Electrically attached parts retainer

Abstract

The present invention provides a holder for electrodeposited components that can uniformly form an electrodeposited film on the component. [Solution] An electrodeposited component holder 100 for forming an electrodeposited film on an electrodeposited component 200 comprises a base body 110 and a plurality of voltage applying members 140 attached to the base body 110 for applying voltage to the electrodeposited component 200. Depending on the distribution of current density on the surface of the electrodeposited component 200 when voltage is applied to the electrodeposited component 200, at least one of the plurality of voltage applying members 140 has a different contact area with the electrodeposited component 200 compared to the other voltage applying members 140. The contact area of ​​the voltage applying members 140 can be set to be smaller for voltage applying members 140 located in areas with high current density on the electrodeposited component 200 and larger for voltage applying members 140 located in areas with low current density.

Description

[Technical Field]

[0001] The present invention relates to an electrodeposition apparatus for processing electrodeposited components in electrochemical processes, particularly processes such as electrodeposition coating, and more particularly to a holder for holding an electrodeposited component. [Background Art]

[0002] Electrodeposition coating is a technique for electrodepositing various films on components such as metal or plastic substrates for the purposes of rust prevention, decoration, and formation of resist films or metal films. In this technique, an electric current is passed through the electrodeposited component to deposit an electrodeposition film on the surface of the region through which the current flows. Conventionally, in order to pass an electric current through an electrodeposited component, a common method has been to fix the electrodeposited component, bring a probe pin connected to a power source into contact with the electrodeposited component, and apply a voltage while the electrodeposited component is immersed in an electrodeposition tank (see, for example, Patent Document 1). As a result, an electrodeposition film is formed on the surface of the electrodeposited component. [Prior Art Literature] [Patent Literature]

[0003] [Patent Document 1] Japanese Utility Model Registration No. 2518686 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] However, in the conventional method, since the probe pin is manually brought into contact with the electrodeposited component, the position of the probe pin is often unstable, and as a result, there has been a problem that the thickness of the electrodeposition film formed on the electrodeposited component becomes non-uniform. This is because when the probe pin contacts different positions of the electrodeposited component, the contact position fluctuates and the current path fluctuates. In view of such problems, an object of the present invention is to provide a holder for an electrodeposited component that can uniformly form an electrodeposition film on the electrodeposited component. [Means for Solving the Problem]

[0005] An electrodeposited component holder for forming an electrodeposited film on an electrodeposited component, comprising a base body and a plurality of voltage applying members attached to the base body for applying a voltage to the electrodeposited component, wherein at least one of the plurality of voltage applying members has a different contact area with the electrodeposited component than the other voltage applying members, depending on the distribution of current density on the surface of the electrodeposited component when a voltage is applied to the electrodeposited component. The contact area of ​​the plurality of voltage-applying members may be set to be smaller for voltage-applying members located in areas with high current density of the electrodeposited component, and larger for voltage-applying members located in areas with low current density. Furthermore, the voltage application member may be a pin, and the end of the pin may be in contact with the electrodeposited component. Furthermore, the outer diameter of the end of at least one of the multiple pins may be different from the outer diameter of the ends of the other pins. Alternatively, the pin may be provided via a spring, and the biasing force of the spring may press it against the electroplated component. Alternatively, the electrodeposited component may be a flat substrate, and the voltage application members may be placed in the center and at both ends of one side of the substrate, such that the contact area between the voltage application member in the center of the substrate and the electrodeposited component is smaller than the contact area between the voltage application members at both ends and the electrodeposited component. [Effects of the Invention]

[0006] This invention makes it possible to uniformly form an electrodeposited film on electrodeposited components. As a result, the quality of electrodeposited components can be improved and the occurrence of defective products can be reduced. [Brief explanation of the drawing]

[0007] [Figure 1] This figure shows the electrodeposited component holder of the present invention, where (a) is a cross-sectional view AA of the electrodeposited component holder and (b) is a cross-sectional view BB. [Figure 2] This is a partially enlarged view of the electrodeposited component holder of the present invention. [Modes for carrying out the invention]

[0008] An embodiment of the electrodeposited component holder of the present invention will be described with reference to Figures 1 and 2. Figure 1 is a diagram showing the electrodeposited component holder of the present invention, where (a) is a cross-sectional view AA of the electrodeposited component holder and (b) is a cross-sectional view BB. Figure 2 is a partially enlarged view of the cross-sectional view AA of the electrodeposited component. The electrodeposited component holder 100 is used to hold the electrodeposited component and to place it in an electrodeposited tank (not shown) to form an electrodeposited film on the surface of the electrodeposited component.

[0009] The electrodeposited component holder 100 (hereinafter referred to as the holder 100) comprises a base body 110, a pin 140 for applying voltage to the electrodeposited component 200, a spring 150, and a pin holder 120 for fixing the pin 140 to the base body 110. The electrodeposited component 200 is, for example, a flat substrate 200, which is attached to the base body 110 and placed together with the base body 110 in the electrodeposition bath, where an electrodeposited film is formed on its surface.

[0010] The substrate 110 is composed of two substantially plate-shaped members, a first substrate 111 and a second substrate 112, which are stacked together. The first substrate 111 and the second substrate 112 each have large openings 111a and 112a in the center. These openings 111a and 112a allow the electrolyte to come into contact with the surface of the substrate 200 when the substrate 200 is immersed in the electrodeposition bath while attached to the substrate 110. The first substrate 111 and the second substrate 112 are positioned to sandwich the four corners of the substrate 200, thereby stably holding the substrate 200. The first base body 111 and the second base body 112 are positioned and fixed together, for example, by fitting a pin (not shown) provided on one surface of the first base body 111 facing the second base body 112 with a recess (not shown) provided on one surface of the second base body 112 facing the first base body 111.

[0011] Furthermore, the first base body 111 is provided with a shaft holding hole 111b for holding the shaft 130. The shaft 130 is fitted into the shaft holding hole 111b with the shaft protruding from the surface of the first base body 111. The shaft 130 is a cylindrical member for positioning the pin holder 120 (more specifically the first pin holder 121, which will be described later) and the first base body 111.

[0012] Furthermore, a pin holder 120 is attached to the first base body 111. The pin holder 120 is for holding the pin 140 in a predetermined position on the first base body 111, and in this embodiment, it consists of a first pin holder 121 located in the center of one side of the first base body 111, and two second pin holders 122 located at both ends of the same side. In this embodiment, the pin 140 held by the first pin holder is referred to as the first pin 141, and the pin 140 held by the second pin holders 122 is referred to as the second pin 142.

[0013] The first pin holder 121 is a substantially rectangular parallelepiped member, with the first pin 141 attached to the bottom surface of the recess 121a. A spring 150 is placed between the bottom surface of the recess 121a and the pin 141, and the first pin 141 is positioned so that its tip protrudes from the recess 121a and is located within the opening 111a, and is positioned so as to contact the surface of the substrate 200 when the substrate 200 is attached to the holder 100.

[0014] Furthermore, the first pin holder 121 has a positioning hole 121b at a position corresponding to the shaft 130 attached to the first base 111, and an adjustment hole 121c that is perpendicular to the positioning hole 121b and is inserted through to the positioning hole 121b. The first pin holder 121 can be positioned relative to the first base 111 by inserting the shaft 130 attached to the first base 111 through the positioning hole 121b, and the shaft 130 inserted through the positioning hole 121b can be fixed with a bolt or the like via the adjustment hole 121c. In this way, the first pin holder 121 is securely fixed to the first base 111 via the shaft 130. Furthermore, when fixing the shaft 130 with bolts or the like, the fixing of the first base 111 and the first pin holder 121, as well as the axial position of the shaft 130 between the first pin 141 attached to the first pin holder 121 and the first base 111, can be adjusted, thereby allowing for fine adjustment of the position of the first pin 141.

[0015] The second pin holder 122 is a substantially rectangular parallelepiped member to which the second pin 142 is attached. The second pin 142 is positioned within the opening 111a of the first base 111 and is arranged to contact the surface of the substrate 200 when the substrate 200 is attached to the holder 100.

[0016] The pin 140 is an example of a voltage applying member that applies a voltage to the substrate 200 mounted on the holder 100. It is a conductive, substantially cylindrical member with a circular flat surface at the tip end that contacts the substrate 200. The outer shape of the pin 140 is adjusted according to the current density distribution of the substrate 200. In this embodiment, the outer diameter of the tip of the first pin 141, which is located in the center of one side of the first base body 111 and contacts the substrate 200, and the outer diameter of the tips of the second pins 142, which are located at both ends, are set to different diameters. Specifically, the outer diameter of the first pin 141, located in the center of one side of the first base body 111, is set to be smaller than the outer diameter of the second pins 142, which are located at both ends.

[0017] The thickness of an electrodeposition film formed on the surface of a substrate 200 depends on current density: the thickness is greater in regions with high current density, and smaller in regions with low current density. Current density varies depending on the contact pressure of pins 140 in contact with the substrate 200 and the contact area between the pins 140 and the substrate 200. That is, current density can be adjusted by changing the contact area between the pins 140 and the substrate 200. In the present embodiment, when a voltage is applied to the substrate 200, current density tends to be higher in a central portion of the substrate 200 than in end portions thereof. Therefore, at both end portions where current density is low, the contact area between the pins 140 and the substrate is increased to lower contact resistance and allow more current to flow. By adopting such a configuration, the current density flowing through the substrate 200 is made uniform, and a uniform electrodeposition film can be formed on the surface of the substrate 200.

[0018] Note that the contact area between the pins 140 and the substrate 200 (the outer diameter of the tip end of each pin 140 in contact with the substrate 200) and arrangement can be set in accordance with a current density distribution obtained in advance through experiments or simulations, and are not limited to those in the present embodiment. Further, the shape of the tip end of each pin 140 in contact with the substrate 200 is not limited to a circular shape having a flat surface, and a conical tip end, a circular tip end, or the like may also be used.

[0019] A spring 150 disposed on a first pin holder 121 is, for example, a compression coil spring. The first pin 141 can be inserted through an inner diameter portion of the compression coil spring, and the spring can be disposed in a compressed state between a convex portion provided on a middle part of the first pin 141 and a bottom surface of a concave portion 121a of the first pin holder 121. The spring 150 provides an appropriate force to the substrate 200, and presses the first pin 141 against the substrate 200 by its biasing force. Accordingly, the contact pressure from the first pin 141 to the substrate 200 is stabilized, the flow of current to the substrate 200 is stabilized, and a uniform electrodeposition film can be formed. In the present embodiment, the spring is provided only on the first pin holder 121; however, a spring may be disposed between a second pin holder 122 and a second pin 142.

[0020] Next, a process for forming an electrodeposited film on a substrate 200 using the electrodeposition component holder 100 of the present invention will be described. First, the substrate 200 is set on the second base 112. Next, the first base 111 is placed on the substrate 200, and the substrate 200 is fixed by being sandwiched between the first base 111 and the second base 112. At this time, the shaft 130 is used to accurately align the positions of the first base 111 and the second base 112. Next, adjustment is performed so that the pin 140 attached to the pin holder 120 contacts the surface of the substrate 200. The contact pressure of the pin 140 is stabilized by the spring 150.

[0021] After the substrate 200 is firmly fixed to the electrodeposition component holder 100, the holder 100 is immersed in an electrodeposition tank. An anode is provided in the electrodeposition tank at a position facing the substrate 200. By applying a voltage between the anode and the substrate 200, a current flows in the electrolytic solution, and an electrodeposited film is formed on the surface of the substrate 200. The voltage application to the substrate 200 can be performed via the pin 140 of the holder 100, and the pin 140 functions as a cathode. At this time, since the contact area of the pin 140 is adjusted according to the current density distribution of the substrate 200, an electrodeposited film with a uniform thickness can be formed on the surface of the substrate 200.

[0022] After the formation of the electrodeposited film is completed, the holder 100 is taken out from the electrodeposition tank, and the substrate 200 is removed from between the first base 111 and the second base 112. Finally, the quality of the electrodeposited film formed on the surface of the substrate 200 is checked, and additional processing is performed if necessary. Through the above steps, a uniform electrodeposited film can be formed on the substrate 200 using the holder 100 of the present invention. [Industrial Applicability]

[0023] The electrodeposition component holder of the present invention can be applied not only to electrodeposition coating but also to other electrochemical treatment processes. For example, it can be used in fields such as electrolytic polishing and electroplating, and can improve the treatment quality of substrate surfaces. [Description of Reference Numerals]

[0024] 100 Electrodeposition component holder 110 Base 111 First Substrate 111a Opening (first base) 111b Shaft retaining hole 112 Second Substrate 112a Opening (second base) 120 Pin Holder 121 First Pin Holder 121a Recess (First pin holder) 121b Positioning hole 121c adjustment hole 122 Second Pin Holder 130 shaft 140 pins (voltage application component) 141 Pin 1 142 Pin 2 150 springs 160 shaft 200 circuit boards (electroplated components)

Claims

1. An electrodeposited component holder for forming an electrodeposited film on an electrodeposited component, The device comprises a base and a plurality of voltage applying members attached to the base for applying voltage to the electrodeposited component. An electrodeposited component holder characterized in that, depending on the distribution of current density on the surface of the electrodeposited component when a voltage is applied to the electrodeposited component, at least one of the plurality of voltage applying members has a different contact area with the electrodeposited component than the other voltage applying members.

2. The electrodeposited component holder according to claim 1, characterized in that the contact area of ​​the plurality of voltage applying members is set to be smaller for voltage applying members that are positioned in areas with high current density of the electrodeposited component, and larger for voltage applying members that are positioned in areas with low current density.

3. The electrodeposited component holder according to claim 1 or 2, characterized in that the voltage applying member is a pin, and the end of the pin is in contact with the electrodeposited component.

4. The electroplated holder according to claim 3, characterized in that the outer diameter of the end of at least one of the plurality of pins is different from the outer diameter of the ends of the other pins.

5. The electrodeposition holder according to claim 3, characterized in that the pin is provided via a spring and is pressed against the electrodeposition component by the biasing force of the spring.

6. The electrodeposited component holder according to claim 2, characterized in that the electrodeposited component is a flat substrate, the voltage applying members are arranged in the center and at both ends of one side of the substrate, and the contact area of ​​the voltage applying member at the center of the substrate with the electrodeposited component is set to be smaller than the contact area of ​​the voltage applying members at both ends with the electrodeposited component.

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