Transport arm, substrate processing device

Abstract

A thin transport arm is provided for transporting warped circuit boards. [Solution] The transport arms 1, 1a-1i comprise an upper surface 2, a lower surface 4 facing the upper surface 2 and having a groove 3 formed thereon, a cover member 5 attached to the lower surface 4 and covering the groove 3, mounting portions 6, 6a formed by cutting out the upper surface 2 or the lower surface 4, and suction pads P, P1, P2 placed on the mounting portions 6, 6a. The mounting portions 6, 6a have openings H2 that communicate with the groove 3, and the suction pads P, P1, P2 have a suction hole H1, a small diameter portion 8 placed on the mounting portions 6, 6a, and a large diameter portion 7 connected to the small diameter portion 8.

Description

[Technical Field]

[0001] The present invention relates to a transfer arm and a substrate processing apparatus used for transferring substrates. [Background Art]

[0002] Substrates such as semiconductor wafers and glass substrates have some unevenness within the substrate surface. Such unevenness is formed, for example, by warpage caused by heating the substrate.

[0003] Warpage of a substrate tends to increase as various types of substrate processing are repeated. Furthermore, even in a single processing step, if the load applied to the substrate is large, the warpage within the substrate surface tends to increase. For example, examples of various substrate processing include the manufacturing process of semiconductor elements. Furthermore, in a film formation step or an ion implantation step among the manufacturing processes of semiconductor elements, when substrate processing is performed by heating the substrate to a high temperature, the load applied to the substrate is large, and the warpage of the substrate becomes particularly significant. Furthermore, as the substrate becomes thinner, the warpage of the substrate becomes even greater.

[0004] In transfer robots, an elastically deformable suction pad made of silicone rubber or synthetic resin is attached to the tip of the transfer arm to transfer warped substrates. Patent Document 1 discloses an example of such a transfer arm.

[0005] The transfer arm disclosed in Patent Document 1 includes a suction pad having a two-layer structure that supports the back surface of a substrate at three points. The large-diameter first layer that is in contact with the back surface of the substrate is made of a conductive material. The small-diameter second layer that supports the first layer is made of a soft deformable material that has lower rigidity than the first layer. Further, the suction pad has a suction hole penetrating the first layer and the second layer. Such a suction pad is fixed to the upper surface of the transfer arm. [Prior Art Documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2022-113985 [Overview of the project] [Problems that the invention aims to solve]

[0007] In mass production equipment, circuit boards are stored in cassettes. Each cassette has multiple shelves arranged vertically. One circuit board is stored in each shelf. When removing a circuit board from a cassette, a transport arm is inserted between the boards. The transport arm is then raised to transfer the circuit board onto it. After the transfer is complete, the transport arm is withdrawn, and the circuit board is removed from the cassette. When loading circuit boards into a cassette, the transport arm operates in the reverse order of when removing circuit boards.

[0008] The spacing between shelves that store circuit boards is set according to the dimensions of the boards being stored. Generally, the larger the board, the wider the shelf spacing. These shelf spacings are set assuming that the boards are flat. Ideally, the distance between boards stored in a cassette is equal to the shelf spacing. However, if the boards are warped, the distance between them will change. Simply put, the greater the warping of the boards, the shorter the distance between them will be.

[0009] The transport arm described in Patent Document 1 has a suction pad fixed to the upper surface of the transport arm, resulting in a relatively large thickness for the transport arm. With such a transport arm, the warping of the substrate may increase, potentially hindering the transfer of the substrate between the cassette and the transport arm. To address the above issues, we provide a thin transport arm capable of transporting warped substrates. [Means for solving the problem]

[0010] The transport arm is Top surface and, Opposite to the aforementioned upper surface is a lower surface in which a groove is formed, A cover member attached to the lower surface and covering the groove, A mounting portion formed by cutting out the upper surface or the lower surface, a suction pad mounted on the mounting portion; an opening communicating with the groove is formed in the mounting portion, the suction pad comprises: a suction hole; a small diameter portion mounted on the mounting portion; and a large diameter portion connected to the small diameter portion. Effects of the Invention

[0011] A mounting portion is formed by notching an upper surface or a lower surface, and a suction pad is mounted thereon. Accordingly, since a part of the suction pad is disposed inside the transfer arm, thickness reduction of the transfer arm can be achieved. Furthermore, since the suction pad has the suction hole, the small diameter portion mounted on the mounting portion, and the large diameter portion connected to the small diameter portion, a warped substrate can be transferred. Brief Description of the Drawings

[0012] [Figure 1] Configuration diagram showing an example of a transfer arm [Figure 2] Perspective view showing an example of a suction pad [Figure 3] Cross-sectional view showing an example of a suction pad [Figure 4] Explanatory diagram regarding the distance between substrates stored in a cassette [Figure 5] Perspective view showing another example of a suction pad [Figure 6] Cross-sectional view showing another example of a transfer arm [Figure 7] Cross-sectional view showing still another example of a transfer arm [Figure 8] Cross-sectional view showing still another example of a transfer arm [Figure 9] Cross-sectional view showing still another example of a transfer arm [Figure 10] Cross-sectional view showing still another example of a transfer arm [Figure 11] Explanatory diagram regarding another fixing method for a suction pad [Figure 12] Cross-sectional view showing still another example of a transfer arm [Figure 13]Cross-sectional view showing another example of a transfer arm [Figure 14] Explanatory view of another configuration of a mounting portion [Figure 15] Plan view of the transfer arm shown in Fig. 14 viewed from another plane [Figure 16] Configuration diagram showing an example of a substrate transfer apparatus [Figure 17] Configuration diagram showing an example of the inside of an atmospheric transfer chamber Mode for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In all the drawings for explaining the embodiments, common components are denoted by the same reference numerals, and repeated description thereof is omitted. It should be noted that the following embodiments do not unreasonably limit the content of the present disclosure described in the claims. In addition, not all of the components shown in the embodiments are essential components of the present disclosure. Furthermore, each drawing is a schematic diagram and is not necessarily strictly illustrated.

[0014] Fig. 1 illustrates a transfer arm 1 used for supporting a substrate S in a transfer robot. The transfer arm 1 is used for transferring the substrate S in the atmosphere, and includes three suction pads P that support the back surface of the substrate S drawn by broken lines.

[0015] The transfer arm 1 includes an upper surface 2 and a lower surface facing the upper surface 2. The lower surface is located in the -W axis direction of the upper surface 2 and is not drawn in Fig. 1. The -W axis direction refers to the direction opposite to the W axis direction. The U axis, V axis, and W axis are all orthogonal to each other. For example, the transfer arm 1 is made of an aluminum material for the purpose of cost reduction and weight reduction. On the other hand, for the purpose of increasing rigidity, it may be made of a ceramic material.

[0016] A groove 3 drawn by an alternate long and short dash line is formed on the lower surface. This groove 3 is connected to each of the suction pads P. By evacuating the inside of the groove 3 with a vacuum pump (not shown), the back surface of the substrate S is sucked onto the suction pads P. It is not necessary for each suction pad P to be connected to a common groove 3. Each suction pad P may have its own independent groove. In this case, the adsorption of the substrate S by each suction pad P is controlled independently.

[0017] Figure 2 is a perspective view of the suction pad P. The suction pad P is a component with a first opening H1 (suction hole) formed in the center. The suction pad P has a small diameter section 8 and a large diameter section 7. The small diameter section 8 and the large diameter section 7 are typically composed of hollow columns of different diameters. The small-diameter section 8 and the large-diameter section 7 are connected to each other and constitute a single component. However, the small-diameter section 8 and the large-diameter section 7 may be manufactured as separate components and assembled together using adhesive, tape, or the like to form a single component.

[0018] In the W-axis direction, the thickness of the large-diameter portion 7 is thinner than that of the small-diameter portion 8. Also, in the V-axis and U-axis directions, the dimensions of the large-diameter portion 7 are larger than those of the small-diameter portion 8. By constructing the large-diameter portion 7 and the small-diameter portion 8 from the same material and maintaining the dimensional relationship between them as described here, the small-diameter portion 8 maintains the rigidity of the suction pad P, while the large-diameter portion 7 deforms to follow the warping of the substrate S. This enables the substrate S to be supported by the suction pad P.

[0019] Materials with excellent heat resistance, such as silicone rubber, fluororubber, polyimide resin, and epoxy resin, are used for the suction pad P. If the large-diameter portion 7 and the small-diameter portion 8 are made separately and then assembled later, the large-diameter portion 7 and the small-diameter portion 8 may be made of different materials. For example, the large-diameter portion 7 may be made of a more flexible material than the small-diameter portion 8. Alternatively, since the large-diameter portion 7 comes into direct contact with the substrate S, the large-diameter portion 7 may be made of a more heat-resistant material than the small-diameter portion 8.

[0020] Figure 3 is a cross-sectional view along the line A1-A1 shown in Figure 1. A cover member 5 is attached to the lower surface 4 in the -W-axis direction to cover the groove 3 formed in the lower surface 4. In the thickness direction of the conveying arm 1 (parallel to the W-axis direction), the conveying arm 1 has a mounting portion 6 between the upper surface 2 and the lower surface 4. This mounting portion 6 is formed by cutting out the upper surface 2. A second opening H2 is formed in the mounting portion 6, which communicates with the groove 3 in the lower surface 4. In the configuration example shown in Figure 3, the extension direction of the second opening H2 is along the W axis, but the extension direction of the second opening H2 may also be in a direction that intersects the W axis at an angle.

[0021] The small-diameter portion 8 of the suction pad P is placed on the mounting portion 6. The small-diameter portion 8 of the suction pad P is fixed to the mounting portion 6 using adhesive or double-sided tape. When fixing the small-diameter portion 8, the center position of the first opening H1 formed in the suction pad P and the center position of the second opening H2 formed in the mounting portion 6 are aligned. In the example configuration shown in Figure 3, the diameters of the first opening H1 and the second opening H2 are the same, but their diameters may be different.

[0022] The portion above the dashed line B drawn on the suction pad P is the large-diameter portion 7 as described in Figure 2. The portion below the dashed line B is the small-diameter portion 8 as described in Figure 2. After attaching the suction pad P to the mounting portion 6, vacuum is drawn through the groove 3 formed on the lower surface 4, enabling the substrate S to be adsorbed through the second opening H2 formed in the mounting portion 6 and the first opening H1 formed in the suction pad P.

[0023] Figure 4 shows how the circuit board S is stored in the cassette 17. The cassette 17 has multiple shelves arranged in the vertical direction (parallel to the W-axis direction). The distance L3 between shelves is determined according to the dimensions of the circuit board S. If the circuit board S is flat, the distance Lx between boards is equal to the distance L3 between shelves. However, if the circuit board S warps significantly due to factors such as thinning of the circuit board S or the load on the circuit board processing, the distance Lx between boards changes.

[0024] When loading and unloading circuit boards S from cassette 17, the transport arm 1 moves in and out between the circuit boards as shown in Figure 4. In this case, if the distance Lx between the circuit boards becomes small, a transport arm with a conventional thickness may have difficulty loading and unloading the circuit boards S. In the transport arm 1 shown in Figure 3, a notch is cut out from the top surface 2 to form a mounting section 6, and the suction pad P is placed on the mounting section 6. As a result, a portion of the suction pad P is positioned inside the transport arm 1, which allows the transport arm 1 to be made thinner and can accommodate small substrate distances Lx.

[0025] Furthermore, in the conventional configuration where the suction pad P is attached to the upper surface 2, the attachment position of the suction pad P becomes uncertain. On the other hand, as shown in Figure 3, by cutting out the upper surface 2 and providing a mounting section 6, the approximate attachment position of the suction pad P becomes clear.

[0026] As shown in Figure 3, the distance between the large-diameter section 7 and the bottom surface 4 is the thickness dimension L1 of the conveying arm 1. The thickness dimension L1 of the conveying arm 1 will be explained with a specific example. If the substrate S being handled is an 8-inch wafer, the shelf distance L3 shown in Figure 4 will be 6.35 mm. Considering that the wafer handling in a high-temperature ion implanter used in the semiconductor device manufacturing process will have a warp of approximately 0.5 mm, the shortest distance between substrates will be 5.35 mm. Taking into account vibrations during substrate transport by the transport arm 1 and distortion of the transport arm 1, the thickness dimension L1 of the transport arm 1 should be 3.85 mm or less. More preferably, taking into account other factors related to substrate transport and the transport stability of the substrate S, the thickness dimension L1 of the transport arm 1 should be 3 mm or less within a range where rigidity can be ensured, and the dimension L2 protruding from the upper surface 2 of the suction pad P should be 0.3 mm or more.

[0027] The suction pad P described in Figure 1-3 had a configuration in which both the large-diameter section 7 and the small-diameter section 8 formed a columnar body. This configuration is just one example, and the suction pad P1 shown in Figure 5 may also be used. Figure 5 shows a perspective view of the suction pad P1. The suction pad P1 has a large-diameter section 7a and a small-diameter section 8, similar to that shown in Figure 3. Unlike the columnar body in Figure 3, the large-diameter section 7a is a member that has a conical section CS that slopes upward from the small-diameter section 8.

[0028] The large-diameter portion 7a has a flat portion E parallel to the UV plane around the first opening H1. Outside of the flat portion E, the large-diameter portion 7a is inclined diagonally upward. The outside of the flat portion E is the side opposite to the first opening H1 when viewed from the flat portion E. Furthermore, the diagonally upward direction has a component in the W axis direction and is the direction away from the small-diameter portion 8. The configuration of the large-diameter portion 7a and the small-diameter portion 8 is roughly funnel-shaped, which increases the contact area between the large-diameter portion 7a and the substrate S during suction compared to the suction pad P shown in Figure 3. As a result, substrate support by the large-diameter portion 7a becomes more reliable.

[0029] Figure 6 shows a cross-sectional view of a transport arm 1a equipped with the suction pad P1 shown in Figure 5. The configuration of this transport arm 1a, excluding the suction pad P1, is the same as that of the transport arm 1 shown in Figure 3. The suction pad P1 has a large-diameter portion 7a with a conical portion CS that slopes upward from a small-diameter portion 8. The tip of the conical portion CS in the large-diameter portion 7a defines the thickness dimension L1 of the transport arm 1a and the protrusion dimension L2 from the upper surface 2.

[0030] The transport arm 1a shown in Figure 6, like the transport arm 1 shown in Figure 3, allows for a thinner transport arm and enables the transport of warped substrates. In addition, the transport arms 1b-1i shown in Figures 7-15 allow for thinner transport arms and the transport of warped substrates.

[0031] In the transport arm 1b shown in Figure 7, the mounting section 6 is equipped with a movement-restricting section 9. In Figure 7, the movement-restricting section 9 is a cylindrical portion formed at the end of the mounting section 6 on the second opening H2 side.

[0032] The suction pad P1 is placed on the mounting section 6 and fixed in place. At this time, there is a concern that the suction pad P1 may shift position and partially block the second opening H2. However, by providing a movement restricting section 9 on the mounting section 6 that restricts the movement of the small-diameter section 8 toward the second opening H2, the concern that the suction pad P1 will partially block the second opening H2 can be eliminated. Furthermore, when using adhesive to place the suction pad P1 on the mounting section 6, providing the movement restricting section 9 can also prevent the adhesive from flowing into the second opening H2.

[0033] In the transport arms 1, 1a, and 1b shown in Figures 3, 6, and 7, the large-diameter sections 7 and 7a are positioned higher than the upper surface 2. On the other hand, in the transport arm 1c shown in Figure 8, a portion of the large-diameter sections 7 and 7a is positioned lower than the upper surface 2 of the transport arm 1. Note that "higher than the upper surface 2" means positioned on the W-axis side of the upper surface 2. In the transport arm 1c shown in Figure 8, when the substrate S is supported by the suction pad P1, the large-diameter portion 7a may interfere with the upper surface 2 when it moves downward, potentially restricting the movement of the large-diameter portion 7a. For this reason, in terms of transport stability of the substrate S, it is desirable for the entire large-diameter portion 7, 7a to be positioned higher than the upper surface 2.

[0034] In the transport arm 1d shown in Figure 9, the configuration of the mounting section 6 and the small-diameter section 8 placed thereon differs from previous configuration examples. In the transport arm 1d shown in Figure 9, the mounting section 6 is inclined with respect to the upper surface 2, and the shape of the mounting section 6 is generally mortar-shaped. The lower surface of the small-diameter section 8 is also inclined to match the shape of the mounting section 6.

[0035] By shaping the mounting portion 6 and the small-diameter portion 8 as shown in Figure 9, when the suction pad P1 is placed on the mounting portion 6, the small-diameter portion 8 slides on the mounting portion 6, and the suction pad P1 is placed in the predetermined position. This makes it easy to align the suction pad P1 on the mounting portion 6. Furthermore, in the configuration example in Figure 9, because the mounting portion 6 is inclined, the entire mounting portion 6 becomes a movement restricting portion 9 that restricts the movement of the small-diameter portion 8 in the direction of the second opening H2.

[0036] In the configuration example shown in Figure 9, the mounting section 6 is inclined diagonally downward toward the second opening H2. Conversely, as shown in the transport arm 1e in Figure 10, the mounting section 6 may be inclined diagonally upward toward the second opening H2. Also, as in the configuration example shown in Figure 9, the shape of the lower surface of the small diameter section 8 matches the shape of the mounting section 6.

[0037] In the configuration example shown in Figure 10, as in the configuration example shown in Figure 9, the mounting section 6 is inclined, so the entire mounting section 6 becomes the movement-restricting area 9. When fixing the suction pad P with adhesive, the configuration example shown in Figure 10 can also prevent the adhesive from flowing into the second opening H2. Furthermore, if the entire lower surface of the small-diameter portion 8 is not fixed to the mounting portion 6, the shape of the lower surface of the small-diameter portion 8 may be different from the shape of the mounting portion 6.

[0038] Figures 1-10 illustrate a configuration in which the suction pads P and P1 are fixed to the mounting section 6 using adhesive or double-sided tape. However, the suction pads P and P1 may also be fixed to the mounting section 6 using methods other than adhesive or double-sided tape.

[0039] For example, the small-diameter portion 8 and the mounting portion 6 are threaded, and the suction pads P and P1 are fixed to the mounting portion 6 by screwing them together. Alternatively, the suction pads P and P1 placed on the mounting section 6 may be fixed in a location separate from the mounting section 6.

[0040] Figure 11 shows a plan view of the transport arm 1f when the suction pads P and P1 are removed. As shown in the figure, for example, the shape of the mounting section 6 is made elliptical in plan view. The upper surface 2 of the transport arm 1e is cut out from the upper surface 2 to the mounting section 6 so as to conform to the elliptical shape of the mounting section 6.

[0041] As in previous examples, the small diameter portion 8 of the suction pads P and P1 is made to be a perfect circle in plan view. When fixing the suction pads P and P1, the small diameter portion 8 of the suction pads P and P1 is pressed along the shape of the mounting portion 6 and placed on the mounting portion 6. After the suction pads P and P1 are placed on the mounting portion 6, the pressure on the small diameter portion 8 is released. As a result, when the small diameter portion 8 returns to its original shape, the suction pads P and P1 are fixed to the wall surface of the transport arm 1f which is in a direction parallel to the U axis.

[0042] In the cross-sectional view of the transport arms 1 and 1a-1f, the mounting section 6 is shown as a straight line, but it may be formed as a curved shape. Alternatively, it may be formed in a stepped shape, as shown in the transport arm 1g in Figure 12.

[0043] In previous embodiments, the mounting portion 6 was formed by cutting out the upper surface 2. Conversely, the mounting portion 6 may also be formed by cutting out the lower surface 4. In the transport arm 1h shown in Figure 13, the mounting portion 6 is formed by cutting out the lower surface 4, and a second opening H2 is formed in the mounting portion 6. In this case, a part of the suction pad P2 is placed inside the second opening H2. To secure the suction pad P2, a flange that rests on the mounting portion 6 is provided on the small diameter portion 8. The flange portion is fixed to the mounting portion 6 using adhesive or double-sided tape. Alternatively, the flange portion may be fixed to the mounting portion 6 using fasteners such as screws.

[0044] The mounting portion 6 can be formed by cutting out the upper surface 2 or the lower surface 4, and can have various configurations. Typically, a counterbore is provided from the upper surface 2 toward the lower surface 4, or from the lower surface 4 toward the upper surface 2. These counterbore holes form the mounting portion 6 and the second opening H2. Alternatively, a mounting portion 6a with a large area, as shown in Figures 14 and 15, may be formed.

[0045] Figure 14 is a plan view of the transport arm 1i in the UV plane. Figure 15 is a plan view of the transport arm 1i in the VW plane. In Figures 14 and 15, the entire tip of the transport arm 1i is cut out to form a mounting section 6a that is one level lower than the upper surface 2.

[0046] The transport arms 1, 1a-1i described above can be used in various devices for transporting substrates S in the atmosphere. More preferably, they are used in transport robots in substrate processing devices that perform film deposition and ion implantation processes in the manufacturing process of semiconductor devices, for transporting substrates after they have been heated to a high temperature and removed to the atmosphere. Figure 16 shows an example of a substrate processing device D, illustrating the configuration around the processing chamber of an ion implantation device.

[0047] Cassettes 17a-17d contain multiple substrates S. Substrates S are circular in plan view, made of materials such as silicon carbide, silicon, or gallium oxide. A circular in plan view substrate is one that is roughly circular when viewed from the substrate surface on which ion implantation is performed, and includes substrates with notches or orientation flats formed at the edges of the substrate surface.

[0048] The transport robots 14a and 14b remove the substrate S from the cassettes 17a-17d and transport it to the aligner 15. After the circumferential position of the substrate S is adjusted in the aligner 15, the transport robots 14a and 14b transport the substrate S to the load lock chambers 13a and 13b. These transport robots 14a and 14b have one of the transport arms 1, 1a-1i as described in Figures 1-15.

[0049] The load lock chambers 13a and 13b enable the transport of the substrate S between the processing chamber 11, which has a different vacuum level, and the atmospheric transport chamber 19, where the aligner 15 is located, by switching the vacuum level inside the chamber. The floors of the load lock chambers 13a and 13b move along the Y-axis direction by a drive mechanism (not shown). For example, when transporting the substrate S to the processing chamber 11, the floors of the load lock chambers 13a and 13b move after the environment inside the load lock chambers 13a and 13b is switched from air to a vacuum.

[0050] For example, in a high-temperature ion implantation apparatus, the substrate S is transported in the following order as the transport path for the substrate S: air transport chamber 19, load lock chamber 13a, platen 12, load lock chamber 13b, and air transport chamber 19. The load lock chamber 13a is equipped with a heater for preheating the substrate S. The platen 12 is equipped with either an electrostatic chuck or a mechanical clamping mechanism, or both, for supporting the substrate S. The platen 12 is equipped with a heater for raising the temperature of the substrate S, which has been preheated in the load lock chamber 13a, to a predetermined temperature.

[0051] The substrate S, supported on a platen 12 in the processing chamber 11, is scanned back and forth across an ion beam transported to the processing chamber 11 by an implantation mechanism unit (not shown). The back and forth scanning of the substrate S irradiates the entire surface of the substrate S with the ion beam, thereby performing ion implantation on the substrate S.

[0052] Once the substrate processing in processing room 11 is complete, the substrate S is collected into one of the cassettes 17a-17d via the load lock room 13b and the air transport room 19. Before transporting the substrate S to the atmospheric transport chamber 19, the substrate S is cooled in the load lock chamber 13b. Cooling of the substrate S is performed when the pressure inside the load lock chamber 13b is returned to atmospheric pressure. Specifically, cooling of the substrate S is performed by blowing nitrogen gas from one end of the load lock chamber 13b to the other. Alternatively, it may be performed by blowing nitrogen gas from vertically above the substrate S toward the substrate surface. To return to atmospheric pressure, it means to make the pressure inside the load lock chamber 13b equal to the pressure inside the atmospheric transport chamber 19 where the transport robots 14a, 14b, etc., are located.

[0053] The processing chamber 11 is equipped with vacuum hands V1 and V2 that can rotate independently in the direction of the arrows shown in the diagram. The vacuum hands V1 and V2 are equipped with gripping parts C1 and C2 that grip the periphery of the substrate S. For example, the vacuum hands V1 and V2 receive the substrate S from the load lock chambers 13a and 13b and transport it to the platen 12.

[0054] The cooled substrate S is transported from the load lock chamber 13b to the atmospheric transport chamber 19. The atmospheric transport chamber 19 is equipped with a base 16 for natural cooling of the substrate S prior to its placement in the cassettes 17a-17d. Figure 17 shows the internal configuration of the atmospheric transport chamber 19 as viewed from the line A2-A2 in Figure 16.

[0055] In Figure 17, a temperature measuring device 18 is positioned on the ceiling of the air transport chamber 19 where the aligner 15 and transport robots 14a and 14b are located. The temperature measuring device 18 is one or more infrared thermometers or thermal imaging cameras. The temperature measuring device 18 is used to measure the temperature of the substrate S on the base 16.

[0056] In the configuration example shown in Figure 17, the temperature measuring device 18 is located on the inner wall of the air transport chamber 19. However, to prevent contamination of the temperature measuring device 18 and to facilitate replacement and troubleshooting in case of malfunction, an infrared-transmitting window may be installed in the ceiling of the air transport chamber 19, and the temperature measuring device 18 may be placed outside the air transport chamber 19.

[0057] Based on the measurement results from the temperature measuring device 18, the transport robots 14a and 14b transport the substrate S from the base 16 to the cassettes 17a-17d.

[0058] By adopting a configuration in which the substrate S is cooled in the load lock chamber 13b after substrate processing in the processing chamber 11, it becomes possible to use inexpensive suction pads P, P1, and P2 with low heat resistance.

[0059] The configurations of the transport arms 1 and 1a-1i shown in each drawing may be rearranged as appropriate to construct a new transport arm. For example, in the configuration examples shown in Figures 7, 9, 10, and 12, the suction pad P1 shown in the diagram may be replaced with the suction pad P shown in Figure 3 to construct a new transport arm.

[0060] Furthermore, it goes without saying that the present invention is not limited to the embodiments described above, and various modifications are possible without departing from its spirit. [Explanation of Symbols]

[0061] 1, 1a-1i Transport Arm 2 Top surface 3 grooves 4 Bottom side 5 Cover component 6, 6a Mounting section 7, 7a Large diameter section 8 Small diameter section 9. Areas with restricted movement P, P1, P2 suction pads H1 1st opening (suction hole) H2 2nd opening CS cone region

Claims

1. Top surface and, Opposite to the aforementioned upper surface is a lower surface in which a groove is formed, A cover member attached to the lower surface and covering the groove, A mounting portion formed by cutting out the upper surface or the lower surface, The mounting portion includes a suction pad, The mounting portion has an opening that communicates with the groove, The aforementioned suction pad, Suction port, The small diameter portion placed on the mounting portion, A transport arm having a large diameter portion connected to the small diameter portion.

2. The conveying arm according to claim 1, wherein the large-diameter portion has a conical portion that is inclined upward from the small-diameter portion.

3. The conveying arm according to claim 1, wherein the large-diameter portion is located above the upper surface.

4. The transport arm according to claim 1, wherein a portion of the suction pad is located 0.3 mm or more above the upper surface.

5. The conveying arm according to claim 1, wherein the distance between the large diameter portion and the lower surface in the direction opposite to the upper surface and the lower surface is 3 mm or less.

6. The conveying arm according to claim 1, wherein the mounting portion has a movement-restricting portion that restricts the movement of the small-diameter portion toward the opening side.

7. A substrate processing apparatus that processes a substrate heated to a high temperature in a processing chamber under vacuum, and discharges the processed substrate into the atmosphere, A load lock chamber that switches the indoor atmosphere between air and vacuum, Adjacent to the aforementioned load lock chamber is an atmospheric transport chamber, the chamber being under atmospheric pressure, The aforementioned air transport chamber is equipped with a transport robot for transporting the substrate, A substrate processing apparatus comprising a transport robot having a transport arm according to any one of claims 1 to 6.

8. The substrate processing apparatus according to claim 7, wherein the substrate is cooled in the load lock chamber.

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