PCB production planning apparatus, PCB production planning method, and PCB production planning program

Abstract

The present invention provides a circuit board production planning device capable of generating a circuit board production plan that can manage intermediate inventory circuit boards that are currently undergoing assembly work. [Solution] This control device (substrate production planning device 300) includes a control unit 301 that generates a substrate production plan for sequentially producing multiple types of substrates P in a component mounting device 200b that mounts components E onto substrates P to produce substrates P. The control unit 301 sets at least one of the maximum quantity of intermediate stock substrates in which mounting work is underway in the component mounting device 200b and the maximum stock time for intermediate stock substrates, and in the substrate production plan, it determines whether or not at least one of the maximum quantity of intermediate stock substrates and the maximum stock time for intermediate stock substrates will be reached.

Description

Technical Field

[0001] The present invention relates to a substrate production planning apparatus, a substrate production planning method, and a substrate production planning program, and particularly relates to a substrate production planning apparatus, a substrate production planning method, and a substrate production planning program that generate a substrate production plan for sequentially producing a plurality of types of substrates in sequence. Background Art

[0002] Conventionally, substrate production planning apparatuses that generate a substrate production plan for sequentially producing a plurality of types of substrates are known (see, for example, Patent Document 1, for example).

[0003] The above Patent Document 1 discloses a production planning display apparatus (substrate production planning apparatus) that generates a substrate production plan for sequentially producing a plurality of types of substrates by mounting components on both the front surface and the back surface of substrates. This production planning display apparatus is configured such that, when a change to the substrate production plan is required, to display the substrate production plan on a display unit by highlighting the production plan of the corresponding portion so that mounting work on the front surface and the back surface of the substrate do not overlap with each other. Prior Art Literature Patent Literature

[0004] Patent Document 1 Japanese Unexamined Patent Publication No. 2022-034623 Summary of the Invention Problem to be Solved by the Invention

[0005] In the case where components are mounted on both the front and back surfaces of a substrate to sequentially produce multiple types of substrates, the mounting work is performed on one of the substrate surfaces first, followed by the mounting work on the other surface. As a result, a substrate after the mounting work has been performed on one of its surfaces becomes an intermediate inventory substrate with the mounting work in progress. The production plan display device (substrate production planning device) described in Patent Document 1 above can generate a substrate production plan that allows for the mounting work to be performed on one of the substrate surfaces first, followed by the mounting work on the other surface. However, it is difficult to manage the intermediate inventory substrates that arise during this process. Therefore, there is a need to be able to generate a substrate production plan that allows for the management of intermediate inventory substrates with the mounting work in progress.

[0006] This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a substrate production planning apparatus, a substrate production planning method, and a substrate production planning program that can generate a substrate production plan capable of managing intermediate inventory substrates that are currently undergoing assembly work. [Means for solving the problem]

[0007] A substrate production planning apparatus according to the first aspect of this invention is a component mounting apparatus that produces substrates by mounting components onto substrates, and comprises a control unit that generates a substrate production plan for sequentially producing multiple types of substrates, wherein the control unit determines in the substrate production plan whether or not the maximum quantity of intermediate stock substrates in which mounting work is underway in the component mounting apparatus and the maximum stock time of the intermediate stock substrates have been reached.

[0008] In the first aspect of this invention, the substrate production planning apparatus, as described above, the control unit determines in the substrate production plan whether at least one of the following is reached: the maximum quantity of intermediate stock substrates in which mounting work is underway in the component mounting apparatus, or the maximum inventory time of the intermediate stock substrates. By determining in the substrate production plan whether at least one of the following is reached: the maximum quantity of intermediate stock substrates or the maximum inventory time of the intermediate stock substrates, the intermediate stock substrates can be managed so that the number of intermediate stock substrates does not reach the maximum quantity, or the inventory time of the intermediate stock substrates does not reach the maximum inventory time. As a result, a substrate production plan can be generated that allows for the management of intermediate stock substrates in which mounting work is underway. This prevents the number of intermediate stock substrates from becoming excessively large, thus eliminating the need to secure a large area for storage space to store the intermediate stock substrates. Furthermore, it is possible to prevent the inventory time of intermediate stock substrates from becoming excessively long.

[0009] In the substrate production planning apparatus according to the first aspect described above, preferably, if the control unit determines that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates will be reached in the substrate production plan, it modifies and generates the substrate production plan so that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates will not be reached. With this configuration, the control unit can generate a substrate production plan that allows for more appropriate management of intermediate stock substrates.

[0010] In this case, preferably, if the control unit determines in the substrate production plan that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates has been reached, it performs at least one of the following actions in the substrate production plan: changing the production order, dividing the production volume, and changing the mounting line. With this configuration, the substrate production plan can be easily modified so that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates is not reached by changing the production order, dividing the production volume, and changing the mounting line.

[0011] In the substrate production planning apparatus according to the first phase described above, preferably, the control unit extracts multiple candidate types of substrates to be produced in the substrate production plan based on constraints including the substrate production order, and from the multiple extracted candidate types of substrates, it sequentially determines the types of substrates from the beginning or end based on a priority including delivery date and maximum inventory time for intermediate inventory substrates, thereby generating a substrate production plan. With this configuration, it is possible to generate a substrate production plan that prioritizes substrates with earlier delivery dates and substrates with closer maximum inventory time for intermediate inventory substrates from among the multiple candidate types of substrates, and performs the mounting work in an earlier order.

[0012] In the substrate production planning apparatus according to the first phase described above, preferably, the control unit calculates the quantity of intermediate stock substrates by adding the quantity of intermediate stock substrates corresponding to the production start time of new types of substrates. With this configuration, the quantity of intermediate stock substrates can be easily managed.

[0013] In the substrate production planning apparatus according to the first phase described above, preferably, the control unit reduces the quantity of intermediate stock substrates in accordance with the time to start mounting work on the intermediate stock substrates, and calculates the quantity of intermediate stock substrates. With this configuration, the quantity of intermediate stock substrates can be easily managed.

[0014] A second aspect of this invention relates to a substrate production planning method for a component mounting apparatus that produces substrates by mounting components onto substrates, and is a substrate production planning method for sequentially producing multiple types of substrates, comprising the step of determining whether the substrate production plan will reach at least one of the maximum quantity of intermediate stock substrates in which mounting work is underway in the component mounting apparatus and the maximum stock time of the intermediate stock substrates.

[0015] In the second aspect of the present invention, the substrate production planning method determines, as described above, whether at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates is reached in the substrate production plan. By determining whether at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time is reached in the substrate production plan, intermediate stock substrates can be managed so that the number of intermediate stock substrates does not reach the maximum quantity, or the inventory time for intermediate stock substrates does not reach the maximum inventory time. As a result, a substrate production plan can be generated that allows for the management of intermediate stock substrates that are currently undergoing assembly work. This prevents an excessive amount of intermediate stock substrates from being stored, thus eliminating the need to secure a large area for storage space for intermediate stock substrates. Furthermore, it prevents the inventory time for intermediate stock substrates from becoming excessively long.

[0016] A third aspect of this invention is a substrate production planning program for a component mounting apparatus that produces substrates by mounting components onto substrates, and for which a computer executes a substrate production planning method for sequentially producing a substrate production plan for a plurality of types of substrates, wherein the substrate production planning method includes a step of determining whether or not the maximum quantity of intermediate stock substrates in which mounting work is underway in the component mounting apparatus and the maximum stock time of the intermediate stock substrates have been reached.

[0017] In the third aspect of this invention, the substrate production planning program determines whether at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates is reached in the substrate production plan, as described above. By determining whether at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates is reached in the substrate production plan, it is possible to manage intermediate stock substrates so that the number of intermediate stock substrates does not reach the maximum quantity, or the inventory time for intermediate stock substrates does not reach the maximum inventory time. As a result, it is possible to generate a substrate production plan that is capable of managing intermediate stock substrates that are currently undergoing assembly work. This prevents the amount of intermediate stock substrates from becoming excessively large, so there is no need to secure a large area for storage space to store intermediate stock substrates. It also prevents the inventory time for intermediate stock substrates from becoming excessively long. [Effects of the Invention]

[0018] According to the present invention, as described above, it is possible to generate a substrate production plan that enables the management of intermediate inventory substrates that are currently undergoing assembly work. [Brief explanation of the drawing]

[0019] [Figure 1] This is a schematic diagram showing a component mounting system according to one embodiment. [Figure 2] This is a schematic plan view showing a component mounting device according to one embodiment. [Figure 3] This is a block diagram showing a substrate production planning apparatus according to one embodiment. [Figure 4] This figure illustrates how to determine whether the intermediate inventory of substrates in a substrate production plan reaches the maximum quantity according to one embodiment. [Figure 5] This figure illustrates the generation of a substrate production plan in which the intermediate inventory of substrates does not reach the maximum quantity, according to one embodiment. [Figure 6] This figure illustrates a first example of increasing or decreasing the number of intermediate stock substrates according to one embodiment. [Figure 7]FIG. 12 is a diagram for explaining a second example of increase / decrease in the number of intermediate inventory boards according to an embodiment. [Figure 8] FIG. 13 is a diagram for explaining the determination of whether an intermediate inventory board in a board production plan according to an embodiment reaches the maximum inventory time. [Figure 9] FIG. 14 is a diagram for explaining generation of a board production plan that prevents an intermediate inventory board from reaching the maximum inventory time according to an embodiment. [Figure 10] FIG. 15 is a flowchart for explaining a first example of board production plan processing according to an embodiment. [Figure 11] FIG. 16 is a flowchart for explaining a second example of board production plan processing according to an embodiment. MODE FOR CARRYING OUT THE INVENTION

[0020] Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

[0021] With reference to FIG. 1, the configuration of a component mounting system 100 according to an embodiment will be described.

[0022] (Configuration of Component Mounting System) The component mounting system 100 is a system that mounts components (electronic components) E such as ICs, transistors, capacitors, and resistors onto a board P such as a printed circuit board, and produces the board P on which the components E are mounted.

[0023] As shown in FIG. 1, the component mounting system 100 includes a plurality of mounting lines 200 for producing boards P, and a control device 300 that manages the production of boards P by the plurality of mounting lines 200 and generates a board production plan for the plurality of mounting lines 200. The control device 300 is an example of the "board production planning device" recited in the claims.

[0024] The assembly line 200 includes a printing device 200a, a component mounting device 200b, a pre-reflow inspection device 200c, a reflow oven 200d, and a post-reflow inspection device 200e. Note that the equipment configuration of the assembly line 200 is an example and is not limited to the configuration shown in Figure 1.

[0025] In the assembly line 200, the printing device 200a, the component mounting device 200b, the pre-reflow inspection device 200c, the reflow oven 200d, and the post-reflow inspection device 200e are arranged in this order from upstream to downstream. A transfer conveyor (not shown) is also placed between each device to transport and transfer the substrate P between them. The transfer conveyor transports the substrate P in the substrate transport direction (X direction) and transfers it from the upstream device to the downstream device. Each device in the assembly line 200 performs its respective operation on the substrate P at a cycle time (CT) set for each type of substrate P, and after the operation, transfers the substrate P to the downstream device.

[0026] The printing device 200a performs a printing operation as part of the production of the substrate P, where it screen prints bonding materials such as solder onto the substrate P. The component mounting device 200b performs a mounting operation as part of the production of the substrate P, where it mounts components E onto the substrate P that has been printed by the printing device 200a. The pre-reflow inspection device 200c performs an inspection operation as part of the inspection of the substrate P, where it inspects the substrate P after the component mounting operation by the component mounting device 200b. The reflow oven 200d performs a reflow operation as part of the production of the substrate P, where it melts and solidifies the bonding material printed on the substrate P, thereby bonding the components E to the substrate P that has been inspected by the pre-reflow inspection device 200c. The post-reflow inspection device 200e performs an inspection operation as part of the inspection of the substrate P, where it inspects the substrate P after the reflow operation by the reflow oven 200d.

[0027] (Configuration of component mounting equipment) Next, the configuration of the component mounting device 200b will be described with reference to Figure 2. In the following description, the direction along the substrate transport direction will be referred to as the X direction, the direction perpendicular to the X direction in the horizontal plane will be referred to as the Y direction, and the vertical direction perpendicular to both the X and Y directions will be referred to as the Z direction.

[0028] As shown in Figure 2, the component mounting device 200b comprises a base 201, a transport unit 202, a head unit 203, a head horizontal movement mechanism unit 204, a component imaging unit 205, a substrate imaging unit 206, a control unit 207, and a communication unit 208.

[0029] The base 201 is the base on which each component is placed in the component mounting device 200b. A transport unit 202, a rail unit 242, and a component imaging unit 205 are provided on the base 201. A control unit 207 is also provided inside the base 201. The base 201 is also provided with multiple (four) setting units 211 for setting a trolley 220 on which multiple component supply units 210 that supply components E are placed. Specifically, the base 201 has two setting units 211 on each side in the Y direction (Y1 direction side and Y2 direction side).

[0030] The component supply unit 210 is a device that supplies components E to be mounted on the circuit board P. Specifically, the component supply unit 210 is composed of a tape feeder that supplies components E by feeding a component supply tape (not shown) containing the components E. The component supply unit 210 is configured to intermittently feed the component supply tape in response to the component holding operation by the head unit 203. Furthermore, the component supply unit 210 is configured to be set in the setting unit 211 when multiple units are arranged in a row on the trolley 220.

[0031] The transport unit 202 is configured to receive the substrate P before mounting, transport it in the substrate transport direction (X direction), and unload the substrate P after mounting. The transport unit 202 is also configured to transport the received substrate P to the substrate fixing position Pa and to fix it at the substrate fixing position Pa by a substrate fixing mechanism (not shown). The transport unit 202 also includes a pair of transport belts 221. The transport unit 202 is configured to transport the substrate P in the substrate transport direction with the pair of transport belts 221 supporting both ends of the substrate P in the width direction (Y direction) from below (Z2 direction side).

[0032] The head unit 203 is a head unit for component mounting. The head unit 203 mounts components E onto a substrate P fixed at a substrate fixing position Pa. The head unit 203 includes a plurality (five) of heads (mounting heads) 231. The tip of each head 231 is fitted with a nozzle (not shown) for holding (attracting) components E. The head 231 is configured to hold (attract) components E to the nozzle using negative pressure supplied from a negative pressure supply unit (not shown). The head 231 is also configured to move vertically between a lowered position for holding or mounting components E and an raised position for transporting the held components E to the substrate P.

[0033] The head horizontal movement mechanism 204 is configured to move the head unit 203 horizontally (in the X and Y directions). The head horizontal movement mechanism 204 includes a support portion 241 that supports the head unit 203 so as to be movable in the X direction, and a rail portion 242 that supports the support portion 241 so as to be movable in the Y direction. The support portion 241 has a ball screw shaft 241a extending in the X direction and an X-axis motor 241b that rotates the ball screw shaft 241a. The head unit 203 is provided with a ball nut (not shown) that engages with the ball screw shaft 241a of the support portion 241. The head unit 203 is configured to move along the support portion 241 in the substrate transport direction when the ball screw shaft 241a is rotated by the X-axis motor 241b, together with the ball nut that engages with the ball screw shaft 241a.

[0034] The rail section 242 includes a pair of guide rails 242a that support the X-direction ends of the support section 241 so as to be movable in the Y-direction, a ball screw shaft 242b extending in the Y-direction, and a Y-axis motor 242c that rotates the ball screw shaft 242b. The support section 241 is provided with a ball nut (not shown) that engages with the ball screw shaft 242b of the rail section 242. The support section 241 is configured to be movable in the Y-direction along the pair of guide rails 242a of the rail section 242, together with the ball nut that engages with the ball screw shaft 242b, as the ball screw shaft 242b is rotated by the Y-axis motor 242c.

[0035] The head unit 203 is configured to move horizontally on the base 201 by the support portion 241 and rail portion 242 of the head horizontal movement mechanism 204. As a result, the head 231 of the head unit 203 can move above the component supply unit 210 and hold (suction) the component E supplied from the component supply unit 210. Furthermore, the head 231 of the head unit 203 can move above the substrate P fixed at the substrate fixing position Pa and mount the held (suctioned) component E onto the substrate P.

[0036] The component imaging unit 205 is a camera for component recognition. The component imaging unit 205 images the component E held (suctioned) by the nozzle of the head 231 while the component E is being transported to the substrate P by the head 231 of the head unit 203. The component imaging unit 205 is fixed on the upper surface of the base 201 and images the component E held (suctioned) by the nozzle of the head 231 from below (Z2 direction side) of the component E. Based on the image of the component E captured by the component imaging unit 205, the control unit 207 acquires (recognizes) the holding state of the component E (rotational orientation and holding position relative to the head 231).

[0037] The substrate imaging unit 206 is a camera for substrate recognition. Before the head 231 of the head unit 203 begins mounting components E onto the substrate P, the substrate imaging unit 206 captures an image from above of the position recognition mark (fiducial mark) F attached to the upper surface of the substrate P, which is fixed at the substrate fixing position Pa. The position recognition mark F is a mark for recognizing the position of the substrate P. Based on the image of the position recognition mark F captured by the substrate imaging unit 206, the control unit 207 acquires (recognizes) the precise position and orientation of the substrate P fixed at the substrate fixing position Pa. The substrate imaging unit 206 is also attached to the head unit 203. The substrate imaging unit 206 is configured to be movable horizontally together with the head unit 203.

[0038] The control unit 207 is a control circuit that controls the operation of the component mounting device 200b. The control unit 207 includes a CPU (Central Processing Unit), ROM (Read Only Memory), and RAM (Random Access Memory). Based on the production program, the control unit 207 controls the transport unit 202, component supply unit 210, X-axis motor 241b, and Y-axis motor 242c, etc., to control the head unit 203 to mount components E onto the substrate P and produce the substrate P.

[0039] The communication unit 208 is an interface for communicating information. The communication unit 208 connects the component mounting device 200b to other devices of the component mounting system 100 (printing device 200a, pre-reflow inspection device 200c, reflow oven 200d, post-reflow inspection device 200e, and control device 300) in a communication manner.

[0040] (Control device configuration) Next, the configuration of the control device 300 will be described with reference to Figure 3.

[0041] As shown in Figure 3, the control device 300 is a device that generates a substrate production plan for sequentially producing multiple types of substrates P in a component mounting device 200b that produces substrates P by mounting components E onto substrates P. The control device 300 also manages the production of substrates P in multiple mounting lines 200. The control device 300 is, for example, a computer configured to perform various calculations. The control device 300 also executes processing by running a program.

[0042] The control device 300 comprises a control unit 301, a storage unit 302, an operation unit 304, a display unit 305, and a communication unit 306. The storage unit 302 stores a program 303 for generating a substrate production plan. The program 303 is an example of the "substrate production plan program" in the claims.

[0043] The control unit 301 is a control circuit that controls the operation of the control device 300. The control unit 301 includes a CPU (Central Processing Unit). The control unit 301 reads a program from the storage unit 302 and executes various processes.

[0044] The memory unit 302 includes ROM (Read Only Memory) and RAM (Random Access Memory) and is configured to store information. The memory unit 302 stores a program 303 for generating a substrate production plan. The memory unit 302 also stores a program for managing the production of substrates P on multiple mounting lines 200.

[0045] The operation unit 304 includes input units such as a mouse and keyboard and is configured to accept user input. The display unit 305 includes, for example, a liquid crystal monitor or an organic EL monitor and displays information such as the calculation results of the substrate production plan.

[0046] The communication unit 306 is an interface for communicating information. The communication unit 306 connects the control device 300 to other devices of the component mounting system 100 (printing device 200a, component mounting device 200b, pre-reflow inspection device 200c, reflow oven 200d, and post-reflow inspection device 200e) in a communication-enabled manner.

[0047] The control unit 301 generates a substrate production plan for sequentially producing multiple types of substrates P in the component mounting apparatus 200b, which mounts components E onto substrates P to produce substrates P. Specifically, the control unit 301 generates the substrate production plan by executing program 303.

[0048] (Circuit board production planning process) Next, referring to Figures 4 to 11, the substrate production planning process by the control device 300 of this embodiment will be described.

[0049] The PCB production plan is designed to sequentially produce multiple types of PCBs using the assembly line 200, setting the production order and the assembly line 200 to be used. In other words, the PCB production plan sequentially sets the types of PCBs P to be produced for each of the multiple assembly lines 200. When generating the PCB production plan, the control device 300 may first acquire a temporarily generated PCB production plan, edit it, and generate the final PCB production plan, or it may generate the PCB production plan from scratch. When acquiring a temporarily generated PCB production plan, the control device 300 may acquire a PCB production plan generated by another device, determine its validity, and edit it, or it may acquire a PCB production plan that has been previously generated by the control device 300. The temporary PCB production plan is generated based on criteria such as delivery date order, order with short setup time, and order with few setup cycles.

[0050] In this embodiment, the control unit 301 sets at least one of the following: the maximum quantity of intermediate stock boards currently undergoing mounting work in the component mounting apparatus 200b, and the maximum storage time for the intermediate stock boards. In the board production plan, it determines whether or not at least one of the following will be reached. Here, intermediate stock boards currently undergoing mounting work are, for example, boards P on which components E are mounted on both the front and back surfaces, which are stored as stock with components E mounted on only one of the surfaces, before components E are mounted on the other surface. In other words, the number of intermediate stock boards increases when mounting work is performed to mount components E on the first of the front and back surfaces, and decreases when mounting work is performed to mount components E on the last of the front and back surfaces. Furthermore, facilities such as factories equipped with the component mounting system 100 store the intermediate stock boards. The location where the intermediate stock boards are stored may be around multiple mounting lines 200. The intermediate stock boards are stored in racks capable of accommodating multiple boards P.

[0051] The maximum quantity of intermediate stock boards is set, for example, based on the area available for storing the intermediate stock boards. That is, the maximum quantity of intermediate stock boards is set by multiplying the number of racks that can be placed in the storage location for intermediate stock boards by the number of boards P that can be accommodated in each rack. Alternatively, the maximum quantity of intermediate stock boards may be set by an operator inputting information to the control device 300, or by the control device 300 itself.

[0052] The maximum inventory time for intermediate stock boards can be set, for example, in hours, days, or weeks. Alternatively, the maximum inventory time for intermediate stock boards can be set so as not to span across days or weeks. Furthermore, the maximum inventory time for intermediate stock boards may be set by an operator inputting information to the control device 300, or it may be set by the control device 300.

[0053] Furthermore, the control unit 301 determines whether at least one of the following is reached in the generated substrate production plan or the substrate production plan obtained from an external device: the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates.

[0054] Specifically, the control unit 301 determines whether a situation occurs where the number of intermediate stock boards exceeds the maximum quantity, based on the set substrate production plan and the maximum quantity of intermediate stock boards. The control unit 301 also determines whether a situation occurs where the number of intermediate stock boards exceeds the maximum inventory time, based on the set substrate production plan and the maximum inventory time of the intermediate stock boards.

[0055] In the example shown in Figure 4, the control unit 301 determines the production order for each type of substrate P based on the order information and generates a production plan. Then, to obtain the quality of the generated production plan, it determines whether or not the maximum quantity of intermediate stock substrates has been reached. In the example shown in Figure 4, the order information is to produce 300 AAA double-sided substrates (substrates with components E mounted on both the front (1st side) and back (2nd side)), 400 BBB double-sided substrates, 400 CCC double-sided substrates, and 400 DDD double-sided substrates. The delivery dates for the AAA substrates are October 1st, the BBB substrates are October 1st, the CCC substrates are October 2nd, and the DDD substrates are October 2nd. The maximum quantity of intermediate stock substrates is set to 1000.

[0056] The control unit 301 generates a production plan by setting the production order based on the delivery date. In this case, the order is set as follows: 300 sheets of AAA 1st side, 400 sheets of BBB 1st side, 400 sheets of CCC 1st side, 400 sheets of DDD 1st side, 300 sheets of AAA 2nd side, 400 sheets of BBB 2nd side, 400 sheets of CCC 2nd side, and 400 sheets of DDD 2nd side.

[0057] The control unit 301 then determines whether the maximum quantity of intermediate stock boards will be reached based on the production plan in which the production order is set. In this case, since the number of intermediate stock boards reaches 1000 during the mounting work of the 1st side of the CCC, it determines that the maximum quantity of intermediate stock boards will be reached (determination = NG (undesirable production plan)).

[0058] In the example shown in Figure 8, the control unit 301 determines the production order for each type of substrate P based on the order information and generates a production plan. Then, to obtain the quality of the generated production plan, it determines whether or not the maximum inventory time for intermediate stock substrates has been reached. In the example shown in Figure 8, the order information is to produce 300 double-sided AAA substrates, 400 double-sided BBB substrates, 400 double-sided CCC substrates, and 400 double-sided DDD substrates. The delivery dates for the AAA substrates are October 1st, the BBB substrates are October 1st, the CCC substrates are October 2nd, and the DDD substrates are October 2nd. The maximum inventory time for intermediate stock substrates is set to 3 days (72 hours).

[0059] The control unit 301 generates a production plan by setting the production order based on the delivery date. In this case, the order is set as follows: 300 sheets of AAA 1st side, 400 sheets of BBB 1st side, 400 sheets of CCC 1st side, 400 sheets of DDD 1st side, 300 sheets of AAA 2nd side, 400 sheets of BBB 2nd side, 400 sheets of CCC 2nd side, and 400 sheets of DDD 2nd side.

[0060] The control unit 301 then determines whether the maximum inventory time for intermediate stock boards will be reached based on the production plan in which the production order is set. In this case, since the inventory period for intermediate stock board P of AAA exceeds 3 days, it determines that the maximum inventory time for intermediate stock boards will be reached (determination = NG (undesirable production plan)).

[0061] Furthermore, if the control unit 301 determines that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates will be reached in the substrate production plan, it modifies and generates the substrate production plan so that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates will not be reached.

[0062] Furthermore, if the control unit 301 determines that at least one of the maximum quantity of intermediate stock boards or the maximum stock time for intermediate stock boards has been reached in the board production plan, it modifies and generates the board production plan by changing the production order, dividing the production volume, and changing the mounting line 200.

[0063] A change in the production order of a circuit board production plan alters the order in which different types of circuit boards are assembled and produced. For example, the order might be changed so that circuit boards that are currently in the intermediate inventory are assembled first.

[0064] In production volume splitting, the PCB production plan is modified so that the assembly work for the same type of PCB is divided into two or three or more parts. For example, the PCB production plan is modified so that some of the types of PCBs that are piled up as intermediate inventory are assembled first.

[0065] A change to assembly line 200 means that the assembly line 200 on which the assembly work is performed is changed. For example, the board production plan is revised so that the types of boards that are currently piled up as intermediate inventory boards are assembled on an available assembly line 200.

[0066] Furthermore, the control unit 301 extracts multiple candidate types of substrates P to be produced in the substrate production plan based on constraints including the substrate production order, and generates a substrate production plan by sequentially determining the types of substrates P from the extracted candidates, based on priority including delivery date and maximum inventory time for intermediate inventory substrates. In other words, the control unit 301 generates a substrate production plan by setting the types of substrates P sequentially from the beginning or end based on priority. In addition, the control unit 301 generates a substrate production plan while selecting the types of substrates P so as not to reach at least one of the maximum quantity of intermediate inventory substrates and the maximum inventory time for intermediate inventory substrates.

[0067] For example, in the example shown in Figure 5, the types of substrates P are set in order from the beginning based on priority according to delivery date. First, 300 AAA 1st side substrates are set first. Next, 400 BBB 1st side substrates are set. Then, when the CCC 1st side substrates or DDD 1st side substrates are set, the number of intermediate stock substrates reaches 1000, so 300 AAA 2nd side substrates are set third.

[0068] Furthermore, in the example shown in Figure 9, for instance, the types of substrates P are set in order from the beginning based on priority derived from delivery dates. First, 300 AAA 1st side substrates are set first. Next, 400 BBB 1st side substrates are set. Then, if CCC 1st side substrates or DDD 1st side substrates are set, the inventory period for the intermediate stock of AAA substrates P will exceed 2 days, so 300 AAA 2nd side substrates are set third.

[0069] Furthermore, the control unit 301 calculates the quantity of intermediate stock boards by adding the quantity of intermediate stock boards in accordance with the start time of production of the new type of board P, and by decreasing the quantity of intermediate stock boards in accordance with the time when mounting work is to be started on the intermediate stock boards.

[0070] In this case, the timing and quantity of changes in the intermediate stock board quantity may be adjusted to match the production time of board P, or they may be adjusted forward or backward by a predetermined amount relative to the production time of board P, or the quantity to be produced may be added or subtracted all at once. For example, the control unit 301 increases the quantity of intermediate stock boards at a predetermined time before the start time of production of a new type of board P. Also, the control unit 301 decreases the quantity of intermediate stock boards at a predetermined time after the time when the mounting work on the intermediate stock boards is completed. This allows for a margin before the intermediate stock boards approach the limit value (maximum quantity). Furthermore, during the time when the intermediate stock boards are approaching the limit value (maximum quantity), a board production plan can be generated so that mounting work on the preceding side is not performed on other mounting lines 200. In this case, during the time when the intermediate stock boards are approaching the limit value (maximum quantity), a board production plan can be generated so that mounting work on one-sided boards or boards with a trailing side is performed.

[0071] For example, in the example shown in Figure 6, the number of intermediate stock boards is calculated so that the number of intermediate stock boards increases slightly before the start of production of the first side of board P, and decreases slightly after the end of production of the second side of board P. Also, in the example shown in Figure 6, the number of intermediate stock boards is calculated one by one.

[0072] Furthermore, in the example shown in Figure 7, the number of intermediate stock boards is calculated such that the total number of boards scheduled for production increases to the number of intermediate stock boards at the time when production of the 1st side of board P begins, and the total number decreases to the number of intermediate stock boards at the time when production of all boards on the 2nd side of board P is completed.

[0073] (Circuit board production planning process) Next, referring to Figures 10 and 11, the substrate production planning process by the control device 300 of this embodiment will be described.

[0074] The first example shown in Figure 10 describes the case where the maximum quantity of intermediate stock substrates is set.

[0075] In step S1 of Figure 10, the control unit 301 acquires order information for multiple types of substrates P to be produced. In step S2, the control unit 301 acquires the type of substrate P for each side on which the substrate P will be mounted, based on the order information. That is, for substrates that are mounted on one side, one type is set for one side. For substrates that are mounted on both sides, a total of two types are set: one type for one side and one type for the other side.

[0076] In step S3, the control unit 301 extracts candidate types of substrates P to be produced. In step S4, the control unit 301 narrows down the candidate types of substrates P that do not exceed the maximum quantity of intermediate stock substrates, taking into consideration priority based on delivery time, setup time, and number of setups.

[0077] In step S5, the control unit 301 selects the type of substrate P to be produced from the narrowing-down results and assigns it to the plan. In step S6, the intermediate inventory information is updated. Specifically, if a substrate P with a leading side is assigned, the number of intermediate inventory items is increased, and if a substrate P with a trailing side is assigned, the number of intermediate inventory items is decreased. If a single-sided substrate P is assigned, the number of intermediate inventory items remains unchanged.

[0078] In step S7, the control unit 301 determines whether or not a production plan has been created that assigns all types of substrates P that have been extracted. If a production plan has not been created that assigns all types of substrates P, the process returns to step S4. If a production plan has been created that assigns all types of substrates P, the substrate production planning process ends.

[0079] The second example shown in Figure 11 describes the case where the maximum inventory time for intermediate stock substrates is set.

[0080] In step S11 of Figure 11, the control unit 301 acquires order information for multiple types of substrates P to be produced. In step S12, the control unit 301 acquires the type of substrate P for each side on which the substrate P will be mounted, based on the order information. That is, for substrates that are mounted on one side, one type is set for one side. For substrates that are mounted on both sides, a total of two types are set: one type for one side and one type for the other side.

[0081] In step S13, the control unit 301 extracts candidate types of substrate P to be produced. In step S14, the control unit 301 narrows down the candidate types of substrate P that do not exceed the maximum inventory time for intermediate inventory substrates, taking into consideration priority based on delivery time, setup time, and number of setups.

[0082] In step S15, the control unit 301 selects the type of substrate P to be produced from the narrowing-down results and assigns it to the plan.

[0083] In step S16, the control unit 301 determines whether or not a production plan has been created that assigns all types of substrates P that have been extracted. If a production plan has not been created that assigns all types of substrates P, the process returns to step S14. If a production plan has been created that assigns all types of substrates P, the substrate production planning process ends.

[0084] (Effects of the embodiment) In this embodiment, the following effects can be obtained.

[0085] In this embodiment, as described above, the control unit 301 determines in the substrate production plan whether at least one of the following is reached: the maximum quantity of intermediate stock substrates in the component mounting device 200b and the maximum inventory time for the intermediate stock substrates. By determining in the substrate production plan whether at least one of the following is reached: the maximum quantity of intermediate stock substrates and the maximum inventory time for the intermediate stock substrates, the intermediate stock substrates can be managed so that the number of intermediate stock substrates does not reach the maximum quantity, or the inventory time for the intermediate stock substrates does not reach the maximum inventory time. As a result, a substrate production plan can be generated that allows for the management of intermediate stock substrates in the process of being mounted. This prevents the number of intermediate stock substrates from becoming excessively large, thus eliminating the need to secure a large area for storage space for the intermediate stock substrates. It also prevents the inventory time for intermediate stock substrates from becoming excessively long.

[0086] Furthermore, in this embodiment, as described above, the control unit 301 determines whether at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates is reached in the generated substrate production plan or the substrate production plan obtained from an external device. This makes it possible to check whether at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates is reached when using a pre-generated substrate production plan, thereby enabling appropriate management of intermediate stock substrates in the pre-generated substrate production plan.

[0087] Furthermore, in this embodiment, as described above, if the control unit 301 determines that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates will be reached in the substrate production plan, it modifies and generates the substrate production plan so that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time for intermediate stock substrates will not be reached. This allows the control unit 301 to generate a substrate production plan that enables more appropriate management of intermediate stock substrates.

[0088] Furthermore, in this embodiment, as described above, if the control unit 301 determines that at least one of the maximum quantity of intermediate stock boards and the maximum inventory time for intermediate stock boards has been reached in the board production plan, it performs at least one of the following actions: changing the production order of the board production plan, dividing the production volume, and changing the mounting line 200. By doing so, the board production plan can be easily modified so that at least one of the maximum quantity of intermediate stock boards and the maximum inventory time for intermediate stock boards is not reached.

[0089] Furthermore, in this embodiment, as described above, the control unit 301 extracts multiple candidate types of substrates P to be produced in the substrate production plan based on constraints including the substrate production order, and from the multiple extracted candidate types of substrates P, it sequentially determines the types of substrates P from the beginning or end based on a priority including delivery date and maximum inventory time for intermediate inventory substrates, thereby generating a substrate production plan. This makes it possible to generate a substrate production plan that prioritizes substrates P with earlier delivery dates and substrates P with closer maximum inventory time for intermediate inventory substrates from among multiple candidate types of substrates P, and performs the mounting work in an earlier order.

[0090] Furthermore, in this embodiment, as described above, the control unit 301 calculates the quantity of intermediate stock substrates by adding the quantity of intermediate stock substrates corresponding to the start time of production of the new type of substrate P, and by decreasing the quantity of intermediate stock substrates corresponding to the time when mounting work is started on the intermediate stock substrates. This makes it easy to manage the quantity of intermediate stock substrates.

[0091] (modified version) It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than by the description of the embodiments above, and further includes all modifications (exceptions) within the meaning and scope equivalent to the claims.

[0092] For example, in the above embodiment, in the production of a double-sided substrate in which components are mounted on two surfaces, the front and back, a substrate that has been stored after the mounting work on one side has been completed was shown as an example of an intermediate stock substrate, but the present invention is not limited to this. In the present invention, in the production of a single-sided substrate in which components are mounted on only one side, a substrate that has been partially mounted on one side and has been removed from the mounting line and stored may be used as an intermediate stock substrate.

[0093] Furthermore, while the above embodiment shows an example of generating a substrate production plan for the production of a double-sided substrate in which components are mounted on two surfaces, the front and back, the present invention is not limited to this. In the present invention, a substrate production plan may be generated for mounting work in which components are mounted on a substrate having three or more surfaces.

[0094] Furthermore, while the above embodiment shows an example of a configuration for generating substrate production plans for multiple mounting lines, the present invention is not limited thereto. In the present invention, a substrate production plan for a single mounting line may be generated.

[0095] Furthermore, while the above embodiment shows an example of generating a substrate production plan in which the front and back surfaces of a double-sided substrate are mounted on the same mounting line, the present invention is not limited to this. In the present invention, a substrate production plan may be generated in which the front and back surfaces of a double-sided substrate are mounted on different mounting lines.

[0096] Furthermore, although the above embodiment shows an example in which intermediate stock substrates are stored in racks, the present invention is not limited thereto. In the present invention, intermediate stock substrates may be stored not in racks, but by being accumulated in a conveying device such as a conveyor or a buffer device.

[0097] Furthermore, although the above embodiment shows an example in which one component mounting device is provided on the mounting line, the present invention is not limited to this. In the present invention, multiple component mounting devices may be provided in series on the mounting line.

[0098] Furthermore, in the above embodiment, for the sake of explanation, the processing operations of the control unit were described using a flow-driven flowchart that processes sequentially according to the processing flow, but the present invention is not limited thereto. In the present invention, the processing operations of the control unit may be performed by event-driven processing, which executes processing on an event-by-event basis. In this case, it may be performed as a completely event-driven system, or a combination of event-driven and flow-driven systems may be used. [Explanation of Symbols]

[0099] 200b Component mounting machine 300 Control devices (printed circuit board production planning equipment, computers) 301 Control Unit 303 Program (Circuit Board Production Planning Program) E parts P board

Claims

1. A component mounting apparatus for producing circuit boards by mounting components onto a circuit board includes a control unit that generates a circuit board production plan for sequentially producing multiple types of circuit boards. A substrate production planning device in which the control unit determines whether or not at least one of the maximum quantity of intermediate stock substrates in which mounting work is underway in the component mounting device and the maximum inventory time of the intermediate stock substrates is reached in the substrate production plan.

2. The substrate production planning apparatus according to claim 1, wherein the control unit determines that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time of the intermediate stock substrates will be reached in the substrate production plan, and modifies and generates the substrate production plan so that at least one of the maximum quantity of intermediate stock substrates and the maximum inventory time of the intermediate stock substrates will not be reached.

3. The substrate production planning apparatus according to claim 2, wherein the control unit determines that at least one of the maximum quantity of intermediate stock substrates and the maximum stock time of intermediate stock substrates has been reached in the substrate production plan, and performs at least one of the following: changing the production order of the substrate production plan, dividing the production volume, and changing the mounting line.

4. The control unit extracts a plurality of candidate types of substrates to be produced in the substrate production plan based on constraints including the substrate production order, and from the plurality of extracted candidate types of substrates, it sequentially determines the types of substrates from the beginning or end based on priority including delivery dates and the maximum inventory time of the intermediate inventory substrates, thereby generating the substrate production plan, as described in claim 1.

5. The substrate production planning apparatus according to claim 1, wherein the control unit calculates the quantity of intermediate stock substrates by adding the quantity of intermediate stock substrates in accordance with the start time of production of a new type of substrate.

6. The substrate production planning apparatus according to claim 1, wherein the control unit reduces the quantity of the intermediate stock substrates in correspondence with the time to start mounting work on the intermediate stock substrates, and calculates the quantity of the intermediate stock substrates.

7. A component mounting apparatus for producing circuit boards by mounting components onto a circuit board, wherein a circuit board production planning method is provided for generating a circuit board production plan for sequentially producing multiple types of circuit boards, A substrate production planning method comprising the step of determining whether or not the maximum quantity of intermediate stock substrates in which mounting work is underway in the component mounting apparatus and the maximum inventory time of the intermediate stock substrates have been reached.

8. A circuit board production planning program for a component mounting apparatus that mounts components onto a circuit board to produce circuit boards, wherein a circuit board production planning method for sequentially producing multiple types of circuit boards is executed by computer, The aforementioned substrate production planning method, in the substrate production planning, A circuit board production planning program comprising the step of determining whether or not at least one of the maximum quantity of intermediate stock circuit boards currently being mounted in the component mounting apparatus and the maximum inventory time for the intermediate stock circuit boards has been reached.

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