Imaging module, method for manufacturing an imaging module, and imaging apparatus

Abstract

This technology provides an improvement in production yield while avoiding an increase in the size of the imaging module. [Solution] An imaging module comprising: a color separation prism having multiple emission surfaces that separate incident light into multiple light corresponding to multiple color components and emit the multiple light in different directions from each other; and multiple image sensors provided corresponding to the multiple emission surfaces and convert the light emitted from the multiple emission surfaces into imaging signals, wherein the image sensors have an opposing surface that faces the emission surface in the direction of the optical axis of the light emitted from the emission surface, and the opposing surface includes an imaging region and an outer peripheral region outside the imaging region, and is fixed to the color separation prism by an adhesive interposed between the outer peripheral region and the emission surface, wherein at least one of the multiple emission surfaces includes a spacing expansion portion in the region facing the outer peripheral region, where the distance between the opposing surface and the outer peripheral region is wider in the direction of the optical axis than the distance between the opposing surface and the imaging region.

Description

[Technical Field]

[0001] The present invention relates to an imaging module used in an imaging apparatus. [Background Art]

[0002] In an imaging module installed in an imaging apparatus such as a camera, it is sometimes necessary to accurately fix electronic components such as imaging elements to an optical component such as a color separation prism. A color camera including a multi-plate imaging module is provided with a plurality of imaging elements respectively corresponding to individual color components. Imaging light is separated into a plurality of color components by a color separation prism, and the image outputs obtained by inputting the subject image of each color component into each imaging element are respectively combined, whereby a color video signal is formed and output. In such an imaging module using a plurality of imaging elements, superimposition of subject images of individual color components captured by the respective imaging elements must be performed in six directions, that is, with respect to six degrees of freedom. The six directions are the optical axis direction, the tilt direction with respect to the optical axis, and four directions resulting from parallel movement and rotational movement within a plane perpendicular to the optical axis. This six-axis adjustment needs to be performed with extremely high accuracy, specifically, alignment must be performed with accuracy on the order of micrometers.

[0003] Furthermore, when aligning the image sensor with respect to the color separation prism, there is a method of adjusting the distance (air gap) between the color separation prism and the image sensor according to the variations in the optical path lengths of the color separation prism and the image sensor. In this method, if the color separation prism and the image sensor are to be directly fixed with adhesive, there are concerns about problems caused by the air gap. That is, since the air gap changes according to the variations in the optical path lengths of the color separation prism and the image sensor, if a fixed amount of adhesive is applied to this air gap, there are concerns that the adhesive may not reach one of the components or that the adhesive may spill out into the imaging area. As a countermeasure, there is a method of indirectly fixing the color separation prism and the image sensor via a fixing member, thereby controlling the thickness of the adhesive to be constant without being affected by fluctuations in the air gap (Patent Document 1). This makes it possible to prevent the adhesive from not reaching one of the components or from spilling out into the imaging area of ​​the image sensor. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 11-101934 [Overview of the project] [Problems that the invention aims to solve]

[0005] However, if a structure is adopted that uses fixed components in addition to the color separation prism and image sensor, there are concerns that the number of parts and bonding points will increase, thus increasing manufacturing man-hours. Furthermore, there are concerns that the color separation prism will need to be larger than the image sensor by the size of the fixed components, resulting in a larger image module size.

[0006] The objective of this invention is to provide a technology that improves production yield while avoiding an increase in the size of the imaging module. [Means for solving the problem]

[0007] To solve the above-mentioned problems, the imaging module of the present invention is: A color separation prism having multiple emission surfaces that separate incident light into multiple light sources corresponding to multiple color components and emit the multiple light sources in different directions from each other, Multiple image sensors are provided corresponding to the multiple emission surfaces, and each of these sensors converts the light emitted from the multiple emission surfaces into an imaging signal. It has, In an imaging module in which the image sensor has an opposing surface that faces the output surface in the direction of the optical axis of the light emitted from the output surface, the opposing surface includes an imaging region and an outer peripheral region outside the imaging region, and is fixed to the color separation prism by an adhesive interposed between the outer peripheral region and the output surface, At least one of the plurality of emission surfaces is characterized in that, in the region facing the outer peripheral region, it includes a spacing expansion portion in the optical axis direction where the distance between it and the outer peripheral region is greater than the distance between it and the imaging region. [Effects of the Invention]

[0008] According to the present invention, it is possible to improve the yield during production while avoiding an increase in the size of the imaging module. [Brief explanation of the drawing]

[0009] [Figure 1] A diagram showing the configuration of a color camera including a three-chip imaging module according to Embodiment 1 of the present invention. [Figure 2] Right side view of the imaging module. [Figure 3] Front view of the image sensor. [Figure 4] Plan view of the imaging module. [Figure 5] A process diagram showing the manufacturing procedure for the imaging module. [Figure 6] Configuration diagram of the manufacturing equipment for imaging modules. [Figure 7] A perspective view showing the bonding structure of the imaging module. [Figure 8] A perspective view showing another configuration example of Example 1. [Figure 9] A perspective view showing another configuration example of Example 1. [Figure 10] A plan view of the three-chip imaging module according to Embodiment 2 of the present invention. [Figure 11] Plan view of another configuration example of Example 2. [Figure 12] A process diagram showing the manufacturing procedure for the three-chip imaging module of Embodiment 3 of the present invention. [Figure 13] Configuration diagram of the manufacturing apparatus for the 3-chip imaging module of Example 3. [Modes for carrying out the invention]

[0010] The embodiments for carrying out this invention will be described in detail below with reference to the drawings, based on examples. However, the dimensions, materials, shapes, and relative arrangements of the components described in these embodiments should be appropriately modified depending on the configuration of the device to which the invention is applied and various conditions. In other words, the scope of this invention is not intended to be limited to the following embodiments. Furthermore, although multiple features are described in the embodiments, not all of these features are necessarily essential to the invention, and the multiple features may be combined arbitrarily. In addition, in the attached drawings, the same or similar components are given the same reference numeral, and redundant explanations are omitted.

[0011] In the following embodiments, we will describe the application of the imaging module and manufacturing method of the present invention to a three-chip color camera, which is an example of a multi-chip imaging module. However, the imaging modules to which the present invention can be applied are not limited to the embodiments shown below. For example, the present invention can also be applied to the imaging module of an endoscope camera provided in an endoscope device as an imaging device.

[0012] (Example 1) FIG. 1 is a schematic diagram illustrating the configuration of a color camera including the three-plate imaging module according to Embodiment 1 of the present invention. As shown in FIG. 1, the three-plate color camera is configured to include an imaging lens 4, a three-plate imaging module composed of a color separation prism 1 and three image sensors 2R, 2G, 2B, and a video signal processing circuit 5. In the following description of the image sensors 2R, 2G, and 2B, the three image sensors 2R, 2G, and 2B are collectively referred to collectively as "the image sensor 2" in the following description, unless otherwise described separately. Similarly, the three exit surfaces 11r, 11g, and 11b of the color separation prism 1, which will be described later, may also be collectively referred to as "the exit surface 11" unless otherwise described separately.

[0013] FIG. 2 shows a right side view of the three-plate imaging module according to the present embodiment. As shown in FIG. 2, the color separation prism 1 included in the imaging module according to the present embodiment separates light incident from an incident surface 10 into three primary color RGB components, and is composed of three prism members 1r, 1g, and 1b. That is, the color separation prism 1 separates incident light into three primary color RGB components as a plurality of color components by the three prism members 1r, 1g, and 1b, and emits the three separated types of light in different directions from each other. The three image sensors 2R, 2G, and 2B are fixed to the respective exit surfaces 11r, 11g, and 11b of the three prism members 1r, 1g, and 1b via an adhesive 3. The three image sensors 2R, 2G, and 2B respectively image the light emitted from the corresponding exit surfaces 11r, 11g, and 11b, convert the light into imaging signals, and output the image signals to the video signal processing circuit 5, and the video signal processing circuit 5 serving as a processing unit combines the images of respective colors to generate a color video signal.

[0014] With respect to the color separation prism 1, three-dimensional position adjustment (positioning) of the image pickup device 2G is performed so as to obtain a desired image. With respect to this image pickup device 2G, three-dimensional position adjustment of the image pickup device 2R and the image pickup device 2B is performed with an accuracy of at most half the pixel size so as to obtain a desired composite image. It is necessary to perform position adjustment not only in the plane direction orthogonal to the light incident on the image pickup device but also in the optical axis direction. During this adjustment in the optical axis direction, variation in various optical path lengths is adjusted (variation is absorbed) by the air gap 12 between the cover glass of the image pickup element 2 and the exit surfaces 11r, 11g, and 11b. Variations in optical path length include variations in the optical path length from the cover glass to the imaging surface (the incident surface on which light is incident in the image pickup element 2) in the image pickup element 2, and variations in the optical path length from the incident surface 10 to the exit surfaces 11r, 11g, and 11b in the color separation prism 1.

[0015] Figure 3 is a front view of the image pickup device 2, and is a schematic diagram showing an incident surface, which is a facing surface of the image pickup device 2 facing the exit surface 11 of the color separation prism 1 in the optical axis direction of the light emitted from the exit surface 11. The incident surface of the image pickup device 2 is covered with a cover glass having the same size as the package, and the imaging area 14, which is the imaging region, is an area narrower than the cover glass. The adhesive 3 is applied to an area (outer peripheral region) outside the imaging area 14. The air gap 12 adjusted according to the variation in optical path length shown in FIG. 2 and the like is fixed by the adhesive 3 applied to an area outside the imaging area 14 of the image pickup device 2 shown in FIG. 3 (interposed between the exit surface 11 and the image pickup device 2). In this case, the amount of the adhesive 3 is set such that the adhesive 3 can contact both the color separation prism 1 and the image pickup element 2 even when the air gap is large, and does not protrude into the imaging area 14 of the image pickup element 2 even when the air gap is small.

[0016] Figure 4 is a schematic plan view of a three-chip imaging module according to this embodiment. The output surface 11 of the color separation prism 1 includes a first region facing the imaging area 14 (imaging region) of the image sensor 2, and a second region facing the area outside the imaging area 14 (outer peripheral region) of the image sensor 2. The second region includes an adhesive portion 13. The adhesive portion 13 is the part that is bonded to the area outside the imaging area 14 (outer peripheral region) of the image sensor 2 via adhesive 3. The adhesive portion 13 of the color separation prism 1 in this embodiment shown in Figure 4 has a sloping shape. Specifically, the adhesive portion 13 provided in the second region of the output surface 11 is configured as a sloping surface such that the distance from the first region in a first direction intersecting the optical axis direction gradually increases as it moves away from the first region in a first direction intersecting the optical axis direction. In this embodiment, the first direction is the direction perpendicular to the optical axis direction. The first region of the emission surface 11 is a surface aligned with the first direction, and the inclined surface of the adhesive portion 13 is a surface aligned with the second direction, which is inclined with respect to the optical axis direction and the first direction, respectively. By providing such an adhesive portion 13, the distance between the emission surface 11 and the image sensor 2 in the optical axis direction is locally increased at the adhesive portion 13. The distance between the image sensor 2 (outer peripheral region) and the adhesive portion 13 in the second region of the emission surface 11 in the optical axis direction is wider than the distance between the image sensor 2 (imaging area 14) and the adhesive portion 13 in the first region of the emission surface 11 in the optical axis direction.

[0017] The inclined shape of the adhesive portion 13 in this embodiment is an example of a spacing expansion portion, which is a feature of the present invention, that widens the adhesive application area (priority area) of the adhesive 3 to a distance in the optical axis direction that is greater than the air gap in the optical axis direction between the output surface 11 and the imaging area 14. Figure 4 shows the adhesive portion 13 of the output surface 11g of the G component viewed from above for illustrative purposes, but the output surfaces 11r and 11b of the R and B components other than the G component have a similar shape.

[0018] The inclination of the adhesive portion 13 is not limited to 45 degrees with respect to the emission surface 11, but should be set to an appropriate angle depending on the viscosity and adhesive strength of the adhesive 3. In the case of adhesive 3 that hardens with UV light, the angle should also take into consideration the UV transmittance. A larger angle with respect to the emission surface 11 increases the effect of the present invention, which is to suppress the overflow of adhesive 3 onto the imaging area 14 of the image sensor 2. However, it is necessary to note that the strength may decrease due to the smaller cross-sectional area of ​​the adhesive 3, and positional displacement due to curing shrinkage may increase due to differences in adhesive thickness in different locations.

[0019] In the example configuration shown in Figure 4, the adhesive 3 is in contact only with the inclined adhesive portion 13, but it is important that it does not cover the imaging area 14 of the image sensor 2 (i.e., the adhesive 3 does not have an area that overlaps with the imaging area 14 when viewed in the direction of the optical axis). Therefore, a configuration in which the adhesive 3 touches the emission surface 11 other than the inclined adhesive portion 13, in a range where the adhesive 3 does not cover the imaging area 14 of the image sensor 2, or a configuration in which the adhesive 3 touches the side surfaces of the color separation prism 1 and the image sensor 2, is also acceptable.

[0020] Furthermore, by applying a water-repellent coating to the imaging area 14 of the image sensor 2 to repel the adhesive 3, an improvement in the effect of suppressing the penetration of the adhesive 3 into the imaging area 14 can be expected. The water-repellent coating, which is water-repellent to the adhesive 3, may be applied not only to the imaging area 14 of the image sensor 2, but also to the first region of the output surface 11 of the color separation prism 1 (the region facing the imaging area 14 of the image sensor 2).

[0021] The manufacturing procedure for the imaging module of Example 1 will be explained with reference to Figures 5 and 6. Figure 5 is a process diagram showing the manufacturing procedure for the imaging module. Figure 6 is a schematic diagram showing the configuration of the manufacturing apparatus for the imaging module of Example 1. Note that this manufacturing procedure shows an example where an adhesive that cures with UV light is used for adhesive 3.

[0022] First, the color separation prism 1 is fixed to the support base 22. The support base 22 is fixed in a predetermined positional relationship with the alignment chart 20 used for positioning and the imaging lens 21. Next, the image sensor 2G is fixed to the 6-axis manipulator (position adjustment device) 23. Then, the image sensor 2G is moved to the coating position where the coating device 24 is located (P1). Using the coating device 24, a predetermined amount of adhesive 3 is applied to the image sensor 2G (P2). While checking the image obtained from the image sensor 2G, the position of the image sensor 2G relative to the color separation prism 1 is adjusted using the 6-axis manipulator (position adjustment device) 23 so that the focus and field of view match those on the alignment chart 20. This position adjustment brings the color separation prism 1 and the image sensor 2G into contact via the adhesive 3 (P3). In this state, the adhesive 3 is irradiated with UV light to cure it (P4).

[0023] The adhesive 3 is applied to image sensors 2R and 2B using the same process as for image sensor 2G. However, when adjusting the position of image sensors 2R and 2B, the position adjustment is performed while checking the composite image with the image of image sensor 2G, so that the adjustment can be made with an accuracy of less than half the pixel size relative to the image of image sensor 2G.

[0024] Figure 7 is a perspective view showing the adhesive structure of the image sensor 2G of the three-chip imaging module according to this embodiment. In this embodiment, the first region of the output surface 11 is a rectangular region, and the adhesive portion 13, which is an inclined surface provided in the second region of the output surface 11, is configured to be provided on the outside of each of the two parallel sides included in the outer boundary of the first region, and the adhesive 3 is applied along the two sides. Figures 4 and 7 show an example of the configuration of the spacing expansion portion, which is a feature of the present invention, in which the adhesive portion 13 is provided only on two sides of the side surface of the color separation prism 1, but the configuration of the adhesive portion 13 as a spacing expansion portion is not limited to this.

[0025] Figure 8 is a perspective view showing another configuration example of Embodiment 1, where the adhesive portion 13 is located at the four corners of the output surface 11 of the color separation prism 1. Figure 9 is a perspective view showing another configuration example of Embodiment 1, where the adhesive portion 13 is located around the entire outer circumference of the output surface 11 of the color separation prism 1. The adhesive portion 13 provided on the color separation prism 1 may be applied to the four corners of the output surface 11 as shown in Figure 8, or to the entire outer circumference of the output surface 11 as shown in Figure 9. That is, in the configuration example shown in Figure 8, the output surface 11 has a rectangular outline when viewed in the direction of the optical axis, and the adhesive portion 13 is provided in the areas corresponding to the four corners of the rectangular outline. In the configuration example shown in Figure 9, the first region of the output surface 11 (the region facing the imaging area 14) is rectangular, and a second region (the region facing the area outside the imaging area 14) is formed to surround its outer circumference, with the adhesive portion 13 provided over the entire area of ​​the second region. As shown in Figure 8, when the adhesive portion 13 is applied only to the four corners of the output surface 11, the amount of adhesive 3 required to bond and fix the color separation prism 1 and the image sensor 2 is reduced, thereby reducing the risk of overflow and shortening the application and curing process. As shown in Figure 9, when the adhesive portion 13 is applied to the entire circumference of the output surface 11, a sufficient bonding area can be secured, and the bonding strength can be increased. In addition, it can be expected to have the effect of preventing dust and other debris from entering the imaging area 14.

[0026] In this embodiment, adhesive portions 13, which are inclined surfaces that serve as gap-expanding portions, are provided on each of the ejection surfaces 11r, 11g, and 11b. However, it is also possible to provide the adhesive portion 13, which is an inclined surface, on at least one of the ejection surfaces 11r, 11g, and 11b.

[0027] Furthermore, the form of the adhesive portion 13 as the gap expansion portion may also be a combination of the configuration examples shown in Figures 7 to 9. For example, a composite form may be used in which a part of the adhesive portion 13 in the form shown in Figure 7 is applied to a part of the second region of the ejection surface 11, and a part of the adhesive portion 13 in the form shown in Figures 8 and 9 is applied to another part.

[0028] According to this embodiment, when fixing the color separation prism 1 and the image sensor 2 with an adhesive, the color separation prism 1 and the image sensor 2 can be stably bonded without using a fixing member as in the conventional method. That is, even if the distance between the color separation prism 1 and the image sensor 2 changes according to variations in the optical path lengths of the color separation prism 1 and the image sensor 2, it is possible to prevent the adhesive 3 from not reaching one of the members or from the adhesive 3 from overflowing into the imaging area 14 of the image sensor 2. Therefore, according to this embodiment, it is possible to improve the yield during production while avoiding an increase in the size of the imaging module.

[0029] (Example 2) Figure 10 is a schematic plan view of a three-chip imaging module according to Embodiment 2 of the present invention. For the sake of explanation, components having the same function as those shown in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted. Also, for explanatory purposes, Figure 10 shows the adhesive portion 13 of the G component emission surface 11g viewed from above, but the R component and B component emission surfaces 11r and 11b have the same shape.

[0030] The adhesive portion 13 of the color separation prism 1 in Example 1 had a sloped shape, as shown in Figure 1. In this embodiment shown in 0, the adhesive portion 13 of the color separation prism 1 is configured as a stepped portion recessed in the optical axis direction relative to the output surface 11 of the color separation prism 1. This step is expected to suppress the overflow of the adhesive 3 into the imaging area 14 even if it is crushed by fluctuations in the air gap 12 due to the alignment of the image sensor 2. Compared to Embodiment 1, this structure has a smaller difference in adhesive thickness from place to place, thus suppressing deviations in curing shrinkage and preventing the penetration of the adhesive 3 into the imaging area 14. The larger the step, the greater the effect of suppressing the penetration of the adhesive 3 into the imaging area 14, but it is important to note that this may reduce the adhesive strength and prevent the adhesive from reaching the area unless the height of the adhesive 3 is above a certain amount.

[0031] Furthermore, Figure 11 shows a plan view of a three-plate imaging module, which is another example of Example 2, in which the adhesive portion 13 has a step and inclination relative to the output surface 11. For illustrative purposes, Figure 11 shows the adhesive portion 13 of the output surface 11g of the G component viewed from above, but the output surfaces 11r and 11b of the R and B components other than the G component have the same shape. In this structure as well, the step of the adhesive portion 13 makes it difficult for the adhesive 3 to penetrate the imaging area 14, and the inclination is expected to have the effect of pushing the adhesive 3 to the opposite side of the imaging area 14. This structure is expected to have both the effect of the inclined shape of the adhesive portion 13 in Example 1 and the effect of the step shape in Example 2 shown in Figure 10.

[0032] In Figures 10 and 11, the adhesive 3 is in contact only with the inclined adhesive portion 13, but it is important that it does not come into contact with the imaging area 14 of the image sensor 2. Therefore, a configuration in which the adhesive 3 comes into contact with the emission surface 11 other than the inclined adhesive portion 13, in a range where the adhesive 3 does not come into contact with the imaging area 14 of the image sensor 2, or a configuration in which the adhesive 3 comes into contact with the side surfaces of the color separation prism 1 and the image sensor 2, is also acceptable.

[0033] In Example 2, the manufacturing process can be carried out in the same manner as in Example 1, following the process diagram in Figure 5, and the details are omitted.

[0034] Figures 10 and 11 show a structure in which adhesive portions 13 are provided only on two sides of the color separation prism 1. However, in Example 2, as in Example 1, the adhesive portions may be applied to the four corners of the emission surface 11, or to the entire outer circumference of the emission surface 11. The effect is the same as in Example 1, and details are omitted.

[0035] (Example 3) The manufacturing procedure for the imaging module according to Embodiment 3 of the present invention will be described with reference to Figures 12 and 13. Figure 12 is a process diagram. Figure 13 is a configuration diagram of the manufacturing apparatus. For the sake of convenience of explanation, components having the same function as those shown in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted.

[0036] In the manufacturing procedures of Examples 1 and 2 described above, a method was described in which a certain amount of adhesive 3 was applied to the image sensor 2 and then brought into contact with the color separation prism 1. In Example 3, a method is described in which the image sensor 2 is positioned relative to the color separation prism 1 and then the required amount of adhesive 3 is applied from the side.

[0037] First, the color separation prism 1 is fixed to the support base 22. The support base 22 is fixed in a predetermined positional relationship with the alignment chart 20 used for positioning and the imaging lens 21. The image sensor 2G is fixed to the 6-axis manipulator (position adjustment device) 23. While checking the image obtained from the image sensor 2G, the position of the image sensor 2G is adjusted so that it is in focus on the alignment chart 20 (P11).

[0038] With the image sensor 2G positioned relative to the color separation prism 1, the emission surface 1 From the side in a direction intersecting the optical axis with respect to the space between 1 and the image sensor 2, the required amount of adhesive 3 is applied to the bonding area 13 by the application device 24 (P12). At this time, it is best to understand the air gap 12 after position adjustment and calculate the amount of adhesive that will not enter the imaging area 14 before applying it. Alternatively, the amount of adhesive applied can be adjusted while checking the clearance between the imaging area 14 and the adhesive 3.

[0039] The color separation prism 1 and the image sensor 2 are fixed in place, and adhesive 3 is applied. UV irradiation is then performed on the adhesive 3 to cure it (P13).

[0040] The same bonding process is used for image sensors 2R and 2B as for image sensor 2G. However, when adjusting the position of image sensors 2R and 2B, the adjustment is performed while checking the composite image with the image of image sensor 2G, so that the adjustment can be made with an accuracy of less than half the pixel size relative to the image of image sensor 2G.

[0041] The structure of the imaging module in this embodiment is designed to facilitate the application of adhesive 3 from the side while the module is in an adjusted position. By manufacturing using this procedure, the process of moving the image sensor 2 to the adhesive application position can be shortened. Furthermore, even if there is a large variation in the optical path length of the color separation prism 1 and the image sensor 2, it becomes possible to adjust the amount of adhesive 3 applied according to the resulting air gap 12, which is expected to suppress the overflow of adhesive 3 onto the imaging area 14.

[0042] In the above descriptions of the embodiments, the imaging module and its manufacturing method of the present invention were described in the case of being applied to a three-chip color camera, but they may also be applied to multi-chip systems such as two-chip or four-chip systems. Also, for the sake of convenience, the color separation prism 1 was described as one that decomposes into multiple color components, namely RGB components, but it is not limited to RGB components and may be applied to prisms that decompose into visible light, near-infrared light, dual green, etc.

[0043] The configurations of each of the above embodiments can be combined with each other.

[0044] The disclosure of embodiments of the present invention includes the following configurations. (Composition 1) A color separation prism having multiple emission surfaces that separate incident light into multiple light sources corresponding to multiple color components and emit the multiple light sources in different directions from each other, Multiple image sensors are provided corresponding to the multiple emission surfaces, and each of these sensors converts the light emitted from the multiple emission surfaces into an imaging signal. It has, In an imaging module in which the image sensor has an opposing surface that faces the output surface in the direction of the optical axis of the light emitted from the output surface, the opposing surface includes an imaging region and an outer peripheral region outside the imaging region, and is fixed to the color separation prism by an adhesive interposed between the outer peripheral region and the output surface, An imaging module characterized in that at least one of the plurality of emission surfaces includes, in the region facing the outer peripheral region, a spacing expansion portion in the optical axis direction where the distance between it and the outer peripheral region is greater than the distance between it and the imaging region. (Configuration 2) The emission surface includes a first region facing the imaging region in the optical axis direction and a second region facing the outer peripheral region in the optical axis direction. The imaging module according to Configuration 1, characterized in that the spacing expansion portion includes an inclined surface inclined with respect to the first region such that the distance between the second region and the outer peripheral region in the optical axis direction gradually increases as it moves away from the first region in a direction intersecting the optical axis direction. (Configuration 3) The first region is a plane along a first direction intersecting the optical axis direction, The imaging module according to configuration 2, characterized in that the inclined surface is a surface along a second direction that is inclined with respect to the optical axis direction and the first direction, respectively. (Composition 4) The first region is a rectangular region, The imaging module according to configuration 2 or 3, characterized in that the inclined surface is provided on the outside of each of the two parallel sides included in the outer boundary of the first region. (Composition 5) The emission surface has a rectangular outline when viewed in the direction of the optical axis, The imaging module according to configuration 2 or 3, characterized in that the inclined surface is provided in the region corresponding to the four corners of the rectangular outline. (Composition 6) The imaging module according to configuration 2 or 3, characterized in that the inclined surface is provided so as to surround the outer periphery of the first region. (Composition 7) The imaging module according to configuration 6, characterized in that the first region is a rectangular region. (Configuration 8) The imaging module according to configuration 1, characterized in that the spacing expansion portion is a stepped portion recessed in the optical axis direction with respect to the first region facing the imaging region in the optical axis direction on the emission surface. (Composition 9) The imaging module according to any one of configurations 1 to 8, characterized in that the imaging area is coated with a water-repellent coating for the adhesive. (Composition 10) The imaging module according to any one of configurations 1 to 9, characterized in that the first region on the emission surface facing the imaging region in the direction of the optical axis is coated with a water-repellent coating for the adhesive. (Composition 11) A method for manufacturing an imaging module according to any one of the configurations 1 to 10, A step of positioning the image sensor with respect to the emission surface of the color separation prism, A step of applying adhesive from the side in a direction intersecting the optical axis to the space between the emission surface and the image sensor, A method for manufacturing an imaging module, characterized by including the following: (Composition 12) An imaging module described in any one of configurations 1 to 10, A processing unit that outputs a video signal based on the imaging signal output by the image sensor of the imaging module, An imaging device characterized by being equipped with [a specific feature]. [Explanation of Symbols]

[0045] 1...Color separation prism, 2...Image sensor, 3...UV curing adhesive, 4...Imaging lens, 5...Video signal processing circuit, 10...Induction surface, 11...Output surface, 12...Air gap, 13...Color separation prism bonding area, 14...Imaging area, 20...Alignment chart, 21...Imaging lens for alignment, 22...Support base, 23...6-axis manipulator (position adjustment device), 24...Coating device

Claims

1. A color separation prism having multiple emission surfaces that separate incident light into multiple light sources corresponding to multiple color components and emit the multiple light sources in different directions from each other, Multiple image sensors are provided corresponding to the multiple emission surfaces, and each of these sensors converts the light emitted from the multiple emission surfaces into an imaging signal. It has, In an imaging module in which the image sensor has an opposing surface that faces the output surface in the direction of the optical axis of the light emitted from the output surface, the opposing surface includes an imaging region and an outer peripheral region outside the imaging region, and is fixed to the color separation prism by an adhesive interposed between the outer peripheral region and the output surface, An imaging module characterized in that at least one of the plurality of emission surfaces includes, in the region facing the outer peripheral region, a spacing expansion portion in the optical axis direction where the distance between it and the outer peripheral region is greater than the distance between it and the imaging region.

2. The emission surface includes a first region facing the imaging region in the optical axis direction and a second region facing the outer peripheral region in the optical axis direction. The imaging module according to claim 1, characterized in that the spacing expansion portion includes an inclined surface inclined with respect to the first region such that the distance between the second region and the outer peripheral region in the optical axis direction gradually increases as it moves away from the first region in a direction intersecting the optical axis direction.

3. The first region is a plane along a first direction intersecting the optical axis direction, The imaging module according to claim 2, characterized in that the inclined surface is a surface along a second direction that is inclined with respect to the optical axis direction and the first direction, respectively.

4. The first region is a rectangular region, The imaging module according to claim 3, characterized in that the inclined surface is provided on the outside of each of the two parallel sides included in the outline of the first region.

5. The emission surface has a rectangular outline when viewed in the direction of the optical axis, The imaging module according to claim 3, characterized in that the inclined surface is provided in the region corresponding to the four corners of the rectangular outline.

6. The imaging module according to claim 3, characterized in that the inclined surface is provided so as to surround the outer periphery of the first region.

7. The imaging module according to claim 6, characterized in that the first region is a rectangular region.

8. The imaging module according to claim 1, characterized in that the spacing expansion portion is a stepped portion recessed in the optical axis direction with respect to the first region facing the imaging region in the optical axis direction on the emission surface.

9. The imaging module according to claim 1, characterized in that the imaging area is coated with a water-repellent coating for the adhesive.

10. The imaging module according to claim 1, characterized in that the first region on the emission surface facing the imaging region in the optical axis direction is coated with a water-repellent coating for the adhesive.

11. A method for manufacturing an imaging module according to claim 1, A step of positioning the image sensor with respect to the emission surface of the color separation prism, A step of applying adhesive from the side in a direction intersecting the optical axis to the space between the emission surface and the image sensor, A method for manufacturing an imaging module, characterized by including the following:

12. The imaging module according to claim 1, A processing unit that outputs a video signal based on the imaging signal output by the image sensor of the imaging module, An imaging device characterized by being equipped with [a specific feature].

Images