a, a second outer layer 115b with a dielectric layer and including a second main surface 110b, and a plurality of internal electrode layers 111, 112 that are alternately stacked with the dielectric layer between the first outer layer 115a and the second outer layer 115b.

[0023] In this embodiment, the dielectric layer constituting the first outer layer 115a and the dielectric layer constituting the second outer layer 115b are substantially the same ceramic material system. Substantially the same ceramic material system means that the mixing ratio of the raw ceramic materials is substantially the same, and the range of variation in ceramic composition due to variations in mixing ratio and processing steps is included in substantially the same ceramic material system.

[0024] Inside the element body 110, internal electrode layers 111 and internal electrode layers 112 are alternately laminated along the lamination direction H. Each of the plurality of internal electrode layers 111 and 112 is provided in parallel to the length direction L and the width direction W. A dielectric layer 115 is disposed between the internal electrode layer 111 and the internal electrode layer 112 that are adjacent to each other in the lamination direction H. That is, the internal electrode layer 111 and the internal electrode layer 112 that are adjacent to each other in the lamination direction H face each other with the dielectric layer 115 interposed therebetween.

[0025] The internal electrode layer 111 is led out to a first end face 110e. The first end face 110e is covered with an external electrode 113. The external electrode 113 is electrically connected to the internal electrode layer 111. The internal electrode layer 112 is led out to a second end face 110f. The second end face 110f is covered with an external electrode 114. The external electrode 114 is electrically connected to the internal electrode layer 112.

[0026] The internal electrode layers 111 and 112 are made of a magnetic material such as Ni. The external electrodes 113 and 114 are made of a suitable conductive material such as Ni, Cu, Ag, Pd, Au, or an Ag-Pd alloy, for example.

[0027] The element body 110 includes an inner layer portion C. The inner layer portion C has a capacitance because the portions of the internal electrode layers 112 facing adjacent internal electrode layers 111 in the lamination direction H and the portions of the internal electrode layers 111 facing adjacent internal electrode layers 112 in the lamination direction H are laminated in the lamination direction H.

[0028] <B. Schematic Configuration of Electronic Component Manufacturing Apparatus> FIG. 3 is a schematic diagram showing an electronic component manufacturing apparatus according to an embodiment. FIG. 4 is an enlarged schematic front view of a vicinity portion of the jig shown in FIG. 3. FIG. 5 is a schematic plan view of a vicinity portion of the jig viewed from the direction of arrow V shown in FIG. 4. FIG. 6 is a schematic bottom view of a vicinity portion of the jig viewed from the direction of arrow VI shown in FIG. 4. Hereinafter, a schematic configuration of the electronic component manufacturing apparatus 1 according to the present embodiment will be described with reference to FIGS. 3 to 6.

[0029] As shown in Figure 3, the manufacturing apparatus 1 mainly comprises a supply roller 11, a winding roller 12, a plurality of driven rollers 13, a stage 14, a cutting mechanism 15, and a transfer mechanism 16.

[0030] A sheet-like member 20 having a long roll shape is wound around the supply roller 11. The sheet-like member 20 is composed of a carrier film 21 made of polyethylene terephthalate (PET) and a ceramic green sheet 22 backed on the carrier film 21.

[0031] The ceramic green sheet 22 is formed from a paste made by kneading dielectric particles and a binder that softens with heat. Known materials can be used as the ceramic green sheet 22. The ceramic green sheet 22 is broadly divided into two types: one with an internal electrode pattern printed on it, and one without an internal electrode pattern printed on it. The internal electrode pattern is formed from a conductive paste made by kneading conductive powder, a solvent, a binder, and ceramic powder. Known materials can be used as the conductive paste.

[0032] The sheet-like member 20 is wound up by the winding roller 12. This transports the sheet-like member 20 from the supply roller 11 towards the winding roller 12. Multiple driven rollers 13 are provided between the supply roller 11 and the winding roller 12. The sheet-like member 20 is placed on the driven rollers 13.

[0033] A stage 14 is positioned at a predetermined location between the supply roller 11 and the winding roller 12. The sheet-like member 20 is fed from the supply roller 11 towards the winding roller 12 such that a portion of the sheet-like member 20 lies along the surface of the stage 14. The carrier film 21 of the sheet-like member 20 faces the stage 14. The ceramic green sheet 22 of the sheet-like member 20 is located on the opposite side from the stage 14 when viewed from the carrier film 21.

[0034] A cutting mechanism 15 is positioned opposite the stage 14, at a predetermined distance from the stage 14. The cutting mechanism 15 is configured to be movable so that its tip approaches and moves away from the surface of the stage 14. The cutting mechanism 15 is used to cut the ceramic green sheet 22 from the sheet-like member 20 into a rectangular shape. The configuration of the cutting mechanism 15 is not particularly limited and may be composed of, for example, a cutting blade.

[0035] A transfer mechanism 16 is positioned downstream of the cutting mechanism 15 in the transport direction of the sheet-like member 20. The transfer mechanism 16 moves the ceramic green sheet 22, which has been cut by the cutting mechanism 15, from the stage 14 onto the work surface 61 of the jig 60. The jig 60 will be described in detail later.

[0036] The transfer mechanism 16 has a head portion 16a configured to hold the ceramic green sheet 22. The method of holding the ceramic green sheet 22 by the head portion 16a is not particularly limited. The head portion 16a may be configured to hold the ceramic green sheet 22 by, for example, suction force, or by adhesive force.

[0037] As shown in Figures 3 to 6, and in Figures 8 and 10 described later, the manufacturing apparatus 1 further comprises a spraying mechanism 50, a jig 60, an adhesive sheet 70, a pressing mechanism 90, and a removal mechanism 95.

[0038] The injection mechanism 50 is a source of gas 51. The injection mechanism 50 is filled with, for example, compressed air. The injection mechanism 50 is composed of, for example, a cylinder to which a nozzle is attached. Note that the gas 51 is not limited to air, but may be an inert gas such as argon, for example.

[0039] The jig 60 is a plate-shaped member having a roughly rectangular shape in plan view. The thickness dimension of the jig 60 is, for example, 0.1 mm to 5 mm. The shape of the jig 60 is not particularly limited to a plate shape and can be changed as appropriate. The material of the jig 60 may be, for example, SUS, aluminum, or various resins such as acrylic resin. The jig 60 may be subjected to surface treatments such as nitriding, fluorine coating, or DLC (Diamond-Like Carbon) coating.

[0040] The jig 60 includes a work surface 61. The work surface 61 is provided with ejection holes 61a from which gas 51 delivered from the injection mechanism 50 is blown out. In this embodiment, four ejection holes 61a that penetrate the jig 60 are provided on the work surface 61. Specifically, when the work surface 61 is viewed from above, one ejection hole 61a is located at each of the four corners of the work surface 61. The ejection holes 61a have a substantially circular shape when viewed from above.

[0041] The number of ejection holes 61a may be one or more than four. The plan view shape of the ejection holes 61a can be changed as appropriate.

[0042] The adhesive sheet 70 has a base layer 71 and an adhesive layer 72 provided on one of the main surfaces of the base layer 71 (see Figure 8). Thus, the first main surface 70a, which is one of the pair of main surfaces of the adhesive sheet 70, is made up of the base layer 71. The second main surface 70b, which is the other of the pair of main surfaces of the adhesive sheet 70, is made up of the adhesive layer 72. Preferably, the in-plane size of the adhesive sheet 70 is larger than the in-plane size of the ceramic green sheet 22 laminated on the adhesive sheet 70.

[0043] The base layer 71 may be made of, for example, a PET film. The adhesive layer 72 may be made of a known adhesive substance. The adhesive sheet 70 is not limited to being made only of the base layer 71 and the adhesive layer 72, and may have another layer in addition to the base layer 71 and the adhesive layer 72.

[0044] The work surface 61 includes an adhesive sheet attachment area 62 to which the second main surface 70b of the adhesive sheet 70 is attached. In other words, the adhesive sheet 70 is attached and fixed to the adhesive sheet attachment area 62 of the work surface 61 by the adhesive force of the adhesive layer 72. By fixing the adhesive sheet 70 to the work surface 61 in this way, it is possible to prevent in-plane displacement of the adhesive sheet 70 and the laminate 101 placed on it with respect to the work surface 61.

[0045] The first main surface 70a of the adhesive sheet 70 includes a workpiece holding region 70a1 that adhesively holds the laminate 101 (see Figure 4) as the workpiece to be processed.

[0046] The laminate 101 is formed by stacking multiple ceramic green sheets 22 on a workpiece holding area 70a1. The number of ceramic green sheets 22 constituting the laminate 101 is, for example, between 100 and 10,000. The ceramic green sheets 22 constituting the laminate 101 include two types: those with the internal electrode pattern printed on them and those without the internal electrode pattern printed on them. The laminate 101 corresponds to a precursor of the multilayer ceramic capacitor 100.

[0047] The four ejection holes 61a described above are formed within the adhesive sheet application area 62 (see Figure 6 in particular). Furthermore, the four ejection holes 61a are formed in positions that do not overlap with the workpiece holding area 70a1 when viewed along the direction normal to the work surface 61.

[0048] A sealing member 80 is positioned on the work surface 61 so as to surround the in-plane peripheral edge of the adhesive sheet 70. The sealing member 80 seals the space between the peripheral edge of the adhesive sheet 70 and the work surface 61. The material of the sealing member 80 is not particularly limited, but for example, silicone rubber or nitrile rubber can be used.

[0049] The pressing mechanism 90 has a plate-shaped portion. When the gas 51 is blown out from the ejection hole 61a, the pressing mechanism 90 abuts against the main surface of the pair of main surfaces in the lamination direction of the laminated body 101 that is located on the opposite side to the pressure-sensitive adhesive sheet 70 side. Accordingly, the pressing mechanism 90 presses the laminated body 101 from the side opposite to the pressure-sensitive adhesive sheet 70 side. It should be noted that the specific shape of the pressing mechanism 90 can be appropriately changed as needed.

[0050] The removing mechanism 95 (see FIG. 10) is used to roll and peel the pressure-sensitive adhesive sheet 70 peeled from the work surface 61 off the laminated body 101. The removing mechanism 95 is constituted by, for example, a chuck or the like, but is not particularly limited thereto, and may be any configuration as long as it can grip the pressure-sensitive adhesive sheet 70.

[0051] <C. Flow of Manufacturing Electronic Component> FIG. 7 is a flow diagram showing a method for manufacturing an electronic component using the electronic component manufacturing apparatus shown in FIG. 3. FIGS. 8 to 10 are schematic cross-sectional views illustrating each step shown in FIG. 7. Next, with reference to FIGS. 7 to 10 and FIG. 3 described above, a series of flow until an electronic component is manufactured using the electronic component manufacturing apparatus 1 according to the present embodiment will be described. Here, in FIGS. 8 to 10, cross-sections of the jig 60, the pressure-sensitive adhesive sheet 70, the seal member 80, the pressing mechanism 90, and the laminated body 101 at a position corresponding to the line VIII-VIII shown in FIG. 6 are illustrated.

[0052] First, as shown in FIG. 7, the pressure-sensitive adhesive sheet 70 is attached to the work surface 61 of the jig 60 from the second main surface 70b side (step S1). The peripheral edge of the pressure-sensitive adhesive sheet 70 in the in-plane direction is surrounded by the seal member 80 arranged in advance on the work surface 61.

[0053] Next, ceramic green sheets 22 are laminated on the first main surface 70a of the pressure-sensitive adhesive sheet 70, thereby forming the laminated body 101 (step S2). Step S2 further includes the following steps S21 to S23.

[0054] First, the conveying of the sheet-like member 20 is initiated (step S21). Specifically, the winding roller 12 is driven, causing the sheet-like member 20 to be conveyed from the supply roller 11 towards the winding roller 12. The ceramic green sheet 22 contained in the sheet-like member 20 being conveyed here does not have an internal electrode pattern formed on it.

[0055] Next, the ceramic green sheet 22 is cut (step S22). Specifically, the cutting mechanism 15 moves so that its tip approaches the stage 14. As a result, the ceramic green sheet 22 is cut in a rectangular shape from the sheet-like member 20 located on the stage 14.

[0056] Next, the cut ceramic green sheet 22 is transferred onto the adhesive sheet 70 (step S23). Specifically, the transfer mechanism 16 is driven to transfer the ceramic green sheet 22, which has been cut by the cutting mechanism 15, from the stage 14 onto the workpiece holding area 70a1 of the adhesive sheet 70 attached to the work surface 61.

[0057] After the ceramic green sheet 22 is cut by the cutting mechanism 15, the carrier film 21 is sequentially recovered by the winding roller 12.

[0058] The steps S21 to S23 described above are repeated. As a result, a predetermined number of ceramic green sheets 22, which do not have an internal electrode pattern formed on them, are stacked on the adhesive sheet 70.

[0059] Next, the ceramic green sheets 22 included in the conveyed sheet-like member 20 are changed to those with an internal electrode pattern formed on them. After this change, the same process as steps S21 to S23 described above is repeated. As a result, a predetermined number of ceramic green sheets 22 with internal electrode patterns formed on them are stacked on the adhesive sheet 70 (more specifically, on top of multiple ceramic green sheets 22 that do not have an internal electrode pattern formed on them).

[0060] Next, the ceramic green sheets 22 included in the conveyed sheet-like member 20 are replaced with those that do not have an internal electrode pattern formed on them. After this replacement, the same process as steps S21 to S23 described above is repeated. As a result, a predetermined number of ceramic green sheets 22 without an internal electrode pattern are stacked on the adhesive sheet 70 (more specifically, on top of multiple ceramic green sheets 22 that have an internal electrode pattern formed on them).

[0061] As a result, as shown in Figure 8, the laminate 101 is formed on the workpiece holding area 70a1 of the adhesive sheet 70.

[0062] Here, the multiple ceramic green sheets 22 constituting the laminate 101 are fixed to each other by the adhesive force inherent in the ceramic green sheets 22 themselves. Among the multiple ceramic green sheets 22, the ceramic green sheet 22 that is in contact with the adhesive sheet 70 is fixed to the adhesive sheet 70 by the adhesive force inherent in the ceramic green sheet 22 itself.

[0063] Next, the adhesive sheet 70 is peeled off the work surface 61 by blowing gas 51 from the ejection holes 61a of the work surface 61 (step S3).

[0064] In detail, as shown in Figure 8, first, the pressing mechanism 90 presses down on the laminate 101, which is held in place by adhesive adhesion to the first main surface 70a of the adhesive sheet 70, from the side opposite to the adhesive sheet 70. In this state, the injection mechanism 50 sends gas 51 toward the injection hole 61a. As a result, the gas 51 is blown out from the injection hole 61a.

[0065] The gas 51 ejected from the nozzle 61a enters the gap between the working surface 61 of the jig 60 and the second main surface 70b of the adhesive sheet 70, which are in close contact with each other. As a result of the gas 51 entering the space between the working surface 61 and the second main surface 70b, the adhesive sheet 70 is smoothly peeled off from the working surface 61, as shown in Figure 9.

[0066] Next, the adhesive sheet 70 is peeled off from the laminate 101 (step S4). Specifically, as shown in Figure 10, the removal mechanism 95 grips the end of the adhesive sheet 70 that has been peeled off from the work surface 61. In this state, the removal mechanism 95 peels off the adhesive sheet 70 from the laminate 101 by peeling it up.

[0067] Next, the laminate 101 is compressed to form a dielectric block (step S5). Specifically, the laminate 101 is pressed in the lamination direction by a hydrostatic press or a rigid press to form a dielectric block. At this time, the ceramic green sheets 22 are pressed at a predetermined temperature, causing them to adhere closely to each other. In addition, a ceramic green sheet 22 of a certain thickness is placed as the outermost layer in the lamination direction and pressed. This protects the ceramic green sheet 22 on which the internal electrode pattern is formed.

[0068] Next, the dielectric block is divided to form chips (step S6). Specifically, the dielectric block is divided into multiple chips by cutting, dicing, or laser cutting to form a matrix. When dividing the dielectric block, it may be heated and softened before division. The corners and edges of the chips may be rounded by barrel polishing or the like.

[0069] Next, the chip is fired (step S7). Specifically, the heating of the chip causes the dielectric material and conductive material contained in the chip to be fired, forming the base body 110. The firing temperature is preferably, for example, 900°C to 1300°C. The firing temperature is set appropriately in accordance with the dielectric material and conductive material.

[0070] Next, external electrodes are formed (step S8). Specifically, a paste containing Ni as a main component and a common material which is a dielectric material is applied to both end faces of the element body 110. As the application method, for example, a method may be adopted in which a paste layer serving as a base electrode layer is formed on a plate, and the end face of the element body 110 is immersed in the paste layer. After application, the element body 110 and the base electrode layer are integrally fired. The firing temperature is preferably, for example, 700°C or higher and 900°C or lower. After firing, plating is performed in the order of, for example, Ni plating and Sn plating. Electrolytic plating is preferable as the plating method.

[0071] Through the steps described above, the multilayer ceramic capacitor 100 can be manufactured.

[0072] <D. Summary> In the manufacturing apparatus 1 according to the present embodiment, as described above, when peeling the adhesive sheet 70 from the work surface 61, the gas 51 is blown out from the ejection holes 61a of the work surface 61 in a state where the laminated body 101 is adhesively held on the adhesive sheet 70. Thereby, the gas 51 enters the gap between the work surface 61 and the second main surface 70b of the adhesive sheet 70 that are in close contact with each other.

[0073] A load is applied from the gas 51 to the adhesive sheet 70 so as to peel the adhesive sheet 70 from the work surface 61. This makes it possible to smoothly peel the adhesive sheet 70 from the work surface 61 while minimizing the load applied to the laminated body 101 adhesively held by the adhesive sheet 70. As a result, when peeling the adhesive sheet 70 and the laminated body 101 from the work surface 61, the occurrence of distortion in the laminated body 101 can be effectively suppressed.

[0074] Therefore, with the configuration as described above, a manufacturing apparatus capable of manufacturing electronic components with improved quality can be provided.

[0075] Furthermore, in the manufacturing apparatus 1 according to this embodiment, as described above, when the gas 51 is being ejected from the ejection hole 61a, the laminate 101 is pressed down by the pressing mechanism 90 from the side opposite to the adhesive sheet 70.

[0076] By configuring it in this way, it is possible to effectively suppress the distortion that occurs in the laminate 101 due to the load applied from the gas 51.

[0077] Furthermore, in the manufacturing apparatus 1 according to this embodiment, as described above, the sealing member 80 is arranged on the work surface 61 so as to surround the adhesive sheet 70.

[0078] This configuration prevents the gas 51 that has entered the gap between the work surface 61 and the second main surface 70b of the adhesive sheet 70 from leaking out to the outside through the gap between the periphery of the adhesive sheet 70 and the work surface 61. As a result, the gas 51 can be distributed throughout the entire gap between the work surface 61 and the second main surface 70b.

[0079] Furthermore, in the manufacturing apparatus 1 according to this embodiment, as described above, the ejection holes 61a are formed in a position that does not overlap with the workpiece holding area 70a1 when viewed along the normal direction of the work surface 61.

[0080] This configuration further suppresses distortion in the laminate 101 when peeling the adhesive sheet 70 and the laminate 101 from the work surface 61. This is because the components positioned in a location that overlaps with the ejection holes 61a when viewed along the normal direction of the work surface 61 are easily subjected to loads due to the ejection of gas 51, while the laminate 101 is positioned in a location different from the location to which such loads are easily applied.

[0081] In the embodiment described above, when forming the laminate 101, the example given was that the sheets conveyed by the winding roller 12, etc., are appropriately changed between sheet-like members 20 including ceramic green sheets 22 with internal electrode patterns formed on them and sheet-like members 20 including ceramic green sheets 22 without internal electrode patterns formed on them. However, separate paths may be provided for conveying sheet-like members 20 including ceramic green sheets 22 with internal electrode patterns and for conveying sheet-like members 20 including ceramic green sheets 22 without internal electrode patterns.

[0082] Furthermore, although the above-described embodiment illustrates a case where the transfer mechanism 16 and the holding mechanism 90 are configured as separate components, the transfer mechanism 16 may also perform the function of the holding mechanism 90.

[0083] (Other forms, etc.) In the embodiments of the present disclosure described above, a multilayer ceramic capacitor was used as an example of an electronic component, and its manufacturing apparatus and manufacturing method were explained. However, the manufacturing apparatus and manufacturing method of the electronic component shown in this embodiment may also be applied to the manufacturing apparatus and manufacturing method of, for example, a multilayer ceramic inductor or a multilayer ceramic thermistor as an electronic component. When the electronic component is a multilayer ceramic inductor, for example, the dielectric is made of magnetic ceramic and the internal electrodes are made of coil-shaped conductors. When the electronic component is a multilayer ceramic thermistor, for example, the dielectric layer is made of semiconductor ceramic.

[0084] The characteristic configurations shown in the embodiments of this disclosure described above can, of course, be combined with each other without departing from the spirit of the present invention.

[0085] The embodiments disclosed herein are illustrative in all respects and not restrictive. The technical scope of the present invention is defined by the claims and includes all modifications within the meaning and scope equivalent to the claims. [Explanation of symbols]

[0086] 1 Manufacturing apparatus, 11 Supply roller, 12 Winding roller, 13 Driven roller, 14 Stage, 15 Cutting mechanism, 16 Transfer mechanism, 16a Head section, 20 Sheet-like material, 21 Carrier film, 22 Ceramic green sheet, 30 Sheet-like material, 50 Injection mechanism, 51 Gas, 60 Jig, 61 Working surface, 61a Injection hole, 62 Adhesive sheet application area, 70 Adhesive sheet, 70a First main surface, 70a1 Workpiece holding area, 70b Second main surface, 71 Base layer, 72 Adhesive layer, 80 Sealing member, 90 Pressing mechanism, 95 Removal mechanism, 100 Multilayer ceramic capacitor, 101 Laminate, 110 Base body section, 110a First main surface, 110b Second main surface, 110c First side surface, 110d Second side surface, 110e First end face, 110f Second end face, 111,112 Internal electrode layer, 113,114 External electrode, 115 Dielectric layer, 115a First outer layer, 115b Second outer layer.

Claims

1. Injection mechanism, A jig having a work surface provided with a nozzle from which gas sent out from the injection mechanism is blown out, The adhesive sheet comprises a first main surface including a workpiece holding region for adhesively holding a workpiece that is a precursor of an electronic component, and a second main surface located on the opposite side of the first main surface. The work surface includes an adhesive sheet application area to which the second main surface is attached. The ejection holes are formed within the adhesive sheet application area. An electronic component manufacturing apparatus configured such that, while the object to be processed is held in adhesive to the first main surface, the adhesive sheet can be peeled off the work surface by blowing out the gas delivered from the injection mechanism through the injection hole.

2. The electronic component manufacturing apparatus according to claim 1, further comprising a removal mechanism for peeling off the adhesive sheet that has been peeled off from the work surface while simultaneously peeling it away from the workpiece.

3. The electronic component manufacturing apparatus according to claim 1, wherein a sealing member is provided on the work surface that surrounds the adhesive sheet and seals the space between the periphery of the adhesive sheet and the work surface.

4. The electronic component manufacturing apparatus according to claim 1, further comprising a pressing mechanism for pressing the workpiece from the side opposite to the adhesive sheet side when the gas is being blown out from the ejection hole.

5. The electronic component manufacturing apparatus according to claim 1, wherein, when viewed along the normal direction of the work surface, the ejection holes are formed in a position that does not overlap with the workpiece holding area.

6. The apparatus for manufacturing electronic components according to any one of claims 1 to 5, wherein the workpiece is a laminate formed by stacking ceramic green sheets.

7. A step of attaching an adhesive sheet having a first main surface and a second main surface located on the opposite side of the first main surface to the work surface of a jig having a work surface provided with ejection holes, from the side of the second main surface, A step of forming a laminate by laminating a ceramic green sheet onto the first main surface of the adhesive sheet attached to the work surface, A method for manufacturing an electronic component, comprising the step of peeling off the adhesive sheet that is adhering to the laminate from the work surface by blowing gas from the ejection hole.

8. The method for manufacturing an electronic component according to claim 7, further comprising the step of peeling off the adhesive sheet that has been peeled off from the work surface from the laminate.

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