Resin composition, method for manufacturing an electronic device, and electronic device

Abstract

The present invention provides a resin composition that exhibits excellent processability during curing and excellent adhesive strength and weather resistance after curing, a method for manufacturing an electronic device, and an electronic device. [Solution] The resin composition of one embodiment contains a (meth)acrylate copolymer, and the (meth)acrylate copolymer may be derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group. As a result, the resin composition of one embodiment may exhibit excellent processability when photocured in air, and may exhibit excellent adhesion and excellent weather resistance after curing.

Description

[Technical Field]

[0001] The present invention relates to a resin composition comprising a (meth)acrylate copolymer, a method of manufacturing an electronic device comprising providing the resin composition, and an electronic device. [Background Art]

[0002] Various electronic devices for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, game consoles and the like have been developed. An electronic device includes various components constituting the electronic device, and may include a display panel that generates an image, or the like. An adhesive member is disposed between components constituting an electronic device. The adhesive member can be formed by providing a resin composition, and the adhesive member included in an electronic device is required to have properties that stably bond components of the electronic device and do not degrade display quality. [Summary of the Invention] [Problem to be Solved by the Invention]

[0003] An object of the present invention is to provide a resin composition that exhibits excellent processability during curing, and exhibits excellent adhesive strength and excellent weather resistance after curing.

[0004] Another object of the present invention is to provide a method of manufacturing an electronic device that exhibits excellent processability.

[0005] Still another object of the present invention is to provide an electronic device that exhibits excellent reliability. [Means for Solving the Problem]

[0006] One embodiment provides a resin composition comprising a (meth)acrylate copolymer derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group.

[0007] The (meth)acrylate copolymer can be represented by Chemical Formula 1 below. [Chemical formula 1] [ka] In the above chemical formula 1, R1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, R2 to R5 are each independently an alkyl group having 1 to 10 carbon atoms, R6 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 12 carbon atoms, R7 and R8 are each independently a hydrogen atom or a methyl group, n1 is an integer from 1 to 24, and n2 may be an integer from 12 to 200.

[0008] The first (meth)acrylate monomer may include a first substructure represented by the following chemical formula M-1, and the second (meth)acrylate monomer may include a second substructure represented by the following chemical formula M-2. [Chemical formula M-1] [ka] [Chemical formula M-2] [ka] In the chemical formula M-1, R2 and R4 are each independently alkyl groups having 1 to 10 carbon atoms, and in the chemical formula M-2, R6 may be a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 12 carbon atoms.

[0009] Based on a total weight of 100 parts by weight of (meth)acrylate monomers provided during the radical polymerization reaction, the amount of the first (meth)acrylate monomer may be 0.01 parts by weight or more and 20 parts by weight or less.

[0010] In the radical polymerization reaction described above, a third (meth)acrylate monomer that does not contain the hindered phenol group and the hindered amine group may be further provided.

[0011] The third (meth)acrylate monomer may contain a functional group that absorbs ultraviolet light.

[0012] The third (meth)acrylate monomer may contain at least one of 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl-2H-benzotriazole and methyl methacrylate (MMA).

[0013] The resin composition further comprises at least one monofunctional (meth)acrylate monomer and at least one photoradical polymerization initiator, wherein the monofunctional (meth)acrylate monomer may include at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), and tetrahydrofurfuryl acrylate (THFA).

[0014] The resin composition may, after curing in air, have a 180° peel strength of 1500 gf / 25 mm or more to at least one of the glass substrate and polymer substrate at a temperature of 25°C.

[0015] One embodiment includes the steps of preparing a display panel, providing a window on the display panel, and, prior to providing the window, providing an adhesive member on the display panel or the window, wherein the step of providing the adhesive member includes the steps of providing a resin composition containing a (meth)acrylate copolymer on the display panel or the window, and irradiating the provided resin composition with light in the atmosphere to form the adhesive member, wherein the (meth)acrylate copolymer provides a method for producing an electronic device derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group.

[0016] The (meth)acrylate copolymer can be represented by the following chemical formula 1. [Chemical formula 1]

Chemical

[0017] The first (meth)acrylate monomer may comprise a first partial structure represented by the following Chemical Formula M-1, and the second (meth)acrylate monomer may comprise a second partial structure represented by the following Chemical Formula M-2. [Chemical Formula M-1]

Chemical

Chemical

[0018] Based on 100 parts by weight in total of the weight of the (meth)acrylate monomer provided in the radical polymerization reaction, the content of the first (meth)acrylate monomer may be 0.01 parts by weight to 20 parts by weight.

[0019] In the radical polymerization reaction, a third (meth)acrylate monomer that does not contain the hindered phenol group and the hindered amine group may be further provided.

[0020] The resin composition may further comprise at least one monofunctional (meth)acrylate monomer and at least one photoradical polymerization initiator.

[0021] The resin composition can be provided by inkjet printing or dispensing.

[0022] One embodiment provides an electronic device comprising a display panel, a window disposed on the display panel, and an adhesive member disposed between the display panel and the window, the adhesive member comprising a polymer derived from a resin composition, wherein the resin composition comprises a (meth)acrylate copolymer derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group.

[0023] The adhesive member may have a 180° peel strength of 1500 gf / 25 mm or more to at least one of the glass substrate and polymer substrate at a temperature of 25°C.

[0024] The electronic device further includes a light control layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light control layer and the window, wherein the optical adhesive layer may contain a polymer derived from the resin composition.

[0025] The electronic device further includes an input sensing unit disposed between the display panel and the window, and the adhesive member may be disposed between the display panel and the input sensing unit, or between the input sensing unit and the window. [Effects of the Invention]

[0026] The resin composition of one embodiment contains a (metho)acrylate copolymer derived from a radical polymerization reaction between a first (metho)acrylate monomer containing a hindered phenol group and a second (metho)acrylate monomer containing a hindered amine group, thereby exhibiting excellent processability during curing and excellent adhesive strength and weather resistance after curing.

[0027] One embodiment of an electronic device manufacturing method includes the step of providing a resin composition of one embodiment to form an adhesive member, and can exhibit excellent processability.

[0028] The electronic device of one embodiment includes an adhesive member containing a polymer derived from the resin composition of one embodiment, and can exhibit excellent reliability. [Brief explanation of the drawing]

[0029] [Figure 1] This is a perspective view showing a display device in one embodiment. [Figure 2] This is a block diagram of an electronic device according to one embodiment. [Figure 3] This is a schematic diagram showing electronic devices in various embodiments. [Figure 4] This is an exploded perspective view showing an electronic device in one embodiment. [Figure 5] This is a cross-sectional view showing the portion corresponding to the line I-I' in Figure 1. [Figure 6] This is a cross-sectional view showing a part of an electronic device according to one embodiment. [Figure 7a] This flowchart shows a manufacturing method for an electronic device according to one embodiment. [Figure 7b] This flowchart shows a manufacturing method for an electronic device according to one embodiment. [Figure 8a] This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 8b] This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 8c] This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 9a]This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 9b] This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 9c] This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 10a] This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 10b] This figure schematically shows the steps for manufacturing an apparatus according to one embodiment. [Figure 10c] This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 10d] This diagram schematically shows the steps for manufacturing an electronic device according to one embodiment. [Figure 11] This is a cross-sectional view showing an electronic device according to one embodiment. [Figure 12] This is a cross-sectional view showing an electronic device according to one embodiment. [Figure 13] This diagram shows the interior of a vehicle in which an electronic device according to one embodiment is installed. [Modes for carrying out the invention]

[0030] Because the present invention can be modified in various ways and take on various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this should be understood not as an attempt to limit the present invention to any particular disclosure, but rather as including all modifications, equivalents, or substitutions that fall within the spirit and technical scope of the present invention.

[0031] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on top of," "connected to," or "joined" another component, it means that it can be directly placed on top of, connected to, or joined to the other component, or that a third component can be placed between them.

[0032] The same drawing symbol refers to the same component. Furthermore, in drawings, the thickness, proportions, and dimensions of components are exaggerated for the sake of effective explanation of the technical content. "and / or" includes all combinations of one or more components defined by the relevant component.

[0033] Terms such as "first," "second," etc., are used to describe a variety of components, but the components are not limited to these terms. The terms are used solely for the purpose of distinguishing one component, part, region, layer, or part from other components, parts, regions, layers, or parts. For example, without departing from the scope of the present invention, a first component, first part, first region, first layer, or first part may be named a second component, second part, second region, second layer, or second part, and similarly, a second component, second part, second region, second layer, or second part may also be named a first component, first part, first region, first layer, or first part. A singular expression includes plural expressions unless the context clearly indicates otherwise.

[0034] Furthermore, terms such as "down," "on the lower side," "up," and "on the upper side" are used to describe the relationships between the components shown in the drawing. These terms are relative concepts and are described in relation to the direction shown in the drawing.

[0035] Terms such as "includes" or "has" indicate the presence of features, figures, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood not to pre-exist to exclude the presence or possibility of adding one or more other features, figures, steps, actions, components, parts, or combinations thereof.

[0036] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art in the field to which the present invention pertains. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an overly idealistic or formal sense unless expressly defined herein.

[0037] In this specification, alkyl groups may be linear or branched. The number of carbon atoms in an alkyl group is 1 to 60, 1 to 50, 1 to 30, 1 to 20, 1 to 10, or 1 to 6. Examples of alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, s-butyl group, t-butyl group, i-butyl group, 2-ethylbutyl group, 3,3-dimethylbutyl group, n-pentyl group, i-pentyl group, neopentyl group, t-pentyl group, 1-methylpentyl group, 3-methylpentyl group, 2-ethylpentyl group, 4-methyl-2-pentyl group, n-hexyl group, and 1-methylhexyl. Group, 2-ethylhexyl group, 2-butylhexyl group, n-heptyl group, 1-methylpeptyl group, 2,2-dimethylheptyl group, 2-ethylheptyl group, 2-butylheptyl group, n-octyl group, t-octyl group, 2-ethyloctyl group, 2-butyloctyl group, 2-hexyloctyl group, 3,7-dimethyloctyl group, n-nonyl group, n-decyl group, 2-ethyldecyl group, 2-butyldecyl group, 2-hexyldecyl n-octyldecyl group, n-undecyl group, n-dodecyl group, 2-ethyldodecyl group, 2-butyldodecyl group, 2-hexyldodecyl group, 2-octyldecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, 2-ethylhexadecyl group, 2-butylhexadecyl group, 2-hexylhexadecyl group, 2-octylhexadecyl group, n-heptadecyl group, n-octadecyl group Examples of such groups include, but are not limited to, syl groups, n-nonadesyl groups, n-icosyl groups, 2-ethylicosyl groups, 2-butylicosyl groups, 2-hexylicosyl groups, 2-octylicosyl groups, n-henicosyl groups, n-docosyl groups, n-tricosyl groups, n-tetracosyl groups, n-pentacosyl groups, n-hexacosyl groups, n-heptacosyl groups, n-octacosyl groups, n-nonacosyl groups, and n-triacontyl groups.

[0038] In this specification, an alkoxy group may mean an alkyl group to which an oxygen atom is bonded. The alkoxy group may be linear, branched, or cyclic. The number of carbon atoms in the alkoxy group is not particularly limited, but for example, it may be 1 to 30, 1 to 20, or 1 to 10. Examples of oxy groups include, but are not limited to, methoxy, ethoxy, n-propoxy, isopropoxy, butoxy, pentyloxy, hexyloxy, octyloxy, nonyloxy, and decyloxy.

[0039] In this specification, "-*" indicates the position of concatenation.

[0040] The embodiments of the present invention will be described below with reference to the drawings. Figure 1 is a perspective view showing a display device of one embodiment.

[0041] The electronic device (EA) in one embodiment shown in Figure 1 may be a device that is activated by an electrical signal. For example, the electronic device (EA) may be a personal computer, a laptop computer, a personal digital terminal, a game console, a portable electronic device, a television, a monitor, an external billboard, a car navigation system, or a wearable device, but the embodiment is not limited to these. Figure 1 exemplifies that the electronic device (EA) is a portable electronic device.

[0042] An electronic device (EA) may provide an image (IM) to the user via a display surface (EA-IS). The display surface (EA-IS) may be aligned with the planes defined by the first directional axis (DR1) and the second directional axis (DR2). The electronic device (EA) may display the image (IM) in the direction of the third directional axis (DR3). The image (IM) may include dynamic and / or static images. Figure 1 shows an electronic device (EA) with a planar display surface (EA-IS), but the embodiments are not limited thereto. For example, the electronic device (EA) may include a curved display surface or a three-dimensional display surface. A three-dimensional display surface may include multiple display areas that indicate different directions from each other.

[0043] The directions indicated by the first to third directional axes (DR1, DR2, DR3) described herein are relative concepts and may be converted to other directions. Furthermore, the directions indicated by the first to third directional axes (DR1, DR2, DR3) may be described as the first to third directions, and the same drawing reference numerals may be used.

[0044] In this specification, the first directional axis (DR1) and the second directional axis (DR2) are orthogonal to each other, and the third directional axis (DR3) may be the normal direction to the plane defined by the first directional axis (DR1) and the second directional axis (DR2). The thickness direction of the electronic device (EA) may be aligned with the third directional axis (DR3). The thickness direction of the electronic device (EA) may use the same drawing reference numerals as the third directional axis (DR3). The front (or top) and back (or bottom) surfaces may oppose each other along the third directional axis (DR3), and the normal directions of the front (or top) and back (or bottom) surfaces may be parallel to the third directional axis (DR3). The front (or top) surface means the surface adjacent to the display surface (EA-IS), and the back (or bottom) surface means the surface separated from the display surface (EA-IS). The upper display surface (EA-IS) is the direction approaching the upper display surface (EA-IS), and the lower display surface (EA-IS) is the direction away from the lower display surface (EA-IS).

[0045] In this specification, a cross-section means a plane aligned with the thickness direction (DR3). A plane is perpendicular to the thickness direction (DR3) and means a plane aligned with the plane defined by the first directional axis (DR1) and the second directional axis (DR2).

[0046] In this specification, the superposition of one component with another means superposition on a plane. Furthermore, the superposition of one component with another is not limited to cases where the components have the same area and shape, but also includes cases where they have different areas and / or different shapes.

[0047] An electronic device (EA) senses an external input applied from the outside. This external input may include various forms of input provided from outside the EA. For example, it may include contact by a part of the user's body, such as their hand, as well as external input applied from close proximity to the EA or adjacent at a predetermined distance (e.g., hovering). Furthermore, the external input may take various forms, such as force, pressure, temperature, or light.

[0048] The display surface (EA-IS) may include a display area (DA) and a non-display area (NDA). The electronic device (EA) may display an image (IM) via the display area (DA).

[0049] The display area (DA) may be an area that is activated by an electrical signal. The display area (DA) may be an area where an image (IM) is displayed and where various forms of external inputs may be sensed.

[0050] The display area (DA) may include a plane defined by a first directional axis (DR1) and a second directional axis (DR2). Although not shown, the display area (DA) may also include a curved surface bent from at least one side of the plane defined by the first directional axis (DR1) and the second directional axis (DR2). For example, the display area (DA) may further include four curved surfaces bent from at least two, for example, four sides of the plane defined by the first directional axis (DR1) and the second directional axis (DR2).

[0051] The electronic device (EA) in one embodiment may be flexible. "Flexible" means bendable, encompassing structures that can be fully folded or bent to the nanometer level. For example, the electronic device (EA) may be rigid. Alternatively, the electronic device (EA) may be foldable.

[0052] The non-display area (NDA) may have a predetermined color. The non-display area (NDA) may be adjacent to the display area (DA). The non-display area (NDA) may surround the display area (DA). Thus, the shape of the display area (DA) can be substantially defined by the non-display area (NDA). However, Figure 1 is an illustrative diagram, and the non-display area (NDA) may be located adjacent to only one side of the display area (DA), or it may be omitted. The display area (DA) is provided in a variety of shapes and is not limited to any one embodiment.

[0053] Figure 2 is a block diagram of an electronic device according to one embodiment. Referring to Figure 2, the electronic device EA according to one embodiment may include a display module DM, a processor 12, a memory 13, and a power supply module 14. In this specification, the electronic device EA is a display device or may include a display device. The display device may include a display module DM.

[0054] The processor (12) may include at least one of the following: a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller. The power supply module (14) may include a power supply module such as a power adapter or a battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power necessary for the operation of the electronic device (EA).

[0055] Memory (13) may store data information necessary for the operation of the processor (12) and the display module (DM). When the processor (12) executes an application stored in memory (13), video data signals and / or input control signals are transmitted to the display module (DM), and the display module (DM) may process the provided signals and output video information via a display screen.

[0056] At least one component of the electronic device (EA) may be included within a display module (DM, Figure 4) according to one embodiment. Furthermore, some of the individual modules functionally included within a single module of the electronic device (EA) may be included within the display device, while others may be provided separately from the display device. For example, the display device may include a display module (DM), while the processor (12), memory (13), and power supply module (14) may be provided in the form of other devices within the electronic device (EA) rather than as a display device.

[0057] Figure 3 is a schematic diagram showing an electronic device according to various embodiments. Referring to Figure 3, an electronic device including a display module (DM, Figure 4) according to one embodiment may include not only electronic devices for displaying images such as smartphones (10_1a), tablet PCs (10_1b), laptop computers (10_1c), televisions (10_1d), and desk monitors (10_1e), but also wearable electronic devices including display devices such as smart glasses (10_2a), head-mounted displays (10_2b), and smartwatches (10_2c), and electronic devices for vehicles (10_3) including display devices such as CIDs (Center Information Displays) and rearview mirror displays located on the instrument panel, center fascia, or dashboard of an automobile.

[0058] Figure 4 is an exploded perspective view showing an electronic device of one embodiment. Referring to Figure 4, the electronic device (EA) may include a display module (DM), a window (WP) positioned on the display module (DM), and an adhesive member (AP) positioned between the display module (DM) and the window (WP). The electronic device (EA) may further include a housing (HAU).

[0059] The housing (HAU) may include a material having relatively high rigidity. For example, the housing (HAU) may include a frame and / or plates made of glass, plastic, or metal. The frame and / or plates may be provided in multiple units. The housing (HAU) may provide a predetermined housing space. The display module (DM) can be housed within the housing space and protected from external impacts.

[0060] The display module (DM) may be activated by an electrical signal and display an image (IM, Figure 1). The display module (DM) may be activated and display an image (IM, Figure 1) in the display area (DA, Figure 1) of the electronic device (EA). The display module (DM) can be defined as an active area (DM-AA) and a peripheral area (DM-NAA).

[0061] The active region (DM-AA) may be a region activated by an electrical signal. Pixels (not shown) may be placed in the active region (DM-AA). Pixels may include transistors (TR) and light-emitting elements (ED, Figure 8). The peripheral region (DM-NAA) may be a region adjacent to at least one side of the active region (DM-AA). Circuits and wiring for driving the active region (DM-AA) may be placed in the peripheral region (DM-NAA).

[0062] An adhesive member (AP) can be used to bond the display module (DM) and the window (WP). In one embodiment, the adhesive member (AP) may include a polymer derived from a resin composition (RC, Figures 8a, 9a, and 10a). The adhesive resin AP can be formed by photocuring the resin composition (RC, Figures 8a, 9a, and 10a). The (meth)acrylate copolymer according to one embodiment may be derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group. The adhesive resin AP may consist of a resin composition (RC, Figures 8a, 9a, and 10a) containing the (meth)acrylate copolymer according to one embodiment and exhibit excellent adhesive strength and excellent weather resistance. In one embodiment, the electronic device (EA) including the adhesive member (AP) may exhibit excellent reliability and excellent display quality.

[0063] A window (WP) can be placed on an adhesive member (AP). The window (WP) may cover the entire outside of the electronic device (EA). The window (WP) may include a transparent area (TA) and a bezel area (BZA). The front of the window (WP) including the transparent area (TA) and the bezel area (BZA) may be in contact with the front of the electronic device (EA). The transparent area (TA) may correspond to the display area (DA) of the electronic device (EA) shown in Figure 1, and the bezel area (BZA) may correspond to the non-display area (NDA) of the electronic device (EA) shown in Figure 1.

[0064] The transparent region (TA) may be an optically transparent region. The bezel region (BZA) may be a region with relatively lower light transmittance compared to the transparent region (TA). The bezel region (BZA) may have a predetermined color. The bezel region (BZA) may be adjacent to and surround the transparent region (TA). The bezel region (BZA) may define the shape of the transparent region (TA). However, the embodiments are not limited to these, and the bezel region (BZA) may be located adjacent to only one side of the transparent region (TA), or a portion of it may be omitted.

[0065] Figure 5 is a cross-sectional view showing the portion corresponding to the line I-I' in Figure 1. Figure 5 may also be a schematic cross-sectional view showing an electronic device EA according to one embodiment.

[0066] Referring to Figure 5, the display module (DM) may include a display panel (DP) and an input sensing unit (TP) placed on the display panel (DP). The display panel (DP) may be configured to substantially generate an image. The display panel (DP) may include a base substrate (BS), a circuit layer (DP-CL) placed on the base substrate (BS), a display element layer (DP-EL) placed on the circuit layer (DP-CL), and a sealing layer (TFE) covering the display element layer (DP-EL). A window (WP) can be placed on the display panel (DP). An adhesive member (AP) can be placed between the display panel (DP) and the window (WP).

[0067] The configuration of the display panel (DP) shown in Figure 5 and other figures is illustrative and not limited to this configuration. For example, the display panel (DP) may include liquid crystal display elements, in which case the sealing layer (TFE) may be omitted.

[0068] The base substrate (BS) may provide a base surface on which the circuit layers (DP-CL) are arranged. The base substrate (BS) may be a flexible substrate that can be bent, folded, rolled, etc. The base substrate (BS) may be a glass substrate, a metal substrate, or a polymer substrate. However, the examples are not limited thereto, and the base substrate (BS) may include an inorganic layer, an organic layer, or a composite material layer.

[0069] The circuit layer (DP-CL) may include an insulating layer, semiconductor patterns, conductive patterns, and signal lines. For example, the circuit layer (DP-CL) may include a switching transistor and a drive transistor for driving the light-emitting element (ED, Figure 8) of the display element layer (DP-EL), which will be described later.

[0070] The display element layer (DP-EL) may include light-emitting elements (ED, Figure 8). For example, the light-emitting elements (ED, Figure 8) may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, or quantum rods. For example, the light-emitting elements (ED, Figure 8) may include micro-LEDs or nano-LEDs.

[0071] The encapsulation layer (TFE) can be placed on top of the display element layer (DP-EL). The encapsulation layer (TFE) may protect the light-emitting element layer (DP-EL) from foreign matter such as moisture, oxygen, and / or dust particles. The encapsulation layer (TFE) may include at least one inorganic layer. For example, the encapsulation layer (TFE) may include sequentially stacked inorganic layers, organic layers, and inorganic layers.

[0072] The input sensing unit (TP) can be placed between the display panel (DP) and the window (WP). An adhesive member (AP) can be placed between the input sensing unit (TP) and the window (WP). For example, the input sensing unit (TP) can be placed directly on the sealing layer (TFE) of the display panel (DP).

[0073] In this specification, the direct placement / provision / formation of one component on top of another component means that no third component is placed / provision / formed between the two components. In other words, the "direct placement / provision / formation" of one component on top of another component means that the two components are in "contact".

[0074] The input sensing unit (TP) may sense an external input, convert it into a predetermined input signal, and provide the input signal to the display panel (DP). For example, in the electronic device (EA) of one embodiment, the input sensing unit (TP) may be a touch sensing unit that senses touches. The input sensing unit (TP) may recognize a direct touch by a user, an indirect touch by a user, a direct touch by an object, or an indirect touch by an object.

[0075] The input sensing unit (TP) may sense at least one of the following: the position of an externally applied touch and the intensity (pressure) of the touch. In one embodiment, the input sensing unit (TP) may have a variety of structures or be made of a variety of materials, and is not limited to any one embodiment. For example, the input sensing unit (TP) may sense external input using a capacitive method. The display panel (DP) may receive an input signal from the input sensing unit (TP) and generate an image in response to the input signal.

[0076] The window (WP) may include a base layer (BL) and a print layer (BM). Although not shown, the window (WP) may further include at least one functional layer (not shown) provided on top of the base layer (BL). For example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, etc., but the embodiments are not limited thereto.

[0077] The base layer (BL) may be a glass substrate, or it may be a plastic substrate. For example, the base layer (BL) may be polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof.

[0078] The print layer (BM) can be placed on one surface of the base layer (BL). The print layer (BM) can be provided on the lower surface of the base layer (BL) adjacent to the display module (DM). The print layer (BM) can be placed in the edge region of the base layer (BL). The print layer (BM) may be an ink print layer. Alternatively, the print layer (BM) may be a layer formed containing a pigment or dye. In a window (WP), the bezel region (BZA, Figure 4) may be the portion where the print layer (BM) is provided.

[0079] An adhesive member (AP) can be placed between the input sensing unit (TP) and the window (WP). In one embodiment, the adhesive member (AP) may have a 180° peel force of 1500 gf / 25 mm or more to at least one of the glass substrate and polymer substrate at a temperature of 25°C. For example, the adhesive member (AP) may have a 180° peel force of 3000 gf / 25 mm or less to at least one of the glass substrate and polymer substrate at a temperature of 25°C. In one embodiment, an adhesive member (AP) made of a resin composition containing a (meth)acrylate copolymer (RC, Figures 8a, 9a, and 10a) may exhibit a high 180° peel force of 1500 gf / 25 mm or more. An adhesive member (AP) with a 180° peel force of 1500 gf / 25 mm or more to at least one of the glass substrate and polymer substrate at a temperature of 25°C may exhibit excellent adhesive strength and stably bond components constituting an electronic device (EA) (e.g., display module (DM), window (WP), etc.). In this specification, 180° peeling force refers to the force measured according to the JIS Z037 method.

[0080] An adhesive member (AP) according to one embodiment may have a yellowness index (YI) of 0.5 or less after a weathering test. The operating environment of electronic devices includes exposure to heat, light, and other environmental factors. The weathering test is conducted to confirm the resistance of the adhesive member to discoloration and fading when exposed to heat, light, and other environmental factors for extended periods. An adhesive member (AP) with a yellowness index of 0.5 or less after a weathering test will either not discolor or minimize discoloration and fading when exposed to heat, light, and other environmental factors for extended periods. As a result, an adhesive member (AP) with a yellowness index of 0.5 or less after a weathering test can exhibit excellent weather resistance.

[0081] Adhesive members that exceed a yellowness level of 0.5 after weathering tests have low resistance to discoloration and fading when exposed to environments such as heat and light for extended periods. As the amount of time spent exposed to environments such as heat and light accumulates, discoloration and / or fading will occur. Adhesive members that have discolored and / or faded will degrade the display quality when providing images generated from a display module placed beneath the adhesive member. The images generated from the display module are transmitted to the user through the adhesive member. In one embodiment, the adhesive member (AP) has a yellowness level of 0.5 or less after weathering tests, and the electronic device (EA) including the adhesive member (AP) can exhibit excellent reliability and excellent display quality.

[0082] Figure 6 is a cross-sectional view showing a display module (DM) according to one embodiment. Figure 6 may also be a cross-sectional view showing the active area (DM-AA) of the display module (DM). The configuration of the display module (DM) shown in Figure 6 is illustrative, and the embodiment is not limited thereto.

[0083] The base substrate (BS) may include a single layer or a multilayer. For example, the base substrate (BS) may include a first synthetic resin layer, a multilayer or single-layer inorganic layer, and a second synthetic resin layer disposed on the multilayer or single-layer inorganic layer. The first synthetic resin layer and the second synthetic resin layer may each contain a polyimide resin. Furthermore, the first synthetic resin layer and the second synthetic resin layer may each contain at least one of the following: acrylic resin, methacryl resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin. In this specification, "○○-based" resin means containing the "○○" active group.

[0084] A display panel (DP) may include a transistor (TR) and a light-emitting element (ED). The transistor (TR) and the light-emitting element (ED) can be placed on a base substrate (BS). Although Figure 6 shows one transistor (TR), the display panel (DP) may include multiple transistors and at least one capacitor to substantially drive the light-emitting element (ED).

[0085] The circuit layer (DP-CL) can be placed on the base substrate (BS). The circuit layer (DP-CL) may include a shielding electrode (BML), a transistor (TR), a connecting electrode (CNE), and a plurality of insulating layers (BFL and INS1 to INS6). The plurality of insulating layers (BFL and INS1 to INS6) may include a buffer layer (BFL) and the first to sixth insulating layers (INS1 to INS6). However, the laminated structure of the circuit layer (DP-CL) shown in Figure 6 is illustrative, and the laminated structure of the circuit layer (DP-CL) can be changed depending on the configuration of the display panel (DP) and processes such as the circuit layer (DP-CL).

[0086] A shielding electrode (BML) can be placed on a base substrate (BS). The shielding electrode (BML) may be superimposed on a transistor (TR). The shielding electrode (BML) may protect the transistor (TR) by blocking light incident on the transistor (TR) from the bottom of the display panel (DP). The shielding electrode (BML) may contain a conductive material. When a voltage is applied to the shielding electrode (BML), the threshold voltage of the transistor (TR) placed on the shielding electrode (BML) can be maintained. However, the embodiment is not limited to this, and the shielding electrode (BML) may be a floating electrode. The shielding electrode (BML) may be omitted.

[0087] A buffer layer (BFL) may be placed on the base substrate (BS) to cover the light-shielding electrode (BML). The buffer layer (BFL) may include an inorganic layer. The buffer layer (BFL) may improve the bonding strength between the semiconductor pattern or conductive pattern placed on the buffer layer (BFL) and the base substrate (BS).

[0088] A transistor (TR) may include a source (S1), a channel (C1), a drain (D1), and a gate (G1). The source (S1), channel (C1), and drain (D1) of the transistor (TR) may consist of a semiconductor pattern. The semiconductor pattern of the transistor (TR) may include polysilicon, amorphous silicon, or metal oxide, but is not limited to any one of these materials as long as it has semiconductor properties.

[0089] A semiconductor pattern may include multiple regions that are divided according to their conductivity. Regions of the semiconductor pattern that are doped with a dopant or in which metal oxides are reduced may have high conductivity and may substantially function as the source and drain electrodes of a transistor (TR). Regions of the semiconductor pattern with high conductivity may correspond to the source (S1) and drain (D1) of the transistor (TR). Regions of the semiconductor pattern that are not doped, are doped at a low concentration, or in which metal oxides are not reduced and have low conductivity may correspond to the channel (C1) (or active) of the transistor (TR).

[0090] A first insulating layer (INS1) can be placed on top of a buffer layer (BFL) while covering the semiconductor pattern of the transistor (TR). The gate (G1) of the transistor (TR) can be placed on top of the first insulating layer (INS1). On a plane, the gate (G1) may be superimposed on the channel (C1) of the transistor (TR). The gate (G1) may function as a mask in the process of doping the semiconductor pattern of the transistor (TR).

[0091] The second insulating layer (INS2) can be placed on top of the first insulating layer (INS1) while covering the gate (G1). The third insulating layer (INS3) can be placed on top of the second insulating layer (INS2).

[0092] The connecting electrode (CNE) may include a first connecting electrode (CNE1) and a second connecting electrode (CNE2) for electrically connecting the transistor (TR) and the light-emitting element (ED). However, the configuration of the connecting electrode (CNE) for electrically connecting the transistor (TR) and the light-emitting element (ED) is not limited thereto, and one of the first and second connecting electrodes (CNE1, CNE2) may be omitted, or additional connecting electrodes may be included.

[0093] A first connecting electrode (CNE1) can be placed on a third insulating layer (INS3). The first connecting electrode (CNE1) can be connected to a first drain (D1) via a first contact hole (CH1) that penetrates the first to third insulating layers (INS1 to INS3). A fourth insulating layer (INS4) can be placed on the third insulating layer (INS3) while covering the first connecting electrode (CNE1). A fifth insulating layer (INS5) can be placed on the fourth insulating layer (INS4).

[0094] A second connecting electrode (CNE2) can be placed on a fifth insulating layer (INS5). The second connecting electrode (CNE2) can be connected to a first connecting electrode (CNE1) via a second contact hole (CH2) that penetrates the fourth and fifth insulating layers (INS4, INS5). A sixth insulating layer (INS6) can be placed on top of the fifth insulating layer (INS5) while covering the second connecting electrode (CNE2).

[0095] Each of the first to sixth functional layers (INS1 to INS6) may include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and ferylene resin.

[0096] The display element layer (DP-EL) may include a pixel definition film (PDL) and an emitting element (ED). The emitting element (ED) may include a first electrode (AE), a hole control layer (HCL), an emission layer (EML), an electronic control layer (TCL), and a second electrode (CE). The second electrode (CE) can be placed on top of the first electrode (AE). The emission layer (EML) can be placed between the first electrode (AE) and the second electrode (CE). The hole control layer (HCL) can be placed between the first electrode (AE) and the emission layer (EML). The electronic control layer (TCL) can be placed between the emission layer (EML) and the second electrode (CE).

[0097] The first electrode (AE) can be placed on the sixth insulating layer (INS6). The first electrode (AE) can be connected to the second connecting electrode (CNE2) via a third contact hole (CH3) that penetrates the sixth insulating layer (INS6). The first electrode (AE) can be electrically connected to the drain (D1) of the transistor (TR) via the first and second connecting electrodes (CNE1, CNE2).

[0098] The first electrode (AE) may be made of a metallic material, a metallic alloy, or a conductive compound. The first electrode (AE) may be an anode or a cathode. However, the examples are not limited thereto. The first electrode (AE) may also be a pixel electrode. The first electrode (AE) may be a transmissive electrode, a semitransmissive electrode, or a reflective electrode. The first electrode (AE) may contain at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, two or more compounds selected from these, a mixture of two or more selected from these, or oxides thereof.

[0099] If the first electrode (AE) is a transmissive electrode, the first electrode (AE) may contain a transparent metal oxide, such as ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), etc. If the first electrode (AE) is a semi-transmissive or reflective electrode, the first electrode (AE) may contain Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca (a layered structure of LiF and Ca), LiF / Al (a layered structure of LiF and Al), Mo, Ti, W, or compounds or mixtures thereof (for example, a mixture of Ag and Mg). Alternatively, the first electrode (AE) may have a multi-layer structure including a reflective film or semi-transmissive film made of the above-mentioned material, and a transparent conductive film made of ITO, IZO, ZnO, ITZO, etc. For example, the first electrode (AE) may have a three-layer structure of ITO / Ag / ITO, but is not limited thereto. Furthermore, the examples are not limited thereto, and the first electrode (AE) may include the above-mentioned metal material, a combination of two or more metal materials selected from the above-mentioned metal materials, or an oxide of the above-mentioned metal material.

[0100] A pixel definition layer (PDL) can be placed on the sixth insulating layer (INS6). The pixel definition layer (PDL) can define light-emitting apertures (PX_OP) that expose a portion of the first electrode (AE). The portion of the first electrode (AE) exposed by the light-emitting apertures (PX_OP) can be defined as a light-emitting region (LA).

[0101] The active area (DM-AA) of the display module (DM) may include an illuminating area (LA) and a light-shielding area (NLA). The area where the pixel definition film (PDL) is placed may correspond to the light-shielding area (NLA). The light-shielding area (NLA) may surround the illuminating area (LA) within the active area (DM-AA).

[0102] The hole control layer (HCL) can be placed on the first electrode (AE) and the pixel definition film (PDL). The hole control layer (HCL) can be provided as a common layer superimposed on the light-emitting region (LA) and the light-shielding region (NLA). Contrary to the illustration, the hole control layer (HCL) may be placed within the region corresponding to the light-emitting aperture (PX_OP). The hole control layer (HCL) may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer (HCL) may include a known hole injection material and / or a known hole transport material.

[0103] The EML (Emission Mitigation Layer) can be placed on the Hole Control Layer (HCL). The EML can be placed in the region corresponding to the light emission aperture (PX_OP). Alternatively, the EML may be provided as a common layer. The EML may contain organic and / or inorganic light-emitting materials. The EML may emit light of any one of the following colors: red, green, and blue. For example, the EML may emit blue light.

[0104] The electronic control layer (TCL) can be placed on top of the light-emitting layer (EML). The electronic control layer (TCL) can be provided as a common layer superimposed on the light-emitting region (LA) and the light-shielding region (NLA). Contrary to the illustration, the electronic control layer (TCL) may be placed within the region corresponding to the light-emitting aperture (PX_OP). The electronic control layer (TCL) may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electronic control layer (TCL) may include a known electron injection material and / or a known electron transport material.

[0105] The second electrode (CE) can be placed on the electronic control layer (TCL). The second electrode (CE) can be provided as a common layer superimposed on the light-emitting region (LA) and the light-shielding region (NLA). The second electrode (CE) may also be a common electrode. The second electrode (CE) may be a cathode or an anode, but the embodiment is not limited thereto. For example, if the first electrode (AE) is an anode, the second electrode (CE) may be a cathode, and if the first electrode (AE) is a cathode, the second electrode (CE) may be an anode.

[0106] The second electrode (CE) may be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. If the second electrode (CE) is a transmissive electrode, it may be made of a transparent metal oxide, such as ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), etc.

[0107] If the second electrode (CE) is a semi-transparent or reflective electrode, the second electrode (CE) may contain Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, Yb, W, or compounds or mixtures containing these (e.g., AgMg, AgYb, or MgYb). Alternatively, the second electrode (CE) may have a multi-layer structure including a reflective or semi-transparent film made of the aforementioned substances, and a transparent conductive film made of ITO (indium tin oxide), IZO (indium zinc oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), etc. For example, the second electrode (CE) may contain the above-mentioned metallic materials, a combination of two or more metallic materials selected from the above-mentioned metallic materials, or oxides of the above-mentioned metallic materials.

[0108] The sealing layer (TFE) may be placed on the second electrode (CE) to cover the light-emitting element (ED). The sealing layer (TFE) may include multiple thin films. For example, the sealing layer (TFE) may include an inorganic film placed on the second electrode (CE) and an organic film placed between the inorganic films. The inorganic film can protect the light-emitting element (ED) from moisture / oxygen, and the organic film can protect the light-emitting element (ED) from foreign matter such as dust particles.

[0109] The input sensing unit (TP) may include a first sensing insulating layer (IL1), a second sensing insulating layer (IL2), and a third sensing insulating layer (IL3). The input sensing unit (TP) may include at least one conductive layer disposed on top of the sensing insulating layer. The input sensing unit (TP) may include a first conductive layer (CDL1) and a second conductive layer (CDL2).

[0110] The first sensing insulating layer (IL1) can be placed on top of the sealing layer (TFE). The first sensing insulating layer (IL1) may include at least one inorganic insulating layer. The first sensing insulating layer (IL1) may be in contact with the sealing layer (TFE). Alternatively, the first sensing insulating layer (IL1) may be omitted, in which case the first conductive layer (CD1) may be in contact with the sealing layer (TFE).

[0111] A first conductive layer (CDL1) can be placed on a first sensing insulating layer (IL1). The first conductive layer (CDL1) may include a plurality of first conductive patterns. The plurality of first conductive patterns can be placed on the first sensing insulating layer (IL1). A second sensing insulating layer (IL2) can be placed on the first sensing insulating layer (IL1) so as to cover at least a portion of the first conductive layer (CDL1).

[0112] A second conductive layer (CDL2) can be placed on top of a second sensing insulating layer (IL2). The second conductive layer (CDL2) may contain multiple second conductive patterns. Multiple second conductive patterns can be placed on top of the second sensing insulating layer (IL2). Each of the multiple second conductive patterns can be connected to multiple first conductive patterns via contact holes formed in the second sensing insulating layer (IL2).

[0113] Each of the multiple first conductive patterns of the first conductive layer (CDL1) and each of the multiple second conductive patterns of the second conductive layer (CDL2) can be arranged to correspond to a light-shielding region (NLA). Each of the multiple first conductive patterns of the first conductive layer (CDL1) and each of the multiple second conductive patterns of the second conductive layer (CDL2) may correspond to a mesh pattern.

[0114] The third sensing insulating layer (IL3) may be placed on top of the second sensing insulating layer (IL2) and cover the second conductive layer (CDL2). The second sensing insulating layer (IL2) and the third sensing insulating layer (IL3) may each include an inorganic insulating layer or an organic insulating layer.

[0115] The first conductive layer (CDL1) and the second conductive layer (CDL2) may each have a single-layer structure or a multilayer structure stacked along a third direction (DR3). The single-layer conductive layers (CDL1, CDL2) may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (ITO). The transparent conductive layer may also include a conductive polymer such as PEDOT, metal nanowires, graphene, etc.

[0116] The multilayer conductive layers (CDL1, CDL2) may include a metal layer. The metal layer may have a three-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti). The multilayer conductive layers (CDL1, CDL2) may include at least one metal layer and at least one transparent conductive layer.

[0117] The electronic device of one embodiment can be manufactured using the method for manufacturing electronic elements of one embodiment. Figures 7a and 7b are flowcharts showing the manufacturing method of the electronic device of one embodiment. Figures 8a to 10d are schematic diagrams showing the manufacturing steps of the electronic device of one embodiment. In the following explanation of Figures 7a and 10d, we will not repeat explanations of content that has been explained with reference to Figures 1 to 6, and will focus on the differences.

[0118] Referring to Figure 7a, the manufacturing method of one embodiment of the electronic device may include the steps of preparing a display panel (S100), providing an adhesive member (S200), and providing a window (S300). Prior to the step of providing the window (S300), the step of providing an adhesive member (AP, Figure 5) on the display panel (DP, Figure 5) or window (WP, Figure 5) (S200) may be performed. Referring to Figure 7b, the step of providing the adhesive member (S200) may include the steps of providing a resin composition (S210) and forming the adhesive member (S220).

[0119] Figures 8a to 8c may illustrate a method for manufacturing an electronic device according to one embodiment, which includes the step of providing a resin composition (RC) onto a display panel (DP). Referring to Figure 8a, the resin composition (RC) can be provided onto a first surface of a display module (DM) including a display panel (DP). The first surface of the display module (DM) may be the top surface of the display module (DM). The resin composition (RC) can be provided onto the display module (DM) via a nozzle (NZ). In Figure 8a, it is shown that the resin composition (RC) is provided via a nozzle (NZ), but the apparatus for providing the resin composition (RC) is not limited thereto.

[0120] The resin composition RC of one embodiment can be provided by inkjet printing or dispensing. The liquid resin composition (RC) can be provided in a uniform amount and / or at a uniform rate.

[0121] In one embodiment, the resin composition (RC) comprises a (meth)acrylate copolymer, which may be derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group. In this specification, (meth)acryloyl group means acryloyl group or methacryloyl group, and (meth)acrylate means acrylate or methacrylate.

[0122] For example, the (meth)acrylate copolymer may be formed by a radical thermal polymerization reaction. A thermal polymerization initiator can be provided by a radical polymerization reaction for forming a (meth)acrylate copolymer according to one example.

[0123] A (metho)acrylate copolymer formed by a radical polymerization reaction of a first (metho)acrylate monomer containing a hindered phenol group and a second (metho)acrylate monomer containing a hindered amine group may contain both a hindered phenol group and a hindered amine group. The hindered phenol group may be a reducing functional group, and the hindered amine group may be a photostable functional group. The hindered phenol group and hindered amine group contained in the (metho)acrylate copolymer may trap oxygen radicals that cause curing inhibition of the outermost surface.

[0124] A (meth)acrylate copolymer containing both a hindered phenol group and a hindered amine group may exhibit a synergistic effect between the hindered phenol group and the hindered amine group. The (meth)acrylate copolymer according to one example may segregate on the outermost surface when the resin composition (RC) is photocured, ensuring adhesiveness through a certain cohesive force, while suppressing (or preventing) environmental degradation due to heat / light at the interface with air through the aforementioned synergistic effect. The outermost surface is the outermost surface of the resin composition applied for photocuring, and may be the surface closest to the atmosphere. As a result, the resin composition (RC) according to one example may have a 180° peel force of 1500 gf / 25 mm or more to at least one of the glass substrate and polymer substrate after photocuring in the atmosphere at a temperature of 25°C. Furthermore, the resin composition (RC) according to one example may have a yellowness of 0.5 or less after a weathering test following photocuring.

[0125] When forming an adhesive member by irradiating a resin composition with light in the atmosphere, oxygen in the atmosphere inhibits surface curing. Radicals generated by cleavage of the photopolymerization initiator by light and terminal radicals of (meth)acrylate grown by the polymerization reaction are consumed by oxygen in the atmosphere at the interface between the atmosphere and the surface (i.e., the surface of the coated resin composition) to become peroxide radicals, which inhibit the formation of high molecular weight materials by the polymerization reaction. The adhesive member, which is the cured product of the composition, is formed by the formation of high molecular weight materials of the reactants provided during the polymerization reaction. In contrast, the resin composition (RC) of one example contains a (meth)acrylate copolymer containing hindered amine groups and hindered phenol groups, and may exhibit excellent processability when photocured in the atmosphere.

[0126] A (meth)acrylate copolymer according to one example can be represented by the following chemical formula 1. The first (meth)acrylate monomer may contain a first substructure represented by the following chemical formula M-1, and the second (meth)acrylate monomer may contain a second substructure represented by the following chemical formula M-2. The first substructure may be a hindered phenol group. The second substructure may be a hindered amine group. [Chemical formula 1] [ka]

[0127] In the above chemical formula 1, R1 may be a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. R2 to R5 may each be an alkyl group having 1 to 10 carbon atoms independently. R6 may be a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 12 carbon atoms. R7 and R8 may each be a hydrogen atom or a methyl group independently. n1 may be an integer from 1 to 24, and n2 may be an integer from 12 to 200. For example, R1 may be a hydrogen atom or a methyl group. R2 and R3 may each be an independent methyl group or an i-pentyl group. R4 and R5 may each be an independent methyl group or an ethyl group. [Chemical formula M-1] [ka] [Chemical formula M-2] [ka]

[0128] In the aforementioned chemical formula M-1, R2 and R4 may each be independently alkyl groups having 1 to 10 carbon atoms. In the aforementioned chemical formula M-2, R6 may be a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 12 carbon atoms. The first substructure represented by chemical formula M-1 and the second substructure represented by chemical formula M-2 may each be included in chemical formula 1.

[0129] The (meth)acrylate copolymer according to one example may have a weight-average molecular weight of 3,000 or more and less than 50,000. The (meth)acrylate copolymer with a weight-average molecular weight of 3,000 or more and less than 50,000 may exhibit a sufficient degree of polymerization and may have the characteristic of being easy to remove impurities by solution precipitation or other methods after the polymerization reaction is complete. Furthermore, the (meth)acrylate copolymer with a weight-average molecular weight of 3,000 or more and less than 50,000 yields a resin composition with excellent solubility and uniformity.

[0130] In contrast, (meth)acrylate copolymers with a weight-average molecular weight of less than 3,000 exhibit insufficient polymerization and are difficult to remove impurities from after the polymerization reaction is complete, such as by solution precipitation. (Meth)acrylate copolymers with a weight-average molecular weight exceeding 50,000 have very low solubility, making it impossible to obtain a uniform resin composition.

[0131] In a radical polymerization reaction to form a (meth)acrylate copolymer according to one embodiment, a third (meth)acrylate monomer is provided in addition to the first and second (meth)acrylate monomers. The third (meth)acrylate monomer may be a monomer that does not contain hindered phenol groups and hindered amine groups. For example, the third (meth)acrylate monomer may contain at least one of 2-[2-Hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole and methyl methacrylate (MMA).

[0132] The third (meth)acrylate monomer may contain a functional group that absorbs ultraviolet light (hereinafter referred to as "ultraviolet-absorbing functional group"). A resin composition (RC) containing a (meth)acrylate copolymer derived from a third (meth)acrylate monomer containing an ultraviolet-absorbing functional group may exhibit excellent weather resistance after curing. For example, the third (meth)acrylate monomer containing an ultraviolet-absorbing functional group may contain at least one of the following: benzotriazole monomers, benzophenone monomers, salicylic acid monomers, salicylate monomers, cyanoacrylate monomers, cinnamate monomers, oxanilide monomers, polystyrene monomers, polyferrocenylsilane monomers, methine monomers, azomethine monomers, triazine monomers, para-aminobenzoic acid monomers, cinnamic acid monomers, and uricanic acid monomers. More specifically, the third (meth)acrylate monomer containing an ultraviolet-absorbing functional group may contain at least one of the following: benzotriazole monomers, benzophenone monomers, and triazine monomers.

[0133] Based on a total of 100 parts by weight of the (meth)acrylate monomers provided in a radical polymerization reaction to form a (meth)acrylate copolymer, the amount of the first (meth)acrylate monomer may be 0.01 parts by weight or more and 20 parts by weight or less. For example, if only the first and second (meth)acrylate monomers are provided in a radical polymerization reaction to form a (meth)acrylate copolymer, based on a total of 100 parts by weight of the first (meth)acrylate monomer and the second (meth)acrylate monomer, the amount of the first (meth)acrylate monomer may be 0.01 parts by weight or 20 parts by weight or less. Alternatively, if first to third (metho)acrylate monomers are provided in a radical polymerization reaction to form a (metho)acrylate copolymer, the amount of first (metho)acrylate monomer may be 0.01 parts by weight or 20 parts by weight or less, based on a total of 100 parts by weight of the first (metho)acrylate monomer, the second (metho)acrylate monomer, and the third (metho)acrylate monomer.

[0134] When the first (meth)acrylate monomer is provided in an amount less than 0.01 parts by weight, based on a total weight of 100 parts by weight of the (meth)acrylate monomers provided in a radical polymerization reaction to form a (meth)acrylate copolymer, the above-mentioned synergistic effect with the second (meth)acrylate containing the hindered amine group cannot be achieved. This is because the amount of the first (meth)acrylate monomer containing the hindered phenol group is insufficient, and therefore the synergistic effect with the second (meth)acrylate containing the hindered amine group cannot be achieved.

[0135] When the first (meth)acrylate monomer is provided in excess of 20 parts by weight, based on a total weight of 100 parts by weight of the (meth)acrylate monomers provided in a radical polymerization reaction to form a (meth)acrylate copolymer, the polymerization reaction is excessively inhibited and the degree of polymerization of the (meth)acrylate copolymer is reduced. The first (meth)acrylate monomer can act as a radical trapping agent, and if it is provided in excess of 20 parts by weight, the polymerization reaction is inhibited.

[0136] Due to the radical capture of monomers containing hindered phenol groups, it is nearly impossible to form a (meth)acrylate copolymer by providing only monomers containing hindered phenol groups alone. Furthermore, a (meth)acrylate copolymer formed by providing more than 20 parts by weight of (meth)acrylate monomers containing hindered phenol groups exhibits excessive light absorption when included in a resin composition, inhibiting the photocuring reaction that forms adhesive members from the resin composition.

[0137] In the method for manufacturing an electronic device (EA, Figure 5) according to one embodiment, the first (meth)acrylate monomer can be provided in an amount of 0.01 parts by weight or more and 20 parts by weight or less, based on a total weight of 100 parts by weight of (meth)acrylate monomers provided during the radical polymerization reaction for forming the (meth)acrylate copolymer. This yields the synergistic effect described above and the (meth)acrylate copolymer according to one embodiment.

[0138] The resin composition (RC) of one example may further comprise at least one monofunctional (meth)acrylate monomer and at least one photoradical polymerization initiator. For example, the monofunctional (meth)acrylate monomer may comprise at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), and tetrahydrofurfuryl acrylate (THFA). The photoradical polymerization initiator may comprise phenyl bis(2,4,6-trimethylbenzoyl)-phosphine oxide.

[0139] If the resin composition (RC) contains multiple photoradical polymerization initiators, the different photoradical polymerization initiators may be activated by ultraviolet light with different central wavelengths. For example, the photoradical polymerization initiators may be 2,2-dimethoxy-1,2-diphenylethan-1-one and 1-hydroxycyclohexyl phenyl ketone. It may contain at least one of the following: cyclohexyl-phenylketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methylpropan-1-one.

[0140] Additionally, photoradical polymerization initiators include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide. [1-(4-phenylsulfanylbenzoyl)heptylideneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate] It may contain at least one of acetate and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrryl)phenyl]titanium(IV)).

[0141] Referring to Figures 8a and 8b, a resin composition (RC) is directly applied to the first surface of the display module (DM), and light (LT) can be irradiated onto the resin composition, which is applied to a certain thickness. For example, the light (LT) may be ultraviolet light. After irradiation with light (LT), the resin composition (RC) can be cured to form the adhesive member (AP) shown in Figure 8c. After the adhesive member (AP) is formed, a window (WP) may be attached to one surface of the adhesive member (AP).

[0142] Light (LT) can be irradiated onto the resin composition (RC) in the atmosphere. The resin composition (RC) of one embodiment may contain (meth)acrylate according to one embodiment, and may exhibit excellent processability by preventing (or minimizing) inhibition by oxygen in the atmosphere.

[0143] Although Figure 8b shows that light (LT) is directly irradiated onto the provided resin composition (RC), contrary to the illustration, a carrier film (not shown) can be placed on top of the resin composition (RC). The carrier film may be one that transmits ultraviolet light.

[0144] Figures 8a to 8c show that the adhesive member (AP) is formed by curing the resin composition (RC) once (i.e., by providing light once and curing it), but the examples are not limited to this. For example, the adhesive member (AP) may be formed by curing the resin composition (RC) two or more times.

[0145] Figures 9a to 9c show the steps for providing an adhesive member according to another embodiment of the present invention. In the following description of Figures 9a and 9c, any content that overlaps with the content described with reference to Figures 1 to 8c will not be explained again, and the focus will be on the differences.

[0146] The manufacturing method shown in Figures 9a to 9c may represent a method for manufacturing an electronic device of one embodiment, which includes the step of providing a resin composition (RC) on a window (WP). Referring to Figure 9a, the resin composition (RC) can be provided on the second surface of the window (WP) via a nozzle (NZ). The resin composition (RC) can be provided directly on the second surface of the window (WP). The second surface of the window (WP) may be the bottom surface of the window (WP).

[0147] Referring to Figures 9b and 9c, light (LT) is applied to a resin composition (RC) coated to a certain thickness, and the resin composition (RC) is cured by the light (LT) to form an adhesive member (AP). Next, a display module (DM) may be attached to one surface of the adhesive member (AP).

[0148] Figures 10a to 10d show the steps for providing an adhesive member according to another embodiment of the present invention. In the following description of Figures 10a to 10d, any content that overlaps with the content described with reference to Figures 1 to 9c will not be explained again, and the focus will be on the differences.

[0149] Referring to Figure 10a, the resin composition (RC) can be supplied onto a substrate (CF) via a nozzle (NZ). For example, the substrate (CF) to which the resin composition (RC) is supplied contains polyethylene terephthalate (PET). The substrate (CF) is a temporary substrate used to form an adhesive member (AP, Figure 10d) from the resin composition (RC), and can be used without limitation as long as it can be easily detached after the resin composition (RC) has cured. One surface of the substrate (CF) supplied to the resin composition (RC) may be treated with a release treatment.

[0150] Referring to Figures 10b and 10c, a resin composition (RC) coated to a substrate (CF) to which light (LT) is applied can form an adhesive member (AP). The resin composition (RC) can be cured by light (LT) to form the adhesive member (AP). Referring to Figures 10c and 10d, the formed adhesive member (AP) can be detached from the substrate (FC) and provided on the first surface of the display module (DM) and the second surface of the window (WP). One surface of the adhesive member (AP) may be laminated onto the first surface of the display module (DM) or the second surface of the window (WP), and the remaining surface of the adhesive member (AP) may be used to attach the third surface of the window (WP) or the fourth surface of the display module (DM), which is not attached. In the display module (DM), the first and fourth surfaces may be separated in the thickness direction (DR3). In the window (WP), the second and third surfaces may be separated in the thickness direction (DR3).

[0151] Figures 11 and 12 are cross-sectional views showing an electronic device according to another embodiment of the present invention. In the following description of Figures 11 and 12, any information that overlaps with the information provided with reference to Figures 1 to 10c will not be repeated, and the focus will be on the differences.

[0152] Compared to the electronic devices (EA) shown in Figures 4 and 5, the electronic device (EA-a) shown in Figure 11 may further include a light control layer (PP) and an optical adhesive layer (AP-a). The electronic device (EA-a) of one embodiment may further include a light control layer (PP) disposed between an adhesive member (AP) and a window (WP), and an optical adhesive layer (AP-a) disposed between the light control layer (PP) and the window (WP). For example, the light control layer (PP) may include a color filter or a polarizer.

[0153] The optical adhesive layer (AP-a) may contain polymers derived from the resin composition of one embodiment (RC, Figures 8a, 9a, and 10a). The optical adhesive layer (AP-a) containing polymers derived from the resin composition (RC, Figures 8a, 9a, and 10a) may have a 180° peel strength of 1500 gf / 25 mm or more to at least one of the glass substrate and polymer substrate at a temperature of 25°C. The optical adhesive layer (AP-a) containing polymers derived from the resin composition (RC, Figures 8a, 9a, and 10a) may have a yellowness of 0.5 or less after a weathering test. As a result, the electronic device (EA-a) containing the optical adhesive layer (AP-a) may exhibit excellent reliability and excellent display quality.

[0154] Compared to the electronic device (EA) described with reference to Figures 4 and 5, the electronic device (EA-b) of one embodiment shown in Figure 12 may further include a light control layer (PP), an optical adhesive layer (AP-a), and an interlayer adhesive layer (PIB). The electronic device (EA-b) of one embodiment shown in Figure 12 may further include a light control layer (PP) disposed between the adhesive member (AP) and the window (WP), and an optical adhesive layer (AP-a) disposed between the light control layer (PP) and the window (WP), as in the electronic device (EA-a) of one embodiment shown in Figure 11.

[0155] In one embodiment of the electronic device (EA-b), the adhesive member (AP) can be provided between the display panel (DP) and the input sensing unit (TP). That is, the input sensing unit (TP) is not directly placed on the display panel (DP), but the display panel (DP) and the input sensing unit (TP) can be bonded to each other by the adhesive member (AP). For example, the adhesive member (AP) can be placed between the sealing layer (TFE, Figure 5) of the display panel (DP) and the input sensing unit (TP).

[0156] An interlayer adhesive layer (PIB) can be provided below the light control layer (PP). The interlayer adhesive layer (PIB) is placed between the input sensing unit (TP) and the light control layer (PP) and may be made of an adhesive material with excellent moisture-proof properties. For example, the interlayer adhesive layer (PIB) may be formed containing polyisobutylene. The interlayer adhesive layer (PIB) may be placed on top of the input sensing unit (TP) to prevent corrosion of the sensing electrode of the input sensing unit (TP). An electronic device (EA-b) of one embodiment includes an optical adhesive layer (AP-a) and an adhesive member (AP) made of the resin composition (RC, Figures 8a, 9a, and 10a) according to one embodiment, and may exhibit excellent reliability and excellent display quality.

[0157] Figure 13 shows a vehicle (AM) in which the first to fourth electronic devices (EA-1, EA-2, EA-3, EA-4) are arranged. At least one of the first to fourth electronic devices (EA-1, EA-2, EA-3, EA-4) may include the same configuration as any one of the electronic devices (EA, EA-a, EA-b) of one embodiment described with reference to Figures 1 to 5, 11, and 12. At least one of the first to fourth electronic devices (EA-1, EA-2, EA-3, EA-4) may include an adhesive member (AP) of one embodiment described with reference to Figures 1 to 5, 11, and 12.

[0158] Although Figure 13 shows an automobile as the vehicle (AM), this is illustrative, and the first to fourth electronic devices (EA-1, EA-2, EA-3, EA-4) may be installed in other means of transport such as bicycles, motorcycles, trains, ships, and airplanes. Furthermore, at least one of the first to fourth electronic devices (EA-1, EA-2, EA-3, EA-4) that also include any one configuration of the electronic devices of one embodiment (EA, EA-a, EA-b, Figures 5, 11, and 12) may be used in other electronic devices without departing from the concept of the present invention.

[0159] At least one of the first to fourth electronic devices (EA-1, EA-2, EA-3, EA-4) may include the adhesive member (AP, Figure 5) of one embodiment. The adhesive resin (AP, Figure 5) of one embodiment may consist of the resin composition (RC, Figures 8a, 9a, and 10a) of one embodiment and may exhibit excellent adhesive strength and excellent weather resistance.

[0160] Referring to Figure 13, the vehicle (AM) includes a steering wheel (HA) and a gear (GR) for operating the vehicle (AM), and a front window (GL) is positioned to face the driver.

[0161] The first electronic device (EA-1) may be located in a first region that overlaps with the steering wheel (HA). For example, the first electronic device (EA-1) may be a digital cluster that displays first information of the vehicle (AM). The first information may include a first scale representing the vehicle's (AM) speed, a second scale indicating the engine speed (i.e., RPM (revolutions per minute)), and an image indicating the fuel status. The first and second scales may be displayed as digital images.

[0162] The second electronic device (EA-2) can be positioned in a second area facing the driver's seat and superimposed on the front window (GL). The driver's seat may be the seat on which the steering wheel (HA) is located. For example, the second electronic device (EA-2) may be a head-up display (HUD) that displays second information about the vehicle (AM). The second electronic device (EA-2) may be optically transparent. The second information may include digital numbers indicating the vehicle's (AM) speed and may further include information such as the current time. Contrary to the illustration, the second information of the second electronic device (EA-2) may be projected and displayed on the front window (GL).

[0163] The third electronic device (EA-3) can be located in a third area adjacent to the gear (GR). For example, the third electronic device (EA-3) may be located between the driver's seat and the passenger seat and may be a Center Information Display (CID) that displays third information. The passenger seat may be a seat separated from the driver's seat with the gear (GR) in between. The third information may include information about road conditions (e.g., navigation information), music or radio playback, dynamic video (or image) playback, and the temperature inside the vehicle (AM).

[0164] The fourth electronic device (EA-4) can be located in a fourth area adjacent to the side of the vehicle (AM), separated from the steering wheel (HA) and gear (GR). For example, the fourth electronic device (EA-4) may be a digital side mirror that displays fourth information. The fourth electronic device (EA-4) may also display images of the outside of the vehicle (AM) captured by a camera module (CM) located on the outside of the vehicle (AM). The fourth information may include images of the outside of the vehicle (AM).

[0165] The first to fourth pieces of information described above are illustrative, and the first to fourth electronic devices (EA-1, EA-2, EA-3, EA-4) may further display information relating to the interior and exterior of the vehicle. The first to fourth pieces of information may contain different information from each other. However, the embodiments are not limited thereto, and some of the first to fourth pieces of information may contain the same information from each other.

[0166] The following will describe in detail a resin composition according to one embodiment of the present invention and an adhesive member made from the resin composition, with reference to examples and comparative examples. Furthermore, the following examples are illustrative to aid in understanding the present invention, and the scope of the present invention is not limited thereto.

[0167] [Examples] 1. Production of (meth)acrylate copolymer The (meth)acrylate copolymers MA-1 to MA-6 provided for the resin compositions of the Examples and Comparative Examples were synthesized by the methods of Synthesis Examples 1 to 6, respectively, as described below. The (meth)acrylate copolymers MA-1 to MA-4 are the (meth)acrylate copolymers of the Examples. The (meth)acrylate copolymers MA-5 and MA-6 are the copolymers of the Comparative Examples. SUMILIZER GM (RN: 61167-58-6), SUMILIZER GS (RN: 123968-25-2), and LA-82 (RN: 68548-08-3), shown below, are substances used in the synthesis of the (meth)acrylate copolymers MA-1 to MA-5. SUMILIZER GM and SUMILIZER GS contain hindered phenol groups. LA-82 contains hindered amine groups. [ka]

[0168] In the synthesis of (meth)acrylate copolymer MA-1, SUMILIZER GM was used as the first (meth)acrylate monomer containing a hindered phenol group, and LA-82 was used as the second (meth)acrylate monomer containing a hindered amine group. In the synthesis of (meth)acrylate copolymer MA-2, SUMILIZER GS was used as the first (meth)acrylate monomer containing a hindered phenol group, and LA-82 was used as the second (meth)acrylate monomer containing a hindered amine group.

[0169] In the synthesis of (meth)acrylate copolymer MA-3, SUMILIZER GM was used as the first (meth)acrylate monomer containing a hindered phenol group, LA-82 was used as the second (meth)acrylate monomer containing a hindered amine group, and RUVA-93 was used as the third (meth)acrylate monomer. In the synthesis of (meth)acrylate copolymer MA-4, SUMILIZER GM was used as the first (meth)acrylate monomer containing a hindered phenol group, LA-82 was used as the second (meth)acrylate monomer containing a hindered amine group, and RUVA-93 and MMA were used as the third (meth)acrylate monomers.

[0170] In the synthesis of (meth)acrylate copolymer MA-5, the first (meth)acrylate monomer containing a hindered phenol group was not used; instead, LA-82 was used as the second (meth)acrylate monomer containing a hindered amine group, and RUVA-93 was used as the third (meth)acrylate monomer. In the synthesis of (meth)acrylate copolymer MA-6, 2-isocyanatoethyl methacrylate and n-butyl acrylate were used as monomers.

[0171] <Synthesis Example 1: Synthesis of (meth)acrylate copolymer MA-1> 30 ml of n-butyl acetate (product of KISHIDA CHEMICAL Co., Ltd.) was placed in a 100 ml circular flask equipped with a condenser, dropping funnel, nitrogen inlet tube, and magnetic stirrer, and the solvent was deoxygenated by stirring at room temperature for 30 minutes while bubbling with nitrogen. This was then heated in an oil bath until the internal temperature reached 90°C. Next, 2.10 g of 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate (SUMILIZER GM, Sumitomo Chemical Co., Ltd. product) and 8.62 g of 1,2,2,6,6-pentamethyl-4-piperidyl-methacrylate (LA-82, ADEKA Corporation product) were placed in a dropping funnel, and 0.60 g of Dimethyl 2,2'-azobis(2-methylpropionate) (V-601, FUJIFILM Wako Pure Chemical Corporation product) was provided as a thermal polymerization initiator. 20 ml of n-butyl acetate was added to prepare a homogeneous solution. The stopcock of the dropping funnel was opened, and the solution was gradually added dropwise into the flask for 1 hour. Then, the mixture was stirred for 3 hours to carry out the polymerization reaction. After the reaction, the flask was removed from the oil bath and allowed to cool completely. Next, 800 ml of ethanol was added to a 1000 ml beaker and stirred with a magnetic stirrer. The polymerization solution from the flask was then gradually added dropwise to precipitate the precipitate. The precipitate was filtered by suction filtration, washed again with ethanol, and filtered to remove n-butyl acetate and unreacted monomers. The precipitate was dried under reduced pressure to obtain 8.72 g of a pale red powder, which was a copolymer of SUMILIZER GM and LA-82. The copolymer of SUMILIZER GM and LA-82 is (meth)acrylate copolymer MA-1.

[0172] <Synthesis Example 2: Synthesis of (meth)acrylate copolymer MA-2> Except for using 2.10 g of 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate (SUMILIZER GS, product of Sumitomo Chemical Co., Ltd.) instead of SUMILIZER GM, 8.61 g of a pale red powder, a copolymer of SUMILIZER GM and LA-82, was obtained by the same method as in Synthesis Example 1. The copolymer of SUMILIZER GS and LA-82 is the (meth)acrylate copolymer MA-2.

[0173] <Synthesis Example 3: Synthesis of (metho)acrylate copolymer MA-3> Before providing the thermal polymerization initiator, 1.08 g of 2-[2-Hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole) (RUVA-93, product of Otsuka Chemical Co., Ltd.) was added, and 9.75 g of a pale red powder, a copolymer of SUMILIZER GM, LA-82, and RUVA-93, was obtained by the same method as in Synthesis Example 1, except that 0.70 g of V-601 was used as the thermal polymerization initiator. The copolymer of SUMILIZER GM, LA-82, and RUVA-93 is the (meth)acrylate copolymer MA-3.

[0174] <Synthesis Example 4: Synthesis of (meth)acrylate copolymer MA-4> Before providing the thermal polymerization initiator, 11.9 g of methyl methacrylate (MMA, product of Tokyo Chemical Industry Co., Ltd.) was added, and 0.70 g of V-601 was used as the thermal polymerization initiator. This was then added to 40 ml of n-butyl acetate to prepare a homogeneous solution. Except for this, 20.5 g of a white powder, a copolymer of SUMILIZER GM, LA-82, RUVA-93, and MMA, was obtained by the same method as in Synthesis Example 3. The copolymer of SUMILIZER GM, LA-82, RUVA-93, and MMA is the (meth)acrylate copolymer MA-4.

[0175] <Synthesis Example 5: Synthesis of (meth)acrylate copolymer MA-5> Except for not using SUMILIZER GM and using 0.50 g of V-601 as a thermal polymerization initiator, 8.83 g of a white powder, a copolymer of LA-82 and RUVA-93, was obtained by the same method as in Synthesis Example 3. The copolymer of LA-82 and RUVA-93 is the (meth)acrylate copolymer MA-5.

[0176] <Synthesis Example 6: Synthesis of (meth)acrylate copolymer MA-6> In a 100 ml circular flask equipped with a condenser, a nitrogen inlet tube, and a magnetic stirrer, 25 ml of n-butyl acetate (product of KISHIDA CHEMICAL Co., Ltd.), 20 g of n-butyl acrylate (product of Tokyo Chemical Industry Co., Ltd.), 1.0 g of 2-isocyanatoethyl methacrylate (Karenz MOI, product of Resonac Inc.), and 1.0 g of 1-dodecanediol (product of Tokyo Chemical Industry Co., Ltd.) were provided and mixed. The mixture was stirred at room temperature for 30 minutes while bubbling with nitrogen to deoxygenate the solvent. This mixture was then heated in an oil bath until the internal temperature reached 90°C.

[0177] A solution of 0.005 g of 1,1-Di(t-hexylperoxy)cyclohexane (PERHEXA HC, NOF CORPORATION product) diluted with 1 g of n-butyl acetate was added to the reaction system using a dropping funnel. This was the first addition of the polymerization initiator. After 1 hour, a solution of 0.007 g of 1,1-di(t-hexylperoxy)-3,3,5-trimethylcyclohexane diluted with 1 g of n-butyl acetate was added to the reaction system. Next, solutions of 0.010 g, 0.02 g, and 0.07 g of di(3,5,5-Trimethylhexanoyl) peroxide (PEROYL 355, NOF CORPORATION product) diluted with 1 g of n-butyl acetate were added three times at 1-hour intervals.

[0178] Seven hours after the initial polymerization initiator was added, 0.4 g of Pentaerythritol Tetrakis (3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate) (Irganox 1010, BASF), 0.4 g of 2-(3',5'-di-t-butyl-2-hydroxyphenyl)-5-chlorobenzotriazole (Tinuvin 327, BASF), and 0.4 g of Bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate (LA-77, ADEKA Corporation) were added, and the reaction was allowed to proceed for an additional 3 hours. After the reaction, the flask was removed from the oil bath and allowed to cool completely. Next, 800 ml of ethanol was added to a 1000 ml beaker and stirred with a magnetic stirrer. The polymerization solution from the flask was then added dropwise to precipitate the precipitate. The precipitate was filtered by suction filtration, and then washed and filtered again with ethanol to remove n-butyl acetate and unreacted monomers. The precipitate was dried under reduced pressure to obtain 20.8 g of a pale yellow powder which is a copolymer of n-butyl acetate and modified 2-isocyanatoethyl methacrylate. Modified 2-isocyanatoethyl methacrylate is obtained by modifying the isocyanate group within 2-isocyanatoethyl methacrylate. The copolymer of n-butyl acetate and modified 2-isocyanatoethyl methacrylate is (meth)acrylate copolymer MA-6. Synthesis Example 6 is based on the method for producing the copolymer of the example disclosed in Patent Publication No. 2004-292616 and Patent Publication No. 2005-290269.

[0179] The (meth)acrylate copolymer MA-6 can be represented by the following chemical formula M6. In chemical formula M6, the dotted rectangles labeled MY-1 to MY-3 are included for explanatory purposes. In chemical formula M6, O a , O b , and N c For the sake of explanation, the letters a, b, and c are used to represent oxygen or nitrogen atoms. In M6 below, m1 is an integer between 1 and 134, m2 is an integer between 1 and 13, m3 is an integer between 1 and 35, and m5 is an integer between 1 and 27. [Chemical formula M6] [ka]

[0180] In chemical formula M6, the first substructure, denoted as MY-1, contains a group in which the reducing functional group (i.e., a hindered phenol group) has been modified. In the first substructure, O a The oxygen atom represented by was the oxygen atom of the -OH group that constitutes the hindered phenol group, but it has been modified into a urethane group. The second substructure represented by MY-2 contains a group in which a light-absorbing functional group (i.e., an ultraviolet-absorbing functional group) has been modified. In the second substructure, O b The oxygen atom represented by was the oxygen atom of the -OH group that constitutes the hydroxybenzotriazole group, but it has been modified into a urethane group. The third substructure represented by MY-3 contains a group in which the photostable functional group (i.e., a hindered amine group) has been modified. In the third substructure, N c The nitrogen atom indicated was originally the nitrogen atom of the -NH group constituting the hindered amine group, but it has been modified into a urea group. In summary, (meth)acrylate copolymer MA-6 has had its reducing functional group, UV absorbing functional group, and photostability functional group modified, resulting in the loss of its reducing, UV absorbing, and photostability properties.

[0181] More specifically, the (meth)acrylate copolymer MA-6 was obtained by primary and secondary reactions. In the primary reaction (radical polymerization reaction), a pre(meth)acrylate copolymer containing an isocyanate group was obtained, and in the secondary reaction, the isocyanate group reacted with the first to third functional groups. The (meth)acrylate copolymer MA-6 was obtained from the pre(meth)acrylate copolymer. The first functional group is the -OH group of a hindered phenol group, which is a reducing functional group. The second functional group is the -OH group of a hydroxybenzotriazole group, which is an ultraviolet absorbing functional group. The third functional group is the -NH group of a hindered amine group, which is a photostable functional group. In the secondary reaction, the -OH group and -NH group are consumed and modified into a urethane group and a urea group, respectively. At this point, the properties of the reducing functional group, ultraviolet absorbing functional group, and photostable functional group are lost.

[0182] <Synthesis Example 7: Synthesis of (meth)acrylate copolymer MA-7> Except for not using LA-82, 6.81 g of a white powder, a copolymer of SUMILIZER GM, RUVA-93, and MMA, was obtained by the same method as in Synthesis Example 4. The copolymer of SUMILIZER GM, RUVA-93, and MMA is the (meth)acrylate copolymer MA-7.

[0183] Table 1 below shows the substances that correspond to the first to third (meth)acrylate monomers and the amounts provided, among the substances used in the synthesis of MA-4 from (meth)acrylate copolymer MA-1.

[0184] [Table 1]

[0185] Referring to Table 1, if the total weight of the first and second (meth)acrylate monomers provided in the synthesis of (meth)acrylate copolymer MA-1 is 100 parts by weight, then the first (meth)acrylate monomer was provided in approximately 19.5 parts by weight.

[0186] When synthesizing (meth)acrylate copolymer MA-2, if the total weight of the first and second (meth)acrylate monomers provided is 100 parts by weight, the first (meth)acrylate monomer was provided in approximately 19.5 parts by weight. When synthesizing (meth)acrylate copolymer MA-3, if the total weight of the first to third (meth)acrylate monomers provided is 100 parts by weight, the first (meth)acrylate monomer was provided in approximately 17.8 parts by weight. When synthesizing (meth)acrylate copolymer MA-4, if the total weight of the first to third (meth)acrylate monomers provided is 100 parts by weight, the first (meth)acrylate monomer was provided in approximately 8.9 parts by weight.

[0187] In one embodiment, based on a total weight of 100 parts by weight of (meth)acrylate monomers provided during the radical polymerization reaction to form the (meth)acrylate copolymer, the amount of the first (meth)acrylate monomer containing a hindered phenol group may be 0.01 parts by weight or more and 20 parts by weight or less. As described above, it can be seen that the amount of the first (meth)acrylate monomer provided during the polymerization reaction to form MA-4 from (meth)acrylate copolymer MA-1 satisfies the range of parts by weight in one embodiment.

[0188] 2. Manufacturing of resin compositions The materials listed in Tables 2 and 3 below were provided in light-shielding, sealed containers according to their respective mixing ratios (parts by weight), and stirred at room temperature for 12 hours using a mix rotor. The mixture was checked, and when it was homogeneous, it was used as the resin composition for the examples and comparative examples.

[0189] <Materials related to Tables 2 and 3> [Monofunctional (meth)acrylate monomer] 4-HBA: 4-hydroxybutyl acrylate (product of Osaka Organic Chemical Industry Co., Ltd.) THFA: Tetrahydrofurfuryl acrylate (product of Kyoeisha Chemical Co., Ltd.) 2-EHA: 2-ethylhexyl acrylate (Toagosei Co., Ltd. product) [Photoradical polymerization initiator] Omnirad 819: Phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide (manufactured by IGM Resins) [Hindered phenol additive] AO-50: Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate (ADEKA Corporation product) [Hindered amine additive] LA-72: Bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate ((octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate) (ADEKA Corporation product) [UV absorber] Tinuvin 928: 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol (manufactured by BASF)

[0190] [Table 2]

[0191] Referring to Table 2, the resin compositions of Examples 1 to 4 are resin compositions according to one example, and each contains (meth)acrylate copolymers MA-1 to MA-4. Furthermore, the resin compositions of Examples 1 to 4 contain 4-HBA, THFA, and 2-EHA as monofunctional (meth)acrylate monomers, and Omnirad819 as a photoradical polymerization initiator.

[0192] (meth)acrylate copolymers MA-1 to MA-4 are (meth)acrylate copolymers according to one example and contain hindered phenol groups and hindered amine groups. (meth)acrylate copolymers MA-3 and MA-4 were synthesized using RUVA-93 and further contain UV-absorbing functional groups. (meth)acrylate copolymer MA-4 was synthesized using MMA and further contains hydrocarbon structures derived from MMA. As a result, (meth)acrylate copolymer MA-4 has improved plasticity, and the resin composition of Example 4 containing (meth)acrylate copolymer MA-4 can improve the adhesive strength after curing.

[0193] [Table 3]

[0194] Referring to Table 2, the resin compositions of Comparative Examples 1 to 3 do not contain (meth)acrylate copolymers. The resin compositions of Comparative Examples 2 and 3 contain hindered amine additives, which differs from the (meth)acrylate copolymers MA-1 to MA-4 contained in the resin compositions of Examples 1 to 4. The (meth)acrylate copolymers MA-1 to MA-4 contain both hindered phenol groups and hindered amine groups within the copolymer. The resin composition of Comparative Example 3 contains an ultraviolet absorber, which differs from the (meth)acrylate copolymers MA-3 and MA-4, which contain ultraviolet absorbing functional groups within the copolymer.

[0195] The resin compositions of Comparative Examples 4 to 6 each contain (meth)acrylate copolymers MA-5 to MA-7, and (meth)acrylate copolymers MA-5 to MA-7 are the copolymers of the Comparative Examples. (meth)acrylate copolymer MA-5 is a copolymer formed without providing a (meth)acrylate monomer containing a hindered phenol group. (meth)acrylate copolymer MA-6 is a copolymer in which the hindered phenol group and hindered amine group have been modified to a urethane group and a urea group, respectively, as previously explained with reference to chemical formula M6. (meth)acrylate copolymer MA-7 is a copolymer formed without providing a (meth)acrylate monomer containing a hindered amine group.

[0196] 3. Evaluation of adhesive materials Table 4 below shows the evaluation of adhesive members of the Examples and Comparative Examples, which are made from the resin compositions of the Examples and Comparative Examples. In Table 4 below, Examples E-1 to E-4 are adhesive members formed using the resin compositions of Examples 1 to 4, respectively. Comparative Examples C-1 to C-6 are adhesive members formed using the resin compositions of Comparative Examples 1 to 6, respectively. The 180° peel strength and yellowness of the adhesive members were evaluated using the method described below, and the laminates produced by the bonding process described below were used as test specimens.

[0197] <Joining process> A resin composition was applied to a first substrate, and an adhesive member was formed by irradiating the applied resin composition with ultraviolet light in the atmosphere. Next, a second substrate was bonded to one surface of the adhesive member to obtain a laminate containing the first substrate, the adhesive member, and the second substrate. A 365 nm UV-LED lamp was used for irradiation with ultraviolet light, and the total amount of light was 1000 mJ / cm². 2 This was achieved by irradiating the area in that manner.

[0198] <180° peel strength of adhesive material> In the aforementioned bonding process, a resin composition was applied to one side of a 76mm x 26mm glass slide to a thickness of 100μm and cured by irradiation with ultraviolet light in the atmosphere. A PET film measuring 150mm x 20mm and 50μm thick was then bonded to this laminate using an atmospheric pressure laminator to create a laminated structure, which was then degassed under pressure in an autoclave at 30°C and 0.5MPa for 5 minutes. The resulting laminate was used as a test specimen for evaluating 180° peel strength. The 180° peel strength was evaluated at a temperature of 25°C in accordance with the JIS Z0237 method. The value obtained by applying the average value of the peel strength in the range of 20mm to 80mm from the start of peeling was recorded in Table 4 as follows. If the 180° peel strength was 1500gf / 25mm or more, it was recorded as "○", and if the 180° peel strength was less than 1500gf / 25mm, it was recorded as "×".

[0199] <Yellowness of adhesive material> The yellowness of the adhesive material is evaluated according to the MIL-STD-810G method.

[0200] In the aforementioned bonding process, a resin composition was applied to one side of a 76mm x 26mm glass slide to a thickness of 100μm, and cured by irradiation with ultraviolet light in the atmosphere. A glass slide of the same size was then bonded to this laminate using a normal pressure laminator to create a laminated structure, which was then degassed under pressure in an autoclave at 30°C and 0.5MPa for 5 minutes. The resulting laminate was used as a test specimen for evaluating yellowness. The yellowness was measured after the weather resistance test.

[0201] For the weather resistance test, a Q-LAB Q-SUN Xe-1 benchtop xenon accelerated weathering tester was used, and the test specimens were exposed to 0.4 mW and 60°C for 200 hours. After completion, the yellowness (YI) of the test specimens was measured using a COH7700 spectrocolorimeter (Nippon Denshoku Kogyo Co., Ltd. product) to evaluate the degree of yellowing. A smaller absolute value of YI indicates less yellowing and better weather resistance. The obtained YI values ​​were recorded in Table 1 as follows. If the YI was 0.50 or less, it was recorded as "○", and if the YI exceeded 0.50, it was recorded as "×".

[0202] [Table 4]

[0203] Referring to Table 4, it can be seen that the adhesive members of Examples E-1 to E-4 have a 180° peel strength of 1500 gf / 25 mm or more at a temperature of 25°C. It can be seen that the adhesive members of Examples E-1 to E-4 have a yellowness of 0.5 or less after the weathering test. The adhesive members of Examples E-1 to E-4 are each made of the resin compositions of Examples 1 to 4, and the resin compositions of Examples 1 to 4 each contain (meth)acrylate copolymers MA-1 to MA-4. Each of the (meth)acrylate copolymers MA-1 to MA-4 contains a hindered phenol group and a hindered amine group, and is formed by a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group. This demonstrates that, in one example, a resin composition containing (metho)acrylate derived from a radical polymerization reaction between a first (metho)acrylate monomer containing a hindered phenol group and a second (metho)acrylate monomer containing a hindered amine group exhibits excellent adhesive reliability and excellent weather resistance after curing.

[0204] The adhesive member of Comparative Example C-1 is made of the resin composition of Comparative Example 1, and the resin composition of Comparative Example 1 does not contain a (meth)acrylate copolymer. The adhesive member of Comparative Example C-1 has a 180° peel strength of 80 gf / 25 mm at a temperature of 25°C, which is less than 1500 gf / 25 mm. A peel strength of 80 gf / 25 mm indicates almost no adhesive strength. After the weathering test, the yellowness of the adhesive member of Comparative Example C-1 was 2.17, which is greater than 0.5. When curing in the atmosphere, the adhesive member of Comparative Example C-1 showed strong yellowing due to inhibition of the reaction on the outermost surface by oxygen.

[0205] The adhesive members of Comparative Examples C-2 and C-3 consist of the resin compositions of Comparative Examples 2 and 3, respectively, and the resin compositions of Comparative Examples 2 and 3 do not contain (meth)acrylate copolymers. The adhesive member of Comparative Example C-2 has a 180° peel strength of 200 gf / 25 mm at a temperature of 25°C and a 180° peel strength of less than 1500 gf / 25 mm. After the weathering test, the yellowness of the adhesive member of Comparative Example C-2 is 1.23, exceeding 0.50. The adhesive member of Comparative Example C-3 has a 180° peel strength of 150 gf / 25 mm at a temperature of 25°C and a 180° peel strength of less than 1500 gf / 25 mm. After the weathering test, the yellowness of the adhesive member of Comparative Example C-3 is 0.72, exceeding 0.50.

[0206] The resin composition of Comparative Example 2 contains a hindered phenol additive and a hindered amine additive, while the resin composition of Comparative Example 3 contains a hindered phenol additive, a hindered amine additive, and an ultraviolet absorber. Since the additives and ultraviolet absorber do not exhibit a surface segregation effect, the adhesive members of Comparative Examples C-2 and C-3, which are made from the resin compositions of Comparative Examples 2 and 3, exhibit low adhesive strength and low weather resistance.

[0207] The adhesive member of Comparative Example C-4 is made of the resin composition of Comparative Example 4, and the resin composition of Comparative Example 4 contains (meth)acrylate copolymer MA-5. The adhesive member of Comparative Example C-4 had a yellowness of 0.55 after the weathering test, and a yellowness exceeding 0.50. (Meth)acrylate copolymer MA-5 contains hindered amine groups and ultraviolet light absorbing functional groups, but does not contain hindered phenol groups. As a result, the adhesive member of Comparative Example C-4 showed low weather resistance after the weathering test.

[0208] The adhesive member of Comparative Example C-5 is made of the resin composition of Comparative Example 5, and the resin composition of Comparative Example 5 contains (meth)acrylate copolymer MA-6. The adhesive member of Comparative Example C-5 has a 180° peel strength of 800 gf / 25 mm at a temperature of 25°C and a 180° peel strength of less than 1500 gf / 25 mm. After the weathering test, the adhesive member of Comparative Example C-5 has a yellowness of 1.36, which exceeds 0.50. The reasons for such low adhesive strength and low weather resistance include the fact that (meth)acrylate copolymer MA-6 has a structure close to three-dimensional crosslinking, the cohesiveness of the outermost surface is excessively high in terms of adhesive strength, and as explained earlier with reference to chemical formula M6, the hindered phenol group, hindered amine group, and UV-absorbing functional group have been modified.

[0209] The adhesive member of Comparative Example C-6 is made of the resin composition of Comparative Example 6, and the resin composition of Comparative Example 6 contains (meth)acrylate copolymer MA-7. The adhesive member of Comparative Example C-6 had a yellowness of 1.47 after the weathering test, exceeding a yellowness of 0.50. (Meth)acrylate copolymer MA-7 contains hindered amine groups and ultraviolet light absorbing functional groups, but does not contain hindered amine groups. As a result, the adhesive member of Comparative Example C-6 showed low weather resistance after the weathering test.

[0210] The electronic device of one embodiment may include an adhesive member positioned between a display panel and a window. The electronic device of one embodiment can be manufactured by the method for manufacturing an electronic element of one embodiment. The electronic device of one embodiment may include the step of providing a resin composition to form an adhesive member. The resin composition of one embodiment may include a (meth)acrylate copolymer derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group. The (meth)acrylate copolymer may contain a hindered phenol group and a hindered amine group. As a result, the resin composition of one embodiment can exhibit excellent processability when photocured in air, and can exhibit excellent adhesive strength and excellent weather resistance after curing. The electronic device of one embodiment, including the adhesive member formed by curing the resin composition, can exhibit excellent reliability.

[0211] Although preferred embodiments of the present invention have been described so far with reference, a person skilled in the art or a person with ordinary knowledge in the art will understand that the present invention may be modified and altered in various ways without departing from the spirit and art domain of the invention as described in the claims below.

[0212] Therefore, the technical scope of the present invention is not limited to what is described in the detailed description of the specification, but should be determined by the claims. [Explanation of Symbols]

[0213] RC: Resin composition EA: Electronic device DP: Display Panel WP: Window AP: Adhesive material

Claims

1. A resin composition comprising a (meth)acrylate copolymer derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group.

2. The (meth)acrylate copolymer is represented by the following chemical formula 1 in the resin composition according to claim 1: [Chemical formula 1] 【Chemistry 1】 In the aforementioned chemical formula 1, R １ is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. R ２ From R ５ Each of these is an alkyl group having 1 to 10 carbon atoms, R ６ is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 12 carbon atoms. R ７ and R ８ Each of these is independently a hydrogen atom or a methyl group. n1 is an integer between 1 and 24, n2 is an integer between 12 and 200 (inclusive).

3. The resin composition according to claim 1, wherein the first (meth)acrylate monomer comprises a first substructure represented by the following chemical formula M-1, and the second (meth)acrylate monomer comprises a second substructure represented by the following chemical formula M-2: [Chemical formula M-1] 【Chemistry 2】 [Chemical formula M-2] 【Transformation 3】 In the aforementioned chemical formula M-1, R ２ and R ４ Each of these is an alkyl group having 1 to 10 carbon atoms, In the aforementioned chemical formula M-2, R ６ represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 12 carbon atoms.

4. The resin composition according to claim 1, wherein the amount of the first (meth)acrylate monomer is 0.01 parts by weight or more and 20 parts by weight or less, based on a total weight of 100 parts by weight of the (meth)acrylate monomers provided during the radical polymerization reaction.

5. The resin composition according to claim 1, further comprising a third (meth)acrylate monomer that does not contain the hindered phenol group and the hindered amine group during the radical polymerization reaction.

6. The resin composition according to claim 5, wherein the third (meth)acrylate monomer comprises a functional group that absorbs ultraviolet light.

7. The resin composition according to claim 5, wherein the third (meth)acrylate monomer comprises at least one of 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl-2H-benzotriazole (2-[2-Hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole) and methyl methacrylate (methyl methacrylate, MMA).

8. The resin composition further comprises at least one monofunctional (meth)acrylate monomer and at least one photoradical polymerization initiator. The resin composition according to claim 1, wherein the monofunctional (meth)acrylate monomer comprises at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), and tetrahydrofurfuryl acrylate (THFA).

9. The resin composition according to claim 1, wherein the 180° peel strength to at least one of the glass substrate and polymer substrate, after curing in air at a temperature of 25°C, is 1500 gf / 25 mm or more.

10. Steps to prepare the display panel, The steps include preparing a window to be placed on the aforementioned display panel, The step of providing the window includes, before the step of providing the window, providing an adhesive member on the display panel or the window, The step of providing the adhesive member is: The steps include providing a resin composition containing a (meth)acrylate copolymer on the display panel or the window, The process includes the step of irradiating the provided resin composition with light in the atmosphere to form the adhesive member, The (meth)acrylate copolymer is derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group, and is used to produce an electronic device.

11. The (meth)acrylate copolymer is represented by the following chemical formula 1. Method for manufacturing an electronic device according to claim 10: [Chemical formula 1] 【Chemistry 4】 In the aforementioned chemical formula 1, R １ is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. R ２ From R ５ Each of these is an alkyl group having 1 to 10 carbon atoms, R ６ is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 12 carbon atoms. R ７ and R ８ Each of these is independently a hydrogen atom or a methyl group. n1 is an integer between 1 and 24, n2 is an integer between 12 and 200 (inclusive).

12. A method for manufacturing an electronic device according to claim 11, wherein the first (meth)acrylate monomer comprises a first substructure represented by the following chemical formula M-1, and the second (meth)acrylate monomer comprises a second substructure represented by the following chemical formula M-2: [Chemical formula M-1] 【Transformation 5】 [Chemical formula M-2] 【Transformation 6】 In the aforementioned chemical formula M-1, R ２ and R ４ Each of these is an alkyl group having 1 to 10 carbon atoms, R ６ This is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 12 carbon atoms.

13. The method for manufacturing an electronic device according to claim 11, wherein the amount of the first (meth)acrylate monomer is 0.01 parts by weight or more and 20 parts by weight or less, based on a total weight of 100 parts by weight of the (meth)acrylate monomers provided during the radical polymerization reaction.

14. The method for manufacturing an electronic device according to claim 11, wherein a third (meth)acrylate monomer that does not contain the hindered phenol group and the hindered amine group is further provided during the radical polymerization reaction.

15. The method for producing an electronic device according to claim 11, wherein the resin composition further comprises at least one monofunctional (meth)acrylate monomer and at least one photoradical polymerization initiator.

16. The method for manufacturing an electronic device according to claim 11, wherein the resin composition is provided by an inkjet printing method or a dispensing method.

17. Display panel and, A window positioned on the aforementioned display panel, The adhesive member comprises a polymer derived from a resin composition and is disposed between the display panel and the window, The resin composition comprises an electronic device comprising a (meth)acrylate copolymer derived from a radical polymerization reaction of a first (meth)acrylate monomer containing a hindered phenol group and a second (meth)acrylate monomer containing a hindered amine group.

18. The electronic device according to claim 17, wherein the adhesive member has a 180° peel force of 1500 gf / 25 mm or more to at least one of the glass substrate and polymer substrate at a temperature of 25°C.

19. The present invention further includes a light control layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light control layer and the window. The electronic device according to claim 17, wherein the optical adhesive layer comprises a polymer derived from the resin composition.

20. The system further includes an input sensing unit positioned between the display panel and the window, The electronic device according to claim 17, wherein the adhesive member is disposed between the display panel and the input sensing unit, or between the input sensing unit and the window.

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