Parts holding device, parts mounting device, and parts mounting method

Abstract

The present invention provides a component holding device, a component mounting device, and a component mounting method that enable a component to be positioned upright with simple operation. [Solution] The parts holding device 20 includes a pair of opposing finger portions 22 for gripping an object, a spacing changing portion 23 for changing the distance W between the pair of finger portions 22 by moving at least one of the pair of finger portions 22, a first gripping portion 24 rotatably provided on the opposite side of the finger portions 22 for gripping an object, and a second gripping portion 25 provided on the opposite side of the finger portions 22 for gripping an object.

Description

Technical Field

[0001] The present disclosure relates to a component holding device, a component mounting apparatus, and a component mounting method that grip and rotate a component.

Background Art

[0002] A component mounting apparatus mounts an insert component such as an electrolytic capacitor having leads extending from a component body by inserting the leads into mounting holes provided in a substrate in a state where the leads are oriented downward in an upright posture. When an insert component is stored and supplied in a storage body such as a tray in a sideways posture, the component mounting apparatus erects the sideways insert component taken out from the storage body and then mounts it on a substrate. Patent Document 1 discloses a robot manipulator that has a pair of opposing finger portions each having an elastic member fixed to the tip of a robot hand, and controls the posture of an article by applying an external force to the peripheral edge of the article in a state where an interval between the pair of finger portions is narrowed and an object is gripped by the elastic members.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] However, in the prior art including Patent Document 1, since the posture of an article is controlled by controlling the external force applied to the peripheral edge of the article, there is a problem that the control becomes complicated.

[0005] Therefore, an object of the present disclosure is to provide a component holding device, a component mounting apparatus, and a component mounting method that can bring a component into an upright posture by a simple operation.

Means for Solving the Problem

[0006] The part holding device of this disclosure comprises: a pair of opposing finger portions for gripping an object; a spacing changing portion for moving at least one of the pair of finger portions to change the distance between the pair of finger portions; a first gripping portion rotatably provided on the opposing side of the finger portions for gripping the object; and a second gripping portion provided on the opposing side of the finger portions for gripping the object.

[0007] The component mounting device of the present disclosure has a component holding device according to any one of claims 1 to 8, and comprises a head for raising and lowering the component holding device, a head moving unit for moving the head, a supply unit for supplying the object in a sideways position, and a control unit for controlling at least the head, the head moving unit, and the spacing changing unit of the component holding device.

[0008] The part mounting method of the present disclosure is a part mounting method using a part mounting device having a part holding device as described in any one of claims 1 to 8, the part mounting device comprising a head for raising and lowering the part holding device, a head moving unit for moving the head, and a supply unit for supplying the object in a sideways position, wherein the supply unit supplies the object in a sideways position, the head lowers the part holding device from a standby position, the spacing changing unit of the part holding device changes the spacing between the pair of fingers to a first spacing so that the pair of fingers grip the supplied sideways object at a position shifted horizontally with respect to the center of gravity, the head raises the part holding device to the standby position, and while the pair of fingers are gripping the object, the spacing changing unit changes the spacing between the pair of fingers to a second spacing wider than the first spacing, after a predetermined time has elapsed, the spacing changing unit changes the spacing between the pair of fingers to a third spacing, and the head moving unit moves the head.

[0009] Another part mounting method of the present disclosure is a part mounting method using a part mounting device having a part holding device according to any one of claims 1 to 8, comprising a head for raising and lowering the part holding device, a head moving unit for moving the head, and a supply unit for supplying the object in a sideways position, wherein the supply unit supplies the object in a sideways position, the head lowers the part holding device from a standby position, the spacing changing unit of the part holding device changes the spacing between the pair of fingers to a second spacing so that the pair of fingers grip the supplied sideways object at a position shifted horizontally with respect to the center of gravity, the head raises the part holding device to the standby position, and after a predetermined time has elapsed, the spacing changing unit changes the spacing between the pair of fingers to a third spacing, and the head moving unit moves the head. [Effects of the Invention]

[0010] According to this disclosure, the component can be placed in an upright position with a simple operation. [Brief explanation of the drawing]

[0011] [Figure 1] A plan view showing the configuration of the main part of a component mounting device according to one embodiment of the present disclosure. [Figure 2] A front view showing the configuration of the main part of the head of a component mounting device according to one embodiment of the present disclosure. [Figure 3] (a) Front view and (b) Plan view taken in the direction of arrow AA, showing the configuration of the main part of a component holding device according to one embodiment of the present disclosure. [Figure 4] A perspective view of the finger portion of a component holding device according to one embodiment of the present disclosure. [Figure 5] A block diagram showing the configuration of the control system of a component mounting device according to one embodiment of the present disclosure. [Figure 6] A flowchart of a component mounting method according to one embodiment of the present disclosure. [Figure 7] (a)(b) A side view illustrating the step of placing an inserted component in an upright position in a component mounting method according to one embodiment of the present disclosure. [Figure 8](a)(b) A side view illustrating the step of placing an inserted component in an upright position in a component mounting method according to one embodiment of the present disclosure. [Figure 9] (a)(b)(c) Front view illustrating the step of placing an insertion component in an upright position in a component mounting method according to one embodiment of the present disclosure. [Figure 10] (a)(b) A front view illustrating the step of placing an insertion component in an upright position in a component mounting method according to one embodiment of the present disclosure. [Figure 11] (a)(b) A plan view illustrating the step of placing an inserted component in an upright position in a component mounting method according to one embodiment of the present disclosure. [Figure 12] (a)(b)(c) Plan view illustrating the step of placing an inserted component in an upright position in a component mounting method according to one embodiment of the present disclosure. [Figure 13] A flowchart of another embodiment of the component mounting method according to one embodiment of the present disclosure. [Figure 14] (a)(b)(c)(d) A side view illustrating the step of positioning an inserted component upright in another embodiment of a component mounting method of one embodiment of the present disclosure. [Figure 15] (a) a side view from the opposite side, (b) a front view, and (c) a top view of a second embodiment of the finger portion of a component holding device according to one embodiment of the present disclosure. [Figure 16] (a) a side view from the opposite side, (b) a front view, and (c) a top view of a third embodiment of the finger portion of a component holding device according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0012] An embodiment of the present disclosure will be described in detail below with reference to the drawings. The configuration, shape, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting apparatus, component holding apparatus, pair of fingers, and head. In the following, corresponding elements in all drawings are denoted by the same reference numerals, and overlapping descriptions are omitted. In FIG. 1 and a part described later, as two axes orthogonal to each other in a horizontal plane, the X-axis in the substrate conveyance direction (the left-right direction in FIG. 1) and the Y-axis orthogonal to the substrate conveyance direction (the up-down direction in FIG. 1) are shown. In FIG. 1 and a part described later, the Z-axis (the up-down direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane.

[0013] First, the configuration of the component mounting apparatus 1 will be described with reference to FIG. 1. The component mounting apparatus 1 has a function of executing a mounting operation for manufacturing a mounted substrate by mounting components supplied to a component supply unit by a head onto a substrate. A substrate conveyance mechanism 3 is arranged along the X-axis in the center of a base 2. The substrate conveyance mechanism 3 carries in a substrate B conveyed from an upstream side to a mounting operation position, positions the substrate B, and holds the substrate B. Further, the substrate conveyance mechanism 3 carries out the substrate B on which the mounting operation has been completed to a downstream side.

[0014] Component supply units 4 are provided on both sides of the substrate conveyance mechanism 3 (in the front-rear direction of the Y-axis). In each component supply unit 4, a plurality of tape feeders 5 are arranged along the X-axis. The tape feeder 5 pitch-feeds a carrier tape formed with pockets for storing components in a direction from the outside of the component supply unit 4 toward the substrate conveyance mechanism 3 (tape feeding direction), thereby supplying components to a component take-out position where components are taken out by a head 12 described below.

[0015] In FIG. 1, a tray feeder 8 that supplies a pallet 7 holding a tray 6 storing components D such as inserted components, large components, connectors, and communication modules is mounted on the front component supply unit 4. A stick feeder 9 is mounted next to the tray feeder 8. The stick feeder 9 stores stick cases 9a each accommodating a plurality of components D therein in a stacked state, and pushes out the components D from the stick cases 9a to supply them.

[0016] The tray feeder 8 and stick feeder 9 function as supply units S that supply tall insertion components DA (see, for example, Figure 7) stored in storage containers such as trays 6 and stick cases 9a in a horizontal position. Furthermore, the components D supplied in a horizontal position, such as insertion components DA, are objects that are rotated around a horizontal axis within the component mounting device 1 to become upright (see, for example, Figure 8(b)) and are then mounted on the substrate B.

[0017] In Figure 1, Y-axis tables 10 equipped with linear drive mechanisms are arranged along the Y-axis at both ends of the X-axis on the upper surface of the base 2. A beam 11, similarly equipped with a linear drive mechanism, is coupled to the Y-axis tables 10 so as to be movable along the Y-axis. The beam 11 is positioned along the X-axis. A head 12 is mounted on the beam 11 via a beam plate 11a so as to be movable along the X-axis. The head 12 is detachable from the beam plate 11a.

[0018] Referring to Figure 2, the detailed configuration of the head 12 will now be described. The head 12 is equipped with multiple (in this case, three) lifting and rotating mechanisms 13A to 13C along the X-axis. Of the three lifting and rotating mechanisms 13A to 13C, suction nozzles 14 are attached to the lower ends of lifting and rotating mechanisms 13A and 13B, and a component holding device 20 is attached to the lower end of lifting and rotating mechanism 13C. The suction nozzles 14 have the function of holding components supplied by the tape feeder 5 and the supply unit S by vacuum suction. The component holding device 20 is equipped with a chuck 21 of variable width and has the function of gripping and holding components D such as insertion components DA supplied by the supply unit S with the chuck 21.

[0019] The lifting and rotating mechanisms 13A to 13C have the function of raising and lowering the suction nozzle 14 or part holding device 20 mounted on the lower end along the Z axis and rotating it around the vertical axis (Z axis). In this way, the lifting and rotating mechanism 13C of the head 12 raises and lowers the part holding device 20 mounted on the lower end and rotates it θ around the vertical axis. Note that the lifting and rotating mechanisms 13A to 13C equipped on the head 12 are not limited to three, and can be changed as appropriate depending on the type of suction nozzle 14 or part holding device 20 to be mounted, the type of part to be picked up, etc. In other words, the head 12 may be equipped with two or more part holding devices 20.

[0020] In Figure 1, the Y-axis table 10 and beam 11 constitute a head movement unit 15 that moves the head 12 horizontally along the X and Y axes. The head movement unit 15 and the head 12 pick up parts supplied from the tape feeder 5, tray feeder 8, and stick feeder 9 located in the parts supply unit 4 by holding them with a suction nozzle 14 or part holding device 20 attached to the head 12, and perform a mounting turn in which they mount the parts to the mounting position on the substrate B positioned in the substrate transport mechanism 3.

[0021] In Figure 1, a component recognition camera 16 is positioned between the component supply unit 4 and the substrate transport mechanism 3. When the head 12, which has taken a component from the component supply unit 4, moves above the component recognition camera 16, the component recognition camera 16 captures an image of the component held by the head 12. The holding posture of the component is recognized from the captured image. A head camera 17 is attached to the beam plate 11a to which the head 12 is mounted. The head camera 17 moves integrally with the head 12.

[0022] As the head 12 moves, the head camera 17 moves above the substrate B positioned by the substrate transport mechanism 3, and captures images of the substrate marks (not shown) provided on the substrate B to recognize the position of the substrate B. During the mounting operation of the substrate B by the head 12, the mounting position is corrected by taking into account the component recognition result by the component recognition camera 16 and the substrate position recognition result by the head camera 17.

[0023] Next, with reference to Figures 3 and 4, the configuration of the component holding device 20 attached to the head 12 will be described. Figure 3(b) is a plan view taken along the arrow AA in Figure 3(a). The tip of the chuck 21 of the component holding device 20 is equipped with a pair of finger portions 22 for gripping a component D (object) such as an insertion component DA. The component holding device 20 is equipped with a spacing change unit 23 that changes the distance between the chucks 21 by moving at least one of the chucks 21. As the chuck 21 moves, the finger portions 22 also move integrally. That is, the spacing change unit 23 changes the distance W between the pair of finger portions 22 by moving at least one of the pair of finger portions 22.

[0024] Each pair of finger portions 22 is comprised of a first gripping portion 24 and a second gripping portion 25. The first gripping portion 24 and the second gripping portion 25 are positioned on opposite sides of the pair of finger portions 22 (on the side where the pair of finger portions 22 grip the object). The second gripping portion 25 is made of an elastic material such as hard rubber and is attached to the chuck 21. In this embodiment, the second gripping portion 25 is fixed to the chuck 21. The first gripping portion 24 is made of an elastic material such as rubber that is softer than the second gripping portion 25 and is positioned inside the through hole 25c formed in the second gripping portion 25. The inner diameter of the through hole 25c is larger than the outer diameter of the first gripping portion 24.

[0025] Furthermore, when the pair of finger portions 22 are not gripping the part D (object), the first gripping surface 24a of the first gripping portion 24 that grips the part D protrudes on the opposite side from the second gripping surface 25a of the second gripping portion 25 that grips the part D. As a result, when the pair of finger portions 22 narrow their distance to grip the part D, the first gripping surface 24a comes into contact with the part D first. Also, the second gripping surface 25a of the second gripping portion 25 is positioned on at least two sides (the left and right sides in the Y-axis direction that surround the first gripping portion 24) that sandwich the first gripping surface 24a of the first gripping portion 24 (see Figures 3(b) and 4).

[0026] In Figure 3, the first gripping portion 24 is attached to a disc-shaped rotating base 26 made of a rigid material. The rotating base 26 is attached to the chuck 21 via a shaft member 27 that rotates around a rotation axis CL extending in the X-axis direction. As a result, the first gripping portion 24 is rotatable around the rotation axis CL inside the through hole 25c of the second gripping portion 25 (arrow a). In this way, the first gripping portion 24 is rotatably provided on the opposite side of the finger portion 22 and grips the part D (object). The second gripping portion 25 is also provided on the opposite side of the finger portion 22 and grips the part D.

[0027] The pair of finger portions 22 shown in Figures 3 and 4 are shaped to be suitable for gripping and moving a cylindrical insertion part DA (cylindrical part) in an upright position. Specifically, the second gripping portion 25 has a concave third gripping surface 25b formed along the outer circumferential surface DAb of the upright insertion part DA with a diameter φA (see Figures 7(a) and 9(a)). That is, the second gripping portion 25 has a vertically elongated groove with an arcuate surface with a radius of approximately 1 / 2·φA that is recessed from the second gripping surface 25a on the opposite side from the opposing side. Furthermore, the through hole 25c of the second gripping portion 25 is formed on the inside of the third gripping surface 25b. As a result, the first gripping portion 24 is positioned on the inside of the third gripping surface 25b.

[0028] Next, referring to Figure 5, the configuration of the control system of the component mounting device 1 having a component holding device 20 will be described. In the following, the component mounting operation will be mainly described in which the component holding device 20 holds the insertion component DA (object) supplied by the supply unit S in a horizontal position, changes it to an upright position, and mounts it on the substrate B. The insertion component DA is mounted on the substrate B such that the lead DAa (Figure 7) is inserted into a mounting hole (not shown) formed on the substrate B. The control device 30 of the component mounting device 1 is connected to the substrate transport mechanism 3, tape feeder 5, supply unit S (tray feeder 8, stick feeder 9), lifting and rotating mechanisms 13A to 13C for the head 12, head moving unit 15, component recognition camera 16, head camera 17, and the spacing changing unit 23 for the component holding device 20.

[0029] The control device 30 includes a storage unit 31 and a control unit 32. The storage unit 31 is a memory device that stores mounting data 31a and the like. The mounting data 31a stores information necessary for the mounting operation, such as the size of the substrate B, the type and mounting position (XY coordinates) of the components to be mounted, the size of the components (length, width, height), and the position of the components stored in the tray 6, for each type of substrate B (substrate type). In the case of an insert component DA, the mounting data 31a includes the diameter φA and height HA (Figure 7(a)) of the insert component DA, the number, length, and position of the leads DAa, the position of the leads DAa when mounted on the substrate B (angle of the insert component DA), the distance between the pair of fingers 22 when the component holding device 20 grips the insert component DA, the gripping position, and the waiting time.

[0030] In Figure 5, the control unit 32 controls at least the head 12, the head movement unit 15, and the spacing change unit 23 of the component holding device 20 based on the mounting data 31a stored in the memory unit 31 to perform the component mounting operation of mounting the insertion component DA onto the substrate B. The control unit 32 also includes a first posture change processing unit 32a and a second posture change processing unit 32b as internal processing units. As will be described later, the first posture change processing unit 32a and the second posture change processing unit 32b perform a posture change process to change the insertion component DA supplied by the supply unit S from a horizontal position to an upright position.

[0031] Next, following the flow chart in Figure 6, and with reference to Figures 7 through 12, a method for mounting parts using the parts mounting device 1 equipped with a parts holding device 20 will be described. In this embodiment, the orientation change processing is performed by the first orientation change processing unit 32a of the control unit 32. Furthermore, the description will be given in an example where a stick feeder 9 supplies the insertion parts DA as the supply unit S.

[0032] In Figure 6, first, the stick feeder 9 (supply unit S) supplies the insertion parts DA (objects) in a sideways position (ST1: insertion part supply process). The stick feeder 9 supplies the insertion parts DA one by one in a sideways position extending along the Y axis (Figure 7(a)). The first posture change processing unit 32a controls the head movement unit 15 to move the pair of fingers 22 of the part holding device 20 above the gripping position P1 of the insertion part DA (arrow b1 in Figure 7(a)).

[0033] Next, the posture change processing unit 32a controls the lifting and rotating mechanism 13C of the head 12 to lower the part holding device 20 from the standby position P0 (arrow b2 in Figure 7(b)), and lower the pair of finger parts 22 to the gripping position P1 (ST2: part holding device lowering process). At this time, the distance W between the pair of finger parts 22 is the zeroth distance W0 (see Figure 9(a)) in which the first gripping surface 24a of the first gripping part 24 does not come into contact with the outer peripheral surface DAb of the inserted part DA. That is, at the zeroth distance W0, the distance between the pair of first gripping surfaces 24a is longer than the diameter φA of the inserted part DA.

[0034] Here, with reference to Figures 7(b), 9(a), and 11(a), the gripping position P1 in which the pair of finger portions 22 grip the insertion component DA will be described. The gripping position P1 is set such that the rotation axis CL of the finger portion 22 coincides with the height of the center of gravity G of the insertion component DA, and the rotation axis CL is set to be further horizontally (in the Y-axis direction) from the lead DAa than the center of gravity G. In other words, the gripping position P1 is set to be horizontally offset from the center of gravity G of the supplied, lying-down insertion component DA (object).

[0035] In Figure 6, the posture change processing unit 32a then controls the spacing change unit 23 of the part holding device 20 to change (narrow) the spacing W of the pair of finger parts 22 to a first spacing W1 where the second gripping surface 25a of the pair of second gripping parts 25 contacts the outer circumferential surface DAb of the inserted part DA (arrow b3 in Figures 9(b) and 11(a)), and grip the gripping position P1 with the pair of finger parts 22 (ST3: first spacing change step). In the process of the second gripping surface 25a contacting the outer circumferential surface DAb of the inserted part DA, the first gripping surface 24a of the first gripping part 24 contacts the outer circumferential surface DAb of the inserted part DA, after which the soft first gripping part 24 is compressed to a thickness where the second gripping surface 25a contacts the outer circumferential surface DAb of the inserted part DA (Figures 9(b) and 11(a)). As a result, the insertable component DA is gripped by the pair of finger portions 22 with a strong gripping force.

[0036] Next, the posture change processing unit 32a controls the lifting and rotating mechanism 13C of the head 12 to raise the part holding device 20 to the standby position P0 (ST4: part holding device raising process) (arrow b4 in Figure 8(a)). During the process of the part holding device 20 rising to the standby position P0, the insertion part DA, gripped by the pair of finger parts 22, rises while maintaining a sideways position due to the strong gripping force. Next, the posture change processing unit 32a controls the spacing changing unit 23 of the part holding device 20 to change the spacing W of the pair of finger parts 22 to a second spacing W2 (W2>W1) which is wider than the first spacing W1 (ST5: second spacing changing process) (arrow b5 in Figures 9(c) and 11(b)).

[0037] Here, with reference to Figures 9(c) and 11(b), the second spacing W2 of the pair of finger portions 22 will be explained. The second spacing W2 is such that the spacing between the first gripping surfaces 24a of the pair of first gripping portions 24 is narrower than the 0th spacing W0 in which the pair of finger portions 22 do not grip the insertion component DA (object), and is wider than the first spacing W1 in which the second gripping surfaces 25a of the pair of second gripping portions 25 abut against the outer peripheral surface DAb of the insertion component DA. As a result, the grip of the insertion component DA by the pair of second gripping portions 25 is released, and the insertion component DA is gripped only by the pair of first gripping portions 24. In this state, since the first gripping portions 24 are rotatable around the rotation axis CL, the insertion component DA, which is gripped by the pair of finger portions 22, rotates by its own weight so that its center of gravity G is below the rotation axis CL (arrow b6 in Figure 8(b)).

[0038] In Figure 6, the first posture change processing unit 32a then waits for a first waiting time (a predetermined time) until the vibration of the rotating and vibrating inserted component DA subsides and the lead DAa of the inserted component DA is in an upright position facing downwards (Figures 8(b), 10(a), and 12(a)) (ST6: first waiting step). After the first waiting time has elapsed (Yes in ST6), the first posture change processing unit 32a controls the spacing change unit 23 to change the spacing W of the pair of finger portions 22 to a third spacing W3 (W3≦W1) which is the same as the first spacing W1 or narrower than the first spacing W1 (ST7: third spacing change step) (arrow b7 in Figures 10(b) and 12(b)).

[0039] Here, with reference to Figures 10(b) and 12(b), the third spacing W3 of the pair of finger portions 22 will be described. When a third gripping surface 25b is formed on the second gripping portion 25, the third spacing W3 is set to the spacing at which the third gripping surface 25b contacts the outer peripheral surface DAb of the insertion part DA. In this case, the third spacing W3 is narrower than the first spacing W1. Also, when a third gripping surface 25b is not formed on the second gripping portion 25, the third spacing W3 is set to the first spacing W1 at which the second gripping surface 25a of the second gripping portion 25 contacts the outer peripheral surface DAb of the insertion part DA. As a result, the insertion part DA is gripped by the pair of finger portions 22 with a strong gripping force. When the second gripping portion 25 is gripping the insertion part DA, the upright posture of the insertion part DA gripped by the pair of finger portions 22 is maintained even if the head 12 moves at high speed due to the strong gripping force.

[0040] In Figure 6, the control unit 32 controls the head movement unit 15 to move the head 12 (ST8: head movement process) and mounts the insertion component DA to the mounting position on the substrate B (ST9: mounting process). In the mounting process (ST9), the control unit 32 moves the insertion component DA held by the component holding device 20 above the component recognition camera 16 to image the lower surface of the insertion component DA and recognize the position of the lead DAa of the insertion component DA (angle of the insertion component DA).

[0041] The control unit 32 also rotates the insertion component DA by θ based on the angle of the recognized insertion component DA, causing the lead DAa to be inserted into the mounting hole of the substrate B. Subsequently, the control unit 32 controls the spacing change unit 23 of the component holding device 20 to widen the spacing W of the pair of finger portions 22 to a 0 spacing W0 where the first gripping surface 24a of the first gripping portion 24 does not come into contact with the outer peripheral surface DAb of the insertion component DA, thereby separating the pair of finger portions 22 from the insertion component DA (arrow b8 in Figure 12(c)). As a result, the insertion component DA (object) is mounted on the substrate B.

[0042] Next, following the flow chart in Figure 13 and with reference to Figure 14, another embodiment of the component mounting method using the component mounting device 1 equipped with a component holding device 20 will be described. In this embodiment, the orientation change process is performed by the second orientation change processing unit 32b of the control unit 32. In this other embodiment of the component mounting method, the component holding device 20 changes the orientation of the inserted component DA from a horizontal orientation at the gripping position P1 to an upright orientation while raising it to the standby position P0, whereas in the component mounting method shown in Figure 6, the inserted component DA is raised to the standby position P0 while remaining in a horizontal orientation and then changed to an upright orientation. Hereafter, the same reference numerals are used for the same steps as in the component mounting method shown in Figure 6, and detailed explanations will be omitted.

[0043] In Figure 13, first, the insertion component supply process (ST1) is performed, in which the stick feeder 9 (supply unit S) supplies the insertion component DA (object) in a sideways position. Next, the second position change processing unit 32b performs the component holding device lowering process (ST2), in which the lifting and rotating mechanism 13C of the head 12 lowers the component holding device 20 from the standby position P0 to the gripping position P1 (arrow c1 in Figure 14(a)).

[0044] Next, the second posture change processing unit 32b controls the spacing change unit 23 of the part holding device 20 to change (narrow) the spacing W of the pair of finger parts 22 to a second spacing W2, so that the pair of finger parts 22 grip the supplied sideways insertion part DA at a gripping position P1 that is shifted horizontally with respect to the center of gravity G (ST11: second spacing change process) (Figure 14(a)). As a result, the insertion part DA is held in a state where it can be rotatably gripped by the pair of finger parts 22.

[0045] In Figure 13, the second posture change processing unit 32b then performs the part holding device raising process (ST4), and the lifting and rotating mechanism 13C of the head 12 raises the part holding device 20 to the standby position P0 (arrows c2 to c4 in Figure 14). As the part holding device 20 rises from the gripping position P1 to the standby position P0, the insertion part DA, which is in a horizontal position, is supported at the bottom by the stick feeder 9 and gradually comes to an upright position (Figures 14(b) to 14(c)).

[0046] Next, the second posture change processing unit 32b waits for a second waiting time (a predetermined time) until the vibration of the rotating and vibrating inserted component DA subsides and the lead DAa of the inserted component DA faces downwards, resulting in an upright posture (Figure 14(c)) (ST12: second waiting step). In this embodiment, as the component holding device 20 rises from the gripping position P1 to the waiting position P0, the inserted component DA gradually assumes an upright posture, so the second waiting time required for the vibration to subside is shorter than the first waiting time.

[0047] After the second waiting time has elapsed (Yes in ST12), the second posture change processing unit 32b executes the third spacing change process (ST7), and the spacing change unit 23 changes (narrows) the spacing W between the pair of finger portions 22 to the third spacing W3. As a result, the insertion component DA is held in an upright position by the pair of finger portions 22 with a strong gripping force. Next, the head movement process (ST8) is executed, and the head movement unit 15 moves the head 12. Then the mounting process (ST9) is executed, and the insertion component DA, which the component holding device 20 was holding in an upright position, is mounted onto the substrate B.

[0048] Next, with reference to Figure 15, a second embodiment of the pair of finger portions provided by the component holding device 20 (hereinafter simply referred to as "the pair of finger portions 22A," etc.) will be described. While the pair of first gripping portions 24 shown in Figures 3 and 4 are made of an elastic material such as soft rubber, the first gripping portion 24A of the pair of finger portions 22A in the second embodiment differs in that it has a plate-shaped member 40 having a first gripping surface 40a for gripping an object (such as an inserted component DA), and an elastic member 41 that biases the plate-shaped member 40 toward the opposite side. Hereafter, the same reference numerals are used for the same parts as the pair of finger portions 22, and detailed explanations will be omitted.

[0049] The plate-shaped member 40 has a configuration in which a disc-shaped gripping plate 43 made of an elastic material such as rubber is positioned opposite a disc-shaped support plate 42 made of a rigid material. The elastic member 41 is a leaf spring such as a wave washer. One end of the elastic member 41 is connected to the plate-shaped member 40, and the other end of the elastic member 41 is connected to a disc-shaped rotating base 44 made of a rigid material. The first gripping portion 24A is positioned inside the third gripping surface 25b of the second gripping portion 25. The rotating base 44 is connected to the shaft member 27. As a result, the first gripping portion 24A is rotatable around the rotation axis CL. Furthermore, when the distance W between the pair of finger portions 22A is changed to the first distance W1, the second distance W2, and the third distance W3, the plate-shaped member 40 is pushed by the outer peripheral surface DAb of the insertion part DA and moves to the opposite side from the opposing side.

[0050] Next, with reference to Figure 16, a third embodiment of the pair of finger parts provided by the component holding device 20 (hereinafter simply referred to as "the pair of finger parts 22B," etc.) will be described. The first gripping part 24A of the pair of finger parts 22A in the second embodiment is equipped with an elastic member 41 such as a leaf spring, whereas the first gripping part 24B of the pair of finger parts 22B in the third embodiment is equipped with an elastic member 45 such as a coil spring. Hereafter, the same reference numerals are used for parts that are the same as those of the pair of finger parts 22A in the second embodiment, and detailed explanations will be omitted.

[0051] Each pair of finger portions 22B has an elastic member 45 consisting of four coil springs arranged rotationally symmetrically around a rotation axis CL. One end of the elastic member 45 is connected to a plate-shaped member 40, and the other end is connected to a rotating base 46. The first gripping portion 24B is positioned inside the third gripping surface 25b of the second gripping portion 25. The rotating base 46 is connected to a shaft member 27. As a result, the first gripping portion 24B is rotatable around the rotation axis CL. Furthermore, when the spacing W of the pair of finger portions 22B is changed to a first spacing W1, a second spacing W2, and a third spacing W3, the plate-shaped member 40 is pushed by the outer circumferential surface DAb of the insertable component DA and moves to the opposite side from the opposing side.

[0052] As explained above, this disclosure discloses the following technical concepts.

[0053] (Technology 1) A pair of opposing finger portions 22, 22A, 22B that grip the object (insertion part DA), A spacing changing unit 23 moves at least one of the pair of finger parts 22, 22A, 22B to change the spacing W between the pair of finger parts 22, 22A, 22B, First gripping parts 24, 24A, 24B are rotatably provided on the opposite side of the finger parts 22, 22A, 22B for gripping an object, A component holding device 20 comprising a second gripping portion 25 provided on the opposite side of the finger portions 22, 22A, and 22B for gripping an object.

[0054] This allows the inserted component DA to be positioned upright with a simple operation.

[0055] (Technology 2) The spacing changing unit 23 changes the spacing W while the pair of finger portions 22, 22A, and 22B are gripping the object (insertion part DA), as described in Technical 1 of the part holding device 20.

[0056] This allows the insert component DA to be held in an upright position with a simple motion.

[0057] (Technology 3) When the pair of finger portions 22, 22A, and 22B are not gripping the object (insertion part DA), The component holding device 20 according to Technology 1 or 2, wherein the first gripping surfaces 24a, 40a of the first gripping portions 24, 24A, 24B that grip an object protrude on the opposite side of the second gripping surface 25a of the second gripping portion 25 that grips an object.

[0058] As a result, the first gripping parts 24, 24A, and 24B grip the insertion part DA, and the insertion part DA can be placed in an upright position with a simple operation.

[0059] (Technology 4) The component holding device 20 according to Technical 3, wherein the second gripping surface 25a is arranged on at least two sides that sandwich the first gripping surfaces 24a, 40a.

[0060] This allows the second gripping portion 25 to grip the insertion component DA and maintain the orientation of the insertion component DA.

[0061] (Technology 5) The object (inserted part DA) is a cylindrical part, The part holding device 20 according to any one of the technologies 1 to 4, wherein the second gripping portion 25 has a concave third gripping surface 25b that is aligned with the outer peripheral surface DAb of the cylindrical part.

[0062] This allows the second gripping portion 25 to grip the cylindrical insertion part DA and maintain the orientation of the insertion part DA.

[0063] (Technology 6) The component holding device 20 according to Technical Reference 5, wherein the first gripping portions 24, 24A, and 24B are positioned inside the third gripping surface 25b.

[0064] This allows the insertion component DA to be placed in an upright position with a simple operation while the first gripping parts 24, 24A, and 24B are gripping the insertion component DA.

[0065] (Technology 7) The first gripping portion 24 is made of an elastic material, and the component holding device 20 is as described in any one of the technologies 1 to 6.

[0066] This allows the first gripping portion 24 to be realized with a simple configuration.

[0067] (Technology 8) The first gripping parts 24A and 24B are A plate-shaped member 40 having a first gripping surface 40a for gripping the object (insertion part DA), A component holding device 20 according to any one of the technologies 1 to 6, comprising elastic members 41 and 45 that bias a plate-shaped member 40 toward the opposite side.

[0068] This allows the first gripping portions 24A and 24B to grip the insertion component DA more securely.

[0069] (Technology 9) The component holding device 20 is described in any of the technologies 1 to 8, and the head 12 raises and lowers the component holding device 20, A head movement unit 15 that moves the head 12, A supply unit S that supplies the object (insertion part DA) in a sideways position, A component mounting device 1 comprises at least a head 12, a head moving part 15, and a control unit 32 that controls the spacing changing part 23 of the component holding device 20.

[0070] This allows the insert component DA to be mounted on the substrate B in an upright position with a simple operation.

[0071] (Technology 10) A component mounting method using a component mounting device 1, which has a component holding device 20 as described in any of technologies 1 to 8, and comprises a head 12 for raising and lowering the component holding device 20, a head moving unit 15 for moving the head 12, and a supply unit S for supplying an object (insertion component DA) in a sideways position, The supply unit S supplies the object in a horizontal position (ST1), The head 12 lowers the parts holding device 20 from the standby position P0 (ST2), The spacing change unit 23 of the component holding device 20 changes the spacing W of the pair of finger portions 22, 22A, and 22B to a first spacing W1, so that the pair of finger portions 22, 22A, and 22B grip the supplied lying-down object at a position (gripping position P1) that is horizontally shifted with respect to the center of gravity G (ST3). The head 12 raises the parts holding device 20 to the standby position P0 (ST4), With the pair of finger portions 22, 22A, and 22B gripping the object, the spacing change unit 23 changes the spacing W of the pair of finger portions 22, 22A, and 22B to a second spacing W2 which is wider than the first spacing W1 (ST5). After a predetermined time has elapsed (first waiting time) (Yes in ST6), the interval changing unit 23 changes the interval W of the pair of finger parts 22, 22A, 22B to a third interval W3 (ST7), A component mounting method in which the head moving unit 15 moves the head 12 (ST8).

[0072] This allows the insert component DA to be mounted on the substrate B in an upright position with a simple operation.

[0073] (Technology 11) The component mounting method described in Technical 10, wherein the third interval W3 is the same as or narrower than the first interval W1.

[0074] This allows the second gripping portion 25 to grip the insertion component DA and maintain the orientation of the insertion component DA.

[0075] (Technology 12) A component mounting method using a component mounting device 1, which has a component holding device 20 as described in any of technologies 1 to 8, and comprises a head 12 for raising and lowering the component holding device 20, a head moving unit 15 for moving the head 12, and a supply unit S for supplying an object (insertion component DA) in a sideways position, The supply unit S supplies the object in a horizontal position (ST1), The head 12 lowers the parts holding device 20 from the standby position P0 (ST2), The spacing change unit 23 of the component holding device 20 changes the spacing between the pair of finger portions 22, 22A, and 22B to a second spacing W2, so that the pair of finger portions 22, 22A, and 22B grip the supplied lying-down object at a position (gripping position P1) that is horizontally shifted with respect to the center of gravity G (ST11). The head 12 raises the parts holding device 20 to the standby position P0 (ST4), After a predetermined time has elapsed (second waiting time) (Yes in ST12), the interval changing unit 23 changes the interval between the pair of finger parts 22, 22A, and 22B to the third interval W3 (ST7), A component mounting method in which the head moving unit 15 moves the head 12 (ST8).

[0076] This allows the insert component DA to be mounted on the substrate B in an upright position with a simple operation.

[0077] (Technology 13) The component mounting method described in Technical Reference 12, wherein the third interval W3 is the same as, or narrower than, the first interval W1 in which the second gripping portion 25 grips the object (insertion component DA).

[0078] This allows the second gripping portion 25 to grip the insertion component DA and maintain the orientation of the insertion component DA. [Industrial applicability]

[0079] The component holding device, component mounting device, and component mounting method of this disclosure have the effect of being able to position components in an upright position with simple operation, and are useful in the field of mounting components on a substrate. [Explanation of symbols]

[0080] 1. Component mounting device 12 heads 15 Head movement section 20. Parts holding device 22, 22A, 22B fingers 23 Interval change section 24, 24A, 24B First gripping section 24a, 40a First gripping surface 25 Second gripping part 25a Second gripping surface 25b Third gripping surface 40 Plate-shaped member 41, 45 Elastic members DA Insertion component (object) DAb outer surface G center of gravity P0 Standby position P1 gripping position S supply section W interval W1 1st interval W2 Second Interval W3 Third interval

Claims

1. A pair of opposing fingers for gripping an object, A spacing changing unit that moves at least one of the pair of fingers to change the distance between the pair of fingers, A first gripping portion is rotatably provided on the opposite side of the aforementioned finger portion and is used to grip the object, A component holding device comprising: a second gripping portion provided on the opposite side of the finger portion for gripping the object.

2. The component holding device according to claim 1, wherein the interval changing unit changes the interval while the pair of fingers are gripping the object.

3. When the pair of fingers are not gripping the object, The component holding device according to claim 1, wherein the first gripping surface of the first gripping portion that grips the object protrudes toward the opposite side of the second gripping surface of the second gripping portion that grips the object.

4. The component holding device according to claim 3, wherein the second gripping surface is arranged on at least two sides that sandwich the first gripping surface.

5. The aforementioned object is a cylindrical part, The component holding device according to claim 4, wherein the second gripping portion has a concave third gripping surface that is aligned with the outer circumferential surface of the cylindrical component.

6. The component holding device according to claim 5, wherein the first gripping portion is arranged on the inside of the third gripping surface.

7. The component holding device according to claim 1, wherein the first gripping portion is made of an elastic body.

8. The first gripping portion is, A plate-shaped member having a first gripping surface for gripping the object, The component holding device according to claim 1, further comprising an elastic member that biases the plate-shaped member toward the opposing side.

9. A component holding device according to any one of claims 1 to 8, comprising a head for raising and lowering the component holding device, A head moving unit for moving the head, A supply unit that supplies the object in a lying position, A component mounting device comprising at least the head, the head moving unit, and a control unit for controlling the spacing changing unit of the component holding device.

10. A method for mounting parts using a parts mounting device, comprising a parts holding device according to any one of claims 1 to 8, a head for raising and lowering the parts holding device, a head moving unit for moving the head, and a supply unit for supplying the object in a sideways position, The supply unit supplies the object in a lying position, The head lowers the component holding device from the standby position, The spacing changing unit of the component holding device changes the spacing between the pair of fingers to a first spacing, so that the pair of fingers grips the supplied lying-down object at a position shifted horizontally with respect to its center of gravity. The head raises the component holding device to the standby position, With the pair of fingers gripping the object, the spacing adjustment unit changes the spacing between the pair of fingers to a second spacing that is wider than the first spacing. After a predetermined time has elapsed, the interval changing unit changes the interval between the pair of fingers to a third interval. A component mounting method wherein the head moving part moves the head.

11. The component mounting method according to claim 10, wherein the third interval is the same as or narrower than the first interval.

12. A method for mounting parts using a parts mounting device, comprising a parts holding device according to any one of claims 1 to 8, a head for raising and lowering the parts holding device, a head moving unit for moving the head, and a supply unit for supplying the object in a sideways position, The supply unit supplies the object in a lying position, The head lowers the component holding device from the standby position, The spacing changing unit of the component holding device changes the spacing between the pair of fingers to a second spacing, so that the pair of fingers grips the supplied lying-down object at a position shifted horizontally with respect to its center of gravity. The head raises the component holding device to the standby position, After a predetermined time has elapsed, the interval changing unit changes the interval between the pair of fingers to a third interval. A component mounting method wherein the head moving part moves the head.

13. The component mounting method according to claim 12, wherein the third interval is the same as or narrower than the first interval in which the second gripping portion grips the object.

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