Substrate processing apparatus, processing liquid supply apparatus, substrate processing method, and processing liquid supply method

Abstract

This reduces the likelihood of the processing liquid supply device and multiple chambers stopping at unintended times. [Solution] The substrate processing apparatus 1 includes a plurality of chambers 4, a processing liquid supply device 2, and a control unit 9. The processing liquid supply device 2 includes a first temperature adjustment unit 12 and a second temperature adjustment unit 13 that adjust the temperature of the processing liquid supplied to the plurality of chambers 4, and fault detectors 12s and 13s that detect failures of these units. The control unit 9 sets a first number as the number of chambers 4 to which processing liquid can be simultaneously supplied from the processing liquid supply device 2 when the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are not malfunctioning. When only one of the first temperature adjustment unit 12 and the second temperature adjustment unit 13 is malfunctioning, the control unit 9 sets a second number, which is smaller than the first number, as the number of chambers 4 to which processing liquid can be simultaneously supplied from the processing liquid supply device 2.

Description

[[Technical Field]]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for processing a plurality of substrates using a processing liquid. The present invention also relates to a processing liquid supply apparatus and a processing liquid supply method for supplying a processing liquid to a plurality of chambers. [[Background Art]]

[0002] Substrate processing apparatuses are used to perform various types of processing on substrates such as semiconductor substrates, substrates for FPD (Flat Panel Display) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, or substrates for solar cells, etc.

[0003] As an example of a substrate processing apparatus, Patent Document 1 describes a substrate processing apparatus that processes a substrate using a chemical solution. The substrate processing apparatus includes a plurality of processing units (chambers) and a chemical solution supply apparatus (processing liquid supply apparatus). The processing liquid supply apparatus supplies the chemical solution to the plurality of chambers. In each chamber, processing is performed in which the chemical solution supplied from the processing liquid supply apparatus is supplied to the substrate. [[Prior Art Literature]] [[Patent Literature]]

[0004] [[Patent Document 1]] Japanese Unexamined Patent Publication No. 2021-52038 [[Summary of the Invention]] [[Problem to be Solved by the Invention]]

[0005] In the processing of substrates using chemical solutions, for example, etching of a coating formed on the surface of the substrate is performed. In this case, the etching rate of the coating changes depending on the temperature of the chemical solution. Therefore, in order to reduce the occurrence of processing defects in the substrate, the temperature of the chemical solution supplied from the processing solution supply device to multiple chambers must be appropriately adjusted according to the required etching amount.

[0006] Therefore, the processing liquid supply system is equipped with a temperature control device in part of the piping that supplies the chemical solution to multiple chambers. However, if the temperature control device of the processing liquid supply system malfunctions, the temperature of the chemical solution cannot be controlled, resulting in the mass production of defective products.

[0007] To prevent such malfunctions, the processing liquid supply device is equipped with a temperature sensor in addition to a temperature control device to detect the temperature of the chemical solution supplied to multiple chambers. Furthermore, the substrate processing device is equipped with an emergency stop function that stops the operation of the processing liquid supply device and all of the multiple chambers if the temperature of the chemical solution detected by the temperature sensor falls outside a predetermined range.

[0008] However, if the entire circuit board processing system stops at an unintended time, the time required to restore the system tends to be longer compared to when the timing of the shutdown is known in advance. This is because it is difficult to perform all the necessary preparations for the restoration work in advance. Therefore, sudden shutdowns of the circuit board processing system significantly reduce the production efficiency of circuit board processing.

[0009] The object of the present invention is to provide a substrate processing apparatus, a processing liquid supply apparatus, a substrate processing method, and a processing liquid supply method that can reduce the likelihood of the processing liquid supply apparatus and multiple chambers stopping at unintended times. [Means for solving the problem]

[0010] A substrate processing apparatus according to one aspect of the present invention comprises a plurality of chambers for processing a plurality of substrates using a processing liquid, a processing liquid supply device for supplying the processing liquid to the plurality of chambers, and a control unit for controlling the plurality of chambers and the processing liquid supply device. The processing liquid supply device includes a first temperature adjustment unit and a second temperature adjustment unit for adjusting the temperature of the processing liquid to be supplied to the plurality of chambers, and a fault determination unit configured to determine whether the first temperature adjustment unit is malfunctioning and whether the second temperature adjustment unit is malfunctioning. The control unit sets a first number, less than or equal to the number of the plurality of chambers, as the number of chambers to which the processing liquid can be simultaneously supplied from the processing liquid supply device, when the fault determination unit determines that both the first and second temperature adjustment units are not malfunctioning. The control unit sets a second number, smaller than the first number, as the number of chambers to which the processing liquid can be simultaneously supplied from the processing liquid supply device, when the fault determination unit determines that one of the first and second temperature adjustment units is malfunctioning and the other of the first and second temperature adjustment units is not malfunctioning.

[0011] A processing liquid supply device according to another aspect of the present invention is a processing liquid supply device that supplies processing liquid to a plurality of chambers, each performing processing using processing liquid on a plurality of substrates, and comprises: a first temperature adjustment unit and a second temperature adjustment unit for adjusting the temperature of the processing liquid to be supplied to the plurality of chambers; a fault determination unit configured to determine whether the first temperature adjustment unit is malfunctioning and whether the second temperature adjustment unit is malfunctioning; a control unit that outputs a command signal to set a first number, which is less than or equal to the number of the plurality of chambers, as the number of chambers that can operate simultaneously, when the fault determination unit determines that both the first temperature adjustment unit and the second temperature adjustment unit are not malfunctioning; and a control unit that outputs a command signal to set a second number, which is smaller than the first number, as the number of chambers that can be supplied simultaneously, when the fault determination unit determines that one of the first temperature adjustment unit and the second temperature adjustment unit is malfunctioning and the other of the first temperature adjustment unit and the second temperature adjustment unit is not malfunctioning.

[0012] A substrate processing method according to yet another aspect of the present invention includes supplying a processing liquid to a plurality of chambers, each of which processes a plurality of substrates using the processing liquid, and controlling the plurality of chambers, wherein supplying the processing liquid to the plurality of chambers includes adjusting the temperature of the processing liquid to be supplied to the plurality of chambers using a first temperature adjustment unit and a second temperature adjustment unit, determining whether the first temperature adjustment unit is malfunctioning, and determining whether the second temperature adjustment unit is malfunctioning, wherein controlling the plurality of chambers includes setting a first number, which is less than or equal to the number of the plurality of chambers, as the number of chambers to which the processing liquid can be supplied simultaneously, when it is determined that both the first temperature adjustment unit and the second temperature adjustment unit are not malfunctioning, and setting a second number, which is smaller than the first number, as the number of chambers to which the processing liquid can be supplied simultaneously, when it is determined that one of the first temperature adjustment unit and the second temperature adjustment unit is malfunctioning and the other of the first temperature adjustment unit and the second temperature adjustment unit is not malfunctioning.

[0013] A processing liquid supply method according to yet another aspect of the present invention is a processing liquid supply method for supplying processing liquid to a plurality of chambers that each perform processing using processing liquid on a plurality of substrates, and includes: adjusting the temperature of the processing liquid to be supplied to the plurality of chambers using a first temperature adjustment unit and a second temperature adjustment unit; determining whether the first temperature adjustment unit is malfunctioning; determining whether the second temperature adjustment unit is malfunctioning; outputting a command signal to set a first number less than or equal to the number of the plurality of chambers as the number of chambers that can operate simultaneously if it is determined that both the first temperature adjustment unit and the second temperature adjustment unit are not malfunctioning; and outputting a command signal to set a second number smaller than the first number as the number of chambers that can operate simultaneously if it is determined that one of the first temperature adjustment unit and the second temperature adjustment unit is malfunctioning and the other of the first temperature adjustment unit and the second temperature adjustment unit is not malfunctioning. [Effects of the Invention]

[0014] According to the present invention, it is possible to reduce the occurrence of the processing liquid supply device and multiple chambers stopping at unintended times. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic diagram of the substrate processing apparatus according to the first embodiment. [Figure 2] Figure 1 is a block diagram showing the configuration of the control system for the substrate processing apparatus. [Figure 3] This flowchart shows an example of a liquid supply process performed in a substrate processing apparatus according to the first embodiment. [Figure 4] This is a schematic diagram of the substrate processing apparatus according to the second embodiment. [Figure 5] Figure 4 is a block diagram showing the configuration of the control system for the substrate processing device. [Figure 6] This flowchart shows an example of a liquid supply process performed in a substrate processing apparatus according to the second embodiment. [Figure 7] It is a schematic configuration diagram of a substrate processing apparatus according to a third embodiment. [Figure 8] It is a block diagram showing the configuration of a control system of the substrate processing apparatus of Fig. 7. [Figure 9] It is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus according to the third embodiment. [Figure 10] It is a schematic configuration diagram of a substrate processing apparatus according to a fourth embodiment. [Figure 11] It is a block diagram showing the configuration of a control system of the substrate processing apparatus of Fig. 10. [Figure 12] It is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus according to the fourth embodiment. [Figure 13] It is a schematic configuration diagram of a substrate processing apparatus according to a fifth embodiment. [Figure 14] It is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus according to the fifth embodiment. [Figure 15] It is a flowchart showing an example of a liquid supply process performed in a substrate processing apparatus according to a sixth embodiment. [Figure 16] It is a schematic configuration diagram of a substrate processing apparatus according to a seventh embodiment. [Figure 17] It is a block diagram showing the configuration of a control system of the substrate processing apparatus of Fig. 16. [Figure 18] It is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus according to the seventh embodiment. [Figure 19] It is a schematic configuration diagram of a substrate processing apparatus according to an eighth embodiment. [Figure 20] It is a block diagram showing the configuration of a control system of the substrate processing apparatus of Fig. 19. [Figure 21] It is a flowchart showing an example of a liquid supply process performed in a processing liquid supply apparatus according to the eighth embodiment. DESCRIPTION OF EMBODIMENTS

[0016] Hereinafter, a substrate processing apparatus, a processing liquid supply apparatus, a substrate processing method, and a processing liquid supply method according to one embodiment of the present invention will be described with reference to the drawings. In the following description, "substrate" refers to a substrate for a flat panel display (FPD) used in liquid crystal display devices or organic electroluminescence (EL) display devices, a semiconductor substrate, a substrate for an optical disc, a substrate for a magnetic disc, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell.

[0017] The substrate processing apparatus described below basically processes multiple substrates using a processing solution within a predetermined temperature range. In the following description, the ideal temperature of the processing solution supplied to the substrate W is referred to as the target temperature, and the predetermined temperature range of the processing solution that includes the target temperature and should be adjusted to process the substrate W is referred to as the processing tolerance range.

[0018] 1. First Embodiment <1> Configuration of a substrate processing apparatus Figure 1 is a schematic diagram of a substrate processing apparatus according to the first embodiment. The substrate processing apparatus 1 includes a processing liquid supply device 2, a substrate processing unit 3, a control unit 9, a display unit 81, and an operation unit 82. In this embodiment, the processing liquid used for processing the substrate W is a chemical solution for etching a film such as a silicon oxide film, a silicon nitride film, or a titanium nitride film formed on the substrate W.

[0019] The chemicals used include hydrofluoric acid (HF), buffered hydrofluoric acid (BHF), dilute hydrofluoric acid (DHF), a mixture of sulfuric acid and hydrogen peroxide (SPM), a mixture of ammonia water and hydrogen peroxide (SC1), a mixture of hydrochloric acid and hydrogen peroxide (SC2), and diluted ammonium hydroxide (dNH4OH) or tetramethylammonium hydroxide (TMAH). The target temperature and permissible processing range of the treatment solution are determined according to the type of chemical used and the treatment content of the substrate W.

[0020] The processing liquid supply device 2 stores a certain amount of processing liquid in the storage tank 10 (described later) and supplies the temperature-adjusted processing liquid to the substrate processing unit 3 while adjusting its temperature to within the acceptable processing range. Details of the configuration of the processing liquid supply device 2 will be described later.

[0021] The substrate processing unit 3 includes a plurality (for example, 12) chambers 4. Each chamber 4 is provided with a spin chuck 4a, a nozzle 4b, and a cup 4c. The spin chuck 4a is configured to hold the substrate W to be processed. The spin chuck 4a is also rotationally driven by a drive device (e.g., an electric motor) (not shown) while holding the substrate W. As a result, the substrate W held in the spin chuck 4a rotates.

[0022] The nozzle 4b discharges a portion of the processing liquid supplied from the processing liquid supply device 2 to the substrate processing unit 3 onto the substrate W, which is held and rotated by the spin chuck 4a. This processes the surface (top surface in this example) of the substrate W. The cup 4c is provided so as to surround the substrate W held by the spin chuck 4a and catches the processing liquid that splashes from the substrate W during processing. The processing liquid caught by the cup 4c is sent to a drainage facility provided outside the substrate processing unit 1, for example. At least a portion of the processing liquid caught by the cup 4c may be returned to the processing liquid supply device 2.

[0023] The control unit 9 controls the operation of each part of the processing liquid supply device 2 and the substrate processing unit 3. Details of the control unit 9 will be described later. The display unit 81 is composed of, for example, a liquid crystal display device or an organic EL display device. Examples of information displayed on the display unit 81 will be described later. The operation unit 82 includes, for example, a keyboard and a pointing device and is configured to be operable by the user. The user can input various types of information to the substrate processing device 1 by operating the operation unit 82.

[0024] <2> Configuration and basic operation of the processing liquid supply device 2 As shown in Figure 1, the processing liquid supply device 2 includes a liquid replenishment device 5, a storage tank 10, a pump 11, a first temperature control unit 12, a second temperature control unit 13, a temperature sensor 14, replenishment piping p11, supply piping p12, and circulation piping p13.

[0025] The substrate processing apparatus 1 according to this embodiment is installed, for example, in a factory. The factory is equipped with a power source for the processing liquid used to process the substrate W, which is used as a power supply for the substrate processing apparatus 1.

[0026] The liquid replenishment device 5 includes fluid-related equipment such as piping, fittings, and valves, and is connected to a source of processed liquid (not shown). The liquid replenishment device 5 may also include a pump as part of the fluid-related equipment. The upstream end of the replenishment pipe p11 is further connected to the liquid replenishment device 5. The downstream end of the replenishment pipe p11 is located inside the storage tank 10. The liquid replenishment device 5 is configured to supply (replenish) processed liquid (new processed liquid) from a source (not shown) to the storage tank 10 through the replenishment pipe p11.

[0027] The storage tank 10 is configured to store a fixed amount of processed liquid. A liquid level sensor LS is attached to the storage tank 10. The liquid level sensor LS detects the liquid level (liquid height) of the processed liquid stored in the storage tank 10. The liquid level sensor LS also outputs a liquid level signal indicating the detected liquid level to the control unit 9. For example, a capacitive liquid level sensor, an optical liquid level sensor, or an ultrasonic liquid level sensor can be used as the liquid level sensor LS.

[0028] The upstream end of the supply pipe p12 is connected to the bottom of the storage tank 10. The supply pipe p12 is equipped with a pump 11, a first temperature control unit 12, a second temperature control unit 13, and a temperature sensor 14 in that order from upstream to downstream.

[0029] Pump 11 draws the processed liquid stored in the storage tank 10 and pumps the drawn-in processed liquid towards the downstream end of the supply pipe p12. The first temperature control unit 12 is configured to adjust the temperature of the processed liquid flowing through the supply pipe p12 to approach the target temperature. Therefore, if the target temperature is higher than the temperature inside the factory or the temperature of the processed liquid being replenished in the storage tank 10, the first temperature control unit 12 includes a heating device such as a heater. On the other hand, if the target temperature is lower than the temperature inside the factory or the temperature of the processed liquid being replenished in the storage tank 10, the first temperature control unit 12 includes a cooling device such as a cooling fan.

[0030] In addition to the above example, the first temperature control unit 12 may be configured to heat and cool the processing solution by including a Peltier element or a heat exchanger. The larger the adjustable range of the processing solution temperature, the greater the degree of freedom in processing the substrate W. For example, it becomes possible to adjust the etching amount over a wide range. The second temperature control unit 13 has the same configuration as the first temperature control unit 12 and operates in the same manner as the first temperature control unit 12.

[0031] Each of the first temperature control unit 12 and the second temperature control unit 13 is equipped with a fault detector 12s, 13s for detecting a failure in the temperature control unit. Each fault detector 12s, 13s detects a failure in the corresponding temperature control unit when the electrical continuity in that unit is interrupted. Alternatively, each fault detector 12s, 13s may include, for example, a temperature sensor, and detect a failure in the corresponding temperature control unit when its temperature deviates from the temperature during normal operation. Furthermore, each fault detector 12s, 13s outputs a fault signal to the control unit 9 indicating that the temperature control unit has failed when the corresponding temperature control unit fails.

[0032] The temperature sensor 14 detects the temperature of the processing liquid flowing downstream of the first temperature adjustment unit 12 and the second temperature adjustment unit 13 in the supply piping p12. The temperature sensor 14 also outputs a temperature signal indicating the detected temperature of the processing liquid to the control unit 9.

[0033] The upstream end of the circulation pipe p13 is connected to the downstream end of the supply pipe p12. The downstream end of the circulation pipe p13 is located inside the storage tank 10. Multiple chamber pipes p21 are connected to multiple sections of the circulation pipe p13. Each of the multiple chamber pipes p21 corresponds to one of the multiple chambers 4 of the substrate processing unit 3, and connects multiple sections of the circulation pipe p13 to the nozzles 4b of the multiple chambers 4. Each of the multiple chamber pipes p21 is provided with multiple valves (not shown). By switching the open and closed states of the multiple valves, a portion of the processing liquid flowing through the circulation pipe p13 is selectively directed to the nozzle 4b of one of the multiple chambers 4.

[0034] <3> Processing liquid replenishment function In the processing liquid supply device 2 having the above configuration, most of the processing liquid flowing from the storage tank 10 to the supply pipe p12 is returned to the storage tank 10 through the circulation pipe p13. That is, most of the processing liquid stored in the storage tank 10 circulates through the storage tank 10, the supply pipe p12, and the circulation pipe p13. On the other hand, a portion of the processing liquid flowing from the storage tank 10 to the supply pipe p12 is supplied to the substrate processing unit 3. Therefore, if no new processing liquid is supplied to the storage tank 10 from the liquid replenishment device 5, the liquid level of the processing liquid stored in the storage tank 10 will decrease each time substrate processing is performed in the substrate processing unit 3.

[0035] Therefore, the processing liquid supply device 2 according to this embodiment is provided with a processing liquid replenishment function that appropriately replenishes the processing liquid in the storage tank 10. In this processing liquid replenishment function, processing liquid is replenished from the liquid replenishment device 5 to the storage tank 10 based on the liquid level of the processing liquid detected by the liquid level sensor LS and a plurality of liquid level levels that are set in advance in the storage tank 10.

[0036] The storage tank 10 is configured with multiple liquid level levels, specifically a lower limit level L1 and a specified level L2. The lower limit level L1 corresponds to the minimum amount of processing liquid considered necessary to supply processing liquid to the substrate processing unit 3, and is used to determine whether or not to start replenishing the processing liquid using the liquid replenishment device 5. On the other hand, the specified level L2 is higher than the lower limit level L1, corresponds to an amount of processing liquid considered sufficient to supply processing liquid to the substrate processing unit 3, and corresponds to an amount of processing liquid that is not considered to overflow from the storage tank 10. The specified level L2 is used to determine whether or not to stop replenishing the processing liquid using the liquid replenishment device 5 during the replenishment process.

[0037] An example of replenishing the storage tank 10 with new processing liquid based on the lower limit level L1 and the specified level L2 will be explained. First, assume that the liquid level of the processing liquid stored in the storage tank 10 is higher than the lower limit level L1 and lower than the specified level L2. In this state, assume that no new processing liquid is being supplied to the storage tank 10 from the liquid replenishment device 5.

[0038] Next, as multiple substrates are processed in the substrate processing unit 3, the liquid level of the processing liquid in the storage tank 10 decreases until the liquid level reaches the lower limit level L1. In this case, when the liquid level of the processing liquid reaches the lower limit level L1, the supply of new processing liquid from the liquid replenishment device 5 to the storage tank 10 begins.

[0039] When the supply of new processing fluid is started, the liquid level of the processing fluid gradually rises. As long as the liquid level of the processing fluid is above the lower limit level L1 and below the specified level L2, the supply of processing fluid from the liquid replenishment device 5 to the storage tank 10 continues. After that, the liquid level of the processing fluid is assumed to reach the specified level L2. At this time, the supply of new processing fluid from the liquid replenishment device 5 to the storage tank 10 is stopped.

[0040] Thus, the processing liquid replenishment function of the substrate processing apparatus 1 ensures that the processing liquid is replenished in the storage tank 10 at the appropriate time. This prevents the processing liquid in the storage tank 10 from running out.

[0041] <4> First temperature control function for the processing solution If the temperature of the processing liquid supplied from the processing liquid supply device 2 is outside the acceptable processing range in each chamber 4 of the substrate processing unit 3, the desired processing cannot be performed. This results in a processing defect of the substrate W. If processing defects of the substrate W occur continuously in each chamber 4, a large number of defective products will be produced. As a result, a large amount of processing liquid and a large amount of substrate W will be wasted.

[0042] Therefore, the processing liquid supply device 2 according to this embodiment is provided with a first temperature control function that manages the temperature of the processing liquid flowing downstream of the first temperature adjustment unit 12 and the second temperature adjustment unit 13. In the first temperature control function, the overall operation of the substrate processing device 1 is permitted or restricted based on the temperature of the processing liquid detected by the temperature sensor 14.

[0043] Specifically, the temperature sensor 14 detects the temperature of the processing liquid flowing through the supply pipe p12 at intervals of a small amount of time, and outputs a temperature signal. Based on the temperature signal output from the temperature sensor 14, it is determined whether the current temperature of the processing liquid is within the acceptable processing range. If the current temperature of the processing liquid is within the acceptable processing range, the entire operation of the substrate processing apparatus 1 is permitted. On the other hand, if the current temperature of the processing liquid is outside the acceptable processing range, the entire operation of the substrate processing apparatus 1 is restricted. In other words, the entire substrate processing apparatus 1 is stopped.

[0044] Thus, according to the first temperature control function of the substrate processing apparatus 1, the substrate processing apparatus 3 is not supplied with processing liquid outside the acceptable processing range. As a result, the occurrence of processing defects caused by the temperature of the processing liquid is suppressed in each chamber 4. Therefore, the continuous processing of inappropriate substrates W is prevented. In addition, the wasteful consumption of processing liquid and substrates W is suppressed.

[0045] <5> Second temperature control function for the processing solution In the processing liquid supply device 2, the temperature of the processing liquid circulating through the storage tank 10, supply pipe p12, and circulation pipe p13 is adjusted by the first temperature adjustment unit 12 and the second temperature adjustment unit 13. Therefore, if the first temperature adjustment unit 12 and the second temperature adjustment unit 13 fail, the temperature of the processing liquid flowing through the supply pipe p12 will not be adjusted. Consequently, there is a high possibility that the temperature of the processing liquid will deviate significantly from the acceptable processing range.

[0046] Therefore, the processing liquid supply device 2 according to this embodiment is provided with a second temperature control function in addition to the first temperature control function described above. In the second temperature control function, the overall operation of the substrate processing device 1 is permitted or restricted based on fault signals output from the fault detectors 12s and 13s of the first temperature adjustment unit 12 and the second temperature adjustment unit 13.

[0047] Specifically, it is determined whether or not fault signals are output from the two fault detectors 12s and 13s. If no fault signals are output from the two fault detectors 12s and 13s, or if a fault signal is output from only one of the two fault detectors 12s and 13s, the entire operation of the substrate processing device 1 is permitted. Conversely, if fault signals are output from both fault detectors 12s and 13s, the entire operation of the substrate processing device 1 is restricted. In other words, the entire substrate processing device 1 is stopped.

[0048] Thus, the second temperature control function of the processing solution in the substrate processing apparatus 1 makes it less likely that processing solution outside the acceptable processing range will be supplied to the substrate processing section 3. As a result, the occurrence of processing defects caused by the temperature of the processing solution is suppressed in each chamber 4. Therefore, the continuous processing of inappropriate substrates W is prevented. In addition, the wasteful consumption of processing solution and substrates W is suppressed.

[0049] <6> Exclusive processing function of substrate processing device 1 In the processing liquid supply device 2 according to this embodiment, the flow rate of the processing liquid circulating through the storage tank 10, supply pipe p12, and circulation pipe p13 is kept constant.

[0050] In the substrate processing apparatus 1 shown in Figure 1, the first temperature control unit 12 and the second temperature control unit 13 are arranged in series on a single supply pipe p12. As a result, even if one of the temperature control units, the first temperature control unit 12 or the second temperature control unit 13, fails, the temperature of the processing liquid can be controlled as long as the other temperature control unit is functioning normally. However, if one of the temperature control units fails, the amount of energy that can be supplied to the processing liquid flowing through the supply pipe p12 per unit time changes compared to when both temperature control units are functioning correctly.

[0051] Therefore, when new processing liquid is added to the storage tank 10, depending on the temperature of the new processing liquid, it may become difficult to keep the temperature of the processing liquid flowing downstream of the second temperature control unit 13 within the acceptable processing range. If the temperature of the processing liquid flowing downstream of the second temperature control unit 13 falls outside the acceptable processing range, the entire substrate processing apparatus 1 is shut down by the first temperature control function.

[0052] As described in the summary of the invention, a sudden shutdown of the substrate processing apparatus 1 significantly reduces the production efficiency of substrate processing. Therefore, the substrate processing apparatus 1 according to this embodiment is provided with an exclusive processing function that reduces the flow rate of processing liquid supplied to the substrate processing unit 3 when only one of the first temperature control unit 12 and the second temperature control unit 13 is malfunctioning.

[0053] Here, in the substrate processing apparatus 1, the number of chambers 4 that can simultaneously receive processing liquid from the processing liquid supply device 2 is set as the number of processable chambers. The number of processable chambers can be said to be the number of chambers 4 that can operate simultaneously (parallel processing is possible) in the substrate processing apparatus 3.

[0054] In this example's exclusive processing function, it is determined whether or not fault signals are output from the two fault detectors 12s and 13s. If no fault signals are output from the two fault detectors 12s and 13s, a first number less than or equal to the number of chambers 4 in the substrate processing unit 3 is set as the number of processable chambers. For example, if the number of chambers 4 in the substrate processing unit 3 is 12, the first number may be "12" or "11". In this case, the substrate processing unit 3 can process multiple substrates W with high efficiency using a temperature-controlled processing solution.

[0055] On the other hand, if a fault signal is output from only one of the two fault detectors 12s and 13s, a second number smaller than the first number is set as the number of processing chambers. For example, if the first number is "12", the second number may be "6" or "5". As a result, the flow rate of processing liquid supplied to the substrate processing unit 3 is reduced compared to the case where both temperature control units (12, 13) are functioning correctly. In other words, the amount of processing liquid lost per unit time in the storage tank 10 is reduced. Therefore, even if one of the two temperature control units (12, 13) fails, the operating state of the substrate processing unit 3 can be maintained for at least a certain period of time without causing processing defects in the substrate W. As a result, the likelihood of all of the processing liquid supply device 2 and the multiple chambers 4 stopping at unintended times is reduced.

[0056] The first and second numbers are predetermined according to the flow rate of the processing liquid circulating in the processing liquid supply device 2 and the capacity of the storage tank 10. In other words, the first and second numbers are determined according to the processing liquid supply capacity of the processing liquid supply device 2. Furthermore, the second number is preferably 3 / 4 or less of the first number, and more preferably 1 / 2 or less of the first number.

[0057] <7> Control system for substrate processing equipment The control system of the substrate processing apparatus 1 will be described along with the configuration of the control unit 9 shown in Figure 1. Figure 2 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 shown in Figure 1. As shown in Figure 2, the control unit 9 includes a CPU (Central Processing Unit) 91, RAM (Random Access Memory) 92, ROM (Read-Only Memory) 93, and a storage device 94.

[0058] RAM92 is used as a workspace for the CPU91. ROM93 stores the system program. The storage device94 includes a storage medium such as a hard disk or semiconductor memory and stores a substrate processing program for performing substrate processing in the substrate processing unit3 and a liquid supply program for supplying processing liquid to multiple chambers4 in the processing liquid supply device2.

[0059] Furthermore, the storage device 94 stores processing liquid information and chamber information regarding the chamber to be operated among the multiple chambers 4. The processing liquid information according to this embodiment includes the target temperature, processing tolerance range, lower limit level L1, and specified level L2. The chamber information according to this embodiment includes the number of processable chambers.

[0060] The substrate processing program and the liquid supply program may be provided stored on a recording medium such as a CD-ROM 95 and installed in ROM 93 or storage device 94. Alternatively, the substrate processing program and the liquid supply program may be distributed from a server outside the substrate processing device 1 via a communication network and installed in ROM 93 or storage device 94.

[0061] When the CPU 91 executes the liquid supply program, the required amount of processing liquid is supplied from the processing liquid supply device 2 to the substrate processing unit 3. Furthermore, when the CPU 91 executes the substrate processing program, the operation of each part of the substrate processing unit 3 is controlled, and substrate processing using the processing liquid is performed in multiple chambers 4.

[0062] The operation of the control unit 9 during the execution of the substrate processing program and the liquid supply program will be described below. The control unit 9 receives the liquid level signal output from the liquid level sensor LS. Based on the detection result from the liquid level sensor LS and the processing liquid information, the control unit 9 controls the liquid replenishment device 5.

[0063] Specifically, the control unit 9 operates the liquid replenishment device 5 to replenish the processed liquid in the storage tank 10 when the liquid level of the processed liquid falls to the lower limit level L1. The control unit 9 also operates the liquid replenishment device 5 to stop replenishing the processed liquid when the liquid level of the processed liquid in the storage tank 10 rises to a specified level L2. As a result, in the storage tank 10, the liquid level of the processed liquid rises to the specified level L2 each time the liquid level of the processed liquid falls to the lower limit level L1.

[0064] Furthermore, the control unit 9 controls the operating state of the pump 11. In this embodiment, the control unit 9 controls the pump 11 to operate at a constant output.

[0065] The control unit 9 receives the temperature signal output from the temperature sensor 14. Based on the detection result from the temperature sensor 14 and the processing liquid information, the control unit 9 controls the first temperature adjustment unit 12 and the second temperature adjustment unit 13. Specifically, the control unit 9 provides feedback control to the first temperature adjustment unit 12 and the second temperature adjustment unit 13 so that the detection result from the temperature sensor 14 approaches the target temperature.

[0066] The control unit 9 receives a fault signal output from the fault detector 12s when the first temperature control unit 12 malfunctions. Based on this, the control unit 9 determines that the first temperature control unit 12 is malfunctioning when it receives a fault signal from the fault detector 12s, and determines that the first temperature control unit 12 is not malfunctioning when it does not receive a fault signal from the fault detector 12s.

[0067] The control unit 9 receives a fault signal output from the fault detector 13s when the second temperature control unit 13 malfunctions. Based on this, the control unit 9 determines that the second temperature control unit 13 is malfunctioning when it receives a fault signal from the fault detector 13s, and determines that the second temperature control unit 13 is not malfunctioning when it does not receive a fault signal from the fault detector 13s.

[0068] Furthermore, the control unit 9 sets the number of processing chambers based on the determination results of whether the first temperature control unit 12 and the second temperature control unit 13 are malfunctioning. The control unit 9 also controls the operation of the chambers 4 that are among the number of processing chambers. As a result, the substrate W is processed in the chambers 4 that are among the number of processing chambers. Alternatively, if both the first temperature control unit 12 and the second temperature control unit 13 are malfunctioning, the control unit 9 stops the operation of the multiple chambers 4.

[0069] Furthermore, the control unit 9 controls the operation of the multiple chambers 4 based on the detection results of the temperature sensor 14 and the processing liquid information. As a result, if the temperature of the processing liquid detected by the temperature sensor 14 falls outside the acceptable processing range, the operation of the multiple chambers 4 is stopped.

[0070] Furthermore, when the power supply to the substrate processing apparatus 1 is turned on, the control unit 9 displays a string of characters or an image on the display unit 81 indicating whether or not the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning. This allows the user to easily determine whether or not the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning by looking at the display unit 81.

[0071] Furthermore, the control unit 9 outputs an alarm via the display unit 81 if the temperature of the processing liquid detected by the temperature sensor 14 is outside the acceptable processing range. Also, the control unit 9 outputs an alarm via the display unit 81 if both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning.

[0072] The user can input at least a portion of the above-mentioned processing liquid information and chamber information by operating the control unit 82. When various types of information are input, the control unit 9 stores the input information in the storage device 94.

[0073] <8> Liquid supply treatment Figure 3 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus 1 according to the first embodiment. The liquid supply process described below is performed by the CPU 91 of the control unit 9 executing a liquid supply program stored in the storage device 94 while using the RAM 92 as a work area.

[0074] The liquid supply process is initiated when the power to the substrate processing device 1 is turned on and is repeated at predetermined intervals. When the liquid supply process is initiated, the CPU 91 determines whether the temperature of the temperature-adjusted processing liquid is within the acceptable processing range based on the temperature signal output from the temperature sensor 14 (step S01).

[0075] If the temperature of the processing liquid after temperature adjustment is within the acceptable processing range, the CPU 91 determines whether both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning based on whether or not a malfunction signal is output from the malfunction detectors 12s and 13s (step S02). Specifically, the CPU 91 determines that the first temperature adjustment unit 12 is not malfunctioning if no malfunction signal is output from the malfunction detector 12s. The CPU 91 determines that the first temperature adjustment unit 12 is malfunctioning if a malfunction signal is output from the malfunction detector 12s. The CPU 91 also determines that the second temperature adjustment unit 13 is not malfunctioning if no malfunction signal is output from the malfunction detector 13s. The CPU 91 determines that the second temperature adjustment unit 13 is malfunctioning if a malfunction signal is output from the malfunction detector 13s.

[0076] If both the first temperature control unit 12 and the second temperature control unit 13 are functioning correctly, the CPU 91 determines whether only one of the first temperature control unit 12 or the second temperature control unit 13 is malfunctioning (step S03).

[0077] If neither the first temperature control unit 12 nor the second temperature control unit 13 is malfunctioning, the CPU 91 sets a first number as the number of processable chambers that is less than or equal to the number of chambers 4 in the substrate processing unit 3 (step S13). That is, the CPU 91 stores a first number in the storage device 94 as the number of chambers 4 that can operate simultaneously in the substrate processing unit 3, which is less than or equal to the number of chambers 4 in the substrate processing unit 3. After that, the CPU 91 terminates the liquid supply process.

[0078] In step S03, if only one of the first temperature control unit 12 or the second temperature control unit 13 fails, the CPU 91 sets a second number smaller than the first number as the number of chambers that can be processed (step S04). That is, the CPU 91 stores a second number smaller than the first number in the storage device 94 as the number of chambers 4 that can be operated simultaneously in the board processing unit 3.

[0079] Next, the CPU 91 displays on the display unit 81 that one of the first temperature control unit 12 and the second temperature control unit 13 is malfunctioning (step S05), and terminates the liquid supply process.

[0080] The CPU 91 executes the substrate processing program in parallel with the liquid supply process described above. As a result, processing with the processing liquid is performed on multiple substrates W in the number of chambers 4 set in either step S04 or S13 of the liquid supply process.

[0081] The following describes the cases where the temperature of the processing liquid after temperature adjustment is not within the acceptable processing range in step S01, and where both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning in step S02. In these cases, the CPU 91 outputs an alarm (step S11). Specifically, the CPU 91 displays a string or image on the display unit 81 indicating that the temperature of the processing liquid after temperature adjustment is not within the acceptable processing range. Alternatively, the CPU 91 displays a string or image on the display unit 81 indicating that both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning. Furthermore, the CPU 91 displays a string or image on the display unit 81 indicating that urgent maintenance is required.

[0082] Subsequently, the CPU 91 stops the overall operation of the processing liquid supply device 2 and the substrate processing unit 3 (step S12), and terminates the liquid supply process.

[0083] Of the liquid supply processes described above, steps S01, S11, and S12 correspond to the first temperature control function. Furthermore, steps S02, S11, and S12 correspond to the second temperature control function. Furthermore, steps S03, S04, and S13 correspond to the exclusive processing function. Note that the liquid replenishment function of the liquid supply device 2 operates continuously based on the liquid information (set lower limit level L1 and specified level L2), regardless of the liquid supply processes described above.

[0084] <9> effect In the substrate processing apparatus 1 described above, it is determined whether the first temperature control unit 12 and the second temperature control unit 13 are malfunctioning. If both the first temperature control unit 12 and the second temperature control unit 13 are functioning correctly, a first number is set as the number of processing chambers. Therefore, by appropriately determining this first number, it becomes possible to process multiple substrates W with high efficiency using a temperature-controlled processing solution.

[0085] If either the first temperature control unit 12 or the second temperature control unit 13 fails but the other does not, a second number, smaller than the first number, is set as the number of processing chambers. As a result, the flow rate of processing liquid supplied to the substrate processing unit 3 is reduced compared to when the first number is set. Therefore, the operating state of the substrate processing unit 3 can be maintained for at least a certain period of time without causing processing defects in the substrate W. As a result, the likelihood of all of the processing liquid supply device 2 and the multiple chambers 4 stopping at unintended times due to the first temperature control function is reduced.

[0086] 2. Second Embodiment The differences between the substrate processing apparatus 1 according to the second embodiment and the substrate processing apparatus 1 according to the first embodiment will be explained. Figure 4 is a schematic configuration diagram of the substrate processing apparatus 1 according to the second embodiment. As shown in Figure 4, in the processing liquid supply device 2 according to this embodiment, a bypass pipe p14 is provided in the supply pipe p12. Specifically, the bypass pipe p14 is connected to the supply pipe p12 in such a way that it bypasses a part of the supply pipe p12 and connects two parts of the supply pipe p12.

[0087] In a portion of the supply piping p12, valve v01 and the first temperature control unit 12 are provided in this order from upstream to downstream. In the bypass piping p14, valve v02 and the second temperature control unit 13 are provided in this order from upstream to downstream. As a result, the first temperature control unit 12 and the second temperature control unit 13 are arranged in parallel on the supply piping p12 and the bypass piping p14.

[0088] Valve v01 is, for example, a ball valve, which, when open, allows the flow of the processing fluid in a portion of the supply pipe p12, and when closed, blocks the flow of the processing fluid in a portion of the supply pipe p12. Valve v02 is, for example, a ball valve, which, when open, allows the flow of the processing fluid in the bypass pipe p14, and when closed, blocks the flow of the processing fluid in the bypass pipe p14.

[0089] Figure 5 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in Figure 4. In Figure 5, parts that differ from the control system of Figure 2 according to the first embodiment are shown with thick solid lines. As shown in Figure 5, the control unit 9 controls valves v01 and v02 in addition to the multiple components of the substrate processing apparatus 1 according to the first embodiment.

[0090] Specifically, the control unit 9 opens valve v01 when the first temperature control unit 12 is functioning correctly, and closes valve v01 when the first temperature control unit 12 is functioning incorrectly. As a result, when the first temperature control unit 12 is functioning correctly, the processing liquid flows through a portion of the supply piping p12, and the temperature of the processing liquid is adjusted by the first temperature control unit 12. On the other hand, when the first temperature control unit 12 malfunctions, the flow of the processing liquid through a portion of the supply piping p12 is interrupted.

[0091] Furthermore, the control unit 9 opens valve v02 when the second temperature control unit 13 is functioning correctly, and closes valve v02 when the second temperature control unit 13 is functioning incorrectly. As a result, when the second temperature control unit 13 is functioning correctly, the processing liquid flows through the bypass piping p14, and its temperature is adjusted by the second temperature control unit 13. On the other hand, when the second temperature control unit 13 malfunctions, the flow of the processing liquid through the bypass piping p14 is interrupted.

[0092] As a result, processing liquid whose temperature is not regulated is not supplied to the multiple chambers 4 of the substrate processing unit 3. Therefore, the instability of the temperature of the processing liquid supplied to the substrate processing unit 3 is reduced.

[0093] In the portion of the processing fluid flow path that consists of piping, the increase in pressure loss can be suppressed relatively easily by appropriately selecting the specifications of the piping. On the other hand, in the portion of the processing fluid flow path that consists of the valves v01, v02, the first temperature control unit 12, and the second temperature control unit 13, the selectable specifications (size, etc.) of each of these components (v01, v02, 12, 13) are often limited to some extent. Therefore, it may be difficult to suppress the pressure loss generated in each component (v01, v02, 12, 13) by selecting the specifications of the component. Accordingly, in the processing fluid supply device 2 according to this embodiment, the valves v01, v02, the first temperature control unit 12, and the second temperature control unit 13 are arranged in parallel as described above.

[0094] According to the above configuration, when both the first temperature control unit 12 and the second temperature control unit 13 are functioning correctly, valves v01 and v02 are opened. This reduces the pressure loss in valves v01 and v02, the first temperature control unit 12, and the second temperature control unit 13 during normal operation, compared to when the first temperature control unit 12 and the second temperature control unit 13 are arranged in series. In other words, during normal operation of the first temperature control unit 12 and the second temperature control unit 13, regardless of the specifications of valves v01 and v02, the first temperature control unit 12, and the second temperature control unit 13, the pressure loss in each component (v01, v02, 12, 13) is reduced.

[0095] Figure 6 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus 1 according to the second embodiment. In Figure 6, the parts that differ from the liquid supply process in Figure 3 according to the first embodiment are shown with thick solid lines.

[0096] In the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as steps S01, S02, S03, S04, and S05 in Figure 3, and then controls the two valves v01 and v02 in Figure 4. Specifically, the CPU 91 closes one valve corresponding to the faulty temperature control unit and opens the other valve corresponding to the non-faulty temperature control unit (step S05a), thereby ending the liquid supply process.

[0097] As a result, if the first temperature control unit 12 malfunctions but the second temperature control unit 13 does not malfunction, one valve v01 will be in a closed state and the other valve v02 will be in an open state. Also, if the first temperature control unit 12 does not malfunction but the second temperature control unit 13 malfunctions, one valve v01 will be in an open state and the other valve v02 will be in a closed state.

[0098] Furthermore, in the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as steps S01, S02, S03, and S13 in Figure 3, and then controls the two valves v01 and v02 in Figure 4. Specifically, the CPU 91 opens the two valves v01 and v02 corresponding to the first temperature control unit 12 and the second temperature control unit 13 (step S13a), and terminates the liquid supply process.

[0099] According to the processes in steps S05a and S13a described above, any processing liquid whose temperature has not been adjusted by either the first temperature adjustment unit 12 or the second temperature adjustment unit 13 is not supplied to the substrate processing unit 3. Therefore, the instability of the temperature of the processing liquid supplied from the processing liquid supply device 2 to the substrate processing unit 3 is reduced.

[0100] 3. Third Embodiment The differences between the substrate processing apparatus 1 according to the third embodiment and the substrate processing apparatus 1 according to the first embodiment will be explained. Figure 7 is a schematic configuration diagram of the substrate processing apparatus 1 according to the third embodiment. As shown in Figure 7, the substrate processing apparatus 1 according to this embodiment is equipped with two substrate processing units 3A and 3B instead of the one substrate processing unit 3 in Figure 1.

[0101] The two substrate processing units 3A and 3B have the same configuration as the substrate processing unit 3 in Figure 1. In each of the two substrate processing units 3A and 3B, multiple chambers 4 are stacked. This stacked configuration of multiple chambers is also called a tower. The supply pipe p12 of the processing liquid supply device 2 is connected to circulation pipes p13 and p15 for supplying processing liquid to the substrate processing units 3A and 3B, respectively. Circulation pipe p13 corresponds to the substrate processing unit 3A, and circulation pipe p15 corresponds to the substrate processing unit 3B.

[0102] Specifically, the upstream end of one of the circulation pipes p13 is connected between the temperature sensor 14 and the downstream end of the supply pipe p12. The downstream end of the circulation pipe p13 is located inside the storage tank 10. Multiple chamber pipes p21 are connected to multiple parts of the circulation pipe p13, similar to the example in Figure 1. In this example, the multiple chamber pipes p21 correspond to the multiple chambers 4 of the substrate processing unit 3A.

[0103] A valve v11 is provided between the upstream end of the circulation pipe p13 and the connection point of the multiple chamber pipes p21. The valve v11 is, for example, a ball valve, which allows the flow of the processing liquid in the circulation pipe p13 when it is open and blocks the flow of the processing liquid in the circulation pipe p13 when it is closed.

[0104] The upstream end of the other circulation pipe p15 is connected to the downstream end of the supply pipe p12. The downstream end of the circulation pipe p15 is located inside the storage tank 10. Multiple chamber pipes p22 are connected to multiple sections of the circulation pipe p15. In this example, the multiple chamber pipes p22 correspond to the multiple chambers 4 of the substrate processing unit 3B.

[0105] A valve v12 is provided between the upstream end of the circulation pipe p15 and the connection point of the multiple chamber pipes p22. The valve v12 is, for example, a ball valve, which allows the flow of the processing liquid in the circulation pipe p15 when it is open and blocks the flow of the processing liquid in the circulation pipe p15 when it is closed.

[0106] Figure 8 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in Figure 7. In Figure 8, parts that differ from the control system of Figure 2 according to the first embodiment are shown with thick solid lines. As shown in Figure 8, the control unit 9 controls valves v11 and v12 in addition to the multiple components of the substrate processing apparatus 1 according to the first embodiment.

[0107] Specifically, while the power supply to the substrate processing device 1 is turned on, the control unit 9 opens valves v11 and v12, regardless of whether the first temperature control unit 12 and the second temperature control unit 13 are malfunctioning or not.

[0108] As a result, even if the number of processable chambers fluctuates due to a failure of the first temperature control unit 12 or the second temperature control unit 13, the processing liquid will always flow through each of the circulation pipes p13 and p15. In other words, even if the number of processable chambers is set to be small, and it is not necessary to supply processing liquid to multiple chambers 4 of one of the two substrate processing units 3A and 3B, the processing liquid will always flow through each of the circulation pipes p13 and p15. Therefore, changes in the temperature of the processing liquid in the circulation pipes p13 and p15 due to the stagnation of the processing liquid are suppressed. In addition, the generation of precipitates due to temperature changes of the processing liquid is suppressed. Therefore, a deterioration in the temperature quality of the processing liquid in the supply pipe p12 and the circulation pipes p13 and p15 can be suppressed. In addition, a deterioration in the flow state of the processing liquid in the supply pipe p12 and the circulation pipes p13 and p15 can be suppressed.

[0109] Figure 9 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus 1 according to the third embodiment. In Figure 9, the parts that differ from the liquid supply process in Figure 3 according to the first embodiment are shown with thick solid lines.

[0110] In the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as steps S01, S02, S03, S04, and S05 in Figure 3, and then controls the two valves v11 and v12 in Figure 7. Alternatively, the CPU 91 sequentially performs the same processes as steps S01, S02, S03, and S13 in Figure 3, and then controls the two valves v11 and v12 in Figure 7. Specifically, the CPU 91 opens the multiple valves v11 and v12 provided in multiple circulation pipes p13 and p15 corresponding to multiple (two in this example) substrate processing units (step S05b), and terminates the liquid supply process. In this embodiment, the process in step S05b may be performed before step S01, or between the processes in steps S02 and S03.

[0111] According to the process in step S05b described above, even when the number of processing chambers is set to be small, the processing liquid is always circulating in each of the multiple circulation pipes p13 and p15 corresponding to the multiple substrate processing units 3A and 3B, respectively. Therefore, it is possible to suppress a decrease in the temperature quality and flow state of the processing liquid circulating in the processing liquid supply device 2.

[0112] In this embodiment, the number of processable chambers is set in steps S04 and S13 of Figure 9. The control unit 9 then determines the set number of chambers 4 (the number of processable chambers) from the multiple chambers 4 of the substrate processing units 3A and 3B as the chambers to be operated. In the following description, the chambers simultaneously determined to be operated will be referred to as execution chambers. The control unit 9 then operates one or more of the determined execution chambers to supply processing liquid to each of the multiple substrates W.

[0113] In this case, the control unit 9 may determine a plurality of execution chambers such that each substrate processing unit 3A, 3B includes at least one execution chamber. This reduces the likelihood of large differences in the amount of processing liquid used among the plurality of substrate processing units 3A, 3B. Therefore, significant differences in the flow state of the processing liquid in the circulation piping p13, p15 are suppressed, and large variations in the temperature quality and flow state of the processing liquid circulating in the processing liquid supply device 2 are suppressed.

[0114] 4. Fourth Embodiment The differences between the substrate processing apparatus 1 according to the fourth embodiment and the substrate processing apparatus 1 according to the first embodiment will be explained. Figure 10 is a schematic configuration diagram of the substrate processing apparatus 1 according to the fourth embodiment. As shown in Figure 10, in the processing liquid supply apparatus 2 according to this embodiment, a flow rate adjustment device 15 is provided in the supply pipe p12. Specifically, the flow rate adjustment device 15 is provided between the upstream end of the supply pipe p12 and the pump 11.

[0115] The flow rate adjustment device 15 is, for example, a motor needle valve, and is configured to adjust its opening degree according to the number of drive pulses provided by the control unit 9. Thus, the flow rate adjustment device 15 adjusts the flow rate of the processed liquid flowing from the storage tank 10 to the supply pipe p12 based on the control of the control unit 9. Hereinafter, the flow rate of the processed liquid flowing from the storage tank 10 to the supply pipe p12 (outflow rate per unit time) will be referred to as the tank outflow rate.

[0116] Figure 11 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in Figure 10. In Figure 11, parts that differ from the control system of Figure 2 according to the first embodiment are shown with thick solid lines. As shown in Figure 11, the control unit 9 controls the flow rate adjustment device 15 in addition to the multiple components of the substrate processing apparatus 1 according to the first embodiment.

[0117] Specifically, the control unit 9 controls the flow rate adjustment device 15 so that the tank outflow rate becomes a first flow rate when both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are functioning correctly. On the other hand, if only one of the first temperature adjustment unit 12 or the second temperature adjustment unit 13 is malfunctioning, the control unit 9 controls the flow rate adjustment device 15 so that the tank outflow rate becomes a second flow rate, which is lower than the first flow rate.

[0118] The reason for adjusting the tank outflow rate is explained above. In the treatment liquid supply device 2, the treatment liquid circulates through the storage tank 10, the supply pipe p12, and the circulation pipe p13. When both the first temperature control unit 12 and the second temperature control unit 13 are functioning correctly, the temperature of the circulating treatment liquid is adjusted by both units. However, if either the first temperature control unit 12 or the second temperature control unit 13 fails, the efficiency of temperature adjustment of the treatment liquid flowing through the supply pipe p12 decreases. Therefore, it is highly likely that it will become difficult to maintain the temperature of the treatment liquid circulating in the treatment liquid supply device 2 using only the other temperature control unit.

[0119] Therefore, in this embodiment, the tank outflow rate (second flow rate) when only one temperature control unit (12, 13) is malfunctioning is lower than the tank outflow rate (first flow rate) when both temperature control units (12, 13) are functioning correctly. This reduces the flow rate of the processing liquid circulating within the processing liquid supply device 2, making it easier to maintain the temperature of the processing liquid. It is preferable that the first and second flow rates be set based on experiments or simulations.

[0120] Figure 12 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus 1 according to the fourth embodiment. In Figure 12, the parts that differ from the liquid supply process in Figure 3 according to the first embodiment are shown with thick solid lines.

[0121] In the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as steps S01, S02, S03, S04, and S05 in Figure 3, and then controls the flow rate adjustment device 15 in Figure 10. Specifically, the CPU 91 adjusts the tank outflow rate to a second flow rate lower than the first flow rate (step S05c), and then terminates the liquid supply process.

[0122] Furthermore, in the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as steps S01, S02, S03, and S13 in Figure 3, and then controls the flow rate adjustment device 15 in Figure 10. Specifically, the CPU 91 adjusts the tank outflow rate to a first flow rate that is higher than the second flow rate (step S13c), and then terminates the liquid supply process.

[0123] According to the processes in steps S05c and S13c described above, the flow rate of the processing liquid circulating within the processing liquid supply device 2 is adjusted according to the temperature adjustment capacity of the processing liquid by the first temperature adjustment unit 12 and the second temperature adjustment unit 13. This makes it easier to maintain the temperature of the processing liquid circulating within the processing liquid supply device 2.

[0124] 5. Fifth Embodiment The differences between the substrate processing apparatus 1 according to the fifth embodiment and the substrate processing apparatus 1 according to the first embodiment will now be explained. Figure 13 is a schematic configuration diagram of the substrate processing apparatus 1 according to the fifth embodiment. As shown in Figure 13, the substrate processing apparatus 1 according to this embodiment has the same configuration as the substrate processing apparatus 1 in Figure 1 according to the first embodiment. However, the processing liquid replenishment function provided by the processing liquid supply device 2 according to this embodiment differs from the processing liquid replenishment function of the processing liquid supply device 2 according to the first embodiment.

[0125] The following describes the processing liquid replenishment function according to this embodiment. In the storage tank 10 according to this embodiment, in addition to the lower limit level L1 and the specified level L2, a fault lower limit level L3 is set as one of several liquid level levels for realizing the processing liquid replenishment function. The fault lower limit level L3 is higher than the lower limit level L1 and lower than the specified level L2.

[0126] In this example of the processing liquid replenishment function, the lower limit level L1 is used to determine the start of processing liquid replenishment when both the first temperature control unit 12 and the second temperature control unit 13 are functioning correctly. That is, when the liquid level of the processing liquid in the storage tank 10 drops to the lower limit level L1, the liquid replenishment device 5 operates to replenish the processing liquid. Subsequently, when the liquid level of the processing liquid rises to the specified level L2, the replenishment of the processing liquid stops.

[0127] On the other hand, in the processing fluid replenishment function of this example, if only one of the first temperature control unit 12 and the second temperature control unit 13 fails, the failure lower limit level L3 is used to determine when to start replenishing the processing fluid. That is, when the liquid level of the processing fluid in the storage tank 10 drops to the failure lower limit level L3, the liquid replenishment device 5 operates to replenish the processing fluid. Subsequently, when the liquid level of the processing fluid rises to the specified level L2, the replenishment of the processing fluid stops.

[0128] This explains why two types of liquid level levels (lower limit level L1 and fault lower limit level L3) are selectively used in the processing liquid replenishment function to determine when to start replenishing the processing liquid. As explained in the fourth embodiment, if one of the two temperature control units (12, 13) fails while both are functioning normally, the efficiency of temperature control of the processing liquid flowing through the supply pipe p12 decreases. Therefore, it is highly likely that it will be difficult to maintain the temperature of the processing liquid circulating in the processing liquid supply device 2 using only the other temperature control unit.

[0129] Therefore, in this embodiment, when both temperature control units (12, 13) are functioning correctly, the lower limit level L1 is used as the liquid level level for determining when to start replenishing the processing liquid. Conversely, when only one temperature control unit (12, 13) is malfunctioning, a fault lower limit level L3, which is higher than the lower limit level L1, is used as the liquid level level for determining when to start replenishing the processing liquid.

[0130] By using these liquid level levels appropriately, if only one temperature control unit (12, 13) malfunctions, the amount of processing liquid replenished to the storage tank 10 at one time decreases compared to when both temperature control units (12, 13) are functioning correctly. Therefore, the temperature change of the processing liquid in the storage tank 10 due to replenishment becomes smaller. As a result, the temperature of the processing liquid circulating within the processing liquid supply device 2 is more easily maintained. It is preferable that the lower limit level L1 and the failure lower limit level L3 be set based on experiments or simulations.

[0131] Figure 14 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus 1 according to the fifth embodiment. In Figure 14, parts that differ from the liquid supply process in Figure 3 according to the first embodiment are shown with thick solid lines.

[0132] In the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as steps S01, S02, S03, S04, and S05 in Figure 3, and then sets the liquid level for determining the start of liquid replenishment in the liquid replenishment function. Specifically, the CPU 91 sets a fault lower limit level L3, which is higher than the lower limit level L1, to be used to determine the start of liquid replenishment (step S05d), and then terminates the liquid supply process.

[0133] Furthermore, in the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as in steps S01, S02, S03, and S13 in Figure 3, and then sets the liquid level for determining the start of liquid replenishment in the liquid replenishment function. Specifically, the CPU 91 sets a lower limit level L1, which is lower than the failure lower limit level L3, to be used to determine the start of liquid replenishment (step S13d), and then terminates the liquid supply process.

[0134] According to the processes described in steps S05d and S13d above, the amount of processing liquid replenished to the storage tank 10 at one time is adjusted according to the temperature adjustment capacity of the processing liquid by the first temperature adjustment unit 12 and the second temperature adjustment unit 13. This makes it easier to maintain the temperature of the processing liquid circulating within the processing liquid supply device 2.

[0135] In the liquid supply process according to this embodiment, instead of setting the fault lower limit level L3 to be used to determine the start of replenishment of the processing liquid in step S05d, the following process may be performed. For example, as the process in step S05d, it may be set to continuously replenish the processing liquid from the liquid replenishment device 5 to the storage tank 10 at a predetermined flow rate (continuous replenishment), regardless of the liquid level of the processing liquid. In this case, it is preferable that the flow rate of the processing liquid supplied from the liquid replenishment device 5 to the storage tank 10 is set lower than the flow rate of the processing liquid supplied from the liquid replenishment device 5 to the storage tank 10 by the process in step S05d. By performing these processes, the amount of processing liquid replenished to the storage tank 10 at one time is adjusted, similar to the example above. This makes it easier to maintain the temperature of the processing liquid circulating in the processing liquid supply device 2.

[0136] 6. Sixth Embodiment The differences between the substrate processing apparatus 1 according to the sixth embodiment and the substrate processing apparatus 1 according to the first embodiment will now be explained. The substrate processing apparatus 1 according to this embodiment has the same configuration as the substrate processing apparatus 1 shown in Figure 1 according to the first embodiment. However, the processing liquid replenishment function provided by the processing liquid supply device 2 according to this embodiment differs from the processing liquid replenishment function of the processing liquid supply device 2 according to the first embodiment.

[0137] The following describes the processing liquid replenishment function according to this embodiment. Here, the liquid replenishment device 5 according to this embodiment is configured to adjust the flow rate of the processing liquid when replenishing from the replenishment pipe p11 to the storage tank 10 based on the control of the control unit 9. Therefore, in the processing liquid replenishment function of this example, when both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are not malfunctioning, the flow rate of the processing liquid replenished from the liquid replenishment device 5 to the storage tank 10 is adjusted to the first replenishment flow rate.

[0138] On the other hand, in the processing liquid replenishment function of this example, if only one of the first temperature control unit 12 and the second temperature control unit 13 is malfunctioning, the flow rate of the processing liquid replenished from the liquid replenishment device 5 to the storage tank 10 is adjusted to a second replenishment flow rate that is lower than the first replenishment flow rate.

[0139] This explains why the flow rate of the processed liquid supplied from the liquid replenishment device 5 to the storage tank 10 is adjusted in the processed liquid replenishment function. As explained in the fourth embodiment, if one of the two temperature control units (12, 13) fails while both are functioning normally, the efficiency of temperature control of the processed liquid flowing through the supply pipe p12 decreases. Therefore, it is highly likely that it will become difficult to maintain the temperature of the processed liquid circulating in the processed liquid supply device 2 using only the other temperature control unit.

[0140] Therefore, in this embodiment, when both temperature control units (12, 13) are functioning correctly, the flow rate of the processed liquid supplied from the liquid replenishment device 5 to the storage tank 10 is adjusted to a first replenishment flow rate. Conversely, when only one temperature control unit (12, 13) is malfunctioning, the flow rate of the processed liquid supplied from the liquid replenishment device 5 to the storage tank 10 is adjusted to a second replenishment flow rate, which is lower than the first replenishment flow rate.

[0141] Depending on how the replenishment flow rate is used, if only one temperature control unit (12, 13) malfunctions, the amount of processed liquid replenished to the storage tank per unit time decreases compared to when both temperature control units (12, 13) are functioning correctly. Therefore, the amount of temperature change per unit time of the processed liquid in the storage tank 10 due to the replenishment of the processed liquid becomes smaller. As a result, the temperature of the processed liquid circulating within the processed liquid supply device 2 becomes easier to maintain. It is preferable that the first and second replenishment flow rates be set based on experiments or simulations.

[0142] Figure 15 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus 1 according to the sixth embodiment. In Figure 16, the parts that differ from the liquid supply process in Figure 3 according to the first embodiment are shown by thick solid lines.

[0143] In the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as steps S01, S02, S03, S04, and S05 in Figure 3, and then sets the flow rate of the processing liquid when replenishing the processing liquid in the processing liquid replenishment function. Specifically, the CPU 91 sets the flow rate of the processing liquid when replenishing the processing liquid to the storage tank 10 to a second replenishment flow rate that is lower than the first replenishment flow rate (step S05e), and then terminates the liquid supply process.

[0144] Furthermore, in the liquid supply process according to this embodiment, the CPU 91 sequentially performs the same processes as in steps S01, S02, S03, and S13 in Figure 3, and then sets the flow rate of the processing liquid when replenishing the processing liquid in the processing liquid replenishment function. Specifically, the CPU 91 sets the flow rate of the processing liquid when replenishing the processing liquid to the storage tank 10 to a first replenishment flow rate that is higher than the second replenishment flow rate (step S13e), and then terminates the liquid supply process.

[0145] According to the processes in steps S05e and S13e described above, the amount of processing liquid replenished in the storage tank 10 is adjusted according to the temperature adjustment capacity of the processing liquid by the first temperature adjustment unit 12 and the second temperature adjustment unit 13. This makes it easier to maintain the temperature of the processing liquid circulating within the processing liquid supply device 2.

[0146] In addition, in the liquid supply process according to this embodiment, in step S05e, in addition to setting the flow rate of the processing liquid when replenishing the storage tank 10 to a second replenishment flow rate that is lower than the first replenishment flow rate, the following process may also be performed. For example, as the process in step S05e, in addition to adjusting the flow rate of the processing liquid when replenishing the storage tank 10 to a second replenishment flow rate, it may also be set to continuously replenish the processing liquid from the liquid replenishment device 5 to the storage tank 10 regardless of the liquid level of the processing liquid (continuous replenishment). In this case, the amount of processing liquid replenished to the storage tank 10 at one time is adjusted. This makes it easier to maintain the temperature of the processing liquid circulating in the processing liquid supply device 2.

[0147] 7. Seventh Embodiment The differences between the substrate processing apparatus 1 according to the seventh embodiment and the substrate processing apparatus 1 according to the first embodiment will be explained. Figure 16 is a schematic configuration diagram of the substrate processing apparatus 1 according to the seventh embodiment. As shown in Figure 16, in the processing liquid supply device 2 according to this embodiment, a flow sensor FS1 and a temperature sensor TS1 are provided in the replenishment pipe p11. The flow sensor FS1 detects the flow rate of the processing liquid flowing through the replenishment pipe p11 and outputs a flow signal indicating the detected flow rate to the control unit 9. The temperature sensor TS1 detects the temperature of the processing liquid in the replenishment pipe p11 and outputs a temperature signal indicating the detected temperature of the processing liquid to the control unit 9.

[0148] Furthermore, in the processing liquid supply device 2 of this example, a temperature sensor TS2 is provided in the storage tank 10. The temperature sensor TS2 detects the temperature of the processing liquid stored in the storage tank 10 and outputs a temperature signal indicating the detected temperature of the processing liquid to the control unit 9.

[0149] Furthermore, in the processing liquid supply device 2 of this example, a flow sensor FS2 is provided in the supply pipe p12. The flow sensor FS2 detects the flow rate of the processing liquid flowing through the supply pipe p12 and outputs a flow signal indicating the detected flow rate to the control unit 9.

[0150] Figure 17 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in Figure 16. In Figure 17, parts that differ from the control system of Figure 2 according to the first embodiment are shown with thick solid lines. As shown in Figure 17, the control unit 9 receives temperature signals output from the temperature sensor 14, as well as temperature signals output from the temperature sensors TS1 and TS2 in Figure 16. The control unit 9 also receives flow rate signals output from the flow rate sensors FS1 and FS2 in Figure 16.

[0151] Furthermore, in the control unit 9 according to this embodiment, temperature control unit information is stored in the storage device 94. The temperature control unit information is information indicating the temperature control capabilities of the first temperature control unit 12 and the second temperature control unit 13. Specifically, the temperature control unit information is information indicating the amount of work that each of the first temperature control unit 12 and the second temperature control unit 13 can output per unit time. The temperature control unit information is stored in the storage device 94 in advance by the user operating the operation unit 82 before processing of the multiple substrates W begins.

[0152] Furthermore, in the control unit 9 according to this embodiment, schedule information is stored in the storage device 94. The schedule information indicates the content of the processing to be performed in the multiple chambers 4 and the number of substrates W to be processed. The schedule information is stored in the storage device 94 in advance by the user through operation of the operation unit 82 before the processing of the multiple substrates W begins. The schedule information includes information indicating the amount of processing liquid required in one chamber 4 to process one substrate W. Therefore, the amount of processing liquid to be consumed in the substrate processing unit 3 can be calculated based on the schedule information and the number of processing chambers.

[0153] Furthermore, in the control unit 9 according to this embodiment, a predetermined period is stored in the storage device 94. The predetermined period is stored in the storage device 94 in advance by the user operating the operation unit 82 before processing of the multiple substrates W begins. The predetermined period is used to define the amount of energy that can be consumed, which will be described later.

[0154] In the substrate processing apparatus 1 according to the first embodiment, the number of processing chambers is set to either a first number or a second number depending on the failure status of the first temperature control unit 12 and the second temperature control unit 13. However, if only one of the first temperature control unit 12 or the second temperature control unit 13 fails, the appropriate number of processing chambers is considered to change dynamically depending on the state of the processing liquid circulating in the processing liquid supply device 2 and the state of the processing liquid being replenished in the storage tank 10 by the processing liquid supply device 2.

[0155] Therefore, in this embodiment, if only one of the first temperature control unit 12 or the second temperature control unit 13 is malfunctioning, the appropriate number of usable chambers is calculated sequentially, taking into account the temperature control capabilities of the first temperature control unit 12 and the second temperature control unit 13, the circulation state of the processing liquid in the processing liquid supply device 2, and the replenishment state of the processing liquid. As a result, the set value of the number of usable chambers is updated at predetermined time intervals.

[0156] This section describes how to calculate the appropriate number of processing chambers. In the following explanation, the maximum amount of processing liquid that can be supplied from the processing liquid supply device 2 to the substrate processing unit 3 while maintaining the temperature of the processing liquid supplied to the substrate processing unit 3 within the specified period from the present time will be referred to as the "consumption amount." Also, a state in which only one of the first temperature control unit 12 and the second temperature control unit 13 is malfunctioning will be referred to as a "one-unit failure state" as appropriate.

[0157] In order to calculate the appropriate number of processing chambers, it is necessary to know the amount of processing fluid that can be consumed. The amount of processing fluid that can be consumed can be estimated, for example, based on information from the temperature control unit, the state of the processing fluid circulating in the processing fluid supply device 2, and the state of the processing fluid being replenished in the storage tank 10 by the processing fluid supply device 2.

[0158] Therefore, in this embodiment, in the event of a one-sided failure, multiple physical quantities indicating the state of the circulating processing liquid in the processing liquid supply device 2 are acquired as circulation information. Specifically, the circulation information includes the amount of processing liquid in the storage tank 10 calculated based on the detection result by the liquid level sensor LS and the design dimensions of the storage tank 10. The circulation information also includes the temperature detected by the temperature sensor TS2 (temperature of the processing liquid in the storage tank 10). Furthermore, the circulation information includes the temperature detected by the temperature sensor 14 (temperature of the temperature-adjusted processing liquid flowing through the supply pipe p12). In addition, the circulation information includes the flow rate detected by the flow rate sensor FS2 (flow rate of the processing liquid flowing through the supply pipe p12).

[0159] Furthermore, in this embodiment, in the event of a one-sided failure, multiple physical quantities indicating the state of the processing liquid being replenished in the storage tank 10 by the processing liquid supply device 2 are acquired as replenishment information. Specifically, the replenishment information includes the temperature detected by the temperature sensor TS1 (the temperature of the processing liquid flowing through the replenishment pipe p11). The replenishment information also includes the flow rate detected by the flow rate sensor FS1 (the flow rate of the processing liquid flowing through the replenishment pipe p11).

[0160] Based on the temperature control unit information stored in the memory device 94 and the detection results from multiple sensors (14, FS1, FS2, LS, TS1, TS2), the amount of energy that can be consumed is estimated. Subsequently, based on the estimated amount of energy that can be consumed and the schedule information stored in the memory device 94, the maximum number of chambers 4 that can operate simultaneously is calculated as the appropriate number of processing chambers. For example, the appropriate number of processing chambers can be determined by dividing the estimated amount of energy that can be consumed by the amount of processing solution required to process one substrate W scheduled from the present time onward.

[0161] The length of the specified period may be set to a few seconds (e.g., 2 or 3 seconds) or to a few minutes (e.g., 10 or 30 minutes).

[0162] Figure 18 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus 1 according to the seventh embodiment. In Figure 18, parts that differ from the liquid supply process in Figure 3 according to the first embodiment are shown with thick solid lines.

[0163] As shown in Figure 18, the CPU 91 acquires temperature control unit information, circulation information, and replenishment information (step S21) if only one of the first temperature control unit 12 or the second temperature control unit 13 fails during the same process as in step S03 in Figure 3.

[0164] Specifically, the CPU 91 acquires temperature control unit information stored in the memory device 94. The CPU 91 also acquires circulation information, based on the detection results of multiple sensors (14, FS2, LS, TS2), including the amount of processing liquid in the storage tank 10, the temperature of the processing liquid in the storage tank 10, the temperature of the temperature-controlled processing liquid flowing through the supply pipe p12, and the flow rate of the processing liquid flowing through the supply pipe p12. Furthermore, the CPU 91 acquires replenishment information, based on the detection results of multiple sensors (FS1, TS1), including the temperature of the processing liquid flowing through the replenishment pipe p11 and the flow rate of the processing liquid flowing through the replenishment pipe p11.

[0165] Next, the CPU 91 estimates the amount of processing fluid that can be consumed based on the acquired temperature control unit information, circulation information and replenishment information, the specified period stored in the storage device 94, and the processing fluid information stored in the storage device 94 (step S22).

[0166] Next, the CPU 91 calculates the maximum number of chambers 4 that can operate simultaneously in the board processing unit 3 based on the estimated available energy consumption and the schedule information stored in the storage device 94, and sets the calculated number as the number of chambers that can be processed (step S23).

[0167] Subsequently, the CPU 91 displays on the display unit 81 that one of the first temperature control unit 12 or the second temperature control unit 13 is malfunctioning (step S05), and terminates the liquid supply process.

[0168] According to the process described in steps S21 to S23 above, if only one of the first temperature control unit 12 or the second temperature control unit 13 fails, the amount of energy that can be consumed is estimated based on the temperature control unit information, circulation information, and replenishment information. Based on the estimated amount of energy that can be consumed and the schedule information, an appropriate number of processing chambers is calculated. As a result, the decrease in the processing efficiency of the substrate W is mitigated.

[0169] The liquid supply process according to this embodiment, like the liquid supply process according to the first embodiment, is started when the power to the substrate processing apparatus 1 is turned on and is repeated at predetermined intervals. Here, it is preferable that the time interval of the liquid supply process repeated in this embodiment be set as small as possible (for example, a few seconds). This allows the appropriate number of processing chambers to be determined and updated in near real time when one of the processing liquid supply devices 2 is in a malfunction state.

[0170] 8. Eighth Embodiment The differences between the substrate processing apparatus 1 according to the eighth embodiment and the substrate processing apparatus 1 according to the first embodiment will now be explained. Figure 19 is a schematic configuration diagram of the substrate processing apparatus 1 according to the eighth embodiment. As shown in Figure 19, in the substrate processing apparatus 1 according to this embodiment, the processing liquid supply device 2 includes a display unit 81 and an operation unit 82. Furthermore, the processing liquid supply device 2 is separate from the control unit 9 of the substrate processing apparatus 1 and further includes a processing liquid control unit 21 that controls the operation of each component of the processing liquid supply device 2.

[0171] Figure 20 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 shown in Figure 19. As shown in Figure 20, the processing liquid control unit 21 includes a CPU 901, RAM 902, ROM 903, and storage device 904, similar to the control unit 9.

[0172] RAM 902 is used as a workspace for CPU 901. ROM 903 stores the system program. Storage device 904 includes a storage medium such as a hard disk or semiconductor memory and stores the liquid supply program, processing liquid information, and chamber information.

[0173] The liquid supply program may be provided stored on a recording medium such as a CD-ROM 905 and installed in ROM 903 or storage device 904. Alternatively, the liquid supply program may be distributed from an external server to the substrate processing device 1 via a communication network and installed in ROM 903 or storage device 904. When the CPU 901 of the processing liquid control unit 21 executes the liquid supply program, the required amount of processing liquid is supplied from the processing liquid supply device 2 to the substrate processing unit 3.

[0174] In this embodiment, the storage device 94 of the control unit 9 stores the substrate processing program. The CPU 91 of the control unit 9 executes the substrate processing program, thereby controlling the operation of each part of the substrate processing unit 3, and performing substrate processing using processing liquid in multiple chambers 4.

[0175] In the substrate processing apparatus 1 according to this embodiment, the processing liquid control unit 21 controls the operation of each part of the processing liquid supply device 2. The processing liquid control unit 21 also outputs a command signal to stop the operation of the substrate processing unit 3 when the temperature detected by the temperature sensor 14 is outside the processing tolerance range, as a process corresponding to the first temperature control function. The processing liquid control unit 21 also outputs a command signal to stop the operation of the substrate processing unit 3 when both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning, as a process corresponding to the second temperature control function.

[0176] Furthermore, the processing liquid control unit 21 outputs the number of processing chambers set according to the failure status of the first temperature control unit 12 and the second temperature control unit 13, as a process corresponding to the exclusive processing function.

[0177] The control unit 9 receives various signals output from the processing liquid control unit 21 and performs either stopping the substrate processing unit 3 or mutual exclusion control of multiple chambers 4 based on the number of chambers that can be processed.

[0178] Figure 21 is a flowchart showing an example of liquid supply processing performed in the processing liquid supply device 2 according to the eighth embodiment. The liquid supply processing described below is performed by the CPU 901 of the processing liquid control unit 21 executing a liquid supply program stored in the storage device 904 while using the RAM 902 as a work area.

[0179] The liquid supply process according to this embodiment, like the liquid supply process according to the first embodiment, is started when the power to the substrate processing apparatus 1 is turned on and is repeated every predetermined time. When the liquid supply process is started, the CPU 901 determines whether the temperature of the temperature-adjusted processing liquid is within the processing tolerance range based on the temperature signal output from the temperature sensor 14 (step S51).

[0180] If the temperature of the processing solution after temperature adjustment is within the acceptable processing range, the CPU 901 determines whether both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning based on whether or not a fault signal is output from the fault detectors 12s and 13s (step S52).

[0181] If both the first temperature control unit 12 and the second temperature control unit 13 are functioning correctly, the CPU 901 determines whether only one of the first temperature control unit 12 or the second temperature control unit 13 is malfunctioning (step S53).

[0182] If neither the first temperature control unit 12 nor the second temperature control unit 13 is malfunctioning, the CPU 901 sets a first number as the number of processable chambers that is less than or equal to the number of chambers 4 in the board processing unit 3 (step S64), and outputs the number of processable chambers (step S65). After that, the CPU 901 terminates the liquid supply process.

[0183] In step S53, if only one of the first temperature control unit 12 or the second temperature control unit 13 is malfunctioning, the CPU 901 sets a second number smaller than the first number as the number of processable chambers (step S54) and outputs that number of processable chambers (step S55).

[0184] Next, the CPU 901 displays on the display unit 81 that one of the first temperature control unit 12 or the second temperature control unit 13 is malfunctioning (step S56), and terminates the liquid supply process.

[0185] The following describes the cases where the temperature of the processing liquid after temperature adjustment is not within the acceptable processing range in step S51, and where both the first temperature adjustment unit 12 and the second temperature adjustment unit 13 are malfunctioning in step S52. In these cases, the CPU 901 outputs an alarm (step S61). Subsequently, the CPU 901 outputs a command signal to stop the operation of the board processing unit 3 (step S62). The CPU 901 also stops the operation of the processing liquid supply device 2 (step S63) and terminates the liquid supply process.

[0186] The CPU 91 of the control unit 9 controls each chamber 4 of the substrate processing unit 3 based on the substrate processing program stored in the storage device 94 and various signals output from the CPU 901 of the processing liquid control unit 21. As a result, processing with the processing liquid is performed on each of the multiple substrates W in the number of chambers 4 set in either step S54 or S64 of the liquid supply processing.

[0187] In this embodiment as well, if either the first temperature control unit 12 or the second temperature control unit 13 fails but the other does not, a second number smaller than the first number is set as the number of chambers that can be processed. This reduces the likelihood that the processing liquid supply device 2 and all of the chambers 4 will stop at an unintended time due to the first temperature control function.

[0188] 9. Other Embodiments (a) The processing liquid supply device 2 according to the above embodiment supplies a chemical solution for etching the substrate W to the substrate processing unit 3 as an example of a processing liquid, but the present invention is not limited thereto. The processing liquid may also be a rinsing liquid for washing the upper surface of the substrate W. That is, the processing liquid supply device 2 may be configured to supply a rinsing liquid to the substrate processing unit 3. Alternatively, the processing liquid may also be a replacement liquid for removing chemical solutions remaining on the upper surface of the substrate W. That is, the processing liquid supply device 2 may be configured to supply a replacement liquid to the substrate processing unit 3.

[0189] (b) In the processing liquid supply device 2 according to the above embodiment, each of the replenishment pipe p11, supply pipe p12, circulation pipe p13, bypass pipe p14, circulation pipe p15, and chamber pipes p21, p22 only needs to form a flow path for the processing liquid. Therefore, each of the pipes (p11, p12, p13, p14, p15, p21, p22) according to the above embodiment may consist of multiple pipes and one or more connectors, etc.

[0190] (c) In the substrate processing apparatus 1 according to the above embodiment, the temperature of the processing liquid supplied from the processing liquid supply device 2 to the substrate processing unit 3 is adjusted by the first temperature adjustment unit 12 and the second temperature adjustment unit 13, but the present invention is not limited thereto. In the processing liquid supply device 2, there may be two or more temperature adjustment units for adjusting the temperature of the processing liquid. Therefore, the processing liquid supply device 2 may include three or more temperature adjustment units, including the first temperature adjustment unit 12 and the second temperature adjustment unit 13.

[0191] In this case, the substrate processing apparatus 1 may be configured to stop the processing liquid supply device 2 and the substrate processing unit 3 if all of the multiple temperature control units fail. Alternatively, the substrate processing apparatus 1 may be configured to sequentially reduce the number of processing chambers as the number of failed temperature control units increases.

[0192] (d) The substrate processing apparatus 1 according to the third embodiment comprises two substrate processing units 3A and 3B, but the present invention is not limited thereto. The substrate processing apparatus 1 according to the third embodiment may include three or more substrate processing units, including the two substrate processing units 3A and 3B. In this case, the substrate processing apparatus 1 is provided with a plurality of circulation pipes corresponding to each of the plurality of substrate processing units. In this case, it is preferable that processing liquid flows through the plurality of circulation pipes at all times while the power to the substrate processing apparatus 1 is turned on.

[0193] (e) The substrate processing apparatus 1 according to the first to seventh embodiments includes features that differ from each other. Therefore, the features described in the first to seventh embodiments may be combined as appropriate. For example, the parallel arrangement of the first temperature control unit 12 and the second temperature control unit 13 and the control method for valves v01 and v02 according to the second embodiment may be applied to the substrate processing apparatus 1 according to the third to seventh embodiments. In addition, the configuration and control method for adjusting the amount of processing liquid discharged from the tank using the flow rate adjustment device 15 according to the fourth embodiment may be applied to the substrate processing apparatus 1 according to the first to third and fifth to seventh embodiments.

[0194] (f) In the substrate processing apparatus 1 according to the eighth embodiment, the processing liquid supply device 2 includes a processing liquid control unit 21, a display unit 81, and an operation unit 82. Furthermore, the processing liquid control unit 21 functions as part of the control unit 9 according to the first embodiment. However, the present invention is not limited thereto. The processing liquid supply device 2 may include the configuration of the processing liquid supply device 2 according to any one of the second to seventh embodiments, and may further include a processing liquid control unit 21 that is capable of functioning as part of the control unit 9 according to that embodiment.

[0195] 10. Correspondence between each component of the claim and each part of the embodiment The following describes examples of the correspondence between each component of the claims and each element of the embodiments, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0196] In the above embodiment, Chamber 4 is an example of a chamber, processing liquid supply device 2 is an example of a processing liquid supply device, control unit 9 and processing liquid control unit 21 are examples of control units, first temperature adjustment unit 12 is an example of a first temperature adjustment unit, second temperature adjustment unit 13 is an example of a second temperature adjustment unit, fault detectors 12s, 13s and control unit 9 are examples of fault determination units, and substrate processing device 1 is an example of a substrate processing device.

[0197] Furthermore, supply piping p12 is an example of the first flow path and supply piping, bypass piping p14 is an example of the second flow path, valve v01 is an example of the first valve, valve v02 is an example of the second valve, substrate processing unit 3A is an example of the first tower, substrate processing unit 3B is an example of the second tower, storage tank 10 is an example of a storage tank, and circulation piping p13 is an example of the circulation piping and first circulation piping.

[0198] Furthermore, circulation piping p15 is an example of a second circulation flow path, multiple chamber piping p21 are examples of multiple first chamber flow paths, multiple chamber piping p22 are examples of multiple second chamber flow paths, flow rate adjustment device 15 is an example of a flow rate adjustment device, liquid level sensor LS is an example of a liquid level detection unit, liquid replenishment device 5 is an example of a liquid replenishment device, lower limit level L1 is an example of a first liquid level height and lower limit height, and fault lower limit level L3 is an example of a second liquid level height.

[0199] 11. Summary of Embodiments (Paragraph 1) The substrate processing apparatus relating to Paragraph 1 is: Multiple chambers for processing multiple substrates using a processing solution, A processing liquid supply device that supplies processing liquid to the plurality of chambers, The system comprises the plurality of chambers and a control unit that controls the processing liquid supply device, The aforementioned processing liquid supply device is A first temperature adjustment unit and a second temperature adjustment unit for adjusting the temperature of the processing liquid to be supplied to the plurality of chambers, The system includes a fault determination unit that is capable of determining whether the first temperature control unit is malfunctioning and is also capable of determining whether the second temperature control unit is malfunctioning. The control unit, If the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not faulty, a first number is set as the number of chambers to which the processing liquid can be simultaneously supplied from the processing liquid supply device, which is less than or equal to the number of the multiple chambers. If the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty, and the fault determination unit determines that the other of the first temperature control unit and the second temperature control unit is not faulty, a second number smaller than the first number is set as the number of chambers to which the processing liquid can be simultaneously supplied from the processing liquid supply device.

[0200] In the substrate processing apparatus, it is determined whether the first temperature control unit and the second temperature control unit are malfunctioning. If both the first and second temperature control units are functioning correctly, a first number is set as the number of chambers to which the processing liquid can be supplied simultaneously. Therefore, by appropriately determining this first number, it becomes possible to process multiple substrates with high efficiency using temperature-controlled processing liquid.

[0201] If either the first or second temperature control unit fails but the other does not, a second number, smaller than the first number, is set as the number of chambers to which the processing liquid can be supplied simultaneously. This reduces the flow rate of the processing liquid supplied to multiple chambers compared to when the first number is set. Therefore, the operating state of at least some of the multiple chambers can be maintained for at least a certain period of time without causing processing defects in the substrate. As a result, the likelihood of the processing liquid supply device and all of the multiple chambers stopping at an unintended time is reduced.

[0202] (Paragraph 2) In the substrate processing apparatus described in Paragraph 1, The processing liquid supply device further includes a first flow path that guides the processing liquid to the plurality of chambers, The first temperature control unit and the second temperature control unit may be arranged in series on the first flow path and adjust the temperature of the processing liquid flowing through the first flow path.

[0203] In this case, even if one of the first and second temperature control units malfunctions, the temperature of the processing liquid can be continued to be adjusted as long as the other temperature control unit is functioning normally. Therefore, by appropriately limiting the number of chambers to which the processing liquid can be supplied simultaneously, the operating state of the substrate processing apparatus can be maintained for at least a certain period of time without causing any processing defects in the substrate.

[0204] (3) In the substrate processing apparatus described in paragraph 1, The aforementioned processing liquid supply device is A first flow path that guides the processing liquid to the plurality of chambers, A second flow path connected to the first flow path is provided so as to bypass a portion of the first flow path, A first valve provided in the portion of the first flow path, The present invention further includes a second valve provided in the second flow path, The first temperature control unit and the second temperature control unit are arranged in parallel by being provided in a portion of the first flow path and in the second flow path, respectively. The control unit, If the fault determination unit determines that the first temperature control unit is faulty and the second temperature control unit is not faulty, the first valve is closed and the second valve is opened. If the fault determination unit determines that the first temperature control unit is not malfunctioning and the second temperature control unit is malfunctioning, the first valve may be opened and the second valve may be closed.

[0205] In this case, even if one of the first and second temperature control units malfunctions, the temperature of the processing liquid can be continued to be adjusted as long as the other temperature control unit is functioning normally. Therefore, by appropriately limiting the number of chambers to which the processing liquid can be supplied simultaneously, the operating state of the substrate processing apparatus can be maintained for at least a certain period of time without causing any processing defects in the substrate.

[0206] Furthermore, according to the above configuration, if the first temperature control unit is malfunctioning but the second temperature control unit is functioning correctly, the flow of the processing liquid in a portion of the first flow path is interrupted. As a result, the processing liquid flows through the second flow path, bypassing a portion of the first flow path. At this time, the temperature of the processing liquid is adjusted by the second temperature control unit.

[0207] Furthermore, if the first temperature control unit is functioning correctly but the second temperature control unit is malfunctioning, the flow of the processing liquid in the second flow path is interrupted. As a result, the processing liquid flows through a portion of the first flow path. At this time, the temperature of the processing liquid is controlled by the first temperature control unit.

[0208] As a result, untemperature-controlled processing fluid is not supplied to the chamber. Therefore, the temperature of the processing fluid supplied to the chamber is less likely to become unstable.

[0209] Furthermore, if both the first and second temperature control units are functioning correctly, the first and second valves may be left open. This reduces the pressure loss in each fluid flow path compared to when the first and second temperature control units are arranged in series.

[0210] (Article 4) In the substrate processing apparatus described in Article 1, The aforementioned plurality of chambers include four or more chambers, The substrate processing apparatus is A first tower including a configuration in which two or more of the aforementioned plurality of chambers are stacked, The tower includes a second tower in which two or more of the aforementioned plurality of chambers are stacked, The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature control unit and the second temperature control unit are provided, and a supply channel extends from the storage tank, A first circulation channel returns a portion of the processing liquid flowing downstream of the first and second temperature control sections of the supply channel to the storage tank, A plurality of first chamber channels that guide the processing liquid flowing through the first circulation channel to the two or more chambers provided in the first tower, A second circulation channel returns the remaining portion of the supply channel downstream of the first and second temperature control sections of the processed liquid back to the storage tank, The system further includes a plurality of second chamber channels that guide the processing liquid flowing through the second circulation channel to the two or more chambers provided in the second tower, The control unit may, regardless of the determination result of the fault determination unit, control the processing liquid supply device to circulate the processing liquid through the first circulation channel and the second circulation channel.

[0211] In this case, even if the number of chambers to which the processing liquid can be supplied simultaneously is reduced, the processing liquid will always flow through both the first and second circulation channels. This suppresses changes in the temperature of the processing liquid in the first and second circulation channels due to stagnation of the processing liquid. It also suppresses the generation of precipitates associated with temperature changes in the processing liquid. Therefore, it is possible to suppress a decrease in the temperature quality and flow condition of the processing liquid in the first and second circulation channels.

[0212] (Article 5) In the substrate processing apparatus described in Article 1, The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature control unit and the second temperature control unit are provided, and a supply channel extends from the storage tank, A circulation channel that returns at least a portion of the processing liquid flowing downstream of the first and second temperature control units in the supply channel to the storage tank, The system further includes a flow rate adjustment device provided in the supply channel for adjusting the flow rate of the processed liquid flowing from the storage tank to the supply channel, The control unit, If the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not faulty, the flow rate adjustment device is controlled to adjust the flow rate of the processed liquid flowing from the storage tank to the supply channel to a first flow rate. If the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty, and the fault determination unit determines that the other of the first and second temperature control units is not faulty, the flow rate adjustment device may be controlled to adjust the flow rate of the processed liquid flowing from the storage tank to the supply channel to a second flow rate that is lower than the first flow rate.

[0213] In the above configuration, the treated liquid circulates through the storage tank, supply channel, and circulation channel. When both the first and second temperature control units are functioning correctly, the temperature of the circulating treated liquid is controlled by both units. However, if either the first or second temperature control unit fails, the efficiency of temperature control of the treated liquid flowing through the supply channel decreases. Therefore, it becomes highly likely that maintaining the temperature of the circulating treated liquid using only the other temperature control unit will be difficult.

[0214] According to the above configuration, if either the first temperature control unit or the second temperature control unit fails, the flow rate of the processed liquid flowing from the storage tank to the supply channel will decrease compared to when both the first and second temperature control units are functioning correctly. This makes it easier to maintain the temperature of the processed liquid circulating through the supply channel and the circulation channel.

[0215] (Paragraph 6) In the substrate processing apparatus described in Paragraph 1, The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature control unit and the second temperature control unit are provided, and a supply channel extends from the storage tank, A circulation channel that returns at least a portion of the processing liquid flowing downstream of the first and second temperature control units in the supply channel to the storage tank, A liquid level detection unit for detecting the liquid level height of the processed liquid stored in the storage tank, The system further includes a liquid replenishment device for replenishing the processing liquid in the storage tank, The control unit, When the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not malfunctioning, and the liquid level detected by the liquid level detection unit falls to the first liquid level, the liquid replenishment device is controlled to replenish the storage tank with processing liquid until a specified amount of processing liquid is stored in the storage tank. If the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty, and the fault determination unit determines that the other of the first temperature control unit and the second temperature control unit is not faulty, and the liquid level detected by the liquid level detection unit has fallen to a second liquid level higher than the first liquid level, the liquid replenishment device may be controlled to replenish the storage tank with processing liquid until the specified amount of processing liquid is stored in the storage tank.

[0216] In the above configuration, the treated liquid circulates through the storage tank, supply channel, and circulation channel. When both the first and second temperature control units are functioning correctly, the temperature of the circulating treated liquid is controlled by the first and second temperature control units. As a portion of the circulating treated liquid is supplied to multiple chambers, the amount of treated liquid in the storage tank decreases. As a result, the liquid level of the treated liquid in the storage tank drops to a first liquid level, and the storage tank is replenished with new treated liquid.

[0217] The temperature of the new processing liquid is usually not regulated. Therefore, the temperature of the processing liquid in the storage tank changes temporarily. In order to supply processing liquid at the appropriate temperature to multiple chambers, regardless of such temperature changes in the processing liquid in the storage tank, the first and second temperature control units are required to have a temperature control capacity of a certain level or higher.

[0218] However, if either the first or second temperature control unit fails, the efficiency of temperature control of the processing liquid flowing through the supply channel decreases. In other words, a certain level of temperature control capacity cannot be achieved. Therefore, depending on the temperature change of the processing liquid in the storage tank, it may become difficult to properly adjust the temperature of the processing liquid using only the temperature control units that are not malfunctioning.

[0219] According to the above configuration, if either the first or second temperature control unit fails, the liquid level of the processed liquid in the storage tank drops to a second liquid level higher than the first liquid level, thereby replenishing the storage tank with new processed liquid. In this case, the amount of processed liquid replenished to the storage tank at one time decreases compared to when both the first and second temperature control units are functioning correctly. Therefore, the temperature change of the processed liquid in the storage tank due to replenishment becomes smaller. As a result, the temperature of the processed liquid circulating through the supply and circulation channels is more easily maintained.

[0220] (Section 7) In the substrate processing apparatus described in Section 1, The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature control unit and the second temperature control unit are provided, and a supply channel extends from the storage tank, A circulation channel that returns at least a portion of the processing liquid flowing downstream of the first and second temperature control units in the supply channel to the storage tank, A liquid level detection unit for detecting the liquid level height of the processed liquid stored in the storage tank, The system further includes a liquid replenishment device for replenishing the processing liquid in the storage tank, The control unit, When the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not malfunctioning, and the liquid level detected by the liquid level detection unit falls to a predetermined lower limit, the liquid replenishment device is controlled to replenish the storage tank with the processing liquid at a first replenishment flow rate until a specified amount of processing liquid is stored in the storage tank. If the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty, and the fault determination unit determines that the other of the first temperature control unit and the second temperature control unit is not faulty, and the liquid level detected by the liquid level detection unit has fallen to the lower limit, the liquid replenishment device may be controlled to replenish the storage tank with processing liquid at a second replenishment flow rate lower than the first replenishment flow rate until the specified amount of processing liquid is stored in the storage tank.

[0221] In the above configuration, the treated liquid circulates through the storage tank, supply channel, and circulation channel. When both the first and second temperature control units are functioning correctly, the temperature of the circulating treated liquid is controlled by the first and second temperature control units. As a portion of the circulating treated liquid is supplied to multiple chambers, the amount of treated liquid in the storage tank decreases. As a result, the liquid level of the treated liquid in the storage tank drops to the lower limit, and new treated liquid is added to the storage tank.

[0222] The temperature of the new processing liquid is usually not regulated. Therefore, the temperature of the processing liquid in the storage tank changes temporarily. In order to supply processing liquid at the appropriate temperature to multiple chambers, regardless of such temperature changes in the processing liquid in the storage tank, the first and second temperature control units are required to have a temperature control capacity of a certain level or higher.

[0223] However, if either the first or second temperature control unit fails, the efficiency of temperature control of the processing liquid flowing through the supply channel decreases. In other words, a certain level of temperature control capacity cannot be achieved. Therefore, depending on the temperature change of the processing liquid in the storage tank, it may become difficult to properly adjust the temperature of the processing liquid using only the temperature control units that are not malfunctioning.

[0224] According to the above configuration, if either the first or second temperature control unit fails, the replenishment flow rate of new processed liquid supplied from the liquid replenishment device to the storage tank will decrease compared to when both the first and second temperature control units are functioning correctly. In this case, the amount of processed liquid supplied to the storage tank per unit time decreases compared to when both the first and second temperature control units are functioning correctly. Therefore, the amount of temperature change per unit time of the processed liquid in the storage tank due to replenishment becomes smaller. As a result, the temperature of the processed liquid circulating through the supply and circulation channels becomes easier to maintain.

[0225] (Clause 8) In the substrate processing apparatus described in paragraph 1, The system further includes a storage unit that stores temperature control unit information indicating the temperature control capabilities of the first and second temperature control units, and schedule information indicating the content of the processing to be performed in the plurality of chambers and the number of substrates to be processed. The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature control unit and the second temperature control unit are provided, and a supply channel extends from the storage tank, A circulation channel that returns at least a portion of the processing liquid flowing downstream of the first and second temperature control units in the supply channel to the storage tank, The system further includes a liquid replenishment device for replenishing the processing liquid in the storage tank, The control unit, If the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty, and the fault determination unit determines that the other of the first temperature control unit and the second temperature control unit is not faulty, Physical quantities relating to the state of the processed liquid flowing from the storage tank through the supply channel and the circulation channel are acquired as circulation information. Physical quantities relating to the state of the processed liquid being replenished from the liquid replenishment device to the storage tank are acquired as replenishment information. Based on the temperature control unit information, the circulation information, and the replenishment information, the maximum amount of processing liquid that can be supplied to any of the multiple chambers while maintaining the temperature of the processing liquid flowing through the circulation channel within a predetermined allowable range for a predetermined period is estimated as the amount that can be consumed. The second number may be calculated based on the estimated amount of available resources and the schedule information.

[0226] In this case, if either the first or second temperature control unit fails, the available energy consumption is estimated based on temperature control unit information, circulation information, and replenishment information. Based on the estimated available energy consumption and schedule information, the second number is appropriately calculated. As a result, the decrease in the processing efficiency of the substrate is mitigated.

[0227] (Paragraph 9) In the substrate processing apparatus described in any one of paragraphs 1 to 8, The control unit may stop the operation of the plurality of chambers and the processing liquid supply device if the fault determination unit determines that the first temperature control unit and the second temperature control unit are malfunctioning.

[0228] In this case, the continuous processing of inappropriate substrates is prevented. This reduces the wasteful consumption of processing solution and substrates.

[0229] (Paragraph 10) In the substrate processing apparatus described in any one of paragraphs 1 to 9, The aforementioned processing liquid supply device is The system further includes a temperature detection unit that detects the temperature of the processing liquid, which is to be supplied to any of the plurality of chambers, and whose temperature is adjusted by at least one of the first temperature adjustment unit and the second temperature adjustment unit. The control unit may stop the operation of the plurality of chambers and the processing liquid supply device if the temperature of the processing liquid detected by the temperature detection unit is not within a predetermined allowable range.

[0230] In this case, the continuous processing of inappropriate substrates is prevented. This reduces the wasteful consumption of processing solution and substrates.

[0231] (Paragraph 11) The processing liquid supply device relating to Paragraph 11 is: A processing liquid supply device that supplies processing liquid to multiple chambers, each performing processing using the processing liquid on multiple substrates, A first temperature adjustment unit and a second temperature adjustment unit for adjusting the temperature of the processing liquid to be supplied to the plurality of chambers, A fault determination unit configured to determine whether the first temperature control unit is malfunctioning and whether the second temperature control unit is malfunctioning, The system includes a control unit that, when the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not faulty, outputs a command signal to set a first number, which is less than or equal to the number of chambers, as the number of chambers that can be operated simultaneously; and a control unit that, when the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty and the other of the first temperature control unit and the second temperature control unit is not faulty, outputs a command signal to set a second number, which is smaller than the first number, as the number of chambers that can be supplied simultaneously.

[0232] In the processing liquid supply device, it is determined whether the first temperature control unit and the second temperature control unit are malfunctioning. If both the first and second temperature control units are functioning correctly, a command signal is output to set a first number as the number of chambers that can operate simultaneously. Therefore, by appropriately determining the first number, it becomes possible to process multiple substrates with high efficiency using temperature-controlled processing liquid.

[0233] If either the first or second temperature control unit fails but the other does not, a command signal is output to set the number of simultaneously operable chambers to a second number smaller than the first number. As a result, the flow rate of processing fluid supplied to multiple chambers is reduced compared to when the first number is set. Therefore, the operating state of at least some of the multiple chambers can be maintained for at least a certain period of time without causing processing defects on the substrate. Consequently, the occurrence of all of the multiple chambers stopping at an unintended time is reduced.

[0234] (Paragraph 12) The substrate processing method relating to Paragraph 12 is: The process involves supplying processing liquid to multiple chambers, each of which processes multiple substrates using the processing liquid, This includes controlling the plurality of chambers, Supplying the processing liquid to the aforementioned multiple chambers is, The temperature of the processing liquid to be supplied to the plurality of chambers is adjusted using the first temperature adjustment unit and the second temperature adjustment unit, To determine whether the first temperature control unit is malfunctioning, This includes determining whether the second temperature control unit is malfunctioning, Controlling the aforementioned multiple chambers is When it is determined that both the first temperature control unit and the second temperature control unit are not malfunctioning, a first number is set as the number of chambers to which the processing liquid can be supplied simultaneously, which is less than or equal to the number of the multiple chambers. The system includes setting a second number, smaller than the first number, as the number of chambers to which the processing liquid can be supplied simultaneously, when it is determined that one of the first and second temperature control units is malfunctioning and the other of the first and second temperature control units is not malfunctioning.

[0235] In this substrate processing method, it is determined whether the first temperature control unit and the second temperature control unit are malfunctioning. If both the first and second temperature control units are functioning correctly, a first number is set as the number of chambers to which the processing solution can be supplied simultaneously. Therefore, by appropriately determining this first number, it becomes possible to process multiple substrates with high efficiency using temperature-controlled processing solution.

[0236] If either the first or second temperature control unit fails but the other does not, a second number, smaller than the first number, is set as the number of chambers to which the processing liquid can be supplied simultaneously. This reduces the flow rate of the processing liquid supplied to multiple chambers compared to when the first number is set. Therefore, the operating state of at least some of the multiple chambers can be maintained for at least a certain period of time without causing processing defects in the substrate. As a result, the likelihood of the processing liquid supply device and all of the multiple chambers stopping at an unintended time is reduced.

[0237] (Paragraph 13) The method for supplying the processing liquid related to Paragraph 13 is: A method for supplying processing liquid to multiple chambers, each of which processes multiple substrates using the processing liquid, The temperature of the processing liquid to be supplied to the plurality of chambers is adjusted using the first temperature adjustment unit and the second temperature adjustment unit, To determine whether the first temperature control unit is malfunctioning, To determine whether the second temperature control unit is malfunctioning, If it is determined that both the first temperature control unit and the second temperature control unit are not malfunctioning, a command signal is output to set a first number, which is less than or equal to the number of chambers, as the number of chambers that can operate simultaneously. The system includes outputting a command signal to set a second number, smaller than the first number, as the number of chambers that can operate simultaneously, when it is determined that one of the first and second temperature control units is malfunctioning and the other of the first and second temperature control units is not malfunctioning.

[0238] In this processing liquid supply method, it is determined whether the first temperature control unit and the second temperature control unit are malfunctioning. If both the first and second temperature control units are functioning correctly, a command signal is output to set a first number as the number of chambers that can operate simultaneously. Therefore, by appropriately determining the first number, it becomes possible to process multiple substrates with high efficiency using temperature-controlled processing liquid.

[0239] If either the first or second temperature control unit fails but the other does not, a command signal is output to set the number of simultaneously operable chambers to a second number smaller than the first number. As a result, the flow rate of processing fluid supplied to multiple chambers is reduced compared to when the first number is set. Therefore, the operating state of at least some of the multiple chambers can be maintained for at least a certain period of time without causing processing defects on the substrate. Consequently, the occurrence of all of the multiple chambers stopping at an unintended time is reduced. [Explanation of symbols]

[0240] 1...Substrate processing device, 2...Processing liquid supply device, 3, 3A, 3B...Substrate processing unit, 4...Chamber, 4a...Spin chuck, 4b...Nozzle, 4c...Cup, 5...Liquid replenishment device, 9...Control unit, 10...Storage tank, 11...Pump, 12...First temperature control unit, 12s, 13s...Fault detector, 13...Second temperature control unit, 14...Temperature sensor, 15...Flow rate adjustment device, 21...Processing liquid control unit, 81...Display unit, 82...Operation unit, 91, 901...CPU, 92, 9 02…RAM, 93, 903…ROM, 94, 904…Storage device, 95, 905…CD-ROM, FS1, FS2…Flow sensor, L1…Lower limit level, L2…Specified level, L3…Failure lower limit level, LS…Liquid level sensor, TS1, TS2…Temperature sensor, W…Circuit board, p11…Refill piping, p12…Supply piping, p13, p15…Circulation piping, p14…Bypass piping, p21, p22…Chamber piping, v01, v02, v11, v12…Valve

Claims

1. Multiple chambers for processing multiple substrates using a processing solution, A processing liquid supply device that supplies processing liquid to the plurality of chambers, The system comprises the plurality of chambers and a control unit that controls the processing liquid supply device, The aforementioned processing liquid supply device is A first temperature adjustment unit and a second temperature adjustment unit for adjusting the temperature of the processing liquid to be supplied to the plurality of chambers, It includes a fault determination unit that is capable of determining whether the first temperature control unit is malfunctioning and is configured to determine whether the second temperature control unit is malfunctioning, The control unit, If the fault determination unit determines that neither the first temperature control unit nor the second temperature control unit is faulty, a first number is set as the number of chambers to which the processing liquid can be simultaneously supplied from the processing liquid supply device, which is less than or equal to the number of the multiple chambers. A substrate processing apparatus, wherein, when the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty and the fault determination unit determines that the other of the first and second temperature control units is not faulty, a second number smaller than the first number is set as the number of chambers to which processing liquid can be simultaneously supplied from the processing liquid supply device.

2. The processing liquid supply device further includes a first flow path that guides the processing liquid to the plurality of chambers, The substrate processing apparatus according to claim 1, wherein the first temperature adjustment unit and the second temperature adjustment unit are arranged in series on the first flow path and adjust the temperature of the processing liquid flowing through the first flow path.

3. The aforementioned processing liquid supply device is A first flow path that guides the processing liquid to the plurality of chambers, A second flow path connected to the first flow path is provided so as to bypass a portion of the first flow path, A first valve provided in the portion of the first flow path, The present invention further includes a second valve provided in the second flow path, The first temperature control unit and the second temperature control unit are arranged in parallel by being provided in a portion of the first flow path and in the second flow path, respectively. The control unit, If the fault determination unit determines that the first temperature control unit is faulty and the second temperature control unit is not faulty, the first valve is closed and the second valve is opened. The substrate processing apparatus according to claim 1, wherein, when the fault determination unit determines that the first temperature control unit is not malfunctioning and the fault determination unit determines that the second temperature control unit is malfunctioning, the first valve is opened and the second valve is closed.

4. The plurality of chambers includes four or more chambers, The substrate processing apparatus is A first tower including a configuration in which two or more of the aforementioned plurality of chambers are stacked, The tower includes a second tower in which two or more of the aforementioned plurality of chambers are stacked, The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature adjustment unit and the second temperature adjustment unit are provided, and a supply channel extends from the storage tank, A first circulation channel returns a portion of the processing liquid flowing downstream of the first and second temperature control sections of the supply channel to the storage tank, A plurality of first chamber channels that guide the processing liquid flowing through the first circulation channel to the two or more chambers provided in the first tower, A second circulation channel returns the remaining portion of the treated liquid flowing downstream of the first and second temperature control sections of the supply channel to the storage tank, The system further includes a plurality of second chamber channels that guide the processing liquid flowing through the second circulation channel to the two or more chambers provided in the second tower, The substrate processing apparatus according to claim 1, wherein the control unit controls the processing liquid supply device to circulate the processing liquid through the first circulation channel and the second circulation channel, regardless of the determination result of the fault determination unit.

5. The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature adjustment unit and the second temperature adjustment unit are provided, and a supply channel extends from the storage tank, A circulation channel that returns at least a portion of the processing liquid flowing downstream of the first temperature adjustment unit and the second temperature adjustment unit of the supply channel to the storage tank, The system further includes a flow rate adjustment device provided in the supply channel for adjusting the flow rate of the processed liquid flowing from the storage tank to the supply channel, The control unit, If the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not faulty, the flow rate adjustment device is controlled to adjust the flow rate of the processed liquid flowing from the storage tank to the supply channel to a first flow rate. The substrate processing apparatus according to claim 1, wherein, when the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty and the fault determination unit determines that the other of the first temperature control unit and the second temperature control unit is not faulty, the flow rate adjustment device is controlled to adjust the flow rate of the processing liquid flowing from the storage tank to the supply channel to a second flow rate lower than the first flow rate.

6. The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature adjustment unit and the second temperature adjustment unit are provided, and a supply channel extends from the storage tank, A circulation channel that returns at least a portion of the processing liquid flowing downstream of the first temperature adjustment unit and the second temperature adjustment unit of the supply channel to the storage tank, A liquid level detection unit for detecting the liquid level height of the processed liquid stored in the storage tank, The system further includes a liquid replenishment device for replenishing the processing liquid in the storage tank, The control unit, When the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not malfunctioning, and the liquid level detected by the liquid level detection unit falls to the first liquid level, the liquid replenishment device is controlled to replenish the storage tank with processing liquid until a specified amount of processing liquid is stored in the storage tank. The substrate processing apparatus according to claim 1, wherein the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty, and the fault determination unit determines that the other of the first temperature control unit and the second temperature control unit is not faulty, and the liquid level detected by the liquid level detection unit has fallen to a second liquid level higher than the first liquid level, the liquid replenishment device is controlled to replenish the storage tank with processing liquid until the specified amount of processing liquid is stored in the storage tank.

7. The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature adjustment unit and the second temperature adjustment unit are provided, and a supply channel extends from the storage tank, A circulation channel that returns at least a portion of the processing liquid flowing downstream of the first temperature adjustment unit and the second temperature adjustment unit of the supply channel to the storage tank, A liquid level detection unit for detecting the liquid level height of the processed liquid stored in the storage tank, The system further includes a liquid replenishment device for replenishing the processing liquid in the storage tank, The control unit, When the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not malfunctioning, and the liquid level detected by the liquid level detection unit falls to a predetermined lower limit, the liquid replenishment device is controlled to replenish the storage tank with the processing liquid at a first replenishment flow rate until a specified amount of processing liquid is stored in the storage tank. The substrate processing apparatus according to claim 1, wherein the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty, and the fault determination unit determines that the other of the first temperature control unit and the second temperature control unit is not faulty, and the liquid level detected by the liquid level detection unit has fallen to the lower limit, the liquid replenishment device is controlled to replenish the storage tank with processing liquid at a second replenishment flow rate lower than the first replenishment flow rate until the specified amount of processing liquid is stored in the storage tank.

8. The system further includes a storage unit that stores temperature control unit information indicating the temperature control capabilities of the first and second temperature control units, and schedule information indicating the content of the processing to be performed in the plurality of chambers and the number of substrates to be processed. The aforementioned processing liquid supply device is A storage tank for storing the processed liquid, The first temperature adjustment unit and the second temperature adjustment unit are provided, and a supply channel extends from the storage tank, A circulation channel that returns at least a portion of the processing liquid flowing downstream of the first temperature adjustment unit and the second temperature adjustment unit of the supply channel to the storage tank, The system further includes a liquid replenishment device for replenishing the processing liquid in the storage tank, The control unit, If the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty, and the fault determination unit determines that the other of the first temperature control unit and the second temperature control unit is not faulty, Physical quantities relating to the state of the processed liquid flowing from the storage tank through the supply channel and the circulation channel are acquired as circulation information. Physical quantities relating to the state of the processed liquid being replenished from the liquid replenishment device to the storage tank are acquired as replenishment information. Based on the temperature control unit information, the circulation information, and the replenishment information, the maximum amount of processing liquid that can be supplied to any of the multiple chambers while maintaining the temperature of the processing liquid flowing through the circulation channel within a predetermined allowable range for a predetermined period is estimated as the amount that can be consumed. The substrate processing apparatus according to claim 1, wherein the second number is calculated based on the estimated amount of consumables and the schedule information.

9. The substrate processing apparatus according to any one of claims 1 to 8, wherein the control unit stops the operation of the plurality of chambers and the processing liquid supply device when the fault determination unit determines that the first temperature control unit and the second temperature control unit are malfunctioning.

10. The aforementioned processing liquid supply device is The system further includes a temperature detection unit that detects the temperature of the processing liquid, which is adjusted by at least one of the first temperature adjustment unit and the second temperature adjustment unit and supplied to one of the plurality of chambers. The substrate processing apparatus according to any one of claims 1 to 8, wherein the control unit stops the operation of the plurality of chambers and the processing liquid supply device when the temperature of the processing liquid detected by the temperature detection unit is not within a predetermined allowable range.

11. A processing liquid supply device that supplies processing liquid to multiple chambers, each performing processing using the processing liquid on multiple substrates, A first temperature adjustment unit and a second temperature adjustment unit for adjusting the temperature of the processing liquid to be supplied to the plurality of chambers, A fault determination unit configured to determine whether the first temperature control unit is malfunctioning and whether the second temperature control unit is malfunctioning, A processing liquid supply device comprising: a control unit that, when the fault determination unit determines that both the first temperature control unit and the second temperature control unit are not faulty, outputs a command signal to set a first number, which is less than or equal to the number of the plurality of chambers, as the number of chambers that can be operated simultaneously; and a control unit that, when the fault determination unit determines that one of the first temperature control unit and the second temperature control unit is faulty and the other of the first temperature control unit and the second temperature control unit is not faulty, outputs a command signal to set a second number, which is smaller than the first number, as the number of chambers that can be supplied simultaneously.

12. The process involves supplying processing liquid to multiple chambers, each of which processes multiple substrates using the processing liquid, This includes controlling the plurality of chambers, Supplying the processing liquid to the aforementioned multiple chambers is, The temperature of the processing liquid to be supplied to the plurality of chambers is adjusted using the first temperature adjustment unit and the second temperature adjustment unit, To determine whether the first temperature control unit is malfunctioning, This includes determining whether the second temperature control unit is malfunctioning, Controlling the aforementioned multiple chambers is When it is determined that both the first temperature control unit and the second temperature control unit are not malfunctioning, a first number is set as the number of chambers to which the processing liquid can be supplied simultaneously, which is less than or equal to the number of the plurality of chambers. A substrate processing method, comprising setting a second number smaller than the first number as the number of chambers to which processing liquid can be supplied simultaneously, when it is determined that one of the first temperature control unit and the second temperature control unit is malfunctioning and the other of the first temperature control unit and the second temperature control unit is not malfunctioning.

13. A method for supplying processing liquid to multiple chambers, each of which processes multiple substrates using the processing liquid, The temperature of the processing liquid to be supplied to the plurality of chambers is adjusted using the first temperature adjustment unit and the second temperature adjustment unit, To determine whether the first temperature control unit is malfunctioning, To determine whether the second temperature control unit is malfunctioning, If it is determined that both the first temperature control unit and the second temperature control unit are not malfunctioning, a command signal is output to set a first number, which is less than or equal to the number of chambers, as the number of chambers that can operate simultaneously. A processing liquid supply method, which includes outputting a command signal to set a second number smaller than the first number as the number of chambers that can operate simultaneously, when it is determined that one of the first temperature control unit and the second temperature control unit is malfunctioning and the other of the first temperature control unit and the second temperature control unit is not malfunctioning.

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