Coil components

Abstract

In a coil component where three coils are magnetically coupled to each other, the thickness in the stacking direction is reduced. [Solution] The coil component 1 comprises coil patterns 21-24 formed in the conductor layer M1, a terminal electrode 101 commonly connected to the outer peripheral ends of coil patterns 21 and 24, terminal electrodes 102 and 103 connected to the outer peripheral ends of coil patterns 22 and 23 respectively, a terminal electrode 104 commonly connected to the inner peripheral ends of coil patterns 21 and 24, and terminal electrodes 105 and 106 connected to the inner peripheral ends of coil patterns 22 and 23 respectively. Coil patterns 22 and 23 are arranged so as to be sandwiched radially between coil patterns 21 and 24. The pattern width of coil patterns 21 and 24 is narrower than the pattern width of coil patterns 22 and 23.

Description

[Technical Field]

[0001] The present disclosure relates to a coil component, and particularly to a coil component in which three coils are magnetically coupled to each other. [Background Art]

[0002] A common common-mode filter is a coil component in which two coils are magnetically coupled to each other, and is widely used for removing common-mode noise superimposed on a differential transmission line. However, in recent years, transmission lines having three lines as one set are sometimes used, and as a coil component for removing common-mode noise superimposed on such a transmission line, a coil component in which three coils are magnetically coupled to each other has been demanded.

[0003] As coil components in which three coils are magnetically coupled to each other, the coil components described in Patent Documents 1 to 3 are known. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent No. 7053535 [Patent Document 2] Japanese Patent No. 6879275 [Patent Document 3] Japanese Patent No. 7378015 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] In the coil components described in Patent Documents 1 to 3, the three coils are respectively arranged on different conductor layers. For this reason, the thickness in the lamination direction tends to increase.

[0006] In the present disclosure, a technique for reducing the thickness in the lamination direction in a coil component in which three coils are magnetically coupled to each other is described. [Means for solving the problem]

[0007] A coil component according to one aspect of the present disclosure comprises a plurality of conductor layers including at least a first conductor layer; first, second, third, and fourth coil patterns formed on the first conductor layer; a first terminal electrode commonly connected to the outer peripheral ends of the first and fourth coil patterns; second and third terminal electrodes connected to the outer peripheral ends of the second and third coil patterns, respectively; a fourth terminal electrode commonly connected to the inner peripheral ends of the first and fourth coil patterns; and fifth and sixth terminal electrodes connected to the inner peripheral ends of the second and third coil patterns, respectively. The second and third coil patterns are circumferentially sandwiched radially by the first and fourth coil patterns. The pattern widths of the first and fourth coil patterns are narrower than the pattern widths of the second and third coil patterns. [Effects of the Invention]

[0008] According to this disclosure, a technique is provided for reducing the thickness in the stacking direction of a coil component in which three coils are magnetically coupled to each other. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a substantially perspective view showing the appearance of a coil component 1 according to one embodiment of the present disclosure, and is an inverted view compared to the mounted state. [Figure 2] Figure 2 is a partial cross-sectional view illustrating the structure of coil layer 3. [Figure 3] Figure 3 is a plan view showing the pattern shape of the conductor pattern located in the conductor layer M1. [Figure 4] Figure 4 is a plan view showing the locations of vias provided in the insulating layer 12. [Figure 5] Figure 5 is a plan view showing the pattern shape of the conductor pattern located in the conductor layer M3. [Figure 6] Figure 6 is a plan view showing the locations of vias provided in the insulating layer 13. [Figure 7]Figure 7 is a plan view showing the pattern shape of the conductor pattern located in the conductor layer M2. [Figure 8] Figure 8 is a plan view showing the locations of vias provided in the insulating layer 14. [Figure 9] Figure 9 is a plan view showing the pattern shape of terminal electrodes 101 to 106. [Figure 10] Figure 10 is the equivalent circuit diagram of coil component 1. [Figure 11] Figure 11 is a schematic plan view illustrating the pattern shape of the circuit board 5 on which the coil component 1 is mounted. [Modes for carrying out the invention]

[0010] The embodiments of the technology described herein will be described in detail below with reference to the attached drawings.

[0011] Figure 1 is a substantially perspective view showing the appearance of a coil component 1 according to one embodiment of the present disclosure, and is an inverted view compared to the mounted state.

[0012] As shown in Figure 1, the coil component 1 according to this embodiment is a surface-mount type common-mode filter with a substantially rectangular parallelepiped shape, comprising a substrate 2, a coil layer 3 provided on the surface of the substrate 2, a resin layer 4 covering the coil layer 3, and six terminal electrodes 101 to 106 connected to the coil layer 3. The substrate 2 is made of a magnetic material such as ferrite or a non-magnetic material, and supports the coil layer 3 and plays a role in ensuring the mechanical strength of the coil component 1. If the substrate 2 is made of a magnetic material, the substrate 2 also functions as a magnetic path for the magnetic field generated by the coil layer 3. The resin layer 4 can also be made of a magnetic material or a non-magnetic material. If the resin layer 4 is made of a magnetic material, for example, a composite material in which magnetic powder made of a metallic magnetic material is dispersed in a binder resin, it functions as a magnetic path for the magnetic field generated by the coil layer 3. The resin layer 4 can also be omitted. The terminal electrodes 101 to 106 are each placed at the corners or edges of the coil component 1 and are embedded in the resin layer 4 so that their top and side surfaces are exposed.

[0013] The terminal electrodes 101 to 103 are provided along one long side extending in the X direction, and the terminal electrodes 104 to 106 are provided along the other long side extending in the X direction. Although not particularly limited, the terminal electrodes 101, 103, 104, and 106 are arranged at corners of the coil component 1. Therefore, these terminal electrodes 101, 103, 104, and 106 are exposed on three side surfaces of the coil component 1: an XY plane, an XZ plane, and a YZ plane. In contrast, the remaining terminal electrodes 102 and 105 are exposed on two side surfaces of the coil component 1: an XY plane and an XZ plane. Although not particularly limited, the terminal electrodes 101 to 106 are formed by a thick film plating method, and the thickness thereof is sufficiently greater than that of electrode patterns formed by sputtering or screen printing.

[0014] FIG. 2 is a partial cross-sectional view for explaining the structure of the coil layer 3.

[0015] As shown in FIG. 2, the coil layer 3 includes insulating layers 11 to 14 stacked in the Z direction, a conductor layer M1 positioned between the insulating layer 11 and the insulating layer 12 and embedded in the insulating layer 12, a conductor layer M2 positioned between the insulating layer 13 and the insulating layer 14 and embedded in the insulating layer 14, and a conductor layer M3 positioned between the insulating layer 12 and the insulating layer 13 and embedded in the insulating layer 13. In the example shown in FIG. 2, the conductor layers M1, M3, and M2 are stacked in this order. That is, the conductor layer M3 is positioned between the conductor layer M1 and the conductor layer M2. A plurality of conductor patterns are provided on the conductor layers M1 to M3, but the conductor pattern positioned in the conductor layer M3 is not shown in the cross-section shown in FIG. 2. The insulating layers 11 to 14 are made of an insulating material such as resin, for example. The conductor patterns provided on the conductor layers M1 to M3 are made of a good conductor such as copper (Cu), for example.

[0016] FIG. 3 is a plan view showing the pattern shape of a conductor pattern positioned in the conductor layer M1.

[0017] As shown in Figure 3, the conductor layer M1 is provided with spirally circulating coil patterns 21-24 and terminal patterns 40-49. Each of the coil patterns 21-24 circles approximately 1.5 turns. Within the same turn, coil pattern 21 is located on the outermost circumference, coil pattern 22 is the second outermost, coil pattern 23 is the third outermost, and coil pattern 24 is located on the innermost circumference. In other words, coil patterns 22 and 23 circulate so as to be sandwiched radially between coil patterns 21 and 24.

[0018] The outer edges of coil patterns 21-23 are connected to terminal patterns 41-43, respectively. Terminal patterns 41-43 are arranged in this order in the X direction. That is, terminal pattern 42 is located between terminal patterns 41 and 43. Terminal patterns 41-43 may be exposed from the edges of the conductor layer M1. The outer edge of coil pattern 24 is connected to terminal pattern 40. The inner edges of coil patterns 21 and 24 are commonly connected to terminal pattern 47. The inner edges of coil patterns 22 and 23 are connected to terminal patterns 48 and 49, respectively. Terminal patterns 47, 49, and 48 are arranged in this order in the X direction. That is, terminal pattern 49 is located between terminal patterns 47 and 48. Terminal patterns 44-46 are provided independently in the plane without being connected to other conductor patterns. Terminal patterns 44-46 are arranged in this order in the X direction. Terminal patterns 44-46 may be exposed from the edge of the conductor layer M1.

[0019] Figure 4 is a plan view showing the locations of vias provided in the insulating layer 12.

[0020] As shown in Figure 4, the insulating layer 12 is provided with vias 50-53 and 57-59 that expose the conductor layer M1. The vias 50-53 and 57-59 are positioned to expose terminal patterns 40-43 and 47-49, respectively.

[0021] Figure 5 is a plan view showing the pattern shape of the conductor pattern located in the conductor layer M3.

[0022] As shown in Figure 5, the conductor layer M3 is provided with connection patterns 31-35 and terminal patterns 60-67. Connection patterns 31-33 are connected to terminal patterns 47-49 located in the conductor layer M1 via vias 57-59 provided in the insulating layer 12. Connection pattern 34 connects terminal pattern 60 and terminal pattern 61. Connection pattern 35 connects terminal pattern 64 and terminal pattern 67. Terminal pattern 60 is connected to terminal pattern 40 located in the conductor layer M1 via via 50 provided in the insulating layer 12. Terminal patterns 61-63 are connected to terminal patterns 41-43 located in the conductor layer M1 via vias 51-53 provided in the insulating layer 12. As a result, the outer edges of coil pattern 21 and coil pattern 24 are connected via connection pattern 34. Terminal patterns 61-66 may be exposed from the edge of the conductor layer M2.

[0023] Figure 6 is a plan view showing the locations of vias provided in the insulating layer 13.

[0024] As shown in Figure 6, the insulating layer 13 is provided with vias 70-74 and 76-79 that expose the conductor layer M2. Vias 71-74 and 76 are provided at positions that expose terminal patterns 61-64 and 66, respectively. Via 70 is provided at a position that exposes terminal pattern 67. Vias 77-79 are provided at positions that expose terminal patterns 31-33, respectively.

[0025] Figure 7 is a plan view showing the pattern shape of the conductor pattern located in the conductor layer M2.

[0026] As shown in Figure 7, the conductor layer M2 is provided with spirally circulating coil patterns 25-28 and terminal patterns 80-89. Each of the coil patterns 25-28 circles approximately 1.5 turns. Within the same turn, coil pattern 25 is located on the outermost circumference, coil pattern 26 is the second outermost, coil pattern 27 is the third outermost, and coil pattern 28 is located on the innermost circumference. In other words, coil patterns 26 and 27 circulate so as to be sandwiched radially between coil patterns 25 and 28.

[0027] The outer edges of coil patterns 25-27 are connected to terminal patterns 84-86, respectively. Terminal patterns 84-86 are arranged in this order in the X direction. That is, terminal pattern 85 is located between terminal patterns 84 and 86. Terminal patterns 84-86 may be exposed from the edge of the conductor layer M2. The outer edge of coil pattern 28 is connected to terminal pattern 80. The inner edges of coil patterns 25 and 28 are commonly connected to terminal pattern 87. The inner edges of coil patterns 26 and 27 are connected to terminal patterns 88 and 89, respectively. Terminal patterns 87, 89, and 88 are arranged in this order in the X direction. That is, terminal pattern 89 is located between terminal patterns 87 and 88. Terminal patterns 81-83 are provided independently in the plane without being connected to other conductor patterns. Terminal patterns 81-83 are arranged in this order in the X direction. Terminal patterns 81-83 may be exposed from the edge of the conductor layer M2.

[0028] Terminal patterns 81-84 and 86 are connected to terminal patterns 61-64 and 66 located in the conductor layer M3 via vias 71-74 and 76 provided in the insulating layer 13. Terminal pattern 80 is connected to terminal pattern 67 located in the conductor layer M3 via via 70 provided in the insulating layer 13. Terminal patterns 87-89 are connected to connection patterns 31-33 located in the conductor layer M3 via vias 77-79 provided in the insulating layer 13. As a result, the outer periphery of coil pattern 25 and the outer periphery of coil pattern 28 are connected via connection pattern 35. In addition, the inner periphery of coil patterns 21 and 24 and the inner periphery of coil patterns 25 and 28 are connected via connection pattern 31. Furthermore, the inner periphery of coil pattern 22 and the inner periphery of coil pattern 26 are connected via connection pattern 32, and the inner periphery of coil pattern 23 and the inner periphery of coil pattern 27 are connected via connection pattern 33.

[0029] Figure 8 is a plan view showing the locations of vias provided in the insulating layer 14.

[0030] As shown in Figure 8, the insulating layer 14 is provided with vias 91 to 96 that expose the conductor layer M2. The vias 91 to 96 are positioned to expose terminal patterns 81 to 86, respectively.

[0031] Figure 9 is a plan view showing the pattern shape of terminal electrodes 101 to 106.

[0032] The terminal electrodes 101 to 106 shown in Figure 9 are connected to terminal patterns 81 to 86 located in the conductor layer M2 via vias 91 to 96 provided in the insulating layer 14. As a result, coil patterns 21 and 24 are connected in parallel between terminal electrode 101 and connection pattern 31, and coil patterns 25 and 28 are connected in parallel between terminal electrode 104 and connection pattern 31. Furthermore, coil pattern 22 is connected between terminal electrode 102 and connection pattern 32, and coil pattern 26 is connected between terminal electrode 105 and connection pattern 32. In addition, coil pattern 23 is connected between terminal electrode 103 and connection pattern 33, and coil pattern 27 is connected between terminal electrode 106 and connection pattern 33.

[0033] Figure 10 is an equivalent circuit diagram of the coil component 1 according to this embodiment.

[0034] As shown in Figure 10, between terminal electrodes 101 and 104, parallel-connected coil patterns 21 and 24 and parallel-connected coil patterns 25 and 28 are connected in series via a connection pattern 31, thereby forming inductor L1. Between terminal electrodes 102 and 105, coil patterns 22 and 26 are connected in series via a connection pattern 32, thereby forming inductor L2. Between terminal electrodes 103 and 106, coil patterns 23 and 27 are connected in series via a connection pattern 33, thereby forming inductor L3. The number of turns for inductors L1 to L3 is approximately 3 turns each. The coil component 1 according to this embodiment constitutes a 3-line common-mode filter circuit in which the three inductors L1 to L3 are magnetically coupled to each other.

[0035] Figure 11 is a schematic plan view illustrating the pattern shape of the circuit board 5 on which the coil component 1 is mounted.

[0036] The circuit board 5 shown in Figure 11 has a mounting area 6 on which the coil component 1 is mounted. The mounting area 6 is provided with land patterns 111 to 116, which correspond to terminal electrodes 101 to 106. When the coil component 1 is mounted on the mounting area 6, the terminal electrodes 101 to 106 and the land patterns 111 to 116 are electrically connected via solder.

[0037] The circuit board 5 is provided with signal lines 121 to 126 connected to land patterns 111 to 116. Of these, three lines of signal lines 121 to 123 constitute one set of wiring group 131, and three lines of signal lines 124 to 126 constitute one set of wiring group 132. Wiring group 131 is, for example, an input wiring group, and wiring group 132 is, for example, an output wiring group. The three signals transmitted by each wiring group 131 and 132 represent data by the potential difference between two signals. For example, in wiring group 131, data is represented by the relative magnitudes of the levels of signal line 121 and signal line 122, the relative magnitudes of the levels of signal line 121 and signal line 123, and the relative magnitudes of the levels of signal line 122 and signal line 123. The same applies to wiring group 132. Therefore, in this example, three bits of data can be transmitted at once. Furthermore, by inserting the coil component 1 according to this embodiment between the wiring group 131 and the wiring group 132, common-mode noise superimposed on the three signals can be removed.

[0038] As shown in Figure 2, coil patterns 21 and 22 are adjacent to each other via the insulating layer 12, coil patterns 22 and 23 are adjacent to each other via the insulating layer 12, and coil patterns 23 and 24 are adjacent to each other via the insulating layer 12. As a result, a stray capacitance C1 is generated between coil pattern 21 and coil pattern 22, a stray capacitance C2 is generated between coil pattern 22 and coil pattern 23, and a stray capacitance C3 is generated between coil pattern 23 and coil pattern 24. Therefore, if the space S1 between coil pattern 21 and coil pattern 22, the space S2 between coil pattern 22 and coil pattern 23, and the space S3 between coil pattern 23 and coil pattern 24 are made approximately the same, then the stray capacitances C1 to C3 will also be approximately the same. Furthermore, since coil patterns 21 and 24 constitute a single coil with their inner and outer ends short-circuited, the capacitance components generated between the coil consisting of coil patterns 21 and 24, the coil consisting of coil pattern 22, and the coil consisting of coil pattern 23 are approximately the same.

[0039] Similarly, coil patterns 25 and 26 are adjacent to each other via the insulating layer 14, coil patterns 26 and 27 are adjacent to each other via the insulating layer 14, and coil patterns 27 and 28 are adjacent to each other via the insulating layer 14. As a result, a stray capacitance C4 is generated between coil pattern 25 and coil pattern 26, a stray capacitance C5 is generated between coil pattern 26 and coil pattern 27, and a stray capacitance C6 is generated between coil pattern 27 and coil pattern 28. Therefore, if the space S4 between coil pattern 25 and coil pattern 26, the space S5 between coil pattern 26 and coil pattern 27, and the space S6 between coil pattern 27 and coil pattern 28 are made approximately the same, then the stray capacitances C4 to C6 will also be approximately the same. Furthermore, since coil patterns 25 and 28 constitute a single coil with their inner and outer ends short-circuited, the capacitance components generated between the coil consisting of coil patterns 25 and 28, the coil consisting of coil pattern 27, and the coil consisting of coil pattern 28 are approximately the same.

[0040] Furthermore, if the radial pattern widths of coil patterns 21 to 24 are W1 to W4, respectively, then pattern widths W1 and W4 are narrower than pattern widths W2 and W3. This reduces the difference between the DC resistance values ​​of the coils made up of coil patterns 21 and 24, the coil made up of coil pattern 22, and the coil made up of coil pattern 23. Pattern widths W1 and W4 may be the same. Pattern widths W2 and W3 may be the same. If pattern widths W1 and W4 are approximately half the widths W2 and W3, the difference between the DC resistance values ​​of the coils made up of coil patterns 21 and 24, the coil made up of coil pattern 22, and the coil made up of coil pattern 23 is further reduced. Furthermore, by making the pattern width W1 of the coil pattern 21 located on the outer circumference wider than the pattern width W4 of the coil pattern 24 located on the inner circumference, it is possible to reduce the difference in DC resistance values ​​caused by the difference in the line length between coil pattern 21 and coil pattern 24. For the same reason, by making the pattern width W2 of the coil pattern 22 located on the outer circumference wider than the pattern width W3 of the coil pattern 23 located on the inner circumference, it is possible to reduce the difference in DC resistance values ​​caused by the difference in the line length between coil pattern 22 and coil pattern 23.

[0041] Similarly, if the radial pattern widths of coil patterns 25 to 28 are W5 to W8, respectively, then pattern widths W5 and W8 are narrower than pattern widths W6 and W7. This reduces the difference between the DC resistance values ​​of the coils made up of coil patterns 25 and 28, the coil made up of coil pattern 26, and the coil made up of coil pattern 27. Pattern widths W5 and W8 may be the same. Pattern widths W6 and W7 may be the same. If pattern widths W5 and W8 are approximately half the widths W6 and W7, the difference between the DC resistance values ​​of the coils made up of coil patterns 25 and 28, the coil made up of coil pattern 26, and the coil made up of coil pattern 27 is further reduced. Furthermore, by making the pattern width W5 of the coil pattern 25 located on the outer circumference wider than the pattern width W8 of the coil pattern 28 located on the inner circumference, it is possible to reduce the difference in DC resistance values ​​caused by the difference in the line length between coil pattern 25 and coil pattern 28. For the same reason, by making the pattern width W6 of the coil pattern 26 located on the outer circumference wider than the pattern width W7 of the coil pattern 27 located on the inner circumference, it is possible to reduce the difference in DC resistance values ​​caused by the difference in the line length between coil pattern 26 and coil pattern 27.

[0042] Pattern widths W1 and W5 may be the same. Pattern widths W2 and W6 may be the same. Pattern widths W3 and W7 may be the same. Pattern widths W4 and W8 may be the same. Spaces S1 to S6 may be the same.

[0043] As shown in Figure 2, the distance Td in the Z direction (stacking direction) between conductor layer M1 and conductor layer M2 may be greater than one or both of the film thicknesses Ti1 and Ti4 of the insulating layers 11 and 14. Here, the film thickness Ti4 of insulating layer 14 is defined by the distance in the Z direction between the upper end surface of conductor layer M2 and the surface of insulating layer 14. By making the distance Td between conductor layer M1 and conductor layer M2 greater than one or both of the film thicknesses Ti1 and Ti4 of insulating layers 11 and 14, the stray capacitance generated between conductor layer M1 and conductor layer M2 is reduced, thereby improving high-frequency characteristics. Although the film thickness Ti1 of insulating layer 11, which is located at the bottom and is the base for conductor layer M1, and the film thickness Ti4 of insulating layer 14, which is located at the top, do not directly affect the stray capacitance generated between conductor layer M1 and conductor layer M2, designing these film thicknesses Ti1 and Ti4 to be thin reduces the overall thickness of coil component 1 in the Z direction and improves its magnetic properties.

[0044] Furthermore, the distance Td between conductor layer M1 and conductor layer M2 may be greater than the combined thickness of film thicknesses Ti1 and Ti4. This ensures a sufficient distance Td between conductor layer M1 and conductor layer M2, thereby further reducing the stray capacitance between conductor layer M1 and conductor layer M2. Moreover, the distance Td between conductor layer M1 and conductor layer M2 may be greater than the conductor thickness Tc1 of conductor layer M1 or the conductor thickness Tc2 of conductor layer M2. Since larger conductor thicknesses Tc1 of conductor layer M1 and Tc2 of conductor layer M2 result in larger stray capacitances C1 to C6, the conductor thicknesses Tc1 of conductor layer M1 and Tc2 of conductor layer M2 can be reduced by making them smaller than the distance Td between conductor layer M1 and conductor layer M2.

[0045] Furthermore, the balance of the line lengths between coil pattern 21 and coil pattern 24, and between coil pattern 25 and coil pattern 28, can also be adjusted by the position of connection pattern 31 (the position of terminal patterns 47 and 87). As shown in Figure 3, terminal pattern 47 (connection pattern 31) is placed in one of the sections 20 that connect position 21A, which is approximately 1.5 turns from the outer edge of coil pattern 21, and position 24A, which is approximately 1.5 turns from the outer edge of coil pattern 24. In the example shown in Figure 3, terminal pattern 47 is placed in the section 20 closer to position 24A, resulting in a longer line length between terminal pattern 47 and position 21A than between terminal pattern 47 and position 24A. Also, by arranging terminal patterns 47, 49, and 48 in this order, the direction of rotation of section 20 becomes the same as the direction of rotation of coil patterns 21 and 24, thereby increasing the inductance.

[0046] As explained above, in this embodiment, one of the three coils is divided into two coil patterns, and the remaining two coils are sandwiched between the two divided coil patterns, thereby reducing the difference in stray capacitance between the three coils. Moreover, since three coils (i.e., four coil patterns) are arranged in one conductor layer, it is also possible to reduce the overall thickness.

[0047] While embodiments of the technology described herein have been explained above, it goes without saying that the technology described herein is not limited to the embodiments described above, and various modifications are possible without departing from its spirit, and these modifications are also included within the scope of the technology described herein.

[0048] The technology relating to this disclosure includes, but is not limited to, the following configuration examples.

[0049] A coil component according to one aspect of the present disclosure comprises a plurality of conductor layers including at least a first conductor layer; first, second, third, and fourth coil patterns formed on the first conductor layer; a first terminal electrode commonly connected to the outer peripheral ends of the first and fourth coil patterns; second and third terminal electrodes connected to the outer peripheral ends of the second and third coil patterns, respectively; a fourth terminal electrode commonly connected to the inner peripheral ends of the first and fourth coil patterns; and fifth and sixth terminal electrodes connected to the inner peripheral ends of the second and third coil patterns, respectively. The second and third coil patterns are circumferentially sandwiched radially by the first and fourth coil patterns. The pattern widths of the first and fourth coil patterns are narrower than the pattern widths of the second and third coil patterns. This reduces the difference in stray capacitance between the coil made up of the first and fourth coil patterns, the coil made up of the second coil pattern, and the coil made up of the third coil pattern.

[0050] In the above coil component, the second terminal electrode may be located between the first and third terminal electrodes, and the inner circumference end of the third coil pattern may be located between the inner circumference ends of the first and fourth coil patterns and the inner circumference end of the second coil pattern. This increases the inductance of the first and fourth coil patterns.

[0051] The above coil component further comprises fifth, sixth, seventh, and eighth coil patterns formed in a second conductor layer included in a plurality of conductor layers, wherein the outer periphery ends of the fifth and eighth coil patterns are commonly connected to the fourth terminal electrode, the outer periphery ends of the sixth and seventh coil patterns are respectively connected to the fifth and sixth terminal electrodes, the inner periphery ends of the first and fourth coil patterns are commonly connected to the inner periphery ends of the fifth and eighth coil patterns, and the inner periphery ends of the second and third coil patterns are respectively connected to the inner periphery ends of the sixth and seventh coil patterns. This increases the number of turns of the three coils, making it possible to obtain a higher inductance.

[0052] The above coil component further comprises first, second, and third connection patterns formed on a third conductor layer included in a plurality of conductor layers, wherein the inner circumferential ends of the first and fourth coil patterns and the inner circumferential ends of the fifth and eighth coil patterns are connected via the first connection pattern, the inner circumferential ends of the second coil pattern and the inner circumferential ends of the sixth coil pattern are connected via the second connection pattern, and the inner circumferential ends of the third coil pattern and the inner circumferential ends of the seventh coil pattern are connected via the third connection pattern. This facilitates the connection between the first conductor layer and the second conductor layer.

[0053] The above coil component further comprises fourth and fifth connection patterns formed in the third conductor layer, wherein the outer periphery of the first coil pattern and the outer periphery of the fourth coil pattern are connected via the fourth connection pattern, and the outer periphery of the fifth coil pattern and the outer periphery of the eighth coil pattern may be connected via the fifth connection pattern. This allows the outer periphery of the first and fourth coil patterns to be connected to each other, as well as the outer periphery of the fifth and eighth coil patterns, without using a fourth conductor layer.

[0054] In the coil component described above, the third conductor layer may be located between the first conductor layer and the second conductor layer. This makes it possible to ensure a sufficient distance between the first and second conductor layers.

[0055] The above coil component further comprises a first insulating layer which is the base for the first conductor layer, a second insulating layer located between the first conductor layer and the third conductor layer, a third insulating layer located between the third conductor layer and the second conductor layer, and a fourth insulating layer which covers the third conductor layer, wherein the distance between the first conductor layer and the second conductor layer in the lamination direction may be greater than the thickness of at least one of the first and fourth insulating layers. This makes it possible to reduce the capacitance component that occurs between the first conductor layer and the second conductor layer.

[0056] In the above coil component, the distance between the first conductor layer and the second conductor layer in the stacking direction may be greater than the total thickness of the first and fourth insulating layers. This makes it possible to further reduce the capacitance component between the first conductor layer and the second conductor layer.

[0057] In the above coil component, the distance between the first conductor layer and the second conductor layer in the stacking direction may be greater than the conductor thickness of at least one of the first and second conductor layers. This makes it possible to reduce the stray capacitance that occurs between the first to fourth coil patterns, or between the fifth to eighth coil patterns. [Explanation of symbols]

[0058] 1. Coil component 2 circuit boards 3 coil layers 4 resin layer 5 Circuit board 6 Loading area 11-14 Insulating layer 20 sections 21-28 Coil Patterns 21A,24A position 31-35 Connection Patterns 40-49 Terminal Patterns 50-53, 57-59 Beer Terminal patterns 60-67 70-74, 76-79 Beer Terminal patterns 80-89 91-96 Beer 101~106 Terminal electrode 111-116 Land Pattern 121-126 Signal Wiring 131,132 wiring group C1~C6 Stray capacitance L1~L3 Inductors M1-M3 Conductor Layers S1~S6 Space Tc1, Tc2 Conductor thickness Td distance Ti1, Ti4 film thickness W1~W8 Pattern width

Claims

1. A plurality of conductor layers, including at least a first conductor layer, The first, second, third, and fourth coil patterns formed on the first conductor layer, A first terminal electrode is connected in common to the outer peripheral ends of the first and fourth coil patterns, The second and third terminal electrodes are connected to the outer peripheral ends of the second and third coil patterns, respectively. A fourth terminal electrode is connected in common to the inner circumferential ends of the first and fourth coil patterns, Fifth and sixth terminal electrodes connected to the inner circumferential ends of the second and third coil patterns, respectively, Equipped with, The second and third coil patterns are arranged so as to be sandwiched radially between the first and fourth coil patterns. The pattern widths of the first and fourth coil patterns are narrower than the pattern widths of the second and third coil patterns. Coil components.

2. The second terminal electrode is located between the first terminal electrode and the third terminal electrode. The inner circumferential end of the third coil pattern is located between the inner circumferential ends of the first and fourth coil patterns and the inner circumferential end of the second coil pattern. The coil component according to claim 1.

3. The system further comprises fifth, sixth, seventh, and eighth coil patterns formed on a second conductor layer included in the plurality of conductor layers, The outer ends of the fifth and eighth coil patterns are commonly connected to the fourth terminal electrode. The outer ends of the sixth and seventh coil patterns are connected to the fifth and sixth terminal electrodes, respectively. The inner ends of the first and fourth coil patterns are commonly connected to the inner ends of the fifth and eighth coil patterns. The inner ends of the second and third coil patterns are connected to the inner ends of the sixth and seventh coil patterns, respectively. The coil component according to claim 1.

4. The system further comprises first, second, and third connection patterns formed on a third conductor layer included in the plurality of conductor layers, The inner circumferential ends of the first and fourth coil patterns and the inner circumferential ends of the fifth and eighth coil patterns are connected via the first connection pattern. The inner circumferential end of the second coil pattern and the inner circumferential end of the sixth coil pattern are connected via the second connection pattern. The inner circumferential end of the third coil pattern and the inner circumferential end of the seventh coil pattern are connected via the third connection pattern. The coil component according to claim 3.

5. The third conductor layer further comprises fourth and fifth connection patterns formed therein. The outer peripheral end of the first coil pattern and the outer peripheral end of the fourth coil pattern are connected via the fourth connection pattern. The outer peripheral end of the fifth coil pattern and the outer peripheral end of the eighth coil pattern are connected via the fifth connection pattern. The coil component according to claim 4.

6. The third conductor layer is located between the first conductor layer and the second conductor layer. The coil component according to claim 4 or 5.

7. The first insulating layer is the base for the first conductor layer, A second insulating layer located between the first conductor layer and the third conductor layer, A third insulating layer located between the third conductor layer and the second conductor layer, A fourth insulating layer covering the third conductive layer, Furthermore, The distance between the first conductor layer and the second conductor layer in the stacking direction is greater than the thickness of at least one of the first and fourth insulating layers. The coil component according to claim 6.

8. The distance between the first conductor layer and the second conductor layer in the stacking direction is greater than the total thickness of the first and fourth insulating layers. The coil component according to claim 7.

9. The distance between the first conductor layer and the second conductor layer in the stacking direction is greater than the conductor thickness of at least one of the first and second conductor layers. The coil component according to claim 7.

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