Push / pull device and substrate processing module

JP2026141829APending Publication Date: 2026-09-07EBARA CORP
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Patent Information

Application Number
JP2025028512
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-26
Publication Date
2026-09-07

AI Technical Summary

Benefits of technology

【0018】 上記手段によれば、押し引き装置は、ピストンロッドの、シリンダハウジングへの衝突を防止することができる。

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Abstract

A push-pull device is provided that can prevent the piston rod from colliding with the cylinder housing. [Solution] The push-pull device comprises a free joint structure, an air bearing cylinder, and a fixed bracket that receives the radial load acting on the rod structure.
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Description

[Technical Field]

[0001] The present invention relates to a push-pull device and a substrate processing module. [Background Art]

[0002] As an example of a drive source for a push-pull mechanism that pushes and pulls an object, an air cylinder can be cited. The air cylinder includes a piston rod and a cylinder housing that accommodates the piston rod. By supplying compressed gas into the cylinder housing, the piston rod moves forward, and is configured to move backward by the biasing force of a biasing member (e.g., a spring) provided separately from the air cylinder.

[0003] As another configuration example of an air cylinder, a configuration in which the piston rod is moved forward and backward only by compressed gas can be mentioned. Such an air cylinder, for example, does not have a biasing member, and has a configuration in which compressed gas is supplied / discharged to opposing spaces via a partition wall disposed inside the cylinder housing. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent No. 7023592 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] However, in an air cylinder having such a configuration, the piston rod may slide against the cylinder housing (more specifically, the guide portion) due to its movement. If sliding friction is generated between the piston rod and the cylinder housing in this way, there is a risk that the movement of the piston rod cannot be controlled with high accuracy.

[0006] Therefore, to solve this problem, there are air bearing cylinders that employ air bearings that support the piston rod with compressed gas supplied into the cylinder housing. However, such air bearing cylinders have the problem of low radial rigidity in supporting the piston rod.

[0007] During assembly or operation of the push-pull mechanism, if a radial load acts on the piston rod, the piston rod may collide with the cylinder housing. If the piston rod and / or cylinder housing are damaged as a result of such a collision, the push-pull mechanism may malfunction. As a result, the operating speed of the piston rod may slow down, potentially triggering an alarm or causing the push-pull mechanism to stop working.

[0008] In particular, in the case of air bearing cylinders, the gap (bearing clearance) that supports the piston rod with an air film is very small compared to the length of the piston rod within the cylinder housing. Therefore, for example, when assembling an air bearing cylinder, if the piston rod is inserted into the cylinder housing at an angle, the piston rod and / or the cylinder housing may be damaged.

[0009] Therefore, the air bearing cylinder must be assembled carefully so that the cylinder housing and piston rod are coaxially positioned, that is, so that the centers of these axes are aligned vertically. However, even if the air bearing cylinder is assembled carefully, or during operation of the air bearing cylinder after assembly, there is still a risk of damage to the piston rod and / or cylinder housing.

[0010] Therefore, the present invention aims to provide a push-pull device and a substrate processing module that can prevent the piston rod from colliding with the cylinder housing. [Means for solving the problem]

[0011] In one embodiment, a push-pull device is provided. The push-pull device comprises a free joint structure, an air bearing cylinder connected to the free joint structure, and a fixed bracket that receives a radial load acting on a rod structure connected to the air bearing cylinder.

[0012] In one embodiment, the fixing bracket has a notch located around the rod structure. In one embodiment, the fixing bracket is fixed to the cylinder housing that accommodates the rod structure. In one embodiment, the free joint structure comprises a pressing member connected to the rod structure, a contact member positioned opposite the pressing member, and a connecting block having a receiving recess for accommodating the pressing member and the contact member.

[0013] In one embodiment, the free joint structure includes a connecting plate attached to the connecting block, the connecting plate closing the receiving recess. In one embodiment, the connecting plate has a notch located around the rod structure. In one embodiment, the free joint structure comprises a push-pull force generating unit that generates push-pull forces, and a target load unit connected to the push-pull force generating unit and to which push-pull forces from the push-pull force generating unit are applied, wherein the push-pull force generating unit is configured to apply a push force to the target load unit by making point contact with the target load unit, and to apply a pull force to the target load unit by making surface contact with the target load unit.

[0014] In one embodiment, the free joint structure has an axial gap and a radial gap formed between the push-pull force generating part and the target load part. In one embodiment, the free joint structure includes a shim for adjusting the size of the axial gap. In one aspect, the target load portion includes: a pressing flat surface portion disposed opposite to the push-pull force generating portion; and an opening flat surface portion disposed on a side opposite to the pressing flat surface portion and having an opening into which the push-pull force generating portion is inserted, wherein the push-pull force generating portion includes a spherical surface portion in point contact with the pressing flat surface portion and a flat flange portion in surface contact with the opening flat surface portion.

[0015] In one aspect, the spherical surface portion and the flat flange portion are disposed on opposite sides of each other. In one aspect, the spherical surface portion is disposed opposite to the pressing flat surface portion, and the flat flange portion is disposed opposite to the opening flat surface portion. In one aspect, the target load portion includes a spacer disposed between the pressing flat surface portion and the opening flat surface portion.

[0016] In one aspect, a substrate processing module is provided. The substrate processing module includes: the above push-pull device; a shaft connected to the push-pull device; and a processing member connected to the shaft and configured to process a substrate or a polishing pad.

[0017] In one aspect, the processing member corresponds to at least one of a polishing head that polishes the substrate and a dresser that dresses the polishing pad. In one aspect, the processing member corresponds to at least one of a buff cleaning member and a pencil cleaning member that clean the substrate. Effects of the Invention

[0018] According to the above measures, the push-pull device can prevent collision of the piston rod with the cylinder housing. Brief Description of the Drawings

[0019] [Figure 1] It is a diagram showing a substrate processing apparatus. [Figure 2] It is a diagram showing a polishing module. [Figure 3]FIG. 1 is a diagram showing a cleaning module including a buff cleaning member. [Figure 4] FIG. 2 is a diagram showing a cleaning module including a pencil cleaning member. [Figure 5] FIG. 3 is a diagram showing a dressing device including a free joint structure. [Figure 6] FIG. 4 is a perspective view of a free joint structure. [Figure 7] FIG. 5 is a cross-sectional view of a free joint structure. [Figure 8] FIG. 6 is a diagram showing a free joint structure in a state where a pushing / pulling force generating unit does not apply a pushing or pulling force to a target load unit. [Figure 9] FIG. 7 is a diagram showing a free joint structure in a state where a pushing / pulling force generating unit applies a pulling force to a target load unit. [Figure 10] FIG. 8 is a diagram showing a free joint structure in a state where a pushing / pulling force generating unit applies a pushing force to a target load unit. [Figure 11] FIG. 9 is a diagram showing radial clearances and axial clearances of a free joint structure. [Figure 12] FIG. 10 is a diagram showing a free joint structure including a shim that adjusts the size of a clearance. [Figure 13] FIG. 11 is a diagram showing another embodiment of a free joint structure. [Figure 14] FIG. 12 is a diagram showing another embodiment of a pushing / pulling device. [Figure 15] FIG. 13 is a plan view of a fixing bracket. [Figure 16] FIG. 14 is a diagram showing one embodiment of a free joint structure. [Figure 17] FIG. 15 is a plan view of a connecting plate. MODE FOR CARRYING OUT THE INVENTION

[0020] Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted. In the multiple embodiments described below, the configuration of one embodiment that is not specifically described is the same as that of the other embodiments, so redundant descriptions are omitted.

[0021] Figure 1 shows a substrate processing apparatus. As shown in Figure 1, the substrate processing apparatus 1 comprises a housing 10 and a load port 12 on which a substrate cassette for stocking a large number of wafers is placed. The load port 12 is located adjacent to the housing 10. A wafer is, for example, a semiconductor wafer and is an example of a substrate.

[0022] The substrate processing apparatus 1 comprises a polishing unit 2 and a cleaning unit 4 located inside the housing 10. The polishing unit 2 comprises a plurality (four in this embodiment) of polishing modules 14a to 14d. The cleaning unit 4 comprises a first cleaning module 16 and a second cleaning module 18 for cleaning the polished substrate, and a drying module 20 for drying the cleaned substrate.

[0023] Polishing modules 14a to 14d are arranged along the longitudinal direction of the substrate processing apparatus 1. Similarly, the first cleaning module 16, the second cleaning module 18, and the drying module 20 are arranged along the longitudinal direction of the substrate processing apparatus 1.

[0024] In this specification, the polishing modules 14a to 14d, the first cleaning module 16, and the second cleaning module 18 are collectively referred to as substrate processing modules for processing substrates.

[0025] The substrate processing apparatus 1 comprises a first transport robot 22 positioned adjacent to the load port 12 and a transport module 24 positioned adjacent to the polishing modules 14a to 14d. The first transport robot 22 receives substrates before polishing from the load port 12 and transfers them to the transport module 24, and also receives dried substrates from the drying module 20 and returns them to the load port 12. The transport module 24 transports the substrates received from the first transport robot 22 and transfers substrates between each of the polishing modules 14a to 14d.

[0026] The substrate processing apparatus 1 includes a second transfer robot 26 positioned between the first cleaning module 16 and the second cleaning module 18, and a third transfer robot 28 positioned between the second cleaning module 18 and the drying module 20. The second transfer robot 26 transfers substrates between the transfer module 24 and each cleaning module 16, 18. The third transfer robot 28 transfers substrates between each module 18, 20.

[0027] The substrate processing apparatus 1 includes a control device 30 located inside the housing 10. The control device 30 is configured to control the movement of each component of the substrate processing module.

[0028] Figure 2 shows a polishing module. In the embodiments shown below, polishing modules 14a to 14d are sometimes collectively referred to as polishing module 14. Polishing module 14 includes a polishing table 80 that supports a polishing pad 84 having a polishing surface 84a, a polishing head (top ring) 81 that holds a wafer W and presses it against the polishing surface 84a, and a slurry supply nozzle 82A that supplies slurry (polishing liquid) to the polishing surface 84a.

[0029] The polishing module 14 includes a pure water supply nozzle 82B for supplying pure water to the polishing surface 84a, a chemical solution supply nozzle 82C for supplying a chemical solution to the polishing surface 84a, and a pure water supply nozzle 85 for supplying pure water to remove slurry adhering to the polishing surface 84a. The pure water supply nozzle 85 is, in other words, an atomizer. Therefore, the pure water supply nozzle 85 may be referred to as the atomizer 85 below.

[0030] In the embodiment shown in Figure 2, the polishing module 14 is equipped with a plurality of supply nozzles 82A, 82B, and 82C. However, in one embodiment, the polishing module 14 may be equipped with a single supply nozzle that selectively supplies one of the following liquids: slurry, pure water, or chemical solution, instead of the plurality of supply nozzles 82A, 82B, and 82C.

[0031] The polishing module 14 includes a dressing device 110 for dressing the polishing pad 84. The dressing device 110 includes a dresser 115 that slides against the polishing surface 84a of the polishing pad 84, a shaft 113 connected to the dresser 115, a dresser arm 111 that supports the dresser 115 via the shaft 113, and a dresser pivot shaft 112 that rotates the dresser arm 111. The dresser pivot shaft 112 is located on the outside of the polishing pad 84.

[0032] As the dresser arm 111 rotates, the dresser 115 oscillates over the polishing surface 84a. The lower surface of the dresser 115 forms a dressing surface consisting of numerous abrasive particles, such as diamond particles.

[0033] The polishing module 14 is equipped with an air bearing cylinder 163 mounted on the dressing device 110. The air bearing cylinder 163 (more specifically, the piston rod 165) is connected to the shaft 113 via a free joint structure 200, which will be described later.

[0034] The dresser 115 (and shaft 113) is configured to move vertically by an air bearing cylinder 163. The air bearing cylinder 163 is configured to adjust the distance between the dresser 115 and the polishing pad 84 by its drive.

[0035] The dressing device 110 having this configuration operates the dresser 115 so that it rotates while oscillating on the polishing surface 84a, and dresses the polishing surface by slightly scraping off the polishing pad 84 with the dresser 115.

[0036] The polishing table 80 is formed in a disc shape and is configured to rotate around its central axis as the axis of rotation. A polishing pad 84 is attached to the upper surface of the polishing table 80. When the polishing table 80 is rotated by a motor (not shown), the polishing pad 84 rotates together with the polishing table 80.

[0037] The top ring 81 holds the wafer W on its underside by vacuum suction or the like. The top ring 81 is configured to rotate together with the wafer W using power from a motor (not shown).

[0038] The top ring 81 is connected to the shaft 81a. The shaft 81a is connected to the air bearing cylinder 163 (more specifically, the piston rod 165) via a free joint structure 200. The top ring 81 is configured to be movable vertically by the air bearing cylinder 163.

[0039] The air bearing cylinder 163 is configured to adjust the distance between the top ring 81 and the polishing table 80 by its drive. With this configuration, the top ring 81 presses the wafer W it holds against the polishing surface 84a of the polishing pad 84.

[0040] The support arm 81b supporting the top ring 81 is configured to swing using a motor (not shown), which moves the top ring 81 in a direction parallel to the polishing surface 84a. In this embodiment, the top ring 81 is configured to move between a wafer W receiving position (not shown) and an upper position of the polishing pad 84, thereby changing the position in which the wafer W is pressed against the polishing pad 84.

[0041] The slurry supply nozzle 82A is located above the polishing table 80 and supplies slurry onto the polishing pad 84. The slurry supply nozzle 82A is supported by a shaft 83A. The shaft 83A is configured to be movable by a motor (not shown). Thus, the slurry supply nozzle 82A can change the slurry dropping position around the shaft 83A during the polishing process of the wafer W. In this way, the slurry supply nozzle 82A supplies slurry so as to penetrate the contact interface between the rotating wafer W and the polishing pad 84.

[0042] A pure water supply nozzle 82B is located above the polishing table 80 and supplies pure water onto the polishing pad 84. The pure water supply nozzle 82B is supported by a shaft 83B. Similarly, a chemical supply nozzle 82C is located above the polishing table 80 and supplies chemical onto the polishing pad 84. The chemical supply nozzle 82C is supported by a shaft 83C. Each of these shafts 83B and 83C is configured to be movable by a motor (not shown).

[0043] The atomizer 85 is located above the polishing table 80 and extends radially along the polishing table 80. Immediately after the slurry polishing process of the wafer W, the atomizer 85 sprays a cleaning fluid at a predetermined flow rate toward the polishing pad 84 to wash away some of the slurry adhering to the polishing surface 84a and the wafer W. The cleaning fluid consists of a mixed fluid of liquid (usually pure water) and gas (for example, an inert gas such as nitrogen gas).

[0044] Figure 3 shows a cleaning module equipped with a buffing cleaning member. As shown in Figure 3, the cleaning module 16 (or cleaning module 18) includes a buffing cleaning member 150 that cleans the wafer W while in contact with the surface of the wafer W, and a rotary table 140 that supports the wafer W.

[0045] The buffing cleaning member 150 includes a buffing pad 151 for buffing the wafer W, and a buffing head 152 for holding the buffing pad 151. The buffing head 152 is connected to a shaft 153.

[0046] The shaft 153 is connected to the air bearing cylinder 163 (more specifically, the piston rod 165) via a free joint structure 200. The buffing member 150 is configured to be movable vertically by the air bearing cylinder 163.

[0047] The air bearing cylinder 163 is configured to adjust the distance between the buffing cleaning member 150 and the wafer W supported by the rotary table 140 by its drive. The buffing head 152 is configured to rotate the buffing pad 151 and bring the buffing pad 151 into contact with the wafer W.

[0048] In the embodiment shown in Figure 3, the cleaning module 16 (or cleaning module 18) includes a pure water supply nozzle 160A for supplying pure water to the surface of the wafer W, and a chemical solution supply nozzle 160B for supplying a chemical solution to the surface of the wafer W.

[0049] The buff arm 154, which supports the buff cleaning member 150, is configured to oscillate the buff cleaning member 150. As the rotary table 140 rotates the wafer W and the buff arm 154 oscillates the buff head 151, the wafer W is cleaned as a whole.

[0050] Figure 4 shows a cleaning module equipped with a pencil cleaning member. As shown in Figure 4, the cleaning module 18 (or cleaning module 16) includes a substrate holding mechanism 70 that holds and rotates the wafer W, and a cleaning member 71 that contacts the wafer W and scrubs the wafer W.

[0051] The cleaning member 71 is connected to a shaft 72. The shaft 72 is connected to an air bearing cylinder 163 (more specifically, a piston rod 165) via a free joint structure 200. The cleaning member 71 is configured to be movable vertically by the air bearing cylinder 163. The air bearing cylinder 163 is configured, by its drive, to adjust the distance between the cleaning member 71 and the wafer W held by the substrate holding mechanism 70. The air bearing cylinder 163 presses the cleaning member 71 against the surface of the wafer W with a predetermined pressure. The cleaning member 71, pressed against the surface of the wafer W, scrubs the wafer W (scrub cleaning).

[0052] The cleaning module 18 (or cleaning module 16) includes an arm swinging mechanism 79 that swings an arm 73 supporting the cleaning member 71 in the horizontal direction, chemical supply nozzles 75, 76 that supply a processing liquid (in this embodiment, a diluent) toward the front and back surfaces of the wafer W, and pure water supply nozzles 77, 78 that supply pure water toward the front and back surfaces of the wafer W.

[0053] The substrate holding mechanism 70 includes chucks 70a to 70d that hold the peripheral edge of the wafer W, and a motor 70e connected to the chucks 70a to 70d. The chucks 70a to 70d hold the wafer W and rotate the wafer W around its axis by driving the motor 70e.

[0054] The cleaning member 71 is a sponge member that has a pencil shape and rotates around its central axis while contacting the surface of the wafer W to scrub the wafer W. Hereinafter, the cleaning member 71 may be referred to as the pencil cleaning member 71.

[0055] The arm 73 is positioned above the wafer W and is connected to an arm oscillating mechanism 79. The arm oscillating mechanism 79 comprises a pivot axis 79a and a rotation mechanism 79b. One end of the arm 73 is connected to the pivot axis 79a, and the other end of the arm 73 is connected to a pencil cleaning member 71. The direction of the central axis of the pencil cleaning member 71 is perpendicular to the front (or back) surface of the wafer W.

[0056] A rotation mechanism 79b for rotating the arm 73 is connected to the pivot axis 79a. The rotation mechanism 79b is configured to rotate the arm 73 in a plane parallel to the wafer W by rotating the pivot axis 79a.

[0057] As described above, the substrate processing module (i.e., the polishing module 14, the first cleaning module 16, and the second cleaning module 18) is equipped with an air bearing cylinder 163 for operating processing members that process the wafer W or the polishing pad 84. Examples of processing members that process the wafer W include the top ring 81, the buff cleaning member 150, and the pencil cleaning member 71. An example of a processing member that processes the polishing pad 84 is the dresser 115.

[0058] The air bearing cylinder 163 has a configuration in which the piston rod 165 is supported non-contact by compressed gas supplied into the cylinder housing 164. Therefore, unlike a typical air cylinder, the air bearing cylinder 163 can prevent sliding friction between the piston rod 165 and the cylinder housing 164.

[0059] On the other hand, the air bearing cylinder 163 has low radial rigidity. Therefore, if there is a misalignment (i.e., eccentricity, angular misalignment) between the piston rod 165 and the shaft 113 (and / or shafts 81a, 153, 72), the misalignment may cause the piston rod to come into contact with the cylinder housing when it moves.

[0060] Therefore, the substrate processing module is equipped with a free joint structure 200 that can absorb the misalignment between the piston rod and the shaft. The structure of the free joint structure 200 will be described below with reference to the drawings.

[0061] Figure 5 shows a dressing device equipped with a free joint structure. Figure 6 is a perspective view of the free joint structure. Figure 7 is a cross-sectional view of the free joint structure. In the embodiments shown in Figures 5 to 7, a free joint structure 200 connected to the shaft 113 of the dressing device 110 is described, but the free joint structure 200 is not limited to the shaft 113 of the dressing device 110, but may be connected to at least one of the shaft 81a to which the top ring 81 is connected, the shaft 153 to which the buff cleaning member 150 is connected, and the shaft 72 to which the pencil cleaning member 71 is connected (see Figures 2, 3, and 4).

[0062] As shown in Figure 5, the dressing device 110 includes a guide member 160 that guides the shaft 113, a bearing 168 that rotatably supports the shaft 113, a pad height measuring device (e.g., a displacement sensor) 162 attached to the bearing 168, and a load measuring device (e.g., a load cell) 161 that measures the load of the dresser 115 applied to the polishing pad 84.

[0063] The pad height measuring device 162 is configured to measure the distance between the pad height measuring device 162 and the polishing surface 84a of the polishing pad 84. The control device 30 is electrically connected to the pad height measuring device 162 and the load measuring device 161. Therefore, the control device 30 accurately controls the dressing of the polishing pad 84 based on the measurements sent from the pad height measuring device 162 and the load measuring device 161.

[0064] The air bearing cylinder 163 comprises a piston rod 165 connected to a shaft 113 via a free joint structure 200, and a cylinder housing 164 that houses the piston rod 165.

[0065] The combination of the air bearing cylinder 163 and the free joint structure 200 constitutes the push-pull device 300. The control device 30 is electrically connected to the push-pull device 300 and is configured to control the operation of the push-pull device 300.

[0066] The cylinder housing 164 has a partition wall 169 located inside it. The partition wall 169 divides the internal space of the cylinder housing 164 into a first space 164a and a second space 164b.

[0067] As shown in Figure 5, by supplying compressed gas to the first space 164a, the compressed gas generates a pushing force Fc1 against the partition wall 169. By supplying compressed gas to the second space 164b, the compressed gas generates a pulling force Fc2 against the partition wall 169. The piston rod 165 moves forward due to the pushing force Fc1 and backward due to the pulling force Fc2.

[0068] As shown in Figure 7, the cylinder housing 164 has an annular gas containment chamber 167 (more specifically, a first gas containment chamber 167a and a second gas containment chamber 167b) arranged around the piston rod 165. As shown in Figures 6 and 7, by supplying compressed gas to the gas containment chamber 167, the cylinder housing 164 forms a compressed gas layer in the gas containment chamber 167. The compressed gas layer supports the piston rod 165 without contact. Note that in Figure 7, the first space 164a, the second space 164b, and the partition wall 169 shown in Figure 5 are omitted from the illustration.

[0069] As shown in Figure 7, the free joint structure 200 includes a push-pull force generating unit 230 that generates a push-pull force as the piston rod 165 moves, and a target load unit 240 that is connected to the push-pull force generating unit 230 and to which the push-pull force from the push-pull force generating unit 230 is applied.

[0070] The push-pull force generating unit 230 is configured to apply a push force Fc1 to the target load unit 240 by making point contact with the target load unit 240, and to apply a pull force Fc2 to the target load unit 240 by making surface contact with the target load unit 240.

[0071] More specifically, the push-pull force generating unit 230 includes a pressing member 202 connected to the piston rod 165 and a lifting member 203 fixed to the pressing member 202. The target load unit 240 includes a pressing surface 207 positioned opposite the push-pull force generating unit 230 and an opening surface 201 positioned on the opposite side of the pressing surface 207 and having an opening 201a into which the push-pull force generating unit 230 is inserted.

[0072] The pressing member 202 of the push-pull force generating unit 230 has a spherical portion 202a that makes point contact with the pressing plane portion 207, and a rod portion 202b fixed to the spherical portion 202a. The rod portion 202b is fixed to the piston rod 165, and the spherical portion 202a is located at the tip of the rod portion 202b. The piston rod 165 and the rod portion 202b extend in a straight line.

[0073] The lifting member 203 has a cylindrical portion 203b into which the rod portion 202b is inserted, and a flat flange portion 203a extending radially outward from the cylindrical portion 203b. The push-pull force generating portion 230 (more specifically, the rod portion 202b and the cylindrical portion 203b) is inserted into an opening 201a formed in the center of the open flat portion 201. The spherical portion 202a and the flat flange portion 203a are located below the open flat portion 201 and are positioned on opposite sides of each other.

[0074] The spherical portion 202a is positioned opposite the pressing plane portion 207 so as to be able to make point contact with the pressing plane portion 207. The planar flange portion 203a is positioned opposite the opening plane portion 201 so as to be able to make surface contact with the opening plane portion 201.

[0075] In this embodiment, the pressing plane portion 207 is located below the push-pull force generating portion 230. More specifically, the pressing plane portion 207 comprises a contact member 206 positioned opposite the spherical portion 202a, and a support flange 205 that supports the contact member 206.

[0076] The contact member 206 has a contact portion 206a that contacts the spherical portion 202a of the pressing member 202, and a rod portion 206b fixed to the contact portion 206a. The contact portion 206a has a machined surface formed on its surface.

[0077] The rod portion 206b is connected to the shaft 113 and extends in a straight line with the rod portion 202b. The support flange 205 has an opening 205a formed in its center. The rod portion 206b passes through the opening 205a of the support flange 205.

[0078] In this embodiment, the spherical portion 202a is formed on the pressing member 202 and the contact portion 206a is formed on the contact member 206. However, the structure of the free joint structure 200 is not particularly limited as long as the pressing member 202 can be made to make point contact with the contact member 206. In one embodiment, the pressing member 202 may have a contact portion corresponding to the contact portion 206a, and the contact member 206 may have a spherical portion corresponding to the spherical portion 202a.

[0079] The pressing surface portion 207 and the opening surface portion 201 are arranged parallel to each other. The target load portion 240 includes a plurality of spacers 209 positioned between the pressing surface portion 207 and the opening surface portion 201, and fasteners 208 that fasten the pressing surface portion 207 and the opening surface portion 201 together.

[0080] The opening plane portion 201 has a plurality of fastening holes 201b arranged around the opening 201a. The support flange 205 has a plurality of insertion holes 205b arranged around the opening 205a. The spacer 209 has a cylindrical shape through which the fastener 208 passes.

[0081] The fastener 208 is inserted into the insertion hole 205b and the fastening hole 201b through the spacer 209. In this state, by tightening the fastener 208, the fastener 208 fixes the relative position of the pressing surface portion 207 and the opening surface portion 201.

[0082] Figure 8 shows a free joint structure in a state where the push-pull force generating unit is not applying a push-pull force to the target load. Figure 9 shows a free joint structure in a state where the push-pull force generating unit is applying a pulling force to the target load. Figure 10 shows a free joint structure in a state where the push-pull force generating unit is applying a pushing force to the target load. Figure 11 shows the radial and axial gaps of the free joint structure.

[0083] As shown in Figure 11, the free joint structure 200 has axial gaps D1, D2 and a radial gap D3 formed between the push-pull force generating section 230 and the target load section 240. In one embodiment, the size of each of the axial gaps D1 and D2 is 0.1 mm. For example, when the spherical section 202a is in point contact with the contact section 206a (i.e., when the axial gap D1 is zero), the axial gap D2 is 0.2 mm.

[0084] Similarly, when the flat flange portion 203a is in surface contact with the opening flat portion 201 (i.e., when the axial gap D2 is zero), the axial gap D1 is 0.2 mm. In one embodiment, the radial gap D3 is 2.0 mm.

[0085] In one embodiment, from the viewpoint of push-pull control responsiveness and required displacement tolerance, the sizes of the axial gaps D1 and D2 may be set in the range of 0.01 to 0.2 mm, and the radial gap D3 may be set in the range of 0.5 to 2 mm.

[0086] As shown in Figure 8, when no pushing or pulling force is applied to the target load 240 from the pushing or pulling force generating unit 230, the pushing or pulling force generating unit 230 is fixed to the piston rod 165 with axial gaps D1, D2 and a radial gap D3 formed. In other words, the pushing or pulling force generating unit 230 is free from the target load 240.

[0087] As shown in Figure 9, when compressed gas is supplied to the second space 164b to raise the push-pull force generating unit 230, the flat flange portion 203a of the lifting member 203 comes into surface contact with the opening flat portion 201. In this way, the push-pull force generating unit 230 applies a pulling force Fc2 to the target load portion 240. As a result, the push-pull force generating unit 230 separates the dresser 115 from the polishing pad 84 together with the shaft 113 via the target load portion 240.

[0088] As shown in Figure 10, when compressed gas is supplied to the first space 164a and the push-pull force generating unit 230 is lowered, the spherical portion 202a of the pressing member 202 makes point contact with the contact portion 206a of the contact member 206. In this way, the push-pull force generating unit 230 applies a pushing force Fc1 to the target load unit 240. As a result, the push-pull force generating unit 230 brings the dresser 115 closer to the polishing pad 84 together with the shaft 113 via the target load unit 240.

[0089] According to this embodiment, the free joint structure 200 can absorb the displacement between the piston rod 165 and the shaft 113. More specifically, when the push-pull force generating section 230 is in point contact with the target load section 240, the axial gaps D1, D2 and the radial gap D3 allow for displacement (angle deviation) between the piston rod 165 and the shaft 113.

[0090] Therefore, even if there is a misalignment (angle deviation) between the piston rod 165 and the shaft 113, the piston rod 165 can move forward and backward without being affected by the angle deviation. As a result, the free joint structure 200 can prevent the piston rod 165 from sliding against the cylinder housing 164.

[0091] When the push-pull force generating section 230 is in surface contact with the target load section 240, the axial gaps D1, D2 and radial gap D3 allow for displacement (eccentricity) between the piston rod 165 and the shaft 113. Therefore, even if displacement (eccentricity) occurs between the piston rod 165 and the shaft 113, the piston rod 165 can move forward and backward without being affected by the eccentricity. As a result, the free joint structure 200 can prevent the piston rod 165 from sliding against the cylinder housing 164.

[0092] If there is a design error in the flat flange portion 203a that makes surface contact with the target load portion 240, that is, if the flat flange portion 203a is not perfectly flat, the push-pull force generating portion 230 may not be able to reliably absorb the eccentricity. A similar problem may occur in the open flat portion 201 of the target load portion 240 that makes surface contact with the flat flange portion 203a.

[0093] Therefore, it is desirable that the contact area of ​​the flat flange portion 203a with the target load portion 240 be as small as possible. In one embodiment, the outer diameter of the flat flange portion 203a is 1.5 times the diameter of the rod portion 202b.

[0094] Figure 12 shows a free joint structure equipped with shims for adjusting the size of the gap. As shown in Figure 12, the free joint structure 200 may be equipped with shims 220A, 220B, and 220C for adjusting the size of its gap. Depending on the design tolerances and required precision of the push-pull force generating section 230 and the target load section 240, the free joint structure 200 can adjust the size of its gap by arranging at least one of the shims 220A, 220B, and 220C.

[0095] In the embodiment shown in Figure 12, the shim 220A is positioned between the cylindrical portion 203b of the lifting member 203 and the piston rod 165. By positioning the shim 220A, the size of the axial gap D2 between the planar flange portion 203a and the open planar portion 201 of the lifting member 203 can be adjusted.

[0096] The shim 220B is positioned between the spacer 209 and the opening plane portion 201. By positioning the shim 220B, the size of the axial gap D1 between the spherical portion 202a of the pressing member 202 and the contact portion 206a of the contact member 206 can be adjusted.

[0097] The shim 220C is positioned between the flat flange portion 203a and the opening flat portion 201 of the lifting member 203. By positioning the shim 220C, the size of the axial gap D2 between the flat flange portion 203a and the opening flat portion 201 can be adjusted.

[0098] Thus, the free joint structure 200 may include a shim 220A (and / or shim 220C) to adjust the size of the axial gap D2, and may also include a shim 220B to adjust the size of the axial gap D1.

[0099] Figure 13 shows another embodiment of the free joint structure. As shown in Figure 13, the free joint structure 200 may include a push-pull force generating section 230 in which the pressing member 202 and the lifting member 203 described with reference to the above-described embodiment are integrally formed, and a target load section 240 in which the opening plane section 201, the pressing plane section 207, and the spacer 209 are integrally formed.

[0100] In the embodiment shown in Figure 13, the target load section 240 includes a pressing plane section 240a positioned opposite the push-pull force generating section 230, and an open plane section 240c having an opening 240b into which the push-pull force generating section 230 is inserted. The push-pull force generating section 230 includes a spherical section 230a that makes point contact with the pressing plane section 240a, and a flat flange section 230b that makes surface contact with the open plane section 240c.

[0101] According to this embodiment, the free joint structure 200 can have a simple structure and reduce the number of parts. In this embodiment as well, the free joint structure 200 can achieve the same effects as the free joint structure 200 according to the above-described embodiment.

[0102] In the embodiment described above, the substrate processing module (more specifically, the polishing module 14) comprises a push-pull device 300 composed of a combination of an air bearing cylinder 163 and a free joint structure 200, a shaft 113 connected to the push-pull device 300, and a dresser 115 as a processing member connected to the shaft 113 (see, for example, Figure 5).

[0103] In one embodiment, the substrate processing module (more specifically, the polishing module 14) may include a push-pull device 300, a shaft 81a connected to the push-pull device 300, and a top ring (i.e., polishing head) 81 as a processing member connected to the shaft 81a (see Figure 2).

[0104] In one embodiment, the substrate processing module (cleaning modules 16, 18) may include a push-pull device 300, a shaft 153 connected to the push-pull device 300, and a buff cleaning member 150 as a processing member connected to the shaft 153 (see Figure 3).

[0105] In one embodiment, the substrate processing module (cleaning modules 16, 18) may include a push-pull device 300, a shaft 72 connected to the push-pull device 300, and a pencil cleaning member 71 as a processing member connected to the shaft 72 (see Figure 4).

[0106] During the assembly of the push-pull device 300 or when the push-pull device 300 is driven, radial loads (i.e., lateral loads) may act on the piston rod 165. In this case, the piston rod 165 may collide with the cylinder housing 164. If the piston rod 165 collides with the cylinder housing 164, damage may occur to the piston rod 165 and / or the cylinder housing 164.

[0107] Such damage can cause the push-pull device 300 to malfunction, potentially hindering the movement of the piston rod 165. As a result, the circuit board processing module may trigger an alarm or stop the operation of the push-pull device 300.

[0108] Therefore, the push-pull device 300 has a configuration to prevent the piston rod 165 from colliding with the cylinder housing 164. This configuration will be described below with reference to the drawings. In this specification, the piston rod 165 and the lifting member 203 may be collectively referred to as the rod structure 350.

[0109] Figure 14 shows another embodiment of the push-pull device. As shown in Figure 14, the push-pull device 300 comprises a free joint structure 200, an air bearing cylinder 163, and a fixed bracket 400 that receives a radial load acting on a rod structure 350 connected to the air bearing cylinder 163.

[0110] Figure 15 is a plan view of the fixing bracket. The fixing bracket 400 is fixed to the lower surface of the cylinder housing 164 which houses the rod structure 350 (specifically, the piston rod 165). The fixing bracket 400 has a U-shaped notch 400a that extends from its outer surface toward the central portion.

[0111] The notch 400a has a size larger than the diameter of the rod structure 350. Therefore, when the fixing bracket 400 is fixed to the cylinder housing 164, the notch 400a is located around the rod structure 350.

[0112] When assembling the push-pull device 300, it is necessary to connect the piston rod 165 to the pressing member 202 (and the lifting member 203). If a fixing bracket 400 is not provided, a radial load may be applied to the piston rod 165 during the assembly of such a rod structure 350, potentially damaging the piston rod 165 and / or the cylinder housing 164. For example, if the piston rod 165 is inserted into the cylinder housing 164 while tilted during the assembly of the push-pull device 300, the piston rod and / or the cylinder housing may be damaged.

[0113] According to this embodiment, the fixing bracket 400 can withstand the radial load acting on the piston rod 165. In other words, the fixing bracket 400 can guide the piston rod 165 to move parallel to the cylinder housing 164. Thus, the fixing bracket 400 can prevent the piston rod 165 from colliding with the cylinder housing 164. As a result, damage to the piston rod 165 and / or the cylinder housing 164 can be prevented.

[0114] In this way, by providing the fixing bracket 400, the ease of assembly of the push-pull device 300 by the worker can be improved. Furthermore, by forming a notch 400a in the fixing bracket 400, the fixing bracket 400 is fixed to the cylinder housing 164 in a manner that avoids the piston rod 165, in other words, without contacting the piston rod 165.

[0115] With this configuration, it is not necessary to fix the fixing bracket 400 to the cylinder housing 164 in advance, and the fixing bracket 400 can be fixed to the cylinder housing 164 during the assembly of the rod structure 350.

[0116] Therefore, the worker can perform other assembly tasks first, and after the other assembly tasks are completed, the fixing bracket 400 can be fixed to the cylinder housing 164 during the assembly of the rod structure 350. As a result, the ease of assembly of the push-pull device 300 can be further improved.

[0117] In the embodiment shown in Figure 14, the push-pull device 300 includes a free joint structure 200 having a push-pull force generating section 230 and a target load section 240, and a fixed bracket 400. However, the device does not necessarily have to have a combination of a free joint structure 200 and a fixed bracket 400 having such a configuration.

[0118] In other words, the free joint structure 200 does not necessarily have to include a push-pull force generating section 230 and a target load section 240. The fixed bracket 400 is applicable to all devices for preventing the piston rod 165 from colliding with the cylinder housing 164.

[0119] Figure 16 shows one embodiment of the free joint structure. As shown in Figure 16 (and Figure 14), the free joint structure 200 includes a pressing member 202 connected to a rod structure 350, a contact member 206 positioned opposite the pressing member 202, and a connecting block 405 having a housing recess 405a that accommodates the pressing member 202 and the contact member 206.

[0120] Figure 17 is a plan view of the connecting plate. The free joint structure 200 includes a connecting plate 401 mounted on a connecting block 405. The connecting plate 401, like the fixed bracket 400, functions as a guide member that guides the movement of the piston rod 165. The connecting plate 401 has a notch 401a located around the rod structure 350 (specifically, the lifting member 203). The upper surface of the connecting block 405 is connected to the connecting plate 401 (see Figure 16).

[0121] By forming a notch 401a in the connecting plate 401, the connecting plate 401 can be connected to the connecting block 405 after the assembly of the rod structure 350 is completed. As a result, the ease of assembly of the push-pull device 300 can be improved. Furthermore, because the push-pull device 300 can be assembled in such a simple manner, mechanical errors in each device caused by the assembly work can be minimized.

[0122] The connecting block 405, which has a receiving recess 405a, has a U-shaped cross-section. With this structure, the connecting block 405 can suppress the scattering of wear particles generated by the contact between the pressing member 202 and the contact member 206.

[0123] By connecting the connecting plate 401 to the connecting block 405, the connecting plate 401 closes the receiving recess 405a. By closing the receiving recess 405a, the combination of the connecting block 405 and the connecting plate 401 forms a hollow box shape when viewed from the side.

[0124] As shown in Figure 16, the free joint structure 200 has grease GR placed between the pressing member 202 and the contact member 206. For example, grease GR is a lubricant with high viscosity. Grease GR not only suppresses the scattering of wear particles but can also suppress the radial load generated on the rod structure 350.

[0125] The dresser 115 is configured to oscillate on the polishing surface 84a as the dresser arm 111 rotates (see, for example, Figure 2). At this time, the radial load acting on the dresser 115 acts on the contact member 206. If such a radial load acts on the rod structure 350 through the pressing member 202, the piston rod 165 and / or cylinder housing 164 may be damaged. Therefore, it is desirable that the radial load acting on the contact member 206 is not transmitted to the rod structure 350 as much as possible.

[0126] According to this embodiment, by applying grease GR, the frictional force generated between the pressing member 202 and the contact member 206 can be reduced, and as a result, the transmission of the radial load acting on the contact member 206 to the pressing member 202 can be prevented. With this configuration, damage to the piston rod 165 and / or cylinder housing 164 can be prevented.

[0127] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications of the above embodiments can be made naturally by those skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of Symbols]

[0128] 1. Substrate processing apparatus 2 Polishing section 4. Cleaning section 10 Housing 12 Load Ports 14a~14d Polishing Module 16. First cleaning module 18. Second cleaning module 20 Drying Modules 22. First Transport Robot 24 transport modules 26. Second Transport Robot 28. Third Transport Robot 30 Control device 70 Board holding mechanism 70a~70d Chuck 70e motor 71 Cleaning component 72 shaft 73 Arm 75, 76 Chemical solution supply nozzle 77,78 Pure water supply nozzle 79. Arm swing mechanism 79a Swivel axis 79b Rotation mechanism 80 Polishing Table 81 Polishing head (top ring) 81a shaft 81b Support arm 82A Slurry Supply Nozzle 82B Pure Water Supply Nozzle 82C Chemical supply nozzle 83A Shaft 83B shaft 83C shaft 84 polishing pads 84a Polished surface 85. Pure water supply nozzle (atomizer) 110 Dressing device 111 Dresser Arm 112 Dresser swivel axis 113 Shaft 115 Dresser 140 Rotating Table 150 Buff Cleaning Components 151 Buffing Pad 152 Buffhead 153 Shaft 154 Buff Arm 160 Guide Member 160A Pure Water Supply Nozzle 160B Chemical Dispensing Nozzle 161 Load measuring instrument 162 Pad Height Measuring Instrument 163 Air bearing cylinder 164 Cylinder Housing 164a 1st space 164b 2nd space 165 Piston Rod 167 Gas containment chamber 167a First Gas Containment Chamber 167b Second Gas Containment Chamber 168 Bearings 169 Bulkhead 200 Free joint structure 201 Opening plane part 201a aperture 201b Fastening hole 202 Pressing Member 202a Spherical part 202b Rod section 203 Lifting Member 203a Flat flange section 203b Cylinder part 205 Support flange 205a aperture 205b Insertion hole 206 Contact Member 206a Contact part 206b Road section 207 Pressing flat section 208 Fasteners 209 Spacer 220A, 220B, 220C shims 230 Push-pull force generating section 230a Spherical part 230b Flat flange section 240 Target load section 240a Pressing flat section 240b aperture 240c Opening plane part 300 Push-pull device 350 Rod Structure 400 Fixed Bracket 400a notch 401 Connecting Plate 401a Notch 405 Connecting Block 405a Recessed recess GR Grease Fc1 Pushing force Fc2 pulling force

Claims

1. A push-pull device, Free joint structure, An air bearing cylinder connected to the aforementioned free joint structure, A push-pull device comprising a fixed bracket that receives a radial load acting on a rod structure connected to the air bearing cylinder.

2. The push-pull device according to claim 1, wherein the fixing bracket has a notch located around the rod structure.

3. The push-pull device according to claim 1, wherein the fixing bracket is fixed to a cylinder housing that accommodates the rod structure.

4. The aforementioned free joint structure is A pressing member connected to the rod structure, A contact member positioned opposite the pressing member, The push-pull device according to claim 1, further comprising a connecting block having a receiving recess for accommodating the pressing member and the contact member.

5. The free joint structure includes a connecting plate attached to the connecting block, The push-pull device according to claim 4, wherein the connecting plate closes the receiving recess.

6. The push-pull device according to claim 5, wherein the connecting plate has a notch located around the rod structure.

7. The aforementioned free joint structure is A push-pull force generating unit that generates push-pull force, It comprises a target load section connected to the push-pull force generating section and to which a push-pull force is applied from the push-pull force generating section, The push-pull force generating unit is configured to apply a pushing force to the target load by making point contact with the target load, and to apply a pulling force to the target load by making surface contact with the target load, as described in claim 1.

8. The push-pull device according to claim 7, wherein the free joint structure has an axial gap and a radial gap formed between the push-pull force generating part and the target load part.

9. The push-pull device according to claim 8, wherein the free joint structure is provided with a shim for adjusting the size of the axial gap.

10. The aforementioned load unit is A pressing surface portion is positioned opposite the push-pull force generating portion, It comprises an opening-shaped flat portion located on the opposite side of the pressing-shaped flat portion and having an opening into which the pushing-pull force generating portion is inserted, The aforementioned push-pull force generating unit is A spherical portion that makes point contact with the pressing plane portion, The push-pull device according to claim 7, further comprising a flat flange portion that makes surface contact with the opening plane portion.

11. The push-pull device according to claim 10, wherein the spherical portion and the planar flange portion are arranged on opposite sides of each other.

12. The spherical portion is positioned opposite the pressing plane portion, The push-pull device according to claim 10, wherein the planar flange portion is arranged opposite to the opening planar portion.

13. The push-pull device according to claim 10, wherein the target load portion includes a spacer disposed between the pressing plane portion and the opening plane portion.

14. A substrate processing module, A push-pull device according to any one of claims 1 to 13, A shaft connected to the aforementioned push-pull device, A substrate processing module comprising a processing member connected to the shaft and for processing a substrate or polishing pad.

15. The substrate processing module according to claim 14, wherein the processing member corresponds to at least one of a polishing head for polishing the substrate and a dresser for dressing the polishing pad.

16. The substrate processing module according to claim 14, wherein the processing member corresponds to at least one of a buff cleaning member and a pencil cleaning member for cleaning the substrate.

Citation Information

Patent Citations

  • Floating joint and ultrasonic vibration bonding equipment

    JP7023592B1