Inspection device and chip manufacturing method

Abstract

The difference in spacing between adjacent chips can be easily confirmed visually. [Solution] An inspection device for inspecting the deviation of each chip from a reference position after a plate-shaped workpiece with tape attached to one side has been divided into a plurality of chips, comprising: a support table that supports an annular frame; an illumination device that irradiates light onto the plurality of chips held by the support table via the frame and tape; an imaging device that images the plurality of chips; a display device; and a controller that controls the imaging device and the display device, wherein the controller has a deviation calculation unit that calculates the amount and direction of deviation of each chip from the reference position in a first direction and a second direction that intersect each other on one side of the workpiece based on images obtained by imaging the plurality of chips with the imaging device; and an evaluation image generation unit that generates an evaluation image in which information indicating the amount and direction of deviation is attached to the image, and the device displays the evaluation image generated by the evaluation image generation unit on the display device.

Description

[Technical Field]

[0001] The present invention relates to an inspection apparatus that inspects deviation from the reference position of each chip after a plate-shaped workpiece having a tape adhered to one surface thereof is divided into a plurality of chips, and a chip manufacturing method for manufacturing a plurality of chips by dividing a plate-shaped workpiece having a tape adhered to one surface thereof into a plurality of chips. [Background Art]

[0002] After a modified region is formed inside a wafer along each of a plurality of planned dividing lines set in a grid pattern on the surface of the wafer, an expandable tape having elasticity and heat shrinkability adhered to the back surface of the wafer and one surface of an annular frame arranged to surround the wafer is expanded substantially isotropically on a predetermined plane, thereby dividing the wafer into a plurality of chips along each planned dividing line. Such a dividing apparatus is known (see, for example, Patent Document 1).

[0003] During dividing, the expandable tape is expanded substantially isotropically on a predetermined plane. However, the expandable tape does not expand completely isotropically over the entire contact area between the expandable tape and the wafer, so the spacing between adjacent chips is usually not completely equal for all chips.

[0004] However, when the spacing between adjacent chips is smaller than a predetermined value, problems may occur such as chip damage due to contact between chips when picking up and conveying the chips, and failure to properly pick up chips from the expandable tape.

[0005] Therefore, for example, it is conceivable to adjust the spacing between adjacent chips by adjusting the expansion amount of the expandable tape. However, since the spacing between adjacent chips is on the order of micrometers, it is impossible for an operator to visually determine whether this spacing is smaller than the predetermined value. In addition, due to non-uniformity in the expansion amount of the expandable tape, the spacing between adjacent chips may differ depending on the position on the expandable tape. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2024-80051 [Overview of the project] [Problems that the invention aims to solve]

[0007] This invention has been made in view of the aforementioned problems, and aims to allow for easy visual confirmation of differences in the spacing between adjacent chips. [Means for solving the problem]

[0008] According to one aspect of the present invention, an inspection device is provided for inspecting the deviation of each chip from a reference position after a plate-shaped workpiece with tape attached to one surface has been divided into a plurality of chips, comprising: a support table supporting an annular frame attached to the tape and arranged so as to surround the plurality of chips; an illumination device having a light source that irradiates light onto the plurality of chips held by the support table via the frame and the tape; an imaging device having an image sensor that images the plurality of chips; a display device; and a controller having a processor and memory that controls the imaging device and the display device, wherein the controller has a deviation calculation unit that calculates the amount and direction of deviation of each chip from the reference position in a first direction and a second direction that intersect each other on the one surface of the workpiece, based on an image obtained by imaging the plurality of chips with the imaging device; and an evaluation image generation unit that generates an evaluation image on which information indicating the amount and direction of deviation is attached to the image, and the inspection device is provided to display the evaluation image generated by the evaluation image generation unit on the display device.

[0009] Preferably, the reference position is determined for each chip by averaging the spacing between adjacent chips in the first direction and averaging the spacing between adjacent chips in the second direction, and is stored in the memory. The displacement calculation unit calculates the amount and direction of displacement for each chip in the first and second directions based on a comparison between the image obtained by imaging the multiple chips and the reference position.

[0010] Preferably, the controller also includes a reference position calculation unit that calculates the reference position for a plurality of device chips manufactured from each of the different workpieces.

[0011] Preferably, the evaluation image generation unit adds color information, which is set in advance according to the amount and direction of the displacement, between adjacent chips in the image obtained by imaging the plurality of chips.

[0012] According to another aspect of the present invention, a method for manufacturing a chip is provided for manufacturing a plurality of chips by dividing a plate-shaped workpiece on which tape is attached to one surface, the method comprising: expanding the tape in a work unit including the workpiece, an annular frame arranged to surround the workpiece, and the tape attached to one surface of the workpiece and one surface of the frame, thereby dividing the workpiece in a first and second direction that intersects with each other on one surface of the workpiece, or expanding the spacing between chips by expanding the tape after dividing the workpiece in the work unit into a plurality of chips; imaging the plurality of chips with an imaging device after the division of the workpiece or expansion of the spacing between chips; a computer calculating the amount and direction of deviation of each chip from a reference position in the first and second directions based on the image obtained by imaging the plurality of chips; the computer generating an evaluation image on which information indicating the amount and direction of deviation is attached to the image; and the computer displaying the evaluation image on a display device.

[0013] Preferably, the chip manufacturing method further comprises the computer calculating the reference position for each chip by averaging the spacing between adjacent chips in a first direction and averaging the spacing between adjacent chips in a second direction, after imaging the plurality of chips and before calculating the amount and direction of the displacement, and in calculating the amount and direction of the displacement, the computer calculates the amount and direction of the displacement for each chip in the first and second directions based on a comparison between the image obtained by imaging the plurality of chips and the reference position.

[0014] Preferably, by calculating the reference position for each chip, the computer calculates the reference position for multiple device chips manufactured from each of the multiple workpieces.

[0015] Preferably, when displaying the evaluation image on the display device, predetermined color information according to the amount and direction of the displacement is displayed between adjacent chips. [Effects of the Invention]

[0016] In an inspection apparatus according to one aspect of the present invention, the controller displays evaluation images on a display device in which information indicating the amount and direction of deviation of each chip from a reference position is attached to images of multiple chips, so that the operator can easily visually confirm the difference in the spacing between adjacent chips.

[0017] In another embodiment of the present invention, the controller displays an evaluation image on a display device in which information indicating the amount and direction of deviation of each chip from a reference position is attached to images of multiple chips, so that the operator can easily visually confirm the difference in the spacing between adjacent chips. [Brief explanation of the drawing]

[0018] [Figure 1] This is a perspective view of the inspection device. [Figure 2] This is a partial cross-sectional side view of the inspection device. [Figure 3] This is a flow diagram illustrating a method for manufacturing device chips. [Figure 4] FIG. 4(A) is a diagram illustrating how a work unit is held by a holding table, and FIG. 4(B) is a diagram illustrating how a workpiece is divided into a plurality of device chips. [Figure 5] FIG. 5(A) is a diagram illustrating a state where expansion of an expand tape has been released, and FIG. 5(B) is a diagram illustrating a state where a region in which slack has occurred in the expand tape is heated. [Figure 6] This is a diagram illustrating how a plurality of device chips are imaged. [Figure 7] This is an example of an original image showing a plurality of device chips. [Figure 8] This is an example of a first processed image in which intersection coordinates, a first X reference line and a first Y reference line are superimposed on the original image. [Figure 9] This is a schematic diagram showing reference positions of a plurality of device chips. [Figure 10] This is a second processed image in which reference positions are superimposed on the original image. [Figure 11] This is an evaluation image in which color information predetermined in accordance with a shift amount and a shift direction is superimposed and displayed on the original image. [Figure 12] This is a diagram for explaining the evaluation image. [Figure 13] FIG. 13(A) is a diagram illustrating how a workpiece is divided into a plurality of device chips by laser processing, and FIG. 13(B) is a diagram illustrating how a workpiece is divided into a plurality of device chips by cutting processing. MODE FOR CARRYING OUT THE INVENTION

[0019] (First Embodiment) An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of an inspection apparatus 2 used in the present embodiment. In FIG. 1, some components of the inspection apparatus 2 are simply shown as functional blocks.

[0020] In this embodiment, the X-axis, Y-axis, and Z-axis directions shown are mutually orthogonal. In this embodiment, the Z-axis direction is substantially parallel to the vertical direction (i.e., downward direction), and the XY plane defined by the mutually orthogonal X-axis and Y-axis directions is substantially parallel to the horizontal plane.

[0021] Furthermore, in this embodiment, the X-axis direction, Y-axis direction, and Z-axis direction are uniquely determined in the inspection device 2. However, the direction along the X-axis direction includes not only the case where it is perfectly parallel to the X-axis direction, but also the case where it intersects the X-axis direction at an angle of less than a predetermined angle (e.g., 10 degrees) and is substantially the same as the X-axis direction. The expression "direction substantially parallel to the X-axis direction" is similar, as are the Y-axis direction and the Z-axis direction.

[0022] The inspection device 2 has a base 4 with a rectangular shape when viewed from above. The base 4 contains a cylindrical cavity inside. A support table 6, which has a rectangular shape larger than the outer shape of the base 4 when viewed from above, is fixed to the base 4.

[0023] The support table 6 includes a circular opening 6a that is concentric with the cavity in the base 4. The top surface 6b of the support table 6 is substantially flat and is positioned substantially parallel to the XY plane. The top surface 6b of the support table 6 is provided with a plurality of protrusions 6c.

[0024] The multiple protrusions 6c include two columnar first protrusions 6c1 arranged in the X-axis direction with the opening 6a in between, and two horizontal beam-shaped second protrusions 6c2 arranged in the Y-axis direction with the opening 6a in between and along the X-axis direction.

[0025] The multiple protrusions 6c position the frame 17 of the chip unit 21 relative to the top surface 6b when the frame 17 is placed on the top surface 6b. However, the multiple protrusions 6c are not essential, and if the frame 17 can be positioned relative to the top surface 6b by other means, the multiple protrusions 6c may be omitted.

[0026] The chip unit 21 shown in Figure 1 has multiple device chips (i.e., chips) 23 manufactured by dividing a disc-shaped (i.e., plate-shaped) workpiece (i.e., workpiece) 11 (see Figure 4(A)) along a planned division line 13 (see Figure 4(B)).

[0027] Here, we will mainly refer to Figures 4(A) and 4(B) to describe the workpiece 11 before division. As shown in Figure 4(A), the workpiece 11 includes a disc-shaped wafer. Note that, for the sake of clarity, the hatching of the workpiece 11 shown in cross-sectional view in Figure 4(A), etc., has been omitted.

[0028] Workpiece 11 is formed from a semiconductor material such as single-crystal silicon, but there are no restrictions on the material, shape, structure, size, etc. of workpiece 11. Workpiece 11 may also be a substrate formed from semiconductors other than silicon (GaAs, SiC, GaN, etc.), diamond, sapphire, glass, ceramics, resin, metal, etc.

[0029] Each workpiece 11 has a circular surface 11a and a back surface (i.e., one side) 11b, and the surface 11a has multiple dividing lines 13 that are perpendicular to each other (i.e., intersect) as shown in Figure 1.

[0030] Each of the multiple rectangular regions demarcated by multiple division lines 13 is provided with a device 15 such as an IC (Integrated Circuit) (see Figure 1). However, there are no restrictions on the type, number, shape, structure, size, or arrangement of the devices 15. The workpiece 11 does not need to have any devices 15.

[0031] An annular metal frame 17 is positioned around the outer periphery of the workpiece 11, and the adhesive surface 19a of an expandable tape (i.e., tape) 19, which has elasticity and heat shrinkability, is attached to the back surface 11b of the workpiece 11 and the back surface (i.e., one side) 17b of the frame 17.

[0032] In other words, the workpiece 11 is supported by the frame 17 via the expandable tape 19. The workpiece 11, frame 17, and expandable tape 19 constitute a workpiece unit 25.

[0033] Furthermore, the surface 11a of the workpiece 11, the adhesive surface 19a of the expandable tape 19, specifically the annular region between the workpiece 11 and the frame 17, and the surface 17a of the frame 17 are exposed upwards (see Figure 1).

[0034] The expanded tape 19 is made of resin and has a laminated structure consisting of an adhesive layer formed of, for example, an ultraviolet (UV) curable acrylic resin and a base layer formed of polyolefin, polyvinyl chloride, or the like.

[0035] The exposed surface of the adhesive layer is the adhesive surface 19a of the expandable tape 19. The exposed surface of the base material layer is the non-adhesive surface 19b, located on the opposite side of the adhesive surface 19a in the thickness direction of the expandable tape 19. The expandable tape 19 does not completely block the light from the light source 8, which will be described later, and can transmit light from the light source 8.

[0036] In this embodiment, modified regions 13a (see Figure 4(A)) with reduced mechanical strength are formed inside the workpiece 11 before division along each planned division line 13. When forming the modified regions 13a, the focal point of a pulsed laser beam having a wavelength that substantially penetrates the workpiece 11 is positioned inside the workpiece 11, and the focal point and the workpiece 11 are moved relative to each planned division line 13.

[0037] For example, if the workpiece 11 has a wafer made of single-crystal silicon, a pulsed laser beam with an average power of 1.0 W, a repetition frequency of 100 kHz, and a wavelength of 1064 nm is used to form modified regions 13a along each planned division line 13. Near the focal point, the crystallinity is modified (i.e., altered) due to multiphoton absorption, and the mechanical strength is reduced compared to the region not passed through the focal point.

[0038] In this manner, after forming a modified region 13a inside the workpiece 11 along the planned division line 13, the expanded tape 19 is expanded approximately isotropically using the expander 40 (see Figure 4(B)). As a result, the workpiece 11 is divided along the planned division line 13, starting from the modified region 13a.

[0039] As shown in Figure 4(A), each planned division line 13 of the workpiece 11 is arranged along a first direction (e.g., the X-axis direction) and a second direction (e.g., the Y-axis direction) that intersect each other on the surface 11a (and back surface 11b), and the workpiece 11 is fractured at each planned division line 13 and divided into a plurality of device chips 23 (see Figures 1 and 4(B)).

[0040] In this embodiment, the first and second directions are orthogonal (i.e., intersect) in the XY plane. After the workpiece 11 is divided, the multiple device chips 23 are located inside the opening of the frame 17 and are arranged so as to be surrounded by the frame 17.

[0041] Incidentally, instead of the modification region 13a, it is also possible to form machining grooves (so-called half-cut grooves) that do not completely cut the workpiece 11 in each planned division line 13, and then use the expander 40 to break and divide the workpiece 11 starting from each machining groove. Note that the use of the expander 40 is not limited to dividing the workpiece 11.

[0042] After dividing the workpiece 11 into multiple device chips 23 by forming machining grooves (so-called full-cut grooves) that completely cut the workpiece 11 on each planned division line 13, the spacing between each device chip 23 may be widened by expanding the spacing of the expanded tape 19 using an expanding device 40.

[0043] Processed grooves such as half-cut grooves and full-cut grooves can be formed, for example, by laser ablation using the laser processing device 62 (see Figure 13(A)) described later, or by cutting using the cutting device 72 (see Figure 13(B)). Now, returning to Figure 1, the configuration of the inspection device 2 will be explained.

[0044] A lighting device 10 is provided in the cavity of the base 4. The lighting device 10 has a light source 8 such as an LED (Light Emitting Diode). The light source 8 in this embodiment emits light in the visible light band. The wavelength used by the light source 8 is not particularly limited as long as the contours of each device chip 23 can be captured by imaging.

[0045] Although the light source 8 shown in Figure 1 is depicted as a point light source, the light source 8 may be a surface light source that illuminates the entirety of the multiple device chips 23 substantially uniformly from below to above.

[0046] The light source 8, which is a surface light source, has multiple LEDs arranged in a circular or rectangular area. In this case, the area illuminated by the light source 8 includes a circle with a diameter defined by the outermost edges of the multiple device chips 23 in an XY plane view. The structure, shape, etc., of the light source 8 are not particularly limited as long as the contours of each device chip 23 can be captured by imaging.

[0047] Furthermore, the light source 8 may have multiple LEDs whose longitudinal portions are arranged along the X-axis, similar to the line sensor 14 described later. In this case as well, the light source 8 is an elongated surface light source (i.e., a line light source), and the area illuminated by the light source 8 has a sufficiently large aspect ratio (X-axis length to Y-axis length) to the X-axis length.

[0048] On the outside of the base 4, a support column 12 is provided, with its longitudinal portion aligned along the Z-axis. At the bottom of the support column 12, a moving mechanism (not shown) is provided for moving the support column 12 along the Y-axis. The moving mechanism may include, for example, a ball screw mechanism.

[0049] The moving mechanism has a pair of guide rails whose longitudinal sections are arranged along the Y-axis. A sliding plate is mounted on the pair of guide rails so as to be slidable along the Y-axis. The bottom of the support column 12 is fixed to the upper surface of the sliding plate.

[0050] Between the pair of guide rails is a screw shaft whose longitudinal portion is aligned along the Y-axis. The screw shaft is rotatably connected to a nut provided on the bottom surface of the slide plate. A drive source, such as a servo motor, is provided at one end of the screw shaft. When the drive source is activated, the support column 12 moves along the Y-axis together with the slide plate.

[0051] The base end of a line sensor (i.e., imaging device) 14, whose longitudinal portion is arranged along the X-axis, is fixed to the side of the top of the support column 12. The line sensor 14 is also called a line scan camera. The line sensor 14 is positioned so as to traverse the opening 6a in the X-axis direction and overlap the top surface 6b of the support table 6 in the Z-axis direction.

[0052] The line sensor 14 has a solid-state image sensor (i.e., an image sensor) 16 that includes a plurality of photoelectric conversion elements arranged along the X-axis. In this embodiment, since multiple device chips 23 are imaged in color, a solid-state image sensor 16 is used in which a plurality of photoelectric conversion elements for blue light, a plurality of photoelectric conversion elements for green light, and a plurality of photoelectric conversion elements for red light are packaged as a single solid-state image sensor.

[0053] However, the line sensor 14 may have a configuration in which, after the light from the subject is spectrally separated by a prism, the light from the subject is guided to multiple photoelectric conversion elements corresponding to each color according to each wavelength band. Of course, the image obtained by imaging is not limited to a color image.

[0054] When imaging multiple device chips 23 with the line sensor 14, first, the frame 17 of the chip unit 21 is positioned on the top surface 6b of the support table 6 using multiple protrusions 6c. At this time, the multiple device chips 23 are supported on the top surface 6b via the expandable tape 19 and the frame 17.

[0055] In this embodiment, the line sensor 14 is moved in the Y-axis direction while the entire device chip 23 is illuminated with light from the light source 8. This allows for imaging of multiple device chips 23 using transmitted light from the light source 8, and an original image (see Figure 7) 30 is obtained.

[0056] In this embodiment, transmitted light is used to image multiple device chips 23, but both the light source 8 and the line sensor 14 may be placed above or below the support table 6, and reflected light may be used to image multiple device chips 23.

[0057] Furthermore, if the light source 8 is a surface light source (i.e., a line light source) with a sufficiently large aspect ratio, and the illumination range of the light from the light source 8 is approximately the same as the light-receiving area of ​​the line sensor 14, the illumination device 10 may be moved in the Y-axis direction in synchronization with the line sensor 14. In this case as well, imaging is possible using transmitted or reflected light.

[0058] Alternatively, the positions of a surface light source (i.e., a line light source) with a sufficiently large aspect ratio and the line sensor 14 may be fixed, and the base 4, support table 6, and chip unit 21 may be moved integrally along the Y-axis to image multiple device chips 23.

[0059] The inspection device 2 of this embodiment, together with the expander 40 described later, constitutes a single splitting and inspection device (not shown). The splitting and inspection device has a metal housing (not shown). The chip unit 21 and the work unit 25 are automatically transported between the inspection device 2 and the expander 40 by a transport device (not shown).

[0060] A touch panel display (i.e., a display device) 20 is provided on the side of the housing of the splitting and inspection device. The touch panel display 20 functions as a display device for displaying images and as an input device for the operator to input instructions to the controller 22.

[0061] Alternatively, a display device without input functionality may be provided instead of the touch panel display 20. In this case, a separate input device (keyboard, mouse, trackball, touchpad, digitizer, etc.) will be provided for the operator to input instructions to the inspection device 2.

[0062] The operation of the lighting device 10, the moving mechanism of the support column 12, the line sensor 14, the touch panel display 20, etc., is controlled by the controller 22. The controller 22 is composed of a computer having, for example, a processor 22a, represented by a CPU (Central Processing Unit), and memory 22b.

[0063] Memory 22b includes main memory such as DRAM (Dynamic Random Access Memory) and auxiliary storage such as flash memory, hard disk drive, and solid-state drive. Software containing a predetermined program is stored in the auxiliary storage. The functions of the controller 22 are realized by operating the processor 22a according to this software.

[0064] Figure 2 is a partial cross-sectional side view of the inspection apparatus 2 illustrating the function of the controller 22. By executing a first program stored in the auxiliary storage device on the processor 22a, the controller 22 functions as a reference position calculation unit 24 that calculates the reference position (see Figures 9 to 12) 32 of each device chip 23.

[0065] In this embodiment, the reference position 32 is a grid of multiple reference lines determined based on an image obtained by capturing multiple device chips 23 with a line sensor 14 (for example, the original image 30 shown in Figure 7), and is used as an indicator of the positional misalignment of the device chips 23.

[0066] To calculate the reference position 32, the reference position calculation unit 24 first obtains the intersection coordinates 13c for all kerfs 13b (see Figure 9) by performing image processing on the original image 30. For example, the reference position calculation unit 24 first extracts the edges of each device chip 23 by edge extraction processing using filters such as a Sobel filter or a Canny filter.

[0067] The edge extraction process allows the coordinates of the edges of each device chip 23 (i.e., the coordinates of both edges that constitute the kerf 13b) to be obtained, so that the intersection coordinates 13c (see Figure 9) of multiple kerfs 13b arranged in a grid can be geometrically calculated. In this way, the reference position calculation unit 24 calculates the intersection coordinates 13c corresponding to the intersection of the kerfs 13b adjacent to each device chip 23.

[0068] Furthermore, the reference position calculation unit 24 similarly extracts a circle defined by the outermost edge of all device chips 23 using image processing, and identifies the coordinates of the center of this outermost circle. The reference position calculation unit 24 then calculates the first X reference line 32X1 and the first Y reference line 32Y1 that pass through the intersection coordinates 13c1 closest to these center coordinates (see Figure 8).

[0069] Furthermore, when calculating the first X reference line 32X1, the reference position calculation unit 24 calculates the average of the inclination angles with respect to the X axis of all line segments defined by the coordinates of two adjacent intersection points 13c along the X axis, and determines the orientation of the first X reference line 32X1 such that it forms this average inclination angle with respect to the X axis.

[0070] Similarly, when calculating the first Y reference line 32Y1, the reference position calculation unit 24 calculates the average of the inclination angles with respect to the Y axis of all line segments defined by the coordinates of two adjacent intersection points 13c along the Y axis, and determines the orientation of the first Y reference line 32Y1 such that it forms this average inclination angle with respect to the Y axis.

[0071] Next, the reference position calculation unit 24 obtains the interval 34x (see Figure 9) between adjacent device chips 23 in the X-axis direction, and then calculates the average value of the intervals 34x by averaging all of them. Similarly, it obtains the interval 34y (see Figure 9) between adjacent device chips 23 in the Y-axis direction, and then calculates the average value of the intervals 34y by averaging all of them.

[0072] Then, using the average value of the interval 34x as the first index amount, multiple second X reference lines 32X2 (see Figure 9) are calculated, each separated from the first X reference line 32X1 by 1, 2, 3...N times (where N is a natural number greater than or equal to 2) the first index amount. It is assumed that all second X reference lines 32X2 are parallel to the first X reference line 32X1.

[0073] Similarly, using the average value of the interval 34y as the second index quantity, multiple second Y reference lines 32Y2 (see Figure 9) are calculated, each separated from the first Y reference line 32Y1 by 1, 2, 3...M times (where M is a natural number greater than or equal to 2) the second index quantity. It is assumed that all second Y reference lines 32Y2 are parallel to the first Y reference line 32Y1.

[0074] As a result, a reference position 32 including a first X reference line 32X1, a first Y reference line 32Y1, multiple second X reference lines 32X2, and multiple second Y reference lines 32Y2 is defined for each device chip 23 (see Figures 9 to 12), and the defined reference position 32 is stored in memory 22b.

[0075] In this specification, for the sake of clarity, we use terms such as the first X reference line 32X1, the first Y reference line 32Y1, the interval 34x, the interval 34y, the second X reference line 32X2, and the second Y reference line 32Y2. However, these lines and intervals do not necessarily have to be parallel to the X-axis or Y-axis direction of the inspection device 2.

[0076] By executing a second program stored in auxiliary storage device on processor 22a, controller 22 functions as a displacement calculation unit 26 that calculates the amount and direction of displacement of each device chip 23 from the reference position 32. The amount and direction of displacement are vector quantities of displacement.

[0077] Incidentally, when imaging is performed by the inspection device 2, the surface of the device chip 23 corresponding to the surface 11a of the workpiece 11 and the back surface of the device chip 23 corresponding to the back surface 11b of the workpiece 11 are arranged approximately parallel to the XY plane in each device chip 23.

[0078] During the splitting process, the expandable tape 19 is expanded approximately isotropically in the XY plane. However, since the expandable tape 19 does not expand perfectly isotropically across the entire contact area between the expandable tape 19 and the workpiece 11, the spacing between adjacent device chips 23 is not always equal across all device chips 23.

[0079] Therefore, the displacement calculation unit 26 calculates the amount of displacement and the direction of displacement (i.e., displacement vector) of each device chip 23 in the X-axis and Y-axis directions based on a comparison of the original image 30 and the reference position 32 described above.

[0080] Specifically, the displacement calculation unit 26 first obtains the displacement amount and displacement direction of the reference line intersection point 32A (marked with an "x" in Figure 9), which is the intersection point of the first X reference line 32X1 or the second X reference line 32X2 and the first Y reference line 32Y1 or the second Y reference line 32Y2, as well as the coordinates 13c of each intersection point. This displacement amount and displacement direction will be reflected in the evaluation image 38 (see Figure 11), which will be described later.

[0081] By executing a third program stored in the auxiliary storage device on the processor 22a, the controller 22 functions as an evaluation image generation unit 28 that generates an evaluation image 38 in which information indicating the amount and direction of displacement is attached to the original image 30.

[0082] Specifically, the evaluation image generation unit 28 generates an evaluation image 38 by adding pre-set color information, according to the amount and direction of displacement, between adjacent device chips 23 in the original image 30.

[0083] For example, the evaluation image generation unit 28 numerically converts the amount of deviation of the intersection coordinate 13c relative to the reference line intersection 32A into a color intensity (for example, the transparency of a predetermined color, i.e., transmittance). More specifically, a larger deviation results in the selection of a darker color (for example, lower transparency), while a smaller deviation results in the selection of a lighter color (for example, higher transparency).

[0084] Furthermore, the evaluation image generation unit 28 converts the displacement direction into color information by using a first color when the displacement direction is along the X-axis, and a second color different from the first color when the displacement direction is along the Y-axis. Typically, the first and second colors have different hues, but two or more of the hue, saturation, and lightness may also differ.

[0085] In this embodiment, if the intersection coordinate 13c is shifted away from the second X reference line 32X2 (or the second Y reference line 32Y2) (i.e., outward), this shift is shown in blue, and if it is shifted towards the intersection coordinate 13c1 (i.e., inward) from the second X reference line 32X2 (or the second Y reference line 32Y2), this shift is shown in red.

[0086] There are several options for the coloring method, but in this embodiment, the deviation of intersection coordinate 13c from the second X reference line 32X2, excluding intersection coordinate 13c1, is represented by coloring a line segment that extends from intersection coordinate 13c in one direction along the Y axis (specifically, the -Y direction) by an average value of interval 34y (i.e., the second index amount).

[0087] Furthermore, in this embodiment, the deviation of intersection coordinates 13c (excluding intersection coordinate 13c1) from the second Y reference line 32Y2 is represented by coloring a line segment that extends from intersection coordinate 13c in one direction along the X axis (specifically, in the +X direction) by an average value of intervals 34x (i.e., the first index amount).

[0088] Of course, there are multiple options for which line segments should be used to represent the X-axis and Y-axis displacements, and the examples above are not the only ones that can be used. The X-axis displacement could be represented by coloring a line segment that extends in the +X direction by the average value of the interval 34x, and the Y-axis displacement could be represented by coloring a line segment that extends in the -Y direction by the average value of the interval 34y.

[0089] The controller 22 displays the evaluation image 38 on the touch panel display 20. This allows the operator to inspect the deviation of each device chip 23 from the reference position 32, and to easily visually confirm the differences in the spacing between adjacent device chips 23 for all device chips 23 manufactured from a single workpiece 11.

[0090] In the annotated image (see Figure 12) of evaluation image 38 (see Figure 11), the clock position is represented as follows: in the area R1 near 11 o'clock, 12 o'clock, and 1 o'clock, and in the area R2 near 4 o'clock, 5 o'clock, and 6 o'clock, a relatively large amount of displacement along the X-axis occurs inward from the reference position 32.

[0091] If such a discrepancy occurs, one or more of the following items (i) to (iii) are adjusted when the workpiece 11 handled thereafter is divided by the expander 40. This makes the spacing between adjacent device chips 23 more uniform.

[0092] (i) the amount of expansion of the expandable tape 19 when it is expanded approximately isotropically, (ii) the range over which the expandable tape 19 is partially heated after expansion to shrink any areas where sagging occurs, and (iii) the orientation of the expandable tape 19 relative to the workpiece 11 (i.e., the TD (Transvers Direction) direction and the MD (Mold Direction) direction).

[0093] Next, a method for manufacturing the device chip 23 will be described with reference to Figures 3 to 12. Figure 3 is a flowchart showing a method for manufacturing a device chip 23, in which an expanded tape 19 is attached to the back surface 11b of a workpiece 11, and multiple device chips 23 are manufactured by dividing the workpiece 11.

[0094] In this embodiment, each step is performed in the order of S10 to S70. In this embodiment, for each of the multiple workpieces 11, the workpiece 11 is divided and the evaluation image 38 is displayed on the touch panel display 20.

[0095] In the splitting process S10, which divides the workpiece 11, an expander 40 (see Figure 4(A)) is used. In this embodiment, the expander 40 is housed in the same enclosure (not shown) as the inspection device 2 described above, but it may be a device that is separately separated from the inspection device 2.

[0096] As shown in Figure 4(A), the expander 40 has a disc-shaped holding table 42. The upper surface of the holding table 42 is substantially flat and is positioned substantially parallel to the XY plane.

[0097] A porous plate is exposed on the upper surface of the holding table 42, to which negative pressure is transmitted from a suction source (not shown), such as an ejector or vacuum pump, and functions as a holding surface 42a that holds the workpiece 11 by suction via the expanded tape 19.

[0098] Multiple rollers 44 (for example, three or more) are arranged at approximately equal intervals along the circumferential direction of the holding surface 42a on the outer periphery of the holding table 42. The upper end of each roller 44 is located at approximately the same height as the holding surface 42a.

[0099] The holding table 42 is configured to be movable in the Z-axis direction by an actuator 46 such as an air cylinder. An annular frame support base 48 for supporting the frame 17 is provided on the outer circumference of the holding table 42.

[0100] The upper surface of the frame support base 48 is substantially flat and is positioned substantially parallel to the XY plane. The outer shape of the frame support base 48 is a rectangle larger than the outer shape of the frame 17, and a circular opening with a larger diameter than the holding table 42 is provided in the center of the frame support base 48.

[0101] Actuators 50, such as air cylinders, are provided at the four corners of the lower surface of the frame support base 48 to move the frame support base 48 in the Z-axis direction. Above the frame support base 48, a frame retaining member 52 is provided that is movable along the horizontal plane.

[0102] The lower surface of the frame retaining member 52 is substantially flat and is positioned substantially parallel to the XY plane. The lower surface of the frame retaining member 52 has substantially the same shape and size as the upper surface of the frame support base 48.

[0103] Above the frame support base 48, a heating unit 54 (see Figure 5(B)) is provided in a manner that does not interfere with the frame retaining member 52. The heating unit 54 has a shaft portion 56 arranged along the Z-axis direction.

[0104] The shaft portion 56 is configured to be movable along the Z-axis direction by an actuator such as an air cylinder, and to be rotatable around a rotation axis 56a parallel to the Z-axis direction by a drive source such as a servo motor. The lower end of the shaft portion 56 is fixed to the center of the upper surface of a disc-shaped base 58.

[0105] Multiple heaters 60 (for example, two) are provided on the outer periphery of the lower surface of the base 58. The multiple heaters 60 are arranged at approximately equal intervals along the circumferential direction of the base 58. The heaters 60 may not be individually separated but may form a continuous annular shape on the outer periphery of the lower surface of the base 58.

[0106] Each heater 60 receives power supplied from a power supply unit (not shown) and emits electromagnetic waves such as infrared rays downwards. The area of ​​the expandable tape 19 from which electromagnetic waves are emitted by the heaters 60 undergoes thermal contraction.

[0107] The division process S10 will be explained with reference to Figures 4(A) to 5(B). First, the holding surface 42a of the holding table 42 and the upper surface of the frame support base 48 are set to the same height in the Z-axis direction. Next, the workpiece 11 is held by the holding table 42 by suction via the expandable tape 19, and the frame 17 is placed on the frame support base 48.

[0108] Subsequently, the frame retaining member 52 is moved directly above the frame support base 48, and the frame 17 is clamped and fixed in the Z-axis direction by the frame support base 48 and the frame retaining member 52. Figure 4(A) shows the work unit 25 being held by the holding table 42.

[0109] Next, as shown in Figure 4(B), the expandable tape 19 is expanded by raising the holding table 42 relative to the frame support base 48. As the expandable tape 19 expands radially, a tensile force is transmitted to the workpiece 11 in a direction approximately parallel to the XY plane.

[0110] This external force causes the workpiece 11 to fracture starting from the modified region 13a, dividing it into multiple device chips 23. Figure 4(B) shows the process of dividing the workpiece 11 into multiple device chips 23. The amount and speed at which the holding table 42 rises are set appropriately according to the material and thickness of the workpiece 11, the number of planned division lines 13, etc.

[0111] After the workpiece 11 is divided, the support table 6 is lowered and returned to the position before it was raised, as shown in Figure 4(A). At this time, the expansion of the expandable tape 19 is released, causing slack 19c in the expandable tape 19 in the annular region between the multiple device chips 23 and the frame 17 (see Figure 5(A)).

[0112] Figure 5(A) shows the expanded state of the expanded tape 19 after it has been released by lowering the holding table 42 relative to the frame support base 48. After releasing the expanded tape 19, the frame retaining member 52 is moved to a position where it does not overlap with the frame support base 48 in the Z-axis direction, and then the heating unit 54 is lowered to bring it closer to the expanded tape 19.

[0113] By rotating the shaft portion 56 while radiating electromagnetic waves from each heater 60, the area of ​​the expanded tape 19 where slack 19c has occurred is heated. The expanded tape 19 contracts as the slack 19c is eliminated by the heating. Figure 5(B) shows the heating of the area of ​​the expanded tape 19 where slack 19c has occurred.

[0114] Furthermore, the controller (not shown) of the expander 40 can operate all the heaters 60 in the same way, or it can operate only specific heaters 60. For example, by emitting electromagnetic waves from only one heater 60 and rotating the shaft 56, it is possible to selectively contract a region in the expander tape 19 where a large amount of displacement has occurred.

[0115] After the division process S10, all device chips 23 that are spaced apart from each other with the kerf 13b in between are imaged by the line sensor 14 (imaging process S20). Figure 6 shows the process of imaging multiple device chips 23.

[0116] In this embodiment, with light irradiated upward from the light source 8, the line sensor 14 is moved from one end to the other of the opening 6a in the Y-axis direction, thereby using transmitted light to image multiple device chips 23 and obtain the original image 30. Figure 7 is an example of the original image 30 showing multiple device chips 23.

[0117] After acquiring the original image 30, the reference position calculation unit 24 calculates the reference position 32 based on the original image 30 (reference position calculation step S30). As described above, the reference position calculation unit 24 first calculates the intersection coordinates 13c1, the first X reference line 32X1, and the first Y reference line 32Y1 (see Figure 8). Figure 8 is an example of a first processed image 34 in which the intersection coordinates 13c1, the first X reference line 32X1, and the first Y reference line 32Y1 are superimposed on the original image 30.

[0118] Next, the reference position calculation unit 24 calculates a reference position 32 that includes multiple second X reference lines 32X2 parallel to the first X reference line 32X1, and multiple second Y reference lines 32Y2 parallel to the first Y reference line 32Y1 (see Figures 9 and 10).

[0119] Furthermore, the reference position calculation unit 24 obtains the intervals 34x between adjacent device chips 23 in the X-axis direction, calculates the average value in the X-axis direction by averaging all the intervals 34x, and obtains the intervals 34y between adjacent device chips 23 in the Y-axis direction, calculates the average value in the Y-axis direction by averaging all the intervals 34y.

[0120] Figure 9 is a schematic diagram showing the reference positions 32 of multiple (3x3) device chips 23, and Figure 10 is a second processed image 36 in which the reference positions 32 are superimposed on the original image 30.

[0121] After the reference position 32 is calculated, the displacement calculation unit 26 calculates the amount of displacement and the direction of displacement of each device chip 23 from the reference position 32 (displacement calculation step S40). That is, the displacement calculation unit 26 calculates the amount of displacement and the direction of displacement of each device chip 23 in the X-axis and Y-axis directions based on a comparison between the original image 30 and the reference position 32.

[0122] After the displacement calculation unit 26 calculates the displacement amount and displacement direction, the evaluation image generation unit 28 generates an evaluation image 38 (see Figure 11) in which the information indicating the displacement amount and displacement direction is attached to the original image 30 (evaluation image generation step S50).

[0123] As described above, the evaluation image generation unit 28 generates an evaluation image 38 by adding pre-set color information, according to the amount and direction of displacement, between adjacent device chips 23 in the original image 30. After the evaluation image 38 is generated, the controller 22 displays the evaluation image 38 on the touch panel display 20 (evaluation image display step S60).

[0124] Figure 11 shows an evaluation image 38 in which predetermined color information, according to the amount and direction of displacement, is superimposed on the original image 30 between adjacent device chips 23, and Figure 12 is a diagram illustrating the evaluation image 38.

[0125] As shown in Figure 12, in the area R1 shown by the dashed line near 11 o'clock, 12 o'clock, and 1 o'clock, and in the area R2 shown by the dashed line near 4 o'clock, 5 o'clock, and 6 o'clock, the intersection coordinate 13c is shifted inward from the nearest first X reference line 32X1 or second X reference line 32X2.

[0126] In other words, the intersection coordinate 13c is shifted so as to approach the intersection coordinate 13c1, with reference to the nearest first X reference line 32X1 or second X reference line 32X2. Furthermore, within ranges R1 and R2, the amount of shift in the outer periphery close to frame 17 is particularly large compared to the amount of shift near the center of the evaluation image 38.

[0127] Furthermore, in the dashed area R3 near 2 o'clock and 3 o'clock, the intersection coordinate 13c is shifted outward from the nearest first X reference line 32X1 or second X reference line 32X2.

[0128] In other words, the intersection coordinate 13c is shifted away from the intersection coordinate 13c1 with respect to the nearest first X reference line 32X1 or second X reference line 32X2. Furthermore, within the range R3, the amount of shift in the outer periphery close to frame 17 is particularly large compared to the amount of shift near the center of the evaluation image 38.

[0129] In this embodiment, the operator can inspect the deviation of each device chip 23 from the reference position 32, and can also easily visually confirm the difference in spacing between adjacent device chips 23 using the evaluation image 38. Therefore, the processing conditions can be optimized when dividing the workpiece 11 using the expander 40 the next time.

[0130] Optimizing these processing conditions reduces the possibility of device chips 23 coming into contact with each other and being damaged during pickup, and also leads to the proper pickup of device chips 23.

[0131] If, after the evaluation image display step S60, the same process from the division step S10 to the evaluation image display step S60 is performed for another workpiece 11 (YES in S70), the process returns to the division step S10. Conversely, if no processing is performed for the other workpiece 11 (NO in S70), the flow terminates.

[0132] In this embodiment, since the inspection device 2 and the expander 40 are housed in the same enclosure, the operator can avoid the trouble of removing the chip unit 21 from the expander 40 and transporting it to the inspection device 2. In addition, the automatically generated evaluation image 38 can be viewed, which offers the advantage of superior convenience.

[0133] Incidentally, in the reference position calculation step S30 of this embodiment, the reference position 32 is calculated for each of the multiple device chips 23 manufactured from each of the multiple different workpieces 11, each time the workpiece 11 is divided. This allows for the accumulation and statistical evaluation of the evaluation for each workpiece 11, which contributes to the optimization of processing conditions.

[0134] Alternatively, assuming that a workpiece 11 of the same diameter and a division process S10 with the same processing conditions are applied, the reference position calculation process S30 may be omitted, and in the deviation calculation process S40, a predetermined reference position 32 stored in memory 22b may be used.

[0135] (Second Embodiment) Next, a second embodiment will be described with reference to Figure 13(A). Figure 13(A) shows the laser dicing process in which a workpiece 11 is divided into multiple device chips 23 by laser processing using a laser processing device 62.

[0136] Note that in Figure 13(A), the dicing tape attached to the back surface 11b of the workpiece 11 and the annular frame 17, which is positioned to surround the outer periphery of the workpiece 11 and has dicing tape attached to its back surface 17b, are omitted.

[0137] Unlike the expandable tape 19, the dicing tape is typically replaced with the expandable tape 19 after laser processing by tape replacement. However, the expandable tape 19 may also be used as the dicing tape.

[0138] The laser processing apparatus 62 comprises a laser beam irradiation unit 64 having a laser medium, an excitation light source, a predetermined optical system (none of which are shown), and a head section 66 including a focusing lens. A pulsed laser beam L having a wavelength absorbed by the workpiece 11 is irradiated from the head section 66.

[0139] A disc-shaped chuck table 68 is provided below the head portion 66. The chuck table 68 has a frame and a porous plate, and holds the workpiece 11 by suction through the negative pressure transmitted to the circular holding surface.

[0140] During laser processing, first, the workpiece unit 25 (note that only the workpiece 11 is shown in Figure 13(A)) is held in place by suction using the chuck table 68 so that the surface 11a is exposed, and the focusing point of the laser beam L is positioned at one end of the planned dividing line 13.

[0141] Next, the chuck table 68 and the focal point of the laser beam L are moved relative to each other so that the focal point moves along the division line 13, thereby forming a full-cut groove (i.e., a kerf 13b) on the division line 13. By similarly forming a full-cut groove on each division line 13, the workpiece 11 is divided into multiple device chips 23.

[0142] After the workpiece 11 is divided, the expansion tape 19 is expanded using the expansion device 40 to widen the spacing between the device chips 23. In this way, the division of the workpiece 11 in the laser processing device 62 and the widening of the spacing between the device chips 23 in the expansion device 40 may be replaced with the division step S10 shown in Figure 3.

[0143] (Third Embodiment) Next, a third embodiment will be described with reference to Figure 13(B). Figure 13(B) shows the blade dicing process in which the workpiece 11 is divided into multiple device chips 23 by cutting by the cutting device 72.

[0144] In Figure 13(B), the dicing tape attached to the back surface 11b of the workpiece 11 and the annular frame 17, which is positioned to surround the outer periphery of the workpiece 11 and has dicing tape attached to its back surface 17b, are omitted.

[0145] Unlike the expanded tape 19, the dicing tape is typically replaced with the expanded tape 19 after machining by replacing the tape. However, the expanded tape 19 may also be used as the dicing tape.

[0146] The cutting device 72 includes a cutting unit 74 having a spindle 76 and a cutting blade 78 mounted on the tip of the spindle 76. Below the cutting unit 74, a disc-shaped chuck table 80 is provided.

[0147] During the cutting process, first, the workpiece unit 25 (note that only the workpiece 11 is shown in Figure 13(B)) is held by suction using the chuck table 80 so that the surface 11a is exposed. Next, the lower end of the cutting edge of the cutting blade 78, which rotates at high speed, is positioned between the holding surface of the chuck table 80 and the back surface 11b of the workpiece 11.

[0148] Then, while supplying cutting fluid such as pure water to the contact area between the cutting edge of the cutting blade 78 and the workpiece 11, the chuck table 80 and the cutting unit 74 are moved relative to each other so that the cutting blade 78 moves along the planned division line 13, thereby forming a full cut groove (i.e., kerf 13b) along the planned division line 13.

[0149] Similarly, by forming full-cut grooves on all planned division lines 13, the workpiece 11 is divided into multiple device chips 23. After the workpiece 11 is divided, the expansion tape 19 is expanded using the expansion device 40 to widen the spacing between the device chips 23. In this way, the division of the workpiece 11 by the cutting device 72 and the widening of the spacing between the device chips 23 by the expansion device 40 may be replaced with the division process S10 shown in Figure 3.

[0150] Furthermore, the structures, methods, etc., according to the embodiments described above can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of Symbols]

[0151] 2: Inspection device, 4: Base, 6: Support table 6a: opening, 6b: top surface, 6c: protrusion, 6c1: first protrusion, 6c2: second protrusion 8: Light source, 10: Lighting device 11: Workpiece, 11a: Front side, 11b: Back side (one side) 12: Support pillar 13: Planned splitting line, 13a: Modified region, 13b: Calf 13c,13c1,13c2,13c3,13c4: Intersection coordinates 14: Line sensor (imaging device), 16: Solid-state image sensor (image sensor) 15: Device, 17: Frame, 17a: Front, 17b: Back (one side) 19: Expandable tape (tape) 19a: Adhesive surface, 19b: Non-adhesive surface, 19c: Slack 20: Touch panel display (display device) 21: Chip Unit 22: Controller (computer), 22a: Processor, 22b: Memory 23: Device chip (chip) 24: Reference position calculation unit, 26: Shift calculation unit, 28: Evaluation image generation unit 25: Work Unit 30: Original image 32: Reference position, 32A: Reference line intersection 32X1: 1st X reference line, 32Y1: 1st Y reference line 32X2: 2nd X reference line, 32Y2: 2nd Y reference line 34: First processed image, 36: Second processed image, 38: Evaluation image 40: Expanding device, 42: Holding table, 42a: Holding surface, 44: Roller 46: Actuator 48: Frame support base, 50: Actuator, 52: Frame retaining member 54: Heating unit, 56: Shaft, 56a: Rotating shaft, 58: Base, 60: Heater 62: Laser processing equipment 64: Laser beam irradiation unit, 66: Head unit, 68: Chuck table L: Laser beam R1, R2, R3: Range 72: Cutting equipment 74: Cutting unit, 76: Spindle, 78: Cutting blade, 80: Chuck table S10: Segmentation process, S20: Imaging process S30: Reference position calculation process, S40: Deviation calculation process S50: Evaluation image generation process, S60: Evaluation image display process

Claims

1. An inspection device for inspecting the deviation of each chip from a reference position after a plate-shaped workpiece with tape attached to one side has been divided into multiple chips, A support table that supports an annular frame attached to the tape and arranged to surround the plurality of chips, A lighting device having a light source that irradiates light onto the plurality of chips held by the support table via the frame and the tape, An imaging device having an image sensor and imaging multiple chips, Display device and A controller having a processor and memory, which controls the imaging device and the display device, Equipped with, The controller is, A displacement calculation unit calculates the amount and direction of displacement of each chip from the reference position in a first and second direction that intersect each other on one surface of the workpiece, based on images obtained by imaging the plurality of chips with the imaging device. It includes an evaluation image generation unit that generates an evaluation image on which information indicating the amount and direction of the displacement is attached to the image, An inspection apparatus characterized by displaying the evaluation image generated by the evaluation image generation unit on the display device.

2. The reference position is determined for each chip by averaging the spacing between adjacent chips in the first direction and averaging the spacing between adjacent chips in the second direction, and is stored in the memory. The inspection apparatus according to claim 1, characterized in that the displacement calculation unit calculates the amount of displacement and the direction of displacement of each chip in the first and second directions based on a comparison of the image obtained by imaging the plurality of chips with the reference position.

3. The inspection apparatus according to claim 2, characterized in that the controller has a reference position calculation unit that calculates the reference position for a plurality of device chips manufactured from each of the different workpieces.

4. The inspection apparatus according to any one of claims 1 to 3, characterized in that the evaluation image generation unit adds color information, which is set in advance according to the amount of displacement and the direction of displacement, between adjacent chips in the image obtained by imaging the plurality of chips.

5. A method for manufacturing chips, which involves dividing a plate-shaped workpiece with tape attached to one side to produce multiple chips, By expanding the tape in a work unit including the workpiece, an annular frame arranged to surround the workpiece, and the tape attached to one surface of the workpiece and one surface of the frame, the workpiece is divided in a first and second direction that intersects with each other on one surface of the workpiece, or by expanding the tape after dividing the workpiece in the work unit into a plurality of chips, the spacing between each chip is expanded. After dividing the workpiece or widening the spacing between each chip, the multiple chips are imaged using an imaging device. The computer calculates the amount and direction of displacement of each chip from its reference position in the first and second directions based on the images obtained by imaging the multiple chips. The computer generates an evaluation image to which information indicating the amount and direction of the displacement is attached, The computer causes the evaluation image to be displayed on a display device, A method for manufacturing chips, characterized by comprising the following features.

6. After imaging the plurality of chips and before calculating the amount and direction of the displacement, the computer further comprises calculating the reference position for each chip by averaging the spacing between adjacent plurality of chips in the first direction and averaging the spacing between adjacent plurality of chips in the second direction. The method for manufacturing a chip according to claim 5, characterized in that the computer calculates the amount of displacement and the direction of displacement of each chip in the first and second directions based on a comparison between the image obtained by imaging the plurality of chips and the reference position.

7. The method for manufacturing a chip according to claim 6, characterized in that by calculating the reference position for each chip, the computer calculates the reference position for a plurality of device chips manufactured from each of the plurality of workpieces.

8. The method for manufacturing a chip according to any one of 5 to 7, characterized in that, when the evaluation image is displayed on the display device, predetermined color information according to the amount and direction of the displacement is displayed between adjacent chips.

Images