Support structure for expansion board of information processing device, support arm for expansion board of information processing device, information processing device

Abstract

This invention provides a support structure for expansion boards of an information processing device, an information processing device, and a support arm that ensure mechanical strength and suppress the complexity of the housing structure for various types of expansion boards. [Solution] The housing of the industrial controller has a motherboard 4 screwed to the bottom panel 3a, a cooling fan and a group of intake vents 3d provided on the side panel 3b, and an exhaust vent provided on the side panel 3c opposite to panel 3b. A CPU is mounted in a socket on the motherboard 4, and a heatsink 7 is attached to the CPU. An expansion board 12 is arranged in parallel to the motherboard 4 in the direction normal to the board surface, and an air guide 25 is provided to divide the cooling air from the cooling fan between the heatsink 7 and the expansion board 7, and a support arm 26 is provided to support the expansion board 12 on the air guide 25.

Description

Technical Field

[0001] The present invention relates to a technology for supporting an expansion board of an information processing apparatus such as an industrial controller.

Background Art

[0002] Information processing apparatuses such as industrial controllers are widely used in a wide range of fields including general industries such as steel, paper pulp, and petrochemical plants, social infrastructure such as communication, transportation, water supply and sewerage systems, and buildings, as well as manufacturing equipment and environment-related equipment in various power-related fields, and support social infrastructure as the core of control systems.

[0003] However, along with the improvement of computing performance in recent years, the amount of heat generated has increased, and cooling inside miniaturized and densified casings has become important.

[0004] For example, Patent Document 1 proposes a structure for an electronic component in which an air guide portion for guiding cooling air is provided in a through-hole formed in a substrate. Further, Patent Document 2 proposes a structure in which the interior of a casing is partitioned to narrow and direct cooling air toward an object to be cooled.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problem to be Solved by the Invention

[0006] In an industrial controller, components that require cooling may be added by attaching / detaching electronic components such as an expansion board (expansion device). However, conventional technologies such as those disclosed in Patent Documents 1 and 2 do not take into consideration that this causes a change in the path of cooling air, leading to a decrease in cooling efficiency. Accordingly, a structure that secures cooling when the expansion board is attached or detached by providing an air guide has been proposed.

[0007] In this structure, although the air guide is located on the intake side of the expansion board, partitioning the inside of the enclosure is undesirable from the standpoint of supple cooling airflow. Therefore, a structure is used in which the air guide does not extend to the expansion board, and in such a structure, the air guide cannot be used as a support structure for the expansion board.

[0008] These expansion boards are typically supported by screws to the casing of the slot and by connecting to the connectors on the motherboard or riser board. In the case of larger video cards, it is not uncommon for heatsinks and other components to be supported by brackets.

[0009] However, when installing enlarged expansion boards in industrial controllers, support by screwing into slots or attaching connectors may not provide sufficient mechanical strength to meet vibration resistance requirements. In this case, support methods such as the aforementioned brackets can be considered, but this complicates the internal structure of the enclosure, and there may be cases where separate boards or other components are installed in the same location as the brackets, making it unsuitable.

[0010] This invention was made to solve the aforementioned conventional problems, and aims to ensure mechanical strength in the support structure for various expansion boards and to suppress the complexity of the housing structure. [Means for solving the problem]

[0011] (1) One aspect of the present invention is: A support structure for an expansion board disposed within the casing of an information processing device, A high-heat-generating element is placed on the motherboard inside the aforementioned enclosure, Within the enclosure, an expansion board is located in the direction normal to the surface of the motherboard, Equipped with, The device is characterized by having a support arm that supports the expansion board in the housing.

[0012] (2) Preferred forms of the support structure are: A fan and intake port are provided on the intake side of the housing, An exhaust port is provided on the side surface of the housing facing the intake side, An air guide that divides the cooling air generated by the fan into directions for the heat-generating element and directions for the expansion board, Furthermore, The aforementioned wind guide is The extended material extends from the intake side to just before the expansion substrate, The expansion board is characterized by being supported by the air guide.

[0013] (3) Other aspects of the present invention are: A support arm for supporting an expansion board mounted inside the housing of an information processing device, The aforementioned information processing device is A high-heat generating element on the motherboard mounted inside the aforementioned enclosure, Within the enclosure, an expansion board is located in the direction normal to the surface of the motherboard, A fan and intake port are provided on the intake side of the housing, An exhaust port is provided on the side surface of the housing facing the intake side, An extension member from the intake side to just before the expansion board, and an air guide that divides the cooling air generated by the fan into the direction of the high heat-generating element and the direction of the expansion board, While possessing, A mounting part fixed to the wind guide, A clamping portion that grips the aforementioned expansion substrate, The arm body between the two aforementioned parts, It is characterized by having the following features.

[0014] (4) The present invention can also be configured as an information processing device equipped with the support structure described above. [Effects of the Invention]

[0015] According to the present invention, a support structure for various expansion boards using an air guide is enabled. In this respect, it is possible to secure the mechanical strength of the expansion board support and suppress the complication of the housing structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] [Figure 1] A plan view showing a device structure inside a housing of an industrial controller according to an embodiment of the present invention. [Figure 2] The same perspective view. [Figure 3] A perspective view showing the same fan. [Figure 4] A perspective view showing the fixing structure of the same air guide. [Figure 5] A perspective view showing a fixed state of a slot of the same expansion board. [Figure 6] An enlarged view showing a support structure of an expansion board using the support arm of Embodiment 1. [Figure 7] A longitudinal sectional view showing the cooling structure of Embodiment 2. [Figure 8] A longitudinal sectional view showing the cooling structure of Embodiment 3. [Figure 9] A longitudinal sectional view showing the cooling structure of Embodiment 4. DESCRIPTION OF EMBODIMENTS

[0017] Hereinafter, an information processing apparatus according to an embodiment of the present invention will be described. Here, an example of application to an industrial controller having an image processing function as an example of the information processing apparatus will be described.

[0018] 1 in FIGS. 1 to 3 indicates the industrial controller. This industrial controller 1 is configured by a computer, and accommodates a device structure such as electronic components in a box-shaped housing 2.

[0019] A motherboard 4 is attached to a bottom plate 3a (see FIG. 2) of the housing 2 by screwing. A CPU is mounted in a socket of the motherboard 4, and a heat sink 7 for cooling the CPU is attached on the CPU.

[0020] The right side (see Figure 1) of the housing 2 is equipped with a panel 3b and a grid-like finger guard 21 (see Figures 2 and 4). As shown in Figure 4, a triple cooling fan 20 is mounted between the panel 3b and the finger guard 21, and an air guide 25 is screwed to the left side of the finger guard 21.

[0021] The left side of the housing 2 is equipped with a panel 3c, and a group of exhaust vents 3e is formed on the panel 3c. In other words, the right side of the housing 2 is the intake side, while the left side is the exhaust side. Hereinafter, these will be referred to as the intake side R and the exhaust side L.

[0022] A PCI-E board 10 is mounted on the exhaust side L of motherboard 4, and the PCI-E board 10 is supported by panel 3c. The terminal lane 12a of the expansion board (expansion circuit board) 12 is attached to the connector 11 of this PCI-E board 10.

[0023] Therefore, the expansion board 12 is positioned in the direction normal to the motherboard 4 and is arranged parallel to the motherboard 4. This expansion board 12 is envisioned to be, for example, an AI accelerator such as a graphics card, and a heatsink 13 for cooling the GPU or other components is fixed to its top.

[0024] The support structure of the expansion board 12 and the cooling structure using the air guide 25 will be described below based on examples. Example 1 shows the support structure of the expansion board 12, and Examples 2 to 4 show the cooling structure using the air guide. [Examples]

[0025] First, the support structure of the expansion board 12, i.e., Embodiment 1, will be described. As mentioned above, the terminal lane 12a is attached to the connector 11, so the exhaust side L of this expansion board 12 is supported by the connector 11.

[0026] On the other hand, although one corner (corner on side B) of the expansion board 12 is fixed to the housing 2 panel 3f (see Figure 5) by screw fastening of the slot 27, the other corner (corner on side F) is free, which may cause stress to concentrate on the connector 11 and the slot 27.

[0027] In this case, although an air guide 25 is positioned on the intake side R of the expansion board 12, the air guide 25 is an extension that only extends to the front of the expansion board 12, and therefore cannot be used to support the expansion board 12.

[0028] Therefore, in this embodiment, a structure is adopted in which the terminal lane 12a attached to the connector 11 of the expansion board 12 is supported on the opposite side via a metal support arm 26.

[0029] (1) Example configuration As shown in Figure 6, the support arm 26 is formed in an L-shape and has a plate-shaped arm body 26a, a mounting portion 26b provided at one end of the arm body 26a, and a bent clamping portion 26c at the other end of the arm body 26a.

[0030] As shown in Figures 2 and 6, the arm body 26a is positioned vertically on the plane of the wind guide 25 and has a tapered end. A mounting portion 26b is fixed to the lower part of this tapered end by welding, while the other end is bent towards side B to form a clamping portion 26c, and an inverted U-shaped groove portion 26d (see Figure 2) is formed near the exhaust side L in the center. Since a cushioning material 28, which will be described later, can be stored in this groove portion 26d, it will henceforth be referred to as the storage portion 26d.

[0031] As shown in Figures 1 and 6, the mounting portion 26b is formed in a substantially rectangular shape and has an adjustment hole 26h. This adjustment hole 26h is formed as an elongated hole along the longitudinal direction of the mounting portion 26b, and the shaft of the bolt 29 passed through the adjustment hole 26h is fastened to a female threaded hole (not shown) formed in the air guide 25. By loosening this fastening, moving the support arm 26, and then fastening it again, the mounting position of the support arm 26 can be freely adjusted along the intake side R and exhaust side L inside the housing 2.

[0032] As shown in Figures 4 and 6, the clamping portion 26c is formed in a substantially concave shape to clamp the side end 12b (exhaust side L) of the extension board 12, and has a bottom portion 26e bent from the other end of the arm body 26a, and a pair of clamping pieces 26f erected on the bottom portion 26e, with a clamping groove 26g provided inside.

[0033] As shown in Figure 6, a resin cushioning material 28, formed in a roughly concave shape, is inserted into the clamping groove 26g. The side end 12b of the extension board 12 is pressed into this cushioning material 28, and the side end 12b of the extension board 12 is clamped by the clamping portion 26c. This cushioning material 28 can be housed by clamping the bottom of the groove (arm body 26a) of the storage portion 26d described above.

[0034] The thickness of the groove bottom of the storage section 26d should be such that the cushioning material 28 can be inserted, and may be about the same thickness as or slightly thicker than the expansion board 12 to be installed. Preferably, the groove width should be about the same as the cushioning material 28.

[0035] (2) Installation work To install the support arm 26, adjust the fixing position of the mounting portion 26b along the adjustment hole 26h according to the distance from the expansion board 12, then fasten the bolt 29, and sandwich the side end 12b of the expansion board 12 inside the cushioning material 18.

[0036] As a result, even if the air guide 25 does not extend to the expansion board 12, the side end 12b of the expansion board 12 is supported by the air guide via the support arm 26. Consequently, the exhaust side L of the expansion board 12 is supported by the connector 11, while the intake side R is supported by the housing 2 by the screw fastening of the slot portion 27 and the air guide 15 via the support arm 26.

[0037] Therefore, the expansion board 12 is supported by three separate points, which effectively distributes stress concentration on the connector 11 and slot portion 27, and also stabilizes the mounting of the expansion board 12. Furthermore, since the fixing position of the mounting portion 26b can be adjusted according to the distance from the expansion board 12, it can appropriately accommodate variations in the length of the expansion board 12.

[0038] Thus, the support arm 26 can accommodate a wide variety of expansion boards 12 while ensuring the necessary mechanical strength for industrial applications with high structural stability (vibration resistance), and providing a structure that stably holds the expansion board 12. In this case, because the support arm 26 is small, there is little risk of interference with other circuit boards, and the complexity of the structure inside the housing 2 can be minimized.

[0039] Furthermore, since the support arm 26 is sandwiched between cushioning material 18, it makes soft contact with the expansion board 12, and its elastic deformation can absorb vibrations, mitigating the impact on the GPU and other components.

[0040] Furthermore, in the case of a non-standard expansion board 12 that is wired in a wiring-prohibited area as defined by the standard, there are often wires or other components in the area that needs to be supported. In this case, it is not preferable to directly clamp the board with the clamping portion 26c, but by clamping it with the cushioning material 18, the three-point support of the expansion board 12 becomes possible.

[0041] However, this embodiment does not exclude the possibility of directly clamping with the clamping portion 26c. If there are no wires or other obstructions in the supported portion and clamping is not hindered, the clamping portion 26c may be used directly without using the cushioning material 18.

[0042] Furthermore, when the expansion board 12 is not used, such as when the industrial controller 1 is shipped, or when the clamping portion 26c is used to directly clamp the object, the cushioning material 18 can be stored in the storage portion 26d of the arm body 26a, which helps prevent the cushioning material 18 from detaching or getting lost.

[0043] Furthermore, even when the support arm 26 is removed from the wind guide 25, the cushioning material 18 can be stored together with the support arm 26 by storing it in the storage compartment 26d, which also helps prevent the cushioning material from detaching or getting lost.

[0044] In this embodiment, a configuration with a wind guide 25 is assumed, but the support arm 26 can also be used as a support structure for the expansion board 12 in a configuration without a wind guide 25.

[0045] In this case, the taper at one end of the arm body 26a is eliminated, while the mounting portion 26b is welded to one end face of the arm body 26a. By screwing this mounting portion 26b to a mounting plate (not shown) welded to the finger guard 21, the extension board 12 is supported by the finger guard 21 via the support arm 26. In this respect as well, the extension board 12 can be supported by three points that are separated from each other. [Examples]

[0046] Embodiment 2 will be described with reference to Figure 7. This embodiment shows a cooling structure inside the enclosure 2 using an air guide 25. In this embodiment, the targets for cooling are a high heat-generating component (e.g., CPU) on the motherboard 4 and an expansion board 12 that generates heat. The two are located in a relationship where they are in the direction normal to the substrate surface of the motherboard 4, and the motherboard 4 and the expansion board 12 are arranged in parallel.

[0047] (1) Example configuration The air guide 25, driven by the cooling fan 20, divides the cooling air into two parallel directions, namely arrows W1 and W2. However, from the perspective of flexibility for the cooling air W1 and W2, the air guide 15 extends to just before the expansion board 12.

[0048] Therefore, a predetermined gap S is provided between the air guide 15 and the expansion board 12, so the inside of the enclosure 2 is not completely partitioned, and the exhaust side L of the air guide 25 is sloped to narrow the cooling air towards the CPU heatsink 7.

[0049] In this embodiment, the air guide 25 has a structure in which one end of a pair of metal plates is bonded together while the other end is isolated, with one end positioned on the intake side R and the other end positioned on the exhaust side L.

[0050] In this case, one end of the metal plate is not limited to being glued together, but may also be joined by screw fixing, welding, etc. Here, the upper metal plate located on the opposite side of the motherboard 4, i.e., the expansion board 12 side, is called the guide part 25a, and the lower metal plate located on the motherboard 4 is called the guide part 25b.

[0051] Furthermore, the guide portion 25b is elastic and can be elastically deformed to a greater extent than the guide portion 25a. In this case, the air guide 25 has an adjustment mechanism that curves the guide portion 25b to narrow the cooling airflow.

[0052] Specifically, a female screw hole (not shown) is formed on the exhaust side L of the guide portion 25a, and the shaft of the bolt 30 is screwed into the female screw hole. The shaft of the bolt 30 presses against the exhaust side L of the guide portion 25b, causing the guide portion 25b to elastically deform into a curved shape. As a result, the exhaust sides L of both 25a and 25b open up, and the guide portion 25b tilts in an arc towards the heat sink 7.

[0053] At this time, the inclination of the guide portion 25b can be varied by adjusting the opening distance (separation distance) α on the exhaust side L between the two 25a and 25b according to the amount the bolt 30 is screwed in. That is, if the head of the bolt 30 is rotated in one direction, the shaft of the bolt 30 is screwed into the female screw hole, the amount of deformation of the guide portion 25b increases and the opening distance α becomes larger. As a result the amount of inclination of the guide portion 25b increases and the inclination gradient becomes steeper.

[0054] On the other hand, if the shaft is rotated in the other direction, the shaft will screw out of the female screw hole, reducing the deformation of the guide portion 25b and decreasing the opening angle α. This reduces the amount of inclination of the guide portion 25b, making the inclination gradient gentler. In this respect, by making the opening distance α variable, the height of the guide portion 25b, i.e., the magnitude of the inclination, can be freely adjusted.

[0055] Such an adjustment mechanism is often preferable to be installed on the exhaust side L of the air guide 25, as it does not require force to turn the bolt 30 and allows for detailed adjustment. However, if it is installed closer to the intake side R, the torque required to turn the bolt 30 will be greater, but in cases where the possible range is larger, there are advantages such as not requiring a specific screw length. Taking this into consideration, it is preferable to determine the position of the adjustment mechanism appropriately based on the dimensions of the air guide 25 and the allowable torque of the bolt 30.

[0056] Furthermore, the arrangement and number of bolts 30 in directions perpendicular to both the exhaust side L and the upper surface of the guide portion 25a should be appropriately designed, taking into consideration the stress that may be generated by deformation and the vibrations and frequencies that may be generated by the cooling air.

[0057] (2) Airflow In this embodiment, the airflow is described as follows: Cooling air is introduced into the housing 2 from the intake vents 3d by the operation of the cooling fan 20. This cooling air is separated in the direction toward the substrate by the air guide 25, and is divided into an upper cooling air W1 and a lower cooling air W2.

[0058] The divided cooling air W1 is guided by the guide section 25a and flows over the expansion board 12, where it is exhausted from the exhaust vent group 3e. This supplies cooling air to the heatsink 13, cooling the heat-generating components on the expansion board 12, such as the GPU.

[0059] Meanwhile, the cooling air W2 is guided by the guide section 25b and flows over the motherboard 4 before being exhausted from the exhaust vents 3e. At this time, the other end of the guide section 25b is sloped toward the heatsink 7, so that the air is supplied to the heatsink 7 at a higher velocity and is concentrated there, giving priority to cooling the CPU on the motherboard 4.

[0060] As a result, this embodiment enables more efficient cooling of high-heat-generating components such as the CPU compared to simply partitioning the inside of the enclosure 2. This makes it possible to optimize the cooling distribution to optimize the airflow within the enclosure, given the high heat generation of the CPU and the limitations of the cooling fan's airflow capacity. Furthermore, the cooling airflow can be kept roughly the same regardless of the presence or absence of the extended material of the air guide 25 or the expansion board 12, thus reducing the design effort.

[0061] In particular, a gap S is created between the air guide 25 and the expansion board 12, and the inside of the enclosure 2 is not a completely partitioned structure. Therefore, by adjusting the height of the air guide 25b, it is possible to achieve a suitable distribution of cooling air that takes into account the heat distribution inside the enclosure 2.

[0062] In this case, it is preferable to adjust the height appropriately, taking into account the type of expansion board 12 and the heat generation conditions. For example, cooling was preferable during the design phase of the industrial controller 1, but it can be difficult to predict the heat generation range of various expansion boards. Therefore, if the heat generated by the heat-generating components varies greatly depending on the application, such appropriate adjustments are preferable even at the final product stage.

[0063] In this embodiment, the amount of inclination of the guide portion 25b is adjusted by the adjustment mechanism, but the guide portion 25b may also be formed by bending it toward the heat sink 7 without providing the adjustment mechanism. Alternatively, one end of the guide portions 25a and 25b may be connected by a hinge, and the other end may be opened downward (towards the heat sink 7) via a separate connecting member.

[0064] Furthermore, the guide portion 25a may be fixed between the housing 2 and the guide portion 25a, 25b may be connected at one end with a hinge so that the guide portion 25b can rotate downward, and the adjustment mechanism may be provided on the exhaust side L. [Examples]

[0065] Example 3 will be described with reference to Figure 8. This example, like Example 2, shows a cooling structure inside the housing 2 using an air guide 25. However, the air guide 25 in this example is constructed by bending a single metal sheet (a material that can be bent, such as sheet metal) rather than using two metal sheets.

[0066] Here, the bending line P is defined as the approximate center of the original metal sheet material before bending, and this bending line is designated as the intake side R, while the ends of the pair of opposing plate-like sections after bending are designated as the exhaust side L. Here, one of the plate-like sections located on the opposite side of the motherboard 4 is called the guide section 25a, and the other plate-like section located on the motherboard 4 side is called the guide section 25b.

[0067] According to this embodiment, not only can the same effects as in Embodiment 1 be obtained, but the wind guide 25 can be realized with only one metal material, contributing to the reduction of manufacturing costs. In addition, a considerable effect can be obtained in reducing the force required for the tilt deformation of the guide portion 25b by the adjustment mechanism, i.e., the pressing force by the bolt 30.

[0068] In other words, when a part is bent with a certain curvature, such as a bent line P, rather than being deformed over a wide, flat surface, the force required is limited to that specific deformation, and the latter can be smaller than the former. As a result, the guide section 25b does not need to be as elastic, and furthermore, a reduction in the force required to screw in and out the bolt 30 can be expected, contributing to improved work efficiency. [Examples]

[0069] Example 4 will be described with reference to Figure 9. This example, like Example 2, shows a cooling structure inside the housing 2 using an air guide 25. However, the air guide 25 in this example is not made by joining and bending metal plates, but is instead made of, for example, a molded body made of resin.

[0070] The molded body is formed in a roughly triangular prism shape, with the horizontal surface opposite the motherboard 4 (parallel to the expansion board 12) serving as the guide portion 25a, while the inclined surface on the motherboard 4 side serves as the guide portion 25b. In this configuration, the adjustment mechanism is eliminated, and the inclination of the guide portion 25b is fixed.

[0071] According to this embodiment, manufacturing costs can be reduced because processing (joining and bending) of metal sheet material is unnecessary. Furthermore, when the expected combination of heat-generating components is limited (for example, CPU and GPU), the heat generation often remains within a certain range. This embodiment is suitable when such an adjustment mechanism is not required.

[0072] It should be noted that the present invention is not limited to the embodiments described above, and can be implemented with modifications within the scope of each claim. For example, the support structure and cooling structure of the expansion board in Examples 1 to 4 can be applied not only to industrial controllers but also to other information processing devices (computers). [Explanation of Symbols]

[0073] 1… Industrial controller 2…Cabinet 4…Motherboard 3D... Intake vent group 3e... Exhaust port group 11… Connector 12…Expansion board (expansion circuit board) 12a…Terminal lane 12b...Side end 27... Slot section 7,13… Heatsink 20...fan 25... Wind Guide 26...Support arm 26a...Arm body 26b…Mounting part 26c...Campling part 26d...Storage compartment 26g…Holding groove 28…Cushioning material

Claims

1. A support structure for an expansion board disposed within the casing of an information processing device, A high-heat-generating element is placed on the motherboard inside the aforementioned enclosure, Within the enclosure, an expansion board is located in the direction normal to the surface of the motherboard, Equipped with, A support structure for an expansion board of an information processing device, characterized in that a support arm is provided for supporting the expansion board on the housing.

2. A fan and intake port are provided on the intake side of the housing, An exhaust port is provided on the side surface of the housing facing the intake side, An air guide that divides the cooling air generated by the fan into directions for the heat-generating element and directions for the expansion board, Furthermore, The aforementioned wind guide is The extended material extends from the intake side to just before the expansion substrate, A support structure for an expansion board of an information processing device, characterized in that the expansion board is supported on the air guide.

3. The aforementioned expansion board is A terminal lane attached to the connector portion of the motherboard or the expansion board mounted on the motherboard, A slot portion fixed to the aforementioned housing, Equipped with, The support structure for the expansion board of the information processing device according to claim 2, characterized in that it is supported at three points: the connector portion, the slot portion, and the air guide.

4. The support arm is, A mounting part fixed to the wind guide, A clamping portion that grips the aforementioned expansion substrate, The arm body between the two aforementioned parts, A support structure for an expansion board of an information processing device according to claim 2, characterized by comprising the above.

5. The aforementioned mounting portion is The support structure for an expansion board of an information processing device according to claim 4, characterized in that the fixing position to the wind guide can be adjusted.

6. The clamping portion is, The clamping grooves that hold the aforementioned expansion substrate, The cushioning material with a concave cross-section within the clamping groove, Equipped with, The expansion board is sandwiched between the aforementioned cushioning material. A support structure for an expansion board of an information processing device according to feature 4.

7. The aforementioned arm body is The support structure for an expansion board of an information processing device according to claim 6, characterized in that it has a storage section capable of accommodating the aforementioned cushioning material.

8. The expansion substrate is provided with the support structure according to any one of claims 1 to 7. An information processing device characterized by the following:

9. A support arm for supporting an expansion board mounted inside the housing of an information processing device, The aforementioned information processing device is A high-heat generating element on the motherboard mounted inside the aforementioned enclosure, Within the enclosure, an expansion board is located in the direction normal to the surface of the motherboard, A fan and intake port are provided on the intake side of the housing, An exhaust port is provided on the side surface of the housing facing the intake side, An extension member from the intake side to just before the expansion board, and an air guide that divides the cooling air generated by the fan into the direction of the high heat-generating element and the direction of the expansion board, While possessing, A mounting part fixed to the wind guide, A clamping portion that grips the aforementioned expansion substrate, The arm body between the two aforementioned parts, A support arm characterized by having the following features.

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