Manufacturing method

Abstract

Assembling smaller optical devices in less time and with greater precision. [Solution] A first holding means for holding and displacing a first optical device on a first holding surface and a second holding means for holding and displacing a second optical device on a second holding surface are provided on a vibration isolation table that isolates vibrations from a frame. A detection means detects the vibration of the vibration isolation table based on its displacement. A first imaging means, provided at a position for imaging the first and second holding surfaces, images the first or second holding surface to acquire a first image when the detected vibration is smaller than a predetermined threshold. The position of the first holding surface is calculated from the first image. The first mounting means places the first optical device on the first holding surface by referring to the calculated position of the first holding surface. The position of the second holding surface of the second holding means is calculated from the first image. The second mounting means places the second optical device on the second holding surface by referring to the calculated position of the second holding surface.

Description

[Technical Field]

[0001] The present invention relates to a manufacturing method, and particularly relates to a manufacturing method for manufacturing an optical device. [Background Art]

[0002] Conventionally, in the manufacturing of optical transceivers, operations such as alignment have been performed manually because accuracy is required for such operations.

[0003] There has also been proposed a method in which a first optical component is accurately aligned with a second optical component coupled to a substrate, and the first optical component is coupled to the substrate by a plurality of coupling elements, the method comprising the steps of: micro-manipulating at least one of the plurality of coupling elements to align the first optical component with the second optical component; monitoring the movement of the first optical component while at least one of the plurality of coupling elements is being micro-manipulated; and repeating the micro-manipulating step and the monitoring step until a quality threshold for optical coupling is achieved (see, for example, Patent Document 1). [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2006-259727 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] However, manual assembly requires handling small optical devices, resulting in a long time required for the assembly work. Furthermore, with the method described in Patent Document 1, accurate alignment cannot be achieved due to Brownian motion.

[0006] The present invention has been made in view of such circumstances, and is intended to enable smaller optical devices to be assembled in a shorter time with higher accuracy. [Means for Solving the Problem]

[0007] One aspect of the present invention is a manufacturing method for manufacturing an optical device by adjusting the relative positions of a first optical device and a second optical device, wherein a first holding means for holding and displacing the first optical device on a first holding surface and a second holding means for holding and displacing the second optical device on a second holding surface are provided on a vibration isolation table that isolates vibrations from a frame, a detection means detects the vibration of the vibration isolation table based on the displacement of the vibration isolation table, and a first imaging means provided at a position for imaging the first and second holding surfaces determines whether the detected vibration is smaller than a predetermined threshold, and then the first holding surface or the second holding surface The surface is imaged to acquire a first image, the position of the first holding surface is calculated from the first image, the first optical device is placed on the first holding surface by the first mounting means, the position of the second holding surface of the second holding means is calculated from the first image, the second optical device is placed on the second holding surface by the second mounting means, the first optical device is displaced by the first holding means, and the second optical device is displaced by the second holding means to adjust the relative positions of the first optical device and the second optical device.

[0008] The first holding means can be moved between an adjustment position in which the relative positions of the first optical device and the second optical device are adjusted and a position in which the first optical device is received from the first mounting means, and the second holding means can be moved between the adjustment position and a position in which the second optical device is received from the second mounting means.

[0009] A third holding means for holding and displacing a first optical device on a third holding surface and a fourth holding means for holding and displacing a second optical device on a fourth holding surface are further provided on the vibration isolation table. When the detected vibration is smaller than a predetermined threshold, the first imaging means images the third or fourth holding surface to acquire a second image, calculates the position of the third holding surface from the second image, and the first mounting means places the first optical device on the third holding surface by referring to the calculated position of the third holding surface. The second mounting means calculates the position of the fourth holding surface from the second image, and the second optical device places the second optical device on the fourth holding surface by referring to the calculated position of the fourth holding surface. The third holding means displaces the first optical device, and the fourth holding means displaces the second optical device to adjust the relative positions of the first and second optical devices.

[0010] When placing a first optical device on the first holding surface of the first holding means, the first holding means can remove the first optical device stored in the first container, transport the removed first optical device, and place it on the first holding surface. When placing a second optical device on the second holding surface of the second holding means, the second holding means can remove the second optical device stored in the second container, transport the removed second optical device, and place it on the second holding surface.

[0011] A second imaging means provided on the vibration isolation table captures a second image for measuring the positions of the first optical device held on the first holding surface and the second optical device held on the second holding surface. When adjusting the relative positions of the first and second optical devices, the positions of the first and second optical devices calculated from the second image can be referenced.

[0012] A second imaging means provided on the vibration isolation table captures an image of the coated surface of the second optical device held on the second holding surface, which is the surface to which adhesive for fixing the second optical device to the first optical device is applied. Based on the captured image of the coated surface, the adhesive can be applied to the coated surface by the coating means provided on the vibration isolation table.

[0013] The second imaging means can capture an image of the coated surface to which the adhesive has been applied.

[0014] The coating position detection means provided on the vibration isolation table can image the coating surface of the second optical device to detect the coating position for adhesive application, the coating means provided on the vibration isolation table can apply the adhesive to the detected coating position, and the shape of the applied adhesive can be measured by the shape measuring means provided on the vibration isolation table.

[0015] The transport means can remove the optical device, in which the first and second optical devices, whose relative positions have been adjusted, are fixed, transport the removed optical device, and store it in a container.

[0016] When the driving means drives the second optical device held on the second holding surface, and the light transmission means transmits light incident from the second optical device to the first optical device held on the first holding surface and light emitted from the first optical device to adjust the relative position between the first optical device and the second optical device, the intensity of the light transmitted by the light transmission means can be referenced. [Effects of the Invention]

[0017] As described above, according to the present invention, smaller optical devices can be assembled in a shorter time and with greater precision. [Brief explanation of the drawing]

[0018] [Figure 1] This is a perspective view illustrating the general configuration of the assembly apparatus 11 according to an embodiment of the present invention. [Figure 2] It is a perspective view illustrating an outline of the configuration of an assembling apparatus 11 according to an embodiment of the present invention. [Figure 3] It is a plan view illustrating the arrangement of an alignment stage 21-1 and an alignment stage 21-2. [Figure 4] It is an enlarged view showing an enlarged configuration of the alignment stage 21. [Figure 5] It is an enlarged view further enlarging the configuration of the alignment stage 21. [Figure 6] It is a diagram showing an example of the hardware configuration of a control device 35. [Figure 7] It is a block diagram showing an example of a functional configuration implemented by the control device 35 that executes a program. [Figure 8] It is a flowchart explaining an assembling process. [Figure 9] It is a flowchart explaining a process of mounting a SiOB on a stage. [Figure 10] It is a flowchart explaining a process of positioning and fixing the SiOB to an AWG. Mode for Carrying Out the Invention

[0019] Embodiments of the present invention will be described below. An example of the correspondence between the constitutional requirements of the present invention and the embodiments described in the detailed description of the invention is as follows. This description is intended to confirm that embodiments supporting the present invention are described in the detailed description of the invention. Therefore, even if there is an embodiment described in the detailed description of the invention that is not described herein as an embodiment corresponding to a constitutional requirement of the present invention, this does not mean that the embodiment does not correspond to said constitutional requirement. Conversely, even if an embodiment is described herein as corresponding to a constitutional requirement, this does not mean that the embodiment does not correspond to any constitutional requirements other than said constitutional requirement.

[0020] One aspect of the present invention is a manufacturing method in which a first holding means (e.g., stage 101 in Figure 5) that holds and displaces a first optical device on a first holding surface (e.g., holding surface 111 in Figure 5) and a second holding means (e.g., stage 102 in Figure 5) that holds and displaces a second optical device on a second holding surface (e.g., holding surface 112 in Figure 5) are placed on a vibration isolation table (e.g., vibration isolation table unit 23 in Figure 2) that isolates vibrations from a frame (e.g., frame 24 in Figure 2), a detection means (e.g., displacement meter 57 in Figure 2) detects the vibration of the vibration isolation table based on the displacement of the vibration isolation table (e.g., step S14 in Figure 8 or step S44 in Figure 9), and a first imaging means (e.g., camera 58 in Figure 2) provided at a position for imaging the first and second holding surfaces captures the first or second holding surface to acquire a first image (e.g., Figure 2) when the detected vibration is smaller than a predetermined threshold (e.g., Figure 2 In step S16 of Figure 8 or step S46 of Figure 9, the position of the first holding surface is calculated from the first image (for example, step S17 of Figure 8), and the first optical device is placed on the first holding surface by the first mounting means (for example, the transport robot 52 in Figure 2) with reference to the calculated position of the first holding surface (for example, step S18 of Figure 8), the position of the second holding surface of the second holding means is calculated from the first image (for example, step S47 of Figure 9), and the second optical device is placed on the second holding surface by the second mounting means (for example, the transport robot 51 in Figure 2) with reference to the calculated position of the second holding surface (for example, step S48 of Figure 9), and the first optical device is displaced by the first holding means and the second optical device is displaced by the second holding means to adjust the relative positions of the first optical device and the second optical device (for example, step S73 of Figure 10).

[0021] Hereinafter, an assembly apparatus and manufacturing method according to an embodiment of the present invention will be described with reference to Figures 1 to 10.

[0022] Figures 1 and 2 are perspective views illustrating the general configuration of the assembly apparatus 11 according to an embodiment of the present invention. Figure 1 is a perspective view of the assembly apparatus 11 from the front. Figure 2 is a perspective view of the assembly apparatus 11 from the rear.

[0023] In the following, in the assembly apparatus 11, the side where the first and second optical devices, which are the workpieces before assembly, are placed is referred to as the front, the front-to-back direction is illustrated by the Y-axis, the left-to-right direction by the X-axis, and the up-to-down direction by the Z-axis. Furthermore, in the following, the lower right side in Figure 1 along the Y-axis will be simply referred to as the front, and the upper left side in Figure 1 along the Y-axis will be simply referred to as the rear (back) side. Furthermore, in the following, the lower left side in Figure 1 along the X-axis will be simply referred to as the left side, and the upper right side in Figure 1 along the X-axis will be simply referred to as the right side. Furthermore, in the following, the upper side in Figure 1 along the Z-axis will be simply referred to as the upper side, and the lower side in Figure 1 along the Z-axis will be simply referred to as the lower side. Note that the rear (back) side is the positive direction of the Y-axis, the right side is the positive direction of the X-axis, and the upper side is the positive direction of the Z-axis. Furthermore, the Z-axis direction is also simply referred to as the up-and-down direction, the X-axis direction as simply the left-and-right direction, and the Y-axis direction as simply the front-and-back direction. In addition, the direction along the plane parallel to the X and Y axes is simply referred to as the horizontal direction. Moreover, the direction that is at a relatively small angle with respect to the horizontal direction and the horizontal direction are also referred to as the lateral direction, and the direction that is at a relatively small angle with respect to the up-and-down direction and the up-and-down direction are also referred to as the vertical direction. The same applies to the following figures.

[0024] The assembly apparatus 11 assembles the optical device by adjusting the relative positions of the first optical device and the second optical device. The first optical device and the second optical device are elements used for artificial light sources and optical transmission, respectively. For example, the first optical device and the second optical device are light-emitting elements such as laser diodes, light-emitting diodes, and organic electroluminescent (EL) elements, light-receiving elements such as photodiodes and phototransistors, optical waveguides having sheet-like or plate-like structures such as slab-type or embedded-type, and optical amplifiers such as semiconductor optical amplifiers, respectively. The optical device consists of multiple optical devices. For example, the optical device is an optical transceiver, transmitter, receiver, optical switch, spectrometer, or photocoupler.

[0025] The assembly apparatus 11 adjusts the relative positions of the first optical device and the second optical device while eliminating dark vibrations transmitted from the floor or other surfaces on which the assembly apparatus 11 is installed. The assembly apparatus 11 also places the first optical device, which has been removed from a container such as a magazine or tray that stores the first optical device, onto a stage that holds and displaces the first optical device. Similarly, the assembly apparatus 11 places the second optical device, which has been removed from a container such as a magazine or tray that stores the second optical device, onto a stage that holds and displaces the second optical device.

[0026] The following describes the configuration of the assembly apparatus 11 and the procedure of the manufacturing method using the assembly apparatus 11, using as an example the case in which the assembly apparatus 11 adjusts the relative position of an arrayed waveguide grating (hereinafter referred to as AWG (Arrayed waveguide gratings)) as an example of a first optical device and a silicon optical bench (SiOB) (hereinafter referred to as OSiOB) on which a laser diode is mounted as an example of a second optical device to assemble an optical transceiver, which is an example of an optical device.

[0027] In the following, the position may be an actual physical position, or it may be a position represented by three-dimensional spatial coordinates in a numerically controlled machine. Furthermore, the position may be a combination of positions on individual motion axes.

[0028] The assembly apparatus 11 is provided with an alignment stage 21-1 that holds and displaces an AWG, which is an example of a first optical device, and an OSIB, which is an example of a second optical device. The assembly apparatus 11 is also provided with an alignment stage 21-2 that operates independently of the alignment stage 21-1 and holds and displaces an AWG, which is an example of a first optical device, and an OSIB, which is an example of a second optical device.

[0029] Figure 3 is a plan view illustrating the arrangement of the alignment stage 21-1 and the alignment stage 21-2.

[0030] The assembly apparatus 11 consists of a centering stage 21-1 and a centering stage 21-2, as well as a vibration isolation table unit 23, a frame 24, a coating syringe 25, a coating camera 26, a three-dimensional displacement meter 27, an autofocus camera 28, an inspection slider 29, an inspection slider rail 30, a control device 35, a transport robot rail 50, a transport robot 51, a transport robot 52, a stage rail 53-1, a stage rail 53-2, a tray slider 54, a tray slider 55, a tray slider 56, a displacement meter 57, a camera 58, a tray slider rail 61, a tray slider rail 62, a tray slider rail 63, a magazine elevator 71, a magazine elevator 72, and a magazine elevator 73.

[0031] Furthermore, the alignment stage 21-1 is equipped with a probe unit 81-1 and an ultraviolet irradiator 82-1. The alignment stage 21-2 is equipped with a probe unit 81-2 and an ultraviolet irradiator 82-2.

[0032] The configuration of the assembly apparatus 11 will be described below with reference to Figures 1 to 5.

[0033] The alignment stage 21-1 holds the AWG and displaces the AWG in the tilt direction around the Z axis (hereinafter referred to as the yaw direction). The alignment stage 21-1 also holds the SiOB and displaces the SiOB in the X axis direction (left and right direction), Y axis direction (front and back direction), Z axis direction (up and down direction), tilt direction around the X axis (hereinafter referred to as the roll direction), tilt direction around the Y axis (hereinafter referred to as the pitch direction), and yaw direction.

[0034] The alignment stage 21-2 holds the AWG and displaces the AWG it holds in the yaw direction. The alignment stage 21-2 also holds the SiOB and displaces the SiOB it holds in the X-axis direction (left-right direction), Y-axis direction (front-back direction), Z-axis direction (up-down direction), roll direction, pitch direction, and yaw direction.

[0035] The alignment stage 21-1 and the alignment stage 21-2 have similar configurations.

[0036] Hereafter, unless it is necessary to distinguish between the alignment stage 21-1 and the alignment stage 21-2 individually, they will simply be referred to as the alignment stage 21.

[0037] Figure 4 is an enlarged view showing the configuration of the alignment stage 21. Figure 5 is an enlarged view showing the configuration of the alignment stage 21 in a further enlarged view. The alignment stage 21 is provided with stages 101, 102, and 103. Stage 101 is an example of a first holding means, and holds the AWG placed on the holding surface 111 and displaces the AWG being held in the yaw direction. For example, stage 101 holds the AWG placed on the holding surface 111 by attracting air through the holding surface 111. In this way, stage 101 holds and displaces the AWG, which is an example of a first optical device.

[0038] Stage 102 is an example of a second holding means, and holds the SiOB placed on the holding surface 112, and displaces the held SiOB in the X-axis direction (left and right direction), Y-axis direction (front and back direction), Z-axis direction (up and down direction), roll direction, pitch direction, and yaw direction. For example, Stage 102 holds the SiOB placed on the holding surface 112 by sucking air onto the holding surface 112. Stage 102 also rotates on the X-axis as a rotation axis, displacing the surface of the SiOB adjacent to Stage 101 upward. In this way, Stage 102 holds and displaces the SiOB, which is an example of a second optical device.

[0039] Stage 103 positions the optical fiber such that its optical axis aligns with the optical axis of the output side of the AWG placed on the holding surface 111 of Stage 101. One end of the optical fiber is positioned on the output side of the AWG, and the other end is connected to an optical power meter (not shown). In this way, Stage 103 receives and transmits the light emitted from the AWG held on Stage 101.

[0040] Returning to Figures 1 to 3, the vibration isolation unit 23 is fixed to the frame 24 and removes vibrations from the frame 24. In other words, the vibration isolation unit 23 performs vibration isolation. The vibration isolation unit 23 is equipped with a base plate 41. For example, the vibration isolation unit 23 supports the base plate 41 with springs such as air springs or metal springs, or with magnetic force, to remove vibrations transmitted from the frame 24 to the base plate 41. The base plate 41 is made of metal or stone and has a relatively large predetermined mass to suppress vibrations. The upper surface of the base plate 41 is formed as a plane parallel to the X and Y axes.

[0041] On the surface plate 41 of the vibration isolation table unit 23, there are alignment stages 21-1 and 21-2, a coating syringe 25, a coating camera 26, a three-dimensional displacement meter 27, an autofocus camera 28, an inspection slider 29, an inspection slider rail 30, a stage rail 53-1, and a stage rail 53-2. In other words, the alignment stages 21-1 and 21-2, the coating syringe 25, the coating camera 26, the three-dimensional displacement meter 27, the autofocus camera 28, the inspection slider 29, the inspection slider rail 30, the stage rail 53-1, and the stage rail 53-2 are all mounted on the surface plate 41 of the vibration isolation table unit 23, which is a vibration-isolated surface plate 41.

[0042] The frame 24 is the main frame and supports the entire assembly device 11. Specifically, the frame 24 directly supports the vibration isolation table unit 23, the transport robot rail 50, the transport robot 51, the transport robot 52, the tray slider 54, the tray slider 55, the tray slider 56, the displacement meter 57, the tray slider rail 61, the tray slider rail 62, the tray slider rail 63, the magazine elevator 71, the magazine elevator 72, and the magazine elevator 73. The frame 24 also supports the alignment stage 21-1 and the alignment stage 21-2, the coating syringe 25, the coating camera 26, the 3D displacement meter 27, the autofocus camera 28, the inspection slider 29, the inspection slider rail 30, the stage rail 53-1, and the stage rail 53-2 via the vibration isolation table unit 23.

[0043] The coating syringe 25, coating camera 26, three-dimensional displacement meter 27, and autofocus camera 28 are mounted on the inspection slider 29. The inspection slider 29 moves along the inspection slider rail 30 in the X-axis direction. The inspection slider rail 30 extends in the X-axis direction and is positioned above the alignment stages 21-1 and 21-2, without interfering with them.

[0044] The application syringe 25 consists of an outer cylinder and a piston, and contains adhesive for bonding AWG and SiOB. The adhesive is applied to the SiOB held on the alignment stage 21-1 or alignment stage 21-2 by dropping the adhesive onto the SiOB. Since the application syringe 25 is provided on the inspection slider 29, the adhesive is applied from above the SiOB held on the alignment stage 21-1 or alignment stage 21-2. For example, the adhesive is an ultraviolet-curing adhesive. The adhesive may be applied to the SiOB by direct contact, by atomizing it with an airless nozzle, or by atomizing it with air. The adhesive may also be applied to a single point, to multiple points, or in a predetermined pattern. The application syringe 25 is provided on the surface plate 41 of the vibration isolation table unit 23.

[0045] The coating camera 26 is a camera that captures images. The coating camera 26 captures an image to measure the position of the coated surface of the SiOB held by the alignment stage 21-1 or alignment stage 21-2, which is the surface to which adhesive for fixing the SiOB to the AWG is applied. The coating camera 26 also captures an image of the coated surface of the SiOB to which the adhesive has been applied. When the coating camera 26 captures an image of the SiOB, the alignment stage 21-1 or alignment stage 21-2 displaces the SiOB so that the coated surface of the SiOB faces upward. Since the coating camera 26 is mounted on the inspection slider 29, it captures an image of the SiOB from above the SiOB held by the alignment stage 21-1 or alignment stage 21-2.

[0046] In this way, the coating camera 26 captures an image to measure the position of the coating surface, which is the surface of the SiOB held on the stage 102 to which the adhesive for fixing the SiOB to the AWG is applied. The coating camera 26 is mounted on the surface plate 41 of the vibration isolation table unit 23. The coating camera 26 also captures an image of the coating surface to which the adhesive has been applied.

[0047] The coating syringe 25 applies adhesive to the coated surface of the SiOB by referring to the position of the coated surface measured from the image captured by the coating camera 26.

[0048] The 3D displacement meter 27 measures three-dimensional displacement, for example, by irradiating it with laser light, scanning the laser light, and receiving the reflected laser light. The 3D displacement meter 27 measures the displacement of the coated surface of the SiOB held on the alignment stage 21-1 or alignment stage 21-2, which is the surface to which adhesive for fixing the SiOB to the AWG is applied. The 3D displacement meter 27 also measures the displacement of the surface of the adhesive applied to the coated surface of the SiOB and the volume of the adhesive. When the 3D displacement meter 27 measures the displacement of the coated surface of the SiOB, the alignment stage 21-1 or alignment stage 21-2 displaces the SiOB so that the coated surface of the SiOB faces upward. Since the 3D displacement meter 27 is installed on the inspection slider 29, it measures the displacement of the coated surface of the SiOB from above the SiOB held on the alignment stage 21-1 or alignment stage 21-2. The three-dimensional displacement sensor 27 is mounted on the surface plate 41 of the vibration isolation table unit 23.

[0049] In this way, the 3D displacement meter 27 measures the displacement of the coated surface, which is the surface of the SiOB held on the stage 102 to which adhesive for fixing the SiOB to the AWG is applied. The 3D displacement meter 27 also measures the displacement of the surface of the adhesive applied to the coated surface.

[0050] Furthermore, the coating syringe 25 applies adhesive to the coating surface of the SiOB by referring to the position of the coating surface measured by the three-dimensional displacement sensor 27.

[0051] The autofocus camera 28 is a camera that captures images at 10x optical magnification using autofocus. The autofocus camera 28 captures images for measuring the position of the AWG and the position of the OSIB held on either the alignment stage 21-1 or the alignment stage 21-2. Since the autofocus camera 28 is mounted on the inspection slider 29, it captures images of the AWG and OSIB from above the AWG and OSIB held on either the alignment stage 21-1 or the alignment stage 21-2.

[0052] The control device 35 is either a dedicated or general-purpose controller. The control device 35 controls the assembly apparatus 11. For example, the control device 35 can be a sequence controller or an industrial computer. Details of the configuration of the control device 35 will be described later.

[0053] The transport robot 51 transports the SiOB by, for example, sucking in air to adsorb and hold it. The transport robot 51 also receives the SiOB transported by the trace slider 54 and places the SiOB on the alignment stage 21-1 or alignment stage 21-2. The transport robot 52 transports the AWG or optical transceiver. For example, the transport robot 52 adsorbs and holds the AWG or optical transceiver by sucking in air. The transport robot 52 also receives the AWG transported by the trace slider 55 and places the AWG on the alignment stage 21-1 or alignment stage 21-2. Furthermore, the transport robot 52 takes the optical transceiver from the alignment stage 21-1 or alignment stage 21-2 and passes it to the trace slider 56.

[0054] As will be described in detail later, the transport robot 52 places the AWG on the holding surface 111 of the stage 101 by referring to the position of the holding surface 111 of the stage 101 measured from the image captured by the camera 58. Similarly, the transport robot 51 places the OSOB on the holding surface 112 of the stage 102 by referring to the position of the holding surface 112 of the stage 102 measured from the image captured by the camera 58.

[0055] The transport robots 51 and 52 each move along the transport robot rail 50 in the X-axis direction. Transport robot 51 is located to the left of transport robot 52. The transport robot rail 50 extends in the X-axis direction and is located above the alignment stages 21-1 and 21-2, in a position that does not interfere with the alignment stages 21-1 and 21-2 and the inspection slider 29.

[0056] The alignment stage 21-1 moves along the stage rail 53-1 in the Y-axis direction. The stage rail 53-1 extends in the Y-axis direction and is mounted on the surface plate 41 of the vibration isolation unit 23. The alignment stage 21-2 moves along the stage rail 53-2 in the Y-axis direction. The stage rail 53-2 extends in the Y-axis direction and is mounted on the surface plate 41 of the vibration isolation unit 23. The stage rail 53-2 is mounted to the left of the stage rail 53-1. The alignment stages 21-1 and 21-2 can move independently of each other. Hereinafter, when there is no need to distinguish between the stage rails 53-1 and 53-2 individually, they will simply be referred to as stage rail 53.

[0057] The alignment stage 21 drives stages 101 and 102 to move to a position where the relative positions of the AWG and the SiOB are adjusted, or to a position where the AWG or SiOB is placed by the transport robot 52 or transport robot 51.

[0058] The trace slider 54 moves along the trace slider rail 61. The trace slider 54 takes the SiOB from a magazine, which is an example of a container located in the magazine elevator 71, transports it, and passes it to the transport robot 51. For example, the trace slider 54 adsorbs and holds the SiOB by sucking in air. The trace slider rail 61 extends in the Y-axis direction and is mounted on the frame 24. The trace slider rail 61 is positioned to the left of the vibration isolation table unit 23.

[0059] The trace slider 55 moves along the trace slider rail 62. The trace slider 55 takes AWG from a magazine, which is an example of a container located in the magazine elevator 72, transports it, and hands it over to the transport robot 52. For example, the trace slider 55 holds the AWG by suctioning air. The trace slider rail 62 extends in the Y-axis direction and is mounted on the frame 24. The trace slider rail 62 is located to the right of the vibration isolation table unit 23. The trace slider rails 61 and 62 are positioned to sandwich the vibration isolation table unit 23 on both sides. That is, the trace sliders 54 and 55 move to sandwich the vibration isolation table unit 23 on both sides.

[0060] Specifically, the transport robot 52 and the tray slider 55 take out the AWG stored in the magazine, which is an example of the first container, transport the taken-out AWG, and place it on the holding surface 111. The transport robot 51 and the tray slider 54 take out the SiOB stored in the magazine, which is an example of the second container, transport the taken-out SiOB, and place it on the holding surface 112.

[0061] The trace slider 56 moves along the trace slider rail 63. The trace slider 56 receives and transports an optical transceiver from the transport robot 52 and places the optical transceiver in a magazine located in a magazine elevator 73, which is an example of a container. For example, the trace slider 56 attracts and holds the optical transceiver by sucking in air. The trace slider rail 63 extends in the Y-axis direction and is mounted on the frame 24. The trace slider rail 63 is positioned to the right of the trace slider rail 62.

[0062] In this way, the tray slider 56 and the transport robot 52 take out an optical transceiver, which is an example of an optical device in which AWG and OSIB are fixed, transport the taken-out optical transceiver, and store it in a container.

[0063] Magazine elevator 71 stores the magazine containing the SiOB and moves the magazine vertically. Magazine elevator 72 stores the magazine containing the AWG and moves the magazine vertically. Magazine elevator 73 stores the magazine containing the optical transceiver and moves the magazine vertically.

[0064] The displacement meter 57 measures displacement, for example, by irradiating a laser beam and receiving the reflected laser beam. The displacement meter 57 measures the displacement of the base plate 41 of the vibration isolation table unit 23. More specifically, the displacement meter 57 measures the displacement of the base plate 41 of the vibration isolation table unit 23 in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. The displacement meter 57 can also be a non-contact type, such as a laser type or LED type optical type, an eddy current type, or an ultrasonic type. Furthermore, the displacement meter 57 may be a proximity type or a contact type. In other words, the displacement meter 57 is an example of a detection means, and it detects the vibration of the vibration isolation table unit 23 based on the displacement of the vibration isolation table unit 23 relative to the frame 24.

[0065] Camera 58 is mounted on the transport robot 52. When the oscillation of the base plate 41, determined from the displacement of the base plate 41 measured by the displacement meter 57, is less than a predetermined threshold, camera 58 captures an image to measure the position of the holding surface 111 of the centering stage 21-1 or centering stage 21-2, specifically the holding surface 111 for holding the AWG, or the holding surface 112 for holding the SiOB. Since camera 58 is mounted on the transport robot 52, it captures an image of the holding surface 111 or holding surface 112 of the centering stage 21-1 or centering stage 21-2 from above. Note that camera 58 may also be mounted on the transport robot 51. Thus, if the shaking of the base plate 41, determined from the displacement of the base plate 41 measured by the displacement meter 57, is less than a predetermined threshold, the camera 58 captures an image to measure the position of the holding surface 111 of the stage 101, which is the holding surface 111 for holding the AWG, or the holding surface 112 of the stage 102, which is the holding surface 112 for holding the SiOB. In other words, the camera 58 is an example of a first imaging means, and is provided at a position to image the holding surface 111 and the holding surface 112, and images the holding surface 111 or the holding surface 112 when the detected shaking is less than a predetermined threshold.

[0066] As shown in Figure 3, the alignment stage 21-1 is equipped with a probe unit 81-1 and an ultraviolet irradiator 82-1. The alignment stage 21-2 is equipped with a probe unit 81-2 and an ultraviolet irradiator 82-2. The probe unit 81-1 brings a probe, which is a needle for supplying power, into contact with the SiOB held on the holding surface 112 of the stage 102 of the alignment stage 21-1. When power is supplied from the probe to the SiOB in contact with it, the SiOB emits light.

[0067] The ultraviolet irradiator 82-1 irradiates the adhesive with ultraviolet light to cure it after the silicon bisectum (SiOB) held on the holding surface 112 of the stage 102 of the alignment stage 21-1, which has adhesive applied to its coating surface, and the AWG held on the holding surface 111 of the stage 101 of the alignment stage 21-1 have been aligned.

[0068] The probe unit 81-2 brings its probe, which is a needle for supplying power, into contact with the silicon ion battery (SiOB) held on the holding surface 112 of the stage 102 of the alignment stage 21-2. When power is supplied from the probe to the OCB in contact with it, the OCB emits light.

[0069] The ultraviolet irradiator 82-2 irradiates the adhesive with ultraviolet light to cure it after the silicon bisectum (SiOB) held on the holding surface 112 of the stage 102 of the alignment stage 21-2, which has adhesive applied to its coating surface, and the AWG held on the holding surface 111 of the stage 101 of the alignment stage 21-2 have been aligned.

[0070] Hereafter, when it is not necessary to distinguish between probe unit 81-1 and probe unit 81-2 individually, they will simply be referred to as probe unit 81. Similarly, when it is not necessary to distinguish between ultraviolet irradiator 82-1 and ultraviolet irradiator 82-2 individually, they will simply be referred to as ultraviolet irradiator 82.

[0071] In this way, the probe unit 81 drives the SiOB held in the stage 102.

[0072] Here, the control device 35 will be described with reference to Figures 6 and 7. Figure 6 is a diagram showing an example of the hardware configuration of the control device 35. In the control device 35, which is a computer, the CPU (Central Processing Unit) 201, ROM (Read-only memory) 202, and RAM (Random access memory) 203 are interconnected by a bus 204.

[0073] An input / output interface 205 is further connected to the bus 204. The input / output interface 205 is connected to an input unit 206 that receives predetermined data and signals from a coating camera 26, a 3D displacement meter 27, an autofocus camera 28, a displacement meter 57, a camera 58, etc., an output unit 207 that outputs signals such as predetermined commands and data such as coordinate values ​​to a centering stage 21, a coating syringe 25, an inspection slider 29, a probe unit 81, an ultraviolet irradiator 82, a transport robot 51, a transport robot 52, a tray slider 54, a tray slider 55, a tray slider 56, etc., a storage unit 208 consisting of non-volatile memory such as a hard disk or SSD (Solid State Drive), a communication unit 209 consisting of a network interface, etc., and a drive 210 that drives removable media 211 such as a magnetic disk, an optical disk, a magneto-optical disk, or a semiconductor memory. The output unit 207 supplies signals to the coating camera 26, the 3D displacement meter 27, the autofocus camera 28, the displacement meter 57, or the camera 58 to command and control imaging or measurement.

[0074] In the control device 35 configured as described above, the CPU 201 loads, for example, a program stored in the memory unit 208 into the RAM 203 via the input / output interface 205 and the bus 204, and executes it, thereby performing a series of processes described later.

[0075] The programs executed by the computer (CPU 201) are recorded on removable media 211, which is a package media consisting of, for example, magnetic disks (including flexible disks), optical disks (CD-ROM (Compact Disc-Read Only Memory), DVD (Digital Versatile Disc), etc.), magneto-optical disks, or semiconductor memory, or provided via wired or wireless transmission media such as local area networks, the internet, or digital satellite communications.

[0076] The program can be installed on a computer by inserting the removable media 211 into the drive 210 and storing it in the storage unit 208 via the input / output interface 205. Alternatively, the program can be received by the communication unit 209 via a wired or wireless transmission medium and stored in the storage unit 208, thereby installing it on a computer. Furthermore, the program can be pre-installed on a computer by pre-storing it in the ROM 202 or the storage unit 208.

[0077] Furthermore, the CPU 201 is not limited to one; multiple CPUs can be provided. In other words, the program described below will be executed on one or more computers. In addition, the output unit 207 may have a built-in motor driver to directly drive the alignment stage 21, coating syringe 25, inspection slider 29, probe unit 81, ultraviolet irradiator 82, transport robot 51, transport robot 52, tray slider 54, tray slider 55, tray slider 56, etc., or it may output a signal to an external motor driver to command it to drive, thereby indirectly controlling the alignment stage 21, coating syringe 25, inspection slider 29, probe unit 81, ultraviolet irradiator 82, transport robot 51, transport robot 52, tray slider 54, tray slider 55, tray slider 56, etc.

[0078] Figure 7 is a block diagram showing an example of the configuration of functions realized by the control device 35 that executes the program. When the control device 35 executes the program, the following functions are realized: the tray slider drive control unit 221, the transport robot drive control unit 222, the inspection slider drive control unit 223, the vibration isolation table displacement measurement control unit 224, the stage holding surface imaging camera control unit 225, the counter 226, the number of aligned devices determination unit 227, the alignment stage control unit 228, the coating camera imaging control unit 229, the displacement meter control unit 230, the autofocus camera imaging control unit 231, and the syringe control unit 232.

[0079] The tray slider drive control unit 221 controls the drive of the tray sliders 54, 55, and 56, respectively. The transport robot drive control unit 222 controls the drive of the transport robots 51 and 52, respectively. The inspection slider drive control unit 223 controls the drive of the inspection slider 29 on the inspection slider rail 30. The vibration isolation table displacement measurement control unit 224 controls the displacement meter 57 and acquires data from the displacement meter 57 indicating the displacement of the base plate 41 of the vibration isolation table unit 23. The vibration isolation table displacement measurement control unit 224 includes a determination unit 241. The determination unit 241 determines whether the vibration of the base plate 41, which is determined from the displacement of the base plate 41 measured by the displacement meter 57, has become smaller than a predetermined threshold. The vibration isolation table displacement measurement control unit 224 can also be said to detect the vibration of the vibration isolation table unit 23 based on the displacement of the vibration isolation table unit 23 relative to the frame 24, using the displacement of the vibration isolation table unit 23 measured by the displacement meter 57.

[0080] The stage holding surface imaging camera control unit 225 controls the imaging of the camera 58, causing the camera 58 to capture an image of the holding surface 111 or the holding surface 112 of the alignment stage 21. The stage holding surface imaging camera control unit 225 includes an image processing unit 251 and a position calculation unit 252. The image processing unit 251 processes the image captured by the camera 58 to determine the position of the holding surface 111 or the holding surface 112 of the alignment stage 21 in the image. The position calculation unit 252 calculates the position of the holding surface 111 or the actual position of the holding surface 112 of the alignment stage 21 in the assembly apparatus 11 from the position of the camera 58 that captured the image and the position of the holding surface 111 or the holding surface 112 of the alignment stage 21 in the captured image. In other words, the position calculation unit 252 calculates the position of the referenced holding surface 112 when the transport robot 51 places the OSIB on the holding surface 112, or the position of the referenced holding surface 111 when the transport robot 52 places the AWG on the holding surface 111.

[0081] The counter 226 holds a value that counts the number of silicon byte (SiOB) that are aligned and fixed to one AWG. The aligned device count determination unit 227 refers to the value of the counter 226 and determines whether a predetermined number of silicon byte (SiOB) have been aligned and fixed to one AWG.

[0082] The alignment stage control unit 228 controls the alignment stage 21. The alignment stage control unit 228 includes a slider drive control unit 261, a stage drive control unit 262, an optical fiber placement control unit 263, a probe control unit 264, an alignment processing unit 265, and an ultraviolet irradiation control unit 266. The slider drive control unit 261 controls the drive of the alignment stage 21 on the stage rail 53. The stage drive control unit 262 controls the drive to displace the stages 101 and 102. The stage drive control unit 262 also controls the holding of AWG or SiOB on the holding surface 111 of the stage 101 or the holding surface 112 of the stage 102. Furthermore, the stage drive control unit 262 controls the rotation of the stage 102 with the X axis as the axis of rotation.

[0083] The optical fiber placement control unit 263 controls the operation of the stage 103 to position the optical fiber so that its optical axis aligns with the output optical axis of the AWG placed on the holding surface 111 of the stage 101. The probe control unit 264 controls the displacement of the probe unit 81, which contacts the silicon optic cable (SiOB) held on the holding surface 112 of the stage 102 of the alignment stage 21 with a probe that supplies power. The probe control unit 264 also controls the supply of power to the OCB through the probe by the probe unit 81.

[0084] The alignment processing unit 265 aligns the AWG held on the holding surface 111 and the SiOB held on the holding surface 112 by displacing the relative positions of the holding surface 111 and the holding surface 112. More specifically, for example, the alignment processing unit 265 measures the power of the light emitted from the emitting SiOB through the AWG and displaces the relative positions of the holding surface 111 and the holding surface 112 so that the light power is maximized, thereby adjusting the relative positions of the AWG held on the holding surface 111 and the SiOB held on the holding surface 112. The ultraviolet irradiation control unit 266 controls the ultraviolet irradiator 82 to displace the ultraviolet irradiator 82 and irradiate the ultraviolet irradiator 82 with ultraviolet light. By irradiating the ultraviolet irradiator 82 with ultraviolet light, the ultraviolet irradiation control unit 266 cures the adhesive applied to the coated surface of the SiOB and also applied to the AWG by alignment.

[0085] The coating camera image control unit 229 controls the image acquisition by the coating camera 26 to measure the position of the coated surface of the SiOB. The coating camera image control unit 229 also controls the image acquisition by the coating camera 26 of the coated surface of the SiOB to which adhesive has been applied. The coating camera image control unit 229 includes an image processing unit 271, a position calculation unit 272, and an adhesive application confirmation unit 273. The image processing unit 271 processes the image acquired by the coating camera 26 to determine the position of the coated surface of the SiOB in the image. The position calculation unit 272 calculates the position of the coated surface of the SiOB in the assembly apparatus 11 from the position of the coating camera 26 that acquired the image and the position of the coated surface of the SiOB in the acquired image. That is, the position calculation unit 272 calculates the position of the coated surface of the SiOB to be referenced when the coating syringe 25 applies adhesive to the coated surface of the SiOB. The adhesive application confirmation unit 273 checks whether or not adhesive has been applied to the coated surface of the SiOB from the image of the coated surface of the SiOB to which adhesive has been applied, as captured by the coating camera 26.

[0086] The displacement sensor control unit 230 controls the measurement of the displacement of the position of the coated surface of the SiOB using the three-dimensional displacement sensor 27. The displacement sensor control unit 230 includes a position calculation unit 281 and an adhesive volume calculation unit 282. The position calculation unit 281 calculates the position of the coated surface of the SiOB in the assembly apparatus 11 from the measurement results of the three-dimensional displacement sensor 27. That is, when the application syringe 25 applies adhesive to the coated surface of the SiOB, the position calculation unit 281 calculates the position of the coated surface of the SiOB that is referenced. The adhesive volume calculation unit 282 calculates the position of the surface of the adhesive applied to the coated surface of the SiOB and the volume of the adhesive from the measurement results of the three-dimensional displacement sensor 27.

[0087] The autofocus camera image control unit 231 controls the acquisition of images by the autofocus camera 28 to measure the positions of the AWG held on the holding surface 111 and the OSIB held on the holding surface 112. The autofocus camera image control unit 231 includes an image processing unit 291 and a position calculation unit 292. The image processing unit 291 processes the image captured by the autofocus camera 28 to determine the positions of the AWG and OSIB in the image. The position calculation unit 292 calculates the positions of the AWG and OSIB in the assembly apparatus 11 from the position of the autofocus camera 28 that captured the image and the positions of the AWG and OSIB in the captured image. That is, when the position calculation unit 292 corrects the gap between the opposing surfaces of the AWG held on the holding surface 111 and the OSIB held on the holding surface 112, it calculates the referenced positions of the AWG and OSIB.

[0088] The syringe control unit 232 controls the application of adhesive by the application syringe 25. Specifically, the syringe control unit 232 controls the amount (volume) of adhesive dropped onto the SiOB held on the holding surface 112 by controlling the displacement of the piston of the application syringe 25.

[0089] Next, the assembly operation by the assembly device 11 will be described. Figure 8 is a flowchart illustrating the assembly process. The method of assembling the optical device by the assembly device 11 is also a method of manufacturing the optical device.

[0090] In step S11, the trace slider drive control unit 221 and the transport robot drive control unit 222 control the trace slider 55 and the transport robot 52, respectively, to remove the AWG from the magazine in the magazine elevator 72 and transport it to the vicinity of the alignment stage 21. Specifically, the trace slider drive control unit 221 controls the trace slider 55 to remove the AWG from the magazine located in the magazine elevator 72, transport it, and hand it over to the transport robot 52. The transport robot drive control unit 222 controls the transport robot 52 to receive the AWG transported by the trace slider 55 and transport the AWG to the vicinity of the alignment stage 21.

[0091] In step S12, the slider drive control unit 261 of the alignment stage control unit 228 controls the alignment stage 21 to move it to the position where the AWG will be placed. In this case, the slider drive control unit 261 of the alignment stage control unit 228 moves the alignment stage 21 to the underside of the transport robot rail 50.

[0092] In step S13, the inspection slider drive control unit 223 controls the inspection slider 29 to move it toward the alignment stage 21 on which the AWG is placed, which is either the alignment stage 21-1 or the alignment stage 21-2.

[0093] In step S14, the vibration isolation table displacement measurement control unit 224 operates the displacement meter 57 to measure the displacement of the base plate 41 of the vibration isolation table unit 23, and acquires the signal supplied from the displacement meter 57 to obtain data indicating the displacement of the base plate 41 of the vibration isolation table unit 23. In other words, the displacement meter 57 measures the displacement of the base plate 41 of the vibration isolation table unit 23. In this case, it can be said that the vibration of the vibration isolation table unit 23 is detected based on the displacement of the vibration isolation table unit 23 by the displacement meter 57. In step S15, the determination unit 241 of the vibration isolation table displacement measurement control unit 224 determines whether the vibration of the base plate 41, which is obtained from the data indicating the displacement of the base plate 41, is smaller than a predetermined threshold. For example, the vibration of the base plate 41 is obtained from the range of displacement of the base plate 41 over a predetermined period, such as 1 second. In step S15, if it is determined that the vibration of the base plate 41 is not smaller than the predetermined threshold, the procedure returns to step S14, and the measurement and determination of the displacement of the base plate 41 are repeated.

[0094] In step S15, if it is determined that the vibration of the base plate 41 is smaller than a predetermined threshold, the procedure proceeds to step S16, where the stage holding surface imaging camera control unit 225 controls the camera 58 to image the holding surface 111 of the alignment stage 21 for holding the AWG. That is, the camera 58 captures an image to measure the position of the holding surface 111 of the alignment stage 21 for holding the AWG. In other words, if the vibration of the base plate 41, which is determined from the displacement of the base plate 41 measured by the camera 58, is smaller than a predetermined threshold, an image is captured to measure the position of the holding surface 111 of the stage 101, which is the holding surface 111 for holding the AWG.

[0095] In step S17, the image processing unit 251 and position calculation unit 252 of the stage holding surface imaging camera control unit 225 determine the position of the holding surface 111 of the alignment stage 21 for holding the AWG from the captured image. More specifically, the image processing unit 251 processes the image captured in step S16 to determine the position of the holding surface 111 of the alignment stage 21 in the image. The position calculation unit 252 calculates the position of the holding surface 111 of the alignment stage 21 in the assembly apparatus 11 from the position of the camera 58 in step S16 and the position of the holding surface 111 of the alignment stage 21 in the captured image. That is, the position of the holding surface 111 of the stage 101 is calculated from the image captured in step S16.

[0096] In step S18, the transport robot drive control unit 222 controls the transport robot 52 to place the AWG held by the transport robot 52 onto the holding surface 111 of the alignment stage 21, referring to the position of the holding surface 111 of the alignment stage 21, which was calculated in step S17. That is, the transport robot 52 places the AWG onto the holding surface 111 of the stage 101, referring to the position of the holding surface 111 calculated in step S17. Also, in steps S11 and S18, the tray slider 55 and the transport robot 52 take out the AWG stored in the magazine, which is an example of a first container and is located in the magazine elevator 72, transport the taken-out AWG, and place it on the holding surface 111.

[0097] In step S19, the optical fiber placement control unit 263 of the alignment stage control unit 228 controls the stage 103 to position the optical fiber so that its optical axis aligns with the output optical axis of the AWG placed on the holding surface 111 of the stage 101. The optical fiber is connected to an optical power meter (not shown).

[0098] In step S20, counter 226, which holds a value counting the number of SiOBs aligned and fixed to one AWG, is cleared. In step S21, the process of placing the SiOBs onto the stage is performed. Details of the SiOB placement process will be described later. In step S22, the process of positioning and fixing the SiOBs onto the AWG is performed. Details of the positioning and fixing process of the SiOBs onto the AWG will be described later.

[0099] In step S23, the aligned device count determination unit 227 refers to the value of the counter 226 to determine whether a predetermined number of OSIBs have been fixed to the AWG. If it is determined in step S23 that a predetermined number of OSIBs have not been fixed to the AWG, the procedure returns to step S21, and the process of placing the OSIBs on the stage and positioning and fixing the OSIBs to the AWG is repeated.

[0100] In step S23, if it is determined that a predetermined number of silicon optics (SiOBs) have been fixed to the AWG, the procedure proceeds to step S24, as the optical transceiver, which is an optical device, is now complete with the AWG and the predetermined number of silicon optics. The optical fiber placement control unit 263 of the alignment stage control unit 228 controls the stage 103 to retract the optical fibers from the AWG (optical transceiver) placed on the holding surface 111 of the stage 101.

[0101] In step S25, the transport robot drive control unit 222 controls the transport robot 52 to pick up the optical transceiver placed on the holding surface 111 of the stage 101. In step S26, the tray slider drive control unit 221 controls the tray slider 56 to receive the optical transceiver from the transport robot 52, transport it, and place the optical transceiver in the magazine located in the magazine elevator 73, thus completing the assembly process. In steps S25 and S26, the transport robot 52 and the tray slider 56 remove the optical transceiver with the AWG and SiOB fixed in their relative positions, transport the removed optical transceiver, and store it in the tray of the magazine elevator 73, which is an example of a container.

[0102] Next, the details of the process of placing the SiOB onto the stage will be explained with reference to the flowchart in Figure 9. In step S41, the tray slider drive control unit 221 and the transport robot drive control unit 222 control the tray slider 54 and the transport robot 51, respectively, to remove the SiOB from the magazine in the magazine elevator 71 and transport it to the vicinity of the alignment stage 21. Specifically, the tray slider drive control unit 221 controls the tray slider 54 to remove the SiOB from the magazine located in the magazine elevator 71, transport it, and hand it over to the transport robot 51. The transport robot drive control unit 222 controls the transport robot 51 to receive the SiOB transported by the tray slider 54 and transport the SiOB to the vicinity of the alignment stage 21.

[0103] In step S42, the slider drive control unit 261 of the alignment stage control unit 228 controls the alignment stage 21 to move it to the position where the SiOB will be placed. In this case, the slider drive control unit 261 of the alignment stage control unit 228 moves the alignment stage 21 to the underside of the transport robot rail 50.

[0104] In step S43, the inspection slider drive control unit 223 controls the inspection slider 29 to move it toward the alignment stage 21 on which the SiOB is placed, which is either the alignment stage 21-1 or the alignment stage 21-2.

[0105] In step S44, the vibration isolation table displacement measurement control unit 224 operates the displacement meter 57 to measure the displacement of the base plate 41 of the vibration isolation table unit 23, and acquires the signal supplied from the displacement meter 57 to obtain data indicating the displacement of the base plate 41 of the vibration isolation table unit 23. In other words, the displacement meter 57 measures the displacement of the base plate 41 of the vibration isolation table unit 23. In this case, it can be said that the vibration of the vibration isolation table unit 23 is detected based on the displacement of the vibration isolation table unit 23 by the displacement meter 57. In step S45, the determination unit 241 of the vibration isolation table displacement measurement control unit 224 determines whether the vibration of the base plate 41, which is determined from the data indicating the displacement of the base plate 41, is smaller than a predetermined threshold. In step S45, if it is determined that the vibration of the base plate 41 is not smaller than the predetermined threshold, the procedure returns to step S44, and the measurement and determination of the displacement of the base plate 41 are repeated.

[0106] In step S45, if it is determined that the vibration of the base plate 41 is less than a predetermined threshold, the procedure proceeds to step S46, where the stage holding surface imaging camera control unit 225 controls the camera 58 to image the holding surface 112 of the alignment stage 21 for holding the SiOB. That is, the camera 58 captures an image to measure the position of the holding surface 112 of the alignment stage 21 for holding the SiOB. In other words, if the vibration of the base plate 41, which is determined from the displacement of the base plate 41 measured by the camera 58, is less than a predetermined threshold, an image is captured to measure the position of the holding surface 112 of the stage 102, which is the holding surface 112 for holding the SiOB.

[0107] In step S47, the image processing unit 251 and position calculation unit 252 of the stage holding surface imaging camera control unit 225 determine the position of the holding surface 112 of the alignment stage 21 for holding the SiOB from the captured image. More specifically, the image processing unit 251 processes the image captured in step S46 to determine the position of the holding surface 112 of the alignment stage 21 in the image. The position calculation unit 252 calculates the position of the holding surface 112 of the alignment stage 21 in the assembly apparatus 11 from the position of the camera 58 in step S46 and the position of the holding surface 112 of the alignment stage 21 in the captured image. That is, the position of the holding surface 112 of the stage 102 is calculated from the image captured in step S46.

[0108] In step S48, the transport robot drive control unit 222 controls the transport robot 51 to place the SiOB it is holding onto the holding surface 112 of the alignment stage 21, referencing the position of the holding surface 112 of the alignment stage 21, which was calculated in step S47. That is, the transport robot 51 places the SiOB onto the holding surface 112 of the stage 102, referencing the position of the holding surface 112 calculated in step S47. Also, in steps S41 and S48, the tray slider 54 and the transport robot 51 take out the SiOB stored in the magazine, which is an example of a second container and is located in the magazine elevator 71, transport the taken-out SiOB, and place it on the holding surface 112. In step S49, the counter 226, which holds a value that counts the number of SiOBs that are aligned and fixed to one AWG, is incremented, the process of placing the SiOB onto the stage is completed, and the process returns to assembly.

[0109] Next, the details of the positioning and fixing process of the SiOB to the AWG will be described with reference to the flowchart in Figure 10. In step S61, the slider drive control unit 261 and the inspection slider drive control unit 223 of the alignment stage control unit 228 move the alignment stage 21 and the inspection slider 29 to positions where the AWG held on the holding surface 111 and the SiOB held on the holding surface 112 are aligned, respectively. That is, in steps S12, S42, and S61, the alignment stage 21 drives the stages 101 and 102 to either a position where the relative positions of the AWG and SiOB are adjusted, or a position where the AWG is placed on the holding surface 111 of the stage 101 or the SiOB is placed on the holding surface 112 of the stage 102.

[0110] In step S62, the stage drive control unit 262 of the centering stage control unit 228 displaces the stages 101 and 102 to correct their positions so that the relative inclination between the opposing surfaces of the AWG held on the holding surface 111 and the SiOB held on the holding surface 112 is reduced, specifically the inclination in the yaw direction.

[0111] When fixing an Oxide-Solid Fiber (SiOB) to an AWG, adhesive is applied to the Oxide-Solid Fiber side of the opposing surfaces of the AWG and Oxide-Solid Fiber. The gap between these opposing surfaces is adjusted, and after the AWG and Oxide-Solid Fiber are aligned, the adhesive is irradiated with ultraviolet light to cure it. Hereinafter, the surface of the Oxide-Solid Fiber to which the adhesive is applied will be referred to as the coated surface.

[0112] In step S63, the stage drive control unit 262 of the alignment stage control unit 228 displaces the stage 102 to displace the SiOB so that the coated surface of the SiOB faces upward. In step S64, the position of the coated surface of the SiOB is measured. Specifically, the coating camera imaging control unit 229 causes the coating camera 26 to capture an image for measuring the position of the coated surface. The image processing unit 271 processes the image captured by the coating camera 26 to determine the position of the coated surface of the SiOB in the image. The position calculation unit 272 calculates the position of the coated surface of the SiOB in the assembly apparatus 11 from the position of the coating camera 26 that captured the image and the position of the coated surface of the SiOB in the captured image. That is, the coating camera 26, which is provided on the vibration-isolated surface plate 41 of the vibration isolation table unit 23, captures an image for measuring the position of the coated surface, which is the surface of the SiOB held on the stage 102 to which adhesive for fixing the SiOB to AWG is applied.

[0113] Furthermore, in step S64, the displacement meter control unit 230 causes the three-dimensional displacement meter 27 to measure the displacement of the position of the coated surface of the SiOB. The position calculation unit 281 calculates the position of the coated surface of the SiOB in the assembly apparatus 11 from the measurement results by the three-dimensional displacement meter 27. That is, the three-dimensional displacement meter 27, which is installed on the vibration-isolated surface plate 41 of the vibration isolation table unit 23, measures the displacement of the coated surface, which is the surface of the SiOB held on the stage 102 to which the adhesive for fixing the SiOB to the AWG is applied.

[0114] In step S65, the syringe control unit 232 controls the application syringe 25 to apply adhesive by dropping adhesive onto the application surface of the SiOB held on the holding surface 112, referring to the position of the application surface of the SiOB calculated from the image or the position of the application surface of the SiOB calculated from the measured displacement. That is, the application syringe 25, which is provided on the vibration-isolated surface plate 41 of the vibration-isolated table unit 23, applies adhesive to the application surface of the SiOB by referring to the position of the application surface of the SiOB calculated from the image captured by the application camera 26. In addition, the application syringe 25, which is provided on the vibration-isolated surface plate 41 of the vibration-isolated table unit 23, applies adhesive to the application surface of the SiOB by referring to the measured displacement of the position of the application surface of the SiOB. Furthermore, when the coating syringe 25 applies adhesive to the coated surface of the SiOB, it may refer to either the position of the coated surface of the SiOB calculated from the image or the position of the coated surface of the SiOB calculated from the measured displacement, or it may refer to both the position of the coated surface of the SiOB calculated from the image and the position of the coated surface of the SiOB calculated from the measured displacement.

[0115] In step S66, the position and volume of the adhesive applied to the coated surface of the SiOB are measured. Specifically, the coating camera imaging control unit 229 causes the coating camera 26 to capture an image of the coated surface of the SiOB to which the adhesive has been applied. The adhesive application confirmation unit 273 checks whether or not adhesive has been applied to the coated surface of the SiOB from the image of the coated surface of the SiOB to which the adhesive has been applied, as captured by the coating camera 26. Alternatively, the image processing unit 271 may process the image captured by the coating camera 26 to determine the position of the adhesive in the image, and the adhesive application confirmation unit 273 may check whether or not adhesive has been applied to the coated surface of the SiOB by comparing the position of the adhesive in the image with the position of the coated surface of the SiOB. In other words, the coating camera 26 captures an image of the coated surface to which the adhesive has been applied.

[0116] Furthermore, in step S66, the displacement meter control unit 230 causes the three-dimensional displacement meter 27 to measure the displacement of the adhesive-coated surface of the SiOB. The adhesive volume calculation unit 282 calculates the surface position and volume of the adhesive applied to the SiOB surface from the measurement results of the three-dimensional displacement meter 27. In other words, the displacement of the surface of the adhesive applied to the coated surface is measured by the three-dimensional displacement meter 27.

[0117] In step S67, the stage drive control unit 262 of the centering stage control unit 228 displaces the stage 102 and displaces the SiOB so that the AWG and SiOB face each other. In other words, in this case, the position of the SiOB is returned to the corrected position in step S62.

[0118] In step S68, the autofocus camera image control unit 231 instructs the autofocus camera 28 to capture an image for measuring the position of the AWG held on the holding surface 111 of the stage 101 and the position of the OSIB held on the holding surface 112 of the stage 102. The image processing unit 291 processes the image captured by the autofocus camera 28 to determine the position of the AWG and the OSIB in the image. The position calculation unit 292 calculates the position of the AWG and the OSIB in the assembly apparatus 11 from the position of the autofocus camera 28 that captured the image and the position of the AWG and the OSIB in the captured image.

[0119] In step S69, the stage drive control unit 262 of the centering stage control unit 228 displaces the stages 101 and 102 by referring to the positions of the AWG and the OSIB in the assembly apparatus 11 determined in step S68, thereby correcting the positions of the AWG held on the holding surface 111 and the OSIB held on the holding surface 112. In this case, for example, the positions are corrected so that the relative inclination of the opposing surfaces of the AWG and OSIB becomes smaller. That is, when the relative positions of the AWG and OSIB are adjusted in step S69, the positions of the AWG and OSIB calculated from the image captured in step S68 are referred to.

[0120] In step S70, the probe control unit 264 of the alignment stage control unit 228 controls the probe unit 81 to displace it, causing the probe, which is a needle for supplying power, to come into contact with the silicon obstructor (SiOB) held on the holding surface 112 of the stage 102 of the alignment stage 21.

[0121] In step S71, the stage drive control unit 262 of the centering stage control unit 228 displaces the stages 101 and 102 by referring to the positions of the AWG and the SiOB in the assembly apparatus 11 determined in step S68, and corrects the gap between the opposing faces of the AWG held on the holding surface 111 and the SiOB held on the holding surface 112. In this case, for example, the stage drive control unit 262 displaces the stages 101 and 102 so that the distance between the AWG face facing the SiOB and the SiOB face facing the AWG is a predetermined value.

[0122] In step S72, the probe control unit 264 of the alignment stage control unit 228 controls the probe unit 81 to supply power to the silicon ion battery (SiOB) through the probe, causing the OCI to emit light. In other words, the probe unit 81 drives the OCI held in the stage 102.

[0123] In step S73, the alignment processing unit 265 controls the stage 101 or stage 102 to displace the position of the stage 101 or stage 102, and adjusts the three-dimensional position of the SiOB held on the holding surface 112 relative to the AWG held on the holding surface 111 so that the light output from the AWG held on the holding surface 111 is maximized. That is, the stage 101 or stage 102 displaces the AWG held on the holding surface 111 or the SiOB held on the holding surface 112 to adjust the relative position of the AWG and the SiOB.

[0124] In step S73, stage 103 transmits light incident from the SiOB to the AWG held by stage 101 and light emitted from the AWG, and when stage 101 or stage 102 adjusts the relative position between the AWG and the SiOB, the intensity of the light transmitted by stage 103 is referenced.

[0125] In step S74, the ultraviolet irradiation control unit 266 irradiates the adhesive applied to the SiOB coating surface and the AWG with ultraviolet light using the ultraviolet irradiator 82 to cure it. This fixes the SiOB to the AWG.

[0126] In step S75, the alignment processing unit 265 measures and inspects the intensity of the light output from the AWG.

[0127] In step S76, the probe control unit 264 of the alignment stage control unit 228 controls the probe unit 81 to stop the power supply, thereby stopping the emission of light from the SiOB, displacing the probe unit 81, retracting the probe from the SiOB, and completing the positioning and fixing process of the SiOB to the AWG, and returning to the assembly process.

[0128] Furthermore, in the alignment stage 21-1 and the alignment stage 21-2, some procedures of the assembly process can be executed in parallel. For example, while one of the alignment stage 21-1 or the alignment stage 21-2 is performing the process of placing the SiOB onto the stage, the other of the alignment stage 21-1 or the alignment stage 21-2 can perform the process of positioning and fixing the SiOB onto the AWG.

[0129] If the vibration of the base plate 41, determined from the displacement of the base plate 41 measured by the displacement gauge 57, is less than a predetermined threshold, the camera 58 captures an image to measure the position of the holding surface 111 of the stage 101, which is the holding surface 111 for holding the AWG, or the holding surface 112 of the stage 102, which is the holding surface 112 for holding the SiOB. This allows for more accurate measurement of the position of the holding surface 111 or the holding surface 112 without image blurring.

[0130] This allows for more precise placement of AWG on the holding surface 111, and also allows for more precise placement of SiOB on the holding surface 112.

[0131] Furthermore, because the image is not blurred, even if the holding surface 111 or the holding surface 112 is made smaller, the position of the holding surface 111 or the holding surface 112 can be measured with greater accuracy. Since the position of the holding surface 111 or the holding surface 112 can be measured with greater accuracy even if the holding surface 111 or the holding surface 112 is made smaller, a smaller AWG can be placed on a smaller holding surface 111, or a smaller SiOB can be placed on a smaller holding surface 112.

[0132] Compared to manually placing AWG or SiOB, the optical device can be assembled in a shorter time. Furthermore, because the AWG can be placed on the holding surface 111 with greater precision, and the SiOB can be placed on the holding surface 112 with greater precision, the possibility of failure in adjusting the relative position of the AWG and SiOB is reduced, and the range of adjustment is also reduced, thus allowing the optical device to be assembled in a shorter time.

[0133] Furthermore, when adjusting the relative position of the AWG and the SiOB, stages 101 and 102 are vibration-isolated, allowing for more precise adjustment of the relative position of the AWG and the SiOB.

[0134] In this way, smaller optical devices can be assembled in less time and with greater precision.

[0135] Thus, the assembly method using the assembly apparatus 11 is a manufacturing method for producing an optical transceiver by adjusting the relative positions of the AWG and the SiOB. A stage 101 that holds and displaces the AWG on the holding surface 111 and a stage 102 that holds and displaces the SiOB on the holding surface 112 are provided on a vibration isolation table unit 23 that isolates the frame 24 from vibration. A displacement meter 57 detects the vibration of the vibration isolation table unit 23 based on the displacement of the vibration isolation table unit 23, and a camera 58 provided at a position to image the holding surface 111 and the holding surface 112 captures an image of the holding surface 111 or the holding surface 112 when the detected vibration is smaller than a predetermined threshold, thereby acquiring a first image. The position of the holding surface 111 is calculated from the first image, and the transport robot 52 places the AWG on the holding surface 111 by referring to the calculated position of the holding surface 111. The position of the holding surface 112 of the stage 102 is calculated from the first image, and the transport robot 51 places the SiOB on the holding surface 112 by referring to the calculated position of the holding surface 112. The stage 101 displaces the AWG, and the stage 102 displaces the SiOB to adjust the relative positions of the AWG and the SiOB.

[0136] Stage 101 can be moved between an adjustment position where the relative positions of the AWG and the SiOB are adjusted and a position where the AWG is received from the transport robot 52, and Stage 102 can be moved between the adjustment position and a position where the SiOB is received from the transport robot 51.

[0137] In addition to stages 101 and 102 of the alignment stage 21-1, stages 101 and 102 of the alignment stage 21-2 can be provided. Stage 101 of the alignment stage 21-2 is an example of a third holding means. The holding surface 111 of stage 101 of the alignment stage 21-2 is an example of a third holding surface. Stage 102 of the alignment stage 21-2 is an example of a fourth holding means. The holding surface 112 of stage 102 of the alignment stage 21-2 is an example of a fourth holding surface.

[0138] Stage 101 of the alignment stage 21-2, which holds and displaces the AWG on the holding surface 111, and Stage 102 of the alignment stage 21-2, which holds and displaces the SiOB on the holding surface 112, are further provided on the vibration isolation table unit 23. When the vibration detected by the camera 58 is smaller than a predetermined threshold, the holding surface 111 of Stage 101 of the alignment stage 21-2 or the holding surface 112 of Stage 102 of the alignment stage 21-2 is imaged to acquire a second image, and the position of the holding surface 111 of Stage 101 of the alignment stage 21-2 is obtained from the second image. The system calculates the position of the holding surface 111, and the transport robot 52 places the AWG on the holding surface 111 by referring to the calculated position of the holding surface 111. The system then calculates the position of the holding surface 112 of the stage 102 of the alignment stage 21-2 from the second image, and the transport robot 51 places the SiOB on the holding surface 112 by referring to the calculated position of the holding surface 112. The system then uses the stage 101 of the alignment stage 21-2 to displace the AWG and the stage 102 of the alignment stage 21-2 to displace the SiOB, thereby adjusting the relative positions of the AWG and the SiOB.

[0139] When placing AWG on the holding surface 111 of stage 101, the transport robot 52 and the tray slider 55 can take out the AWG stored in a magazine, which is an example of a container located in the magazine elevator 72, transport the taken-out AWG, and place the AWG on the holding surface 111. When placing OSOB on the holding surface 112 of stage 102, the transport robot 51 and the tray slider 54 can take out the OSOB stored in a magazine, which is an example of a container located in the magazine elevator 71, transport the taken-out OSOB, and place the OSOB on the holding surface 112.

[0140] An autofocus camera 28 mounted on the vibration isolation table unit 23 captures a second image for measuring the position of the AWG held on the holding surface 111 and the position of the OSIB held on the holding surface 112. When adjusting the relative positions of the AWG and OSIB, the positions of the AWG and OSIB calculated from the second image can be referenced.

[0141] A coating camera 26, mounted on the vibration isolation table unit 23, captures an image of the coating surface, which is the surface of the SiOB held on the holding surface 112 to which adhesive for fixing the SiOB to the AWG is applied. Based on the captured image of the coating surface, the adhesive can be applied to the coating surface using a coating syringe 25, also mounted on the vibration isolation table unit 23.

[0142] The coating camera 26 can capture an image of the coated surface to which the adhesive has been applied.

[0143] A coating camera 26 mounted on the vibration isolation table unit 23 captures an image of the coated surface of the SiOB to detect the application position for the adhesive. A coating syringe 25 mounted on the vibration isolation table unit 23 applies the adhesive to the detected application position. A three-dimensional displacement meter 27 mounted on the vibration isolation table unit 23 can measure the shape of the applied adhesive.

[0144] The tray slider 56 and transport robot 52 can retrieve the optical transceiver with the AWG and OSIB fixed in their relative positions, transport the retrieved optical transceiver, and store it in the magazine located on the magazine elevator 73.

[0145] When the probe unit 81 drives the SiOB held on the holding surface 112, and the stage 103 transmits light incident from the SiOB to the AWG held on the holding surface 111 and emitted from the AWG to adjust the relative position between the AWG and the SiOB, the intensity of the transmitted light can be referenced by the stage 103.

[0146] Furthermore, the embodiments of the present invention are not limited to those described above, and various modifications are possible without departing from the spirit of the invention. [Explanation of Symbols]

[0147] 11 Assembly device, 21, 21-1 and 21-2 Alignment stage, 23 Vibration isolation table unit, 24 Stand, 25 Dispensing syringe, 26 Dispensing camera, 27 3D displacement sensor, 28 Autofocus camera, 29 Inspection slider, 30 Inspection slider rail, 35 Control device, 41 Surface plate, 50 Transport robot rail, 51 Transport robot, 52 Transport robot, 53-1 and 53-2 Stage rail, 54 Tray slider, 55 and 56 Tray slider, 57 Displacement sensor, 58 Camera, 61 to 63 Tray slider rail, 71 to 73 Magazine elevator, 81, 81-1 and 81-2 Probe unit, 82, 82-1 and 82-2 UV irradiator, 101 Stage, 102 Stage, 103 Stage, 111 Holding surface, 112 Holding surface, 201 CPU, 202 ROM, 203 RAM, 204 Bus, 205 Input / Output Interface, 206 Input Unit, 207 Output Unit, 208 Storage Unit, 209 Communication Unit, 210 Drive, 211 Removable Media, 221 Tray Slider Drive Control Unit, 222 Transport Robot Drive Control Unit, 223 Inspection Slider Drive Control Unit, 224 Vibration Isolation Table Displacement Measurement Control Unit, 225 Stage Holding Surface Imaging Camera Control Unit, 226 Counter, 227 Aligned Device Count Determination Unit, 228 Aligned Stage Control Unit, 229 Coating Camera Imaging Control Unit, 230 Displacement Meter Control Unit, 231 Autofocus Camera Imaging Control Unit, 232 Syringe Control Unit, 241 Determination Unit, 251 Image processing unit, 252 Position calculation unit, 261 Slider drive control unit, 262 Stage drive control unit, 263 Optical fiber placement control unit, 264 Probe control unit, 265 Alignment processing unit, 266 Ultraviolet irradiation control unit, 271 Image processing unit, 272 Position calculation unit, 273 Adhesive application confirmation unit, 281 Position calculation unit, 282 Adhesive volume calculation unit, 291 Image processing unit, 292 Position calculation unit

Claims

1. In a manufacturing method for producing an optical device by adjusting the relative positions of a first optical device and a second optical device, A first holding means for holding and displacing the first optical device on a first holding surface and a second holding means for holding and displacing the second optical device on a second holding surface are provided on a vibration isolation table that isolates the frame from vibration. The detection means detects the vibration of the vibration isolation table based on its displacement, A first imaging means, provided at a position for imaging the first and second holding surfaces, captures the first or second holding surface to acquire a first image when the detected shaking is smaller than a predetermined threshold. The position of the first holding surface is calculated from the first image. The first optical device is placed on the first holding surface by the first mounting means, with reference to the position of the first holding surface calculated by the first mounting means. The position of the second holding surface of the second holding means is calculated from the first image. The second optical device is placed on the second holding surface by the second mounting means, with reference to the calculated position of the second holding surface. The first holding means displaces the first optical device, and the second holding means displaces the second optical device, thereby adjusting the relative position of the first optical device and the second optical device. Manufacturing method.

2. In the manufacturing method described in claim 1, The first holding means is moved between an adjustment position in which the relative positions of the first optical device and the second optical device are adjusted, and a position in which the first optical device is received from the first mounting means. The second holding means is moved between the adjustment position and the position where the second optical device is received from the second mounting means. Manufacturing method.

3. In the manufacturing method described in claim 2, A third holding means for holding and displacing the first optical device on a third holding surface and a fourth holding means for holding and displacing the second optical device on a fourth holding surface are further provided on the vibration isolation table. When the shaking detected by the first imaging means is less than a predetermined threshold, the third or fourth holding surface is imaged to acquire a second image. The position of the third holding surface is calculated from the second image. The first optical device is placed on the third holding surface by the first mounting means, with reference to the position of the third holding surface calculated by the first mounting means. The position of the fourth holding surface is calculated from the second image. The second optical device is placed on the fourth holding surface by the second mounting means, with reference to the position of the fourth holding surface calculated by the second mounting means. The third holding means displaces the first optical device, and the fourth holding means displaces the second optical device, thereby adjusting the relative position of the first optical device and the second optical device. Manufacturing method.

4. In the manufacturing method described in claim 1, When the first optical device is placed on the first holding surface, the first placing means removes the first optical device stored in the first container, transports the removed first optical device, and places the first optical device on the first holding surface. When placing the second optical device on the second holding surface, the second placing means removes the second optical device stored in the second container, transports the removed second optical device, and places the second optical device on the second holding surface. Manufacturing method.

5. In the manufacturing method described in claim 1, A second imaging means provided on the vibration isolation table captures a second image for measuring the position of the first optical device held on the first holding surface and the position of the second optical device held on the second holding surface. When adjusting the relative positions of the first optical device and the second optical device, the positions of the first optical device and the second optical device calculated from the second image are referenced. Manufacturing method.

6. In the manufacturing method described in claim 1, A second imaging means provided on the vibration isolation table captures an image of the coated surface of the second optical device held on the second holding surface, which is the surface to which adhesive for fixing the second optical device to the first optical device is applied. The adhesive is applied to the coated surface based on an image of the coated surface captured by the coating means provided on the vibration isolation table. Manufacturing method.

7. In the manufacturing method described in claim 6, The second imaging means captures an image of the coated surface to which the adhesive has been applied. Manufacturing method.

8. In the manufacturing method described in claim 1, The coating position detection means provided on the vibration isolation table is used to image the coating surface of the second optical device and detect the coating position for applying the adhesive. The adhesive is applied to the detected application position by the application means provided on the vibration isolation table. The shape of the applied adhesive is measured by a shape measuring means provided on the vibration isolation table. Manufacturing method.

9. In the manufacturing method described in claim 1, A manufacturing method comprising using a transport means to remove the optical device on which the first optical device and the second optical device, whose relative positions have been adjusted, are fixed, transporting the removed optical device, and storing it in a container.

10. In the manufacturing method described in claim 1, The driving means drives the second optical device held on the second holding surface, The light transmission means transmits light incident from the second optical device to the first optical device held on the first holding surface, and light emitted from the first optical device. When adjusting the relative positions of the first optical device and the second optical device, the intensity of the light transmitted by the light transmission means is referenced. Manufacturing method.

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