Plasma devices

Abstract

Providing plasma devices. [Solution] This disclosure provides a plasma device. The plasma device comprises a chamber base having a first opening in its top wall, a dielectric tube located above the chamber base and sealed and fitted to the chamber base such that the internal space of the dielectric tube communicates with the internal space of the chamber base through the first opening, a coil assembly fitted to the outside of the dielectric tube, and a cooling tube located between the dielectric tube and the coil assembly and having a predetermined gap between itself and the dielectric tube, the cooling tube being provided with an intake hole for introducing cooling gas, the cooling tube having a first layer tube wall and a second layer tube wall, the first layer tube wall being located on the inside of the second layer tube wall facing the dielectric tube, a guide channel being formed between the first layer tube wall and the second layer tube wall, and a plurality of exhaust holes being provided in the first layer tube wall, the exhaust holes and intake holes each communicating with the guide channel.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor devices, and in particular to plasma devices.

Background Art

[0002] In the related art, ICP (Inductively Coupled Plasma) plasma etching devices and ashing devices for removing photoresist are important process devices in the manufacturing process of semiconductor chips, and remote plasma technology is widely applied to the above-mentioned devices. Remote plasma technology aims to generate plasma in a region far away from a wafer, and process the wafer after the plasma reaches the wafer region. However, high temperature is generated in the process of generating plasma.

Summary of the Invention

Problem to be Solved by the Invention

[0003] The present disclosure provides a plasma device capable of dissipating heat from a dielectric tube and lowering the temperature of the dielectric tube.

Means for Solving the Problem

[0004] As one embodiment of the present invention, an embodiment of the present disclosure provides a plasma device comprising: a chamber base having a first opening in its top wall; a dielectric tube located above the chamber base and sealed and fitted to the chamber base such that the internal space of the dielectric tube communicates with the internal space of the chamber base through the first opening; a coil assembly fitted to the outside of the dielectric tube; and a cooling tube located between the dielectric tube and the coil assembly and having a predetermined gap between itself and the dielectric tube, wherein the cooling tube is provided with an intake hole for introducing cooling gas, and the cooling tube comprises a first layer tube wall and a second layer tube wall The cooling tube comprises a first layer tube wall located on the inside of the second layer tube wall facing the dielectric tube, a guide channel formed between the first layer tube wall and the second layer tube wall, a plurality of exhaust holes provided in the first layer tube wall, the exhaust holes and intake holes each communicating with the guide channel, some of the exhaust holes distributed at intervals in the axial direction of the cooling tube, and some of the exhaust holes distributed at intervals in the circumferential direction of the cooling tube, wherein, due to the guidance of the guide channel, the cooling gas flowing in from the intake holes can flow toward the plurality of exhaust holes, and after being discharged from the exhaust holes, flows into the predetermined gap so as to dissipate heat from the dielectric tube.

[0005] In some embodiments, the cooling tube includes a vertical segment extending axially along the cooling tube and a bent segment connected to the vertical segment and extending away from the dielectric tube, wherein the bent segment is provided with the intake holes, and at least a portion of the guide channel is located in the vertical segment.

[0006] In some embodiments, the diameter of the exhaust port gradually increases along the direction from bottom to top.

[0007] In some embodiments, the distribution density of the exhaust holes gradually increases along the direction from bottom to top.

[0008] In some embodiments, the diameter of the exhaust port is 5 mm or less.

[0009] In some embodiments, the preset gap between the cooling tube and the dielectric tube is 5 mm or less.

[0010] In some embodiments, the cooling tube is provided with a plurality of the elongated holes, the longitudinal direction of the elongated holes is parallel to the axial direction of the cooling tube, at least two of the elongated holes are distributed at intervals in the circumferential direction of the cooling tube, and the first layer tube wall is provided with the exhaust holes in the portion located between two adjacent elongated holes in the circumferential direction of the cooling tube.

[0011] In some embodiments, the cooling tube is made of a metallic material, or the cooling tube is made of a dielectric material.

[0012] In some embodiments, the cooling tube is detachably connected to the chamber base.

[0013] In some embodiments, the plasma device further comprises a cover plate covering one end of the dielectric tube away from the chamber base, and an intake device, wherein the intake line of the intake device is an intake device into which the cover plate is inserted.

[0014] According to the plasma device provided by the embodiments of this disclosure, the cooling gas that flows in through the intake port of the cooling tube, is guided through the guide channel to the exhaust port, and is then discharged to the dielectric tube can dissipate heat from the dielectric tube, thereby lowering the temperature of the dielectric tube and improving or avoiding the problem of the dielectric tube melting due to high temperature. Furthermore, by reducing the temperature difference inside the dielectric tube, the temperature uniformity of the dielectric tube can be improved, improving or avoiding the problem of the dielectric tube rupturing due to excessively large temperature differences.

[0015] It should be understood that the information contained herein is not intended to describe any key points or important features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Further details of other features of this disclosure will be provided in the specification below.

[0016] The attached drawings are provided to better understand the solutions of this disclosure and do not limit this disclosure. [Brief explanation of the drawing]

[0017] [Figure 1] This is a schematic diagram showing the configuration of a plasma device according to an embodiment of the present disclosure. [Figure 2] This is a schematic diagram of a partial cross-section of a plasma device according to an embodiment of the present disclosure. [Figure 3] This is a schematic perspective view of a cooling tube according to an embodiment of the present disclosure. [Figure 4] This is a schematic cross-sectional view of a cooling tube according to an embodiment of the present disclosure. [Modes for carrying out the invention]

[0018] Hereinafter, exemplary embodiments of the present disclosure will be described in conjunction with the drawings. Various details of the embodiments of the present disclosure are included herein for the sake of clarity and should be considered as illustrative only. Accordingly, those skilled in the art should be aware that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, in order to be clear and concise, descriptions of known functions and structures will be omitted in the following description.

[0019] In the related art, a plasma device includes a chamber base body, a dielectric tube and a coil assembly, wherein the chamber base body is provided with a wafer region, the dielectric tube is provided with an ion excitation region, and the coil assembly is located outside the dielectric tube. There is a certain distance between the ion excitation region and the wafer region, and in order to achieve the required concentration of excited-state components on the wafer surface, large power is used to excite plasma generation. When energy is supplied to the coil assembly, the plasma concentration in the region corresponding to the coil in the coil assembly becomes the highest, and ions bombard the dielectric tube, causing the temperature of the dielectric tube to rise, which in turn leads to problems such as melting of the dielectric tube. In addition, since the coil is helical, the coil is not uniformly distributed relative to the dielectric tube, which deteriorates the temperature uniformity of the dielectric tube, and further causes problems such as rupture of the dielectric tube.

[0020] In order to overcome the above problems, the present embodiment provides a plasma device, wherein a cooling pipe is arranged outside the dielectric tube, heat is dissipated from the dielectric tube by cooling gas flowing into the cooling pipe, so as to lower the temperature of the dielectric tube, thereby improving or avoiding the problem of melting of the dielectric tube caused by high temperature; furthermore, by reducing the temperature difference inside the dielectric tube, the temperature uniformity of the dielectric tube is improved, and the problem of rupture of the dielectric tube caused by an excessively large temperature difference can be improved or avoided.

[0021] Hereinafter, with reference to the drawings, the configuration, functions and implementation process of the plasma device provided by the present embodiment will be described by way of examples.

[0022] FIG. 1 is a schematic cross-sectional view of a plasma device according to an embodiment of the present disclosure (the cross-section is taken along a vertical plane passing through the central axis of the plasma device), FIG. 2 is a schematic partial cross-sectional view of a coil assembly, a cooling pipe and a dielectric tube according to an embodiment of the present disclosure, FIG. 3 is a schematic perspective view of a cooling pipe according to an embodiment of the present disclosure, and FIG. 4 is a schematic cross-sectional view of a cooling pipe according to an embodiment of the present disclosure (the cross-section is taken along a vertical plane passing through the central axis of the plasma device).

[0023] Referring to FIGS. 1 to 4, this embodiment provides a plasma device, comprising: a chamber base body 100, wherein a top wall of the chamber base body is provided with a first opening; a dielectric tube 200 located above the chamber base body 100, wherein the dielectric tube 200 is in sealing fit with the chamber base body 100 such that an inner space of the chamber base body 100 communicates with an inner space of the dielectric tube 200 via the first opening; a coil assembly 300 fitted outside the dielectric tube 200; and a cooling tube 400 located between the dielectric tube 200 and the coil assembly 300, wherein a preset gap is formed between the cooling tube 400 and the dielectric tube 200, the cooling tube 400 is provided with an air inlet hole 411 for introducing cooling gas, the cooling tube 400 has a first-layer tube wall 410 and a second-layer tube wall 420, the first-layer tube wall 410 is located on an inner side of the second-layer tube wall 420 facing the dielectric tube 200, a flow guide channel 412 is formed between the first-layer tube wall 410 and the second-layer tube wall 420, the first-layer tube wall 410 is provided with a plurality of exhaust holes 413, the exhaust holes 413 and the air inlet hole 411 are respectively communicated with the flow guide channel 412, some of the exhaust holes 413 are distributed at intervals in an axial direction of the cooling tube 400, and some of the exhaust holes 413 are distributed at intervals in a circumferential direction of the cooling tube 400.

[0024] Here, guided by the flow guide channel 412, the cooling gas introduced from the air inlet hole 411 can flow towards the plurality of exhaust holes 413, and after being discharged from the exhaust holes 413, the cooling gas blows towards the dielectric tube 200 and flows into the preset gap, so that heat can be dissipated from the dielectric tube 200.

[0025] The chamber base body 100 is generally cylindrical or prismatic. The chamber base body 100 has an inner space, and the shape of the inner space can be set according to actual requirements. For example, the inner space of the chamber base body 100 can be generally cylindrical or prismatic. The inner space of the chamber base body 100 is used for accommodating a wafer 800. Generally, a support device for supporting the wafer 800 is provided in the inner space of the chamber base body 100, and the support device can include at least one of a tray, lift pins or an air float structure.

[0026] For the sake of explanation, this embodiment will be described in which the axial direction of the chamber base 100 is the vertical direction, and the direction in which the chamber base 100 faces the dielectric tube 200 is considered the top (or apex).

[0027] The chamber base 100 has a top end and a bottom end that are spaced apart along its axial direction. The top wall of the chamber base 100 is provided with a first opening for supplying gas to the internal space of the chamber base 100. Here, the first opening may be a circular through hole. In other examples, the first opening may be polygonal, and the shape of the first opening can be specifically set as needed. If the chamber base 100 is cylindrical, the diameter of the first opening may be about half the outer diameter of the chamber base 100.

[0028] A dielectric tube 200 is provided above the chamber substrate 100. The dielectric tube 200 may be a hollow column, and the internal space of the dielectric tube 200 can provide space for ion generation. The dielectric tube 200 may also be cylindrical. In another example, the dielectric tube 200 may be prismatic.

[0029] The dielectric tube 200 has a second opening corresponding to the first opening of the chamber base 100, such that the internal space of the dielectric tube 200 communicates with the internal space of the chamber base 100.

[0030] The dielectric tube 200 may be fixedly connected to the hole wall of the first opening and sealed. Exemplarily, the hole wall of the first opening may be stepped, and the first opening may include a first hole segment and a second hole segment, with the first hole segment positioned above the second hole segment and having a larger diameter than the second hole segment, thereby forming a support surface at the connection between the first and second hole segments. The dielectric tube 200 is inserted into the first hole segment, and the dielectric tube 200 is supported by the support surface. To improve sealing reliability, a seal ring 440 may be provided between the outer wall of the dielectric tube 200 and the hole wall of the first hole segment, or between the bottom end face of the dielectric tube 200 and the support surface.

[0031] The dielectric tube 200 further has a third opening located at the top of the dielectric tube 200. A cover plate 500 may be provided at the top of the dielectric tube 200 to close the third opening. In other examples, the cover plate 500 may be provided integrally with the dielectric tube 200.

[0032] The plasma device may also include an intake device 600 drilled into the cover plate 500 to supply gas into the dielectric tube 200.

[0033] Outside the dielectric tube 200, a coil assembly 300 is provided to excite the gas in the internal space of the dielectric tube 200 with radio frequency or microwaves when energy is supplied, thereby forming a plasma. The power of the energy supplied to the coil assembly 300 can be set according to actual requirements.

[0034] The coil assembly 300 may include a coil body and a coil mounting member, the coil mounting member being used to permanently connect the coil body to other components of the plasma device. For example, the coil mounting member can permanently connect the coil body to the chamber base 100, and the configuration of the coil mounting member can be set according to actual requirements.

[0035] A cooling tube 400 is provided between the coil assembly 300 and the dielectric tube 200 to transport cooling gas blown toward the dielectric tube 200 and to cool the dielectric tube 200. The cooling tube 400 is located relatively close to the dielectric tube 200 so that the gas discharged from the cooling tube 400 is blown toward the dielectric tube 200 as much as possible.

[0036] The cooling tube 400 can be fitted into a column structure provided outside the dielectric tube 200. There is a certain gap between the dielectric tube 200 and the cooling tube 400, allowing the cooling gas discharged from the cooling tube 400 to flow through this gap, thereby increasing the contact area between the cooling gas and the dielectric tube 200. The shape of the cooling tube 400 can match the shape of the dielectric tube 200. For example, if the dielectric tube 200 is cylindrical, the cooling tube 400 may also be cylindrical, and the inner diameter of the dielectric tube 200 is slightly larger than the outer diameter of the dielectric tube 200.

[0037] The cooling tube 400 may have a two-layer structure. For example, the cooling tube 400 includes a first layer tube wall 410 and a second layer tube wall 420, wherein the first layer tube wall 410 is located on the inside of the second layer tube wall 420 facing the dielectric tube 200, that is, the first layer tube wall 410 is closer to the dielectric tube 200, and a guide channel 412 is formed between the first layer tube wall 410 and the second layer tube wall 420. The first layer tube wall 410 is provided with a plurality of exhaust holes 413. The cooling tube 400 is also provided with intake holes 411. The exhaust holes 413 and intake holes 411 are each connected to the guide channel 412. As a result, cooling gas flows in from the intake holes 411, is guided through the guide channel 412, and is finally discharged from the exhaust holes 413 and blown toward the dielectric tube 200.

[0038] Some of the exhaust holes 413 are distributed at intervals along the axial direction of the cooling tube 400, while others are distributed at intervals along the circumferential direction of the cooling tube 400. In this way, a large number of exhaust holes 413 can be provided, and the distribution of the exhaust holes 413 is relatively uniform, which helps to improve the cooling effect on the dielectric tube 200.

[0039] The cooling tube 400 is made of a metallic material, in which case the cooling tube 400 may be a Faraday tube. Alternatively, the cooling tube 400 is made of a dielectric material, and the dielectric material may include ceramics or quartz.

[0040] The cooling tube 400 is detachably attached to the ion device to facilitate inspection and replacement of the cooling tube 400. For example, the bottom of the cooling tube 400 can be bolted or locked to the chamber base 100 via an intermediate connecting member such as a mounting bracket.

[0041] The plasma device provided by this embodiment, with the above-described setup, allows cooling gas to flow in from the intake port 411 of the cooling tube 400, be guided through the guide channel 412 to the exhaust port 413, and then discharged to the dielectric tube 200, thereby dissipating heat from the dielectric tube 200. This lowers the temperature of the dielectric tube 200, avoiding the problem of the dielectric tube 200 melting at high temperatures. Furthermore, by reducing the temperature difference inside the dielectric tube 200, the temperature uniformity of the dielectric tube 200 is improved, avoiding or improving the problem of the dielectric tube 200 rupturing due to excessively large temperature differences. In addition, in this embodiment, by providing the intake port 411, guide channel 412, and exhaust port 413 in the cooling tube 400, the impact on the supply efficiency of the coil assembly 300 can be reduced without affecting the vacuum environment inside the dielectric tube 200.

[0042] In some embodiments, the cooling tube 400 includes a vertical segment 400a extending axially along the cooling tube 400 and a bent segment 400b extending radially along the cooling tube 400, the bent segment 400b being optionally positioned perpendicular to the vertical segment 400a.

[0043] For example, to enhance the integrity of the cooling tube 400, the vertical segment 400a may be a hollow cylinder, to which a structure extending away from the central axis of the cylinder is connected to the bottom end, forming a bent segment 400b. In other examples, the bent segment 400b may include at least one block structure.

[0044] The folded segment 400b is provided with an intake hole 411, and at least a portion of the guide channel 412 may be located in the vertical segment 400a. Exemplarily, the intake hole 411 may penetrate the folded segment 400b and the guide channel 412 may be located in the vertical segment 400a, or the intake hole 411 may not penetrate the folded segment 400b, and a portion of the guide channel 412 may be located in the vertical segment 400a and another portion in the folded segment 400b so that the guide channel 412 communicates with the intake hole 411.

[0045] In some examples, the bent segment 400b is connected to the bottom end of the vertical segment 400a. The bent segment 400b is provided with an intake port 411 connected to a cooling gas source. Illustratively, the intake port 411 is provided at one end of the bent segment 400b away from the vertical section 400a, or the first layer tube wall 410 is located at the end face of the bent segment 400b away from the vertical section 400a, and the end face of the second layer tube wall 420, also away from the vertical section 400a, surrounds the intake port 411.

[0046] The cooling tube 400 can be provided with multiple rows of exhaust holes 413. Here, a straight line parallel to the axial direction of the cooling tube 400, which penetrates both the wall of the cooling tube 400 and the exhaust holes 413, is used as a reference line, and the multiple exhaust holes 413 that this reference line penetrates can be considered as one row of exhaust holes 413.

[0047] In the folded segment 400b, intake holes 411 are provided in the portions corresponding to at least two rows of opposing exhaust holes 413. Optionally, intake holes 411 are provided in the portions of the folded segment 400b corresponding to each row of air holes 413, which helps to improve the uniformity of the cooling effect. Alternatively, to simplify the structure, intake holes 411 are provided in the portions of the folded segment 400b corresponding to one exhaust hole 413 for every two, three, or four exhaust holes 413. The number of intake holes 411 can be set specifically according to the actual requirements.

[0048] Selectively, to improve the problem of uneven cooling effect between the upper and lower parts of the dielectric tube 200 due to energy loss as the cooling gas flows from bottom to top, the diameter of the exhaust holes 413 gradually increases along the direction from bottom to top, thereby improving the uniformity of the cooling effect of the dielectric tube 200. In specific implementation, as the axial length of the cooling tube 400 increases, the ratio of the diameter of the upper exhaust holes 413 to the diameter of the lower exhaust holes 413 also increases. Note that the ratio of the diameter of the upper exhaust holes 413 to the diameter of the lower exhaust holes 413 can be set according to actual requirements.

[0049] Selectively, to improve the problem of uneven cooling effect between the upper and lower parts of the dielectric tube 200 due to energy loss as the cooling gas flows from bottom to top, the distribution density of exhaust holes 413 gradually increases along the direction from bottom to top, thereby improving the uniformity of the cooling effect of the dielectric tube 200. Exemplarily, the distance between two axially adjacent exhaust holes 413 gradually decreases along the direction from bottom to top. In specific implementation, as the axial length of the cooling tube 400 increases, the ratio of the distribution density of exhaust holes 413 located in the upper region to the distribution density of exhaust holes 413 located in the lower region also increases. Note that the ratio of the distribution density of exhaust holes 413 located in the upper region to the distribution density of exhaust holes 413 located in the lower region can be set according to actual requirements.

[0050] In other examples, the vertical segment 400a has an upper, lower, and central section connected between the upper and lower sections, and the folded segment 400b may be connected to the central section or upper section of the vertical segment 400a.

[0051] In some embodiments, the diameter of the exhaust port 413 is 5 mm or less. Exemplarily, the diameter of the exhaust port 413 may be 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, 4.5 mm, or 5.0 mm, or any two of these values. With the above configuration, the cooling tube 400 can be fitted with a large number of exhaust ports 413, and the velocity and pressure of the cooling gas flowing out of the exhaust ports 413 can be ensured to reach preset values, thereby ensuring a cooling effect on the dielectric tube 200.

[0052] In some embodiments, the preset gap between the cooling tube 400 and the dielectric tube 200 is 5 mm or less. Illustratively, the preset gap between the cooling tube 400 and the dielectric tube 200 may be 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, 4.5 mm, or 5.0 mm, or any two of the above values. This configuration provides a diffusion space for the cooling gas discharged from the exhaust port 413, while avoiding excessive diffusion of the cooling gas that could affect the cooling effect of the dielectric tube 200.

[0053] In some embodiments, to reduce its own weight and minimize its impact on the energy supply efficiency to the coil assembly 300, the cooling tube 400 is provided with a plurality of elongated holes 430 having a longitudinal direction parallel to the axial direction of the cooling tube 400. Here, the elongated holes 430 can be located at least in the vertical segment 400a of the cooling tube 400; for example, the elongated holes 430 can be located in the vertical segment 400a, or for example, the majority of the elongated holes 430 can be located in the vertical segment 400a and a small portion in the folded segment 400b. Furthermore, if the cooling tube 400 is made of a metallic material such as an aluminum alloy, the above arrangement can also provide electrostatic shielding for the cooling tube 400.

[0054] The elongated hole 430 may be provided penetrating the cooling tube 400 in the thickness direction. Alternatively, the elongated hole 430 may have an opening located on the inner surface of the first layer tube wall 410 and a blind hole provided in the first layer tube wall 410, and / or an opening located on the outer surface of the second layer tube wall 420 and a blind hole provided in the second layer tube wall 420. If the elongated hole 430 is provided penetrating the cooling tube 400 in the thickness direction, it can be understood that the elongated hole does not communicate with the guide channel 412. The cooling tube 400 can be manufactured using an integral molding process such as 3D printing, injection molding, or press molding, or the first layer tube wall 410 and the second layer tube wall 420 can be fixedly connected by at least one connection method such as bonding, engagement, screw connection, or welding.

[0055] Selectively, at least two elongated holes 430 are distributed at intervals in the circumferential direction of the cooling tube 400. Exhaust holes 413 are provided between two elongated holes 430 that are adjacent in the circumferential direction of the cooling tube 400. The elongated holes 430 and the rows of exhaust holes 413 are distributed at intervals. For example, one or more rows of exhaust holes 413 are provided between two elongated holes 430 that are adjacent in the circumferential direction of the cooling tube 400. Alternatively, for example, one or more elongated holes 430 are provided between two rows of exhaust holes 413 that are adjacent in the circumferential direction of the cooling tube 400.

[0056] In other examples, the elongated hole 430 may be provided between two exhaust holes 413 spaced apart in the axial direction of the cooling tube 400, or between two exhaust holes 413 spaced apart in the circumferential direction of the cooling tube 400.

[0057] In some embodiments, the plasma device also includes a recovery device for recovering the cooling gas located in the gap between the dielectric tube 200 and the cooling tube 400, which facilitates the timely discharge of the cooling gas from the gap between the dielectric tube 200 and the cooling tube 400 after heat exchange with the dielectric tube 200.

[0058] Exemplary, the recovery device includes a recovery tray having a central hole which can be used to fit with at least one of the cover plate 500, dielectric tube 200, and cooling tube 400, wherein at least a portion of the recovery tray may be fitted outside the dielectric tube 200, or at least a portion of the recovery tray may be fitted outside the cooling tube 400, or at least a portion of the recovery tray may be fitted outside the cover plate 500. Recovery holes are provided in the recovery tray, which may extend along the inner circumference of the recovery tray, i.e., along the inner wall of the central hole, or there may be multiple recovery holes which are uniformly distributed along the inner circumference of the recovery tray. Recovery channels are provided within the recovery tray, which are in communication with each recovery hole. Interfaces may also be provided in the recovery tray, which are connected to the recovery channels, which can be connected to recovery pipelines, which can be connected to suction members or members capable of containing gas. The cooling gas after heat exchange flows into the recovery tray through the recovery port, is guided through the recovery channel, and can then be discharged into the recovery pipeline through the interface.

[0059] If the intake port 411 of the cooling tube 400 is located at the bottom, the recovery tray can be installed close to the top of the cooling tube 400. For example, there may be a predetermined distance between the top end surface of the cooling tube 400 and the bottom end surface of the cover plate 500, and at least a portion of the recovery tray may be located between the top end of the cooling tube 400 and the bottom end of the cover plate 500. Alternatively, the gap between the top end surface of the cooling tube 400 and the bottom end surface of the cover plate 500 may communicate with the recovery port of the recovery tray, allowing the cooling gas after heat exchange to flow into the recovery tray through the recovery port.

[0060] Optionally, a first valve may be provided in the gas source device supplying the cooling gas, and a second valve may be provided at the inlet end of the recovery device, for example, the second valve may be attached to the interface of the recovery tray. The first and second valves are each communicated with a control device of the plasma device, and the control device is used to control the operating state of the first and second valves, such as the opening and closing and degree of opening of the valves. For example, the control device can be controlled to open the first valve and to open the second valve at preset intervals to quickly discharge the cooling gas that has exchanged heat with the dielectric tube 200 from the gap between the dielectric tube 200 and the cooling tube 400. Alternatively, for example, after the cooling of the dielectric tube 200 is completed, the control device can be controlled to close the first valve and to close the second valve after a preset time interval to confirm that the cooling gas is discharged from the gap between the dielectric tube 200 and the cooling tube 400.

[0061] In some embodiments, a vacuum pump 700 is attached to the lower end of the chamber base 100 to create a vacuum environment within the chamber base 100, and the vacuum pump 700 is communicated with a control device.

[0062] Other configurations and operations of the plasma device in this embodiment are known to those skilled in the art to reduce redundancy and are therefore omitted from this description.

[0063] Other configurations of the plasma etching apparatus in the above-described embodiment can employ various solutions that are currently and may be known in the future by those skilled in the art, and will not be described in detail here.

[0064] In this description, the orientations or positional relationships indicated by the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “top,” “bottom,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” “outside,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” are based on the orientations or positional relationships shown in the drawings and are solely for the purpose of facilitating and simplifying the description of this disclosure, and do not indicate or suggest that such devices or elements have, are configured in, or must operate in a particular orientation, nor should they be understood as limiting this disclosure.

[0065] Furthermore, the terms “First” and “Second” are used solely for descriptive purposes and are not intended to indicate or imply relative importance or the number of technical features described. Therefore, features limited to “First” and “Second” may include one or more such features, either explicitly or implicitly. In this disclosure, unless otherwise explicitly and specifically limited, “multiple” means two or more.

[0066] In this disclosure, unless otherwise explicitly stated and limited, terms such as “attach,” “connect,” “join,” and “fix” can be interpreted broadly, for example, as fixed connections, removable connections, or integral connections; mechanical connections, electrical connections, or communicative connections; direct connections, indirect connections via an intermediate medium, internal communication between two elements, or interaction relationships between two elements. A person skilled in the art will understand the specific meaning of the above terms in this disclosure depending on the specific circumstances.

[0067] In this disclosure, unless otherwise explicitly stated and limited, the phrase "above" or "below" a first feature may include direct contact between the first and second features, or it may include contact between the first and second features via an additional feature between them, rather than direct contact. Furthermore, the phrase "above," "above," and "above" a first feature may mean that the first feature is directly above and diagonally above the second feature, or simply that the horizontal height of the first feature is greater than the horizontal height of the second feature. The phrase "below," "below," and "above" a second feature may mean that the first feature is directly below and diagonally below the second feature, or simply that the horizontal height of the first feature is less than the horizontal height of the second feature.

[0068] The above disclosure provides many different embodiments or examples for realizing different structures of this disclosure. For the sake of brevity of the disclosure, components and configurations of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, this disclosure may repeat reference figures and / or reference letters in different embodiments, such repetitions are for simplification and clarity and do not in themselves indicate relationships between the various embodiments and / or configurations discussed.

[0069] The specific embodiments described above do not limit the scope of protection of this disclosure. Those skilled in the art will understand that various modifications, combinations, subcombinations, substitutions, etc., can be made depending on design requirements and other factors. All modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure are included within the scope of protection of this disclosure. [Explanation of symbols]

[0070] 100 Chamber Substrate 200 dielectric tubes 300 Coil Assembly 400 Cooling pipe 410 First layer pipe wall 411 Intake port 412 Channel 413 Exhaust port 420 Second layer pipe wall 400a Vertical Segment 400b Folding Segment 430 long hole 440 sealing rings 500 Cover Plate 600 Intake System 700 Vacuum Pump 800 wafers

Claims

1. A chamber base having a first opening in its top wall, A dielectric tube is located above the chamber base and is sealed and fitted to the chamber base such that the internal space of the dielectric tube communicates with the internal space of the chamber base through the first opening. A coil assembly fitted to the outside of the dielectric tube, A cooling tube is located between the dielectric tube and the coil assembly and has a predetermined gap between itself and the dielectric tube, the cooling tube is provided with an intake hole for introducing cooling gas, the cooling tube has a first layer tube wall and a second layer tube wall, the first layer tube wall is located on the inside of the second layer tube wall facing the dielectric tube, a guide channel is formed between the first layer tube wall and the second layer tube wall, the first layer tube wall is provided with a plurality of exhaust holes, the exhaust holes and intake holes are each in communication with the guide channel, some of the exhaust holes are distributed at intervals in the axial direction of the cooling tube, and some of the exhaust holes are distributed at intervals in the circumferential direction of the cooling tube, the cooling tube comprises Due to the guidance of the aforementioned guide channel, the cooling gas flowing in from the intake port can flow toward the plurality of exhaust ports, and after being discharged from the exhaust ports, flows into the predetermined gap so as to dissipate heat from the dielectric tube. Plasma device.

2. The cooling tube includes a vertical segment extending in the axial direction of the cooling tube and a bent segment connected to the vertical segment and extending away from the dielectric tube, wherein the bent segment is provided with the intake holes, and at least a portion of the guide channel is located in the vertical segment. The plasma device according to claim 1.

3. The bottom end of the vertical segment is connected to the folded segment. The plasma device according to claim 2.

4. The diameter of the exhaust port gradually increases along the direction from bottom to top. The plasma device according to claim 3.

5. The distribution density of the exhaust holes gradually increases along the direction from bottom to top. The plasma device according to claim 3.

6. The diameter of the exhaust port is 5 mm or less, and / or the preset gap between the cooling tube and the dielectric tube is 5 mm or less. The plasma device according to claim 1.

7. The cooling tube is provided with a plurality of elongated holes, and the longitudinal direction of the elongated holes is parallel to the axial direction of the cooling tube. At least two of the aforementioned elongated holes are distributed at intervals in the circumferential direction of the cooling tube, The first layer of the tube wall is provided with the exhaust hole in the portion located between two elongated holes adjacent to each other in the circumferential direction of the cooling tube. The plasma device according to claim 1.

8. The cooling tube is formed of a metallic material, or the cooling tube is formed of a dielectric material. The plasma device according to claim 1.

9. The cooling tube is detachably connected to the chamber base. The plasma device according to claim 1.

10. The aforementioned plasma device further, A cover plate covering one end of the dielectric tube that is away from the chamber base, An intake device comprising an intake pipe of the intake device into which the cover plate is inserted, The plasma device according to claim 1.

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