In-vehicle camera system

Abstract

By reducing the size of the terminals that connect to the internal circuit board from the outside, the overall size of the in-vehicle camera device can be reduced, and the in-vehicle camera device can be made easier to assemble. [Solution] The rigid printed circuit board comprises a first conductive part that supplies a predetermined potential, which is a power source, and a first opening that penetrates the rigid printed circuit board. The flexible printed circuit board comprises a second opening that penetrates the flexible printed circuit board and a second conductive part located opposite the first conductive part of the rigid printed circuit board and shaped along the second opening. The housing comprises a fixing part that is inserted into the first and second openings to fix the rigid printed circuit board to the flexible printed circuit board while bringing the first conductive part into contact with the second conductive part. The fixing part is a projection extending from the housing, or a projection that fits into a third opening provided in the housing.

Description

[[TECHNICAL FIELD]]

[0001] The present invention relates to, for example, an in-vehicle camera device in which a terminal of a flexible printed circuit board (hereinafter also abbreviated as FPC) is electrically connected to an incorporated rigid printed circuit board (hereinafter also abbreviated as a substrate). [[BACKGROUND ART]]

[0002] For example, when a camera device is used in an environment with low outside temperature, providing a heater around a lens barrel may make an image captured through the lens less susceptible to the influence of outside temperature. In general, a connector is often employed as a terminal for electrically connecting the heater to a substrate on the camera device side (see, for example, Patent Document 1, Patent Document 2, and Patent Document 3). [[PRIOR ART DOCUMENTS]] [[PATENT DOCUMENTS]]

[0003] [[Patent Document 1]] Japanese Patent Laid-Open No. 5-36872 [[Patent Document 2]] US Patent Application Publication No. 2005 / 0230813 [[Patent Document 3]] US Patent Application Publication No. 2019 / 0027842 [[SUMMARY OF THE INVENTION]] [[Problem to be Solved by the Invention]]

[0004] However, with the technologies disclosed in each of the patent documents, when a connector is used as a terminal for electrically connecting the substrate on the camera device side, the structure not only becomes larger, but also there is a risk that it becomes difficult to assemble the camera device.

[0005] An object of the present invention is to appropriately downsize the in-vehicle camera device as a whole by reducing the size of an externally connected terminal with respect to an incorporated substrate. [[Means for Solving the Problem]]

[0006] The present invention relates to an in-vehicle camera device comprising: a housing that forms a space inside; a rigid printed circuit board provided within the housing and having a predetermined rigidity; and a flexible printed circuit board that supplies power from the rigid printed circuit board located inside the housing to electronic components located outside the housing, wherein the rigid printed circuit board comprises a first conductive portion that supplies a predetermined potential which is a power source, and a first opening that penetrates the rigid printed circuit board; the flexible printed circuit board comprises a second opening that penetrates the flexible printed circuit board, and a second conductive portion located opposite the first conductive portion of the rigid printed circuit board and having a shape along the second opening; the housing comprises a fixing portion that is inserted into the first and second openings to fix the rigid printed circuit board to the flexible printed circuit board and to bring the first conductive portion into contact with the second conductive portion, wherein the fixing portion is a projection extending from the housing, or a third opening provided in the housing and a projection that fits into the third opening. [Effects of the Invention]

[0007] According to the present invention, the number of terminals connected to the internal circuit board from the outside can be reduced, thereby miniaturizing the in-vehicle camera device as a whole. Other problems, configurations, and effects will be clarified by the following description of embodiments. [Brief explanation of the drawing]

[0008] [Figure 1] This is an exploded perspective view showing an example of a camera device as an example of an in-vehicle camera device according to the first embodiment. [Figure 2] Figure 1 is a partial cross-sectional view showing an example of the configuration of the camera device body with the heater attached. [Figure 3] This is a plan view showing an example of the configuration of the front case that houses the circuit board shown in Figure 2. [Figure 4]This is a plan view showing an example of the configuration of the side of an FPC facing the substrate. [Figure 5] This is a plan view showing an example of the configuration of the surface facing the front case in an FPC (Flexible Printed Circuit). [Figure 6] This is a cross-sectional view showing an example configuration in which the FPC is fixed between the front case and the substrate by a fixing part. [Figure 7] This is a plan view showing an example of the configuration of the FPC of a camera device according to the second embodiment. [Figure 8] This is a plan view showing an example of the configuration of the FPC of a camera device according to the third embodiment. [Figure 9] This is a plan view showing an example of the configuration of the side of the FPC facing the substrate in the camera device according to the fourth embodiment. [Figure 10] This is a plan view showing an example of the configuration of the surface facing the front case in the FPC of the camera device according to the fourth embodiment. [Figure 11] This is a cross-sectional view showing an example configuration in which the FPC is fixed between the front case and the circuit board by two fixing parts. [Figure 12] This is a plan view showing an example configuration in which an FPC is positioned and placed on the upper surface of the substrate. [Figure 13] This is a partial cross-sectional view showing a modified configuration in which the fixing part secures a flexible printed circuit board to the front case while sandwiching it between the substrate and the front case. [Figure 14] This is a partial cross-sectional view showing a modified configuration in which the fixing part secures a flexible printed circuit board to the front case while sandwiching it between the substrate and the front case. [Modes for carrying out the invention]

[0009] One embodiment of the present invention will be described below with reference to the drawings. (1) First Embodiment FIG. 1 is an exploded perspective view showing an exploded configuration example of camera devices 100, 100A, 100B, 100C, 100D as an example of an in-vehicle camera device according to the first embodiment. In the illustrated example, a state is shown in which a camera device main body 1, a heater 101, and a cover 102 are disassembled along an optical axis 3C of the camera device main body 1. Hereinafter, in the present embodiment, the camera device is exemplified as the in-vehicle camera device. The in-vehicle camera device is not limited to the camera device, and may be another device mounted on a vehicle.

[0010] Hereinafter, the embodiments and specific examples will be described with reference to the horizontal direction HR57 and the vertical direction VT57 described in each drawing. In the following embodiments, a surface facing upward in the vertical direction VT57 may be referred to as an upper surface, and a surface facing downward in the vertical direction VT57 may be referred to as a lower surface.

[0011] Furthermore, in the following embodiments and specific examples, the descriptions "formed" and "provided" include both cases where a member is integrally formed, and cases where the member is formed as separate bodies and then bonded or welded together. In the following embodiments and specific examples, "inner side" refers to the closed space side formed by fitting a front case 5 and a rear case 7 together. The description "outer side" refers to the open space side that is not included in the aforementioned space.

[0012] In terms of external appearance, the camera device main body 1 includes a conductive lens barrel 3, a conductive front case 5, a conductive rear case 7, and a mounting connector 9. The front case 5 is fitted together with the rear case 7 to form an internal space, and forms a substantially rectangular parallelepiped in terms of external appearance. In the present embodiment, at least one of the front case 5 and the rear case 7 is also collectively referred to as a "housing".

[0013] The camera device 100 is an example of an in-vehicle camera device. The camera device 100 includes: a housing that forms an internal space; a rigid printed circuit board (hereinafter referred to as a substrate) 4 provided in the housing and having predetermined rigidity; and a flexible printed circuit board (hereinafter also abbreviated as FPC) 112 that supplies electric power from the rigid printed circuit board 4 located inside the housings 5 and 7 to an electronic component located outside the housing, the flexible printed circuit board having flexibility, for example. The outside of the housing is outside the space formed by the housing.

[0014] Among the four corners on the upper surface of the front case 5, two corners located on a diagonal line are formed with screw holes 5X into which screws 103A are screwed, and screw holes 5Y into which screws 103B are screwed. Detailed descriptions of the lens barrel 3, the front case 5, the rear case 7, and the mounting connector 9 will be given later.

[0015] The heater 101 includes a heat generating portion 101A, a first descending portion 101B, a horizontal portion 101C, a second descending portion 101D, and the FPC 112. The heat generating portion 101A, the first descending portion 101B, the horizontal portion 101C, and the second descending portion 101D are continuously formed integrally. Two pieces of wiring are provided inside the first descending portion 101B, the horizontal portion 101C, and the second descending portion 101D. The first descending portion 101B, the horizontal portion 101C, and the second descending portion 101D may be integrated with the FPC 112.

[0016] The heat generating portion 101A has a cylindrical shape. The heat generating portion 101A is mounted so as to surround the cylindrical lens barrel portion 3Z of the lens barrel 3 from the outside. The first descending portion 101B is a member extending from the lower end of the heat generating portion 101A along the vertical direction VT57.

[0017] The horizontal portion 101C is a member extending from an end of the first descending portion 101B opposite to the end of the heat generating portion 101A along the horizontal direction HR57. The second descending portion 103D is a member extending from an end of the horizontal portion 101C opposite to the end of the first descending portion 101B along the vertical direction VT57.

[0018] The FPC112 is a flexible member that extends horizontally along HR57, for example, so as to be continuous with the first lowering section 101B. The FPC112 is electrically connected to the heating section 101A via two wires inside the first lowering section 101B, the horizontal section 101C, and the second lowering section 101D. Details of the FPC112 will be described later.

[0019] The cover 102 is an exterior component that can be attached to the camera device body 1, to which the heater 101 is mounted, so as to cover it along the optical axis 3C which is aligned with the vertical VT57. When the cover 102 is attached to the camera device body 1, it is fastened with screws 103A and 103B.

[0020] Figure 2 is a partial cross-sectional view showing an example configuration of the camera device body 1 with the heater 101 shown in Figure 1 attached. In Figure 2, the cover 102 and screws 103A and 103B are omitted from the illustration. In the illustrated example, hatching on the cross-sectional configuration may be omitted.

[0021] The camera device body 1 mainly comprises a front case 5, a rear case 7, and a conductive mounting connector 9. The camera device body 1 can be used in different orientations depending on the application, as the mounting connector 9 is attached to the target.

[0022] The lens barrel 3 is located on top of the camera device body 1 when positioned in the orientation shown in the illustration. The lens barrel 3 is, for example, formed by connecting multiple cylinders with different radii, where the radius of the upper cylinder is larger than the radius of the lower cylinder. The lens barrel 3 houses a lens 3A at its top. The convex lens surface 3B of the lens 3A is exposed on the upper surface of the lens barrel 3.

[0023] The front case 5 is formed, for example, as a hollow rectangular prism. The four corners of the top surface of the front case 5 are rounded. Screw holes 5X into which the lower cylinder of the lens barrel 3 described above can be inserted are formed in the front case 5. The lens barrel 3 described above is configured to be detachable from the front case 5 by screwing its lower cylinder into the screw holes 5X of the front case 5.

[0024] The rear case 7 is formed, for example, as a hollow rectangular prism. The four corners of the bottom surface of the rear case 7 are rounded. The rear case 7 is fitted into the front case 5 described above. By fitting the rear case 7 into the front case 5, a space is formed inside the rear case 7 and the front case 5. The periphery of the rear case 7 is the area around the end, including the end of the rear case 7. The periphery of the front case 5 is the area around the end, including the end of the front case 5.

[0025] The width of the front case 5 in the direction perpendicular to the direction parallel to the optical axis 3C of lens 3A, i.e., in the horizontal direction HR57, is formed to be approximately the same as the width of the rear case 7.

[0026] On the underside of the rear case 7, a mounting connector 9, which can be connected to a connector (not shown), is provided so as to extend in a direction parallel to the optical axis 3C of the lens 3A.

[0027] First, an overview of the configuration of the camera device body 1 according to this embodiment will be described. The camera device body 1 comprises a front case 5 and a rear case 7, which are formed of a conductive material and constitute a housing that encloses a rigid printed circuit board 4, and a lens barrel 3, which is also made of a conductive material. When the front case 5 and the rear case 7 are not distinguished, they are sometimes simply referred to as the housing. The camera device body 1 includes, for example, a lens 3A supported by the lens barrel 3. Below, a more specific example of the configuration of the camera device body 1 will be described.

[0028] When the periphery of the front case 5 is fitted into the periphery of the rear case 7, a space is formed inside the front case 5 and the rear case 7. The periphery of the front case 5 is fixed to the periphery of the rear case 7 by an adhesive applied between the periphery of the front case 5 and the periphery of the rear case 7. The adhesive also functions as a sealant to seal the closed space formed by the front case 5 and the rear case 7. The adhesive can be partially or completely cured by ultraviolet light. If an active alignment, described later, is performed before curing, the optical axis 3C of the lens 3A is positioned with the image sensor 6, described later.

[0029] The circuit board 4 is housed inside the rear case 7. On the circuit board 4, for example, an image sensor 6 is provided near the intersection of the extension of the optical axis 3C of the lens 3A of the lens barrel 3 provided in the front case 5. A hole for mounting the mounting connector 9 is provided on the lower surface of the rear case 7. The mounting connector 9 and the drive device 10 are provided on the lower surface of the circuit board 4.

[0030] Connector 8 ensures electrical conductivity between the mounting connector 9 and the circuit board 4 by mating with the mounting connector 9. The drive device 10 has an electronic circuit for driving the image sensor 6.

[0031] Figure 3 is a plan view showing an example configuration of the front case 5 that houses the substrate 4 shown in Figure 2. In the illustrated example, the rear case 7 shown in Figure 3 has been removed from the front case 5. Figure 2 shows the bottom surface of the substrate 4, that is, the surface facing downwards in the vertical direction VT57. The substrate 4 is, for example, rectangular, and its four corners are rounded. In the illustrated example, the drive device 10 is mounted on the surface of the substrate 4, but the illustration of, for example, the image sensor 6 is omitted.

[0032] One or more openings 4B are formed in the substrate 4. A first grounding portion 4C and a first conductive portion 4A, described later, may be formed around the openings 4B. For example, openings 4B are formed at two diagonal corners of the substrate 4. Multiple openings 4B can be provided depending on the second openings 12A. For example, if the isolation insulating portion 12Z, described later, branches into a first direction and a second direction, openings 4B are formed at positions corresponding to one second opening 12A located in the first direction and the other second opening 12A located in the second direction. The substrate 4 is fixed to the rear case 7, which is an example of a housing, by inserting each fixing portion 11 into one or more openings 4B.

[0033] Figures 4 and 5 are plan views showing specific configuration examples of the FPC112. Figure 4 shows an example of the configuration of the side of the FPC112 facing the substrate 4 (hereinafter also referred to as the bottom surface). Figure 5 shows an example of the configuration of the side of the FPC112 facing the front case 5 (hereinafter also referred to as the top surface). In other words, the top surface shown in Figure 5 is the side opposite to the bottom surface shown in Figure 4.

[0034] The substrate 4 includes a conductive first conductive portion 4A that supplies a predetermined potential, which is the power supply, and a first opening 4B that penetrates the substrate 4. The FPC 112 includes a second opening 12A that penetrates the FPC 112 and a second conductive portion 12B that is located opposite the first conductive portion 4A of the substrate 4 and has a shape along the second opening 12A. The housing includes a fixing portion 11 that is inserted into the first opening 4B and the second opening 12A, fixing the substrate 4 to the FPC 112 and bringing the first conductive portion 4A into contact with the conductive second conductive portion 12B. The fixing portion 11 is a projection extending from the housing. Details of the fixing portion 11 will be described later.

[0035] The FPC112 has a configuration in which a ground wire 12G and a power supply wire 12P, which ensure electrical conductivity with the heater 101, are encased in an insulator. In other words, the wire 12G is grounded to ground potential. The wire 12P is connected to the power supply. The FPC112 has an annular end 31 on the opposite side of the end connected to the heater 101.

[0036] In particular, as shown in Figure 4, the front side of the annular end 31 is provided with a circular second opening 12A, a peripheral insulating portion 12F, a second grounding portion 12D, a second conductive portion 12B, a isolating insulating portion 12C, an insulating portion 12K, and an insulating portion 12J. The second opening 12A is a circular hole formed in the center of the annular end 31. An annular peripheral insulating portion 12F is formed around the second opening 12A.

[0037] The second conductive portion 12B is semicircular in shape with a radius larger than that of the second opening 12A. The second ground portion 12D is a semicircular conductive member having the same radius as the second conductive portion 12B and sharing its center with the semicircular shape of the second conductive portion 12B.

[0038] The second grounding portion 12D is configured as an annular ring approximately halfway around the annular peripheral insulating portion 12F. The second grounding portion 12D is connected to the wiring 12G. The second conductive portion 12B is configured as an annular ring approximately halfway around the annular peripheral insulating portion 12F. The second conductive portion 12B is connected to the wiring 12P. An annular insulating portion 12J is formed around the second grounding portion 12D.

[0039] An isolation insulating portion 12C and an insulating portion 12K are formed between the ends of the ring approximately half the circumference of the second ground portion 12D and the ends of the ring approximately half the circumference of the second conductive portion 12B. More specifically, an isolation insulating portion 12C is formed between one end of the ring approximately half the circumference of the second ground portion 12D and one end of the ring approximately half the circumference of the second conductive portion 12B. An insulating portion 12K is formed between one end of the ring approximately half the circumference of the second ground portion 12D and one end of the ring approximately half the circumference of the second conductive portion 12B.

[0040] The FPC112 includes a peripheral insulating portion 12F located along the periphery of the second opening 12A. The second conductive portion 12B is located at a predetermined distance from the peripheral insulating portion 12F.

[0041] The substrate 4 further includes a conductive first grounding portion 4C that is grounded to a ground potential which is a potential relatively lower than a predetermined potential. The FPC 112 further includes a second grounding portion 12D located at a position corresponding to the first grounding portion 4C of the substrate 4. The second grounding portion 12D is located on the same plane as the second conductive portion 12B, along the second opening 12A. An isolation insulating portion 12C is located between the second grounding portion 12D and the second conductive portion 12B.

[0042] As shown in Figure 5, the back side of the annular end 31 is provided with a third grounding portion 12E and an insulating portion 12H. The third grounding portion 12E is a conductive member configured in an annular shape that extends approximately halfway around the peripheral insulating portion 12F of the annular shape. The third grounding portion 12E is connected to the wiring 12G.

[0043] The FPC112 is provided with a third grounding portion 12E on the back side of the surface where the second grounding portion 12D is located, which is grounded to the ground potential. The third grounding portion 12E is located along the second opening 12A.

[0044] Figure 6 is a cross-sectional view showing an example configuration in which the FPC 112 is fixed between the front case 5 and the substrate 4 by a fixing part 11. In Figure 6, hatching that should be shown in the cross-sectional configuration is omitted. Hereinafter, the fixing part 11 will be described as an example of a rod-shaped rivet that is fitted into a hole by being pushed in. The rivet may also be part of the housing.

[0045] The FPC112 is fixed between the front case 5 and the substrate 4 by inserting a fixing portion 11, which is inserted through the first opening 4B of the substrate 4, into the second opening 12A of the FPC112, and fixing it to the front case 5. In other words, the fixing portion 11 fixes the FPC112 by sandwiching it between the front case 5 and the substrate 4 while the first opening 4B of the substrate 4 faces the second opening 12A of the FPC112.

[0046] As shown in Figure 4, the second ground portion 12D and the second conductive portion 12B are exposed from the insulating portion 12J on the surface of the FPC 112, and as shown in Figure 5, the third ground portion 12E is exposed from the insulating portion 12J on the back surface of the FPC 112. As shown in Figure 6, the surface of the substrate 4 facing the front case 5 (hereinafter also referred to as the top surface) has a first ground portion 4C and a first conductive portion 4D around the first opening 4B. The first ground portion 4C and the first conductive portion 4A are each made of a semicircular, annular conductive metal that surrounds the first opening 4B.

[0047] The first ground portion 4C of the substrate 4 faces the second ground portion 12D of the FPC 112. The first ground portion 4C is an annular conductive member with a shape almost identical to the second ground portion 12D of the FPC 112. Because the first ground portion 4C is in contact with the second ground portion 12D, it is grounded to ground potential. On the other hand, the first conductive portion 4A of the substrate 4 faces the second conductive portion 12B of the FPC 112. The first conductive portion 4A is an annular conductive member with a shape almost identical to the second conductive portion 12B of the FPC 112. Because the first conductive portion 4A is in contact with the second conductive portion 12B, it is at a predetermined potential, which is the power supply.

[0048] On the other hand, on the surface of the substrate 4 opposite to the top surface facing the front case 5 (hereinafter also referred to as the bottom surface), a conductive annular fourth grounding portion 4Z is provided around the first opening 4B, enclosing the first opening 4B. The fourth grounding portion 4Z is provided to increase the contact area with the fixing portion 11, thereby reducing the contact resistance with the fixing portion 11.

[0049] With this configuration, the power supplied via the internal wiring 12P of the FPC112 is supplied to the substrate 4 via the second conductive part 12B and the first conductive part 4A of the FPC112. Meanwhile, the substrate 4 is grounded to ground potential via the first ground part 4C of the FPC112 through the second ground part 12D of the FPC112. The front case 5 is grounded to ground potential via the third ground part 12E of the FPC112.

[0050] As described above, the camera device 100 as an example of an in-vehicle camera device according to this embodiment includes a housing that forms a space inside, a substrate 4 provided inside the housing and having a predetermined rigidity, and an FPC 112 as an example of a flexible printed circuit board that supplies power from the substrate 4 located inside the housing to electronic components located outside the housing. The substrate 4 includes a first conductive portion 4A that supplies a predetermined potential which is a power source, and a first opening 4B that penetrates the substrate 4. The FPC 112 includes a second opening 12A that penetrates the FPC 112, and a second conductive portion 12B that is located opposite the first conductive portion 4A of the substrate 4 and has a shape along the second opening 12A. The housing includes a fixing portion 11 that is inserted into the first opening 4B and the second opening 12A and fixes the substrate 4 to the FPC 112 while bringing the first conductive portion 4A into contact with the second conductive portion 12B. The fixing portion 11 is a projection extending from the housing. Details of the fixing portion 11 will be described later.

[0051] With the above configuration, the FPC112 can reliably supply power to the board 4 without using a connector installed on the board 4. Furthermore, by making the flexible printed circuit board (e.g., FPC112) that serves as an externally connected terminal to the built-in board 4 smaller, the overall in-vehicle camera device can be miniaturized, and the in-vehicle camera device can be easily assembled.

[0052] In this embodiment, the FPC 112 includes a peripheral insulating portion 12F located along the periphery of the second opening 12A. The second conductive portion 12B is located at a predetermined distance from the peripheral insulating portion 12F. This prevents the power supply current from flowing to the fixed portion 11, which is ground, and causing a short circuit.

[0053] In this embodiment, the substrate 4 further includes a first grounding portion 4C that is grounded to a ground potential which is a potential relatively lower than a predetermined potential. The FPC 112 further includes a second grounding portion 12D located at a position corresponding to the first grounding portion 4C of the substrate 4. The second grounding portion 12D is located on the same plane as the second conductive portion 12B and along the second opening 12A. In this way, the FPC 112 is reliably connected to the ground potential on the substrate 4 via the second grounding portion 12D provided around the fixed portion 11 without the need for a connector.

[0054] In this embodiment, the FPC112 is provided with a third grounding portion 12E on the back side of the surface where the second grounding portion 12D is located, which is grounded to ground potential. The third grounding portion 12E is located along the second opening 12A. This increases the number of paths for static electricity that has flowed through at least one of the front case 5 and the rear case 7, which are examples of housings, to escape to the outside of the housing.

[0055] In this embodiment, the second conductive portion 12B is semicircular in shape with a radius larger than the radius of the second opening 12A. The second ground portion 12D is semicircular in shape with the same radius as the second conductive portion 12B and shares its center with the semicircular shape of the second conductive portion 12B. In this way, by simply passing the fixing portion 11 of the housing through the first opening 4B of the substrate 4 and the second opening 12A of the FPC 112, the second conductive portion 12B and the first conductive portion 4A, and the second ground portion 12D and the first ground portion 4C become electrically conductive separately, thus simplifying the positioning of the FPC 112.

[0056] In this embodiment, the FPC112 includes an isolation insulating portion 12C located between the second ground portion 12D and the second conductive portion 12B. This prevents, for example, a short circuit between the second ground portion 12D and the second conductive portion 12B.

[0057] (2) Second Embodiment The camera device as an example of an in-vehicle camera device according to the second embodiment has a configuration that is substantially the same as the camera device 100 according to the first embodiment, so the description of the similar configuration will be omitted. Hereinafter, the second embodiment will mainly describe the parts that differ from the first embodiment. In the second embodiment, the configuration of the FPC 112 is mainly different from that of the first embodiment, and the surrounding configurations that correspond to the difference in the configuration of the FPC 112 are also different.

[0058] Figure 7 is a plan view showing an example configuration of the FPC112A of the camera device according to the second embodiment. Figure 7 corresponds to Figures 4 and 5 in the first embodiment. The FPC112A shown in Figure 7 is formed in a single layer such that the ground wiring 12G and the power wiring 12P are on the same layer. Hereinafter, FPC112A will also be referred to as "single-layer FPC112A".

[0059] In the second embodiment, unlike the first embodiment, the single-layer FPC 112A has a second ground portion 12D1 corresponding to the second ground portion 12D in the first embodiment and a second conductive portion 12B1 corresponding to the second conductive portion 12B in the first embodiment, both formed on the same surface of the single-layer FPC 112A. In the illustrated example, the same surface of the single-layer FPC 112 is the top surface. That is, in the second embodiment, the second ground portion 12D1 exposed on the top surface of the single-layer FPC 112A is connected to the wiring 12G, and the second conductive portion 12B1 exposed on the top surface of the single-layer FPC 112A is connected to the wiring 12P.

[0060] In this embodiment, as described above, the second conductive portion 12B1 is a circle with a radius larger than the radius of the second opening 12A. The second ground portion 12D1 is a circle with a radius larger than the radius of the second conductive portion 12B1. In this way, by simply passing the fixing portion 11 of the housing through the first opening 4B of the substrate 4 and the second opening 12A of the FPC 112, the second conductive portion 12B and the first conductive portion 4A, and the second ground portion 12D and the first ground portion 4C become electrically conductive separately, so the angle of the FPC 112 is not restricted.

[0061] The second ground portion 12D1 has an annular peripheral insulating portion 12F formed to surround a cylindrical second opening 12A formed along the thickness direction of the single-layer FPC 112A. A similarly annular second conductive portion 12B1 is formed to surround the outer circumference of the peripheral insulating portion 12F. A similarly annular isolating insulating portion 12L is formed to surround the outer circumference of the second conductive portion 12B1. A partially missing annular second ground portion 12D1 is formed to surround the outer circumference of the isolating insulating portion 12L. One end of the partially missing portion of the second ground portion 12D1 is connected to the wiring 12G. A similarly annular insulating portion 12J is formed to surround the outer circumference of the second ground portion 12D1.

[0062] According to this embodiment, since the second conductive portion 12B1 is surrounded by the second ground portion 12D1 or second ground portion 12D1 which is grounded to the ground potential, the second conductive portion 12B1 becomes less susceptible to noise, for example.

[0063] (3) Third Embodiment Camera device 100B, as an example of an in-vehicle camera device according to the third embodiment, has substantially the same configuration as camera device 100 according to the first embodiment and camera device 100A according to the second embodiment, respectively, so the description of the similar configuration will be omitted. Hereinafter, the third embodiment will mainly describe the parts that differ from the first and second embodiments. In the third embodiment, the main difference from the first embodiment is the configuration of the FPC 112, and consequently, the surrounding configurations that correspond to the difference in the configuration of the FPC 112 are also different.

[0064] Figure 8 is a plan view showing an example of the configuration of the FPC112B of the camera device 100B according to the third embodiment. Figure 8 corresponds to Figures 4 and 5 in the first embodiment. The FPC112B shown in Figure 8 is formed in multiple layers such that the ground wiring 12G and the power wiring 12P are on separate layers. Hereinafter, the FPC112B will also be referred to as the "multilayer FPC112B".

[0065] In the third embodiment, unlike the first embodiment, the multilayer FPC 112B has a second ground portion 12D2 corresponding to the second ground portion 12D in the first embodiment and a second conductive portion 12B1 corresponding to the second conductive portion 12B in the first embodiment, both formed on the same surface of the multilayer FPC 112B. In the illustrated example, the same surface of the multilayer FPC 112B is the top surface. That is, in the second embodiment, the second ground portion 12D2 exposed on the top surface of the multilayer FPC 112B is connected to the wiring 12G, and the second conductive portion 12B1 exposed on the top surface of the multilayer FPC 112B is connected to the wiring 12P.

[0066] The second ground portion 12D1 has an annular peripheral insulating portion 12F formed to surround a cylindrical second opening 12A formed along the thickness direction of the multilayer FPC 112B. A similar annular second conductive portion 12B1 is formed to surround the outer circumference of the peripheral insulating portion 12F. The second conductive portion 12B1 is connected to the wiring 12P at one end, although not shown. A similar annular isolation insulating portion 12L is formed to surround the outer circumference of the second conductive portion 12B1. A similar annular second ground portion 12D2 is formed to surround the outer circumference of the isolation insulating portion 12L. The second ground portion 12D2 is connected to the wiring 12G at one end, although not shown. A similar annular insulating portion 12J is formed to surround the outer circumference of the second ground portion 12D2.

[0067] According to this embodiment, the second conductive portion 12B1 is surrounded by the second ground portion 12D1 or the second ground portion 12D2 which is grounded to the ground potential, so for example, the second conductive portion 12B1 becomes less susceptible to noise.

[0068] (4) Fourth Embodiment Camera device 100C, as an example of an in-vehicle camera device according to the fourth embodiment, has a configuration that is almost the same as camera devices 100, 100A, and 100B according to the first to third embodiments, respectively, so the description of the similar configuration will be omitted. In the fourth embodiment, the main difference from the first to third embodiments will be described below. In the fourth embodiment, the configuration of the FPC 112 is different from that of the first embodiment, and consequently, the surrounding configurations are also different.

[0069] Figures 9 and 10 are plan views showing example configurations of the FPC112C of the camera device 100C according to the fourth embodiment, respectively. Figures 9 and 10 correspond to Figures 4 and 5 in the first embodiment, respectively. The FPC112C is formed such that one annular end 31A, which is continuous with the ground wiring 12G, and the other annular end 31B, which is continuous with the power wiring 12P, are bifurcated. As shown in Figures 9 and 10, the ground is sometimes referred to as GND and the power supply as Power. Figure 9 shows an example configuration of the lower surface of the FPC112C facing the substrate 4. Figure 10 shows an example configuration of the upper surface of the FPC112C facing the front case 5. That is, the upper surface shown in Figure 10 is the surface opposite to the lower surface shown in Figure 9.

[0070] In this embodiment, the first grounding portion 4C1, the second grounding portion 12D1, the third grounding portion 12E1, the first conductive portion 4A1, and the second conductive portion 12B1, although having different structures, have substantially the same functions as the first grounding portion 4C, the second grounding portion 12D, the third grounding portion 12E, the first conductive portion 4A, and the second conductive portion 12B in the first to third embodiments described above.

[0071] The FPC112C has a configuration in which a ground wire 12G and a power supply wire 12P, which ensure electrical conductivity with the heater 101, are encased in an insulator. In other words, wire 12G is grounded to ground potential. Wire 12P is connected to the power supply. The FPC112C has annular ends 31A and 31B on the opposite side of the end connected to the heater 101.

[0072] In the FPC112C, the isolation and insulation portion 12Z branches, for example, in a first direction and in a second direction that forms a predetermined angle with the first direction. The second conductive portion 12B1 is located in the first direction from which the isolation and insulation portion 12Z branches. The second ground portion 12D1 is located in the second direction from which the isolation and insulation portion 12Z branches.

[0073] As shown in Figure 9, the front side of the annular end 31A is provided with a circular second opening 12A, a peripheral insulating portion 12F, a second grounding portion 12D1, and an insulating portion 12J. The second opening 12A is a circular hole formed in the center of the annular end 31A. The annular peripheral insulating portion 12F is formed around the second opening 12A.

[0074] The second grounding portion 12D1 is configured in an annular shape along the periphery of the annular peripheral insulating portion 12F. The second grounding portion 12D1 is connected to the wiring 12G. An annular insulating portion 12J is formed around the second grounding portion 12D1.

[0075] The annular end portion 31B comprises a circular second opening 12A, a peripheral insulating portion 12F, a second conductive portion 12B1, and an insulating portion 12J. The second opening 12A is a circular hole formed in the center of the annular end portion 31A. An annular peripheral insulating portion 12F is formed around the second opening 12A. The second conductive portion 12B1 is formed to surround the peripheral insulating portion 12F.

[0076] The second conductive portion 12B1 is configured in an annular shape along the periphery insulating portion 12F. The second conductive portion 12B1 is connected to the wiring 12P. An annular insulating portion 12J is formed around the second ground portion 12D1.

[0077] As shown in Figure 10, the back side of the annular end 31A is provided with a circular second opening 12A, a peripheral insulating portion 12F, a third grounding portion 12E1, and an insulating portion 12J. The second opening 12A is a circular hole formed in the center of the annular end 31A. An annular peripheral insulating portion 12F is formed around the second opening 12A.

[0078] The third grounding portion 12E1 is configured in an annular shape along the periphery of the annular peripheral insulating portion 12F. The third grounding portion 12E1 is connected to the wiring 12G. An annular insulating portion 12J is formed around the third grounding portion 12E1.

[0079] The annular end portion 31B is covered by the insulating portion 12H and the isolation insulating portion 12Z, and neither grounding portion is exposed.

[0080] Figure 11 is a cross-sectional view showing an example configuration in which the FPC112C is fixed between the front case 5 and the substrate 4 by two fixing parts 11A and 11B. In Figure 11, hatching that should be shown in the cross-sectional configuration is omitted. The following explanation will also refer to Figures 9 and 10. The fixing parts 11A and 11B have substantially the same function as the fixing part 11 in the first to third embodiments described above.

[0081] The FPC112C is fixed between the front case 5 and the substrate 4 by inserting a fixing portion 11, which is inserted through the first opening 4B of the substrate 4, into the second opening 12A of the FPC112C and fixing it to the front case 5. In other words, the fixing portions 11A and 11B fix the FPC112C by facing the first opening 4B of the substrate 4 so that it aligns with the second opening 12A of the FPC112C, and sandwiching the FPC112C between the front case 5 and the substrate 4.

[0082] As shown in Figure 9, on the surface of the FPC112C, the second ground portion 12D1 is exposed from the insulating portion 12J at the annular end 31A, and the second conductive portion 12B1 is exposed from the insulating portion 12J at the annular end 31B. As shown in Figure 10, on the back surface of the FPC112C, the third ground portion 12E1 is exposed from the insulating portion 12J at the annular end 31A, but no conductive portion is exposed from the insulating portion 12J at the annular end 31B. In the example shown in Figure 11, the annular end 31A and the annular end 31B are shown to be close together, but in reality, for example, the annular end 31A and the annular end 31B are positioned at physically separated locations.

[0083] As shown in Figure 11, on the upper surface of the substrate 4 facing the front case 5, a first ground portion 4C1 and a first conductive portion 4A1 are provided around each first opening 4B. The first ground portion 4C1 and the first conductive portion 4A1 are each made of a semicircular, annular conductive metal that surrounds the first opening 4B.

[0084] The first ground portion 4C1 of the substrate 4 faces the second ground portion 12D1 of the FPC112C. The first ground portion 4C1 is an annular conductive member with a shape almost identical to the second ground portion 12D1 of the FPC112C. Since the first ground portion 4C1 is in contact with the second ground portion 12D1, it is grounded to ground potential. On the other hand, the first conductive portion 4A1 of the substrate 4 faces the second conductive portion 12B1 of the FPC112C. The first conductive portion 4A1 is an annular conductive member with a shape almost identical to the second conductive portion 12B1 of the FPC112C. Since the first conductive portion 4A1 is in contact with the second conductive portion 12B1, it is at a predetermined potential, which is the power supply.

[0085] On the other hand, on the lower surface of the substrate 4 opposite to the upper surface facing the front case 5, a fourth grounding portion 4Z1 of an annular conductive member is provided around the first opening 4B, so as to surround the first opening 4B. The fourth grounding portion 4Z1 is provided to increase the contact area with the fixed portion 11A, and can reduce the contact resistance with the fixed portion 11A.

[0086] With this configuration, the power supplied via the internal wiring 12P of the FPC112C is supplied to the substrate 4 via the second conductive part 12B1 and the first conductive part 4A1 of the FPC112C. Meanwhile, the substrate 4 is grounded to ground potential via the first ground part 4C1 of the FPC112C through the second ground part 12D1. The front case 5 is grounded to ground potential via the third ground part 12E1 of the FPC112C.

[0087] In this embodiment, the isolation insulating portion 12Z branches into a first direction and a second direction. The second conductive portion 12B is located in the first direction from which the isolation insulating portion 12Z branches. The second ground portion 12D is located in the second direction from which the isolation insulating portion 12Z branches. In this configuration, by passing the fixing portion 11 of the housing through the first opening 4B of the substrate 4 and the second opening 12A of the FPC 112, the second conductive portion 12B and the first conductive portion 4A, and the second ground portion 12D and the first ground portion 4C become electrically connected at a distance, thus reducing the possibility of a short circuit.

[0088] (5) Fifth embodiment Camera device 100D, as an example of an in-vehicle camera device according to the fifth embodiment, has a configuration that is almost the same as camera devices 100, 100A, 100B, and 100C according to the first to fourth embodiments, so the description of the similar configuration will be omitted. In the fourth embodiment, the differences from the first to fourth embodiments will be mainly described. The fifth embodiment differs from the first to fourth embodiments in that one of the positioning mechanisms FPC112, FPC112A, FPC112B, or FPC112C is provided. In the fifth embodiment, the positioning mechanism of FPC112 in the first embodiment shown in Figure 4 will be illustrated below.

[0089] Figure 12 is a plan view showing an example configuration in which the FPC 112 is positioned and placed on the upper surface of the substrate 4. In the illustrated example, the configuration of the upper surface of the substrate 4 is partially omitted.

[0090] In this embodiment, a plurality of positioning parts 6A, 6B are provided on the surface facing at least one of the front case 5 and rear case 7, which are examples of housings on the substrate 4, for suppressing rotation of the FPC 112 around the second opening 12A and fixing the position of the FPC 112. For example, in this embodiment, the surface facing at least one of the front case 5 and rear case 7, which are examples of housings, is the surface facing the front case 5. This makes it easy to position the FPC 112 when assembling the camera device 100, etc.

[0091] In other words, in this embodiment, positioning parts 6A and 6B that regulate the position of the FPC 112 in the longitudinal direction may be mounted on the surface of the substrate 4. The distance between the positioning parts 6A and 6B is, for example, the same width W as the width direction of the FPC 112. Furthermore, the positioning parts 6A and 6B may have a shape that extends along the longitudinal direction of the FPC 112. For example, the positioning parts 6A and 6B may be convex-shaped components provided on the surface of the substrate 4, or they may be clips or pogo pins. It is desirable that the height of the positioning parts 6A and 6B be equal to or less than the thickness of the FPC 112. This makes it possible to miniaturize the housing compared to providing a connector in the thickness direction of the substrate 4.

[0092] Multiple positioning portions 6A and 6B are formed on the upper surface of the substrate 4, spaced slightly wider than the width W of the FPC 112. The positioning portions 6A and 6B are protruding members provided on the upper surface of the substrate 4. The FPC 112 is easily positioned along the width W direction by the positioning portions 6A and 6B. Alternatively, the positioning portions 6A and 6B may be replaced with electronic components provided on the upper surface of the substrate 4. In this case, it becomes unnecessary to intentionally provide protruding members.

[0093] (6) Modified example of the fixed part Figure 13 is a partial cross-sectional view showing a modified configuration in which, instead of fixing parts 11A and 11B, fixing part 11X fixes to the front case 5 while sandwiching the FPC 112, etc., between the substrate 4 and the front case 5. Fixing part 11 is the name used when fixing parts 11A, 11B, 11X, and 11Y are not distinguished.

[0094] The fixing portion 11X may be a third opening provided in the housing and a projection that fits into the third opening. Instead of the rivet exemplified in the above embodiment, the fixing portion 11X may be, for example, a nut 11X1 and a bolt 11X2, as shown in the figure. For example, if the fixing portion 11X is composed of a nut 11X1 and a bolt 11X2, the bolt 11X2, which stands up from the third opening 5A, which is a hole formed in the front case 5, passes through the first opening 4B of the FPC 112C, and the nut 11X1 is attached to the tip of the bolt 11X2. The bolt 11X2 is, for example, a rod-shaped member with a helical groove carved into its side circumference. The nut 11X1 is, for example, a cylindrical member with a helical groove carved into its inner circumference. The helical groove formed on the inner circumference of the nut 11X1 engages with the helical groove formed on the side circumference of the bolt 11X2. The nut 11X1 is attached to one end of the bolt 11X2 by screwing it in while fitting it into the bolt 11X2 so that the two helical grooves interlock.

[0095] The fixing portion 11X has a third opening 5A formed in the housing and a bolt 11X2 as an example of a projection that fits into the third opening 5A. With this configuration, the fixing portion 11X can reliably fix the FPC 112 and the like between the substrate 4 and the front case 5, and can also achieve the same effects as the embodiments described above.

[0096] Figure 14 is a partial cross-sectional view showing a modified configuration in which the fixing part 11Y is fixed to the front case 5 while sandwiching an FPC 112 or the like between the substrate 4 and the front case 5. Instead of fixing parts 11A and 11B, the fixing part 11Y is fixed to the front case 5 while sandwiching an FPC 112 or the like between the substrate 4 and the front case 5.

[0097] The fixing portion 11Y has a third opening 5A provided in the housing and a screw, which is an example of a projection that fits into the third opening 5A. The screw is, for example, a rod-shaped member, and is a so-called screw with a helical groove provided on the side surface of the rod-shaped member. With the above configuration, the fixing portion 11Y can reliably fix the FPC 112 and the like between the substrate 4 and the front case 5, and can also exhibit the same effects as the embodiments described above.

[0098] The present invention is not limited to the embodiments described above, but includes various modifications and equivalent configurations within the spirit of the appended claims. For example, the embodiments described above are described in detail for the purpose of clearly illustrating the present invention, and the present invention is not necessarily limited to having all the configurations described. Furthermore, each element described in parallel in this embodiment may be configured such that at least one of the elements is connected in series with respect to the other elements.

[0099] Furthermore, the present invention is applicable to more than just the heater 101. For example, the present invention is broadly applicable to electronic components located outside the front case 5 and rear case 7 and electrically connected to the substrate 4 via the FPC 112, within a device comprising a front case 5, a rear case 7, a substrate 4, and an FPC 112. [Explanation of symbols]

[0100] 1: Camera device body, 3: Lens barrel, 4: Circuit board, 4A: First conductive part, 4B: First opening, 4C: First grounding part, 5: Front case, 5A: Third opening, 6A, 6B: Positioning part, 7: Rear case, 11, 11A, 11B, 11X, 11Y: Fixing part, 11X2: Bolt, 12A: Second opening, 12B, 12B1: Second conductive part, 12C: Peripheral insulating part, 12D, 12D1, 12D2: Second grounding part, 12E: Third grounding part, 12L, 12Z: Isolation insulating part, 100: Camera device, 112~112C: FPC

Claims

1. An in-vehicle camera device comprising: a housing that forms a space inside; a rigid printed circuit board provided within the housing and having a predetermined rigidity; and a flexible printed circuit board that supplies power from the rigid printed circuit board located inside the housing to electronic components located outside the housing, The rigid printed circuit board is A first conductive part that supplies a predetermined potential, which is the power source, The rigid printed circuit board comprises a first opening that penetrates the rigid printed circuit board, The aforementioned flexible printed circuit board is A second opening that penetrates the aforementioned flexible printed circuit board, The rigid printed circuit board comprises a second conductive portion located opposite the first conductive portion and having a shape along the second opening, The aforementioned housing is The device includes a fixing portion that is inserted into the first and second openings to fix the rigid printed circuit board to the flexible printed circuit board while bringing the first conductive portion into contact with the second conductive portion, The fixing portion is a projection extending from the housing, or a third opening provided in the housing and a projection that fits into the third opening. An in-vehicle camera device characterized by the following features.

2. The aforementioned flexible printed circuit board is The second opening is provided with a peripheral insulating portion located along its periphery, The second conductive portion is located at a predetermined distance from the peripheral insulating portion. The in-vehicle camera device according to claim 1.

3. The rigid printed circuit board is The system further includes a first grounding section that grounds to a ground potential that is relatively lower than the predetermined potential, The aforementioned flexible printed circuit board is The rigid printed circuit board further comprises a second grounding portion located at a position corresponding to the first grounding portion, The second ground portion is located on the same plane as the second conductive portion, along the second opening. The in-vehicle camera device according to claim 1.

4. The aforementioned flexible printed circuit board is On the back side of the surface where the second grounding portion is located, a third grounding portion is provided that is grounded to the ground potential. The third grounding portion is located along the second opening. The in-vehicle camera device according to feature 3.

5. The second conductive portion is circular in shape and has a radius larger than the radius of the second opening. The second grounding portion is circular in shape, with a radius larger than the radius of the second conductive portion. The in-vehicle camera device according to feature 3.

6. The second conductive portion is semicircular in shape with a radius larger than the radius of the second opening. The second grounding portion has the same radius as the second conductive portion and is a semicircular shape that shares its center with the semicircular shape of the second conductive portion. The in-vehicle camera device according to feature 3.

7. The flexible printed circuit board includes an isolation insulating portion located between the second ground portion and the second conductive portion. The in-vehicle camera device according to feature 3.

8. The aforementioned isolation and insulating portion branches in a first direction and a second direction, The second conductive portion is located in the first direction from which the isolation insulating portion branches, The second grounding portion is located in the second direction from which the isolation insulating portion branches. The in-vehicle camera device according to feature 7.

9. On the surface of the rigid printed circuit board facing the housing, Multiple positioning parts are provided to suppress rotation of the flexible printed circuit board about the second opening as an axis and fix the position of the flexible printed circuit board. The in-vehicle camera device according to claim 1.

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