Method and apparatus for manufacturing functional materials

Abstract

The objective is to provide a highly safe method for producing powder materials through a composite thin-film process of raw materials, which allows for the formation of powder without impairing the activity of the obtained materials and for removal from the manufacturing equipment. [Solution] A film is formed by CVD before or after the formation of the material thin film, and the material thin film and the CVD film are separated from the support simultaneously.

Description

Technical Field

[0001] The present disclosure relates to a method and an apparatus for producing a functional material using a vacuum film-forming method. In particular, the present disclosure relates to a method and an apparatus for producing powder composed of a functional material that is produced through a step of forming a composite thin film from raw materials. Background Art

[0002] Powder materials produced through a composite thin-film forming step of raw materials are used in various fields such as various energy devices including batteries, various ceramic devices, and carbon material devices, and are indispensable for many industrial products. For example, high-capacity secondary batteries such as lithium-ion batteries are widely used in many fields because of their high energy density and capability of repeated charging and discharging. Specifically, they are used in various fields including driving power sources for electric vehicles such as electric vehicles and hybrid vehicles, the mobility field such as drones, batteries for portable electronic devices such as smartphones and tablet terminals, and energy storage systems for efficiently storing and supplying electric power in conjunction with renewable energy such as photovoltaic power generation.

[0003] Various materials have been studied as negative electrode materials for high-capacity secondary batteries for the purpose of improving energy density. Among these, Si / C-based negative electrode materials have attracted significant attention because they combine the characteristics of silicon and carbon, overcome the problems of single silicon or single graphite to a certain extent, and exhibit high performance. Several methods have been proposed as methods for producing negative electrode materials.

[0004] Si (silicon) enables realization of high-capacity batteries because it has a very high theoretical capacity and a high lithium storage capacity. However, it repeatedly expands and contracts during charging and discharging, which causes a problem in that it leads to structural destruction.

[0005] Various methods have been employed to suppress expansion and contraction. For example, a method has been disclosed in which porous carbon fine powder is used, and silicon is deposited in the porous pores using thermal CVD (chemical vapor deposition) with silane (SiH4) gas to absorb the expanded volume (Patent Document 1).

[0006] Furthermore, a method for producing functional materials without using silane gas has also been disclosed. In this method, an ionic liquid is provided on the surface of a polymer film substrate, then a thin film of metal or a metal compound is formed to obtain a laminate, and the obtained laminate is heated to a point above the melting point of the ionic liquid to peel the ionic liquid and the thin film from the substrate, separating and recovering the ionic liquid and the thin film (Patent Document 2). [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Special Publication No. 2018-534720 [Patent Document 2] Japanese Patent Publication No. 2015-096628 [Overview of the project] [Problems that the invention aims to solve]

[0008] The method described in Patent Document 1 requires the use of silane gas. Silane gas is known to have extremely high flammability and the risk of explosion, as well as corrosiveness and toxicity, posing safety problems. Therefore, there is a need to develop a method that can achieve equivalent or better performance without using silane gas. Furthermore, the invention described in Patent Document 2 does not require the use of silane gas, but when separating the material thin film from the support, the active portion of the material thin film comes into rapid contact with oxygen and water molecules in the air, causing heat generation and material degradation. The object of the present invention is to provide a method for forming a powder without using silane gas and without impairing the activity of the obtained material during the manufacturing process, and for removing it from the manufacturing equipment. [Brief explanation of the drawing]

[0009] [Figure 1] This diagram schematically shows the configuration of the manufacturing apparatus for functional materials in Embodiment 1. [Figure 2] This flowchart shows an example of a method for producing a functional material in Embodiment 1. [Figure 3] This diagram schematically shows the configuration of the functional material manufacturing apparatus in Embodiment 2. [Figure 4] This flowchart shows an example of a method for producing a functional material in Embodiment 2. [Modes for carrying out the invention]

[0010] The following description focuses on functional powders used as negative electrode materials for high-capacity secondary batteries, particularly Si / C (silicon-carbon composite) negative electrode materials. However, the description is not limited to these. Functional powder materials formed through a composite thin-film process of raw materials can also be suitably used as materials for various energy devices, including batteries, various ceramic devices, and carbon material devices. Specifically, they can be used as manufacturing methods and equipment for hydrogen storage alloys and the like.

[0011] Here, "functional materials" refer to "laminated structures with functionality" manufactured through a composite thin-film formation process, and "powder with functionality" manufactured by crushing the laminate. Furthermore, since the laminate with functionality is used to manufacture powder, it is also called a material film or powder material. The following explanation will be accompanied by drawings, but the present invention is not limited to the following disclosures; the arrangement of the film-forming source can be changed, or the order of film formation can be rearranged to manufacture various materials. Also, when electrostatic deposition is performed using the carbon powder shown in the following examples, a film is not strictly formed. However, including these structures, the formed layered structure will be referred to here as a "film," the formed single layered structure will be referred to as a "film-forming structure," and the structure in which these are stacked will be referred to as a laminate. The process of forming a film, including the layered structure, is called the film-forming step.

[0012] [Embodiment 1] Figure 1 is a schematic diagram of a functional material manufacturing apparatus in Embodiment 1. It shows an apparatus for manufacturing functional materials by forming a laminate on a cylindrical can 110 that circulates in a vacuum chamber 100. An evaporation source 200, a film formation source 250, and a CVD functional unit 300 are arranged around the cylindrical can 110 that circulates in the vacuum chamber 100. As the cylindrical can rotates, materials are sequentially laminated from the evaporation source and film formation source with each rotation, and a laminate is manufactured. In addition, although not shown here, a grinding device such as a scraper for peeling and grinding the film can be provided in the vacuum chamber, allowing for production from film formation to powder.

[0013] The evaporation source 200 holds the evaporation material 210, and the heated evaporation material 210 turns into vapor and moves toward the circumferential surface of the cylindrical can 100. Examples of evaporation materials include silicon oxide, silicon oxynitride, silicon nitride, organosilicon, nickel, titanium, etc. As a means of heating the evaporation material, methods commonly used in this field, such as resistance heating and electron beam heating, can be used.

[0014] The evaporation material 210 deposited on the circumferential surface of the cylindrical can forms a thin film that becomes the powder material 1000. The thickness of the material film is adjusted to the desired thickness by the evaporation rate of the evaporation material and the rotation speed of the cylindrical can. Furthermore, the thin film does not necessarily have to be a continuous film; it may be a perforated film, a discontinuous film, or even have irregularities.

[0015] In addition to the evaporation source 200, a film deposition source 250 is arranged around the cylindrical can. The film deposition source 250 may be an evaporation source, or it may be a film deposition source that uses other film deposition methods such as a sputtering source, a transfer deposition source, or an electrostatic coating source. For the film deposition source 250, carbon powder, for example, can be used as the film deposition raw material. By using the evaporation source 200 and the film deposition source 250 in combination, various material films such as multilayer thin films and composite films can be formed on the circumferential surface of the cylindrical can.

[0016] Prior to forming a material film on the circumferential surface of the cylindrical can by the evaporation source 200 and the film deposition source 250, a CVD film can be formed by the CVD functional unit 300. The CVD step is performed, for example, by ionizing or thermally decomposing the raw material gas and introducing it to the CVD film deposition surface. The CVD step may be performed before forming the material film on the circumferential surface of the cylindrical can by the evaporation source 200 and the film deposition source 250, after forming the material film on the circumferential surface of the cylindrical can by the evaporation source 200 and the film deposition source 250, or at both timings. Furthermore, the formation of the material film and the formation of the CVD film may be repeated. The lamination of the material film and the CVD film on the circumferential surface of the cylindrical can may be repeated, layer by layer, or two or more layers of either may be formed.

[0017] Various CVD methods can be used to form CVD films, such as thermal CVD and plasma CVD. CVD is a gas reaction process with a relatively short mean free path, which has the advantage of easily forming dense and thin films regardless of surface irregularities. Therefore, it is possible to densely cover the surface of the material film with few coating defects, preventing degradation of the material due to oxygen and water vapor. Another advantage of CVD is the wide range of gas types that can be selected without adversely affecting the performance of the functional material.

[0018] When manufacturing Si / C-based anode materials, examples of gases used for CVD film formation include hydrocarbon gases such as acetylene gas and propane. The formation of the CVD film ensures that at least one of the front or back surfaces of the material film formed on the circumferential surface of the cylindrical can by the evaporation source 200 and the film formation source 250 is covered by the CVD film. If the material film formed on the circumferential surface of the cylindrical can by the evaporation source 200 and the film formation source 250 is highly reactive, there is a high risk of the material film degrading due to rapid reaction caused by exposure to an atmosphere containing oxygen and water vapor when the material film formed in a vacuum is returned to an atmospheric pressure environment to produce powder. However, by covering the surface of the material film with a CVD film beforehand, it is possible to prevent reaction with oxygen and water vapor, thereby suppressing rapid reactions. Therefore, safe and high-quality functional materials can be obtained.

[0019] In order to obtain a functional material using the formed CVD-coated material film, necessary steps are selected from, for example, a step of peeling the material film from the peripheral surface of the cylindrical can, a step of returning the periphery of the cylindrical can to a normal pressure environment, a step of carrying the peeled material film out of the vacuum chamber, and the like, and the steps are applied after optimizing the order as appropriate.

[0020] In the scraping function unit, the material film is scraped off from the peripheral surface of the cylindrical can. The scraping function unit has a configuration necessary for scraping off the material film. As methods for peeling the material film from the peripheral surface of the cylindrical can, various methods commonly used in this field can be used, including a method utilizing the physical properties of the material film such as applying heat to the material film from a heating source and peeling the film by using the difference in thermal expansion, a method of physically peeling the film via a jig like a scraper, a method using vibration, a method including spontaneous peeling using the internal stress of the material film, and combinations of these methods.

[0021] A pulverization step can also be applied to further pulverize the material film taken out to obtain powder. A part of the pulverization step can be carried out in advance in the vacuum chamber before taking the material film out of the vacuum chamber. As the pulverization step, a roller mill, a jet mill, a hammer mill, a vibration mill, a planetary mill, a bead mill, or the like can be appropriately used, but the pulverization step is not limited thereto.

[0022] Fig. 2 shows an example of a method for producing a functional material using the apparatus of Embodiment 1. In Fig. 2, CVD film formation is performed first. By performing CVD film formation with a stable material such as carbon on the surface of the cylindrical can and laminating another material thereon, deterioration of the material can be prevented because the material surface is stable even when peeling and taking-out is finally performed.

[0023] Next, a vapor deposition film is formed. When manufacturing a Si / C-based anode material, small lumps or granules of Si can be suitably used as the evaporation raw material. Vapor deposition is performed in the vapor deposition function unit. The vapor deposition function unit has a function to control vapor deposition film formation, and is equipped with the necessary components for vapor deposition, such as a heating means for the evaporation source, and a shutter that can block the adhesion of the deposited material is provided between the evaporation source 200 and the cylindrical can 110.

[0024] After vapor deposition, a second film deposition is performed. When manufacturing a Si / C-based anode material, carbon powder is used as the raw material for film deposition. The second film deposition is performed by a second film deposition function unit. The second film deposition function unit has the necessary components for film deposition and a shutter capable of blocking film adhesion is provided between the film deposition source 250 and the cylindrical can 110 to control film deposition.

[0025] Vapor deposition and the second deposition can be repeated until a predetermined film thickness is reached. The film thickness of each layer can be controlled by the evaporation rate of the evaporation material and the rotation speed of the cylindrical can. Once the predetermined film thickness is reached, CVD deposition is performed again. By performing CVD deposition, the film surface can be covered with a stable material. After deposition, the film can be peeled off and removed from the vacuum chamber, or the film can be peeled off, pulverized, and then removed. In the method of Embodiment 1, since CVD deposition is performed in a vacuum, the film surface is covered with a stable material, which suppresses degradation due to contact with oxygen and moisture in the atmosphere.

[0026] The flowchart shown in Figure 2 illustrates one example of a manufacturing method. For example, the order of vapor deposition and the second deposition can be reversed, or CVD deposition may be performed before each vapor deposition. Furthermore, CVD deposition may be omitted entirely. The order can be rearranged as appropriate to suit the functional material being manufactured.

[0027] The following shows an example of manufacturing a functional material using the apparatus of Embodiment 1. [Example 1] (1) A plasma CVD film was formed on the circumferential surface of a cylindrical can using acetylene gas as the raw material and high-frequency plasma at 500W to create a carbon-based thin film with an average thickness of 0.005 microns. (2) Silicon was used as the evaporation material, and a silicon thin film was formed on the CVD film by electron beam deposition. A silicon thin film of 0.5 microns was deposited with an electron beam output of 10 kW and a cylindrical can peripheral speed of 0.5 m / min. (3) As a second film formation, carbon powder was used as the raw material, and a carbon layer with an average thickness of 0.5 microns was formed using electrostatic deposition. (4) Processes (2) and (3) above were repeated to form a laminate on the circumferential surface of the cylindrical can, and the laminate formation was terminated when the laminate thickness reached approximately 50 microns. (5) As a plasma CVD film, acetylene gas was used as the source gas, and a carbon-based thin film with an average thickness of 0.005 microns was formed using a high-frequency plasma of 500 W. (6) After the functional laminate was peeled off and recovered from the cylindrical can using a scraper, it was further crushed to obtain a functional powder.

[0028] [Example 2] (1) Silicon was used as the evaporation material, and a silicon thin film was formed on the circumferential surface of a cylindrical can by electron beam deposition. A silicon thin film of 0.5 microns was deposited with an electron beam output of 10 kW and a circumferential velocity of 0.5 m / min of the cylindrical can. (2) As a plasma CVD film, acetylene gas was used as the raw material gas, and a carbon-based thin film with an average thickness of 0.005 microns was formed using a high-frequency plasma of 500 W. (3) The processes described in (1) and (2) above were repeated to form a laminate on the circumferential surface of the cylindrical can. When the laminate thickness reached approximately 50 microns, the film formation was terminated, and the functional laminate was peeled off the cylindrical can with a scraper and recovered. After further grinding, a functional material powder was obtained.

[0029] Example 2 is an example of manufacturing a functional material by performing some of the steps in the flowchart shown in Figure 2 to form a film. As shown in Example 2, a thin carbon layer can be formed by CVD deposition. Therefore, the formation of the carbon layer can be performed by both the second deposition and CVD deposition, as shown in Example 1, or by CVD deposition alone, as shown in Example 2. As illustrated in Example 2, it is not necessary to perform all of the deposition steps shown in the figure; only the necessary steps should be performed according to the purpose.

[0030] [Embodiment 2] Figure 3 is a schematic diagram showing a functional material manufacturing apparatus in Embodiment 2. The apparatus of Embodiment 2 is configured to form a film on a polymer substrate 120, with two cylindrical cans 110, 111 circulating in a vacuum chamber 100, unwinding rolls / winding rolls 130, 150, an evaporation source 200, a film formation source 250, and a CVD functional unit 300.

[0031] The polymer substrate 120 is wound from the unwinding / winding roll 130 onto the unwinding / winding roll 150 via the guide roller 140. The unwinding / winding of the polymer substrate is performed by the substrate moving function unit. The substrate moving function unit, which controls the movement of the polymer substrate, such as adjusting the speed of the polymer substrate or reversing it, can utilize commonly used mechanisms.

[0032] A laminate is formed along the winding path by evaporation sources 200 and film deposition sources 250 arranged around two cylindrical cans. Specifically, while traveling along the cylindrical can 110, evaporation material is deposited from the evaporation source 200, which is positioned opposite the circumferential surface of the cylindrical can 110. The evaporation source 200 holds evaporation raw material 210, and the heated evaporation material 210 turns into vapor and moves toward the circumferential surface of the cylindrical can 110. Film deposition sources 250 other than the evaporation source 200 may also be positioned opposite the circumferential surface of the cylindrical can 110. The evaporation source 200 and film deposition source 250 may be configured to face the circumferential surface of the same cylindrical can, or they may be positioned opposite the circumferential surfaces of different cylindrical cans. As shown in Figure 3, by positioning the evaporation source 200 and film deposition source 250 opposite the circumferential surfaces of different cylindrical cans, it is easier to optimize conditions such as substrate temperature, deposition atmosphere, and applied voltage according to the respective film formation.

[0033] The film deposition source 250 may be an evaporation source, or it may be a film deposition source that uses other film deposition methods such as a sputtering source, a transfer deposition source, or an electrostatic coating source. This allows for the formation of various material films, such as multilayer thin films and composite films, on the polymer substrate 120. The cylindrical can may be operated in one direction or in both directions to stack the layers. By operating it in both directions, a laminate with the desired layers can be fabricated.

[0034] The thickness of the material film is adjusted to the desired thickness by the evaporation rate of the evaporation material and the running speed of the polymer substrate. Furthermore, the material film does not necessarily have to be a continuous film; it can be a perforated film, a discontinuous film, or even have irregularities. In addition, by providing a shutter between the evaporation source 200, the film formation source 250, and the cylindrical cans 110 and 111, a laminate with a desired layer structure can be formed.

[0035] Prior to forming a material film on the polymer substrate using the evaporation source 200 and the film formation source 250, a CVD film can be formed on the polymer substrate by the CVD functional unit 300. The CVD film formation step is carried out, for example, by ionizing or thermally decomposing the raw material gas and guiding it to the CVD film formation surface.

[0036] The CVD film formation step can be performed either before or after the formation of the material film on the polymer substrate, or both, or, if multiple layers are to be built up, it can be performed each time a layer is built up. For example, if it is performed immediately before the material film is formed on the polymer substrate by the evaporation source 200 or the film formation source 250, the CVD film can be formed on the polymer substrate, the polymer substrate can be wound up once, the polymer substrate with the CVD film formed on it can be wound up again, and then the material film can be formed.

[0037] Furthermore, a CVD film can be formed on top of the material film. In this case as well, the material film on the polymer substrate can be wound up once, and then the polymer substrate on which the material film has been formed can be wound up again to form the CVD film. CVD film formation may be performed after the material film has been formed on the circumferential surface of the cylindrical can by the evaporation source 200 and the film formation source 250, or it may be performed at both timings.

[0038] The formation of the CVD film ensures that at least one of the front and back surfaces of the material film formed on the polymer substrate by the evaporation source 200 and the film formation source 250 is covered by the CVD film.

[0039] When the material film formed on the polymer substrate by the evaporation source 200 or the film formation source 250 has high material reactivity, exposing the material film formed in a vacuum to an atmosphere containing oxygen and water vapor in order to produce a functional material carries a high risk of rapid reaction, leading to heat generation and material degradation of the material film. However, according to the method of this embodiment, since a portion of the surface area of ​​the material film is covered with a CVD film beforehand, the rapid reaction can be suppressed. Therefore, a powder can be obtained as a high-quality functional material.

[0040] To obtain powder using the formed material film and the powder material further covered by the CVD film, necessary steps are selected from among, for example, a step of returning the area around the cylindrical can to an atmospheric pressure environment, a step of removing the polymer substrate from the vacuum chamber, and a step of crushing and peeling the polymer substrate to obtain a functional material, and the order is optimized and applied as appropriate.

[0041] Various methods can be used to peel a material film from the peripheral surface of a polymer substrate, including methods that use the difference in thermal expansion by applying heat to the material film from a heat source, methods that use a physical object such as a scraper to peel it off, methods that use vibration, methods that apply mechanical compressive force to a polymer film that has been formed on it and wound into a roll to break the adhesion between the polymer film and the material film, methods that use the internal stress of the material film to peel it off, including through natural delamination, and methods that dissolve a part of the substrate film, as well as methods that can be used in combination with these methods.

[0042] It is also possible to apply a grinding step to further pulverize the material film extracted to obtain a functional material. Part of the grinding step can also be performed inside the vacuum chamber before removing the material from the vacuum chamber.

[0043] Figure 4 shows a flowchart illustrating an example of a method for manufacturing a functional material using the apparatus of Embodiment 2. In Figure 4, CVD film deposition is performed first. By performing CVD film deposition with a stable material such as carbon on the surface of a cylindrical can and then laminating other materials on top of it, degradation can be prevented because the material surface remains stable even when the material is finally peeled off.

[0044] The polymer substrate 120 is wound onto the unwinding / winding roll 150 from the unwinding / winding roll 130 while CVD film deposition is performed. Once the CVD film deposition of the polymer substrate is complete, the cylindrical cans 110 and 111 begin to invert. Vapor deposition is performed by the deposition source 250. When manufacturing a Si / C-based anode material, carbon powder is used as the raw material for evaporation. After deposition, a second film is deposited by vapor deposition using the evaporation source 200. When manufacturing a Si / C-based anode material, Si pellets or the like can be suitably used as the raw material for deposition.

[0045] Once the polymer substrate 120 is completely wound onto the unwinding / winding roll 130, film deposition is performed while the cylindrical can is rotated in the reverse direction. This process can be repeated until the desired film thickness is reached. Once the predetermined film thickness is reached, CVD film deposition is performed using the CVD function unit 300. By performing CVD film deposition, the film surface can be covered with a stable material. After film deposition, the film together with the substrate can be removed and the laminate can be extracted as a powder by crushing and breaking it.

[0046] The flowchart shown in Figure 4 illustrates an example of a manufacturing method. For example, the order of vapor deposition and the second deposition can be reversed, or CVD deposition can be performed before each vapor deposition. Furthermore, CVD deposition may be omitted entirely. The order can be rearranged or steps skipped depending on the type of film to be manufactured.

[0047] The following shows an example of manufacturing a functional material using the apparatus of Embodiment 2. [Example 3] (1) A long polyimide substrate with a thickness of 25 microns was unwound at 0.5 m / min, and a carbon-based thin film with an average thickness of 0.01 microns was formed on the substrate as a plasma CVD film using acetylene gas as the source gas and a high-frequency plasma of 500 W. CVD deposition was carried out until the unwinding was complete. (2) While unwinding the substrate in the opposite direction, a silicon thin film was formed on the CVD film using silicon as the evaporation raw material, and then a carbon layer was formed using carbon as the second film deposition. Specifically, with an electron beam output of 10 kW, a 0.5 micron silicon thin film was formed, and then, using carbon powder as the raw material for the second film deposition, an average carbon layer of 0.5 microns was deposited using electrostatic deposition and then wound up. (3) As a plasma CVD film, acetylene gas was used as the raw material gas, and while unwinding the above (2), a carbon-based thin film with an average thickness of 0.01 microns was formed using a high-frequency plasma of 500W, and then wound up again. After processes (1) to (3), the core was removed and the material was repeatedly crushed in different directions. The functional powder, consisting of a functional laminate that broke and peeled off from the polymer substrate due to the crushing, was recovered and further pulverized to obtain material powder.

[0048] [Example 4] (1) A silicon thin film was formed on a 25-micron thick long polyimide substrate that moved at 0.5 m / min using silicon as the evaporation material by electron beam deposition. The electron beam output was set to 10 kW, and the 0.5-micron silicon thin film was deposited on the substrate and then wound up. (2) As a plasma CVD film, acetylene gas was used as the raw material gas, and while unwinding the above (1), a carbon-based thin film with an average thickness of 0.01 microns was formed using a high-frequency plasma of 500 W, and then wound up again. After processes (1) and (2), the core was removed and the material was repeatedly crushed in different directions. The functional powder, consisting of a functional laminate that broke and peeled off from the polymer substrate due to the crushing, was recovered and further pulverized to obtain material powder.

[0049] As described above, by using the apparatus shown in the above embodiment, high-performance functional powders can be safely produced without using silane gas. [Explanation of Symbols]

[0050] 100 vacuum chamber 110, 111 Cylindrical can 120 Polymer substrate 130, 150 unwinding / rewinding rolls 140 Guide Rollers 200 Evaporation source 210 Raw materials for evaporation 250 Film deposition source 300 CVD Functional Unit 1000 powder material

Claims

1. A method for manufacturing functional materials, A film deposition step of forming a film on a cylindrical can rotating in a vacuum, or on a substrate running along the cylindrical can, The aforementioned film formation step includes a vapor deposition step in which a film is formed by evaporating a material using a vapor deposition method, The CVD step includes forming a film with ionized source gas, The CVD step is a step that is performed before and / or after the deposition step to form a laminate. A method for producing a functional material, characterized by obtaining a functional powder by performing a scraping step of peeling or scraping off the laminate from the cylindrical can or the substrate.

2. A method for manufacturing functional materials, This is a thin film manufacturing method in which a film is deposited on a substrate that travels along a cylindrical can rotating in a vacuum. A vapor deposition step in which a material is evaporated by a vapor deposition method to form a film, The film formation step comprises a CVD step of forming a film with an ionized source gas, A method for producing a functional material, characterized in that the CVD step is performed before the vapor deposition step and / or after the vapor deposition step to form a thin film consisting of a laminate.

3. A method for producing a functional material according to claim 1 or 2, characterized in that the film formation step and the vapor deposition step are repeated until the laminate reaches a desired thickness.

4. The method for producing a functional material according to claim 1, characterized in that a grinding step is carried out after the peeling or scraping step.

5. After forming a thin film consisting of a laminate, A method for producing a functional material according to claim 2, characterized in that the entire substrate is removed, crushed, and peeled off to produce a powder.

6. A method for producing a functional material according to claim 1 or 2, characterized in that the pressure of the film-forming atmosphere in the CVD step is higher than that of the film-forming atmosphere in the vapor deposition step.

7. A method for producing a functional material according to claim 1 or 2, characterized in that the material contains silicon.

8. A method for producing a functional material according to claim 1 or 2, characterized in that the raw material gas contains carbon.

9. A cylindrical can that rotates in a vacuum, or a substrate moving function unit that travels along the cylindrical can, A vapor deposition function unit that evaporates at least one material by vapor deposition to form a film on the cylindrical can or the substrate, A thin film manufacturing apparatus characterized by having a CVD function unit that forms a film using an ionized raw material gas, which is arranged to form a film before and / or after the deposition function unit.

10. Furthermore, it is equipped with a second film-forming function section, The second film-forming functional section is a functional section that forms a film using a material different from the material used in the vapor deposition functional section. The thin film manufacturing apparatus according to claim 9, characterized in that it is provided capable of forming a film before the vapor deposition function unit and / or after the vapor deposition function unit and before the CVD function unit.

11. The thin film manufacturing apparatus according to claim 9 or 10, A functional powder manufacturing apparatus, characterized by having a scraping function unit for peeling or scraping the laminate from the cylindrical can or the substrate.

12. A functional powder manufacturing apparatus characterized by comprising a crushing and peeling device for manufacturing powder by crushing and peeling a thin film formed by the thin film manufacturing apparatus described in claim 9 or 10 and removed from the thin film.

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