Power converter

Abstract

The present invention provides a power conversion device that suppresses unidirectional enlargement and prevents deterioration of cooling efficiency. [Solution] The power converter comprises a first electrical component, a second electrical component, a first cooling pipe 211 as a first cooling section, a second cooling pipe 212 as a second cooling section, a first connecting pipe 221 as a first connection section, a second connecting pipe 222 as a second connection section, and a third connecting pipe 223 as a third connection section. The multiple first electrical components are stacked in a first direction, and the multiple second electrical components are stacked in a second direction. The first cooling pipe 211 cools the first electrical component from both sides in the first direction, and the second cooling pipe 212 cools the second electrical component from both sides in the second direction. The first connecting pipe 221 is connected to one end of the multiple first cooling channels. The second connecting pipe 222 is connected to one end of the multiple second cooling channels. The third connecting pipe 223 is connected to the other end of the multiple first cooling channels and also to the other end of the multiple second cooling channels.

Description

Technical Field

[0001] The disclosure described in the present specification relates to a power converter.

Background Art

[0002] Patent Document 1 describes a power converter including a plurality of power cards that constitute an inverter circuit, and a cooler that cools the power cards from both sides. Each power card is in the form of a card obtained by resin-molding a semiconductor element, and is stacked and arranged in a single row. The cooler has a cooling pipe and a connection pipe that form a refrigerant flow path inside. The cooling pipe is a card-shaped pipe stacked and arranged together with the power cards. The connection pipe has an inflow pipe (a first connection portion) connected to one ends of the plurality of cooling pipes, and an outflow pipe (a second connection portion) connected to the other ends of the plurality of cooling pipes. The liquid refrigerant that has flowed into the inflow pipe is distributed to the plurality of cooling pipes by the inflow pipe. Thereafter, the liquid refrigerant flows through the cooling pipes, absorbs heat from the power cards, converges into the outflow pipe, and flows out.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of Invention

Problem to be Solved by the Invention

[0004] Here, when the number of power cards increases, the power converter increases in size in one direction (the stacking direction), which degrades mountability on vehicles and the like. Furthermore, even in a case where the object to be cooled by the cooler is expanded to include other electrical components in addition to semiconductor elements, when the number of electrical components to be cooled increases, the increase in size in one direction degrades mountability.

[0005] Furthermore, an increase in the number of components to be cooled means an increase in the number of cooling tubes. In this case, variations in the refrigerant flow rate in each cooling tube are more likely to occur, raising concerns about a decrease in cooling efficiency.

[0006] The disclosures described herein aim to provide a power conversion device that suppresses unidirectional enlargement and reduces deterioration of cooling efficiency. [Means for solving the problem]

[0007] To achieve the above objectives, the power conversion device according to this disclosure is: An electrical component included in a power conversion circuit, comprising a plurality of first electrical components (M1u, M1v, M1w, M2u, M2v, M2w, B1, B2, C3, C4) stacked in a first direction, An electrical component included in a power conversion circuit, comprising a plurality of second electrical components (C1, C2, C3, L1, L2, S) offset from a first direction and stacked in a second direction parallel to the first direction, A first cooling section (211, 111) that forms a plurality of first cooling channels (211a, 111a) that cool the first electrical component from both sides in a first direction, A second cooling section (212, 112) communicates with the upstream or downstream side of the first cooling channel and forms a plurality of second cooling channels (212a, 112a) that cool the second electrical component from both sides in the second direction, A first connecting portion (221, 121) that forms a first connecting channel (221a, 121a) connected to one end of a plurality of first cooling channels, A second connecting portion (222, 122) that forms a second connecting channel (222a, 122a) connected to one end of a plurality of second cooling channels, A third connecting section (223, 123) is connected to the other end of a plurality of first cooling channels and forms a third connecting channel (223a, 123a) that is connected to the other end of a plurality of second cooling channels, It is equipped with.

[0008] According to the power conversion device disclosed above, the refrigerant distributed at the first connection point and flowing through the first cooling section is redistributed to the second cooling section by the third connection point before it is collected at the second connection point. Therefore, it is possible to distribute the refrigerant to the optimal flow rate according to the cooling capacity required for each of the first and second electrical components.

[0009] The reference numbers in parentheses above merely indicate the correspondence with the configurations described in the embodiments below, and do not in any way limit the technical scope. [Brief explanation of the drawing]

[0010] [Figure 1] This is an electrical circuit diagram showing the electric system according to the first embodiment. [Figure 2] This is a cross-sectional view of the power conversion device according to the first embodiment, seen from above. [Figure 3] This is a top view of the laminate according to the first embodiment. [Figure 4] This is a cross-sectional view along the line IV-IV in Figure 3. [Figure 5] This is a top view showing a part of the laminate according to the first embodiment. [Figure 6] This is a top view of an integrated cooling tube according to the first embodiment. [Figure 7] This is a top view of a separate cooling tube according to the first embodiment. [Figure 8] This is a top view of a cooling tube according to the second embodiment. [Figure 9] This is a cross-sectional view along the IX-IX line in Figure 8. [Figure 10] This is a cross-sectional view of a cooling tube according to a modified example of the second embodiment. [Figure 11] This is a cross-sectional view of a cooling tube according to the third embodiment. [Figure 12] Figure 11 is a top view of the cooling tube. [Figure 13] This is a cross-sectional view of a cooling tube according to a modified example of the third embodiment. [Figure 14] Figure 13 is a cross-sectional view of the cooling tube. [Figure 15]It is a top view of the laminated body according to the fourth embodiment. [Figure 16] It is a side view of the laminated body according to the fifth embodiment. [Figure 17] It is a cross-sectional view taken along line XVII-XVII in FIG. 16. [Figure 18] It is a schematic diagram showing the positional relationship between the laminated body and the motor according to the fifth embodiment. [Figure 19] It is an electric circuit diagram showing the electric system according to the sixth embodiment. [Figure 20] It is a top view of the laminated body corresponding to the electric circuit shown in FIG. 19. [Figure 21] It is an electric circuit diagram showing the electric system according to the seventh embodiment. [Figure 22] It is a top view of the laminated body corresponding to the electric circuit shown in FIG. 21. [Figure 23] It is a cross-sectional view of the power converter according to the eighth embodiment, as viewed from above. [Figure 24] It is a cross-sectional view taken along line XXIV-XXIV in FIG. 23. [Figure 25] In the eighth embodiment, it is a diagram schematically showing the flow resistance of the refrigerant. [Figure 26] It is a top view of the laminated body according to the ninth embodiment. [Figure 27] It is a top view of the laminated body according to a modification of the ninth embodiment. [Figure 28] It is a cross-sectional view of the power converter according to a modification of the ninth embodiment, as viewed from above. MODE FOR CARRYING OUT THE INVENTION

[0011] Hereinafter, a plurality of modes for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, portions corresponding to matters described in preceding embodiments may be assigned the same reference numerals, and overlapping descriptions may be omitted. When only a part of the configuration is described in each embodiment, the other embodiments described previously can be applied to the other parts of the configuration.

[0012] Furthermore, not only are combinations of parts explicitly shown as being combinable in each embodiment possible, but it is also possible to partially combine embodiments with each other, embodiments with modified versions, and modified versions with each other, even if not explicitly shown, as long as there are no obstacles to the combination.

[0013] (First Embodiment) The electric system shown in Figure 1 is installed in a vehicle. This vehicle is a hybrid vehicle equipped with an electric motor and an internal combustion engine as its driving power source. The electric motor includes two motor generators capable of regenerative power generation. In the following description, these motors will be referred to as motor MG1 and motor MG2. Motors MG1 and MG2 are three-phase AC motors.

[0014] Furthermore, the above vehicle is equipped with a high-voltage battery BAT1 and a low-voltage battery BAT2. For example, the high-voltage battery BAT1 is connected to the P line VP and the N line VN, and outputs 800V of power to the P line VP. The low-voltage battery BAT2 is connected to the low-potential line VL and the N line VN, and outputs 400V of power to the low-potential line VL. The potential of the N line VN is lower than the potential of the low-potential line VL.

[0015] The power converter according to this embodiment is mounted on the vehicle described above. In the following description, the three directions that are orthogonal to each other will be referred to as the X direction, Y direction, and Z direction. The Z direction indicates the vertical direction when the power converter is mounted on the vehicle, and the arrow indicating the Z direction in the figure points upward. The X direction indicates the left-right direction of the vehicle, and the Y direction indicates the front-rear direction of the vehicle.

[0016] The power converter includes a power conversion circuit, which includes a boost circuit and an inverter circuit. The inverter circuit converts the DC power output from the high-voltage battery BAT1 and the low-voltage battery BAT2 into AC power and outputs it to motors MG1 and MG2. The boost circuit boosts the DC power output from the low-voltage battery BAT2 and supplies it to the inverter circuit.

[0017] The boost circuit comprises a filter capacitor 1, a reactor 2, a switching element 5, and a diode 6. The switching element 5 shown in Figure 1 is an n-channel insulated-gate bipolar transistor (IGBT), but a metal-oxide-semiconductor (MOS) may also be used. IGBT is an abbreviation for Insulated Gate Bipolar Transistor, and MOS is an abbreviation for Metal-Oxide-Semiconductor.

[0018] The boost circuit has upper and lower arms formed by a pair of switching elements 5. In the example shown in Figure 1, there are two upper and lower arms. The collector electrode of the IGBT on the upper arm is connected to the P line VP. The emitter electrode of the IGBT on the lower arm is connected to the N line VN. The emitter electrode of the upper arm and the collector electrode of the lower arm are connected to each other and to the low-potential line VL.

[0019] Reactor 2 is connected to the low-potential line VL, and filter capacitor 1 is connected between the low-potential line VL and the N line VN. When the upper and lower arms are switched, the voltage of the low-potential line VL is boosted by reactor 2 and filter capacitor 1.

[0020] An inverter circuit is provided for each of the two motors MG1 and MG2. The inverter circuit has upper and lower arms formed by a pair of switching elements 5. In the example shown in Figure 1, one inverter circuit has upper and lower arms for each phase of the three-phase AC motor. In other words, in the example of Figure 1 with two inverter circuits, the power converter has six upper and lower arms.

[0021] The collector electrode of the upper arm IGBT is connected to the P line VP. The emitter electrode of the lower arm IGBT is connected to the N line VN. The emitter electrode of the upper arm and the collector electrode of the lower arm are interconnected and connected to the output lines Vu, Vv, and Vw. The output lines Vu, Vv, and Vw are connected to the U-phase winding, V-phase winding, and W-phase winding of motors MG1 and MG2. When the upper and lower arms are switched, the DC power supplied from the P line VP and the low-potential line VL is converted to AC power. The converted AC power is output to motors MG1 and MG2 through the output lines Vu, Vv, and Vw.

[0022] Furthermore, the power conversion device includes a smoothing capacitor 3, snubber capacitors 31 and 32, a discharge resistor 4, and a current sensor 7. The discharge resistor 4 discharges the power stored in the smoothing capacitor 3. As a result, the charge of the smoothing capacitor 3 is quickly reduced to zero immediately after the electric system is stopped.

[0023] The smoothing capacitor 3 is connected between the P line VP and the low-potential line VL. The smoothing capacitor 3 is connected in parallel with the upper and lower arms of the inverter circuit and the boost circuit. The smoothing capacitor 3 smooths the current pulsations in the P line VP and the low-potential line VL. In short, the smoothing capacitor 3 reduces the ripple in the power supplied to the switching element 5.

[0024] Snubber capacitors 31 and 32 are provided in the inverter circuits of motors MG1 and MG2, respectively. The snubber capacitors 31 and 32 are connected between the P line VP and the low-potential line VL, similar to the smoothing capacitor 3, and are connected in parallel with the upper and lower arms of the inverter circuit. The snubber capacitors 31 and 32 absorb switching surges generated by the switching element 5. Each of the snubber capacitors 31 and 32 is formed to have a smaller capacitance than the smoothing capacitor 3.

[0025] The current path from the switching element 5 to the snubber capacitor 31, which constitutes the inverter circuit of motor MG1, is called the first snubber path. The current path from the switching element 5 to the smoothing capacitor 3, which constitutes the inverter circuit of motor MG1, is called the first smoothing capacitor path. The smoothing capacitor 3, snubber capacitor 31, and switching element 5 are laid out so that the first snubber path is shorter than the first smoothing capacitor path.

[0026] Similarly, the current path from the switching element 5 related to the motor MG2 to the snubber capacitor 32 is called the second snubber path, and the current path to the smoothing capacitor 3 is called the second smoothing capacitor path. The smoothing capacitor 3, snubber capacitor 32, and switching element 5 are laid out so that the second snubber path is shorter than the second smoothing capacitor path.

[0027] The current sensor 7 is attached to the output lines Vu, Vv, and Vw of motors MG1 and MG2, and detects the magnitude of the current flowing to each phase winding of motors MG1 and MG2. Alternatively, the current sensor 7 may be attached to the low-potential line VL to detect the magnitude of the current flowing through that line.

[0028] Furthermore, the power converter includes a control board 8, a drive circuit 8a, and a microcomputer (microcontroller 8b). The microcontroller 8b includes a processor and memory. The microcontroller 8b generates drive commands to operate the switching element 5 and outputs them to the drive circuit 8a. The drive circuit 8a generates drive signals based on the drive commands from the microcontroller 8b and outputs them to the gate electrode of the switching element 5. In this way, the operation of the boost circuit and the inverter circuit is controlled by the microcontroller 8b.

[0029] Here, the switching element 5 is sealed by a molded resin sealant 5m and formed into a flat card shape. Cards containing the switching element 5 in this way correspond to power cards M1u, M1v, M1w, M2u, M2v, M2w, B1, and B2. Hereafter, these power cards will be collectively referred to as power cards M1u to B2. Power cards M1u, M1v, and M1w provide the upper and lower arms of the inverter circuit that outputs to motor MG1. Power cards M2u, M2v, and M2w provide the upper and lower arms of the inverter circuit that outputs to motor MG2. Power cards B1 and B2 provide the upper and lower arms of the boost circuit.

[0030] The power card has a main terminal 5a and a signal terminal 5b. The main terminal 5a is electrically connected to the emitter or collector electrode of the switching element 5. The signal terminal 5b is electrically connected to the gate electrode of the switching element 5. As shown in Figures 2 and 3, the main terminal 5a and the signal terminal 5b extend from the inside to the outside of the encapsulant 5m.

[0031] The signal terminal 5b extending from the encapsulant 5m is connected to the control board 8, thereby electrically connecting it to the drive circuit 8a. The main terminal 5a extending from the encapsulant 5m is connected to various busbars, which will be described later. The power card according to this embodiment includes a pair of switching elements 5 and a diode 6 that form the upper and lower arms.

[0032] These power cards M1u to B2 are all common to each other. That is, the switching element 5 and diode 6 are common, and the shape and size of the encapsulation 5m are also common. In addition, the arrangement of the main terminal 5a and signal terminal 5b on the encapsulation 5m is also common. The encapsulation 5m is a cube with a roughly rectangular shape in plan. The encapsulation 5m may further have protrusions that are not shown.

[0033] As shown in Figure 2, the smoothing capacitor 3, snubber capacitors 31 and 32, and filter capacitor 1 are also formed in a card shape, similar to the power card. That is, the capacitor elements providing these capacitors are sealed by a encapsulant 5m and formed in a flat card shape. The capacitor elements have a pair of electrodes and a dielectric. In Figure 1, the smoothing capacitor 3 is represented by a single electrical symbol, but the smoothing capacitor 3 may be provided by multiple capacitor elements connected to each other. The same applies to the snubber capacitors 31 and 32 and the filter capacitor 1; they may also be provided by multiple capacitor elements.

[0034] Cards containing capacitor elements in this manner are called capacitor cards. Among the capacitor cards, those that provide snubber capacitors 31 and 32 are called snubber cards C1 and C2. A card that provides a smoothing capacitor 3 is called a smoothing card C3, and a card that provides a filter capacitor 1 is called a filter card C4. Hereafter, these capacitor cards may be collectively referred to as capacitor cards C1 to C4.

[0035] Capacitor cards C1 to C4 each have a pair of main terminals 1a. The main terminals 1a are electrically connected to the emitter or collector electrode of the switching element 5. As shown in Figure 3, the main terminals 1a extend from the inside to the outside of the encapsulant 5m. The main terminals 1a of snubber cards C1, C2 and smoothing card C3 are electrically connected to the P line VP and N line VN by being connected to a busbar described later. The main terminals 1a of filter capacitor 1 are electrically connected to the low-potential line VL and N line VN by being connected to a busbar described later.

[0036] In the example shown in Figure 2, the smoothing capacitor 3 is provided by two smoothing cards C3 connected in parallel. The capacitance of the two smoothing cards C3 is the same. The snubber capacitor 31 is provided by one snubber card C1, and the snubber capacitor 32 is provided by one snubber card C2. The filter capacitor 1 is provided by one filter card C4.

[0037] These snubber cards C1 and C2, smoothing card C3, and filter card C4 have different capacitor capacities. For example, the capacitor capacities of the two snubber cards C1 and C2 are the same. The capacitor capacities of one smoothing card C3 are greater than the capacitor capacities of one snubber card C1 or C2. The capacitor capacities of one filter card C4 are smaller than the capacitor capacities of one smoothing card C3, but larger than the capacitor capacities of one snubber card C1 or C2.

[0038] Basically, the structure of these capacitor cards C1 to C4 is common to all of them. That is, the shape and size of the encapsulation 5m are also common. In addition, the arrangement of the main terminals 1a relative to the encapsulation 5m is also common. The encapsulation 5m is a cube with a roughly rectangular shape in plan. However, the Y-direction dimension (thickness dimension) of the encapsulation 5m differs depending on the capacitance of the capacitor cards C1 to C4. On the other hand, even if the capacitor cards have different capacitances, the X-direction dimension (width dimension) and Z-direction dimension (height dimension) of the encapsulation 5m are common. However, contrary to this embodiment, the width dimension or height dimension of the encapsulation 5m may differ depending on the electrical component.

[0039] As shown in Figure 2, the reactor 2 is also formed in a card shape, similar to the power card. That is, the coil and core that make up the reactor 2 are sealed by a sealant 5m and formed into a flat card shape. Thus, the card containing the coil and other components of the reactor 2 corresponds to reactor cards L1 and L2.

[0040] The reactor cards L1 and L2 each have a pair of main terminals 2a. The main terminals 2a are electrically connected to the emitter or collector electrode of the switching element 5. As shown in Figure 3, the main terminals 2a extend from the inside to the outside of the encapsulant 5m. The main terminals 2a are electrically connected to the low-potential line VL and power cards B1 and B2 by being connected to a busbar, which will be described later. Specifically, of the pair of main terminals 2a on reactor card L1, one is connected to the low-potential line VL and the other is connected to power card B1. Of the pair of main terminals 2a on reactor card L2, one is connected to the low-potential line VL and the other is connected to power card B2.

[0041] In this embodiment, the inductances of the two reactor cards L1 and L2 are the same. However, their inductances may be set to be different. In that case, it is desirable to set the inductance by the number of turns of the coil.

[0042] Basically, these reactor cards L1 and L2 are standardized. That is, the shape and size of the encapsulation body 5m are also standardized. Furthermore, the arrangement of the main terminals 2a relative to the encapsulation body 5m is also standardized. The encapsulation body 5m is a cube with a roughly rectangular shape in plan. However, the Y-direction dimension (thickness dimension) of the encapsulation body 5m may be different depending on the inductance of the reactor cards L1 and L2. On the other hand, even if the reactor cards have different inductances, it is desirable that the X-direction dimension (width dimension) and Z-direction dimension (height dimension) of the encapsulation body 5m be standardized.

[0043] As shown in Figure 2, the current sensor 7 is also formed in a card shape, similar to the power card. That is, the sensor element providing the current sensor 7 is sealed by a sealant 5m and formed into a flat card shape. The sensor element is positioned adjacent to the busbars providing the output lines Vu, Vv, and Vw, and is an element that detects the magnitude of the current without contact with the busbars. Thus, the card containing the sensor element of the current sensor 7 corresponds to the sensor card S.

[0044] Furthermore, the encapsulation body 5m of the sensor card S contains various sensors, such as a discharge resistor 4, a water temperature sensor, and a voltage sensor. The sensor card S only needs to contain at least one of the current sensor 7, the discharge resistor 4, the water temperature sensor, and the voltage sensor. The sensor card S has a pair of main terminals 4a connected to the discharge resistor 4. The main terminals 4a are electrically connected to the P line VP and the N line VN. As shown in Figure 3, the main terminals 4a extend from the inside to the outside of the encapsulation body 5m.

[0045] The power cards M1u~B2, capacitor cards C1~C4, reactor cards L1, L2, and sensor card S described above correspond to electrical components. In the following explanation, these electrical components may be collectively referred to as card components M1u~S. Basically, all card components M1u~S are common in the following respects: The Y-direction dimension (thickness dimension) of the 5m encapsulation body may differ, but the X-direction dimension (width dimension) of the 5m encapsulation body is common. It is also desirable that the Z-direction dimension (height dimension) be common. Furthermore, the direction in which the main terminals 2a, 4a, and 5a protrude from the 5m encapsulation body is consistently towards the lower Z-direction.

[0046] Multiple electrical components are stacked in the Y direction. In the example shown in Figure 2, they are stacked in two columns, and the two columns are aligned in the X direction. Of the multiple electrical components, the electrical components in the column on the left side of Figure 2 correspond to the first electrical components, and the electrical components in the column on the right side correspond to the second electrical components. In other words, the first electrical components correspond to the carded components M1u, M1v, M1w, M2u, M2v, M2w, B1, B2, C3, and C4. The second electrical components correspond to the carded components C1, C2, C3, L1, L2, and S. It can also be said that the first electrical components are stacked in the Y direction (first direction) at a first position in the X direction. It can also be said that the second electrical components are stacked in the Y direction (second direction) at a second position offset from the first position in the X direction.

[0047] These card-type components M1u~S generate heat when power is applied and therefore require cooling. The power converter is equipped with a cooler 20 that cools all card-type components M1u~S together. The structure of the cooler 20 will be described in detail later using Figures 3 to 9.

[0048] Furthermore, the power converter includes a case 10, an input terminal block 30, and an output terminal block 40. The case 10 is made of metal and houses the carded components M1u~S, the cooler 20, the input terminal block 30, and the output terminal block 40 inside.

[0049] The input terminal block 30 has P terminals, low-voltage terminals, N terminals, and an insulating base. The P terminals are terminals that are bolted to a busbar connected to the high-voltage battery BAT1. The low-voltage terminals are terminals that are bolted to a busbar connected to the low-voltage battery BAT2. These terminals are mounted on a resin insulating base, electrically insulated from each other.

[0050] The output terminal block 40 has output terminals and an insulating base. The output terminals include terminals for motor MG1 and terminals for motor MG2. The output terminals are fastened with bolts to busbars connected to the respective phase windings of motors MG1 and MG2. These terminals are mounted on a resin insulating base, electrically insulated from each other. Openings are formed in the parts of the case 10 that face the terminals of the input terminal block 30 and the output terminal block 40. The aforementioned terminals are arranged so that they can be exposed to the outside of the case 10 through the openings in the case 10.

[0051] The structure of the cooler 20 will be described in detail below with reference to Figures 3 to 9. The cooler 20 cools the carded components M1u to S using a liquid coolant that flows in from outside the power converter and circulates. The cooler 20 includes cooling tubes 211, 212 and connecting tubes 221, 222, 223 that form a flow path for the liquid coolant inside. These cooling tubes 211, 212 and connecting tubes 221, 222, 223 are made of metal with good thermal conductivity (e.g., aluminum). However, the connecting tubes 221, 222, 223 may be made of resin.

[0052] Cooling tubes 211 and 212 are stacked in the Y direction together with carded components M1u to S, and cool each of the carded components M1u to S from both sides in the stacking direction. Cooling tubes 211 and 212 include a plurality of first cooling tubes 211 and a plurality of second cooling tubes 212. The first cooling tubes 211 are pipes extending in the X direction, stacked alternately with the first electrical components, and cool the first electrical components from both sides. The second cooling tubes 212 are pipes extending in the X direction, stacked alternately with the second electrical components, and cool the second electrical components from both sides.

[0053] The first cooling tube 211 and the second cooling tube 212 correspond to the first cooling section and the second cooling section. The liquid refrigerant flow paths formed inside the first cooling tube 211 and the second cooling tube 212 correspond to the first cooling flow path 211a and the second cooling flow path 212a.

[0054] Due to the difference in the number of components arranged in the stacking direction between the first and second electrical components, the number of components arranged in the stacking direction differs between the first cooling channel 211a and the second cooling channel 212a. In other words, the number of first cooling tubes 211 and second cooling tubes 212 differs. In the example shown in Figure 3, there are 10 carded components corresponding to the first electrical components, while there are 6 carded components corresponding to the second electrical components. Consequently, there are 11 first cooling tubes 211 and 7 second cooling tubes 212.

[0055] The connecting pipes 221, 222, and 223 are pipes that extend in a direction perpendicular to the direction in which the cooling pipes 211 and 212 extend (for example, the Y direction). The connecting pipes 221, 222, and 223 include the first connecting pipe 221, the second connecting pipe 222, and the third connecting pipe 223. The first connecting pipe 221, the second connecting pipe 222, and the third connecting pipe 223 correspond to the first connection section, the second connection section, and the third connection section. The liquid coolant flow paths formed inside the first connecting pipe 221, the second connecting pipe 222, and the third connecting pipe 223 correspond to the first connecting flow path 221a, the second connecting flow path 222a, and the third connecting flow path 223a.

[0056] An inlet 20in for introducing refrigerant into the cooler 20 is formed in the first connecting pipe 221. An outlet 20out for releasing refrigerant from the cooler 20 is formed in the second connecting pipe 222. The first connecting pipe 221, the second connecting pipe 222, and the third connecting pipe 223 are arranged side by side in the X direction, and the positions of the three connecting pipes in the Z direction are the same (see Figure 4). The third connecting pipe 223 is positioned between the first connecting pipe 221 and the second connecting pipe 222.

[0057] The first connecting pipe 221 is connected to one end (upstream end) of a plurality of first cooling pipes 211. The second connecting pipe 222 is connected to one end (downstream end) of a plurality of second cooling pipes 212. The third connecting pipe 223 is connected to the other ends (downstream ends) of a plurality of first cooling pipes 211, as well as the other ends (upstream ends) of a plurality of second cooling pipes 212. As a result, the refrigerant flowing in from the inlet 20in flows as shown by the arrows in Figure 3, and then flows out from the outlet 20out.

[0058] Specifically, the refrigerant flowing in from the inlet 20in is distributed to multiple first cooling channels 211a via the first connecting channel 221a. The distributed refrigerant then collects in the third connecting channel 223a. The collected refrigerant is then redistributed to multiple second cooling channels 212a via the third connecting channel 223a. The redistributed refrigerant then collects again in the second connecting channel 222a and flows out from the outlet 20out.

[0059] As shown in Figure 2, the inlet pipe Pin is connected to the first connecting pipe 221, and the outlet pipe Pout is connected to the second connecting pipe 222. The inlet pipe Pin and the outlet pipe Pout are positioned at openings formed in the case 10, and are arranged to span both the inside and outside of the case 10. External piping (not shown) is connected to the inlet pipe Pin and the outlet pipe Pout, and they are connected to the discharge port and suction port of the circulation pump.

[0060] As shown in Figure 4, the first cooling tube 211 and the second cooling tube 212 are arranged in a straight line in the X direction. The Y-direction dimension (thickness dimension) and Z-direction dimension (height dimension) are common to both the first cooling tube 211 and the second cooling tube 212. In the example shown in Figure 4, the Z-direction dimension (height dimension) is common to both the first and second electrical components, but it may be different.

[0061] The main terminals of the first electrical component and the second electrical component extend in the same direction (downward) relative to the 5m of the encapsulant. The extension lengths of these main terminals are the same. These main terminals are connected by busbars 50 according to the electrical wiring shown in Figure 1. Busbars 50 include P busbars, N busbars, and O busbars. The P busbars form part of the P line VP. The N busbars form part of the N line VN. The O busbars form part of the output lines Vu, Vv, and Vw.

[0062] The signal terminals 5b of power cards M1u to B2 extend from the encapsulation 5m on the opposite side (upper side) from the main terminals. The extension length of these signal terminals 5b is the same. These signal terminals 5b are inserted and mounted on the control board 8. The control board 8 is positioned so that its surface is perpendicular to the Z direction. As shown in Figure 2, the control board 8 is positioned to cover all signal terminals 5b from above. In the example shown in Figure 2, the control board 8 is positioned to cover all first electrical components from above. Furthermore, the control board 8 is also positioned to cover all second electrical components from above. The control board 8 is positioned to span both at least a portion of the first electrical components and at least a portion of the second electrical components.

[0063] As shown in Figure 2, multiple carded components M1u~S and cooling tubes 211, 212 are pressed in the stacking direction by a pressurizing member 20sp. For example, a leaf spring is used for the pressurizing member 20sp. This causes the carded components M1u~S and cooling tubes 211, 212 to press against each other in the stacking direction, improving their contact. This improves the amount of heat dissipated from the carded components M1u~S to the cooling tubes 211, 212. An electrical insulator with good thermal conductivity (e.g., thermal grease) may be interposed between the carded components M1u~S and the cooling tubes 211, 212. Alternatively, the thermal grease may be omitted, allowing the carded components M1u~S and cooling tubes 211, 212 to be in direct contact.

[0064] As shown in Figure 5, the first connecting pipe 221, the second connecting pipe 222, and the third connecting pipe 223 each have multiple divided pipes 22A and 22B that are connected to one another. In other words, the connecting pipe is formed by connecting multiple divided pipes 22A and 22B in series in the Y direction. These divided pipes include the first divided pipe 22A and the second divided pipe 22B, which have different lengths from each other. As shown in Figure 5, the length of the second divided pipe 22B is longer than the length of the first divided pipe 22A.

[0065] As mentioned earlier, the multiple card components M1u~S include cards with different thicknesses. Therefore, the second split tube 22B is positioned adjacent to the card components with larger thicknesses. Of the multiple card components M1u~S, the power cards M1u~B2 have the smallest thickness.

[0066] Here, in the laminate consisting of card components M1u~S and a cooler 20, the card regions A1 and A2 in the stacking direction required for one card component and a cooling pipe differ according to the thickness dimension of the corresponding card component. The card region A1 corresponding to one power card M1u~B2 is the smallest among multiple card regions. The thickness dimension of the card components is set such that the Y-direction dimension of a card region larger than card region A1 is an integer multiple of the Y-direction dimension of card region A1. For example, the thickness dimension of snubber card C1 is set such that the Y-direction dimension of card region A2 corresponding to snubber card C1 is twice that of card region A1.

[0067] In the example shown in Figure 5, two first division pipes 22A are located in the portion of the first connecting pipe 221 adjacent to the power card M1u, and two first division pipes 22A are located in the portion adjacent to the power card M1v. In other words, four first division pipes 22A are located adjacent to the two power cards. On the other hand, two first division pipes 22A and one second division pipe 22B are located in the portion of the second connecting pipe 222 adjacent to the snubber card C1. As a result, the Y-direction dimensions of the two card areas A1 of the first connecting pipe 221 and the Y-direction dimension of the one card area A2 of the second connecting pipe 222 are the same.

[0068] As shown in Figures 6 and 7, two types of piping members are used to form the first cooling pipe 211 and the second cooling pipe 212. The piping member shown in Figure 6 is an integrated cooling pipe 21A, and the piping member shown in Figure 7 is a separate cooling pipe 21B.

[0069] The integrated cooling pipe 21A has the first cooling pipe 211 and the second cooling pipe 212 formed as one unit. In other words, the integrated cooling pipe 21A includes both the first cooling pipe 211 and the second cooling pipe 212. The separate cooling pipe 21B forms either the first cooling pipe 211 or the second cooling pipe 212. In other words, the first cooling pipe 211 and the second cooling pipe 212 are separate pipes.

[0070] Figures 6 and 7 show the state in which the first divided pipe 22A is connected to the integrated cooling pipe 21A and the separate cooling pipe 21B. The integrated cooling pipe 21A and the separate cooling pipe 21B have a first cooling channel 211a and a second cooling channel 212a formed inside, as well as a through hole 21h. The through hole 21h communicates with the through hole 22h formed in the first divided pipe 22A. As a result, the first connecting channel 221a, the second connecting channel 222a, and the third connecting channel 223a communicate with either the first cooling channel 211a or the second cooling channel 212a. The cooler 20 shown in Figure 3 is formed by combining the integrated cooling pipe 21A, the separate cooling pipe 21B, the first divided pipe 22A, and the second divided pipe 22B.

[0071] <Summary Group A> In the power converter according to this embodiment, in addition to the power cards M1u to B2, other electrical components such as capacitor cards C1 to C4, reactor cards L1 and L2, and sensor card S are also stacked and cooled on both sides. Therefore, various types of electrical components can be cooled effectively. Furthermore, the card components as electrical components and the components of the cooler 20 can be easily standardized for each of several types of power converters with different capacities. The components of the cooler 20 are the cooling pipes 211 and 212 and the connecting pipes 221, 222, and 223.

[0072] In this configuration, electrical components are stacked in multiple rows (for example, two rows). Therefore, compared to stacking in a single row, the size of the stack consisting of carded components M1u~S and the cooler 20 can be reduced in the stacking direction. Furthermore, this reduction in size in the stacking direction reduces the vibrations described below. Specifically, the stack is supported at both ends in the stacking direction and pressed by the pressure member 20sp. As a result, the central part in the stacking direction becomes an antinode, making it prone to large vertical vibrations. Therefore, according to this embodiment, which allows for reduction in size in the stacking direction, the length between the end supports can be shortened, thereby reducing the amplitude of the antinodes.

[0073] Furthermore, according to this embodiment, the cooler 20 includes a first cooling pipe 211, a second cooling pipe 212, a first connecting pipe 221, and a second connecting pipe 222, as well as a third connecting pipe 223. Therefore, the refrigerant distributed by the first connecting pipe 221 and flowing through the first cooling pipe 211 is redistributed to the second cooling pipe 212 by the third connecting pipe 223 before it can be collected in the second connecting pipe 222. Thus, it is possible to distribute the refrigerant to a flow rate that corresponds to the cooling capacity required for each of the first and second electrical components.

[0074] The technical considerations for how to set the arrangement of the card components M1u~S are explained below. For example, the power cards M1u~B2 among the card components M1u~S generate more heat than the other cards. Therefore, it is desirable to increase the refrigerant flow rate of the cooling pipe in the part of the first cooling pipe 211 that is in contact with the power cards M1u~B2. Also, the capacitor cards C1~C4 have lower heat resistance than the other cards. Therefore, it is desirable to increase the refrigerant flow rate of the cooling pipes in the parts of the first cooling pipe 211 and the second cooling pipe 212 that are in contact with the capacitor cards C1~C4.

[0075] On the other hand, the refrigerant flow rate decreases the further away the refrigerant passage is from the inlet 20in within the cooler 20. In other words, the flow rate decreases and the cooling capacity decreases as the flow path lengthens. Also, the refrigerant flow rate increases with a larger pressure difference, so the flow rate tends to be lower upstream of a high-pressure section and higher downstream. For example, if there is a high-pressure section in the second cooling passage 212a, the flow rate in the adjacent first cooling passage 211a tends to be lower. In short, the refrigerant flow rate distribution is determined by the pressure distribution inside the cooler 20.

[0076] Considering the above points, the arrangement of the card components M1u~S (electrical components) is determined by taking into account the heat generation and heat resistance of the card components M1u~S, the length of the refrigerant flow path, and the pressure distribution inside the cooler 20.

[0077] Furthermore, in this embodiment, the number of first cooling channels 211a and the number of second cooling channels 212a are different. Therefore, the effect of redistribution by the third connecting pipe 223 becomes more pronounced, making it easier to distribute the refrigerant to a flow rate that corresponds to the cooling capacity required for each electrical component.

[0078] Furthermore, in this embodiment, an inlet 20in for introducing refrigerant is formed in the first connecting pipe 221, and an outlet 20out for introducing refrigerant is formed in the second connecting pipe 222. Therefore, compared to, for example, the case where the inlet 20in and outlet 20out are formed in the third connecting pipe 223, it is possible to distribute the refrigerant to a flow rate that corresponds to the cooling capacity required for each electrical component.

[0079] Furthermore, in this embodiment, at least one of the first cooling tubes 211 is a separate pipe, i.e., a separate cooling tube 21B, from the second cooling tube 212. Therefore, it is easy to make the number of first cooling channels 211a and the number of second cooling channels 212a different. In addition to arranging the first cooling tubes 211 and the second cooling tubes 212 parallel to each other, it is also easy to arrange the first cooling tubes 211 and the second cooling tubes 212 non-parallel to each other.

[0080] Furthermore, in this embodiment, at least one of the first cooling tubes 211 is an integrated pipe with the second cooling tube 212, i.e., an integrated cooling tube 21A. Therefore, the number of cooling tube components can be reduced.

[0081] Furthermore, in this embodiment, the first connecting pipe 221, the second connecting pipe 222, and the third connecting pipe 223 each have a plurality of divided pipes 22A and 22B that are connected to one another. Therefore, by adjusting the number of divided pipes 22A and 22B that are connected, the stacking pitch of the first cooling pipe 211 or the second cooling pipe 212 can be adjusted. Thus, it is possible to share the divided pipes 22A and 22B for multiple types of coolers 20 with different stacking pitches.

[0082] Furthermore, in this embodiment, the divided pipe includes a first divided pipe 22A and a second divided pipe 22B, which have different lengths. Therefore, instead of connecting many divided pipes with short lengths, a divided pipe with a long length can be used, thus reducing the number of divided pipes used.

[0083] <Summary Group B> In the power conversion device according to this embodiment, the first electrical components include power cards M1u to B2 having switching elements 5 that form a power conversion circuit. The second electrical components include other electrical components having functions different from the switching elements 5. Specific examples of other electrical components include capacitor cards C1 to C4, reactor cards L1 and L2, and sensor card S. The second electrical components are electrical components stacked in the Y direction at a position offset in the X direction from a plurality of first electrical components stacked in the Y direction.

[0084] In this embodiment, in order to cool other electrical components together with the power cards M1u to B2 using the cooler 20 on both sides, the card components M1u to S are stacked in multiple rows. In this case, if the power cards are arranged side by side in the X direction, contrary to this embodiment, the downstream power cards will be more susceptible to heat damage from the upstream power cards. That is, the refrigerant reaching the downstream power cards will have its temperature raised by the upstream power cards. As a result, the downstream power cards will tend to become hotter than the upstream power cards, causing temperature variations between the two power cards. Consequently, performance variations will occur between the two power cards, leading to a decrease in the performance of the inverter circuit or boost circuit.

[0085] In light of this, in this embodiment, when stacking the card components M1u to S in multiple rows, a second electrical component with a different function from the switching element 5 is included. In short, the power cards are not arranged side by side in the X direction. Therefore, the concern about heat damage mentioned above can be reduced, and performance variations between power cards M1u to B2 can be suppressed. Thus, performance degradation of the inverter circuit or boost circuit provided by power cards M1u to B2 can be suppressed.

[0086] Examples of capacitor cards as second electrical components (other electrical components) include snubber cards C1 and C2, smoothing card C3, and filter card C4. When snubber cards C1 and C2, as second electrical components, are placed next to the power card, as the first electrical component, the busbar connecting the snubber card and the power card can be shortened. This reduces the impedance caused by the busbar and improves the functionality of the snubber card. Similarly, when smoothing card C3 is placed next to the power card, the busbar connecting the smoothing card and the power card can be shortened. This reduces the impedance caused by the busbar and improves the functionality of the smoothing card.

[0087] Furthermore, in this embodiment, the multiple power cards M1u to B2 are not included in the second electrical component, but are consolidated into the first electrical component. Therefore, performance variations due to thermal damage can be suppressed in all power cards M1u to B2.

[0088] Furthermore, instead of consolidating all power cards, some power cards may be consolidated into the first electrical component, as exemplified below. For example, power cards for common inverter circuits may be consolidated. For example, three power cards M1u, M1v, and M1w may be consolidated, or three power cards M2u, M2v, and M2w may be consolidated. Alternatively, all (six) power cards M1u to M2w related to two inverter circuits may be consolidated into the first electrical component. Also, power cards for common boost circuits may be consolidated into the first electrical component. Furthermore, all (two) power cards B1 and B2 related to two boost circuits may be consolidated into the first electrical component. Additionally, power cards for inverter circuits and boost circuits may be consolidated into the first electrical component.

[0089] Here, the switching element 5 included in the power card is a heat-generating element, while the capacitor element included in the capacitor card does not generate heat. In that sense, it is desirable to prioritize cooling the power card over the capacitor card. On the other hand, the capacitor element has lower heat resistance than the switching element 5. In that sense, it is desirable to prioritize cooling the capacitor card over the power card. Furthermore, cooling the power card addresses the instantaneous heat generation of the power card and contributes to an instantaneous increase in output. On the other hand, since it takes time for the capacitor card to rise in temperature and reach saturation, cooling the capacitor card contributes to a continuous increase in output.

[0090] In light of these points, in this embodiment, in the plurality of first cooling channels 211a and the plurality of second cooling channels 212a, at least one of the power cards relating to the first electrical component is positioned upstream of the capacitor cards C1 to C4. For example, as shown in Figure 3, power cards M1u, M1v, and M1w are positioned upstream of the corresponding snubber card C1. Power cards M2u, M2v, and M2w are positioned upstream of the corresponding snubber card C2. Power cards M1u to B2 are positioned upstream of the smoothing card C3. Therefore, since the power cards can be cooled with priority over the capacitor cards, the instantaneous output boost of the power converter can be improved.

[0091] Contrary to this embodiment, the capacitor card may be placed upstream of the power card. This allows the capacitor card to be cooled with priority over the power card, thereby improving the continuous output increase of the power converter.

[0092] <Summary Group C> In the power converter according to this embodiment, the snubber cards C1 and C2 (snubber capacitors) are positioned to be cooled by the cooling units 211 and 212. In other words, when arranging the snubber capacitors within the case 10, they are incorporated into the laminate. Therefore, compared to the case where the snubber capacitors are placed outside the laminate, the busbar connecting the snubber capacitors and the power cards can be shortened. The effects of this will be explained below.

[0093] By incorporating a snubber capacitor into the laminated structure and shortening the busbar, the connection path between the snubber capacitor and the power card (hereinafter referred to as the loop circuit) can be shortened. A shorter loop circuit path length results in a smaller inductance. However, increasing the switching speed of the power card increases the surge voltage as a trade-off for reducing inverter losses. Therefore, the switching speed is constrained so that the surge voltage does not exceed the breakdown voltage. In this embodiment, as described above, the surge voltage is reduced as the path inductance decreases. Consequently, the switching speed can be increased, and inverter losses can be reduced. In other words, the degree to which the AC output power is smaller than the DC input power can be reduced, improving inverter efficiency. Furthermore, the reduced path inductance of the loop circuit also improves the effect of the snubber capacitor in absorbing switching surges.

[0094] Furthermore, in this embodiment, snubber cards C1 and C2 are positioned adjacent to power cards M1u to M2w. In the example shown in Figure 2, one snubber card C1 is provided for the three power cards M1u, M1v, and M1w related to the first inverter circuit. One snubber card C2 is provided for the three power cards M2u, M2v, and M2w related to the second inverter circuit.

[0095] Furthermore, power cards M1u and M1v and snubber card C1 are adjacent in the X direction. Therefore, the loop circuit between power cards M1u, M1v, and M1w and snubber card C1 can be shortened, improving the inverter efficiency of the first inverter circuit. Also, power card M2u and snubber card C2 are adjacent in the X direction. Therefore, the loop circuit between power cards M2u, M2v, and M2w and snubber card C2 can be shortened, improving the inverter efficiency of the second inverter circuit.

[0096] In this embodiment, the snubber card and power card are positioned adjacent to each other in the X direction. Alternatively, the snubber card and power card may be positioned adjacent to each other in the Y direction (stacking direction).

[0097] Furthermore, in this embodiment, the smoothing card C3 (smoothing capacitor) is positioned in a location where it is cooled by the cooling units 211 and 212. In other words, when arranging the smoothing capacitor within the case 10, it is incorporated into the laminate. Therefore, compared to the case where the smoothing capacitor is placed outside the laminate, the busbar connecting the smoothing capacitor and the power card can be shortened. As a result, the loop circuit between the smoothing capacitor and the power card can be shortened, and the path inductance of the loop circuit can be reduced. Thus, inverter losses can be reduced in the same way as the above effect of the snubber card, and the improvement of inverter efficiency can be promoted.

[0098] Furthermore, in this embodiment, the smoothing card C3 is positioned adjacent to the power card M1u. In the example shown in Figure 2, one power card M1u and the smoothing card C3 related to the first inverter circuit are adjacent in the Y direction. Therefore, the loop circuit between the power cards M1u, M1v, M1w and the smoothing card C3 can be shortened, and the inverter efficiency of the first inverter circuit can be improved.

[0099] In this embodiment, the smoothing card and power card are positioned adjacent to each other in the Y direction (stacking direction). Alternatively, the smoothing card and power card may be positioned adjacent to each other in the X direction.

[0100] (Second Embodiment) As shown in Figures 8 and 9, the first cooling tube 211 in this embodiment has a first cooling fin 211f, and the second cooling tube 212 has a second cooling fin 212f. The first cooling fin 211f is pin-shaped and protrudes from the wall surface of the first cooling tube 211 and is arranged in the first cooling channel 211a. The second cooling fin 212f is pin-shaped and protrudes from the wall surface of the second cooling tube 212 and is arranged in the second cooling channel 212a.

[0101] In one first cooling tube 211, the total surface area of ​​the inner wall surface facing the first cooling passage 211a is defined as the first total area, and the flow resistance of the refrigerant in one first cooling tube 211 is defined as the first flow resistance. Similarly, in one second cooling tube 212, the total surface area facing the second cooling passage 212a is defined as the second total area, and the flow resistance of the refrigerant in one second cooling tube 212 is defined as the second flow resistance. By making the first total area and the second total area different, the first flow resistance and the second flow resistance are made different.

[0102] In the examples shown in Figures 8 and 9, the number of first cooling fins 211f is increased to be greater than the number of second cooling fins 212f, thereby increasing the first flow resistance above the second flow resistance. The pin shape and size are the same for both the first cooling fins 211f and the second cooling fins 212f.

[0103] According to this embodiment, since the flow resistance of the refrigerant is made different in the first cooling channel 211a and the second cooling channel 212a, it is easier to achieve a desired pressure distribution inside the cooler 20. Therefore, it is easier to optimize the cooling capacity for each of the carded components M1u to S (electrical components), taking into account the amount of heat generated and the heat resistance of each component.

[0104] Alternatively, instead of adjusting the flow resistance by adjusting the number of fins as described above, the flow resistance may be adjusted by adjusting the shape and size of the fins. Or, the flow resistance may be adjusted by the presence or absence of fins.

[0105] Furthermore, the first cooling fin 211f and the second cooling fin 212f are not limited to a pin shape, but may also be plate-shaped as shown in Figure 10. In addition, when forming plate-shaped fins, they may be straight, extending linearly in the X direction as shown on the right side of Figure 10, or they may be wave-shaped as shown on the left side of Figure 10.

[0106] (Third embodiment) In the example shown in Figure 4, the first cooling pipe 211 and the second cooling pipe 212 are arranged in a straight line in the X direction. That is, the direction in which the first cooling pipe 211 extends and the direction in which the second cooling pipe 212 extends are parallel. In contrast, in this embodiment, as shown in Figure 11, the direction in which the first cooling pipe 211 extends intersects with the direction in which the second cooling pipe 212 extends. Also, in this embodiment, as shown in Figure 12, the first cooling pipe 211 and the second cooling pipe 212 are separate pipes. The first cooling pipe 211 and the second cooling pipe 212 are connected to each other by the first dividing pipe 22A and are positioned at different locations in the Y direction.

[0107] As described above, according to this embodiment, since the first cooling tube 211 and the second cooling tube 212 are separate components, the intersection angle of these cooling tubes can be adjusted. For example, the first cooling tube 211 and the second cooling tube 212 can be arranged non-parallel, and by adjusting the intersection angle of the cooling tubes, the degree of freedom in the arrangement layout of the laminate can be improved.

[0108] In the modified example shown in Figure 13, the first cooling pipe 211 and the second cooling pipe 212 are non-parallel and arranged in directions that intersect each other, similar to the third embodiment described above. However, in this modified example, the first cooling pipe 211 and the second cooling pipe 212 are a single integrated pipe. Furthermore, as shown in Figure 14, the first cooling pipe 211 and the second cooling pipe 212 are arranged in a straight line in the X direction.

[0109] (Fourth Embodiment) In the first embodiment described above, the outflow pipe Pout is connected to the second connecting pipe 222. In contrast, in this embodiment, as shown in Figure 15, the outflow pipe Pout is connected to the third connecting pipe 223.

[0110] Specifically, the cooler 20 is equipped with a bypass pipe 23. One end of the bypass pipe 23 is connected to the second connecting pipe 222, and the other end of the bypass pipe 23 is connected to the third connecting pipe 223. An outlet pipe Pout is also connected to the other end of the bypass pipe 23. Furthermore, a flow-stopping cover 24 is attached to the third connecting pipe 223, thereby blocking communication between the third connecting pipe 223 and the bypass pipe 23.

[0111] As described above, the refrigerant flow path from the inlet 20in to the outlet 20out is the same in this embodiment as in the embodiments described above. However, the outlet pipe Pout can be connected to the third connecting pipe 223 instead of the second connecting pipe 222.

[0112] (Fifth embodiment) In each of the embodiments described above, there is one laminate consisting of the cooler 20 and electrical components. In contrast, in this embodiment, as shown in Figures 16 and 17, two laminates are arranged side by side in the Z direction. The laminate located in the upper position of the two laminates is described as the upper laminate 201, and the laminate located in the lower position is described as the lower laminate 202. The upper laminate 201 and the lower laminate 202 each have the same structure as the laminates in each of the embodiments described above.

[0113] The upper laminate 201 and the lower laminate 202 are connected by a connecting pipe 25 (connecting section). The connecting pipe 25 forms a connecting channel inside. The connecting channel connects one of the first cooling channel, second cooling channel, first connecting channel, second connecting channel, and third connecting channel to one of the third cooling channel, fourth cooling channel, fourth connecting channel, fifth connecting channel, and sixth connecting channel. As a result, the refrigerant is shared between the two laminates.

[0114] In this embodiment, the filter card C4, power cards B1, B2, and reactor cards L1, L2 of the first embodiment described above have been moved from the upper stack (upper stack 201) to the lower stack (lower stack 202). The moved cards are described as filter card C4x, power cards B1x, B2x, and reactor cards L1x, L2x. Filter card C4x and power cards B1x, B2x correspond to the third electrical component. Reactor cards L1x, L2x correspond to the fourth electrical component.

[0115] The upper laminate 201 comprises a first electrical component, a second electrical component, a first cooling pipe 211, a second cooling pipe 212, a first connecting pipe 221, a second connecting pipe 222, and a third connecting pipe 223. The lower laminate 202 comprises a third electrical component, a fourth electrical component, a third cooling pipe 211x, a fourth cooling pipe 212x, a fourth connecting pipe 221x, a fifth connecting pipe 222x, and a sixth connecting pipe 223x.

[0116] The cooling tubes 211x and 212x are stacked in the Y direction together with the third and fourth electrical components, cooling each of the electrical components from both sides in the stacking direction. The cooling tubes 211x and 212x include multiple third cooling tubes 211x and multiple fourth cooling tubes 212x. The third cooling tubes 211x are pipes extending in the X direction, stacked alternately with the third electrical components, and cooling the third electrical components from both sides. The fourth cooling tubes 212x are pipes extending in the X direction, stacked alternately with the fourth electrical components, and cooling the fourth electrical components from both sides.

[0117] The third cooling tube 211x and the fourth cooling tube 212x correspond to the third cooling section and the fourth cooling section. The liquid coolant flow paths formed inside the third cooling tube 211x and the fourth cooling tube 212x correspond to the third cooling path 211ax and the fourth cooling path 212ax.

[0118] Due to the difference in the number of components aligned in the stacking direction between the third and fourth electrical components, the number of components aligned in the stacking direction differs between the third cooling channel 211ax and the fourth cooling channel 212ax. In other words, the number of third cooling tubes 211x and the fourth cooling tubes 212x differs.

[0119] The connecting pipes 221x, 222x, and 223x are pipes that extend in a direction perpendicular to the direction in which the cooling pipes 211x and 212x extend (for example, the Y direction). The connecting pipes 221x, 222x, and 223x include the fourth connecting pipe 221x, the fifth connecting pipe 222x, and the sixth connecting pipe 223x. The fourth connecting pipe 221x, the fifth connecting pipe 222x, and the sixth connecting pipe 223x correspond to the fourth connection section, the fifth connection section, and the sixth connection section. The liquid refrigerant flow paths formed inside the fourth connecting pipe 221x, the fifth connecting pipe 222x, and the sixth connecting pipe 223x correspond to the fourth connecting flow path 221ax, the fifth connecting flow path 222ax, and the sixth connecting flow path 223ax.

[0120] The fourth connecting pipe 221x is connected to one end (upstream end) of multiple third cooling pipes 211x. The fifth connecting pipe 222x is connected to one end (downstream end) of multiple fourth cooling pipes 212x. The sixth connecting pipe 223x is connected to the other ends (downstream ends) of multiple fourth cooling pipes 212x, as well as the other ends (upstream ends) of multiple fourth cooling pipes 212x. The aforementioned connecting pipe 25 includes the first connecting pipe 251 and the second connecting pipe 252. The first connecting pipe 251 connects the first connecting pipe 221 and the fourth connecting pipe 221x. The second connecting pipe 252 connects the second connecting pipe 222 and the fifth connecting pipe 222x.

[0121] The refrigerant flowing from the inlet 20in into the first connecting channel 221a is distributed to multiple first cooling channels 211a, and also to the fourth connecting channel 221ax via the first connecting pipe 251. The refrigerant distributed to the fourth connecting channel 221ax is then distributed to multiple third cooling channels 211ax. Subsequently, the refrigerant distributed to the third cooling channels 211ax gathers in the sixth connecting channel 223ax. The gathered refrigerant is then redistributed to multiple fourth cooling channels 212ax via the sixth connecting channel 223ax. Subsequently, the distributed refrigerant gathers again in the fifth connecting channel 222ax, flows into the second connecting channel 222a via the second connecting pipe 252, and then flows out from the outlet 20out.

[0122] As shown in Figure 18, the case 10 according to this embodiment is formed integrally with the motor case 10M that houses the motor MG1. For example, the case 10 and the motor case 10M may be integrally molded by die casting or the like, or they may be integrally assembled by fastening with bolts or joining by welding or the like. The orientation of the case 10 and the motor case 10M is set so that the direction in which the rotation axis of the motor MG1 extends is the X direction.

[0123] Here, the outer surface 10Ma of the motor case 10M tends to have a curved arc shape around the axis of rotation. Therefore, when mounting the motor MG1 on a vehicle, the portion along the outer surface 10Ma of the motor case 10M tends to become dead space and is difficult to utilize effectively. In consideration of this point, in this embodiment, the laminate is divided into two layers: an upper laminate 201 and a lower laminate 202. Therefore, as shown in Figure 18, it becomes possible to arrange the two layers of laminate along the outer surface 10Ma of the motor case 10M, thereby promoting the effective utilization of dead space.

[0124] (Sixth Embodiment) In the first embodiment described above, the vehicle is equipped with two drive motors, and each drive motor is driven and controlled by a separate inverter circuit. In contrast, in this embodiment, as shown in Figure 19, one drive motor is driven and controlled by two inverter circuits. Furthermore, there is no boost circuit, and power cards B1 and B2 have been eliminated. Filter card C4 has also been eliminated.

[0125] As shown in Figure 20, the electrical components cooled by the cooler 20 include power cards M1u, M1v, M1w, M2u, M2v, M2w, snubber cards C1, C2, smoothing card C3, and sensor card S. The laminate according to the first embodiment above includes one sensor card S, as shown in Figure 3. In contrast, this embodiment includes two sensor cards S, as shown in Figure 20. Furthermore, this embodiment includes four smoothing cards C3.

[0126] Thus, the carded components and the components of the cooler 20 can be standardized between the first embodiment and this embodiment. The components of the cooler 20 are the cooling pipes 211, 212 and the connecting pipes 221, 222, and 223. In other words, the power conversion device with the electrical circuit configuration shown in Figure 1 and the power conversion device with the electrical circuit configuration shown in Figure 19 can be made more compatible with the carded components and the cooler 20, thereby promoting the standardization of components in the laminate.

[0127] (Seventh Embodiment) As shown in Figures 21 and 22, in this embodiment, a boost circuit is added to the power converter according to the sixth embodiment, and one inverter circuit is eliminated. Specifically, a reactor card L1 and a filter card C4 are added to the laminate according to the sixth embodiment, and power cards M2u, M2v, M2w and snubber cards C1 and C2 are eliminated.

[0128] Thus, the carded components and the components of the cooler 20 can be standardized between the embodiments described above and this embodiment. In other words, the standardization of carded components and the cooler 20 can be promoted between the electrical circuit configurations of each embodiment and the electrical circuit configuration of this embodiment, thereby promoting the standardization of components in the laminate.

[0129] (Eighth embodiment) In this embodiment, the cooler 20 according to each of the above embodiments is modified as follows. Note that for components other than the cooler 20, the same structural components are denoted by the same reference numerals and described accordingly. The power conversion device according to this embodiment includes a storage case 100 as shown in Figures 23 and 24. The storage case 100 has a storage chamber 100a for storing liquid refrigerant. The halftone hatches in the figures indicate liquid refrigerant. The storage case 100 has an inlet 100b for introducing refrigerant into the storage chamber 100a and an outlet 100c for releasing refrigerant from the storage chamber 100a. The material of the storage case 100 may be metal or resin.

[0130] The first and second electrical components are located in the storage chamber 100a. In the example shown in Figure 23, the power cards M1u, M1v, M1w, B1 and filter card C4 correspond to the first electrical components. The snubber card C1, smoothing card C3 and reactor card L1 correspond to the second electrical components. In other words, these first and second electrical components are housed in the storage case 100, immersed in the liquid refrigerant in the storage chamber 100a.

[0131] The storage case 100 has an inlet 100b for introducing refrigerant into the storage chamber 100a, and an outlet 100c for releasing refrigerant from the storage chamber 100a. An inlet pipe Pin is connected to the inlet 100b, and an outlet pipe Pout is connected to the outlet 100c. The storage case 100 has an opening 100d. The first and second electrical components are inserted into the storage chamber 100a through the opening 100d. The opening 100d is closed by a cover 190 attached to the storage case 100.

[0132] As shown in Figure 24, multiple openings 190a are formed in the portion of the cover 190 facing the first and second electrical components. The upper parts of the first and second electrical components are inserted into the openings 190a. As a result, the main terminals 5a and signal terminals 5b located on the top of the power cards M1u, M1v, M1w, and B1 are located outside the storage chamber 100a. Similarly, for the filter card C4, snubber card C1, smoothing card C3, and reactor card L1, the main terminals 1a and 2a are located outside the storage chamber 100a.

[0133] Multiple electrical components are stacked in the Y direction. In the example shown in Figure 23, they are stacked in two columns, and the two columns are aligned in the X direction. Of the multiple electrical components, the electrical components in the column on the left in Figure 23 correspond to the first electrical components, and the electrical components in the column on the right correspond to the second electrical components.

[0134] The portion of the storage chamber 100a located between adjacent first electrical components corresponds to the first cooling channel 111a. Furthermore, the portion between the first electrical components located at the end in the stacking direction and the side walls 103 and 104 of the storage case 100 also corresponds to the first cooling channel 111a.

[0135] The portion of the storage chamber 100a located between adjacent second electrical components corresponds to the second cooling channel 112a. Furthermore, the portion between the second electrical component located at the end in the stacking direction and the side walls 103 and 104 of the storage case 100 also corresponds to the second cooling channel 112a.

[0136] The dashed line in Figure 23 indicates the first connection channel 121a, the second connection channel 122a, and the third connection channel 123a, which are described below. The portion of the storage chamber 100a between the sides of the multiple first electrical components and the side wall 101 of the storage case 100 corresponds to the first connection channel 121a. The portion of the storage chamber 100a between the sides of the multiple second electrical components and the side wall 102 of the storage case 100 corresponds to the second connection channel 122a. The portion of the storage chamber 100a between the sides of the multiple first electrical components and the sides of the multiple second electrical components corresponds to the third connection channel 123a. The third connection channel 123a is located between the first connection channel 121a and the second connection channel 122a.

[0137] These channels essentially have the connection relationships shown in Figure 25. Specifically, one end (upstream end) of multiple first cooling channels 111a is connected to the first connecting channel 121a. One end (downstream end) of the second cooling channel 112a is connected to the second connecting channel 122a. The other ends (downstream ends) of multiple first cooling channels 111a are connected to the third connecting channel 123a, as well as the other ends (upstream ends) of multiple second cooling channels 112a.

[0138] The refrigerant flowing in from the inlet 20in is distributed to multiple first cooling channels 111a through the first connecting channel 121a. The distributed refrigerant then collects in the third connecting channel 123a. The collected refrigerant is then redistributed to multiple second cooling channels 112a by the third connecting channel 123a. The redistributed refrigerant then collects again in the second connecting channel 122a and flows out from the outlet 20out.

[0139] As described above, the storage case 100 provides multiple refrigerant passages and corresponds to a cooler for cooling electrical components. Of the bottom wall of the storage case 100, the portion forming the first connecting passage 121a corresponds to the first connection part 121, the portion forming the second connecting passage 122a corresponds to the second connection part 122, and the portion forming the third connecting passage 123a corresponds to the third connection part 123. Furthermore, of the bottom wall of the storage case 100, the portion forming the first cooling passage 111a corresponds to the first cooling part 111, and the portion forming the second cooling passage 112a corresponds to the second cooling part 112.

[0140] The storage chamber 100a is equipped with passage width adjustment members 106 and 107. The passage width adjustment member 106 is attached to the bottom wall of the storage case 100, and the passage width adjustment member 107 is attached to the bottom wall and side wall 103 of the storage case 100. These passage width adjustment members 106 and 107 may also be attached to the first electrical component or the second electrical component.

[0141] The passage width adjustment members 106 and 107 function to reduce the cross-sectional area of ​​the second cooling passage 112a, thereby increasing the flow resistance. In other words, the flow of refrigerant is made more difficult in the passages where the passage width adjustment members 106 and 107 are placed, reducing the flow rate. As a result, the flow rate of refrigerant increases in the passages where the passage width adjustment members 106 and 107 are not placed. In short, by adjusting the position and size of the passage width adjustment members 106 and 107, the flow resistance shown in Figure 25 can be adjusted, and the flow rate of refrigerant in each passage can be adjusted.

[0142] As described below, the power conversion device according to this embodiment also exhibits the same effects as the first embodiment described above.

[0143] <Summary Group A> According to the power converter of this embodiment, in addition to the power cards M1u to B2, other electrical components such as capacitor cards C1 to C4, reactor cards L1 and L2, and sensor card S are also placed in the storage chamber 100a and cooled. Therefore, various types of electrical components can be effectively cooled. Furthermore, it is possible to easily standardize the card components as electrical components for each of several types of power converters with different capacities.

[0144] Furthermore, in the power conversion device according to this embodiment, the electrical components are stacked in multiple rows (for example, two rows). Therefore, compared to the case where the components are stacked in a single row, the size of the storage case 100 can be reduced in the stacking direction.

[0145] Furthermore, according to this embodiment, the storage case 100, which serves as a cooler, includes a first cooling section 111, a second cooling section 112, a first connection section 121, and a second connection section 122, as well as a third connection section 123. Therefore, the refrigerant distributed at the first connection section 121 and flowing through the first cooling section 111 is redistributed to the second cooling section 112 by the third connection section 123 before it can be collected at the second connection section 122. Thus, it is possible to distribute the refrigerant at a flow rate corresponding to the cooling capacity required for each of the first and second electrical components.

[0146] <Summary Group B> In the power conversion device according to this embodiment, the first electrical components and the second electrical components are housed in a storage case 100. The first electrical components include power cards M1u, M1v, M1w, and B1, each having a switching element 5 that forms a power conversion circuit. The second electrical components include a snubber card C1, a smoothing card C3, and a reactor card L1, which are electrical components with functions different from the switching element 5. The second electrical components are stacked in the Y direction at a position offset in the X direction from a plurality of first electrical components stacked in the Y direction.

[0147] In this embodiment, in order to cool other electrical components together with the power cards M1u, M1v, M1w, and B1 in the storage case 100 on both sides, the carded components are stacked in multiple rows. In this case, if the power cards are arranged side by side in the X direction, contrary to this embodiment, the downstream power cards will be more susceptible to heat damage from the upstream power cards. That is, the refrigerant reaching the downstream power cards will have its temperature raised by the upstream power cards. As a result, the downstream power cards will tend to become hotter than the upstream power cards, causing temperature variations between the two power cards. Consequently, performance variations will occur between the two power cards, leading to a decrease in the performance of the inverter circuit or boost circuit.

[0148] In light of this, in this embodiment, when stacking multiple card components in rows, a second electrical component with a different function from the switching element 5 is included. In short, the power cards are not arranged side by side in the X direction. Therefore, the above-mentioned concern about heat damage can be reduced, and performance variations among the power cards M1u, M1v, M1w, and B1 can be suppressed. Thus, performance degradation of the inverter circuit or boost circuit provided by the power cards M1u, M1v, M1w, and B1 can be suppressed.

[0149] Examples of capacitor cards as second electrical components (other electrical components) include snubber card C1, smoothing card C3, and filter card C4. When snubber card C1, as a second electrical component, is placed next to the power card, as a first electrical component, the busbar connecting the snubber card and the power card can be shortened. This reduces the impedance caused by the busbar and improves the functionality of the snubber card. Similarly, when smoothing card C3 is placed next to the power card, the busbar connecting the smoothing card and the power card can be shortened. This reduces the impedance caused by the busbar and improves the functionality of the smoothing card.

[0150] Furthermore, in this embodiment, within the storage case 100, the multiple power cards M1u, M1v, M1w, and B1 are not included in the second electrical component but are consolidated into the first electrical component. Therefore, performance variations due to thermal damage can be suppressed in all power cards.

[0151] Furthermore, in this embodiment, in the plurality of first cooling channels 111a and the plurality of second cooling channels 112a, at least one of the power cards relating to the first electrical component is positioned upstream of the capacitor card. For example, as shown in Figure 23, the power cards M1u, M1v, and M1w are positioned upstream of the corresponding snubber card C1. Power cards M1u and M1w are positioned upstream of the smoothing card C3. Therefore, the power cards can be cooled with priority over the capacitor card, thereby improving the instantaneous output boost of the power converter.

[0152] Contrary to this embodiment, the capacitor card may be placed upstream of the power card. This allows the capacitor card to be cooled with priority over the power card, thereby improving the continuous output increase of the power converter.

[0153] In the example shown in Figure 23, multiple electrical components formed in a flat card shape are stacked in the thickness direction of the card. Alternatively, multiple electrical components may be stacked in the width direction of the card.

[0154] <Summary Group C> In the power converter according to this embodiment, when arranging the snubber capacitor inside the case 10, the snubber card C1 (snubber capacitor) is placed inside the storage case 100. Therefore, compared to the case where the snubber capacitor is placed outside the storage case 100, the busbar connecting the snubber capacitor and the power card can be shortened. The effects of this will be explained below.

[0155] By placing the snubber capacitor inside the storage case 100 and shortening the busbar, the connection path (loop circuit) between the snubber capacitor and the power card can be shortened, and the inductance of the loop circuit path can be reduced. Therefore, the inverter efficiency of the inverter circuit can be improved, and the effect of the snubber capacitor in absorbing switching surges can also be improved.

[0156] Furthermore, in this embodiment, the snubber card C1 is positioned adjacent to the power card M1w. Therefore, the loop circuit between the power card M1w and the snubber card C1 can be shortened, improving the inverter efficiency of the inverter circuit. In this embodiment, the snubber card and power card are positioned adjacent to each other in the X direction. Alternatively, the snubber card and power card may be positioned adjacent to each other in the Y direction (stacking direction).

[0157] Furthermore, in this embodiment, when arranging the smoothing capacitor within the case 10, the smoothing card C3 (smoothing capacitor) is placed inside the storage case 100. Therefore, compared to the case where the smoothing capacitor is placed outside the storage case 100, the busbar connecting the smoothing capacitor and the power card can be shortened. As a result, the loop circuit between the smoothing capacitor and the power card can be shortened, the path inductance of the loop circuit can be reduced, and the inverter efficiency of the inverter circuit can be improved.

[0158] Furthermore, in this embodiment, the smoothing card C3 is positioned adjacent to the power card. In the example shown in Figure 23, the power cards M1u and M1v and the smoothing card C3 are adjacent in the X direction. Therefore, the loop circuit between the power cards M1u and M1v and the smoothing card C3 can be shortened, improving the inverter efficiency of the inverter circuit.

[0159] In this embodiment, the smoothing card and power card are positioned adjacent to each other in the X direction. Alternatively, the smoothing card and power card may be positioned adjacent to each other in the Y direction (stacking direction).

[0160] (Ninth Embodiment) As shown in Figure 26, the first embodiment is modified as follows in this embodiment. First, the third connecting pipe 223 is eliminated in this embodiment. Accordingly, the first cooling pipe 211 and the second cooling pipe 212 are formed as a single unit. Therefore, the refrigerant flowing in from the inlet 20in is distributed to multiple first cooling channels 211a through the first connecting channel 221a. The distributed refrigerant flows directly into the second connecting channel 222a without being redistributed, collects, and flows out from the outlet 20out.

[0161] Furthermore, in the laminate in which electrical components are stacked in multiple rows, in the first embodiment described above, all power cards are arranged in the same row. In other words, not all power cards are included in the second electrical component, but are all concentrated in the first electrical component. In contrast, in this embodiment, in a laminate with multiple rows, the power cards are distributed and arranged in multiple rows. In the example shown in Figure 26, the three power cards M1u, M1v, and M1w related to the first inverter circuit and the three power cards M2u, M2v, and M2w related to the second inverter circuit are distributed in separate rows. However, the three power cards M1u, M1v, and M1w related to the first inverter circuit are concentrated in the same row. The three power cards M2u, M2v, and M2w related to the second inverter circuit are concentrated in the same row.

[0162] Furthermore, in the example shown in Figure 26, the power cards M1u, M1v, M1w, and B1 related to the first inverter circuit and the snubber card C1 are arranged in the same row. The snubber card C1 is positioned adjacent to the power cards M1u, M1v, M1w, and B1 in the Y direction. More specifically, the snubber card C1 is positioned between the power card M1w and the power card B1. The power cards M1u, M1v, M1w, and B1 are positioned between the snubber card C1 and the smoothing card C3 in the stacking direction.

[0163] The same applies to the second inverter circuit, where power cards M2u, M2v, M2w, and B2 and snubber card C2 are arranged in the same row. Snubber card C2 is positioned adjacent to power cards M2u, M2v, M2w, and B2 in the Y direction. More specifically, snubber card C2 is positioned between power card M2w and power card B2. Power cards M2u, M2v, M2w, and B2 are positioned between snubber card C2 and smoothing card C3 in the stacking direction.

[0164] Furthermore, in the example shown in Figure 26, one smoothing card C3 is positioned across both the first cooling tube 211 and the second cooling tube 212. In this embodiment, the capacitor capacitance of the smoothing card C3 is greater than the capacitor capacitance of the snubber card C1 or the snubber card C2. More specifically, as mentioned above, the capacitor card has multiple capacitor elements connected to each other. These capacitor elements are sealed by a sealant 5m. The capacitor elements of one smoothing card C3 have a larger capacitor capacitance than the capacitor elements of one snubber card C1 or C2. Also, the number of capacitor elements in one smoothing card C3 is greater than the number of capacitor elements in one snubber card C1 or C2.

[0165] Furthermore, a single filter card C4 is positioned across both the first cooling tube 211 and the second cooling tube 212, similar to the smoothing card C3. However, while the smoothing card C3 is cooled on both sides in the stacking direction, the filter card C4 is cooled on one side in the stacking direction. The filter card C4 is positioned between the first connecting tube 221 and the second connecting tube 222. Note that the smoothing card C3 may be cooled on one side, and the filter card C4 may be cooled on both sides.

[0166] The configuration according to this embodiment may be combined with the configurations of each of the above embodiments as appropriate. For example, the arrangement of the card components shown in Figure 26 may be changed to the arrangement of the card components shown in Figure 3 to obtain the configuration shown in Figure 27.

[0167] In this embodiment, the smoothing card C3 is incorporated into the laminate, but as shown in Figure 28, the smoothing card C3 may be placed outside the laminate. Even in this case, it is desirable to arrange the smoothing card C3 in the stacking direction (Y direction) relative to the laminate.

[0168] (Other embodiments) In each of the above embodiments, the power cards M1u to B2 are positioned upstream of the refrigerant flow relative to the capacitor cards C1 to C4, reactor cards L1 and L2, and sensor card S. In contrast, the power cards M1u to B2 may be positioned downstream.

[0169] In each of the above embodiments, electrical components other than the power cards M1u to B2 are stacked together with the power cards and cooled by the cooler 20. In contrast, the electrical components other than the power cards M1u to B2 may be placed outside the stack or outside the storage case 100.

[0170] In each of the above embodiments, the inlet 20in is formed at the first connection part 121, and the outlet 20out is formed at the second connection part 122. In contrast, the inlet 20in may be formed at the second connection part 122 or the third connection part 123. Also, the outlet 20out may be formed at the first connection part 121 or the third connection part 123. Multiple outlets 20out may be formed. For example, the inlet 20in may be formed at the third connection part 123, and the outlets 20out may be formed at two locations, the first connection part 121 and the second connection part 122.

[0171] The second divided tube 22B in each of the above embodiments may be a bellows structure that can expand and contract in the stacking direction. Also, the structure in which the stacked electrical components are arranged in two rows in each of the above embodiments may be three or more rows.

[0172] Dummy cards may be stacked together with the first or second electrical components. This allows the stacking length of each row to be aligned by the dummy cards, even if the stacking length of multiple first electrical components differs from the stacking length of multiple second electrical components.

[0173] Busbars connected to card components may be configured to be cooled by a cooler. For example, busbars may be cooled by bringing them into contact with a cooling unit via an electrical insulating material. Alternatively, busbars may be cooled by bringing them into contact with a card component such as a dummy card.

[0174] In each of the above embodiments, when stacking multiple electrical components, they are stacked in multiple rows (for example, two rows). In contrast, multiple electrical components may be stacked in a single row. Also, when stacking in multiple rows, power cards may be concentrated in a single row or distributed across multiple rows. Similarly, reactor cards and capacitor cards may be concentrated in a single row or distributed across multiple rows. Similarly, multiple snubber cards may be concentrated in a single row or distributed across multiple rows. Similarly, multiple smoothing cards may be concentrated in a single row or distributed across multiple rows.

[0175] The power conversion devices of each of the above embodiments are applicable, for example, to mobile bodies that use a rotating electric machine as a drive source. Mobile bodies include, for example, electric vehicles such as battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), and plug-in hybrid electric vehicles (PHEVs), electric aircraft such as drones and electric vertical take-off and landing aircraft (eVTOLs), ships, construction machinery, and agricultural machinery. BEV is an abbreviation for Battery Electric Vehicle. HEV is an abbreviation for Hybrid Electric Vehicle. eVTOL is an abbreviation for electronic Vertical Take-Off and Landing aircraft.

[0176] (Disclosure of technical ideas) This specification discloses several technical ideas, as described in the following paragraphs. Some paragraphs may be written in a multiple dependent form, where subsequent paragraphs alternately refer to preceding paragraphs. Furthermore, some paragraphs may be written in a multiple dependent form, referring to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical ideas. In addition, the technical ideas in groups A, B, and C described below can be combined as appropriate.

[0177] <Technical Thought Group A> (Technical Thought 1A) An electrical component included in a power conversion circuit, comprising a plurality of first electrical components (M1u, M1v, M1w, M2u, M2v, M2w, B1, B2, C3, C4) stacked in a first direction, The power conversion circuit includes an electrical component comprising a plurality of second electrical components (C1, C2, C3, L1, L2, S) that are offset from the first direction and stacked in a second direction parallel to the first direction, A first cooling section (211, 111) that forms a plurality of first cooling channels (211a, 111a) for cooling the first electrical component from both sides in the first direction, A second cooling section (212, 112) communicates with the upstream or downstream side of the first cooling channel and forms a plurality of second cooling channels (212a, 112a) that cool the second electrical component from both sides in the second direction, A first connecting portion (221, 121) that forms a first connecting channel (221a, 121a) connected to one end of a plurality of the first cooling channels, A second connecting portion (222, 122) that forms a second connecting channel (222a, 122a) connected to one end of a plurality of the second cooling channels, A third connecting portion (223, 123) is connected to the other end of a plurality of first cooling channels and forms a third connecting channel (223a, 123a) that is connected to the other end of a plurality of second cooling channels, A power conversion device equipped with the following features.

[0178] (Technical Thought 2A) A power conversion device according to technical concept 1A, wherein the number of first cooling channels and the number of second cooling channels are different.

[0179] (Technical Thought 3A) The first connection portion is formed with an inlet (20in) for allowing refrigerant to flow into the first connection flow path. The power conversion device according to technical concept 1A or 2A, wherein the second connection portion has an outlet (20out) formed therein for discharging refrigerant from the second connection channel.

[0180] (Technical Thought 4A) A power conversion device according to any one of technical concepts 1A to 3A, wherein the total area of ​​the first cooling section facing the first cooling channel and the total area of ​​the second cooling section facing the second cooling channel are made different, thereby making the refrigerant flow resistance different in the first cooling channel and the second cooling channel.

[0181] (Technical Thought 5A) The first cooling unit has a first cooling fin (211f) arranged in the first cooling channel, The power conversion device according to technical concept 4A, wherein the second cooling section has a second cooling fin (212f) arranged in the second cooling channel.

[0182] (Technical Thought 6A) The first cooling unit has a plurality of first cooling tubes (211) that form the first cooling channel inside, The second cooling section has a plurality of second cooling tubes (212) that form the second cooling channel inside, A power conversion device according to any one of technical ideas 1A to 5A, wherein at least one of the plurality of first cooling tubes is a separate pipe from the second cooling tube.

[0183] (Technical Thought 7A) The first cooling unit has a plurality of first cooling tubes (211) that form the first cooling channel inside, The second cooling section has a plurality of second cooling tubes (212) that form the second cooling channel inside, A power conversion device according to any one of technical ideas 1A to 5A, wherein at least one of the plurality of first cooling tubes is a piping integral with the second cooling tube.

[0184] (Technical Thought 8A) A power conversion device according to any one of technical ideas 1A to 7A, wherein at least one of the first connection part, the second connection part, and the third connection part has a plurality of divided pipes (22A, 22B) connected to each other.

[0185] (Technical Thought 9A) The power conversion device according to technical concept 8A, wherein the divided pipe includes a first divided pipe (22A) and a second divided pipe (22B) having different lengths.

[0186] (Technical Thought 10A) Multiple third electrical components (C4x) are stacked, Multiple fourth electrical components (L1x) are stacked, A third cooling section (211x) that forms a plurality of third cooling channels (211ax) for cooling the third electrical component from both sides in the stacking direction, A fourth cooling section (212x) that forms a plurality of fourth cooling channels (212ax) for cooling the fourth electrical component from both sides in the stacking direction, A fourth connecting portion (221x) that forms a fourth connecting channel (221ax) connected to one end of a plurality of the third cooling channels, A fifth connecting portion (222x) that forms a fifth connecting channel (222ax) connected to one end of a plurality of the fourth cooling channels, A sixth connecting portion (223x) is connected to the other end of a plurality of third cooling channels and forms a sixth connecting channel (223ax) that is connected to the other end of a plurality of fourth cooling channels, A power conversion device according to any one of technical concepts 1A to 9A, comprising a connecting portion (25) that forms a connecting channel that connects any of the first cooling channel, the second cooling channel, the first connecting channel, the second connecting channel, and the third connecting channel to any of the third cooling channel, the fourth cooling channel, the fourth connecting channel, the fifth connecting channel, and the sixth connecting channel.

[0187] (Technical Thought 11A) A storage case (100) is provided, which has a storage chamber (100a) for storing liquid refrigerant formed inside, and an inlet (100b) for introducing refrigerant into the storage chamber and an outlet (100c) for releasing refrigerant from the storage chamber. The first electrical component and the second electrical component are arranged in the storage chamber. In the aforementioned storage chamber, the space between the multiple first electrical components functions as the first cooling channel. In the aforementioned storage chamber, the space between the multiple second electrical components functions as the second cooling channel. Of the storage chambers, the space between the first electrical component and the second electrical component functions as the third connecting channel. Of the storage chamber, the portion opposite to the third connection channel with respect to the first electrical component functions as the first connection channel. Of the storage chamber, the portion opposite to the third connection channel with respect to the second electrical component functions as the second connection channel. The power conversion device according to any one of the technical concepts 1A to 9A, wherein the first cooling unit, the second cooling unit, the first connection unit, the second connection unit, and the third connection unit are included in the storage case.

[0188] <Technical philosophy group B> (Technical Thought 1B) An electrical component included in a power conversion circuit, comprising a plurality of first electrical components stacked in a first direction, An electrical component included in the power conversion circuit, comprising a plurality of second electrical components offset from the first direction and stacked in a second direction parallel to the first direction, A first cooling section (211, 111) that forms a plurality of first cooling channels (211a, 111a) for cooling the first electrical component from both sides in the first direction, The system includes a second cooling section (212, 112) which communicates with the upstream or downstream side of the first cooling channel and forms a plurality of second cooling channels (212a, 112a) that cool the second electrical component from both sides in the second direction, The first electrical component includes power cards (M1u, M1v, M1w, M2u, M2v, M2w, B1, B2) having switching elements that form a power conversion circuit. A power converter comprising the second electrical component, which includes other electrical components (C1, C2, C3, C4, L1, L2, S) having functions different from the switching element.

[0189] (Technical Thought 2B) The power conversion device according to technical concept 1B, wherein the other electrical components include at least one of capacitors (C1, C2, C3, C4) and reactors (L1, L2) provided in the power conversion circuit.

[0190] (Technical Thought 3B) The power conversion device according to technical concept 1B, wherein the other electrical components include at least one of a smoothing capacitor (C3) that reduces ripple in the power supplied to the power card, and snubber capacitors (C1, C2) that absorb switching surges generated by the switching element.

[0191] (Technical Thought 4B) A power conversion device according to any one of Technical Concepts 1B to 3B, wherein the multiple power cards are not included in the second electrical component but are integrated into the first electrical component.

[0192] (Technical Thought 5B) At least one of the first electrical component and the second electrical component includes capacitors (C1, C2, C3, C4) provided in the power conversion circuit. The power card is a power conversion device according to any one of the technical concepts 1B to 4B, wherein the power card is arranged upstream of the capacitor among a plurality of first cooling channels and a plurality of second cooling channels.

[0193] (Technical Thought 6B) At least one of the first electrical component and the second electrical component includes capacitors (C1, C2, C3, C4) provided in the power conversion circuit. The capacitor is located upstream of the power card among the plurality of first cooling channels and the plurality of second cooling channels, as described in any one of technical concepts 1B to 4B of the power conversion device.

[0194] <Technical philosophy group C> (Technical Thought 1C) Multiple power cards (M1u, M1v, M1w, M2u, M2v, M2w, B1, B2) are stacked and have switching elements that form a power conversion circuit. Cooling units (211, 212, 111, 112) that cool the power card from both sides in the stacking direction, A smoothing capacitor (C3) that reduces the ripple of the power supplied to the power card, A snubber capacitor (C1, C2) is formed to have a smaller capacitance than the smoothing capacitor and absorbs the switching surge generated by the switching element, Equipped with, A power conversion device in which the snubber capacitor is positioned to be cooled by the cooling unit together with a plurality of power cards.

[0195] (Technical Thought 2C) The snubber capacitor is located adjacent to the power card in the power conversion device described in Technical Concept 1C.

[0196] (Technical Thought 3C) The smoothing capacitor is stacked together with a plurality of power cards so that it is cooled by the cooling unit. The power card is disposed between the snubber capacitor and the smoothing capacitor in the stacking direction, as described in the power conversion device according to technical concept 1C or 2C.

[0197] (Technical Thought 4C) The smoothing capacitor is located adjacent to the power card in the power conversion device described in Technical Concept 3C.

[0198] (Technical Thought 5C) The power conversion device according to technical concept 1C or 2C, wherein the smoothing capacitor is located outside the laminate formed by the plurality of power cards and the snubber capacitor so as to be cooled by a cooling unit separate from the cooling unit.

[0199] (Technical Thought 6C) The power conversion circuit includes a boost circuit having the power card and reactors (L1, L2), The power card forming the boost circuit is arranged between the snubber capacitor and the reactor in the stacking direction, as described in any one of the technical concepts 1C to 5C of the power conversion device. [Explanation of Symbols]

[0200] 211...First cooling tube (first cooling section), 211a...First cooling channel, 212...Second cooling tube (second cooling section), 212a...Second cooling channel, 221...First connecting tube (first connection section), 221a...First connecting channel, 222...Second connecting tube (second connection section), 222a...Second connecting channel, 223...Third connecting tube (third connection section), 223a...Third connecting channel, C1, C2...Snubber card, C3...Smoothing card, C4...Filter card, L1, L2...Reactor card, M1u, M1v, M1w, M2u, M2v, M2w, B1, B2...Power card, S...Sensor card.

Claims

1. An electrical component included in a power conversion circuit, comprising a plurality of first electrical components (M1u, M1v, M1w, M2u, M2v, M2w, B1, B2, C3, C4) stacked in a first direction, The power conversion circuit includes an electrical component comprising a plurality of second electrical components (C1, C2, C3, L1, L2, S) that are offset from the first direction and stacked in a second direction parallel to the first direction, A first cooling section (211, 111) that forms a plurality of first cooling channels (211a, 111a) for cooling the first electrical component from both sides in the first direction, A second cooling section (212, 112) is provided, which communicates with the upstream or downstream side of the first cooling channel and forms a plurality of second cooling channels (212a, 112a) that cool the second electrical component from both sides in the second direction, A first connecting portion (221, 121) that forms a first connecting channel (221a, 121a) connected to one end of a plurality of first cooling channels, A second connecting portion (222, 122) that forms a second connecting channel (222a, 122a) which is attached to one end of a plurality of the second cooling channels, A third connecting portion (223, 123) is connected to the other end of a plurality of first cooling channels and forms a third connecting channel (223a, 123a) that is connected to the other end of a plurality of second cooling channels, A power conversion device equipped with the following features.

2. The power conversion device according to claim 1, wherein the number of first cooling channels and the number of second cooling channels are different.

3. The first connection portion is formed with an inlet (20 in) for allowing refrigerant to flow into the first connection flow path. The power conversion device according to claim 1 or 2, wherein the second connection portion has an outlet (20out) formed therein for discharging refrigerant from the second connection channel.

4. The power conversion device according to claim 1, wherein the total area of ​​the first cooling section facing the first cooling channel and the total area of ​​the second cooling section facing the second cooling channel are made different so that the flow resistance of the refrigerant is different in the first cooling channel and the second cooling channel.

5. The first cooling unit has a first cooling fin (211f) arranged in the first cooling channel, The power conversion device according to claim 4, wherein the second cooling unit has a second cooling fin (212f) arranged in the second cooling channel.

6. The first cooling unit has a plurality of first cooling tubes (211) that form the first cooling channel inside, The second cooling section has a plurality of second cooling tubes (212) that form the second cooling channel inside, The power conversion device according to claim 1 or 2, wherein at least one of the plurality of first cooling tubes is a separate pipe from the second cooling tube.

7. The first cooling unit has a plurality of first cooling tubes (211) that form the first cooling channel inside, The second cooling section has a plurality of second cooling tubes (212) that form the second cooling channel inside, The power conversion device according to claim 1 or 2, wherein at least one of the plurality of first cooling tubes is a pipe integrated with the second cooling tube.

8. The power conversion device according to claim 1 or 2, wherein at least one of the first connection portion, the second connection portion, and the third connection portion has a plurality of divided pipes (22A, 22B) connected to each other.

9. The power conversion device according to claim 8, wherein the divided pipe includes a first divided pipe (22A) and a second divided pipe (22B) having different lengths.

10. Multiple third electrical components (C4x) are stacked, Multiple fourth electrical components (L1x) are stacked, A third cooling section (211x) that forms a plurality of third cooling channels (211ax) for cooling the third electrical component from both sides in the stacking direction, A fourth cooling section (212x) that forms a plurality of fourth cooling channels (212ax) for cooling the fourth electrical component from both sides in the stacking direction, A fourth connecting portion (221x) that forms a fourth connecting channel (221ax) connected to one end of a plurality of third cooling channels, A fifth connecting portion (222x) that forms a fifth connecting channel (222ax) connected to one end of a plurality of the fourth cooling channels, A sixth connecting portion (223x) is connected to the other end of a plurality of third cooling channels and forms a sixth connecting channel (223ax) that is connected to the other end of a plurality of fourth cooling channels, The power conversion device according to claim 1 or 2, further comprising a connecting portion (25) that forms a connecting channel connecting any of the first cooling channel, the second cooling channel, the first connecting channel, the second connecting channel, and the third connecting channel to any of the third cooling channel, the fourth cooling channel, the fourth connecting channel, the fifth connecting channel, and the sixth connecting channel.

11. A storage case (100) is provided, which has a storage chamber (100a) for storing liquid refrigerant formed inside, an inlet (100b) for introducing refrigerant into the storage chamber, and an outlet (100c) for releasing refrigerant from the storage chamber. The first electrical component and the second electrical component are arranged in the storage chamber. In the aforementioned storage chamber, the space between the multiple first electrical components functions as the first cooling channel. In the aforementioned storage chamber, the space between the multiple second electrical components functions as the second cooling channel. Of the storage chambers, the space between the first electrical component and the second electrical component functions as the third connecting channel. Of the storage chamber, the portion opposite to the third connection channel with respect to the first electrical component functions as the first connection channel. Of the storage chamber, the portion opposite to the third connection channel with respect to the second electrical component functions as the second connection channel. The power conversion device according to claim 1 or 2, wherein the first cooling unit, the second cooling unit, the first connection unit, the second connection unit, and the third connection unit are included in the storage case.

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