Coil plate and manufacturing method

Abstract

This invention provides a coil plate with increased thrust and a method for manufacturing the same. [Solution] The coil plate includes a first coil 301, a first plating layer 303 covering the first coil, a dielectric layer 401 covering the first plating layer, a second coil 501 on the dielectric layer, and a second plating layer 503 covering the second coil, wherein the first plating layer is located between the dielectric layer and the first coil, the dielectric layer includes a first blind via 402, and the second coil is electrically connected to the first coil via the first blind via. The coil plate further includes a first conductive pad 302 installed parallel to the first coil and a second conductive pad 502 installed parallel to the second coil. The dielectric layer further includes a second blind via 403, and the second conductive pad is electrically connected to the first conductive pad via the second blind via. The second plating layer is electroplated onto the isolated second coil by simply connecting the second conductive pad to an external electrode.

Description

Technical Field

[0001] The present disclosure relates to the field of packaging technology, and in particular to a coil plate and a manufacturing method thereof.

Background Art

[0002] A voice coil motor (abbreviated as VCM) features high frequency response and high precision. An optical image stabilization system (abbreviated as OIS) is a type of VCM, which is widely applied in cameras, implements an autofocus function, and displays clear images by adjusting the position of a lens. A coil plate is applied to a camera VCM-OIS, and implements image stabilization by driving a lens or a sensor to move through force exerted on an energized coil in a magnetic field.

[0003] Along with the increasing complexity of lens modules, the weight thereof also tends to increase, and the force required for moving lenses and sensors also increases. According to the force formula of an energized lead wire in a magnetic field F=BIL (wherein B is magnetic field strength, I is current, and L is the length of the lead wire), Ohm's law I=U / R (wherein U is voltage, and R is resistance), and the lead wire resistance formula R=ρL / S (wherein ρ is the resistivity of the material used to manufacture the resistor, L is the length of the lead wire for winding the resistor, and S is the cross-sectional area of the lead wire for winding the resistor), the formula can be converted into F=BUS / ρ. When the magnetic field strength B, voltage U, and material resistivity ρ are constant values, an increase in thrust can be achieved by increasing the cross-sectional area S of the lead wire. However, there are still obvious deficiencies in the related art regarding the technical solution for increasing the cross-sectional area S.

Summary of the Invention

Problem to be Solved by the Invention

[0004] In view of this, an object of the present disclosure is to provide a coil plate and a manufacturing method thereof. [Means for solving the problem]

[0005] To achieve the above objective, in a first embodiment, the Disclosure provides a coil plate comprising a first coil, a first plating layer covering the first coil, a dielectric layer covering the first plating layer, a second coil in the dielectric layer, and a second plating layer covering the second coil, wherein the first plating layer is located between the dielectric layer and the first coil, the dielectric layer includes a first blind via, and the second coil is electrically connected to the first coil via the first blind via, and the coil plate further comprises a first conductive pad positioned parallel to the first coil and a second conductive pad positioned parallel to the second coil, the dielectric layer includes a second blind via, and the second conductive pad is electrically connected to the first conductive pad via the second blind via.

[0006] In some embodiments, a solder resist layer is further included, the solder resist layer covering the second plating layer and the dielectric layer, and the solder resist layer includes solder resist openings for exposing at least a portion of the second plating layer.

[0007] In some embodiments, a first conductive pad is covered with a first plating layer, and / or a second conductive pad is covered with a second plating layer.

[0008] In some embodiments, the first conductive pad and the second conductive pad are located in the non-product area of ​​the coil plate.

[0009] In a second embodiment, the embodiments of the present disclosure further provide a method for manufacturing a coil plate. Step (a) prepares the mounting plate, (b) a step of forming a first coil and a first conductive pad on the mounting plate, Step (c) electroplating the entire surface to form a first plating layer that covers the first coil and the first conductive pad, Step (d) of pressing a dielectric layer onto the first plated layer to create a first blind via and a second blind via, wherein the first blind via exposes the first plated layer in the first coil, and the second blind via exposes the first plated layer in the first conductive pad, Step (e) of forming a second coil and a second conductive pad in the dielectric layer, wherein the second coil is electrically connected to the first coil via the first blind via, and the second conductive pad is electrically connected to the first conductive pad via the second blind via, Step (f) is to electroplat a second plating layer onto the second coil and the second conductive pad, wherein the first conductive pad and the second conductive pad are located in a non-product area. The process includes (g) removing the mounting plate.

[0010] In some examples, The step (h) of forming a solder resist layer on the dielectric layer, the step (h) further comprising the solder resist layer including solder resist openings for exposing at least a portion of the second plating layer.

[0011] In some embodiments, step (b) specifically means: The mounting plate includes a support layer and a first seed layer in the support layer, and the process includes the step (b1) of forming a first photoresist layer on the first seed layer and creating a pattern, Step (b2) of electroplating a first coil and a first conductive pad in the pattern of the first photoresist layer, The process includes (b3) removing the first photoresist layer.

[0012] In some embodiments, the material of the first seed layer is copper. Step (b) further comprises forming a first metal layer on the first seed layer and forming a first coil and a first conductive pad on the first metal layer, wherein the first metal layer includes a non-copper metal. Step (c) further includes etching the exposed first metal layer and then electroplating the entire surface to form a first plated layer that covers the first coil and the first conductive pad.

[0013] In some embodiments, step (g) further includes etching the first metal layer remaining on the first coil and the first conductive pad.

[0014] In some embodiments, the non-copper metal includes at least one of titanium (Ti), chromium (Cr), tungsten (W), zirconium (Zr), aluminum (Al), silver (Ag), and gold (Au).

[0015] In some embodiments, step (e) is: The steps include (e1) performing electroless copper plating on the dielectric layer, The steps include (e2) forming a second photoresist layer on the dielectric layer and creating a pattern, Step (e3) of electroplating a second coil and a second conductive pad in the pattern of the second photoresist layer, The procedure includes (e4) the step of removing the second photoresist layer.

[0016] In some embodiments, the aforementioned mounting plate further includes a copper foil layer, the copper foil layer is located between the support layer and the first seed layer, and the copper foil layer and the first seed layer are physically bonded. Step (g) includes separating the copper foil layer from the first seed layer and removing the aforementioned mounting plate. [Effects of the Invention]

[0017] As can be seen from the above description, the coil plate and the manufacturing method provided by the present disclosure increase the cross-sectional area of the first coil by using the first plating processed layer and increase the cross-sectional area of the second coil by using the second plating processed layer by adding the first plating processed layer and the second plating processed layer, thereby achieving the technical effect of increasing the thrust of the coil plate. The present disclosure achieves the technical effect of electroplating the second plating processed layer on the isolated second coil by using the first conductive pad and the second conductive pad. Moreover, the first conductive pad and the second conductive pad are formed in a non-working area and do not need to be removed, which saves process steps. Non-copper metal is used to form the first metal layer to protect the bottom surface of the first coil, so that when the first seed layer and the first plating processed layer exposed in subsequent etching are removed, the first coil will not be eroded, thereby preventing the cross-section of the first coil from becoming thinner. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure or related art, the following briefly introduces the drawings required for describing the embodiments or related art. Obviously, the drawings in the following description are merely embodiments of the present disclosure, and those skilled in the art can obtain other drawings based on these drawings without creative work. [Figure 1] A schematic diagram of a central structure of a coil plate provided by related art is shown. [Figure 2(a)] Schematic diagrams of cross-sections or front views of a central structure at each step of a method for manufacturing a coil plate provided by an embodiment of the present disclosure are shown. [Figure 2(b)] Schematic diagrams of cross-sections or front views of a central structure at each step of a method for manufacturing a coil plate provided by an embodiment of the present disclosure are shown. [Figure 2(c)] Schematic diagrams of cross-sections or front views of a central structure at each step of a method for manufacturing a coil plate provided by an embodiment of the present disclosure are shown. [Figure 2(d)] Schematic diagrams of cross-sections or front views of a central structure at each step of a method for manufacturing a coil plate provided by an embodiment of the present disclosure are shown. [Figure 2(e)]The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(f)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(g)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(h)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(i)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(j)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(k)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(l)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(m)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(n)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(o)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(p)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(q)] The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 2(r)]The diagrams show schematic cross-sectional or front views of the central structure for each step of the coil plate manufacturing method provided in the embodiments of this disclosure. [Figure 3] A schematic diagram of the structure of the coil plate provided in the embodiments of this disclosure is shown. [Modes for carrying out the invention]

[0019] To further clarify the purpose, technical solutions, and advantages of this disclosure, the following will describe this disclosure in more detail, with reference to the drawings and in conjunction with specific embodiments.

[0020] Unless otherwise defined, technical or scientific terms used in the embodiments of this disclosure must have the general meaning understood by a person skilled in the art in the field to which this disclosure belongs. The terms “first,” “second,” and similar terms used in the embodiments of this disclosure do not indicate any order, number, or importance, but are used simply to distinguish different components. Similar terms such as “include” or “incorporate” mean that the element or article appearing before the term covers the elements or articles and their equivalents listed after the term, and do not exclude other elements or articles. Similar terms such as “connection” or “linking” are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. When describing the positional relationship between two members using terms such as “above,” “upper,” “downward,” and “below,” one or more members may be located between the two members unless these terms are used in conjunction with “immediately” or “directly.” When one element or layer is placed “on top” of another element or layer, the other layer or element may be directly inserted into or between the other element. In drawings, the thickness and shape of layers and regions may be exaggerated for ease of understanding and convenience of explanation. Even if not explicitly stated, components are to be interpreted as including a general tolerance range.

[0021] Conventional technologies have not addressed how to increase the cross-sectional area of ​​a coil to increase its thrust. Furthermore, regarding the problem of electroplating coils, as shown in Figure 1, related technologies disclose creating a single temporary electroplating lead wire (within the dashed frame in Figure 1) on the coil, using this temporary lead wire as an electrical conduction path during electroplating, and removing subsequent temporary electroplating leads to avoid short circuits. Conventional solutions increase process complexity and design difficulty.

[0022] In view of this, embodiments of the present disclosure provide a method for manufacturing a coil plate. Figures 2(a) to 2(r) show schematic cross-sectional or front views of the central structure of each step of the method for manufacturing a coil plate provided by embodiments of the present disclosure. As shown in Figures 2(a) to 2(r), the manufacturing method includes the following:

[0023] First, step (a) provides the mounting plate 100, as shown in Figure 2(a).

[0024] In some embodiments, the mounting plate 100 further includes a support layer 101, a first seed layer 103, and a copper foil layer 102 located between them. Here, the copper foil layer 102 and the first seed layer 103 are physically bonded and can be physically separated.

[0025] Selectively, the material of the support layer 101 includes, but is not limited to, resin, glass fiber, glass, silicon, and metal. The first seed layer 103 and the copper foil layer 102 are installed on one or both sides of the support layer 101. It should be understood that the mounting plate 100 may further include, and is not limited to, more peelable metallic conductive layers, such as copper foil.

[0026] Selectively, the thickness of the copper foil layer 102 is 16-20 μm, for example, 18 μm. Selectively, the first seed layer 103 may be a copper foil of 1.5-5 μm thickness.

[0027] Next, as shown in Figure 2(b), a first metal layer 201 is formed on the first seed layer 103. The first metal layer 201 contains a non-copper metal. Here, the non-copper metal includes at least one of titanium (Ti), chromium (Cr), tungsten (W), zirconium (Zr), aluminum (Al), silver (Ag), and gold (Au).

[0028] Selectively, the first metal layer 201 may further contain copper. In this case, the copper should be located on the side of the first metal layer 201 away from the mounting plate 100.

[0029] Selectively, the first metal layer 201 can be formed by sputtering or electroplating, for example, by first sputtering titanium onto the first seed layer 103 and then sputtering copper, or for example, by first electroplating titanium onto the first seed layer 103 and then electroplating copper.

[0030] The step of forming the first metal layer 201 can be omitted.

[0031] Next, step (b) is to form the first coil 301 and the first conductive pad 302 on the first metal layer 201, as shown in Figures 2(c) to 2(g).

[0032] It should be understood that if the step of forming the first metal layer 201 is omitted, the first coil 301 and the first conductive pad 302 are formed on the first seed layer 103.

[0033] In some embodiments, step (b) specifically includes the following:

[0034] (b1) A first photoresist layer 202 is formed on the first metal layer 201 and patterned, as shown in Figures 2(c) and 2(d). Here, exposure and development are performed to expose the position of the first wiring layer and achieve patterning.

[0035] If the step of forming the first metal layer 201 is omitted, the first photoresist layer 202 is formed on the first seed layer 103 and patterned, but this disclosure will not be described in detail.

[0036] (b2) The first wiring layer 203 is formed by electroplating the pattern of the first photoresist layer 202, as shown in Figure 2(e). Here, part of the first wiring layer 203 forms the first coil 301 and part of the first conductive pad 302. The material of the first wiring layer 203 may be copper.

[0037] (b3) Remove the first photoresist layer 202, as shown in Figure 2(f).

[0038] (b4) The first metal layer 201 not covered by the first wiring layer 203 is etched, as shown in Figures 2(g) and 2(h). It should be understood that the first metal layer 201 can be etched using a chemical that corrodes a specific metal, and therefore the chemical should correspond to the material of the first metal layer 201, but this disclosure is not limited thereto. If the step of forming the first metal layer 201 is omitted, step (b4) can be omitted.

[0039] In step (b), as is clear from Figure 2(h), the first coil 301 and the first conductive pad 302 are formed on the first seed layer 103. The first conductive pad 302 is located in the non-product area, i.e., the waste area.

[0040] This method does not require additional processing of the first conductive pad 302 after the final product is completed, thus helping to reduce the number of steps in the process.

[0041] Next, step (c), shown in Figure 2(i), is performed by electroplating the entire surface to form a first plated layer 303 that covers the first coil 301, the first conductive pad 302, and the first seed layer 103. Here, the material of the first plated layer 303 may be copper.

[0042] Next, the dielectric layer 401 is pressed onto the first plated layer 303 to create the first blind via 402 and the second blind via 403. The first blind via 402 exposes a portion of the first plated layer on the first coil 301, and the second blind via 403 exposes a portion of the first plated layer on the first conductive pad 302. This is step (d), see Figure 2(j).

[0043] Selectively, the material of the dielectric layer 401 may be one selected from the group consisting of resin materials, such as liquid crystal polymers, BT (bismaleimide triazine) resins, semi-cured prepregs, ABF (Ajinomoto Build-up Film) films, epoxy resins, and polyimide resins, but this disclosure is not limited thereto.

[0044] The first blind via 402 and the second blind via 403 can be opened by methods such as laser drilling or laser drilling, and this disclosure is not limited thereto.

[0045] In some alternative embodiments, the dielectric layer 401 and the second seed layer are pressed onto the first plated layer 303, thereby saving the step of manufacturing the second seed layer.

[0046] Next, step (e) is to form a second coil 501 and a second conductive pad 502 in the dielectric layer 401, as shown in Figures 2(j) and 2(k). Here, the second coil 501 is electrically connected to the first coil 301 via the first blind via 402, and the second conductive pad 502 is electrically connected to the first conductive pad 302 via the second blind via 403.

[0047] Furthermore, the second conductive pad 502 is located in the non-product area, i.e., the waste area. This method does not require additional processing of the second conductive pad 502 after the final product is completed, and helps to reduce the manufacturing process.

[0048] In some embodiments, step (e) includes the following:

[0049] (e1) Desmear and electroless copper plating (PHT) are performed. Here, the desmear treatment can remove any organic residue remaining on the first blind via 402 and the second blind via 403, helping to ensure that the second coil 501 is electrically connected to the first coil 301 via the first blind via 402, and the second conductive pad 502 is electrically connected to the first conductive pad 302 via the second blind via 403, thus avoiding a temporary connection.

[0050] Electroless copper plating can form a copper layer on the side walls and bottom of the first blind via 402 and the second blind via 403, facilitating subsequent electroplating.

[0051] (e2) A second photoresist layer is formed on the dielectric layer 401 to create a pattern.

[0052] (e3) The second coil 501 and the second conductive pad 502 are formed in the hollow areas of the pattern of the second photoresist layer by electroplating.

[0053] (e4) Remove the second resist layer.

[0054] (e5) Flash etch the second seed layer.

[0055] Here, steps (e2) to (e4) are similar to steps (b1) to (b3), so a detailed explanation will be omitted.

[0056] Next, step (f), shown in Figure 2(l), is to electroplat the second coil 501 and the second conductive pad 502 with a second plating layer 503. Here, since both the first coil 301 and the first conductive pad 302 are formed on the surface of the first seed layer 103, the entire substrate can be made electrically conductive. The second coil 501 conducts through the first blind via to the first coil 301, the first seed layer 103, and the first conductive pad 302, and the second conductive pad 502 conducts through the second blind via to the first conductive pad 302, and the second conductive pad 502 is used to connect external electrodes and form an electrical circuit.

[0057] During electroplating, an electrical circuit can be formed simply by connecting the second conductive pad 502 to an external electrode, achieving the objective of plating the isolated second coil 501 without requiring electroplating lead wires to be drawn to the second coil 501, thus helping to improve the complex plating process.

[0058] Next, a third photoresist layer 601 is formed on the dielectric layer 401 and the second plating layer 503, as shown in Figure 2(m). The third photoresist 601 is used to protect the first coil 301 and the second coil 501, prevent damage, and avoid subsequent etching of the first coil 301 and the second coil 501.

[0059] Next is step (g), which involves removing the support layer 101, as shown in Figure 2(n). Specifically, the support layer 101 can be easily removed by peeling off the copper foil layer 102 and the first seed layer 103.

[0060] Next, the first seed layer 103 and the first plating layer 303 located on the surface of the dielectric layer 401 away from the second coil 501 and the second conductive pad 502 are etched, as shown in Figure 2(o).

[0061] Here, by etching the first plating layer 303 located on the surface of the dielectric layer 401, it is possible to ensure that the first coil 301 is not in a short-circuit state.

[0062] Since the surface material of the first metal layer 201 is different from copper, it does not dissolve in the copper etching solution, which protects the first coil 301 from excessive etching and ensures that the cross-sectional area of ​​the first coil 301 is not significantly reduced.

[0063] As shown in Figure 2(p), the process further includes etching the first metal layer 201 located on the first coil 301 and the first conductive pad 302. The material of the first coil 301 and the first conductive pad 302 is copper, and the etching solution used to etch the first metal layer 201 does not dissolve copper, thus effectively preventing the first coil 301 from being corroded.

[0064] It should be understood that omitting the step of forming the first metal layer 201 makes it difficult to ensure that the first coil 301 is not eroded when etching the first seed layer 103 and the first plating layer 303, thus being detrimental to maximizing the cross-sectional area of ​​the first coil 301. Nevertheless, the fabrication method provided in the embodiments of this disclosure utilizes the first plating layer and can still improve the cross-sectional area of ​​the first coil 301.

[0065] Next, the third photoresist layer is removed, as shown in Figure 2(q).

[0066] Finally, a solder resist layer 701 is formed on the dielectric layer 401, the solder resist layer 701 including solder resist openings 702 and exposing at least a portion of the second plating layer 503 - step (i), shown in Figure 2(r).

[0067] As shown in Figure 3, an embodiment of the present disclosure further provides a coil plate. As shown in Figure 3, the coil plate includes a dielectric layer 401, a first coil 301, a second coil 501, a first plating layer 303, and a second plating layer 503, wherein the first coil 301 is placed within the dielectric layer 401, the first plating layer 303 is located between the dielectric layer 401 and the first coil 301, the second coil 501 is placed on the dielectric layer 401, the dielectric layer 401 includes a first blind via 402, the second coil 501 is electrically connected to the first coil 301 via the first blind via 402, and the second plating layer 503 is placed on the second coil 501. By placing the first plating layer 303 and the second plating layer 503 on the first coil 301 and the second coil 501, respectively, the effect of increasing the thrust of the coil plate is achieved.

[0068] In some embodiments, a solder resist layer 701 is further included, the solder resist layer 701 being placed on the surface of the dielectric layer 401, and the solder resist layer 701 includes solder resist openings 702 for exposing at least a portion of the second plating layer 503.

[0069] In some embodiments, a first conductive pad 302 and a second conductive pad 502 are further included, of which the first conductive pad 302 is installed in the dielectric layer 401 parallel to the first coil 301, the dielectric layer 401 includes a second blind via 403, and the second conductive pad 502 is installed in the dielectric layer 401 parallel to the second coil 501 and is electrically connected to the first conductive pad 302 via the second blind via 403.

[0070] By using the second conductive pad 502 to increase the cross-sectional area of ​​the second coil 501, it is possible to easily perform plating on the second coil 501.

[0071] In some embodiments, a first plating layer 303 is provided between the dielectric layer 401 and the first conductive pad 302, and / or a second plating layer 503 is provided on the second conductive pad 502.

[0072] In some embodiments, the first conductive pad 302 and the second conductive pad 502 are located in the non-production area of ​​the coil plate. Placing the first conductive pad 302 and the second conductive pad 502 in the non-production area helps to reduce the manufacturing process by eliminating the need for additional processing.

[0073] As those skilled in the art will understand, the discussion of any embodiments described above is illustrative and not intended to imply that the scope of this disclosure (including the claims) is limited to these examples, and in the spirit of this disclosure, the technical features of the embodiments or different embodiments can be combined, the steps can be carried out in any order, and there are numerous other variations of the embodiments of this disclosure described above that are not provided in detail for the sake of simplicity.

[0074] The embodiments of this disclosure are intended to include all such substitutions, modifications, and variations within the broad scope of the attached claims. Accordingly, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this disclosure should be included within the scope of protection of this disclosure. [Explanation of Symbols]

[0075] 100 Mounting plate, 101 Support layer, 102 Copper foil layer, 103 First seed layer, 201 First metal layer, 202 First photoresist layer, 203 First wiring layer, 301 First coil, 302 First conductive pad, 303 First plating layer, 401 Dielectric layer, 402 First blind via, 403 Second blind via, 501 Second coil, 502 Second conductive pad, 503 Second plating layer, 601 Third photoresist, 601 Third photoresist layer, 701 Solder resist layer, 702 Solder resist opening.

Claims

1. A coil plate comprising: a first coil; a first plating layer covering the first coil; a dielectric layer covering the first plating layer; a second coil in the dielectric layer; and a second plating layer covering the second coil, wherein the first plating layer is located between the dielectric layer and the first coil, the dielectric layer includes a first blind via, and the second coil is electrically connected to the first coil via the first blind via; and further comprising: a first conductive pad installed parallel to the first coil; and a second conductive pad installed parallel to the second coil, wherein the dielectric layer includes a second blind via, and the second conductive pad is electrically connected to the first conductive pad via the second blind via.

2. The coil plate according to claim 1, further comprising a solder resist layer, wherein the solder resist layer covers the second plating layer and the dielectric layer, and the solder resist layer includes solder resist openings for exposing at least a portion of the second plating layer.

3. The first conductive pad is covered with the first plating layer, and / or The coil plate according to claim 1, characterized in that the second conductive pad is covered with the second plating layer.

4. The coil plate according to claim 1, characterized in that the first conductive pad and the second conductive pad are located in a non-product area of ​​the coil plate.

5. Step (a) prepares the mounting plate, (b) a step of forming a first coil and a first conductive pad on the mounting plate, Step (c) electroplating the entire surface to form a first plating layer that covers the first coil and the first conductive pad, Step (d) of pressing a dielectric layer onto the first plated layer to open a first blind via and a second blind via, wherein the first blind via exposes the first plated layer in the first coil, and the second blind via exposes the first plated layer in the first conductive pad, Step (e) of forming a second coil and a second conductive pad in the dielectric layer, wherein the second coil is electrically connected to the first coil via the first blind via, and the second conductive pad is electrically connected to the first conductive pad via the second blind via, Step (f) of electroplating a second plating layer onto the second coil and the second conductive pad, wherein the first conductive pad and the second conductive pad are located in a non-product area. A method for manufacturing a coil plate, comprising the step (g) of removing the mounting plate.

6. The manufacturing method according to claim 5, further comprising the step (h) of forming a solder resist layer on the dielectric layer, wherein the solder resist layer includes solder resist openings for exposing at least a portion of the second plating layer.

7. Step (b) specifically means: The mounting plate includes a support layer and a first seed layer in the support layer, and the process includes the step (b1) of forming a first photoresist layer on the first seed layer and creating a pattern, Step (b2) of forming a first coil and a first conductive pad by electroplating in the pattern of the first photoresist layer, The manufacturing method according to claim 5, further comprising the step (b3) of removing the first photoresist layer.

8. The material of the first seed layer is copper. Step (b) is a step of forming a first metal layer on the first seed layer and forming a first coil and a first conductive pad on the first metal layer, the step further comprising the first metal layer comprising a non-copper metal, The manufacturing method according to claim 7, further comprising step (c) etching the exposed first metal layer and then electroplating the entire surface to form a first plated layer that covers the first coil and the first conductive pad.

9. Step (g) is, The manufacturing method according to claim 8, further comprising the step of etching the first metal layer remaining on the first coil and the first conductive pad.

10. The method for producing according to claim 8, characterized in that the non-copper metal includes at least one of titanium, chromium, tungsten, zirconium, aluminum, silver, and gold.

11. Step (e) is, The steps include (e1) performing electroless copper plating on the dielectric layer, Step (e2) of forming a second photoresist layer on the dielectric layer and creating a pattern, Step (e3) of electroplating a second coil and a second conductive pad in the pattern of the second photoresist layer, The manufacturing method according to claim 5, further comprising the step (e4) of removing the second photoresist layer.

12. The mounting plate further includes a copper foil layer, the copper foil layer is located between the support layer and the first seed layer, and the copper foil layer and the first seed layer are physically bonded. The manufacturing method according to claim 7, characterized in that step (g) includes the step of separating the copper foil layer and the first seed layer and removing the aforementioned mounting plate.

Images