Processing method and processing apparatus

Abstract

To reduce the effort and hassle required for operators to clean the processing equipment. [Solution] The cutting device 100 includes a reference information storage step S1 for storing reference information about the inside of the cutting device 100 including a holding table 110 that does not hold the workpiece 10, a processing step S4 for processing the workpiece 10 held by the holding table 110, a comparison information storage step S2 for storing comparison information about the inside of the cutting device 100 including a holding table 110 that does not hold the workpiece 10 corresponding to the reference information, either before or after the processing step S4, an abnormality determination step S3 for determining an abnormality inside the cutting device 100 including the holding table 110 based on the reference information and the comparison information, and a removal step S6 for removing the abnormality. If the abnormality determination step S3 determines that an abnormality has occurred, the removal step S6 is executed, and if it is determined that no abnormality has occurred, the processing step S4 is executed.

Description

[Technical Field]

[0001] The present invention relates to a processing method and a processing apparatus for a workpiece. [Background Art]

[0002] A plurality of devices are formed on a surface of a thin plate-shaped wafer, and dividing the wafer into individual devices allows forming device chips to be mounted on electronic equipment. A cutting apparatus having a cutting blade is used for such division of the wafer (for example, Patent Document 1). [Prior Art Literature] [Patent Literature]

[0003] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2024-150272 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] In the cutting apparatus, a cutting unit with a cutting blade mounted thereon divides a workpiece held on a holding table along lines to divide. At this time, since cutting processing is performed by rotating the cutting blade at a high speed while supplying cutting fluid or the like to the workpiece, cutting chips generated during cutting may scatter inside the cutting apparatus including the holding table. For this reason, operators are required to perform periodic cleaning inside the cutting apparatus, but the cleaning work is time-consuming and troublesome for operators.

[0005] The present invention provides a processing method and a processing apparatus that can reduce the time and trouble for operators to clean the inside of the processing apparatus. [Means for Solving the Problem]

[0006] One aspect of the present invention is a processing method for a workpiece held on a holding table, A reference information storage step for storing reference information inside the processing apparatus, which includes the holding table that does not hold the object to be processed, A processing step of processing the workpiece held in the holding table, A comparison information storage step, which stores comparison information within the processing apparatus, including the holding table that does not hold the object to be processed corresponding to the reference information, before or after the processing step, An abnormality determination step in which an abnormality is determined inside the processing apparatus, including the holding table, based on the reference information and the comparison information, The system includes a removal step to remove the aforementioned abnormality, If the abnormality determination step determines that the abnormality has occurred, the removal step is executed. If the abnormality determination step determines that no abnormality has occurred, the processing step is executed.

[0007] Furthermore, other embodiments of the present invention include: Apparatus for processing a workpiece, A holding table for holding the object to be processed, A processing unit that performs processing on the object to be processed held by the holding table, An information acquisition unit that acquires information about the inside of the processing apparatus, including the holding table, An abnormality removal unit for removing abnormalities inside the processing apparatus, including the holding table, The apparatus comprises a control unit for controlling the aforementioned processing device, The control unit is A first storage unit stores internal reference information of the processing apparatus, including the holding table which does not hold the object to be processed, which was previously acquired by the information acquisition unit. A second storage unit stores comparison information of the inside of the processing apparatus, including the holding table that does not hold the object to be processed, acquired by the information acquisition unit, before or after processing by the processing unit, An abnormality determination unit that determines the abnormality inside the processing apparatus based on the reference information and the comparison information, It comprises a processing execution unit, The processing execution unit, when the abnormality determination unit determines that said abnormality has not occurred, holds said object to be processed with said holding table and processes said object to be processed with said processing unit, when the abnormality determination unit determines that said abnormality has occurred, performs processing for removing said abnormality with said abnormality removing unit.

Effects of the Invention

[0008] According to the present invention, it is possible to reduce the labor and hassle required for an operator to clean the inside of the processing apparatus.

Brief Description of Drawings

[0009] [Figure 1] Fig. 1 is a perspective view showing an example of a cutting apparatus 100. [Figure 2] Fig. 2 is a perspective view showing an example of an object 10 to be processed. [Figure 3] Fig. 3 is a top view for explaining a water curtain 140 which is an example of the abnormality removing unit. [Figure 4] Fig. 4 is a block diagram showing an example of the configuration of a control unit 200. [Figure 5] Fig. 5 is a diagram showing an example of reference information stored in a first storage unit 240. [Figure 6] Fig. 6 is a diagram showing an example of comparison information stored in a second storage unit 250. [Figure 7] Fig. 7 is a flowchart showing an example of processing of the processing method. [Figure 8] Fig. 8 is a diagram for explaining an abrasive member 300 which is another example of the abnormality removing unit.

Mode for Carrying Out the Invention

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0011] In the embodiment, information inside the cutting device 100 when the workpiece 10 is not held on the holding table 110 is acquired, an abnormality inside the cutting device 100 is determined, and an appropriate cleaning timing for an operator is specified. Before describing the processing method, the processing apparatus will be described. In the following description, the X-axis direction is one direction in a horizontal plane. The Y-axis direction is a direction orthogonal to the X-axis direction in the horizontal plane. The Z-axis direction is a direction orthogonal to both the X-axis direction and the Y-axis direction.

[0012] [Cutting Apparatus] The processing apparatus in the embodiment is a cutting apparatus 100 that cuts a workpiece 10. FIG. 1 is a perspective view showing the cutting apparatus 100. The workpiece 10 is, for example, a substantially disk-shaped wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors, or a wafer formed of an optical device wafer.

[0013] FIG. 2 shows a wafer as an example of the workpiece 10. On a surface 10a of the workpiece 10, a plurality of streets 14 intersecting each other are set as planned dividing lines, and a plurality of regions partitioned by the planned dividing lines are formed in a grid pattern. Devices 15 such as ICs (Integrated Circuits), LSIs (Large Scale Integrated circuits), and MEMS (Micro Electro Mechanical Systems) are formed in each of the partitioned regions. When the workpiece 10 is divided along the planned dividing lines by the cutting apparatus 100, individual device chips are formed.

[0014] The workpiece 10 is transported and processed in an integrated state with an annular frame 11 and a tape 12 that is attached to cover the opening of the annular frame 11. The frame 11 is an annular plate member formed of, for example, metal or resin, and has an opening larger than the outer diameter of the workpiece 10. The tape 12 is an expandable sheet member with an outer diameter larger than the opening of the frame 11. The tape 12 is attached to the back side of the frame 11 so as to cover the opening of the frame 11. The workpiece 10 is positioned at a predetermined position in the opening of the frame 11 and fixed to the frame 11 and the tape 12 by the back side 10b of the workpiece 10 being attached to the tape 12.

[0015] Returning to Figure 1, the configuration of the cutting apparatus 100 will be described. The cutting apparatus 100 comprises a holding table 110 that holds the workpiece 10 by suction on a holding surface 111, a cutting unit 120 that cuts the workpiece 10 held by the holding table 110, an imaging unit 130 that images the workpiece 10 held on the holding table 110, a water curtain 140, and a control unit 200.

[0016] Furthermore, the cutting apparatus 100 includes a moving unit 150 that moves the holding table 110 and the cutting unit 120 relative to each other. The moving unit 150 includes a machining feed unit 151 that feeds the holding table 110 in the X-axis direction parallel to the horizontal direction, an indexing feed unit 152 that feeds the cutting unit 120 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction, an in-cut feed unit 153 that feeds the cutting unit 120 in the Z-axis direction parallel to the vertical direction and perpendicular to both the X-axis and Y-axis directions, and a rotational moving unit (not shown) that rotates the holding table 110 around an axis parallel to the Z-axis direction.

[0017] The machining feed unit 151 moves the holding table 110 in the X-axis direction, which is the machining feed direction, thereby moving the holding table 110 relative to the cutting unit 120 along the X-axis direction.

[0018] The indexing feed unit 152 moves the cutting unit 120 in the Y-axis direction, which is the indexing feed direction, thereby moving the cutting unit 120 and the holding table 110 relative to each other along the Y-axis direction.

[0019] The cutting feed unit 153 moves the cutting unit 120 in the Z-axis direction, which is the cutting feed direction, thereby moving the cutting unit 120 and the holding table 110 relative to each other along the Z-axis direction.

[0020] The machining feed unit 151, the indexing feed unit 152, and the depth-of-cut feed unit 153 may be composed of, for example, known ball screw type moving units. The rotary moving unit may be configured to be rotated by, for example, a motor that rotates the holding table 110 around its axis.

[0021] The holding table 110 holds the workpiece 10 on its holding surface 111. The holding surface 111 of the holding table 110 is a disc shape formed from porous ceramic or the like, and is connected to a vacuum suction source via a vacuum suction path (not shown). The workpiece 10 placed on the holding surface 111 is held in place by suction from the vacuum suction source. Multiple clamps 112 are arranged around the holding table 110 to grip the frame 11 surrounding the workpiece 10 (see Figure 5).

[0022] The cutting unit 120 is a processing unit that performs cutting on a workpiece 10 held by a holding table 110 along a planned division line. The cutting unit 120 is provided to move in the Y-axis direction by an indexing feed unit 152 and is also provided to move in the Z-axis direction by a cutting feed unit 153 relative to the workpiece 10 held by the holding table 110. The cutting unit 120 allows the cutting blade 121 to be positioned at any position on the holding surface 111 of the holding table 110 by the processing feed unit 151, the indexing feed unit 152, and the cutting feed unit 153.

[0023] The cutting unit 120 includes a cutting blade 121, a spindle housing 122 that is movable in the Y-axis and Z-axis directions by an indexing feed unit 152 and a depth-of-cut feed unit 153, a spindle 123 that is rotatable about its axis in the spindle housing 122, a spindle motor (not shown) that rotates the spindle 123 about its axis, and a cutting fluid supply unit 124 that supplies cutting fluid to the cutting blade 121.

[0024] The cutting blade 121 is an extremely thin cutting wheel having a substantially ring shape. The cutting blade 121 cuts the workpiece 10 held by the holding table 110. The cutting blade 121 is a so-called hub blade, comprising an annular cutting edge for cutting the workpiece 10 held by the holding table 110, and an annular base that supports the cutting edge on its outer edge and is detachably mounted on the spindle 123.

[0025] The spindle housing 122 is supported so as to be movable in the Z-axis direction by the cutting feed unit 153, and is supported so as to be movable in the Y-axis direction by the indexing feed unit 152 via the cutting feed unit 153. The spindle housing 122 houses the portion of the spindle 123 excluding the tip and a spindle motor (not shown), and supports the spindle 123 so as to be rotatable around its axis.

[0026] The spindle 123 has a cutting blade 121 that is detachably fixed to its tip. The spindle 123 is rotated around its axis by a spindle motor (not shown), and its tip protrudes from the tip surface of the spindle housing 122. The tip of the spindle 123 is gradually tapered towards the tip, and the cutting blade 121 is mounted thereon. The axes of the spindle 123 and the cutting blade 121 of the cutting unit 120 are parallel to the Y-axis direction. That is, the cutting blade 121 of the cutting unit 120 is rotated around its axis by the spindle motor.

[0027] The cutting fluid supply unit 124 supplies cutting fluid to the machining area during cutting. The machining area refers to the area of ​​the workpiece 10 that is being cut by the rotating cutting blade 121, and is the area in contact between the rotating cutting blade 121 and the workpiece 10. The cutting fluid is, for example, pure water.

[0028] Furthermore, a waterproof cover 160 is provided below the holding table 110. In addition, a bellows section 170 is provided on either side of the waterproof cover 160 in the X-axis direction. The waterproof cover 160 and the bellows section 170 are intended to prevent cutting fluid supplied from the cutting fluid supply unit 124 and cleaning fluid supplied from the water curtain 140 from entering the main body of the device 2.

[0029] The bellows section 170 is a so-called bellows having a repeating structure of mountain folds and valley folds. In the X-axis direction, one end of the bellows section 170 is fixed to the waterproof cover 160, and the other end is fixed to the device body 2. In other words, the bellows section 170 is fixed to both sides of the holding table 110 in the X-axis direction and covers the processing feed unit 151 in the Y-axis direction. The bellows section 170 can expand and contract as the holding table 110 moves in the X-axis direction.

[0030] The imaging unit 130 is mounted on the spindle housing 122 of the cutting unit 120 and positioned above the holding table 110. It is moved in the Y-axis and Z-axis directions together with the cutting unit 120 by the indexing feed unit 152 and the depth-of-cut feed unit 153. The imaging unit 130 is equipped with an image sensor that images the area of ​​the workpiece 10 held on the holding table 110 that is to be machined. The image sensor is, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The imaging unit 130 images the workpiece 10 held on the holding table 110 and outputs the image obtained to the control unit 200.

[0031] Furthermore, the cutting device 100 has a plurality of upright walls 3 erected from the outer edge of the device body 2, and a ceiling wall 4 connected to the upper end of the upright walls 3. The area enclosed by the upright walls 3 and the ceiling wall 4 forms the processing chamber 5. The processing chamber 5 includes the processing area described above. The processing chamber 5 corresponds to the interior of the cutting device 100.

[0032] Furthermore, the cutting device 100 is equipped with a camera 180 for imaging the inside of the processing chamber 5. The camera 180 is an example of an "information acquisition unit" that acquires information about the inside of the cutting device 100, including the holding table 110. The camera 180 images the inside of the processing chamber 5 and outputs the image obtained to the control unit 200. In this embodiment, the camera 180 is equipped with a wide-angle lens and images at least the holding table 110 and the area around the holding table 110 in the processing area of ​​the processing chamber 5.

[0033] The camera 180 is equipped with an image sensor that captures images of the inside of the processing chamber 5. The image sensor is, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. In this embodiment, the image captured by the camera 180 is an image in which the intensity of light received by each pixel is shown in multiple levels (for example, 256 levels), that is, a color image having shades of each color.

[0034] The water curtain 140 is a tubular member through which a cleaning solution flows. In this embodiment, it primarily supplies the cleaning solution to remove foreign matter adhering to the holding table 110 and its surroundings. It may also supply the cleaning solution to the workpiece 10 held on the holding table 110. The cleaning solution is, for example, pure water. The water curtain 140 is an example of an "abnormality removal unit" in this embodiment.

[0035] The water curtain 140 extends in the Y-axis direction, straddling the machining feed unit 151 of the cutting device 100, and is fixed to the upper surface of the device body 2 at both ends in the Y-axis direction. The water curtain 140 is positioned above the holding table 110 in the Z-axis direction, so as not to interfere with the moving holding table 110 or the workpiece 10. The water curtain 140 is connected to a cleaning fluid supply source (not shown), and a flow control valve (not shown) for adjusting the flow rate of the cleaning fluid is connected between the water curtain 140 and the cleaning fluid supply source.

[0036] As shown in Figure 3, the water curtain 140 has a plurality of nozzles 141 capable of spraying cleaning fluid W supplied from a cleaning fluid source (not shown) toward the holding table 110 and the area surrounding the holding table 110. The plurality of nozzles 141 extend in the Y-axis direction intersecting the direction of movement of the holding table 110. The plurality of nozzles 141 are formed at predetermined intervals along the Y-axis direction. In the example shown in Figure 3, four nozzles 141 are typically reference-labeled. The nozzles 141 are provided, for example, in an area that covers at least the holding table 110. This allows the water curtain 140 to evenly spray the cleaning fluid onto the holding table 110.

[0037] Furthermore, in this embodiment, in addition to the water curtain 140, a bellows cleaning nozzle 142 is provided, mainly for cleaning the bellows section 170. In this embodiment, two bellows cleaning nozzles 142 are provided near the bellows section 170, flanking the waterproof cover 160 in the X-axis direction. This allows for, for example, active cleaning of the bellows section 170.

[0038] Furthermore, the cutting device 100 includes a notification unit 260 that accepts input such as processing conditions from the operator via a touch panel, etc., and displays the status of the processing operation and images, as well as warning lights that emit light, sound, etc. The notification unit 260 is connected to the control unit 200. The notification unit 260 notifies the operator of information by displaying information on a touch panel, etc., or by emitting sound, light, etc. In this embodiment, for example, if an abnormality occurs inside the cutting device 100, notification is given via the notification unit 260. The notification unit 260 may also include a portable terminal held by the operator, etc.

[0039] The cutting apparatus 100 also includes, although not shown in the figures, a cassette table on which cassettes for containing the workpieces 10 before and after cutting are placed, a cleaning unit for cleaning the workpieces 10 after cutting, and a transport unit for transporting the workpieces 10 between the cassette table, the holding table 110, and the cleaning unit.

[0040] The control unit 200 controls each component of the cutting device 100 to perform various operations on the workpiece 10. Specifically, the control unit 200 controls the holding table 110, cutting unit 120, imaging unit 130, water curtain 140, bellows cleaning nozzle 142, moving unit 150, camera 180, notification unit 260, etc.

[0041] The control unit 200 is a computer capable of executing computer programs, comprising an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device such as ROM (read-only memory) or RAM (random access memory), and an input / output interface device.

[0042] Furthermore, as shown in Figure 4, the control unit 200 includes an abnormality detection unit 210, a processing execution unit 220, a notification unit 230, and a first storage unit 240 and a second storage unit 250, which are examples of storage devices.

[0043] The first storage unit 240 stores reference information, which is, for example, information about the inside of the cutting device 100 (i.e., information about the processing chamber 5) captured by the camera 180. Figure 5 shows an image of the inside of the processing chamber 5 based on this reference information, and includes an image of the holding table 110 that is not holding the workpiece 10. In the example shown in Figure 5, the image includes the holding table 110 that is not holding the workpiece 10, and the surrounding bellows portion 170, etc. Here, reference information means information that the processing chamber 5, including the holding table 110, is free from foreign matter, including liquids such as cleaning fluid and dirt such as cutting chips. In other words, it refers to information about the normal state in which there is no abnormality inside the cutting device 100. The image based on this reference information is an image obtained by capturing the inside of the processing chamber 5 with the camera 180. This image can be obtained, for example, when a new cutting device 100 is installed or immediately after the processing chamber 5 of the cutting device 100 has been cleaned. Note that the reference information may be an image obtained immediately after cleaning, and can therefore be updated periodically.

[0044] The second storage unit 250 stores comparison information, which is, for example, information about the inside of the cutting device 100 (i.e., information about the processing chamber 5) captured by the camera 180. This comparison information is information that can be compared with the above-mentioned reference information. Therefore, it includes information corresponding to the reference information. Information corresponding to the reference information means information that includes the same object to be imaged. In this embodiment, at least the holding table 110 is the same object to be imaged. Since the comparison information is an image that is compared with the reference information, it is preferable that the image stored is obtained by capturing it at the same field of view as the reference information.

[0045] Figure 6 shows an image of the processing chamber 5 based on the comparison information, and, similar to the reference information in Figure 5, the image includes the holding table 110 that does not hold the workpiece 10, and the surrounding bellows section 170, etc. As mentioned above, the comparison information is information corresponding to the reference information, and more specifically, it is information about the inside of the cutting device 100, including the holding table 110 that does not hold the workpiece 10. This comparison information is obtained, for example, by imaging the state in which the workpiece 10 is not held by the holding table 110 before the cutting process is performed. Alternatively, it is obtained by imaging the state in which the workpiece 10 is not held by the holding table after the cutting process has been performed, such as when the cut workpiece 10 is transported from the holding table 110 to a predetermined position in the cutting device 100 or to an external device. In other words, the comparison information is an image obtained in the state in which the workpiece 10 is not held by the holding table 110 during the normal operation of the cutting device 100. Therefore, there may be cases where no foreign matter, including liquids such as cleaning solutions or dirt such as cutting chips, is attached, or there may be cases where foreign matter is attached. The example shown in Figure 6 shows an example where foreign matter P is present.

[0046] The control unit 200 performs various calculations based on a predetermined program stored in the memory device. In the above-described cutting device 100, the cutting unit 120 cuts the workpiece 10 with the cutting blade 121 while the cutting unit 120 supplies cutting fluid from the cutting fluid supply unit 124. For example, cutting fluid containing cutting chips generated during cutting may be sprayed and scattered in the processing chamber 5, adhering to the holding table 110 and the area around the holding table 110. When the adhering cutting fluid dries, cutting chips remain, causing dirt to accumulate in the processing chamber 5. Therefore, normally, the operator is required to clean the dirt periodically (for example, every predetermined usage time of the cutting device or every day), but this cleaning can be troublesome or inconvenient for the operator. In this embodiment, a predetermined program is executed that can reduce the trouble and inconvenience for the operator.

[0047] The abnormality detection unit 210, the processing execution unit 220, and the notification unit 230 are functional units for executing a predetermined program.

[0048] The abnormality detection unit 210 determines any abnormalities inside the cutting device 100 based on the reference information and comparison information described above. Specifically, the abnormality detection unit 210 refers to the first storage unit 240 and the second storage unit 250 and performs abnormality detection by comparing the image based on the reference information shown in Figure 5 with the image based on the comparison image shown in Figure 6. For example, the control unit 200 compares the registered reference information image with the comparison information image using template matching, and determines that there is no abnormality if the images are similar. Conversely, it determines that there is an abnormality if the images are not similar. The specific method of abnormality detection will be explained in the processing method described later.

[0049] If the abnormality determination unit 210 determines that no abnormality has occurred inside the cutting device 100, the processing execution unit 220 holds the workpiece 10 in the holding table 110 and processes the workpiece 10 with the cutting unit 120. In other words, the processing execution unit 220 determines that no abnormality has occurred inside the cutting device 100, including the holding table 110, that would require cleaning, and therefore transports and holds the workpiece 10 in the holding table 110. The processing execution unit 220 then controls the cutting unit 120 to perform cutting along the planned division line.

[0050] On the other hand, if the abnormality detection unit 210 determines that an abnormality has occurred inside the cutting device 100, the processing execution unit 220 performs a process to remove the abnormality, for example, using the water curtain 140. That is, since the processing execution unit 220 determines that an abnormality such as the attachment of foreign matter or dirt has occurred inside the cutting device 100, including the holding table 110, it uses the water curtain 140 to supply cleaning fluid to the holding table 110 and performs cleaning. Also, if there is an abnormality in the bellows section 170, it uses the bellows cleaning nozzle 142 to supply cleaning fluid to the bellows section 170 and performs cleaning. After the processing execution unit 220 has removed the abnormality inside the cutting device 100 through this cleaning, it performs cutting of the workpiece 10.

[0051] The notification unit 230 notifies the operator that an abnormality has occurred inside the cutting device 100 if the abnormality inside the cutting device 100 cannot be removed. For example, if there is an abnormality inside the cutting device 100 and the abnormality cannot be removed by cleaning with the water curtain 140 or the like, the notification unit 230 activates a notification unit 260, such as a display unit or warning light, to notify the operator that an abnormality has occurred in the cutting device 100. This notifies the operator that an abnormality has occurred inside the cutting device 100 and prompts the operator to clean the inside of the cutting device 100.

[0052] [Processing method] Next, the processing method for the object to be processed 10 in the embodiment will be described. Figure 7 is a flowchart showing an example of the processing method. The processing method in the embodiment includes a reference information storage step S1, a comparison information storage step S2, an abnormality determination step S3, a processing step S4, an abnormality removal determination step S5, a removal step S6, and a notification step S7. Each of these steps is performed by the control unit 200.

[0053] In the reference information storage step S1, the control unit 200 stores reference information for the inside of the cutting device 100, including the holding table 110 which does not hold the workpiece 10. That is, the control unit 200 uses the camera 180 to image the inside of the processing chamber 5 of the cutting device 100, including the holding table 110, when there are no abnormalities such as liquids such as cutting fluid or cleaning fluid, or dirt such as cutting chips adhering to the processing chamber 5. The image obtained from the image is then stored in the first storage unit 240. In this embodiment, the image shown in Figure 5 is an image based on the reference information.

[0054] In the comparison information storage step S2, the control unit 200 stores the internal comparison information of the cutting device 100, including a holding table 110 that does not hold the workpiece 10 corresponding to the reference information, either before or after the processing step S4. Here, "before processing step S4" and "after processing step S4" may be synonymous. In other words, the difference is whether the internal information of the cutting device 100 corresponding to the reference information is stored when the next workpiece 10 to be processed is not held in the holding table 110 (an example before processing step S4), or whether the internal information of the cutting device 100 corresponding to the reference information is stored when the workpiece 10 processed immediately before is not held in the holding table (an example after processing step S4). In either case, the internal information of the cutting device 100 is stored when the workpiece 10 is not held in the holding table 110 during normal use. Here, following the order of the flowchart, we will explain an example in which the internal comparison information of the cutting device 100, including a holding table 110 that does not hold the workpiece 10 corresponding to the reference information, is stored before processing step S4.

[0055] In the comparison information storage step S2, the control unit 200 uses the camera 180 to image the inside of the processing chamber 5, including the holding table 110. The control unit 200 then stores the image obtained in the second storage unit 250. In this embodiment, the image shown in Figure 6 is the image based on the comparison information.

[0056] In the abnormality determination step S3, the control unit 200 determines an abnormality inside the cutting device 100, including the holding table 110, based on the reference information and comparison information described above. Specifically, the control unit 200 determines the abnormality by referring to the first storage unit 240 and the second storage unit 250 and comparing the image based on the reference information shown in Figure 5 with the image based on the comparison image shown in Figure 6. The means for determining the abnormality is, for example, template matching. As template matching, for example, known methods such as SAD (Sum of Absolute Difference), SSD (Sum of Squared Difference), NCC (Normalized Cross-Correlation), and ZNCC (Zero-mean Normalized Cross-Correlation) can be used. These are algorithms that determine abnormalities by looking at the difference in pixel values ​​in various ways.

[0057] For example, if the difference in pixel values ​​between the image based on the reference information in Figure 5 and the image based on the comparison image in Figure 6 is greater than or equal to a threshold, the control unit 200 considers the two images to be dissimilar and determines that there is an abnormality inside the cutting device 100, including the holding table 110. Conversely, if the difference in pixel values ​​between the image based on the reference information in Figure 5 and the image based on the comparison image in Figure 6 is less than a threshold, the control unit 200 considers the two images to be similar and determines that there is no abnormality inside the cutting device 100, including the holding table 110.

[0058] In this embodiment, the comparison image shown in Figure 6 contains foreign matter P compared to the reference image shown in Figure 5, which shows a state without abnormalities. In this case, it can be assumed that the difference in pixel values ​​is greater than or equal to a threshold, and therefore, it is determined that there is an abnormality inside the cutting device 100, including the holding table 110.

[0059] If it is determined that there is an abnormality inside the cutting device 100, including the holding table 110 (Yes in abnormality determination step S3), the control unit 200 proceeds to the abnormality removal determination step S5. Conversely, if it is determined that there is no abnormality inside the cutting device 100, including the holding table 110 (No in abnormality determination step S3), the control unit 200 proceeds to the processing step S4. First, let's explain the processing step S4.

[0060] In processing step S4, the control unit 200 performs cutting on the workpiece 10. Specifically, the control unit 200 transports the workpiece 10 to the holding table 110 and places the workpiece 10 on the holding surface 111. Then, the control unit 200 performs cutting on the workpiece 10 placed on the holding surface 111. Specifically, after performing alignment, the control unit 200 controls the cutting unit 120 to move the cutting blade 121 and the holding table 110 relative to each other, performing cutting along the planned division line and dividing the workpiece 10 into individual devices 15.

[0061] In the abnormality removal determination step S5, the control unit 200 determines whether the abnormality inside the cutting device 100 can be removed by executing the removal step S6 described later. For example, the control unit 200 may be configured to make a negative determination in this step (No in the abnormality removal determination step S5) if the difference between the reference image and the comparison image is greater than or equal to a predetermined threshold that prevents the removal of the abnormality, based on the image that was determined to be abnormal in the abnormality determination step S3. In this case, the threshold may be greater than, for example, the threshold in the abnormality determination step S3.

[0062] Furthermore, the control unit 200 may be configured to make a positive determination in the abnormality removal determination step S5 (Yes in abnormality removal determination step S5) in the first routine, for example, since the removal step S6 has not yet been executed. In that case, it may be configured to make a positive determination in the abnormality removal determination step S5 (Yes in abnormality removal determination step S5) and a negative determination in the third and subsequent determinations (No in abnormality removal determination step S5) in the first two times, including the first time, assuming that the abnormality inside the cutting device 100 can be resolved by the removal step S6.

[0063] If the abnormality removal determination step S5 is determined to be positive (Yes in the abnormality removal determination step S5), the control unit 200 proceeds to the removal step S6.

[0064] In removal step S6, the control unit 200 cleans the inside of the cutting device 100, including the holding table 110. This is to clean foreign matter such as cutting chips adhering to the holding table 110, for example. Specifically, the control unit 200 sprays cleaning fluid onto the holding table 110 using the water curtain 140. The control unit 200 also cleans the bellows portion 170 using the bellows cleaning nozzle 142 if, for example, foreign matter is adhering to the bellows portion 170 by referring to an image based on comparative information.

[0065] In this way, after cleaning the inside of the cutting device 100, including the holding table 110, by the removal step S6, the control unit 200 executes the comparison information storage step S2 again. That is, the control unit 200 acquires (i.e., images) information about the inside of the cleaning process of the cutting device 100, and performs an abnormality determination again by comparing the images in the abnormality determination step S3. If the abnormality determination step S3 is performed again and an abnormality is determined (Yes in the abnormality determination step S3), and the abnormality removal determination step S5 is also determined positively (Yes in the abnormality removal determination step S5), the removal step S6 will be performed again. In this case, for example, the cleaning conditions in the removal step S6 may be changed to stronger cleaning conditions than the normal conditions. For example, the cleaning time with the water curtain 140 may be increased, the supply pressure of the cleaning fluid from the water curtain 140 may be increased, or areas where foreign matter is attached may be cleaned more thoroughly.

[0066] On the other hand, if the abnormality removal determination step S5 is determined to be negative (No in the abnormality removal determination step S5), the control unit 200 proceeds to the notification step S7.

[0067] In notification step S7, the control unit 200 notifies the operator that an abnormality has occurred inside the cutting device 100. Specifically, for example, the control unit 200 activates a notification unit 260, such as a display unit or warning lights, to notify the operator that an abnormality has occurred inside the cutting device 100. This allows the operator to understand that an abnormality has occurred inside the cutting device 100. Furthermore, by providing such notification, the operator can be prompted to clean the inside of the cutting device 100.

[0068] As described above, in this embodiment, if the abnormality determination step S3 determines that there is no abnormality inside the cutting device 100, including the holding table 110, based on a comparison with reference information, the cutting process is performed. If an abnormality is determined to exist, the cutting device 100 performs processing to remove the abnormality. Therefore, appropriate cutting and cleaning processes can be performed without the operator having to periodically clean the cutting device 100. As a result, the burden and hassle of cleaning the cutting device 100 for the operator can be reduced.

[0069] Furthermore, by performing abnormality detection and cleaning within the cutting device 100 in this manner, energy consumption associated with cleaning can be reduced compared to, for example, cleaning the device every time it is used. As a result, cost reductions associated with the use of the cutting device 100 and improvements in productivity at the cutting device 100 can be achieved.

[0070] Furthermore, in this embodiment, if it is determined that an abnormality inside the cutting device 100, including the holding table 110, cannot be removed by the removal step S6, a notification is issued indicating that an abnormality has occurred. This allows the operator to understand that an abnormality has occurred inside the cutting device 100 and prompts the operator to clean the inside of the cutting device 100. The timing for cleaning the inside of the cutting device 100 may vary depending on, for example, the amount of cutting debris scattered, the range over which the cutting debris is scattered, or the cutting conditions of the workpiece 10. Therefore, as in this embodiment, by determining an abnormality inside the cutting device 100 within the device and activating the notification unit 260 to issue a notification if the abnormality cannot be removed, the operator can be notified of the appropriate cleaning timing and encouraged to clean. In other words, by providing such notifications, the effort and hassle of cleaning for the operator can be reduced.

[0071] [Differentiation] Next, a modified example will be described. In the above-described embodiment, the holding table 110 was cleaned using the water curtain 140 in the removal step S6, but the abnormality removal unit is not limited to the water curtain 140. For example, abnormalities in the holding table 110 may be removed by polishing the holding table 110 using the polishing member 300 as shown in Figure 8. By using the polishing member 300, for example, stubborn foreign matter adhering to the holding table 110 can be removed.

[0072] Figure 8 shows an example of polishing the holding table 110 using the polishing member 300. The polishing member 300 includes a rotating shaft 310 and a cleaning abrasive 320 attached to the tip of the rotating shaft 310.

[0073] The cleaning wheel 320 cleans and polishes the holding surface 111 of the holding table 110 by moving relative to the holding table 110 while in contact with the holding surface 111. The cleaning wheel 320 can be at least one of the following: a vitrified wheel containing abrasive grains of resin, glass, alumina, or silicon carbide; a resin-bonded wheel; or an Arkansas wheel.

[0074] The shape of the cleaning wheel 320 may be circular, for example, as shown in Figure 8, or it may be rectangular or other shapes. The size of the cleaning wheel 320 may be set to an appropriate size by the manufacturer or the like. The cleaning wheel 320 is movable in the vertical direction (Z-axis direction in Figure 1) by a cleaning wheel holding mechanism (not shown), and is also able to rotate in conjunction with the rotation of the rotation axis 310.

[0075] Furthermore, in the example shown in Figure 8, the cleaning wheel 320 may be configured as a brush or the like. In that case, the brush rotates in conjunction with the rotation of the rotating shaft 310, thereby removing dirt such as cutting debris that has adhered to the holding table 110.

[0076] Furthermore, the removal of foreign matter using these cleaning wheels 320 or brushes may be used in conjunction with cleaning using the water curtain 140.

[0077] Furthermore, some of the processing of the control unit 200 in the above-described embodiment may be configured to be performed by other devices. For example, the abnormality determination step S3, which determines an abnormality inside the cutting device 100, may be configured to be performed by an inspection device or the like that performs abnormality determination separately from the cutting device 100.

[0078] Furthermore, some of the configurations of the above-described embodiments may be omitted, or the processing may be changed or omitted. For example, the above-described reference information storage step S1 is a step for storing reference information, so once the reference information has been acquired, it may be omitted except when updating the reference information.

[0079] Although each embodiment has been described above with reference to the drawings, it goes without saying that the present invention is not limited to these embodiments. It is clear to those skilled in the art that various modifications and alterations can be conceived within the scope of the claims, and these are also understood to naturally fall within the technical scope of the present invention. Furthermore, the components of the above embodiments may be combined arbitrarily without departing from the spirit of the invention.

[0080] In the above embodiment, an example of reference information was described as registering an image of the cutting device 100 in a normal state. However, the reference information may also include images of the cutting device 100 in an abnormal state. In that case, the abnormality determination of the cutting device 100 in the abnormality determination step S3 may be configured to determine that it is normal if the reference information and comparison information are not similar, and to determine that an abnormality has occurred if they are similar.

[0081] Furthermore, the means for detecting information inside the cutting device 100 may be a particle counter for detecting particles inside the cutting device 100, or a thickness detection sensor for measuring abnormal thickness inside the cutting device 100, in addition to the camera 180. In this case, the reference information will be a reference threshold (number) or a reference thickness.

[0082] Furthermore, the processing device is not limited to the cutting device 100, but may also be, for example, a grinding device that performs grinding on the workpiece 10, or a polishing device that polishes the workpiece 10.

[0083] Furthermore, the processing method described in the above-described embodiment can be realized by executing a pre-prepared control program on a computer. This control program is recorded on a computer-readable storage medium and executed when read from the storage medium. This control program may also be provided in the form of a non-transient storage medium such as flash memory, or it may be provided via a network such as the Internet. The computer that executes this control program may be included in the processing unit, or it may be included in an electronic device such as a smartphone, tablet terminal, or personal computer that can communicate with the processing unit, or it may be included in a server device that can communicate with these processing units and electronic devices.

[0084] This specification contains at least the following information. Note that the components etc. in parentheses indicate those corresponding to the embodiments described above, but are not limited thereto.

[0085] (1) A method for processing an object to be processed (object to be processed 10) held in a holding table (holding table 110), A reference information storage step (reference information storage step S1) for storing reference information inside the processing apparatus, which includes the holding table that does not hold the object to be processed, A processing step (processing step S4) for processing the object to be processed held in the holding table, A comparison information storage step (comparison information storage step S2) is performed before or after the processing step, which stores comparison information within the processing apparatus, including the holding table that does not hold the object to be processed corresponding to the reference information. An abnormality determination step (abnormality determination step S3) is performed to determine an abnormality inside the processing apparatus, including the holding table, based on the reference information and the comparison information. The system includes a removal step (removal step S6) to remove the aforementioned abnormality, If the abnormality determination step determines that the abnormality has occurred, the removal step is executed. If the abnormality determination step determines that no abnormality has occurred, the processing step is executed. Processing method.

[0086] According to (1), if the abnormality determination step determines that there is no abnormality inside the processing device, including the holding table, based on a comparison with reference information, the processing step is performed. If an abnormality is determined to exist, the processing device performs processing to remove the abnormality. Therefore, appropriate processing and cleaning can be performed without the operator having to clean the processing device regularly. As a result, the burden and hassle of cleaning the processing device for the operator can be reduced.

[0087] (2) The processing method described in (1), An abnormality removal determination step (abnormality removal determination step S5) is performed to determine whether the abnormality can be removed by the removal step, If the abnormality removal determination step determines that the abnormality cannot be removed, the system further includes a notification step (notification step S7) that notifies that the abnormality has occurred. Processing method.

[0088] According to (2), if it is determined that the removal step cannot remove the abnormality inside the processing apparatus, including the holding table, a notification is given that the abnormality has occurred. This allows the operator to understand that an abnormality has occurred inside the processing apparatus and prompts the operator to clean the inside of the processing apparatus. In other words, it prompts the operator to clean at an appropriate time.

[0089] (3) The processing method described in (1) or (2), The aforementioned reference information storage step involves storing the image captured and acquired by the imaging unit as the reference information. The comparison information storage step involves storing the comparison image acquired by the imaging unit as the comparison information. Processing method.

[0090] According to (3), abnormalities inside the processing device can be detected by comparing the captured images.

[0091] (4) The processing method described in (1) or (2), The removal step involves supplying liquid to the holding table for cleaning. Processing method.

[0092] According to (4), the abnormality that occurred can be removed by supplying liquid to the holding table and performing cleaning.

[0093] (5) The processing method described in (1) or (2), The removal step involves polishing the holding table with a polishing member (polishing member 300). Processing method.

[0094] According to (5), polishing the holding table can remove, for example, any stubborn abnormalities that have occurred.

[0095] (6) The processing method described in (1) or (2), The removal step is, A liquid is supplied to a bellows portion (bellows portion 170) provided in the direction of movement of the holding table, which is expandable and contractible as the holding table moves, for cleaning. Processing method.

[0096] According to (6), by cleaning the bellows section, for example, it is possible to suppress the scattering of cutting chips and other debris attached to the bellows section onto the holding table as the holding table moves.

[0097] (7) An apparatus for processing an object to be processed (object 10), A holding table (holding table 110) for holding the object to be processed, A processing unit (cutting unit 120) that performs processing on the workpiece held by the holding table, An information acquisition unit (camera 180) acquires information about the inside of the processing apparatus, including the holding table, An abnormality removal unit (water curtain 140, polishing member 300) for removing abnormalities inside the processing apparatus including the holding table, The system includes a control unit (control unit 200) for controlling the aforementioned processing device, The control unit is A first storage unit (first storage unit 240) stores reference information for the processing apparatus, including the holding table which does not hold the object to be processed, which was previously acquired by the information acquisition unit, A second storage unit (second storage unit 250) stores comparison information of the inside of the processing apparatus, including the holding table that does not hold the object to be processed, acquired by the information acquisition unit, before or after processing by the processing unit. An abnormality determination unit (abnormality determination unit 210) that determines the abnormality inside the processing apparatus based on the reference information and the comparison information, It comprises a processing execution unit (processing execution unit 220), The processing execution unit, If the abnormality detection unit determines that no abnormality has occurred, the holding table holds the workpiece, and the processing unit processes the workpiece. If the abnormality detection unit determines that the abnormality has occurred, the abnormality removal unit performs a process to remove the abnormality. Processing device.

[0098] According to (7), if it is determined that there is no abnormality inside the processing apparatus, including the holding table, based on a comparison with reference information, cutting or other processing is performed. If an abnormality is determined to exist, processing is performed in the processing apparatus to remove the abnormality. Therefore, appropriate processing and cleaning can be performed without the operator having to clean the processing apparatus regularly. As a result, the burden and hassle of cleaning the processing apparatus on the operator can be reduced.

[0099] (8) The apparatus described in (7), The control unit is If the aforementioned abnormality cannot be eliminated, the system further includes a notification unit (notification unit 230) that notifies that the aforementioned abnormality has occurred. Processing device.

[0100] According to (8), if it is determined that an abnormality inside the processing device, including the holding table, cannot be removed, a notification will be issued that an abnormality has occurred. This allows the operator to understand that an abnormality has occurred inside the processing device and to prompt the operator to clean the inside of the processing device. In other words, it is possible to prompt the operator to clean at an appropriate time. [Explanation of symbols]

[0101] 10. Items to be processed 110 Holding Table 120 Cutting Units (Processing Units) 140 Water Curtain (Anomaly Removal Unit) 170 Bellows section 180 Camera (Information Acquisition Unit) 200 control units 210 Abnormality judgment section 220 Processing Execution Unit 230 Hochi Department 240 1st memory section 250 2nd memory section 300 Polishing component (abnormality removal unit) S1 Reference information storage step S2 Comparison Information Storage Step S3 Anomaly detection step S4 Processing Step S5 Anomaly Removal Determination Step S6 Removal Step S7 Hochi Step

Claims

1. A method for processing objects held in a holding table, A reference information storage step for storing reference information inside the processing apparatus, which includes the holding table that does not hold the object to be processed, A processing step of processing the workpiece held in the holding table, A comparison information storage step, which stores comparison information within the processing apparatus, including the holding table that does not hold the object to be processed corresponding to the reference information, before or after the processing step, An abnormality determination step in which an abnormality is determined inside the processing apparatus, including the holding table, based on the reference information and the comparison information, The system includes a removal step to remove the aforementioned abnormality, If the abnormality determination step determines that the abnormality has occurred, the removal step is executed. If the abnormality determination step determines that no abnormality has occurred, the processing step is executed. Processing method.

2. The processing method according to claim 1, An abnormality removal determination step for determining whether the abnormality can be removed by the removal step, The system further includes a notification step that, if it is determined by the abnormality removal determination step that the abnormality cannot be removed, notifies that the abnormality has occurred. Processing method.

3. A processing method according to claim 1 or 2, The aforementioned reference information storage step involves storing the image captured and acquired by the imaging unit as the reference information. The comparison information storage step involves storing the comparison image acquired by the imaging unit as the comparison information. Processing method.

4. A processing method according to claim 1 or 2, The removal step involves supplying liquid to the holding table for cleaning. Processing method.

5. A processing method according to claim 1 or 2, The removal step involves polishing the holding table with an abrasive member. Processing method.

6. A processing method according to claim 1 or 2, The removal step is, A bellows section, provided in the direction of movement of the holding table and expandable and contractable with the movement of the holding table, is supplied with liquid for cleaning. Processing method.

7. Apparatus for processing a workpiece, A holding table for holding the object to be processed, A processing unit that performs processing on the object to be processed held by the holding table, An information acquisition unit that acquires information about the inside of the processing apparatus, including the holding table, An abnormality removal unit for removing abnormalities inside the processing apparatus, including the holding table, The apparatus comprises a control unit for controlling the aforementioned processing device, The control unit is A first storage unit stores internal reference information of the processing apparatus, including the holding table which does not hold the object to be processed, which was previously acquired by the information acquisition unit. A second storage unit stores comparison information of the inside of the processing apparatus, including the holding table that does not hold the object to be processed, acquired by the information acquisition unit, before or after processing by the processing unit, An abnormality determination unit that determines the abnormality inside the processing apparatus based on the reference information and the comparison information, It comprises a processing execution unit, The processing execution unit, If the abnormality detection unit determines that no abnormality has occurred, the holding table holds the workpiece, and the processing unit processes the workpiece. If the abnormality detection unit determines that the abnormality has occurred, the abnormality removal unit performs a process to remove the abnormality. Processing device.

8. The apparatus according to claim 7, The control unit is If the aforementioned abnormality cannot be eliminated, the system further includes a notification unit that notifies that the aforementioned abnormality has occurred. Processing device.

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