Anti-counterfeit IC card and method for manufacturing an anti-counterfeit IC card

Abstract

We provide an IC card that can prevent the unauthorized replacement of IC modules. [Solution] The anti-counterfeiting IC card 1 is an IC card in which an IC module 11 having a contact terminal substrate 110 with a plurality of contact terminals 110a formed on its surface is mounted on a card base 10. In the anti-counterfeiting IC card 1, a marking pattern 12 is engraved across both the surface of the contact terminal substrate 110 and the surface of the card base 10 in order to prevent the unauthorized replacement of the IC module.

Description

[Technical Field]

[0001] The present application discloses an invention for preventing unauthorized replacement of an IC module embedded in an IC card. [Background Art]

[0002] An IC card is one type of electronic device used in systems that require high security. An IC card is a card medium on which an IC chip (semiconductor integrated circuit) is mounted. Advanced encryption technology is implemented on the IC chip mounted on the IC card. This prevents counterfeiting of data stored in the IC chip.

[0003] For IC cards used in systems that require high security, in addition to preventing data counterfeiting, it is also necessary to prevent counterfeiting of the card medium. In order to prevent counterfeiting of the card medium of an IC card, holograms have been affixed to the card medium of IC cards for a long time. In the invention disclosed in Patent Document 1, in order to prevent counterfeiting of the hologram affixed to the card medium, a half stamp is engraved on the hologram affixed to the card medium. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Unexamined Patent Publication No. 10-86566 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] One type of IC card is the contact-type IC card. A contact-type IC card is an IC card in which an IC module with multiple contact terminals formed on the front side for contact with a reader / writer is embedded in the card base. In contact-type IC cards, the IC chip is mounted on the back side of the IC module. In the case of contact-type IC cards, there is a concern that one method of counterfeiting the IC card is to peel off the IC module embedded in the contact-type IC card and replace it with a counterfeit IC module (hereinafter referred to as the "counterfeit IC module").

[0006] Therefore, this application provides an IC card that can prevent the unauthorized replacement of IC modules, and a method for manufacturing this IC card. [Means for solving the problem]

[0007] The first invention, which solves the above-mentioned problems, is an IC card in which an IC module having a contact terminal substrate with a plurality of contact terminals formed on its surface is mounted on a card base, and the anti-counterfeiting IC card has a split pattern formed across both the surface of the contact terminal substrate and the surface of the card base.

[0008] Furthermore, the second invention is a counterfeit prevention IC card according to the first invention, characterized in that a groove-shaped margin is provided between the surface of the contact terminal substrate and the card base, exposing the base material layer of the card base, and a split pattern is formed across the surface of the contact terminal substrate, the margin, and the surface of the card base, respectively.

[0009] Furthermore, the third invention is a method for manufacturing an anti-counterfeit IC card, comprising the steps of: A) processing a cavity in a card base into which an IC module having a contact terminal substrate with a plurality of contact terminals formed on its surface is embedded; B) embedding the IC module in the cavity; and C) forming a split pattern across both the surface of the contact terminal substrate and the surface of the card base by laser engraving.

[0010] Furthermore, the fourth invention is a method for manufacturing an anti-counterfeiting IC card as described in the third invention, characterized in that, in step A, a cavity is processed in the card base in which a groove-shaped margin is provided between the surface of the contact terminal substrate and the card base, exposing the base material layer of the card base, and in step C, the split pattern is formed spanning the surface of the contact terminal substrate, the margin, and the surface of the card base, respectively. [Effects of the Invention]

[0011] The invention disclosed herein prevents unauthorized replacement of an IC module by forming a split pattern across the surface of the contact terminal substrate of the IC module and the surface of the card base. [Brief explanation of the drawing]

[0012] [Figure 1] This figure shows a counterfeit-prevention IC card according to this embodiment. [Figure 2] This figure shows the structure of the anti-counterfeiting IC card according to this embodiment. [Figure 3] A diagram showing the 11 module. [Figure 4] This figure shows a method for manufacturing a counterfeit-resistant IC card according to this embodiment. [Figure 5] Figure 1 shows a cross-section of the area where the seal pattern was engraved. [Figure 6] A diagram showing a photograph of a seal pattern. [Figure 7] A diagram illustrating the effect of the seal pattern. [Figure 8] A diagram showing a modified version of the anti-counterfeiting IC card. [Figure 9] A diagram showing the structure of a counterfeit-prevention IC card in a modified form. [Figure 10] A diagram showing the manufacturing process of a counterfeit-prevention IC card with modified specifications. [Figure 11] Figure 2 shows a cross-section of the area where the seal pattern was engraved. [Figure 12] A diagram illustrating the effect of the margins. [Modes for carrying out the invention]

[0013] Embodiments according to the present invention will be described hereinafter. The present embodiments are provided to facilitate understanding of the present invention. The present invention is not limited to the present embodiments. In addition, unless otherwise specified, the drawings are schematic diagrams drawn to facilitate understanding of the present invention.

[0014] Figure 1 is a diagram showing an anti-counterfeiting IC card 1 according to the present embodiment. The anti-counterfeiting IC card 1 illustrated in Figure 1 is an IC card having a structure in which an IC module 11 including a contact terminal substrate 110 having a plurality of contact terminals 110a formed on the surface thereof is embedded in a card base body 10. As an IC card having such a structure, a contact-type IC card, or a dual-interface IC card having both contact-type and non-contact-type functions can be assumed. Although Figure 1 shows the anti-counterfeiting IC card 1 according to the present embodiment in the shape of a credit card, the anti-counterfeiting IC card 1 according to the present embodiment may also be in the shape of a SIM card.

[0015] In the anti-counterfeiting IC card 1 according to the present embodiment, as a measure to prevent unauthorized replacement of the IC module 11, a split seal pattern 12 ("ABC" in Figure 1) is formed across both the surface of the contact terminal substrate 110 and the surface of the card base body 10. In Figure 1, the split seal pattern 12 is formed from the upper end portion of the surface of the contact terminal substrate 110 to the surface of the card base body 10. In Figure 1, a part (substantially upper half) of the split seal pattern 12 is formed on the card base body 10, and the remaining part (substantially lower half) of the split seal pattern 12 is formed on the surface of the contact terminal substrate 110.

[0016] In the present embodiment, laser engraving (laser marking) is used to form the split seal pattern 12. Laser engraving is a technique in which a laser is irradiated onto a surface layer of an object to engrave characters, graphics, or the like on the surface layer of the object. In laser engraving, characters or the like are engraved on the surface of the object by carving the surface of the object with the laser or causing the surface of the object to develop color via the laser. Examples of lasers used in laser engraving include YAG lasers and carbon dioxide lasers. Among laser engraving methods, there is also a mask method in which a planar laser is irradiated and characters / graphics are engraved on portions that have passed through a mask. However, in the present embodiment, a scanning method is used, in which a single-point laser is scanned by a scanning mirror or the like to engrave characters and graphics. This is because changing the split seal pattern 12 is easy with the scanning method of laser engraving.

[0017] In the present embodiment, the split seal pattern 12 engraved on the anti-counterfeiting IC card 1 is formed as characters, but the split seal pattern 12 may also be a pattern such as an image, a geometric pattern, or an optical code. A more fine split seal pattern 12 makes replacement of the IC module 11 more difficult. Further, in FIG. 1, the split seal pattern 12 is engraved at one location on the contact terminal substrate 110 included in the IC module 11, but the location where the split seal pattern 12 is engraved is not limited to one location. However, since the anti-counterfeiting IC card 1 is inserted into a contact-type reader / writer, it is necessary to engrave the split seal pattern 12 at a position that does not interfere with the pins of the contact-type reader / writer. If the split seal pattern 12 is scraped off by the pins of the contact-type reader / writer, the anti-counterfeiting effect provided by the split seal pattern 12 will be diminished. Since the anti-counterfeiting IC card 1 is inserted into the contact-type reader / writer from the left direction in FIG. 1, it is preferable not to engrave the split seal pattern 12 on the left end side of the contact terminal substrate 110.

[0018] Figure 2 shows the structure of the anti-counterfeiting IC card 1 according to this embodiment. In Figure 2, the cross section A-A' in Figure 1 is shown, and the portion where the marking pattern 12 is engraved is omitted. As shown in Figure 2, the anti-counterfeiting IC card 1 according to this embodiment has a structure in which an IC module 11 having a contact terminal substrate 110 on which a plurality of contact terminals 110a are formed is embedded in a card base 10. Note that there may be an adhesive layer (not shown) between the contact terminal substrate 110 and the card base 10 for bonding the IC module 11 and the card base 10. A liquid adhesive or a film adhesive is used for this adhesive layer.

[0019] The card substrate 10 has a layer structure consisting of at least a base layer 100, an opacity layer 101, and a printing layer 102. In Figure 2, the base layer 100 is shown as a single layer, but the base layer 100 may be a multi-layer structure. The layer structure of the card substrate 10 is not limited to the structure shown in Figure 2. The layer structure of the card substrate 10 may also consist of an oversheet layer laminated between the base layer 100 and the opacity layer 101. In addition, layers not shown in Figure 2, such as a magnetic recording layer, may be laminated on the surface of the card substrate 10.

[0020] The base material layer 100 of the card base 10 uses a plastic material. In addition to common plastic materials such as polyvinyl chloride, polyethylene terephthalate, and polycarbonate, biodegradable plastics can also be used. The concealment layer 101 of the card base 10 is a layer that hides the internal structure of the anti-counterfeiting IC card 1 from the outside. The concealment layer 101 is formed by applying or printing an ink containing metal pigments such as titanium dioxide or aluminum. Generally, silver ink containing metal inks such as aluminum is used for the concealment layer 101. White ink containing titanium dioxide as a white pigment may also be used for the concealment layer 101. The printed layer 102 is the layer that displays the image on the anti-counterfeiting IC card 1. The image displayed on the anti-counterfeiting IC card 1 is determined by the intended use of the anti-counterfeiting IC card 1. If the anti-counterfeiting IC card 1 is a credit card, the image displayed on the anti-counterfeiting IC card 1 includes the cardholder's name, card number, and expiration date.

[0021] Figure 3 shows the IC module 11 provided in the anti-counterfeiting IC card 1. Figure 3(a) shows the surface of the IC module 11, and Figure 3(b) is a cross-sectional view BB' of the IC module 11. As shown in Figure 3(a), the IC module 11 has a contact terminal substrate 110 on its front side, which has eight contact terminals 110a formed in accordance with the ISO 7816 standard. As shown in Figure 3(a) and other figures, in this embodiment, a split pattern 12 is engraved on the upper end portion of the surface of the contact terminal substrate 110 of the IC module 11.

[0022] As shown in Figure 3(b), the IC module 11 has a contact terminal substrate 110 on its front side, with a plurality of contact terminals 110a formed on its surface, and an IC chip 111 and a molded resin 112 covering the IC chip 111 on the back side of the contact terminal substrate 110. The surface of the contact terminal substrate 110 is the part that physically contacts the contact-type reader / writer. In this embodiment, the contact terminal substrate 110 has a configuration that includes a copper foil layer 1101 laminated on an insulating layer 1100, a nickel plating layer 1102 laminated on the copper foil layer 1101, and a gold plating layer 1103 laminated on the nickel plating layer 1102. The IC chip 111 and the copper foil layer 1101 of the contact terminal substrate 110 are electrically connected by bonding wires 1105 using through-holes 1104 provided in the insulating layer 1100.

[0023] Figure 4 shows a method for manufacturing the anti-counterfeiting IC card 1 according to this embodiment. The method for manufacturing the anti-counterfeiting IC card 1 according to this embodiment includes the steps of forming a cavity 103 (recess) for mounting the IC module 11 in the card base 10 by milling (Figure 4(a)), embedding the IC module 11 in the cavity 103 formed in the card base 10 (Figure 4(b)), and using a laser engraving device 4 to engrave a split pattern 12 so as to span both the surface of the contact terminal substrate 110 and the surface of the card base 10 (Figure 4(c)).

[0024] The cavity 103 formed in the card base 10 of the anti-counterfeiting IC card 1 according to this embodiment will now be described. As shown in Figure 3(b), the IC module 11 has a shape in which the molded resin 112 protrudes from the back side of the contact terminal substrate 110. The cavity 103 formed in the card base 10 so that the surface of the IC module 11 is substantially the same as the surface of the card base 10 has a first cavity 1030 that accommodates the molded resin 112 that protrudes from the back side of the IC module 11 and a second cavity 1031 that accommodates the contact terminal substrate 110. In the anti-counterfeiting IC card 1 according to this embodiment, the width L0 from the edge of the second cavity 1031 to the edge of the first cavity 1030 is substantially equal to the width L1 from the edge of the molded resin 112 of the IC module 11 to the edge of the insulating substrate 113. The width L2 of the first cavity 1030 is slightly longer than the width L3 of the molded resin 112. This is due to variations in the shape of the molded resin 112, among other reasons. As a result, a small gap is created between the molded resin 112 and the first cavity 1030.

[0025] Figure 5 is the first diagram showing a cross-section of the area where the seal pattern 12 is engraved. Figure 5 shows a cross-sectional view of CC' in Figure 3(a) as an example of the area where the seal pattern 12 is engraved. In the anti-counterfeiting IC card 1 according to this embodiment, the seal pattern 12 is engraved by peeling off the metal film layer closest to the surface with a laser. This eliminates the need to change the laser output in the card base 10 and the IC module 11. In the card base 10, the metal film layer closest to the surface is the concealing layer 101 containing metal pigment. In the card base 10, the seal pattern 12 is engraved by peeling off the layer above the concealing layer 101, which is the metal film layer, i.e., the concealing layer 101 and the printing layer 102 with a laser. In the IC module 11, the metal film layer closest to the surface is the gold plating layer 1103. In the IC module 11, the seal pattern 12 is engraved by peeling off the gold plating layer 1103 with a laser.

[0026] From here, an example of a marking pattern 12 to be formed on the anti-counterfeiting IC card 1 according to this embodiment is shown. Figure 6 shows a photograph 12P of the marking pattern 12. As mentioned above, the shape of the marking pattern 12 to be formed on the anti-counterfeiting IC card 1 according to this embodiment can be arbitrary. Figure 6(a) shows a photograph 12P (12Pa) of a marking pattern 12 that forms a filled-in star shape. Figure 6(b) shows a photograph 12P (12Pb) of a marking pattern 12 that forms a barcode. Although not shown in Figure 6, it is of course possible to form a marking pattern 12 of a string of characters.

[0027] To form the split pattern 12 shown in Figure 6, an IDP Corporation laser marker "WISE-LE" was used as the scanning laser marking device 4. The IDP Corporation laser marker "WISE-LE" is compatible with metals (aluminum, gold, nickel, etc.) and plastic materials (polycarbonate, PET bottles, PE). The laser irradiation conditions used when manufacturing the sample shown in Figure 6 were as follows. (Laser irradiation conditions during sample manufacturing) • Laser light source: YAG laser • Laser light wavelength: 1064nm • Power setting: 60 Speed ​​setting: 1000

[0028] By moving a laser, following the laser irradiation conditions described above, along the shape of the marking pattern 12 so as to span both the surface of the contact terminal substrate 110 of the IC module 11 and the surface of the card base 10, a marking pattern 12 spanning both the surface of the contact terminal substrate 110 of the IC module 11 and the surface of the card base 10 can be formed. As shown in Figure 6, when the surface of the contact terminal substrate 110 is irradiated with a laser, the gold plating layer 1103, which is the metal film layer closest to the surface, is peeled off by the laser, exposing the nickel plating layer 1102, and the marking pattern 12 that forms the basis of photograph 12Pa is formed by the contrast between the gold plating layer 1103 and the nickel plating layer 1102. Furthermore, when a laser conforming to the above-described laser irradiation conditions is irradiated onto the surface of the card substrate 10 (the surface on which the IC module 11 is mounted), the concealing layer 101, which is the metal film layer closest to the surface, and the printing layer 102 (in this case, only the concealing layer 101) which is the layer above it are peeled off by the laser, exposing the substrate layer 100. The contrast between the substrate layer 100 and the concealing layer 101 forms the split pattern 12 that forms the basis of photograph 12Pb.

[0029] Figure 7 shows the effect of the marking pattern 12. In the anti-counterfeiting IC card 1 according to this embodiment, if a counterfeit IC module is embedded in place of the genuine IC module 11 by removing the IC module 11 from the card base 10 and replacing the IC chip 111, an abnormality occurs in the marking pattern 12 of the anti-counterfeiting IC card 1. If the counterfeit IC module 3a, which does not have the marking pattern 12 engraved on it, is installed, a part of the marking pattern 12 engraved on the genuine contact terminal substrate 110 will be missing (Figure 7(a)). Also, if the counterfeit IC module 3b, which has a counterfeit marking pattern 3b0 similar to that of the genuine IC module 11, is installed, a lateral misalignment occurs between the marking pattern 12 engraved on the card base 10 and the counterfeit marking pattern 3b0 (Figure 7(b)). Therefore, in the anti-counterfeiting IC card 1 according to this embodiment, unauthorized replacement of the IC module 11 can be detected by detecting an abnormality in the marking pattern 12 engraved on the IC module 11. Furthermore, it is desirable that abnormalities in the seal pattern 12 can be confirmed both visually and mechanically. If abnormalities in the seal pattern 12 can be detected visually, not only skilled technicians involved in card manufacturing but also users of the anti-counterfeiting IC card 1 will be able to detect abnormalities in the seal pattern 12.

[0030] From here, a modified example of the anti-counterfeiting IC card according to this embodiment will be described. Figure 8 shows an anti-counterfeiting IC card 2 according to the modified example. In the description of the anti-counterfeiting IC card 2 according to the modified example, the same reference numerals are used for the same elements as in the anti-counterfeiting IC card according to this embodiment.

[0031] The modified anti-counterfeiting IC card 2 is an IC card with a structure similar to the anti-counterfeiting IC card according to the embodiment, in which an IC module 11 having a plurality of contact terminals 110a on its front side and an IC chip 111 mounted on its side is embedded in a card base 10. In the modified anti-counterfeiting IC card 2, a groove-shaped margin 23 is provided between the end where the splitting pattern 12 is engraved and the card base 10, exposing the base material layer, and the splitting pattern 12 is engraved across the surface of the contact terminal substrate 110 of the IC module 11, the groove-shaped margin 23, and the surface of the modified card base 10. Furthermore, there are two splitting patterns 12 engraved on the modified anti-counterfeiting IC card 2. One splitting pattern 12a is engraved from the upper end of the IC module 11 to the card base 10, and the other splitting pattern 12b is engraved from the lower end of the IC module 11 to the card base 10.

[0032] Figure 9 shows the structure of a modified anti-counterfeiting IC card 2. Figure 9 shows the cross-section along D-D' in Figure 8. Similar to the anti-counterfeiting IC card 1 according to this embodiment, the modified anti-counterfeiting IC card 2 has a structure in which an IC module 11 having a contact terminal substrate 110 with a plurality of contact terminals 110a formed on its surface is embedded in a card base 10. In the modified anti-counterfeiting IC card 2, the configuration of the card base 10 and the configuration of the IC module 11 are the same as in the anti-counterfeiting IC card 1 according to the embodiment. The difference between the anti-counterfeiting IC card 1 according to the embodiment and the modified anti-counterfeiting IC card 2 is that a groove-shaped margin 23 is provided between the contact terminal substrate 110 and the card base 10, exposing the base material layer 100 of the card base 10.

[0033] Figure 10 shows the manufacturing process of a modified anti-counterfeiting IC card. The manufacturing process of the anti-counterfeiting IC card according to this embodiment includes the steps of forming a cavity 203 for mounting the IC module 11 in the card base 10 by milling (Figure 10(a)), embedding the IC module 11 in the cavity 203 formed in the card base 10 (Figure 10(b)), and engraving a split pattern 12 across the surface of the contact terminal substrate 110, the margin 23, and the card base 10 using a laser engraving device 4 (Figure 10(c)).

[0034] In the modified anti-counterfeiting IC card 2, the configuration of the card base 10 and the configuration of the IC module 11 are the same as in the embodiment, but the cavity 203 differs from that of the embodiment. Similar to the embodiment, the modified cavity 203 has a first cavity 2030 that houses the molded resin 112 that protrudes from the back side of the IC module 11, and a second cavity 2031 that houses the insulating substrate 113. The first cavity 2030 of the modified cavity 203 is the same as in the embodiment, but the second cavity 2031 of the modified cavity 203 differs from that of the embodiment. In the modified cavity 203, the width L4 from the end of the second cavity 2031, which is the side on which the seal pattern 12 is engraved, to the end of the first cavity 2030 is longer than the width L1 from the end of the molded resin 112 of the IC module 11 to the end of the insulating substrate 113. Therefore, as shown in Figure 10(c), in the modified anti-counterfeiting IC card 2, a groove-shaped margin 23 is formed between the card base 10 and the IC module 11. The base material layer 100 of the card base 10 is exposed at the bottom of the margin 23.

[0035] In the modified anti-counterfeiting IC card 2, a portion of the seal pattern 12 is also engraved in the groove-shaped margin 23. Considering that a portion of the seal pattern 12 engraved in the groove-shaped margin 23 can be visually confirmed, a groove width of 0.3 mm or more is desirable for the margin 23. However, if the groove width of the margin 23 is too wide, it will impair the appearance and the IC module 11 may easily detach from the card base 10. For this reason, a groove width of between 0.3 mm and 2.0 mm is appropriate for the margin 23.

[0036] Figure 11 is the second figure showing a cross-section of the area where the splitting pattern 12 is engraved. In Figure 11, the EE' cross-section in Figure 8 is shown as an example of the area where the splitting pattern 12 is engraved. In the modified anti-counterfeiting IC card 2, a portion of the splitting pattern 12 is also engraved on the card base 10 and the IC module 11 by laser engraving. In the modified anti-counterfeiting IC card 2, a groove-shaped margin 23 exists between the card base 10 and the IC module 11, so a portion of the splitting pattern 12 is also engraved on this margin 23 by laser engraving. Since there is no metal film layer at the bottom of the groove-shaped margin 23, a portion of the splitting pattern 12 is engraved on the bottom of the margin 23 by a laser-induced colored portion 23a. The colored portion 23a is formed by burning or discoloration by the laser. Since the base material layer 100 is exposed at the bottom of the groove-shaped margin 23, in the modified anti-counterfeiting IC card 2, it is preferable to use a plastic material with excellent color development properties for laser engraving for the base material layer 100. For example, polycarbonate is one of the plastic materials that has good color development properties for laser engraving.

[0037] Figure 12 illustrates the effect of the margin portion 23 provided in the modified anti-counterfeiting IC card 2. Because the modified anti-counterfeiting IC card 2 has a margin portion 23, if the genuine IC module 11 is replaced with a counterfeit IC module 3c, the position of the IC module 11 is likely to shift. This is because, as mentioned above, a small gap is created between the molded resin 112 and the first cavity 2030. In Figure 12, the counterfeit IC module 3c is embedded shifted upward from its original position. When the position of the counterfeit IC module 3c shifts upward, it covers part of the split mark pattern 12 engraved on the upper margin portion 23. Also, when the position of the counterfeit IC module 3c shifts upward, the groove width of the lower margin portion 23 becomes longer than it should be. As a result, a region without a split mark pattern 12 is created between part of the split mark pattern 12 engraved on the lower margin portion 23 and the counterfeit split mark pattern 3c0 engraved on the counterfeit IC module 3c. Thus, in the modified anti-counterfeiting IC card 2, the positional accuracy required when embedding the counterfeit IC module 3c is necessary for the unauthorized replacement of the IC module 11, making the unauthorized replacement of the IC module 11 more difficult.

[0038] Furthermore, if the adhesive layer for fixing the IC module 11 protrudes into the margin 23, a portion of the marking pattern 12 engraved or printed on the margin 23 will also be formed on this adhesive layer. In this case, when the IC module 11 is peeled off the card base 10 and the counterfeit IC module 3c is embedded, a portion of the marking pattern 12 engraved or printed on the original adhesive layer will be destroyed and not visible, making it even more difficult to illegally replace the IC module 11.

[0039] In this embodiment, a configuration in which laser engraving is used to form the seal pattern 12 has been described. Naturally, the seal pattern 12 can also be formed by methods other than laser engraving. For example, although the durability of the seal pattern 12 is lower than that of laser engraving, the seal pattern 12 can also be formed by inkjet printing. [Explanation of Symbols]

[0040] 1. Anti-counterfeit IC card 10 card bases 100 Base material layer 101 Concealing layer 102 Printing layer 103 Cavity 1030 First Cavity 1031 Second Cavity 11 IC modules 110 Contact terminal board 110a contact terminal 1100 Insulating layer 1101 Copper foil layer 1102 Nickel plating layer 1103 Gold plating layer 1104 Through Hole 1105 Bonding Wire 111 IC chips 112 Molding resin 12 Seal Patterns 2. Counterfeit prevention IC card related to the modified version 203 Cavity 2030 First Cavity 2031 Second Cavity 23 Margins 3a, 3b, 3c Counterfeit IC Modules 3b0, 3c0 counterfeit seal patterns 4. Laser engraving machine

Claims

1. An IC card comprising an IC module having a contact terminal substrate with multiple contact terminals formed on its surface, mounted on a card base, wherein a split pattern is formed across both the surface of the contact terminal substrate and the surface of the card base, making it an anti-counterfeiting IC card.

2. The anti-counterfeiting IC card according to claim 1, characterized in that a groove-shaped margin is provided between the surface of the contact terminal substrate and the card base, exposing the base material layer of the card base, and a split pattern is formed across the surface of the contact terminal substrate, the margin, and the surface of the card base, respectively.

3. A method for manufacturing an anti-counterfeit IC card, comprising: step A of processing a card base into a cavity for embedding an IC module having a contact terminal substrate with multiple contact terminals formed on its surface; step B of embedding the IC module in the cavity; and step C of forming a split pattern across both the surface of the contact terminal substrate and the surface of the card base by laser engraving.

4. A method for manufacturing an anti-counterfeit IC card according to claim 3, characterized in that, in step A, a cavity is processed in the card base having a groove-shaped margin between the surface of the contact terminal substrate and the card base that exposes the base material layer of the card base, and in step C, the split pattern is formed spanning the surface of the contact terminal substrate, the margin, and the surface of the card base, respectively.

Images