Sheet peeling apparatus, sheet peeling method, and chip manufacturing method

Abstract

The present invention provides a sheet peeling device that can detect when chips or other components have peeled off the sheet. [Solution] The sheet peeling device includes a chuck table that holds a second sheet fixed to the second surface of a plurality of chips, the second sheet being fixed to the first surface of a plurality of chips, the second sheet being fixed to the first surface of a plurality of chips, the second sheet being fixed to the first surface of a plurality of chips, a peeling unit that peels the first sheet from the plurality of chips while the second sheet is held by the chuck table, and a detection unit that detects when a chip or a part thereof has been peeled off from the second sheet.

Description

Technical Field

[0001] The present invention relates to a sheet peeling apparatus and a sheet peeling method used when peeling a sheet fixed to a plurality of chips, and a chip manufacturing method including the sheet peeling method.

Background Art

[0002] In order to realize small and lightweight chips, a technique called pre-dicing has been proposed, in which a wafer having devices such as integrated circuits provided on the front surface side is divided into a plurality of chips while being thinly processed (see, for example, Patent Document 1). In pre-dicing, first, streets as boundary lines partitioning a plurality of regions to be turned into chips are set on the wafer, and grooves are formed on one surface (hereinafter referred to as the front surface) of the wafer so as to overlap the streets.

[0003] Thereafter, the wafer is ground from the other surface (hereinafter referred to as the back surface) side where no groove is formed, such that the side walls of the groove are exposed on the back surface side. As a result, the wafer is divided along the streets while being thinned, and a plurality of chips that are sufficiently thinner than the wafer serving as the base material of the chips can be obtained.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0005] Incidentally, when grinding a wafer from the back side, a protective sheet is usually fixed (attached) to the front side of the wafer to prevent damage to the front side from impacts from the processing tool. However, in this case, the front side of the chips obtained from the wafer is covered by the sheet, making it difficult to identify the position of each chip based on the patterns of devices on the front side and pick up a specific chip.

[0006] Therefore, another sheet is fixed to the back side of multiple exposed chips, and the sheet that was fixed to the front side of the multiple chips is peeled off. However, when the sheet on the front side is peeled off, the chips or parts thereof (hereinafter referred to as "chips, etc.") may peel off from the sheet on the back side and scatter into the surroundings. For example, if chips, etc. scatter within the device, it is highly likely to adversely affect subsequent processing performed in that device.

[0007] Therefore, the object of the present invention is to provide a sheet peeling device and a sheet peeling method that can detect when chips or the like have peeled off from a sheet, as well as a chip manufacturing method including this sheet peeling method. [Means for solving the problem]

[0008] According to one aspect of the present invention, a sheet peeling device is provided, comprising: a chuck table that holds a second sheet fixed to a second surface facing the opposite side of a plurality of chips, the first sheet being fixed to a first surface; a peeling unit that peels the first sheet from the plurality of chips while the second sheet is held by the chuck table; and a detection unit that detects when a chip or a part thereof has been peeled off from the second sheet.

[0009] In one aspect of the present invention, the peeling unit comprises a pair of peeling rollers that the first sheet contacts when peeling the first sheet from a plurality of chips, and the detection unit may detect that the chips or a part thereof have been peeled off the second sheet by detecting the adhesion of the chips or a part thereof to the peeling rollers.

[0010] Furthermore, in one aspect of the present invention, the detection unit may detect that a chip or a part thereof has peeled off the second sheet by detecting the adhesion of the chip or a part thereof to the first sheet that has been peeled off from a plurality of chips.

[0011] Furthermore, in one aspect of the present invention, the detection unit may detect that a chip or a part thereof has been detached from the second sheet by detecting that no chips or parts thereof remain on the second sheet after the first sheet has been detached from a plurality of chips.

[0012] According to another aspect of the present invention, a sheet peeling method is provided, comprising: holding a second sheet fixed to a second surface facing the opposite side of a plurality of chips to which a first sheet is fixed to a first surface using a chuck table; forming an actuated portion on the first sheet to which a force for peeling the first sheet from the plurality of chips is applied; applying force to the actuated portion to peel the first sheet from the plurality of chips; and detecting that a chip or a part thereof has peeled off the second sheet while peeling the first sheet from the plurality of chips or after peeling the first sheet from the plurality of chips.

[0013] In another aspect of the present invention, when peeling the first sheet from a plurality of chips, a pair of peeling rollers are rotated so as to contact the first sheet, and when it is detected that a chip or a part thereof has peeled off from the second sheet, the adhesion of the chip or a part thereof to the peeling roller is detected.

[0014] In another aspect of the present invention, when detecting that the chip or a part thereof has peeled off from the second sheet, the adhesion of the chip or a part thereof to the first sheet, which has been peeled off from a plurality of the chips, may be detected.

[0015] In another aspect of the present invention, when detecting that the chip or a part thereof has peeled off from the second sheet, the first sheet may be peeled off from a plurality of the chips, and then it may be detected that the chip or a part thereof is not remaining on the second sheet.

[0016] According to yet another aspect of the present invention, a chip manufacturing method is provided which includes the sheet peeling method described above, wherein, before holding the second sheet with the chuck table, a plate-like object to which the first sheet is fixed is divided to manufacture a plurality of chips, and then the second sheet is fixed to the plurality of chips. [Effects of the Invention]

[0017] According to the sheet peeling apparatus according to one aspect of the present invention, the sheet peeling method according to another aspect, and the chip manufacturing method according to yet another aspect, it is possible to detect when a chip or a part thereof has peeled off from the second sheet while peeling the first sheet from a plurality of chips or after peeling the first sheet from a plurality of chips. [Brief explanation of the drawing]

[0018] [Figure 1] Figure 1 is a schematic plan view showing an example of a frame unit. [Figure 2] Figure 2 is a schematic cross-sectional view showing an example of a frame unit. [Figure 3] Figure 3 is a schematic diagram showing an example of a sheet peeling device. [Figure 4] Figure 4 is a flowchart showing an example of a chip manufacturing method, including a sheet peeling method. [Figure 5] Figure 5 schematically shows how the frame unit is held by a chuck table or the like. [Figure 6] Fig. 6 is a diagram schematically showing how a release tape is fixed to a sheet. [Figure 7] Fig. 7 is a diagram schematically showing how a sheet is peeled. [Figure 8] Fig. 8 is a diagram schematically showing how peeling of chips or the like is detected. [Figure 9] Fig. 9 is a diagram schematically showing how peeling of chips or the like is detected in a first modified example. [Figure 10] Fig. 10 is a diagram schematically showing how peeling of chips or the like is detected in a second modified example. MODE FOR CARRYING OUT THE INVENTION

[0019] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a plan view schematically showing an example of a frame unit used in the present embodiment, and Fig. 2 is a cross-sectional view schematically showing an example of the frame unit. A frame unit 1 shown in Fig. 1 and Fig. 2 includes a plurality of device chips (chips) 13 and a plurality of surplus chips (chips) 15 manufactured by dividing a plate-like object 11.

[0020] The plate-like object 11, which is the material of each device chip 13 and each surplus chip 15, is typically a disk-shaped wafer mainly containing a semiconductor such as silicon. That is, the plate-like object 11 has a circular front surface (first surface) 11a and a circular back surface (second surface) 11b facing the opposite side to the front surface 11a. The plate-like object 11 is divided into each device chip 13 and each surplus chip 15 along a plurality of streets (boundary lines, planned dividing lines) set substantially parallel to the front surface 11a and the back surface 11b.

[0021] Each device chip 13 is manufactured from the portion of the plate-like material 11 excluding the outer edge (the portion including the outer edge) (the central portion, the non-outer edge portion). An integrated circuit (IC) or other device 17 is provided on the surface 11a side of each device chip 13. On the other hand, each surplus chip 15 is manufactured from the outer edge of the plate-like material 11 and has a different external shape from the device chip 13. Furthermore, each surplus chip 15 does not have a device 17 that would be mounted on the device chip 13 that becomes the final product.

[0022] In this embodiment, a disc-shaped wafer containing a semiconductor such as silicon as the main material is exemplified as the plate-like object 11, but the material, shape, structure, size, etc. of the plate-like object 11 are not limited to the exemplified embodiment. For example, substrates mainly containing other semiconductors, ceramics, resins, metals, etc. can be used as the plate-like object 11. Similarly, the type, quantity, shape, structure, size, arrangement, etc. of the devices 17 are not limited to the exemplified embodiment. The plate-like object 11 may not even have devices 17 provided on it.

[0023] As shown in Figure 2, small gaps are provided between two adjacent device chips 13, between adjacent device chips 13 and surplus chips 15, and between two adjacent surplus chips 15. In other words, multiple device chips 13 and multiple surplus chips 15 are separated from each other by the aforementioned gaps.

[0024] When dividing a plate-like object 11 into multiple device chips 13 and multiple surplus chips 15, a method called pre-dicing is typically used. However, the plate-like object 11 may be divided into multiple device chips 13 and multiple surplus chips 15 using a method other than pre-dicing.

[0025] In pre-dicing, grooves are first formed on the surface 11a side of the plate-like object 11 in a manner that overlaps with each street. The grooves are formed, for example, by cutting using a processing tool called a cutting blade, or by ablation using a laser beam. However, the specific method for forming the grooves is not limited to the manner described above.

[0026] Subsequently, the plate-like object 11 is ground from the back surface 11b side so that the side walls of the grooves are exposed on the back surface 11b side of the plate-like object 11. Specifically, the plate-like object 11 is thinned by grinding from the back surface 11b side using a grinding tool called a grinding wheel. When the side walls of the grooves are exposed on the back surface 11b side of the plate-like object 11, the plate-like object 11 is divided into multiple device chips 13 and multiple surplus chips 15. Therefore, the multiple device chips 13 and multiple surplus chips 15 are separated from each other by the gaps that existed between the side walls of the grooves.

[0027] Before the plate-like object 11 is ground from the back surface 11b, for example, a sheet (first sheet) 21 is fixed (attached) to the surface 11a of the plate-like object 11. This protects the surface 11a of the plate-like object 11 from impacts during grinding, thereby reducing the possibility of damage to the device 17 during grinding.

[0028] The sheet 21 typically includes a base material made of resin or the like, and an adhesive layer (glue layer) provided on the surface of the base material. By bringing the adhesive layer of the sheet 21 into contact with the surface 11a of the plate-like object 11, the sheet 21 is fixed to the plate-like object 11. As shown in Figure 1, the sheet 21 of this embodiment is configured in a circular shape that is roughly the same size as the plate-like object 11 when viewed from a direction facing the surface 11a of the plate-like object 11 to which the sheet 21 is fixed. However, the shape and size of the sheet 21 are not limited to this embodiment.

[0029] After the plate-like object 11 is divided, another sheet (second sheet) 31 is fixed (attached) to the back surface 11b of the divided plate-like object 11 so that the sheet 21 fixed to the surface 11a of the divided plate-like object 11 can be peeled off. In other words, another sheet 31 is fixed to the back surface 11b of the multiple device chips 13 and the multiple surplus chips 15 so that the sheet 21 fixed to the surface 11a of the multiple device chips 13 and the multiple surplus chips 15 can be peeled off.

[0030] Sheet 31 has a similar structure to sheet 21 and typically includes a base material made of resin or the like, and an adhesive layer (glue layer) provided on the surface of the base material. By bringing the adhesive layer of sheet 31 into contact with the back surface 11b of the divided plate-like object 11, sheet 31 is fixed to the plate-like object 11, that is, to the multiple device chips 13 and the multiple surplus chips 15.

[0031] As shown in Figure 1 and other figures, the sheet 31 in this embodiment is configured in a circular shape that extends beyond the outer edge of the plate-like object 11 (a plurality of device chips 13 and a plurality of surplus chips 15) to which the sheet 31 is fixed, when viewed from a direction facing the surface 11a. However, the shape and size of the sheet 31 are not limited to this configuration.

[0032] An annular frame 41 is fixed (attached) to the outer edge of the sheet 31. The annular frame 41 has an opening 41a configured to accommodate the plate-like object 11, and is fixed to the sheet 31 so as to accommodate the plate-like object 11 in this opening 41a. As a result, the plate-like object 11 is integrated with the frame 41 via the sheet 31, and the frame unit 1 is completed.

[0033] Figure 3 is a schematic diagram illustrating an example of a sheet peeling device. Note that in Figure 3, some parts of the sheet peeling device are represented by functional blocks. Also, the X, Y, and Z axes used in the following explanation are perpendicular to each other.

[0034] The sheet peeling device 2 shown in Figure 3 includes a chuck table 4 configured to hold the frame unit 1 described above. The chuck table 4 comprises, for example, a disc-shaped frame 4a having a recess that opens upward (to one side of the Z-axis), and a holding plate 4b made of a porous material and positioned in the recess of the frame 4a.

[0035] A suction source, such as an ejector, is connected to the lower part of the retaining plate 4b via a flow path provided inside the frame 4a and a valve located outside the frame 4a. Therefore, when the valve is opened, the negative pressure generated by the suction source acts on the upper surface of the retaining plate 4b, i.e., the upper surface 4c of the chuck table 4, through the flow path.

[0036] The frame unit 1 described above is placed on the chuck table 4 such that the sheet 31 is in contact with the upper surface 4c of the chuck table 4. In this state, when negative pressure from the suction source acts on the upper surface 4c of the chuck table 4, the sheet 31 of the frame unit 1 is sucked into the chuck table 4. In other words, the sheet 31 of the frame unit 1 is held in place by the chuck table 4.

[0037] Furthermore, multiple clamps 6 are provided around the chuck table 4 to secure the annular frame 41 that constitutes the frame unit 1. The frame 41 of the frame unit 1 is secured by the multiple clamps 6 at the time the seat 31 of the frame unit 1 is held by the chuck table 4, or at the time immediately before or after that. Each clamp 6 may be configured to move along the Z-axis relative to the chuck table 4.

[0038] Below the chuck table 4, a table moving mechanism is provided. The table moving mechanism includes, for example, a screw shaft constituting a ball screw, a rotating mechanism such as a motor connected to the end of the screw shaft, and a moving table provided with a nut portion connected to the screw shaft, and moves the moving table along the screw shaft.

[0039] The chuck table 4 is supported by the movable table of the table movement mechanism, and when the table movement mechanism is activated, it moves along the screw axis together with the movable table. In this embodiment, the screw axis is arranged approximately parallel to the X axis, and the table movement mechanism can move the chuck table 4 along the X axis. However, the structure of the table movement mechanism is not limited to this embodiment.

[0040] A support roller 8 is positioned above the chuck table 4 to support the wound strip-shaped release tape 51. A rotating mechanism, such as a motor, is connected to the support roller 8, and the driving force generated by this mechanism controls the unwinding of the release tape 51. The release tape 51 unwinded from the support roller 8 is sent, for example, to a tape fixing unit 10 located to the side of the support roller 8 (on one side along the X-axis).

[0041] The tape fixing unit 10 includes a cutting tool 12, which has, for example, a sharp cutting edge, and is positioned so that this cutting edge faces downward. Below the cutting tool 12 is a cutting table 14 that receives the cutting edge of the cutting tool 12 on its upper surface. The cutting tool 12 is supported by, for example, a cutting tool moving mechanism and can be moved along the Z-axis relative to the cutting table 14. As the cutting tool moving mechanism, a fluid actuator such as an air cylinder, or an electric actuator including a motor can be used.

[0042] The cutting tool 12 and the cutting table 14 move relative to each other along the Z-axis, for example, with the release tape 51 placed on the upper surface of the cutting table 14, so that the cutting edge of the cutting tool 12 approaches the upper surface of the cutting table 14. As a result, the cutting tool 12 cuts into the portion of the release tape 51 supported by the cutting table 14, and the release tape 51 is cut at the portion cut by the cutting edge of the cutting tool 12.

[0043] A heat-pressing tool 16 is positioned to the side (one side along the X-axis) of the cutting tool 12 and the cutting table 14. The heat-pressing tool 16 is equipped with a heater made of an electric heating wire or the like, and its lower part generates heat when power is supplied. The heat-pressing tool 16 is supported by, for example, a heat-pressing tool moving mechanism and can be moved along the Z-axis relative to the chuck table 4. As the heat-pressing tool moving mechanism, fluid actuators such as air cylinders and electric actuators including motors can be used.

[0044] The chuck table 4 and the heat-press tool 16 move relative to each other along the Z-axis, for example, with the sheet 21 and a portion of the release tape 51 within the frame unit 1 held by the chuck table 4 positioned below the heat-press tool 16. As a result, a portion of the release tape 51 is pressed against the sheet 21 by the heat-press tool 16.

[0045] In this state, when the lower part of the heat-press tool 16 generates heat, heat is conducted from the heat-press tool 16 to the release tape 51 and sheet 21, causing the release tape 51 and sheet 21 to soften. After the release tape 51 and sheet 21 have softened sufficiently, the chuck table 4 and the heat-press tool 16 move relative to each other along the Z-axis so as to move away from each other.

[0046] When the chuck table 4 and the heat-pressing tool 16 are separated from each other and the release tape 51 and sheet 21 are cooled, the release tape 51 becomes firmly fixed to the sheet 21. It is acceptable for the release tape 51 and sheet 21 to melt slightly when softening them. Thus, the sheet release device 2 of this embodiment employs a technique called heat-pressing, in which pressure is applied to two or more objects that have been softened or melted by heat to fix them to each other.

[0047] In this embodiment, the support roller 8, tape fixing unit 10, etc., are supported by a lifting mechanism. This lifting mechanism includes, for example, a screw shaft constituting a ball screw, a rotating mechanism such as a motor connected to the end of the screw shaft, and a movable table provided with a nut connected to the screw shaft, and moves the movable table along the screw shaft.

[0048] The support rollers 8, tape fixing unit 10, etc., are supported by the movable table of this lifting mechanism, and when the lifting mechanism is operated, they move along the screw axis together with the movable table. In this embodiment, the screw axis is arranged approximately parallel to the Z axis, and the lifting mechanism can move (raise and lower) the support rollers 8, tape fixing unit 10, etc., along the Z axis relative to the chuck table 4. However, the structure of the lifting mechanism is not limited to this embodiment. A cutting tool moving mechanism, a heat press tool moving mechanism, etc., may be used as part of the lifting mechanism.

[0049] A peeling unit 18 is positioned above the chuck table 4 so as not to interfere with the support roller 8, tape fixing unit 10, etc. The peeling unit 18 includes a gripping part 20 for gripping the peeling tape 51 and a peeling force generating part 22 for generating a force to peel off the sheet 21.

[0050] The gripping section 20 includes a pair of gripping plates 20a and 20b arranged vertically, and a gripping plate moving mechanism that moves the gripping plates 20a and 20b relative to each other along the Z-axis. The gripping section 20a and 20b grip the release tape 51 by sandwiching it from above and below. The gripping plate moving mechanism can be a fluid actuator such as an air cylinder, or an electric actuator including a motor.

[0051] Furthermore, the gripping portion 20 is supported, for example, by a gripping portion movement mechanism and can move along both the X-axis and the Z-axis. Examples of gripping portion movement mechanisms include fluid actuators such as air cylinders, and electric actuators including motors.

[0052] The peeling force generating unit 22 includes a pair of peeling rollers 22a and 22b whose length along the Y-axis is longer than the diameter (maximum width) of the sheet 21, and a rotating mechanism such as a motor for rotating the peeling rollers 22a and 22b. The peeling rollers 22a and 22b are supported by a peeling roller moving mechanism and can move relative to each other along the X-axis. In this embodiment, the peeling roller moving mechanism can move each of the peeling rollers 22a and 22b along the X-axis in an independent manner.

[0053] The pair of peeling rollers 22a and 22b move relative to each other along the X-axis, for example, with a sheet 21 or a peeling tape 51 fixed to the sheet 21 placed between the peeling rollers 22a and 22b, so that they are sufficiently close to each other. The sheet 21 or peeling tape 51 is then sandwiched between the peeling rollers 22a and 22b in the direction along the X-axis.

[0054] In this state, when the peeling rollers 22a and 22b rotate, a force acts on the sheet 21 or the peeling tape 51 in a direction corresponding to the direction of rotation of the peeling rollers 22a and 22b. Therefore, by rotating the peeling rollers 22a and 22b in such a way that an upward force is applied to the sheet 21 or the peeling tape 51, the sheet 21 can be peeled off from the multiple device chips 13 and the multiple excess chips 15.

[0055] For example, a detection unit 24 is positioned above the range in which the peeling roller 22b can move along the X-axis. The detection unit 24 is typically a camera capable of photographing the surface of the peeling roller 22b positioned directly below it. This camera includes a two-dimensional optical sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor that is sensitive to visible light, and an imaging lens.

[0056] In this embodiment, the sheet peeling device 2 is configured such that when the sheet 21 is peeled from the multiple device chips 13 and the multiple excess chips 15, the surface of the sheet 21 that was fixed to the device chips 13 and the excess chips 15 comes into contact with the peeling roller 22b. Therefore, when the sheet 21 comes into contact with the peeling roller 22b while the device chips 13, the excess chips 15, or a part thereof (hereinafter referred to as "chips, etc.") remain on the sheet 21, the chips, etc. remaining on the sheet 21 peel off from the sheet 21 and adhere to the peeling roller 22b.

[0057] By detecting the adhesion of chips, etc., to the peeling roller 22b using the detection unit 24, it is possible to detect that chips, etc., remained on the sheet 21, or in other words, that the chips, etc., had peeled off from the sheet 31. If the detection unit 24 is a camera, it is desirable that the color of the peeling roller 22b and the color of the chips, etc., be sufficiently different so that the adhesion of chips, etc., to the peeling roller 22b can be determined by image processing such as binarization.

[0058] The type and structure of the detection unit 24 are not limited to the embodiments described above. The detection unit 24 only needs to be capable of detecting the adhesion of chips, etc., to the peeling roller 22b. For example, the detection unit 24 may be a back pressure sensor or the like that can detect surface irregularities of the peeling roller 22b caused by the adhesion of chips, etc.

[0059] A controller (control unit) 26 is connected to each part of the sheet peeling device 2 described above. This controller 26 is composed of, for example, a computer including a processing unit and a storage unit, and controls the operation of each part of the sheet peeling device 2 described above so that the sheet 21 is peeled off properly.

[0060] The processing unit is typically a CPU (Central Processing Unit) and performs various processes necessary to control the parts described above. The storage device includes, for example, a main memory such as DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive or flash memory. The functions of the controller 26 are realized, for example, by the processing unit operating according to a program stored in the storage device.

[0061] The controller 26 is connected to an input / output device that serves as a user interface. The input / output device is, for example, a touchscreen, which inputs commands from the operator to the controller 26. The input / output device also outputs (displays, in the case of a touchscreen) information related to the sheet peeling device 2 in a manner that the operator can recognize, based on the commands from the controller 26.

[0062] Furthermore, an input device having an input function and an output device having an output function may be connected to the controller 26, respectively. Examples of input devices include keyboards and mice. Examples of output devices include display devices such as liquid crystal displays, speakers capable of transmitting information by sound, and indicator lights capable of transmitting information by the color or state of light emission (illumination, blinking, off, etc.).

[0063] Next, a sheet peeling method performed using the sheet peeling apparatus 2 described above and a chip manufacturing method including this sheet peeling method will be explained. Figure 4 is a flowchart showing an example of a chip manufacturing method including a sheet peeling method. As shown in Figure 4, in the chip manufacturing method according to this embodiment, first, a frame unit 1 is formed (step S11).

[0064] As described above, when pre-dicing is applied, grooves are formed on the surface 11a side of the plate-like material 11 in any manner. Next, with the sheet 21 fixed to the surface 11a side of the plate-like material 11, the plate-like material 11 is ground from the back surface 11b side so that the side walls of the grooves are exposed on the back surface 11b side of the plate-like material 11. As a result, the plate-like material 11 is divided at the grooves, and multiple device chips 13 and multiple surplus chips 15 are manufactured.

[0065] After the plate-like object 11 is divided, another sheet 31 is fixed to the back surface 11b side of the divided plate-like object 11, that is, to the back surface 11b side of the multiple device chips 13 and the multiple surplus chips 15. In addition, an annular frame 41 is fixed to the outer edge of the sheet 31 so that the plate-like object 11 is housed in its opening 41a. In this way, a frame unit 1 is formed in which the plate-like object 11 (multiple device chips 13 and multiple surplus chips 15), the sheet 21, the sheet 31, and the frame 41 are integrated.

[0066] After the frame unit 1 is formed, the sheet peeling method according to this embodiment is carried out. Specifically, first, the frame unit 1 is brought into the sheet peeling device 2 and held by a chuck table 4 or the like (step S12). Figure 5 is a schematic diagram showing how the frame unit 1 is held by the chuck table 4 or the like.

[0067] When the frame unit 1 is held by the chuck table 4, etc., as shown in Figure 5, the chuck table 4 is first positioned at an loading / unloading position from which the frame unit 1 can be loaded from above. The loading / unloading position is, for example, a position where, when viewed from a direction facing the top surface 4c of the chuck table 4, the support roller 8, tape fixing unit 10, and peeling unit 18 do not overlap with the chuck table 4.

[0068] Next, the frame unit 1 is placed on the chuck table 4 so that the sheet 31 is in contact with the upper surface 4c of the chuck table 4. Then, negative pressure from the suction source acts on the upper surface 4c of the chuck table 4, and the sheet 31 is held in place by the chuck table 4. In addition, the frame 41 is secured by multiple clamps 6. In this way, the frame unit 1 is held in place by the chuck table 4 and the like.

[0069] After the frame unit 1 is held by the chuck table 4, etc., the release tape 51 is fixed (heat-pressed) to the sheet 21 (step S13). Figure 6 is a schematic diagram showing how the release tape 51 is fixed to the sheet 21. When fixing the release tape 51 to the sheet 21, as shown in Figure 6, the chuck table 4 moves from the loading / unloading position to the tape fixing position so that the edge of the sheet 21 is positioned directly below the heat-pressing tool 16.

[0070] Furthermore, the peeling rollers 22a and 22b move relative to each other along the X-axis, separating from one another, so that the support roller 8 and the tape fixing unit 10 can be positioned between them. Subsequently, the support roller 8 and the tape fixing unit 10 move to the lower tape fixing position. The peeling tape 51 is then fed out from the support roller 8 so that it passes between the cutting tool 12 and the cutting table 14 and between the chuck table 4 and the heat-pressing tool 16, and is gripped by the gripping unit 20.

[0071] In this state, the heat-pressing tool 16 descends relative to the chuck table 4, pressing a portion 53 of the release tape 51 against the edge of the sheet 21, as shown in Figure 6. Furthermore, the lower part of the heat-pressing tool 16 generates heat, softening the portion 53 of the release tape 51 and the edge of the sheet 21. Subsequently, as the heat-pressing tool 16 rises relative to the chuck table 4, the release tape 51 and the sheet 21 cool, and the portion 53 of the release tape 51 is fixed to the edge of the sheet 21.

[0072] The end of the sheet 21 to which a portion 53 of the release tape 51 is fixed functions as the acted portion to which the peeling force acts on the sheet 21 at the initial timing when the sheet 21 is peeled off from the multiple device chips 13 and the multiple surplus chips 15. In other words, when a force for peeling the sheet 21 is applied to the acted portion of the sheet 21, the peeling of the sheet 21 begins.

[0073] Furthermore, at the time when this portion to be acted upon is formed on the sheet 21, or at a timing immediately before or after that, the cutting tool 12 cuts into the release tape 51, and the release tape 51 is cut. As a result, a release tape (release tape piece) 55 is obtained that is fixed to the sheet 21 and held by the gripping part 20.

[0074] After the release tape 55 fixed to the sheet 21 is obtained, the sheet 21 is peeled off from the multiple device chips 13 and the multiple surplus chips 15 (step ST14). Figure 7 is a schematic diagram showing how the sheet 21 is peeled off.

[0075] First, the support roller 8 and the tape fixing unit 10 move to an upper retracted position. Next, with the gripping part 20 that grips the peeling tape 55 positioned above the peeling rollers 22a and 22b, the peeling rollers 22a and 22b move relative to each other along the X-axis and approach each other.

[0076] As a result, a portion of the release tape 55 is gripped by the release rollers 22a and 22b in the direction along the X axis. Subsequently, as the release rollers 22a and 22b rotate and an upward force is applied to the release tape 55, an upward force is also applied to the affected portion (the end of the sheet 21 to which a portion 53 of the release tape 51 is fixed), and the sheet 21 begins to peel off from the position corresponding to this affected portion.

[0077] Subsequently, as the peeling rollers 22a and 22b continue to rotate, the sheet 21 is gradually peeled away from the multiple device chips 13 and the multiple excess chips 15, as shown in Figure 7. During this process, the chuck table 4 moves along the X-axis in a direction that does not hinder the peeling of the sheet 21, in accordance with the speed at which the sheet 21 is peeled away.

[0078] Similarly, the gripping unit 20 moves in accordance with the speed at which the sheet 21 is peeled off. The sheet 21, which has been completely peeled off from the multiple device chips 13 and the multiple excess chips 15, is transported by the gripping unit 20 and discarded. During the process described above in which the sheet 21 is peeled off, the sheet 21 comes into contact with the peeling rollers 22a and 22b.

[0079] After the sheet 21 has been completely detached from the multiple device chips 13 and the multiple surplus chips 15, it is confirmed whether the device chips 13, the surplus chips 15, or any part thereof (i.e., chips, etc.) have detached from the sheet 31 (step S15). Figure 8 is a schematic diagram showing how the detachment of chips, etc., is detected.

[0080] Specifically, as shown in Figure 8, the peeling roller 22b, which was in contact with the surfaces of the device chip 13 and excess chip 15 of the sheet 21, moves directly below the detection unit 24, and the surface of the peeling roller 22b is photographed by the detection unit 24. The obtained image is sent to the controller 26.

[0081] The controller 26 performs image processing, such as binarization, on the obtained image to determine whether or not chips or the like are attached to the surface of the peeling roller 22b. If it is determined that chips or the like are attached to the surface of the peeling roller 22b, that is, if it is detected that chips or the like have peeled off from the sheet 31 (YES in step ST15), the controller 26 issues a warning to inform the operator or the like (step ST16). After that, the frame unit 1 is discharged from the sheet peeling device 2 (step ST17).

[0082] In this case, for example, the operator can clean each part of the sheet peeling device 2 after the frame unit 1 has been removed from the sheet peeling device 2, in order to prevent any adverse effects on the peeling process of the next sheet. On the other hand, if it is not determined that chips or the like are attached to the surface of the peeling roller 22b, that is, if it is not detected that the chips or the like have been peeled off from the sheet 31 (NO in step ST15), the controller 26 does not issue a warning. Thereafter, the frame unit 1 is similarly removed from the sheet peeling device 2 (step ST17).

[0083] As described above, according to the sheet peeling apparatus 2, sheet peeling method, and chip manufacturing method of this embodiment, after peeling the sheet (first sheet) 21 from the plurality of device chips (chips) 13 and the plurality of surplus chips (chips) 15, it is possible to detect that the chips, etc. (device chips 13, surplus chips 15, or a part thereof) have peeled off from the sheet (second sheet) 31.

[0084] The present invention is not limited by the embodiments described above and can be implemented in various modified forms. For example, in the embodiments described above, the peeling of chips, etc. from the sheet 31 is detected by the detection unit 24 detecting chips, etc. adhering to the peeling roller 22b, but the peeling of chips, etc. may be detected by other methods.

[0085] Figure 9 schematically shows how the detachment of chips, etc., is detected in the sheet peeling method and chip manufacturing method according to the first modified example. In this first modified example, the detachment of chips, etc., from the sheet 31 is detected by detecting the adhesion of chips, etc., to the peeled sheet 21.

[0086] Specifically, in the first modified example, as shown in Figure 9, for example, the state of the sheet 21 immediately after passing between the peeling roller 22a and the peeling roller 22b is checked by the detection unit 32. In other words, in the sheet peeling method and chip manufacturing method according to this first modified example, the state of the surface of the sheet 21 that was fixed to the device chip 13 and the excess chip 15 immediately after passing between the peeling roller 22a and the peeling roller 22b is checked by the detection unit 32.

[0087] Therefore, the detection unit 32 is positioned to check the state of the sheet 21 immediately after it has passed between the peeling roller 22a and the peeling roller 22b when checking for peeling of chips, etc. More specifically, the detection unit 32 is positioned above the peeling roller 22b when the sheet 21 is being peeled from multiple device chips 13 and multiple excess chips 15.

[0088] The sheet peeling method and chip manufacturing method according to the first modified example are the same as the sheet peeling method and chip manufacturing method according to the embodiment described above, except for the part in which it is confirmed whether or not the chips have been peeled off from the sheet 31. In this first modified example, as shown in Figure 9, when the sheet 21 is peeled off from the multiple device chips 13 and the multiple surplus chips 15, it is confirmed whether or not the chips have been peeled off.

[0089] In other words, when the sheet 21 is being peeled off from the multiple device chips 13 and the multiple surplus chips 15, the surface of the sheet 21 that was fixed to the device chips 13 and the surplus chips 15 is photographed by the detection unit 32. The obtained image is sent to the controller 26.

[0090] The controller 26 performs image processing, such as binarization, on the obtained image to determine whether or not chips or the like are attached to the surface of the sheet 21 that was fixed to the device chip 13 and the surplus chip 15. In this first modified example, it is desirable that the color of the sheet 21 and the color of the chips or the like are sufficiently different so that the attachment of chips or the like to the sheet 21 can be determined by image processing such as binarization.

[0091] The flow after it is determined that chips or the like are attached to sheet 21, that is, after it is detected that chips or the like have peeled off from sheet 31, is the same as the sheet peeling method and chip manufacturing method according to the embodiment described above. Similarly, the flow after it is determined that chips or the like are not attached to sheet 21, that is, after it is not detected that chips or the like have peeled off from sheet 31, is also the same as the sheet peeling method and chip manufacturing method according to the embodiment described above.

[0092] Furthermore, by positioning the detection unit 24 at the location of the detection unit 32 in Figure 9, the surface of the peeling roller 22b can be photographed while the sheet 21 is being peeled from the device chip 13 and the excess chip 15. In other words, in the sheet peeling method and chip manufacturing method according to the above-described embodiment, the state of the peeling roller 22b can be checked while the sheet 21 is being peeled from the device chip 13 and the excess chip 15, and the peeling of the chips etc. from the sheet 31 can be detected.

[0093] Figure 10 schematically shows how the detachment of chips, etc., is detected in the sheet peeling method and chip manufacturing method according to the second modified example. In this second modified example, the detachment of chips, etc., from the sheet 31 is detected by detecting that no chips, etc., remain on the sheet 31 after the sheet 21 has been peeled off from the multiple device chips 13 and the multiple surplus chips 15.

[0094] The sheet peeling method and chip manufacturing method according to the second modified example are the same as the sheet peeling method and chip manufacturing method according to the embodiment described above, except for the part that confirms whether or not the chips have been peeled off from the sheet 31. In this second modified example, as shown in Figure 10, after the sheet 21 has been peeled off from the multiple device chips 13 and the multiple surplus chips 15, the chuck table 4 moves so that it passes directly under the detection unit 24, so that the detection unit 24 takes a picture of the entire sheet 31. The obtained image is sent to the controller 26.

[0095] The controller 26 performs image processing such as binarization on the obtained image and determines whether or not chips remain in the positions on the sheet 31 where they should remain. In this second modified example, it is desirable that the color of the sheet 31 and the color of the chips are sufficiently different so that the presence or absence of chips on the sheet 31 can be determined by image processing such as binarization.

[0096] The flow after it is determined that no chips or the like remain on the sheet 31, that is, after it is detected that the chips or the like have been peeled off from the sheet 31, is the same as the sheet peeling method and chip manufacturing method according to the embodiment described above. Furthermore, the flow after it is determined that chips or the like remain on the sheet 31, that is, after it is not detected that the chips or the like have been peeled off from the sheet 31, is also the same as the sheet peeling method and chip manufacturing method according to the embodiment described above.

[0097] Furthermore, in the embodiments and variations described above, for example, the detection unit 24, the detection unit 32, etc., may be configured to be movable as needed.

[0098] Furthermore, the structures, methods, etc., of the embodiments and their respective modifications described above may be modified as appropriate, as long as they do not deviate from the scope of the present invention. [Explanation of Symbols]

[0099] 2: Sheet peeling device 4: Chuck Table 4a: Frame 4b: Holding plate 4c:Top surface 6: Clamp 8: Support roller 10: Tape fixing unit 12: Cutting tools 14: Cutting table 16: Heat compression tool 18: Peeling Unit 20: Grip part 20a: Gripping plate 20b: Grip plate 22: Peeling force generating section 22a: Peeling roller 22b: Peeling roller 24: Detection Unit 26: Controller (control unit) 32: Detection Unit 51: Release tape 53: some 55: Release tape (piece of release tape) 1: Frame Unit 11: Plate-like object 11a: Surface (first side) 11b: Back side (second side) 13: Device chip (chip) 15: Surplus chips (chips) 17: Device 21: Sheet (First Sheet) 31: Seat (2nd seat) 41: Frame 41a: Opening

Claims

1. A sheet peeling device, A chuck table that holds a second sheet fixed to the second side of a plurality of chips, each having a first sheet fixed to its first side, and the second sheet fixed to the second side facing the opposite side from the first side. A peeling unit that peels the first sheet from a plurality of chips while the second sheet is held by the chuck table, A sheet peeling device comprising a detection unit that detects when the chip or a part thereof has peeled off from the second sheet.

2. The peeling unit is, The first sheet is provided with a pair of peeling rollers that the first sheet contacts when peeling the first sheet from a plurality of chips, The detection unit is, The sheet peeling device according to claim 1, which detects that the chip or a part thereof has been peeled off the second sheet by detecting the adhesion of the chip or a part thereof to the peeling roller.

3. The detection unit is, The sheet peeling device according to claim 1, which detects that a chip or a part thereof has been peeled off from the second sheet by detecting the adhesion of the chip or a part thereof to the first sheet that has been peeled off from a plurality of the chips.

4. The detection unit is, The sheet peeling device according to claim 1, which detects that the chips or a part thereof have been peeled off the second sheet by detecting that no chips or a part thereof remain on the second sheet after the first sheet has been peeled off from a plurality of chips.

5. A method for peeling off a sheet, A chuck table holds a second sheet, which is fixed to the second side of a plurality of chips, the side facing the opposite side from the first side of the first sheet fixed to the first side of each chip. A portion of the first sheet is formed on which a force is applied to peel the first sheet from a plurality of chips. Applying force to the affected portion, the first sheet is peeled off from the multiple chips. A sheet peeling method for detecting that a chip or a part thereof has peeled off the second sheet while peeling the first sheet from a plurality of chips, or after peeling the first sheet from a plurality of chips.

6. When peeling the first sheet from multiple chips, a pair of peeling rollers are rotated so as to contact the first sheet. The sheet peeling method according to claim 5, wherein when it is detected that the chip or a part thereof has peeled off from the second sheet, the adhesion of the chip or a part thereof to the peeling roller is detected.

7. The sheet peeling method according to claim 5, wherein when it is detected that the chip or a part thereof has peeled off from the second sheet, the adhesion of the chip or a part thereof to the first sheet peeled off from a plurality of the chips is detected.

8. The sheet peeling method according to claim 5, wherein when detecting that the chip or a part thereof has peeled off from the second sheet, the first sheet is peeled off from a plurality of chips, and then it is detected that the chip or a part thereof does not remain on the second sheet.

9. A chip manufacturing method comprising a sheet peeling method according to any one of claims 5 to 8, A chip manufacturing method comprising, before holding the second sheet with the chuck table, dividing a plate-like object to which the first sheet is fixed to produce a plurality of chips, and then fixing the second sheet to the plurality of chips.

Images