Light-emitting device and illumination device

Abstract

Reduces misalignment of electronic components relative to the circuit board. [Solution] The light-emitting device comprises a substrate, an electronic component, and a light-emitting element. The substrate has a first surface and a first electrode and a second electrode on the first surface side. The electronic component has a third electrode electrically connected to a first portion of the first electrode and a fourth electrode electrically connected to a second portion of the second electrode. The light-emitting element is electrically connected to the first electrode and the second electrode, respectively. When the direction in which the first portion and the second portion are aligned is defined as the first direction, the minimum width of the first portion in the first direction is less than or equal to the first width of the third electrode in the first direction.

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device and a lighting device.

Background Art

[0002] There is known a light-emitting device comprising a substrate, and a light-emitting element, an electronic component and a wavelength conversion member respectively located on a first surface side of the substrate (see, for example, the description in Patent Document 1).

[0003] In this light-emitting device, the substrate includes, on the first surface side, a pair of first electrodes, a pair of second electrodes, and a pair of connection conductor paths. A first one of the pair of first electrodes and a first one of the pair of second electrodes are connected by a first one of the pair of connection conductor paths. A second one of the pair of first electrodes and a second one of the pair of second electrodes are connected by a second one of the pair of connection conductor paths. The light-emitting element is electrically connected to the pair of first electrodes via brazing material, solder, or the like, and is supplied with electric power by the pair of first electrodes. The electronic component is electrically connected to the pair of second electrodes, thereby being electrically connected in parallel to the light-emitting element. The wavelength conversion member encapsulates the light-emitting element, and emits light having a wavelength different from that of excitation light to the outside of the light-emitting device in response to incidence of the excitation light emitted from the light-emitting element.

[0004] There is also known a lighting device including a mounting board on which one or more light-emitting devices or a plurality of light-emitting devices are mounted (see, for example, the description in Patent Document 1).

Prior Art Literature

Patent Literature

[0005]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0006] Regarding light-emitting devices and lighting devices, there is room for improvement in reducing the misalignment of electronic components relative to the substrate. [Means for solving the problem]

[0007] Light-emitting devices and illumination devices are disclosed.

[0008] One embodiment of a light-emitting device comprises a substrate, an electronic component, and a light-emitting element. The substrate has a first surface and a first electrode and a second electrode on the first surface side. The electronic component has a third electrode electrically connected to a first portion of the first electrode and a fourth electrode electrically connected to a second portion of the second electrode. The light-emitting element is electrically connected to the first electrode and the second electrode, respectively. When the direction in which the first portion and the second portion are aligned is defined as the first direction, the minimum width of the first portion in the first direction is less than or equal to the first width of the third electrode in the first direction.

[0009] One embodiment of a lighting device comprises a plurality of light-emitting devices according to the above embodiment. [Effects of the Invention]

[0010] In a light-emitting device, the misalignment of electronic components relative to the substrate can be reduced. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a plan view showing the external appearance of an example of a light-emitting device according to the first embodiment. [Figure 2] Figure 2 is a front view showing the external appearance of an example of a light-emitting device according to the first embodiment. [Figure 3] Figure 3 shows an example of the configuration of a light-emitting device according to the first embodiment. [Figure 4] Figure 4 is a cross-sectional view showing a hypothetical cross-section of an example of the light-emitting device according to the first embodiment as seen in the +Y direction at position IV-IV shown in Figures 1 and 3, respectively. [Figure 5] Figure 5 is a cross-sectional view showing a hypothetical cross-section of an example of the light-emitting device according to the first embodiment as seen in the +Y direction at position VV shown in Figures 1 and 3, respectively. [Figure 6] Figure 6 is a plan view showing the external appearance of an example of an electronic component. [Figure 7] Figure 7 is a bottom view showing the external appearance of an example of an electronic component. [Figure 8] Figure 8 is a cross-sectional view showing a hypothetical cross-section of an example of an electronic component viewed in the +Y direction at positions VIII-VIII, as shown in Figures 6 and 7, respectively. [Figure 9] Figure 9 is a cross-sectional view showing a hypothetical cross-section of another example of an electronic component as seen in the +Y direction at positions VIII-VIII, as shown in Figures 6 and 7, respectively. [Figure 10] Figure 10 shows an example of a light-emitting device according to the first embodiment, illustrating the positional relationship between the first portion of the first electrode on the substrate and the third electrode of the electronic component, and the positional relationship between the second portion of the second electrode on the substrate and the fourth electrode of the electronic component. [Figure 11] Figure 11 shows another example of the light-emitting device according to the first embodiment, illustrating the positional relationship between the first portion of the first electrode on the substrate and the third electrode of the electronic component, and the positional relationship between the second portion of the second electrode on the substrate and the fourth electrode of the electronic component. [Figure 12] Figure 12 schematically shows an example of a state where the bonding material has reached the side surface of an electronic component. [Figure 13] Figure 13 is a bottom view showing the appearance of electronic components used in one specific example and one reference example of the experiment. [Figure 14] Figure 14 is a plan view showing the appearance of a substrate used in one specific example of the experiment. [Figure 15] Figure 15 is a plan view showing the appearance of a substrate used in one example experiment. [Figure 16]FIG. 16 is a diagram for explaining a method of measuring the shorter distance (first spatial distance) of the distance between the first portion of the first electrode of the substrate and the fourth electrode of the electronic component in the first direction and the distance between the second portion of the second electrode of the substrate and the third electrode of the electronic component in the first direction, for each of a plurality of samples according to a specific example of an experiment. [Figure 17] FIG. 17 is a diagram for explaining a method of measuring the first spatial distance when an electronic component is joined to a substrate at an angle, for one or more samples according to a specific example of an experiment. [Figure 18] FIG. 18 is a diagram for explaining a method of measuring the shorter distance (second spatial distance) of the distance between the first portion of the first electrode of the substrate and the fourth electrode of the electronic component in the first direction and the distance between the second portion of the second electrode of the substrate and the third electrode of the electronic component in the first direction, for each of a plurality of samples according to a reference example of an experiment. [Figure 19] FIG. 19 is a diagram for explaining a method of measuring the second spatial distance when an electronic component is joined to a substrate at an angle, for one or more samples according to a reference example of an experiment. [Figure 20] FIG. 20 is a diagram showing measurement results of the first spatial distance for a plurality of samples according to a specific example of an experiment, and measurement results of the second spatial distance for a plurality of samples according to a reference example of an experiment. [Figure 21] FIG. 21 is a diagram showing measurement results of the first spatial distance for a plurality of samples according to a specific example of an experiment, and measurement results of the second spatial distance for a plurality of samples according to a reference example of an experiment. [Figure 22] FIG. 22 is a diagram respectively showing the positional relationship between the first portion of the first electrode of the substrate and the third electrode of the electronic component, and the positional relationship between the second portion of the second electrode of the substrate and the fourth electrode of the electronic component, for an example of a light-emitting device according to a second embodiment. [Figure 23] FIG. 23 is a diagram respectively showing the positional relationship between the first portion of the first electrode of the substrate and the third electrode of the electronic component, and the positional relationship between the second portion of the second electrode of the substrate and the fourth electrode of the electronic component, for an example of a light-emitting device according to a third embodiment. [Figure 24]Figure 24 shows the positional relationship between the first portion of the first electrode on the substrate and the third electrode of the electronic component, and the positional relationship between the second portion of the second electrode on the substrate and the fourth electrode of the electronic component, respectively, for a first example of a light-emitting device according to the fourth embodiment. [Figure 25] Figure 25 shows the positional relationship between the first portion of the first electrode on the substrate and the third electrode of the electronic component, and the positional relationship between the second portion of the second electrode on the substrate and the fourth electrode of the electronic component, respectively, for a second example of the light-emitting device according to the fourth embodiment. [Figure 26] Figure 26 shows the positional relationship between the first portion of the first electrode on the substrate and the third electrode of the electronic component, and the positional relationship between the second portion of the second electrode on the substrate and the fourth electrode of the electronic component, respectively, for a third example of a light-emitting device according to the fourth embodiment. [Figure 27] Figure 27 is a front view showing the external appearance of an example of a light-emitting device according to the fifth embodiment. [Figure 28] Figure 28 shows an example of the configuration of a light-emitting device according to the fifth embodiment. [Figure 29] Figure 29 is a schematic diagram showing the external appearance of an example of a lighting device. [Modes for carrying out the invention]

[0012] There is a light-emitting device comprising a substrate and light-emitting elements, electronic components, and wavelength conversion members located on the first surface side of the substrate. There is also a lighting device comprising a mounting board on which one or more light-emitting devices or multiple light-emitting devices are mounted.

[0013] In this light-emitting device, the substrate has a pair of first electrodes, a pair of second electrodes, and a pair of connecting conductors on its first surface (also referred to as the top surface of the substrate). The first of the pair of first electrodes and the first of the pair of second electrodes are connected by the first of the pair of connecting conductors. The second of the pair of first electrodes and the second of the pair of second electrodes are connected by the second of the pair of connecting conductors. The light-emitting element is electrically connected to the pair of first electrodes via brazing material or solder, and emits excitation light when power is supplied by the pair of first electrodes. The electronic component is electrically connected in parallel to the light-emitting element by being electrically connected to the pair of second electrodes, and the voltage between the pair of electrodes of this electronic component (also referred to as the third electrode) can be controlled. The wavelength conversion member encloses the light-emitting element and has a substrate-side surface (also called the bottom surface), a surface opposite the substrate (also called the top surface), and one or more surfaces connecting the bottom surface and the top surface (also called the side surfaces). In response to the incidence of excitation light from the light-emitting element, this wavelength conversion member emits light of a different wavelength from the excitation light from the top surface and one or more side surfaces to the outside of the light-emitting device. A light-emitting device having this structure is called a chip-size package (CSP) type light-emitting device.

[0014] Incidentally, in the manufacturing process of a light-emitting device, for example, a pair of third electrodes of an electronic component are joined to a pair of second electrodes on the first surface of the substrate by a conductive bonding material such as brazing material or solder. More specifically, the first third electrode of the electronic component is joined to the first second electrode on the substrate by a bonding material, and the second third electrode of the electronic component is joined to the second second electrode on the substrate by a bonding material. For example, the joining of the first third electrode to the first second electrode via a bonding material, and the joining of the second third electrode to the second second electrode via a bonding material, can be achieved by a process (also called reflow soldering) in which the electronic component, with bonding material applied to each of the pair of third electrodes, is placed on the substrate and heated. In this case, a misalignment of the position of the electronic component relative to the substrate may occur. More specifically, the first second electrode and the second third electrode may come closer together, or the second second electrode and the first third electrode may come closer together. In this case, the distance between the first second electrode and the second third electrode, or the distance between the second second electrode and the first third electrode, may be shorter than the insulation distance required to reduce the occurrence of a short circuit between the first second electrode and the second second electrode.

[0015] In other words, there is room for improvement in light-emitting devices and lighting devices in terms of reducing the misalignment of electronic components relative to the substrate.

[0016] Therefore, the inventors of this disclosure have created a technology that can reduce the misalignment of electronic components relative to the substrate in light-emitting devices and lighting devices.

[0017] This will be explained below with reference to various embodiments and examples. In the drawings, the same reference numerals are used for parts having the same or similar configuration and function. Duplicate explanations have been omitted in the following description. The drawings are shown schematically. The drawings include diagrams with right-handed XYZ coordinate systems indicated where appropriate. In the following description, one direction along the first surface (also called the first board surface or top surface) 2f1 of the substrate 2 is referred to as the first direction Dr1, which is the +X direction. Another direction along the first surface 2f1 of the substrate 2 is referred to as the second direction Dr2, which is the +Y direction. One direction along the normal to the first surface 2f1 of the substrate 2 is referred to as the third direction, which is the +Z direction. The second direction Dr2, which is the +Y direction, is orthogonal to the first direction Dr1, which is the +X direction. In other words, the direction along the first surface 2f1 of the substrate 2 and orthogonal to the first direction Dr1 is referred to as the second direction Dr2. The third direction, the +Z direction, is orthogonal to both the first direction, the +X direction (Dr1), and the second direction, the +Y direction (Dr2).

[0018] Where expressions indicating relative or absolute positional relationships are used in this disclosure, unless otherwise specified, these expressions not only strictly represent the positional relationship but also represent a state in which the positional relationship is displaced relative to an angle or distance within a tolerance or range in which equivalent functionality is obtained. Expressions indicating relative or absolute positional relationships may include, for example, "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," or "coaxial." Where expressions indicating equality are used in this disclosure, unless otherwise specified, these expressions not only represent a state in which things are quantitatively exactly equal but also represent a state in which there is a difference in which tolerance or equivalent functionality is obtained. Expressions indicating equality may include, for example, "identical," "equal," or "homogeneous." Where expressions indicating shape are used in this disclosure, unless otherwise specified, these expressions not only represent the geometrically exactly shape but also represent a shape that has, for example, a concave or chamfered shape on which the shape is based, within a range in which equivalent functionality is obtained. Expressions describing shape may include, for example, "triangular," "quadrilateral," "rectangular," "square," "rectangular," or "cylindrical." Where the expressions "comprising one or more components," "containing one or more components," or "having one or more components" are used in this disclosure, these expressions are not exclusive and exclude the existence of other components different from the one or more components. Where the expressions "at least one of A, B, and C" are used in this disclosure, these expressions include the cases of A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

[0019] <1. First Embodiment> <1-1. Configuration of the light-emitting device> Figure 1 is a plan view showing the external appearance of an example of the light-emitting device 1 according to the first embodiment. Figure 2 is a front view showing the external appearance of an example of the light-emitting device 1 according to the first embodiment. Figure 3 is a diagram showing an example of the configuration of the light-emitting device 1 according to the first embodiment. Figure 4 is a cross-sectional view showing a hypothetical cross-section of an example of the light-emitting device 1 according to the first embodiment as seen in the +Y direction as the second direction Dr2 at position IV-IV shown in Figures 1 and 3, respectively. Figure 5 is a cross-sectional view showing a hypothetical cross-section of an example of the light-emitting device 1 according to the first embodiment as seen in the +Y direction as the second direction Dr2 at position VV shown in Figures 1 and 3, respectively. Figure 6 is a plan view showing the external appearance of an example of the electronic component 4. Figure 7 is a bottom view showing the external appearance of an example of the electronic component 4. Figure 8 is a cross-sectional view showing a hypothetical cross-section of an example of the electronic component 4 as seen in the +Y direction as the second direction Dr2 at position VIII-VIII shown in Figures 6 and 7, respectively. Figure 9 is a cross-sectional view showing a hypothetical cross-section of another example of electronic component 4 as seen in the +Y direction as the second direction Dr2 at position VIII-VIII shown in Figures 6 and 7, respectively.

[0020] Figure 3 shows the relative positional relationship between the substrate 2, the light-emitting element 3, the electronic component 4, the wavelength conversion unit 5, and the reflective member 6 when the light-emitting device 1 according to the first embodiment is viewed planarly in the -Z direction (hereinafter simply referred to as the -Z direction), which is the fourth direction opposite to the third direction. In Figure 3, the outer edge of the portion of the substrate 2 facing the +Z direction (hereinafter simply referred to as the +Z direction), which is the third direction, and the outer edge of the reflective member 6 are drawn with solid lines, the outer edges of the light-emitting element 3 and the electronic component 4 are drawn with thin dashed lines, and the outer edge of the wavelength conversion unit 5 is drawn with a thin dotted line.

[0021] As shown in Figures 1 to 5, the light-emitting device 1 comprises a substrate 2, a light-emitting element 3, an electronic component 4, and a wavelength conversion unit 5. In the first embodiment, the light-emitting device 1 further comprises a reflective member 6. The substrate 2 has a first surface 2f1. The light-emitting element 3, the electronic component 4, and the wavelength conversion unit 5 are each located on the side of the first surface 2f1 of the substrate 2. The light-emitting element 3 may have a surface 3f3 on the substrate 2 side (also referred to as the second surface or the first element surface). In other words, the light-emitting element 3 may have a second surface 3f3 facing the first surface 2f1 of the substrate 2. The electronic component 4 may have a surface 4f2 on the substrate 2 side (also referred to as the third surface or the first component surface). In other words, the electronic component 4 may have a third surface 4f2 facing the first surface 2f1 of the substrate 2. The wavelength conversion unit 5 covers the light-emitting element 3. More specifically, the wavelength conversion unit 5 is positioned on the first surface 2f1 side of the substrate 2, covering the light-emitting element 3. In other words, the light-emitting element 3 is sandwiched between the substrate 2 and the wavelength conversion unit 5. In the first embodiment, the wavelength conversion unit 5 is positioned on the first surface 2f1 side of the substrate 2, covering the electronic component 4. In other words, the electronic component 4 is sandwiched between the substrate 2 and the wavelength conversion unit 5. Here, for example, if the electronic component 4, substrate 2, and light-emitting element 3 are viewed from a plane, the electronic component 4 may be located between the outer edge of the substrate 2 and the light-emitting element 3. If the electronic component 4, substrate 2, and light-emitting element 3 are viewed from a plane, this may be the case where the electronic component 4, substrate 2, and light-emitting element 3 are viewed from a plane in the -Z direction. Also, for example, if the electronic component 4, the first surface 2f1, and the light-emitting element 3 are viewed from a plane, the electronic component 4 may be located between the outer edge of the first surface 2f1 and the light-emitting element 3. When the electronic component 4, the first surface 2f1, and the light-emitting element 3 are viewed from a plane, this may be the case when the electronic component 4, the first surface 2f1, and the light-emitting element 3 are viewed from a plane in the -Z direction.

[0022] In the light-emitting device 1, the light-emitting element 3 emits excitation light as first light. The excitation light emitted by the light-emitting element 3 may be directly incident on the wavelength conversion unit 5. In response to the incidence of the excitation light emitted by the light-emitting element 3, the wavelength conversion unit 5 can emit second light having a different spectrum (also called a spectral distribution) from the excitation light. The light emitted from the wavelength conversion unit 5 can be emitted as illumination light to the outside of the light-emitting device 1.

[0023] For example, when the light-emitting device 1 is viewed from above in the -Z direction, the external shape of the light-emitting device 1 may be, for example, rectangular. In this disclosure, the rectangular shape may be rectangular or square, or it may be a shape based on a rectangle or square with one or more corners rounded, or it may be a shape based on a rectangle or square with one or more corners having portions that form two or more obtuse angles.

[0024] <1-1-1. Circuit board> The substrate 2 has, for example, a first surface 2f1 and a surface 2f2 opposite to this first surface (first board surface) 2f1 (also referred to as the second board surface or substrate bottom surface). In the examples of Figures 2 to 5, the first surface 2f1 faces in the +Z direction. The first surface 2f1 may be a generally flat surface. The first surface 2f1 may have some irregularities. The second board surface 2f2 faces in the -Z direction. The second board surface 2f2 may be a generally flat surface. The second board surface 2f2 may have some irregularities. Here, for example, it is assumed that the light-emitting device 1 is viewed from above in the -Z direction. In this case, for example, as shown in Figure 3, the first surface 2f1 includes a region A1 surrounding the light-emitting element 3 and the electronic component 4 (also referred to as the first region).

[0025] The substrate 2 has one or more sides (also referred to as substrate sides) 2fs connecting the first surface (first board surface) 2f1 and the second board surface 2f2. The shape of the outer edges of the first surface (first board surface) 2f1 and the second board surface 2f2 may be, for example, rectangular. In other words, the first surface (first board surface) 2f1 may have a rectangular outer edge, and the second board surface 2f2 may have a rectangular outer edge. In this case, for example, the formation of the substrate 2 becomes easier, and the light-emitting device 1 can be easily manufactured.

[0026] If the shape of the outer edges of the first surface (first board surface) 2f1 and the second board surface 2f2 are rectangular, then the substrate 2 has four substrate sides 2fs, which are one or more substrate sides 2fs. In the examples of Figures 2 to 5, the four substrate sides 2fs include the first substrate side 2fs, the second substrate side 2fs, the third substrate side 2fs, and the fourth substrate side 2fs. The first substrate side 2fs faces the +X direction (hereinafter simply referred to as the +X direction) as the first direction Dr1. The second substrate side 2fs faces the +Y direction (hereinafter simply referred to as the +Y direction) as the second direction Dr2. The third substrate side 2fs faces the -X direction (hereinafter simply referred to as the -X direction) as the direction opposite to the first direction Dr1. The fourth substrate side 2fs faces the -Y direction (hereinafter simply referred to as the -Y direction), which is the opposite direction to the second direction Dr2.

[0027] The substrate 2 may have a thickness of, for example, 100 micrometers (μm) to about 1000 μm. The thickness of the substrate 2 may be, for example, the length of the substrate 2 in the +Z direction. The substrate 2 may have a width of, for example, 1 millimeter (mm) to about 4 mm. The width of the substrate 2 may be, for example, the length of the substrate 2 in the +X direction. The substrate 2 may have a depth of, for example, 1 mm to about 4 mm. The depth of the substrate 2 may be, for example, the length of the substrate 2 in the +Y direction. For example, if the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, the first surface 2f1 may be a rectangular surface having a width of about 1 mm to 4 mm and a depth of about 1 mm to 4 mm.

[0028] The substrate 2 has a first electrode 21 and a second electrode 22 on the first surface 2f1 side. In other words, the substrate 2 has two electrodes (also referred to as the first plate surface electrode or surface electrode) on the first surface 2f1 side: a first electrode (also referred to as the first A plate surface electrode or first A surface electrode) 21 and a second electrode (also referred to as the first B plate surface electrode or first B surface electrode) 22. In the first embodiment, the substrate 2 includes a main body portion (also referred to as the substrate main body portion) 20. Also, in the first embodiment, the substrate 2 has, for example, two electrodes (also referred to as the second plate surface electrode or back surface electrode) on the second plate surface 2f2 side: an electrode (also referred to as the second A plate surface electrode) 23 and an electrode (also referred to as the second B plate surface electrode) 24.

[0029] <<Main circuit board section>> The substrate body 20 may have insulating properties. The substrate body 20 may be made of, for example, an insulating material (also called an insulating material). The insulating material constituting the substrate body 20 may be, for example, a ceramic material such as aluminum oxide (also called alumina) or mullite, or a glass ceramic material. The insulating material constituting the substrate body 20 may be, for example, a material made by mixing two or more types of ceramic materials (also called a composite material), or a material made by mixing one or more types of ceramic materials and a glass ceramic material (also called a composite material). The insulating material constituting the substrate body 20 may be, for example, a polymer resin material in which metal oxide fine particles are dispersed for the purpose of adjusting the thermal expansion coefficient of the substrate body 20. The insulating material constituting the substrate body 20 may be, for example, aluminum nitride, or a material containing aluminum nitride or silicon carbide. This may improve the thermal conductivity of the substrate body 20. As a result, the heat dissipation performance of the light-emitting device 1 may be improved.

[0030] The substrate body 20 has a surface (also referred to as the third surface) 20f3 on the side of the first surface (first board surface) 2f1, and a surface (also referred to as the fourth surface) 20f4 on the side of the second surface 2f2. A part of the third surface 20f3 may constitute a part of the first surface 2f1. A part of the fourth surface 20f4 may constitute a part of the second surface 2f2. The substrate body 20 may have a plate-like shape. The shape of the outer edges of the third surface 20f3 and the fourth surface 20f4 may be, for example, rectangular. In other words, the third surface 20f3 may have a rectangular outer edge, and the fourth surface 20f4 may have a rectangular outer edge.

[0031] The substrate body portion 20 may have a thickness of, for example, 80 μm to 980 μm. The thickness of the substrate body portion 20 may be, for example, the length of the substrate body portion 20 in the +Z direction. The substrate body portion 20 may have a width of, for example, 1 mm to 4 mm. The width of the substrate body portion 20 may be, for example, the length of the substrate body portion 20 in the +X direction. The substrate body portion 20 may have a depth of, for example, 1 mm to 4 mm. The depth of the substrate body portion 20 may be, for example, the length of the substrate body portion 20 in the +Y direction. For example, if the outer edges of the third board surface 20f3 and the fourth board surface 20f4 are rectangular, then each of the third board surface 20f3 and the fourth board surface 20f4 may be a surface having a rectangular outer edge with a width of about 1 mm to 4 mm and a depth of about 1 mm to 4 mm.

[0032] <<First plate electrode>> Each of the two electrodes (first surface electrodes), the first electrode 21 and the second electrode 22, is located on the first surface 2f1 side of the substrate 2. Each of the first electrode 21 and the second electrode 22 may be located on the third surface 20f3 of the substrate body 20. Each of the first electrode 21 and the second electrode 22 may have a film-like or thin plate-like shape. Each of the first electrode 21 and the second electrode 22 may be formed by a dry process or a wet process. Dry processes may include, for example, vapor deposition, chemical vapor deposition (CVD), sputtering, etc. Wet processes may include, for example, coating and drying of conductive paste. In the first electrode 21, the surface of the first electrode 21 opposite to the substrate body 20 constitutes part of the first surface 2f1. The surface of the first electrode 21 that constitutes part of the first surface 2f1 may be flat. In the second electrode 22, the surface of the second electrode 22 opposite to the substrate body portion 20 constitutes a part of the first surface 2f1. The surface of the second electrode 22 that constitutes a part of the first surface 2f1 may be flat.

[0033] The first electrode 21 and the second electrode 22 are, for example, separated from each other in the +X direction along the first surface 2f1, and aligned in the +X direction. In the examples of Figures 3 to 5, the first electrode 21 and the second electrode 22 are aligned in the +X direction in the order described, and separated from each other in the +X direction. The first electrode 21 is located on the -X side of the second electrode 22. The second electrode 22 is located on the +X side of the first electrode 21. From another point of view, the first electrode 21 may be located on the -X side of the third surface 20f3 of the substrate body 20. The second electrode 22 may be located on the +X side of the third surface 20f3 of the substrate body 20. Here, for example, the first electrode 21 and the second electrode 22 may have a symmetric relationship with respect to a hypothetical straight line along the +Y direction. The first electrode 21 includes a first portion 21p1, and the second electrode 22 includes a second portion 22p2. The first electrode 21 may include a third portion 21p3 other than the first portion 21p1, and the second electrode 22 may include a fourth portion 22p4 other than the second portion 22p2.

[0034] The first electrode 21 includes a first portion 21p1 and a third portion 21p3. The third portion 21p3 is located on the -Y side of the first electrode 21. In other words, the third portion 21p3 may be located on the -Y side of the third surface 20f3 of the substrate body 20. The first portion 21p1 is located on the +Y side of the first electrode 21. In other words, the first portion 21p1 may be located on the +Y side of the third surface 20f3 of the substrate body 20. In other words, the first portion 21p1 may be located on the +Y side of the third portion 21p3. The width of the first portion 21p1 may be smaller than the width of the third portion 21p3. The width of the third portion 21p3 may be, for example, the length of the third portion 21p3 in the +X direction. The width of the first portion 21p1 may be the length of the first portion 21p1 in the +X direction. The third portion 21p3 may be the portion of the first electrode 21 other than the first portion 21p1.

[0035] -When viewed in plane perspective towards the Z direction, the shape of the outer edge of the third portion 21p3 may be, for example, rectangular.

[0036] The first part 21p1 may have a shape that is elongated in the +Y direction, for example. In other words, the longitudinal direction of the first part 21p1 may be, for example, the +Y direction or a direction along the +Y direction. The first part 21p1 may have, for example, an edge on the +X side (also called the first edge) Es1, an edge on the -X side opposite to the first direction Dr1 (also called the second edge) Es2, and an end in the +Y direction (also called the first end) Ef1. The first end Ef1 may be the end of the first part 21p1 opposite to the third part 21p3. Here, in the first part 21p1, the first edge Es1 and the second edge Es2 may each be located along the +Y direction without bending from the third part 21p3 to the first end Ef1, which is the +Y end of the first part 21p1.

[0037] If this configuration is adopted, the shape of the first part 21p1 is simple. This makes it easy to form the first part 21p1 and can reduce dimensional errors in the first part 21p1. It can also make it easier to check the dimensional tolerances of the first part 21p1. For example, the first edge Es1 may be a straight edge along the +Y direction, and the second edge Es2 may be a straight edge along the +Y direction. Here, the straight edge along the +Y direction may include, for example, an edge that is inclined at an angle of a few degrees or less with respect to a hypothetical straight line extending in the +Y direction. This number of degrees may be, for example, 5 degrees or less, 4 degrees or less, 3 degrees or less, 2 degrees or less, or 1 degree or less.

[0038] Here, for example, when the first surface 2f1 of the substrate 2 is viewed from above, the shape of the first part 21p1 may be rectangular, or it may be a rectangular shape in which each of one or more corners forms two or more obtuse angles or a rounded portion. The rectangular shape in which each of one or more corners forms two or more obtuse angles or a rounded portion may be a shape based on a rectangle in which each of one or more corners forms two or more obtuse angles, or it may be a shape in which each of one or more corners is rounded.

[0039] If this configuration is adopted, the shape of the first part 21p1 is simpler. This makes it easier to form the first part 21p1 and can reduce dimensional errors of the first part 21p1. It can also make it easier to check the dimensional tolerances of the first part 21p1. When the first surface 2f1 of the substrate 2 is viewed from a plane, it may be when the first surface 2f1 of the substrate 2 is viewed from a plane in the -Z direction. The first part 21p1 may have a width of, for example, 50 μm to 200 μm. The first part 21p1 may have a length of, for example, 300 μm to 1200 μm in the longitudinal direction.

[0040] The second electrode 22 includes a second portion 22p2 and a fourth portion 22p4. The fourth portion 22p4 is located on the -Y side of the second electrode 22. In other words, the fourth portion 22p4 may be located on the -Y side of the third surface 20f3 of the substrate body 20. The second portion 22p2 is located on the +Y side of the second electrode 22. In other words, the second portion 22p2 may be located on the +Y side of the third surface 20f3 of the substrate body 20. In other words, the second portion 22p2 may be located on the +Y side of the fourth portion 22p4. The width of the second portion 22p2 may be smaller than the width of the fourth portion 22p4. The width of the fourth portion 22p4 may be, for example, the length of the fourth portion 22p4 in the +X direction. The width of the second portion 22p2 may be the length of the second portion 22p2 in the +X direction. The fourth portion 22p4 may be the portion of the second electrode 22 other than the second portion 22p2.

[0041] The fourth part 22p4 and the second part 22p2 may have shapes that are approximately symmetrical to the third part 21p3 and the first part 21p1 mentioned above. Here, for example, the fourth part 22p4 and the second part 22p2 and the third part 21p3 and the first part 21p1 may have a line-symmetric or approximately line-symmetric relationship with respect to a hypothetical straight line along the +Y direction. Here, the part of the second part 22p2 that corresponds to the second edge Es2 in the first part 21p1 is called the third edge Es3. This third edge Es3 is the edge on the +X side of the second part 22p2. The part of the second part 22p2 that corresponds to the first edge Es1 in the first part 21p1 is called the fourth edge Es4. This fourth edge Es4 is the edge on the -X side of the second part 22p2. Of the second section 22p2, the part corresponding to the first end Ef1 is called the second end Ef2. This second end Ef2 is the end of the second section 22p2 in the +Y direction.

[0042] The first part 21p1 and the second part 22p2 are aligned in the +X direction in the order described. In other words, the direction in which the first part 21p1 and the second part 22p2 are aligned is defined as the first direction Dr1. The first part 21p1 and the second part 22p2 are separated from each other in the +X direction. In other words, the first part 21p1 is located on the -X side of the second part 22p2. The second part 22p2 is located on the +X side of the first part 21p1. From another perspective, the first part 21p1 may be located on the -X side of the third surface 20f3 of the main body of the substrate 20. The second part 22p2 may be located on the +X side of the third surface 20f3 of the main body of the substrate 20. Here, for example, the first part 21p1 and the second part 22p2 may have a symmetric relationship with respect to a hypothetical straight line along the +Y direction. The distance (also called the spacing) between the first part 21p1 and the second part 22p2 in the +X direction may be, for example, about 50 μm to 200 μm.

[0043] Here, each of the first portion 21p1 of the first electrode 21 and the second portion 22p2 of the second electrode 22 can function as a portion that supplies power to the electronic component 4. For example, the first electrode 21 may function as the positive electrode and the second electrode 22 may function as the negative electrode. More specifically, the first portion 21p1 of the first electrode 21 may function as the positive electrode and the second portion 22p2 of the second electrode 22 may function as the negative electrode. The first electrode 21 may function as the negative electrode and the second electrode 22 may function as the positive electrode. More specifically, the first portion 21p1 of the first electrode 21 may function as the negative electrode and the second portion 22p2 of the second electrode 22 may function as the positive electrode.

[0044] The third part 21p3 and the fourth part 22p4 may be arranged in the +X direction in the order described herein. In other words, the direction in which the third part 21p3 and the fourth part 22p4 are arranged may be, for example, the first direction Dr1. As illustrated in Figures 3 to 5, the third part 21p3 and the fourth part 22p4 may be arranged in the +X direction in the order described herein, and may also be separated from each other in the +X direction. The third part 21p3 may be located on the -X side of the fourth part 22p4. The fourth part 22p4 may be located on the +X side of the third part 21p3. From another point of view, the third part 21p3 may be located on the -X side of the third surface 20f3 of the substrate body 20. The fourth part 22p4 may be located on the +X side of the third surface 20f3 of the substrate body 20. Here, for example, the third part 21p3 and the fourth part 22p4 may have a symmetric relationship with respect to a hypothetical straight line along the +Y direction. The distance (also called the spacing) between the third part 21p3 and the fourth part 22p4 in the +X direction may be, for example, about 50 μm to 200 μm.

[0045] Here, the third portion 21p3 of the first electrode 21 and the fourth portion 22p4 of the second electrode 22 can each function as a portion that supplies power to the light-emitting element 3. For example, the third portion 21p3 of the first electrode 21 may function as the positive electrode, and the fourth portion 22p4 of the second electrode 22 may function as the negative electrode. For example, the third portion 21p3 of the first electrode 21 may function as the negative electrode, and the fourth portion 22p4 of the second electrode 22 may function as the positive electrode.

[0046] Conductive materials may be used for the materials constituting the first electrode 21 and the second electrode 22, respectively. Conductive materials may include metallic materials such as tungsten (W), molybdenum (Mo), manganese (Mn), or copper (Cu).

[0047] <<Second plate electrode>> Each of the two second surface electrodes, the second A surface electrode 23 and the second B surface electrode 24, is located on the second surface 2f2 side of the substrate 2. Each of the second A surface electrode 23 and the second B surface electrode 24 may be located on the fourth surface 20f4 of the substrate body 20. Each of the second A surface electrode 23 and the second B surface electrode 24 may have a film-like or thin plate-like shape. In each of the second A surface electrode 23 and the second B surface electrode 24, the surface opposite to the substrate body 20 constitutes a part of the second surface 2f2. The second A surface electrode 23 and the second B surface electrode 24 are, for example, separated from each other in the +X direction and aligned in the +X direction. The second A surface electrode 23 is located on the -X side of the two second surface electrodes. The second B plate electrode 24 is located on the side of the two second plate electrodes that is in the +X direction.

[0048] The second A surface electrode 23 may be electrically connected to the third portion 21p3 of the first electrode 21 by wiring (also referred to as the first through-wiring) that penetrates the main body of the substrate 20. In other words, the substrate 2 may include the first through-wiring that electrically connects the third portion 21p3 of the first electrode 21 and the second A surface electrode 23. The second B surface electrode 24 may be electrically connected to the fourth portion 22p4 of the second electrode 22 by wiring (also referred to as the second through-wiring) that penetrates the main body of the substrate 20. In other words, the substrate 2 may include the second through-wiring that electrically connects the fourth portion 22p4 of the second electrode 22 and the second B surface electrode 24.

[0049] Here, for example, the second A surface electrode 23 may be electrically connected to the first portion 21p1 of the first electrode 21 by a first through-wiring, and the second B surface electrode 24 may be electrically connected to the second portion 22p2 of the second electrode 22 by a second through-wiring. In other words, the substrate 2 may include a first through-wiring that electrically connects the second A surface electrode 23 and the first portion 21p1 of the first electrode 21, and a second through-wiring that electrically connects the second B surface electrode 24 and the second portion 22p2 of the second electrode 22.

[0050] Here, the second A plate electrode 23 and the second B plate electrode 24 can each function as electrodes that supply power to the light-emitting element 3. For example, the second A plate electrode 23 may function as the positive electrode and the second B plate electrode 24 may function as the negative electrode. For example, the second A plate electrode 23 may function as the negative electrode and the second B plate electrode 24 may function as the positive electrode. The second A plate electrode 23 and the second B plate electrode 24 may be bonded to a substrate of a lighting device, for example, when the light-emitting device 1 is mounted on a lighting device.

[0051] Conductive materials may be used for the materials constituting the second A plate electrode 23 and the second B plate electrode 24, respectively. Conductive materials may include metallic materials such as tungsten (W), molybdenum (Mo), manganese (Mn), or copper (Cu).

[0052] <1-1-2. Electronic Components> The electronic component 4 is located on the first surface 2f1 side of the substrate 2. More specifically, the electronic component 4 is electrically connected to the first portion 21p1 of the first electrode 21 and the second portion 22p2 of the second electrode 22. In other words, the electronic component 4 may be mounted on the first surface 2f1 of the substrate 2.

[0053] A protective element may be applied to the electronic component 4, for example. The protective element has the function of maintaining the voltage between the first electrode 21 and the second electrode 22 below a predetermined voltage. For example, it is conceivable that an excessive voltage may be applied between the first electrode 21 and the second electrode 22 due to electrostatic discharge (ESD), etc. Even in this case, the protective element can maintain the voltage between the first electrode 21 and the second electrode 22 below a predetermined voltage by allowing a large current to flow at a substantially constant voltage through the protective element. The protective element can maintain the voltage across another element electrically connected in parallel with the protective element below a predetermined voltage. Therefore, the protective element can maintain the voltage across the light-emitting element 3 connected to the third portion 21p3 of the first electrode 21 and the fourth portion 22p4 of the second electrode 22 below a predetermined voltage, for example, as will be described later. This can reduce the occurrence of damage to the light-emitting element 3.

[0054] The protection element may be, for example, a Zener diode, or a transient voltage suppressor (TVS) diode or varistor.

[0055] For example, the electronic component 4 may be bonded to the first portion 21p1 of the first electrode 21 and the second portion 22p2 of the second electrode 22, which are located on the first surface 2f1 side of the substrate 2. The bonding of the electronic component 4 to the first portion 21p1 and the second portion 22p2 can be achieved, for example, by a conductive bonding material (also called a bonding medium) C1 such as brazing material or solder. In this way, the electronic component 4 can be electrically connected to the first portion 21p1 and the second portion 22p2 via the bonding material C1.

[0056] The electronic component 4 may be mounted on the substrate 2 using a flip-chip connection. Here, for example, as shown in Figure 4, the electronic component 4 has a third electrode 43 and a fourth electrode 44. More specifically, the electronic component 4 may have a third surface (first component surface) 4f2. The electronic component 4 may have the third electrode 43 and the fourth electrode 44 on the third surface 4f2 side. The third surface 4f2 may be the surface of the electronic component 4 facing the substrate 2. From another point of view, the third surface 4f2 of the electronic component 4 may be the surface facing the first surface 2f1 of the substrate 2. The third surface 4f2 may be a generally flat surface. The third surface 4f2 may have some irregularities.

[0057] Each of the third electrode 43 and the fourth electrode 44 may have, for example, a film-like or thin plate-like shape. The thickness of each of the third electrode 43 and the fourth electrode 44 may be, for example, about 5 μm to 30 μm. The thickness of the third electrode 43 may be, for example, the length of the third electrode 43 in the +Z direction. The thickness of the fourth electrode 44 may be, for example, the length of the fourth electrode 44 in the +Z direction. Each of the third electrode 43 and the fourth electrode 44 may have a width of, for example, about 50 μm to 250 μm. The width of the third electrode 43 may be, for example, the length of the third electrode 43 in the +X direction. The width of the fourth electrode 44 may be, for example, the length of the fourth electrode 44 in the +X direction.

[0058] As shown in Figure 7, for example, when viewed from above or in perspective in the +Z direction, the shapes of the third electrode 43 and the fourth electrode 44 may be rectangular. The rectangular shape may be, for example, a rectangle, or a shape based on a rectangle with one or more rounded corners, or a shape based on a rectangle with one or more corners having parts that form two or more obtuse angles. The third electrode 43 may have a shape that is elongated in the +Y direction. In other words, the longitudinal direction of the third electrode 43 may be, for example, the +Y direction, or a direction along the +Y direction. For example, the longitudinal direction of the third electrode 43 and the longitudinal direction of the first part 21p1 may be the same, or substantially the same. The fourth electrode 44 may have a shape that is elongated in the +Y direction. In other words, the longitudinal direction of the fourth electrode 44 may be, for example, the +Y direction, or a direction along the +Y direction. For example, the longitudinal direction of the fourth electrode 44 and the longitudinal direction of the second portion 22p2 may be the same or substantially the same. The third electrode 43 and the fourth electrode 44 may each have a length of, for example, about 150 μm to 600 μm. The length of the third electrode 43 may be, for example, the length of the third electrode 43 in the +Y direction. The length of the fourth electrode 44 may be, for example, the length of the fourth electrode 44 in the +Y direction.

[0059] For example, the third electrode 43 and the fourth electrode 44 may be aligned in the +X direction in the order described. In other words, for example, the direction in which the third electrode 43 and the fourth electrode 44 are aligned may be the first direction Dr1. As illustrated in Figure 7, the third electrode 43 and the fourth electrode 44 may be aligned in the +X direction in the order described, and may also be separated from each other in the +X direction. The third electrode 43 may be located on the -X side of the fourth electrode 44. The fourth electrode 44 may be located on the +X side of the third electrode 43. From another point of view, the third electrode 43 may constitute a part of the third plane 4f2 on the -X side. The fourth electrode 44 may constitute a part of the third plane 4f2 on the +X side. Here, for example, the third electrode 43 and the fourth electrode 44 may have a line-symmetric relationship with respect to a hypothetical straight line along the +Y direction. The distance (also called the spacing) between the third electrode 43 and the fourth electrode 44 in the +X direction may be, for example, about 40 μm to 200 μm.

[0060] Conductive materials may be used for the materials constituting the third electrode 43 and the fourth electrode 44, respectively. Conductive materials may include metallic materials such as tungsten (W), molybdenum (Mo), manganese (Mn), or copper (Cu).

[0061] For example, the third electrode 43 may be the positive electrode of the electronic component 4, and the fourth electrode 44 may be the negative electrode of the electronic component 4. For example, the third electrode 43 may be the negative electrode of the electronic component 4, and the fourth electrode 44 may be the positive electrode of the electronic component 4. Here, the third electrode 43 may be electrically connected to the first portion 21p1 of the first electrode 21, and the fourth electrode 44 may be electrically connected to the second portion 22p2 of the second electrode 22. More specifically, the third electrode 43 may be joined to the first portion 21p1 of the first electrode 21, and the fourth electrode 44 may be joined to the second portion 22p2 of the second electrode 22. For example, the third electrode 43 may be joined to the first portion 21p1 of the first electrode 21 via a first bonding material C11 as a conductive bonding material C1. For example, the fourth electrode 44 may be joined to the second portion 22p2 of the second electrode 22 via a second bonding material C12, which is a conductive bonding material C1.

[0062] Here, the first joining material C11 and the second joining material C12 may each have a shape such as a film or a thin plate. The thickness of the first joining material C11 and the second joining material C12 may be, for example, about 5 μm to 20 μm. The thickness of the first joining material C11 may be, for example, the length of the first joining material C11 in the +Z direction. The thickness of the second joining material C12 may be, for example, the length of the second joining material C12 in the +Z direction. The materials of the first joining material C11 and the second joining material C12 may be the same or different. Conductive materials such as brazing material or solder may be applied to the materials of the first joining material C11 and the second joining material C12. For example, a gold-tin (AuSn) alloy may be applied to the brazing material or solder.

[0063] For example, the bonding of the third electrode 43 to the first portion 21p1 via the first bonding material C11, and the bonding of the fourth electrode 44 to the second portion 22p2 via the second bonding material C12, can be achieved by a process (also called reflow soldering) in which the electronic component 4, with bonding material C1 applied to the third electrode 43 and the fourth electrode 44 respectively, is placed on the substrate 2 and then heated. Here, the placement of the electronic component 4 on the substrate 2 is carried out in a manner in which the third electrode 43 is located on the first portion 21p1 via bonding material C1, and the fourth electrode 44 is located on the second portion 22p2 via bonding material C1. The heating temperature is set to be above the melting point of the bonding material C1. The heating of the substrate 2 on which the electronic component 4 is placed may be carried out, for example, in a so-called reflow oven. When an AuSn alloy is applied to the bonding material C1, the heating temperature is set to, for example, 280°C to 330°C, which is above the melting point of the AuSn alloy, 280°C.

[0064] Here, for example, it is assumed that the light-emitting device 1 is viewed from above in the -Z direction, as shown in Figure 3. In this case, the electronic component 4 may be positioned on the first portion 21p1 of the first electrode 21 and the second portion 22p2 of the second electrode 22, covering at least a portion of the first portion 21p1 of the first electrode 21 and at least a portion of the second portion 22p2 of the second electrode 22, respectively.

[0065] For example, as shown in Figures 6 to 8, the three-dimensional shape of the electronic component 4 may be, for example, a rectangular parallelepiped or a cube. The rectangular parallelepiped shape may be, for example, a rectangular parallelepiped, or a shape based on a rectangular parallelepiped with one or more corners rounded, or a shape based on a rectangular parallelepiped with one or more corners forming two or more obtuse angles. The cube shape may be, for example, a cube, or a shape based on a cube with one or more corners rounded, or a shape based on a cube with one or more corners forming two or more obtuse angles. From another point of view, the shape of the outer edge of the third face (first component face) 4f2 may be, for example, rectangular.

[0066] The electronic component 4 may have a thickness of, for example, 75 μm to 300 μm. The thickness of the electronic component 4 may be, for example, the length of the electronic component 4 in the +Z direction. The electronic component 4 may have a width of, for example, 200 μm to 800 μm. The width of the electronic component 4 may be, for example, the length of the electronic component 4 in the +X direction. The electronic component 4 may have a depth of, for example, 200 μm to 800 μm. The depth of the electronic component 4 may be, for example, the length of the electronic component 4 in the +Y direction. For example, if the shape of the outer edge of the third surface 4f2 is rectangular, the third surface 4f2 may be a rectangular surface having a width of, for example, 200 μm to 800 μm and a depth of, for example, 200 μm to 800 μm.

[0067] Figure 8 schematically shows an example of a hypothetical cross-section of a Zener diode 4z1 that can be applied to electronic component 4. In the example in Figure 8, the Zener diode 4z1 has a semiconductor substrate 4s, an insulating layer 4i, a third electrode 43, and a fourth electrode 44. The semiconductor substrate 4s includes a semiconductor region of a first conductivity type (also called the first semiconductor region) 4p, and two semiconductor regions of a second conductivity type (also called the second semiconductor region) 4n, namely the second A semiconductor region 4n1 and the second B semiconductor region 4n2. If the first conductivity type is p-type, then the second conductivity type is n-type. The majority of the semiconductor substrate 4s is the first semiconductor region 4p. The third electrode 43 and the fourth electrode 44 are located on the third surface 4f2 side of the semiconductor substrate 4s. The region of the semiconductor substrate 4s in contact with the third electrode 43 is the second A semiconductor region 4n1. The region of the semiconductor substrate 4s that is in contact with the fourth electrode 44 is the second B semiconductor region 4n2. A portion of the first semiconductor region 4p is located between the second A semiconductor region 4n1 and the second B semiconductor region 4n2, so the second A semiconductor region 4n1 and the second B semiconductor region 4n2 are not in contact. On the third surface 4f2 side of the semiconductor substrate 4s, the portion where the third electrode 43 and the fourth electrode 44 are not located is covered with an insulating layer 4i. The insulating layer 4i is located between the third electrode 43 and the first semiconductor region 4p and the second B semiconductor region 4n2, and between the fourth electrode 44 and the first semiconductor region 4p and the second A semiconductor region 4n1. In the Zener diode 4z1 illustrated in Figure 8, for example, the third electrode 43 is electrically connected to the fourth electrode 44 via the second A semiconductor region 4n1, the first semiconductor region 4p, and the second B semiconductor region 4n2 in the order described above. As a result, in the Zener diode 4z1, regardless of whether a positive or negative voltage is applied between the third electrode 43 and the fourth electrode 44, a phenomenon can occur where the current increases but the voltage remains approximately constant (also called the breakdown phenomenon). If a Zener diode 4z1 having this structure (also called a bidirectional Zener diode) is used, it is easy to set the orientation of the Zener diode 4z1 when it is placed on the substrate 2 before joining the Zener diode 4z1 to the substrate 2.

[0068] Figure 9 schematically shows another example of a hypothetical cross-section of a Zener diode 4z2, which is an example of an electronic component 4. The Zener diode 4z2 illustrated in Figure 9 is based on the Zener diode 4z1 illustrated in Figure 8, and has a configuration in which the second A semiconductor region 4n1 is replaced by a part of the first semiconductor region 4p. In other words, the region of the semiconductor substrate 4s that is in contact with the third electrode 43 is the first semiconductor region 4p. In the Zener diode 4z2 illustrated in Figure 9, for example, the third electrode 43 is electrically connected to the fourth electrode 44 via the first semiconductor region 4p and the second B semiconductor region 4n2 in that order. As a result, in the Zener diode 4z2, when either a positive or negative voltage is applied between the third electrode 43 and the fourth electrode 44, a phenomenon can occur in which the current increases but the voltage remains approximately constant (also called the breakdown phenomenon). When a Zener diode 4z2 (also called a unidirectional Zener diode) having this structure is used, the Zener diode 4z2 should be joined to the first electrode 21 and the second electrode 22 of the substrate 2 in a configuration that is connected in parallel with the light-emitting element 3 and connected in the reverse direction.

[0069] <1-1-3. Light-emitting element> The light-emitting element 3 is located on the first surface 2f1 side of the substrate 2. More specifically, the light-emitting element 3 is electrically connected to the third portion 21p3 of the first electrode 21 and the fourth portion 22p4 of the second electrode 22. In other words, the light-emitting element 3 is electrically connected to the first electrode 21 and the second electrode 22, respectively.

[0070] The light-emitting element 3 can emit light by operating with power supplied, for example, from two second surface electrodes, the second A surface electrode 23 and the second B surface electrode 24, to two first surface electrodes, the first electrode 21 and the second electrode 22. More specifically, the light-emitting element 3 can emit light by operating with power supplied, for example, from two second surface electrodes, the second A surface electrode 23 and the second B surface electrode 24, to a third portion 21p3 of the first electrode 21 and a fourth portion 22p4 of the second electrode 22. The light emitted from the light-emitting element 3 can function as excitation light. The light-emitting element 3 provided in the light-emitting device 1 is also called an excitation light-emitting element.

[0071] The light-emitting element 3 may emit light having a spectrum in which the peak of light intensity (also referred to as light intensity) is located in a wavelength region of, for example, 360 nanometers (nm) or more and 430 nm or less. In this disclosure, the wavelength region of 360 nm or more and 430 nm or less is also referred to as the violet light wavelength region (also referred to as the violet light region). In this disclosure, the peak of light intensity in the light spectrum may be the point (also referred to as the maximum point) where the light intensity is at its maximum in a graph showing the light spectrum. In this disclosure, the wavelength at which the light intensity is at its maximum in a graph showing the light spectrum may be referred to as the peak wavelength in the light spectrum. Furthermore, the peak wavelength in the light spectrum may include the wavelength at the peak of a peak-shaped portion located between two adjacent valley-shaped portions of the light spectrum in a graph showing the light spectrum.

[0072] For example, a light-emitting diode (LED) can be used as the light-emitting element 3. An LED can emit light to the outside when electrons and holes recombine at the PN junction where a P-type semiconductor and an N-type semiconductor are joined. The light-emitting element 3 is not limited to an LED, but may be any other light-emitting device (also called a light-emitting device).

[0073] The light-emitting element 3 may be mounted on the first surface 2f1 of the substrate 2. For example, the light-emitting element 3 may be bonded to the third portion 21p3 of the first electrode 21 and the fourth portion 22p4 of the second electrode 22, which are located on the first surface 2f1 side of the substrate 2. The bonding of the light-emitting element 3 to the third portion 21p3 and the fourth portion 22p4 can be achieved, for example, by a conductive bonding material (bonding medium) C1 such as brazing material or solder. In this way, the light-emitting element 3 can be electrically connected to the third portion 21p3 and the fourth portion 22p4 via the bonding material C1.

[0074] When the light-emitting device 1 is viewed planar in the -Z direction, the light-emitting element 3 may be positioned to cover at least a portion of each of the third portion 21p3 and the fourth portion 22p4. For example, when the light-emitting device 1 is viewed planar in the -Z direction, the light-emitting element 3 may cover a portion of each of the third portion 21p3 and the fourth portion 22p4, or it may cover all of each of the third portion 21p3 and the fourth portion 22p4, or it may cover all of the third portion 21p3 and all of the fourth portion 22p4, or it may cover all of the third portion 21p3 and part of the fourth portion 22p4. In the example in Figure 3, the light-emitting element 3 is positioned to cover all of each of the third portion 21p3 and the fourth portion 22p4.

[0075] The light-emitting element 3 may be mounted on the substrate 2 by a flip-chip bond, for example. Here, for example, as shown in Figure 5, the light-emitting element 3 has a second surface (first element surface) 3f3, and the fifth electrode 35 and the sixth electrode 36 may be included on this second surface 3f3 side. The second surface 3f3 may be the surface of the light-emitting element 3 that faces the substrate 2. From another point of view, the second surface 3f3 of the light-emitting element 3 may be the surface facing the first surface 2f1 of the substrate 2. The second surface 3f3 may be a generally flat surface. The second surface 3f3 may have some irregularities.

[0076] The fifth electrode 35 and the sixth electrode 36 may each have a film-like or thin plate-like shape. The thickness of the fifth electrode 35 and the sixth electrode 36 may be, for example, about 5 μm to 30 μm. The thickness of the fifth electrode 35 may be, for example, the length of the fifth electrode 35 in the +Z direction. The thickness of the sixth electrode 36 may be, for example, the length of the sixth electrode 36 in the +Z direction.

[0077] For example, the fifth electrode 35 and the sixth electrode 36 may be aligned in the +X direction in the order described. In other words, the direction in which the fifth electrode 35 and the sixth electrode 36 are aligned may be the first direction Dr1. As illustrated in Figure 5, the fifth electrode 35 and the sixth electrode 36 may be aligned in the +X direction in the order described, and may also be separated from each other in the +X direction. The fifth electrode 35 may be located on the -X side of the sixth electrode 36. The sixth electrode 36 may be located on the +X side of the fifth electrode 35. From another point of view, the fifth electrode 35 may constitute a part of the second surface 3f3 on the -X side. The sixth electrode 36 may constitute a part of the second surface 3f3 on the +X side. The distance (also called the spacing) between the fifth electrode 35 and the sixth electrode 36 in the +X direction may be, for example, about 40 μm to 200 μm.

[0078] Conductive materials may be used for the materials constituting the fifth electrode 35 and the sixth electrode 36, respectively. Conductive materials may include metallic materials such as tungsten (W), molybdenum (Mo), manganese (Mn), or copper (Cu).

[0079] For example, the fifth electrode 35 may be the positive electrode of the light-emitting element 3, and the sixth electrode 36 may be the negative electrode of the light-emitting element 3. Alternatively, the fifth electrode 35 may be the negative electrode of the light-emitting element 3, and the sixth electrode 36 may be the positive electrode of the light-emitting element 3. Here, the fifth electrode 35 may be joined to the third portion 21p3 of the first electrode 21, and the sixth electrode 36 may be joined to the fourth portion 22p4 of the second electrode 22. More specifically, the fifth electrode 35 may be joined to the third portion 21p3 of the first electrode 21 via a third bonding material C13 as a conductive bonding material C1. The sixth electrode 36 may be joined to the fourth portion 22p4 of the second electrode 22 via a fourth bonding material C14 as a conductive bonding material C1.

[0080] With this configuration, as will be described later, the occurrence of short circuits between the first electrode 21 and the second electrode 22 during the mounting of the electronic component 4 on the substrate 2 is reduced, thereby reducing the possibility of a malfunction in which the light-emitting element 3 does not emit excitation light as the first light.

[0081] Here, the third bonding material C13 and the fourth bonding material C14 may each have a shape such as a film or a thin plate. The thickness of the third bonding material C13 and the fourth bonding material C14 may be, for example, about 5 μm to 20 μm. The thickness of the third bonding material C13 may be, for example, the length of the third bonding material C13 in the +Z direction. The thickness of the fourth bonding material C14 may be, for example, the length of the fourth bonding material C14 in the +Z direction. The materials of the third bonding material C13 and the fourth bonding material C14 may be the same or different. Conductive materials such as brazing material or solder may be applied to the materials of the third bonding material C13 and the fourth bonding material C14. For example, a gold-tin (AuSn) alloy may be applied to the brazing material or solder.

[0082] Here, for example, it is assumed that the light-emitting device 1 is viewed from above in the -Z direction, as shown in Figure 3. In this case, the third portion 21p3 of the first electrode 21 and the fourth portion 22p4 of the second electrode 22, respectively, as well as the bonding material C1 on the third portion 21p3 and the fourth portion 22p4, may be covered by the light-emitting element 3.

[0083] If this configuration is adopted, the proportion of the excitation light emitted from the light-emitting element 3 and the light emitted in the wavelength conversion unit 5 in response to the incidence of excitation light that is incident on the third portion 21p3 of the first electrode 21, the fourth portion 22p4 of the second electrode 22, and the bonding material C1 can be reduced. As a result, the proportion of the excitation light emitted from the light-emitting element 3 and the light emitted in the wavelength conversion unit 5 in response to the incidence of excitation light that is absorbed by the third portion 21p3 of the first electrode 21, the fourth portion 22p4 of the second electrode 22, and the bonding material C1 can be reduced. This can increase the amount of light emitted to the outside of the light-emitting device 1 in response to the emission of excitation light from the light-emitting element 3. As a result, light can be emitted to the outside of the light-emitting device 1 more efficiently.

[0084] For example, when the light-emitting device 1 is viewed from above in the -Z direction, the distance between the light-emitting element 3 and the electronic component 4 may be approximately 100 μm to 300 μm. From another perspective, at the first electrode 21, the distance between the region of the first portion 21p1 to which the electronic component 4 is joined and the third portion 21p3 may be approximately 100 μm to 300 μm, and at the second electrode 22, the distance between the region of the second portion 22p2 to which the electronic component 4 is joined and the fourth portion 22p4 may be approximately 100 μm to 300 μm. This reduces the occurrence of collisions between the light-emitting element 3 and the electronic component 4 when they are placed on the substrate 2. As a result, damage to either the light-emitting element 3 or the electronic component 4 may be reduced. Furthermore, the size of the light-emitting device 1, which would be increased due to the light-emitting element 3 and the electronic component 4 being too far apart, can be reduced.

[0085] In the first embodiment, the light-emitting device 1 does not have any other light-emitting element besides the light-emitting element 3. In other words, one light-emitting element 3 is mounted on the first surface 2f1 of the substrate 2. If this configuration is adopted, the light source in the light-emitting device 1 can be a point light source. This makes it easier to design the optical aspects such as focusing and beam angle in the lighting device using the light-emitting device 1.

[0086] Furthermore, for example, the light-emitting device 1 is not limited to a configuration in which it does not have any light-emitting elements other than the one light-emitting element 3. The light-emitting device 1 may have any light-emitting elements other than the one light-emitting element 3. In other words, the light-emitting device 1 may have a configuration in which two or more light-emitting elements 3 are mounted on the first surface 2f1 of the substrate 2. In this configuration, when the light-emitting device 1 is viewed from above in the -Z direction, the two or more light-emitting elements 3 may be positioned in a way that they do not overlap each other.

[0087] The light-emitting element 3 may have a thickness of, for example, 75 μm to 300 μm. The thickness of the light-emitting element 3 may be, for example, the length of the light-emitting element 3 in the +Z direction. The light-emitting element 3 may have a width of, for example, 500 μm to 2000 μm. The width of the light-emitting element 3 may be, for example, the length of the light-emitting element 3 in the +X direction. The light-emitting element 3 may have a depth of, for example, 500 μm to 2000 μm. The depth of the light-emitting element 3 may be, for example, the length of the light-emitting element 3 in the +Y direction. For example, if the shape of the outer edge of the second surface 3f3 is rectangular, the second surface 3f3 may be a rectangular surface having a width of, for example, 500 μm to 2000 μm and a depth of, for example, 500 μm to 2000 μm.

[0088] The light-emitting element 3 may include, for example, a translucent substrate and an optical semiconductor layer located on the translucent substrate. The material of the translucent substrate may be, for example, a material on which an optical semiconductor layer can be grown using a chemical vapor deposition method such as metal-organic vapor deposition or molecular beam epitaxial deposition. Examples of materials for the translucent substrate include sapphire, gallium nitride, aluminum nitride, zinc oxide, zinc selenide, silicon carbide, silicon (Si), or zirconium diboride. The translucent substrate may have a thickness of, for example, 50 μm or more and 300 μm or less. The translucent substrate may have a plate-like shape. The thickness of the translucent substrate may be, for example, the length of the translucent substrate in the +Z direction.

[0089] The optical semiconductor layer includes, for example, a first semiconductor layer, an emissive layer, and a second semiconductor layer. The first semiconductor layer may be located on a translucent substrate. The emissive layer may be located on the first semiconductor layer. The second semiconductor layer may be located on the emissive layer. The materials of the first semiconductor layer, the emissive layer, and the second semiconductor layer may be, for example, a group III nitride semiconductor or a group III-V semiconductor. The group III nitride semiconductor may be, for example, gallium nitride, aluminum nitride, or indium nitride. The group III-V semiconductor may be, for example, gallium phosphorus or gallium arsenide. The thickness of the first semiconductor layer may be, for example, 1 μm or more and 5 μm or less. The thickness of the emissive layer may be, for example, 25 nm or more and 150 nm or less. The thickness of the second semiconductor layer may be, for example, 50 nm or more and 600 nm or less.

[0090] <1-1-4. Wavelength Conversion Section> The wavelength conversion unit 5 is located on the first surface 2f1 side of the substrate 2 and covers the light-emitting element 3. In other words, the wavelength conversion unit 5 is located on the first surface 2f1 side of the substrate 2 and covers the light-emitting element 3 from the region on the opposite side of the substrate 2 from the light-emitting element 3. To put it another way, the wavelength conversion unit 5 is located on the +Z direction side of the substrate 2 and the light-emitting element 3. From another point of view, the light-emitting element 3 is sandwiched between the substrate 2 and the wavelength conversion unit 5. The wavelength conversion unit 5 may be in contact with the first surface 2f1 of the substrate 2. More specifically, the wavelength conversion unit 5 may be in contact with the first region A1 on the first surface 2f1 of the substrate 2.

[0091] The wavelength conversion unit 5 may be in contact with the surface of the reflective member 6 in the portion of the first surface 2f1 that is covered by the reflective member 6. In other words, the wavelength conversion unit 5 may be located on the first surface 2f1 of the substrate 2 via the reflective member 6. From another point of view, the wavelength conversion unit 5 may be located on the third surface 20f3 of the substrate body 20 via the reflective member 6. The wavelength conversion unit 5 may be in contact with the first surface 2f1 of the substrate 2 in the portion of the first surface 2f1 that is not covered by the reflective member 6. From another point of view, the wavelength conversion unit 5 may be in contact with the third surface 20f3 of the substrate body 20 in the portion of the first surface 2f1 that is not covered by the reflective member 6.

[0092] The wavelength conversion unit 5 may seal the light-emitting element 3 by filling the space around the light-emitting element 3. In other words, the wavelength conversion unit 5 may seal the light-emitting element 3 located on the first surface 2f1 side of the substrate 2 from the region on the opposite side of the substrate 2 from the light-emitting element 3. The wavelength conversion unit 5 may be formed, for example, by being applied to the first surface 2f1 side of the substrate 2 in a paste state and then cured.

[0093] As described above, the wavelength conversion unit 5 can emit light (second light) having a different spectrum from the excitation light (first light) emitted by the light-emitting element 3, in response to the incidence of the first light (excitation light) emitted by the light-emitting element 3. The wavelength conversion unit 5 can convert the first light (excitation light) incident on the wavelength conversion unit 5 from the light-emitting element 3 into second light (also referred to as converted light or converted light) having a spectrum in which the peak wavelength is in the wavelength region of, for example, 360 nm or more and 780 nm or less. The wavelength conversion unit 5 can emit this converted light to the outside of the wavelength conversion unit 5. In this disclosure, the wavelength region of 360 nm or more and 780 nm or less is also referred to as the visible light region (also referred to as the visible light region). The wavelength conversion unit 5 may emit light having a spectrum in which the peak wavelength is in the visible light region when excited by the light emitted by the light-emitting element 3.

[0094] The wavelength conversion unit 5 may comprise a light-transmitting substrate and a plurality of phosphors.

[0095] The substrate may be made of, for example, a light-transmitting and insulating resin or light-transmitting glass. The resin constituting the substrate may be a light-transmitting resin such as a fluororesin, silicone resin, acrylic resin, or epoxy resin. The refractive index of the substrate may be, for example, 1.4 or higher and 1.6 or lower.

[0096] Multiple phosphors may be positioned, for example, in a dispersed state within the substrate. Here, a large number of phosphors may be positioned, for example, in a substantially uniformly dispersed state within the wavelength conversion unit 5. When excitation light emitted from the light-emitting element 3 enters the interior of the wavelength conversion unit 5, the phosphors are excited by this excitation light and can emit light (also called fluorescence). Multiple phosphors may convert the incident excitation light into light (fluorescence) having a spectrum with various different peak wavelengths.

[0097] The combination of phosphor types constituting the multiple phosphors in the wavelength conversion unit 5 is not particularly limited. The types of phosphors constituting the multiple phosphors in the wavelength conversion unit 5 are not limited to blue phosphors, blue-green phosphors, green phosphors, red phosphors, and near-infrared phosphors. The multiple phosphors may include various phosphors different from the blue phosphor, blue-green phosphor, green phosphor, red phosphor, and near-infrared phosphor. Furthermore, the materials of each of the blue phosphor, blue-green phosphor, green phosphor, red phosphor, and near-infrared phosphor may include materials different from those listed above.

[0098] As described above, the excitation light incident from the light-emitting element 3 to the wavelength conversion unit 5 may be converted into light having a spectrum with various peak wavelengths different from those of the multiple phosphors. The peak wavelengths in the spectrum of this converted light may be included in the visible light region. Depending on the combination of phosphor types constituting the multiple phosphors provided in the wavelength conversion unit 5, the light converted by the wavelength conversion unit 5 may have a spectrum with multiple peak wavelengths. For example, if the multiple phosphors provided in the wavelength conversion unit 5 include a blue phosphor, a blue-green phosphor, and a green phosphor, the light converted by the wavelength conversion unit 5 will have a spectrum with peak wavelengths of blue light, blue-green light, and green light, respectively. If the multiple phosphors provided in the wavelength conversion unit 5 include only one type of phosphor material, the light converted by the wavelength conversion unit 5 will have a spectrum with a peak wavelength corresponding to this one type of phosphor. The multiple phosphors are not limited to the above example and may include various combinations of materials. The color of the light emitted from the wavelength conversion unit 5 can be determined by one or more materials contained in the multiple phosphors. In other words, the light converted by the wavelength conversion unit 5 (converted light) can have various spectra.

[0099] The light-emitting device 1 according to the first embodiment can emit light having various spectra (second light) depending on the combination of materials constituting the plurality of phosphors provided in the wavelength conversion unit 5. The light-emitting device 1 may emit light having, for example, the spectrum of direct sunlight from the sun, the spectrum of sunlight that has reached a predetermined depth in the sea, the spectrum emitted by a candle flame, or the spectrum of firefly light. In other words, the light-emitting device 1 may emit light having any color. Furthermore, the light-emitting device 1 may emit light having any color temperature.

[0100] The wavelength conversion unit 5 may have, for example, a surface 5f1 on the substrate 2 side (also referred to as the first outer surface), a surface 5f2 on the opposite side of the substrate 2 (also referred to as the second outer surface), and one or more sides (also referred to as the third outer surface) 5f3 connecting the first outer surface 5f1 and the second outer surface 5f2, respectively. The first outer surface 5f1 may be in contact with the first surface 2f1 of the substrate 2. More specifically, the first outer surface 5f1 may be in contact with the first region A1 on the first surface 2f1 of the substrate 2. In other words, the first outer surface 5f1 may be in contact with the first surface 2f1 of the substrate 2 in the portion of the first surface 2f1 that is not covered by the reflective member 6. From another point of view, the first outer surface 5f1 may be in contact with the third plate surface 20f3 of the substrate body 20 in the portion of the first surface 2f1 that is not covered by the reflective member 6. The first outer surface 5f1 may be in contact with the surface of the reflective member 6 in the portion of the first surface 2f1 of the substrate 2 that is covered by the reflective member 6. Each of the second outer surface 5f2 and one or more third outer surfaces 5f3 may be exposed to the outside of the light-emitting device 1.

[0101] If this configuration is adopted, the frame or dam surrounding the wavelength conversion unit 5 from the side is not provided on the substrate 2 and / or the reflective member 6, thus enabling miniaturization of the light-emitting device 1. A light-emitting device 1 having this structure is also called a chip-size package (CSP) type light-emitting device.

[0102] If the outer edge of the first surface 2f1 of the substrate 2 is rectangular, the three-dimensional shape of the wavelength conversion unit 5 may be a rectangular parallelepiped. In this case, the distance that the excitation light emitted from the light-emitting element 3 travels through the wavelength conversion unit 5 may increase. As a result, the proportion (also called the conversion rate) at which the first light (excitation light) is converted in the wavelength conversion unit 5 into second light (converted light) having a different spectrum from the excitation light may increase. For example, when the light-emitting device 1 is viewed from above in the -Z direction, the outer edge of the wavelength conversion unit 5 may be rectangular, for example. In other words, the first outer surface 5f1 may have a rectangular outer edge, and the second outer surface 5f2 may have a rectangular outer edge. The second outer surface 5f2 may also be a rectangular surface.

[0103] The wavelength conversion section 5 may have a thickness of, for example, 200 μm to 1000 μm. The thickness of the wavelength conversion section 5 may be, for example, the length of the wavelength conversion section 5 in the +Z direction. The wavelength conversion section 5 may have a width of, for example, 1 mm to 4 mm. The width of the wavelength conversion section 5 may be, for example, the length of the wavelength conversion section 5 in the +X direction. The wavelength conversion section 5 may have a depth of, for example, 1 mm to 4 mm. The depth of the wavelength conversion section 5 may be, for example, the length of the wavelength conversion section 5 in the +Y direction. For example, if the shape of the outer edge of the second outer surface 5f2 is rectangular, the second outer surface 5f2 may be a rectangular surface having a width of, for example, 1 mm to 4 mm and a depth of, for example, 1 mm to 4 mm.

[0104] If the wavelength conversion unit 5 has a rectangular parallelepiped shape, the light-emitting device 1 may have a cubic shape. The light-emitting device 1 may have a thickness of, for example, 400 μm to 2000 μm. The thickness of the light-emitting device 1 may be, for example, the length of the light-emitting device 1 in the +Z direction. The light-emitting device 1 may have a width of, for example, 1 mm to 4 mm. The width of the light-emitting device 1 may be, for example, the length of the light-emitting device 1 in the +X direction. The light-emitting device 1 may have a depth of, for example, 1 mm to 4 mm. The depth of the light-emitting device 1 may be, for example, the length of the light-emitting device 1 in the +Y direction.

[0105] If the shape of the outer edges of the first outer surface 5f1 and the second outer surface 5f2 are rectangular, then the one or more third outer surfaces 5f3 may be four third outer surfaces 5f3. The shape of each of the one or more third outer surfaces 5f3 may be planar or convex toward the outside of the wavelength conversion unit 5. If the shape of the third outer surface 5f3 is convex, the distance that the excitation light emitted from the light-emitting element 3 passes through the wavelength conversion unit 5 may increase. As a result, the proportion of the first light (excitation light) converted into second light (converted light) having a different spectrum from the excitation light in the wavelength conversion unit 5 may increase.

[0106] In the examples shown in Figures 1 to 5, the four third outer surfaces 5f3 include a first third outer surface 5f3 facing the +X direction, a second third outer surface 5f3 facing the -X direction, a third third outer surface 5f3 facing the +Y direction, and a fourth third outer surface 5f3 facing the -Y direction.

[0107] -When the light-emitting device 1 is viewed through a plane in the Z direction, the wavelength conversion unit 5 may be located on the outer edge of the first surface 2f1 of the substrate 2. If this configuration is adopted, the amount of excitation light emitted from the light-emitting element 3 that is reflected by the first surface 2f1 or the reflective member 6 on the first surface 2f1 and then incident into the wavelength conversion unit 5 may increase. As a result, the proportion of the first light (excitation light) emitted from the light-emitting element 3 that is converted into second light (converted light) in the wavelength conversion unit 5 may increase.

[0108] Here, we assume that the light-emitting device 1 is viewed through a plane in the -Z direction. In this case, for example, as shown in Figure 3, the wavelength conversion unit 5 may include a region that overlaps with the reflecting member 6 and a region located outside this region and that does not overlap with the reflecting member 6. If this configuration is adopted, the distance that the excitation light emitted from the light-emitting element 3 travels through the wavelength conversion unit 5 after being reflected by the reflecting member 6 can be increased. As a result, the proportion of the first light (excitation light) that is converted into second light (converted light) having a different spectrum from the excitation light can be increased in the wavelength conversion unit 5.

[0109] <1-1-5. Reflective Material> The reflective member 6 is located on the first surface 2f1 of the substrate 2. This reflective member 6 surrounds the first electrode 21 and the second electrode 22. For this reason, the reflective member 6 may be located, for example, on the third surface 20f3 of the substrate body 20. From another point of view, the reflective member 6 may be located on the first region A1 on the first surface 2f1 of the substrate 2. As described above, the first region A1 may be the region surrounding the light-emitting element 3 and the electronic component 4 on the first surface 2f1 of the substrate 2 when the light-emitting device 1 is viewed planar in the -Z direction. The reflective member 6 may have a film-like or thin plate-like shape. The reflective member 6 may be located over the entire first region A1, or it may be located in part on the first region A1.

[0110] The reflective member 6 has a higher light reflectivity than the portion of the first surface 2f1 (more specifically, the third surface 20f3) of the substrate body 20 that is in contact with the reflective member 6. As a result, the amount of first light (excitation light) emitted from the light-emitting element 3 and the second light emitted in the wavelength conversion unit 5 in response to the incidence of the first light (excitation light) can be reduced by the first surface 2f1 of the substrate 2. As a result, the amount of light emitted to the outside of the light-emitting device 1 in response to the emission of first light (excitation light) from the light-emitting element 3 can be increased. Consequently, light can be emitted to the outside of the light-emitting device 1 more efficiently.

[0111] Here, for example, the reflective member 6 may be positioned over the entire outer edge of the first surface 2f1 of the substrate 2. With this configuration, the amount of first light (excitation light) emitted from the light-emitting element 3 and second light emitted in the wavelength conversion unit 5 in response to the incidence of the first light (excitation light) can be further reduced by the first surface 2f1 of the substrate 2. As a result, the amount of light emitted to the outside of the light-emitting device 1 in response to the emission of first light (excitation light) from the light-emitting element 3 can be further increased. As a result, light can be emitted to the outside of the light-emitting device 1 more efficiently.

[0112] The material of the reflective member 6 may be, for example, a material in which a white material is added to a silicone resin. For example, titanium oxide may be used as the white material. The material of the reflective member 6 is not limited to this; any material that has a light reflectance in the reflective member 6 that is higher than the light reflectance of the first surface 2f1 (more specifically, the third surface 20f3) of the substrate body 20 is acceptable.

[0113] <1-2. Reducing the misalignment of electronic components relative to the circuit board> Figure 10 shows an example of a light-emitting device 1 according to the first embodiment, illustrating the positional relationship between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, and the positional relationship between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4. In Figure 10, the positional relationship between the first portion 21p1 and the third electrode 43, and the positional relationship between the second portion 22p2 and the fourth electrode 44 are shown when the example of the light-emitting device 1 according to the first embodiment is viewed from a plane in the -Z direction. In Figure 10, the outer edges of the portions of the first portion 21p1 and the second portion 22p2 that are hidden by the electronic component 4 are drawn with thin dashed lines, while the outer edges of the third electrode 43 and the fourth electrode 44 that are hidden by the electronic component 4 are drawn with thick dashed lines.

[0114] For example, it is assumed that the joining of the third electrode 43 to the first part 21p1 via the first bonding material C11, and the joining of the fourth electrode 44 to the second part 22p2 via the second bonding material C12, are both achieved by reflow soldering. In this case, first, due to heating, molten bonding material C1 is present between the first part 21p1 and the third electrode 43, and molten bonding material C1 is present between the second part 22p2 and the fourth electrode 44. In other words, molten bonding material C1 is located on the first part 21p1 and the third electrode 43 is located on this molten bonding material C1, and molten bonding material C1 is located on the second part 22p2 and the fourth electrode 44 is located on this molten bonding material C1. In this case, due to the surface tension of the bonding material C1, when viewed from above and downwards in a planar perspective, the electronic component 4 may be positioned such that the area where the first portion 21p1 and the third electrode 43 overlap is large, and the area where the second portion 22p2 and the fourth electrode 44 overlap is also large. Furthermore, due to the solidification of the bonding material C1 by cooling, the third electrode 43 may be bonded to the first portion 21p1 via the first bonding material C11, and the fourth electrode 44 may be bonded to the second portion 22p2 via the second bonding material C12.

[0115] Here, assuming that the width of the first portion 21p1 in the +X direction is larger, the greater the variation in the position of the third electrode 43 in the +X direction on the molten bonding material C1 on the first portion 21p1 during the reflow soldering process may be. This variation can occur because the molten bonding material C1 can spread over a wider area on the first portion 21p1. As a result, the variation in the position of the third electrode 43, which is bonded to the first portion 21p1 via the first bonding material C11, in the +X direction may increase. This can lead to a larger displacement of the position of the electronic component 4 relative to the substrate 2 in the +X direction. Consequently, in the +X direction, the third electrode 43 of the electronic component 4 may approach the second portion 22p2 of the second electrode 22 of the substrate 2, or the fourth electrode 44 of the electronic component 4 may approach the first portion 21p1 of the first electrode 21 of the substrate 2. Therefore, the distance between the third electrode 43 and the second part 22p2, or the distance between the fourth electrode 44 and the first part 21p1, may be shorter than the insulation distance required to reduce short circuits between the first part 21p1 of the first electrode 21 and the second part 22p2 of the second electrode 22.

[0116] In contrast, for example, as shown in Figure 10, it is conceivable that the first range R1 is the range in which the third electrode 43 exists in the +Y direction. In other words, the first range R1 is the range in the +Y direction in which the third electrode 43 exists. In this case, in the light-emitting device 1 according to the first embodiment, in the first range R1, the width Wp2 of the first part 21p1 in the +X direction is less than or equal to the width (also called the first width) W1 of the third electrode 43 in the +X direction. The width Wp2 of the first part 21p1 may be the length of the first part 21p1 in the +X direction. The width (first width) W1 of the third electrode 43 may be the length of the third electrode 43 in the +X direction. The width (first width) W1 of the third electrode 43 may be the maximum value (also called the maximum width) of the width of the third electrode 43.

[0117] If this configuration is adopted, for example, when reflow soldering is performed, the positional variation of the third electrode 43 in the +X direction on the molten bonding material C1 located on the first portion 21p1 may be reduced. Therefore, the positional variation in the +X direction of the third electrode 43, which is bonded to the first portion 21p1 via the first bonding material C11, may be reduced. As a result, the positional displacement of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2 may be reduced. In other words, the positional displacement of the electronic component 4 relative to the substrate 2 may be reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 may be reduced. Therefore, by ensuring an insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 may be reduced. In other words, the reliability of the light-emitting device 1 can be improved.

[0118] Here, in the first embodiment, for example, as shown in Figure 10, the shape of the first portion 21p1 may be rectangular when the first surface 2f1 of the substrate 2 is viewed planar in the -Z direction. In other words, for example, the width of the first portion 21p1 may be constant or approximately constant regardless of its position in the +Y direction. In this case, the width Wp2 of the first portion 21p1 may be the minimum width (also called the minimum width) Wp2mi of the first portion 21p1 in the first range R1, the average width (also called the average width) Wp2me of the first portion 21p1 in the first range R1, or the maximum width (also called the maximum width) Wp2ma of the first portion 21p1 in the first range R1.

[0119] In other words, in the first embodiment, in the first range R1, the minimum width (minimum width) Wp2mi of the first portion 21p1 in the +X direction may be less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction. In the first embodiment, in the first range R1, the average value (average width) Wp2me of the width (average width) of the first portion 21p1 in the +X direction may be less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction. In the first embodiment, in the first range R1, the maximum value (maximum width) Wp2ma of the width (maximum width) of the first portion 21p1 in the +X direction may be less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction.

[0120] In the example shown in Figure 10, the minimum width (minimum width) Wp2mi of the first part 21p1 in the +X direction is less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction. Also, the average width (average width) Wp2me of the first part 21p1 in the +X direction is less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction. Furthermore, the maximum width (maximum width) Wp2ma of the first part 21p1 in the +X direction is less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction.

[0121] Here, for example, in the first range R1, the minimum width (minimum width) Wp2mi of the first part 21p1 in the +X direction may be smaller than the width (first width) W1 of the third electrode 43 in the +X direction. For example, in the first range R1, the average width (average width) Wp2me of the first part 21p1 in the +X direction may be smaller than the width (first width) W1 of the third electrode 43 in the +X direction. For example, in the first range R1, the maximum width (maximum width) Wp2ma of the first part 21p1 in the +X direction may be smaller than the width (first width) W1 of the third electrode 43 in the +X direction.

[0122] If this configuration is adopted, for example, when reflow soldering is performed, the positional variation of the third electrode 43 in the +X direction on the molten bonding material C1 located on the first portion 21p1 can be further reduced. As a result, the positional variation in the +X direction of the third electrode 43, which is bonded to the first portion 21p1 via the first bonding material C11, can be further reduced. This can further reduce the positional displacement of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the positional displacement of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be further reduced. Thus, by ensuring an insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0123] In the example shown in Figure 10, the minimum width (minimum width) Wp2mi of the first part 21p1 in the +X direction is smaller than the width (first width) W1 of the third electrode 43 in the +X direction. Also, the average width (average width) Wp2me of the first part 21p1 in the +X direction is smaller than the width (first width) W1 of the third electrode 43 in the +X direction. Furthermore, the maximum width (maximum width) Wp2ma of the first part 21p1 in the +X direction is smaller than the width (first width) W1 of the third electrode 43 in the +X direction.

[0124] Here, assuming that the width of the second portion 22p2 in the +X direction is larger, the greater the variation in the position of the fourth electrode 44 in the +X direction on the molten bonding material C1 on the second portion 22p2 during the reflow soldering process may be. This variation can occur because the molten bonding material C1 can spread over a wider area on the second portion 22p2. As a result, the variation in the position of the fourth electrode 44, which is bonded to the second portion 22p2 via the second bonding material C12, in the +X direction may increase. This can lead to a larger displacement of the position of the electronic component 4 relative to the substrate 2 in the +X direction. Consequently, in the +X direction, the third electrode 43 of the electronic component 4 may approach the second portion 22p2 of the second electrode 22 of the substrate 2, or the fourth electrode 44 of the electronic component 4 may approach the first portion 21p1 of the first electrode 21 of the substrate 2. Therefore, the distance between the third electrode 43 and the second part 22p2, or the distance between the fourth electrode 44 and the first part 21p1, may be shorter than the insulation distance required to reduce short circuits between the first part 21p1 of the first electrode 21 and the second part 22p2 of the second electrode 22.

[0125] In contrast, for example, as shown in Figure 10, it is conceivable that the second range R2 is the range in which the fourth electrode 44 exists in the +Y direction. In other words, the second range R2 is the range in the +Y direction in which the fourth electrode 44 exists. In this case, in the light-emitting device 1 according to the first embodiment, in the second range R2, the width Wp4 of the second portion 22p2 in the +X direction may be less than or equal to the width (also called the second width) W2 of the fourth electrode 44 in the +X direction. The width Wp4 of the second portion 22p2 may be the length of the second portion 22p2 in the +X direction. The width (second width) W2 of the fourth electrode 44 may be the length of the fourth electrode 44 in the +X direction. The width (second width) W2 of the fourth electrode 44 may be the maximum value (also called the maximum width) of the width of the fourth electrode 44.

[0126] If this configuration is adopted, for example, when reflow soldering is performed, the positional variation of the fourth electrode 44 in the +X direction on the molten bonding material C1 located on the second portion 22p2 may be reduced. Therefore, the positional variation in the +X direction of the fourth electrode 44, which is bonded to the second portion 22p2 via the second bonding material C12, may be reduced. As a result, the positional displacement of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2 may be reduced. In other words, the positional displacement of the electronic component 4 relative to the substrate 2 may be reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 may be further reduced. Therefore, by ensuring the insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 may be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0127] In the first embodiment, for example, as shown in Figure 10, the shape of the second portion 22p2 may be rectangular when the first surface 2f1 of the substrate 2 is viewed planar in the -Z direction. In other words, for example, the width of the second portion 22p2 may be constant or approximately constant regardless of its position in the +Y direction. In this case, the width Wp4 of the second portion 22p2 may be the minimum width (also called the minimum width) Wp4mi of the second portion 22p2 in the second range R2, the average width (also called the average width) Wp4me of the second portion 22p2 in the second range R2, or the maximum width (also called the maximum width) Wp4ma of the second portion 22p2 in the second range R2.

[0128] In other words, in the first embodiment, in the second range R2, the minimum width (minimum width) Wp4mi of the second portion 22p2 in the +X direction may be less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction. In the first embodiment, in the second range R2, the average value (average width) Wp4me of the second portion 22p2 in the +X direction may be less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction. In the first embodiment, in the second range R2, the maximum value (maximum width) Wp4ma of the second portion 22p2 in the +X direction may be less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction.

[0129] In the example shown in Figure 10, the minimum width (minimum width) Wp4mi of the second part 22p2 in the +X direction is less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction. Also, the average width (average width) Wp4me of the second part 22p2 in the +X direction is less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction. Furthermore, the maximum width (maximum width) Wp4ma of the second part 22p2 in the +X direction is less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction.

[0130] Here, for example, in the second range R2, the minimum width (minimum width) Wp4mi of the second part 22p2 in the +X direction may be smaller than the width (second width) W2 of the fourth electrode 44 in the +X direction. For example, in the second range R2, the average width (average width) Wp4me of the second part 22p2 in the +X direction may be smaller than the width (second width) W2 of the fourth electrode 44 in the +X direction. For example, in the second range R2, the maximum width (maximum width) Wp4ma of the second part 22p2 in the +X direction may be smaller than the width (second width) W2 of the fourth electrode 44 in the +X direction.

[0131] If this configuration is adopted, for example, when reflow soldering is performed, the positional variation of the fourth electrode 44 in the +X direction on the molten bonding material C1 located on the second portion 22p2 can be further reduced. As a result, the positional variation in the +X direction of the fourth electrode 44, which is bonded to the second portion 22p2 via the second bonding material C12, can be further reduced. This can further reduce the positional displacement of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the positional displacement of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be further reduced. Thus, by ensuring an insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0132] In the example shown in Figure 10, the minimum width (minimum width) Wp4mi of the second part 22p2 in the +X direction is smaller than the width (second width) W2 of the fourth electrode 44 in the +X direction. Also, the average width (average width) Wp4me of the second part 22p2 in the +X direction is smaller than the width (second width) W2 of the fourth electrode 44 in the +X direction. Furthermore, the maximum width (maximum width) Wp4ma of the second part 22p2 in the +X direction is smaller than the width (second width) W2 of the fourth electrode 44 in the +X direction.

[0133] <1-3. Other Components> For example, as shown in Figure 11, the longitudinal direction of the third electrode 43 does not have to be the same as the longitudinal direction of the first part 21p1, and the longitudinal direction of the fourth electrode 44 does not have to be the same as the longitudinal direction of the second part 22p2. More specifically, for example, as shown in Figure 11, the longitudinal direction of the third electrode 43 may be inclined with respect to the longitudinal direction of the first part 21p1 at an angle of a predetermined value or less, such as a few degrees or less, and the longitudinal direction of the fourth electrode 44 may be inclined with respect to the longitudinal direction of the second part 22p2 at an angle of a predetermined value or less, such as a few degrees or less. This number of degrees may be, for example, 5 degrees, 4 degrees, 3 degrees, 2 degrees, or 1 degree.

[0134] Figure 11 shows the positional relationship between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, and the positional relationship between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4, respectively, for another example of the light-emitting device 1 according to the first embodiment. In Figure 11, the positional relationship between the first portion 21p1 and the third electrode 43, and the positional relationship between the second portion 22p2 and the fourth electrode 44 are shown when the other example of the light-emitting device 1 according to the first embodiment is viewed from above in the -Z direction. In Figure 11, as in Figure 10, the outer edges of the portions of the first portion 21p1 and the second portion 22p2 that are hidden by the electronic component 4 are drawn with thin dashed lines, and the outer edges of the third electrode 43 and the fourth electrode 44 that are hidden by the electronic component 4 are drawn with thick dashed lines.

[0135] Furthermore, for example, the electronic component 4 may have a surface 4f4 located on the opposite side of the third surface 4f2 (also referred to as the fourth surface or the second component surface). Also, for example, the light-emitting element 3 may have a surface 3f5 located on the opposite side of the second surface 3f3 (also referred to as the fifth surface or the second element surface). In other words, for example, the light-emitting element 3 may have a fifth surface 3f5 located on the opposite side of the substrate 2. Here, for example, the distance d1 from the first surface 2f1 of the substrate 2 to the fourth surface 4f4 of the electronic component 4 (also referred to as the first height) may be smaller than the distance d2 from the first surface 2f1 to the fifth surface 3f5 of the light-emitting element 3 (also referred to as the second height).

[0136] If this configuration is adopted, the amount of light blocked by the electronic component 4 from the first light (excitation light) emitted from the light-emitting element 3 and the second light (converted light) emitted by the wavelength conversion unit 5 in response to the incidence of the first light (excitation light) can be reduced. As a result, light can be efficiently emitted to the outside of the light-emitting device 1.

[0137] Here, the fourth surface 4f4 may be, for example, flat or nearly flat, convex, concave, or have irregularities. The distance (first height) d1 may be the distance between the first surface 2f1 and the fourth surface 4f4 in the +Z direction. The distance (first height) d1 may be, for example, the maximum value of the distance between the first surface 2f1 and the fourth surface 4f4 in the +Z direction. The fifth surface 3f5 may be, for example, flat or nearly flat, convex, concave, or have irregularities. The distance (second height) d2 may be the distance between the first surface 2f1 and the fifth surface 3f5 in the +Z direction. The distance (second height) d2 may be, for example, the maximum value of the distance between the first surface 2f1 and the fifth surface 3f5 in the +Z direction.

[0138] Here, for example, an electronic component 4 may have one or more sides (also called component sides) 4fs connecting the third surface 4f2 and the fourth surface 4f4, respectively. If the shape of the outer edges of the third surface 4f2 and the fourth surface 4f4 is rectangular, then the electronic component 4 has four component sides 4fs, which are one or more component sides 4fs. For example, a light-emitting element 3 may have one or more sides (also called element sides) 3fs connecting the second surface 3f3 and the fifth surface 3f5, respectively. If the shape of the outer edges of the second surface 3f3 and the fifth surface 3f5 is rectangular, then the light-emitting element 3 has four element sides 3fs, which are one or more element sides 3fs.

[0139] Furthermore, as shown in Figures 10 and 11, for example, it is conceivable that the first distance D1 is the distance from the end of the first part 21p1 opposite to the second part 22p2 in the +X direction to the end of the second part 22p2 opposite to the first part 21p1. The first distance D1 may be, for example, the distance from the second edge Es2 of the first part 21p1 to the third edge Es3 of the second part 22p2 in the +X direction. As described above, the second edge Es2 is the edge of the first part 21p1 on the -X side, opposite to the first direction Dr1, and the third edge Es3 is the edge of the second part 22p2 on the +X side. Here, for example, in the +X direction, the first distance D1 may be less than or equal to the width Wf2 of the third surface 4f2 of the electronic component 4. The width Wf2 of the third surface 4f2 may be, for example, the length of the third surface 4f2 in the +X direction.

[0140] If this configuration is adopted, the occurrence of a state in which a part of the second portion 22p2 is located in the +X direction relative to the electronic component 4 when the electronic component 4 is bonded to the substrate 2 can be reduced, as can the occurrence of a state in which a part of the first portion 21p1 is located in the -X direction relative to the electronic component 4. As a result, when the electronic component 4 is bonded to the substrate 2, the creeping of the molten bonding material C1 onto the side surface (component side surface) 4fs of the electronic component 4 in the first direction Dr1, and onto the side surface (component side surface) 4fs of the electronic component 4 in the direction opposite to the first direction Dr1, can be reduced, as shown in Figure 12. Figure 12 is a schematic diagram showing an example of a state in which the bonding material C1 has reached the side surface (component side surface) 4fs of the electronic component 4. Figure 12 is a diagram in which an example of bonding material C1 has been added to a cross-sectional view of an example of an electronic component 4 shown in Figure 8.

[0141] Figure 12 shows an example of a state in which the first bonding material C11, which joins the first portion 21p1 of the first electrode 21 and the third electrode 43, reaches the side surface (component side surface) 4fs of the electronic component 4. This state can occur, for example, when the electronic component 4 is bonded to the substrate 2, if a portion of the first portion 21p1 exists in the -X direction from the electronic component 4, the molten bonding material C1 can reach the side surface (component side surface) 4fs of the electronic component 4 in the opposite direction to the first direction Dr1 via the surface of this portion of the first portion 21p1. In this state, the first portion 21p1 of the first electrode 21 is electrically connected to the first semiconductor region 4p without going through the second A semiconductor region 4n1. As a result, a malfunction may occur in which the electronic component 4 cannot function properly. Furthermore, Figure 12 shows an example of a state in which the second bonding material C12, which joins the second portion 22p2 of the second electrode 22 and the fourth electrode 44, reaches the side surface (component side surface) 4fs of the electronic component 4. This state can occur, for example, when the electronic component 4 is bonded to the substrate 2, if a part of the second portion 22p2 exists in the +X direction from the electronic component 4, and the molten bonding material C1 reaches the side surface (component side surface) 4fs in the first direction Dr1 of the electronic component 4 via the surface of this part of the second portion 22p2. In this state, the second portion 22p2 of the second electrode 22 is electrically connected to the first semiconductor region 4p without going through the second B semiconductor region 4n2. As a result, a malfunction may occur in which the electronic component 4 cannot function properly.

[0142] In contrast, by reducing the creeping of the molten bonding material C1 onto the component side surface 4fs of the electronic component 4 as described above, the amount of bonding material C1 reaching the component side surface 4fs of the electronic component 4 can be reduced. As a result, for example, in the light-emitting device 1, deviations from the light distribution design that may occur due to light reflection and diffuse reflection on the surface of the bonding material C1 located along the side surface (component side surface) 4fs of the electronic component 4 can be reduced. Therefore, the occurrence of light spreading in directions other than those intended from the light-emitting device 1 can be reduced. Furthermore, in the light-emitting device 1, for example, as shown in Figure 12, if the side surface (component side surface) 4fs of the electronic component 4 is not covered with an insulator, the occurrence of a malfunction in which the first part 21p1 of the first electrode 21 or the second part 22p2 of the second electrode 22 is electrically connected to an unintended polarity part of the electronic component 4 can be reduced.

[0143] Here, for example, if the first distance D1 in the +X direction is smaller than the width Wf2 of the third surface 4f2 of the electronic component 4, the amount of molten bonding material C1 reaching the component side surface 4fs of the electronic component 4 can be further reduced by further reducing the creeping of the molten bonding material C1 onto the component side surface 4fs of the electronic component 4 as described above. As a result, for example, in the light-emitting device 1, deviations from the light distribution design that may occur due to light reflection and diffuse reflection on the surface of the bonding material C1 located along the side surface (component side surface) 4fs of the electronic component 4 can be further reduced. Therefore, the occurrence of light spreading in directions other than those intended from the light-emitting device 1 can be further reduced. In addition, in the light-emitting device 1, for example, as shown in Figure 12, if the side surface (component side surface) 4fs of the electronic component 4 is not covered with an insulator, the occurrence of a malfunction in which the first part 21p1 of the first electrode 21 or the second part 22p2 of the second electrode 22 is electrically connected to an unintended polarity part of the electronic component 4 can be further reduced.

[0144] Furthermore, as shown in Figures 10 and 11, for example, the second distance D2 may be defined as the distance from the end of the third electrode 43 opposite to the fourth electrode 44 to the end of the fourth electrode 44 opposite to the third electrode 43 in the +X direction. Here, for example, the first distance D1 may be less than or equal to the second distance D2 in the +X direction.

[0145] If this configuration is adopted, the occurrence of a state in which a part of the second portion 22p2 is located in the +X direction relative to the electronic component 4 when the electronic component 4 is bonded to the substrate 2, and the occurrence of a state in which a part of the first portion 21p1 is located in the -X direction relative to the electronic component 4, can be further reduced. As a result, the occurrence of molten bonding material C1 creeping up onto the side surface (component side surface) 4fs of the electronic component 4 in the first direction Dr1, and onto the side surface (component side surface) 4fs of the electronic component 4 in the opposite direction to the first direction Dr1, as shown in Figure 12, can be further reduced. Therefore, the reach of bonding material C1 onto the component side surface 4fs of the electronic component 4 can be further reduced. As a result, for example, in the light-emitting device 1, the occurrence of deviations from the light distribution design that may occur due to light reflection and diffuse reflection on the surface of the bonding material C1 located along the side surface (component side surface) 4fs of the electronic component 4 can be further reduced. Thus, the occurrence of light spreading in directions not intended from the light-emitting device 1 can be further reduced. Furthermore, in the light-emitting device 1, for example, as shown in Figure 12, if the side surface (component side surface) 4fs of the electronic component 4 is not covered with an insulator, the occurrence of a malfunction in which the first portion 21p1 of the first electrode 21 or the second portion 22p2 of the second electrode 22 is electrically connected to an unintended polarity portion of the electronic component 4 can be further reduced.

[0146] Here, for example, if the first distance D1 is smaller than the second distance D2 in the +X direction, the occurrence of a state where a part of the second portion 22p2 is located in the +X direction relative to the electronic component 4, and a state where a part of the first portion 21p1 is located in the -X direction relative to the electronic component 4, can be further reduced when the electronic component 4 is bonded to the substrate 2. As a result, the occurrence of molten bonding material C1 creeping up onto the side surface (component side surface) 4fs of the electronic component 4 in the first direction Dr1, and onto the side surface (component side surface) 4fs of the electronic component 4 in the opposite direction to the first direction Dr1, as shown in Figure 12, can be further reduced when the electronic component 4 is bonded to the substrate 2. Therefore, the reach of bonding material C1 onto the component side surface 4fs of the electronic component 4 can be further reduced. As a result, for example, in the light-emitting device 1, the occurrence of deviations from the light distribution design that may occur due to light reflection and diffuse reflection on the surface of the bonding material C1 located along the side surface (component side surface) 4fs of the electronic component 4 can be further reduced. Therefore, the occurrence of light spreading in directions unintended from the light-emitting device 1 can be further reduced. In addition, in the light-emitting device 1, for example, as shown in Figure 12, if the side surface (part side surface) 4fs of the electronic component 4 is not covered with an insulator, the occurrence of a malfunction in which the first part 21p1 of the first electrode 21 or the second part 22p2 of the second electrode 22 is electrically connected to an unintended polarity part of the electronic component 4 can be further reduced.

[0147] Furthermore, as shown in Figures 10 and 11, for example, the distance Ds1 between the first portion 21p1 and the second portion 22p2 (also referred to as the first interval) in the +X direction may be greater than or equal to the distance Ds2 between the third electrode 43 and the fourth electrode 44 (also referred to as the second interval). The first interval Ds1 may be, for example, the distance from the first edge Es1 of the first portion 21p1 to the fourth edge Es4 of the second portion 22p2 in the +X direction.

[0148] If this configuration is adopted, even if the position of the electronic component 4 relative to the substrate 2 is misaligned in the first direction Dr1 when the electronic component 4 is bonded to the substrate 2, the proximity between the first portion 21p1 of the first electrode 21 of the substrate 2 and the fourth electrode 44 of the electronic component 4, as well as the proximity between the second portion 22p2 of the second electrode 22 of the substrate 2 and the third electrode 43 of the electronic component 4, can be reduced. As a result, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be reduced. In other words, the reliability of the light-emitting device 1 can be improved.

[0149] Here, for example, in the +X direction, the distance between the first part 21p1 and the second part 22p2 (first distance) Ds1 may be greater than the distance between the third electrode 43 and the fourth electrode 44 (second distance) Ds2. In this case, when the electronic component 4 is joined to the substrate 2, even if the position of the electronic component 4 relative to the substrate 2 is shifted in the first direction Dr1, the proximity between the first part 21p1 of the first electrode 21 of the substrate 2 and the fourth electrode 44 of the electronic component 4, as well as the proximity between the second part 22p2 of the second electrode 22 of the substrate 2 and the third electrode 43 of the electronic component 4, can be further reduced. As a result, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0150] Furthermore, for example, as shown in Figure 3, the first portion 21p1 of the first electrode 21 may include a portion (also called the first tip) Ep1 that protrudes from the third portion 21p3 and is located on the opposite side from the third portion 21p3. The second portion 22p2 of the second electrode 22 may include a portion (also called the second tip) Ep2 that protrudes from the fourth portion 22p4 and is located on the opposite side from the fourth portion 22p4. Here, for example, as shown in Figures 10 and 11, when the first surface 2f1 of the substrate 2 and the electronic component 4 are viewed from a plane, at least one of the tips of the first tip Ep1 and the second tip Ep2 may protrude from the electronic component 4 in the +Y direction. When the first surface 2f1 of the substrate 2 and the electronic component 4 are viewed from a plane, this may mean that the first surface 2f1 of the substrate 2 and the electronic component 4 are viewed from a plane in the -Z direction.

[0151] If this configuration is adopted, it can be easily visually confirmed that the electronic component 4 is securely mounted on the substrate 2. Furthermore, for example, when the electronic component 4 is bonded to the substrate 2, even if the position of the electronic component 4 relative to the substrate 2 is slightly off from the design position, the bonding between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, or the bonding between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4, can be performed more reliably. For example, if the first surface 2f1 and the electronic component 4 are viewed from above, and the first tip portion Ep1 protrudes from the electronic component 4 in the +Y direction, then when the electronic component 4 is bonded to the substrate 2, even if the position of the electronic component 4 relative to the substrate 2 is slightly off from the design position, the bonding between the first portion 21p1 and the third electrode 43 can be performed more reliably. For example, if the first surface 2f1 and the electronic component 4 are viewed from above, and the second tip portion Ep2 protrudes from the electronic component 4 in the +Y direction, then when the electronic component 4 is bonded to the substrate 2, even if the position of the electronic component 4 relative to the substrate 2 is slightly off from the design position, the bonding between the second portion 22p2 and the fourth electrode 44 can be more reliably achieved. Furthermore, it becomes easier to secure the area where the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4 are bonded, or where the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4 are bonded. For example, if the first surface 2f1 and the electronic component 4 are viewed through from above, and the second tip portion Ep2 protrudes from the electronic component 4 in the +Y direction, then a region can be secured in which the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4 are joined. This can increase heat dissipation from the electronic component 4 through the substrate 2 in the light-emitting device 1.

[0152] Furthermore, as shown in Figures 10 and 11, for example, when the first surface 2f1 of the substrate 2 and the electronic component 4 are viewed from a plane, the first tip portion Ep1 and the second tip portion Ep2 may each protrude from the electronic component 4 in the +Y direction. When the first surface 2f1 of the substrate 2 and the electronic component 4 are viewed from a plane, this may be when the first surface 2f1 of the substrate 2 and the electronic component 4 are viewed from a plane in the -Z direction.

[0153] With this configuration, it is easy to visually confirm that the electronic component 4 is securely mounted on the substrate 2. Furthermore, even if the position of the electronic component 4 relative to the substrate 2 is slightly off from the design position when the electronic component 4 is bonded to the substrate 2, the bonding between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, and the bonding between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4 can be performed more reliably. In addition, it is easy to secure the area where the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4 are bonded, and where the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4 are bonded. As a result, heat dissipation from the electronic component 4 through the substrate 2 can be increased in the light-emitting device 1.

[0154] <1-4. Experimental Examples Regarding the Occurrence of Misalignment of Electronic Components on a Substrate> Here, a specific example of an experiment conducted regarding the occurrence of displacement of the electronic component 4 relative to the substrate 2 with respect to the light-emitting device 1 according to the first embodiment described above will be explained. In addition, a reference example of an experiment conducted regarding the occurrence of displacement of the electronic component 4 relative to the substrate 2A will be explained.

[0155] The following will be explained in order: [i] the conditions relating to the electronic component 4 used in both a specific example and a reference example of the experiment; [ii] the conditions relating to the first surface 2f1 of the substrate 2 used in a specific example of the experiment and the conditions relating to the first surface 2f1 of the substrate 2A used in a reference example of the experiment; [iii] the conditions relating to the bonding of the electronic component 4 to the substrate 2 in a specific example of the experiment and the conditions relating to the bonding of the electronic component 4 to the substrate 2A in a reference example of the experiment; and [iv] the conditions relating to the measurement of the distance between electrodes in accordance with the displacement of the electronic component 4 bonded to the substrate 2 in a specific example of the experiment and the conditions relating to the measurement of the distance between electrodes in accordance with the displacement of the electronic component 4 bonded to the substrate 2A in a reference example of the experiment. Then, [v] the measurement results for the distance between electrodes in accordance with the displacement of the electronic component 4 to the substrate 2 in a specific example of the experiment and the measurement results for the distance between electrodes in accordance with the displacement of the electronic component 4 to the substrate 2A in a reference example of the experiment will be explained.

[0156] <1-4-1. Conditions related to electronic components> In both the specific example and reference example of the experiment, a Zener diode having substantially identical configuration and dimensions was used as electronic component 4.

[0157] Figure 13 is a bottom view showing the appearance of electronic component 4, which was used in both a specific example and a reference example of the experiment.

[0158] As shown in Figure 13, the third surface (first component surface) 4f2 of the electronic component 4 was a roughly flat, square-shaped surface with a width of approximately 395 μm and a depth of approximately 395 μm. When the third surface (first component surface) 4f2 of the electronic component 4 was viewed from above, the third electrode 43 and the fourth electrode 44 were located in the center of the third surface (first component surface) 4f2 in the direction of its width. When the third surface (first component surface) 4f2 of the electronic component 4 was viewed from above, the third electrode 43 and the fourth electrode 44 were symmetrical with respect to a hypothetical straight line along the direction of the depth of the third surface (first component surface) 4f2.

[0159] In each of the third electrode 43 and the fourth electrode 44, the surface constituting the third face (first component face) 4f2 of the electronic component 4 was a rectangular surface having a width of approximately 120 μm and a length of approximately 310 μm. The direction of the width of the third face (first component face) 4f2 was the same as the direction of the width of the surface constituting the third face (first component face) 4f2 of the electronic component 4 in each of the third electrode 43 and the fourth electrode 44. The direction of the depth of the third face (first component face) 4f2 was the same as the direction of the length of the surface constituting the third face (first component face) 4f2 of the electronic component 4 in each of the third electrode 43 and the fourth electrode 44.

[0160] The distance between the third electrode 43 and the fourth electrode 44 was set to approximately 85 μm. The distance between the end of the third electrode 43 on the third surface (first component surface) 4f2 opposite to the fourth electrode 44 and the outer edge of the third surface (first component surface) 4f2 on the opposite side of the third electrode 43 was set to approximately 35 μm. The distance between the end of the fourth electrode 44 on the third surface (first component surface) 4f2 opposite to the third electrode 43 and the outer edge of the third surface (first component surface) 4f2 on the opposite side of the fourth electrode 44 was set to approximately 35 μm. On each side of the length direction (longitudinal direction) of the third electrode 43 on the third surface (first component surface) 4f2, the distance between the third electrode 43 and the outer edge of the third surface (first component surface) 4f2 was set to approximately 42.5 μm. On each side of the third surface (first component surface) 4f2 in the longitudinal direction of the fourth electrode 44, the distance between the fourth electrode 44 and the outer edge of the third surface (first component surface) 4f2 was set to approximately 42.5 μm.

[0161] Furthermore, before the electronic component 4 was bonded to the substrate 2, the electronic component 4 had a layer of AuSn approximately 15 μm thick as a bonding material on the entire surface of the third electrode 43 and the entire surface of the fourth electrode 44 on the third surface (first component surface) 4f2.

[0162] <1-4-2. Conditions relating to the first surface of the substrate> <<One specific example>> Figure 14 is a plan view showing the appearance of substrate 2 used in one specific example of the experiment.

[0163] As shown in Figure 14, the first surface (first board surface) 2f1 of the substrate 2 was a roughly flat, square-shaped surface. When the first surface (first board surface) 2f1 of the substrate 2 was viewed from above, the first electrode 21 and the second electrode 22 were located in the center of the first surface (first board surface) 2f1 in the width direction. When the first surface (first board surface) 2f1 of the substrate 2 was viewed from above, the first electrode 21 and the second electrode 22 were symmetrical with respect to a hypothetical straight line along the depth direction of the first surface (first board surface) 2f1.

[0164] The distance between the third portion 21p3 of the first electrode 21 and the fourth portion 22p4 of the second electrode 22 was set to approximately 90 μm.

[0165] In the first portion 21p1 of the first electrode 21, the surface constituting the first surface (first board surface) 2f1 of the substrate 2 was a rectangular surface with a width of approximately 105 μm. The direction of the width of the first surface (first board surface) 2f1 was the same as the direction of the width of the surface constituting the first surface (first board surface) 2f1 of the substrate 2 in the first portion 21p1 of the first electrode 21. The direction of the depth of the first surface (first board surface) 2f1 was the same as the direction of the length of the surface constituting the first surface (first board surface) 2f1 of the substrate 2 in the first portion 21p1 of the first electrode 21. The dimensions of the second portion 22p2 were approximately the same as the dimensions of the first portion 21p1.

[0166] The distance between the first portion 21p1 of the first electrode 21 and the second portion 22p2 of the second electrode 22 was set to approximately 90 μm.

[0167] The reflective member 6 was positioned above the area surrounding the first electrode 21 and the second electrode 22 on the first surface (first plate surface) 2f1. The reflective member 6 was positioned over the entire region of the first surface (first plate surface) 2f1 that was more than 100 μm away from both the first electrode 21 and the second electrode 22.

[0168] <<One reference example>> Figure 15 is a plan view showing the appearance of substrate 2A, which was used in one example experiment.

[0169] In one example of the experiment, substrate 2A was based on substrate 2 used in the specific example of the experiment described above, and had a first part 21p1A instead of the first part 21p1, and a second part 22p2A instead of the second part 22p2. The first part 21p1A was based on the first part 21p1, and had a configuration in which the width of a part of this first part 21p1 was expanded in the direction opposite to that of the second part 22p2. The second part 22p2A was based on the second part 22p2, and had a configuration in which the width of a part of this second part 22p2 was expanded in the direction opposite to that of the first part 21p1.

[0170] As shown in Figure 15, the first part 21p1A was composed of the first A part 21p1Aa, which is located on the opposite side from the third part 21p3, and the first B part 21p1Ab, which is located on the side of the third part 21p3.

[0171] In section 1A 21p1Aa, the surface constituting the first surface (first board surface) 2f1 of the substrate 2 was a rectangular surface having a width of approximately 155 μm and a length of approximately 400 μm. The direction of the width of the first surface (first board surface) 2f1 was the same as the direction of the width of the surface constituting the first surface (first board surface) 2f1 of the substrate 2 in section 1A 21p1Aa. The direction of the depth of the first surface (first board surface) 2f1 was the same as the direction of the length of the surface constituting the first surface (first board surface) 2f1 of the substrate 2 in section 1A 21p1Aa.

[0172] In section 1B 21p1Ab, the surface constituting the first surface (first board surface) 2f1 of the substrate 2 was a rectangular surface with a width of approximately 105 μm. The direction of the width of the first surface (first board surface) 2f1 was the same as the direction of the width of the surface constituting the first surface (first board surface) 2f1 of the substrate 2 in section 1B 21p1Ab. The direction of the depth of the first surface (first board surface) 2f1 was the same as the direction of the length of the surface constituting the first surface (first board surface) 2f1 of the substrate 2 in section 1B 21p1Ab.

[0173] As shown in Figure 15, the second section 22p2A consisted of the second A section 22p2Aa, located on the opposite side from the fourth section 22p4, and the second B section 22p2Ab, located on the fourth section 22p4 side. The dimensions of the second A section 22p2Aa were approximately the same as those of the first A section 21p1Aa. The dimensions of the second B section 22p2Ab were approximately the same as those of the first B section 21p1Ab.

[0174] <1-4-3. Conditions for bonding electronic components to a substrate> <<One specific example>> In one specific example of the experiment, an electronic component 4 was placed on a substrate 2 with its first surface (first board surface) 2f1 facing upwards. The substrate 2 was then heated to approximately 300°C for a predetermined time, thereby bonding the electronic component 4 to the substrate 2. As a result, multiple samples related to this specific example of the experiment were created.

[0175] Figure 14 shows, in a specific example of the experiment, the outer edge of the position of the electronic component 4 when it is placed on the substrate 2, and the outer edges of the positions of the third electrode 43 and the fourth electrode 44 at that time, are indicated by thin dashed lines.

[0176] In this configuration, the electronic component 4 is placed on the substrate 2 such that, when the first surface 2f1 and the electronic component 4 are viewed from above, a hypothetical straight line passing midway between the first portion 21p1 of the first electrode 21 and the second portion 22p2 of the second electrode 22 coincides with a hypothetical straight line passing midway between the third electrode 43 and the fourth electrode 44. In this configuration, when the first surface 2f1 and the electronic component 4 are viewed from above, the first tip Ep1 of the first portion 21p1 of the first electrode 21 and the second tip Ep2 of the second portion 22p2 of the second electrode 22 each protrude approximately 2.5 μm from the electronic component 4.

[0177] <<One reference example>> In one example of the experiment, an electronic component 4 was placed on a substrate 2A with its first surface (first board surface) 2f1 facing upwards. The substrate 2A was then heated to approximately 300°C for a predetermined time, thereby bonding the electronic component 4 to the substrate 2A. As a result, multiple samples related to this example experiment were created.

[0178] Figure 15 shows, as a reference example of the experiment, the outer edge of the position of the electronic component 4 when it is placed on the substrate 2A, and the outer edges of the positions of the third electrode 43 and the fourth electrode 44 at that time, are indicated by thin dashed lines.

[0179] In this configuration, when the first surface 2f1 and the electronic component 4 are viewed from above, the electronic component 4 is placed on the substrate 2A in such a way that a hypothetical straight line passing midway between the first portion 21p1A of the first electrode 21 and the second portion 22p2A of the second electrode 22 coincides with a hypothetical straight line passing midway between the third electrode 43 and the fourth electrode 44. In this case, when the first surface 2f1 and the electronic component 4 are viewed from above, the center of the portion consisting of the first A portion 21p1Aa of the first portion 21p1A of the first electrode 21 and the second A portion 22p2Aa of the second portion 22p2A of the second electrode 22 coincides with the center of the electronic component 4.

[0180] <1-4-4. Measurement conditions for the distance between electrodes according to the displacement of electronic components relative to the substrate> <<One specific example>> Figure 16 is a diagram illustrating a method for measuring the shorter of the following distances (also called the first spatial distance or spatial distance) for each of several samples relating to one specific example of the experiment: the distance between the first portion 21p1 of the first electrode 21 of the substrate 2 and the fourth electrode 44 of the electronic component 4 in the first direction Dr1, and the distance between the second portion 22p2 of the second electrode 22 of the substrate 2 and the third electrode 43 of the electronic component 4 in the first direction Dr1. In Figure 16, for an example of a sample relating to one specific example of the experiment, the positional relationship between the first portion 21p1 and the third electrode 43, and the positional relationship between the second portion 22p2 and the fourth electrode 44, are shown when the first surface 2f1 and the electronic component 4 are viewed from above. In Figure 16, the outer edges of the parts of the first portion 21p1 and the second portion 22p2 that are hidden by the electronic component 4 are drawn with thin dashed lines, and the outer edges of the third electrode 43 and the fourth electrode 44 that are hidden by the electronic component 4 are drawn with thick dashed lines.

[0181] As shown in Figure 16, for each of several samples relating to a specific example of the experiment, the distance Dd1 (also called the first eccentricity distance) between a hypothetical line (also called the first hypothetical line) Lv1 passing midway between the first part 21p1 of the first electrode 21 and the second part 22p2 of the second electrode 22, and a hypothetical line (also called the second hypothetical line) Lv2 passing midway between the third electrode 43 and the fourth electrode 44 was measured using a length-measuring microscope. The first eccentricity distance Dd1 was defined as the distance between the first hypothetical line Lv1 and the second hypothetical line Lv2 in the first direction Dr1.

[0182] Furthermore, if the first eccentricity distance Dd1 was 2.5 μm or less, the first spatial distance Dg1 was set to 85 μm. On the other hand, if the first eccentricity distance Dd1 was greater than 2.5 μm, the first spatial distance Dg1 (in μm) was calculated by substituting the first eccentricity distance Dd1 (in μm) into the following equation (1).

[0183] Dg1 = (90 - 2.5) - Dd1 ... (1).

[0184] Incidentally, in some of the samples among several samples related to one specific example of the experiment, there were cases where the electronic component 4 was clearly tilted when bonded to the substrate 2. More specifically, in some of the samples among several samples related to one specific example of the experiment, there were cases where the longitudinal directions of the third electrode 43 and the fourth electrode 44 of the electronic component 4 were clearly tilted in a direction that rotates around the normal to the first surface 2f1 with respect to the longitudinal directions of the first portion 21p1 and the second portion 22p2 of the substrate 2. Figure 17 is a diagram illustrating the method for measuring the first spatial distance Dg1 when the electronic component 4 was clearly tilted when bonded to the substrate 2 for each of the samples related to one specific example of the experiment. In this case, as shown in Figure 17, a length-measuring microscope was used to measure the first spatial distance Dg1 from the positions of the design outer edges of the first portion 21p1 and the second portion 22p2 of the substrate 2 and the positions of the design outer edges of the third electrode 43 and the fourth electrode 44 of the electronic component 4.

[0185] In this study, the first spatial distance (spatial distance) Dg1 was measured for each of the 397 samples related to a specific example of the experiment.

[0186] <<One reference example>> Figure 18 is a diagram illustrating the measurement method for the shorter of the following distances (also called the second spatial distance or spatial distance) for each of several samples relating to one reference example of the experiment: the distance between the first portion 21p1A of the first electrode 21 of substrate 2A and the fourth electrode 44 of electronic component 4 in the first direction Dr1, and the distance between the second portion 22p2A of the second electrode 22 of substrate 2A and the third electrode 43 of electronic component 4 in the first direction Dr1. In Figure 18, for an example of a sample relating to one reference example of the experiment, the positional relationship between the first portion 21p1A and the third electrode 43 and the positional relationship between the second portion 22p2A and the fourth electrode 44 are shown when the first surface 2f1 and electronic component 4 are viewed from above. In Figure 18, the outer edges of the parts of the first section 21p1A and the second section 22p2A that are hidden by electronic component 4 are drawn with thin dashed lines, while the outer edges of the third electrode 43 and the fourth electrode 44, which are hidden by electronic component 4 itself, are drawn with thick dashed lines.

[0187] As shown in Figure 18, for each of several samples relating to one reference example of the experiment, the distance Dd2 (also called the second eccentricity distance) between a hypothetical line (also called the first A hypothetical line) Lv1A passing midway between the first part 21p1A of the first electrode 21 and the second part 22p2A of the second electrode 22, and a hypothetical line (also called the second hypothetical line) Lv2 passing midway between the third electrode 43 and the fourth electrode 44 was measured using a length-measuring microscope. The second eccentricity distance Dd2 was defined as the distance between the first A hypothetical line Lv1A and the second hypothetical line Lv2 in the first direction Dr1.

[0188] Furthermore, if the second eccentricity distance Dd2 was 2.5 μm or less, the second spatial distance Dg2 was set to 85 μm. On the other hand, if the second eccentricity distance Dd2 was greater than 2.5 μm, the second spatial distance Dg2 (in μm) was calculated by substituting the second eccentricity distance Dd2 (in μm) into the following equation (2).

[0189] Dg2 = (90 - 2.5) - Dd2 ... (2).

[0190] Incidentally, in some of the samples among the multiple samples related to one reference example of the experiment, just as in some of the samples related to one specific example of the experiment, there were instances where the electronic component 4 was clearly tilted when bonded to the substrate 2A. More specifically, in some of the samples among the multiple samples related to one reference example of the experiment, there were instances where the longitudinal directions of the third electrode 43 and the fourth electrode 44 of the electronic component 4 were clearly tilted in a direction that rotates around the normal to the first surface 2f1 with respect to the longitudinal directions of the first portion 21p1A and the second portion 22p2A of the substrate 2A. Figure 19 is a diagram illustrating the method for measuring the second spatial distance Dg2 when the electronic component 4 is clearly tilted when bonded to the substrate 2A in some of the samples related to one reference example of the experiment. In this case, as shown in Figure 19, a length-measuring microscope was used to measure the second spatial distance Dg2 from the positions of the design outer edges of the first portion 21p1A and the second portion 22p2A of the substrate 2A, and the positions of the design outer edges of the third electrode 43 and the fourth electrode 44 of the electronic component 4.

[0191] In this study, the second spatial distance (spatial distance) Dg2 was measured for each of the 399 samples related to one example of the experiment.

[0192] <1-4-5. Measurement results of the distance between electrodes according to the displacement of electronic components relative to the substrate> Figures 20 and 21 show the measurement results of the first spatial distance Dg1 for each of several samples related to one specific example of the experiment, and the measurement results of the second spatial distance Dg2 for each of several samples related to one reference example of the experiment.

[0193] Figure 20 shows the maximum value, minimum value, mean value, and standard deviation of the first spatial distance (spatial distance) Dg1, measured for 397 samples related to one specific example of the experiment. Figure 20 also shows the maximum value, minimum value, mean value, and standard deviation of the second spatial distance (spatial distance) Dg2, measured for 399 samples related to one reference example of the experiment.

[0194] Figure 21 shows the relationship between the first spatial distance (spatial distance) Dg1, measured for 397 samples related to one specific example of the experiment, and the frequency, using a bar graph with black bars. Figure 21 also shows the relationship between the second spatial distance (spatial distance) Dg2, measured for 399 samples related to one reference example of the experiment, and the frequency, using a bar graph with upward-sloping hatched bars.

[0195] As shown in Figure 20, the standard deviation (variability) of the first spatial distance (spatial distance) Dg1 for one specific example of the experiment was found to be smaller than the standard deviation (variability) of the second spatial distance (spatial distance) Dg2 for one reference example of the experiment. Furthermore, as shown in Figure 21, for the first spatial distance (spatial distance) Dg1 for one specific example of the experiment, the frequency of the maximum value of 85 μm was higher, and the frequency of smaller values ​​was lower, compared to the second spatial distance (spatial distance) Dg2 for one reference example of the experiment.

[0196] Therefore, it was confirmed that if, in the first range R1, the width Wp2 of the first portion 21p1 is less than or equal to the first width W1 of the third electrode 43, and in the second range R2, the width Wp4 of the second portion 22p2 is less than or equal to the second width W2 of the fourth electrode 44, then the positional displacement of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is joined to the substrate 2 can be reduced. In other words, it was confirmed that the positional displacement of the electronic component 4 relative to the substrate 2 can be reduced. Furthermore, it was confirmed that the proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2 can be reduced. Thus, it was confirmed that the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be reduced by ensuring an insulating distance between the electrodes. In other words, it was confirmed that the reliability of the light-emitting device 1 can be improved.

[0197] <1-5. Summary of the First Embodiment> In the light-emitting device 1 according to the first embodiment, in the first range R1, the width Wp2 of the first portion 21p1 is less than or equal to the first width W1 of the third electrode 43. The first range R1 is the range in which the third electrode 43 exists in the +Y direction. If this configuration is adopted, the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is joined to the substrate 2 can be reduced. That is, the misalignment of the electronic component 4 relative to the substrate 2 can be reduced. Furthermore, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be reduced. Therefore, by ensuring an insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be reduced. In other words, the reliability of the light-emitting device 1 can be improved.

[0198] <2. Other Embodiments> This disclosure is not limited to the first embodiment described above, and various modifications and improvements are possible without departing from the gist of this disclosure.

[0199] <2-1. Second Embodiment> In the first embodiment described above, for example, as shown in Figure 22, the distance between the first portion 21p1 and the second portion 22p2 (first distance) Ds1 in the +X direction may be equal to the distance between the third electrode 43 and the fourth electrode 44 (second distance) Ds2. Here, for example, the first distance D1 may be less than or equal to the width Wf2 of the third surface 4f2 of the electronic component 4, or less than or equal to the second distance D2. As described above, the first distance D1 may be the distance in the +X direction from the end of the first portion 21p1 opposite to the second portion 22p2 to the end of the second portion 22p2 opposite to the first portion 21p1. The second distance D2 may be the distance in the +X direction from the end of the third electrode 43 opposite to the fourth electrode 44 to the end of the fourth electrode 44 opposite to the third electrode 43.

[0200] In this case, when the electronic component 4 is bonded to the substrate 2, the creeping of the molten bonding material C1 onto the side surface (component side surface) 4fs of the electronic component 4 in the first direction Dr1 and onto the side surface (component side surface) 4fs of the electronic component 4 in the direction opposite to the first direction Dr1 can be reduced. Furthermore, since the excessive reduction of the width Wp2 of the first portion 21p1 and the width Wp4 of the second portion 22p2 can be reduced, the decrease in the strength of the bond between the electronic component 4 and the substrate 2 can be reduced.

[0201] Figure 22 shows an example of a light-emitting device 1 according to the second embodiment, illustrating the positional relationship between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, and the positional relationship between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4. In Figure 22, as with Figure 10, the positional relationship between the first portion 21p1 and the third electrode 43 and the positional relationship between the second portion 22p2 and the fourth electrode 44 are shown when viewed from a plane in the -Z direction. In Figure 22, as with Figure 10, the outer edges of the portions of the first portion 21p1 and the second portion 22p2 that are hidden by the electronic component 4 are drawn with thin dashed lines, while the outer edges of the third electrode 43 and the fourth electrode 44 that are hidden by the electronic component 4 are drawn with thick dashed lines.

[0202] <2-2. Third Embodiment> In the first embodiment described above, for example, as shown in Figure 23, the first distance D1 may be equivalent to the second distance D2. The first distance D1 may be the distance in the +X direction from the end of the first portion 21p1 opposite to the second portion 22p2 to the end of the second portion 22p2 opposite to the first portion 21p1. The second distance D2 may be the distance in the +X direction from the end of the third electrode 43 opposite to the fourth electrode 44 to the end of the fourth electrode 44 opposite to the third electrode 43. Here, for example, in the +X direction, the distance between the first portion 21p1 and the second portion 22p2 (first distance) Ds1 may be greater than the distance between the third electrode 43 and the fourth electrode 44 (second distance) Ds2.

[0203] In this case, even if the position of the electronic component 4 relative to the substrate 2 shifts in the first direction Dr1 when the electronic component 4 is bonded to the substrate 2, the proximity between the first portion 21p1 of the first electrode 21 of the substrate 2 and the fourth electrode 44 of the electronic component 4, as well as the proximity between the second portion 22p2 of the second electrode 22 of the substrate 2 and the third electrode 43 of the electronic component 4, can be reduced. As a result, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be reduced. In other words, the reliability of the light-emitting device 1 can be improved. Furthermore, since excessive reduction in the width Wp2 of the first portion 21p1 and the width Wp4 of the second portion 22p2 can be reduced, the decrease in the strength of the bond between the electronic component 4 and the substrate 2 can be reduced.

[0204] Figure 23 is a diagram showing an example of a light-emitting device 1 according to the third embodiment, illustrating the positional relationship between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, and the positional relationship between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4. In Figure 23, as with Figures 10 and 22, the positional relationship between the first portion 21p1 and the third electrode 43 and the positional relationship between the second portion 22p2 and the fourth electrode 44 are shown when viewed from a plane in the -Z direction. In Figure 23, as with Figures 10 and 22, the outer edges of the portions of the first portion 21p1 and the second portion 22p2 that are hidden by the electronic component 4 are drawn with thin dashed lines, while the outer edges of the third electrode 43 and the fourth electrode 44 that are hidden by the electronic component 4 are drawn with thick dashed lines.

[0205] <2-3. Fourth Embodiment> In the first embodiment described above, for example, in the first range R1, if the minimum width Wp2mi or average width Wp2me of the width of the first portion 21p1 in the +X direction is less than or equal to the first width W1 of the third electrode 43, then the maximum width Wp2ma of the width of the first portion 21p1 in the +X direction may be greater than or equal to the first width W1 of the third electrode 43, or greater than the first width W1 of the third electrode 43. As described above, the first range R1 may be the range in the +Y direction where the third electrode 43 is present. In this case, the portion of the first portion 21p1 to which the third electrode 43 is joined may be expanded, thereby improving the strength of the bond between the electronic component 4 and the substrate 2.

[0206] Here, for example, in the second range R2, if the minimum width Wp4mi or average width Wp4me of the second portion 22p2 in the +X direction is less than or equal to the second width W2 of the fourth electrode 44, then the maximum width Wp4ma of the second portion 22p2 in the +X direction may be greater than or equal to the second width W2 of the fourth electrode 44, or greater than the second width W2 of the fourth electrode 44. As described above, the second range R2 may be the range in the +Y direction where the fourth electrode 44 exists. In this case, the portion of the second portion 22p2 to which the fourth electrode 44 is joined may be expanded, thereby improving the strength of the bond between the electronic component 4 and the substrate 2.

[0207] Figure 24 shows the positional relationship between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, and the positional relationship between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4, respectively, for a first example of the light-emitting device 1 according to the fourth embodiment. Figure 25 shows the positional relationship between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, and the positional relationship between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4, respectively, for a second example of the light-emitting device 1 according to the fourth embodiment. Figure 26 shows the positional relationship between the first portion 21p1 of the first electrode 21 of the substrate 2 and the third electrode 43 of the electronic component 4, and the positional relationship between the second portion 22p2 of the second electrode 22 of the substrate 2 and the fourth electrode 44 of the electronic component 4, respectively, for a third example of the light-emitting device 1 according to the fourth embodiment. Figures 24 to 26, as with Figures 10, 22, and 23, show the positional relationship between the first part 21p1 and the third electrode 43, and the positional relationship between the second part 22p2 and the fourth electrode 44, respectively, when viewed in planar perspective in the -Z direction. In Figures 24 to 26, as with Figures 10, 22, and 23, the outer edges of the parts of the first part 21p1 and the second part 22p2 that are hidden by the electronic component 4 are drawn with thin dashed lines, while the outer edges of the third electrode 43 and the fourth electrode 44 that are hidden by the electronic component 4 themselves are drawn with thick dashed lines.

[0208] <<Example 1>> For example, as shown in Figure 24, in each of the first range R1, the width of the first portion 21p1 in the +X direction (e.g., minimum width Wp2mi) may be less than or equal to the first width W1 of the third electrode 43. The first range R1a is a portion of the first range R1 on the +Y side. The first range R1b is a portion of the first range R1 on the -Y side. From another perspective, the first range R1b is the portion of the first range R1 opposite to the first range R1a.

[0209] Here, for example, in the first range R1, the minimum width (minimum width) Wp2mi of the first portion 21p1 in the +X direction may be less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction. Even in this case, for example, when reflow soldering is performed, the variation in the position of the third electrode 43 in the +X direction on the molten bonding material C1 located on the first portion 21p1 may be reduced. As a result, the variation in the position of the third electrode 43 in the +X direction, which is bonded to the first portion 21p1 via the first bonding material C11, may be reduced. This can reduce the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be reduced. As a result, for example, proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2 can be reduced. Therefore, by ensuring an insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be reduced. In other words, the reliability of the light-emitting device 1 can be improved.

[0210] Here, for example, in the first range R1, the minimum width (minimum width) Wp2mi of the first portion 21p1 in the +X direction may be less than the width (first width) W1 of the third electrode 43 in the +X direction. Even in this case, for example, when reflow soldering is performed, the variation in the position of the third electrode 43 in the +X direction on the molten bonding material C1 located on the first portion 21p1 may be reduced. As a result, the variation in the position of the third electrode 43 in the +X direction, which is bonded to the first portion 21p1 via the first bonding material C11, may be reduced. This can further reduce the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2, can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0211] Here, for example, in the range R1c (also called the first C range) located between the first A range R1a and the first B range R1b of the first range R1, the width of the first portion 21p1 in the +X direction (for example, the maximum width Wp2ma) may be greater than or equal to the first width W1 of the third electrode 43. This allows the portion of the first portion 21p1 to which the third electrode 43 is joined to be expanded, thereby improving the strength of the bond between the electronic component 4 and the substrate 2.

[0212] Here, for example, when viewed from a plane in the -Z direction, the first portion 21p1 may have a portion (also called the first protruding portion) Pr1 that protrudes from the electronic component 4 in the -X direction within the first C range R1c of the first range R1. In this case, this first protruding portion Pr1 can be used as a marker to visually confirm the degree of displacement of the electronic component 4 relative to the substrate 2 in the +X direction.

[0213] For example, as shown in Figure 24, in each of the second range R2, the width of the second portion 22p2 in the +X direction (e.g., minimum width Wp4mi) may be less than or equal to the second width W2 of the fourth electrode 44. The second range R2a is a portion of the second range R2 on the +Y side. The second range R2b is a portion of the second range R2 on the -Y side. From another perspective, the second range R2b is the range of the second range R2 opposite to the second range R2a.

[0214] Here, for example, in the second range R2, the minimum width (minimum width) Wp4mi of the second portion 22p2 in the +X direction may be less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction. Even in this case, for example, when reflow soldering is performed, the positional variation of the fourth electrode 44 in the +X direction on the molten bonding material C1 located on the second portion 22p2 may be reduced. As a result, the positional variation in the +X direction of the fourth electrode 44, which is bonded to the second portion 22p2 via the second bonding material C12, may be reduced. This can reduce the positional displacement of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the positional displacement of the electronic component 4 relative to the substrate 2 can be reduced. As a result, for example, proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2 can be reduced. Therefore, by ensuring an insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be reduced. In other words, the reliability of the light-emitting device 1 can be improved.

[0215] Here, for example, in the second range R2, the minimum width (minimum width) Wp4mi of the second portion 22p2 in the +X direction may be less than the width (second width) W2 of the fourth electrode 44 in the +X direction. Even in this case, for example, when reflow soldering is performed, the variation in the position of the fourth electrode 44 in the +X direction on the molten bonding material C1 located on the second portion 22p2 may be reduced. As a result, the variation in the position of the fourth electrode 44 in the +X direction, which is bonded to the second portion 22p2 via the second bonding material C12, may be reduced. This can further reduce the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2, can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0216] Here, for example, in the range R2c (also called the second C range) located between the second A range R2a and the second B range R2b of the second range R2, the width of the second portion 22p2 in the +X direction (for example, the maximum width Wp4ma) may be greater than or equal to the second width W2 of the fourth electrode 44. This allows the portion of the second portion 22p2 to which the fourth electrode 44 is joined to be expanded, thereby improving the strength of the bond between the electronic component 4 and the substrate 2.

[0217] Here, for example, when viewed from a plane in the -Z direction, the second portion 22p2 may have a portion (also called the second protruding portion) Pr2 that protrudes from the electronic component 4 in the +X direction within the second C range R2c of the second range R2. In this case, this second protruding portion Pr2 can be used as a marker to visually confirm the degree of displacement of the electronic component 4 relative to the substrate 2 in the +X direction.

[0218] Furthermore, as in the first, second, and third embodiments described above, if the maximum width (maximum width) Wp2ma of the first portion 21p1 in the +X direction within the first range R1 is less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction, the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is joined to the substrate 2 can be further reduced. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be further reduced. Therefore, by ensuring an insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0219] Furthermore, as in the first, second, and third embodiments described above, if the maximum width (maximum width) Wp4ma of the second portion 22p2 in the +X direction within the second range R2 is less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction, the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is joined to the substrate 2 can be further reduced. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be further reduced. Therefore, by ensuring an insulating distance between electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0220] <<Example 2>> For example, as shown in Figure 25, in each of the first A range R1a and the first C range R1c within the first range R1, the width of the first portion 21p1 in the +X direction (e.g., minimum width Wp2mi) may be less than or equal to the first width W1 of the third electrode 43. In other words, in a part of the first range R1, the width of the first portion 21p1 in the +X direction (e.g., minimum width Wp2mi) may be less than or equal to the first width W1 of the third electrode 43.

[0221] Here, for example, in the first range R1, the average value (average width) Wp2me of the width of the first portion 21p1 in the +X direction may be less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction. In this case, for example, compared to the configuration of the first example above, the range in the first range R1 where the width of the first portion 21p1 in the +X direction is less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction is even larger. Therefore, when the reflow soldering process is performed, the variation in the position of the third electrode 43 in the +X direction on the molten bonding material C1 located on the first portion 21p1 may be reduced. Therefore, the variation in the position of the third electrode 43 in the +X direction, which is bonded to the first portion 21p1 via the first bonding material C11, may be reduced. As a result, the displacement of the position of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2 can be further reduced. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0222] Here, for example, in the first range R1, the average value (average width) Wp2me of the width of the first portion 21p1 in the +X direction may be less than the width (first width) W1 of the third electrode 43 in the +X direction. In this case, for example, when reflow soldering is performed, the variation in the position of the third electrode 43 in the +X direction on the molten bonding material C1 located on the first portion 21p1 may be further reduced. As a result, the variation in the position of the third electrode 43 in the +X direction, which is bonded to the first portion 21p1 via the first bonding material C11, may be further reduced. This can further reduce the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2, can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0223] Here, for example, in the first B range R1b of the first range R1, the width of the first portion 21p1 in the +X direction (e.g., maximum width Wp2ma) may be greater than or equal to the first width W1 of the third electrode 43. This allows the portion of the first portion 21p1 to which the third electrode 43 is joined to be expanded, thereby improving the strength of the bond between the electronic component 4 and the substrate 2.

[0224] Here, for example, when viewed from a plane in the -Z direction, the first portion 21p1 may have a portion (first protruding portion) Pr1 that protrudes from the electronic component 4 in the -X direction within the first B range R1b of the first range R1. In this case, this first protruding portion Pr1 can be used as a marker to visually confirm the degree of displacement of the electronic component 4 relative to the substrate 2 in the +X direction.

[0225] For example, as shown in Figure 25, in each of the second range R2, specifically the second A range R2a and the second C range R2c, the width of the second portion 22p2 in the +X direction (e.g., minimum width Wp4mi) may be less than or equal to the second width W2 of the fourth electrode 44. In other words, in a portion of the second range R2, the width of the second portion 22p2 in the +X direction (e.g., minimum width Wp4mi) may be less than or equal to the second width W2 of the fourth electrode 44.

[0226] Here, for example, in the second range R2, the average value (average width) Wp4me of the width of the second portion 22p2 in the +X direction may be less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction. In this case, for example, compared to the configuration of the first example above, the range in the second range R2 where the width of the second portion 22p2 in the +X direction is less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction is even larger. Therefore, when the reflow soldering process is performed, the variation in the position of the fourth electrode 44 in the +X direction on the molten bonding material C1 located on the second portion 22p2 may be reduced. Therefore, the variation in the position of the fourth electrode 44 in the +X direction, which is bonded to the second portion 22p2 via the second bonding material C12, may be reduced. As a result, the displacement of the position of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2 may be reduced. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0227] Here, for example, in the second range R2, the average value (average width) Wp4me of the width of the second portion 22p2 in the +X direction may be less than the width (second width) W2 of the fourth electrode 44 in the +X direction. In this case, for example, when reflow soldering is performed, the variation in the position of the fourth electrode 44 in the +X direction on the molten bonding material C1 located on the second portion 22p2 may be further reduced. As a result, the variation in the position of the fourth electrode 44 in the +X direction, which is bonded to the second portion 22p2 via the second bonding material C12, may be further reduced. This can further reduce the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2, can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0228] Here, for example, in the second B range R2b of the second range R2, the width of the second portion 22p2 in the +X direction (e.g., maximum width Wp4ma) may be greater than or equal to the second width W2 of the fourth electrode 44, or greater than the second width W2. This allows the portion of the second portion 22p2 to which the fourth electrode 44 is joined to be expanded, thereby improving the bonding strength of the electronic component 4 to the substrate 2.

[0229] Here, for example, when viewed from a plane in the -Z direction, the second portion 22p2 may have a portion (second protruding portion) Pr2 that protrudes from the electronic component 4 in the +X direction within the second B range R2b of the second range R2. In this case, this second protruding portion Pr2 can be used as a marker to visually confirm the degree of displacement of the electronic component 4 relative to the substrate 2 in the +X direction.

[0230] <<Example 3>> For example, as shown in Figure 26, in each of the first B range R1b and the first C range R1c within the first range R1, the width of the first portion 21p1 in the +X direction (e.g., minimum width Wp2mi) may be less than or equal to the first width W1 of the third electrode 43. In other words, in a part of the first range R1, the width of the first portion 21p1 in the +X direction (e.g., minimum width Wp2mi) may be less than or equal to the first width W1 of the third electrode 43.

[0231] Here, for example, as in the second example above, in the first range R1, the average value (average width) Wp2me of the width of the first portion 21p1 in the +X direction may be less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction. In this case, for example, compared to the configuration of the first example above, the range in the first range R1 where the width of the first portion 21p1 in the +X direction is less than or equal to the width (first width) W1 of the third electrode 43 in the +X direction is even larger. Therefore, when the reflow soldering process is performed, the variation in the position of the third electrode 43 in the +X direction on the molten bonding material C1 located on the first portion 21p1 may be reduced. Therefore, the variation in the position of the third electrode 43 in the +X direction joined to the first portion 21p1 via the first bonding material C11 may be reduced. As a result, the displacement of the position of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is joined to the substrate 2 can be further reduced. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0232] Here, for example, as in the second example above, the average value (average width) Wp2me of the width of the first portion 21p1 in the +X direction in the first range R1 may be less than the width (first width) W1 of the third electrode 43 in the +X direction. In this case, for example, when reflow soldering is performed, the variation in the position of the third electrode 43 in the +X direction on the molten bonding material C1 located on the first portion 21p1 may be further reduced. As a result, the variation in the position of the third electrode 43 in the +X direction, which is bonded to the first portion 21p1 via the first bonding material C11, may be further reduced. This can further reduce the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2, can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0233] Here, for example, in the first range R1a of the first range R1, the width of the first portion 21p1 in the +X direction (e.g., maximum width Wp2ma) may be greater than or equal to the first width W1 of the third electrode 43. This allows the portion of the first portion 21p1 to which the third electrode 43 is joined to be expanded, thereby improving the strength of the bond between the electronic component 4 and the substrate 2.

[0234] Here, for example, when viewed from a plane in the -Z direction, the first portion 21p1 may have a portion (first protruding portion) Pr1 that protrudes from the electronic component 4 in the -X direction within the first A range R1a of the first range R1. In this case, this first protruding portion Pr1 can be used as a marker to visually confirm the degree of displacement of the electronic component 4 relative to the substrate 2 in the +X direction.

[0235] For example, as shown in Figure 26, in each of the second B range R2b and the second C range R2c of the second range R2, the width of the second portion 22p2 in the +X direction (e.g., minimum width Wp4mi) may be less than or equal to the second width W2 of the fourth electrode 44. In other words, in a part of the second range R2, the width of the second portion 22p2 in the +X direction (e.g., minimum width Wp4mi) may be less than or equal to the second width W2 of the fourth electrode 44.

[0236] Here, for example, as in the second example above, in the second range R2, the average value (average width) Wp4me of the width of the second portion 22p2 in the +X direction may be less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction. In this case, for example, compared to the configuration of the first example above, the range in the second range R2 where the width of the second portion 22p2 in the +X direction is less than or equal to the width (second width) W2 of the fourth electrode 44 in the +X direction is even larger. Therefore, when the reflow soldering process is performed, the variation in the position of the fourth electrode 44 in the +X direction on the molten bonding material C1 located on the second portion 22p2 may be reduced. Therefore, the variation in the position of the fourth electrode 44 in the +X direction, which is bonded to the second portion 22p2 via the second bonding material C12, may be reduced. As a result, the displacement of the position of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2 may be reduced. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0237] Here, for example, as in the second example above, in the second range R2, the average value (average width) Wp4me of the width of the second portion 22p2 in the +X direction may be less than the width (second width) W2 of the fourth electrode 44 in the +X direction. In this case, for example, when reflow soldering is performed, the variation in the position of the fourth electrode 44 in the +X direction on the molten bonding material C1 located on the second portion 22p2 may be further reduced. As a result, the variation in the position of the fourth electrode 44 in the +X direction, which is bonded to the second portion 22p2 via the second bonding material C12, may be further reduced. This can further reduce the misalignment of the electronic component 4 in the +X direction relative to the substrate 2 that may occur when the electronic component 4 is bonded to the substrate 2. In other words, the misalignment of the electronic component 4 relative to the substrate 2 can be further reduced. As a result, for example, the proximity between the third electrode 43 of the electronic component 4 and the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity between the fourth electrode 44 of the electronic component 4 and the first portion 21p1 of the first electrode 21 of the substrate 2, can be further reduced. Therefore, by ensuring an insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be further reduced. In other words, the reliability of the light-emitting device 1 can be further improved.

[0238] Here, for example, in the second range R2a of the second range R2, the width of the second portion 22p2 in the +X direction (e.g., maximum width Wp4ma) may be greater than or equal to the second width W2 of the fourth electrode 44. This can increase the area in the second portion 22p2 to which the fourth electrode 44 is joined, thereby improving the strength of the bond between the electronic component 4 and the substrate 2.

[0239] Here, for example, when viewed from a plane in the -Z direction, the second portion 22p2 may have a portion (second protruding portion) Pr2 that protrudes from the electronic component 4 in the +X direction within the second A range R2a of the second range R2. In this case, this second protruding portion Pr2 can be used as a marker to visually confirm the degree of displacement of the electronic component 4 relative to the substrate 2 in the +X direction.

[0240] <2-4. Fifth Embodiment> In each of the above-described first to fourth embodiments, for example, the reflective member 6 may not be present.

[0241] Figure 27 is a front view showing an example of the external appearance of the light-emitting device 1 according to the fifth embodiment. Figure 28 is a diagram showing an example of the configuration of the light-emitting device 1 according to the fifth embodiment.

[0242] As shown in Figures 27 and 28, in the light-emitting device 1 according to the fifth embodiment, for example, the wavelength conversion unit 5 may be located on the third surface 20f3 of the substrate body 20. From another viewpoint, for example, the wavelength conversion unit 5 may be located on the first region A1 of the first surface 2f1 of the substrate 2. The wavelength conversion unit 5 may, for example, be in contact with the entire or substantially entire area of ​​the first region A1. The light-emitting device 1 in the example of Figures 27 and 28 is based on the light-emitting device 1 in the example of Figures 1 to 5, with the reflective member 6 removed and the wavelength conversion unit 5 extending to the area where the reflective member 6 was located.

[0243] <2-5. Sixth Embodiment> Each of the light-emitting devices 1 according to the first to fifth embodiments described above may be applied to, for example, an illumination device 100.

[0244] Figure 29 is a schematic diagram showing the external appearance of an example of the lighting device 100.

[0245] As shown in Figure 29, the lighting device 100 may include, for example, a plurality of light-emitting devices 1. Each of these plurality of light-emitting devices 1 may be, for example, a light-emitting device 1 according to any one embodiment of the first to fifth embodiments described above. Here, when the light-emitting devices 1 are manufactured for the manufacture of the lighting device 100, as described above, the misalignment of the position of the electronic component 4 relative to the substrate 2 can be reduced. Furthermore, the proximity of the third electrode 43 of the electronic component 4 to the second portion 22p2 of the second electrode 22 of the substrate 2, or the proximity of the fourth electrode 44 of the electronic component 4 to the first portion 21p1 of the first electrode 21 of the substrate 2 can be reduced. Therefore, by ensuring the insulating distance between the electrodes, the possibility of a short circuit occurring between the first electrode 21 and the second electrode 22 can be reduced. In other words, the reliability of the light-emitting device 1 can be improved. As a result, the reliability of the lighting device 100 can be improved.

[0246] The lighting device 100 can emit light emitted by multiple light-emitting devices 1 as illumination light. The lighting device 100 may, for example, independently control the intensity of the light emitted by each of the multiple light-emitting devices 1, or it may control the intensity of the light emitted by each of the multiple light-emitting devices 1 in relation to each other. The spectra of the light emitted by each of the multiple light-emitting devices 1 may be the same or different from each other. The lighting device 100 may, for example, emit light (also called composite light) which is a composite of the light emitted by each of the multiple light-emitting devices 1 as illumination light. The lighting device 100 may, for example, selectively emit light from some of the multiple light-emitting devices 1. In other words, the lighting device 100 may, for example, emit light emitted from some of the multiple light-emitting devices 1 as illumination light.

[0247] As shown in Figure 29, the lighting device 100 may comprise, for example, a housing 111, a wiring board 112, and a plurality of light-emitting devices 1. The housing 111 houses, for example, the wiring board 112 and the plurality of light-emitting devices 1. The lighting device 100 emits, for example, the light emitted by the plurality of light-emitting devices 1 inside the housing 111 as illumination light to the outside of the housing 111. In the example of Figure 29, the lighting device 100 has an elongated rectangular parallelepiped shape with a longitudinal direction along the +X direction.

[0248] The housing 111 has, for example, an opening facing the +Z direction. The housing 111 has, for example, a function to dissipate the heat emitted by the multiple light-emitting devices 1 to the outside. The material of the housing 111 may be, for example, a metal such as aluminum, copper, or stainless steel, or it may be plastic or resin. In the example of Figure 29, the housing 111 has, for example, an elongated rectangular parallelepiped shape with a longitudinal direction along the +X direction and a width direction along the +Y direction.

[0249] The housing 111 includes, for example, a main body (also referred to as the housing body) 121 and two lids 122. The housing body 121 has, for example, an elongated groove-like outer shape with a longitudinal direction along the +X direction, a U-shaped cross section along the YZ plane, and a width direction along the +Y direction. In other words, the housing body 121 has, for example, a first opening facing the +Z direction, a second opening located at the first end in the longitudinal direction along the +X direction, and a third opening located at the second end in the longitudinal direction along the -X direction. The two lids 122 close, for example, the first and second openings located at both ends of the housing body 121 in the longitudinal direction along the +X direction.

[0250] The wiring board 112 is located, for example, within the housing 111 and fixed to the housing 111. The wiring board 112 may be fixed, for example, to a surface facing the +Z direction inside the housing 111. The wiring board 112 may be a printed circuit board such as a rigid board, a flexible board, or a rigid-flexible board. The wiring board 112 may have a plate-like shape with, for example, an elongated rectangular front and back surface. The wiring board 112 may have a function to dissipate heat emitted by the light-emitting device 1 to the outside. The wiring board 112 may include a portion made of, for example, a metallic material such as aluminum, copper, or stainless steel, an organic resin material, or a composite material containing these. The shape of the wiring board 112 may be, for example, an elongated rectangle in a plan view facing the -Z direction. The shape of the wiring board 112 is not limited to this and may be various other shapes.

[0251] Multiple light-emitting devices 1 are mounted on a wiring board 112, for example, within a housing 111. Each of the two second surface electrodes of a light-emitting device 1, the second A surface electrode 23 and the second B surface electrode 24, may be electrically connected to the wiring of the wiring board 112, for example, via solder or conductive adhesive. The multiple light-emitting devices 1 may be arranged, for example, along a virtual straight line along the longitudinal direction of the housing 111, or in a grid or staggered pattern, or in various other patterns.

[0252] Here, a signal from the wiring board 112 is transmitted to the light-emitting element 3 via the board 2, allowing the light-emitting element 3 to emit light. The wiring board 112 may be supplied with power from an external power source via wiring. The power source may be, for example, a button battery or various other power sources. The wiring board 112 may have a control unit mounted on it that can output control signals for controlling the light-emitting element 3. The control unit may be, for example, a processor.

[0253] The lighting device 100 may further include, for example, a translucent substrate 113. The translucent substrate 113 may seal the wiring board 112 and the plurality of light-emitting devices 1 housed inside the housing 111. The translucent substrate 113 may be positioned, for example, to close a first opening facing the +Z direction of the housing 111. The material of the translucent substrate 113 is a material that allows light emitted from each of the plurality of light-emitting devices 1 to pass through. The material of the translucent substrate 113 may be, for example, acrylic resin or glass. The translucent substrate 113 may be, for example, a plate-like body having an elongated rectangular front and back surface. The shape of the translucent substrate 113 is not limited to this and may be various other shapes.

[0254] The lighting device 100 may include, for example, a sealing material placed in a predetermined location, such as between the housing 111 and the translucent substrate 113. This can reduce the intrusion of water, dust, and dirt into the housing 111. As a result, the reliability of the lighting device 100 can be improved regardless of the environment in which it is installed. In addition, the lighting device 100 may include, for example, a desiccant placed inside the housing 111.

[0255] <3. Others> In each of the above-described first to sixth embodiments, for example, when viewed from a plan or through a plan in the +Z direction, the shapes of the third electrode 43 and the fourth electrode 44 may be different from a rectangular shape, such as an ellipse.

[0256] In each of the above-described embodiments from the first to the sixth, for example, when viewed planar in the -Z direction, the portion of the first electrode 21 that connects the portion to which the third electrode 43 of the electronic component 4 is joined with the third portion 21p3 does not have to extend along the +Y direction. For example, when viewed planar in the -Z direction, the portion of the first electrode 21 that connects the portion to which the third electrode 43 of the electronic component 4 is joined with the third portion 21p3 may extend in a direction inclined with respect to the +Y direction, or may have a curved shape such as a bend.

[0257] Furthermore, for example, when viewed planar in the -Z direction, the portion of the second electrode 22 that connects the portion to which the fourth electrode 44 of the electronic component 4 is joined with the fourth portion 22p4 does not necessarily have to extend along the +Y direction. For example, when viewed planar in the -Z direction, the portion of the second electrode 22 that connects the portion to which the fourth electrode 44 of the electronic component 4 is joined with the fourth portion 22p4 may extend in a direction inclined with respect to the +Y direction, or it may have a curved shape such as a bend.

[0258] In each of the first to sixth embodiments described above, for example, an element different from a protective element such as a Zener diode may be applied to the electronic component 4. For example, a different light-emitting element such as an LED may be applied to the electronic component 4 as an element electrically connected in parallel with the light-emitting element 3.

[0259] In each of the above-described embodiments from the first to the sixth, for example, the configuration of the light-emitting device 1 may be changed to a configuration that is inverted with respect to a virtual plane along the XZ plane, or to a configuration that is inverted with respect to a virtual plane along the YZ plane.

[0260] In each of the first to sixth embodiments described above, for example, in the manufacturing process of the light emitting device 1, a layer of a bonding material such as AuSn may be formed on the first electrode 21 and the second electrode 22 of the substrate 2 before the electronic component 4 is bonded to the substrate 2.

[0261] In each of the first to sixth embodiments described above, for example, when the light emitting device 1 is planarly viewed in the -Z direction, the shape of the outer edge of each of the light emitting device 1, the first surface 2f1 of the substrate 2 and the wavelength conversion portion 5 is not limited to a rectangular shape, and may be any shape among, for example, a quadrilateral shape including a parallelogram or a rhombus, a polygonal shape different from the quadrilateral shape, or a shape having a curved outer edge such as a circular shape or an elliptical shape. Here, for example, when the light emitting device 1 is planarly viewed in the -Z direction, if the shape of the outer edge of each of the first surface 2f1 and the second plate surface 2f2 of the substrate 2 is a shape constituted by a curved line such as a circular shape or an elliptical shape, the substrate 2 may have one substrate side surface 2fs. Therefore, the substrate 2 may have one or more substrate side surfaces 2fs. For example, when the light emitting device 1 is planarly viewed in the -Z direction, if the shape of the second outer surface 5f2 of the wavelength conversion portion 5 is a shape having a curved outer edge such as a circular shape or an elliptical shape, the wavelength conversion portion 5 may have one third outer surface 5f3. Therefore, the wavelength conversion portion 5 may have one or more third outer surfaces 5f3.

[0262] In each of the first to sixth embodiments described above, for example, the second outer surface 5f2 of the wavelength conversion portion 5 may be a planar surface or a concave surface. If the second outer surface 5f2 of the wavelength conversion portion 5 is a concave surface, converted light emitted from the second outer surface 5f2 of the wavelength conversion portion 5 can be condensed.

[0263] In each of the first to sixth embodiments described above, for example, the outer shape of the light-emitting device 1 does not need to have a plane-symmetrical relationship with respect to an imaginary plane along the XZ plane, and does not need to have a plane-symmetrical relationship with respect to an imaginary plane along the YZ plane. In other words, the outer shape of the light-emitting device 1 may be asymmetric in the +X direction, or may be asymmetric in the +Y direction.

[0264] In the present disclosure, terms such as "first" and "second" are identifiers for distinguishing respective components. Components distinguished by terms such as "first" and "second" in the present disclosure may be exchanged within a range where the numbers assigned to the components do not cause contradiction. The arrangement and formation order of components, and the existence of identifiers with smaller numbers are not determined solely based on the description of identifiers such as "first" and "second" in the present disclosure.

[0265] In the present disclosure, the X axis, Y axis and Z axis are provided for convenience of explanation, and may be interchanged with each other. The configuration according to the present disclosure has been described using a right-handed orthogonal coordinate system constituted by the X axis, Y axis and Z axis, but the direction along the X axis, the direction along the Y axis and the direction along the Z axis are not limited to being orthogonal to each other, and may be replaced with a relationship of intersecting each other.

[0266] As described above, the light-emitting device and the illumination device have been described in detail. However, the above description is illustrative in all aspects, and the present disclosure is not limited thereto. In addition, the various examples described above may be combined as long as they do not contradict each other. Innumerable examples not illustrated herein can be envisaged without departing from the scope of the present disclosure.

[0267] The present disclosure includes the following contents.

[0268] In one embodiment, (1) the light-emitting device comprises a substrate having a first surface and a first electrode and a second electrode on the first surface side, an electronic component having a third electrode electrically connected to a first portion of the first electrode and a fourth electrode electrically connected to a second portion of the second electrode, and a light-emitting element electrically connected to the first electrode and the second electrode, respectively, wherein when the direction in which the first portion and the second portion are aligned is defined as the first direction, the minimum width of the first portion in the first direction is less than or equal to the first width of the third electrode in the first direction.

[0269] (2) In the light-emitting device described in (1) above, the first electrode may include a third portion other than the first portion, the second electrode may include a fourth portion other than the second portion, and the light-emitting element may be electrically connected to the third portion and the fourth portion.

[0270] (3) In the light-emitting device of (1) or (2) above, when the electronic component, the substrate and the light-emitting element are viewed through a plane, the electronic component may be located between the outer edge of the substrate and the light-emitting element.

[0271] (4) Any one of the light-emitting devices described in (1) to (3) above includes a wavelength conversion unit, the wavelength conversion unit is located on the first surface side of the substrate, the wavelength conversion unit covers the light-emitting element, and the wavelength conversion unit may emit a second light having a different spectrum from the first light in response to the incidence of the first light emitted by the light-emitting element.

[0272] (5) In any one of the light-emitting devices described in (1) to (4) above, the third electrode may be joined to the first portion via a conductive first bonding material, and the fourth electrode may be joined to the second portion via a conductive second bonding material.

[0273] (6) In the light-emitting device of (2) above, the light-emitting element has a second surface and includes a fifth electrode and a sixth electrode on the second surface side, the fifth electrode is joined to the third portion and the sixth electrode is joined to the fourth portion.

[0274] (7) In the light-emitting device described in (6) above, the fifth electrode may be joined to the third portion via a conductive third bonding material, and the sixth electrode may be joined to the fourth portion via a conductive fourth bonding material.

[0275] (8) In any one of the light-emitting devices described in (1) to (7) above, the minimum width of the second portion in the first direction may be less than or equal to the second width of the fourth electrode in the first direction.

[0276] (9) In any one of the light-emitting devices described in (1) to (8) above, the second direction is defined as the direction that is along the first surface and perpendicular to the first direction, and the range in which the third electrode exists in the second direction is defined as the first range, in which the average width of the first portion in the first range in the first direction may be less than or equal to the first width.

[0277] (10) In any one of the light-emitting devices described in (1) to (9) above, the maximum width of the first portion in the first direction may be less than or equal to the first width.

[0278] (11) In the light-emitting device of (2) above, the second direction is a direction that is along the first surface and perpendicular to the first direction, the first portion has a shape that is elongated in the second direction, and has a first edge on the side of the first direction and a second edge on the side opposite to the first direction, and each of the first edge and the second edge may be located along the second direction without bending from the third portion to the end of the first portion in the second direction.

[0279] (12) In the light-emitting device described in (11) above, when the first surface is viewed through from above, the first portion may be rectangular in shape, or rectangular in shape having one or more corners that form two or more obtuse angles or rounded portions.

[0280] (13) In any one of the light-emitting devices described in (1) to (12) above, the electronic component has a third surface facing the first surface, and in the first direction, the first distance from the end of the first portion opposite to the second portion to the end of the second portion opposite to the first portion may be less than or equal to the width of the third surface.

[0281] (14) In the light-emitting device described in (13) above, the first distance in the first direction may be less than or equal to the second distance from the end of the third electrode opposite to the fourth electrode to the end of the fourth electrode opposite to the third electrode.

[0282] (15) In any one of the light-emitting devices described in (1) to (14) above, the distance between the first part and the second part in the first direction may be greater than or equal to the distance between the third electrode and the fourth electrode.

[0283] (16) In any one of the light-emitting devices described in (1) to (15) above, the substrate includes an insulating main body, and the light-emitting device further includes a reflective member located on the first surface and surrounding the first electrode and the second electrode, wherein the reflective member may have a higher light reflectivity than the portion of the main body that is in contact with the reflective member on the first surface.

[0284] (17) Any one of the light-emitting devices described in (1) to (16) above does not need to be equipped with a light-emitting element other than the aforementioned light-emitting element.

[0285] (18) In the light-emitting device of (2) above, the second direction is a direction that is along the first surface and perpendicular to the first direction, the first part includes a first tip that protrudes from the third part and is located on the opposite side from the third part, and the second part includes a second tip that protrudes from the fourth part and is located on the opposite side from the fourth part, and when the first surface and the electronic component are viewed through from above, at least one of the first tip and the second tip may protrude from the electronic component in the second direction.

[0286] (19) In the light-emitting device according to (18) above, when the first surface and the electronic component are viewed through in a plan view, in the second direction, each of the first tip portion and the second tip portion may protrude from the electronic component.

[0287] (20) In the light-emitting device according to any one of (1) to (12), (18) and (19) above, the electronic component has a third surface facing the first surface, the electronic component has a fourth surface located on a side opposite to the third surface, the light-emitting element has a fifth surface located on a side opposite to the substrate, and a distance from the first surface to the fourth surface may be smaller than a distance from the first surface to the fifth surface.

[0288] In one embodiment, (21) a lighting device includes a plurality of light-emitting devices according to any one of (1) to (20) above. Description of Symbols

[0289] 1 Light-emitting device 2, 2A Substrate 2f1 First surface 3 Light-emitting element 3f3 Second surface 3f5 Fifth surface 4 Electronic component 4f2 Third surface 4f4 Fourth surface 5 Wavelength conversion portion 6 Reflective member 20 Substrate body portion (body portion) 21 First electrode 21p1, 21p1A First portion 21p3 Third portion 22 Second electrode 22p2, 22p2A Second portion 22p4 Fourth portion 35 Fifth electrode 36 Sixth electrode 43 Third electrode 44 Fourth electrode 100 Lighting device C11 1st bonding material C12 2nd bonding material C13 3rd bonding material C14 4th joining material D1 1st distance D2 2nd distance Dr1 1st direction Dr2 2nd direction Episode 1: First Tip Episode 2: Second Tip Es1 First Edge Es2 2nd edge Es3 Third Edge Es4 4th Edge R1 First Range R2 Second Range W1 1st width W2, 2nd width Wp2ma max width Wp2me average width Wp2mi minimum width Wp4ma max width Wp4me average width Wp4mi minimum width

Claims

1. A substrate having a first surface and a first electrode and a second electrode on the side of the first surface, An electronic component having a third electrode electrically connected to a first portion of the first electrode and a fourth electrode electrically connected to a second portion of the second electrode, The system comprises a light-emitting element electrically connected to the first electrode and the second electrode, respectively. A light-emitting device in which, when the direction in which the first portion and the second portion are aligned is defined as the first direction, the minimum width of the first portion in the first direction is less than or equal to the first width of the third electrode in the first direction.

2. A light-emitting device according to claim 1, The first electrode includes a third portion other than the first portion, The second electrode includes a fourth portion other than the second portion, A light-emitting device in which the light-emitting element is electrically connected to the third and fourth parts.

3. A light-emitting device according to claim 1 or claim 2, A light-emitting device in which, when the electronic component, the substrate, and the light-emitting element are viewed through a plane, the electronic component is located between the outer edge of the substrate and the light-emitting element.

4. A light-emitting device according to claim 1 or claim 2, Equipped with a wavelength conversion unit, The wavelength conversion unit is located on the first surface side of the substrate, The wavelength conversion unit covers the light-emitting element and emits a second light having a different spectrum from the first light in response to the incidence of the first light emitted by the light-emitting element, in a light-emitting device.

5. A light-emitting device according to claim 1 or claim 2, The third electrode is bonded to the first portion via a conductive first bonding material. A light-emitting device in which the fourth electrode is bonded to the second portion via a conductive second bonding material.

6. A light-emitting device according to claim 2, The light-emitting element has a second surface and includes a fifth electrode and a sixth electrode on the second surface side. The aforementioned fifth electrode is joined to the aforementioned third portion. The sixth electrode is joined to the fourth portion of the light-emitting device.

7. A light-emitting device according to claim 6, The fifth electrode is bonded to the third portion via a conductive third bonding material. A light-emitting device in which the sixth electrode is bonded to the fourth portion via a conductive fourth bonding material.

8. A light-emitting device according to claim 1 or claim 2, A light-emitting device in which the minimum width of the second portion in the first direction is less than or equal to the second width of the fourth electrode in the first direction.

9. A light-emitting device according to claim 1 or claim 2, The second direction is a direction that is along the first surface and perpendicular to the first direction. A light-emitting device in which, when the range in which the third electrode exists in the second direction is defined as the first range, the average width of the first portion in the first range in the first direction is less than or equal to the first width.

10. A light-emitting device according to claim 1 or claim 2, A light-emitting device in which the maximum width of the first portion in the first direction is less than or equal to the first width.

11. A light-emitting device according to claim 2, The second direction is a direction that is along the first surface and perpendicular to the first direction. The first portion has a shape that is elongated in the second direction and has a first edge on the side facing the first direction and a second edge on the side opposite to the first direction. A light-emitting device in which each of the first and second edges is positioned along the second direction without bending, from the third portion to the end of the first portion in the second direction.

12. A light-emitting device according to claim 11, A light-emitting device in which, when the first surface is viewed from above, the first portion is rectangular in shape, or rectangular in shape in which each of one or more corners forms two or more obtuse angles or rounded portions.

13. A light-emitting device according to claim 1 or claim 2, The electronic component has a third surface facing the first surface, A light-emitting device in which, in the first direction, the first distance from the end of the first part opposite to the second part to the end of the second part opposite to the first part is less than or equal to the width of the third surface.

14. A light-emitting device according to claim 13, A light-emitting device in which, in the first direction, the first distance is less than or equal to the second distance from the end of the third electrode opposite to the fourth electrode to the end of the fourth electrode opposite to the third electrode.

15. A light-emitting device according to claim 1 or claim 2, A light-emitting device in which, in the first direction, the distance between the first portion and the second portion is greater than or equal to the distance between the third electrode and the fourth electrode.

16. A light-emitting device according to claim 1 or claim 2, The substrate includes an insulating main body, The light-emitting device further comprises a reflective member located on the first surface and surrounding the first electrode and the second electrode, The light-emitting device wherein the reflective member has a higher light reflectivity than the portion of the main body that is in contact with the reflective member on the first surface of the main body.

17. A light-emitting device according to claim 1 or claim 2, A light-emitting device that does not have a light-emitting element other than the aforementioned light-emitting element.

18. A light-emitting device according to claim 2, The second direction is a direction that is along the first surface and perpendicular to the first direction. The first portion includes a first tip portion that protrudes from the third portion and is located on the opposite side from the third portion, The second portion includes a second tip portion that protrudes from the fourth portion and is located on the opposite side from the fourth portion. A light-emitting device wherein, when the first surface and the electronic component are viewed through from a plane, at least one of the first tip and the second tip protrudes from the electronic component in the second direction.

19. A light-emitting device according to claim 18, A light-emitting device wherein, when the first surface and the electronic component are viewed through from a plane, the first tip and the second tip each protrude from the electronic component in the second direction.

20. A light-emitting device according to claim 1 or claim 2, The electronic component has a third surface facing the first surface, The aforementioned electronic component has a fourth surface located on the opposite side from the third surface, The light-emitting element has a fifth surface located on the side opposite to the substrate, A light-emitting device in which the distance from the first surface to the fourth surface is less than the distance from the first surface to the fifth surface.

21. A lighting device comprising a plurality of light-emitting devices according to claim 1 or claim 2.

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